An arrangement comprising a motor (9) with a motor contact device (94) and a power
semiconductor module (1) with a power
semiconductor arrangement (2), a housing (7) having a recess (704, 724) in a housing side (700, 720) with an outer surface (702, 722) having a through-direction in the normal direction (N) of this outer surface (702, 722), an internal contact device (3) having an
electrically conductive contact within the housing (7) to an
external connection element (4), in particular designed as a load connection element, arranged with a section in the recess (704, 724), and a spring element (6), wherein the connection element (4) is designed as a rigid metallic shaped body with an inner and an outer contact surface (40, 42), wherein the outer contact surface (42) is accessible from the outside.wherein the connecting element (4) is movably connected to the housing (7) in the through-direction (704, 724) via an electrically insulating and mechanically elastic retaining device (5), and wherein the spring element (6) is arranged and designed such that its spring action acts directly or indirectly on the connecting element (4) in the through-direction, and wherein the connecting element (4) has a first connecting element position relative to the through-direction in which the outer contact surface (42) has a first contact surface position (P1) relative to the outer surface (702, 722), and wherein the connecting element (4) is displaceable in the negative through-direction against a
spring force of the spring element, and wherein the power
semiconductor module (1) is fixed with its outer surface (702, 722) on a
power module surface (92) by means of a fastening device (76, 96).wherein an
electrically conductive pressure contact is formed between the outer contact surface (42) and the associated motor contact device (94).