Protective colloids and their use

Abstract

The present invention discloses a protective colloid and its use method, which belongs to the technical field of processing and manufacturing, and the raw materials constituting the protective colloid include UV epoxy modified acrylate polymer, thermal expansion particles, plasticizer, active monomer and cationic photoinitiator, the weight percentage of the UV epoxy modified acrylate polymer is 40-65%, the weight percentage of the thermal expansion particles is 2-10%, the weight percentage of the plasticizer is 10-15%, the weight percentage of the active monomer is 10-30%, and the weight percentage of the cationic photoinitiator is 1-3%. The protective colloid and its use method provided by the present invention are unlikely to cause separation between the protective colloid and the attachment during processing, and the protective colloid can effectively protect the attachment, and the protective colloid is unlikely to be altered, the probability of forming residual colloid on the attachment is reduced, and the protective colloid can be easily peeled off.

Description

[Technical field]

[0001] <Related Applications> This application claims priority from Chinese Patent Application No. 202110296133.8, filed on March 19, 2021, entitled "Protective colloid and its use method," the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to the technical field of product processing and manufacturing, and in particular to protective colloids and methods of using same. [Background technology]

[0003] In the processing of electronic products, computer numerically controlled machine tools are generally used to perform operations such as cutting and machining of workpieces.

[0004] In the machining process of a workpiece, it is generally necessary to attach a protective film to the surface of the workpiece in order to protect the surface of the workpiece. In the prior art, the protective film is attached to the surface of the workpiece with an adhesive, but the adhesive is relatively sensitive to temperature, and a higher temperature will reduce the viscosity of the adhesive, and the protective film will be easily separated from the workpiece during the machining process. In addition, the adhesive is easily altered due to temperature changes in the machining process, the impact of the cutting fluid, chemical corrosion of the cutting fluid, etc., making it difficult to peel off the protective film, and forming a large amount of residual colloids on the surface of the workpiece, which cannot be effectively removed. As can be seen from the above, the protective film protecting the workpiece in the prior art has the problem that it cannot effectively protect the workpiece and is more difficult to peel off. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a protective colloid that can effectively protect an attachment and can be more easily separated from the attachment, and a method for using the same. [Means for solving the problem]

[0006] In view of this, the technical solutions used in the present invention are as follows: A protective colloid, the composition of which includes UV epoxy modified acrylate polymer, thermal expansion particles, plasticizer, active monomer and cationic photoinitiator; The weight percentage of the UV epoxy modified acrylate polymer is 40-65%, the weight percentage of the thermally expandable particles is 2-10%, the weight percentage of the plasticizer is 10-15%, the weight percentage of the active monomer is 10-30%, and the weight percentage of the cationic photoinitiator is 1-3%.

[0007] As an option, the thermally expandable particles include a shell and a foaming agent in the shell, and when the temperature of the protective colloid after curing is between 110°C and 150°C, the foaming agent is vaporized by heat to generate internal pressure, and the shell is softened and expanded by heat, thereby expanding the protective colloid.

[0008] Optionally, the raw material constituting the protective colloid further comprises magnetic particles, the weight percentage of the magnetic particles being 2-5%.

[0009] Optionally, the magnetic particles include one or a combination of iron carbide, ferric oxide, manganese zinc ferrite, nickel zinc ferrite, and the magnetic particles have a particle size of 10 to 200 nanometers.

[0010] As an option, the raw material constituting the protective colloid further includes a fluorescent agent, the weight percentage of the fluorescent agent is 0.1-0.5%, and the fluorescent agent includes one of a stilbene type fluorescent agent, a coumarin type fluorescent agent, a pyrazoline type fluorescent agent, a benzoxazole type fluorescent agent, a dicarbonyl imide type fluorescent agent, or a combination thereof.

[0011] Optionally, the plasticizer and the active monomer are water soluble, and the plasticizer comprises one or a combination of polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, polyethylene glycol 1000, and the active monomer comprises polyethylene glycol acrylate.

[0012] Optionally, the cationic photoinitiator includes one or a combination of diaryliodonium hexafluorophosphate, mixed liquid triarylsulfonium hexafluoroantimonate, 4-(phenylthio)phenyldiphenylthiohexafluorophosphate, bis(4,4′-thioethertriphenylsulfonium)hexafluorophosphate, 4-isobutylphenyl-4′-methylphenyliodohexafluorophosphate.

[0013] A method for using a protective colloid, comprising a curing step and a separating step, The curing step comprises: S1, in which the protective colloid is applied to the attachment by a dispenser, spray, or brush application method, and the protective colloid is in a liquid state; S2, which hardens the liquid protective colloid through a UV curing process to harden the protective colloid and form an adhesive force between the protective colloid and the attachment, and sets the wavelength of the ultraviolet light in the UV curing process to 365 nanometers, 395 nanometers, or 405 nanometers; The separation step comprises: (S3) controlling the temperature of the protective colloid to be higher than 110° C., so that the thermally expandable particles in the protective colloid expand to generate internal pressure, thereby expanding a part or all of the protective colloid and separating it from the attachment; and S4 dissolving the remaining protective colloid on the attachment by placing the attachment and the remaining protective colloid adhering to the attachment in water at 60 to 95°C for a predetermined period of time, the predetermined period of time being 2 to 20 minutes.

[0014] As an option, the raw material constituting the protective colloid further includes magnetic particles, and in step S3, the protective colloid in a solid state is controlled to pass through an alternating magnetic field, so that the magnetic particles absorb the energy of the alternating magnetic field and convert it into heat, and the power of the magnetic field generator of the alternating magnetic field is 200 watts or more, and the frequency of the magnetic field generator is 300 kilohertz or more.

[0015] Optionally, in step S2, the thickness of the protective colloid in a solid state is 100-200 nanometers, and the protective colloid in a solid state has a material hardness of 75 Shore D or more. Effect of the Invention

[0016] The present invention has at least the following beneficial effects: In the protective colloid and the method for using the protective colloid provided by the present invention, the protective colloid has thermal expansion particles, and when the temperature of the protective colloid is higher than 110°C, the thermal expansion particles expand, facilitating the separation of the protective colloid from its attachment; when the temperature of the protective colloid is lower than 110°C, the thermal expansion particles do not expand, so that the adhesive force between the protective colloid and the attachment after curing is not affected, and further, the situation in which the protective colloid and the attachment are separated during processing is unlikely to occur, so that the protective colloid can effectively protect the attachment; and after the UV epoxy modified acrylate polymer is cured by the UV curing process, it can resist the impact of cutting fluid, chemical corrosion of cutting fluid, etc., making the protective colloid less likely to be altered, reducing the probability of forming residual colloid on the attachment, and facilitating the peeling off of the protective colloid. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a flow chart of the curing steps according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a flow chart of the separation steps according to an embodiment of the present invention. [Diagram 3]FIG. 3 is a flow chart showing the application of a protective colloid and a method of using the protective colloid according to an embodiment of the present invention to a CNC machining process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] In order to make the technical problem to be solved, the technical solution used and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further described below by specific embodiments with reference to the drawings. It should be understood that the specific examples described herein are merely for the purpose of interpreting the present invention, and are not intended to limit the present invention. For the sake of convenience, the drawings only show parts related to the present invention, and do not show the entirety of the present invention.

[0019] This embodiment provides a protective colloid that can be used to protect the attachment during the processing of the workpiece (i.e., the attachment) by adhering to the surface of the workpiece, and the protective colloid provided by this embodiment is more difficult to separate from the attachment during the processing of the attachment, and is easier to peel off from the attachment after the processing of the attachment is completed.

[0020] The raw materials constituting the protective colloid include UV epoxy modified acrylate polymer, thermally expandable particles, plasticizer, active monomer and cationic photoinitiator.

[0021] The UV epoxy modified acrylate polymer refers to the acrylate polymer after UV epoxy treatment, and has the characteristic of being modified during the UV curing process. Specifically, the UV epoxy modified acrylate polymer can change from the original liquid state to a solid state after being treated by the UV curing process. In this embodiment, the weight percentage of the UV epoxy modified acrylate polymer is between 50-75%, and in this embodiment, 40-65% is taken as an example, but this does not limit the implementation of the present invention. It is the main component of the protective colloid, which allows the protective colloid to have the characteristics of the UV epoxy modified acrylate polymer, that is, the protective colloid can be attached to the attachment by being cured by the UV curing process.

[0022] The weight percentage of the thermal expansion particles is between 2-20%, and in this embodiment, 2-10% is taken as an example, but this does not limit the implementation of the present invention. The thermal expansion particles have the property of expanding when exposed to heat, specifically, when the temperature of the protective colloid is higher than 110°C, the thermal expansion particles expand and generate internal pressure, so that the protective colloid expands under the action of the thermal expansion particles, and facilitates separation from the attachment. Alternatively, the thermal stability temperature of the thermal expansion particles is 100°C, that is, when the temperature of the protective colloid is lower than 100°C, the thermal expansion particles can maintain stability without any abnormality, and can also resist temperature changes during processing. When the temperature of the protective colloid is higher than 100°C and lower than 110°C, the thermal expansion particles are in an unstable state, and the molecules in the thermal expansion particles move, but the volume of the thermal expansion particles does not change, that is, the thermal expansion particles do not expand.

[0023] The weight percentage of the plasticizer is between 3% and 25%, and in this embodiment, it is 10% to 15% by way of example, but this does not limit the implementation of the present invention. The plasticizer has the functions of improving the compatibility between the raw materials in the protective colloid, improving the flexibility of the protective colloid, reducing the tensile strength of the protective colloid, and improving the impact resistance and low temperature performance of the protective colloid.

[0024] The weight percentage of the active monomer is between 5% and 40%, and in this embodiment, it is 10% and 30% as an example, but it does not limit the implementation of the present invention and has the role of adjusting the rheological properties of the liquid protective colloid.

[0025] The weight percentage of the cationic photoinitiator is between 0.5-5%, and in this embodiment, it is 1-3%, but it is not limited to the present invention, and the cationic photoinitiator photoactivates the molecules of protective colloid into an excited state, and the molecules undergo a series of reactions, and finally produces super strong protonic acid. The super strong protonic acid can be used as the active species of cationic polymerization to initiate the polymerization of epoxy compounds, vinyl ethers, lactones, acetals, cyclic ethers, etc.

[0026] The protective colloid provided in this embodiment has thermally expandable particles, and when the temperature of the protective colloid is higher than 110°C, the thermally expandable particles expand, facilitating the separation of the protective colloid from its attachment; when the temperature of the protective colloid is lower than 110°C, the thermally expandable particles do not expand, so that the adhesive force between the protective colloid and the attachment after curing is not affected, and the situation of separation between the protective colloid and the attachment during processing is unlikely to occur, allowing the protective colloid to effectively protect the attachment; and after the UV epoxy modified acrylate polymer is cured by the UV curing process, it can resist the impact of cutting fluid, chemical corrosion of cutting fluid, etc., making the protective colloid less likely to be altered, reducing the probability of forming residual colloid on the attachment, and facilitating the peeling off of the protective colloid.

[0027] Alternatively, the thermally expandable particles in this embodiment are thermally burstable microspheres with a core-shell structure, and for example, the thermally expandable particles include a shell and a foaming agent in the shell, and the shell is spherical and surrounded by the foaming agent. The temperature of the protective colloid after curing is between 110°C and 150°C, that is, when the temperature of the protective colloid is higher than 110°C and lower than 150°C, for example, 120°C, the foaming agent in the shell is vaporized by heat and generates internal pressure, that is, the foaming agent in this embodiment can be a physical foaming agent, and the shell is softened by heat and expands together with the foaming agent, so that the thermally expandable particles are rapidly expanded and stretched to become thin, and the protective colloid is expanded by the action of the internal pressure and external tension of the thermally expandable particles, and the adhesive force of the attachment can be reduced after the colloid expands, and the protective colloid can be easily peeled off. As can be seen from the above, by controlling the temperature of the protective colloid to be lower than 150°C, the thermally expandable particles can be prevented from being altered.

[0028] In addition, when the temperature of the protective colloid is between 110℃ and 150℃, the thermally expanded particles start to expand, and by shortening the expansion time to less than 5 seconds, the separation efficiency of the protective colloid can be improved. By making the ratio of the expansion volume of the thermally expanded particles to the initial volume less than 300%, the thermally expanded particles are prevented from becoming too large after expansion. In addition, the thermally expanded particles are uniformly distributed in the protective colloid, which makes it easier to separate the protective colloid from the attachment.

[0029] In this embodiment, the temperature of the protective colloid can be increased to above 110°C in various ways, specifically, the raw material constituting the protective colloid further includes magnetic particles, the weight percentage of the magnetic particles is 2-5%, and the magnetic particles are used to absorb the energy of the alternating magnetic field and convert it into heat, thereby increasing the temperature of the protective colloid itself. Specifically, after the attachment undergoes a processing process, an external alternating magnetic field can be passed through the attachment and the solid-state protective colloid, and a large amount of energy of the alternating magnetic field can be absorbed and rapidly converted into heat energy by utilizing the magnetocaloric effect of the magnetic particles in the protective colloid through eddy current loss, hysteresis loss, residual loss, etc., thereby rapidly increasing the temperature of the protective colloid to above 110°C. The effect of the external alternating magnetic field on the thermal effect of the attachment (especially the attachment made of metal material) is extremely low, the effect of the heat source on the attachment can be avoided, and the deformation in shape and size caused by the heating expansion / cooling contraction of the attachment can be reduced, and the quality of the attachment can be guaranteed. As will be appreciated, the temperature of the protective colloid can be increased to above 110° C. by directly heating the protective colloid and the attachment with a heating device, but the present embodiment is not limited thereto.

[0030] Furthermore, the magnetic particles in this embodiment include one or a combination of iron carbide, ferric oxide, manganese zinc ferrite, and nickel zinc ferrite, which allows the magnetic particles to effectively generate magnetocaloric effect due to the material properties, and when the particle size of the magnetic particles is 10 to 200 nanometers, the magnetic particles are uniformly distributed in the protective colloid, so that the temperature at each position of the protective colloid can be increased synchronously.

[0031] Optionally, in this embodiment, the raw material constituting the protective colloid further comprises a fluorescent agent, and the weight percentage of the fluorescent agent is 0.1-0.5%. Illustratively, the fluorescent agent is an externally added fluorescent agent, and the externally added fluorescent agent comprises one or a combination of stilbene type fluorescent agent, coumarin type fluorescent agent, pyrazoline type fluorescent agent, benzoxazole type fluorescent agent, and dicarbonyl imide type fluorescent agent, and the protective colloid is for absorbing incident light to generate fluorescence, which can facilitate the determination of the specific positions of the protective colloid and the attachment in the processing process, and can also be used to determine whether the protective colloid is separated from the attachment in the processing process.

[0032] In this embodiment, both the plasticizer and the active monomer are water-soluble, i.e., both the plasticizer and the active monomer can be dissolved or swelled in water. Illustratively, the plasticizer includes one or a combination of polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, and polyethylene glycol 1000. The active monomer includes polyethylene glycol acrylate.

[0033] Optionally, the cationic photoinitiator in this embodiment includes one or a combination of diaryliodonium hexafluorophosphate, mixed liquid triarylsulfonium hexafluoroantimonate, 4-(phenylthio)phenyldiphenylthiohexafluorophosphate, bis(4,4′-thioethertriphenylsulfonium)hexafluorophosphate, 4-isobutylphenyl-4′-methylphenyliodohexafluorophosphate.

[0034] The protective colloid provided in this embodiment has a liquid state and a solid state, and when changing from a liquid state to a solid state, a UV curing process needs to be carried out, and when the temperature of the protective colloid is higher than 110°C, it will expand and separate from the attachment. It can effectively protect the surface of the attachment, and avoids the contradiction that the protective film in the prior art needs to have strong adhesion to chemicals during the processing step, and is difficult to achieve low adhesion and easy separation during the peeling step after processing. The protective colloid has a simple composition, is suitable for large-scale industrial mass production, does not affect the attachment, has high stability, is more reproducible, and is low cost.

[0035] This embodiment further provides a method for using the protective colloid described above, which includes a curing step and a separating step.

[0036] As shown in FIG. 1, the curing step includes the following steps S1 and S2. S1 Apply liquid protective colloid to the attachment by dispensing, spraying or brushing.

[0037] A protective colloid is applied to the portion of the attachment that needs protection, and the method of applying the colloid may further include dipping, etc. Since the protective colloid is liquid, compared with the method of using a protective film in the prior art, it is easy to apply the protective colloid to a curved surface with a special shape, a complex characteristic position, or a fine structure, thereby realizing application without blind spots and improving the protective effect of the protective colloid.

[0038] Optionally, after performing step S1, the dispensing state can be inspected to determine whether the protective colloid completely covers the location to be protected and whether the protective colloid is evenly distributed; if YES, perform step S2; if NO, the protective colloid on the attachment needs to be wiped off and dispensed, sprayed or brushed again.

[0039] S2 The liquid protective colloid is cured by the UV curing process to harden the protective colloid and form adhesion between the attachment, and the wavelength of the ultraviolet light during the UV curing process is 365nm, 395nm or 405nm.

[0040] Since the protective colloid contains UV epoxy modified acrylate polymer, the protective colloid can be rapidly cured when exposed to UV light. The UV curing process can form strong chemical adhesion between the protective colloid and the surface of the attachment, which can resist transportation in subsequent processes, the impact and corrosion of cutting fluid in the processing process, the temperature of anodizing and the corrosion of chemical solutions, etc., and can protect the surface of the attachment from corrosion and impact without deformation.

[0041] Alternatively, in step S2, the thickness of the solid-state protective colloid is 100-200 nanometers, which provides higher protection, and the solid-state protective colloid has a material hardness of 75 Shore D or more, which allows the protective colloid to have higher abrasion resistance and scratch resistance, and can effectively prevent the attachment from being abraded, scratched or bruised.

[0042] As shown in FIG. 2, the separation step includes the following steps S3 and S4. S3 The temperature of the protective colloid is controlled to be higher than 110°C, and the thermally expandable particles in the protective colloid expand to generate internal pressure, causing a part or all of the protective colloid to expand and separate from the attachment.

[0043] In step S3, some or all of the protective colloid can be separated from the attachment by manually removing the protective colloid on the attachment or by placing the attachment in water to cause the protective colloid to separate from most or all of the attachment.

[0044] S4: The attachment and a portion of the protective colloid remaining on the attachment are placed in water at 60 to 95° C. for a predetermined period of time, thereby dissolving a portion of the protective colloid remaining on the attachment. The predetermined period of time is 2 to 20 minutes.

[0045] In order to ensure that no protective colloid residue remains on the attachment, it is necessary to keep the surface of the attachment clean by placing the attachment in water at 60 to 95°C, so that the expanding protective colloid overflows from the attachment and the minor residue on the surface of the attachment is swelled or dissolved by the hot water. For example, the attachment can be immersed in water and washed to improve the effect of removing the residue.

[0046] The protective colloid provided in this embodiment is simple and easy to use, and can be applied to multiple processing steps.

[0047] Optionally, if the raw material constituting the protective colloid further comprises magnetic particles, step S3 further comprises: The method includes controlling the solid-state protective colloid to pass through an alternating magnetic field, causing the magnetic particles to absorb the energy of the alternating magnetic field and convert it into heat, and raising the temperature of the protective colloid to above 110°C, thereby causing the thermal expansion particles in the protective colloid to expand and generate internal pressure, thereby expanding a part or all of the protective colloid and separating it from the attachment.

[0048] The power of the alternating magnetic field generator is 200 watts or more, and the frequency of the magnetic field generator is 300 kilohertz or more, so that the protective colloid can generate sufficient heat.

[0049] When the protective colloid and the method of using the protective colloid provided in this embodiment are applied to the machining process of a computer numerically controlled machine (CNC), as shown in FIG. 3, the specific steps are as follows: S01: Inspect the attachment and positioning status using the image sensor.

[0050] By checking the location status of the attachment, subsequent dispensing can be facilitated.

[0051] S1 Apply liquid protective colloid to the attachment by dispensing, spraying or brushing.

[0052] S02 Check whether the dispense state is passed. If it is YES, execute step S2. If it is NO, execute step S03. S03 Wipe off all protective colloid on the attachment and execute step S01.

[0053] If the dispense does not pass, the attachment positioning is inaccurate, meaning that the protective colloid has not been placed where it should be protected, and the attachment positioning status must be inspected and the attachment position adjusted.

[0054] S2 The liquid protective colloid is cured by the UV curing process to harden the protective colloid and form adhesion between the attachment, and the wavelength of the ultraviolet light during the UV curing process is 365nm, 395nm or 405nm.

[0055] S04 Implement CNC clamping and machining processes. S31 A solid-state protective colloid is controlled to pass through an alternating magnetic field, and the magnetic particles absorb the energy of the alternating magnetic field and convert it into heat. By raising the temperature of the protective colloid to above 110°C, the thermal expansion particles in the protective colloid expand to generate internal pressure, and some or all of the protective colloid expands and is separated from the attachment.

[0056] S4: The attachment and a portion of the protective colloid remaining on the attachment are placed in water at 60 to 95° C. for a predetermined period of time, thereby dissolving a portion of the protective colloid remaining on the attachment. The predetermined period of time is 2 to 20 minutes.

[0057] S05: A surface inspection is carried out on the attachment, and if the attachment passes the surface inspection, a warehousing process is carried out on the attachment.

[0058] Furthermore, if the surface inspection fails, the film can be removed manually or by related mechanical tools, and the surface inspection can be carried out again after the film is removed, so as to ensure the quality of the attachment and the product.

[0059] The above embodiments are merely illustrative of the basic principles and characteristics of the present invention, and the present invention is not limited to the above embodiments, and the present invention may be modified and changed in various ways without departing from the spirit and scope of the present invention, and all such modifications and changes are included within the scope of the present invention for which protection is sought. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A protective colloid for protecting a workpiece that is processed by being in a liquid state and a solid state, The raw materials constituting the protective colloid include a UV epoxy modified acrylate polymer, a thermal expansion particle, a plasticizer, an active monomer including polyethylene glycol acrylate, and a cationic photoinitiator; A protective colloid, characterized in that the weight percentage of the UV epoxy modified acrylate polymer is 40-65%, the weight percentage of the thermally expandable particles is 2-10%, the weight percentage of the plasticizer is 10-15%, the weight percentage of the active monomer is 10-30%, and the weight percentage of the cationic photoinitiator is 1-3%.

2. 2. The protective colloid according to claim 1, wherein the thermally expansive particles have a thermally stable temperature of 100° C., and the thermally expansive particles are uniformly distributed in the protective colloid.

3. 2. The protective colloid of claim 1, wherein the thermally expandable particles include a shell and a blowing agent within the shell.

4. 4. The protective colloid according to claim 3, wherein the foaming agent is a physical foaming agent.

5. 2. The protective colloid according to claim 1, wherein the raw material constituting the protective colloid further contains magnetic particles, and the weight percentage of the magnetic particles is 2 to 5%.

6. 6. The protective colloid of claim 5, wherein the magnetic particles include one or a combination of iron carbide, ferric oxide, manganese zinc ferrite, nickel zinc ferrite, and the magnetic particles have a particle size of 10 to 200 nanometers.

7. 2. The protective colloid according to claim 1, wherein the raw materials constituting the protective colloid further contain a fluorescent agent, and the weight percentage of the fluorescent agent is 0.1 to 0.5%.

8. 8. The protective colloid according to claim 7, wherein the fluorescent agent comprises one or a combination of a stilbene type fluorescent agent, a coumarin type fluorescent agent, a pyrazoline type fluorescent agent, a benzoxazole type fluorescent agent, and a dicarbonyl imide type fluorescent agent.

9. 2. The protective colloid of claim 1, wherein the plasticizer and the active monomer are water soluble, and the plasticizer comprises one of polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, polyethylene glycol 1000, or a combination thereof.

10. 2. The protective colloid of claim 1, wherein the cationic photoinitiator comprises one or a combination of diaryliodonium hexafluorophosphate, mixed liquid triarylsulfonium hexafluoroantimonate, 4-(phenylthio)phenyldiphenylthiohexafluorophosphate, bis(4,4'-thioethertriphenylsulfonium)hexafluorophosphate, 4-isobutylphenyl-4'-methylphenyliodohexafluorophosphate.

11. A method for using a protective colloid, comprising a curing step and a separating step, The curing step comprises: S1, in which the protective colloid according to any one of claims 1 to 10 is applied to the attachment as the workpiece by a dispenser, spray, or brush application method, and the protective colloid is in a liquid state; S2, in which the protective colloid in a liquid state is cured by a UV curing process to harden the protective colloid into a solid state and form an adhesive force between the protective colloid and the attachment, and the wavelength of the ultraviolet light in the UV curing process is 365 nanometers, 395 nanometers, or 405 nanometers; The separation step comprises: S3, controlling the temperature of the protective colloid to be higher than 110° C., and causing thermal expansion particles in the protective colloid to expand and generate internal pressure, thereby expanding a part or all of the protective colloid and separating it from the attachment; and S4, dissolving the remaining protective colloid on the attachment by placing the attachment and a portion of the protective colloid remaining on the attachment in water at 60 to 95°C for a predetermined period of time, the predetermined period of time being 2 to 20 minutes.

12. The method for using a protective colloid according to claim 11, wherein the raw materials constituting the protective colloid further contain magnetic particles, and in step S3, the protective colloid in a solid state is controlled to pass through an alternating magnetic field, so that the magnetic particles absorb the energy of the alternating magnetic field and convert it into heat, and the power of a magnetic field generator of the alternating magnetic field is 200 watts or more, and the frequency of the magnetic field generator is 300 kilohertz or more.

13. 12. The method for using a protective colloid according to claim 11, wherein in step S2, the thickness of the protective colloid in a solid state is 100-200 nanometers, and the protective colloid in a solid state has a material hardness of 75 Shore D or more.

14. 12. The method for using a protective colloid according to claim 11, wherein in step S3, the temperature of the protective colloid is controlled to be higher than 110°C and lower than 150°C.

15. 12. The method for using a protective colloid according to claim 11, wherein in step S3, the ratio of the expanded volume to the initial volume of the thermally expandable particles is less than 300%.

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