88results about "Small component housings" patented technology

Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 comprises a first encapsulation member 20, a second encapsulation member 30, a first circuit member 40, and a second circuit member 50. The first encapsulation member 20 comprises a first film composed of a film as a base. The device 10 is formed with a sealed space 18. The sealed space 18 is surrounded by the first encapsulation member 20 and the second encapsulation member 30 so as to be blocked from the outside of the device 10. The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18. The first circuit member 40 has a first contact 48. The second circuit member 50 has a second contact 58. The first contact 48 and the second contact 58 are in contact with each other. The second encapsulation member 30 is provided with a convexoconcave part 62. The convexoconcave part 62 is in contact with the second circuit member 50 and covers a predetermined region 19 corresponding to the second contact 58.SELECTED DRAWING: Figure 3