Substrate carrier, deposition system, and method for manufacturing electronic device

Abstract

To provide a substrate holding technique capable of suppressing separation and vibration of a glass substrate.SOLUTION: A substrate carrier has a plurality of substrate holders, and holds and transports a substrate vertically downward by the plurality of substrate holders. The plurality of substrate holders at least includes a first substrate holder that adhesively holds the substrate and a second substrate holder that has shear rigidity higher than that of the first substrate holder and adhesively holds the substrate. On the substrate holding surface, the distance from the second substrate holder to the center of the substrate is shorter than the distance from the first substrate holder to the center of the substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate carrier, a deposition system, and a method for manufacturing an electronic device. [Background technology]

[0002] In recent years, the FPD (Flat Panel Display) industry has tended to use large glass substrates for production efficiency. For example, glass substrates with a side length of more than 2 meters, such as G7 size (1870 x 2200 mm) and G8 size (2160 x 2460 mm), are used. After undergoing manufacturing processes such as film deposition on these large glass substrates, they are chamfered to the product panel size according to demand to become the final product.

[0003] As a film forming apparatus for forming a film on a glass substrate, there is an in-line type film forming apparatus in which the glass substrate is suspended and held by a substrate carrier, and the film is formed while being transported together with the substrate carrier. In this case, Patent Document 1 discloses that an adhesive holder is used as one means for the substrate carrier to hold the glass substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-195670 A Summary of the Invention [Problem to be solved by the invention]

[0005] Large glass substrates are sometimes used for chamfering to create large finished panels, such as 65-inch or 78-inch panels. If an adhesive holder is used to hold a large glass substrate within the screen display area of ​​a large finished panel, defects may occur during the film formation process. For this reason, adhesive holders are sometimes placed only on the chamfer boundaries, avoiding the screen display area of ​​the finished panel.

[0006] If adhesive holders are placed only on the chamfered boundaries, the finished panel will be large, and a large force will be applied to the adhesive holder in the shear direction perpendicular to the hanging direction of the glass substrate due to bending caused by deformation due to the glass's own weight and thermal displacement caused by the film formation process. This can cause the glass substrate to peel off from the adhesive holder, resulting in defects in the film formation process. Patent Document 1 discloses that by reducing the shear direction rigidity of the adhesive holder so that the glass substrate does not peel off from the adhesive holder, the force in the shear direction is alleviated and the peeling of the glass substrate is prevented.

[0007] On the other hand, if the rigidity of the adhesive holder in the shear direction is reduced, there is a problem in that when the substrate carrier receives a disturbance while transporting the glass substrate, the glass substrate vibrates, resulting in defects.

[0008] In view of the above problems, an object of the present invention is to provide a substrate holding technique capable of suppressing peeling and vibration of a glass substrate. [Means for solving the problem]

[0009] In order to solve the above problems, according to the substrate carrier of the present invention, A plurality of substrate holders are provided, A substrate carrier for holding and transporting a substrate vertically downward by the plurality of substrate holders, The plurality of substrate holders include: a first substrate holder that adhesively holds a substrate; a second substrate holder having a shear stiffness higher than that of the first substrate holder and adhesively holding a substrate; At least The present invention is characterized in that, on a substrate holding surface, the distance from the second substrate holder to the center of the substrate is shorter than the distance from the first substrate holder to the center of the substrate. Effect of the Invention

[0010] According to the present invention, a substrate holding technique capable of suppressing peeling and vibration of a glass substrate can be provided. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a schematic plan view showing the substrate carrier according to the first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing the substrate carrier according to the first embodiment. [Diagram 3] FIG. 2 is a diagram showing an example of an arrangement of substrate holders according to the first embodiment. [Figure 4] 1A and 1B are views showing a substrate holder according to a first embodiment. [Diagram 5] (A) and (B) are diagrams explaining the forces acting on a mother glass held by a substrate carrier. [Figure 6] 5 is a flowchart for attaching / detaching a mother glass to / from the substrate carrier according to the embodiment. [Figure 7] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 8] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 9] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 10] 5A to 5C are diagrams illustrating the operation of the substrate holding device according to the embodiment. [Figure 11] 5A to 5C are diagrams illustrating the operation of a reversing device of the substrate holding device according to the embodiment. [Figure 12] 5A to 5C are explanatory diagrams illustrating the operation of the film forming apparatus of the substrate holding device according to the embodiment. [Figure 13] 5A to 5C are explanatory views of the operation of the substrate holding device according to the embodiment at the time of peeling. [Figure 14] 5A to 5C are explanatory views of the operation of the substrate holding device according to the embodiment at the time of peeling. [Figure 15] (A) is a diagram showing the arrangement of substrate holders on a substrate carrier, and (B) is a diagram showing the amount of shear displacement for each arrangement. [Figure 16] 13(A) to 13(E) are diagrams showing modified examples of the substrate holder. [Figure 17]FIG. 11 is a schematic diagram of a substrate carrier according to a second embodiment. [Figure 18] (A) is a diagram showing the arrangement of substrate holders on a substrate carrier, and (B) is a diagram showing the amount of shear displacement for each arrangement. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0013] [First embodiment] The substrate carrier according to the present embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic plan view of a substrate carrier on which an adhesive holder according to the present embodiment is installed. For ease of explanation, the scale of Figure 1 may differ from the actual scale. Figure 2 is a schematic cross-sectional view of the substrate carrier according to the present invention, and is a cross-sectional view on the XZ plane passing through the line A-A' in Figure 1. Note that in Figures 1 and 2, some components are shown with dotted lines to make the positional relationship easier to understand.

[0014] The substrate carrier 100 shown in FIG. 1 includes a flat plate-shaped member 110 and a frame 115 that supports the flat plate-shaped member 110. A holding surface (hereinafter referred to as a substrate holding surface 110X or a glass holding surface 110X) that holds the mother glass (glass substrate) 10 by the adhesive holder 120 is formed as a flat surface on the flat plate-shaped member 110. The flat plate-shaped member 110 is provided with a plurality of pin through holes 111 at a portion corresponding to a boundary portion of the chamfer size. As shown in FIG. 2, the glass substrate 10 can be moved up and down by moving a pin 240 that can appear and disappear from the substrate holding surface 110X through the pin through hole 111 up and down. A plurality of holder through holes 112 are also provided adjacent to the pin through hole 111. The adhesive holder 120 is a substrate holder that is attached to the flat plate-shaped member 110 by being inserted through the holder through hole 112. The adhesive holder 120 is configured to be movable up and down within a certain range so that the amount of protrusion from the substrate holding surface 110X can be controlled.

[0015] The substrate carrier 100 further includes a plurality of supports 130 for the flat plate member 110 to support the periphery of the glass substrate 10. Any known technology such as a clamping mechanism can be used as the supports 130. That is, the glass substrate 10 is supported and fixed to the substrate holding surface 110X by the adhesive holders 120 and supports 130 arranged in a plurality of positions, and is transported together with the substrate carrier 100. The shape and dimensions of the flat plate member 110 are appropriately set according to the dimensions of the glass substrate 10 and the dimensions (film formation area) of the single product size to be chamfered. The dimensions, number and arrangement of the pin through hole 111, the holder through hole 112, the adhesive holder 120 and the support 130 are also appropriately set according to the dimensions of the glass substrate 10 and the chamfering dimensions (film formation area).

[0016] The adhesive holder 120 is not placed in the area that will become the image display area in the final product, but is placed only in the chamfered boundary (also called the frame area). As a result, the adhesive holder 120 is placed at a distance of at least the length of the short side, which increases the unsupported area. The chamfered boundary (frame area) is the area between the two parts used as the display panel in the product.

[0017] Next, the arrangement of the adhesive holder 120 on the substrate carrier 100 according to this embodiment will be described with reference to FIG. 3. FIG. 3 is a schematic plan view of the substrate carrier, showing a case where a chamfering pattern is formed using glass substrates with two large screens and five small screens. Adhesive holders 301 and 302 are arranged on the substrate carrier 100, and the adhesive parts of the adhesive holders 301 and 302 adhesively hold the glass substrates (not shown). The adhesive holders 301 and 302 are arranged only on the panel chamfer boundary on the substrate carrier 100 so as not to adhesively hold the effective part of the finished panel. The dotted lines shown in FIG. 3 indicate the diagonal lines of the glass substrate, and the intersection of the dotted lines indicates the approximate center of the glass substrate. The adhesive holder 301 arranged in this region has a higher shear rigidity than the adhesive holders 302 arranged in other places, as described later. Although the number of adhesive holders 301 is six in FIG. 3, this is not limited to this. In other words, a plurality of substrate holders 120 are arranged on the substrate carrier 100, and the substrate holders include adhesive holders 301 and 302. Also, adhesive holder 301 is arranged closer to the center of the glass substrate than adhesive holder 302.

[0018] <Adhesive holder> Next, the adhesive holders 301 and 302 installed on the substrate carrier 100 will be described. FIG. 4(A) shows a first embodiment of the adhesive holder 301, and FIG. 4(B) shows a second embodiment of the adhesive holder 302. As shown in FIG. 4(A), the adhesive holder 301 has an elastomer layer (elastic layer) 310 as an adhesive layer on the metal shaft 126, and an adhesive layer (not shown) is formed between the two. A known material can be used as the material for the adhesive layer, and it is preferable that the material does not emit outgassing components that adversely affect the vacuum film deposition process. In addition, the elastomer layer 310 is preferably fluororubber that does not contain siloxane bonds so as not to emit outgassing components that adversely affect the vacuum film deposition process. In this embodiment, the metal shaft 126 is made of stainless steel or ceramic parts with a diameter of 10 mm, and the elastomer layer 310 is made of fluororubber with a diameter of 10 mm and a thickness of 0.5 mm. The substrate carrier 100 is fixed to the flat plate member 110 at a fixed portion 127 so that the fixing member 150 and the substrate carrier 100 are integrated.

[0019] As shown in FIG. 4B, the adhesive holder 302 is laminated with an elastomer B layer (elastic body B layer) 121 that is adhered to a metal fixed part 127, a deformation blocking layer (middle layer) 122, and an elastomer A layer (elastic body A layer) 123 that is an adhesive layer that adhesively holds the substrate. An adhesive layer (not shown) is formed between each layer. A known material can be used as the material for the adhesive layer, and it is preferable that the adhesive layer does not emit outgassing components that adversely affect the vacuum film formation process. In addition, the elastomer A layer and the elastomer B layer are preferably fluororubber that does not contain siloxane bonds so as not to emit outgassing components that adversely affect the vacuum film formation process. In one example, the metal shaft 126 is a stainless steel or ceramic part with a diameter of 10 mm, and the deformation blocking layer 122 is a stainless steel or ceramic part with a diameter of 10 mm and a thickness of 1 mm. In one example, the elastomer A layer 123 and the elastomer B layer 121 are both made of fluororubber with a diameter of 10 mm and a thickness of 0.5 mm. The substrate carrier 100 is fixed to the flat plate member 110 at a fixed portion 127 so that the fixing member 150 and the substrate carrier 100 are integrated.

[0020] The adhesive holder 301 shown in FIG. 4(A) is configured to omit the elastomer B layer 121 and the deformation barrier layer 122 compared to the adhesive holder 302 shown in FIG. 4(B). Since the deformation barrier layer 122 is made of metal, the elastomer B layer 121 may be considered as an elastic element. Therefore, without the elastomer B layer 121, the adhesive holder 301 has fewer elastic elements between the substrate carrier 100 and the adhesively held glass substrate 10, and has a higher shear rigidity than the adhesive holder 302. The shear rigidity is expressed as the amount of displacement in a direction along the substrate holding surface 110X when a certain force is applied in that direction. The higher the shear rigidity, the smaller the amount of displacement for a certain force. Therefore, the amount of displacement of the adhesive surface of the adhesive layer for a shear force, i.e., a force in a direction parallel to the adhesive surface, is larger for the adhesive holder 302 than for the adhesive holder 301.

[0021] As shown in Fig. 4(A) and Fig. 4(B), the adhesive holders 301 and 302 are fixed to the flat plate member 110 via the fixing member 150 at the fixed portion 127 of the shaft 126 so as to be integrated with the substrate carrier 100. The fixing member 150 and the flat plate member 110 can be fixed by a known means (not shown), such as a bolt. The elastomer layer 310 of the adhesive holder 301 and the elastomer A layer 123 of the adhesive holder 302 are inserted into the holder through hole 112 with their upper surfaces parallel to the substrate holding surface 110X and facing vertically upward, and protrude slightly vertically upward from the substrate holding surface 110X. The amount of protrusion depends on the size of the members constituting the adhesive holder 120 and the compressive properties of the material, but in one example, it is less than the thickness of the glass substrate 10. Because the diameter of the holder through hole 112 is large, the adhesive holder 120 is allowed to swing vertically and horizontally within a predetermined range.

[0022] Next, a method for determining the location of the adhesive holder 301, which has a higher shear stiffness than the adhesive holder 120, on the substrate carrier 100 will be described. The amount of shear displacement applied to the adhesive holder when the substrate carrier 100 shown in FIG. 1 adhesively holds the glass substrate 10 at the location shown in FIG. 15(A) and a vacuum film formation process is applied is shown, which is obtained by simulation. In the simulations shown in FIG. 15(A) and FIG. 15(B), the adhesive holders 120 placed on the substrate carrier 100 are calculated as having the same characteristics. FIG. 15(B) shows the amount of shear displacement applied to the adhesive holder 120 at each location, and FIG. 15(A) shows the attachment positions of the adhesive holders 120 on the substrate carrier 100 corresponding to the graphs shown in FIG. 15(B). For example, 134 in FIG. 15(B) indicates the position of the adhesive holder 120 indicated by the arrow 134 in FIG. 15(A), and is a curve connecting the plots of the shear displacement of each adhesive holder 120. The adhesive holder 120 placed at point 135 shown in FIG. 15(B) has a very small shear displacement compared to the adhesive holders 120 placed at other positions, even when a vacuum film formation process is applied. Therefore, by increasing the rigidity of the adhesive holder 120 in the shear direction, even if a larger shear force is applied, it is possible to prevent the glass from peeling off without exceeding the allowable shear force of the adhesive holder. In addition, since the adhesive holder 120 placed at point 135 has a small shear displacement, vibration of the glass substrate 10 can be suppressed by placing an adhesive holder 120 with a small displacement against a force in the shear direction.

[0023] The position of the adhesive holder at point 135 shown in FIG. 15(B) on the substrate carrier 100 is near the intersection of the diagonal lines of the substrate carrier 100, as shown by point 135 in FIG. 15(A). It can be seen that although it is not strictly the center due to the placement of the adhesive holder, it is approximately the center of the transport carrier. The range to which the adhesive holder with high shear stiffness is placed can be determined according to the value of the allowable shear force of the adhesive holder. For example, during simulation, the adhesive holder placed at the point where the shear displacement amount is equal to or less than a predetermined threshold value is the adhesive holder with high stiffness 301 shown in FIG. 4(A), and the adhesive holder placed at the other points is the adhesive holder with low stiffness 302 shown in FIG. 4(B). This makes it possible to adhesively hold the glass substrate 10 in a state where the glass substrate 10 is deflected. Also, by adhesively holding the vicinity of the center of the glass substrate with the adhesive holder with high stiffness 301, vibration of the glass substrate 10 can be suppressed.

[0024] Next, the shear stiffness of the adhesive holder of this embodiment will be described with reference to Fig. 5(A) and Fig. 5(B). In Fig. 5(A) and Fig. 5(B), the adhesive holder 302 will be described as an example, but the same applies to the adhesive holder 301. Fig. 5(A) is a partial schematic diagram showing a state in which a pair of adhesive holders 302 is installed on a flat plate-like member 110 constituting the substrate carrier 100, and a glass substrate 10 having a length (X direction) of 2200 mm, a width (Y direction) of 2200 mm, and a thickness of 0.5 mm is suspended (a state in which the substrate carrier 100 is turned upside down so that the substrate holding surface 110X is facing downward), and is a cross-sectional view of the XZ plane passing through the dashed line CC' in Fig. 1. Fig. 5(B) is a partial enlarged view of the dotted frame portion of Fig. 5(A).

[0025] In Fig. 5(A), a pair of adhesive holders 302 installed in the frame area are spaced 1050 mm apart from each other, which corresponds to the case where an area of ​​80 inches (996 mm x 1771 mm) in size is chamfered from the glass substrate 10. The glass substrate 10 bends due to its own weight at a position near the middle M of the pair of adhesive holders 302, and a shear force F, indicated by an arrow in the Y direction as viewed in Fig. 5(A), acts on the adhesive holder 302 in association with the bending. If the concept of a toggle mechanism is applied, the shear force F can be simply expressed as (Equation 1) using the angle θ formed by the glass surfaces and the glass weight G. TIFF0007649693000001.tif6115When hanging glass, the angle θ is close to 180 degrees, but according to (Equation 1), the smaller the angle θ, the smaller the magnitude of the shear force F is. Therefore, if an adhesive material with a small shear stiffness is used, the glass deflection becomes relatively large, and the angle θ can be made smaller. In general, the shear stiffness decreases with soft materials, so if the adhesive material is made of the same elastic body, the thicker it is, the easier it is for the adhesive material to move in the direction of the shear force (Y-axis direction). On the other hand, if we focus on the stress generated when peeling the adhesive force between the adhesive material and the adherend, a thin adhesive material has a small deformation (= small stress at the contact interface), and a thick adhesive material has a large deformation (= large stress at the contact interface). For this reason, it is considered that a thin adhesive material has a larger adhesive force than a thick adhesive material. In other words, if the same material is used, the shear stiffness and adhesive force will be small when the thickness is large, and the shear stiffness and adhesive force will be large when the thickness is small. Here, shear stiffness refers to the magnitude of displacement in a horizontal plane (a plane horizontal to the adhesive surface) relative to a given shear force, and adhesive strength refers to the load-bearing capacity in the vertical downward direction (hanging direction).

[0026] The adhesive holder 302 according to this embodiment is functionally separated into an elastomer A (adhesive) layer having an adhesive function and an elastomer B (relaxation) layer that reduces shear stiffness, thereby improving the shear load resistance and reducing the shear force at the same time. That is, as shown in FIG. 5(B), the elastomer B layer 121 bears the shear force and deforms, increasing the amount of glass deflection and mitigating the shear force. The deformation blocking layer 122 blocks the deformation of the elastomer B layer 121, and the elastomer A layer 123 adheres to the glass substrate 10 in a state where the shear force is relaxed. Therefore, even when a large screen is chamfered, the adhesive holder 302 in the frame region can continue to adhesively hold the glass substrate 10.

[0027] The thickness T1 of elastomer A layer 123 that adheres to the glass and the thickness T2 of elastomer B layer 121 that contacts the shaft can be set in various ways depending on the physical properties of the elastomer. In one example, in consideration of ease of manufacture of adhesive holder 120, when elastomer A layer 123 and elastomer B layer 121 are made of the same material, the relationship T1≦T2 is satisfied.

[0028] Moreover, elastomer A layer 123 and elastomer B layer 121 constituting adhesive holder 302 are preferably made of fluororubber that does not contain siloxane bonds in its structure, and deformation barrier layer 122 is preferably made of stainless steel. Furthermore, elastomer A layer 123 and elastomer B layer 121 constituting adhesive holder 302 according to this embodiment preferably have a shear rigidity of 10 to 30 [N / mm] in order to reduce the shear force caused by the deflection of glass substrate 10.

[0029] <Processing> As shown in the flow charts of Figures 6(A) and 6(B), the processing of the mother glass includes a mother glass holding step S601, a reversing step S602, a mask holding step S603, a film forming step S604, and a peeling step S605, and these steps are performed in a vacuum atmosphere. The mother glass holding step S601 further includes a preparation step S611, a placement step S612, and an adhesion step S613. The processing of the mother glass using the adhesive holder 120 according to this embodiment will be described below in order.

[0030] <<Mother glass holding process (S601)>> In S601, a glass substrate 10 is held by a substrate carrier 100 in a substrate holding device 700 shown in Fig. 7. The substrate holding device 700 shown in Fig. 7 includes a substrate holding chamber (first chamber) R1, a pin unit 200 (substrate moving mechanism) that moves the glass substrate 10 up and down in the Z direction, a pressing unit 400 that presses the glass substrate 10, and a support stand 500 that supports the substrate carrier 100.

[0031] The substrate carrier 100 is supported by a support stand 500, and is configured so that the substrate holding surface 110X of the flat plate member 110 of the substrate carrier 100 is parallel to a horizontal plane. Note that, although Fig. 7 shows a case where a ball screw mechanism is used as a mechanism for vertically moving the pin 240 and the pressing unit 400, other known techniques such as a rack and pinion system may also be used.

[0032] The pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 that moves up and down along the screw shaft 220 as the screw shaft 220 rotates, and a pin 240 that is fixed to the nut portion 230 and moves up and down together with the nut portion 230. A plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220.

[0033] The pressing unit 400 includes a motor 410, a screw shaft 420 rotated by the motor 410, a nut portion 430 that moves up and down along the screw shaft 420 as the screw shaft 420 rotates, a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430, and a pressing portion 450 provided at the tip of the shaft portion 440. Note that a plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 430 and the outer peripheral surface of the screw shaft 420. A plurality of pressing portions 450 are provided so that each pressing portion corresponds to a corresponding one of the plurality of adhesive holders 120.

[0034] The substrate holding chamber R1 is divided into a substrate processing area A1, a first driving source arrangement area A2, and a second driving source arrangement area A3. The first driving source arrangement area A2 is provided vertically below the substrate processing area A1, and the second driving source arrangement area A3 is provided vertically above the substrate processing area A1. The substrate carrier 100 and the like are arranged in the substrate processing area A1. The motor 210 and the like of the pin unit 200 are arranged in the first driving source arrangement area A2, and the motor 410 and the like of the pressing unit 400 are arranged in the second driving source arrangement area A3. This configuration can prevent foreign matter generated by the rotation of the motors 210, 410 and foreign matter generated at the sliding portion of the ball screw from entering the substrate processing area A1. It is also possible that not all of areas A1, A2, and A3 are located within the vacuum atmosphere of the substrate holding chamber R1, but rather, for example, the substrate processing area A1 is located within the vacuum atmosphere of the substrate processing area R1, and the first driving source placement area A2 and the second driving source placement area A3 are located under the atmospheric atmosphere.

[0035] The pin unit 200, which drives the pin 240 that moves the glass substrate 10 up and down in the Z-axis direction, and the drive unit 400, which drives the pressing unit 450, are connected to the controller 720 by control lines 201 and 401, respectively, and are controlled by executing a control program. The control will be described below. The power supply unit 710 supplies power to each part of the system.

[0036] <<<Preparation process (S611)>>> In a preparation state before the glass substrate 10 is placed on the substrate carrier 100, both the pins 240 and the pressing portion 450 are waiting at the uppermost position in the vertical direction. In this state, the pins 240 protrude from the pin through holes 111 of the flat member 110 in the substrate carrier 100 vertically upward from the substrate holding surface 110X. The elastomer layer of the adhesive holder 120 is fixed to the flat member 110, protruding slightly from the substrate holding surface 110X as shown in FIG. 4. In addition, the pressing portion 450 is separated from the substrate carrier 100. In this state, when the glass substrate 10 is carried into the substrate processing area A1 of the substrate holding chamber R1 by a mechanism not shown, the glass substrate 10 is placed on the pins 240 as shown in FIG. 7.

[0037] <<<Installation process (S612)>>> When the motor 210 moves the pin 240 vertically downward, the tip of the pin 240 penetrates the pin through hole 111 of the flat plate-like member 110 and moves vertically downward beyond the surface opposite to the substrate holding surface 110X. As a result, the glass substrate 10 comes into contact with the adhesive layer (elastomer layer) of the adhesive holder 120.

[0038] FIG. 8 shows a state where the pin 240 moves downward and the glass substrate 10 comes into contact with the elastomer layer of the adhesive holder 120. When chamfering a large screen display from the glass substrate 10, the adhesive holder 120 is not present on the glass surface corresponding to the image display area as shown in FIG. 1. This makes it possible to prevent scratches on the glass surface corresponding to the image display area caused by dust or the like when dust or the like adheres to the surface of the adhesive holder 120. In addition, the downward movement of the pin 240 may leave undulations on the glass substrate 10, but the undulations of the glass substrate 10 can be reduced by adjusting the downward movement of the pin 240.

[0039] <<<Adhesion process (S613)>>> Next, in S613, the glass substrate 10 is pressed using a pressing mechanism. The pressing unit 450 is moved vertically downward by the motor 410, so that the contact surface between the adhesive layer of the adhesive holder 120 and the mother glass can be sufficiently secured. At this time, instead of pressing the multiple pressing units 450 simultaneously against the mother glass, the pressing area may be controlled to gradually change from a specific start point to a specific end point. For example, pressing is controlled to start from the center of the glass substrate 10 in the longitudinal direction and to be pressed sequentially toward both ends. This makes it possible to prevent the glass substrate 10 from undulating. FIG. 9 shows a state in which the pressing unit 450 moves downward and the glass substrate 10 comes into contact with and adheres to the elastomer A layer 123 of the adhesive holder 120 that protrudes slightly from the flat plate-like member 110.

[0040] 10, the pressing part 450 is moved vertically upward by the motor 410. The periphery of the glass substrate 10 is fixed to the substrate carrier 100 by the support 130, and a sufficient contact surface with the elastomer A layer 123 is secured. In this manner, the glass substrate 10 is integrated with the substrate carrier 100, completing the process before being carried out from the substrate holding chamber R1.

[0041] <<Reversal process (S602)>> 11(A) and 11(B) are schematic cross-sectional views of the inversion device. The inversion device includes an inversion chamber R2, a holding member 610 that holds the substrate carrier 100, a rotating shaft 620 fixed to the holding member 610, a motor 630 that rotates the rotating shaft 620, and a support member 640 that axially supports the rotating shaft 620.

[0042] As shown in FIG. 11(A), the substrate carrier 100 integrated with the glass substrate 10 is transported from the substrate holding chamber R1 to the reversing chamber R2 by a mechanism (not shown) and held by the holding member 610. The substrate carrier 100 then rotates 180 degrees, and the mother glass faces vertically downward (hangs) relative to the substrate carrier as shown in FIG. 11(B). When chamfering a large screen, the mother glass in the portion not held by the adhesive holder 120 is deflected vertically downward. The adhesive holder 120 according to this embodiment has an elastomer EB layer and has low shear stiffness, so that it is possible to continuously and stably hold the glass substrate 10 by reducing the shear force caused by the deflection.

[0043] <<Mask holding step (S603)>> The substrate carrier 100 holding the glass substrate 10 is transported from the reversing chamber R2 to the alignment chamber. The mask 20 waiting in the alignment chamber and the glass substrate 10 are aligned, and the substrate carrier is placed above the mask in an aligned state. When fixing the substrate carrier 100 to the mask 20, for example, a means using magnetism such as an electromagnet or a mechanical mechanism such as a clamp can be used. It is also possible to not fix the substrate carrier 100 to the mask 20, but to place the substrate carrier on the mask 20 that is on a transport member such as a roller, and move them together on the transport member.

[0044] <<Film formation process (S604)>> FIG. 12 is a schematic cross-sectional view showing an outline of a deposition apparatus as an example of a film forming apparatus. The deposition apparatus includes a film forming chamber R3, in which an evaporation source 30 is installed. The substrate carrier 100, which holds the glass substrate 10 and the mask 20 integrally, is transported from the alignment chamber to the film forming chamber R3. The substrate carrier 100 passes through a space in which the film forming material is evaporated or sublimated from the evaporation source 30, forming a thin film on the glass substrate 10. It is also possible to adopt a configuration in which a plurality of film forming chambers are provided, each of which is provided with a film forming source that emits a different film forming material, and the substrate carrier 100 is transported in sequence to sequentially form a plurality of types of thin films on the glass substrate 10. When the film formation is completed, the mask 20 combined with the glass substrate 10 is removed. Alternatively, a different mask may be combined again to repeat the film forming process.

[0045] <<Peeling process (S605)>> After the film-forming step S604 is completed and the mask is removed, the mother glass is peeled off. FIG. 13(A) and FIG. 13(B) are schematic cross-sectional views showing an outline of the mother glass peeling device. The mother glass peeling device includes a mother glass peeling chamber R4. The mother glass peeling device includes a pin unit 200 for moving the glass substrate 10 up and down and a support stand 500, similar to the substrate holding device. The substrate carrier 100 transported from the film-forming chamber R3 to the mother glass peeling chamber R4 has the support 130 released as shown in FIG. 13(A). Then, the motor 210 moves the pins 240 vertically upward as shown in FIG. 13(B), and the glass substrate 10 is lifted by the multiple pins 240 and separated from the substrate carrier 100. Then, the glass substrate 10 is carried out of the mother glass peeling chamber R4.

[0046] In addition, when the glass substrate 10 is vertically separated upward from the substrate carrier 100 by the pin 240, a mechanism for controlling the adhesive holder 120 is provided to reduce the adhesive force of the adhesive holder 120 and facilitate peeling the glass substrate 10 from the substrate carrier 100. As shown in FIG. 14, the adhesive holder 120 has a shaft 126 locked horizontally to the vertical direction indicated by the straight line L while adhering the glass substrate 10, but when the glass substrate 10 is separated from the substrate carrier, the control member 28 presses the shaft 126 in the direction of the arrow D1, and the shaft 126 can be tilted at a predetermined angle as indicated by the arrow D2. At this time, the pressing force in the direction D1 is preferably greater than the load capacity of the adhesive holder 120 in the shear direction. This biases the pressure applied to the adhesive surface of the adhesive holder 120, making it easier to peel the glass substrate 10 from the adhesive holder 120.

[0047] <Modification of adhesive holder> Next, an embodiment applicable to adhesive holders 301 and 302 will be described. The description assumes that adhesive holder 301 is the one shown in Fig. 4(A), and adhesive holder 302, which is arranged on the outer edge side of adhesive holder 301, is the one shown in Fig. 4(B).

[0048] Another example of the adhesive holder 302 will be described with reference to Figs. 16(A) to 16(E).

[0049] FIG. 16(A) shows another example of the adhesive holder 302. A metal shaft 126 and an elastomer layer 1602 are configured, and an adhesive sheet layer 1601 is formed between the two. A known material can be used as the material for the adhesive sheet layer 1601, and it is preferable that the material does not emit outgassing components that adversely affect the vacuum film formation process. In one example, the metal shaft 126 is a stainless steel or ceramic part with a diameter of 10 mm, and the elastomer layer 1602 is a fluororubber with a diameter of 10 mm and a thickness of 0.5 mm. The fixed part 127 is fixed to the flat plate 110 of the substrate carrier 100 via a fixing member 150. The adhesive holder shown in FIG. 16(A) and the adhesive holder shown in FIG. 4(A) have different adhesive sheet layers and adhesive layers. An adhesive sheet is coated on both sides, and the adhesive layer generally has a higher rigidity than the adhesive sheet layer. Therefore, since there is no adhesive sheet layer in Figure 4(A), the adhesive holder 301 shown in Figure 4(A) has fewer elastic elements between the substrate carrier 100 and the adhesively held glass substrate 10, and has higher shear rigidity, compared to the adhesive holder 302 shown in Figure 16(A).

[0050] Also, another example of the adhesive holder 302 is shown in Fig. 16(B) and Fig. 16(C). Fig. 16(B) is a view of the adhesive surface of the adhesive holder 302 viewed from the vertical direction (Z direction), and Fig. 16(C) is a cross section of Fig. 16(B) taken along the line AA. An elastomer C layer 1611 is formed on a metal base 1610, and an adhesive layer (not shown) is formed between the two. The periphery of the base 1610 is covered with an elastomer D layer 1612, and the periphery of the elastomer D layer 1612 is further covered with a pedestal portion 1613. An adhesive layer (not shown) is formed between the base 1610 and the elastomer D layer 1612, and between the elastomer D layer 1612 and the pedestal portion 1613. A known material can be used as the material for the adhesive layer, and it is preferable that the adhesive layer does not emit outgassing components that adversely affect the vacuum film formation process. In one example, the metal base 1610 is made of a stainless steel part with a diameter of 10 mm, the elastomer C layer 1611 is made of fluororubber with a diameter of 10 mm and a thickness of 0.5 mm. Furthermore, the elastomer D layer 1612 is made of fluororubber with an inner diameter of 10 mm and an outer diameter of 20 mm, and the base 1613 is made of a stainless steel part. There is no direct contact between the base 1610 and the base 1613, and between the elastomer C layer 1611 and the elastomer D layer 1612. The base 1613 is fastened to the substrate carrier. The adhesive holder shown in Fig. 16(B) and Fig. 16(C) and the adhesive holder shown in Fig. 4(A) have the same configuration except for the elastomer D layer 1612 and the base 1613. Since the base 1613 is made of metal, the elastomer D layer 1612 can be considered as an elastic element. Therefore, due to the absence of the elastomer D layer 1612, the adhesive holder shown in Figure 4(A) has fewer elastic elements between the substrate carrier 100 and the adhesively held glass substrate 10, and has higher shear rigidity, compared to the adhesive holder 302 shown in Figures 16(B) and 16(C).

[0051] Also, another example of the adhesive holder 302 is shown in Fig. 16(D) and Fig. 16(E). Fig. 16(D) is a view of the adhesive surface of the adhesive holder viewed from the vertical direction (Z direction), and Fig. 16(E) is a cross section of Fig. 16(D) taken along the line BB. An elastomer layer 1621 is formed on a metal base 1620, and an adhesive layer (not shown) is formed between the two. The base 1620 is bonded to a leaf spring portion 1622, and the leaf spring portion 1622 is bonded to a pedestal portion 1623. A known material can be used as a material for the adhesive layer, and it is desirable that the material does not emit outgassing components that adversely affect the vacuum film formation process. In one example, the metal base 1620 and the pedestal portion 1623 are stainless steel parts, and the elastomer layer 1621 is a fluororubber having a diameter of 10 mm and a thickness of 0.5 mm. Furthermore, the leaf spring portion 1622 is a stainless steel part with a thickness of 0.5 mm, L shown in FIG. 16(D) being 50 mm, and H shown in FIG. 16(E) being 10 mm. The base 1620 and the pedestal portion 1623 are not in direct contact with each other, and the pedestal portion 1623 is fastened to the flat plate 110 on the substrate carrier 100 side. The adhesive holder 302 shown in FIG. 16(D) and FIG. 16(E) differs from the adhesive holder 301 shown in FIG. 4(A) in the shape of the base 1620 and the presence of the leaf spring portion 1622 and the pedestal portion 1623. As an elastic element, it is sufficient to consider the thickness direction of the leaf spring portion. Therefore, since there is no leaf spring portion, the adhesive holder 301 shown in FIG. 4(A) has fewer elastic elements between the substrate carrier 100 and the adhesively held glass substrate 10 compared to the adhesive holder 302 shown in FIG. 16(D) and FIG. 16(E), and has higher shear rigidity.

[0052] 16(D) and 16(E) have anisotropy in stiffness in the shear direction, unlike other types of adhesive holders. Since stiffness is low in the thickness direction of the leaf spring part 152, it is necessary to change the attachment phase of the adhesive holder 302 according to the vector of the shear force at the position of the adhesive pad mounted on the substrate carrier 100.

[0053] As described above, even if the substrate carrier 100 is disturbed while transporting the glass substrate 10, the adhesive holder 301 with high shear stiffness can suppress vibration of the glass substrate. In addition, the adhesive holder 302 with low shear stiffness can suppress peeling of the glass substrate from the adhesive holder caused by bending due to deformation by the glass's own weight or thermal displacement during the film formation process.

[0054] <Second embodiment> Next, the second embodiment will be described with reference to FIG. 17. FIG. 17 is a schematic plan view of a substrate carrier, showing a case where a chamfering pattern is formed with three large screens and two small screens using a glass substrate of G8.5 size (2200 mm×2500 mm). Adhesive holders 1701 and 1702 are fixed to a substrate carrier 1700, and the adhesive parts of the adhesive holders 1701 and 1702 adhesively hold a glass substrate (not shown) to transport the glass substrate. The adhesive holders cannot be arranged on the substrate carrier so as to adhesively hold a part that will be an effective part of a finished panel, and are arranged only at the panel chamfer boundary, which is the same as the substrate carrier shown in FIG. 1. The dotted lines shown in FIG. 17 indicate the diagonal lines of the glass substrate, and the intersection of the dotted lines indicates the approximate center of the glass substrate. The adhesive holder 1701 arranged in the area near the approximate center has a higher shear rigidity than the adhesive holder 1702 arranged in other places. For example, adhesive holder 301 in Fig. 4(A) can be applied to adhesive holder 1701, and adhesive holder 302 in Fig. 4(B) can be applied to adhesive holder 1702. In the example in Fig. 17, the number of adhesive holders 1701 is nine, but this is not limited to this.

[0055] Next, a method of arranging adhesive holder 1701, which has higher shear stiffness than adhesive holder 1702, in the approximate center of the substrate carrier will be described. The vicinity of the intersection of the diagonal lines of the substrate carrier shown by the dotted lines in Fig. 17 is inside the product panel due to the arrangement of the product panel chamfer, and no adhesive holder is arranged therein. In this case, perpendicular lines are drawn from the intersection of the diagonal lines to the nearby chamfer boundary, and multiple intersections of the perpendicular lines and the chamfer boundary are defined as the approximate center.

[0056] FIG. 18 shows the shear force applied to the adhesive holder when the substrate carrier shown in FIG. 17 adhesively holds glass and a vacuum film-forming process is applied, which is obtained by simulation. In the simulation to obtain the numerical values ​​shown in FIG. 18, the adhesive holders arranged on the substrate carrier are calculated as having the same characteristics. FIG. 18(B) shows the shear displacement applied to the adhesive holder at each position, and FIG. 18(A) shows the attachment positions of the adhesive holders on the substrate carrier 1700 corresponding to each graph shown in FIG. 18(B). For example, 1810 in FIG. 18(B) shows the position of the adhesive holder arranged along the arrow 1810 in FIG. 18(A) in correspondence with the shear displacement. The shear displacement values ​​of the adhesive holders at positions 1815, 1816, 1817, and 1818 shown in FIG. 18(B) are very small compared to the others, even when a vacuum film-forming process is applied.

[0057] Therefore, by increasing the rigidity of the adhesive holder in the shear direction, even if a larger shear force is applied, it is possible to prevent the glass from peeling off without exceeding the allowable shear force of the adhesive holder.

[0058] 18(B) coincide with the adhesive holders that are close to the center of the substrate carrier, it is understood that the adhesive holders with high shear stiffness should be placed approximately at the center of the substrate carrier. As in the first embodiment, the range of the adhesive holders with high shear stiffness should be determined depending on the allowable shear force of the adhesive holders.

[0059] As the adhesive holder 1702, the one shown in Figs. 16(A) to 16(E) may be used.

[0060] As described above, even if the substrate carrier is disturbed while transporting the glass substrate, the adhesive holder 301 with high shear stiffness can suppress vibration of the glass substrate. Also, the adhesive holder 302 with low shear stiffness can suppress peeling of the glass substrate from the adhesive holder caused by bending due to deformation by the glass's own weight or thermal displacement during the film formation process.

[0061] <Other embodiments> The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0062] 100: substrate carrier, 301, 302: adhesive holder, 110: flat plate member, 310, 121, 123: elastomer layer, 122: deformation barrier layer

Claims

1. A plurality of substrate holders are provided, A substrate carrier for holding and transporting a substrate vertically downward by the plurality of substrate holders, The plurality of substrate holders include: a first substrate holder that adhesively holds a substrate; a second substrate holder having a shear stiffness higher than that of the first substrate holder and adhesively holding a substrate; At least A substrate carrier, characterized in that, on a substrate holding surface, a distance from said second substrate holder to a center of said substrate is shorter than a distance from said first substrate holder to a center of said substrate.

2. The substrate carrier of claim 1 , wherein the shear stiffness corresponds to an amount of displacement of the substrate holding surfaces of the plurality of substrate holders in response to a force applied in a direction parallel to the holding surfaces of the plurality of substrate holders.

3. The substrate carrier according to claim 1 or 2, characterized in that all of the substrate holders among the plurality of substrate holders having a shear stiffness lower than the shear stiffness of the second substrate holder are positioned closer to the outer edge of the substrate than the second substrate holder.

4. The first substrate holder includes: a first elastic layer having an adhesive surface that adheres to the substrate; a second elastic layer that is adhered to a support member on the substrate carrier side and has a larger displacement than the first elastic layer with respect to a predetermined shear force in a predetermined direction parallel to the adhesive surface; an intermediate layer disposed between the first elastic layer and the second elastic layer and having a rigidity higher than the rigidity of the first and second elastic layers; The substrate carrier of claim 1 , further comprising:

5. 5. The substrate carrier according to claim 4, wherein the first and second elastic layers are made of an elastomer such as fluororubber.

6. 6. The substrate carrier of claim 4, wherein the intermediate layer is stainless steel.

7. The second substrate holder includes:

7. The substrate carrier according to claim 1, further comprising an elastic layer attached to a support member on the substrate carrier side and having an adhesive surface that adheres to the substrate.

8. A substrate carrier according to any one of claims 1 to 7; a film forming apparatus for performing a film forming process on the substrate held by the substrate carrier, A film forming system comprising:

9. Holding a substrate by a substrate carrier according to any one of claims 1 to 7; performing a film formation process on the substrate held by the substrate carrier; peeling the substrate from the substrate holding surface after the film formation process; A method for manufacturing an electronic device, comprising:

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