Substrate holder, substrate carrier, deposition system, and method for manufacturing electronic device

Abstract

To provide a technique to convey a substrate while achieving both the load capacity in a shearing direction and the adhesion load capacity.SOLUTION: A substrate holding tool is provided on a substrate carrier for holding and conveying a substrate in a lower part in the vertical direction, and has: a first elastic body layer that has an adhesive surface adhered to the substrate; a second elastic body layer that is bonded to a support member on the substrate carrier side and in which its amount of displacement with respect to a predetermined magnitude force in a direction parallel to the adhesive surface is larger than that of the first elastic body layer; and an intermediate layer that is arranged between the first and second elastic body layers and has a rigidity higher than the rigidity of the first elastic body layer and the rigidity of the second elastic body layer.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate holder, a substrate carrier, a deposition system, and a method for manufacturing an electronic device. [Background technology]

[0002] In recent years, the FPD (Flat Panel Display) industry has adopted a method to improve production efficiency by dividing a large glass substrate called mother glass into multiple glass substrates for individual displays. In this method, mother glass with a side length of, for example, more than 2 meters is subjected to manufacturing processes such as film deposition, and then divided and processed into products, with the premise that multiple single panel sizes will be produced according to demand. Generally, mother glass is less than a few millimeters thick, and a major challenge is how to handle the mother glass while preventing breakage and processing defects during various processes such as transportation and film deposition.

[0003] One method for transporting the mother glass in the manufacturing process is to transport it together with a substrate support member (substrate carrier). Common methods for holding the mother glass with the substrate carrier include supporting the outer periphery with a clamping mechanism, using an electrostatic chuck, using magnetic attraction, and using an adhesive member such as an adhesive pad.

[0004] By using an adhesive member to hold the mother glass with a substrate carrier, a power source is not required, making the system compact, and processes such as film formation can be performed while suppressing the effects of magnetic force, etc. Patent Document 1 discloses that a supported portion W2 of a thin workpiece W is supported by a substrate carrier 1000, while an unsupported portion W1 is suspended in an adhesive state with an adhesive member 2000, eliminating deflection and holding the thin workpiece W in a flat state. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2012 / 117509 Summary of the Invention [Problem to be solved by the invention]

[0006] Here, in order to maintain the uniformity of the film formation, the adhesive member may be placed discretely at the chamfering boundary (frame region) avoiding the image display region. In such a case, when chamfering the mother glass to a large screen size, glass bending is unavoidable at the center of the large screen, and a large shear force parallel to the glass surface acts as a load on the adhesive member placed in the frame region. When the temperature rises during the process accompanying film formation, the shear load capacity of the adhesive member may be insufficient, causing the mother glass to peel off from the substrate carrier, resulting in manufacturing defects. For this reason, in order to transport the mother glass during a series of manufacturing process cycles, it is necessary to reduce the shear force acting on the adhesive member or to improve the shear load capacity (shear direction adhesive force) of the adhesive member.

[0007] An object of the present invention is to provide a technique for transporting a substrate while satisfying both the load resistance in the shear direction and the adhesive load resistance. [Means for solving the problem]

[0008] In order to solve the above problems, according to the substrate holder of the present invention, A substrate holder provided on a substrate carrier for holding and transporting a substrate vertically downward, comprising: a first elastic layer having an adhesive surface that adheres to the substrate; a second elastic layer that is bonded to a support member on the substrate carrier side and has a larger displacement than the first elastic layer with respect to a predetermined force in a direction parallel to the adhesive surface; an intermediate layer disposed between the first and second elastic layers and having a stiffness higher than each of the stiffness of the first elastic layer and the stiffness of the second elastic layer; The present invention is characterized by having the following. Effect of the Invention

[0009] According to the substrate holding device of the present invention, it is possible to provide a technique for transporting a substrate while satisfying both the load resistance in the shear direction and the adhesive load resistance. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic plan view showing the substrate carrier according to the embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing the substrate carrier according to the embodiment. [Diagram 3] FIG. 2 is a diagram showing an adhesive substrate holder of a substrate holding device according to the present embodiment. [Figure 4] FIG. 2 shows an adhesive substrate holder incorporated in a substrate carrier according to the present embodiment. [Diagram 5] 4A to 4C are diagrams for explaining forces acting on a glass substrate held by a substrate carrier. [Figure 6] 5 is a flowchart for mounting / removing a glass substrate to / from the substrate carrier according to the embodiment. [Figure 7] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 8] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 9] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 10] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 11] 5A to 5C are diagrams illustrating the operation of a reversing device of the substrate holding device according to the embodiment. [Figure 12] 5A to 5C are explanatory diagrams illustrating the operation of the film forming apparatus of the substrate holding device according to the embodiment. [Figure 13] 5A to 5C are explanatory views of the operation of the substrate holding device according to the embodiment at the time of peeling. [Figure 14] 5A to 5C are explanatory views of the operation of the substrate holding device according to the embodiment at the time of peeling. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] In this specification, "adhesion" refers to the property that arises when an adhesive material having adhesive properties comes into contact with the surface of an adherend, such as a glass substrate, due to intermolecular forces (van der Waals forces) between the adhesive material and the surface of the adherend.

[0013] The adhesive holding device according to the present embodiment can be preferably applied to a substrate carrier and a substrate holding method, a film forming apparatus and a film forming method using these, an electronic device manufacturing apparatus and a manufacturing method using a substrate with a film formed thereon, etc. The film forming method can be any method such as vapor deposition or sputtering, and the type of film forming material or vapor deposition material can be any type.

[0014] [First embodiment] In recent years, the FPD industry has been working to increase the resolution of display images. This has led to new demands for mother glass transportation. In Patent Document 1, the unsupported areas that are not supported by the substrate carrier are functional parts that require post-processing such as film formation, and often correspond to the image display area of ​​the final product. If an adhesive member is attached to the unsupported areas and film formation is performed as in Patent Document 1, partial differences in heat conduction performance occur, which may impair the uniformity of the film formation and affect the high-definition image display in the finished panel. Therefore, it is considered that the adhesive members are discretely arranged at the chamfering boundary area (frame area) to avoid the image display area and maintain the uniformity of the film formation. However, when chamfering a large screen size from the mother glass, glass bending is unavoidable at the center of the large screen, and a large shear force parallel to the glass surface acts as a load on the adhesive member arranged in the frame area. Then, when the temperature rises during the process associated with film formation, the shear load capacity of the adhesive member is insufficient, and the mother glass may peel off from the substrate carrier, causing manufacturing problems. For this reason, in order to transport the mother glass during a series of manufacturing process cycles, it is necessary to reduce the shear force acting on the adhesive member or to increase the shear load capacity (shear adhesive force) of the adhesive member.

[0015] As a method for reducing the load in the shear direction on the adhesive member, it is possible to provide a buffer layer to the combination of the adhesive layer and the rigid substrate to add functionality. For example, a buffer layer with a thickness of 5 to 100 μm and characteristic softness absorbs foreign matter on the grinding stage, and the rigid substrate blocks deformation, making it possible to hold the wafer (workpiece) placed on the adhesive layer without unevenness. In addition, by making the buffer layer less than 100 μm thick, it has the function of suppressing vibrations transmitted to the workpiece and not impeding the alignment of the chips that are separated during processing.

[0016] In this embodiment, a substrate holder that has both low rigidity in the substrate holder shear direction and high adhesive strength (adhesive load capacity) in the hanging direction will be described.

[0017] A substrate holder according to the present embodiment, a substrate carrier equipped with the substrate holder, and a method for transporting a mother glass using the substrate carrier will be described with reference to FIGS.

[0018] In this specification, the transport direction of the substrate carrier and the glass substrate is defined as the X direction, the direction perpendicular to the transport direction within the substrate plane is defined as the Y direction, and the vertical direction perpendicular to the substrate plane is defined as the Z direction.

[0019] <Board carrier> The substrate carrier will be described with reference to Figures 1 and 2. Figure 1 is a schematic plan view of a substrate carrier on which an adhesive holder according to the present embodiment is installed. For ease of explanation, the scale of Figure 1 may differ from the actual scale. Figure 2 is a schematic cross-sectional view of the substrate carrier according to the present invention, and is a cross-sectional view on the XZ plane passing through the line A-A' in Figure 1. Note that in Figures 1 and 2, some components are shown with dotted lines to make the positional relationship easier to understand.

[0020] The substrate carrier 100 shown in FIG. 1 includes a flat plate member 110 and a frame 115 that supports the flat plate member 110. A holding surface (hereinafter referred to as a substrate holding surface 110X or a glass holding surface 110X) that holds the mother glass (glass substrate) 10 by the adhesive holder 120 is formed as a flat surface on the flat plate member 110. In addition, the flat plate member 110 is provided with a plurality of pin through holes 111 at a portion corresponding to a boundary portion of the chamfer size. As shown in FIG. 2, the glass substrate 10 can be moved up and down by moving a pin 240 that is movable in the vertical direction (Z direction) intersecting the substrate holding surface 110X through the pin through hole 111 up and down. In addition, a plurality of holder through holes 112 are provided adjacent to the pin through hole 111. The adhesive holder 120 is a substrate holder that is attached to the flat plate member 110 by being inserted through the holder through hole 112. The adhesive holder 120 is configured to be movable up and down within a certain range so that the amount of protrusion from the substrate holding surface 110X can be controlled.

[0021] The substrate carrier 100 further includes a plurality of supports 130 for the flat plate member 110 to support the periphery of the glass substrate 10. Any known technology such as a clamping mechanism can be used as the supports 130. That is, the glass substrate 10 is supported and fixed to the substrate holding surface 110X by the adhesive holders 120 and supports 130 arranged in a plurality of positions, and is transported together with the substrate carrier 100. The shape and dimensions of the flat plate member 110 are appropriately set according to the dimensions of the glass substrate 10 and the dimensions (film formation area) of the single product size to be chamfered. The dimensions, number and arrangement of the pin through hole 111, the holder through hole 112, the adhesive holder 120 and the support 130 are also appropriately set according to the dimensions of the glass substrate 10 and the chamfering dimensions (film formation area).

[0022] In this embodiment, the adhesive holder 120 is not placed in the area of ​​the glass substrate 10 that will become the image display area in the final product, but is placed only in the chamfered boundary portion (also called the frame area). Therefore, the adhesive holder 120 is placed at a distance of at least the length of the short side, and the unsupported area becomes large.

[0023] <Adhesive holder> Next, the structure of the adhesive holder (substrate holder) according to this embodiment will be described with reference to Figures 3 and 4. A plurality of adhesive holders according to this embodiment are arranged on the substrate holding surface of the substrate carrier to hold the substrate.

[0024] FIG. 3 is a schematic diagram of an adhesive holder 120 according to this embodiment. The adhesive holder 120 is configured such that an elastomer EB layer 125, a deformation barrier layer 124, and an elastomer EA layer 123, which are adhered to a metal shaft 126, overlap in the Z direction, i.e., the lamination direction is the Z direction, and an adhesive layer (not shown) is formed between each layer. The elastomer EA layer 123 is an elastic layer having an adhesive surface. The elastomer EB layer 125 is an elastic layer disposed between the metal shaft 126 and the deformation barrier layer 124. The deformation barrier layer 124 has a higher rigidity than the elastomer EA layer 123 and the elastomer EB layer 125, and is an intermediate layer disposed between the elastomer EA layer 123 and the elastomer EB layer 125. In one example, each elastomer layer is made of fluororubber that does not contain siloxane bonds, taking into consideration outgassing during the manufacturing process under vacuum. The adhesive layer may be made of a known adhesive or double-sided tape that does not emit outgassing components that adversely affect the manufacturing process under vacuum. In this embodiment, the shaft 126 is a stainless steel shaft with an outer diameter of 10 mm (φ10), and is a support member that is fixed to the flat plate member 110 on the substrate carrier 100 side to support the elastomer EB layer 125, as described below. The elastomer EB layer 125 and the elastomer EA layer 123 are both fluororubber with a diameter of φ10 and a thickness of 0.5 mm. The deformation barrier layer 124 is a stainless steel part with a diameter of φ10 and a thickness of 1 mm.

[0025] 4 is a schematic diagram showing a state in which the adhesive holder 120 according to this embodiment is attached to the substrate carrier 100, and is a cross-sectional view of the substrate carrier 100 and the adhesive holder 120 in the XZ plane passing through the dashed line B-B' in FIG. 1. As shown in FIG. 4, the adhesive holder 120 is fixed to the flat plate member 110 by the fixed portion 127 of the shaft 126 so as to integrate the holder fixing member 150 and the substrate carrier 100. The fixing means for the holder fixing member 150 and the flat plate member 110 can be a known means (not shown), such as a bolt. The elastomer EA layer 123 of the adhesive holder 120 is preferably inserted into the holder through hole 112 with its upper surface parallel to the substrate holding surface 110X and facing vertically upward, and is slightly protruding vertically upward from the substrate holding surface 110X. The amount of protrusion depends on the size of the members constituting adhesive holder 120 and the compression characteristics of the material, but is less than the thickness of glass substrate 10. Because the diameter of holder through hole 112 is large, adhesive holder 120 is allowed to oscillate in the vertical and horizontal directions within a predetermined range.

[0026] Next, the adhesive holder of this embodiment will be further described with reference to Fig. 5. Fig. 5(A) is a partial schematic diagram showing a state in which a pair of adhesive holders 120 is placed on a flat plate-like member 110 and a glass substrate 10 is suspended therefrom (a state in which the substrate carrier 100 is turned upside down so that the substrate holding surface 110X faces downward), and is a cross-sectional view of the XZ plane passing through the dashed line CC' in Fig. 1. Fig. 5(B) is a partial enlarged view of the dotted frame portion of Fig. 5(A).

[0027] In Fig. 5(A), for example, a pair of adhesive holders 120 installed in the frame region are spaced apart by 1050 mm, which corresponds to the case where a region of a predetermined size is chamfered from the glass substrate 10. The glass substrate 10 bends due to its own weight at a position near the middle M of the pair of adhesive holders 120, and a shear force F shown by an arrow in the Y direction as viewed in Fig. 5(A) acts on the adhesive holder 120 in association with the bending. If the concept of a toggle mechanism is applied, the shear force F can be simply expressed as (Equation 1) using the angle θ formed by the glass surfaces and the glass weight G. When hanging the glass, the angle θ is close to 180 degrees, but according to (Equation 1), if the angle θ is small, the magnitude of the shear force F is reduced. Therefore, if an adhesive member with low shear stiffness is used, the glass deflection becomes relatively large, and the angle θ can be reduced. The shear stiffness is expressed as the amount of displacement in the direction along the substrate holding surface 110X when a certain force (shear force) is applied in that direction. The higher the shear stiffness, the smaller the amount of displacement for a certain force. In general, since the shear stiffness decreases with soft materials, when the adhesive member is made of the same elastic body, the thicker the adhesive member is, the easier it is to move in the direction of the shear force (Y-axis direction). On the other hand, if the adhesive force between the adhesive member and the adherend is considered to be the stress generated when peeling it off, a thin adhesive member has a small deformation (= small stress at the contact interface), and a thick adhesive member has a large deformation (= large stress at the contact interface). For this reason, a thin adhesive member is considered to have a larger adhesive force than a thick adhesive member. In other words, if the same material is used, the greater the thickness, the smaller the shear stiffness and adhesive strength, and the smaller the thickness, the larger the shear stiffness and adhesive strength. Here, the shear stiffness refers to the magnitude of displacement in the horizontal plane (plane horizontal to the adhesive surface) relative to a given shear force, and the adhesive strength refers to the load capacity in the vertical downward direction (hanging direction).

[0028] The adhesive holder 120 according to this embodiment is functionally separated into an elastomer EA (adhesive) layer having an adhesive function and an elastomer EB (relaxation) layer that reduces shear stiffness, thereby improving the shear load resistance and reducing the shear force at the same time. That is, as shown in FIG. 5(B), the elastomer EB layer 125 bears the shear force and deforms, increasing the amount of glass deflection and mitigating the shear force. The deformation blocking layer 124 blocks the deformation of the elastomer EB layer 125, and the elastomer EA layer 123 adheres to the glass substrate 10 in a state where the shear force is relaxed. Therefore, even when a large screen is chamfered, the adhesive holder 120 in the frame region can continue to adhesively hold the glass substrate 10.

[0029] Note that thickness T1 of elastomer EA layer 123 that adheres to the glass and thickness T2 of elastomer EB layer 125 that contacts the shaft can be set in various ways depending on the physical properties of the elastomer. In one example, in consideration of ease of manufacture of adhesive holder 120, it is preferable that elastomer EA layer 123 and elastomer EB layer 125 satisfy the relationship T1≦T2 when made of the same material.

[0030] In addition, the amount of displacement of the adhesive surface of the elastomer EA layer 123 due to a force in the shear direction may be smaller than the amount of displacement of the elastomer EB layer 125. In one example, the elastomer EA layer 123 and the elastomer EB layer 125 may be made of the same material and the amount of displacement due to the shear force may be adjusted by changing the shape. In one example, the elastomer EA layer 123 and the elastomer EB layer 125 may have the same thickness, but the diameter of the elastomer EB layer 125 may be smaller than that of the elastomer EA layer 123 so that the amount of displacement of the elastomer EB layer 125 due to the shear force may be larger. In addition, any structure may be applied, such as making the elastomer EB layer 125 sponge-like, so that the amount of displacement of the elastomer EB layer 125 due to the shear force may be larger.

[0031] Moreover, the elastomer EA layer 123 and the elastomer EB layer 125 constituting the adhesive holder 120 are preferably made of fluororubber that does not contain siloxane bonds in its structure, and the deformation barrier layer 124 is preferably made of stainless steel. Furthermore, the elastomer EA layer 123 and the elastomer EB layer 125 constituting the adhesive holder 120 according to this embodiment preferably have a shear rigidity of 10 to 30 [N / mm] in order to reduce the shear force caused by the deflection of the glass substrate 10.

[0032] Here, regardless of the materials of the elastomer EA layer 123 and the elastomer EB layer 125 and the amount of displacement with respect to a certain shear force, by satisfying the relationship that the thickness T2 of the elastomer EB layer 125 is greater than the thickness T1 of the elastomer EA layer 123, the adhesive surface of the elastomer EA layer 123 can maintain sufficient adhesive strength and can reduce peeling due to shear force. In this case, as long as the elastomer EA layer 123 and the elastomer EB layer 125 each exhibit elasticity, the relationship of the amount of displacement with respect to a certain shear force between the elastomer EA layer 123 and the elastomer EB layer 125 is not limited. For example, the amount of displacement of the elastomer EA layer 123 with respect to a certain shear force may be greater than the amount of displacement of the elastomer EB layer 125. This is because the adhesive strength can be improved by making the elastomer EA layer 123 thin, and the shear force can be alleviated by making the elastomer EB layer 125 thick.

[0033] <Processing> As shown in the flow charts of Figures 6(A) and 6(B), the processing of the mother glass includes a mother glass holding step S601, a reversing step S602, a mask holding step S603, a film forming step S604, and a peeling step S605, and these steps are performed in a vacuum atmosphere. The mother glass holding step S601 further includes a preparation step S611, a placement step S612, and an adhesion step S613. The processing of the mother glass using the adhesive holder 120 according to this embodiment will be described below in order.

[0034] <<Mother glass holding process (S601)>> In S601, a glass substrate 10 is held by a substrate carrier 100 in a substrate holding device 700 shown in Fig. 7. The substrate holding device 700 shown in Fig. 7 includes a substrate holding chamber (first chamber) R1, a pin unit 200 (substrate moving mechanism) that moves the glass substrate 10 up and down in the Z direction, a pressing unit 400 that presses the glass substrate 10, and a support stand 500 that supports the substrate carrier 100.

[0035] The substrate carrier 100 is supported by a support stand 500, and is configured so that the substrate holding surface 110X of the flat plate member 110 of the substrate carrier 100 is parallel to a horizontal plane. Note that, although Fig. 7 shows a case where a ball screw mechanism is used as a mechanism for vertically moving the pin 240 and the pressing unit 400, other known techniques such as a rack and pinion system may also be used.

[0036] The pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 that moves up and down along the screw shaft 220 as the screw shaft 220 rotates, and a pin 240 that is fixed to the nut portion 230 and moves up and down together with the nut portion 230. A plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220.

[0037] The pressing unit 400 includes a motor 410, a screw shaft 420 rotated by the motor 410, a nut portion 430 that moves up and down along the screw shaft 420 as the screw shaft 420 rotates, a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430, and a pressing portion 450 provided at the tip of the shaft portion 440. Note that a plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 430 and the outer peripheral surface of the screw shaft 420. A plurality of pressing portions 450 are provided so that each pressing portion corresponds to a corresponding one of the plurality of adhesive holders 120.

[0038] The substrate holding chamber R1 is divided into a substrate processing area A1, a first driving source arrangement area A2, and a second driving source arrangement area A3. The first driving source arrangement area A2 is provided vertically below the substrate processing area A1, and the second driving source arrangement area A3 is provided vertically above the substrate processing area A1. The substrate carrier 100 and the like are arranged in the substrate processing area A1. The motor 210 and the like of the pin unit 200 are arranged in the first driving source arrangement area A2, and the motor 410 and the like of the pressing unit 400 are arranged in the second driving source arrangement area A3. This configuration can prevent foreign matter generated by the rotation of the motors 210, 410 and foreign matter generated at the sliding portion of the ball screw from entering the substrate processing area A1. It is also possible that not all of areas A1, A2, and A3 are located within the vacuum atmosphere of the substrate holding chamber R1, but rather, for example, the substrate processing area A1 is located within the vacuum atmosphere of the substrate processing area R1, and the first driving source placement area A2 and the second driving source placement area A3 are located under the atmospheric atmosphere.

[0039] The pin unit 200, which drives the pin 240 that moves the glass substrate 10 up and down in the Z-axis direction, and the drive unit 400, which drives the pressing unit 450, are connected to a controller 720 by control lines 201 and 401, respectively, and are controlled by the controller 720 executing a control program. The control will be described below. The power supply unit 710 supplies power to each part of the system.

[0040] <<<Preparation process (S611)>>> In a preparation state before the glass substrate 10 is placed on the substrate carrier 100, both the pins 240 and the pressing portion 450 are waiting at the uppermost position in the vertical direction. In this state, the pins 240 protrude from the pin through holes 111 of the flat member 110 in the substrate carrier 100 vertically upward from the substrate holding surface 110X. The elastomer EA layer of the adhesive holder 120 protrudes slightly from the substrate holding surface 110X and is fixed to the flat member 110 as shown in FIG. 4. In addition, the pressing portion 450 is separated from the substrate carrier 100. In this state, when the glass substrate 10 is carried into the substrate processing area A1 of the substrate holding chamber R1 by a mechanism not shown, the glass substrate 10 is placed on the pins 240 as shown in FIG. 7.

[0041] <<<Installation process (S612)>>> When the pin 240 is moved vertically downward by the motor 210, the tip of the pin 240 penetrates the pin through hole 111 of the flat plate-like member 110 and moves vertically downward beyond the surface opposite to the substrate holding surface 110X. As a result, the glass substrate 10 comes into contact with the elastomer EA layer 123 of the adhesive holder 120.

[0042] 8 shows a state where the pin 240 moves downward and the glass substrate 10 comes into contact with the elastomer EA layer 123 of the adhesive holder 120. When a large-screen display is to be chamfered from the glass substrate 10, the adhesive holder 120 is not present on the glass surface corresponding to the image display area as shown in FIG. 1. This makes it possible to prevent scratches on the glass surface corresponding to the image display area caused by dust or the like when dust or the like adheres to the surface of the adhesive holder 120. In addition, the downward movement of the pin 240 may leave undulations on the glass substrate 10, but the undulations of the glass substrate 10 can be reduced by adjusting the downward movement of the pin 240.

[0043] <<<Adhesion process (S613)>>> Next, in S613, the glass substrate 10 is pressed using a pressing mechanism. The pressing unit 450 is moved vertically downward by the motor 410, so that the contact surface between the elastomer EA layer 123 of the adhesive holder 120 and the mother glass can be sufficiently secured. At this time, instead of pressing the multiple pressing units 450 simultaneously against the mother glass, the pressing area may be controlled to gradually change from a specific start point to a specific end point. For example, pressing is controlled to start from the center of the glass substrate 10 in the longitudinal direction and to be pressed sequentially toward both ends. This makes it possible to prevent the glass substrate 10 from undulating. FIG. 9 shows a state in which the pressing unit 450 moves downward and the glass substrate 10 comes into contact with and adheres to the elastomer EA layer 123 of the adhesive holder 120 that protrudes slightly from the flat plate-like member 110.

[0044] 10, the pressing unit 450 is moved vertically upward by the motor 410. The periphery of the glass substrate 10 is fixed to the substrate carrier 100 by the support 130, and a sufficient contact surface with the elastomer EA layer 123 is secured. In this manner, the glass substrate 10 is integrated with the substrate carrier 100, completing the process prior to being carried out from the substrate holding chamber R1.

[0045] <<Reversal process (S602)>> 11(A) and 11(B) are schematic cross-sectional views of the inversion device. The inversion device includes an inversion chamber R2, a holding member 610 that holds the substrate carrier 100, a rotating shaft 620 fixed to the holding member 610, a motor 630 that rotates the rotating shaft 620, and a support member 640 that axially supports the rotating shaft 620.

[0046] As shown in FIG. 11(A), the substrate carrier 100 integrated with the glass substrate 10 is transported from the substrate holding chamber R1 to the reversing chamber R2 by a mechanism (not shown) and held by the holding member 610. The substrate carrier 100 then rotates 180 degrees, and the mother glass faces vertically downward (hangs) relative to the substrate carrier as shown in FIG. 11(B). When chamfering a large screen, the mother glass in the portion not held by the adhesive holder 120 is deflected vertically downward. The adhesive holder 120 according to this embodiment has an elastomer EB layer and has low shear stiffness, so that it is possible to continuously and stably hold the glass substrate 10 by reducing the shear force caused by the deflection.

[0047] <<Mask holding step (S603)>> The substrate carrier 100 holding the glass substrate 10 is transported from the reversing chamber R2 to the alignment chamber. The mask 20 waiting in the alignment chamber and the glass substrate 10 are aligned, and the substrate carrier is placed above the mask in an aligned state. When fixing the substrate carrier 100 to the mask 20, for example, a means using magnetism such as an electromagnet or a mechanical mechanism such as a clamp can be used. It is also possible to not fix the substrate carrier 100 to the mask 20, but to place the substrate carrier on the mask 20 that is on a transport member such as a roller, and move them together on the transport member.

[0048] <<Film formation process (S604)>> FIG. 12 is a schematic cross-sectional view showing an outline of a deposition apparatus as an example of a film forming apparatus. The deposition apparatus includes a film forming chamber R3, in which an evaporation source 30 is installed. The substrate carrier 100, which holds the glass substrate 10 and the mask 20 integrally, is transported from the alignment chamber to the film forming chamber R3. The substrate carrier 100 passes through a space in which the film forming material is evaporated or sublimated from the evaporation source 30, forming a thin film on the glass substrate 10. It is also possible to adopt a configuration in which a plurality of film forming chambers are provided, each of which is provided with a film forming source that emits a different film forming material, and the substrate carrier 100 is transported in sequence to sequentially form a plurality of types of thin films on the glass substrate 10. When the film formation is completed, the mask 20 combined with the glass substrate 10 is removed. Alternatively, a different mask may be combined again to repeat the film forming process.

[0049] <<Peeling process (S605)>> After the film-forming step S604 is completed and the mask is removed, the mother glass is peeled off. FIG. 13(A) and FIG. 13(B) are schematic cross-sectional views showing an outline of the mother glass peeling device. The mother glass peeling device includes a mother glass peeling chamber R4. The mother glass peeling device includes a pin unit 200 for moving the glass substrate 10 up and down and a support stand 500, similar to the substrate holding device. The substrate carrier 100 transported from the film-forming chamber R3 to the mother glass peeling chamber R4 has the support 130 released as shown in FIG. 13(A). Then, the motor 210 moves the pins 240 vertically upward as shown in FIG. 13(B), and the glass substrate 10 is lifted by the multiple pins 240 and separated from the substrate carrier 100. Then, the glass substrate 10 is carried out of the mother glass peeling chamber R4.

[0050] In addition, when the glass substrate 10 is vertically separated upward from the substrate carrier 100 by the pin 240, a mechanism for controlling the adhesive holder 120 is provided to reduce the adhesive force of the adhesive holder 120 and facilitate peeling the glass substrate 10 from the substrate carrier 100. As shown in FIG. 14, the adhesive holder 120 has a shaft 126 locked horizontally to the vertical direction indicated by the straight line L while adhering the glass substrate 10, but when the glass substrate 10 is separated from the substrate carrier, the control member 28 presses the shaft 126 in the direction of the arrow D1, and the shaft 126 can be tilted at a predetermined angle as indicated by the arrow D2. At this time, the pressing force in the direction D1 is preferably greater than the load capacity of the adhesive holder 120 in the shear direction. This biases the pressure applied to the adhesive surface of the adhesive holder 120, making it easier to peel the glass substrate 10 from the adhesive holder 120.

[0051] As described above, according to this embodiment, the adhesive holder 120 that adhesively holds the mother glass to the substrate carrier is laminated in such a way that a portion that obtains a strong adhesive force against peeling (a layer with a small thickness if made of the same material) and a portion with a small shear rigidity that relieves shear force (a layer with a large thickness if made of the same material) are separated by an intermediate layer with high rigidity (deformation blocking layer). This makes it possible to appropriately achieve both a strong adhesive force that reliably holds the mother glass against its weight and prevention of peeling due to shear force caused by glass bending.

[0052] <Other embodiments> The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0053] 10: Mother glass, 20: Mask, 30: Evaporation source, 100: Substrate carrier, 110: Flat plate member, 110X: Substrate holding surface, 111: Pin through hole, 112: Holder through hole, 115: Frame, 120: Adhesive type holder, 123: Elastomer EA (adhesive) layer, 124: Deformation barrier layer, 125: Elastomer EB (relaxation) layer, 126: Shaft, 127: Fixed part, 130: Support, 150: Holder fixing member, 200: Pin unit, 210: Motor, 2 20: screw shaft, 230: nut portion, 240: pin, 400: pressing unit, 410: motor, 420: screw shaft, 430: nut portion, 440: shaft portion, 450: pressing portion, 500: support base, 610: holding member, 620: rotating shaft, 630: motor, 640: support member, 710: power supply, 720: control unit, A1: substrate processing area, A2: first drive source arrangement area, A3: second drive source arrangement area, R1: substrate holding chamber, R2: reversing chamber, R3: film formation chamber, R4: mother glass peeling chamber

Claims

1. A substrate holder provided on a substrate carrier for holding and transporting a substrate vertically downward, comprising: a first elastic layer having an adhesive surface that adheres to the substrate; a second elastic layer that is bonded to a support member on the substrate carrier side and has a larger displacement than the first elastic layer with respect to a predetermined force in a direction parallel to the adhesive surface; an intermediate layer disposed between the first and second elastic layers and having a stiffness higher than each of the stiffness of the first elastic layer and the stiffness of the second elastic layer; A substrate holder comprising:

2. 2. The substrate holder according to claim 1, wherein the first and second elastic layers are made of the same material.

3. 2. The substrate holder according to claim 1, wherein the first and second elastic layers are made of an elastomer such as fluororubber.

4. 4. The substrate holder according to claim 1, wherein the thickness of the first elastic layer in the stacking direction is smaller than the thickness of the second elastic layer in the stacking direction.

5. 5. The substrate holder according to claim 1, wherein the intermediate layer is made of stainless steel.

6. 6. The substrate holder according to claim 1, wherein the stiffness against shear force of at least one of the first and second elastic layers is within a range of 10 to 30 [N / mm].

7. A substrate holder provided on a substrate carrier for holding and transporting a substrate vertically downward, comprising: a first elastic layer having an adhesive surface that adheres to the substrate; a second elastic layer bonded to a support member on the side of the substrate carrier and having a thickness greater than that of the first elastic layer; an intermediate layer disposed between the first and second elastic layers and having a stiffness higher than both the stiffness of the first elastic layer and the stiffness of the second elastic layer; A substrate holder comprising:

8. 8. The substrate holder according to claim 7, wherein the first and second elastic layers are made of the same material.

9. 8. The substrate holder according to claim 7, wherein the first and second elastic layers are made of an elastomer such as fluororubber.

10. 10. The substrate holder according to claim 7, wherein the intermediate layer is made of stainless steel.

11. 11. The substrate holder according to claim 7, wherein the stiffness against shear force of at least one of the first and second elastic layers is within a range of 10 to 30 [N / mm].

12. A substrate carrier that holds and transports a substrate placed thereon, The substrate carrier is provided with a substrate holder according to any one of claims 1 to 11 at each of a plurality of positions on the substrate holding surface. A substrate carrier comprising:

13. A substrate carrier according to claim 12; a film forming apparatus for performing a film forming process on the substrate held by the substrate holder, A film forming system comprising:

14. holding a substrate with a substrate carrier according to claim 12; performing a film formation process on the substrate held by the substrate holder; and peeling the substrate after the film formation process from the adhesive surface.

2. A method for producing an electronic device comprising the steps of:

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