Encapsulated RFID in consumable chamber parts

Abstract

A consumable part and a method for tracking the consumable part, the method including embedding a radio frequency tag in a pocket formed in a side of the consumable part facing away from a process region defined in a process chamber of a processing tool, and covering an opening of the pocket with a plug that is laser fused along an interface formed between a sidewall of the plug and a sidewall of the pocket.

Description

[Technical field]

[0001] The present embodiments relate to a method, system, and program for tracking consumable parts in semiconductor manufacturing equipment. [Background technology]

[0002] Substrates (e.g., wafers, flat panels) are subjected to various types of processing to form electronic products such as integrated circuits, flat panel displays, etc. The substrate is placed in a process chamber and subjected to different processing operations such as plasma etching, cleaning, deposition, etc., exposing the surface of the substrate to different chemicals. For example, during a plasma etching operation, selective portions of the substrate's surface are exposed to plasma. The selective portions are exposed by placing a photoresist mask layer on the substrate surface and subjecting the substrate to plasma etching to enable the plasma etching to remove underlying material not covered by the photoresist. Similarly, the substrate can undergo cleaning in the same process chamber or in a different process chamber, where the substrate is treated with cleaning chemicals to remove by-products remaining on the substrate's surface from the different processing operations.

[0003] One or more processing operations performed in a process chamber expose various parts of the process chamber to harsh chemicals used in the respective process chamber. In a production environment, for example, a single etch chamber may be used for multiple etch processes, each of which may use chemicals that may affect the wear rate of different chamber parts differently. Based on the wear rate (i.e., consumption rate), each of these parts is defined as having a certain amount of useful life before the part needs to be replaced, and thus these parts are referred to as "consumable" parts. Based on the type of part, the location of the part, and the amount of exposure to the harsh chemicals used in the process chamber, some system administrators define the life of each consumable part in terms of different numbers (number of chamber processing hours, number of wafers run, etc.), or out-of-specification wafer metrology data. These numbers are defined primarily based on the specifications of the consumable part. As a result, as the specifications change, the numbers also change. For example, the specifications may change for a particular type of consumable part (e.g., edge ring) used in the process chamber, and such changes may be based on the geometry, thickness, type of material used, etc. Different consumable parts in the process chamber may be made of different materials and therefore may wear at different rates. As a result, it is desirable to track the type and condition of consumable parts used in each process chamber to achieve optimal process results.

[0004] Current tracking of consumable parts relies on part numbers that are engraved on the consumable parts. However, over the life of the part, these visual markings can be compromised by etching and / or refurbishment cleaning. Furthermore, these markings can be easily tampered with. If these markings are provided on the underside of the consumable parts, tracking of these consumable parts can only be done by opening the process chamber, removing the consumable parts, and reading / scanning the engraved part number. This leads to significant downtime, as the consumable parts need to be properly re-inserted in the process chamber, and the process chamber needs to be calibrated before use.

[0005] The embodiments arise in this context. Summary of the Invention

[0006] A method, device, system, and computer program for tracking consumable parts used in a process chamber in a semiconductor processing system are presented. It should be understood that the present embodiments can be implemented in many ways, such as a method, an apparatus, a system, a device, or a computer program on a computer readable medium. Some embodiments are described below.

[0007] A semiconductor processing system may be a cluster tool that includes multiple process chambers that are used to perform different process operations on a surface of a substrate to define electronic devices. One or more of the process chambers may use process chemicals to perform process operations such as plasma etching, cleaning, etc. The process chambers include multiple consumable parts that are configured to deliver process chemicals, provide power, contain process chemicals within the process region, extend the processing region on the wafer, and / or remove by-products and impurities. These consumable parts are exposed to process chemicals and need to be tracked to ensure that (a) the consumable parts being used are compatible with the process chamber, (b) wear on the consumable parts is below a level that requires replacement, and (c) the consumable parts are functioning at an optimal level. Some examples of parts that may be exposed to process chemicals in a process chamber include focus rings, edge rings, inner liners, back shadow rings, electrostatic chucks or pedestals used to accept substrates for processing, chamber walls, plasma containment components (e.g., C-shrouds, confinement rings, etc.), whose surfaces may wear over time due to exposure to process chemicals and need to be replaced.

[0008] A particular embodiment of tracking consumable parts includes embedding a radio frequency (RF) tag in a consumable part used in a process chamber. The RF tag is embedded in a pocket defined in the side of the consumable part facing away from the process area where process chemicals are present. A plug is used to provide an airtight seal of the opening of the pocket. The airtight seal acts to insulate the RF tag from process chemicals, by-products, or radicals that make their way toward the opening of the pocket. The depth of the pocket is defined such that a sufficient amount of the consumable part remains on the side that experiences wear due to exposure of the side of the consumable part to process chemicals during the life of the consumable part.

[0009] The RF tag contains the identification information of the consumable part. In some implementations, the RF tag is an encapsulated passive RF tag that, when activated by an RF reader, allows verification of the consumable part using the labeling information contained therein. A plug sealing the opening of the pocket provides sufficient insulation for the RF tag embedded inside. The RF tag is activated from the side facing the processing area, and the identification information is read using an RF reader, allowing the consumable part to be easily tracked without fear of losing tracking ability due to wear. The RF tag is tamper-resistant, thus providing a reliable method for tracking the consumable part. In some implementations, the RF tag embedded in the consumable part defined in the process chamber used for plasma etching can operate at a higher frequency than the operating frequency used to generate plasma in the process chamber. This allows the RF tag to be activated only when needed, and not when the process chamber is operating. Keeping the operating frequency of the chamber different from the frequency at which the RF tag operates ensures that the frequency of the RF tag does not adversely affect the plasma process performed on top of the wafer. Furthermore, operating the RF tag at a frequency different from the operating frequency ensures that the RF tag will not be damaged by the operating frequency.

[0010] The identification information contained in the RF tag can be used for auditing purposes such as detecting consumable parts used in a process chamber, identifying mismatches of parts in a process chamber, tracking consumable parts during their life both in the process chamber and when removed from the process chamber for refurbishment, cleaning, etc. and reintroduced into the process chamber. The RF tag information can also be used to link the consumable parts to other parts used in the process chamber. The RF tag information can be provided to a computer that can include a software system for performing the audit. RF tags can be encapsulated in different consumable parts of a process chamber such as showerheads, inner liners, electrostatic chucks, confinement rings, edge rings, focus rings, shadow rings, etc., and these consumable parts can be part of an interlock system. In such cases, each consumable part can actively communicate with the interlock system's computer to ensure that the consumable parts used in a particular process chamber are authentic and in accordance with the specifications of the particular process chamber. The audit helps to avoid chamber part mismatches and troubleshoot process problems. An RF reader is used to read the RF tags.

[0011] With a general understanding of the various features, specific embodiments will now be described.

[0012] According to one embodiment, a consumable part for use in a process chamber used to process wafers is disclosed. The consumable part includes a pocket defined in a side facing away from the process region. The pocket extends to a first depth and has an opening. A radio frequency tag is embedded in the pocket and configured to generate a radio frequency signal when activated. A plug extends to a second depth and covers the opening. The plug is laser fused to seal the radio frequency tag in the pocket. Laser fusion is performed along an interface defined between a sidewall of the plug and a sidewall of the pocket.

[0013] In another embodiment, a method for manufacturing a traceable consumable part for use in a process chamber is disclosed. The method includes forming a pocket of a first depth on a side of the consumable part facing away from a process region defined in the process chamber. A radio frequency (RF) tag is embedded in the pocket. The opening of the pocket is sealed using a plug of a second depth such that a top surface of the plug is flush with a surface of the consumable part adjacent the pocket. The sealing is performed via laser fusing along an interface defined between a sidewall of the plug and a sidewall of the pocket using a laser welder, thereby providing an airtight seal of the interface using material from the plug and the sidewall of the pocket. The top surface of the plug and a portion of the surface of the traceable consumable part adjacent the opening of the pocket are polished to match a surface profile of the remaining surface of the traceable consumable part.

[0014] In yet another embodiment, a method for tracking a consumable part used in a process chamber is disclosed. The method includes embedding a radio frequency tag in a pocket defined in a side of the consumable part facing away from a processing region defined in the process chamber, and an opening of the pocket is sealed with a plug by laser fusion. The embedded radio frequency tag is activated by a reader inserted into the process chamber. Data related to the consumable part is collected by the reader via the activated radio frequency tag. The reader is coupled to a power source to provide power to the reader and activate the radio frequency tag. The reader is also coupled to a memory used to store data collected from the radio frequency tag. The collected data is interpreted to identify attributes of the consumable part used in the process chamber. According to some embodiments, the attributes include information related to the identification and / or usage data of the consumable part.

[0015] Other aspects will become apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0016] The embodiments may be best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0017] [Figure 1] FIG. 1 illustrates an exemplary semiconductor process cluster tool architecture having various process chambers (i.e., process modules) that include radio frequency (RF) tags embedded with one or more consumable parts, according to one embodiment.

[0018] [Figure 2A] FIG. 2A is a simplified block diagram of a process module that includes a consumable part with an embedded RF tag that is used to track the consumable part, according to one embodiment.

[0019] [Figure 2B] FIG. 2B is a close-up view of a consumable part having one or more embedded RF tags, according to one embodiment.

[0020] [Figure 3A] FIG. 3A illustrates a traversal path of an end effector having an embedded RF reader for reading RF tags embedded in consumable parts used in a process chamber, according to one embodiment.

[0021] [Figure 3B] FIG. 3B is a diagram illustrating the alignment of an RF reader-RF tag in a process chamber along the traversal path shown in FIG. 3A according to one embodiment.

[0022] [Figure 4A] FIG. 4A illustrates a process for embedding an RF tag within a pocket defined in the underside of the edge ring according to one embodiment. [Figure 4B] FIG. 4B illustrates a process of embedding an RF tag within a pocket defined in the underside of the edge ring according to one embodiment. [Figure 4C]FIG. 4C illustrates a process of embedding an RF tag within a pocket defined in the underside of the edge ring according to one embodiment. [Figure 4D] FIG. 4D illustrates a process of embedding an RF tag within a pocket defined in the underside of the edge ring according to one embodiment.

[0023] [Figure 5A] FIG. 5A illustrates a plug-pocket interface defined between a sidewall of the plug and a sidewall of the pocket in one embodiment.

[0024] [Figure 5B] FIG. 5B illustrates laser fusing of the plug to the pocket along the pocket-plug interface to provide an airtight seal in one embodiment.

[0025] [Figure 6] FIG. 6 illustrates a cross-sectional side view of a portion of an edge ring having an embedded RF tag in one exemplary embodiment, and the detected change in the intensity of the RF signal emanating from the RF tag based on erosion of the top surface of the edge ring.

[0026] [Figure 7A] FIG. 7A illustrates an end effector of a robotic arm on which one or more RF readers can be positioned to read RF tags, according to one embodiment.

[0027] [Figure 7B] FIG. 7B illustrates a reader ring in which one or more RF readers are deployed, where the reader ring is introduced to a process module via an end effector of a robotic arm, according to one embodiment.

[0028] [Figure 8A] FIG. 8A is a flow chart of a method for manufacturing a traceable consumable part with an embedded RF tag for use in a semiconductor processing tool, according to one embodiment.

[0029] [Figure 8B] FIG. 8B is a flow chart of a method for tracking consumable parts with embedded RF tags used in semiconductor processing equipment, according to one embodiment.

[0030] [Figure 9] FIG. 9 is a simplified schematic diagram of a computer system for implementing embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] The embodiments present methods, systems, and devices for embedding radio frequency (RF) tags within consumable parts, reading identification information from the RF tags, and using the identification information to track the consumable parts. Tracking can be used to perform audits to verify that genuine parts are being used in a process module, troubleshoot process issues, and determine remaining life before the consumable part needs to be replaced. Tracking of the consumable parts can be done in-situ without downtime of the process module. The RF tags are tamper-proof, thereby ensuring that the identification information and other attributes of the consumable part are not compromised. Positioning of the RF tags ensures that the information contained in the RF tags is accessible and that the identification information and other attributes of the consumable part can be read during the life of the consumable part.

[0032] The RF tag can be an encapsulated passive radio frequency identification (RFID) tag that can be embedded within non-metallic chamber parts (i.e., consumable parts), such as edge rings, ground rings, shadow rings, inner liners, showerheads, etc. An RF reader located on the end effector, embedded in the reader ring, or on a separate probe arm can be used to activate the RF tag and read the identification information. Alternatively, the RF reader can be located in an area of ​​the processing tool where the RF-tagged consumable parts pass through or are received (e.g., in the process chamber, load lock chamber, etc.) to activate the RF tag and read the identification information. RFID implants offer several advantages over traditional imprinting. Some advantages include fast and accurate verification of process chamber hardware configuration, elimination of uncertainty in authenticating various consumable parts, and providing an accurate measurement of remaining life to enable efficient and effective management of consumable part inventory where identification information is required. Thus, RFID implants improve the operational efficiency of processing tools while implementing predictive maintenance by providing an accurate measurement of the usage of consumable parts within the processing tool and the life remaining on the consumable parts. Other advantages will become apparent to those of ordinary skill in the art after reviewing the various embodiments described herein.

[0033] In some embodiments, the RF tag may be an ultra-high frequency tag, designed to be greater than the operating frequency of the process chamber. The ultra-high frequency for reading the RF tag ensures that the RF tag does not interfere with plasma generation or adversely affect the operating conditions within the process chamber.

[0034] The information collected from the RF tag can be used for audit purposes to verify that the process chamber is using authentic parts. The information can also be used for matching chamber parts. Based on the process chamber specifications and the RF tag identification information, each consumable part is matched to a specific process chamber. The RF tag information can also be used to track the number of times a consumable part has been repaired and / or refurbished to reduce running costs by optimizing the use of the part (i.e., optimizing life). For example, if a consumable part has a life of approximately 1500 hours and the average time between cleanings is 500 hours, the consumable part can be used for three process cycles after which the part can be discarded with no residual value remaining in the part. However, if a consumable part has a life of approximately 1200 hours and the average time between cleanings (MTBC) is approximately 500 hours, the part can be used for only two process cycles after which the remaining 200 hours remain. To optimize part use, consumable parts can be tracked within a process tool that includes multiple process chambers to determine the life remaining in the consumable part after each cleaning or refurbishment. If the remaining time remaining on the consumable part is less than the MTBC of the process chamber, the consumable part may be moved to another process chamber that has a shorter MTBC for the consumable part (i.e., at or near the remaining time remaining) to optimize the use of the consumable part. Additionally, tracking of consumable parts can be used for inventory control.

[0035] With a general understanding of embodiments of the present invention, illustrative details of various implementations will now be described with reference to the various figures.

[0036] FIG. 1 illustrates an example of a semiconductor process tool architecture. The semiconductor process tool 100 includes several process modules and airlocks that are coupled to a vacuum transfer module (VTM) 140 through corresponding interfaces as shown. The interfaces may include gate valves that provide controlled access to the respective process modules. The clustering of modules such as process modules and airlocks around the VTM allows for the transfer of wafers from one process module to another under vacuum using a robot 142 of the VTM 140, and is therefore also referred to as a "cluster tool assembly" or simply a "cluster tool." The airlock 130 (also referred to as a load lock) of the cluster tool 100 assists in transferring wafers from an atmospheric transfer module (ATM) 110 maintained at atmospheric conditions to the VTM 140 maintained at vacuum, and is therefore also referred to as a "transfer module." The cluster tool 100 is shown to include four process modules 120a-120d, each of which may be configured to perform various fabrication operations or individually optimized to perform separate fabrication operations. As an example, the processing modules 120a, 120b, 120c, 120d may be individually implemented to perform transformer coupled plasma (TCP) substrate etching, layer deposition, and / or sputtering. Each process module has a facet 136 that defines an interface between the process module and the VTM 140. The facet 136 may include a gate valve that may be operated by a controller. One or more sensors disposed on the facet 136 may be used to detect the passage of a substrate 102 or a consumable part, such as an edge ring, as it enters or leaves the respective process module.

[0037] The robot 142 of the VTM 140 is used to transfer substrates 102 and / or consumable parts, such as edge rings, from one process module to another, or between the airlock 130 and a process module. In one embodiment, the robot 142 has one arm. In another embodiment, the robot 142 has two arms. Each arm of the robot 142 has an end effector 144 that is used to transfer wafers and / or consumable parts between the airlock 130 and a process module (any one of the process modules 120a-120d) or between the process modules 120a-120d.

[0038] The ATM 110 may also include a robot (i.e., a front-end robot) 116 that may be used to transfer wafers or consumable parts from a cassette / front-opening unified pod (FOUP) 114 or a front-opening ring pod (FORP) (not shown) received at the load port 112 to the airlock 130. The front-end robot 116 may use an aligner 118 in the ATM 110 to align the wafers and / or consumable parts before the wafers / consumable parts are transferred to the airlock 130.

[0039] A controller may be coupled to the cluster tool 100 to control the movement of wafers or consumable parts within the cluster tool 100. The controller may be part of a computer that may be local to the cluster tool 100, located somewhere on the manufacturing floor, or at a remote location and connected to the cluster tool 100 via a network.

[0040] One or more of the process modules 120a-120d in the cluster tool 100 may include one or more consumable parts that have radio frequency (RF) tags embedded therein. The RF tags are passive tags that are energized by an RF reader when the RF reader is in proximity to the tag. The RF tags contain identifying information that can be used to track the consumable parts. The identifying information can be used to perform audits, determine chamber matching, identify repair or refurbishment statistics to determine when a consumable part needs to be scrapped / replaced, manage consumable part inventory, etc. Details of placing RF tags on consumable parts and reading identifying information contained in the RF tags are described in more detail with reference to FIGS. 2-7.

[0041] It will be apparent that the present embodiments may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail so as not to unnecessarily obscure the present embodiments.

[0042] FIG. 2A illustrates a process module 120a configured to perform plasma etching. In one embodiment, the process module 120a can be a capacitively coupled plasma processing system. The capacitively coupled plasma processing system includes a chamber 214 for generating plasma. The chamber 214 includes an upper electrode, such as a showerhead 210, and a lower electrode (i.e., a wafer support module 204), such as a pedestal or electrostatic chuck (ESC). In the embodiment illustrated in FIG. 2A, the showerhead 210 is shown as grounded and the wafer support module 204 is coupled to an RF power source. In an alternative embodiment, the showerhead 210 can be biased or coupled to a second RF source (not shown) and can be powered. The showerhead 210 is connected to one or more gas sources 228 coupled to a controller 222. The controller 222 can generate signals to cause the RF source 224 to provide an RF signal to the wafer support module 204 and the gas source 228 to inject a desired process gas into the plasma processing region 220 of the chamber 214 to generate plasma. The desired process gases are used in the process chamber 214 and may be based on a recipe controlled by a controller 222. A plasma is generated in a plasma processing region 220 defined between the showerhead 210 and the wafer support module 204. The plasma may be used to etch the surface of the wafer or to volatilize deposits formed on different surfaces of the chamber 214.

[0043] The wafer support module 204 provides a surface for receiving and supporting a wafer 202 (also referred to as a "substrate") to be processed. The edge ring 206 is configured to be positioned on the wafer support module 204 adjacent the wafer 202 when the wafer is received by the wafer support module 204. The chamber sidewall 234 extends the lateral length of the chamber 214. An access window 236 is defined along the chamber sidewall of the chamber 214 for transferring the wafer into and out of the process chamber. In one embodiment, an inner liner (not shown) can be defined on the inner surface of the chamber sidewall 234 to protect the sidewall of the chamber. In such an embodiment, a window can be defined on the inner liner and aligned with a corresponding opening of the access window 236 defined on the chamber sidewall 234. The access window 236 can be used to introduce a transfer arm 208 with one or more RF readers 243 or a probe 240 having an end effector of a robot arm into the chamber during operation. In some embodiments, a viewport used to monitor the internal conditions of the chamber can be used to introduce the transfer arm 208 or an end effector with an RF reader 243 into the chamber. The viewport can be defined above or below an access window 236 defined on the chamber sidewall 234. In embodiments where a transfer arm 208 is used, the transfer arm 208 is coupled to a reader control 232 used to control the movement of the probe 240 within the chamber 214. The reader control 232 is then coupled to a controller 222, which provides appropriate signals to control the movement of the RF reader 243 within the process module. In embodiments where a robotic arm end effector is used, the robot is coupled to the controller 222 to control the movement of the robot arm with the end effector.

[0044] In one embodiment, the RF reader 243 is configured to activate any RF tags included in one or more consumable parts located in the chamber 214 and read the tag information. The RF reader 243 can include a power source and a memory. The power source is configured to provide power to the RF reader and the one or more RF tags, and the memory is used to store data related to the consumable parts collected from the RF tags. The data collected by the RF reader 243 is transferred to the controller 222. The controller 222 can use the data from the RF tags to identify / define attributes of the one or more consumable parts.

[0045] Some of the parts in the chamber 214 may be affected when etching, cleaning, or other operations using harsh chemicals are performed in the chamber. Alternatively, some of the processes performed in the chamber may be affected if mismatched parts are used in the chamber or if parts are left in the chamber well beyond their lifespan. To minimize the impact on the parts / processes, authentic parts must be used in the chamber, and these parts must be replaced or repaired or refurbished after a certain number of process cycles (i.e., number of operating hours) so that the integrity of the process operations in the chamber can be maintained. The attributes identified for each consumable part from the information obtained from the RF tag of each part can be used to perform audits, identify matching features of the chamber, use the features to determine mismatches of the part with the chamber, optimize part inventory, determine repair / refurbishment attributes of the part, determine remaining life, identify various process modules in which the consumable part can be used, etc. Thus, the attributes of the consumable parts can be used to help optimize the use of the consumable parts and determine when to discard, replace, remove, or transfer the consumable parts.

[0046] Some of the consumable parts that may be beneficial to track may include the edge ring 206, shadow ring, focus ring, back shadow ring, confinement ring (not shown), plasma confinement structures such as a C-shroud, chamber wall covers, and showerhead 210. The list of consumable parts described above is not exhaustive, and additional parts contained in chamber 120a or other chambers (e.g., 120b-120d) may also be consumable and need to be tracked and effectively managed. Although the embodiments presented herein are described with reference to tracking the edge ring 206, the principles presented may be utilized to track any other consumable parts contained within chambers 120a-120d.

[0047] The RF source 224 that provides power to the wafer support module 204 may include multiple RF power sources or a single RF power source capable of generating multiple frequencies of RF signals. In one example, the frequency of the RF signal for generating the RF plasma may be between about 2 MHz and about 60 MHz. In another example, the frequency of the RF signal for generating the RF plasma may be between about 100 kHz and about 100 MHz. In one example, the RF signal may have an RF power between about 50 w and about 10 Kw. In another example, the RF signal may have an RF power between about 100 w and about 1500 w. The RF power source 124 may generate a pulsed or non-pulsed RF signal.

[0048] A pump 226 is coupled to the chamber 214 to pump process gases and / or by-products released during fabrication operations out of the chamber 214. The pump 226 is coupled to a controller to control the function of the pump 226.

[0049] The controller 222 includes a processor, memory, integrated circuits, software logic, hardware logic, input and output subsystems for receiving instructions, issuing signals / instructions, controlling operations such as etching, cleaning, etc., enabling endpoint measurements, communicating with various components of the chamber 214, and monitoring and generally controlling various aspects of the different operations performed within the chamber 214 of the process module 120a. The controller may be part of a substrate processing system, such as the cluster tool 100, and may be coupled to each module within the cluster tool 100 to individually communicate with, monitor and control various aspects of the process operations performed within the respective modules of the cluster tool 100. The controller 222 includes one or more recipes that include multiple set points for various operating parameters (e.g., voltage, current, frequency, pressure, flow rate, power, temperature, etc.) for different processes performed within different process modules of the cluster tool 100. Depending on the processing requirements and / or type of system, the controller can be programmed to control various process operations including delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and motion settings, wafer loading and unloading to and from the process modules, as well as wafer loading and unloading to and from other transfer modules and / or load locks connected or interfaced with a particular system module.

[0050] In addition to controlling the operating parameters of the different processes, the controller 222, in one embodiment, is configured to track the various consumable parts used in one or more process modules within the cluster tool 100. The controller is configured to control the position and operation of the transfer arm, for example, by providing appropriate signals to the reader control 232 to enable one or more RF readers 243 mounted on the end of the transfer arm to access, activate, and read RF tags embedded in the various consumable parts. Data collected from the various tags provides the identity of the consumable parts, which is transmitted to the controller to determine attributes of the consumable parts. The attributes of the consumable parts can be used to optimize the use of consumable parts within the cluster tool 100 and optimize the processes performed within the different modules of the cluster tool 100.

[0051] The integrated circuits of the controller 222 may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, i.e., microcontrollers, that execute program instructions (e.g., software). The program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define the operating parameters for performing a particular process on or for a semiconductor wafer or system. The operating parameters may, in some implementations, be part of a recipe defined by a process engineer to accomplish one or more processing steps, including forming layers, removing layers, depositing materials such as metals, oxides, silicon, silicon dioxide, etc., on the surface of the wafer and / or on the die on the wafer during the fabrication of one or more circuits.

[0052] The controller may be part of or coupled to a computer integrated with or otherwise networked to the system in some embodiments. For example, the controller may be in the "cloud" and all or part of a fab host computer system. This allows remote access and control of processing operations of a cluster tool (i.e., a substrate processing system) to define circuits on a wafer. The computer may allow remote access to the system to monitor the progress of a current fabrication operation, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, modify parameters of a current process, set processing steps following a current fabrication operation, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system over a network. Such a network may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data, the data specifying parameters of each of the processing steps to be performed during one or more process operations. It should be understood that the parameters may be specific to the type of process being performed and the type of cluster tool or process module that the controller is configured to interface with or control. The controller may be distributed, for example, by having one or more individual controllers networked together and working together toward a common purpose (such as the processes and control described herein). An example of a distributed controller for such purposes includes one or more integrated circuits on the chamber that communicate with one or more integrated circuits that are remotely located (e.g., at the platform level or as part of a remote computer) and coupled to control the process in the chamber.

[0053] Depending on the type of process operations performed in the substrate processing system, example systems may include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a tracking chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor devices.

[0054] As described above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the fabrication facility, tools within the factory, a main computer, another controller, or tools used for material transport to and from tool locations and / or load ports within the semiconductor manufacturing facility.

[0055] FIG. 2B shows a close-up view of a consumable part such as an edge ring 206 used in the chamber 214, which has an embedded RF tag for tracking. The edge ring 206 may have distinct ring profiles on the top and bottom surfaces with a step-down defined along the inner radius and an elongated sidewall along the outer radius, such that the height of the edge ring along the inner radius is less than the height of the edge ring along the outer radius. An alternative embodiment of the edge ring is shown in FIGS. 4A-4D, in which the edge ring has a distinct ring profile along the top surface with a step-down along the inner radius and a flat surface profile along the bottom surface. In this alternative embodiment, the height of the edge ring along the inner radius is less than the height along the outer radius. In other embodiments, the edge ring may have a flat surface profile along both the top and bottom surfaces. The edge ring includes an RF tag embedded in a pocket defined on a surface facing away from the process region 220 of the chamber 214. For example, the RF tag may be embedded in the surface that is maintained in vacuum (ie, location 1 in FIG. 2B) or in the underside of the edge ring that faces away from the process region 220 (ie, location 2 in FIG. 2B).

[0056] Alternative implementations of the process chamber can also be visualized. For example, the chamber 214 may include a plasma confinement structure for confining the plasma generated within the plasma processing region 221 of the chamber 214. The confinement structure can be in the form of, for example, a set of confinement rings or a C-shroud.

[0057] 2A, the probe 242 with the attached or embedded reader 243 can be introduced into the chamber 214 via the transfer arm 208. The probe 242 can be introduced through an access window 236 provided in the side of the chamber 214. The access window 236 can be the same opening used to move the wafer into and out of the chamber 214 in one embodiment. Alternatively, a view port separate from the access window can be used to provide separate access for the probe into the chamber 214. During introduction of the probe 242, the bottom electrode (i.e., the pedestal or ESC 204) can be moved down to allow the probe with the reader to move along a horizontal axis into the chamber 214 and power and read identification information from passive RF tags located in the consumable parts.

[0058] The transfer arm 208 is configured to move in different directions within the chamber 214 to allow the probe 242 to reach different sections of the chamber 214 and the RF reader 243 to detect and read the RF tags 304 embedded in the different consumable parts within the chamber 214. In some implementations, the transfer arm 208 may include one or more joints 208a configured to allow the portion of the transfer arm 208 with the probe 242 to rotate along a vertical axis, extend along a horizontal axis, or rotate radially. The one or more joints 208a provided on the transfer arm 208 provide the probe 242 with sufficient freedom of movement within the chamber 214 to allow the RF reader 243 to locate and activate the different RF tags 304 included in the different consumable parts. The transfer arm 208 is coupled to a reader control 232 to control the movement of the probe sensor. The reader control 232 is then coupled to a controller 222 which provides appropriate signals to move the transfer arm in and out of the chamber 214 as well as to move the probe 242 into the processing region 220 of the chamber 214.

[0059] 3A and 3B show the traversal path and the alignment of the RF reader with the RF tag embedded in the consumable part, such as the edge ring 206, when the RF reader is introduced into the process module 120a on the transfer arm or end effector. In an embodiment where an end effector 144 is used, one or more RF readers 243 are embedded on the top and / or bottom surface along the body of the end effector 144. Alternatively, one or more RF readers 243 may be located on the fingers of the end effector 144 (either the body of the fingers or the tips of the fingers), or anywhere else on the end effector 144. In an alternative embodiment, one or more RF readers 243 may be located on the surface of the reader ring 242. The reader ring 242 may be similar in design to the edge ring, and the RF readers 243 may be located along the circumference of the reader ring 242 on the top and / or bottom surface of the reader ring 242 and introduced into the process chamber. In yet another embodiment, the RF reader may be located on the top and / or bottom surface of the wafer-like disk and introduced into the process chamber on the end effector 144. The RF reader may also be embedded within a probe and introduced into the process chamber via a transfer arm.

[0060] 3A shows an embodiment of an end effector 144 with an RF reader 243 embedded in the fingers of the end effector 144. The end effector 144 is controlled to move along a traversal path 247 defined along a horizontal axis, such that the RF reader 243 traverses along a reader path 249 parallel to the traversal path 247 when the end effector is introduced into the chamber 120a through the access window 236. The reader path 249 aligns the RF reader embedded in the fingers of the end effector with the RF tag embedded in the edge ring. In some implementations, the consumable part may be held in place within the process chamber (e.g., on a pedestal or ESC) using one or more alignment pins 351, which may reliably define the location of the RF tag and the alignment of the RF reader 243.

[0061] Figure 3B shows a view of the RF reader-RF tag alignment within the process chamber along the vertical axis BB shown in Figure 3A as the end effector moves along traversal path 247 and the RF reader moves along reader path 249. Only a portion of edge ring 206 with embedded RF tags is shown within a portion of process module 120a to emphasize the alignment, although in reality the remaining components of the process module are also present.

[0062] When the RF reader 243 is introduced into the process module 120a along the reader path 249, the RF reader 243 aligned over the RF tag 304 embedded in the consumable part 206 (either embedded directly in the end effector 144 or embedded in a reader ring supported on the end effector 144) is configured to activate the RF tag 304, read the tag identification, and store the tag identification in a local memory. The tag identification information is then transferred to the controller 222. The controller 222 uses the RF tag identification information to track the consumable part in the process chamber when the consumable part is moved from one process chamber to another in the process tool, and when the consumable part is removed from the process tool and later reintroduced into the process tool. Details of providing the RF reader 243 for the transfer arm or end effector are described with reference to FIGS. 7A-7B.

[0063] The frequency at which the RF tag 304 operates is greater than the operating frequency used to generate plasma in the chamber 214. This ensures that the RF tag 304 is not prematurely activated during operation of the chamber 214 and interferes with the plasma etch process. In some implementations, the operating frequency for generating plasma in the chamber 214 may be between about 100 kilohertz (kHz) and about 100 megahertz (MHz). In some specific implementations, the operating frequency for generating plasma may be between about 400 kHz and about 60 MHz. The RF tag 304 may be configured to operate at an ultra-high frequency, which may be defined to be greater than the operating frequency of the chamber 214. In one implementation, ultra-high frequency is defined to be between about 150 MHz and about 1 gigahertz (GHz).

[0064] The various embodiments of the application described herein can be extended to include other non-metallic chamber parts such as inner liners, ground rings, shadow rings, showerheads, ESCs, etc. These consumable parts are generally made from quartz, silicon, carbide, silicon carbide, oxide ceramics, and / or other materials that have similar chemical, physical, and thermal properties that contribute to the processes carried out in the chamber.

[0065] 4A-4D show an example of how an RF tag 304 is integrated into a pocket 302 defined in the underside of a consumable part such as an edge ring in one embodiment. The diagrams shown in FIGS. 4A-4D are upside-down cross-sectional views of a portion of the edge ring illustrating the location of the pocket and placement of the RF tag relative to the upper and lower surfaces 206a, 206b of the edge ring. First, the pocket 302 is formed in the lower surface 206b (the side of the edge ring 206 facing away from the plasma processing region of the chamber). The edge ring 206 has a ring profile with a height "d1" along the inner radius that is smaller than a height "d2" along the outer radius of the consumable part. The pocket 302 can also be formed along the inner diameter of the consumable part that is maintained in a vacuum (e.g., the side shown in FIG. 2B) or a shadow space shielded from the RF plasma. If the consumable part is an inner liner, the pocket can be defined in the outer surface of the sidewall of the inner liner facing away from the processing region.

[0066] 4B shows a diagram of the pocket 302 in which the RF tag 304 is placed. The depth "d3" of the pocket is defined such that there is enough space to embed the RF tag and leave an amount of the consumable part on the top surface that is greater than the wear of the consumable part during the life of the part. For example, in the case of an edge ring, the depth of the pocket "d3" is defined such that the depth of the consumable part from the bottom of the pocket to the top surface 206a of the consumable part 206 (i.e., the difference d2-d3) is greater than the amount of wear the consumable part experiences during the life of the consumable part. This is to ensure that the RF tag 304 is not damaged during use of the chamber.

[0067] The RF tag 304 may be adhered to the bottom surface of the pocket 302 using an adhesive 313. The adhesive 313 used to secure the RF tag 304 to the bottom of the pocket 302 may be selected to withstand the process conditions in the process chamber.

[0068] The top surface 206a of the edge ring 206 has a ring profile that includes a step down along an inner radius. Note that the ring profile of the consumable part 206 differs from the ring profile shown in Figures 2A and 2B. The pocket 302 is defined in the portion having the greater height (i.e., the portion at height d2).

[0069] FIG. 4C shows plug 306 being placed to cover and seal the opening of pocket 302. The plug is placed over RF tag 304 received in pocket 302 and laser fused in a laser welder using material from the plug and pocket to provide an airtight seal of pocket 302. Plug 306 may be made of the same material as consumable part 206 or may be made of a different material that exhibits similar chemical, thermal, and physical properties as the rest of consumable part 206. The height of plug 306 is defined to ensure that sufficient space is left above RF tag 304 in the pocket. For example, height "d4" of plug 306 is defined to be less than the difference between the height of pocket d3 and height "d5" of RF tag 304 (i.e., d4<(d3-d5)), such that there is sufficient space between the top surface of RF tag 304 and the bottom surface of plug 306. The opening is substantially sealed to ensure that the pocket in which the RF tag is received is maintained at a vacuum, so that the RF tag 304 is not exposed to danger from RF radicals.

[0070] In one embodiment, the plug 306 is sealed by laser fusion using a pulsed laser welder 307. Details of sealing the opening are described in more detail with reference to Figures 5A-5B. The welding does not have to be pulsed laser welding, but can be any other type of welding. In another embodiment, the opening of the pocket 302 is sealed via a press fit using the plug 306. The seal is made to ensure that there are no leaks, either air leaks or RF leaks. Even with the press fit, there is a possibility of having RF leaks, and RF radicals may get into the pocket where the RF tag is embedded. For example, if the pocket has edges or corners, the press fit may not completely seal the opening. As a result, RF radicals may get into the pocket and may cause arcing issues. To prevent such leaks, the press fit may be augmented with an adhesive bond to further seal the plug in place. The adhesive bond used to seal the opening is selected to be fairly resistant to the harsh effects of RF plasma, at least for the life of the consumable part. For example, if the edge ring (i.e., the consumable part) has a life of 2000 hours, the adhesive may be selected to have the ability to withstand RF plasma for at least 2200 hours. The number of hours is shown as an example to illustrate the point that the adhesive selected must be strong enough to withstand the effects of RF plasma for at least the life of the consumable part. In one embodiment, the adhesive used to seal the plug to the opening and the adhesive used to bond the RF tag to the bottom of the pocket is epoxy based. In one embodiment, any other adhesive can be used to seal the opening and / or bond the RF tag to the pocket, the adhesive being selected to be able to withstand the effects of RF plasma. In an alternative embodiment, the opening of the pocket is sealed using a threaded plug to provide an airtight seal. In another embodiment, the opening of the pocket is sealed by using an adhesive bond along the length of the interface, and the adhesive used for the bond can be epoxy based.The adhesive for sealing the opening and / or for adhering the RF tag within the pocket is not limited to an epoxy-based adhesive, but any other type of adhesive capable of providing similar functionality as an epoxy-based adhesive may be used.

[0071] A pocket 302 for placing the RF tag 304 may be formed not only on the underside, but also on the inner diameter of the consumable part in the vacuum or in the shadow space (as shown in FIGS. 2A and 2B) that is protected from both the direct and indirect effects of the RF plasma. In some implementations where the consumable part is an electrostatic chuck that includes a cooling component, the pocket may be defined deep inside the ESC and in close proximity to the cooling component so that the welding location is away from the RF tag and the top surface of the ESC, thereby preserving the integrity of the RF tag. The RF tag is selected such that it can withstand the temperatures in the chamber.

[0072] 4D shows a view of the underside 206b of the consumable part 206 after the plug 306 has been placed to seal the opening and the surface around the pocket has been polished. After the plug 306 has been placed and the opening sealed, the top surface of the opening and the portion of the top surface of the consumable part 206 adjacent to the opening are polished to match the surface profile of the remaining surface of the consumable part. The result of polishing is a consumable part with a fully integrated RF tag. The RF tag allows the consumable part to be easily tracked and is tamper-proof and damage-proof for at least the life of the consumable part.

[0073] 5A-5B show an example of laser fusing a plug to an opening of a pocket defined in a surface of a consumable part such as an edge ring using a pulsed laser welder in one embodiment. The pocket 302 is defined at a particular depth on the lower surface 206b of the edge ring 206. The pocket is formed by removing a portion of the consumable part. In one embodiment, the pocket is defined by drilling and removing a portion of the consumable part. In some embodiments, precision machining may be used to drill the pocket. The portion of the consumable part that is removed may be used to define the plug 306 to cover the opening defined by the pocket 302. In this embodiment, the height of the plug 306 removed to define the pocket may be adjusted to include sufficient space between the top surface of the RF tag 302 and the bottom surface of the plug 306 that covers the pocket. In other embodiments, different materials may be used to fill the opening, and the different materials may have the same or substantially the same refractive index as the refractive index of the consumable part. In another embodiment, the pocket may be formed using a mold or three-dimensional (3D) printing. In this embodiment, the plug can be separately defined using the same or substantially the same material as the consumable part. In some embodiments, using substantially the same material includes using a material that has similar chemical, physical, and thermal properties as the material used in the consumable part. The depth of the pocket 302 is defined to ensure that the amount of material left on the top surface is greater than the wear experienced during the life of the consumable part and that there is sufficient space to embed an RF tag. The pocket 302 is defined by a sidewall 310 and a bottom surface 312. The length of the sidewall 310 of the pocket 302 is defined to be greater than the height of the plug 306 but less than the height d2 of the consumable part along the outer diameter.

[0074] The RF tag 304 is received at the bottom 312 of the pocket 302. In some implementations, the RF tag 304 may be glued in place in the pocket using an adhesive. The opening of the pocket 302 is sealed using a plug 306. The length of the sidewall of the plug is defined such that there is sufficient space between the top surface of the RF tag 304 received in the pocket 302 and the bottom surface of the plug 306. The plug received in the opening defines a plug-pocket interface 315 that spans the length of the sidewall of the plug 306. In some implementations, the consumable part (e.g., edge ring) and the plug used to seal the opening of the pocket 302 are made of a translucent material. The plug may be made of the same material as the consumable part or may be made of a different translucent material. The use of a translucent material for the consumable part 206 and the plug 306 provides a line of sight to the depth of the plug-pocket interface 315. Additionally, the material used for the consumable part has a defined refractive index, and if the plug 306 is made of the same material as the consumable part, the plug 306 will have the same refractive index. However, in this case, the plug-pocket interface will have a different refractive index than the consumable part 206 and the plug 306. In alternative embodiments, the plug 306 may be made of a different material than the material of the consumable part. The material for the plug can be selected to have substantially the same refractive index as the material used for the consumable part.

[0075] The laser welder 307 can be adjusted to detect the refractive index of the plug-pocket interface 315, so that the laser generated by the laser welder 307 can be directed to perform laser fusion and weld along the plug-pocket interface 315. This is advantageous over simply welding the surface, since a surface weld may not last long because it does not have enough depth. A surface weld may be easily damaged by RF radicals reaching the underside of the edge ring 206. Therefore, to ensure that the seal lasts the life of the edge ring, the weld is performed along the length of the plug-pocket interface 315. The adjusted laser can weld the length of the plug-pocket interface 315 as long as the laser has a line of sight. The line of sight may be at an angle from the plug-pocket interface, as shown in FIG. 5B. The translucent properties of the materials used for the plug and consumable parts, as well as the adjustment of the laser, allow the laser to detect the plug-pocket interface 315 and weld the sidewall of the plug 306 to the sidewall 310 of the pocket 302 over the length of the plug-pocket interface 315. The line of sight angle can be anywhere from 0° to 90°. Another advantage of using pulsed laser welding is that a pulsed laser can be used to control the weld location where heat from the laser is applied to a specific area (i.e., a portion of the sidewall) to provide enough focused heat to weld the sidewall without heating the entire edge ring. Additionally, the pocket is deep enough so that the RF tag is far from the weld location at the plug-pocket interface, preventing damage to the RF tag during welding. It should be noted that pulsed laser welding is one form of welding that can be used and that other types of welding can also be used to weld the plug 306 to the sidewall of the pocket 302.

[0076] FIG. 5B illustrates how a laser from a pulsed laser welder 307 is used to weld 317 the length of the plug-pocket interface 315. The weld is made by first adjusting the laser to find the plug-pocket interface 315 and then directing the adjusted laser to weld the sidewall of the plug to the sidewall 310 of the pocket 302. The top surface of the plug is aligned with the top surface of the pocket and the laser is positioned to move along the plug-pocket interface 315 and laser weld (or simply "weld") 317 the interface between the sidewall of the pocket and the plug together. The laser can also be directed at an angle. The adjustment allows the laser to find the interface below the surface of the plug by identifying the difference in the refractive index of the plug-pocket interface 315 while masking the top surface of the pocket. The laser weld 317 made along the plug-pocket interface 315 does not require welding the top surface of the pocket 302. However, in some implementations, the top surface of the pocket may also be welded. The weld along the length of the plug-pocket interface 315 ensures that the opening is tightly sealed (i.e., hermetically sealed) and provides sufficient insulation to the inside of the pocket to prevent RF leakage of RF radicals into the pocket. The weld at the interface lasts for a longer period of time than a surface weld. This type of plug seal ensures that the RF tag is protected not only from processes performed in the chamber, but also when the edge ring is removed from the chamber for cleaning, refurbishing, handling, or other post-processing operations. For further details on pulsed laser welding, see the article entitled "Ultrafast Pulsed Lasers Weld Ceramics Without a Furnace" published in SciTechDaily on August 26, 2019 by University of California, Riverside and University of California, San Diego.

[0077] FIG. 6 illustrates the effect of wear on the top surface of a consumable part, such as an edge ring, on the strength of an RF signal generated by an RF tag 304. An RF reader 243 is introduced into the chamber to activate an RF tag embedded within the consumable part. The activated RF tag emits an RF signal, which is then read by the RF reader 243. The strength of the RF signal emitted from the RF tag varies based on the amount of consumable part at the top of the pocket 302. As the consumable part wears due to exposure to the plasma in the processing region of the chamber, the RF signal strength increases. The strength of the RF signal can be captured by the RF reader along with identification information and transmitted to the controller 222. The controller 222 can use the information provided by the RF reader 243 to initially identify the consumable part and determine attributes of the consumable part. Additionally, the signal strength can be used to determine the depth of the cross section of the consumable part, which can then be used to determine the amount of wear that has occurred, the amount of life remaining of the consumable part, the approximate surface profile due to wear, etc.

[0078] The amount of wear can vary due to uneven erosion of the surface of the consumable part, especially in non-metallic consumable parts made of quartz, silicon, etc. In such cases, the amount of wear can be approximately determined by calibration, by first determining the strength of the RF signal emitted by the RF tag for an unused consumable part, and then comparing the signal strength of the unused part to the signal strength collected over the life of the consumable part. The amount of wear endured by the entire consumable part can be approximately determined using the signal strength from a tightly controlled high tolerance surface defined on the RF tag. Care may need to be taken to ensure that the angle at which the signal strength is measured remains constant for the life of the consumable part. This can be done by mounting an RF reader on a scope and introducing the scope into the chamber via a transfer arm such that the scope is at a particular height and positioned at a particular angle to read the RF signal from the RF tag. Details of mounting the RF reader on different reading surfaces are described with reference to Figures 7A-7B. The consumables' identity and other attributes can be used to perform various part audits such as determining if the chamber is using genuine parts, determining chamber for consumable part mismatch, remaining life on the consumable part, number of repairs / refurbishments performed on the consumable part, performing part usage optimization, amount of wear on the consumable part, managing part inventory, etc. If it is determined that the chamber is using non-genuine parts, an alert can be generated to indicate such.

[0079] 7A-7B show various surfaces on which an RF reader may be placed to read information from an RF tag in some exemplary embodiments. FIG. 7A shows one exemplary embodiment in which an RF reader is placed on a robot arm used in a process tool / process chamber and mounted on an end effector 144 that is introduced into the chamber through an opening in the chamber. The RF reader 243 may be mounted on one or both fingers of the end effector. The RF reader 243 is coupled to a power supply 702 that provides power to the RF reader 243 to activate the RF tag 304, and to a memory 704 that stores the RF tag information. The robot is coupled to a controller 222 directly or through a reader control 232 to communicate the RF tag information to the controller 222. The opening used to introduce the end effector 144 into the RF reader may be the same opening used to insert and remove the wafer into the chamber, or may be a different opening, such as an access window or gate valve in the sidewall of the chamber. The end effector 144 that includes the RF reader may be the same end effector used to move the wafer into and out of the chamber, or it may be a different end effector.

[0080] The RF readers may be provided on the underside of the end effector 144, and / or on the top side of the end effector 144, and / or on the tips of one or more fingers of the end effector 144, and / or on the inner or outer sides of the fingers of the end effector 144, or any other location on the end effector 144. As the end effector is introduced into the chamber along the traversal path, one or more RF readers on the end effector 144 traversing along the reader path activate various RF tags located in one or more consumable parts and read information provided through RF signals generated by the activated RF tags. Information from the RF tags is stored in memory 704 and shared with the controller 222. The controller 222 uses the tag and signal strength information to identify the RF tags and determine attributes of the associated consumable part.

[0081] 7B shows an alternative embodiment in which a reader ring 242 is engaged to detect, activate, and read RF tags disposed within the chamber. The design of the reader ring 242 may be similar to that of the edge ring 206, and one or more of the RF readers 243 may be disposed on the top and / or bottom surface of the reader ring 242. The reader ring 242 may be balanced on an end effector 144, the fingers of which are elongated and include a proximal end proximal to the arm support and a distal end defined by the tips of the elongated fingers. Contact pads may be provided on the end effector 144 at the proximal and distal ends (i.e., at the tips of the elongated fingers) to provide reliable support to the reader ring 242 received thereon. When the end effector 144 with reader ring 242 is introduced into the chamber, one or more RF readers 243 on the reader ring 242 detect the RF tags 304 embedded in the consumable parts and activate and read the identification information of the RF tags 304. The robotic arm controls the movement of the end effector 144 into and within the chamber, allowing detection of all RF tags.

[0082] In an alternative embodiment, a wafer-like device (not shown) with an RF reader 243 disposed on a surface (either the bottom or top) can be used in place of the reader ring 242 shown in Figure 7B. In such an embodiment, the end effector 144 can be used to balance and move the wafer-like device in a manner similar to the reader ring 242 or wafer.

[0083] In an embodiment using a reader 242 or a wafer-like device, an existing end effector used to transport a wafer can be used to move the reader 242 or wafer-like device to the chamber without requiring modification. The end effector is configured to hold the reader 242 or wafer-like device at a predefined height from the surface of the lower electrode such that the RF reader 243 aligns with the RF tag on the consumable part. In an alternative embodiment where the RF reader 243 is located on a probe, the probe can be moved in different directions to detect, activate, and read the RF tags located on different consumable parts. Each time an RF tag needs to be read using the end effector, the end effector moves the reader 242 or wafer-like device to the chamber, and after the RF tag is read and information is collected, the reader or wafer-like device is moved out of the chamber. The wafer-like device or reader can then be inserted into a second chamber, the RF tags embedded in one or more consumable parts in the second chamber can be read, etc. In these embodiments, the reader ring or wafer-like device is not loaded onto the lower electrode, but is maintained at a defined height along the reader path to read information from the RF tag. In some embodiments, the reader ring 242 or wafer-like structure is stored in a buffer in a ring station coupled to the process tool, and an end effector from the ATM and / or VTM robot is configured to retrieve the reader ring from the ring station and move the reader ring to one or more process modules of the process tool. In another embodiment, the reader ring or wafer-like device can be stored in a slot or airlock (i.e., a transfer module) in the aligner. The RF reader used to activate the RF tag can be battery powered.

[0084] In yet another embodiment, the RF reader may be located directly on the end effector. In this embodiment, the RF reader may be used to activate and track the consumable parts in the process chamber whenever the end effector is used to move the wafer into or out of the process chamber. Since no process operations occur when the wafer moves into or out of the process chamber, activating the RF tag and reading information from the RF tag does not interfere with the process operations. Alternatively, the RF reader may be moved into or out of the process chamber via a transfer arm 208 located on the probe and coupled to the reader control 232. The transfer arm 208 is configured to move along a horizontal axis and / or rotate along a vertical axis within the chamber, allowing the RF reader 243 embedded thereon to reach different sections of the chamber and detect and read the RF tag 304 embedded in the consumable part. One or more joints provided on the transfer arm may provide sufficient freedom of movement within the chamber to allow the RF reader 243 located on the probe 242 to access different sections of the chamber.

[0085] 8A is a flowchart of a method for manufacturing a consumable part that can be used in a semiconductor processing tool, according to one embodiment. The consumable part is trackable using a radio frequency tag embedded therein. Although the various operations of this flowchart are presented and described in sequence, one skilled in the art will understand that some or all of the operations may be performed in a different order, combined or omitted, or performed in parallel.

[0086] The method begins at operation 810, where a pocket is formed (i.e., defined) in a side of a consumable part facing away from a process region of the chamber. The consumable part may be an edge ring configured to surround a wafer when the wafer is received on a pedestal or electrostatic chuck disposed in the chamber for processing. In the case of an edge ring, the side facing away from the process region is the bottom surface, since the top surface adjacent the wafer is exposed to the harsh chemicals of the plasma chamber. The pocket defined in the bottom surface is of a defined height and is defined in a portion of the edge ring having a maximum depth. The edge ring may include a ring profile that includes a step defined along an inner radius. Thus, the pocket is defined in a portion having a maximum depth, and the height of the pocket is defined to be less than the maximum depth. Since the pocket is defined on the underside (i.e., bottom side) of the edge ring, the height of the pocket is defined to ensure that there is sufficient edge ring surface between the bottom of the pocket and the top surface of the edge ring. The pocket is defined such that the amount of edge ring surface remaining on the top surface of the edge ring from the bottom of the pocket is greater than the amount of wear experienced on the top surface of the consumable during the life of the edge ring. This ensures that the RF tag embedded in the pocket will not be damaged during the life of the edge ring. The depth of the pocket ensures that the RF tag is sufficiently insulated from the harsh environment of the chamber from both sides of the edge ring.

[0087] A radio frequency (RF) tag is embedded within the pocket, as shown in operation 820. The RF tag, in one embodiment, may be adhered to the bottom surface of the pocket using an adhesive capable of withstanding the environment of the chamber.

[0088] The opening of the pocket is sealed using a plug of a defined depth, as shown in operation 830. The depth of the plug is defined to be less than the depth of the pocket, but with sufficient depth along the plug-pocket interface defined along the plug and sidewalls of the pocket to adequately insulate the RF tag. In one embodiment, the plug is made of the same material as the edge ring. For example, the plug can be a portion of the edge ring that was removed when the edge ring was drilled to form the pocket. If precision machining is used to form the pocket, the portion of the edge ring that is removed will have precise surface properties and dimensions to cover and seal the opening of the pocket. In this example, the depth of the plug can be tailored to provide the pocket with enough space to accommodate the RF tag. In an alternative embodiment, the plug is made of a different material that has similar physical, chemical, and thermal properties as the edge ring. In one embodiment, the plug is made of a material that has the same or substantially the same refractive index as the material used for the consumable part. The depth of the plug is less than the difference between the depth of the pocket and the depth of the RF tag. 4A-4C, the depth "d4" of the plug 306 is less than (d3-d5), where "d3" is the depth of the pocket 302 and "d5" is the height of the RF tag 304. In some implementations, the edge ring and plug may be made of a translucent material to provide a line of sight to the depth of the plug.

[0089] The opening of the pocket is sealed along a plug-pocket interface defined between the sidewalls of the pocket and the sidewalls of the plug, thereby providing a seal to the depth of the plug. The seal can be achieved via laser fusion using, for example, pulsed laser welding using a pulsed laser welder, where the pulsed laser is modulated to provide focused heat to the selected area without introducing excessive heat to the remainder of the edge ring that could potentially damage the RF tag. The focused heat is sufficient to fuse the two sidewalls together along the plug-pocket interface to provide an airtight seal. In some cases, the seal is vacuum tight. As previously mentioned, other forms of welding or bonding can also be used, including press fit, adhesive bonding, and press fit augmented with adhesive bonding. The previously mentioned forms are given by way of example and should not be considered exhaustive, and other forms of welding / bonding can also be used.

[0090] After the plug-pocket interface is sealed along the length of the plug, the top surface of the plug and a portion of the surface adjacent the opening of the pocket are polished / grinded, as shown in operation 840. The polishing / grinding is performed to ensure seamless embedding of the RF tag into the edge ring by matching the surface profile of the plug and the area around the opening with the surface profile of the remainder of the edge ring. The polishing / grinding can be performed using lapping or other surface finishing methods to render the plug visually undetectable and the opening visually indistinguishable relative to the surrounding surfaces.

[0091] 8B is a flow chart of a method for tracking consumable parts that may be used in a semiconductor processing tool, according to one embodiment, where tracking is enabled via radio frequency tags embedded therein.

[0092] The method begins at operation 850, where a radio frequency tag is embedded in a pocket defined on a side of a consumable part received in a process chamber. The consumable part, in one embodiment, can be an edge ring configured to be received in a process chamber and surround a wafer when the wafer is received in a substrate support region of the consumable part. The side on which the radio frequency (RF) tag is embedded is the side facing away from a processing region defined in the process chamber. In some embodiments, the pocket can be defined on a bottom surface of the consumable part. In an alternative embodiment, the pocket can be defined on an outer surface of the consumable part that is outside of the process region. The RF tag is a passive tag.

[0093] The RF tag embedded in the pocket of the consumable part is activated by a reader in the process chamber, as shown in operation 860. In some embodiments, the reader is inserted into the process chamber. For example, in one embodiment, the reader may be defined on the underside of the end effector of the robot and introduced into the process chamber when transferring the wafer for processing or when data from the RF tag needs to be collected. In alternative embodiments, the reader may be included in the reader ring or on the underside of a wafer-like device supported on the end effector of the robot and introduced into the process chamber. In these embodiments, the robot is coupled to a controller that provides signals to control the movement of the robot into and out of the process chamber. The reader is coupled to a power source, and power from the power source is used to power the reader and activate the RF tag.

[0094] Data related to the consumable part is collected by the reader via the activated RF tag, as shown in operation 870. In some implementations, the reader is an RF reader and includes or is coupled to a memory. The memory in or coupled to the reader is used to store the data collected by the reader.

[0095] The data collected by the reader is interpreted to identify attributes of the consumable part used in the process chamber, as shown in operation 880. In some embodiments, the data collected by the reader is transmitted to a controller, which interprets the data and identifies one or more attributes of the consumable part. The one or more attributes that may be identified from the collected data include the identity of the consumable part, or usage data of the consumable part used in the process chamber, or a combination thereof. In some embodiments, the collected information is used to determine the amount of useful life remaining in the consumable part before the consumable part needs to be replaced.

[0096] Various embodiments described herein provide a method for tracking consumable parts in-situ in real time. This method provides advantages over conventional tracking methods that provide engraved identification numbers that can be easily damaged by continued exposure to the harsh environment of the chamber or that can be easily tampered with. If these engraved identification numbers were provided on the underside to avoid exposure, the consumable parts would have to be removed from their position in the chamber to be read, which would involve opening the chamber, removing the part, reading and verifying the part, replacing the part, and closing and adjusting the chamber. This would result in significant downtime. Current embodiments provide a method for embedding tags within consumable parts such that the tag is in-situ and insulated from the harsh environment of the chamber while allowing the information from the tag to be easily read. According to some embodiments, the tag is a passive tag (i.e., an extremely high frequency tag) configured to operate at an extremely high frequency, a frequency that is sufficiently greater than the frequency used to generate plasma in the chamber, so that it does not resonate and send back a signal when the chamber is operating, thereby avoiding interference with processes performed at the operating frequency of the chamber. Whenever the tag needs to be read, the process in the chamber can be stopped and a probe embedded with an RF reader can be introduced via the transfer arm. The RF reader powers the RF tag and reads the RF signal transmitted by the RF tag to determine the identification information. The identification information encoded on the RF tag is difficult to reproduce, making it sufficiently tamper-proof, and the air-tight seal of the pocket ensures that RF radicals cannot enter the pocket and damage the RF tag. The information provided on the RF tag allows for a digital thread to be maintained of the consumable parts by allowing the part to be easily tracked from inception to death (i.e., when the part has fulfilled its life course and must be discarded). Consumable parts can be part of an interlock system, where the chamber requires certain parts to function, and each chamber part communicates with a controller or computer to enable smooth functioning of the system.

[0097] In some embodiments, the RF tag may be encapsulated in a ceramic shell. The RF tag is selected to operate at high temperatures. In some embodiments, the temperature at which the RF tag functions is between about 40° C. and about 150° C. In other embodiments, the RF tag may be configured to operate at temperatures much higher than the ranges provided above (e.g., up to 400° C. or higher). In some embodiments, RF tags operating at lower temperatures (i.e., in the ranges defined above) may be shielded by embedding the RF tag on the back or side facing away from the process environment of the chamber, where the temperature is significantly lower. The pocket for mounting the RF tag is deep enough so that the RF tag can barely feel the extreme temperatures, while a sufficient amount of consumable parts covers the bottom side of the RF tag. Other advantages may be visualized by one of ordinary skill in the art after reading the various embodiments described herein.

[0098] FIG. 9 is a simplified schematic diagram of a computer system 900 for implementing an embodiment of the present disclosure. It should be understood that the methods described herein can be implemented using a digital processing system, such as a conventional general-purpose computer system. A special-purpose computer designed or programmed to perform only one function may alternatively be used. The computer system includes a central processing unit (CPU) 904 coupled to a random access memory (RAM) 906, a read-only memory (ROM) 912, and a mass storage device 914 through a bus 910. A system controller program 908 resides in the RAM 906, but may also reside in the mass storage device 914.

[0099] Mass storage device 914 represents a persistent data storage device such as a floppy disk drive or fixed disk drive, which may be local or remote. Network interface 930 provides a connection over network 932, allowing communication with other devices. It should be understood that CPU 904 may be embodied with a general purpose processor, a special purpose processor, or a specially programmed logic device. Input / output (I / O) interfaces provide communication with different peripherals and are connected to CPU 904, RAM 906, ROM 912, and mass storage device 914 through bus 910. Sample peripherals include display 918, keyboard 922, cursor control 924, removable media device 934, etc.

[0100] The display 918 is configured to display the user interface described herein. A keyboard 922, cursor control (e.g., mouse) 924, removable media device 934, and other peripherals are coupled to the I / O interface 920 for communicating information in command selections to the CPU 904. It should be appreciated that data to and from external devices may be communicated through the I / O interface 920. Embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a wire-based or wireless network.

[0101] Embodiments may be practiced with a variety of computer system configurations including hand-held devices, microprocessor systems, microprocessor-based or programmable consumer electronics, minicomputers, mainframe computers, etc. Embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a network.

[0102] With the above embodiments in mind, it should be understood that the embodiments may employ various computer-implemented operations involving data stored in computer systems. These operations are operations requiring physical manipulation of physical quantities. Any of the operations described herein that form part of the embodiments are useful machine operations. The embodiments also relate to devices or apparatus for performing these operations. The apparatus may be specially constructed for the required purpose, such as a special purpose computer. When defined as a special purpose computer, the computer may be operable for its special purpose, but may also perform other processes, program execution, or routines that are not part of its special purpose. Alternatively, the operations may be processed by a general purpose computer selectively activated or configured by one or more computer programs stored in a computer memory, cache, or retrieved over a network. If data is retrieved over a network, the data may be processed by other computers on the network (e.g., a cloud of computing resources).

[0103] One or more embodiments may also be fabricated as computer readable code on a computer readable medium. A computer readable medium is any data storage device that can store data, which can then be read by a computer system. Examples of computer readable media include hard drives, network attached storage (NAS), read-only memory, random access memory, CD-ROM, CD-R, CD-RW, magnetic tape, and other optical and non-optical data storage devices. A computer readable medium may include computer readable tangible media distributed over a network-coupled computer system such that the computer readable code is stored and executed in a distributed fashion.

[0104] Although the method operations have been described in a particular order, it should be understood that other housekeeping operations may be performed between each operation, or may be coordinated so that each operation can occur at slightly different times, or may be distributed into a system that allows for the occurrence of processing operations at various intervals relative to processing, so long as the processing of the overlay operation is performed in a desired manner.

[0105] Although the foregoing embodiments have been described in some detail for clarity of understanding, it will be apparent that certain changes and modifications can be practiced within the scope of the appended claims. Thus, the present embodiments should be considered as illustrative and not restrictive, and the embodiments should not be limited to the details set forth herein, but may be modified within the scope of the appended claims and their equivalents.

Claims

1. 1. A consumable part for use in a process chamber used to process wafers, the consumable part comprising: a pocket defined in a side of the consumable part facing away from a process area, the pocket extending to a first depth and having an opening; a radio frequency tag embedded within the pocket, the radio frequency tag configured to generate a radio frequency signal when activated; a plug covering the opening and extending through the radio frequency tag to a second depth, the plug being laser fused to seal the radio frequency tag within the pocket, the laser fusion being performed along an interface defined between a sidewall of the plug and a sidewall of the pocket; A consumable part.

2. 2. The consumable part according to claim 1, The laser fusing uses material from the sidewall of the plug and the sidewall of the pocket to define an airtight seal at the interface.

3. 2. The consumable part according to claim 1, The consumable part, wherein the radio frequency tag is an extremely high frequency tag, the frequency for the extremely high frequency tag being selected to be greater than an operating frequency used to generate a plasma in the process chamber.

4. The consumable part according to claim 3, The frequency at which the radio frequency tag operates is between about 150 megahertz and about 1 gigahertz.

5. The consumable part according to claim 3, The operating frequency of the process chamber is between about 100 kilohertz and about 100 megahertz.

6. 2. The consumable part according to claim 1, The radio frequency tag is secured to a bottom surface of the pocket using an adhesive, the adhesive being selected to withstand process conditions within the process chamber.

7. 2. The consumable part according to claim 1, a first depth defined such that an amount of the consumable part between a bottom surface of the pocket and a top surface of the consumable part is greater than an amount of wear experienced by the consumable part during a life of the consumable part.

8. 2. The consumable part according to claim 1, The second depth of the plug is less than the first depth of the pocket.

9. 2. The consumable part according to claim 1, The plug and the consumable part are made of a translucent material having substantially the same refractive index.

10. The consumable part according to claim 9, a refractive index of the interface different from that of the plug and the consumable part, and the laser fusing is performed by adjusting a laser welder to detect the refractive index of the interface.

11. 2. The consumable part according to claim 1, A consumable part, wherein the side of the consumable part that defines the pocket is a bottom surface or a surface along an inner diameter that is maintained in vacuum, or is an exterior of the consumable part that faces away from the process area.

12. 2. The consumable part according to claim 1, The radio frequency tag is a passive tag.

13. The consumable part according to claim 12, The radio frequency tag is encapsulated in a ceramic shell.

14. 2. The consumable part according to claim 1, The consumable part further includes a cooling element, the pocket being defined proximate to the cooling element.

15. 1. A method for manufacturing a consumable part for use in a process chamber, comprising: forming a pocket of a first depth in a side of the consumable part facing away from a process region defined within the process chamber; embedding a radio frequency tag within said pocket; sealing the opening of the pocket using a plug of a second depth such that a top surface of the plug is flush with a surface of the consumable part adjacent the pocket, the sealing being performed using laser fusing along an interface defined between a sidewall of the plug and a sidewall of the pocket, thereby providing a hermetic seal at the interface using material from the plug and the sidewall of the pocket; grinding the top surface of the plug and a portion of the surface of the consumable part adjacent the opening of the pocket to match a surface profile of the remaining surface of the consumable part; Including, The consumable parts are traceable using the radio frequency tags embedded therein. method.

16. 16. The method of claim 15, the consumable part and the plug are made of a translucent material having substantially the same refractive index, and the refractive index of the interface is different from the refractive index of the consumable part and the plug; performing the laser fusion adjusting a laser welder to detect the refractive index of the interface extending to the second depth of the plug; using the adjusted laser welder to perform the laser fusing of the sidewall of the plug to the sidewall of the pocket along the interface to define a hermetic seal at the interface using material of the plug and the pocket; Including, method.

17. 16. The method of claim 15, the first depth of the pocket is defined such that a depth of the consumable part between a bottom surface of the pocket and a top surface of the consumable part is greater than an amount of wear experienced by the consumable part during a life of the consumable part.

18. 16. The method of claim 15, The second depth of the plug is less than the first depth of the pocket.

19. 16. The method of claim 15, The method, wherein the side of the consumable part for forming the pocket is a lower surface or an inner diameter that is maintained in vacuum, or is an exterior side of the consumable part that faces away from the process area.

20. 16. The method of claim 15, The method wherein the radio frequency tag is encapsulated within a ceramic shell.

21. 16. The method of claim 15, The method, wherein the radio frequency tag is a very high frequency tag, and the frequency for the very high frequency tag is selected to be greater than an operating frequency used to generate a plasma in the process chamber.

22. 22. The method of claim 21, The method, wherein the frequency at which the radio frequency tag operates is between about 150 megahertz and about 1 gigahertz, and the operating frequency of the process chamber is between about 100 kilohertz and about 100 megahertz.

23. 16. The method of claim 15, The method, wherein sealing the opening further includes press-fitting the plug into the opening and enhancing the seal with an adhesive bond along the interface to provide the airtight seal of the pocket.

24. 16. The method of claim 15, The method, wherein the plug is a threaded plug and sealing the opening includes threading the plug into the opening to provide the airtight seal of the pocket.

25. 1. A method for tracking consumable parts used in a process chamber, comprising: embedding a radio frequency tag in a pocket defined in a side of the consumable part facing away from a processing region defined in the process chamber, an opening of the pocket being sealed with a plug by performing laser fusing; activating, by a reader, the embedded radio frequency tag; collecting data related to the consumable part via the radio frequency tag by the reader, the reader coupled to a power source that provides power to the reader and activates the radio frequency tag, the reader further coupled to a memory for storing the data collected from the radio frequency tag; interpreting the collected data and identifying attributes of the consumable parts used in the process chamber, the attributes including information related to identification or usage data of the consumable parts; A method comprising:

26. 26. The method of claim 25, The method further includes inserting the reader into the process chamber, the inserting comprising: (a) the underside of a robot end effector that is introduced into the process chamber when transferring a wafer for processing or when data associated with the radio frequency tag needs to be collected; or (b) a reader supported on the end effector of the robot and introduced into the process chamber when needed to collect the data associated with the radio frequency tag; or (c) an underside of a wafer-like device supported on the end effector of the robot and introduced into the process chamber when the data associated with the radio frequency tag needs to be collected; The robot may be connected to a controller that is connected to a bottom surface of the wafer-like device. (d) a probe attached to a transfer arm and introduced into the process chamber when the data associated with the radio frequency tag needs to be collected, the transfer arm having one or more joints providing the probe with degrees of freedom of movement along horizontal and vertical axes, the transfer arm being coupled to the controller via a reader control; The movement of the reader is controlled based on a signal from a controller. The method of claim 1, further comprising embedding the reader in a

27. 26. The method of claim 25, transmitting the data collected from the radio frequency tags to a controller; interpreting, by the controller, the data collected from the radio frequency tag and identifying the attribute of the consumable part; The method further comprising:

Images