Vacuum deposition apparatus and method for producing deposited film

Abstract

To provide a vacuum vapor deposition apparatus and a method for producing a vapor-deposited film in which an apparatus size is made smaller, utilization efficiency of a vapor deposition material is improved, and film thickness distribution of a vapor-deposited film is further made uniform.SOLUTION: A vacuum vapor deposition apparatus of an embodiment comprises: an evaporation source which evaporates a vapor deposition material; adjacent one mask and the other mask each of which holds one substrate and the other substrate which have a vapor deposition surface on which the vapor deposition material is vapor-deposited; and a drive part which rotates the one mask and the other mask in mutually opposite directions at the same speed, and in an in-plane direction of the vapor deposition surface. The one mask and the other mask are rectangular. The one mask is arranged in the state where positions of its corner parts are shifted with respect to positions of corner parts of the other mask. A distance between rotation centers of the one mask and the other mask is shorter than a diagonal line length of the one mask. Each corner part of the one and the other mask is chamfered such that adjacent masks do not interfere with each other even if phases of adjacent mask substrates are shifted by ±10°.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vacuum deposition apparatus and a method for producing a deposited film. [Background technology]

[0002] A flat panel X-ray detector that converts X-rays into visible light for detection includes a sensor array substrate having a scintillator film on its surface.

[0003] A scintillator film can be easily formed on a substrate by vacuum deposition, but it is difficult to deposit the deposition material, scintillator, uniformly on the substrate, so a method is used in which deposition is performed while the substrate is rotating. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-031785 A Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by the present invention is to provide a vacuum deposition apparatus and a method for producing a deposited film, which reduce the size of the apparatus itself, improve the utilization efficiency of the deposition material, and make the thickness distribution of the deposited film more uniform. [Means for solving the problem]

[0006] The vacuum deposition apparatus of the embodiment includes an evaporation source for evaporating an evaporation material, adjacent masks for holding one substrate and the other substrate having an evaporation surface on which the evaporation material is evaporated, and a drive unit for rotating the one mask and the other mask in the in-plane direction of the evaporation surface in opposite directions at the same speed. The one mask and the other mask are rectangular. The one mask is disposed with the position of its corners shifted from the position of the corners of the other mask. The distance between the rotation centers of the one mask and the other mask is shorter than the diagonal length of the one mask. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing the arrangement of a mask, a substrate, and a vapor port when the vacuum deposition apparatus shown in FIG. 5 is viewed from above. [Diagram 2] FIG. 2 is a cross-sectional view showing a flat panel X-ray detector. [Diagram 3] FIG. 3 is a perspective view showing the X-ray detection panel. [Figure 4] 4(a) is a cross-sectional view showing the vacuum deposition apparatus of the first embodiment, and (b) is a plan view of the vacuum deposition apparatus shown in (a). [Diagram 5] FIG. 5 is a flowchart showing a method for producing a vapor-deposited film according to the first embodiment. [Figure 6] FIG. 6 is a plan view showing the arrangement of masks in the vacuum deposition apparatus of the second embodiment. [Figure 7] FIG. 7 is a plan view showing the arrangement of a mask, a substrate, and a vapor port in a vacuum deposition apparatus according to the third embodiment. [Figure 8] FIG. 8 is a cross-sectional view showing a driving unit of a vacuum deposition apparatus according to the third embodiment. [Figure 9] FIG. 9 is a plan view showing a driving section of the vacuum deposition apparatus of FIG. [Figure 10] FIG. 10 is a plan view showing the arrangement of the masks in Comparative Example 1. As shown in FIG. [Figure 11] FIG. 11 is a plan view showing the arrangement of the masks in Comparative Example 2. As shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, a description will be given of a vacuum deposition apparatus and a method for manufacturing a deposited film according to the first embodiment. First, a configuration of an X-ray flat panel detector manufactured by the vacuum deposition apparatus and the method for manufacturing a deposited film according to the first embodiment will be described.

[0009] (X-ray flat panel detector) As shown in FIG. 2, the X-ray flat panel detector 1 includes an X-ray detection panel 2, a moisture-proof cover 3, a support plate 4, a circuit board 5, a lead plate 6 for X-ray shielding, a heat dissipating insulation sheet 7, a support member 8 and a flexible circuit board 10, which are housed in a housing 9, as well as an entrance window 11 attached to an opening of the housing 9.

[0010] The X-ray detection panel 2 is fixed to one side of a support plate 4. The support plate 4 is made of, for example, an aluminum alloy. A moisture-proof cover 3 is disposed on one side of the X-ray detection panel 2. The moisture-proof cover 3 is made of, for example, an aluminum alloy.

[0011] A circuit board 5 is fixed to the other side of the support plate 4 via a lead plate 6 and a heat dissipation insulation sheet 7. The circuit board 5 and the X-ray detection panel 2 are connected via a flexible circuit board 10 arranged at an end. A support member 8 is fixed to a housing 9 and supports the support plate 4.

[0012] The opening of the housing 9 is formed at a position facing the X-ray detection panel 2. The entrance window 11 is made of a material that transmits X-rays, so that the X-rays pass through the entrance window 11 and enter the X-ray detection panel 2.

[0013] (X-ray detection panel) Next, the detailed configuration of the X-ray detection panel 2 will be described.

[0014] 3, the X-ray detection panel 2 includes a photoelectric conversion substrate 12 and a scintillator film 13. The photoelectric conversion substrate 12 includes a glass substrate 14 and a plurality of photodetection units 15 formed in an array on the glass substrate 14. The photodetection units 15 include TFTs (thin film transistors) 16 as switching elements and PDs (photodiodes) 17 as photosensors. The photoelectric conversion substrate 12 is, for example, a square with each side measuring 50 cm.

[0015] The scintillator film 13 is formed directly on the photoelectric conversion substrate 12. The scintillator film 13 is located on the X-ray incident side of the photoelectric conversion substrate 12. The scintillator film 13 converts X-rays into light (fluorescence). The PD 17 converts the light converted by the scintillator film 13 into an electrical signal. This makes it possible to detect X-rays as an electrical signal.

[0016] The scintillator film 13 can be formed by depositing a scintillator material on the photoelectric conversion substrate 12. For example, a material in which cesium iodide (CsI) (main scintillator material) is doped with thallium (Tl) or thallium iodide (TlI) (scintillator additive) can be used. The scintillator material is preferably CsI or CsI doped with TlI. The thickness of the scintillator film 13 is preferably 100 to 1000 μm.

[0017] (Vacuum deposition equipment) Next, there will be described a vacuum deposition apparatus used for depositing the scintillator film 13 on the photoelectric conversion substrate 12. Here, the photoelectric conversion substrate 12 is also simply referred to as the "substrate".

[0018] As shown in (a) of Figure 4, the vacuum deposition apparatus 20 includes a vacuum chamber 21, a crucible 22 placed at the bottom of the vacuum chamber 21, a first mask 28 and a second mask 29 that hold a first substrate 26 and a second substrate 27, respectively, with their deposition surfaces 26a and 27a facing the crucible 22, and a drive unit 30 that rotates the first mask 28 and the second mask 29, respectively.

[0019] The vacuum chamber 21 is equipped with a vacuum exhaust device (not shown), which maintains the interior of the vacuum chamber 21 at a pressure lower than atmospheric pressure.

[0020] The crucible 22 is an evaporation source that contains a scintillator material as an evaporation material and heats and evaporates the evaporation material. A vapor port 22a is provided on the top surface of the crucible 22 for ejecting the evaporation material heated in the crucible 22 vertically upward.

[0021] The crucible 22 may include a heater for heating the crucible 22, a means for cooling the crucible 22, a temperature control unit for measuring the temperature inside the crucible 22 and driving the heater.

[0022] The first substrate 26 and the second substrate 27 are held by a first mask 28 and a second mask 29, respectively, in a state in which the deposition surfaces are parallel to the horizontal direction.

[0023] The first mask 28 and the second mask 29 are removably attached, and can be removed from the vacuum chamber 21 when the first substrate 26 and the second substrate 27 are mounted.

[0024] 1, the first mask 28 and the second mask 29 are squares of the same size when viewed in a plan view. The first substrate 26 and the second substrate 27 fixed thereto are also squares of the same size. The first mask 28 and the second mask 29 may be squares with chamfered corners, for example.

[0025] The position of the first corner 28a of the first mask 28 is shifted by 45° from the position of the second corner 29a of the second mask 29. That is, the angle φ between the line I1 connecting the first corner 28a and the rotation center P1 of the first mask 28 and the line I2 connecting the second corner 29a and the rotation center P2 of the second mask 29 is 45°. This angle φ does not necessarily have to be 45°, and may be any angle θ at which |tan θ|=1. Furthermore, when the corners of the mask are chamfered, the angle φ may be in the range of the angle θ at which |tan θ|=1±10°.

[0026] The first mask 28 and the second mask 29 are closely spaced such that the distance WP between their rotation centers P1 and P2 is shorter than the diagonal length D of the first mask. That is, the first mask 28 and the second mask 29 are arranged so that at least a part of their movable areas (broken circles in FIG. 1) overlap with each other.

[0027] With this arrangement, the width of the entire movable regions becomes smaller than when the movable regions do not overlap. For example, if the length of one side of the first mask 28 is L, the distance W between the left and right ends of the movable regions of the first mask 28 and the second mask 29 is 2.4L. This is 0.4L shorter than the distance between the left and right ends when the movable regions of the first mask 28 and the second mask 29 do not overlap. For example, if the size of one side of the first mask 28 is 600 mm, the width of the vacuum deposition apparatus 20 can be reduced by 240 mm.

[0028] The first mask 28 and the second mask 29 are rotated at the same speed in the in-plane direction in opposite directions by the driving unit 30. In this example, the first mask 28 rotates clockwise, and the second mask 29 rotates counterclockwise. When rotated in this manner, the sum of the rotation angles of the first mask 28 and the second mask 29 is 0, so that the angle φ (45° in the example of FIG. 1) between the initial straight lines I1 and I2 is maintained during rotation. This allows the first mask 28 and the second mask 29 to rotate without interfering with each other. Here, the "same speed" may essentially mean the same speed, and may be rotated at a speed at which the first mask 28 and the second mask 29 can maintain their rotation without interfering with each other and stopping until the deposition process is completed.

[0029] The steam port 22a of the crucible 22 is disposed at a position where the distance to the rotation center P1 of the first mask 28 and the distance to the rotation center P2 of the second mask 29 are equal to each other. The position is on a symmetrical plane of the rotation centers P1 and P2 (represented by a dashed line S in FIG. 1).

[0030] As shown in Fig. 4(a) and (b), the driving unit 30 includes a first gear 31, a second gear 32, a third gear 33, a fourth gear 34, and a motor 35. The upper end of the shaft 31a of the first gear 31 is connected to a shaft 35a of the motor 35, and the lower end is connected to the first mask 28, and the first gear 31 is driven clockwise by the motor 35. The second gear 32 meshes with the first gear 31 and rotates in the opposite direction to the first gear 31. The third gear 33 meshes with the second gear 32 and has the same reference circle diameter, number of teeth, and circular pitch as the second gear 32 and rotates in the opposite direction to the second gear 32. The fourth gear 34 meshes with the third gear 33 and has the same reference circle diameter, number of teeth, and circular pitch as the first gear 31 and rotates in the opposite direction to the third gear 33, i.e., counterclockwise. The lower end of the shaft 34a of the fourth gear 34 is connected to the second mask 29 and rotates the second mask 29 counterclockwise, thereby allowing the first mask 28 and the second mask 29 to rotate in opposite directions at the same speed.

[0031] (Method of manufacturing vapor-deposited film) As shown in FIG. 5, the method for producing a vapor deposition film according to the embodiment includes: (S1) a substrate fixing step of fixing a first substrate 26 and a second substrate 27 to a first mask 28 and a second mask 29, respectively; (S2) a rotation driving step of rotating the first mask 28 and the second mask 29 in the in-plane direction of the deposition surface of the substrate at the same speed but in opposite directions by a driving unit 30; and (S3) a vapor deposition step of evaporating a vapor deposition material from a crucible 22 (evaporation source) and vacuum-depositing the vapor deposition material on the deposition surface to form a vapor deposition film.

[0032] An example of an embodiment of a method for producing a vapor-deposited film using the vacuum deposition apparatus 20 shown in FIG. 4 will be described in detail below.

[0033] First, the vacuum deposition apparatus 20, the first substrate 26, and the second substrate 27 are prepared. Next, the first mask 28 and the second mask 29 are removed from the vacuum deposition apparatus 20, and the first substrate 26 and the second substrate 27 are attached to the first mask 28 and the second mask 29, respectively. Thereafter, the first mask 28 and the second mask 29 with the substrates attached thereto are carried into the vacuum chamber 21, and attached to the lower ends of the shafts of the first gear 31 and the fourth gear 34.

[0034] Next, the vacuum chamber 21 is sealed, and a vacuum is created in the vacuum chamber 21 using a vacuum exhaust device. Then, the motor 35 is operated to rotate the first substrate 26 and the second substrate 27. For example, the timing to start operating the motor 35 may be adjusted based on the monitoring result of the temperature of the crucible 22.

[0035] Next, heating of the crucible 22 is started. Thereafter, the deposition material in the crucible 22 evaporates, whereby the deposition material is deposited on the first substrate 26 and the second substrate 27.

[0036] The scintillator material incident on the first substrate 26 and the second substrate 27 forms crystals on the first substrate 26 and the second substrate 27. At the initial stage of deposition, minute crystal grains are formed on the first substrate 26 and the second substrate 27, but as deposition continues, the crystal grains eventually grow into columnar crystals. As a result, a deposition film (FIG. 3, scintillator film 13) is formed on the first substrate 26 and the second substrate 27.

[0037] According to the vacuum deposition apparatus and the method for manufacturing the deposition film described above, the distance between the first mask 28 and the second mask 29 is narrowed so that the distance WP between the rotation centers of the first mask 28 and the second mask 29 is shorter than the diagonal length D of the first mask, and the movable areas of the first mask 28 and the second mask 29 are arranged overlapping each other, so that the volume of the vacuum chamber 21 can be made smaller and the size of the vacuum deposition apparatus can be made smaller. This reduces the weight of the entire apparatus, and a place with a relatively low floor strength can be selected as the installation location of the apparatus. In addition, the reduction in the volume of the vacuum chamber 21 makes it possible to make the vacuum pump smaller and shorten the time for evacuation. The shortening of the evacuation time shortens the time for forming the scintillator film, improving the production capacity of the product.

[0038] In addition, since the space between the first substrate and the second substrate is reduced, the amount of deposition material lost through the space is reduced, improving the utilization efficiency of the deposition material. In addition, since the distance between the deposition source and the rotation center P1 or P2 is shorter than when the movable regions are not overlapped, the deposition material is more likely to spread over the entire substrate, and the film thickness distribution is uniform over the entire substrate.

[0039] In a further embodiment, the first mask 28 and the second mask 29 may be rotated by two gears having the same reference circle diameter, number of teeth, and circular pitch. In this case, the upper end of the shaft of one of the gears is connected to the shaft of the motor 35, and the lower end is connected to the first mask 28. The other gear meshes with the one of the gears, and the lower end is connected to the second mask 29.

[0040] Although the driving unit 30 using gears is shown in this example, the first mask 28 and the second mask 29 may be driven mechanically or electrically by means other than gears.

[0041] Other mechanical driving methods include, for example, a method using a belt or a chain, etc. For example, a method can be used in which a motor is attached to the first mask 28, and a belt or a chain is installed that crosses once between the axis of the first mask 28 and the axis of the second mask 29.

[0042] As an electrical driving method, a method can be used in which the same type of motor is attached to each of the first mask 28 and the second mask 29, the angles of the first mask 28 and the second mask 29 are first determined, and then each motor is controlled to rotate in the opposite direction at the same speed.

[0043] Other embodiments will be described below, in which the same reference numerals are used to designate parts that provide the same effects, and detailed descriptions of those parts will be omitted.

[0044] In the second embodiment, the first mask 28 and the second mask 29 are rectangular with the same dimensions. In this case, the angle φ between the straight line I1 and the straight line I2 may be 45±10° to 90±10° depending on the ratio of the long side to the short side. In this example, the angle φ may be the angle between the longitudinal directions of the first mask 28 and the second mask 29. As shown in FIG. 6, when the first mask 28 and the second mask 29 are rectangular with an extremely short short side and close to a rod shape, the angle φ may be 90±10°.

[0045] In the vacuum deposition apparatus of this embodiment, the first mask 28 and the second mask 29 may be rotated in opposite directions at the same speed by a driving unit similar to that of the first embodiment. The vacuum deposition apparatus of the embodiment may also be used in a deposition film manufacturing method similar to that of the first embodiment.

[0046] In the third embodiment, the vacuum deposition apparatus includes three pairs of the first mask 28 and the second mask 29, totaling six masks. As shown in FIG. 7, in the vacuum deposition apparatus 20 in this example, the first mask 28, the second mask 29, the third mask 36, the fourth mask 37, the fifth mask 38, and the sixth mask 39 are arranged in this order so that their respective rotation centers P are aligned on the same circle. The first mask 28, the third mask 36, and the fifth mask 38 rotate in a counterclockwise direction. The second mask 29, the fourth mask 37, and the sixth mask 39 are arranged in a state rotated by 60° (i.e., angle φ=60°) with respect to the first mask 28, the third mask 36, and the fifth mask 38, respectively, and rotate in a clockwise direction. The masks are arranged with a small interval between them so that the distance WP between the rotation centers P of the adjacent masks is shorter than the diagonal length D.

[0047] With this arrangement, the maximum width W of the movable area of ​​the mask (dashed line in the figure) is reduced by 0.2L (L=the length of one side of the first mask 28) compared to when the movable areas are not overlapped.

[0048] One crucible 22 may be placed at the center of the circle in which the six masks are arranged. In this case, it is preferable to rotate each mask on its axis, and to revolve all six masks. Alternatively, one crucible 22 may be placed for every two masks (i.e., three in total) at the positions shown in FIG. 1.

[0049] Hereinafter, the driving unit 40 of the vacuum deposition apparatus shown in Fig. 7 will be described with reference to Fig. 8 and Fig. 9. As shown in Fig. 8, the driving unit 40 includes a first gear train 41 and a second gear train 42 provided outside the vacuum chamber 21.

[0050] The first gear train 41 has a fifth gear 43 at its center. A shaft 43a of the fifth gear 43 is connected to a shaft 35a of the motor 35. When the first gear train 41 is viewed from above, as shown in Fig. 9(a), a sixth gear 44, a seventh gear 45, and an eighth gear 46, which have the same reference circle diameter, number of teeth, and circular pitch, mesh with each other at equal intervals.

[0051] As shown in Fig. 8, the ninth gear 47 of the second gear train 42 is attached below the shaft 44a of the sixth gear 44, the tenth gear 48 of the second gear train 42 is attached below the shaft 45a of the seventh gear 45, and although omitted in Fig. 8, the eleventh gear 49 of the second gear train 42 is attached below the shaft of the eighth gear 46. As shown in Fig. 9(b), the ninth gear 47, the tenth gear 48 and the eleventh gear 49 have the same reference circle diameter, number of teeth and circular pitch.

[0052] 9(b), the second gear train 42 includes a ninth gear 47, a tenth gear 48, and an eleventh gear 49, a twelfth gear 50 meshing with the ninth gear 47 and the tenth gear 48, a thirteenth gear 51 meshing with the tenth gear 48 and the eleventh gear 49, a fourteenth gear 52 meshing with the eleventh gear 49 and the ninth gear 47, and an internal gear 53 meshing from the outside with the twelfth gear 50, the thirteenth gear 51, and the fourteenth gear 52. The twelfth gear 50, the thirteenth gear 51, and the fourteenth gear 52 have the same reference circle diameter, number of teeth, and circular pitch.

[0053] Although not shown, the first mask 28 is connected to the lower end of the shaft 44a of the sixth gear 44, the third mask 36 is connected to the lower end of the shaft 45a of the seventh gear 45, and the fifth mask 38 is connected to the lower end of the shaft of the eighth gear 46. The second mask 29 is attached to the lower end of the shaft of the twelfth gear 50, the third mask 36 is attached to the lower end of the shaft of the thirteenth gear 51, and the fifth mask 38 is attached to the lower end of the shaft of the fourteenth gear 52.

[0054] When the motor 35 drives the fifth gear 43 clockwise, the sixth gear 44, the seventh gear 45, and the eighth gear 46 rotate counterclockwise, causing the first mask 28, the third mask 36, and the fifth mask 38 to rotate counterclockwise. In addition, the counterclockwise drive of the sixth gear 44, the seventh gear 45, and the eighth gear 46 also drives the ninth gear 47, the tenth gear 48, and the eleventh gear 49 counterclockwise. This drives the twelfth gear 50, the thirteenth gear 51, and the fourteenth gear 52 clockwise, causing the second mask 29, the fourth mask 37, and the sixth mask 39 to rotate clockwise.

[0055] As a result, it is possible to rotate the first mask 28, the third mask 36, and the fifth mask 38 in the opposite directions at the same speed as the second mask 29, the fourth mask 37, and the sixth mask 39. In this example, the other mechanical and electrical driving methods described above can also be used.

[0056] The vacuum deposition apparatus of the third embodiment can be used in the same deposition film manufacturing method as the first embodiment. According to the third embodiment, deposition films can be formed on a plurality of substrates at once, improving product production capacity. In addition, the masks are closely spaced from each other so that the distance WP between the rotation centers of adjacent masks is shorter than the diagonal length D of the masks, making it possible to reduce the size of the apparatus itself. This improves the efficiency of use of deposition materials and makes the thickness distribution of the deposition film more uniform.

[0057] The number of first masks 28 and second masks 29 is not limited to one pair as in the first embodiment (FIG. 1) or three pairs as in the third embodiment (FIG. 7), but may be two pairs, four pairs or more.

[0058] [example] Hereinafter, a simulation example of the production of a deposition film using the vacuum deposition apparatus of the embodiment will be described. The deposition amount (material utilization efficiency) and film thickness distribution of the deposition material were compared in the following four types of vacuum deposition apparatus by simulation using the Monte Carlo method.

[0059] Example 1: Mask arrangement as shown in FIG. 1 (length L of one side of the mask is 600 mm); Example 2: Mask arrangement shown in FIG. 7 (length L of one side of the mask is 600 mm); Comparative Example 1: As shown in FIG. 10, the movable areas of the two masks in Example 1 are not overlapped, and the distance WP between the rotation centers P is set to be the same as the diagonal length D of the masks, and the masks are rotated in the same direction; Comparative Example 2: As shown in Figure 11, the movable areas of the six masks in Example 2 were not overlapped, and each mask was rotated in the same direction with the distance WP between the rotation centers P of two adjacent masks being the same as the diagonal length D of the masks.

[0060] The results are shown in Table 1. The material utilization efficiency indicates the ratio of the deposition amount in Examples 1 and 2 when the deposition amount of the deposition material in Comparative Examples 1 and 2 is taken as 100%. The film thickness distribution indicates the ratio of the thickness of the deposited film on the periphery of the substrate to the thickness of the deposited film at the center of the substrate. [Table 1]

[0061] As shown in Table 1, the material efficiency of Example 1 was 119%, which was improved by 19% compared to Comparative Example 1. The material efficiency of Example 2 was 104%, which was improved by 4% compared to Comparative Example 2. The film thickness distribution was 11.1% thicker in the center than in the peripheral area in Comparative Example 1, whereas it was 106.2% in Example 1, and the thickness difference was suppressed to 6.2%, resulting in a more uniform deposition film. The film thickness distribution of Example 2 was 0.6% lower than that of Comparative Example 2, but this can be considered to be substantially the same value. However, it is also possible to improve the film thickness distribution while maintaining a high material utilization efficiency by changing the position of the crucible. For example, in this simulation, the crucible was placed on the line connecting the rotation centers of two masks located diagonally, but it is also possible to shift the position of the crucible in the horizontal direction, thereby improving the film thickness distribution.

[0062] 10 and 11, the width (W) of the movable region is 2.6 L in Examples 1 and 2, which is shorter by 0.2 L than 2.8 L in Comparative Examples 1 and 2. This result shows that it is possible to make the vacuum deposition apparatus smaller. [Explanation of symbols]

[0063] 20...Vacuum deposition equipment 26...First board 26a...evaporation surface 27...Second board 27a...evaporation surface 28...First Mask 28a…First corner 29...Second Mask 29a…Second corner 30...Drive unit 36...Third Mask 37...The Fourth Mask 38...The Fifth Mask 39...6th Mask 40…Drive unit D…Diagonal length P…Center of rotation

Claims

1. An evaporation source that evaporates an evaporation material; one mask and another mask adjacent to each other, each of which holds a substrate having an evaporation surface on which the evaporation material is evaporated, and the other substrate; a driving unit that rotates the one mask and the other mask in an in-plane direction of the deposition surface in opposite directions at the same speed; Equipped with the one mask and the other mask are squares of the same size in a plan view, the one mask is arranged with a corner position thereof shifted in a rotational direction relative to a corner position of the other mask, the distance between the rotation centers of the one mask and the other mask is shorter than a diagonal length of the one mask, and each corner of the one mask and the other mask is located on a straight line connecting the rotation center of the one mask and the rotation center of the other mask, If an angle between a line connecting a corner of one mask and the center of rotation of the one mask and a line connecting a corner of the other mask and the center of rotation of the other mask is θ, then θ is an angle such that |tan θ|=1, A vacuum deposition apparatus in which the corners of the other mask are chamfered so that adjacent masks do not interfere with each other even if the rotation angle of the other mask deviates from the θ by a range of ±10° in the rotation direction.

2. 2. The vacuum deposition apparatus according to claim 1, comprising a plurality of pairs of the one mask and the other mask, the centers of rotation of the masks being disposed on the same circle.

3. In a state where one mask and another mask are adjacent to each other and are squares of the same size in a plan view, and each corner of the one mask and the other mask is located on a straight line connecting a rotation center of the one mask and a rotation center of the other mask, If an angle between a line connecting a corner of one mask and the center of rotation of the one mask and a line connecting a corner of the other mask and the center of rotation of the other mask is θ, then θ is an angle such that |tan θ|=1, a substrate fixing step of fixing one substrate and the other substrate, each substrate having an evaporation surface on which an evaporation material is evaporated, to the one mask and the other mask, respectively, wherein a corner of the other mask is chamfered so that adjacent masks do not interfere with each other even if the rotation angle of the other mask deviates within a range of ±10° in the rotation direction with respect to θ, the one mask is disposed in a state in which a position of a corner of the one mask is deviated in the rotation direction with respect to a position of a corner of the other mask, and a distance between rotation centers of the one mask and the other mask is shorter than a diagonal length of the one mask; a rotation driving step of rotating the one mask and the other mask in an in-plane direction of the deposition surface at the same speed in opposite rotation directions by a driving unit; and A method for producing a vapor-deposited film, comprising a vapor deposition step of evaporating the vapor deposition material from an evaporation source and vacuum-depositing the vapor deposition material on the deposition surface to form a vapor-deposited film.

4. 4. The method for producing a vapor-deposited film according to claim 3, wherein in the substrate fixing step, a plurality of pairs of the one mask and the other mask are provided, and the rotation centers of the masks are arranged on the same circle.

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