Cable assembly and method for manufacturing the same

Abstract

The present invention relates to the field of cable technology, and provides a cable assembly and a manufacturing method for the cable assembly to solve the problem that the shield connection structure in the cable is not yet mature. The cable assembly according to the present invention includes a first cable, a second cable, and a shield connection assembly. The first cable has a first cable core covered with a first protective layer on the outside, and a first shield layer provided on the outside of the first protective layer. The second cable has a second cable core covered with a second protective layer on the outside, and a second shield layer provided on the outside of the second protective layer. The shield connection assembly includes at least one shield device, and the at least one shield device is connected to the first shield layer and is connected to the second shield layer. The cable assembly according to the present invention can ensure effective continuity of the shield connection between the first cable and the second cable.

Description

[Technical field]

[0001] (Related Applications) This application claims priority to a Chinese patent application filed on March 12, 2021, bearing application number 202110269927.5 and entitled "Cable assembly and manufacturing method for cable assembly," the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to the field of cable technology, and in particular to a cable assembly and a method for manufacturing the cable assembly. [Background technology]

[0003] With the continuous development and popularization of new energy technologies, more and more vehicles are beginning to use batteries as power sources. In vehicles equipped with batteries, electronic devices such as motors and on-board computers need to be connected to the battery via cables, and the electrical energy in the battery is transmitted to the electronic devices via the cables, allowing each electronic device to perform its function. In practical applications, the cable for connecting the battery and the electrical devices is not a single complete cable, but is made up of multiple cables connected in sequence.

[0004] Specifically, a cable generally includes a cable core and a shield mesh that covers the outside of the cable core. The main function of the cable core is to realize the transmission of power, and the main function of the shield mesh is to provide a good shielding effect for the cable to prevent the current in the cable core from generating electromagnetic interference to external electrical components.

[0005] Currently, when two cables are butt-connected, if the connection structure adopted is immature, a stable and effective connection cannot be achieved between the shielding meshes of the two cables at the butt-connection point of the cables, which is disadvantageous to ensuring the electromagnetic shielding effect of the cable. Summary of the Invention

[0006] The present invention provides a shielded cable assembly and a method for manufacturing the cable assembly, which can effectively improve the electromagnetic shielding effect between cables.

[0007] According to one aspect, the present invention provides a cable assembly including a first cable, a second cable, and a shield connection assembly. The first cable includes a first cable core covered with a first protective layer on the outside, and a first shield layer provided on the outside of the first protective layer. The second cable includes a second cable core covered with a second protective layer on the outside, and a second shield layer provided on the outside of the second protective layer. The shield connection assembly is used to connect the first shield layer and the second shield layer, and the shield connection assembly includes at least one shield device connected to the first shield layer and to the second shield layer. That is, the first shield layer and the second shield layer may be connected by at least one shield device. This ensures the continuity of the shield structure between the first cable and the second cable.

[0008] As an example, the shield connection assembly may have four shield devices, including a first shield internal device, a second shield internal device, a first shield middle device, and a second shield middle device. A first end of the conductive device is provided outside the inverted portion of the free end of the first shield layer, and a second end of the conductive device is provided outside the inverted portion of the free end of the second shield layer. The first shield middle device is provided outside the first end of the conductive device, and the first end of the conductive device and the inverted portion of the first shield layer are pressed between the first shield internal device and the first shield middle device. The second shield middle device is provided outside the second end of the conductive device, and the second end of the conductive device and the inverted portion of the second shield layer are pressed between the second shield internal device and the second shield middle device.

[0009] In the cable assembly according to the present invention, the first shield layer and the second shield layer can be effectively electrically connected by the conductive device, and the electromagnetic shielding performance between the first shield layer and the second shield layer can be ensured. In addition, the first shield internal attachment device and the first shield middle device can effectively ensure the connection stability between the first shield layer and the conductive device. Accordingly, the second shield internal attachment device and the second shield middle device can effectively ensure the connection stability between the second shield layer and the conductive device. In addition, since the first shield layer has an inverted portion, the stress strength between the first shield layer and the conductive device can be effectively improved. Since the second shield layer also has an inverted portion, the stress strength between the second shield layer and the conductive device can also be effectively improved.

[0010] In one example, the shield connection assembly further includes a first shield external attachment device and a second shield external attachment device. The first shield central device is provided on the outside of a first end of the conductive device, and the first end of the conductive device is folded outward and attached to an outer wall of the first shield central device, and the first shield external attachment device is provided on the outside of an inverted portion of the first end of the conductive device. The second shield central device is provided on the outside of a second end of the conductive device, and the second end of the conductive device is folded outward and attached to an outer wall of the second shield central device, and the second shield external attachment device is provided on the outside of an inverted portion of the second end of the conductive device.

[0011] Since the first end of the conductive device has an inverted portion, the stress strength between the first shield layer and the conductive device can be effectively improved, and since the second end of the conductive device also has an inverted portion, the stress strength between the second shield layer and the conductive device can be effectively improved.

[0012] For example, an inner wall of the conductive device is provided with an inner insulating layer, and the first and second ends of the conductive device are not provided with the inner insulating layer, which can provide good protection for the inside of the conductive device and prevent conductive contact between the conductive device and other components located inside the conductive device.

[0013] For example, an outer wall of the conductive device is provided with an outer insulating layer, and the first and second ends of the conductive device are not provided with the outer insulating layer, which can provide good protection for the outside of the conductive device and prevent conductive contact between the conductive device and other members located outside the conductive device.

[0014] For example, the first cable core and the second cable core may be connected by lap connection or butt connection. The lap connection refers to the first cable core and the second cable core having an overlapping area. The butt connection refers to the end face of the first cable core and the end face of the second cable core being connected. In concrete implementation, the connection manner between the first cable core and the second cable core can be reasonably selected and adjusted according to the actual situation to ensure the connection effect between the first cable core and the second cable core.

[0015] In order to improve the connection effect between the first cable core and the second cable core, the minimum cross-sectional area at the overlap connection or butt connection point between the first cable core and the second cable core is made equal to or greater than the minimum cross-sectional area of ​​the first cable core and the second cable core.

[0016] The impedance at the connection between the shielding device and the shielding layer and the impedance at the connection between the conductive device and the shielding layer should be as small as possible, so that the current generated in the shielding layer can flow back to the energy source or ground without any hindrance. If the impedance at the connection between the shielding device and the shielding layer and the impedance at the connection between the conductive device and the shielding layer are large, a large current will be generated at the connection between the shielding device and the shielding layer and the connection between the conductive device and the shielding layer, which will result in a large radiation at the connection between the cable.

[0017] As an example, the cable assembly further includes an isolation sleeve disposed on the outer side of the first end of the first cable core and the outer side of the first end of the second cable core, the isolation sleeve providing good protection for the exposed first cable core and the exposed second cable core, and improving the safety thereof.

[0018] For example, one end of the isolation sleeve is connected to the first protective layer, and the other end of the isolation sleeve is connected to the second protective layer, so that the first cable core and the second cable core can be sealed and protected, and the safety can be further improved.

[0019] As an example, the first cable further includes a third protective layer, and the second cable further includes a fourth protective layer. The third protective layer is provided on the outside of the first shielding layer, and the fourth protective layer is provided on the outside of the second shielding layer. The third protective layer can effectively improve the use safety and structural strength of the first cable. Correspondingly, the fourth protective layer can effectively improve the use safety and structural strength of the second cable.

[0020] Meanwhile, the present invention further provides a method for manufacturing a cable assembly.

[0021] The production method comprises the steps of: providing a first cable having a first cable core, a first protective layer provided on the outside of the first cable core, and a first shielding layer provided on the outside of the first protective layer; peeling off a first shield layer and a first protective layer at a first end of a first cable to expose a first cable core; providing a second cable having a second cable core, a second protective layer provided on the outside of the second cable core, and a second shielding layer provided on the outside of the second protective layer; peeling off the second shield layer and the second protective layer at the first end of the second cable to expose a second cable core; connecting a first end of the first cable core and a first end of the second cable core; providing a shield connection assembly having a conductive device, a first shield internal device, a first shield middle device, a second shield internal device, and a second shield middle device; providing a first shield internal attachment device on the outside of a free end of the first shield layer, folding the free end of the first shield layer outward, and attaching the turned-over portion to an outer wall of the first shield internal attachment device; providing a second shield internal attachment device on the outside of a free end of the second shield layer, folding the free end of the second shield layer outward, and attaching the turned-over portion to an outer wall of the second shield internal attachment device; providing a first end of the conductive device on an exterior of the turned-over portion of the first shield layer and a second end of the conductive device on an exterior of the turned-over portion of the second shield layer; providing a first shielding middle device outboard of the first end of the conductive device; providing a second shielding middle device outboard of the second end of the conductive device; Connecting (1) welding a first end of the conductive device and an inverted portion of the first shield layer between the first shield internal device and the first shield middle device, and welding a second end of the conductive device and an inverted portion of the second shield layer between the second shield internal device and the second shield middle device; (2) crimping a first end of the conductive device and an inverted portion of the first shield layer between a first internal shield device and a first middle shield device, and crimping a second end of the conductive device and an inverted portion of the second shield layer between a second internal shield device and a second middle shield device; or (3) A first end of the conductive device and an inverted portion of the first shield layer are abutted between the first shield internal device and the first shield middle device, and a second end of the conductive device and an inverted portion of the second shield layer are abutted between the second shield internal device and the second shield middle device; and connecting the

[0022] As an example, the shield connection assembly further includes a first shield external attachment device and a second shield external attachment device.

[0023] The production method comprises the steps of: Folding a first end of the conductive device outward and attaching it to an outer wall of the first shield middle device; providing a first shield external attachment device on an outer side of the turned-over portion of the first end of the conductive device; folding the second end of the conductive device outward and attaching it to an outer wall of the second shield middle device; providing a second shield external attachment device on an outer side of the turned-over portion of the second end of the conductive device; Connecting (4) welding an inverted portion of a first end of the conductive device between the first shield middle device and the first shield outer device, and welding an inverted portion of a second end of the conductive device between the second shield middle device and the second shield outer device; (5) crimping an inverted portion of a first end of the conductive device between the first shield middle device and the first shield outer device, and crimping an inverted portion of a second end of the conductive device between the second shield middle device and the second shield outer device; or (6) A reversed portion of a first end of the conductive device is abutted between the first shield middle device and the first shield external device, and a reversed portion of a second end of the conductive device is abutted between the second shield middle device and the second shield external device; and connecting the first and second electrodes such that the first and second electrodes are connected to the first and second electrodes.

[0024] As an example, connecting the first end of the first cable core and the first end of the second cable core specifically includes connecting the first end of the first cable core and the first end of the second cable core by a welding or crimping process.

[0025] As an example, before providing one end of the conductive device outside the first shielding layer and the other end of the conductive device outside the second shielding layer, the manufacturing method further includes providing an isolation sleeve outside the connection point between the first cable core and the second cable core.

[0026] The beneficial effects of the embodiments of the present invention are as follows:

[0027] In the cable assembly according to the present invention, the conductive device can effectively electrically connect the first shield layer and the second shield layer, and the electromagnetic shielding performance between the first shield layer and the second shield layer can be ensured. In addition, the first internal shield device and the first middle shield device can effectively ensure the connection stability between the first shield layer and the conductive device, and accordingly, the second internal shield device and the second middle shield device can effectively ensure the connection stability between the second shield layer and the conductive device. In addition, since the first shield layer has an inverted portion and the second shield layer also has an inverted portion, the stress strength between the first shield layer and the conductive device can be effectively improved, and the stress strength between the second shield layer and the conductive device can also be effectively improved. [Brief description of the drawings]

[0028] [Figure 1] 1 is a schematic cross-sectional view of a cable assembly according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a schematic cross-sectional view of another cable assembly according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a schematic cross-sectional view of another cable assembly according to an embodiment of the present invention; [Figure 4] FIG. 1 is a schematic cross-sectional view of another cable assembly according to an embodiment of the present invention; [Diagram 5] 1 is an exploded structural schematic diagram of a cable assembly according to an embodiment of the present invention; [Figure 6] FIG. 1 is a schematic plan view of a cable assembly according to an embodiment of the present invention; [Figure 7] Cross section AA in Figure 6 [Figure 8] Cross section B-B in Figure 6 [Figure 9] FIG. 1 is an exploded structural schematic diagram of another cable assembly according to an embodiment of the present invention; [Figure 10] FIG. 1 is a schematic plan view of a cable assembly according to another embodiment of the present invention; [Figure 11] CC cross section in Figure 10 [Figure 12] Cross section of Fig. 10 [Figure 13] FIG. 1 is a schematic cross-sectional view of a cable assembly according to an embodiment of the present invention; [Figure 14] FIG. 1 is a schematic cross-sectional view of a cable assembly according to an embodiment of the present invention; [Figure 15] FIG. 1 is a schematic cross-sectional view of a cable assembly according to an embodiment of the present invention; [Figure 16] FIG. 1 is a schematic cross-sectional view of a cable assembly according to an embodiment of the present invention; [Figure 17] FIG. 1 is a schematic planar structure diagram of a case in which shield layers according to an embodiment of the present invention are provided in a symmetrical connection; [Figure 18] FIG. 1 is a schematic diagram of a three-dimensional structure in which shield layers according to an embodiment of the present invention are provided in a symmetrical connection; [Figure 19] FIG. 1 is a schematic planar structure diagram of a case in which shield layers according to an embodiment of the present invention are provided in an asymmetrical connection; [Figure 20] FIG. 1 is a schematic diagram of a three-dimensional structure in which the shielding layers according to an embodiment of the present invention are asymmetrically connected; [Figure 21] A flowchart of a method for manufacturing a cable assembly according to an embodiment of the present invention. [Figure 22] A flowchart of another method for manufacturing a cable assembly according to an embodiment of the present invention. [Explanation of symbols]

[0029] 10 - first cable, 11 - first cable core, 12 - first protective layer, 13 - first shield layer, 131 - inside out part, 14 - third protective layer, 20 - second cable, 21 - second cable core, 22 - second protective layer, 23 - second shield layer, 231 - inside out part, 24 - fourth protective layer, 30 - shield connection assembly, 31 - conductive device, 311, 312 - inside out part, 313 - inner insulating layer, 314 - outer insulating layer, 32 - first shield inner device, 33 - first shield middle device, 34 - second shield inner device, 35 - second shield middle device, 36 - first shield outer device, 37 - second shield outer device, 38 - crimping ring, 39 - isolation sleeve. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description of the embodiments of the present invention is given with reference to the accompanying drawings.

[0031] 1, an embodiment of the present invention provides a cable assembly including a first cable 10, a second cable 20, and a shield connection assembly (not shown). The electromagnetic shield structures of the first cable 10 and the second cable 20 are electrically connected via the shield connection assembly, thereby realizing the continuity of the electromagnetic shield structure between the first cable 10 and the second cable 20, and effectively improving the electromagnetic shield effect of the cable assembly.

[0032] Specifically, in an embodiment of the present invention, the first cable 10 has a first cable core 11 and a first shielding layer 13, the outside of the first cable core 11 is covered with a first protective layer 12, and the first shielding layer 13 is provided on the outside of the first protective layer 12.

[0033] The first cable core 11 is mainly used for transmitting electrical energy. In particular, the first cable core 11 may be made of a material with excellent electrical conductivity, such as copper, aluminum, etc.

[0034] The first protective layer 12 covers the outside of the first cable core 11, thereby providing good protection for the first cable core 11. When specifically arranged, the first protective layer 12 may be made of one or a combination of insulating materials selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene, and may provide good electrical insulation for the first cable core 11.

[0035] The first shield layer 13 is provided on the outside of the first protective layer 12 and is used to provide an electromagnetic shielding effect for the first cable core 11. When a current flows through the first cable core 11, an electromagnetic signal is generated, and the first shield layer 13 can provide a shielding effect for the electromagnetic signal and prevent the electromagnetic signal from being transmitted to the external environment. In a specific arrangement, the first shield layer 13 may be formed by winding a conductive foil, or may be formed of graphene, or may be formed by knitting metal wires, so as to have good flexibility. Alternatively, in some embodiments, a single insulating protective layer may be formed on the surface of the first shield layer 13 to improve the structural strength and safety of the first shield layer 13.

[0036] The second cable 20 has a second cable core 21 and a second shield layer 23 , the outside of the second cable core 21 is covered with a second protective layer 22 , and the second shield layer 23 is provided on the outside of the second protective layer 22 .

[0037] The second cable core 21 is mainly used for transmitting electrical energy. In particular, the second cable core 21 may be made of a material with excellent electrical conductivity, such as copper, aluminum, etc.

[0038] The second protective layer 22 covers the outside of the second cable core 21, thereby providing good protection for the second cable core 21. When specifically arranged, the second protective layer 22 may be made of one or a combination of insulating materials selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene, and may provide the second cable core 21 with good electrical insulation.

[0039] The second shield layer 23 is provided on the outside of the second protective layer 22 and is used to provide an electromagnetic shielding effect for the second cable core 21. When a current flows through the second cable core 21, an electromagnetic signal is generated, and the second shield layer 23 can provide a shielding effect for the electromagnetic signal and prevent the electromagnetic signal from being transmitted to the external environment. In particular, the second shield layer 23 may be formed by winding a conductive foil, or may be formed of graphene, or may be formed by knitting a metal wire, so as to have good flexibility. Alternatively, in some embodiments, a single insulating protective layer may be formed on the surface of the second shield layer 23 to improve the structural strength and safety of the second shield layer 23.

[0040] 1 and 15, in one embodiment of the present invention, the shield connection assembly includes a first shield internal attachment device 32. The first shield internal attachment device 32 is provided on the outside of the first shield layer 13 and connected to the second shield layer 23, thereby ensuring the continuity of the electromagnetic shield between the first shield layer 13 and the second shield layer 23.

[0041] In short, in a specific implementation, the first shield layer 13 and the second shield layer 23 may be connected by one shield device or by a plurality of shield devices.

[0042] The description will be made with reference to Figures 1, 17 and 18. Specifically, the connection points between the shielding device (not shown) and the first shielding layer 13 are provided symmetrically, and the connection points between the shielding device and the second shielding layer 23 are provided symmetrically.

[0043] The following description will be given with reference to Figures 19 and 20. If the connection between the shielding device and the shielding layer is made at a single point, a large current flows at the connection point, generating a magnetic field, which combines with the magnetic field generated by the cable core, generating large radiation throughout the entire connection point of the cable, significantly affecting the operation state of other electronic devices. If the connection between the shielding device and the shielding layer is provided symmetrically, the magnetic fields generated at the connection point will have opposite directions, canceling each other out and reducing the composite electric field, thereby reducing radiation at the cable connection point, effectively reducing the magnetic field generated in the cable core, and reducing the impact on other electronic devices.

[0044] Specifically, the connection points between the shielding device and the first shielding layer 13 are provided over 360°. That is, the shielding device and one end of the first shielding layer 13 are completely butted together. The connection points between the shielding device and the second shielding layer 23 are provided over 360°. That is, the shielding device and one end of the second shielding layer 23 are completely butted together.

[0045] Whereas the connection points between the shielding device and the shielding layer are symmetrically arranged, the connection points between the shielding device and the shielding layer are arranged over 360°, which provides a significant shielding and cancellation effect against radiation generated from the cable core of the cable and radiation generated from the shielding layer itself, thereby optimizing the shielding effect at the cable connection points.

[0046] As a test method, the test equipment outputs one signal value (this value is test value 2) to the first or second cable, and a detection device is provided on the outside of the cable assembly, and this detection device detects one signal value (this value is test value 1). Shield performance value = test value 2 - test value 1.

[0047] Table 1 shows the effect of the arrangement of the connection points between the shielding device and the shielding layer on the shielding performance.

[0048] [Table 1]

[0049] The above table shows data from testing a selection of cables of a specific wire diameter, where the standard requires that the shielding performance at the connection between the shielding device and the shielding layer be greater than 60 dB.

[0050] If the dimensions of the connection points between the shielding device and the shielding layer are the same, when the shielding device is asymmetrically arranged, the shielding performance value at the connection points between the shielding device and the shielding layer is less than 60 dB, which does not meet the standard requirements. When the shielding device is symmetrically arranged, even if the connection is not complete, the electromagnetic radiation is offset, so the shielding performance value at the connection points between the shielding device and the shielding layer still meets the standard requirements. Preferably, the connection points between the shielding device and the shielding layer are arranged over 360°. In this case, the shielding performance at the cable connection points is better.

[0051] In a specific embodiment, the first shield internal mounting device 32 and the second shield layer 23 may be connected by another structure.

[0052] 2 and 16, in another embodiment of the present invention, the shield connection assembly 30 further includes a conductive device 31. The conductive device 31 is provided outside the first shield internal mounting device 32, thereby realizing a connection between the conductive device 31 and the first shield internal mounting device 32.

[0053] Specifically, the connection points between the first end of the conductive device 31 and the first shield layer 13 are provided symmetrically, and the connection points between the second end of the conductive device 31 and the second shield layer 23 are provided symmetrically.

[0054] If the connection between the conductive device 31 and the shield layer is made at a single point, a large current flows at the connection point, generating a magnetic field, which combines with the magnetic field generated by the cable core to generate large radiation throughout the entire connection point of the cable, significantly affecting the operation state of other electronic devices. If the connection between the conductive device 31 and the shield layer is made symmetrically, the magnetic fields generated at the connection point will be in opposite directions, canceling each other out and reducing the composite electric field, thereby reducing radiation at the cable connection point, effectively reducing the magnetic field generated in the cable core, and reducing the impact on other electronic devices.

[0055] Specifically, the connection points between the first end of the conductive device 31 and the first shield layer 13 are provided over 360°, and the connection points between the second end of the conductive device 31 and the second shield layer 23 are provided over 360°.

[0056] Whereas the connection points between the conductive device 31 and the shielding layer are symmetrically arranged, the connection points between the conductive device 31 and the shielding layer are arranged at 360°, which provides a significant shielding and offsetting effect against radiation generated from the cable core of the cable and radiation generated from the shielding layer itself, thereby optimizing the shielding effect at the cable connection points.

[0057] As a test method, a test device outputs one signal value (this value is test value 2) to the first cable 10 or the second cable 20, and a detection device is provided outside the cable assembly, and this detection device detects one signal value (this value is test value 1). Shield performance value = test value 2 - test value 1.

[0058] Table 2 shows the effect of the arrangement of the connection points between the conductive device and the shielding layer on the shielding performance.

[0059] [Table 2]

[0060] The above table shows data from testing a selection of cables of a particular wire diameter, where the standard requires that the shielding performance at the junction between the conductive device and the shielding layer be greater than 60 dB.

[0061] Assuming that the dimensions of the connection points between the conductive device 31 and the shielding layer are the same, if they are arranged asymmetrically, the shielding performance value at the connection points between the conductive device 31 and the shielding layer is less than 60 dB, which does not meet the standard requirements. If they are arranged symmetrically, even if they are not completely connected, the electromagnetic radiation is offset, so the shielding performance value at the connection points between the conductive device 31 and the shielding layer still meets the standard requirements. Preferably, the connection points between the conductive device 31 and the shielding layer are arranged over 360°. In this case, the shielding performance at the cable connection points is better.

[0062] Alternatively, the shield connection assembly 30 may have more structural members. For example, as shown in Fig. 3, in one embodiment of the present invention, the shield connection assembly 30 includes a conductive device 31, a first shield internal attachment device 32, a first shield middle device 33, a second shield internal attachment device 34, and a second shield middle device 35. A first end (left end in the figure) of the conductive device 31 is electrically connected to a free end of the first shield layer 13, and a second end (right end in the figure) of the conductive device 31 is electrically connected to a free end of the second shield layer 23. This realizes an electrical connection between the first shield layer 13 and the second shield layer 23, and ensures the continuity of the electromagnetic shield between the first shield layer 13 and the second shield layer 23.

[0063] Specifically, the first shield layer 13 and the conductive device 31 are fixedly and electrically connected by a first shield internal attachment device 32 and a first shield middle device 33. The first shield internal attachment device 32 is provided on the outside of the first shield layer 13, and a free end of the first shield layer 13 is folded back 180 degrees outward and attached to the outer wall of the first shield internal attachment device 32. A first end (the left end in the figure) of the conductive device 31 is provided on the outside of an inverted portion 131 of the free end of the first shield layer 13, and the inner wall of the first end of the conductive device 31 and the inverted portion 131 are favorably attached to each other, thereby realizing an electrical connection between the first shield layer 13 and the conductive device 31.

[0064] The first shield middle device 33 is provided on the outside of the first end of the conductive device 31, and a certain force is applied to the first shield middle device 33 using a tool such as a crimping clamp to deform the first shield middle device 33 inward. Meanwhile, since the first shield internal mounting device 32 has a certain structural strength, a certain stress is maintained between the first shield middle device 33 and the first shield internal mounting device 32, thereby pressing the inverted portion 131 of the first shield layer 13 and the left end of the conductive device 31 between the first shield middle device 33 and the first shield internal mounting device 32. In addition, the inverted portion 131 can improve the connection strength between the first shield layer 13 and the conductive device 31, which is advantageous in ensuring the connection stability between the first shield layer 13 and the conductive device 31. Alternatively, the inverted portion 131 of the first shield layer 13 and the left end of the conductive device 31 may be welded between the first shield central device 33 and the first shield internal device 32 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, etc.

[0065] The second shield layer 23 and the conductive device 31 are fixedly and electrically connected by a second shield internal attachment device 34 and a second shield middle device 35. Specifically, the second shield internal attachment device 34 is provided on the outside of the second shield layer 23, and the free end of the second shield layer 23 is folded back 180 degrees to the outside and attached to the outer wall of the second shield internal attachment device 34. The second end (the left end in the figure) of the conductive device 31 is provided on the outside of the inverted portion 231 of the free end of the second shield layer 23, and the inner wall of the second end of the conductive device 31 and the inverted portion 231 are favorably attached to each other, thereby realizing an electrical connection between the second shield layer 23 and the conductive device 31.

[0066] The second shield middle device 35 is provided on the outside of the second end of the conductive device 31, and a certain force is applied to the second shield middle device 35 using a tool such as a crimping clamp to deform the second shield middle device 35 inward. Meanwhile, since the second shield internal mounting device 34 has a certain structural strength, a certain stress is maintained between the second shield middle device 35 and the second shield internal mounting device 34, thereby pressing the inverted portion 231 of the second shield layer 23 and the right end of the conductive device 31 between the second shield middle device 35 and the second shield internal mounting device 34. In addition, the inverted portion 231 can improve the connection strength between the second shield layer 23 and the conductive device 31, which is advantageous in ensuring the connection stability between the second shield layer 23 and the conductive device 31. Alternatively, the inverted portion 231 of the second shield layer 23 and the right end of the conductive device 31 may be welded between the second shield middle device 35 and the second shield internal device 34 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, etc.

[0067] 4, the present invention further provides another embodiment. Specifically, a first shield external mounting device 36 and a second shield external mounting device 37 are added to the shield connection assembly 30.

[0068] After pressing the first shield central device 33 using a tool such as a crimping clamp, the first end (left end) of the conductive device 31 can be folded outward by 180° to attach the inverted portion 311 to the outer wall of the first shield central device 33. Then, the first shield external attachment device 36 is provided on the outside of the inverted portion 311, and finally, the first shield external attachment device 36 is pressed using a tool such as a crimping clamp. As a result, the inverted portion 311 of the conductive device 31 is pressed between the first shield external attachment device 36 and the first shield central device 33, preventing the conductive device 31 from coming off the first shield external attachment device 36 and the first shield central device 33, and improving the connection stability of the cable assembly. Alternatively, the inverted portion 311 of the conductive device 31 may be welded between the first shield central device 33 and the first shield external attachment device 36 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, or brazing.

[0069] Accordingly, after pressing the second shield central device 35 using a tool such as a crimping clamp, the second end (right end) of the conductive device 31 can be folded outward by 180° to attach the inverted portion 312 to the outer wall of the second shield central device 35. Then, the second shield external attachment device 37 is provided on the outside of the inverted portion 312, and finally, the second shield external attachment device 37 is pressed using a tool such as a crimping clamp. This causes the conductive device 31 to be pressed between the second shield external attachment device 37 and the second shield central device 35, preventing the conductive device 31 from coming off the second shield external attachment device 37 and the second shield central device 35, and improving the connection stability of the cable assembly. Alternatively, the inverted portion 312 of the conductive device 31 may be welded between the second shield central device 35 and the second shield external attachment device 37 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, or brazing.

[0070] In specific implementations, the components of the shield connection assembly 30 may have a variety of configurations.

[0071] For example, the shield connection assembly 30 may include only at least one shielding device. The shielding device may be provided outside the first shielding layer 13 and connected to the second shielding layer 23, and the first shielding layer 13 and the second shielding layer 23 may be mechanically and electrically connected to each other by one or more shielding devices. In addition, when the shield connection assembly includes the conductive device 31, a first end of the conductive device 31 may be directly connected to the first shielding layer 13 (e.g., by welding). Alternatively, the first end of the conductive device 31 may be connected to the first shielding layer 13 via at least one shielding device, thereby realizing the mechanical and electrical connection between the conductive device 31 and the first shielding layer 13. A second end of the conductive device 31 may be directly connected to the second shielding layer 23 (e.g., by welding). Alternatively, the second end of the conductive device 31 may be connected to the second shielding layer 23 via at least one shielding device, thereby realizing the mechanical and electrical connection between the conductive device 31 and the second shielding layer 23.

[0072] Furthermore, the conducting device 31 may be a straight cylindrical structure with a constant cylindrical diameter in the longitudinal direction, or may be a cylindrical structure with a non-constant cylindrical diameter (for example, a gradually increasing or partially increasing diameter).

[0073] For example, as shown in FIGS. 5 and 6, the conducting device 31 has a cylindrical diameter that gradually increases from left to right.

[0074] In addition, the cross section of the conductive device 31 may be a circular, elliptical, polygonal or irregular ring structure. The cross-sectional shapes of the first end and the second end of the conductive device 31 may be the same or different.

[0075] For example, as shown in FIGS. 6 to 8, the cross-sectional shapes of the first and second ends of the conducting device 31 are both annular, and the tube diameter of the first end of the conducting device 31 is smaller than the tube diameter of the second end.

[0076] Alternatively, as shown in FIGS. 9 to 12, the cross-sectional shape of the first end of the conductive device 31 is annular, and the cross-sectional shape of the second end is rectangular ring.

[0077] During manufacturing, the conductive device 31 may be a cylindrical structure made of conductive materials such as copper, aluminum, graphene, etc., so as to have a certain degree of flexibility, or may be a cylindrical structure wound with conductive foil, made of graphene, or made of woven metal wires, thereby improving the range of application and performance such as earthquake resistance. The material and manufacturing method of the conductive device 31 are not limited to the present invention.

[0078] The cross section of the first shield mounting device 32 may be a circular, elliptical, polygonal or irregular annular structure.

[0079] The cross section of the first shield middle device 33 may be a circular, elliptical, polygonal or irregular annular structure.

[0080] The cross section of the first shield external mounting device 36 may be a circular, elliptical, polygonal or irregular annular structure, which can effectively improve the application range of the shield connection assembly.

[0081] The cross-sectional shapes of the first shield internal attachment device 32 and the first shield external attachment device 36 may be substantially the same so as to ensure a crimping effect between the first shield internal attachment device 32 and the first shield external attachment device 36 .

[0082] In addition, in a specific implementation, the inverted portion 131 of the first shield layer 13 and the first end of the conductive device 31 are pressed between the first shield middle device 33 and the first shield internal device 32, and the inverted portion 311 of the first end of the conductive device 31 is pressed between the first shield middle device 33 and the first shield external device 36. Therefore, in order to improve the compression effect, the cross-sectional contours of the first shield layer 13, the first end of the conductive device 31, the first shield internal device 32, the first shield middle device 33 and the first shield external device 36 may be substantially the same. In a specific application, the cross-sectional shapes of the first shield layer 13 and the second shield layer 23 may be circular, elliptical, polygonal or irregular ring structures.

[0083] For example, as shown in FIG. 11, in one embodiment of the present application, the cross-sectional contours of the first shield layer 13, the first end of the conductive device 31, the first shield internal device 32, the first shield central device 33 and the first shield external device 36 are all circular.

[0084] The cross section of the second shield mounting device 34 may be a circular, elliptical, polygonal or irregular annular structure.

[0085] The cross section of the second shield middle device 35 may be a circular, elliptical, polygonal or irregularly shaped annular structure.

[0086] The cross section of the second shield external mounting device 37 may be a circular, elliptical, polygonal or irregular annular structure, which can effectively improve the application range of the shield connection assembly.

[0087] In addition, in a specific implementation, the free end of the second shield layer 23 and the second end of the conductive device 31 are pressed between the second shield middle device 35 and the second shield internal attachment device 34, and the inverted portion 312 of the second end of the conductive device 31 is pressed between the second shield middle device 35 and the second shield external attachment device 37. Therefore, in order to improve the compression effect, the cross-sectional contours of the second shield layer 23, the second end of the conductive device 31, the second shield internal attachment device 34, the second shield middle device 35 and the second shield external attachment device 37 may be substantially the same.

[0088] For example, as shown in FIG. 12, in one embodiment of the present application, the cross-sectional contours of the second shield layer 23, the second end of the conductive device 31, the second shield internal device 34, the second shield central device 35 and the second shield external device 37 are all rectangular ring structures.

[0089] During manufacturing, the first shield internal attachment device 32 may be formed by processes such as cutting and pressing materials such as copper and aluminum, and accordingly, the first shield central device 33 and the first shield external attachment device 36 may be formed by processes such as cutting and pressing materials such as copper and aluminum.

[0090] Also, in some embodiments, in order to improve the pressing force between the first shield internal device 32 and the first shield middle device 33, the structural strength of the first shield internal device 32 may be greater than the structural strength of the first shield middle device 33, so that when a pressing force is applied to the first shield middle device 33, no significant distortion occurs in the first shield internal device 32. Correspondingly, in order to improve the pressing force between the first shield middle device 33 and the first shield external device 36, the structural strength of the first shield middle device 33 may be greater than the structural strength of the first shield external device 36, so that when a pressing force is applied to the first shield external device 36, no significant distortion occurs in the first shield middle device 33.

[0091] The material and manufacturing method of the second shield internal attachment device 34 may be similar to the material and manufacturing method of the above-mentioned first shield internal attachment device 32. Accordingly, the material and manufacturing method of the second shield middle device 35 may be similar to the material and manufacturing method of the above-mentioned first shield middle device 33. The material and manufacturing method of the second shield external attachment device 37 may be similar to the material and manufacturing method of the above-mentioned first shield external attachment device 36. Explanation is omitted here.

[0092] 13, in some embodiments, an inner insulating layer 313 may be provided on the inner wall of the conductive device 31. This can prevent defects such as short circuits from occurring between the conductive device 31 and other internal components.

[0093] In addition, an outer insulating layer 314 may be provided on the outer wall of the conductive device 31. This can prevent defects such as short circuits from occurring between the conductive device 31 and other external members.

[0094] The inner insulating layer 313 and the outer insulating layer 314 may be made of materials such as polyvinyl chloride, polyethylene, nylon, etc., or may be made of other materials with good electrical insulation properties, and the present invention is not limited thereto.

[0095] Moreover, in order to establish an electrical connection between the first cable 10 and the second cable 20 and to achieve the purpose of power transmission, one end of the first cable core 11 and one end of the second cable core 21 are connected.

[0096] In specific implementation, the first cable core 11 and the second cable core 21 may be connected by processes such as crimping, laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, or may be connected in other ways.

[0097] 13, in one embodiment of the present invention, the first cable core 11 and the second cable core 21 are connected by crimping. Specifically, an end of the first cable core 11 and an end of the second cable core 21 are butted together, and a crimp ring 38 is provided on the outside of the butt-connected portion of the first cable core 11 and the second cable core 21. The crimp ring 38 is pressed using a tool such as a crimp clamp, so that the crimp ring 38 is firmly provided on the outside of the first cable core 11 and the second cable core 21. This achieves a conductive connection between the first cable core 11 and the second cable core 21.

[0098] When specifically arranged, the crimping ring 38 may be made of a material with good conductive properties, such as copper, aluminum, etc., so as to improve the electrical connection performance between the first cable core 11 and the second cable core 21.

[0099] As can be understood, in a specific implementation, the cross-sectional contours of the first cable core 11 and the second cable core 21 may be the same or different, for example, the cross-sectional contours of the first cable core 11 and the second cable core 21 may both be circular.

[0100] Alternatively, in some other embodiments, the butt joint between the first cable core 11 and the second cable core 21 may be specially treated to increase the effective contact area therebetween, thereby improving the electrical connection performance between the first cable core 11 and the second cable core 21.

[0101] For example, as shown in Fig. 14, in one embodiment of the present invention, the first cable core 11 and the second cable core 21 are connected by welding. Specifically, the right end of the first cable core 11 is cut out in about half to form a contact surface having a large area, and the left end of the second cable core 21 is also cut out in about half to form a contact surface having a large area. When the first cable core 11 and the second cable core 21 are welded together, the first cable core 11 and the second cable core 21 can be partially overlapped, which improves the welding area between the first cable core 11 and the second cable core 21 and ensures the connection effect between the first cable core 11 and the second cable core 21. Here, the overlapping area between the first cable core 11 and the second cable core 21 may be equal to or larger than the cross-sectional area of ​​the first cable core, or may be equal to or larger than the cross-sectional area of ​​the second cable core.

[0102] In addition, in order to provide good protection for the connection point between the first cable core 11 and the second cable core 21, in this embodiment of the present invention, an isolation sleeve 39 is further provided on the outside of the connection point between the first cable core 11 and the second cable core 21.

[0103] In particular, the isolating sleeve 39 may be a heat shrink tube or an insulating material of one or more combinations of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene, which is injection molded on the outside of the butt joint. In order to provide good protection for the first cable core 11 and the second cable core 21, the left end of the isolating sleeve 39 may be butted against the first protective layer 12 of the first cable 10, and the right end of the isolating sleeve 39 may be butted against the second protective layer 22 of the second cable 20.

[0104] The first shield layer 13, the second shield layer 23 and the conductive device 31 may each have a thickness of 0.003 mm to 27 mm.

[0105] As a test method, the test equipment outputs one signal value (this value is test value 2) to the first or second cable, and a detection device is provided on the outside of the cable assembly, and this detection device detects one signal value (this value is test value 1). Shield performance value = test value 2 - test value 1.

[0106] Table 3 shows the effect of the thickness of the shielding layer and conductive device on the shielding performance and the number of bend radius increments.

[0107] [Table 3]

[0108] The above table shows data from testing a selection of cables of a particular wire diameter, where the standard requires that the shielding performance at the junction between the conductive device and the shielding layer be greater than 60 dB.

[0109] As can be seen from the test results shown in the table, when the thicknesses of the first shielding layer 13, the second shielding layer 23, and the conductive device are between 0.003 mm and 27 mm, the shielding performance of the first cable 10 and the second cable 20 increases as the thickness increases, but when the thicknesses of the first shielding layer 13, the second shielding layer 23, and the conductive device 31 exceed 27 mm, the change in the shielding performance of the first cable 10 and the second cable 20 is small, and no significant improvement is observed. When the thicknesses of the first shield layer 13, the second shield layer 23, and the conductive device 31 are 0.003 mm to 27 mm, the increase in the bending radius of the first cable 10 and the second cable 20 increases as the thickness increases. However, when the thicknesses of the first shield layer 13, the second shield layer 23, and the conductive device 31 exceed 27 mm, the increase in the bending radius of the first cable 10 and the second cable 20 exceeds 200 mm, which is disadvantageous in actual processing. Therefore, it is preferable that the thicknesses of the first shield layer 13, the second shield layer 23, and the conductive device 31 are 0.003 mm to 27 mm.

[0110] In addition, the outer surface area of ​​the shielding device (e.g., the first shielding internal attachment device 32) connected to the first shielding layer 13 is greater than 1.3% of the outer surface area of ​​the shielding device (e.g., the first shielding internal attachment device 32). This ensures a connection effect between the shielding device and the first shielding layer 13.

[0111] In addition, the outer surface area of ​​the shielding device (e.g., the second shielding internal attachment device 34) connected to the second shielding layer 23 is greater than 1.3% of the outer surface area of ​​the shielding device (e.g., the second shielding internal attachment device 34). This ensures a connection effect between the shielding device and the second shielding layer 23.

[0112] Specifically, the larger the connection area between the shielding device and the first shielding layer 13 or the second shielding layer 23, the better the mechanical performance between them. If it can be guaranteed that the pull-out force between the shielding device and the first shielding layer 13 or the second shielding layer 23 meets the standard requirement in the usage environment, it can be avoided from being torn off by external force. Through numerous experiments and tests, it has been found that if the outer surface area of ​​the shielding device connected to the first shielding layer 13 or the second shielding layer 23 is less than 1.3% of the outer surface area of ​​the shielding device, the pull-out force between the shielding device and the first shielding layer 13 or the second shielding layer 23 cannot meet the standard requirement and will be torn off. This leads to a decrease in shielding performance, and ultimately to a loss of shielding performance, and in the worst case, the shielding function will be lost.

[0113] Table 4 shows the effect of the connection area between the shielding device and the shielding layer on the pull-out force between the shielding device and the shielding layer.

[0114] [Table 4]

[0115] The above table shows the data for a selection of cables of a certain wire diameter, where the standard requirement is that the pull-out force between the shielding device and the shielding layer is greater than 50N.

[0116] Therefore, the outer surface area of ​​the shielding device that is connected to the first shielding layer 13 or the second shielding layer 23 is greater than 1.3% of the outer surface area of ​​the shielding device, thereby ensuring the connection effect between the shielding device and the first shielding layer 13 or the second shielding layer 23.

[0117] In addition, the outer surface area of ​​the first end of the conductive device 31 connected to the first shield layer 13 is greater than 1.4% of the outer surface area of ​​the shield device (e.g., the first shield middle device 33). This ensures the connection effect between the first end of the conductive device 31 and the first shield layer 13.

[0118] In addition, the outer surface area of ​​the second end of the conductive device 31 connected to the second shield layer 23 is greater than 1.4% of the outer surface area of ​​the shield device (e.g., the second shield middle device 35). This ensures the connection effect between the second end of the conductive device 31 and the second shield layer 23.

[0119] Specifically, the larger the connection area between the conductive device 31 and the first shield layer 13 or the second shield layer 23, the better the mechanical performance between them. If it can be guaranteed that the pull-out force between the conductive device 31 and the first shield layer 13 or the second shield layer 23 meets the standard requirement in the usage environment, it can be avoided from being torn off by external force. Through numerous experiments and tests, it has been found that if the outer surface area of ​​the conductive device 31 connected to the first shield layer 13 or the second shield layer 23 is less than 1.3% of the outer surface area of ​​the shield device, the pull-out force between the conductive device 31 and the first shield layer 13 or the second shield layer 23 cannot meet the standard requirement and will be torn off. This leads to a decrease in shielding performance, and ultimately to a loss of shielding performance, and in the worst case, the shielding function will be lost.

[0120] Table 5 shows the effect of the contact area between the conductive device and the shield layer on the pull-out force between the conductive device and the shield layer.

[0121] [Table 5]

[0122] The data is from a selection of cables with specific wire diameters as shown in the table above, where the standard requirement is that the pull-out force between the conductive device and the shield layer is greater than 50N.

[0123] Therefore, the outer surface area of ​​the conductive device 31 connected to the first shield layer 13 or the second shield layer 23 is greater than 1.4% of the outer surface area of ​​the shield device, thereby ensuring the connection effect between the conductive device 31 and the first shield layer 13 or the second shield layer 23.

[0124] Moreover, the minimum cross-sectional area at the connection point between the first end (the left end in the figure) of the conductive device 31 and the first shield layer 13 is 60% to 260% of the cross-sectional area of ​​the first shield layer 13. This ensures a connection effect between the first end of the conductive device 31 and the first shield layer 13.

[0125] Moreover, the minimum cross-sectional area at the connection point between the second end (the right end in the figure) of the conductive device 31 and the second shield layer 23 is 60% to 260% of the cross-sectional area of ​​the second shield layer 23. This ensures a connection effect between the second end of the conductive device 31 and the second shield layer 23.

[0126] The main role of the first shield layer 13 and the second shield layer 23 is to prevent electromagnetic interference by grounding eddy currents generated by current conduction in the cable core. The larger the cross-sectional area of ​​the cable core, the larger the current that can be conducted and the larger the eddy currents generated in the shield layers. If the minimum cross-sectional area at the connection point between one end of the conductive device 31 and the first shield layer 13 or the second shield layer 23 is smaller than the minimum cross-sectional area required by the standard, local heat will be generated at the connection point, and in the worst case, the connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 will be burned off, resulting in a decrease in shielding performance and ultimately a loss of shielding performance.

[0127] Table 6 shows the effect of the ratio of the minimum cross-sectional area at the connection point between the conductive device and the first shield layer to the cross-sectional area of ​​the first shield layer on the temperature rise between the conductive device and the shield layer.

[0128] [Table 6]

[0129] Table 7 shows the effect of the ratio of the minimum cross-sectional area at the connection point between the conductive device and the second shield layer to the cross-sectional area of ​​the second shield layer on the temperature rise between the conductive device and the shield layer.

[0130] [Table 7]

[0131] The above table shows the data for a selection of cables of a certain wire diameter, where the standard requires that the temperature rise between the conductive device and the shield layer is less than 50°C.

[0132] As can be seen from the above table, if the ratio of the minimum cross-sectional area at the connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 to the cross-sectional area of ​​the first shield layer or the second shield layer is less than 60%, the temperature rise value between the conductive device 31 and the first shield layer 13 or the second shield layer 23 does not meet the standard requirements.

[0133] When the ratio of the minimum cross-sectional area at the connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 to the cross-sectional area of ​​the first shield layer 13 or the second shield layer 23 is greater than 260%, the cross-sectional areas of the first shield layer 13 and the second shield layer 23 are much larger than the minimum conduction area of ​​the eddy current, so that the temperature rise value between the conductive device 31 and the first shield layer 13 or the second shield layer 23 is almost the same as when the above ratio is 260%, but the cost and processing cycle will be higher.

[0134] Therefore, it is preferable that the minimum cross-sectional area at the connection point between the first end of the conductive device 31 and the first shield layer 13 is 60% to 260% of the cross-sectional area of ​​the first shield layer 13, and the minimum cross-sectional area at the connection point between the second end of the conductive device 31 and the second shield layer 23 is 60% to 260% of the cross-sectional area of ​​the second shield layer 23.

[0135] Specifically, the impedance at the connection point between the shielding device and the first shielding layer is less than 13.7 mΩ, and the impedance at the connection point between the shielding device and the second shielding layer is less than 13.7 mΩ.

[0136] In a preferred embodiment, the impedance at the connection between the shielding device and the first shielding layer is less than 12.5 mΩ, and the impedance at the connection between the shielding device and the second shielding layer is less than 12.5 mΩ.

[0137] It is necessary to minimize the impedance at the connection point between the shielding device and the shielding layer, so that the current generated in the shielding layer can flow back to the energy source or to ground without any problems. If the impedance at the connection point between the shielding device and the shielding layer is large, a large current will be generated at the connection point between the shielding device and the shielding layer, which will result in a large radiation at the connection point of the cable.

[0138] As a test method, the test equipment outputs one signal value (this value is test value 2) to the first or second cable, and a detection device is provided on the outside of the cable assembly, and this detection device detects one signal value (this value is test value 1). Shield performance value = test value 2 - test value 1.

[0139] Table 8 shows the effect of impedance at the connection point between the shielding device and the shielding layer on the shielding performance.

[0140] [Table 8]

[0141] The above table shows data from testing a selection of cables of a specific wire diameter, where the standard requires that the shielding performance at the connection between the shielding device and the shielding layer be greater than 60 dB.

[0142] When the impedance at the connection point between the shielding device and the first shielding layer is greater than 13.7 mΩ and the impedance at the connection point between the shielding device and the second shielding layer is greater than 13.7 mΩ, the shielding performance value at the connection point between the shielding device and the shielding layer is less than 60 dB, which does not satisfy the standard requirements. When the impedance at the connection point between the shielding device and the first shielding layer is less than 12.5 mΩ and the impedance at the connection point between the shielding device and the second shielding layer is less than 12.5 mΩ, the shielding performance value at the connection point between the shielding device and the shielding layer does not change significantly. Therefore, the present inventors set the impedance at the connection point between the shielding device and the first shielding layer to less than 13.7 mΩ and the impedance at the connection point between the shielding device and the second shielding layer to less than 13.7 mΩ.

[0143] In a preferred embodiment, the impedance at the connection between the shielding device and the first shielding layer is less than 12.5 mΩ, and the impedance at the connection between the shielding device and the second shielding layer is less than 12.5 mΩ.

[0144] Specifically, the impedance at the connection between the first end of the conductive device and the first shield layer is less than 13.7 mΩ, and the impedance at the connection between the second end of the conductive device and the second shield layer is less than 13.7 mΩ.

[0145] In a preferred embodiment, the impedance at the connection between the first end of the conductive device and the first shield layer is less than 12.5 mΩ, and the impedance at the connection between the second end of the conductive device and the second shield layer is less than 12.5 mΩ.

[0146] It is necessary to minimize the impedance at the connection between the conductive device and the shielding layer, so that the current generated in the shielding layer can flow back to the energy source or ground without any problems. If the impedance at the connection between the conductive device and the shielding layer is large, a large current will be generated at the connection between the conductive device and the shielding layer, which will result in a large radiation at the connection point of the cable.

[0147] As a test method, the test equipment outputs one signal value (this value is test value 2) to the first or second cable, and a detection device is provided on the outside of the cable assembly, and this detection device detects one signal value (this value is test value 1). Shield performance value = test value 2 - test value 1.

[0148] Table 9 shows the effect of impedance at the connection between the conductive device and the shielding layer on shielding performance.

[0149] [Table 9]

[0150] The above table shows data from testing a selection of cables of a particular wire diameter, where the standard requires that the shielding performance at the junction between the conductive device and the shielding layer be greater than 60 dB.

[0151] When the impedance at the connection point between the first end of the conductive device and the first shield layer is greater than 13.7 mΩ and the impedance at the connection point between the second end of the conductive device and the second shield layer is greater than 13.7 mΩ, the shielding performance value at the connection point between the conductive device and the shield layer is less than 60 dB, which does not meet the standard requirements. Also, when the impedance at the connection point between the first end of the conductive device and the first shield layer is less than 12.5 mΩ and the impedance at the connection point between the second end of the conductive device and the second shield layer is less than 12.5 mΩ, the shielding performance value at the connection point between the conductive device and the shield layer does not change significantly. Therefore, the inventors set the impedance at the connection point between the first end of the conductive device and the first shield layer to less than 13.7 mΩ and the impedance at the connection point between the second end of the conductive device and the second shield layer to less than 13.7 mΩ.

[0152] In a preferred embodiment, the impedance at the connection between the first end of the conductive device and the first shield layer is less than 12.5 mΩ, and the impedance at the connection between the second end of the conductive device and the second shield layer is less than 12.5 mΩ.

[0153] As shown in FIG. 14, in practical applications, the first cable 10 may typically further have a third protective layer 14 (which may be understood as an outer jacket), and the second cable 20 may typically further have a fourth protective layer 24 (which may be understood as an outer jacket).

[0154] Specifically, the third protective layer 14 is provided on the outside of the first shielding layer 13, and prevents conductive contact between the first shielding layer 13 and other components, thereby improving the safety of use of the first cable 10 and also improving the waterproof, dustproof, and other performance of the entire first cable 10.

[0155] In a specific embodiment, the third protective layer 14 may be made of an insulating material selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene, or a combination of two or more of these materials.

[0156] Accordingly, in the second cable 20, the fourth protective layer 24 is provided on the outside of the second shielding layer 23, and by preventing conductive contact between the second shielding layer 23 and other components, the safety of use of the second cable 20 can be improved and the waterproof, dustproof, and other performances of the entire second cable 20 can also be improved.

[0157] In a specific implementation, the fourth protective layer 24 may be made of an insulating material selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene, or a combination of two or more of these.

[0158] In addition, in a specific implementation, an insulating cover (not shown) may be provided on the outside of the shield connection assembly 30. Here, the left end of the insulating cover may be covered on the outside of the third protective layer 14 of the first cable 10, and the right end of the insulating cover may be covered on the outside of the fourth protective layer 24 of the second cable 20. This improves the reliability of the shield connection assembly 30 and prevents conductive contact between the shield connection assembly 30 and an external conductor. In a specific arrangement, the insulating cover may be a structural member having good insulating properties such as a heat shrink tube, and the specific material and type of the insulating cover may be adaptively selected according to actual needs, and the present application does not specifically limit them.

[0159] When manufacturing a cable assembly, the following steps may be employed.

[0160] 3 and 21, the manufacturing method may include the following steps.

[0161] In S10, a first cable 10 is provided. The first cable 10 has a first cable core 11, a first protective layer 12, and a first shielding layer 13, where the first protective layer 12 is provided on the outside of the first cable core 11, and the first shielding layer 13 is provided on the outside of the first protective layer 12.

[0162] In S11, the first shield layer 13 and the first protective layer 12 at the first end of the first cable 10 (the right end of the first cable 10 in FIG. 3) are peeled off to expose the first cable core 11.

[0163] In S20, a second cable 20 is provided. The second cable 20 has a second cable core 21, a second protective layer 22, and a second shielding layer 23, where the second protective layer 22 is provided on the outside of the second cable core 21, and the second shielding layer 23 is provided on the outside of the second protective layer 22.

[0164] In S21, the second shield layer 23 and the second protective layer 22 at the first end of the second cable 20 (the left end of the second cable 20 in FIG. 3) are peeled off to expose the second cable core 21.

[0165] In S22, the first end of the first cable core 11 and the first end of the second cable core 21 are connected to realize an electrical connection between the first cable core 11 and the second cable core 21.

[0166] In S30, a shield connection assembly 30 is provided. The shield connection assembly 30 includes a conductive device 31, a first shield internal mounting device 32, a first shield middle device 33, a second shield internal mounting device 34, and a second shield middle device 35.

[0167] In S31, the first shield internal attachment device 32 is provided on the outside of the free end of the first shield layer 13, the free end of the first shield layer 13 is folded back outward, and the turned-over portion 131 is attached to the outer wall of the first shield internal attachment device 32. The second shield internal attachment device 34 is provided on the outside of the free end of the second shield layer 23, the free end of the second shield layer 23 is folded back outward, and the turned-over portion 231 is attached to the outer wall of the second shield internal attachment device 34.

[0168] In S32, a first end of the conductive device 31 is provided on the outside of the turned-over portion 131 of the first shield layer 13, and a second end of the conductive device 31 is provided on the outside of the turned-over portion 231 of the second shield layer 23. This realizes a connection between the first shield layer 213 and the second shield layer 223.

[0169] In S33, a first shield middle device 33 is provided outside a first end of the conductive device 31, and a second shield middle device 35 is provided outside a second end of the conductive device 31.

[0170] As can be understood, in a specific implementation, the first shield middle device 33 may be pre-installed outside the first end of the conductive device 31, and then the first end of the conductive device 31 may be pre-installed outside the first shield layer 13. Correspondingly, the second shield middle device 35 may be pre-installed outside the second end of the conductive device 31, and then the second end of the conductive device 31 may be pre-installed outside the second shield layer 23.

[0171] In S34, the first end of the conductive device 31 and the inverted portion 131 of the first shield layer 13 are welded between the first shield internal attachment device 32 and the first shield middle device 33, and the second end of the conductive device 13 and the inverted portion 231 of the second shield layer 23 are welded between the second shield internal attachment device 34 and the second shield middle device 35. Alternatively, in S34, the first end of the conductive device 31 and the inverted portion 131 of the first shield layer 13 are crimped between the first shield internal attachment device 32 and the first shield middle device 33, and the second end of the conductive device 13 and the inverted portion 231 of the second shield layer 23 are crimped between the second shield internal attachment device 34 and the second shield middle device 35. Alternatively, in S34, a first end of the conductive device 31 and an inverted portion 131 of the first shield layer 13 are abutted between the first shield internal mounting device 32 and the first shield middle device 33, and a second end of the conductive device 13 and an inverted portion 231 of the second shield layer 23 are abutted between the second shield internal mounting device 34 and the second shield middle device 35.

[0172] When welding, a first end of the conductive device 31 can be welded to the inverted portion 131 of the first shield layer 13, and a second end of the conductive device 31 can be welded to the inverted portion 231 of the second shield layer 23 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, etc.

[0173] When performing crimping, a force is applied to the first shield central device 33 and the second shield central device 34 using a tool such as a crimping clamp, thereby achieving a crimp connection between the first shield central device 33 and the first shield internal mounting device 32, and a crimp connection between the second shield central device 35 and the second shield internal mounting device 34.

[0174] In this process, since the first shield mounting device 32 has a certain strength, it can provide a certain protective effect on the first cable core 11 and prevent the first cable core 11 from being pressed too hard. Correspondingly, since the second shield mounting device 34 has a certain strength, it can provide a certain protective effect on the second cable core 21 and prevent the second cable core 21 from being pressed too hard.

[0175] In step S22, connecting the first end of the first cable core 11 and the first end of the second cable core 21 specifically includes connecting the first end of the first cable core 11 and the first end of the second cable core 21 by a welding or crimping process.

[0176] As can be understood, in a specific implementation, the first cable core 11 and the second cable core 21 may be connected in other ways to achieve a conductive connection and a mechanical connection between the first cable core 11 and the second cable core 21.

[0177] In addition, before step S32, the manufacturing method further includes providing an isolation sleeve 39 on the outside of the connection point between the first cable core 11 and the second cable core 21. This can prevent defects such as conductive contact between the connection point and the conductive device 11.

[0178] The isolation sleeve 39 may be heat shrink tubing or another insulating layer that is injection molded directly over the outside of the connection point.

[0179] Also, in some embodiments, when a third protective layer 14 is provided on the outside of the first cable 10, performing step S11 further includes peeling off the third protective layer 14 of the first cable 10. Correspondingly, when a fourth protective layer 24 is provided on the outside of the second cable 20, performing step S21 further includes peeling off the fourth protective layer 24 of the second cable 20.

[0180] Moreover, as shown in Fig. 22, the embodiment of the present invention further provides another method for manufacturing a cable assembly, in which steps S35 to S37 are added.

[0181] The process will be described with reference to Figures 4 and 22. Specifically, steps S35 to S37 are further included after step S34.

[0182] In S35, the first end of the conductive device 31 is folded back 180 degrees outward and attached to the outer wall of the first shield central device 33, and the first shield external attachment device 36 is provided outside the turned-over portion 311 of the first end of the conductive device 31.

[0183] In S36, the second end of the conductive device 31 is folded back 180 degrees outward and attached to the outer wall of the second shield central device 35, and the second shield external attachment device 37 is provided outside the turned-over portion 312 of the second end of the conductive device 31.

[0184] In S37, the inverted portion 311 of the conductive device 31 is welded between the first shield central device 33 and the first shield external device 36, and the inverted portion 312 of the conductive device 31 is welded between the second shield central device 35 and the second shield external device 37. Alternatively, in S37, the inverted portion 311 of the conductive device 31 is crimped between the first shield central device 33 and the first shield external device 36, and the inverted portion 312 of the conductive device 31 is crimped between the second shield central device 35 and the second shield external device 37. Alternatively, in S37, the inverted portion 311 of the conductive device 31 is abutted between the first shield central device 33 and the first shield external device 36, and the inverted portion 312 of the conductive device 31 is abutted between the second shield central device 35 and the second shield external device 37.

[0185] When welding, the inverted portion 311 of the conductive device 31 can be welded between the first shield central device 33 and the first shield external device 36, and the inverted portion 312 of the conductive device 31 can be welded between the second shield central device 35 and the second shield external device 37 by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, etc.

[0186] When performing crimping, a force is applied to the first shield external attachment device 36 and the second shield external attachment device 37 using a tool such as a crimping clamp, thereby achieving a crimp connection between the first shield external attachment device 36 and the first shield central device 33, and a crimp connection between the second shield external attachment device 37 and the second shield central device 35.

[0187] The manufacturing method may further include providing an insulating cover on the outside of the shield connection assembly 30. The left end of the insulating cover may be covered on the outside of the third protective layer 14 of the first cable 10, and the right end of the insulating cover may be covered on the outside of the fourth protective layer 24 of the second cable 20. This can improve the reliability of the shield connection assembly 30 and prevent conductive contact between the shield connection assembly 30 and an external conductor. In a specific arrangement, the insulating cover may be a structural member having good insulating properties such as a heat shrink tube, and the specific material and type of the insulating cover can be adaptively selected according to actual needs, and the present application does not specifically limit the same.

[0188] As can be understood, when manufacturing a cable assembly, the manufacturing sequence can be adaptively adjusted according to the actual situation, and some steps can be added or omitted, and is not specifically limited in the present application.

[0189] It is obvious to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include these modifications and variations.

Claims

1. A cable assembly comprising: A first cable having a first cable core covered with a first protective layer on the outside and a first shield layer provided on the outside of the first protective layer; a second cable having a second cable core covered with a second protective layer on the outside and a second shield layer provided on the outside of the second protective layer; Equipped with a shield connection assembly having at least one shield device; The shield connection assembly further comprises a conductive device; the conductive device has a first end and a second end, the first end being connected to the first shield layer and the second end being connected to the second shield layer; The shield device includes: a first shield internal attachment device provided on the outside of the first shield layer, the first shield layer being folded back to the outside and having a free end attached to an outer wall of the first shield internal attachment device; a second shield internal attachment device provided on the outside of the second shield layer, the free end of the second shield layer folded back to the outside being attached to an outer wall of the second shield internal attachment device; a first shield middle device disposed outside a first end of the conductive device; a second shield middle device disposed outside the second end of the conductive device; having a first end of the conductive device and a free end of the first shield layer are crimped, welded, or abutted between the first shield inner device and the first shield middle device; a second end of the conductive device and a free end of the second shield layer are crimped, welded, or abutted between the second shield inner device and the second shield middle device; The first shield internal attachment device and the first shield central device are provided separately, The inner wall of the first shielding device is bonded to the outside of the first shielding layer, The second shield internal attachment device and the second shield central device are provided separately, The inner wall of the second shielding device is bonded to the outside of the second shielding layer. A cable assembly comprising:

2. a connection portion between the first shield internal attachment device and the first shield layer is symmetrical with respect to an axial center line of the cable assembly, and a connection portion between the second shield internal attachment device and the second shield layer is symmetrical with respect to an axial center line of the cable assembly.

2. The cable assembly according to claim 1 .

3. The connection points between the first shield internal mounting device and the first shield layer are provided over 360°, and the connection points between the second shield internal mounting device and the second shield layer are provided over 360°.

2. The cable assembly according to claim 1 .

4. a connection point between a first end of the conductive device and the first shield layer is symmetrical with respect to an axial center line of the cable assembly, and a connection point between a second end of the conductive device and the second shield layer is symmetrical with respect to an axial center line of the cable assembly.

2. The cable assembly according to claim 1 .

5. A connection point between the first end of the conductive device and the first shield layer is provided over 360°, and a connection point between the second end of the conductive device and the second shield layer is provided over 360°.

2. The cable assembly according to claim 1 .

6. The shield connection assembly further includes a first shield external attachment device and a second shield external attachment device; The first shielding central device is provided on the outside of the first end of the conductive device, and the first end of the conductive device is folded outward and attached to an outer wall of the first shielding central device; the first shield external attachment device is provided on an outer side of the turned-over portion of the first end of the conductive device; The second shielding central device is provided on the outside of the second end of the conductive device, and the second end of the conductive device is folded outward and attached to an outer wall of the second shielding central device; The second shield external attachment device is provided on the outside of the turned-over portion of the second end of the conductive device.

2. The cable assembly according to claim 1 .

7. The cross-sectional shapes of the first shield internal attachment device, the first shield central device, and the first shield external attachment device are circular, elliptical, polygonal, or irregularly shaped annular structures.

7. The cable assembly according to claim 6.

8. The cross-sectional shapes of the second shield internal mounting device, the second shield central device, and the second shield external mounting device are circular, elliptical, polygonal, or irregularly shaped annular structures.

7. The cable assembly according to claim 6.

9. an inner insulating layer is provided on an inner wall of the conductive device; the first end and the second end of the conductive device are free of the inner insulating layer; 2. The cable assembly according to claim 1 .

10. an outer insulating layer is provided on the outer wall of the conductive device; the first end and the second end of the conductive device are free of an outer insulating layer; 2. The cable assembly according to claim 1 .

11. The first cable core and the second cable core are connected by a lap connection or a butt connection.

2. The cable assembly according to claim 1 .

12. The minimum cross-sectional area at the lap joint or the butt joint is equal to or greater than the minimum cross-sectional area of ​​the first cable core and the second cable core.

12. The cable assembly of claim 11.

13. the thickness of the first shield layer, the second shield layer and the conductive device is 0.003 mm to 27 mm; 2. The cable assembly according to claim 1 .

14. an outer surface area of ​​the first shielding device connected to the first shield layer is greater than 1.3% of the outer surface area of ​​the first shielding device; 2. The cable assembly according to claim 1 .

15. an outer surface area of ​​the second shielding device connected to the second shield layer is greater than 1.3% of the outer surface area of ​​the second shielding device; 2. The cable assembly according to claim 1 .

16. a minimum cross-sectional area at a connection point between the first end of the conductive device and the first shield layer is 60% to 260% of a cross-sectional area of ​​the first shield layer; 2. The cable assembly according to claim 1 .

17. a minimum cross-sectional area at a connection point between the second end of the conductive device and the second shield layer is 60% to 260% of a cross-sectional area of ​​the second shield layer; 2. The cable assembly according to claim 1 .

18. an outer surface area of ​​the first end of the conductive device connected to the first shield layer is greater than 1.4% of an outer surface area of ​​the first shield middle device; 2. The cable assembly according to claim 1 .

19. an outer surface area where the second end of the conductive device is connected to the second shield layer is greater than 1.4% of an outer surface area of ​​the second shield middle device; 2. The cable assembly according to claim 1 .

20. an impedance at a connection point between the first shield internal device and the first shield layer is less than 13.7 mΩ, and an impedance at a connection point between the second shield internal device and the second shield layer is less than 13.7 mΩ; 2. The cable assembly according to claim 1 .

21. an impedance at a connection point between the first shield internal device and the first shield layer is less than 12.5 mΩ, and an impedance at a connection point between the second shield internal device and the second shield layer is less than 12.5 mΩ; 2. The cable assembly according to claim 1 .

22. an impedance at a connection point between a first end of the conductive device and the first shield layer is less than 13.7 mΩ, and an impedance at a connection point between a second end of the conductive device and the second shield layer is less than 13.7 mΩ; 2. The cable assembly according to claim 1 .

23. an impedance at a connection point between a first end of the conductive device and the first shield layer is less than 12.5 mΩ, and an impedance at a connection point between a second end of the conductive device and the second shield layer is less than 12.5 mΩ; 2. The cable assembly according to claim 1 .

24. a separator sleeve disposed on an outer side of a first end of the first cable core and an outer side of a first end of the second cable core; 2. The cable assembly according to claim 1 .

25. one end of the isolation sleeve is connected to the first protective layer, and the other end of the isolation sleeve is connected to the second protective layer; 25. The cable assembly of claim 24.

26. The first cable further includes a third protective layer provided on an outer side of the first shielding layer, The second cable further includes a fourth protective layer provided on the outside of the second shielding layer.

2. The cable assembly according to claim 1 .

27. A method for manufacturing a cable assembly, comprising: providing a first cable having a first cable core, a first protective layer provided on an outside of the first cable core, and a first shielding layer provided on an outside of the first protective layer; stripping a first shield layer and a first protective layer from a first end of the first cable to expose the first cable core; providing a second cable having a second cable core, a second protective layer provided on the outside of the second cable core, and a second shielding layer provided on the outside of the second protective layer; stripping a second shield layer and a second protective layer from a first end of the second cable to expose the second cable core; connecting a first end of the first cable core and a first end of the second cable core; providing a shield connection assembly having a conductive device, a first shield internal mounting device, a first shield middle device provided separately from the first shield internal mounting device, a second shield internal mounting device, and a second shield middle device provided separately from the second shield internal mounting device; attaching the first shield internal attachment device to an outer side of the first shield layer, and disposing the first shield layer further outward than a free end of the first shield layer in an axial direction of the cable assembly; folding back the free end of the first shield layer to the outside, and attaching a turned-over portion to an outer wall of the first shield internal attachment device; the second shield internal attachment device is attached to an outer side of the second shield layer, and disposed outside the second shield layer relative to a free end of the second shield layer in an axial direction of the cable assembly, and the free end of the second shield layer is folded back to the outside, and then attached to an outer wall of the second shield internal attachment device; a first end of the conductive device disposed outside the turned-over portion of the first shield layer and a second end of the conductive device disposed outside the turned-over portion of the second shield layer; providing the first shielding central device outboard of a first end of the conductive device; providing the second shielding central device outboard of the second end of the conductive device; Connecting (1) A first end of the conductive device and an inverted portion of the first shield layer are welded between the first shield internal attachment device and the first shield middle device, and a second end of the conductive device and an inverted portion of the second shield layer are welded between the second shield internal attachment device and the second shield middle device. (2) A first end of the conductive device and an inverted portion of the first shield layer are crimped between the first shield internal attachment device and the first shield middle device, and a second end of the conductive device and an inverted portion of the second shield layer are crimped between the second shield internal attachment device and the second shield middle device, or (3) A first end of the conductive device and an inverted portion of the first shield layer are abutted between the first shield internal attachment device and the first shield middle device, and a second end of the conductive device and an inverted portion of the second shield layer are abutted between the second shield internal attachment device and the second shield middle device. and connecting the 4. A method for manufacturing a cable assembly comprising the steps of:

28. Providing a first shield external attachment device and a second shield external attachment device; Folding a first end of the conductive device outward and attaching it to an outer wall of a first shield middle device; providing a first shield external attachment device on an outer side of the turned-over portion of the first end of the conductive device; folding a second end of the conductive device outward and attaching it to an outer wall of a second shield middle device; providing a second shield external attachment device on an outer side of the everted portion of the second end of the conductive device; Connecting (4) welding an inverted portion of a first end of the conductive device between the first shield middle device and the first shield external device, and welding an inverted portion of a second end of the conductive device between the second shield middle device and the second shield external device; (5) A reversed portion of a first end of the conductive device is crimped between the first shield middle device and the first shield external device, and a reversed portion of a second end of the conductive device is crimped between the second shield middle device and the second shield external device, or (6) An inverted portion of a first end of the conductive device is abutted between the first shield middle device and the first shield external device, and an inverted portion of a second end of the conductive device is abutted between the second shield middle device and the second shield external device. and further comprising connecting the 28. The method of claim 27.

29. Connecting the first end of the first cable core and the first end of the second cable core includes connecting the first end of the first cable core and the first end of the second cable core by welding or crimping.

28. The method of claim 27.

30. before providing one end of the conductive device outside the first shield layer and the other end of the conductive device outside the second shield layer, and providing an isolation sleeve on the outside of a connection point between the first cable core and the second cable core.

30. The method of claim 29.

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