Substrate processing systems and consumable parts

Abstract

To improve the management of components of a substrate processor.SOLUTION: The substrate processor includes: a processing chamber including a chamber body; a gate valve provided in the chamber body; and a reader arranged in a connection unit connecting an inner space of the chamber body and the gate valve and / or in the gate valve. The reader is configured so as to read a marker formed by processing a surface and / or the inside of an edge ring arranged in the inner space. The substrate processor can thus improve the management of components of the substrate processor.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a method for processing a substrate. system , and Consumables Regarding. [Background technology]

[0002] Parts can be managed by attaching tape showing the serial numbers of the parts to the parts. For example, parts are managed at the manufacturing site of a substrate processing apparatus by manually inputting and recording the serial numbers of the parts shown on the tape attached to the parts, and by checking which parts are installed in the substrate processing apparatus. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 4-146649 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides techniques that allow for improved management of parts for substrate processing equipment. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, Processing Processing chamber At least one substrate processing apparatus comprising: and, The above process Chamber Inside To A transfer chamber for transferring substrates And the above A transfer path along which the substrate is transferred to the processing chamber. and a reader disposed at the In the processing chamber to be placed in Consumables A substrate processing device configured to be capable of reading a marker formed on the surface and / or inside of the substrate. system is provided. Effect of the Invention

[0006] According to one aspect, management of parts for substrate processing apparatus can be improved. [Brief description of the drawings]

[0007] [Figure 1] FIG. 13 is a diagram showing an example of a marker engraved on a component according to the embodiment. [Diagram 2] FIG. 13 is a diagram showing the material and stamped state of a part according to an embodiment. [Diagram 3] 1 is a diagram showing a substrate processing system according to an embodiment; [Figure 4] 1 is a schematic cross-sectional view showing a substrate processing apparatus according to an embodiment; [Diagram 5] FIG. 1 is a diagram showing an example of a component management system according to an embodiment. [Figure 6] FIG. 4 is a diagram showing an example of information about a part included in two-dimensional code information according to the embodiment. [Figure 7] FIG. 11 is a diagram showing an example of available use information set for each user according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0009] [Parts engraving] First, the marking of a marker on a component according to the embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of a marker marked on a component according to the embodiment. The component in Fig. 1 is an edge ring 25 arranged in a substrate processing apparatus, and is an example of a component for the substrate processing apparatus.

[0010] A marker 25c is formed on the surface of the edge ring 25. The marker 25c is an engraving machined on the surface of the component, and has a two-dimensional code in which information about the edge ring 25 is graphically represented by a groove 25a1 formed in the edge ring 25. The code formed on the marker 25c may be a two-dimensional code such as a QR (Quick Response) code, a Data Matrix, or a barcode, or may be a three-dimensional code. In the embodiment, two-dimensional code information can be acquired from the marker 25c.

[0011] The marker 25c is embedded in the edge ring 25 by directly processing the edge ring 25 with, for example, a laser, and is not a sticker-like object to be affixed to the edge ring 25 or a mark drawn directly on the edge ring 25. Therefore, even if the surface of the edge ring 25 wears away due to repeated processes (such as etching of the substrate) in the substrate processing apparatus, the marker 25c can be prevented from disappearing by digging a groove of a predetermined depth. This allows the two-dimensional code information embedded in the marker 25c to be read by a reader, and the two-dimensional code information can be managed by being integrated with the edge ring 25. The two-dimensional code information can be read by a portable reader or a reader mounted on the device.

[0012] Furthermore, in the case of a sticker-like marker affixed to the edge ring 25 or a marker directly drawn on the edge ring 25, the marker 25c may peel off or disappear when the edge ring 25 is worn out, which may contaminate the substrate processing apparatus and adversely affect the process.

[0013] However, in the embodiment, edge ring 25 is directly machined to carve grooves 25a1 in edge ring 25 itself, and marker 25c is formed. Components used in the substrate processing apparatus are made of materials that do not adversely affect the processes performed in the substrate processing apparatus. Therefore, even if marker 25c wears out together with edge ring 25, it does not adversely affect the processes. From the above, by marking marker 25c on components for substrate processing apparatus according to the embodiment, adverse effects on the processes can be avoided, and the efficiency of component management and management accuracy can be improved.

[0014] The two-dimensional code information held by the marker 25c can be read by the contrast of light generated when light irradiated from a reader to the marker 25c is reflected by the groove 25a1 of the marker 25c. The position of the marker 25c is the upper surface of the edge ring 25 in the example of FIG. 1, but is not limited thereto. For example, the marker 25c is preferably located on a surface (e.g., a side surface) that is not exposed to plasma when the edge ring 25 is placed in the substrate processing apparatus. This can suppress wear of the marker 25c. However, the location of the marker 25c is not limited thereto.

[0015] [Engraving] Next, the material of the part and the marking method will be described with reference to Fig. 2. Fig. 2 is a diagram showing the material of the part P according to the embodiment and the state in which it is marked. Fig. 2 shows a simplified view of an area Pa that is part of the area indicated by the marker 25c in Fig. 1.

[0016] The marker 25c is engraved on the part P by thermally processing the part P with a laser. Fig. 2(a) shows the state of a partial area Pa of the marker 25c engraved on the part P when the part P is made of quartz. The marker 25c is composed of a groove Pa1 formed in the part P by laser processing.

[0017] When the part P is made of quartz, the marker 25c is engraved on the part P by applying heat to the marking portion including the area Pa by applying a laser to the quartz, melting it and creating unevenness. This changes the amount of light reflected by the melted and smoothed groove Pa1 portion and the sand-printed glass portion Pb, creating a light contrast.

[0018] As a result, when the light output from the reader hits the marker 25c, the reader reads the two-dimensional code information from the contrast between the light incident on the groove Pa1 formed on the surface of the part P from the marker 25c formed on the part P and the light incident on the surface portion Pb. This makes it possible to obtain information about the part P, such as the part number, serial number, and manufacturing date of the part P, contained in the two-dimensional code information.

[0019] 2(b) shows the state of a partial area Pa of the marker 25c engraved on the part P when the part P is a ceramic part. The marker 25c is composed of a groove Pa1 formed in the part P by laser processing, the color of a part Pa2 discolored by laser processing, and the color of the part P before discoloration.

[0020] If the part P is ceramic, the marker 25c is engraved on the part P by applying heat to the area Pa by applying a laser to the ceramic, melting it and creating irregularities. This changes the amount of light reflected by the melted, smooth groove Pa1 and other areas, creating a light contrast. The area Pa to which heat was applied also changes color. The areas other than the area Pa to which heat was applied retain the ceramic's original color before discoloration, creating a color contrast between the color of the discolored area Pa2 and the other areas.

[0021] As a result, when the light output from the reader hits the marker 25c, the reader reads the contrast between the light incident on the groove Pa1 formed on the surface of the part P from the marker 25c formed on the part P and the light incident on other surface parts. At the same time, the reader reads the contrast between the color of the discolored part Pa2 and the color of the other parts from the marker 25c formed on the part P. The reader then reads the two-dimensional code information from the read light contrast and color contrast. This makes it possible to obtain information about the part P, such as the part number, serial number, and manufacturing date of the part P, contained in the two-dimensional code information.

[0022] 2(c) shows the state of a partial area Pa of the marker 25c engraved on the part P when the part P is made of aluminum, stainless steel (SUS), aluminum with an anodized surface, or silicon. The marker 25c is composed of a groove Pa1 formed in the part P by laser processing and the unevenness of the surface of the groove Pa1.

[0023] If the part P is made of aluminum, stainless steel, anodized, or silicon, a laser is irradiated onto the part P to finely cut the surface, and unevenness is created on the surface of the formed groove Pa1, thereby engraving the marker 25c into the part P. Since the unevenness on the surface of the groove Pa1 is finer than the unevenness when the part P is made of quartz or ceramic, diffuse reflection of light occurs, and the portion of the groove Pa1 appears white due to the diffuse reflection of light.

[0024] As a result, when the light output from the reader hits the marker 25c, the reader reads the light contrast from the amount of light reflected by the unevenness of the groove Pa1 formed on the surface of the part P from the marker 25c formed on the part P. The reader also reads the contrast between the white of the groove Pa1 part and the color of the other parts caused by the diffuse reflection of light. The reader obtains two-dimensional code information according to the read light contrast and / or color contrast. This makes it possible to obtain information about the part P, such as the part number, serial number, and manufacturing date of the part P, contained in the two-dimensional code information.

[0025] 2(d) shows the state of a partial area Pa of the marker 25c engraved on the part P when the part P is made of aluminum or stainless steel. The marker 25c is composed of the color of the oxide film formed on the part P by laser processing and the color of the part P before discoloration.

[0026] If the part P is aluminum or stainless steel, the laser is focused on the part P to transmit heat that is not enough to melt the part P. By applying heat without cutting the part P, an oxide film Pa3 is formed on the surface of the part P, and this oxide film Pa3 appears black. This creates a contrast between the black color of the area Pa where the oxide film Pa3 is formed and the color of the aluminum or stainless steel in the other areas.

[0027] As a result, when the light output from the reader hits the marker 25c, the reader reads the contrast between the black color of the area Pa where the oxide film Pa3 is formed and the color of the other areas. The reader then obtains two-dimensional code information according to the read color contrast. This makes it possible to obtain information about the part P, such as the part number, serial number, and manufacturing date of the part P, contained in the two-dimensional code information.

[0028] However, if part P shown in Fig. 2(d) is aluminum or stainless steel, the marking area including area Pa may rise due to thermal expansion caused by heat being transferred to the metal to develop color. In this case, the 2D code information may be transferred to the raised convex area. In that case, it is also possible to mark the code in area Pa only with white areas without creating black areas.

[0029] In the case of any of the materials shown in FIG. 2, the part P is directly processed to imprint the marker 25c on the part P. This makes it possible to prevent the marker 25c from adversely affecting processes such as etching. Furthermore, in the case of a part P that is consumed by plasma, such as the edge ring 25, by forming a groove Pa1 of a certain depth in the part P, it is possible to process the marker 25c on the part P so that the marker 25c is resistant to consumption even when the marker 25c is exposed to plasma. Furthermore, if the part P is prone to consumption, it is preferable to form the marker 25c on the side or other surface of the part P, in a position that is not easily exposed to plasma and where the reader can read the marker 25c.

[0030] In the above description, the marker 25c is engraved on the surface of the component P, but the present invention is not limited to this. For example, the marker 25c may form a groove (hollow space) inside the component P. When the marker 25c is formed inside the component P, the marker 25c is recognized by the color contrast due to the hollow space inside the component P. However, when the component P is transparent, the marker 25c can also be recognized by the light contrast.

[0031] In this way, the marker 25c imprinted on the part P according to the embodiment has embedded therein two-dimensional code information that can be read by a reader. Furthermore, the marker 25c has a function that allows for error correction of the two-dimensional code information. The size and amount of information of the two-dimensional code information are determined by three factors: the cell size (size of one dot), the number of cells (the number of dots that make up the two-dimensional code), and the error correction level (ability to restore data).

[0032] For example, the larger the cell size, the larger the size of each dot, making it easier to read the information. Also, the larger the number of cells, the more dots that make up the code and the more information it can carry. Also, the higher the error correction level, the larger the code size and the less information it can carry.

[0033] However, the higher the error correction level, the higher the data recovery capability. Therefore, even if part of the marker 25c is damaged or dirty due to wear of the part P, the information about the part P included in the two-dimensional code information can be obtained by error correction. For these reasons, the marker 25c is configured to enable error correction of the two-dimensional code information.

[0034] By using the above-described marking method, the component P for the substrate processing apparatus is processed and the marker 25c is directly marked on the component P, so that the marker 25c is configured as a part of the component P. As a result, even if the component P for the substrate processing apparatus is worn out, the marker 25c does not adversely affect the process.

[0035] Moreover, the marker 25c is configured to be able to read the two-dimensional code information by a groove and / or two or more colors formed in the component P when it is lowered. This makes it possible to obtain information about the component P contained in the two-dimensional code information by reading the marker 25c with a reader. Furthermore, the marker 25c has a function for correcting errors in the two-dimensional code information, so that even if part of the marker 25c is scraped off due to wear and tear of the component P, the two-dimensional code information can be restored using the error correction function.

[0036] Furthermore, when the two-dimensional code marker 25c according to the embodiment is engraved, the required engraving range can be reduced to about 1 / 13 compared to when the serial number of the part is engraved directly on the part. This makes it easier to process the marker 25c in a position on the part P that is not exposed to the plasma. Also, since the two-dimensional code information embedded in the marker 25c can be obtained using a reader, information on the part P cannot be obtained visually without using a reader. This makes it possible to protect the information on the part P. Also, using a reader to obtain and record the two-dimensional code information embedded in the marker 25c can contribute to shortening the recording work time and reducing recording errors.

[0037] [Substrate processing system and substrate processing apparatus] A substrate processing system having a substrate processing apparatus in which the components having the markers engraved thereon as described above are arranged and a transport chamber for transporting substrates to the substrate processing apparatus will be described with reference to Fig. 3. The substrate processing apparatus will also be described with reference to Fig. 4. Fig. 3 is a diagram showing a substrate processing system 1 according to an embodiment. Fig. 4 is a schematic cross-sectional view showing a substrate processing apparatus 11 according to an embodiment. Figs. 3 and 4 show an embodiment in which a reader is installed, but it is also possible to use a portable type reader without installing it in the substrate processing system and substrate processing apparatus.

[0038] The substrate processing system 1 includes processing chambers 111-114, a vacuum transfer chamber 120, load lock chambers 131, 132, an atmospheric transfer chamber 140, load ports 151-153, gate valves 161-168, and a computer 81. The vacuum transfer chamber 120 and the atmospheric transfer chamber 140 are examples of transfer chambers. The processing chambers 111-114 are examples of processing chambers of a substrate processing apparatus.

[0039] The processing chambers 111-114 have stages 111a-114a on which the wafer W is placed, and are connected to the vacuum transfer chamber 120 via gate valves 161-164. The insides of the processing chambers 111-114 are depressurized to a predetermined vacuum atmosphere, and the wafer W is subjected to a desired process therein.

[0040] The inside of the vacuum transfer chamber 120 is depressurized to a predetermined vacuum atmosphere. A transfer mechanism 121 is provided in the vacuum transfer chamber 120, and the transfer mechanism 121 transfers the wafer W between the processing chambers 111 to 114 and the load lock chambers 131 and 132.

[0041] The load lock chambers 131, 132 have stages 131a, 132a on which a wafer W is placed, and are connected to the vacuum transfer chamber 120 via gate valves 165, 166, and are connected to the atmospheric transfer chamber 140 via gate valves 167, 168. The insides of the load lock chambers 131, 132 have a function of switching between an atmospheric atmosphere and a vacuum atmosphere.

[0042] The atmospheric transfer chamber 140 has an atmospheric atmosphere, and is provided with a transfer mechanism 141. The transfer mechanism 141 transfers the wafer W between the load lock chambers 131, 132 and the carriers C of the load ports 151-153.

[0043] The computer 81 controls the entire substrate processing system 1. For example, the computer 81 controls the operations of the processing chambers 111-114, the transfer mechanisms 121, 141, the opening and closing of the gate valves 161-168, and switching between a vacuum atmosphere and an air atmosphere in the load lock chambers 131, 132. The computer 81 is an example of a control unit that controls the substrate processing system 1.

[0044] 3, the reader R is disposed in the vacuum transfer chamber 120, but is not limited thereto, and may be disposed at any position on the transfer path along which the substrate W is transferred to the processing chambers 111-114 of the substrate processing apparatus via the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. For example, the reader R may be disposed in the processing chambers 111-114, the load lock chambers 131, 132, the atmospheric transfer chamber 140, the load ports 151-153, or the gate valves 161-168. The number of readers R is not limited to one, and multiple readers may be disposed. As described above, it is also possible to use a portable type reader that is not mounted on the substrate processing system and the substrate processing apparatus.

[0045] The reader R reads the two-dimensional code information from the marker engraved on the part P placed in the processing chambers 111 to 114, the part P being transported, or the part P placed in another chamber. The reader R transmits the read two-dimensional code information to the computer 81. The computer 81 acquires the part number, serial number, manufacturing date, etc. of the part P from the received two-dimensional code information.

[0046] For example, if the edge ring 25 has a marker 25c engraved thereon, the edge ring 25 is transported along the path for transporting the substrate W. In this case, the marker 25c can be read by the reader R during transport of the edge ring 25, and two-dimensional code information can be obtained. This makes it easy to manage the parts of the edge ring 25 to be replaced. Furthermore, by reading the marker 25c by the reader R, it is possible to accurately manage whether the parts arranged in the substrate processing apparatus are products of the company or products of other companies.

[0047] (Substrate processing equipment) Next, the configuration of the substrate processing apparatus 11 will be described with reference to FIG. 4. The substrate processing apparatus 11 has a chamber 10 having an internal space 10s, which forms, for example, processing chambers 111 to 114 shown in FIG. 3. The chamber 10 has a chamber body 12 having a substantially cylindrical shape. A passage 12p is formed in a side wall of the chamber body 12. The substrate W passes through the passage 12p when being transferred between the internal space 10s and the outside of the chamber 10. The passage 12p can be opened and closed by a gate valve 12g. The gate valve 12g is provided along the side wall of the chamber body 12. The passage 12p is a passage through which the substrate W and the edge ring 25 are transferred, and a leader R is disposed in the passage 12p. The leader R may be disposed in the gate valve 12g.

[0048] A support 13 is provided on the bottom of the chamber body 12. The support 13 has a substantially cylindrical shape and is made of an insulating material. An edge ring 25 (also called a focus ring) that surrounds the periphery of the substrate and a mounting table 14 are provided on the support 13. The edge ring 25 has a substantially cylindrical shape and may be made of silicon or the like. A marker 25c is engraved on the upper surface of the edge ring 25. However, the position of the marker 25c is not limited to the upper surface of the edge ring 25, and may be a side or rear surface of the edge ring 25, or may be formed inside the edge ring 25, as long as the marker 25c is a position that can be read by the reader R or another reader outside the substrate processing apparatus 11.

[0049] The substrate processing apparatus 11 includes a mounting table 14 in an internal space 10s. The mounting table 14 supports a substrate W. The mounting table 14 includes an electrostatic chuck 20, a lower electrode 18, and an electrode plate 16. The electrode plate 16 and the lower electrode 18 are made of a conductor such as aluminum, and have a substantially disk shape.

[0050] The electrostatic chuck 20 is provided on the lower electrode 18. The electrode of the electrostatic chuck 20 is connected to a DC power supply. When a voltage from the DC power supply is applied to the electrode, the substrate W is held by the electrostatic chuck 20 by electrostatic attraction. The electrostatic chuck 20 supports the substrate W and an edge ring 25. A marker 14c is engraved on the side surface of the mounting table 14. However, the position of the marker 14c is not limited to the side surface of the mounting table 14, and may be on the upper surface of the mounting table 14 or may be formed inside the mounting table 14, as long as the marker 14c is in a position that can be read by the reader R or another reader outside the substrate processing apparatus 11.

[0051] An upper electrode 30 is provided above the mounting table 14. The upper electrode 30 is supported on the upper part of the chamber body 12 via an insulating member 32. The upper electrode 30 may include a top plate 34 and a support 36. The top plate 34 may be made of a low-resistance conductor or semiconductor that generates little Joule heat. A plurality of gas discharge holes 34a are formed in the top plate 34. The plurality of gas discharge holes 34a penetrate the top plate 34 in the plate thickness direction.

[0052] A marker 34c is engraved on the underside of the top plate 34. However, the position of the marker 34c is not limited to the underside of the top plate 34, and may be on the side of the top plate 34 or may be formed inside the top plate 34, as long as the marker 34c is in a position that can be read by the reader R or another reader outside the substrate processing apparatus 11. Hereinafter, the reader R or another reader outside the substrate processing apparatus 11 will also be referred to as "reader R, etc."

[0053] The support 36 detachably supports the top plate 34. The support 36 is made of a conductive material such as aluminum. A gas diffusion chamber 36a is provided inside the support 36. A plurality of gas holes 36b are formed in the support 36. The plurality of gas holes 36b extend downward from the gas diffusion chamber 36a. The plurality of gas holes 36b are connected to the plurality of gas discharge holes 34a. A gas inlet 36c is formed in the support 36. The gas inlet 36c is connected to the gas diffusion chamber 36a. A gas supply pipe 38 is connected to the gas supply pipe 38, and a gas source 40 is connected to the gas supply pipe 38. Gas from the gas source 40 passes through the gas supply pipe 38, passes through the plurality of gas holes 36b from the gas inlet 36c via the gas diffusion chamber 36a, and is introduced from the gas discharge hole 34a.

[0054] In the substrate processing apparatus 11, a shield 46 is detachably provided along the inner wall surface of the chamber body 12. The shield 46 is also provided on the outer periphery of the support part 13. The shield 46 prevents reaction products such as etching by-products from adhering to the chamber body 12.

[0055] A baffle plate 48 is provided between the support 13 and the side wall of the chamber body 12. The baffle plate 48 is formed, for example, by forming a corrosion-resistant film on the surface of a member made of aluminum. A plurality of through holes are formed in the baffle plate 48. An exhaust port 12e is provided below the baffle plate 48 and at the bottom of the chamber body 12. An exhaust device 50 is connected to the exhaust port 12e via an exhaust pipe 52.

[0056] The substrate processing apparatus 11 includes a high frequency power supply 62 that applies high frequency RF power. The high frequency power supply 62 is connected to the electrode plate 16 via a matching device 66, and is configured to generate high frequency RF power in order to generate plasma from the gas in the chamber 10. The frequency of the high frequency HF is, for example, within a range of 27 MHz to 100 MHz.

[0057] The substrate processing apparatus 11 may further include a computer 80. The computer 80 is an example of a control unit that controls each part of the substrate processing apparatus 11. The computer 80 executes a control program and controls each part of the substrate processing apparatus 11 according to recipe data, so that various processes are performed in the substrate processing apparatus 11.

[0058] In the substrate processing apparatus 11 having such a configuration, the top plate 34, the edge ring 25, and the mounting table 14 on which the markers are engraved have been given as examples of parts for the substrate processing apparatus 11, but the present invention is not limited to these. For example, other examples of parts for the substrate processing apparatus 11 include the baffle plate 48, the shield 46, etc., and the markers may be engraved on these members.

[0059] [Parts management system] Next, an example of a component management system to which a computer 80 that controls the substrate processing apparatus 11 and a computer 81 that controls the substrate processing system 1 are connected will be described with reference to Fig. 5. Fig. 5 is a diagram showing an example of a component management system according to an embodiment.

[0060] Some of the components P arranged in the substrate processing apparatus 11 and the components P arranged in the substrate processing system 1 are marked with markers (34c, 14c, 25c, etc.). A reader R or the like reads two-dimensional code information of the marker marked on the components P and transmits it to a computer 80 that controls the substrate processing apparatus 11 or a computer 81 that controls the substrate processing system 1.

[0061] The computer 80 and the computer 81 record the information about the part P included in the two-dimensional code information in a recording medium. Fig. 6 is a diagram showing an example of the information about the part P included in the two-dimensional code information according to the embodiment.

[0062] The computers 80 and 81 record, as information about the part P, for example, the part number "ER11", the part name "edge ring", the serial number "123456", and the manufacturing date "20190101" on the recording medium. Furthermore, the installation date and time "20200315 / 15:38" and the removal date and time "20210915 / 12:21" are recorded on the recording medium. The marker always has embedded therein information, particularly the part number, serial number, and manufacturing date. This allows the computers 80 and 81 to identify the part P by acquiring the part number, serial number, and manufacturing date.

[0063] The computer 80 and the computer 81 are connected to a host computer 100 via a network N. The number of the computers 80 and the computers 81 is not limited to two and may be any number. The host computer 100 may be a computer on the cloud.

[0064] The computers 80 and 81 may transmit information about the part P to the host computer 100. The host computer 100 may store the information about the part P received from the computers 80 and 81 in a recording medium and use it as history information for part management.

[0065] The timing of collecting information about the parts P will be described. A parts supplier or a manufacturer of substrate processing equipment directly marks a two-dimensional code marker containing information such as a serial number on the parts P to be shipped to a customer. Then, in order to know which parts P have been shipped, the two-dimensional code information embedded in the marked marker is read by a reader R or the like before shipping to the customer, and the read information about the parts P is recorded in a recording medium such as the host computer 100. When the substrate processing equipment 11 is manufactured, information about the parts P such as the serial number is also recorded, so that it is possible to know which parts P are incorporated in which substrate processing equipment 11. When a new part P is incorporated in the substrate processing equipment 11 or when a worn-out part P is removed, the two-dimensional code information embedded in the marker is read by a reader R or the like, and the read information is recorded in a recording medium such as the host computer 100. This makes it possible to manage which parts are attached and detached in which equipment and when based on the recorded information about the parts P.

[0066] For example, it is possible to check whether or not a third-party part is present by comparing the two-dimensional code information read at the time of shipment with the two-dimensional code information read when the part P is attached or detached. In addition, by recording the operation information of the substrate processing apparatus 11 in a recording medium such as the host computer 100, the operation time of each part P can be calculated, making it easy to check the correlation with the process characteristics.

[0067] Next, an example of how information about parts P is used will be described. When a problem occurs in each substrate processing apparatus 11, the host computer 100 and the computers 80, 81 can extract the accumulated information about parts P and use it to investigate the problem. In addition, based on the accumulated information about parts P, it becomes possible to confirm the correlation with process results such as etching, and this can be used when performing more delicate and complicated processes.

[0068] For example, when installing the substrate processing apparatus 11, by reading the marker engraved on the component P using a reader R or the like, it is possible to quickly determine which component P is used in the installed substrate processing apparatus 11, and the components can be efficiently managed and analyzed.

[0069] Furthermore, when a component P is removed from the substrate processing apparatus 11, by reading the marker formed on the component P to be removed, it is possible to quickly determine when and where the component P was manufactured and at what point in time it was removed from the substrate processing apparatus 11, enabling efficient component management and analysis.

[0070] Also, for example, the accumulated usage time of each part P can be managed from history information on the installation date and time of the substrate processing apparatus 11 and history information on the date and time of removal of the part from the substrate processing apparatus 11. Furthermore, if a problem such as damage or failure occurs in a part P, the damaged or failed part P can be quickly investigated from this history information.

[0071] The host computer 100 and the computers 80 and 81 may restrict the information that can be used among the history information accumulated by the user. Fig. 7 is a diagram showing an example of the available information set for each user according to the embodiment.

[0072] 7, user "A" can use the part number, serial number, and manufacturing date from the recorded history information. For example, when host computer 100 or computers 80, 81 display history information related to part P on the display unit of a terminal device owned by user "A," the display unit displays only the part number, serial number, and manufacturing date, and no other information.

[0073] On the other hand, user "B" can use the part number, part name, serial number, manufacturing date, installation date and time, and removal date and time from the recorded history information. In other words, the history information about part P displayed on the terminal device owned by user "A" is different from the history information about part P displayed on the terminal device owned by user "B". This makes it possible to manage the disclosure scope of the history information about part P for each user.

[0074] As described above, in the component P for the substrate processing apparatus according to the embodiment, a marker with a coded serial number is formed directly on the component P by laser processing. The reader R or the like acquires the two-dimensional code information embedded in the marker and records it in a recording medium such as the host computer 100. This contributes to shortening the recording work time and reducing recording errors. In addition, by recording the read two-dimensional code information in a recording medium such as the host computer 100, it is possible to accumulate history information of the components in one or more substrate processing apparatuses 11. This allows the components to be promptly managed, investigated, and analyzed based on the accumulated history information of the components.

[0075] In addition, by placing the marker engraved on the part within the viewfinder screen of the reader or camera, it is possible to realize an Augmented Reality (AR) function that displays virtual content corresponding to the marker by superimposing it on a display in a real environment. In this case, content information associated with the marker is stored in advance in the host computer 100 or the like. Then, by the reader or camera reading the marker, the content information associated with the marker is transmitted from the host computer 100 or the like to the reader or camera. This allows the desired content to be displayed on the display unit of the reader or camera.

[0076] The substrate processing apparatus and the substrate processing system according to the embodiments disclosed herein should be considered as illustrative and not restrictive in all respects. The above-described embodiments can be modified and improved in various forms without departing from the scope and spirit of the appended claims. The matters described in the above-described embodiments can be configured in other ways without contradiction, and can be combined without contradiction.

[0077] The substrate processing apparatus of the present disclosure can be applied to any type of apparatus, including Atomic Layer Deposition (ALD) apparatus, Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), and Helicon Wave Plasma (HWP). [Explanation of symbols]

[0078] 1. Substrate Processing System 11 Substrate processing equipment 14 Placement table 14c Marker 25 Edge Ring 25c Marker 34 Tabletop 34c Marker 80,81 Computers 100 host computer 111~114 Processing Room 120 Vacuum Transfer Chamber P parts R Leader

Claims

1. at least one substrate processing apparatus including a processing chamber; a transfer chamber for transferring a substrate into the processing chamber; a reader disposed on a transport path along which the substrate is transported to the processing chamber; The leader may: A marker including a groove having a depth that will not disappear due to a process by the substrate processing apparatus is readable on the surface and / or inside of a consumable part disposed in the processing chamber. Substrate processing system.

2. The reader is disposed in at least one of the processing chamber, the vacuum transfer chamber and / or the atmospheric transfer chamber which are the transfer chamber, a load lock chamber, a load port, and a gate valve. The substrate processing system of claim 1 .

3. The consumable parts are parts that are consumed by plasma processing. The substrate processing system according to claim 1 .

4. The marker is configured to be capable of reading code information based on the contrast of light incident on a groove formed on the surface and / or inside of the consumable part. The substrate processing system according to any one of claims 1 to 3.

5. The marker is configured to be able to read code information based on contrast between two or more colors formed on the surface and / or inside of the consumable part. The substrate processing system according to any one of claims 1 to 3.

6. The marker is configured to enable error correction of code information. The substrate processing system according to any one of claims 1 to 5.

7. The marker is a two-dimensional code. The substrate processing system according to any one of claims 1 to 6.

8. The consumable part is at least one of an upper electrode, a mounting table, an edge ring, a baffle plate, and a shield. The substrate processing system according to any one of claims 1 to 7.

9. A consumable part disposed within a processing chamber, comprising: The marker is configured to be readable by a reader disposed on a transport path along which the substrate is transported to the processing chamber, and includes a marker having a groove on its surface and / or inside, the groove having a depth that will not disappear due to a process by the substrate processing apparatus. Consumable parts.

10. The marker is read by the reader disposed in at least one of a vacuum transfer chamber and / or an atmospheric transfer chamber, a load lock chamber, a load port, and a gate valve. The consumable part according to claim 9.

11. The process is a plasma treatment. The consumable part according to claim 9 or 10.

12. The consumable parts are parts that are consumed by plasma processing. The consumable part according to any one of claims 9 to 11.

13. The marker is configured to be capable of reading code information based on the contrast of light incident on a groove formed on the surface and / or inside of the consumable part. The consumable part according to any one of claims 9 to 12.

14. The marker is configured to be able to read code information based on contrast between two or more colors formed on the surface and / or inside of the consumable part. The consumable part according to any one of claims 9 to 12.

15. The marker is configured to enable error correction of code information. The consumable part according to any one of claims 9 to 14.

16. The marker is a two-dimensional code. The consumable part according to any one of claims 9 to 15.

17. The consumable part is at least one of an upper electrode, a mounting table, an edge ring, a baffle plate, and a shield. The consumable part according to any one of claims 9 to 16.

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