External electrode paste

Abstract

Provided are: a paste for an external electrode which makes it possible to suppress swelling of a central section compared to an end section when used for coating and suppress the occurrence of voids when a film is sintered after coating; a method for forming an external electrode in an electronic component using the paste for an external electrode; and a method for producing an electronic component including formation of an external electrode using the paste for an external electrode.　The paste for an external electrode includes a resin, a metal filler, and a solvent. The solvent used includes a combination of predetermined amounts of each of a first solvent and a second solvent satisfying a predetermined relationship regarding the boiling points thereof at atmospheric pressure.

Description

[Technical field]

[0001] The present invention relates to an external electrode paste used for forming external electrodes of electronic components, a method for forming external electrodes in electronic components using the external electrode paste, and a method for manufacturing electronic components including forming external electrodes using the external electrode paste. [Background technology]

[0002] A method for forming external electrodes of electronic components such as multilayer ceramic capacitors using an external electrode paste is known. Such an external electrode paste generally contains a resin as a binder, a metal filler, and a solvent.

[0003] Patent Document 1 describes a binder composition containing ethyl cellulose and an acrylic polymer, and the use of such a binder composition in the manufacture of a multilayer ceramic capacitor, etc. This binder composition is a composition in which ethyl cellulose and an acrylic polymer are simply mixed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-71986 A Summary of the Invention [Problem to be solved by the invention]

[0005] When a conventional external electrode paste, such as the external electrode paste containing the binder composition described in Patent Document 1, is applied to a ceramic body, the center swells more than the edges due to the influence of surface tension, etc. Therefore, the external electrodes formed have a convex shape that is thick in the center and thin at the edges. This makes it difficult to miniaturize electronic components. Furthermore, when a conventional binder composition such as that described in Patent Document 1 is used, voids are likely to occur when the coated film is sintered.

[0006] The present invention is devised to solve the above-mentioned problems, and aims to provide an external electrode paste that can suppress the swelling of the central portion compared to the edges when applied and the generation of voids when the applied film is sintered; a method for forming external electrodes in electronic components using the external electrode paste; and a method for manufacturing electronic components that includes forming external electrodes using the external electrode paste. [Means for solving the problem]

[0007] The paste for external electrodes is Resin and Metal filler; A solvent; Including, the solvent comprises one or more first solvents and one or more second solvents; The ratio of the mass of the first solvent to the mass of the solvent and the ratio of the mass of the second solvent to the mass of the solvent are each 40 mass% or more, The lowest boiling point T of one or more second solvents at atmospheric pressure Hl is the highest boiling point T of one or more first solvents at atmospheric pressure. Lh More than 10 degrees Celsius higher than The highest boiling point T of one or more second solvents at atmospheric pressure Hh But, T Hl +10℃ or less, The lowest boiling point T of one or more first solvents at atmospheric pressure Ll But, T Lh -10℃ or higher, The solvent may contain a sub-solvent in addition to the first solvent and the second solvent, The boiling point of the co-solvent at atmospheric pressure is (T Ll -10)℃ or less, (T Lh More than +10)℃(T Hl -10)℃ or less, or (T Hh +10)℃.

[0008] A method for forming external electrodes in an electronic component includes the steps of: providing an electronic component element; applying the external electrode paste to an outer surface of an electronic component element; and baking the external electrode paste applied to the outer surfaces of the electronic component elements.

[0009] The method for manufacturing an electronic component is a method including a step of forming external electrodes by the above-described method for forming external electrodes. Effect of the Invention

[0010] The external electrode paste of the present invention can suppress swelling of the center compared to the edges when applied, and suppress the generation of voids when the applied film is sintered. Therefore, electronic components manufactured using the external electrode paste can be made smaller. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram for explaining a process of applying the external electrode paste to a ceramic body, in which (a) shows the ceramic body immersed in the external electrode paste, (b) shows the ceramic body being pulled up, (c) shows the generation of an outward flow of the external electrode paste from the center to the ends, and (d) shows the external electrode paste having dried. [Diagram 2] FIG. 13 is a diagram showing the external shape and cutting positions of a ceramic body used to check the flatness of an external electrode paste. [Diagram 3] FIG. 1(a) is a schematic diagram showing a cross section of a multilayer ceramic capacitor in which external electrodes are formed using the external electrode paste of the present invention, and FIG. 1(b) is a schematic diagram showing a cross section of a multilayer ceramic capacitor in which external electrodes are formed using a conventional external electrode paste. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The features of the present invention will be described in detail below with reference to embodiments of the present invention.

[0013] The external electrode paste in one embodiment contains a resin, a metal filler, and a solvent. The resin, the metal filler, and the solvent will be described in detail below.

[0014] The type of resin is not particularly limited as long as the desired effect is not hindered. As the resin, various resins that have conventionally been blended in pastes for external electrodes can be used without any particular limitation. Examples of preferred resins include cellulose-based resins, acrylic resins, and butyral-based resins. It is particularly preferred that the resin contains a cellulose-based resin, since it is easy to obtain an external electrode paste having a viscosity suitable for forming the external electrodes. It is also preferred that the resin contains a copolymer resin having a block derived from a cellulose-based resin. Such a copolymer resin may be a block copolymer or a graft copolymer.

[0015] The cellulose-based resin is, for example, at least one of ethyl cellulose, methyl cellulose, hydroxypropyl cellulose, trityl cellulose, acetyl cellulose, carboxymethyl cellulose, and nitrocellulose.

[0016] The acrylic resin is, for example, a homopolymer or copolymer of one or more monomers selected from isobutyl methacrylate, methyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, n-butyl methacrylate, and 2-ethylhexyl methacrylate.

[0017] The metal filler is made of the metal that constitutes the external electrodes. The type of metal that constitutes the metal filler is appropriately selected depending on the type of metal that constitutes the external electrodes. The metal is preferably copper (Cu), silver (Ag), nickel (Ni), or an alloy containing these metals, because of its excellent electrical conductivity and the ease of obtaining metal fillers with the desired particle size. The alloy containing these metals preferably contains one or more selected from the group consisting of copper (Cu), silver (Ag), and nickel (Ni). It is also preferable that the alloy containing these metals contains tin (Sn).

[0018] In terms of improving the wettability of the metal filler to the solvent described later, it is preferable that the metal filler has a coating layer on its surface. The method of forming the coating layer is not particularly limited. For example, the metal filler may be coated with the coating layer by spraying a solution of the coating agent toward an air flow containing the metal filler and drying the solution attached to the metal filler. In addition, a coating agent that can be attached or bonded to a metal surface may be attached or bonded to the metal filler surface to form a coating layer. Examples of the coating agent include silane coupling agents, titanium coupling agents, aluminum coupling agents, aliphatic carboxylic acids, aliphatic thiols, and amine coupling agents. These coating agents may be used alone or in combination of two or more. Among these, aliphatic carboxylic acids and silane coupling agents are preferred because they have good binding properties to the metal filler surface, are inexpensive, and are easily available.

[0019] Examples of silane coupling agents include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-octyltriethoxysilane, 1,6-bis(trimethoxysilyl)hexane, and trifluoropropyltrimethoxysilane.

[0020] The particle size of the metal filler is preferably 80 nm or more and 1000 nm or less, more preferably 90 nm or more and 800 nm or less, and particularly preferably 100 nm or more and 500 nm or less. Here, the particle size of the metal filler is a median system D50 obtained by observing the metal filler with a scanning electron microscope. In addition, when the metal filler includes a coating layer, the particle size of the metal filler includes the thickness of the coating layer.

[0021] The external electrode paste contains a solvent as a component that dissolves the above-mentioned resin, disperses the metal filler, and imparts fluidity to the paste.

[0022] The solvent includes one or more first solvents and one or more second solvents. The ratio of the mass of the first solvent to the mass of the solvent and the ratio of the mass of the second solvent are each 40 mass % or more. The lowest boiling point T of one or more second solvents at atmospheric pressure Hl is the highest boiling point T of one or more first solvents at atmospheric pressure. Lh is more than 10°C higher. The highest boiling point T of one or more second solvents at atmospheric pressure Hh But, T Hl It is below +10℃. The lowest boiling point T of one or more first solvents at atmospheric pressure Ll But, T Lh It is above -10°C. The solvent may contain a sub-solvent in addition to the first solvent and the second solvent. The solvent may consist of a first solvent and a second solvent, or a first solvent, a second solvent, and a co-solvent. The boiling point of the co-solvent at atmospheric pressure is (T Ll -10)℃ or less, (T Lh More than +10)℃(T Hl -10)℃ or less, or (T Hh +10)℃.

[0023] As described above, the solvent includes one or more first solvents and one or more second solvents. From the viewpoint of ease of preparation of the external electrode paste, the number of first solvents is preferably one or two, and more preferably one. Also, the number of second solvents is preferably one or two.

[0024] The ratio of the mass of the first solvent to the mass of the solvent is 40 mass% or more, respectively. Since this makes it easier to prevent the central part from swelling compared to the ends when the external electrode paste is applied, the ratio of the sum of the mass of the first solvent and the mass of the second solvent to the mass of the solvent is preferably 90 mass% or more, more preferably 95 mass% or more, and even more preferably 100 mass%.

[0025] For a solvent, the lowest boiling point T of one or more secondary solvents at atmospheric pressure Hl is the highest boiling point T of one or more first solvents at atmospheric pressure. Lh The boiling point difference between the second solvent and the first solvent is 10° C. or more higher than that between the ends of the external electrode paste. By including the second solvent and the first solvent that satisfy this boiling point difference, it is easy to suppress swelling of the center compared to the ends when the external electrode paste is applied. Hl is T Lh It is preferably at least 20° C. higher than the above temperature, and more preferably at least 30° C. higher than the above temperature. When forming the external electrodes, the solvent is easily removed, so T Hl is (T Lh +100)℃ or less, and (T Lh +80)℃ or less, and (T Lh It is even more preferable that the temperature is not higher than +50°C.

[0026] The boiling point of each of the one or more solvents constituting the second solvent under atmospheric pressure is not particularly limited as long as the desired effect can be obtained. The boiling point of each of the one or more solvents constituting the second solvent under atmospheric pressure is preferably 200° C. or higher and 300° C. or lower, more preferably 210° C. or higher and 250° C. or lower. The boiling point of each of the one or more solvents constituting the first solvent under atmospheric pressure is not particularly limited as long as the desired effect can be obtained. The boiling point of each of the one or more solvents constituting the first solvent under atmospheric pressure is preferably 150°C or higher and 240°C or lower, more preferably 200°C or higher and 230°C or lower.

[0027] Regarding the solvents, the difference between the weighted average value of the surface tension of the second solvent and the weighted average value of the surface tension of the first solvent is preferably 3 mN / m or more, and more preferably 8 mN / m or more. Either the surface tension of the first solvent or the surface tension of the second solvent may be higher. When the weighted average value of the surface tension of the second solvent and the weighted average value of the surface tension of the first solvent satisfy the above relationship, it is easy to suppress swelling of the center compared to the edges when the external electrode paste is applied to form a film.

[0028] The weighted average value of the surface tension of the second solvent is preferably 23 mN / m or more and 50 mN / m or less. The weighted average value of the surface tension of the first solvent is preferably 20 mN / m or more and 47 mN / m or less.

[0029] The ratio of the mass of the solvent to the mass of the external electrode paste is preferably 35% by mass to 50% by mass, more preferably 37.5% by mass to 45% by mass. By using a solvent in such an amount, the external electrode paste can be smoothly convected and flowed when a film is formed using the external electrode paste, and swelling of the center compared to the edges when the external electrode paste is applied can be easily suppressed.

[0030] Specific examples of suitable solvents include Texanol, propylene glycol monophenyl ether, butyl carbitol, terpene solvents, diethylene glycol, carbitol acetate, butyl carbitol acetate, benzyl alcohol, methyl propylene diglycol, diphenyl ether, and ethylene glycol.

[0031] As long as the desired effect is obtained, the external electrode paste may contain optional components such as glass frit, dispersants, thickeners, etc. in addition to the above-mentioned resin and metal filler. These optional components are used appropriately taking into account the amounts usually used in external electrode pastes.

[0032] The resin and metal filler described above, and the optional components described above, if necessary, are dissolved and dispersed in a desired ratio in a solvent that satisfies the above-mentioned specific requirements, to obtain a paste for external electrodes.

[0033] FIG. 1 is a diagram for explaining the process of applying an external electrode paste 11 to a ceramic body 12 in this embodiment.

[0034] First, the regions of the ceramic body 12 where the external electrodes are to be formed are immersed in the external electrode paste 11 (see FIG. 1(a)). Next, the ceramic body 12 is pulled up (see FIG. 1(b)). The regions where the external electrodes are to be formed are, for example, both end faces of the ceramic body 12. Here, the description will be given with the reference numeral 11a denoting the external electrode paste attached to the ceramic body 12. When the above-mentioned external electrode paste is used as the external electrode paste 11a, when the ceramic body 12 is pulled up, Marangoni convection occurs as shown by the arrows in FIG. 1(b) due to the temperature difference and the solute concentration difference between the center and the end of the external electrode paste 11a attached to the ceramic body 12. The solute is a resin contained in the external electrode paste 11a.

[0035] The amount of the paste for external electrodes applied at the end is smaller than that at the center, and the gas-liquid interface per volume at the end is larger. Therefore, drying is more likely to proceed at the end. Therefore, the proportion of solids (resin and metal filler) in the paste for external electrodes is greater at the end than at the center. As a result, the solid-liquid interface at the end increases relative to the center, making the end energetically unstable. In addition, among the solvents, the first solvent evaporates preferentially. For these reasons, the solvent moves from the center to the end so that the concentration gradient of the solids in the paste for external electrodes is mitigated. In addition, convection of the solvent occurs from the center to the end so that the composition of the solvent is homogenized. As a result, an outward flow is generated in which the paste for external electrodes 11a flows from the center to the end (see FIG. 1(c)). This outward flow occurs while the resin concentration at the end is higher than the resin concentration at the center. Note that as drying proceeds, the interface between the solute and the solvent increases. It is considered that the greater the interfacial tension at this time, the more energetically unstable the paste is, and the stronger the outward flow becomes.

[0036] Here, when the above-mentioned external electrode paste is used, as described above, the solvent moves so that the composition of the solvent becomes uniform during the process of drying the external electrode paste 11a on the ceramic body 12. This movement of the solvent plays a role in promoting the outward flow. The generation of a strong outward flow causes the external electrode paste 11a to flow from the center to the ends. This makes it possible to suppress the external electrode paste 11a from swelling outward in the center (see FIG. 1(d)).

[0037] That is, the external electrode paste of this embodiment contains the above-mentioned second solvent and first solvent in a predetermined amount as the solvent, and therefore has better fluidity than the conventional external electrode paste. As a result, the use of the external electrode paste of this embodiment can suppress the central portion from swelling compared to the ends. Therefore, the electronic component manufactured using the external electrode paste of this embodiment can be made smaller.

[0038] Fig. 2(a) is a schematic cross-sectional view of a multilayer ceramic capacitor 20a in which external electrodes 22a are formed on a ceramic body 21a using the external electrode paste of this embodiment, and Fig. 2(b) is a schematic cross-sectional view of a multilayer ceramic capacitor 20b in which external electrodes 22b are formed on a ceramic body 21b using a conventional external electrode paste.

[0039] As shown in FIG. 2(b), the shape of the external electrode 22b formed using the conventional external electrode paste is a convex shape that is thick in the center and thin at the ends. In contrast, the shape of the external electrode 22a formed using the external electrode paste of this embodiment is a flat shape with reduced bulge in the center. Therefore, by forming an external electrode using the external electrode paste of this embodiment, the multilayer ceramic capacitor can be made smaller. Furthermore, when compared at the same size, the external electrode can be made thinner and the internal element can be made larger, making it possible to increase the capacity.

[0040] The method of applying the external electrode paste to the ceramic body in this embodiment is not limited to immersion in the external electrode paste described above.

[0041] The external electrode paste described above can be used when forming external electrodes of electronic components, such as multilayer ceramic capacitors. Electronic components manufactured using this external electrode paste can be manufactured through the steps of preparing an electronic component element, applying the external electrode paste of this embodiment to the outer surface of the electronic component element, and baking the applied external electrode paste to form external electrodes.

[0042] A step of drying the external electrode paste may be included between the step of applying the external electrode paste and the step of baking the applied external electrode paste.

[0043] The external electrode paste can be applied to the outer surfaces of electronic component elements by a variety of methods such as printing and dipping.

[0044] The electronic component element has a structure in which, for example, ceramic layers and internal electrodes are alternately stacked in multiple layers. EXAMPLES

[0045] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0046] In the examples and comparative examples, solvents S1 to S5 having the following boiling points and surface tensions were used as solvents. Note that the boiling points listed below are those under atmospheric pressure. S1: Boiling point 231 °C, surface tension 26mN / m S2: Boiling point 205℃, surface tension 48mN / m S3: Boiling point 244℃, surface tension 28mN / m S4: Boiling point 218℃, surface tension 31mN / m S5: Boiling point 220℃, surface tension 29mN / m

[0047] In Examples 1 to 8, Examples 10 to 18, Comparative Example 1, and Comparative Example 2, copper fine particles having an average diameter shown in Table 2 and having a coating layer were used as the metal filler. In Example 9, the same particles having an average diameter shown in Table 2 but not having a coating layer were used as the metal filler.

[0048] Resin R1 containing a cellulose-based resin was used as the resin in Examples 1 to 7, Examples 9 to 18, Comparative Examples 1 and 2. Resin R2 not containing a cellulose-based resin was used in Example 8.

[0049] 50 parts by mass of the metal filler shown in Table 2 and 7 parts by mass of the resin of the type shown in Table 2 were dissolved and dispersed in a solvent to obtain the solid content concentration shown in Table 2, to obtain an external electrode paste for each of the Examples and Comparative Examples. In Examples 1 to 18 and Comparative Example 2, a mixed solvent in which the first solvent and the second solvent shown in Table 1 were mixed at a mass ratio of 1:1 was used as the solvent. In Comparative Example 1, S5 shown in Table 1 was used alone as the solvent. The flatness of the film formed using the obtained external electrode paste and the denseness (void suppression) of the film formed after sintering using the obtained external electrode paste were evaluated according to the following methods. The evaluation results are shown in Table 2.

[0050] <Flatness evaluation> The flatness of the film formed using the external electrode paste was confirmed by the following method. First, a ceramic body 40 was prepared having a length direction L dimension of 1.0 mm, a width direction W dimension of 0.5 mm, and a thickness direction T dimension of 0.5 mm, as shown in Fig. 4. This ceramic body 40 constitutes a multilayer ceramic capacitor after the external electrodes are formed, and is formed by firing a laminate in which a plurality of ceramic green sheets coated with the internal electrode paste are laminated. An internal electrode 42 was exposed on an end face 41 of the ceramic body 40 and on an end face located opposite to the end face 41 in the length direction L.

[0051] The end surface 41 of the prepared ceramic body 40 was immersed in the external electrode paste, and the external electrode paste applied to the end surface 41 of the ceramic body 40 and its periphery was then dried. Then, the difference in film thickness of the external electrode paste when the ceramic body 40 was cut along the AA cutting line and the BB cutting line shown in FIG. 4 was examined. More specifically, the difference between the film thickness of the thickest part of the film thickness of the external electrode paste at the position where the ceramic body 40 was cut along the AA cutting line and the film thickness of the thinnest part of the film thickness of the external electrode paste at the position where the ceramic body 40 was cut along the BB cutting line was examined. The film thickness of the thickest part of the film formed using the external electrode paste at the position where the ceramic body 40 was cut along the AA cutting line is the film thickness at the center position in the thickness direction T. Also, the film thickness of the thinnest part of the film formed using the external electrode paste at the position where the ceramic body 40 was cut along the BB cutting line is the film thickness at the end of the thickness direction T.

[0052] Here, the AA cutting line is a cutting line taken at the center of the ceramic body 40 in the width direction W, along a plane defined by the length direction L and thickness direction T. The BB cutting line is a line parallel to the AA cutting line, and is a cutting line taken at the end of the internal electrode 42 in the width direction W of the ceramic body 40. The position of the BB cutting line is, for example, 30 μm inward in the width direction W from the end of the ceramic body 40 in the width direction W.

[0053] Among the thicknesses of the films formed using the external electrode paste, the case where the difference between the thickness of the thickest part and the thickness of the thinnest part was 30 μm or less was judged as ⊚. The case where the difference in the thickness was more than 30 μm and 40 μm or less was judged as ◯. The case where the difference in the thickness was more than 40 μm was judged as ×.

[0054] <Density (void) evaluation> After forming a film from the external electrode paste of each Example and Comparative Example in the same manner as in the flatness evaluation, the obtained film was sintered at a maximum temperature of 750° C. in a nitrogen atmosphere. The sintered film was observed by a scanning electron microscope (SEM) from a direction substantially perpendicular to the end face 41 of the ceramic body 40. From the obtained observation image, the ratio of the area of ​​the void portion to the area of ​​the sintered film was obtained. When the obtained area ratio of the void portion was less than 1.6%, it was judged as ⊚. When the area ratio of the void portion was 1.6% or more and less than 2.0%, it was judged as ◯. When the area ratio of the void portion was 2.0% or more, it was judged as x.

[0055] [Table 1]

[0056] [Table 2]

[0057] According to Examples 1 to 18, it is found that an external electrode paste containing a combination of a first solvent and a second solvent so as to satisfy the above-mentioned specified requirements can prevent the central part from swelling compared to the edges when applied, and can prevent the occurrence of voids when the applied film is sintered. On the other hand, according to Comparative Example 1 and Comparative Example 2, when the external electrode paste does not contain a combination of the first solvent and the second solvent so as to satisfy the above-mentioned specified requirements, it is found that it is not possible to simultaneously prevent the central part from swelling compared to the ends when the paste is applied and to prevent the occurrence of voids when the applied film is sintered. [Explanation of symbols]

[0058] 11 External electrode paste 11a External electrode paste attached to ceramic body 12 Ceramic body 20 Ceramic body 21 End face 22 Internal electrode 30a, 30b Multilayer ceramic capacitor 31a, 31b Ceramic body 32a, 32b external electrode

Claims

1. Resin and Metal filler; A solvent; Including, the solvent comprises one first solvent and one second solvent; a ratio of the mass of the first solvent to the mass of the solvent and a ratio of the mass of the second solvent to the mass of the solvent are each 40 mass% or more; a ratio of the sum of the mass of the first solvent and the mass of the second solvent to the mass of the solvent is 95 mass% or more; The boiling point of the second solvent under atmospheric pressure is higher by 10° C. or more than the boiling point of the first solvent under atmospheric pressure; The solvent may include a sub-solvent in addition to the first solvent and the second solvent, The boiling point of the auxiliary solvent under atmospheric pressure is less than (the boiling point of the first solvent under atmospheric pressure - 10°C), or is more than (the boiling point of the first solvent under atmospheric pressure + 10°C) and less than (the boiling point of the second solvent under atmospheric pressure - 10°C), or is more than (the boiling point of the second solvent under atmospheric pressure + 10°C); A paste for external electrodes, wherein the difference between the surface tension value of the first solvent and the surface tension value of the second solvent is 3 mN / m or more.

2. 2. The external electrode paste according to claim 1, wherein the boiling point of the second solvent under atmospheric pressure is at least 20° C. higher than the boiling point of the first solvent under atmospheric pressure.

3. 2. The external electrode paste according to claim 1, wherein a difference between a surface tension value of the first solvent and a surface tension value of the second solvent is 8 mN / m or more.

4. The paste for external electrodes according to claim 1 , wherein the resin comprises a cellulose-based resin.

5. The external electrode paste according to any one of claims 1 to 4, wherein the metal filler has a coating layer on its surface.

6. The coating layer is made of a coating agent attached or bonded to the surface of the metal filler, 6. The external electrode paste according to claim 5, wherein the coating agent is at least one selected from the group consisting of a silane coupling agent, a titanium coupling agent, an aluminum coupling agent, an aliphatic carboxylic acid, an aliphatic thiol, and an amine coupling agent.

7. 7. The external electrode paste according to claim 1, wherein a ratio of the mass of the solvent to the mass of the entire external electrode paste is 35 mass % or more and 50 mass % or less.

8. providing an electronic component element; A step of applying the external electrode paste according to any one of claims 1 to 7 to an outer surface of an electronic component element; and baking the external electrode paste applied to the outer surface of the electronic component element.

9. A method for manufacturing an electronic component, comprising the step of forming external electrodes by the method for forming external electrodes according to claim 8.

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