Image sensor package test equipment

Abstract

To provide a test device that tests an image sensor package.SOLUTION: The present invention relates to a test device that tests an image sensor package. The test device is configured to stably vacuum-adsorb an image sensor package in a surface manner, wherein when a vacuum adsorption sheet having a package adsorption hole in the shape of a wide square surface is coupled to a lower part of a floating plate at which an upper socket is seated, a vacuum line is formed by connecting a cover vacuum hole of a pusher, a board vacuum hole of an upper circuit board, a plate vacuum hole of the floating plate, and the package adsorption hole of the vacuum adsorption sheet together.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a test apparatus for a light-detecting semiconductor device, and more particularly to a test apparatus for an image sensor package that can automatically test whether an image sensor package is defective before it is assembled into a camera module. [Background technology]

[0002] Image sensors are semiconductor elements that capture images of people and objects. Following their use in smartphones, image sensors are now used as essential components in major information and communication devices such as automotive driving assistance systems, autonomous vehicles, and network cameras, and the market size is constantly expanding.

[0003] Such an image sensor is configured in the form of a camera module and is mounted on the device. The camera module is composed of a lens, a holder, an infrared filter, an image sensor, and a printed circuit board (PCB). The lens of the camera module forms an image, and the image formed by the lens is focused on the image sensor via the IR filter, and the image sensor converts the optical signal of the image into an electrical signal to capture the image.

[0004] Among these components, the image sensor that converts optical signals into electrical signals is either directly mounted on the camera module in a bare chip state, or the image sensor chip is packaged and then mounted on the camera module. The method of directly mounting the image sensor bare chip on the camera module uses the Chip On Board (COB) method, but due to a high defect rate due to the inflow of dust particles during the manufacturing process and limitations in miniaturization, the method of mounting the image sensor chip on the camera module using an image sensor package manufactured by pre-packaging the image sensor chip is widely used.

[0005] Since the most critical and most common type of defect in a camera module is a defect caused by dust intrusion into a pixel area of ​​an image sensor, it is not preferable to perform an inspection procedure to determine whether an image sensor is defective after assembling an image sensor package into a camera module. That is, it is preferable to determine whether an image sensor package is defective before assembling the image sensor package into a camera module. However, since existing devices for testing image sensor packages only have a function of testing whether a simple electrical defect occurs by connecting a connection terminal of the image sensor package to an external terminal and then passing electricity through the connection terminal, there is a problem in that the devices are unable to perform an optical characteristic test, such as whether the amount of light received by the image sensor is constant with respect to light irradiated from a light source.

[0006] In recent years, a test apparatus for inspecting optical characteristics of an image sensor package has been developed. Figures 1 to 3 show a conventional test apparatus 100 for an image sensor package, where Figure 1 is a diagram showing a conventional test apparatus for testing an image sensor package, Figure 2 is a diagram showing the operation of the conventional test apparatus, and Figure 3 is a diagram showing a part of the conventional test apparatus that adsorbs an image sensor package.

[0007] As shown in the drawing, an image sensor package 10 has a structure in which a light receiving surface 11 is located at the bottom and a sensor terminal 12, which is usually made of a solder ball, is located at the top. In order to move the image sensor package to a testing position, the top surface of the image sensor package must be vacuum-sucked, and since the sensor terminal made of a solder ball is formed on the top surface and the top surface of the image sensor package is not flat, it is impossible to move the image sensor package by a vacuum picker. Therefore, in a test device for an image sensor package, a vacuum line must be formed on a pusher operated by a driver (DP) such as a handler, and the pusher must suck up the image sensor package and place it at the testing position, in a pick & place method.

[0008] The conventional image sensor package test device 100 includes a lower socket 30, an upper socket 60, and a pusher 70 having an upper circuit board 50 therein. The conventional test device includes a package seating portion 32 on which an image sensor package 10 is seated, a lower socket 30 including pogo pins 31 for transmitting electrical signals to a socket housing having a light source insertion portion 33 in which a light source device 20 is disposed, and the pusher 70 having an upper circuit board 50 connected to the lower socket and an upper socket 60 having pogo pins 61 therein. The lower socket and the light source device are attached to a tester 40, and the pogo pins of the upper socket are disposed in the socket housing so that the upper side contacts the upper circuit board 50 and the lower side contacts the image sensor package 10.

[0009] A pusher 70 connected to a driver (DP) such as a handler transfers a vacuum pressure generated by a vacuum generator (VG) to a socket vacuum hole 63 of an upper socket 60 through a pusher vacuum hole 71 to suck an image sensor package 10 and position it in a package seat 32 of a lower socket 30. When a test signal is transferred from a tester, a light source device 20 irradiates light, and at the same time, a signal is transferred to the image sensor package 10 through the lower socket, the upper circuit board, and the upper socket, and the image sensor package receives the light irradiated from the light source device. Through this process, an optical characteristic test is performed to check whether the amount of light received by the image sensor package is constant.

[0010] However, in the conventional image sensor package test apparatus 100, the upper socket is of a pogo socket type using pogo pins. Generally, a pogo pin has a structure in which an upper pin and a lower pin made of a metal are arranged at the top and bottom of a barrel, respectively, with a spring interposed between the upper pin and the lower pin. Therefore, the upper pin made of a metal is connected to a pad of an upper circuit board in a point contact manner, and the lower pin is also connected to a solder ball terminal of an image sensor in a point contact manner. As a result, the contact is unstable, and there is a high possibility of misalignment occurring. As a result, the test yield is low due to the unstable contact.

[0011] In addition, since the metallic upper and lower pins come into contact with the electrodes of the upper circuit board and the solder ball-shaped sensor terminals of the image sensor package, there is a problem that the electrodes of the upper circuit board and the solder ball-shaped sensor terminals of the image sensor package may be damaged.

[0012] In addition, in the case of a full array type image sensor package, a vacuum pressure must be transmitted to the area between the solder balls, so a vacuum area must be formed in a narrow area between the pogo pins of the upper socket. FIG. 3 shows the underside of a suction part that suctions an image sensor package in a conventional image sensor package test device, and as shown in FIG. 3, it can be seen that a large number of small socket vacuum holes 63 are formed between the pogo pins in the peripheral area of ​​the upper socket. That is, the conventional test device using an upper socket with pogo pins vacuum-sucks the image sensor package in a so-called "point method" using small point-like socket vacuum holes. The total area of ​​such socket vacuum holes 63 is usually only about 2 to 3% of the area of ​​the image sensor package.

[0013] Therefore, in the conventional test equipment, if the point-like socket vacuum holes are not precisely aligned with the areas between the solder balls, the image sensor package may be adsorbed in a distorted state, and the vacuum area may be very narrow and insufficient vacuum pressure may not be transmitted, which may easily result in pick-up errors of the image sensor package and further reduce the test yield. [Prior art documents] [Patent documents]

[0014] [Patent Document 1] Korean Patent Publication No. 10-1212946 (Registered December 11, 2012) Summary of the Invention [Problem to be solved by the invention]

[0015] The present invention has been made to solve the above problems, and an object of the present invention is to provide an image sensor package test apparatus which can reduce damage to an upper circuit board and an image sensor package, vacuum-suck the image sensor package in a surface manner, and eliminate pick-up errors, thereby significantly improving the inspection yield. [Means for solving the problem]

[0016] In order to achieve the above object, the present invention provides a test apparatus for an image sensor package, an image sensor package having a light receiving surface at a lower portion and a sensor terminal at an upper portion; a light source device attached to a tester for providing a test signal and configured to irradiate light onto a light receiving surface of the image sensor package; a lower socket including: a package seating portion attached to the tester and on which the image sensor package is seated; a light source insertion portion in which the light source device is disposed under the package seating portion; and a pogo pin electrically connecting the tester and the upper circuit board; an upper socket having an elastic conductive portion, the elastic conductive portion being formed of an elastic insulating material containing a plurality of conductive particles, electrically connecting the upper circuit board and the image sensor package; a pusher to which the upper circuit board having a board vacuum hole formed therein is coupled, which has a cover vacuum hole to which a vacuum pressure of a vacuum generating device is transmitted, and which is movable by receiving power from a driving unit so as to approach or move away from the lower socket; and a floating plate connected to the pusher, having a plate vacuum hole formed therein, and having a socket seating portion and a plate hole on which the upper socket is seated; A vacuum suction sheet having a package suction hole for suctioning the image sensor package is attached to the bottom of the floating plate. The cover vacuum hole may communicate with the substrate vacuum hole, the substrate vacuum hole may communicate with the plate vacuum hole, and the plate vacuum hole may form a vacuum line communicating with the package suction hole.

[0017] A test signal provided to the tester may be transmitted to the image sensor package via the light source device, the lower socket, the upper circuit board, and the upper socket.

[0018] A guide portion for guiding the image sensor package may be protruded from a lower surface of the floating plate, and the vacuum suction sheet may have a guide hole into which the guide portion is fitted.

[0019] The package suction hole of the vacuum suction sheet may be sized to surround the plate hole of the floating plate.

[0020] The area of ​​the package suction hole may be 0.1 times or more the area of ​​the image sensor package.

[0021] The vacuum suction sheet may be made of a non-elastic insulating material.

[0022] The non-resilient insulating material may be one of the following: polyimide film, FR4, engineering plastic, or metal with an insulating coating.

[0023] The pusher may include a base that houses the upper circuit board, the upper socket, and the floating plate, and a cover that covers the base.

[0024] The cover vacuum hole may be formed in the cover.

[0025] A gasket may be coupled between the cover and the upper circuit board to surround the cover vacuum hole and the board vacuum hole.

[0026] A gasket may be coupled between the upper circuit board and the floating plate to surround the board vacuum hole and the plate vacuum hole. Effect of the Invention

[0027] The image sensor package test device according to the present invention has a package suction hole for vacuum-sucking an image sensor package having a wide surface, so that the image sensor package can be stably sucked in a surface manner, and since the vacuum suction area is formed to be three times larger than that of the conventional device, the image sensor package can be stably picked and placed without a pick-up error, and the inspection yield is significantly improved.

[0028] In addition, the image sensor package testing device according to the present invention performs vacuum sealing by inserting non-metallic gaskets between the pusher cover and the upper circuit board, and between the upper circuit board and the floating plate, so that the constant vacuum pressure provided by the vacuum generator can be smoothly applied to the vacuum suction sheet without loss.

[0029] In addition, the image sensor package testing device according to the present invention has an advantage that the vacuum suction sheet that adsorbs the image sensor package is made of a sheet of inelastic insulating material, thereby mitigating the impact that occurs when it comes into contact with the image sensor package.

[0030] In addition, the test apparatus for the image sensor package according to the present invention uses an upper socket made of an elastic conductive portion having elasticity, and connects to the image sensor package in a surface contact manner in which the elastic conductive portion of the upper socket wraps around the solder ball-shaped sensor terminals of the image sensor package, thereby reducing contact resistance and enabling stable connection without misalignment, thereby significantly improving the test yield.

[0031] In addition, the test device for the image sensor package according to the present invention can prevent damage to the sensor terminals of the image sensor package and the electrodes of the upper circuit board since the elastic conductive portion of the upper socket smoothly connects to the sensor terminals of the image sensor package and the electrodes of the upper circuit board. [Brief description of the drawings]

[0032] [Figure 1] 1 is a diagram showing a conventional test apparatus for testing an image sensor package. [Diagram 2] 1 is a diagram showing the operation of a conventional test device. [Diagram 3] 1 is a diagram showing a portion for adsorbing an image sensor package in a conventional test device. [Figure 4] 1 illustrates a test apparatus for testing an image sensor package according to an embodiment of the present invention; [Diagram 5] FIG. 2 is an exploded perspective view of a portion in which a vacuum line is formed in a test device according to an embodiment of the present invention. [Figure 6] 1 is a view showing an upper socket according to an embodiment of the present invention; [Figure 7] 1 is a view showing a floating plate according to an embodiment of the present invention; [Figure 8] 1 is a view showing a vacuum suction sheet according to an embodiment of the present invention; [Figure 9] 1 is a view showing a state in which an upper socket and a vacuum suction sheet are coupled to a floating plate according to an embodiment of the present invention; [Figure 10] 4 is a diagram illustrating an example of a test apparatus in which a vacuum line is formed according to an embodiment of the present invention; [Figure 11] 4 is a diagram illustrating an operation of a test apparatus for an image sensor package according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a test apparatus for an image sensor package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0034] In the present invention, since the upper socket is located on the upper side of the image sensor package and the tester is located on the lower side, the “top surface,” “upper side,” “upper end,” “lower surface,” “lower side,” “lower end,” etc. of the components will be described based on this.

[0035] In the following description with reference to the accompanying drawings, the same or related reference numerals will be used for the same components regardless of the reference numerals, and redundant description thereof will be omitted.

[0036] Fig. 4 is a diagram showing a test apparatus for testing an image sensor package according to an embodiment of the present invention, Fig. 5 is an exploded perspective view of a portion of the test apparatus in which a vacuum line is formed according to an embodiment of the present invention, Fig. 6 is a diagram showing an upper socket according to an embodiment of the present invention, Fig. 7 is a diagram showing a floating plate according to an embodiment of the present invention, and Fig. 8 is a diagram showing a vacuum suction sheet according to an embodiment of the present invention, Fig. 9 is a diagram showing a state in which an upper socket and a vacuum suction sheet are combined with a floating plate according to an embodiment of the present invention, Fig. 10 is a diagram showing an example in which a vacuum line is formed in the test apparatus according to an embodiment of the present invention, and Fig. 11 is a diagram showing the operation of the test apparatus for an image sensor package according to an embodiment of the present invention.

[0037] As shown in the drawings, the image sensor package testing apparatus 1000 according to an embodiment of the present invention is a testing apparatus for inspecting electrical or optical characteristics of an image sensor package receiving light irradiated from a light source device, and can electrically mediate between a tester 140 that generates a test signal and the image sensor package 10.

[0038] The image sensor package testing apparatus 1000 according to an embodiment of the present invention includes an image sensor package 10 having a light receiving surface 11 at a lower portion and a sensor terminal 12 at an upper portion, a light source device 20 attached to a tester 140 for providing a test signal and irradiating light onto the light receiving surface of the image sensor package, a package seating part 132 attached to the tester and on which the image sensor package is seated, a light source inserting part 133 in which the light source device is disposed below the package seating part, a lower socket 130 having pogo pins 131 for electrically connecting the tester 140 and an upper circuit board 150, an upper socket 160 having an elastic conductive part 161 made of an elastic insulating material containing a number of conductive particles and electrically connecting the upper circuit board 150 and the image sensor package 10, and an upper circuit board having a substrate vacuum hole 153 formed therein. The floating plate 170 includes a pusher 190 which is movable toward or away from the lower socket by receiving power from a driving unit (DP) and a floating plate 170 having a socket seat 171 on which the upper socket 160 is seated and a plate hole 172, and a vacuum suction sheet 180 having a package suction hole 181 for suctioning the image sensor package 10 is coupled to a lower portion of the floating plate 170. The vacuum suction sheet 180 is coupled to a lower portion of the floating plate 170, and has a cover vacuum hole 193 to which a vacuum pressure from a vacuum generator (VG) is transmitted. The cover vacuum hole 193 is connected to the substrate vacuum hole 153, the substrate vacuum hole 153 is connected to the plate vacuum hole 173, and the plate vacuum hole 173 is connected to the package suction hole 181 to form a vacuum line (VL).

[0039] The components of the test apparatus 1000 according to one embodiment of the present invention will now be described in detail.

[0040] The image sensor package 10 has a structure having a light receiving surface 11 for receiving light at its lower portion and a plurality of solder ball-shaped sensor terminals 12 at its upper portion. The image sensor package is a widely known device, so a detailed description thereof will be omitted.

[0041] The light source device 20 is a device that irradiates light onto the light receiving surface of the image sensor package and is attached to a tester 140 that provides a test signal. The light source device 20 is disposed below the image sensor package 10 so as to irradiate light onto the light receiving surface 11 of the image sensor package.

[0042] The lower socket 130 is attached to the tester 140 and electrically connects the tester 140 to the upper circuit board 150. The lower socket 130 includes a package seating portion 132 on which an image sensor package is seated, a socket housing 134 having a light source insertion portion 133 in which a light source device is disposed below the package seating portion, and pogo pins 131 spaced apart inside the socket housing to electrically connect the tester 140 to the upper circuit board 150.

[0043] The package seating part 132 protrudes so that an edge region of the image sensor package 10 is positioned therein, and a through hole is formed in the center of the package seating part 132 to expose the light receiving surface 11 of the image sensor package 10 downward. A guide hole 136 into which the guide part 175 of the floating plate 170 can be inserted is formed on the outer periphery of the package seating part 132.

[0044] The light source insertion part 133 is an opening connected to a through hole of the package mounting part 132 and is a space in which the light source device 20 is disposed. The light source insertion part 133 may have any shape as long as the light source device 20 can be inserted therein.

[0045] The pogo pin 131 has a structure in which an upper pin and a lower pin are respectively arranged on the upper and lower parts of the barrel, and a spring is interposed between the upper pin and the lower pin. One end of the pogo pin 131 contacts an electrode (not shown) provided on the upper side of the tester 140, and the other end of the pogo pin 131 contacts an electrode (not shown) provided on the lower side of the upper circuit board 150, thereby electrically connecting the tester 140 and the upper circuit board 150. The ends of the upper pin and the lower pin that contact the tester and the upper circuit board may be formed in a round shape. In a conventional test device, as shown in FIG. 3, the ends of the upper pin and the lower pin are sharpened in a crown shape, which may damage the electrodes of the tester and the upper circuit board, but the rounded upper pin and lower pin can prevent damage to the electrodes of the tester and the upper circuit board.

[0046] In addition to the illustrated structure, the lower socket 130 may be modified to various other structures that can be attached to the tester 140 and electrically connect the tester 140 and the upper circuit board 150 .

[0047] The upper circuit board 150 is an intermediate board connecting the lower socket 130 and the upper socket 160, and has pad-like electrodes formed on its underside. A test signal provided by the tester 140 is transferred to the upper circuit board 150 via the lower socket 130, and the upper circuit board 150 transfers the received signal to the upper socket 160. As shown in Fig. 5, the upper circuit board 150 is formed with a board vacuum hole 153 communicating with the upper cover vacuum hole 193 and the lower plate vacuum hole 173.

[0048] The upper socket 160 is disposed under the upper circuit board 150 and electrically connects the upper circuit board 150 and the image sensor package 10. As shown in Fig. 6, the upper socket 160 has elastic conductive parts 161, each of which is made of an elastic insulating material and contains a number of conductive particles, disposed at intervals within an insulating part 162 and supported by the insulating part 162. One end of the elastic conductive part 161 may contact an electrode of the upper circuit board 150 and the other end of the elastic conductive part 161 may be connected to a sensor terminal 12 of the image sensor package 10. A frame (not shown) may be coupled to the outer periphery of the insulating part 162, which supports the upper socket and has holes for alignment.

[0049] The elastic conductive part 161 includes a conductive part body 165 located within the insulating part 162, a conductive part lower bump 166 connected to the conductive part body 165 so as to protrude from the lower surface of the insulating part 162, and a conductive part upper bump 167 connected to the conductive part body 165 so as to protrude from the upper surface of the insulating part 162. When the upper socket 160 approaches the lower socket 130, the conductive part upper bump 167 and the conductive part lower bump 166 are pressed against the terminal of the upper circuit board 150 and the sensor terminal 12 of the image sensor package 10, thereby allowing stable contact with the terminal of the upper circuit board and the sensor terminal of the image sensor package.

[0050] The upper socket 160 has the elastic conductive part 161 having elasticity as a conductive path, so that when the elastic conductive part 161 comes into contact with the electrodes of the upper circuit board 150 or the sensor terminals of the image sensor package 10, a smooth connection can be achieved and damage to the electrodes of the upper circuit board or the sensor terminals of the image sensor package can be prevented. In addition, the elastic conductive part 161 is compressed while wrapping the solder ball-shaped sensor terminals, so that contact resistance can be reduced by connecting in a surface contact manner.

[0051] The elastic insulating material constituting the elastic conductive portion 161 can be a heat-resistant polymeric material having a cross-linked structure, such as silicone rubber, and the conductive particles constituting the elastic conductive portion 161 can be one having a magnetic property that can react to a magnetic field. For example, the conductive particles can be particles of a magnetic metal such as iron, nickel, or cobalt, or alloy particles thereof, or particles containing these metals, or particles formed as core particles with the surface of the core particles plated with a metal having good conductivity such as gold, silver, palladium, or radium.

[0052] The insulating portion 162 may be made of an elastic insulating material or a non-elastic insulating material. The elastic insulating material may be the same as the elastic insulating material constituting the elastic conductive portion 161, and various synthetic resins may be used as the non-elastic insulating material.

[0053] The pusher 190 can move toward the lower socket 130 or away from the lower socket 130 when a moving force is provided from a driving unit (DP). As shown in Fig. 5, the pusher 190 includes a base 191 that can accommodate the upper circuit board 150, the upper socket 160, and the floating plate 170, and a cover 192 that covers the base 191. The cover 192 is fastened to the base 191 by fastening means 194 such as a screw to form the pusher 190.

[0054] The cover 192 is provided with a cover vacuum hole 193 for transmitting the vacuum pressure of a vacuum generator (VG). The base 191 is provided with a plate seating portion 195 that is open upward to seat the floating plate 170, and a base hole 196 that is open downward to receive the sensor terminal 12 of the image sensor package 10. The cover vacuum hole 193 is connected to an external vacuum generator (VG) to transmit the vacuum pressure generated by the vacuum generator to the inside of the pusher 190.

[0055] The pusher 190 can load or unload the image sensor package 10 into or from the lower socket 130 by moving toward or away from the lower socket 130 .

[0056] In addition to the configuration shown, the pusher 190 can be modified to various other configurations in which the upper circuit board 150 and upper socket 160 can be mounted and moved by a drive portion (DP).

[0057] The floating plate 170 is placed on the plate seat 195 of the pusher 190, so that the upper socket 160 can be seated on the upper part and the vacuum suction sheet 180 can be coupled to the lower part.

[0058] 5 and 7, the upper portion of the floating plate 170 includes a socket seating portion 171 that is open upward and receives the upper socket 160, and a plate hole 172 that is open downward to expose the lower surface of the elastic conductive portion 161. A plurality of guide portions 175 that guide the image sensor package are protruded around the plate hole 172 on the lower surface of the floating plate 170. The guide portions 175 are provided with an inclined surface 176 that widens downward to easily guide the image sensor package 10.

[0059] 9, the floating plate 170 is provided with plate vacuum holes 173 for transmitting the vacuum pressure transmitted from the upper circuit board 150 to the package suction holes 181 of the vacuum suction sheet 180. The plate vacuum holes 173 are formed around the area where the upper socket 160 is seated on the socket seating part 171. The plate vacuum holes 173 are formed in communication with the substrate vacuum holes 153 and the package suction holes 181, and the vacuum pressure supplied from the vacuum generator (VG) is transmitted to the plate vacuum holes 173 via the substrate vacuum holes 153, and the vacuum pressure transmitted to the plate vacuum holes 173 is transmitted to the package suction holes 181.

[0060] The vacuum suction sheet 180 is coupled to the lower part of the floating plate 170. As shown in Fig. 8, the vacuum suction sheet 180 has a package suction hole 181 for suctioning the image sensor package 10 formed in the center thereof, and guide holes 182 into which the guide portions 175 of the floating plate 170 can be fitted formed in the peripheral region at positions corresponding to the guide portions 175.

[0061] The vacuum suction sheet 180 may be fastened to the upper socket 160 and the floating plate 170 by a fastening means such as an adhesive or a screw, with the guide portion 175 of the floating plate 170 fitted into the guide hole 182 .

[0062] 9 is a diagram showing a state in which the upper socket 160 and the vacuum suction sheet 180 are coupled to the floating plate 170 according to an embodiment of the present invention. As shown in the figure, the package suction hole 181 of the vacuum suction sheet 180 has a wide rectangular surface shape and has a size that surrounds the plate hole 172 of the floating plate 170. The size of the package suction hole 181 of the vacuum suction sheet 180 may be formed to be the same as, or slightly larger or smaller than, the size of the plate hole 172 of the floating plate 170. Therefore, in the test device according to an embodiment of the present invention, since the vacuum suction area where the vacuum pressure acts to suction the image sensor package has a wide surface shape, it is possible to vacuum suction the image sensor package 10 in a so-called "surface method".

[0063] Since the package suction hole 181 of the vacuum suction sheet 180 can be formed to be approximately the same size as the plate hole 172 where the bottom surface of the elastic conductive part 161 is exposed, the area (S) of the package suction hole 181 can be formed to be at least 0.1 times the area of ​​the image sensor package 10. This has an adsorption area at least three times larger than that of a conventional image sensor package test device using an upper socket with pogo pins, and since the image sensor package can be adsorbed in a surface manner, it is possible to stably adsorb the image sensor package 10 without pickup errors compared to the conventional test device.

[0064] The vacuum suction sheet 180 may be made of a non-elastic insulating material. The vacuum suction sheet 180 made of a non-elastic insulating material can transfer the vacuum pressure transferred from the vacuum generator (VG) to the image sensor package 10 without loss and can adsorb the image sensor package 10 without a pick-up error. Examples of such non-elastic insulating materials include polyimide film, FR4, engineering plastic, and metal with an insulating coating.

[0065] The vacuum suction sheet 180 is made of a sheet of non-elastic insulating material, and therefore has the advantage that the shock generated when it comes into contact with the image sensor package 10 is mitigated.

[0066] Also, a gasket may be disposed between the cover 192 of the pusher 190 and the upper circuit board 150 to perform a vacuum seal between the cover 192 and the upper circuit board 150. The gasket may be made of non-metallic materials such as rubber, asbestos, Teflon, etc. The gasket 157 is combined in a form surrounding the cover vacuum hole 193 and the board vacuum hole 153, and the cover 192 is provided with a gasket insertion hole (not shown) into which the gasket 157 is inserted.

[0067] A gasket may also be disposed between the upper circuit board 150 and the floating plate 170. The gasket 158 ​​is coupled in a manner surrounding the board vacuum hole 153 and the plate vacuum hole 173, and a gasket insertion hole 174 may be provided on the upper surface of the floating plate 170 so that the gasket 158 ​​can be fitted in. Although such a gasket may be formed only between the cover and the upper circuit board, or only between the upper circuit board and the floating plate, it is more preferable to dispose the gasket both between the cover and the upper circuit board and between the upper circuit board and the floating plate, since the vacuum pressure between the coupled parts can be transmitted without loss.

[0068] In the image sensor package test apparatus 1000 according to an embodiment of the present invention, a vacuum line is formed in which the cover vacuum holes 193 communicate with the substrate vacuum holes 153, the substrate vacuum holes 153 communicate with the plate vacuum holes 173, and the plate vacuum holes 173 communicate with the package suction holes 181, so that a vacuum pressure (suction pressure or release pressure) generated by a vacuum generator (VG) is transferred to the package suction holes 181 via the cover vacuum holes 193, the substrate vacuum holes 153, and the plate vacuum holes 173 to suction or release the image sensor package 10. FIG. 10 exemplarily illustrates the formation of such a vacuum line (VL).

[0069] The operation of the image sensor package test apparatus 1000 according to an embodiment of the present invention will now be described.

[0070] As shown in FIGS. 4 and 11, the pusher 190 is lowered by the driving unit (DP) so that the vacuum suction sheet 180 can suction the image sensor package 10. As shown in FIG.

[0071] The vacuum suction sheet 180 suctions the image sensor package 10 through a vacuum line (VL) formed by a vacuum pressure generated by a vacuum generator (VG). The vacuum pressure of the vacuum generator is transferred to the vacuum suction sheet 180 through cover vacuum holes 193 of the cover 192, board vacuum holes 153 of the upper circuit board 150, and plate vacuum holes 173 of the floating plate 170, and the package suction holes 181 of the vacuum suction sheet suction the image sensor package 10 in a planar manner using the vacuum pressure. At this time, the image sensor package 10 is aligned and suctioned at a fixed position along the inclined surface 176 of the guide portion 175.

[0072] Next, the vacuum suction sheet 180 coupled to the pusher 190 can transport the image sensor package 10 that has been suctioned onto the lower socket 130. That is, the pusher 190 approaches the image sensor package 10 at the standby position and suctions the image sensor package 10 using the package suction holes 181 of the vacuum suction sheet 180, and the pusher 190 moves over the lower socket 130 to position the image sensor package 10 in the package seat 132 of the lower socket 130. At this time, the guide portion 175 of the floating plate 170 is inserted into the guide hole 136 of the lower socket 130, and the image sensor package 10 can be aligned so that it is fixedly positioned in the package seat 132. At the same time, the protrusion 137 of the lower socket 130 is inserted into the lower socket protrusion insertion portion 197 of the pusher 190, and the pogo pins 131 of the lower socket 130 are arranged to contact the electrodes of the upper circuit board 150.

[0073] Thereafter, the pusher 190 further descends toward the lower socket 130 to press the image sensor package 10, so that the elastic conductive portion 161 of the upper socket 160 is connected to the sensor terminal 12 of the image sensor package 10, and the pogo pin 131 of the lower socket 130 is connected to the electrode of the upper circuit board 150. Thus, the lower socket 130, the upper circuit board 150, the upper socket 160, and the image sensor package 10 are electrically connected to each other.

[0074] At this time, when a test signal generated by the tester 140 is transmitted to the light source device 20 and also transmitted to the image sensor package 10 via the lower socket 130, the upper circuit board 150, and the upper socket 160, the image sensor package 10 receives the light irradiated from the light source device 20 on the light receiving surface 11, and the tester 140 can test the optical or electrical characteristics, such as whether the amount of light received by the image sensor is constant, based on the signal received by the image sensor package 10.

[0075] After completing the test, the pusher 190 rises, and the image sensor package 10 adsorbed to the pusher 190 can be unloaded from the lower socket 130 according to the movement of the pusher 190 and transferred to a loading device (not shown).

[0076] As described above, the image sensor package test apparatus according to the present invention can stably pick up the image sensor package in a planar manner since the package suction holes for vacuum-sucking the image sensor package have a wide surface shape, and since the vacuum area is formed three times larger than that of the conventional apparatus, the image sensor package can be stably picked and placed without any pick-up errors, thereby significantly improving the inspection yield.

[0077] In addition, by inserting non-metallic gaskets into the joints between the pusher cover and the upper circuit board, and between the upper circuit board and the floating plate to perform vacuum sealing, the vacuum pressure provided by the vacuum generator can be smoothly applied to the vacuum suction sheet without loss.

[0078] In addition, since the vacuum suction sheet that suctions the image sensor package is made of a sheet of non-elastic insulating material, there is an advantage in that the shock that occurs when it comes into contact with the image sensor package is mitigated.

[0079] In addition, by using an upper socket composed of an elastic conductive part having elasticity, the elastic conductive part of the upper socket wraps around the solder ball-shaped sensor terminal of the image sensor package to connect using a surface contact method, thereby reducing contact resistance and preventing misalignment, enabling stable connection and significantly improving the test yield.

[0080] In addition, since the elastic conductive portion of the upper socket smoothly connects with the sensor terminals of the image sensor package and the electrodes of the upper circuit board, damage to the sensor terminals of the image sensor package and the electrodes of the upper circuit board can be prevented.

[0081] Although the present invention has been described with reference to preferred embodiments, it is not intended that the scope of the present invention be limited to the embodiments previously described and illustrated. [Explanation of symbols]

[0082] 10: Image sensor package 11: Light receiving surface 12: Sensor terminal 20:Light source device 100, 1000: Image sensor package test equipment 130: Lower socket 131: Pogo pin 132: Package mounting section 133: Light source insertion section 134: Socket housing 136: Guide hole 137: Lower socket protrusion 140: Tester 150: Upper circuit board 153: Substrate vacuum hole 157, 158: Gasket 160: Upper socket 161: Elastic conductive part 162: Insulation section 170: Floating plate 171: Socket mounting part 172: Plate Hall 173: Plate vacuum hole 174: Gasket insertion hole 175: Guide section 180: Vacuum suction sheet 181: Package suction hole 182: Guide Hall 190: Pusher 191: Bass 192: Cover 193: Cover vacuum hole 195: Plate mounting section 196: Base Hole 197: Lower socket protruding insert

Claims

1. In the image sensor package test equipment, an image sensor package having a light receiving surface at a lower portion and a sensor terminal at an upper portion; a light source device attached to a tester for providing a test signal and for irradiating light onto a light receiving surface of the image sensor package; a lower socket including: a package seating portion attached to the tester, on which the image sensor package is seated; a light source insertion portion in which the light source device is disposed under the package seating portion; and a pogo pin electrically connecting the tester and an upper circuit board; an upper socket having an elastic conductive portion, the elastic conductive portion being formed of an elastic insulating material containing a plurality of conductive particles, electrically connecting the upper circuit board and the image sensor package; a pusher to which the upper circuit board having a board vacuum hole formed therein is coupled, which has a cover vacuum hole to which a vacuum pressure of a vacuum generating device is transmitted, and which is movable by receiving power from a driving unit so as to approach or move away from the lower socket; and a floating plate connected to the pusher, having a plate vacuum hole formed therein, and having a socket seating portion on which the upper socket is seated and a plate hole at an upper portion thereof; A vacuum suction sheet having package suction holes for suctioning the image sensor package is attached to the bottom of the floating plate. a vacuum line is formed such that the cover vacuum hole is connected to the substrate vacuum hole, the substrate vacuum hole is connected to the plate vacuum hole, and the plate vacuum hole is connected to the package suction hole.

2. 2. The apparatus for testing an image sensor package according to claim 1, wherein a test signal provided to the tester is transmitted to the image sensor package via the light source device, the lower socket, the upper circuit board, and the upper socket.

3. 2. The image sensor package testing device according to claim 1, wherein a guide portion for guiding the image sensor package is protruded from a lower surface of the floating plate, and the vacuum suction sheet is provided with a guide hole into which the guide portion is fitted.

4. 2. The image sensor package testing apparatus according to claim 1, wherein the package suction hole of the vacuum suction sheet is sized to surround the plate hole of the floating plate.

5. 2. The image sensor package testing apparatus as set forth in claim 1, wherein an area of ​​the package suction hole is at least 0.1 times an area of ​​the image sensor package.

6. 2. The image sensor package testing device according to claim 1, wherein the vacuum suction sheet is made of a non-elastic insulating material.

7. 7. The image sensor package testing apparatus according to claim 6, wherein the non-elastic insulating material is any one of polyimide film, FR4, engineering plastic, and metal with insulating coating.

8. 2. The image sensor package test apparatus according to claim 1, wherein the pusher includes a base that accommodates the upper circuit board, the upper socket, and the floating plate, and a cover that covers the base.

9. 9. The apparatus for testing an image sensor package as set forth in claim 8, wherein the cover vacuum hole is formed in the cover.

10. 10. The image sensor package testing apparatus of claim 9, further comprising a gasket coupled between the cover and the upper circuit board to surround the cover vacuum hole and the board vacuum hole.

11. 11. The image sensor package testing apparatus according to claim 1, further comprising a gasket surrounding the substrate vacuum hole and the plate vacuum hole, the gasket being coupled between the upper circuit board and the floating plate.

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