Uninterruptible power supply device

Abstract

To provide an uninterruptible power supply that can be reduced in size.SOLUTION: An uninterruptible power supply comprises: a plurality of first and second semiconductor modules including semiconductor devices for performing power conversion; and a heat sink for cooling the plurality of first and second semiconductor modules. The heat sink includes a base part for mounting the plurality of first and second semiconductor modules, and a fin part connected with the base part. The plurality of first and second semiconductor modules are provided respectively on an inflow port surface and an outflow port surface of cooling air from the fin part. A longitudinal direction of the plurality of first semiconductor modules is provided to be perpendicular to an inflow direction of the cooling air from the fin part from the inflow port surface to the outflow port surface. A longitudinal direction of the plurality of second semiconductor modules is provided to be parallel to the inflow direction of the cooling air from the fin part.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to uninterruptible power supplies. [Background technology]

[0002] Conventionally, an uninterruptible power supply device includes a converter that converts an AC voltage into a DC voltage, and an inverter that converts the DC voltage from the converter back into an AC voltage and outputs the AC voltage to a load.

[0003] Converters, inverters, and the like use power semiconductor modules that are configured with IGBTs (Insulated Gate Bipolar Transistors), diodes, and the like.

[0004] These power semiconductor modules generate heat due to conduction loss caused by current flow and switching loss caused by switching during operation of the uninterruptible power supply, causing the element temperature to rise. If the temperature of the power semiconductor module exceeds the rated temperature, the internal circuitry will deteriorate or break down.

[0005] For this reason, the power semiconductor module is arranged on one side of a heat sink, cooling fins are provided on the other side of the heat sink, and air is blown onto the cooling fins from a cooling fan to dissipate the heat from the power semiconductor elements, and various methods of arrangement on a heat sink have been proposed (see Patent Documents 1-3). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 5558401 [Patent Document 2] JP 2003-259658 A [Patent Document 3] Patent No. 5715352 Summary of the Invention [Problem to be solved by the invention]

[0007] In this regard, further improvements are needed in terms of the arrangement of power semiconductor modules for converters and inverters on a heat sink.

[0008] The present disclosure has been made to solve the above-mentioned problems, and provides an uninterruptible power supply that can be made compact. [Means for solving the problem]

[0009] An uninterruptible power supply according to one aspect includes a plurality of first and second semiconductor modules including semiconductor elements for power conversion, and a heat sink for cooling the plurality of first and second semiconductor modules. The heat sink includes a base portion for mounting the plurality of first and second semiconductor modules, and a fin portion connected to the base portion. The plurality of first and second semiconductor modules are provided on the inlet surface side and outlet surface side of the cooling air of the fin portion, respectively. The longitudinal direction of the plurality of first semiconductor modules is provided perpendicular to the inflow direction of the cooling air from the inlet surface side to the outlet surface side of the fin portion. The longitudinal direction of the plurality of second semiconductor modules is provided parallel to the inflow direction of the cooling air of the fin portion.

[0010] The plurality of first semiconductor modules are converters that convert AC voltages into DC voltages, and the plurality of second semiconductor modules are inverters that convert DC voltages into AC voltages.

[0011] Each of the plurality of first and second semiconductor modules includes one IGBT element.

[0012] The first semiconductor modules are provided on a cooling air inlet side of the fin portion, and the second semiconductor modules are provided on a cooling air outlet side of the fin portion. Effect of the Invention

[0013] According to one embodiment, the uninterruptible power supply can be made compact. [Brief description of the drawings]

[0014] [Figure 1] 1 is a diagram illustrating a circuit configuration of an uninterruptible power supply 1 based on an embodiment. [Diagram 2] 1 is a diagram illustrating a configuration of a power conversion unit including a converter CNV, an inverter INV, and an electrolytic capacitor 11 according to an embodiment. [Diagram 3] 11 is a diagram illustrating a configuration of a heat sink 50 of a converter CNV and an inverter INV based on a comparative example. FIG. [Figure 4] 11 is a diagram illustrating a configuration of a heat sink 60 of a converter CNV and an inverter INV based on the embodiment. FIG. [Diagram 5] 10 is a diagram illustrating the flow of cooling air in a heat sink 50 based on a comparative example. FIG. [Figure 6] 5A to 5C are diagrams illustrating the flow of cooling air in a heat sink 60 based on an embodiment. [Figure 7] 10A to 10C are diagrams illustrating temperature changes in heat sinks 50 and 60 due to cooling air based on an embodiment and a comparative example. [Figure 8] 10 is a diagram illustrating a temperature distribution in a base portion 100 of a heat sink 50 based on a comparative example. FIG. [Figure 9] 5A to 5C are diagrams illustrating the temperature distribution in a base portion 100 of a heat sink 60 based on the embodiment. [Figure 10] 13A and 13B are diagrams illustrating a configuration of a heat sink 70 of a converter CNV and an inverter INV based on another embodiment. [Figure 11] 10 is a diagram illustrating a temperature distribution in a base portion 100 of a heat sink 50 according to another embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The present embodiment will be described in detail with reference to the drawings, in which the same or corresponding parts are designated by the same reference characters and description thereof will not be repeated.

[0016] FIG. 1 is a diagram illustrating a circuit configuration of an uninterruptible power supply 1 based on an embodiment. 1, the uninterruptible power supply 1 is connected to an AC input power supply 2, a bypass input power supply 3, and a load 4. The uninterruptible power supply 1 is also connected to a storage battery 31 via a switch 14.

[0017] The AC input power supply 2 and the bypass input power supply 3 are AC power supplies that supply AC power to the uninterruptible power supply 1. Each of these input power supplies is constituted by, for example, a commercial AC power supply or a private generator.

[0018] As an example of the input AC power supply, a single-phase single-wire (1φ1W) type is shown. However, the type of the input AC power supply is not limited to the single-phase single-wire type, and may be, for example, a three-phase three-wire type power supply or a single-phase three-wire type power supply.

[0019] The uninterruptible power supply 1 includes a bypass input terminal T1, an AC input terminal T2, a storage battery terminal T3, and an output terminal T4.

[0020] The bypass input terminal T1 receives AC power from the bypass input power source 3. The AC input terminal T2 receives AC power from the AC input power source 2. The storage battery terminal T3 is connected to the positive electrode of the storage battery 31 via the switch 14. The load 4 is connected to the output terminal T4.

[0021] The uninterruptible power supply 1 includes electromagnetic contactors 5, 15, and 17, reactors 7 and 9, a converter CNV, an electrolytic capacitor 11, an inverter INV, capacitors 8 and 10, a thyristor switch 18, and a control device 30.

[0022] Of these, the contactor 5, the reactors 7 and 9, the inverter INV, the converter CNV, and the contactor 15 are connected in series between the AC input terminal T2 and the output terminal T4.

[0023] The contactor 5 and the reactor 7 are connected in a current path between the AC input terminal T2 and the converter CNV. The capacitor 8 is connected to the contactor 5 in parallel with the reactor 7. The contactor 5 opens (ON) and closes (OFF) in response to a command from the control device 30. The capacitor 8 and the reactor 7 are filters for removing harmonics and high frequencies from the AC power input / output to the converter CNV.

[0024] The converter CNV converts AC power supplied from the AC input power source 2 into DC power. The electrolytic capacitor 11 smoothes the output voltage of the converter CNV. The inverter INV converts the DC power smoothed by the electrolytic capacitor 11 into AC power of a predetermined voltage and a predetermined frequency. The converter CNV and the inverter INV are each controlled by a control device 30.

[0025] The contactor 15 and the reactor 9 are connected in an electrical path between the output terminal T4 and the inverter INV. The capacitor 10 is connected to the contactor 15 in parallel with the reactor 9. The contactor 15 opens (ON) and closes (OFF) in response to a command from the control device 30. The contactor 15 and the reactor 9 are filters for removing harmonics and high frequencies from the AC power input to and output from the inverter INV.

[0026] The contactor 15 switches the AC output output from the output terminal T4 to the load 4 between the output of the inverter INV and the output of a bypass circuit consisting of a thyristor switch 18 and a contactor 17.

[0027] The thyristor switch 18 and the contactor 17 are connected in parallel between the bypass input terminal T1 and the output terminal T4. The thyristor switch 18 is a switch for quickly switching the AC output output from the output terminal T4 to the load 4 from the output of the inverter INV to AC power from the bypass input power source 3. The contactor 17 is connected in an electrical path from the bypass input terminal T1 to the output terminal T4. The contactor 17 is for maintaining the AC power from the bypass input power source 3 as the AC output output from the uninterruptible power supply. The contactor 15, the thyristor switch 18 and the contactor 17 close (ON) and open (OFF) in response to a command from the control device 30.

[0028] The storage battery 31 is a power storage device for supplying DC power to the inverter INV when the AC input power source 2 cannot supply AC power (for example, during a power outage). The reactor 12 and the switch 14 are connected in series with the storage battery 31. The reactor 12 is provided to prevent an inrush current to the storage battery 31.

[0029] During normal operation when AC power is being supplied from the AC input power source 2, DC power generated by the converter CNV is stored in the storage battery 31 and is also converted to AC power by the inverter INV and supplied to the load 4. On the other hand, during a power outage when the supply of AC power from the AC input power source 2 stops, the operation of the converter CNV is stopped and the DC power stored in the storage battery 31 is converted to AC power by the inverter INV and supplied to the load 4. Therefore, according to the uninterruptible power supply device, it is possible to continue the operation of the load 4 using the power stored in the storage battery 31 even during a power outage.

[0030] The control device 30 is a control device for controlling the converter CNV and the inverter INV in order to generate AC power to be supplied to the load 4 during normal operation and during a power outage, and is mainly composed of a microcomputer including a CPU (Central Processing Unit) and storage units such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The control device 30 controls the converter CNV, the inverter INV, etc. by the CPU reading a program stored in advance in the ROM or the like into the RAM and executing the program.

[0031] Furthermore, the control device 30 controls the contactors 5, 15, 17 and the bypass circuit in addition to controlling the converter CNV and the inverter INV. At least a part of the control device 30 may be configured to execute predetermined numerical and logical calculation processing by hardware such as an electronic circuit.

[0032] FIG. 2 is a diagram illustrating the configuration of a power conversion unit including a converter CNV, an inverter INV, and an electrolytic capacitor 11 according to the embodiment.

[0033] 2, the power conversion unit includes a plurality of semiconductor elements (IGBTs) QA1-QA4, QA1#-QA4#, capacitor units CD1, CD2, resistor units RCD1, RCD2, and bus bars L1, L2. Each semiconductor element (IGBT) has the same configuration.

[0034] The semiconductor elements (IGBTs) QA1 to QA4 constituting the converter CNV are commonly connected to an input terminal, and are respectively connected between the bus bar L1 and the bus bar L2.

[0035] A plurality of semiconductor elements (IGBTs) QA#1 to QA#4 that constitute the inverter INV are connected in parallel to one another between the bus bar L1 and the bus bar L2, and their outputs and an output terminal are commonly connected.

[0036] The capacitor units CD1 and CD2 are connected in parallel between the bus bar L1 and the bus bar L2.

[0037] The resistor units RCD1 and RCD2 are connected in parallel between the bus bar L1 and the bus bar L2. FIG. 3 is a diagram illustrating the configuration of a heat sink 50 of the converter CNV and the inverter INV based on a comparative example.

[0038] As shown in FIG. 3A, the layout configuration of a plurality of semiconductor elements (IGBTs) QA on a base portion 100 of a heat sink 50 is shown.

[0039] The plurality of semiconductor elements QA are provided on the inlet surface side and outlet surface side of the cooling air of the fin portion 200. The plurality of semiconductor elements QA are arranged in two stages, on the front side and the back side.

[0040] 3B is an example of a heat sink 50 having a base portion at the top and a comb-shaped fin portion at the bottom. However, the present invention is not limited to this, and lattice-shaped fins or wave-shaped fins may be used.

[0041] As an example, multiple metal pieces are provided at a predetermined interval so that cooling air can be received from one side (inlet) and discharged to the opposite side (outlet). The cooling air passes through the fins, thereby lowering the temperature of the base connected to the fins.

[0042] The multiple semiconductor elements QA are all oriented in the same direction, and are arranged with their longitudinal direction aligned with the inflow direction of the cooling air.

[0043] FIG. 4 is a diagram illustrating a configuration of a heat sink 60 of the converter CNV and the inverter INV based on the embodiment.

[0044] As shown in FIG. 4A, the layout configuration of a plurality of semiconductor elements (IGBTs) QA on a base portion 100 of a heat sink 60 is shown.

[0045] As shown in FIG. 4B, the heat sink 50 has a base portion provided at its upper portion and a comb-shaped fin portion at its lower portion.

[0046] 3, the layout configuration of the semiconductor elements QA is different. Specifically, the multiple semiconductor elements QA are provided on the inlet surface side and outlet surface side of the cooling air of the fin portion 200. The multiple semiconductor elements QA are arranged in two stages, on the front side and the back side. The orientation of the multiple semiconductor elements QA is not all in the same direction, and the longitudinal direction of the multiple semiconductor elements QA arranged on the inlet surface side (front side) is arranged perpendicular to the inflow direction of the cooling air. The longitudinal direction of the multiple semiconductor elements QA arranged on the outlet surface side (back side) is arranged parallel to the inflow direction of the cooling air.

[0047] As an example, the semiconductor elements QA1 to QA4 constituting the converter CNV are arranged on the inlet surface side (front side). Meanwhile, the semiconductor elements QA#1 to QA#4 constituting the inverter INV are arranged on the outlet surface side (rear side). In this example, the semiconductor elements QA1 to QA4 constituting the converter CNV are arranged on the inlet surface side (front side) and the semiconductor elements QA#1 to QA#4 constituting the inverter INV are arranged on the outlet surface side (rear side), but they may be arranged in a reversed manner. In this regard, it is preferable to compare the heat generation amounts of the semiconductor elements and arrange the semiconductor elements with a higher heat generation amount on the inlet surface side (front side) and the semiconductor elements with a lower heat generation amount on the outlet surface side (rear side).

[0048] FIG. 5 is a diagram for explaining the flow of cooling air in the heat sink 50 based on a comparative example. 5, the multiple semiconductor elements QA are provided on the inlet side and outlet side of the cooling airflow of the fin portion 200. The multiple semiconductor elements QA are arranged in two stages, on the front side and the back side. Here, the cross-sectional line DA of the multiple semiconductor elements QA arranged on the back side and the cross-sectional line DB of the multiple semiconductor elements QA arranged on the front side are shown.

[0049] The cooling air flows in from the inlet side of the heat sink 50 and is discharged from the outlet side. The heat of the semiconductor element QA arranged on the front side of the base part 100 is cooled by the fin part 200 by the cooling air. Meanwhile, the cooling air containing that heat passes through the fin part 200 corresponding to the semiconductor element QA arranged on the back side of the base part 100. Therefore, the heat of the semiconductor element QA arranged on the back side of the base part 100 is cooled by the fin part 200 by the warmed cooling air.

[0050] FIG. 6 is a diagram illustrating the flow of cooling air in a heat sink 60 based on the embodiment.

[0051] 6, the multiple semiconductor elements QA are provided on the inlet surface side and outlet surface side of the cooling air of the fin portion 200. The multiple semiconductor elements QA are arranged in two stages, on the front side and the back side. Here, the cross-sectional line DC of the multiple semiconductor elements QA arranged on the back side and the cross-sectional line DD of the multiple semiconductor elements QA arranged on the front side are shown.

[0052] The cooling air flows in from the inlet side of the heat sink 50 and is discharged from the outlet side. The heat of the semiconductor element QA arranged on the front side of the base part 100 is cooled by the fin part 200 by the cooling air. Meanwhile, the cooling air containing that heat passes through the fin part 200 corresponding to the semiconductor element QA arranged on the back side of the base part 100. Therefore, the heat of the semiconductor element QA arranged on the back side of the base part 100 is cooled by the fin part 200 by the warmed cooling air.

[0053] Here, the heat sink 60 is configured such that the longitudinal direction of the multiple semiconductor elements QA arranged on the front side is perpendicular to the inflow direction of the cooling air, while the longitudinal direction of the multiple semiconductor elements QA arranged on the outlet surface side (rear side) is parallel to the inflow direction of the cooling air.

[0054] Therefore, the cooling air that passes through the fin portion 200 for the semiconductor element QA arranged on the front side of the base portion 100 does not all pass through the fin portion 200 corresponding to the semiconductor element QA arranged on the back side of the base portion 100, but is cooled by the fin portion 200 by the warmed cooling air in the area where the arrangement overlaps with the inflow direction of the cooling air.

[0055] FIG. 7 is a diagram illustrating temperature changes of the heat sinks 50 and 60 due to cooling air based on the embodiment and the comparative example.

[0056] 7, the vertical axis indicates temperature T. The horizontal axis indicates the position of the heat sink. In this example, the left end to the right end of the heat sink are shown.

[0057] As shown in the figure, when comparing the comparative example with the embodiment, the cross-sectional line DA and the cross-sectional line DC are in the same position, and the cross-sectional line DB and the cross-sectional line DD are in the same position.

[0058] In this example, temperature change waveforms M1 to M4 are shown on the cross-sectional lines DA to DD, respectively.

[0059] As shown in the temperature change waveform, the local maximum temperature is lower in the embodiment than in the comparative example. In other words, the temperature is dispersed without being concentrated locally. Therefore, it is clear that the embodiment has a higher cooling effect than the comparative example.

[0060] FIG. 8 is a diagram illustrating the temperature distribution in the base portion 100 of the heat sink 50 based on the comparative example.

[0061] FIG. 9 is a diagram illustrating the temperature distribution in base portion 100 of heat sink 60 based on the embodiment.

[0062] 8 and 9, the temperature is shown in gray scale, with black indicating a high temperature and white indicating a low temperature.

[0063] It is clear that the embodiment has a wider white temperature region than the comparative example, and has a significantly higher cooling effect.

[0064] Therefore, it is possible to fully utilize the heat dissipation capability of the heat sink, and it is possible to reduce the size of the heat sink itself.

[0065] FIG. 10 is a diagram illustrating a configuration of a heat sink 70 of a converter CNV and an inverter INV based on another embodiment.

[0066] As shown in FIG. 10A, the layout configuration of a plurality of semiconductor elements (IGBTs) QA on a base portion 100 of a heat sink 70 is shown.

[0067] As shown in FIG. 10(B), the heat sink 70 has a base portion provided at its upper portion and a comb-shaped fin portion at its lower portion.

[0068] 3, the layout configuration of the semiconductor elements QA is different. Specifically, the multiple semiconductor elements QA are provided on the inlet surface side and outlet surface side of the cooling air of the fin portion 200. The multiple semiconductor elements QA are arranged in two stages, on the front side and the back side. The orientation of the multiple semiconductor elements QA is not all in the same direction, and the longitudinal direction of the multiple semiconductor elements QA arranged on the outlet surface side (back side) is arranged perpendicular to the inflow direction of the cooling air. The longitudinal direction of the multiple semiconductor elements QA arranged on the inlet surface side (front side) is arranged parallel to the inflow direction of the cooling air.

[0069] FIG. 11 is a diagram illustrating the temperature distribution in the base portion 100 of the heat sink 50 according to another embodiment.

[0070] 11, the temperature is shown in gray scale, with black representing high temperature and white representing low temperature.

[0071] The white temperature region is wider in the temperature distribution of the other embodiment than in the temperature distribution of the comparative example in FIG. 8, and it is clear that the cooling effect is greater.

[0072] Therefore, by configuring the heat sink 70, it is possible to cool more efficiently than the comparative example. Therefore, it is possible to fully utilize the heat dissipation capacity of the heat sink, and it is possible to reduce the size of the heat sink itself.

[0073] 4 and the heat sink 70 of FIG. 10, the heat sink 60 has a greater cooling effect.

[0074] In the above, as an example, a configuration has been described in which the semiconductor elements QA1 to QA4 constituting the converter CNV are arranged on the inlet surface side (front side), and the semiconductor elements QA#1 to QA#4 constituting the inverter INV are arranged on the outlet surface side (rear side). However, this is not limited to this, and a configuration may also be used in which the semiconductor elements QA#1 to QA#4 constituting the inverter INV are arranged on the inlet surface side (front side), and the semiconductor elements QA1 to QA4 constituting the converter CNV are arranged on the outlet surface side (rear side).

[0075] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the scope and meaning equivalent to the claims. [Explanation of symbols]

[0076] 1 uninterruptible power supply, 2 AC input power supply, 3 bypass input power supply, 4 load, 5, 15, 17 contactor, 7, 9, 12 reactor, 8, 10 capacitor, 11 electrolytic capacitor, 14 switch, 18 thyristor switch, 30 control device, 31 storage battery, 50 to 70 heat sink, 100 base portion, 200 fin portion.

Claims

[Claim 1] a plurality of first and second semiconductor modules including semiconductor devices for power conversion; a heat sink for cooling the plurality of first and second semiconductor modules; The heat sink is a base portion for mounting the first and second semiconductor modules; a fin portion connected to the base portion, the first and second semiconductor modules are provided on a cooling air inlet side and a cooling air outlet side of the fin portion, respectively; a longitudinal direction of the plurality of first semiconductor modules is perpendicular to a direction in which cooling air of the fin portion flows from the inlet surface side to the outlet surface side, the longitudinal direction of the second semiconductor modules is arranged to be parallel to the inflow direction of the cooling air of the fin portion; the plurality of first semiconductor modules are converters that convert AC voltage into DC voltage; the plurality of second semiconductor modules are inverters that convert the DC voltage into an AC voltage; each of the first and second semiconductor modules includes an IGBT element; the plurality of first semiconductor modules are provided on a cooling air inlet side of the fin portion, The plurality of second semiconductor modules are provided on a cooling air outlet surface side of the fin portion.

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