Sample Processing Equipment

Abstract

To provide a sample processing device capable of easily preventing an optical apparatus from colliding with an ion source.SOLUTION: A sample processing device processes a sample by irradiating the sample with an ion beam, and includes: an ion source for emitting an ion beam; a chamber in which the sample is accommodated; a sample stage for holding the sample; a drawing mechanism for drawing the sample stage from the chamber; an optical apparatus that is attached to the drawing mechanism and disposed at an observation position where the sample can be observed when the drawing mechanism is opened and the sample stage is drawn; and a guide for converting linear motion of the drawing mechanism performed when the drawing mechanism is closed and the sample stage is pushed into the chamber, into rotational motion of the optical apparatus so as to guide the optical apparatus to a retreat position separated from the ion source.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a sample processing device. [Background technology]

[0002] Known sample processing devices that use an ion beam to process a sample include a Cross Section Polisher (registered trademark) for processing a cross section of a sample and an Ion Slicer (registered trademark) for producing a thin film sample.

[0003] In such a sample processing apparatus, prior to processing, alignment is performed to align a target processing position of the sample with the irradiation position of the ion beam.

[0004] For example, Patent Document 1 discloses a sample processing device that includes an extraction mechanism that is attached to a vacuum chamber so as to be able to open and close, and in which an optical microscope is placed above a sample when the extraction mechanism is open, and an ion gun is placed above the sample when the extraction mechanism is closed. In the sample processing device of Patent Document 1, the optical microscope can be used to align the sample by previously aligning the optical axis of the optical microscope when the extraction mechanism is open with the central axis of the ion beam irradiated from the ion gun when the extraction mechanism is closed.

[0005] The sample processing device of Patent Document 1 has an optical microscope tilting mechanism that tilts the optical microscope to move the optical microscope away from above the sample. In the sample processing device of Patent Document 1, when the extraction mechanism is closed, the optical microscope is tilted so that the optical microscope does not collide with the ion source. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2005-37164 A Summary of the Invention [Problem to be solved by the invention]

[0007] In the sample processing device of Patent Document 1, as described above, when retracting the optical microscope, the user must tilt the optical microscope. [Means for solving the problem]

[0008] One aspect of the sample processing device according to the present invention is to A sample processing apparatus for processing a sample by irradiating the sample with an ion beam, comprising: an ion source that emits the ion beam; A chamber in which the sample is contained; A sample stage for holding the sample; a withdrawal mechanism that withdraws the sample stage from the chamber; an optical instrument attached to the pull-out mechanism and arranged at an observation position where the sample can be observed by opening the pull-out mechanism and pulling out the sample stage; a guide that converts a linear motion of the extraction mechanism when the extraction mechanism is closed and the sample stage is pushed into the chamber into a rotational motion of the optical device, and guides the optical device to a retracted position away from the ion source; Includes.

[0009] In such a sample processing device, the guide pushes the sample stage into the chamber. Since the linear motion of the extraction mechanism is converted into the rotational motion of the optical device to guide the optical device to a retracted position away from the ion source, it is possible to easily prevent the optical device from colliding with the ion source. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing the configuration of a sample processing device according to an embodiment of the present invention; [Diagram 2] 1 is a diagram showing the configuration of a sample processing device according to an embodiment of the present invention; [Diagram 3] 1 is a perspective view showing a sample processing device according to an embodiment of the present invention; [Figure 4] FIG. [Diagram 5] FIG. 4 is a diagram for explaining the movement of a guide pin. [Figure 6] FIG. 11 is a diagram for explaining the operation of a guide. [Figure 7] FIG. 11 is a diagram for explaining the operation of a guide. [Figure 8] FIG. 4 is a diagram for explaining a guide rail. [Figure 9] FIG. 4 is a diagram for explaining a shock absorbing member. [Figure 10] FIG. 13 is a diagram showing the configuration of a sample processing device according to a first modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are necessarily essential components of the present invention.

[0012] 1. Sample processing equipment A sample processing device according to an embodiment of the present invention will be described with reference to the drawings. Figures 1 and 2 are diagrams showing the configuration of a sample processing device 100 according to an embodiment of the present invention. Figures 1 and 2 show an X-axis, a Y-axis, and a Z-axis as three mutually orthogonal axes.

[0013] The sample processing device 100 is an ion beam processing device that irradiates an ion beam onto a sample S to process the sample S and prepare a sample for observation or analysis. The sample processing device 100 is, for example, a Cross Section Polisher (registered trademark) for processing a cross section of a sample.

[0014] The sample processing device 100 is used to prepare samples for electron microscopes such as a scanning electron microscope (SEM), a transmission electron microscope (TEM), a scanning transmission electron microscope (STEM), etc. The sample processing device 100 is also used to prepare samples for analytical devices other than electron microscopes such as an electron probe microanalyzer (EPMA) or an Auger microprobe.

[0015] 1 and 2, the sample processing device 100 includes an ion source 10, an extraction mechanism 20, a sample stage 30, a swing mechanism 40, an alignment camera 50, a processing and observation camera 60, a chamber 70, and a guide 80. Note that Fig. 1 illustrates a state in which the extraction mechanism 20 is closed and the sample stage 30 is pushed into the chamber 70, and Fig. 2 illustrates a state in which the extraction mechanism 20 is open and the sample stage 30 is extracted from the chamber 70.

[0016] The ion source 10 generates an ion beam. The ion source 10 irradiates the ion beam onto a sample S. The ion source 10 is attached to the upper part of a chamber 70. The optical axis of the ion beam emitted from the ion source 10 is parallel to the Z axis.

[0017] The extraction mechanism 20 is attached to the chamber 70 so as to be able to open and close. The extraction mechanism 20 constitutes a lid of the chamber 70. A sample stage 30 is attached to the extraction mechanism 20. is.

[0018] The extraction mechanism 20 can be opened by linearly moving the extraction mechanism 20 in the +Y direction from a closed state. By opening the extraction mechanism 20, the sample stage 30 can be pulled out from the sample chamber 72 as shown in FIG. 2. This allows the inside of the chamber 70 to be opened to the atmosphere. Furthermore, by opening the extraction mechanism 20, the alignment camera 50 is guided by the guide 80 to move to an observation position P2 where the sample S can be observed. This allows the sample S to be observed by the alignment camera 50, and alignment can be performed to align the target processing position of the sample S with the irradiation position of the ion beam.

[0019] The extraction mechanism 20 can be closed by moving the extraction mechanism 20 linearly in the -Y direction from the open state. By closing the extraction mechanism 20, the sample stage 30 can be pushed into the sample chamber 72 as shown in FIG. 1. This makes the chamber 70 airtight. In this state, the sample chamber 72 can be evacuated by operating an exhaust device (not shown), and the sample chamber 72 can be put into a vacuum state (reduced pressure state). Furthermore, by closing the extraction mechanism 20, the sample S is positioned on the optical axis of the ion source 10, and the sample S can be processed by the ion beam emitted from the ion source 10. Furthermore, by closing the extraction mechanism 20, the alignment camera 50 is guided by the guide 80 and moves to the retracted position P4. This makes it possible to prevent the alignment camera 50 from colliding with the ion source 10.

[0020] The sample stage 30 is attached to a swing mechanism 40. The sample stage 30 holds a sample S to be processed. The sample stage 30 has an X-moving mechanism 32 and a Y-moving mechanism 34. The X-moving mechanism 32 can move the sample S along the X-axis. The Y-moving mechanism 34 can move the sample S along the Y-axis. The X-moving mechanism 32 and the Y-moving mechanism 34 can move the sample S two-dimensionally in the horizontal direction. The X-moving mechanism 32 and the Y-moving mechanism 34 can be used to align the sample S. Although not shown, the sample processing device 100 is provided with a shielding plate that blocks the ion beam, and the portion of the sample S supported by the sample stage 30 that protrudes from the shielding plate is cut.

[0021] The swing mechanism 40 is attached to the drawer mechanism 20. By opening the drawer mechanism 20, the swing mechanism 40 is drawn out, and the sample stage 30 is drawn out.

[0022] The swing mechanism 40 tilts the sample stage 30 around a swing axis A (tilt axis). The swing mechanism 40 swings the sample S by tilting the sample stage 30 around the swing axis A at a constant period, for example. In the illustrated example, the swing axis A is an axis parallel to the Y axis. In the sample processing device 100, the sample S can be processed by irradiating an ion beam onto the sample S while swinging the sample S with the swing mechanism 40.

[0023] The alignment camera 50 is attached to the pull-out mechanism 20. The alignment camera 50 is, for example, a camera attached to an optical microscope. That is, the image acquired by the alignment camera 50 is an image observed through the optical microscope.

[0024] The alignment camera 50 is a camera for aligning a target processing position of the sample S to an irradiation position of the ion beam. For example, the extraction mechanism 20 is opened and the alignment camera 50 is placed at an observation position P2, and the target processing position is aligned with the center of an image acquired by the alignment camera 50. This allows the ion beam emitted from the ion source 10 to be irradiated onto the target processing position when the extraction mechanism 20 is closed. When the extraction mechanism 20 is closed, the alignment camera 50 is placed at a retracted position P4 away from the ion source 10.

[0025] The processing and observation camera 60 is disposed outside the sample chamber 72. The sample S in the sample chamber 72 can be observed through an observation window 74 provided in the chamber 70. The processing and observation camera 60 is a camera for observing the sample S during processing. The processing and observation camera 60 can observe the cross section of the sample S during processing. The optical axis of the processing and observation camera 60 is parallel to the Y axis.

[0026] The sample stage 30 is housed in the chamber 70. The sample chamber 72 is a space within the chamber 70. In the sample chamber 72, the sample S is irradiated with an ion beam.

[0027] The guide 80 guides the alignment camera 50 to the observation position P2. For example, the guide 80 guides the alignment camera 50 from the observation position P2 to the retracted position P4, and also guides the alignment camera 50 from the retracted position P4 to the observation position P2.

[0028] 2. Guide 2.1. Guide Structure Fig. 3 is a perspective view that typically shows the sample processing device 100. Fig. 4 is a perspective view that typically shows the guide 80. Note that Figs. 3 and 4 show a state in which the pull-out mechanism 20 is closed and the alignment camera 50 is located at the retracted position P4.

[0029] The alignment camera 50 is supported by a support member 52. The support member 52 is attached to the pull-out mechanism 20. The support member 52 is rotatably attached to the pull-out mechanism 20 via a shaft 54. This allows the alignment camera 50 to move along a guide 80. Although not shown, a magnet may be incorporated in the support member 52 near the shaft 54. This magnet allows the alignment camera 50 to be accurately positioned at the observation position P2.

[0030] As shown in FIGS. 3 and 4, the guide 80 includes a guide pin 82, a guide rail 84, a stopper 86, and a shock absorbing member 88.

[0031] 2.2. Guide pin The guide pin 82 is attached to the alignment camera 50. The guide pin 82 is attached to the alignment camera 50 by a mounting member 83. The mounting member 83 is fixed to the alignment camera 50.

[0032] When the drawer mechanism 20 is opened and closed to move the alignment camera 50, the guide pin 82 moves along the guide rail 84. This allows the alignment camera 50 to move between the observation position P2 and the retracted position P4.

[0033] The guide pin 82 has a rod-like shape extending along the Z-axis. This allows the guide pin 82 to come into contact with the guide rail 84 even when the alignment camera 50 is moved along the Z-axis to match the height of the sample S.

[0034] FIG. 5 is a diagram for explaining the movement of the guide pin 82. As shown in FIG.

[0035] Guide pin 82 can rotate within an angle range of ±α around shaft 2 by a spring (not shown). For example, if the angle of the reference position of guide pin 82 is θ=θ0, guide pin 82 can rotate within the range of θ=θ0+α, θ=θ0-α. The spring biases guide pin 82 so that guide pin 82 is located at the reference position (θ=θ0). The action of this spring allows guide pin 82 to move smoothly, following the shape of guide rail 84.

[0036] 2.3. Guide rails 3, the guide rail 84 is disposed above the chamber 70. The guide rail 84 is disposed above the chamber 70 by a mounting member 85. The mounting member 85 is provided so as to surround the ion source 10.

[0037] The guide rail 84 guides the guide pin 82. The guide pin 82 moves following the shape of the guide rail 84.

[0038] The guide rail 84 converts the linear motion of the pull-out mechanism 20 when the pull-out mechanism 20 is closed and the sample stage 30 is pushed into the chamber 70 into rotational motion of the alignment camera 50, and guides the alignment camera 50 from the observation position P2 to the retracted position P4.

[0039] In addition, the guide rail 84 converts the linear motion of the pull-out mechanism 20 when the pull-out mechanism 20 is opened to pull out the sample stage 30 from the chamber 70 into rotational motion of the alignment camera 50, and guides the alignment camera 50 from the retracted position P4 to the observation position P2.

[0040] In addition, when the sample stage 30 is pushed into the chamber 70 while the pull-out mechanism 20 is opened and the sample stage 30 is pulled out from the chamber 70 and the alignment camera 50 is positioned away from the observation position P2, the guide rail 84 guides the alignment camera 50 to the retracted position P4.

[0041] 2.4. Stopper The stopper 86 limits the movable range (swing width) of the alignment camera 50 by an elastic member such as a spring. The stopper 86 has a pin 87 that contacts the support member 52, and the pin 87 is elastically biased. Therefore, when the support member 52 contacts the pin 87, the pin 87 pushes back the support member 52. This makes it possible to limit the movable range of the alignment camera 50.

[0042] For example, when the maximum swing range of the support member 52 is 45°, the swing range is limited to 40° by the stopper 86. This allows the guide pin 82 to be pressed against the guide rail 84. Furthermore, as will be described later, when the guide pin 82 goes beyond the end of the guide rail 84, the alignment camera 50 can be placed at the retracted position P4.

[0043] 2.5. Guide behavior FIG. 6 is a diagram for explaining the operation of the guide 80. As shown in FIG.

[0044] Figure 6 (A) illustrates the state in which the alignment camera 50 is located at the retracted position P4 (P=P4), Figure 6 (B) and Figure 6 (C) illustrate the alignment camera 50 moving from the retracted position P4 to the observation position P2, and Figure 6 (D) illustrates the state in which the alignment camera 50 is located at the observation position P2 (P=P2).

[0045] 6A, when the drawer mechanism 20 is closed and the sample stage 30 is pushed into the chamber 70, the alignment camera 50 is located at the retracted position P4. When the drawer mechanism 20 is opened in this state, the sample stage 30 is drawn out and moves in the +Y direction.

[0046] At this time, as shown in Fig. 6B and Fig. 6C, the guide pin 82 moves along the guide rail 84. By the guide pin 82 moving along the guide rail 84, the linear motion of the extraction mechanism 20 along the Y axis can be converted into the rotational motion of the alignment camera 50. Therefore, the alignment camera 50 is moved to the retracted position P4 to avoid the ion source 10. can be moved to observation position P2.

[0047] 6(C), when the guide pin 82 moves away from the guide rail 84, the swing width of the support member 52 decreases, and the support member 52 becomes substantially parallel to the Y-axis. At this time, the support member 52 is fixed parallel to the Y-axis by a magnet disposed near the rotation shaft 54 ​​of the support member 52. This allows the alignment camera 50 to be accurately positioned at the observation position P2.

[0048] 6(D), when the extraction mechanism 20 is opened and the sample stage 30 is extracted from the chamber 70, the alignment camera 50 is located at the observation position P2. When the extraction mechanism 20 is closed in this state, the sample stage 30 is pushed in and moves in the -Y direction.

[0049] 6(C) and 6(B), the alignment camera 50 (the housing of the alignment camera 50) moves along the guide rail 84. By moving the alignment camera 50 along the guide rail 84, the linear motion of the extraction mechanism 20 along the Y axis can be converted into the rotational motion of the alignment camera 50. Therefore, the alignment camera 50 can be moved from the observation position P2 to the retracted position P4 while avoiding the ion source 10.

[0050] FIG. 7 is a diagram for explaining the operation of the guide 80. As shown in FIG.

[0051] (A), (B), (C), and (D) in Fig. 7 correspond to (A), (B), (C), and (D) in Fig. 6. (E) in Fig. 7 illustrates a state in which the alignment camera 50 is located at a position P3 away from the observation position P2 (P=P3) with the drawer mechanism 20 open, and (F), (G), and (H) in Fig. 7 illustrate the state in which the alignment camera 50 has moved from the position P3 to the retracted position P4.

[0052] In the sample processing device 100, when replacing the sample S, the pull-out mechanism 20 is opened and the sample stage 30 is pulled out to replace the sample S. At this time, the alignment camera 50 arranged at the observation position P2 interferes with the work of replacing the sample S. Therefore, as shown in FIG. 7E, the support member 52 is rotated about the shaft 54 ​​as the rotation axis to move the alignment camera 50 to a position P3 away from the observation position P2. In this state, when the pull-out mechanism 20 is closed, the sample stage 30 is pushed in and moves in the -Y direction.

[0053] 7(F), 7(G), and 7(H), as the pull-out mechanism 20 moves in the -Y direction, the guide pin 82 comes into contact with the guide rail 84, and the guide pin 82 moves along the guide rail 84. As the guide pin 82 moves along the guide rail 84, the alignment camera 50 moves in the +X direction, and the stopper 86 (pin 87) is pushed in. As a result, the support member 52 is biased by the stopper 86, and the guide pin 82 is pressed against the guide rail 84.

[0054] When the guide pin 82 passes the end of the guide rail 84, the support member 52 is pressed by the stopper 86, and the alignment camera 50 is disposed at the retracted position P4.

[0055] Before the alignment camera 50 is placed in the retracted position P4, the guide pin 82 comes into contact with the shock absorbing member 88. This makes it possible to absorb the shock applied to the alignment camera 50.

[0056] As described above, in the sample processing device 100, the position The alignment camera 50 can be disposed at the observation position P2 or at the retreat position P4. Therefore, the sample processing device 100 can save the user time and effort, and allows the sample S to be processed easily.

[0057] 2.6. Guide rails FIG. 8 is a diagram for explaining the guide rail 84. As shown in FIG.

[0058] As shown in FIG. 8, the guide rail 84 has a first surface 84a with which the guide pin 82 contacts when the alignment camera 50 is moved from the retracted position P4 to the observation position P2, and a second surface 84b with which the alignment camera 50 contacts when the alignment camera 50 is moved from the observation position P2 to the retracted position P4.

[0059] 8, the first surface 84a has a first portion 840a and a second portion 840b. The first portion 840a is curved in a plan view (as viewed from the Z direction) and guides the alignment camera 50 to avoid the ion source 10. The second portion 840b guides the alignment camera 50 so that it is reliably positioned at the observation position P2 when the extraction mechanism 20 is opened and the alignment camera 50 is positioned at the observation position P2. Therefore, the angle formed by the second portion 840b and the Y axis is smaller than the angle formed by the first portion 840a and the Y axis. This allows the alignment camera 50 to be accurately guided to the observation position P2.

[0060] When the alignment camera 50 is moved from the observation position P2 to the retracted position P4, the alignment camera 50 moves along the second surface 84b. A tip portion 842 of the second surface 84b forms a small angle with the Y axis so as to reduce the impact when the alignment camera 50 collides. In addition, a rear end portion 844 of the second surface 84b is curved in a plan view so that the guide pin 82 can move smoothly from the second surface 84b to the first surface 84a.

[0061] When the guide 80 guides the alignment camera 50 from the retracted position P4 to the observation position P2, the guide pin 82 moves along the first surface 84a. When the guide 80 guides the alignment camera 50 from the observation position P2 to the retracted position P4, the alignment camera 50 moves along the second surface 84b.

[0062] Furthermore, when the guide 80 guides the alignment camera 50 from a position P3 that is off the observation position P2 to the retracted position P4, the guide pin 82 moves along the second surface 84b.

[0063] 2.7. Impact mitigation materials Fig. 9 is a diagram for explaining the impact absorbing member 88. Fig. 9 illustrates a state in which the alignment camera 50 shown in Fig. 7(A) is disposed at the retracted position P4 after the drawer mechanism 20 is moved in the -Y direction from the state in Fig. 7(H).

[0064] 7(H) in the -Y direction, and when the guide pin 82 passes the end of the guide rail 84, the guide pin 82 moves away from the guide rail 84. At this time, the alignment camera 50 is pushed by the stopper 86 and comes into contact with the guide rail 84.

[0065] Here, the guide 80 has an impact mitigating member 88, and the guide pin 82 hits a collision surface 89 of the impact mitigating member 88 before the alignment camera 50 hits the guide rail 84. The orientation of the collision surface 89 is adjusted so that the guide pin 82 hits at a shallow angle. Therefore, by the guide pin 82 coming into contact with the collision surface 89 of the impact mitigating member 88 before the alignment camera 50 hits the guide rail 84, the impact applied to the alignment camera 50 when the alignment camera 50 hits the guide rail 84 can be mitigated.

[0066] 3. Effects In the sample processing apparatus 100, the guide 80 converts the linear motion of the extraction mechanism 20 when the extraction mechanism 20 is closed and the sample stage 30 is pushed into the chamber 70 into a rotational motion of the alignment camera 50, and guides the alignment camera 50 to a retracted position P4 away from the ion source 10. Therefore, in the sample processing apparatus 100, it is possible to prevent the alignment camera 50 from colliding with the ion source 10 when the sample stage 30 is pushed into the chamber 70. Therefore, in the sample processing apparatus 100, it is possible to save the trouble of retracting the alignment camera 50 when the extraction mechanism 20 is closed, and it is possible to easily prevent the alignment camera 50 from colliding with the ion source 10.

[0067] In the sample processing device 100, when the sample stage 30 is pushed into the chamber 70 with the alignment camera 50 located at the observation position P2, the guide 80 guides the alignment camera 50 from the observation position P2 to the retracted position P4. Also, when the sample stage 30 is pulled out of the chamber 70 with the alignment camera 50 located at the retracted position P4, the guide 80 guides the alignment camera 50 from the retracted position P4 to the observation position P2.

[0068] Therefore, the alignment camera 50 can be positioned at the observation position P2 with good reproducibility in the sample processing apparatus 100. Therefore, in the sample processing apparatus 100, the processing precision and processing reproducibility can be improved.

[0069] For example, when manually placing the alignment camera 50 at the observation position P2, it is difficult to keep constant the deviation caused by the impact applied to the alignment camera 50. In contrast, in the sample processing device 100, the guide 80 guides the alignment camera 50 to the observation position P2, so that the deviation caused by the impact applied to the alignment camera 50 can be made smaller than when the alignment camera 50 is manually placed at the observation position P2.

[0070] In the sample processing apparatus 100, when the sample stage 30 is pulled out from the chamber 70 and the alignment camera 50 is positioned at position P3 away from the observation position P2, and the sample stage 30 is pushed into the chamber 70, the guide 80 guides the alignment camera 50 to the retracted position P4. Therefore, in the sample processing apparatus 100, even if the alignment camera 50 is shifted from the observation position P2, the pull-out mechanism 20 can be closed to push the sample stage 30 into the chamber 70 to place the alignment camera 50 in the retracted position P4. This can save the user time and effort.

[0071] In the sample processing device 100, the guide 80 includes a guide pin 82 attached to the alignment camera 50 and a guide rail 84 that guides the guide pin 82. The guide rail 84 has a first surface 84a that the guide pin 82 comes into contact with when the alignment camera 50 is moved from the retracted position P4 to the observation position P2, and a second surface 84b that the guide pin 82 comes into contact with when the alignment camera 50 is moved from a position P3 away from the observation position P2 to the retracted position P4. Therefore, in the sample processing device 100, the alignment camera 50 can be placed at the observation position P2 by opening the drawer mechanism 20, and the alignment camera 50 can be placed at the retracted position P4 by closing the drawer mechanism 20.

[0072] In the sample processing apparatus 100, when the guide pin 82 moves from the second surface 84b to the first surface 84a of the guide rail 84, the guide pin 82 moves away from the guide rail 84. The guide 80 also includes an impact absorbing member 88 with which the guide pin 82 comes into contact when the guide pin 82 moves away from the guide rail 84. Therefore, in the sample processing apparatus 100, the impact applied to the alignment camera 50 can be mitigated.

[0073] In the sample processing apparatus 100, the guide 80 includes an elastic member (stopper 86) that urges the support member 52 to bring the guide pin 82 into contact with the guide rail 84 (second surface 84b) when the sample stage 30 is pulled out from the chamber 70 and the alignment camera 50 is positioned at position P3 away from the observation position P2 and the sample stage 30 is pushed into the chamber 70. Therefore, in the sample processing apparatus 100, even if the alignment camera 50 is shifted from the observation position P2, the alignment camera 50 can be placed in the retracted position P4 by closing the pull-out mechanism 20 and pushing the sample stage 30 into the chamber 70.

[0074] 4. Modifications The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the present invention.

[0075] 4.1. First variant 10 is a diagram showing the configuration of a sample processing apparatus 200 according to a first modified example. Hereinafter, in the sample processing apparatus 200 according to the first modified example, components having the same functions as those of the above-mentioned sample processing apparatus 100 are given the same reference numerals, and detailed description thereof will be omitted.

[0076] As shown in FIG. 10, the sample processing device 200 includes an image processing device 202 and a display unit 204.

[0077] The display unit 204 outputs the image processed by the image processing device 202. The display unit 204 can be realized by a display such as an LCD (liquid crystal display).

[0078] The image processing device 202 acquires the images taken by the alignment camera 50 and the images taken by the processing and observation camera 60, and displays them on the display unit 204. The sample processing device 200 has a sensor that detects the opening and closing of the pull-out mechanism 20, and the image processing device 202 switches between the images taken by the alignment camera 50 and the images taken by the processing and observation camera 60 according to the detection result by the sensor.

[0079] Specifically, when the sensor detects that the pull-out mechanism 20 is open, the image processing device 202 causes the display unit 204 to display the image captured by the alignment camera 50, and when the sensor detects that the pull-out mechanism 20 is closed, the image processing device 202 causes the display unit 204 to display the image captured by the processing observation camera 60.

[0080] The image processing device 202 switches images, for example, at the timing when the pull-out mechanism 20 is pulled out from a closed state. In the sample processing device 200, when the pull-out mechanism 20 is opened, the guide 80 guides the alignment camera 50 to the observation position P2, so that the alignment camera 50 can photograph the sample S in a short time. Therefore, in the sample processing device 200, when switching from an image photographed by the processing and observation camera 60 to an image photographed by the alignment camera 50, the time for which an image other than the sample S is displayed is short.

[0081] For example, when an optical microscope tilting mechanism for tilting an optical microscope is used, after the sample stage 30 is pulled out by the pull-out mechanism 20, the optical microscope must be manually operated to place the optical microscope at the observation position. Therefore, it takes a long time for the alignment camera 50 to be in a state where it can capture an image of the sample S. Therefore, when switching from an image captured by the processing and observation camera 60 to an image captured by the alignment camera 50, an image other than the sample S is displayed for a long time.

[0082] 4.2. Second variant In the above-described embodiment, a camera (alignment camera 50) is used as an optical device used for alignment to align the target processing position of the sample S with the irradiation position of the ion beam, but the optical device used for alignment is not limited to a camera. As the optical device used for alignment, various optical devices such as a magnifying glass, an optical microscope, and a digital camera can be used.

[0083] 4.3. Third variant In the above-described embodiment, the sample processing device is a Cross Section Polisher (registered trademark) for preparing a cross-sectional sample, but the sample processing device according to the present invention may be an Ion Slicer (registered trademark) for preparing a thin film sample. The Ion Slicer (registered trademark) is equipped with a shield belt for blocking an ion beam, and the sample can be thinned by blocking the ion beam with the shield belt. Furthermore, the sample processing device according to the present invention can be applied to various devices that irradiate an ion beam onto a sample to process the sample.

[0084] The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the present invention includes a configuration that is substantially the same as the configuration described in the embodiment. A substantially identical configuration is, for example, a configuration that has the same function, method, and result, or a configuration that has the same purpose and effect. The present invention also includes a configuration in which non-essential parts of the configuration described in the embodiment are replaced. The present invention also includes a configuration that has the same action and effect as the configuration described in the embodiment, or a configuration that can achieve the same purpose. The present invention also includes a configuration in which publicly known technology is added to the configuration described in the embodiment. [Explanation of symbols]

[0085] 10... ion source, 20... extraction mechanism, 30... sample stage, 32... X-movement mechanism, 34... Y-movement mechanism, 40... swing mechanism, 50... alignment camera, 52... support member, 54... shaft, 60... processing and observation camera, 70... chamber, 72... sample chamber, 74... observation window, 80... guide, 82... guide pin, 83... mounting member, 84... guide rail, 84a... first surface, 84b... second surface, 85... mounting member, 86... stopper, 87... pin, 88... impact mitigation member, 89... collision surface, 100... sample processing device, 200... sample processing device, 202... image processing device, 204... display unit, 840a... first part, 840b... second part, 842... tip part, 844... rear end part

Claims

1. A sample processing apparatus for processing a sample by irradiating the sample with an ion beam, comprising: an ion source that emits the ion beam; A chamber in which the sample is contained; A sample stage for holding the sample; a withdrawal mechanism that withdraws the sample stage from the chamber; an optical instrument attached to the pull-out mechanism and arranged at an observation position where the sample can be observed by opening the pull-out mechanism and pulling out the sample stage; a guide that converts a linear motion of the extraction mechanism when the extraction mechanism is closed and the sample stage is pushed into the chamber into a rotational motion of the optical device, and guides the optical device to a retracted position away from the ion source; A sample processing device comprising:

2. In claim 1, The guide is When the sample stage is pushed into the chamber with the optical instrument positioned at the observation position, the optical instrument is guided from the observation position to the retracted position; When the sample stage is withdrawn from the chamber while the optical instrument is positioned at the retracted position, the sample processing apparatus guides the optical instrument from the retracted position to the observation position.

3. In claim 2, A sample processing apparatus, wherein the guide guides the optical instrument to the retracted position when the sample stage is pulled out of the chamber and the optical instrument is positioned away from the observation position and the sample stage is pushed into the chamber.

4. In any one of claims 1 to 3, The guide is A guide pin attached to the optical device; A guide rail for guiding the guide pin; A sample processing device comprising:

5. In claim 4, The guide rail is a first surface with which the guide pin comes into contact when the optical device is moved from the retracted position to the observation position; a second surface with which the guide pin comes into contact when the optical device is moved from a position away from the observation position to the retracted position; A sample processing device having the above structure.

6. In claim 5, When the guide pin moves from the second surface to the first surface, the guide pin moves away from the guide rail; The guide includes an impact absorbing member that comes into contact with the guide pin when the guide pin moves away from the guide rail.

7. In any one of claims 4 to 6, a support member for supporting the optical device; The guide is adapted to guide the sample stage out of the chamber and the optical system a sample processing device including an elastic member that urges the support member to bring the guide pin into contact with the guide rail when the sample stage is pushed into the chamber while the vessel is positioned at a position away from the observation position.

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