Laser processing method and laser processing system

Abstract

In this laser processing method, a site being processed is formed in a processing area on an object being processed through irradiation of the processing area with pulsed laser light. The laser processing method comprises an irradiation step for guiding pulsed laser light emitted from an excimer laser device to a portion of the processing area and moving an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light, and a movement step for moving the object being processed in the height direction of the object being processed. The irradiation step is carried out at a plurality of height positions on the object being processed that moves in the height direction due to the movement step. In the irradiation step, at least some respective irradiation spots of the pulsed laser light overlap other irradiation spots that are adjacent to said irradiation spots.

Description

[Technical field]

[0001] The present disclosure relates to a laser processing method and a laser processing system. [Background technology]

[0002] In recent years, semiconductor exposure devices are required to improve their resolution in accordance with the miniaturization and high integration of semiconductor integrated circuits. For this reason, the wavelength of light emitted from the exposure light source is being shortened. For example, as gas laser devices for exposure, KrF excimer laser devices that output laser light with a wavelength of about 248 nm and ArF excimer laser devices that output laser light with a wavelength of about 193 nm are used.

[0003] The spectral line width of the spontaneous oscillation light of the KrF excimer laser device and the ArF excimer laser device is as wide as 350 pm to 400 pm. Therefore, if a projection lens is made of a material that transmits ultraviolet light such as KrF and ArF laser light, chromatic aberration may occur. As a result, the resolution may decrease. Therefore, it is necessary to narrow the spectral line width of the laser light output from the gas laser device to a level where the chromatic aberration can be ignored. Therefore, in order to narrow the spectral line width, a line narrow module (LNM) including a line narrowing element (such as an etalon or grating) may be provided in the laser resonator of the gas laser device. Hereinafter, a gas laser device in which the spectral line width is narrowed is referred to as a line narrowing gas laser device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2000-271770 A [Patent Document 2] JP 2018-16525 A [Patent Document 3] Summary of JP-A-3-157917

[0005] A laser processing method according to one aspect of the present disclosure is a laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, the method including an irradiation step of guiding pulsed laser light emitted from an excimer laser device to a part of the processing area and moving an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light, and a moving step of moving the workpiece in a height direction of the workpiece, the irradiation step being performed at multiple height positions of the workpiece that is moved in the height direction by the moving step, and in the irradiation step, at least a portion of each irradiation spot of the pulsed laser light may overlap another irradiation spot adjacent to the irradiation spot.

[0006] A laser processing system according to one aspect of the present disclosure is a laser processing system that forms a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, and includes an irradiation optical system that guides pulsed laser light emitted from an excimer laser device to a part of the processing area and moves an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light, an fθ lens that focuses the pulsed laser light from the irradiation optical system on the processing area, and a moving stage that moves the workpiece in the height direction of the workpiece, and the irradiation optical system irradiates the pulsed laser light at multiple height positions of the workpiece moved in the height direction by the moving stage, and at least a portion of each irradiation spot of the pulsed laser light may overlap another irradiation spot adjacent to the irradiation spot. [Brief description of the drawings]

[0007] Some embodiments of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings. [Figure 1] FIG. 1 is a schematic diagram showing an example of the overall configuration of a laser processing system of a comparative example. [Diagram 2] FIG. 2 is a diagram showing the spectral waveform of laser light in the case of spontaneous oscillation and the light absorption by oxygen. [Diagram 3] FIG. 3 is a schematic diagram showing an example of a schematic overall configuration of the laser processing system of the first embodiment. [Figure 4] FIG. 4 is a diagram for explaining the helical cutting process. [Diagram 5] FIG. 5 is a diagram for explaining the raster scan processing. [Figure 6] FIG. 6 is a diagram showing a part of a control flowchart of the laser processing processor of the first embodiment. [Figure 7] FIG. 7 is a diagram showing another part of the control flowchart of the laser processing processor of the first embodiment. [Figure 8] FIG. 8 is a diagram showing the remaining part of the control flowchart of the laser processing processor of the first embodiment. [Figure 9] FIG. 9 is a diagram showing a part of a control flowchart of a laser processing processor according to a modified example of the first embodiment. [Figure 10] FIG. 10 is a diagram showing another part of the control flowchart of the laser processing processor according to the modified example of the first embodiment. [Figure 11] FIG. 11 is a schematic diagram showing an example of a schematic overall configuration of a laser processing system according to the second embodiment. [Figure 12] FIG. 12 is a diagram showing a part of a control flowchart of the laser processing processor of the second embodiment. [Figure 13] FIG. 13 is a control flow chart of the laser processing processor in the height recording process. [Figure 14] FIG. 14 is a diagram showing another part of the control flowchart of the laser processing processor of the second embodiment. [Figure 15] FIG. 15 is a diagram showing a part of a control flowchart of the laser processing processor of the third embodiment. [Figure 16] FIG. 16 is a diagram for explaining step SP61. [Figure 17] FIG. 17 is a diagram for explaining step SP61. [Figure 18] FIG. 18 is a diagram for explaining step SP61. [Figure 19] FIG. 19 is a diagram for explaining the helical cutting process of the fourth embodiment. [Figure 20] FIG. 20 is a diagram for explaining the helical cutting process of the fourth embodiment. [Figure 21] FIG. 21 is a diagram for explaining the helical cutting process of the fourth embodiment. [Figure 22] FIG. 22 is a diagram illustrating irradiation with a pulsed laser beam according to the fifth embodiment. [Figure 23] FIG. 23 is a diagram illustrating irradiation with a pulsed laser beam according to the fifth embodiment. [Figure 24] FIG. 24 is a diagram illustrating irradiation with a pulsed laser beam according to the fifth embodiment. [Diagram 25] FIG. 25 is a diagram illustrating irradiation with a pulsed laser beam according to the fifth embodiment. [Figure 26] FIG. 26 is a diagram showing a part of a control flowchart of the laser processing processor of the fifth embodiment. [Figure 27] FIG. 27 is a diagram showing another part of the control flowchart of the laser processing processor of the fifth embodiment. [Figure 28] FIG. 28 is a diagram for explaining a plurality of machined portions formed in a state where the workpiece is inclined with respect to the Z axis. [Figure 29] FIG. 29 is a schematic diagram showing an example of a schematic overall configuration of a gas laser device according to a modified example. Embodiment

[0008] 1. Overview 2. Description of the laser processing system and the laser processing method of the comparative example 2.1 Configuration 2.2 Operation 2.3 Challenges 3. Description of the laser processing system and laser processing method according to the first embodiment 3.1 Configuration 3.2 Operation 3.3 Actions and Effects 4. Description of the laser processing system and the laser processing method according to the second embodiment 4.1 Configuration 4.2 Operation 4.3 Actions and Effects 5. Description of the laser processing system and the laser processing method according to the third embodiment 5.1 Configuration 5.2 Operation 5.3 Actions and Effects 6. Description of the laser processing system and the laser processing method according to the fourth embodiment 6.1 Configuration 6.2 Operation 6.3 Actions and Effects 7. Description of the laser processing system and the laser processing method according to the fifth embodiment 7.1 Configuration 7.2 Operation 7.3 Actions and Effects 8. Description of modified gas laser devices Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0009] The embodiments described below are merely examples of the present disclosure and do not limit the contents of the present disclosure. Furthermore, not all of the configurations and operations described in each embodiment are necessarily essential to the configurations and operations of the present disclosure. Note that the same components are given the same reference symbols and redundant descriptions are omitted.

[0010] 1. Overview The present disclosure relates to a laser processing system and a laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with a pulsed laser beam. The processing area is an area to which a pulsed laser beam is irradiated to form the processed portion. The processed portion is formed inside the outer shape of the processing area. The processed portion is, for example, a through hole or a groove, but is not limited thereto.

[0011] 2. Description of the laser processing system and the laser processing method of the comparative example 2.1 Configuration A laser processing system 10 and a laser processing method of a comparative example will be described. Note that the comparative example of the present disclosure is a form that the applicant recognizes as being known only by the applicant, and is not a publicly known example that the applicant recognizes.

[0012] 1 is a schematic diagram showing an example of the overall schematic configuration of a laser processing system 10. The laser processing system 10 mainly includes a gas laser device 100, a laser processing device 300, and an optical path tube 500 that connects the gas laser device 100 and the laser processing device 300. In the following description, the direction parallel to the optical axis direction of the pulsed laser light incident on the workpiece 20 is referred to as the Z direction, the direction perpendicular to the Z direction is referred to as the X direction, and the direction perpendicular to the X direction and the Z direction is referred to as the Y direction. The Z direction is also the height direction of the workpiece 20.

[0013] The gas laser device 100 is, for example, an ArF excimer laser device that uses a mixed gas containing argon (Ar), fluorine (F2), and neon (Ne). In this case, the gas laser device 100 outputs a pulsed laser beam with a central wavelength of about 193.40 nm. The gas laser device 100 may be a gas laser device other than an ArF excimer laser device, and may be, for example, a KrF excimer laser device that uses a mixed gas containing krypton (Kr), F2, and Ne. In this case, the gas laser device 100 outputs a pulsed laser beam with a central wavelength of about 248 nm. A mixed gas containing Ar, F2, and Ne as a laser medium, or a mixed gas containing Kr, F2, and Ne as a laser medium, may be called a laser gas.

[0014] Gas laser device 100 mainly includes a housing 110, a master oscillator 130, a monitor module 150, a shutter 170, and a laser processor 190. Master oscillator 130, monitor module 150, shutter 170, and laser processor 190 are disposed in the internal space of housing 110.

[0015] The master oscillator 130 includes a laser chamber 131, a charger 141, a pulse power module 143, a rear mirror 145, and an output coupling mirror 147. In Fig. 1, the internal configuration of the laser chamber 131 is shown as viewed from a direction substantially perpendicular to the traveling direction of the laser light.

[0016] Laser chamber 131 includes an internal space in which light is generated by excitation of the laser gas. The laser gas is supplied to the internal space of laser chamber 131 from a laser gas supply source (not shown) disposed in gas laser device 100 via piping (not shown). The light generated by excitation of the laser gas travels to windows 139a and 139b, which will be described later.

[0017] A pair of electrodes 133a and 133b are disposed in the internal space of the laser chamber 131. The electrodes 133a and 133b are discharge electrodes for exciting the laser medium by glow discharge. In this example, the electrode 133a is a cathode, and the electrode 133b is an anode. The electrodes 133a and 133b are disposed opposite to each other. In addition, the longitudinal direction of the electrodes 133a and 133b is disposed along the traveling direction of light generated by a high voltage applied between the electrodes 133a and 133b.

[0018] The electrode 133a is supported by an electrical insulator 135. The electrical insulator 135 covers an opening formed in the laser chamber 131. A conductive portion is embedded in the electrical insulator 135, and the conductive portion applies a high voltage supplied from the pulse power module 143 to the electrode 133a. The electrode 133b is supported by a return plate 137. The return plate 137 is connected to the inner surface of the laser chamber 131 by wiring (not shown).

[0019] The charger 141 is a DC power supply device that charges a charging capacitor (not shown) in the pulse power module 143 with a predetermined voltage. The pulse power module 143 includes a switch 143a controlled by the laser processor 190. When the switch 143a is turned from OFF to ON, the pulse power module 143 generates a pulsed high voltage from the electric energy held in the charger 141, and applies this high voltage between the electrodes 133a and 133b.

[0020] When a high voltage is applied between the electrodes 133a and 133b, the insulation between the electrodes 133a and 133b is broken down, causing a discharge. The energy of this discharge excites the laser medium in the laser chamber 131 and causes it to transition to a higher energy level. When the excited laser medium subsequently transitions to a lower energy level, it emits light according to the difference in energy levels.

[0021] The laser chamber 131 is provided with windows 139a and 139b. The windows 139a and 139b are arranged opposite to each other, sandwiching a space between the electrodes 133a and 133b in the traveling direction of the light. The window 139a is located at one end side of the laser chamber 131 in the traveling direction of the laser light, and the window 139b is located at the other end side of the laser chamber 131 in the traveling direction of the laser light. The window 139a is fitted into a hole in the laser chamber 131, but may be held by a cylindrical holder. When the window 139a is held by the holder, one end of the holder is connected to a wall surface of the laser chamber 131, and the hollow part of the holder communicates with the hole of the laser chamber 131, and the window 139a is arranged on the other end surface of the holder so as to face the hollow part. The window 139b is fitted into a hole like the window 139a, but may be held by a cylindrical holder. As described below, in gas laser device 100, light oscillates on an optical path including laser chamber 131 to emit laser light, and the laser light generated in the internal space of laser chamber 131 is emitted to the outside of laser chamber 131 through windows 139a and 139b. Windows 139a and 139b are inclined to form a Brewster angle with respect to the traveling direction of the laser light so as to suppress reflection of P-polarized light of the laser light.

[0022] The rear mirror 145 faces the window 139a, and the output coupling mirror 147 faces the window 139b. The rear mirror 145 is coated with a highly reflective film, and the output coupling mirror 147 is coated with a partially reflective film. The rear mirror 145 reflects the laser light emitted from the window 139a with high reflectance and returns it to the laser chamber 131. The output coupling mirror 147 transmits a part of the laser light output from the window 139b and reflects the other part to return it to the internal space of the laser chamber 131 via the window 139b. The output coupling mirror 147 is composed of an element in which a dielectric multilayer film is formed on a calcium fluoride substrate, for example.

[0023] Therefore, the rear mirror 145 and the output coupling mirror 147 form a Fabry-Perot type laser resonator, and the laser chamber 131 is disposed on the optical path of the laser resonator. The laser light emitted from the laser chamber 131 travels back and forth between the rear mirror 145 and the output coupling mirror 147. The traveling laser light is amplified every time it passes through the laser gain space between the electrodes 133a and 133b. A part of the amplified light is emitted as pulsed laser light via the output coupling mirror 147.

[0024] The rear mirror 145 is disposed in the internal space of a housing 145a connected to one end side of the laser chamber 131. The output coupling mirror 147 is disposed in the internal space of an optical path tube 147a connected to the other end side of the laser chamber 131.

[0025] The monitor module 150 is disposed on the optical path of the pulsed laser light emitted from the output coupling mirror 147. The monitor module 150 includes, for example, a housing 151, a beam splitter 153, and an optical sensor 155. An opening is formed in the housing 151, and the optical path tube 147a is connected so as to surround this opening. Therefore, the internal space of the housing 151 communicates with the internal space of the optical path tube 147a. The beam splitter 153 and the optical sensor 155 are disposed in the internal space of the housing 151. The beam splitter 153 and the optical sensor 155 are optical elements into which the pulsed laser light emitted from the output coupling mirror 147 is incident.

[0026] The beam splitter 153 transmits the pulsed laser light emitted from the output coupling mirror 147 toward the shutter 170 with high transmittance, and also reflects a portion of the pulsed laser light toward the light receiving surface of the optical sensor 155. The optical sensor 155 measures pulse energy E, which is an actual measured value of the pulse energy of the pulsed laser light incident on the light receiving surface. The optical sensor 155 is electrically connected to the laser processor 190, and outputs a signal indicating data related to the measured pulse energy E to the laser processor 190.

[0027] The laser processor 190 of the present disclosure is a processing device including a storage device 190a in which a control program is stored and a CPU 190b that executes the control program. The laser processor 190 is specially configured or programmed to execute various processes included in the present disclosure. The laser processor 190 also controls the entire gas laser apparatus 100.

[0028] The laser processor 190 receives a signal indicating data related to the pulse energy E from the optical sensor 155 of the monitor module 150. The laser processor 190 is also electrically connected to the laser processing processor 310 of the laser processing device 300, and transmits and receives various signals between the laser processing processor 310. For example, the laser processor 190 receives a signal indicating a light emission trigger Tr, which will be described later, and data on a target pulse energy Et, which will be described later, from the laser processing processor 310. The laser processor 190 controls the charging voltage of the charger 141 based on the pulse energy E and the target pulse energy Et received from the optical sensor 155 and the laser processing processor 310. The pulse energy of the pulse laser light is controlled by controlling the charging voltage of the charger 141. The laser processor 190 also transmits a command signal to the pulse power module 143 to turn on or off the switch 143a. The laser processor 190 also controls the opening and closing of the shutter 170.

[0029] The shutter 170 is disposed in the optical path of the pulsed laser light transmitted through the beam splitter 153 of the monitor module 150. The shutter 170 is disposed in the internal space of an optical path tube 171 connected to the housing 151 of the monitor module 150. An opening is formed on the side of the housing 151 opposite to the side to which the optical path tube 147a is connected, and the optical path tube 171 is connected so as to surround this opening. Therefore, the internal space of the optical path tube 171 communicates with the internal space of the housing 151 and the internal space of the optical path tube 147a. In addition, the optical path tube 171 communicates with the optical path tube 500 via an opening formed in the housing 110.

[0030] The shutter 170 is electrically connected to the laser processor 190. After the start of laser oscillation, the laser processor 190 controls the shutter 170 so that the shutter 170 is closed until the difference ΔE between the pulse energy E received from the monitor module 150 and the target pulse energy Et received from the laser processing processor 310 falls within an allowable range, and the shutter 170 is opened when the laser processor 190 receives a signal indicating the light emission trigger Tr from the laser processing processor 310. When the difference ΔE falls within an allowable range, the laser processor 190 transmits a reception preparation completion signal to the laser processing processor 310 to notify that the light emission trigger Tr is ready to receive. The light emission trigger Tr is specified by a predetermined repetition frequency f of the pulse laser light and a predetermined pulse number P, and is a timing signal for the laser processing processor 310 to cause the master oscillator 130 to perform laser oscillation, and is an external trigger. The repetition frequency f of the pulse laser light is, for example, 1 kHz or more and 10 kHz or less.

[0031] The internal spaces of the optical path pipes 171 and 147a and the internal spaces of the housings 151 and 145a are filled with a purge gas. The purge gas contains an inert gas such as high-purity nitrogen with little impurities such as oxygen. The purge gas is supplied from a purge gas supply source (not shown) disposed outside the gas laser device 100 through piping (not shown) to the internal spaces of the optical path pipes 171 and 147a and the internal spaces of the housings 151 and 145a.

[0032] An exhaust device (not shown) is disposed in the internal space of housing 110 of gas laser apparatus 100 to exhaust the laser gas exhausted from the internal space of laser chamber 131. The exhaust device removes F2 gas from the gas exhausted from the internal space of laser chamber 131 using a halogen filter, and releases the gas into the housing of gas laser apparatus 100.

[0033] The laser processing apparatus 300 mainly includes a laser processing processor 310, an optical system 330, a table 351, a moving stage 353, a housing 355, and a frame 357. The optical system 330, the table 351, and the moving stage 353 are arranged in the internal space of the housing 355. The housing 355 is fixed to the frame 357. An opening is formed in the housing 355, and the optical path pipe 500 is connected to this opening. Therefore, the internal space of the housing 355 communicates with the internal space of the optical path pipe 500.

[0034] The laser processing processor 310 is a processing device including a storage device 310a in which a control program is stored and a CPU 310b that executes the control program. The laser processing processor 310 is specially configured or programmed to execute various processes included in the present disclosure. The laser processing processor 310 controls several components of the laser processing apparatus 300. The laser processing processor 310 also controls the entire laser processing apparatus 300.

[0035] The optical system 330 includes high-reflection mirrors 331a, 331b, and 331c, an attenuator 333, a mask 335, and a transfer optical system 337. The high-reflection mirrors 331a, 331b, and 331c, the attenuator 333, the mask 335, and the transfer optical system 337 are each fixed to a holder (not shown), and are disposed at a predetermined position within a housing 355.

[0036] The high-reflection mirrors 331a, 331b, and 331c reflect the pulsed laser beam with high reflectance. The high-reflection mirrors 331a, 331b, and 331c are configured such that, for example, a transparent substrate made of synthetic quartz or calcium fluoride is coated with a reflective film that highly reflects the pulsed laser beam. The high-reflection mirror 331a reflects the pulsed laser beam incident from the gas laser device 100 toward the attenuator 333. The high-reflection mirror 331b reflects the pulsed laser beam from the attenuator 333 toward the high-reflection mirror 331c. The high-reflection mirror 331c reflects the pulsed laser beam toward the transfer optical system 337.

[0037] The attenuator 333 is disposed on the optical path between the high reflection mirror 331a and the high reflection mirror 331b. The attenuator 333 includes, for example, rotating stages 333a and 333b, and partial reflection mirrors 333c and 333d fixed to the rotating stages 333a and 333b. The rotating stages 333a and 333b are electrically connected to the laser processing processor 310 and rotate around the Y axis by a control signal from the laser processing processor 310. When the rotating stages 333a and 333b rotate, the partial reflection mirrors 333c and 333d also rotate. The partial reflection mirrors 333c and 333d are optical elements whose transmittances change depending on the angle of incidence of the pulsed laser light to the partial reflection mirrors 333c and 333d. The rotation angles of the partial reflection mirrors 333c and 333d around the Y axis are adjusted by rotating the rotation stages 333a and 333b so that the angles of incidence of the pulsed laser beams match each other and the transmittance of the partial reflection mirrors 333c and 333d becomes a desired transmittance. As a result, the pulsed laser beam from the high reflection mirror 331a is attenuated to a desired pulse energy and passes through the attenuator 333.

[0038] The mask 335 is disposed between the high-reflection mirror 331b and the high-reflection mirror 331c. The mask 335 is composed of, for example, a circular transmission hole through which a part of the pulsed laser light passes, and a light shielding plate where the transmission hole is located and which blocks the other part of the pulsed laser light. The shape of the transmission hole is not limited. The mask 335 has a variable mechanism capable of changing the size of the transmission hole, and can adjust the size of the transmission hole according to the size of the processed part to be formed on the workpiece 20. The pulsed laser light passes through the transmission hole, thereby forming a transfer pattern corresponding to the processed part. The transfer pattern is transferred to the workpiece 20, thereby forming a processed part having a circular cross section on the workpiece 20.

[0039] The transfer optical system 337 focuses the pulsed laser light on the workpiece 20 so that the transfer pattern is imaged at an imaging position located at a predetermined depth ΔZsf from the surface side of the workpiece 20. The transfer optical system 337 is configured by combining a plurality of lenses. The transfer optical system 337 is a reduction optical system that images a circular transfer pattern having a size smaller than the size of the transmission hole of the mask 335 at the imaging position. The magnification of the transfer optical system 337 is, for example, 1 / 10 to 1 / 5. Although the transfer optical system 337 is shown as an example of a combination lens, when one small circular transfer pattern is imaged near the optical axis of the transfer optical system 337, the transfer optical system 337 may be configured by a single lens.

[0040] The table 351 supports the workpiece 20. The main surface of the table 351 is positioned approximately perpendicular to the Z axis and is positioned approximately along the XY plane. Therefore, the front and back surfaces of the workpiece 20 are positioned approximately perpendicular to the Z axis and approximately along the XY plane.

[0041] The workpiece 20 is an object to be laser-processed by irradiation with pulsed laser light. Examples of the workpiece 20 include quartz glass. Examples of the workpiece 20 include materials containing carbon atoms, organic materials such as polyimide and fluororesin, composite materials of carbon fiber and resin (CFRP: Carbon Fiber Reinforced Plastics), and diamond. Examples of the workpiece 20 include wide band gap materials such as sapphire and SiC (silicon carbide), and transparent materials such as CaF2 crystals, MgF2 crystals, and glass materials.

[0042] The moving stage 353 is disposed on the bottom surface of the housing 355, and supports the table 351. The moving stage 353 is movable in the X direction, the Y direction, and the Z direction, and the position of the table 351 can be adjusted by the movement. Such a moving stage 353 is capable of adjusting the position of the workpiece 20 by moving the workpiece 20 via the table 351 so that the pulsed laser light emitted from the optical system 330 is irradiated onto the workpiece 20.

[0043] Nitrogen (N2) gas, which is an inert gas, flows constantly through the internal space of the housing 355 during operation of the laser processing system 10. The housing 355 is provided with an intake port 355a for sucking nitrogen gas into the housing 355 and an exhaust port 355b for exhausting nitrogen gas from the housing 355 to the outside. The intake port 355a and the exhaust port 355b are adapted to be connected to an intake pipe and an exhaust pipe (not shown). The intake port 355a and the exhaust port 355b are sealed by an O-ring (not shown) to prevent outside air from entering the housing 355 when the intake pipe and the exhaust pipe are connected. A nitrogen gas supply source 363 is connected to the intake port 355a. The housing 355 prevents impurities from entering the internal space of the housing 355 in which the workpiece 20 is placed. The nitrogen gas also flows through an optical path tube 500 that communicates with the housing 355. Optical path tube 500 is sealed by O-rings at the connecting portion with gas laser device 100 and at the connecting portion with laser processing device 300.

[0044] Figure 2 shows the spectrum waveform FR of the free running ArF excimer laser light in oxygen-free nitrogen gas. N2 Spectral waveform FR N2 The central wavelength of the pulsed laser beam is approximately 193.40 nm, and the spectral line width is approximately 450 pm at full width at half maximum (FWHM). It is known that oxygen has multiple absorption lines that are absorption bands that absorb pulsed laser light. If the spectral waveform FR N2 When a part of the absorption line of oxygen overlaps with the absorption line of oxygen, a part of the pulsed laser light is absorbed by oxygen at the overlapping part. This generates ozone from the oxygen, and the ozone absorbs another part of the pulsed laser light. When the absorption of the pulsed laser light occurs, the spectral waveform FR N2 The spectrum waveform FR where the absorption line of oxygen overlaps with the absorption line of oxygen air is the spectrum waveform FR N2 In comparison, a drop in the light intensity I occurs at multiple absorption lines. Here, the relative intensity on the vertical axis of FIG. 2 is a normalized value of the light intensity I.

[0045] For example, as described in Japanese Patent Laid-Open Publication No. 3-157917, the absorption lines in the wavelength range from 175 nm to 250 nm are due to the absorption transition of the Schumann-Runge band, and correspond to the absorption bands represented by the branches R(17), P(15), R(19), P(17), P(19), R(21), P(21), and R(23). As shown in FIG. 2, the spectral waveform FR of ArF excimer laser light is air At , the light intensity I falls off at the absorption lines corresponding to these branches.

[0046] As described above, if the wavelength of the pulsed laser light overlaps with the absorption line of oxygen in the atmosphere, the intensity of the pulsed laser light decreases, and there is a concern that the workpiece 20 may not be properly processed. However, in the comparative example, nitrogen gas flows into the internal space of the housing 355, oxygen is exhausted from the housing 355, and overlap between the wavelength of the pulsed laser light and the absorption line of oxygen is suppressed. This suppresses the generation of ozone, the absorption of the pulsed laser light by ozone, and the decrease in the intensity of the pulsed laser light due to absorption.

[0047] 2.2 Operation Next, the operation of the laser processing system 10 of the comparative example will be described.

[0048] In gas laser apparatus 100, before gas laser apparatus 100 emits laser light, the internal spaces of optical path pipes 147a, 171, 500 and the internal spaces of housings 145a, 151 are filled with purge gas from a purge gas supply source (not shown). Laser gas is supplied to the internal space of laser chamber 131 from a laser gas supply source (not shown). In laser processing apparatus 300, nitrogen gas flows in the internal space of housing 355.

[0049] Next, in the laser processing apparatus 300, the workpiece 20 is supported on the table 351 of the movable stage 353. The laser processing processor 310 sets, on the movable stage 353, coordinates X, Y, and Z of an initial irradiation position where the pulsed laser light is irradiated to form the processed portion. The initial irradiation position is an imaging position where the transfer pattern described above is imaged. As a result, the movable stage 353 moves to the set initial irradiation position.

[0050] When the movement of the moving stage 353 is completed, the laser processing processor 310 controls the gas laser device 100 so that the pulse laser light irradiated to the workpiece 20 has a desired fluence Fm required for laser processing. In controlling the gas laser device 100, the laser processing processor 310 first reads out the target pulse energy Et stored in the laser processing processor 310. The target pulse energy Et is a target value of the pulse energy required during laser processing. Next, the laser processing processor 310 transmits a signal indicating the read target pulse energy Et to the laser processor 190 of the gas laser device 100. When the laser processor 190 receives the signal indicating the target pulse energy Et, it sets the target pulse energy Et as the pulse energy Em required during laser processing. The target pulse energy Et may be stored in the storage device 190a of the laser processor 190.

[0051] Incidentally, the fluence F is the energy density of the pulsed laser light on the surface of the workpiece 20 irradiated with the pulsed laser light, and is defined by the following formula (1) when the optical loss of the optical system 330 is negligible. F = Et / S [mJ / cm 2 ] ···(1) In formula (1), S is the irradiation area of ​​the pulsed laser beam on the surface of the workpiece 20, and D is the irradiation spot diameter of the pulsed laser beam on the surface of the workpiece 20. S=π(D / 2) 2 [cm 2 ]

[0052] Therefore, the fluence Fm required for laser processing is defined by the following formula (2) based on formula (1), where the irradiation area of ​​the pulsed laser light during laser processing is Sm. Fm = Em / Sm [mJ / cm 2 ] ···(2) Therefore, the fluence Fm is determined from the pulse energy Em.

[0053] When the laser processor 190 receives a signal indicating the target pulse energy Et as described above, it sets the target pulse energy Et as the pulse energy Em. The laser processor 190 also closes the shutter 170 and operates the charger 141 so that the pulse energy becomes the pulse energy Em. The laser processor 190 also turns on the switch 143a of the pulse power module 143 by an internal trigger (not shown). As a result, the pulse power module 143 generates a pulsed high voltage from the electric energy held in the charger 141, and a high voltage is applied between the electrodes 133a and 133b. When a high voltage is applied between the electrodes 133a and 133b, the insulation between the electrodes 133a and 133b is broken down and a discharge occurs. The energy of this discharge causes the laser medium contained in the laser gas between the electrodes 133a and 133b to be excited, and emits spontaneous emission light when returning to the ground state. Part of this light is ultraviolet light, which passes through the window 139a. The transmitted light is reflected by the rear mirror 145. The light reflected by the rear mirror 145 propagates again from the window 139a into the internal space of the laser chamber 131. The light propagating into the internal space of the laser chamber 131 passes through the window 139b and proceeds to the output coupling mirror 147. A part of the light passes through the output coupling mirror 147 and the beam splitter 153 and is blocked by the shutter 170, and the remaining part of the light is reflected by the output coupling mirror 147, passes through the window 139b, and propagates into the internal space of the laser chamber 131. The light propagated into the internal space of the laser chamber 131 passes through the window 139a and proceeds to the rear mirror 145 as described above. In this way, light of a predetermined wavelength travels back and forth between the rear mirror 145 and the output coupling mirror 147. The light is amplified every time it passes through a discharge space in the internal space of the laser chamber 131, and laser oscillation occurs. Then, a portion of the laser light passes through output coupling mirror 147 as pulsed laser light and proceeds to beam splitter 153 .

[0054] A part of the pulsed laser light that has traveled to the beam splitter 153 is reflected by the beam splitter 153. The reflected pulsed laser light is received by the optical sensor 155, which measures the pulse energy E of the received pulsed laser light. The optical sensor 155 outputs a signal indicating data related to the measured pulse energy E to the laser processor 190. The laser processor 190 controls the charging voltage of the charger 141 so that the difference ΔE between the pulse energy E and the target pulse energy Et approaches 0. Specifically, the laser processor 190 controls the charging voltage so that the difference ΔE falls within an allowable range. When the difference ΔE falls within an allowable range, the laser processor 190 transmits a reception preparation completion signal to the laser processing processor 310 notifying that preparation for receiving the light emission trigger Tr of the pulsed laser light has been completed.

[0055] When the laser processing processor 310 receives the ready-to-receive signal, it controls the transmittance Tm of the attenuator 333 so that the pulsed laser light irradiated to the workpiece 20 has a fluence Fm required for laser processing.

[0056] When there is no optical loss in the optical system 330, the transmittance Tm is defined by the following formula (3). Tm = π(D / 2) 2 (F / Et) ···(3)

[0057] Therefore, when the irradiation spot diameter of the pulsed laser light on the surface of the workpiece 20 during laser processing is taken as D, the transmittance Tm during laser processing is defined by the following formula (4). Tm = π(D / 2) 2 (Fm / Em) ···(4)

[0058] When the pulse energy Em and the transmittance T are controlled as described above, the laser processing processor 310 transmits a light emission trigger Tr to the laser processor 190. As a result, when the laser processor 190 opens the shutter 170 in synchronization with the reception of the light emission trigger Tr, the pulsed laser light that has passed through the shutter 170 enters the laser processing device 300. This pulsed laser light is an ArF laser light that is ultraviolet light with a central wavelength of 193.4 nm.

[0059] The pulsed laser light incident on the laser processing apparatus 300 travels through a high-reflection mirror 331a, an attenuator 333, a high-reflection mirror 331b, a mask 335, and a high-reflection mirror 331c to a transfer optical system 337. The pulsed laser light transmitted through the transfer optical system 337 forms an image of the transfer pattern at the above-mentioned imaging position.

[0060] The workpiece 20 is irradiated with the pulsed laser light in accordance with a light emission trigger Tr defined by the repetition frequency f and the number of pulses P required for laser processing. When the irradiation of the pulsed laser light is continued, ablation occurs near the surface of the workpiece 20, causing defects. As a result, a processed portion is formed in the workpiece 20.

[0061] When another processed portion is to be formed after the processed portion is formed, the laser processing processor 310 sets, in the moving stage 353, the coordinates X, Y, and Z of the initial irradiation position where the pulsed laser light is irradiated to form the other processed portion. This causes the moving stage 353 to move to the set initial irradiation position. Laser processing is performed on the workpiece 20 at the coordinates. If no other processed portion is to be formed, the laser processing ends. This procedure is repeated until the laser processing of all processed portions is completed.

[0062] 2.3 Challenges In the laser processing apparatus 300 of the comparative example, the mask 335 causes a loss of the pulsed laser light, compared to when the mask 335 is not used. When this loss occurs, the energy density of the pulsed laser light irradiating the processing area of ​​the workpiece 20 decreases. When the energy density decreases, it may become difficult to form the processed portion when the workpiece 20 is hard.

[0063] Therefore, in the following embodiment, a laser processing system 10 and a laser processing method that can easily form a processed portion in a workpiece 20 are illustrated. In the embodiment, the processed portion is described as a through hole. In the present embodiment, the workpiece 20 may be a ceramic matrix composite material (CMC).

[0064] 3. Description of the laser processing system and laser processing method according to the first embodiment Next, a description will be given of the laser processing system 10 and the laser processing method according to the embodiment 1. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0065] 3.1 Configuration 3 is a schematic diagram showing an example of the overall schematic configuration of the laser processing system 10 of this embodiment. In the laser processing system 10 of this embodiment, the configurations of the gas laser device 100 and the optical path tube 500 are the same as those of the gas laser device 100 and the optical path tube 500 of the comparative example. The configuration of the laser processing device 300 of this embodiment is different from that of the laser processing device 300 of the comparative example, and in the optical system 330 of the laser processing device 300 of this embodiment, the high reflection mirror 331c, the mask 335, and the transfer optical system 337 are not arranged in the internal space of the housing 355, and the irradiation optical system 370 and the fθ lens 375 are arranged in the internal space of the housing 355.

[0066] The irradiation optical system 370 guides the pulsed laser light emitted from the gas laser device 100, which is an excimer laser device, to a part of the processing area, and moves the irradiation spot of the guided pulsed laser light in the in-plane direction of the projection plane of the processing area to irradiate the entire processing area with the pulsed laser light. The projection plane is a plane located on the XY plane when the processing area is viewed from the opposite direction to the traveling direction of the pulsed laser light to the processing area. Therefore, the projection plane is a plane located on the XY plane when the processing area is viewed from the back side of the workpiece 20 toward the front side of the workpiece 20 along the Z direction. In this embodiment, the front side of the workpiece 20 is approximately perpendicular to the Z axis, and the planar direction of the processing area is approximately perpendicular to the optical axis of the pulsed laser light. Therefore, the projection plane is approximately parallel to the processing area and is located opposite to it, and the in-plane direction of the projection plane is the in-plane direction of the processing area and is also perpendicular to the height direction. In the irradiation of the pulsed laser light in this embodiment, the pulsed laser light moves in the XY plane. Examples of such movement include movement of the pulsed laser light in the vertical and horizontal directions on the XY plane as described in the raster scan processing of the filling processing described later, and movement of the pulsed laser light so as to draw a circle on the XY plane as described in the hericado processing of the filling processing. The irradiation optical system 370 includes galvano scanners 371 and 373.

[0067] Galvano scanner 371 includes a driver 371a and a mirror 371b attached to the oscillation shaft of driver 371a and capable of oscillation around the oscillation shaft. Galvano scanner 373 has the same configuration as galvano scanner 371, and includes driver 373a and a mirror 373b attached to the oscillation shaft of driver 373a and capable of oscillation around the oscillation shaft.

[0068] The driving units 371a, 373a are motors or the like, and are electrically connected to the laser processing processor 310. The oscillation speed and oscillation angle of the oscillation axes of the driving units 371a, 373a are controlled by control signals from the laser processing processor 310. The oscillation axis of the driving unit 371a is perpendicular to the oscillation axis of the driving unit 373a.

[0069] The mirror 371b reflects the pulsed laser light from the high reflection mirror 331b toward the mirror 373b. The mirror 373b reflects the pulsed laser light from the mirror 371b toward the fθ lens 375. Since the mirrors 371b and 373b do not block the pulsed laser light like the mask 335, the loss of the pulsed laser light is suppressed compared to the case where the mask 335 is used. The orientations of the mirrors 371b and 373b are adjusted by the oscillation angle of the oscillation shafts of the drivers 371a and 373a. The adjustment of the orientation of the mirror 371b may be synchronized with the adjustment of the orientation of the mirror 373b. The speed of the mirrors 371b and 373b when they oscillate is adjusted by the oscillation speed when the oscillation shafts of the drivers 371a and 373a oscillate.

[0070] The galvano scanners 371, 373 as described above irradiate the surface of the workpiece 20 with the pulsed laser light while moving it in the X and Y directions by the mirrors 371b, 373b, and perform a filling process on the workpiece 20 by the movement and irradiation to form a processed portion. The filling process will be described later. In addition, during the movement and irradiation, the interval and moving speed of the irradiation line of the pulsed laser light irradiating the workpiece 20 are controlled by the orientation and speed of the mirrors 371b, 373b. The irradiation line is a line along which the irradiation spot of the pulsed laser light moves in the processing area of ​​the workpiece 20.

[0071] The fθ lens 375 is disposed on the optical path between the mirror 373b and the workpiece 20. The optical axis of the fθ lens 375 is located along the Z direction. The fθ lens 375 causes the pulsed laser light from the galvano scanner 373 to be incident on the processing area on the surface of the workpiece 20 along the optical axis of the fθ lens 375, and focuses the light on the processing area. Since the surface of the workpiece 20 in this embodiment is substantially orthogonal to the Z axis, the pulsed laser light is substantially perpendicularly incident on the processing area. In addition, the fθ lens 375 focuses the pulsed laser light on the processing area so that the irradiation spot diameter of the pulsed laser light on the processing area is smaller than the diameter of the processing part.

[0072] The irradiation spot diameter is preferably, for example, 30 μm or more and 2 mm or less. The pulse energy Em of the pulse laser light is preferably, for example, 0.1 mJ or more and 30 mJ or less. The laser processing processor 310 controls the interval between the irradiation lines of the pulse laser light and the moving speed of the pulse laser light by controlling the oscillation angle of the oscillation shaft of the driving units 371a and 373a and the oscillation speed when the oscillation shaft oscillates so that the amount of deviation between one irradiation spot and another irradiation spot adjacent to the irradiation spot is 0.5% or more and 100% or less of the irradiation spot diameter. When the amount of deviation is 0.5%, the adjacent irradiation spots almost overlap each other. When the amount of deviation is 100%, the outer edges of the adjacent irradiation spots overlap. In this way, at least a part of each irradiation spot of the pulse laser light irradiating the workpiece 20 overlaps with another irradiation spot adjacent to the irradiation spot.

[0073] Next, the filling process will be described.

[0074] The filling process is a process in which the pulsed laser light moves and irradiates the entire processing area in an in-plane direction to fill the entire area. In the filling process, the movement and irradiation of the pulsed laser light in the X and Y directions causes ablation in the processing area, resulting in defects. Next, the moving stage 353 moves in the Z direction, and the filling process is performed at each moved height position, causing ablation at each moved height position, resulting in defects. This forms a processed part. In the filling process, a pulsed laser light whose irradiation spot diameter in the processing area is smaller than the hole diameter of the processing part is used. In the filling process of this embodiment, the mirrors 371b and 373b do not block the pulsed laser light like the mask 335, so the reduction in the energy density of the pulsed laser light irradiating the processing area is suppressed compared to when the mask 335 is used. In the filling process, the pulsed laser light may move and irradiate at least a part of the entire processing area in an in-plane direction to fill the entire area.

[0075] Examples of fill processing include helical processing and raster scan processing, each of which will be described below.

[0076] FIG. 4 is a diagram for explaining helical cutting. FIG. 4 is a diagram of the cutting area 23 of the workpiece 20 viewed from the fθ lens 375 side. The dashed lines shown in FIG. 4 indicate a plurality of circular irradiation lines positioned at regular intervals in a generally concentric manner in the cutting area 23, and in helical cutting, the pulsed laser light is irradiated to each irradiation line. In FIG. 4, in order to clearly indicate the circular irradiation line positioned on the outermost side, the irradiation line is shifted to the inside of the cutting area 23. The inside of the irradiation line is the cutting area 23. Each arrow shown in FIG. 4 indicates the traveling direction of the pulsed laser light irradiating each irradiation line. In helical cutting, the pulsed laser light moves and irradiates the outermost irradiation line at least once, and then moves and irradiates the irradiation line that is the first innermost than the irradiation line at least once. The pulsed laser light gradually shifts the irradiation line to be irradiated to the inside, and moves and irradiates the innermost irradiation line last. Therefore, the irradiation spot of the pulsed laser light moves in the in-plane direction of the projection surface of the processing area 23, and irradiates the entire processing area 23. In this irradiation, at least a part of each irradiation spot of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot. Adjacent refers to the circumferential and radial directions of the irradiation line. Note that the pulsed laser light may move and irradiate each irradiation line in order from the innermost irradiation line to the outermost irradiation line. The number of irradiations on each irradiation line may be the same or different. For example, the number of irradiations may be increased or decreased as the irradiation line becomes more inner.

[0077] FIG. 5 is a diagram for explaining raster scan processing. FIG. 5 is a diagram of the processing area 23 viewed from the fθ lens 375 side. In raster scan processing, the pulsed laser light is moved linearly from the lower end to the upper end of the processing area 23 and irradiated from left to right. Each arrow in FIG. 5 indicates the traveling direction of the pulsed laser light irradiating each irradiation line. In FIG. 5, in order to clearly show the pulsed laser light irradiating the lowermost irradiation line and the uppermost irradiation line, the pulsed laser light is shifted to the inside of the processing area 23. The area between the irradiation lines is the processing area 23. In raster scan processing, the pulsed laser light moves and irradiates the lowermost irradiation line from left to right, and then moves and irradiates the irradiation line one line above the irradiation line from right to left. Next, the pulsed laser light moves and irradiates the irradiation line one line above the irradiation line from left to right. The pulsed laser light gradually shifts the irradiation line upward, and repeats the movement and irradiation to the left and right or right and left, and moves and irradiates the uppermost irradiation line last. Therefore, the irradiation spot of the pulsed laser light moves in the in-plane direction of the projection surface of the processing area 23, and irradiates the entire area of ​​the processing area 23. In this irradiation, at least a part of each irradiation spot of the pulsed laser light overlaps another irradiation spot adjacent to the irradiation spot. Adjacent refers to the left and right direction and the up and down direction of the irradiation line. Note that the pulsed laser light may move and irradiate each irradiation line in order from the uppermost irradiation line to the lowermost irradiation line, in the opposite manner to the above. Alternatively, the pulsed laser light may move and irradiate the irradiation line up and down from the left end to the right end or from the right end to the left end of the processing area 23.

[0078] 3.2 Operation Next, the operation of the laser processing processor 310 in this embodiment will be described.

[0079] Fig. 6 is a diagram showing a part of the control flowchart of the laser processing processor 310 of this embodiment. Fig. 7 is a diagram showing another part of the control flowchart. Fig. 8 is a diagram showing the remaining part of the control flowchart. The control flowchart of this embodiment includes steps SP11 to SP25, and shows a laser processing method for forming a processed portion in a processing area. In addition, in the following control flowchart, the laser processing method is explained using helical processing in which a pulsed laser beam moves and irradiates each irradiation line in order from the outermost irradiation line to the innermost irradiation line.

[0080] 6, the workpiece 20 is supported by the movable stage 353. The laser processing processor 310 receives a ready-to-receive signal from the laser processor 190. The shutter 170 is closed, and the pulsed laser light is not emitted from the gas laser device 100 and is not incident on the laser processing device 300.

[0081] (Step SP11) In this step, parameters are input from an input unit (not shown) to the storage device 310a of the laser processing processor 310. The parameters are, for example, a processing number M assigned to each processing area for forming each processed portion in the workpiece 20, a processing number Mmax which is the maximum number of the processing number M, position data of an initial irradiation position where the pulse laser light is first irradiated in each processing area for forming each processed portion, a thickness T of the workpiece 20, an irradiation diameter φ(M) of the pulse laser light, a change width Δφ of the irradiation diameter φ(M), and a change width ΔZ of the coordinate Z described later. For example, when there are three processed portions, processing numbers M1, M2, and M3 are assigned to the processing areas of the three processed portions, and the processing number Mmax is 3. Each processed portion is formed discontinuously from each other. Therefore, the processing areas forming each processed portion are also located discontinuously from each other. Although an example in which there are three processed portions has been described, the number of processed portions may be other than three. The initial irradiation position is an initial value indicating the position where the pulsed laser beam is first irradiated in each processing area, and is the processing start point in each processing area. The position data of the initial irradiation position includes the coordinate X(M), coordinate Y(M), and coordinate Z(M) of the initial irradiation position, and is set in each processing area. The coordinate X(M) and coordinate Y(M) may be the center position of the processing area. The irradiation diameter φ(M) will be described later.

[0082] The parameters may be input to a storage device other than the storage device 310a of the laser processing processor 310. The storage device is provided outside the laser processing processor 310 and is electrically connected to the laser processing processor 310. The storage device is, for example, a non-transitory recording medium, and is preferably a semiconductor recording medium such as a random access memory (RAM) or a read only memory (ROM), but may include any type of recording medium such as an optical recording medium or a magnetic recording medium. Note that a "non-transitory" recording medium includes all computer-readable recording media except for a transient, propagating signal, and does not exclude volatile recording media.

[0083] The input unit is operated, for example, by an operator who operates the laser processing system 10. The input unit is a general input device, for example, a keyboard, a pointing device such as a mouse, a button switch, a dial, etc. The operator may input parameters displayed on the display unit to the input unit while visually checking the display unit such as a monitor (not shown). The input unit may be used by the operator to input various commands for operating the laser processing system 10.

[0084] When the parameters are input to the storage device 310a of the laser processing processor 310, the laser processing processor 310 advances the control flow to step SP12.

[0085] (Step SP12) In this step, the laser processing processor 310 sets the first processing number M after the workpiece 20 is supported by the movable stage 353 to processing number M1. Therefore, in the following, after the workpiece 20 is supported by the movable stage 353, a processed part is first formed in the processing area with processing number M1, and thereafter, processed parts are formed in the processing areas with processing numbers M2, M3 in order. After setting the processing number M to processing number M1, the laser processing processor 310 advances the control flow to step SP13.

[0086] (Step SP13) In this step, the laser processing processor 310 reads out the coordinates X(M), Y(M), and Z(M) which are the position data of the initial irradiation position in the processing area of ​​the current processing number M from the storage device 310a, and moves the moving stage 353 to the coordinates X(M), Y(M), and Z(M). Note that if the coordinates X(M) and Y(M) are within the irradiation ranges of the galvano scanners 371 and 373, the laser processing processor 310 may only move the moving stage 353 to the coordinate Z(M) without moving it to the coordinates X(M) and Y(M). After moving the moving stage 353, the laser processing processor 310 advances the control flow to step SP14.

[0087] (Step SP14) In this step, the laser processing processor 310 reads out the irradiation diameter φ(M) from the storage device 310a, and sets the irradiation diameter φ to the read irradiation diameter φ(M). The irradiation diameter φ(M) is an initial value of the irradiation diameter, which is the diameter of the irradiation line along which the pulsed laser light moves initially after the workpiece 20 is supported by the moving stage 353 in order to perform the above-mentioned helical cutting in the cutting area of ​​the current cutting number M. In this control flow in which helical cutting is performed, the irradiation diameter φ(M) is the diameter of the outermost irradiation line. After setting the irradiation diameter φ(M), the laser processing processor 310 advances the control flow to step SP15.

[0088] (Step SP15) In this step, the laser processing processor 310 advances the control flow to step SP16 if the current irradiation diameter φ is greater than 0. If the irradiation diameter φ is equal to or less than 0, the laser processing processor 310 advances the control flow to step SP19 shown in FIG.

[0089] (Step SP16) In this step, the laser processing processor 310 controls the drive shafts of the drive units 371a, 373a of the galvano scanners 371, 373 to control the orientations of the mirrors 371b, 373b so that the pulsed laser light irradiates the processing start point of the processing area of ​​the current processing number M. The processing start point is the first irradiation position in the parameters described in step SP11, and is located on the outermost irradiation line described in step SP14. After controlling the orientations of the mirrors 371b, 373b, the laser processing processor 310 transmits a light emission trigger Tr to the laser processor 190. This opens the shutter 170, and the pulsed laser light enters the laser processing device 300 from the gas laser device 100 and irradiates the processing start point. After transmitting the light emission trigger Tr to the laser processor 190, the laser processing processor 310 advances the control flow to step SP17.

[0090] (Step SP17) In this step, the laser processing processor 310 controls the tilting speed of the mirrors 371b, 373b and the orientation of the mirrors 371b, 373b via the swing speed and swing angle of the swing shafts of the driving units 371a, 373a so that the pulsed laser light moves and irradiates the processing area of ​​the processing number M at least one revolution with the current irradiation diameter φ. In this step, the moving stage 353 does not move, so that the irradiation spot of the pulsed laser light only moves in the XY plane during irradiation, and the coordinate Z of the irradiation spot does not change. Incidentally, the optical axis of the fθ lens 375 is located along the Z direction, and the surface of the workpiece 20 is approximately perpendicular to the Z axis. Therefore, in this step, the pulsed laser light irradiates the processing area whose planar direction is approximately perpendicular to the optical axis of the pulsed laser light. When the pulsed laser light moves and irradiates at least one revolution, the laser processing processor 310 advances the control flow to step SP18.

[0091] (Step SP18) In this step, the laser processing processor 310 sets the irradiation diameter φ to a value obtained by subtracting the change width Δφ of the irradiation diameter from the current irradiation diameter φ. The change width Δφ is, for example, the difference between the diameter of the current irradiation line and the diameter of the irradiation line one line inward from the current irradiation line, and is also the interval between the two irradiation lines. The set irradiation diameter φ may be stored in the storage device 310a. After setting the irradiation diameter φ, the laser processing processor 310 returns the control flow to step SP15.

[0092] In this way, steps SP14 to SP18 are an irradiation process in which the pulsed laser light emitted from the gas laser device 100 is guided to a part of the processing area, and the irradiation spot of the guided pulsed laser light is moved in the in-plane direction of the projection surface of the processing area to irradiate the entire processing area with the pulsed laser light. Therefore, when the irradiation process of this embodiment is completed, all irradiation in the processing area is completed. In the irradiation process, at least a part of each irradiation spot of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot.

[0093] In addition, in the helical cutting in steps SP14 to SP18, the pulsed laser light moves and irradiates each of the irradiation lines at least once in order from the outermost irradiation line to the innermost irradiation line among the multiple irradiation lines at a certain coordinate Z. When the helical cutting is performed at a certain coordinate Z and the pulsed laser light is irradiated to the entire processing area at the certain coordinate Z so as to fill the entire processing area, the control flowchart proceeds from step SP15 to step SP19 shown in FIG.

[0094] The laser processing processor 310 may set the diameter of the innermost irradiation line as the irradiation diameter φ(M) in step SP14, and set the irradiation diameter φ to a value obtained by adding the change width Δφ of the irradiation diameter to the current irradiation diameter φ in step SP18. In this case, in the helical processing in steps SP14 to SP18, the pulsed laser light moves and irradiates each of the irradiation lines at least one revolution in order from the innermost irradiation line to the outermost irradiation line among the multiple irradiation lines at a certain coordinate Z.

[0095] Therefore, in the helical processing of steps SP14 to SP18, the pulsed laser light moves and irradiates a portion of the multiple concentric irradiation lines in the processing area at least once, and then moves and irradiates another portion of the multiple irradiation lines adjacent to the portion of the irradiation lines at least once.

[0096] Furthermore, the laser processing processor 310 may input the position of the lowermost irradiation line irradiated with the pulsed laser light in processing number M to the galvano scanners 371, 373 as the first irradiation line in the processing area of ​​processing number M in step SP14, and set the irradiation line to a value obtained by adding the change width of the irradiation line to the current irradiation line in step SP18. As a result, in steps SP14 to SP18, raster scan processing is performed in which the pulsed laser light moves and irradiates each irradiation line in order from the lower irradiation line to the upper irradiation line at a certain coordinate Z.

[0097] Next, steps SP19 to SP21 will be described with reference to FIG.

[0098] (Step SP19) In this step, the laser processing processor 310 reads out the thickness T from the storage device 310a, and if the current coordinate Z is smaller than the sum of the coordinate Z(M) and the thickness T, the control flow proceeds to step SP20. If the current coordinate Z is larger than the sum of the coordinate Z(M) and the thickness T, the laser processing processor 310 proceeds to step SP22 shown in FIG.

[0099] (Step SP20) In this step, the laser processing processor 310 reads out the change amount ΔZ from the storage device 310a, and sets the coordinate Z to a value obtained by adding the change amount ΔZ of the coordinate Z to the current coordinate Z. The set coordinate Z may be stored in the storage device 310a. After setting the coordinate Z, the laser processing processor 310 advances the control flow to step SP21.

[0100] (Step SP21) In this step, the laser processing processor 310 moves the moving stage 353 to the coordinate Z set in step SP20. Therefore, this step is a moving process for moving the workpiece 20 in the height direction of the workpiece 20. The height direction is the direction along the optical axis direction of the pulsed laser light. In addition, the moving direction of the workpiece 20 is the opposite direction to the traveling direction of the pulsed laser light traveling from the fθ lens 375 to the workpiece 20. After moving the moving stage 353, the laser processing processor 310 returns the control flow to step SP14 shown in FIG. 6.

[0101] In steps SP19 to SP21, if the current coordinate Z is smaller than the sum of the coordinate Z(M) and the thickness T, the laser processing processor 310 moves the moving stage 353 upward in the Z direction toward the fθ lens 375 by the change width ΔZ, and moves the irradiation position of the pulsed laser light in the Z direction of the workpiece 20 from the front side to the back side of the workpiece 20 by the change width ΔZ. When the control flow returns to step SP14 and proceeds to steps SP15 to SP18, the irradiation spot of the pulsed laser light moves in the in-plane direction of the projection plane of the processing area at the coordinate Z after the movement, and the pulsed laser light performs helical processing in the processing area at the coordinate Z after the movement. Therefore, the irradiation steps of steps SP14 to SP18 are performed at multiple height positions of the workpiece 20 that moves in the height direction of the workpiece 20 before and after the movement step of step SP21. The irradiation step and the movement step are alternately repeated until one processing portion is formed. Between steps SP19 and SP21, between steps SP21 and SP14 when the control flow returns from step SP21 to step SP14, and between steps SP14 and SP16, the laser processing processor 310 may stop the progression of the pulsed laser light from the gas laser apparatus 100 to the laser processing apparatus 300 as in step SP22 described below. Therefore, when the irradiation step and the movement step are alternately repeated, step SP22, which is a pause step for pausing the irradiation of the pulsed laser light, is provided between the irradiation step and the movement step.

[0102] Incidentally, in step SP19, if the current coordinate Z is greater than the sum of the coordinate Z(M) and the thickness T, then helical machining is performed at each coordinate Z shifted by the change width ΔZ, and a machined portion is formed in the machining area of ​​the current machining number M. Therefore, the laser machining processor 310 advances the control flow from step SP19 to step SP22 shown in FIG. 8 in order to form another machined portion.

[0103] Next, steps SP22 to SP25 will be described with reference to FIG.

[0104] (Step SP22) In this step, the laser processing processor 310 stops the progression of the pulsed laser light from the gas laser apparatus 100 to the laser processing apparatus 300. In this case, the laser processing processor 310 may output a signal to the laser processor 190 to close the shutter 170 via the laser processor 190, or may stop the charger 141 and turn off the switch 143a of the pulsed power module 143. When the laser processing processor 310 stops the progression of the pulsed laser light, it advances the control flow to step SP23.

[0105] (Step SP23) In this step, the laser processing processor 310 sets the processing number M to a value obtained by adding 1 to the current processing number M, and advances the control flow to step SP24. The set processing number M may be stored in the storage device 310a.

[0106] (Step SP24) In this step, the laser processing processor 310 reads out the processing number Mmax from the storage device 310a, and if the processing number M to which 1 has been added in step SP23 is greater than the processing number Mmax, it means that all the processed portions have been formed, and so the control flow ends. Also, if the processing number M to which 1 has been added in step SP23 is equal to or less than the processing number Mmax, the laser processing processor 310 advances the control flow to step SP25.

[0107] (Step SP25) In this step, the laser processing processor 310 initializes the current coordinate Z, and returns the control flow to step SP13 shown in FIG. 6. In the initialization, the laser processing processor 310 sets the coordinate Z to the coordinate Z(M). In step SP13, the laser processing processor 310 moves the moving stage 353 to the coordinate X(M), coordinate Y(M), and coordinate Z(M) in the processing area of ​​the processing number M to which 1 was added in step SP23. In step SP23, the progression of the pulsed laser light to the laser processing device 300 is stopped, so that the pulsed laser light is not irradiated to the workpiece 20 during the movement of the moving stage 353. When the control flow returns to step SP13 and proceeds to step SP22 again, a processed part is formed in the processing area of ​​the processing number M to which 1 was added in step SP23. Therefore, step SP22, which is a pause step for pausing the irradiation of the pulsed laser light, is provided between the formation of the processed part and the formation of another processed part after the formation of the processed part.

[0108] 3.3 Actions and Effects In the laser processing method of the present embodiment, a processed portion is formed in a processing area of ​​a workpiece 20 by irradiating the processing area with pulsed laser light. The laser processing method includes steps SP14 to SP18, which are irradiation steps in which a pulsed laser light emitted from a gas laser device 100, which is an excimer laser device, is guided to a part of the processing area, and an irradiation spot of the guided pulsed laser light is moved in an in-plane direction of a projection surface of the processing area to irradiate the entire processing area with the pulsed laser light, and step SP21, which is a moving step in which the workpiece 20 is moved in the height direction of the workpiece 20. The irradiation step is performed at a plurality of height positions of the workpiece 20 that is moved in the height direction by the moving step. In addition, in the irradiation step, at least a part of each irradiation spot of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot.

[0109] In the irradiation step, when at least a part of each irradiation spot overlaps with another irradiation spot adjacent to the irradiation spot, and the pulse laser light irradiates the entire area of ​​the processing area, a filling process is performed at a certain coordinate Z. In addition, in the irradiation step after the workpiece 20 moves in the height direction in the movement step, the pulse laser light irradiates the entire area of ​​the processing area at a coordinate Z different from the above coordinate Z, and a filling process is performed at the other coordinate Z. By such movement of the workpiece 20 and irradiation of the pulse laser light at a plurality of height positions, a processed portion is formed. In the laser processing method of this embodiment, the mask 335 is not used, and the pulse laser light is irradiated. Therefore, in the laser processing method of this embodiment, compared to the case where the mask 335 is used, the occurrence of loss of the pulse laser light is suppressed, and the decrease in the energy density of the pulse laser light irradiating the processing area can be suppressed. When the decrease in energy density is suppressed, compared to the case where the mask 335 is used, the processed portion can be easily formed in the workpiece 20 even if the workpiece 20 is a hard material such as CMC. In addition, when an excimer laser device is used, the wavelength of the pulsed laser light is shorter and the pulse energy is higher than when an excimer laser device is not used, so the divergence angle of the pulsed laser light is suppressed. When the divergence angle is suppressed, the focal depth in the workpiece 20 is deeper, and the laser processing method can be performed on a workpiece 20 having deep recesses on the surface of the workpiece 20, a workpiece 20 having high protrusions on the surface of the workpiece 20, and a thick workpiece 20.

[0110] Moreover, in the laser processing method of the present embodiment, the pulsed laser light is irradiated without using the transfer optical system 337. Therefore, blurring of the transfer pattern does not occur, the spread of the irradiation area of ​​the irradiation spot of the pulsed laser light is suppressed, and the decrease in the energy density irradiating the processing area can be suppressed.

[0111] In addition, in the irradiation process of this embodiment, the pulsed laser light moves and irradiates some of the multiple concentric irradiation lines in the processing area at least once, and then moves and irradiates another part of the multiple irradiation lines at least once. Therefore, in this irradiation process, helical processing is performed. For example, when a circular hole is to be formed as the processed part, helical processing is easier to form a circular hole than raster scan processing. Also, for example, when the processed part is ring-shaped, helical processing is easier to form the processed part than raster scan processing. Note that, for example, when the processed part is a rectangular hole, raster scan processing is easier to form a rectangular hole than helical processing.

[0112] In the laser processing method of this embodiment, the irradiation step and the movement step are alternately repeated until one processed portion is formed. In this case, until a processed portion is formed in the current processing area, it may become unnecessary to move the moving stage 353 in the X and Y directions for irradiating another processing area with the pulsed laser light. When it becomes unnecessary to move the moving stage 353, the load on the laser processing processor 310 may be reduced compared to the case where the moving stage 353 moves in the X and Y directions.

[0113] The control flowchart of the laser processing processor 310 of this embodiment is not limited to the above, and modified examples of the control flowchart of the laser processing processor 310 will be described below. Fig. 9 is a diagram showing a part of the control flowchart of the laser processing processor 310 of this modified example. Fig. 10 is a diagram showing another part of the control flowchart of the laser processing processor 310 of this modified example.

[0114] As shown in FIG. 9, the control flowchart of this modified example differs from the control flowchart of the first embodiment in that it includes steps SP31 and SP32 between steps SP14 and SP15.

[0115] As shown in FIG. 9, the laser processing processor 310 of this modified example sets the irradiation diameter φ to the irradiation diameter φ(M) in step SP14, and then advances the control flow to step SP31.

[0116] (Step SP31) In this step, the laser processing processor 310 sets the current number of repetitions N to the number of repetitions N1, and advances the control flow to step SP32. The number of repetitions N is the number of times that the moving stage 353 is moved upward in the Z direction from the coordinate Z(M) in step SP13.

[0117] (Step SP32) In this step, the laser processing processor 310 moves the moving stage 353 upward in the Z direction from the coordinate Z(M) in step SP13, and moves the irradiation position of the pulsed laser light in the Z direction of the workpiece 20 from the front side to the back side of the workpiece 20. Therefore, this step is a moving process of moving the workpiece 20 in the height direction of the workpiece 20. The laser processing processor 310 may move the moving stage 353 at a constant speed, or may move it at an accelerated speed. After moving the moving stage 353, the laser processing processor 310 advances the control flow to step SP15.

[0118] In step SP15, if the current irradiation diameter φ is greater than 0, the laser processing processor 310 advances the control flow to step SP16. The control flow after step SP16 includes steps SP17 to SP18 described in the first embodiment, and is not shown in FIG. 9 and will not be described below. As with the irradiation process in the first embodiment, when the irradiation process in the present embodiment, which is steps SP14 to SP18, is completed, all irradiations in the processing area are completed. In the irradiation process, as described in step SP32, which is the moving process, the workpiece 20 moves in the height direction. Therefore, the irradiation process is performed at multiple height positions of the moving workpiece 20. In step SP15, if the irradiation diameter φ is equal to or less than 0, the laser processing processor 310 advances the control flow to step SP33 shown in FIG. 10.

[0119] As shown in FIG. 10, the control flowchart of this modified example differs from the control flowchart of the first embodiment in that it includes steps SP33 to SP35 instead of steps SP19 to SP21.

[0120] (Step SP33) In this step, the laser processing processor 310 reads the maximum number of repetitions Nmax from the storage device 310a, and if the current number of repetitions N is equal to or greater than the maximum number of repetitions Nmax, the control flow proceeds to step SP22 shown in FIG. 8. When the control flow proceeds to step SP22, the moving stage 353 moves by the number of repetitions N while performing helical cutting, and a processed portion is formed in the processing area of ​​the current processing number M. Therefore, the laser processing processor 310 advances the control flow from step SP33 to step SP22 shown in FIG. 8 in order to form another processed portion. The maximum number of repetitions Nmax is stored as a parameter in the storage device 310a in step SP11. In the control flow chart of this modification, step SP25 shown in FIG. 8 is unnecessary, and in step SP24 shown in FIG. 8, the laser processing processor 310 returns the control flow to step SP13 shown in FIG. 9 if the processing number M obtained by adding 1 in step SP23 is equal to or less than the processing number Mmax.

[0121] Also, in this step, if the current number of repetitions N is smaller than the maximum number of repetitions Nmax, the laser processing processor 310 advances the control flow to step SP34.

[0122] (Step SP34) In this step, the laser processing processor 310 reads out the irradiation diameter φ(M) from the storage device 310a and sets the irradiation diameter φ to the read-out irradiation diameter φ(M). After setting the irradiation diameter φ(M), the laser processing processor 310 advances the control flow to step SP35.

[0123] (Step SP35) The laser processing processor 310 sets the number of repetitions N to a value obtained by adding 1 to the current number of repetitions N, and returns the control flow to step SP32 shown in Fig. 9. The set number of repetitions N may be stored in the storage device 310a. In the control flowchart of this modification, the irradiation diameter is reduced Nmax times for the moving stage 353 moving in the Z direction, and processing is repeated.

[0124] In the control flow chart of the first embodiment, after the helical cutting is performed at a certain coordinate Z, the moving stage 353 moves in the Z direction, and the helical cutting is performed at another coordinate Z. That is, the irradiation process and the moving process are alternately repeated until one workpiece is formed. On the other hand, in the control flow chart of the present modification, in steps SP14, SP31, SP32, SP15 to SP18, and SP33 to SP35, the moving stage 353 moves in the Z direction until the current number of repetitions N is equal to or greater than the maximum number of repetitions Nmax, and the helical cutting is performed during this movement. Therefore, in the control flow chart of the present modification, the moving process is performed during the irradiation process. In this case, the time required to form one workpiece may be shorter than when the irradiation process and the moving process are alternately repeated.

[0125] 4. Description of the laser processing system and the laser processing method according to the second embodiment Next, a description will be given of a laser processing system 10 and a laser processing method according to embodiment 2. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0126] 4.1 Configuration 11 is a schematic diagram showing an example of the overall schematic configuration of the laser processing system 10 of this embodiment. In the laser processing device 300 of this embodiment, the configuration of the table 351 is different from the configuration of the table 351 of embodiment 1. In addition, the laser processing device 300 of this embodiment further includes a height measuring device 379 that is disposed in the internal space of the housing 355 and is electrically connected to the laser processing processor 310.

[0127] The table 351 is positioned at an incline with respect to the XY plane. Therefore, the front and back surfaces of the workpiece 20 are inclined to the Z axis and are positioned at an incline with respect to the XY plane. Therefore, the projection plane of this embodiment faces the processing area but is not parallel, and the in-plane direction of the projection plane is inclined to the in-plane direction of the processing area. The inclination angle of the workpiece 20 formed between the back surface of the workpiece 20 and the XY plane is defined as the inclination angle θ.

[0128] The height measuring device 379 includes a measuring member (not shown) that can move along the Z direction. The measuring member is, for example, a metal rod-shaped member, but is not particularly limited thereto. The height measuring device 379 is electrically connected to the laser processing processor 310, and can move in the X direction, the Y direction, and the Z direction under the control of the laser processing processor 310. When the end of the measuring member comes into contact with the center position of the processing area of ​​the workpiece 20 tilted by the table 351 due to the movement of the height measuring device 379, the height measuring device 379 transmits a signal indicating the coordinate Z of the contact portion to the laser processing processor 310. Note that the contact position is not particularly limited as long as it is within the processing area. When the laser processing processor 310 receives the signal, it stores the coordinate Z indicated by the signal in the storage device 310a.

[0129] 4.2 Operation Next, the operation of the laser processing processor 310 in this embodiment will be described.

[0130] Fig. 12 is a diagram showing a part of a control flowchart of the laser processing processor 310 of this embodiment. As shown in Fig. 12, the control flowchart of this embodiment differs from the control flowchart of embodiment 1 in that step SP41 is included between step SP11 and step SP12.

[0131] In step SP11, when parameters are input to the storage device 310a of the laser processing processor 310, the laser processing processor 310 advances the control flow to step SP41. Note that in step SP11 of the first embodiment, the coordinate Z(M) of the initial irradiation position is input as part of the parameters, whereas in step SP11 of the present embodiment, the coordinate Z(M) is recorded in the height recording process of step SP41. For this reason, in step SP11 of the present embodiment, the coordinate Z(M) is input as 0.

[0132] (Step SP41) In this step, the laser processing processor 310 proceeds to height recording processing. When the height recording processing ends, the laser processing processor 310 advances the control flow to step SP12.

[0133] Fig. 13 is a control flowchart of the height recording process of the laser processing processor 310. As shown in Fig. 13, the control flowchart of the height recording process includes steps SP51 to SP56.

[0134] (Step SP51) In this step, the laser processing processor 310 sets the first processing number M to M1 after the workpiece 20 is supported by the moving stage 353. After setting the processing number M to the processing number M1, the laser processing processor 310 advances the control flow to step SP52.

[0135] (Step SP52) In this step, the laser processing processor 310 reads out the processing number Mmax from the storage device 310a, and if the current processing number M is greater than the processing number Mmax, the control flow in the height recording process ends since the coordinate Z of each processed portion has been input, and the control flow proceeds to step SP12 shown in Fig. 12. Also, if the current processing number M is equal to or less than the processing number Mmax, the laser processing processor 310 proceeds to step SP53.

[0136] (Step SP53) In this step, the laser processing processor 310 reads out the position data of the first initial irradiation position in the processing area of ​​the current processing number M from the storage device 310a, and moves the moving stage 353 to the coordinate X(M), coordinate Y(M), and coordinate Z(M). This position data is the position data input in step SP11. In this step, the coordinate Z(M) is 0. After moving the moving stage 353, the laser processing processor 310 advances the control flow to step SP54.

[0137] (Step SP54) In this step, the laser processing processor 310 brings the end of the measurement member of the height measuring instrument 379 into contact with the processing area of ​​the current processing number M, and receives a signal indicating the height position, which is the coordinate Z of the contact portion, from the height measuring instrument 379. Therefore, this step is a measurement process in which the height position is measured by the height measuring instrument 379. The coordinate Z is the height position of the first irradiation position of the processing area of ​​the current processing number M. Once the coordinate Z has been measured, the control flow proceeds to step SP55.

[0138] (Step SP55) In this step, the laser processing processor 310 stores the measured coordinate Z in the storage device 310a as part of the parameters in step SP11. After storing the coordinate Z, the laser processing processor 310 advances the control flow to step SP56.

[0139] (Step SP56) In this step, the laser processing processor 310 adds 1 to the current processing number M, and returns the control flow to step SP52.

[0140] When the coordinate Z of the first irradiation position of each processing area is measured and stored in steps SP51 to SP56, the control flow proceeds from step SP52 to step SP12 shown in Fig. 12. In this way, the height measurement and storage process including the measurement step is performed before the irradiation step.

[0141] Next, returning to FIG. 12, the description of the control flowchart shown in FIG. 12 will be continued.

[0142] In step SP13 of this embodiment, similarly to step SP13 of embodiment 1, the laser processing processor 310 reads out the position data of the first irradiation position in the processing area of ​​processing number M, and moves the moving stage 353 to the coordinate X(M), coordinate Y(M), and coordinate Z(M). The coordinate X(M) and coordinate Y(M) of this embodiment are input as parameters in step SP11, similarly to the coordinate X(M) and coordinate Y(M) of embodiment 1. On the other hand, the coordinate Z(M) of this embodiment is a coordinate measured in step SP54, unlike embodiment 1, which was input as a parameter in step SP11. Step SP13 of this embodiment is a moving step in which the workpiece 20 is moved to the height position measured in the measuring step.

[0143] In step SP15 of this embodiment, if the current irradiation diameter φ is greater than 0, the laser processing processor 310 advances the control flow to steps SP16 to SP18. As described above, the front and back surfaces of the workpiece 20 in this embodiment are inclined to the Z axis and inclined to the XY plane. Therefore, in step SP17, the pulsed laser light is irradiated to the processing area whose planar direction is inclined to the optical axis of the pulsed laser light. In this case, the focusing position of the pulsed laser light is located between the upper end and the lower end of the processing area in the height direction of the workpiece 20. The focusing position is located approximately halfway between the upper end and the lower end.

[0144] In step SP15, if the irradiation diameter φ is equal to or smaller than 0, the laser processing processor 310 advances the control flow to step SP42 shown in FIG.

[0145] 14 is a diagram showing another part of the control flowchart of the laser processing processor 310 of the present embodiment. The control flowchart of the present embodiment differs from the control flowchart of the first embodiment in that it includes step SP42 instead of step SP19.

[0146] (Step SP42) The thickness of the workpiece 20 is T, and the workpiece 20 in this embodiment is inclined with respect to the XY plane. As described above, if the inclination angle of the workpiece 20 formed between the back surface of the workpiece 20 and the XY plane is the inclination angle θ, the length of the inclined workpiece 20 in the Z direction is T / cosθ. For example, the thickness T is about 2 mm, and the inclination angle θ is about 60°, but is not limited thereto. In this step, if the current coordinate Z is smaller than the sum of the coordinate Z(M) and T / cosθ, the laser processing processor 310 advances the control flow to step SP20, step SP21, and step SP14 shown in FIG. 12 in that order. Also, if the current coordinate Z is equal to or greater than the sum of the coordinate Z(M) and T / cosθ, the laser processing processor 310 advances the control flow to step SP22 shown in FIG. 8.

[0147] 4.3 Actions and Effects In the irradiation step of the laser processing method of this embodiment, the pulsed laser beam is irradiated onto the processing area whose planar direction is inclined to the optical axis of the pulsed laser beam. This allows the processed portion to be formed in a state in which it is inclined to the optical axis of the pulsed laser beam and the thickness direction of the workpiece 20.

[0148] In the irradiation step of the laser processing method of the present embodiment, the focusing position of the pulsed laser light is located between the upper end and the lower end in the height direction of the workpiece 20 within the processing area. This allows the pulsed laser light to irradiate the workpiece 20 even if the workpiece 20 is positioned in a state inclined with respect to the optical axis of the pulsed laser light.

[0149] Note that the laser processing method of this embodiment may include steps SP31 and SP32 between steps SP14 and SP15, and may include steps SP33 to SP35 instead of steps SP42, SP20, and SP21, and may omit step SP25, as in the laser processing method of the modified example of embodiment 1. Therefore, in the laser processing method of this embodiment, the moving step may be performed during the irradiation step.

[0150] 5. Description of the laser processing system and the laser processing method according to the third embodiment Next, a description will be given of a laser processing system 10 and a laser processing method according to embodiment 3. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0151] 5.1 Configuration The configuration of the laser processing apparatus 300 of this embodiment is similar to the configuration of the laser processing apparatus 300 of the second embodiment, and therefore a description thereof will be omitted.

[0152] 5.2 Operation Next, the operation of the laser processing processor 310 in this embodiment will be described.

[0153] 15 is a diagram showing a part of a control flowchart of the laser processing processor 310 of this embodiment. The control flowchart of this embodiment differs from the control flowchart of embodiment 2 in that it includes step SP61 instead of step SP17. Therefore, the irradiation step of this embodiment includes steps SP14 to SP16, step SP61, and step SP18.

[0154] (Step SP61) In this step, the laser processing processor 310 moves and irradiates the pulsed laser light at least one revolution, and moves the workpiece 20 back and forth in the Z direction via the moving stage 353 in synchronization with the position of the irradiation spot of the pulsed laser light on the workpiece 20. FIGS. 16 to 18 are diagrams for explaining this step, and the movement and irradiation of the pulsed laser light are indicated by broken lines in FIGS. 16, 17, and 18. As shown in FIGS. 16 to 18, the laser processing processor 310 moves the workpiece 20 back and forth in the height direction via the moving stage 353 in synchronization with the position of the irradiation spot in the in-plane direction so that the diameter of the irradiation spot of the pulsed laser light focused on the processing area of ​​the workpiece 20 moving in the height direction does not change substantially in the processing area. In this case, the distance in the Z direction between the fθ lens 375 and the irradiation spot of the pulsed laser light on the workpiece 20 is substantially constant. This step as described above is part of the irradiation process and part of the movement process, and part of the movement process in this embodiment is performed during the irradiation process. The irradiation process is performed at a plurality of height positions of the reciprocating workpiece 20. When the pulsed laser light has moved and irradiated at least one revolution and the moving stage 353 has moved back and forth in the Z direction, the laser processing processor 310 advances the control flow to step SP18. When the control flow advances from step SP18 to step SP15 to step SP42, all irradiations in the processing area have been completed, and the irradiation process has ended.

[0155] 5.3 Actions and Effects In the laser processing method of this embodiment, the moving step is performed during the irradiating step, and in the moving step, the workpiece 20 is moved in the height direction in synchronization with the position of the irradiation spot in the in-plane direction so that the diameter of the irradiation spot of the pulsed laser light focused on the processing area moving in the height direction in the moving step does not change substantially in the irradiating step. Therefore, even if the workpiece 20 is tilted, the pulsed laser light is focused on the processing area of ​​the tilted workpiece 20, and the change in the diameter of the irradiation spot can be suppressed. When the change in the diameter of the irradiation spot is suppressed, even if the workpiece 20 is tilted, the decrease in the energy density of the pulsed laser light in the processing area is suppressed, and the processed portion can be easily formed on the workpiece 20 compared to the case where the energy density decreases.

[0156] 6. Description of the laser processing system and the laser processing method according to the fourth embodiment Next, a description will be given of a laser processing system 10 and a laser processing method according to embodiment 4. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0157] 6.1 Configuration The configuration of the laser processing system 10 of this embodiment is similar to the configuration of the laser processing system 10 of the first embodiment, and therefore a description thereof will be omitted.

[0158] 6.2 Operation In the laser processing method of this embodiment, an irradiation step and a moving step are performed alternately on each processing area. The operation of the laser processing processor 310 in this embodiment will be described below.

[0159] The laser processing processor 310 of this embodiment performs helical cutting on a processing area of ​​processing number M1 at a certain coordinate Z, as shown in Fig. 19. Next, at the coordinate Z where helical cutting was performed on the processing area of ​​processing number M1, as shown in Fig. 20, it performs helical cutting on a processing area of ​​processing number M2. Next, at the coordinate Z where helical cutting was performed on the processing area of ​​processing number M1, it performs helical cutting on a processing area of ​​processing number M3, as shown in Fig. 21. Therefore, the laser processing processor 310 performs helical cutting on each processing area in the order of processing numbers M1, M2, and M3 without changing the coordinate Z.

[0160] 21, when the laser processing processor 310 performs helical cutting on the processing area with processing number M3, it sets the coordinate Z to a value obtained by adding the change width ΔZ of the coordinate Z to the current coordinate Z, moves the moving stage 353 to the set coordinate Z, and performs helical cutting on each of the processing areas in the order of processing numbers M1, M2, and M3 in the same manner as described above at the set coordinate Z. By repeating the above, the pulsed laser light is irradiated onto each processing area, and a processed portion is formed in each processing area by the irradiation of the pulsed laser light.

[0161] Therefore, in the irradiation process performed on each processing area at a certain coordinate Z, after all irradiations in a part of the processing areas among the multiple processing areas are completed, the irradiation process is performed in the other part of the multiple processing areas. After the irradiation process in the other part of the processing areas is performed, the moving process is performed. After the moving process, the coordinate Z is changed and the above-mentioned irradiation process is performed. In this way, the irradiation process and the moving process are repeated.

[0162] 6.3 Actions and Effects In the laser processing method of this embodiment, in the irradiation process performed on each processing area, after all irradiations in a part of the multiple processing areas are completed, the irradiation process is performed in another part of the multiple processing areas.

[0163] In the above, the processing area irradiated with the pulsed laser light changes for each irradiation step. When the processing area changes, heat concentration in the processing area due to the irradiation with the pulsed laser light is suppressed, and localized heat generation in the workpiece 20 can be suppressed.

[0164] In addition, in the laser processing method of the present embodiment, the irradiation step and the moving step are performed alternately in each processing area. This reduces the number of moving steps compared to the case where the irradiation step and the moving step are repeated in one processing area, and can reduce the load on the laser processing processor 310.

[0165] 7. Description of the laser processing system and the laser processing method according to the fifth embodiment Next, a description will be given of a laser processing system 10 and a laser processing method according to embodiment 5. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0166] 7.1 Configuration The configuration of the laser processing system 10 of this embodiment is similar to the configuration of the laser processing system 10 of the first embodiment, and therefore a description thereof will be omitted.

[0167] 7.2 Operation In the laser processing method of this embodiment, the irradiation process and the moving process are alternately performed in each processing area, similarly to the laser processing method of embodiment 4. Note that the irradiation process of this embodiment has a different order of irradiation from the irradiation process of embodiment 4. The operation of the laser processing processor 310 in this embodiment will be described below.

[0168] In the laser processing processor 310 of this embodiment, as shown in FIG. 22, in helical cutting, the pulsed laser light is moved and irradiated at least one revolution at the coordinate Z of the processing area of ​​the processing number M1 with the irradiation diameter φ. Next, as shown in FIG. 23, in helical cutting, the laser processing processor 310 moves and irradiates at least one revolution to the processing area of ​​the processing number M2 with the same coordinate Z and irradiation diameter φ as the processing area of ​​the processing number M1. Next, as shown in FIG. 24, in helical cutting, the laser processing processor 310 moves and irradiates at least one revolution to the processing area of ​​the processing number M3 with the same coordinate Z and irradiation diameter φ as the processing number M1. Therefore, the laser processing processor 310 moves and irradiates the pulsed laser light to each processing area in the order of the processing numbers M1, M2, and M3 without changing the coordinate Z and irradiation diameter φ.

[0169] Next, the laser processing processor 310 sets the irradiation diameter φ to a value obtained by subtracting the change width Δφ of the irradiation diameter from the current irradiation diameter φ. As shown in FIG. 25, the laser processing processor 310 moves and irradiates the pulsed laser light to the processing area of ​​the processing number M1 without changing the coordinate Z at the set irradiation diameter φ in the helical cutting. Next, although not shown, the laser processing processor 310 moves and irradiates the pulsed laser light to each processing area in the order of the processing areas of the processing numbers M2 and M3 without changing the coordinate Z at the set irradiation diameter φ. Therefore, by repeating the above, the laser processing processor 310 performs helical cutting on each processing area in the order of the processing areas of the processing numbers M1, M2, and M3 without changing the coordinate Z.

[0170] By repeating the above, the pulsed laser light is irradiated onto each processing area, and a processed portion is formed in each processing area by the irradiation of the pulsed laser light.

[0171] In this way, in the irradiation process performed on each processing area, the irradiation process in some of the processing areas is performed after the irradiation in the irradiation process in the other processing areas of the multiple processing areas is stopped midway. Therefore, the irradiation process in some of the processing areas is performed before all of the irradiation in the irradiation process in the other processing areas is completed. Also, the irradiation process in the other processing areas is performed after the irradiation process in the some processing areas is stopped midway. Therefore, the irradiation process in the other processing areas is performed before all of the irradiation in the irradiation process in the some processing areas is completed. In this way, in the irradiation process of this embodiment, part of the irradiation in the irradiation process in some of the processing areas and part of the irradiation in the irradiation process in the other processing areas are alternately performed until the entire area of ​​each processing area is irradiated with the pulsed laser light.

[0172] In addition, in the irradiation process of each processing area, when the processing area of ​​processing number M1 is irradiated with the pulsed laser light at a certain irradiation diameter φ, the processing area irradiated with the pulsed laser light is changed to the processing area of ​​processing number M2. However, it is not necessary to be limited to this. For example, when the processing area of ​​processing number M1 is irradiated with the pulsed laser light at a certain irradiation diameter φ and a value obtained by subtracting the change width Δφ from the irradiation diameter φ, the processing area irradiated with the pulsed laser light may be changed to the processing area of ​​processing number M2. Therefore, in the irradiation process of each processing area, the irradiation line irradiated with the pulsed laser light is not limited to one.

[0173] Fig. 26 is a diagram showing a part of the control flowchart of the laser processing processor 310 of this embodiment. Fig. 27 is a diagram showing another part of the control flowchart of the laser processing processor 310 of this embodiment. The control flowchart of this embodiment includes steps SP11 to SP24 and step SP62 in the control flowchart of embodiment 1. The control flow of this embodiment is partially different from the control flow of embodiment 1, and the differences will be described below.

[0174] 26, in step SP15, if the current irradiation diameter φ is greater than 0, the laser processing processor 310 advances the control flow to step SP16. If the irradiation diameter φ is equal to or less than 0, the laser processing processor 310 ends the control flow since all of the processed portions have been formed. In addition, in step SP17, when the pulsed laser light has moved and irradiated at least one revolution, the laser processing processor 310 advances the control flow to steps SP22 to SP24 as shown in FIG.

[0175] In step SP24 shown in FIG. 27, the laser processing processor 310 reads out the processing number Mmax from the storage device 310a, and if the processing number M to which 1 was added in step SP23 is equal to or less than the processing number Mmax, the control flow returns to step SP13 shown in FIG. 26. When the control flow proceeds to steps SP13 to SP17, the irradiation in the irradiation process in the current processing area is stopped midway, and then the irradiation process in another processing area is performed. In step SP24, if the processing number M to which 1 was added in step SP23 is greater than the processing number Mmax, the laser processing processor 310 advances the control flow to step SP62. In step SP62, the laser processing processor 310 returns the processing number M to the initial value, processing number M1, and advances the control flow to step SP19. In step SP19, if the current coordinate Z is smaller than the sum of the coordinate Z(M) and the thickness T, the laser processing processor 310 advances the control flow to step SP20, step SP21, step SP18, and step SP15 shown in FIG. 26 in this order. The irradiation diameter φ set in step SP18 is stored in the storage device 310a. When the control flow advances from step SP16 to step SP17 via step SP15, as shown in FIG. 25, the laser processing processor 310 reads out the irradiation diameter φ set in step SP18 from the storage device 310a and moves and irradiates the pulsed laser light at least one revolution with the irradiation diameter φ. Step SP18 is the last step in the irradiation process, and step SP21, which is a moving step, is performed before step SP18. Therefore, the moving step in this embodiment is performed during the irradiation process. In addition, in step SP19, if the coordinate Z is larger than the sum of the coordinate Z(M) and the thickness T, the laser processing processor 310 ends the control flow since all the processed portions have been formed.

[0176] 7.3 Actions and Effects In the laser processing method of the present embodiment, in the irradiation step performed on each processing area, a part of the irradiation in the irradiation step on some processing areas and a part of the irradiation in the irradiation step on other processing areas are performed alternately.

[0177] In the above, the processing area irradiated with the pulsed laser light is changed during the irradiation process. When the processing area is changed, heat concentration in the processing area due to the irradiation of the pulsed laser light is suppressed, and localized heat generation in the workpiece 20 can be suppressed, compared with the case where the processing area irradiated with the pulsed laser light is changed after the irradiation process is completed.

[0178] The workpiece 20 in the fourth and fifth embodiments is generally perpendicular to the Z axis like the workpiece 20 in the first embodiment, but may be inclined to the Z axis like the workpiece 20 in the second embodiment. In this case, as shown in FIG. 28, the processing areas of processing numbers M1 to M3 located at the same height position in the Z direction and the processing areas of processing numbers M4 to M6 located at a different coordinate Z from the processing areas of processing numbers M1 to M3 are set on the workpiece 20. The processing areas of processing numbers M4 to M6 are located at the same height position in the Z direction. In addition, the processing areas of processing numbers M1 to M3 are set as the first group, and the processing areas of processing numbers M4 to M6 are set as the second group. As in the fourth or fifth embodiment, the laser processing processor 310 may move and irradiate the pulse laser light in each processing area in the first group to form a processed part, and then move and irradiate the pulse laser light in each processing area in the second group to form a processed part. This can reduce the amount of movement of the moving stage 353 compared to when the first group of processed portions and the second group of processed portions are processed alternately.

[0179] 8. Description of modified gas laser devices Next, a description will be given of a modification of gas laser apparatus 100 of the above-mentioned embodiment 1. Note that the same components as those described above are given the same reference numerals, and duplicated descriptions will be omitted unless otherwise specified.

[0180] FIG. 29 is a schematic diagram showing an example of a schematic overall configuration of a gas laser device 100 according to a modified example.

[0181] Monitor module 150 includes the addition of a beam splitter 157 and a wavelength monitor 159 .

[0182] Beam splitter 157 is disposed between beam splitter 153 and optical sensor 155. Beam splitter 157 reflects a portion of the light reflected by beam splitter 153 and transmits the remainder. The transmitted light that has passed through beam splitter 157 is incident on optical sensor 155, and the reflected light that has been reflected by beam splitter 157 is incident on wavelength monitor 159.

[0183] The wavelength monitor 159 is a known etalon spectrometer. The etalon spectrometer is composed of, for example, a diffusion plate, an air gap etalon, a condenser lens, and a line sensor. The etalon spectrometer generates interference fringes of the incident pulsed laser light by the diffusion plate and the air gap etalon, and forms an image of the generated interference fringes on the light receiving surface of the line sensor by the condenser lens. Then, the wavelength λ of the pulsed laser light is measured by measuring the interference fringes formed on the line sensor. The wavelength monitor 159 is electrically connected to the laser processor 190, and outputs a signal indicating data related to the measured wavelength λ of the pulsed laser light to the laser processor 190.

[0184] The gas laser device 100 includes a line narrowing module 210 in place of the rear mirror 145 in the master oscillator 130. The line narrowing module 210 includes a prism 210a, a grating 210b, a rotating stage 210c, and a housing 210d that houses the prism 210a, the grating 210b, and the rotating stage 210c. The prism 210a expands the beam width of the light emitted from a window 139a of the laser chamber 131 and makes the light enter the grating 210b. The prism 210a also reduces the beam width of the light reflected from the grating 210b and returns the light to the internal space of the laser chamber 131 via the window 139a.

[0185] The surface of the grating 210b is made of a material with high reflectivity, and a large number of grooves are formed on the surface at a predetermined interval. The grating 210b is a dispersive optical element. The cross-sectional shape of each groove is, for example, a right-angled triangle. The light incident on the grating 210b from the prism 210a is reflected by these grooves and diffracted in a direction according to the wavelength of the light. The grating 210b is Littrow-arranged so that the angle of incidence of the light incident on the grating 210b from the prism 210a coincides with the angle of diffraction of the diffracted light of the desired wavelength. As a result, the light near the desired wavelength is returned to the laser chamber 131 via the prism 210a.

[0186] The rotating stage 210c supports the prism 210a and rotates the prism 210a around the Z axis. By rotating the prism 210a, the angle of incidence of light with respect to the grating 210b is changed. Therefore, by rotating the prism 210a, the wavelength of the light returning from the grating 210b to the laser chamber 131 via the prism 210a can be selected. In this way, the gas laser device 100 corresponds to a wavelength-tunable laser device capable of changing the wavelength of the output pulsed laser light. In the line narrowing module 210, the number of prisms is one in this example, but is not particularly limited as long as it includes at least one rotating prism like the rotating stage 210c.

[0187] A laser resonator is formed by the output coupling mirror 147 and the grating 210b, which are provided on either side of the laser chamber 131, and the laser chamber 131 is disposed on the optical path of this laser resonator. Thus, light from the internal space of the laser chamber 131 travels back and forth between the grating 210b of the line narrowing module 210 and the output coupling mirror 147 via the windows 139a, 139b and the prism 210a. The traveling light is amplified every time it passes through the laser gain space between the electrodes 133a and 133b. A part of the amplified light passes through the output coupling mirror 147 via the window 139b, and enters the power oscillator 230, which will be described later, as pulsed laser light.

[0188] In the master oscillator 130, the laser processor 190 controls the charger 141 and the switch 143a in the pulse power module 143 to apply a high voltage between the electrodes 133a and 133b, as in the first embodiment. When a high voltage is applied between the electrodes 133a and 133b, the insulation between the electrodes 133a and 133b is broken down and a discharge occurs. The energy of this discharge excites the laser medium contained in the laser gas between the electrodes 133a and 133b, and emits spontaneous emission light when returning to the ground state. A part of this light is ultraviolet light, and passes through the window 139a. The transmitted light is expanded in the light traveling direction each time it passes through the prism 210a. In addition, when the light passes through the prism 210a, it is dispersed in wavelength and guided to the grating 210b. The light is incident on the grating 210b at a predetermined angle and diffracted, and the light of a predetermined wavelength is reflected by the grating 210b at a reflection angle equal to the incident angle. The light reflected by the grating 210b propagates again from the window 139a to the internal space of the laser chamber 131 via each prism 210a. The wavelength of the light propagating to the internal space of the laser chamber 131 is narrowed so as not to include the absorption line of oxygen. This narrowed-band light causes stimulated emission in the excited laser medium, amplifying the light. The light passes through the window 139b and travels to the output coupling mirror 147. A part of the light passes through the output coupling mirror 147, and the remaining part of the light is reflected by the output coupling mirror 147, passes through the window 139b, and propagates to the internal space of the laser chamber 131. The light propagated to the internal space of the laser chamber 131 passes through the window 139a and the prism 210a as described above and travels to the grating 210b. In this way, light of a predetermined wavelength travels back and forth between the grating 210b and the output coupling mirror 147. The light is amplified and laser oscillation occurs every time it passes through a discharge space in the internal space of the laser chamber 131. Then, a part of the laser light passes through the output coupling mirror 147 and enters the power oscillator 230 as a pulsed laser light.

[0189] Gas laser device 100 further includes a power oscillator 230 which corresponds to an amplifier. Power oscillator 230 is disposed on the optical path of the pulsed laser light between master oscillator 130 and monitor module 150. Power oscillator 230 is an amplifier which amplifies the energy of the pulsed laser light output from master oscillator 130.

[0190] The power oscillator 230 has a basic configuration similar to that of the master oscillator 130, and includes a laser chamber 131, a charger 141, and a pulse power module 143, similar to the master oscillator 130. The power oscillator 230 includes a Fabry-Perot type laser resonator including an output coupling mirror 247 and a rear mirror 245. The output coupling mirror 247 and the rear mirror 245 reflect a part of the pulse laser light and transmit the remaining part. For example, the reflectance of the output coupling mirror 247 may be approximately 10% to 30%, and the reflectance of the rear mirror 245 may be approximately 80% to 90%. The output coupling mirror 247 faces the beam splitter 153, and the rear mirror 245 faces the output coupling mirror 147. The rear mirror 245 is disposed in the internal space of the optical path tube 147a together with the output coupling mirror 147. The output coupling mirror 247 is disposed in the internal space of the optical path tube 247a. The optical path tube 247a has the same configuration as the optical path tube 147a.

[0191] When the laser processor 190 receives a signal indicating data such as the target pulse energy Et and the target wavelength λt from the laser processing processor 310, it controls the charging voltage of the charger 141 in the master oscillator 130, the charging voltage of the charger 141 in the power oscillator 230, and the rotation of the rotating stage 210c of the line narrowing module 210 so as to oscillate the laser at the target value. The target wavelength λt may be, for example, a wavelength that avoids the oxygen absorption line in the amplification region of the ArF excimer laser light. Such a wavelength may be, for example, a wavelength of 193.40 nm.

[0192] When the laser processor 190 receives the light emission trigger Tr from the laser processing processor 310, it causes the master oscillator 130 to oscillate. In addition, the laser processing processor 310 drives the power oscillator 230 in synchronization with the master oscillator 130. The laser processor 190 turns on the switch 143a of the pulse power module 143 of the power oscillator 230 so that a discharge occurs when the pulse laser light output by the master oscillator 130 is incident on the discharge space in the laser chamber 131 of the power oscillator 230. As a result, the pulse laser light incident on the power oscillator 230 is amplified and oscillated in the power oscillator 230.

[0193] The pulse energy and wavelength of the pulsed laser light amplified and output by the power oscillator 230 are measured in the monitor module 150. The laser processor 190 controls the charging voltage of the charger 141 in the master oscillator 130, the charging voltage of the charger 141 in the power oscillator 230, and the line narrowing module 210 of the master oscillator 130 so that the actual measured values ​​of the measured pulse energy and wavelength approach the target pulse energy Et and target wavelength λt, respectively.

[0194] When the laser processor 190 opens the shutter 170 , the pulsed laser light transmitted through the beam splitter 153 of the monitor module 150 enters the laser processing device 300 .

[0195] The wavelength of the pulsed laser light is narrowed so as not to include the absorption line of oxygen. Therefore, in the laser processing apparatus 300, in the internal space of the housing 355 in which the workpiece 20 is placed, nitrogen gas, which is an inert gas, does not need to flow constantly during the operation of the laser processing system 10. Moreover, even if no inert gas flows, the pulsed laser light can process the CMC.

[0196] As in the gas laser device 100, by providing a power oscillator 230 as an amplifier, the pulse energy of the pulse laser light can be increased. Laser processing often requires high pulse energy. When a narrowband pulse laser light is used for laser processing as in this example, the pulse energy decreases compared to when a naturally oscillating pulse laser light is used. In the gas laser device 100 of this example, the decrease in pulse energy can be suppressed by the amplifier capable of increasing the pulse energy.

[0197] In this example, a Fabry-Perot resonator is used as the amplifier, but a ring resonator may be used instead. Also, the power oscillator 230 may include a convex mirror and a concave mirror instead of the output coupling mirror 247 and the rear mirror 245.

[0198] The master oscillator 130 may include a semiconductor laser that outputs seed light, a titanium sapphire amplifier that amplifies the seed light, and a wavelength conversion system.

[0199] The semiconductor laser is a distributed feedback type semiconductor laser that outputs a CW (Continuous Wave) laser beam, which is a laser beam that oscillates continuously at a wavelength of 773.6 nm, as a seed beam. The oscillation wavelength can be changed by changing the temperature setting of the semiconductor laser.

[0200] The Ti:sapphire amplifier includes a Ti:sapphire crystal and a pumping pulsed laser device. The Ti:sapphire crystal is disposed on the optical path of the seed light. The pumping pulsed laser device is a laser device that outputs second harmonic light of a YLF laser.

[0201] The wavelength conversion system generates fourth harmonic light with a central wavelength of about 193.40 nm, and includes an LBO (LiB3O5) crystal and a KBBF (KBe2BO3F2) crystal that converts the wavelength from the fundamental wave to the fourth harmonic light. Each crystal is placed on a rotating stage (not shown) and is configured so that the angle of incidence of the seed light to each crystal can be changed.

[0202] The master oscillator 130 may include a solid-state laser device that emits ultraviolet laser light with a central wavelength of about 193.40 nm, and a wavelength conversion system including a nonlinear crystal. In this case, the master oscillator 130 corresponds to a wavelength-tunable laser device, and does not need to oscillate the laser light in the amplification region of the ArF laser, but only needs to oscillate the laser light within the wavelength range of 175 nm to 200 nm where oxygen absorption occurs.

[0203] The above description is intended to be illustrative rather than restrictive. Thus, it will be apparent to one skilled in the art that modifications may be made to the disclosed embodiments without departing from the scope of the claims. It will also be apparent to one skilled in the art that the disclosed embodiments may be used in combination. Terms used throughout the specification and claims should be interpreted as "open ended" terms unless otherwise specified. For example, the terms "include" or "included" should be interpreted as "not limited to what is described as including." The term "having" should be interpreted as "not limited to what is described as having." The indefinite article "a" should be interpreted as "at least one" or "one or more." The term "at least one of A, B, and C" should be interpreted as "A," "B," "C," "A+B," "A+C," "B+C," or "A+B+C." It should also be interpreted as including combinations of these with other than "A," "B," and "C."

Claims

1. A laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, comprising: an irradiation step of guiding the pulsed laser light emitted from an excimer laser device to a part of the processing area and irradiating the processing area with the pulsed laser light by moving an irradiation spot of the guided pulsed laser light; a moving step of moving the workpiece in a height direction of the workpiece; Equipped with the irradiation step is performed at a plurality of height positions of the workpiece that is moved in the height direction by the moving step, In the irradiation step, at least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, In the irradiation step, the pulsed laser light is irradiated at least once around a part of a plurality of concentric irradiation lines in the processing area, and then irradiated at least once around another part of the plurality of irradiation lines. Laser processing method.

2. A laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, comprising: an irradiation step of guiding the pulsed laser light emitted from an excimer laser device to a part of the processing area and irradiating the processing area with the pulsed laser light by moving an irradiation spot of the guided pulsed laser light; a moving step of moving the workpiece in a height direction of the workpiece; Equipped with the irradiation step is performed at a plurality of height positions of the workpiece that is moved in the height direction by the moving step, In the irradiation step, at least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, The moving step is performed during the irradiation step. Laser processing method.

3. A laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, comprising: an irradiation step of guiding the pulsed laser light emitted from an excimer laser device to a part of the processing area and irradiating the processing area with the pulsed laser light by moving an irradiation spot of the guided pulsed laser light; a moving step of moving the workpiece in a height direction of the workpiece; Equipped with the irradiation step is performed at a plurality of height positions of the workpiece that is moved in the height direction by the moving step, In the irradiation step, at least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, In the irradiation step, a planar direction of the processing area is inclined to an optical axis of the pulsed laser light. Laser processing method.

4. A laser processing method for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, comprising: an irradiation step of guiding the pulsed laser light emitted from an excimer laser device to a part of the processing area and irradiating the processing area with the pulsed laser light by moving an irradiation spot of the guided pulsed laser light; a moving step of moving the workpiece in a height direction of the workpiece; Equipped with the irradiation step is performed at a plurality of height positions of the workpiece that is moved in the height direction by the moving step, In the irradiation step, at least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, The wavelength of the pulsed laser light is narrowed so as not to include the absorption line of oxygen. Laser processing method.

5. The laser processing method according to claim 1, In the irradiating step, the pulsed laser light irradiates each of the plurality of irradiation lines in order from the outermost irradiation line to the innermost irradiation line at least once around the irradiation line.

6. The laser processing method according to claim 3, In the irradiation step, a focusing position of the pulsed laser light is located between an upper end and a lower end of the processing area in the height direction.

7. The laser processing method according to claim 6, In the irradiation step, the light collecting position is located midway between the upper end and the lower end.

8. The laser processing method according to claim 3, The moving process is performed during the irradiation process, and in the moving process, the workpiece is moved in the height direction in synchronization with the position of the irradiation spot in a direction perpendicular to the height direction so that the diameter of the irradiation spot of the pulsed laser light focused on the processing area of ​​the workpiece moving in the height direction in the moving process does not change in the irradiation process.

9. The laser processing method according to claim 8, The method further includes a measuring step of measuring a height position of the processing area before the irradiation step, In the moving step, the workpiece is moved to the height position measured in the measuring step.

10. The laser processing method according to any one of claims 1, 3 and 4, The workpiece includes a plurality of the processing areas that are discontinuously located from one another, the processed portions are formed in the respective processing areas by irradiating the respective processing areas with the pulsed laser light, The irradiation step performed on each of the processing areas and the moving step are performed alternately.

11. 5. The laser processing method according to claim 1, The workpiece is a ceramic matrix composite.

12. 5. The laser processing method according to claim 1, The irradiation spot diameter is not less than 30 μm and not more than 2 mm.

13. 5. The laser processing method according to claim 1, The pulse energy of the pulsed laser light is not less than 0.1 mJ and not more than 30 mJ.

14. 5. The laser processing method according to claim 1, The workpiece is placed in the internal space of a housing through which an inert gas flows.

15. A laser processing system for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, an irradiation optical system that guides the pulsed laser light emitted from an excimer laser device to a part of the processing area and moves an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light; an fθ lens that focuses the pulsed laser light from the irradiation optical system onto the processing area; a moving stage that moves the workpiece in a height direction of the workpiece; Equipped with the irradiation optical system irradiates the pulsed laser beam at a plurality of height positions of the workpiece moved in the height direction by the moving stage, At least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, The irradiation optical system irradiates a part of a plurality of concentric irradiation lines in the processing area with the pulsed laser light at least once, and then irradiates another part of the plurality of irradiation lines with the pulsed laser light at least once. Laser processing system.

16. A laser processing system for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, an irradiation optical system that guides the pulsed laser light emitted from an excimer laser device to a part of the processing area and moves an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light; an fθ lens that focuses the pulsed laser light from the irradiation optical system onto the processing area; a moving stage that moves the workpiece in a height direction of the workpiece; Equipped with the irradiation optical system irradiates the pulsed laser beam at a plurality of height positions of the workpiece moved in the height direction by the moving stage, At least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, The moving stage moves the workpiece in a height direction of the workpiece while the irradiation optical system is irradiating the pulsed laser beam at the plurality of height positions. Laser processing system.

17. A laser processing system for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, an irradiation optical system that guides the pulsed laser light emitted from an excimer laser device to a part of the processing area and moves an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light; an fθ lens that focuses the pulsed laser light from the irradiation optical system onto the processing area; a moving stage that moves the workpiece in a height direction of the workpiece; Equipped with the irradiation optical system irradiates the pulsed laser beam at a plurality of height positions of the workpiece moved in the height direction by the moving stage, At least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, When the irradiation optical system irradiates the pulsed laser beam, the planar direction of the processing area is inclined to the optical axis of the pulsed laser beam. Laser processing system.

18. A laser processing system for forming a processed portion in a processing area of ​​a workpiece by irradiating the processing area with pulsed laser light, an irradiation optical system that guides the pulsed laser light emitted from an excimer laser device to a part of the processing area and moves an irradiation spot of the guided pulsed laser light to irradiate the processing area with the pulsed laser light; an fθ lens that focuses the pulsed laser light from the irradiation optical system onto the processing area; a moving stage that moves the workpiece in a height direction of the workpiece; Equipped with the irradiation optical system irradiates the pulsed laser beam at a plurality of height positions of the workpiece moved in the height direction by the moving stage, At least a part of each of the irradiation spots of the pulsed laser light overlaps with another irradiation spot adjacent to the irradiation spot, The wavelength of the pulsed laser light is narrowed so as not to include the absorption line of oxygen. Laser processing system.

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