Electronic Components
By designing an adjustable elastic clamp structure in electronic components, the clamping instability caused by the tolerance of the daughter plate is solved, and stable clamping within the tolerance range and optimization of the overall device size is achieved.
Patent Information
- Application Number
- JP2021018167
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-02-08
- Publication Date
- 2025-04-21
- Estimated Expiration
- 2041-02-08
AI Technical Summary
When existing electronic components are fixed to the daughter board, clamping is unstable due to the allowable tolerance of the daughter board thickness, thick daughter board causes excessive deformation of the clamping member, and thin daughter board has problems such as poor clamping.
An electronic component with an adjustable clamping structure is designed, using two pairs of symmetrical elastic clamping members (first and second clamping members). The first clamping member is responsible for clamping when the thin daughter plate is and the second clamping member is responsible for clamping when the thick daughter plate is ensured to stabilize the clamping of the daughter plate within the tolerance range.
It is realized within the allowable tolerance range of the daughter plate thickness, ensuring stable clamping of the daughter plate, avoiding the problems of poor clamping and excessive deformation of the clamping parts, and reducing the size of the overall device.
Smart Images

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Abstract
Description
[Technical field]
[0001] FIELD OF THE DISCLOSURE Embodiments of the present invention relate to electronic components, such as pressure sensors. [Background technology]
[0002] Generally, electronic components are housed in a case in which a board on which circuit components are arranged is stored. The board is positioned and held by protrusions provided on both sides of the case (see, for example, Patent Document 1). [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2003-229682 A Summary of the Invention [Problem to be solved by the invention]
[0004] When a part of a board is held by a protrusion provided on a case, there may be a tolerance for the thickness of the board as an allowable error. If the board is thick within the tolerance range, the protrusion will deform significantly and the board will not be able to be held adequately by the protrusion. Furthermore, if the protrusion deforms significantly, the case must be made larger to take into account the maximum deformation amount of the protrusion. On the other hand, if the board is thin within the tolerance range, a gap will occur between the board and the protrusion, and the board will not be able to be held adequately by the protrusion.
[0005] The present embodiment provides an electronic component capable of reliably holding a substrate having a thickness tolerance. [Means for solving the problem]
[0006] The electronic component of this embodiment is Two pairs of parallel side surfaces, a bottom surface connecting the two pairs of side surfaces, and an upper portion facing the bottom surface. With opening do A rectangular case, a base plate having a bottom surface placed on an upper edge of the case and covering the opening; Parallel to the above case A pair ofA pair of first engagement parts arranged opposite to each other on the side surfaces of the case; A pair of parallel and a pair of second engagement portions disposed adjacent to the pair of first engagement portions on the side surfaces, each of the pair of first engagement portions being Elastic a first arm having a first end and a second end, the first end A part of the pair of side surfaces and the second end is provided from a side surface of the substrate. The substrate A first projection protruding from the front surface side, and each of the pair of second engagement portions is Elastic a second arm having a third end and a fourth end, the third end being connected to the case; A part of the pair of side surfaces and the fourth end is provided from a side surface of the substrate. The substrate A second projection is provided on the front surface side of the second projection. Protruding direction The length of the first protrusion Direction Longer than length. [Brief description of the drawings]
[0007] [Figure 1] FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing a part of FIG. 1. [Diagram 3] Top view of Figure 2. [Figure 4] FIG. 4 is a side view showing a portion taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a side view showing the operation of FIG. 4; [Figure 6] FIG. 6 is a side view showing an operation different from that in FIG. 5 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0008] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same parts are denoted by the same reference numerals.
[0009] 1 shows an electronic component to which this embodiment is applied, for example, a pressure sensor. This embodiment is not limited to pressure sensors, and can be applied to various electronic components and electronic equipment.
[0010] 1 to 3, rectangular case 11 has a pair of first side surfaces 11-1 parallel to each other, a pair of second side surfaces 11-2 perpendicular to the first side surfaces and parallel to each other, and a bottom surface 11-3, and has an opening 11a at an upper portion facing the bottom surface. Each of the pair of first side surfaces 11-1 has a first cutout portion 11b and a second cutout portion 11c.
[0011] A plate 13 is attached to the first cutout 11b, and the plate 13 has, for example, an inlet 13a and an outlet 13b for a gas to be measured. A connector (not shown) is attached to the second cutout 11c. The connector has a plurality of terminals (not shown), and the plurality of terminals are connected to a pressure sensor and an electronic circuit (not shown) arranged inside the case 11.
[0012] An opening 11a of the case 11 is covered with a printed circuit board (hereinafter referred to as the board) 14. A pressure sensor is provided inside the case 11, and the pressure sensor is connected to the inlet 13a and the outlet 13b by, for example, a pipe (not shown).
[0013] Furthermore, the first side surface 11-1, the second side surface 11-2, and the substrate 14 of the case 11 are covered with a cover 12. The cover 12 is engaged with a plurality of protrusions 11d, 11e provided on the second side surface 11-2 of the case 11.
[0014] A pair of first engagement portions 11f and a pair of second engagement portions 11g for fixing the substrate 14 are provided on the second side surface 11-2 of the case 11. The pair of first engagement portions 11f are disposed opposite the parallel second side surface 11-2, and the pair of second engagement portions 11g are disposed adjacent to the first engagement portions 11f and opposite the parallel second side surface 11-2.
[0015] As shown in Fig. 1, each of the first engagement parts 11f has a first arm 11f-1 and a claw-shaped first protrusion 11f-2, and each of the second engagement parts 11g has a second arm 11g-1 and a claw-shaped second protrusion 11g-2. A first end of the first arm 11f-1 is provided on a part of the second side surface 11-2, and a second end of the first arm 11f-1 has a first protrusion 11f-2. A first end of the second arm 11g-1 is provided on a part of the second side surface 11-2, and a second end of the second arm 11g-1 has a second protrusion 11g-2.
[0016] As shown in FIG. 2, the first arm 11f-1 has a first length L1, and the second arm 11g-1 has a second length L2 that is longer than the first length L1.
[0017] 1 and 3, the first protrusion 11f-2 protrudes in a direction substantially perpendicular to the length direction of the first arm 11f-1, and the second protrusion 11g-2 protrudes in a direction substantially perpendicular to the length direction of the second arm 11g-1. The tips of the first protrusion 11f-2 and the second protrusion 11g-2 are, for example, substantially arc-shaped, and the tip of the second protrusion 11g-2 protrudes further than the tip of the first protrusion 11f-2. The shape of the first protrusion 11f-2 is similar to the shape of the second protrusion 11g-2, but may be different.
[0018] 4 shows an enlarged view of the first protrusion 11f-2 and the second protrusion 11g-2. The length of the first protrusion 11f-2 is L3, and the length of the second protrusion 11g-2 is L4, and L4 is longer than L3 (L3 <L4)。
[0019] Also, the position of the tip of the first protrusion 11f-2 is lower than the position of the tip of the second protrusion 11g-2. The difference between the position of the tip of the first protrusion 11f-2 and the position of the tip of the second protrusion 11g-2 is indicated by a distance L5. The distance L5 is equal to L2-L1 (L5=L2-L1), but may be different.
[0020] A gap is provided between the first arm 11f-1 and the second arm 11g-1 and the inner surface of the cover 12. The distance of this gap is indicated by Z. The first arm 11h-1 and the second arm 11g-1 can move within the range of this gap.
[0021] The distance between the pair of opposing first projections 11f-2 is X, The width of the substrate 14 disposed between the pair of first engagement portions 11f and the pair of second engagement portions 11g is defined as Y. If the distance between the first engagement portion 11f and the second engagement portion 11g and the inner surface of the cover 12 is Z, the relationship therebetween is expressed by the following formula.
[0022] (YX) / 2 <Z The width Y of the substrate 14 is equal to or slightly narrower than the distance between the pair of first arms 11f-1 (the pair of second arms 11g-1).
[0023] In the above configuration, the operation of the first engagement portion 11f and the second engagement portion 11g will be described. (For thin substrates) 5, when the thickness of the substrate 14 is thinner by T1 within the tolerance range than the standard thickness T0 shown in FIG. 4, the substrate 14 is held by the pair of first engagement portions 11f in contact with the corners of the substrate 14. Specifically, the first protrusions 11f-2 of the pair of first engagement portions 11f are positioned on the surface of the substrate 14 from the side surface side of the substrate 14, and the bases (lower portions) of the first protrusions 11f-2 are in contact with the corners of the substrate 14. Therefore, the first arm 11f-1 is slightly deformed toward the inner surface of the cover 12, and the substrate 14 is pushed toward the bottom surface of the case 11 by the first protrusions 11f-2 due to the elasticity of the first arm 11f-1.
[0024] On the other hand, the second projection 11g-2 of the second engagement portion 11g does not contact the surface of the substrate 14. For this reason, the second arm 11g-1 is hardly deformed.
[0025] (For thick boards) 6, when the thickness of the substrate 14 is thicker by T2 within the tolerance range than the standard thickness T0 shown in FIG. 4, the substrate 14 is held by the pair of second engagement portions 11g in contact with the corners of the substrate 14. Specifically, the second projections 11g-2 of the pair of second engagement portions 11g are positioned on the surface of the substrate 14 from the side surface side of the substrate 14, and the bases (lower portions) of the second projections 11g-2 are in contact with the corners of the substrate 14. Therefore, the second arm 11g-1 is slightly deformed toward the inner surface of the cover 12, and the substrate 14 is pushed toward the bottom surface of the case 11 by the second projections 11g-2 due to the elasticity of the second arm 11g-1.
[0026] On the other hand, the tip of the first projection 11f-2 of the first engagement portion 11f is in contact with the corner or side of the substrate 14. Therefore, when the thickness of the substrate 14 is thick within the tolerance range, the first projection 11f-2 cannot hold the substrate 14 toward the bottom surface of the case 11. At this time, the first arm 11f-1 is deformed toward the inner surface of the cover 12 more than the second arm 11g-1. However, since the length L3 of the first projection 11f-2 is shorter than the length L4 of the second projection 11g-2, and further, the length L1 of the first arm 11f-1 is shorter than the length L2 of the second arm 11g-1, the deformation amount of the first arm 11f-1 can be kept within the range of the distance Z of the gap between the first arm 11f-1 and the second arm 11g-1 and the inner surface of the cover 12 when the substrate 14 is not present.
[0027] If the thickness of the substrate 14 is slightly larger within the tolerance range, the substrate 14 is held by both the first projections 11f-2 and the second projections 11g-2.
[0028] (Effects of the embodiment) According to the above embodiment, the case 11 includes a pair of first engaging portions 11f and a pair of second engaging portions 11g, each of the first engaging portions 11f has a first arm 11f-1 and a first protrusion 11f-2, and each of the second engaging portions 11g has a second arm 11g-1 and a second protrusion 11g-2. The second arm 11g-1 is longer than the first arm 11f-1, and the second protrusion 11g-2 is longer than the first protrusion 11f-2. Therefore, when the thickness of the substrate 14 is thin within the tolerance range, the substrate 14 is held by the first protrusion 11f-2, and when the thickness of the substrate 14 is thick within the tolerance range, the substrate 14 is held by the second protrusion 11g-2. Therefore, according to the above embodiment, the substrate 14 can be reliably held even when the thickness varies within the tolerance range.
[0029] Moreover, according to the above embodiment, the length of the first protrusion 11f-2 is shorter than the length of the second protrusion 11g-2, so that when the thickness of the substrate 14 is thick within the tolerance range, the amount of deformation of the first arm 11f-1 can be suppressed. Furthermore, the length of the first arm 11f-1 is shorter than the length of the second arm 11g-1. Therefore, the distance Z of the gap between the first arm 11f-1 and the second arm 11g-1 and the inner surface of the cover 12 can be reduced, and the size of the cover 12 and the electronic component 10 can be suppressed.
[0030] In addition, the present invention is not limited to the above-mentioned embodiments as they are, and in the implementation stage, the components can be modified and embodied without departing from the gist of the invention. In addition, various inventions can be formed by appropriately combining the multiple components disclosed in the above-mentioned embodiments. For example, some components may be deleted from all the components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. [Explanation of symbols]
[0031] 10...electronic component, 11...case, 11-1...first side, 11-2...second side, 11a...opening, 11f...first engagement portion, 11f-1...first arm, 11f-2...first protrusion, 11g...second engagement portion, 11g-1...second arm, 11g-2...second protrusion, 12...cover, 14...board.
Claims
1. A rectangular case having two pairs of parallel side surfaces, a bottom surface connecting the two pairs of side surfaces, and an opening at an upper portion opposite the bottom surface; a base plate having a bottom surface placed on an upper edge of the case and covering the opening; A pair of first engagement portions disposed opposite to the pair of parallel side surfaces of the case; a pair of second engagement portions disposed adjacent to the pair of first engagement portions on the pair of parallel side surfaces of the case; Equipped with Each of the pair of first engagement portions includes a first arm having elasticity, the first arm having a first end and a second end, the first end being provided on a portion of the pair of side surfaces, and the second end having a first protrusion protruding from a side surface side of the substrate toward a front surface side of the substrate, Each of the pair of second engagement portions includes a second arm having elasticity, the second arm having a third end and a fourth end, the third end being provided on a part of the side surface of the pair of cases, and the fourth end having a second protrusion protruding from a side surface side of the substrate to a front surface side of the substrate, An electronic component, characterized in that the length of the second protrusion in the protruding direction is longer than the length of the first protrusion in the protruding direction.
2. a cover attached to the case and covering the substrate, the first engagement portion, and the second engagement portion; The distance between the pair of opposing first projections is X, A width of the substrate disposed between the pair of first engaging portions and the pair of second engaging portions is defined as Y, If the distance between the first engaging portion and the second engaging portion and the inner surface of the cover is Z, the relationship therebetween is expressed by the following formula: (Y-X) / 2<Z 2. The electronic component according to claim 1 .
3. 2. The electronic component of claim 1, wherein the first arm has a first length and the second arm has a second length that is longer than the first length.
4. 2 . The electronic component according to claim 1 , wherein a tip of the second projection is positioned higher from the surface of the substrate than a tip of the first projection is positioned higher from the surface of the substrate.
Citation Information
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