21results about "Small component housings" patented technology

A semiconductor module includes a circuit board mounted on a base, a case having a sidewall and a lid and covering the circuit board, a plurality of conductive plates each parallel to a predetermined plane, electrically connected to different conductive patterns. The lid of the case has a partition that protrudes from an inner surface of the lid toward the base between two of the conductive plates. The partition has a first portion at a position where the partition and the conductive plates overlap each other, and a second portion at a position where the partition and the conductive plates do not overlap each other in a side view. The second portion has a cutout section disposed such that in a depth direction, a distance from the base to the second portion is greater than a distance from the base to the first portion.

Electrically conductive and hermetic vias are disposed within a flexible insulator substrate of a feedthrough assembly to provide miniaturization of feedthrough assemblies inasmuch as the feedthrough components are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

An ultrasonic sensor includes a piezoelectric element, a cell case (3) configured to support the piezoelectric element bonded to a front portion of the cell case at an inside of the cell case, the cell case having an opening at a rear portion thereof, a PCB assembly electrically connected to the piezoelectric element, a housing (7) coupled to the opening of the cell case while receiving the PCB assembly therein and configured to seal a space required for electrical connection between the piezoelectric element in the cell case and the PCB assembly, a filler filling the space required for electrical connection between the piezoelectric element and the PCB assembly, after completion of the electrical connection between the piezoelectric element and the PCB assembly, and a rear cover configured to seal a rear opening formed at the housing in order to allow insertion of the PCB assembly.

A wireless receiver dongle for very small connectors (such as USB-C or Apple Lightning connectors) that is thin enough to sit almost flush with the computer host device into which it is inserted.

A waterproof gate assembly, which is configured to be mounted to a housing and includes a cover, an installation axle and a fixing member, is provided. The installation axle is connected to the cover, allowing the cover to rotate relative to the installation axle. The installation axle includes an axial groove, an engaging structure and a fixing structure. The axial groove is connected to the cover and includes a first end portion and a second end portion. The engaging structure is connected to one side of the axial groove corresponding to the cover, extends to the first end portion of the axial groove, and is configured to be engaged at the housing. The fixing structure is connected to one side of the axial groove corresponding to the cover, and close to the second end portion. The fixing member passes through the fixing structure and is fixed at the housing.

The invention proposes a power semiconductor module and a method for arranging the module on a motor, the power semiconductor module having: a power semiconductor assembly; a housing having a recess in a housing side having an outer surface, the recess having a passage direction along the direction of the normal to the outer surface; having an internal contact device that electrically contacts an external connection element, in particular designed as a load terminal element, in the interior of the housing, and a section is arranged in the recess; and having a spring element, wherein the connection element is designed as a rigid metal profile having an internal contact surface and an external contact surface, wherein the external contact surface is accessible from the outside, wherein the connection element is connected to the housing via an electrically insulating and mechanically resilient holding device, such that the connection element is movable along the passage direction, and wherein the spring element is arranged and designed such that its spring action acts directly or indirectly on the connection element along the passage direction.

The application discloses a logistics anti-theft positioning box with an anti-disassembly structure and relates to the technical field of logistics positioning box installation. The surface of the first connecting pipe is provided with a first connecting groove, the bottom end of the first connecting pipe is provided with a second connecting pipe, the surface of the second connecting pipe is provided with two second connecting grooves, and the bottom end of the second connecting pipe is provided with a third connecting pipe. In the application, the positioning box body is installed in the mounting block by connecting the fixing plate, the mounting block and the positioning box body through bolts, the mounting block and the fixing pipe at the bottom end thereof are in contact with the first connecting pipe and the second connecting pipe, the first spring is used to enable the moving plate, the moving rod and the first ball to move into the fixing pipe through the positioning hole, the positioning box body and the like are fixed on the connecting pipe through the internal fixing mode, the theft of the positioning box by personnel is avoided, the loss of property is avoided, and the problem that the existing logistics positioning box does not have an anti-theft function is solved.

An apparatus including a housing, circuitry at least partially within the housing, a power source including first and second terminals, first and second electrically conductive leads, and a coupler. The first and second electrically conductive leads may be connected electrically to the first and second terminals, respectively, of the power source. The coupler may be attached to the power source. At least a portion of the housing may extend into the coupler. The coupler may include one or more openings through which the first and second electrically conductive leads are capable of being laser welded to first and second contact pads, respectively, of the circuitry. A method for manufacturing the apparatus may include laser welding the first and second electrically conductive leads to the first and second contact pads, respectively, of the circuitry through the one or more openings of the coupler.

An electronic device including a foldable housing including a first housing, a second housing, and a connection structure; a flexible display; a first plate including at least a portion disposed on a lower end of a first area of the display and a first periphery; a second plate including at least a portion disposed on a lower end of a second area of the display, and a second periphery; and a protection layer. When the electronic device is in an unfolded state, the first periphery and the second periphery are configured to be in contact with the display. When the electronic device pivots from the unfolded state to a folded state, the first periphery and the second periphery are configured to be spaced apart from the display, and the protection layer is configured to cover an area of the display exposed between the first periphery and the second periphery.

Method for producing a water-resistant substrate (20), wherein the method comprises the steps: Providing a substrate (22); Mounting the substrate (22) with at least one component; Purifying the substrate (22) containing the at least one component to form a purified substrate (22); and Deposition of a multilayer waterproof coating (24, 26, 28) onto the cleaned substrate (22); wherein the multi-layer waterproof coating (24, 26, 28) consists exclusively of silicone; wherein the deposition step comprises a step of spraying a first water-resistant layer (24) onto the cleaned substrate (22) and curing the first water-resistant layer (24); wherein the deposition step further comprises a step of spraying a second waterproof layer (26) onto the first waterproof layer (24) and curing the second waterproof layer (26); and wherein the deposition step further comprises a step of spraying a third waterproof layer (28) onto the second waterproof layer (26) and curing the third waterproof layer (28) to produce the multilayer waterproof coating (24, 26, 28).

The invention discloses a TF card embedded with a national secret security chip, and belongs to the technical field of intelligent chips, the TF card comprises a TF card body and a U-shaped frame used for storing the TF card body, a groove structure is arranged in the U-shaped frame, a packaging assembly is rotatably connected in the groove structure of the U-shaped frame, one side of the TF card body is inserted into the packaging assembly, and the other side of the TF card body is inserted into the packaging assembly. A locking and pushing assembly is slidably connected to the top surface of the U-shaped frame, a top fixing assembly is inserted into the U-shaped frame, the bottom end of the top fixing assembly is inserted into the packaging assembly and used for stopping the packaging assembly in the U-shaped frame, and the locking and pushing assembly is pushed to move horizontally on the U-shaped frame, so that one side of the top fixing assembly extends out of the outer wall of the U-shaped frame, and the bottom end of the top fixing assembly is separated from the packaging assembly. By adopting the cooperative sealing design of the rotating frame and the blocking part, the protection cavity is formed in the U-shaped frame, so that daily collision is effectively resisted, the impact resistance is improved, the failure rate of the intelligent chip in a humid environment is reduced, and the protection effect on the intelligent chip is improved.

In some examples, a feedthrough assembly for a medical device may include a collar. The collar defines an aperture extending through the collar from an outer end surface defined by the collar to an inner end surface defined by the collar. The aperture includes a first portion having a first diameter and a second portion having a second diameter smaller than the first diameter. The aperture defines a longitudinal axis extending therethrough, and the collar defines a flange between the first and second portions of the aperture, the flange extending radially inward toward the longitudinal axis. The feedthrough assembly may also include a conductive pin within the aperture and an insulating member surrounding at least a portion of the pin. The insulating member electrically insulates the conductive pin from the collar, and the flange and the surface of the insulating member adjacent to the flange may define a space therebetween.

The methods can involve mounting a plurality of microelectronic chips onto a printed circuit board (PCB). The individual microelectronic chips within the plurality of chips can be electrically connected via at least one via on the PCB. Microelectronic component packages can be isolated from the PCB, each package comprising at least one microelectronic chip from the plurality of chips and a section of the PCB. The structures can include multiple microelectronic chips mounted on a PCB. The PCB can include vias, with subsets of the vias positioned for electrical connection to a specific microelectronic chip within the plurality of chips.

The present technology provides an external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in an approximately vertical direction on a ground.

A cover member which is detachable from an electronic device operated by means of a first battery is provided with: a first communication unit capable of communicating with an external terminal; a second communication unit for acquiring information relating to the electronic device from said electronic device; and a control unit for controlling communication of the first communication unit and the second communication unit on the basis of the information relating to the electronic device acquired through the second communication unit.

The application discloses a kind of electrode-containing intelligent ring, glue pouring jig and packaging process thereof, comprising: ring shell, ring shell is the circular ring with inside opening;Ring inner shell, ring inner shell is placed in the inside of ring shell;Ring shell cavity, ring shell cavity is placed between ring shell and ring inner shell;Flexible printed circuit board, flexible printed circuit board is installed in the inside of ring shell cavity;The beneficial effects of the application are: by the method that ring shell cavity fills the high-transmittance biological compatible glue and forms ring inner shell, ring shell, internal electronic components, ring inner shell are integrated into a complete structure, so as to improve the waterproof ability of intelligent ring.Meanwhile, with the help of special jig, controllable blocking part glue flow path solves the problem that electronic components must be lower than the height of ring shell cavity cavity in glue pouring process, and is more suitable for the manufacture and processing of electrode-containing intelligent ring.

An electronic device including a foldable housing including a first housing, a second housing, and a connection structure; a flexible display; a first plate including at least a portion disposed on a lower end of a first area of the display and a first periphery; a second plate including at least a portion disposed on a lower end of a second area of the display, and a second periphery; and a protection layer. When the electronic device is in an unfolded state, the first periphery and the second periphery are configured to be in contact with the display. When the electronic device pivots from the unfolded state to a folded state, the first periphery and the second periphery are configured to be spaced apart from the display, and the protection layer is configured to cover an area of the display exposed between the first periphery and the second periphery.

An arrangement comprising a motor (9) with a motor contact device (94) and a power semiconductor module (1) with a power semiconductor arrangement (2), a housing (7) having a recess (704, 724) in a housing side (700, 720) with an outer surface (702, 722) having a through-direction in the normal direction (N) of this outer surface (702, 722), an internal contact device (3) having an electrically conductive contact within the housing (7) to an external connection element (4), in particular designed as a load connection element, arranged with a section in the recess (704, 724), and a spring element (6), wherein the connection element (4) is designed as a rigid metallic shaped body with an inner and an outer contact surface (40, 42), wherein the outer contact surface (42) is accessible from the outside.wherein the connecting element (4) is movably connected to the housing (7) in the through-direction (704, 724) via an electrically insulating and mechanically elastic retaining device (5), and wherein the spring element (6) is arranged and designed such that its spring action acts directly or indirectly on the connecting element (4) in the through-direction, and wherein the connecting element (4) has a first connecting element position relative to the through-direction in which the outer contact surface (42) has a first contact surface position (P1) relative to the outer surface (702, 722), and wherein the connecting element (4) is displaceable in the negative through-direction against a spring force of the spring element, and wherein the power semiconductor module (1) is fixed with its outer surface (702, 722) on a power module surface (92) by means of a fastening device (76, 96).wherein an electrically conductive pressure contact is formed between the outer contact surface (42) and the associated motor contact device (94).

This flavor inhaler comprises: a housing that has a ventilation opening; a battery that is positioned in a space in the interior of the housing, said space being in communication with the ventilation opening; and a covering member that covers at least a portion of the ventilation opening, wherein the covering member is bonded to the housing in a manner allowing the same to be removed from the housing, the covering member constitutes the bottom surface of a recess that is formed in the outer surface of the housing, and the depth of said recess is less than the thickness of the covering member.

An aerosol generating device having a removable battery, a system including such a device, and a method for replacing the battery in such a device are provided. An aerosol generating device (1) is provided that includes a power supply unit configured to provide power for operation of the aerosol generating device to generate an aerosol, the power supply unit including a battery compartment (10) for removably holding a battery (2). The aerosol generating device further includes an aerosol-generation compartment including an aerosol-generating article-receiving cavity (12) for removably receiving an aerosol-generating article. A housing accommodates the power supply unit and the aerosol-generation compartment. The housing includes two removably attachable housing portions (3, 4). One of the housing portions forms a ring element (4) for securing the aerosol-generation compartment within the housing.

A surge protective device (SPD) assembly module includes a polymeric outer enclosure, an SPD module, a first terminal, and a second terminal. The polymeric outer enclosure defines an enclosed, environmentally sealed enclosure chamber. The SPD module is disposed in the enclosure chamber. The SPD module defines an environmentally sealed SPD chamber and includes: first and second electrically conductive electrode members; and a varistor member formed of a varistor material and electrically connected between the first and second electrode members. The varistor member is disposed in the SPD chamber between the first and second electrode members. The first terminal is electrically connected to the first electrode member and extending out from the outer enclosure. The second terminal is electrically connected to the second electrode member and extending out from the outer enclosure.