40results about "Small component housings" patented technology

Embodiments of the invention provide a container (e.g., marker tip holder box) that comprises a holding pad (e.g., marker tip holder pad) having a plurality of holders to retain objects (e.g., marker tips for use with a pen-stylus). Each holder has an opening to receive an object (e.g., a marker tip). Each holder further comprises a flexible leaflet, that surrounds the opening in the holder, wherein the flexible leaflet has an irregular but nearly conical shape that narrows in diameter as it approaches an arrester that is located below the flexible leaflet, such that a retained object rests in the arrester in the holder. The flexible leaflet has two states, a first state that holds the retained object (e.g., a marker tip) with sufficient firmness to retain the object in the holder, and a second state in which the irregular but nearly conical shape of the flexible leaflet interferes with an outer housing of the object retained in the holder to form a flexure that enables removal of the retained object from the container.

Devices and methods for protecting an electronic circuit. A device includes a base frame, an electronic circuit, and a cage frame depending from the base frame. The cage frame is configured to provide physical protection on at least four sides for the electronic circuit. The cage frame also defines a plurality of openings configured to provide air circulation across the electronic circuit. The device also has at least one fan disposed within the cage frame and configured to at least partially drive the air circulation. A method involves providing the above components. These devices and methods are able to be further adapted to provide for the retrofit of an installed electronics device.

Embodiments of the present disclosure generally relate to enclosures and casings for electronic devices and memory devices, and more particularly to such enclosures and casings having a nickel-boron coating and methods for forming such a nickel-boron coating. In one embodiment, an article for housing at least a portion of an electronic device is provided, the article comprising a metal-containing substrate and a layer comprising nickel and boron disposed on at least a portion of the metal-containing substrate, wherein: the amount of nickel in the layer is about 95 wt% or greater based on the total amount of nickel and boron in the layer, and the amount of boron in the layer is about 5 wt% or less. The article has a thermal conductivity of about 25 W / mK or greater, a scratch hardness of about 0.5 GPa or greater, a coefficient of friction of about 0.4 or less, or a combination thereof.

A semiconductor module includes a circuit board mounted on a base, a case having a sidewall and a lid and covering the circuit board, a plurality of conductive plates each parallel to a predetermined plane, electrically connected to different conductive patterns. The lid of the case has a partition that protrudes from an inner surface of the lid toward the base between two of the conductive plates. The partition has a first portion at a position where the partition and the conductive plates overlap each other, and a second portion at a position where the partition and the conductive plates do not overlap each other in a side view. The second portion has a cutout section disposed such that in a depth direction, a distance from the base to the second portion is greater than a distance from the base to the first portion.

The present disclosure relates to an aerosol generation device (1) comprising a housing (11), an aerosol generation chamber (12) configured to receive a substrate and generate an aerosol, the aerosol generation chamber (12) having an opening at least partially uncovered by the housing, a cover (13) configured to be in a closed position covering the opening or in an open position exposing the opening, and an opening mechanism (14) engaged with the cover, the opening mechanism (14) including a biasing element (146) that biases the cover toward the open position and a locking element (1452) configured to releasably lock the cover in the closed position, wherein the opening mechanism is configured to be in a covered state, an open state, or a partially open state.

The inhalation device (46) has a body (48) with a recess (52) for receiving a consumable product, a displaceable cover having an opening (26), a slidable spring carrier (14) for covering the recess (52) and supporting a spring (16), and a base (10) provided on the body (48) and having a track (34) for accommodating a first arm portion (28) of the spring (16), the track (34 having a locking portion (40) adapted to lock the spring (16) in a position where the spring carrier (14) covers the recess (52), and the cover, when displaced, is adapted to move the spring carrier (14) to disengage the spring (16) from the locking portion (40) when in a position covering the recess (52), and to move the spring carrier (14) to engage the spring (16) with the locking portion (40) when in a position exposing the recess (52).

A portable electric fence energizer is described, having a housing and an electric pulse generating circuit located within the housing. The energizer further includes a post securing mechanism configured to secure the housing relative to an electrically conductive post. The post securing mechanism includes at least one electrical contact configured to contact the post when secured by the post securing mechanism. A conductive link between the electrical contact and the electric pulse generating circuit may be used to provide an earth connection for the energiser, or an output connection between the electric pulse generating circuit and a wire of the electric fence.

Electrically conductive and hermetic vias are disposed within a flexible insulator substrate of a feedthrough assembly to provide miniaturization of feedthrough assemblies inasmuch as the feedthrough components are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

An ultrasonic sensor includes a piezoelectric element, a cell case (3) configured to support the piezoelectric element bonded to a front portion of the cell case at an inside of the cell case, the cell case having an opening at a rear portion thereof, a PCB assembly electrically connected to the piezoelectric element, a housing (7) coupled to the opening of the cell case while receiving the PCB assembly therein and configured to seal a space required for electrical connection between the piezoelectric element in the cell case and the PCB assembly, a filler filling the space required for electrical connection between the piezoelectric element and the PCB assembly, after completion of the electrical connection between the piezoelectric element and the PCB assembly, and a rear cover configured to seal a rear opening formed at the housing in order to allow insertion of the PCB assembly.

A wireless receiver dongle for very small connectors (such as USB-C or Apple Lightning connectors) that is thin enough to sit almost flush with the computer host device into which it is inserted.

A waterproof gate assembly, which is configured to be mounted to a housing and includes a cover, an installation axle and a fixing member, is provided. The installation axle is connected to the cover, allowing the cover to rotate relative to the installation axle. The installation axle includes an axial groove, an engaging structure and a fixing structure. The axial groove is connected to the cover and includes a first end portion and a second end portion. The engaging structure is connected to one side of the axial groove corresponding to the cover, extends to the first end portion of the axial groove, and is configured to be engaged at the housing. The fixing structure is connected to one side of the axial groove corresponding to the cover, and close to the second end portion. The fixing member passes through the fixing structure and is fixed at the housing.

The invention proposes a power semiconductor module and a method for arranging the module on a motor, the power semiconductor module having: a power semiconductor assembly; a housing having a recess in a housing side having an outer surface, the recess having a passage direction along the direction of the normal to the outer surface; having an internal contact device that electrically contacts an external connection element, in particular designed as a load terminal element, in the interior of the housing, and a section is arranged in the recess; and having a spring element, wherein the connection element is designed as a rigid metal profile having an internal contact surface and an external contact surface, wherein the external contact surface is accessible from the outside, wherein the connection element is connected to the housing via an electrically insulating and mechanically resilient holding device, such that the connection element is movable along the passage direction, and wherein the spring element is arranged and designed such that its spring action acts directly or indirectly on the connection element along the passage direction.

Devices and methods for protecting an electronic circuit. A device includes a base frame, an electronic circuit, and a cage frame depending from the base frame. The cage frame is configured to provide physical protection on at least four sides for the electronic circuit. The cage frame also defines a plurality of openings configured to provide air circulation across the electronic circuit. The device also has at least one fan disposed within the cage frame and configured to at least partially drive the air circulation. A method involves providing the above components. These devices and methods are able to be further adapted to provide for the retrofit of an installed electronics device.

The application discloses a logistics anti-theft positioning box with an anti-disassembly structure and relates to the technical field of logistics positioning box installation. The surface of the first connecting pipe is provided with a first connecting groove, the bottom end of the first connecting pipe is provided with a second connecting pipe, the surface of the second connecting pipe is provided with two second connecting grooves, and the bottom end of the second connecting pipe is provided with a third connecting pipe. In the application, the positioning box body is installed in the mounting block by connecting the fixing plate, the mounting block and the positioning box body through bolts, the mounting block and the fixing pipe at the bottom end thereof are in contact with the first connecting pipe and the second connecting pipe, the first spring is used to enable the moving plate, the moving rod and the first ball to move into the fixing pipe through the positioning hole, the positioning box body and the like are fixed on the connecting pipe through the internal fixing mode, the theft of the positioning box by personnel is avoided, the loss of property is avoided, and the problem that the existing logistics positioning box does not have an anti-theft function is solved.

Aerosol-generating device with removable battery, system comprising such device and battery replacement method for such device. There is provided an aerosol-generating device (1) comprising a power supply unit, configured to supply power for operation of the aerosol-generating device to generate an aerosol, wherein the power supply unit comprises a battery compartment (10) for removably holding a battery (2), The aerosol-generating device further comprises an aerosol- generating compartment comprising an aerosol-generating-article- receiving cavity (12) for removably receiving an aerosol-generating article. A housing accommodats the power supply unit as well as the aerosol-generating compartment The housing comprises two removably attachable housing portions (3, 4), One of the housing portions forms a ring element (4) for securing the aerosol- generating compartment within the housing.

An apparatus including a housing, circuitry at least partially within the housing, a power source including first and second terminals, first and second electrically conductive leads, and a coupler. The first and second electrically conductive leads may be connected electrically to the first and second terminals, respectively, of the power source. The coupler may be attached to the power source. At least a portion of the housing may extend into the coupler. The coupler may include one or more openings through which the first and second electrically conductive leads are capable of being laser welded to first and second contact pads, respectively, of the circuitry. A method for manufacturing the apparatus may include laser welding the first and second electrically conductive leads to the first and second contact pads, respectively, of the circuitry through the one or more openings of the coupler.

An electronic device including a foldable housing including a first housing, a second housing, and a connection structure; a flexible display; a first plate including at least a portion disposed on a lower end of a first area of the display and a first periphery; a second plate including at least a portion disposed on a lower end of a second area of the display, and a second periphery; and a protection layer. When the electronic device is in an unfolded state, the first periphery and the second periphery are configured to be in contact with the display. When the electronic device pivots from the unfolded state to a folded state, the first periphery and the second periphery are configured to be spaced apart from the display, and the protection layer is configured to cover an area of the display exposed between the first periphery and the second periphery.

A container is provided that includes a holding pad having a plurality of holders to hold an object. Each holder has an opening to receive an object (e.g., a marking pen tip). Each holder further includes a flexible blade surrounding an opening in the holder, where the flexible blade has an irregular but approximately conical shape having a diameter that narrows as the flexible blade approaches a stopper located beneath the flexible blade, and where the flexible blade has an irregular but approximately conical shape having a diameter that narrows as the flexible blade approaches the stopper located beneath the flexible blade. The holder is configured such that the stored object rests in a stopper in the holder. The flexible blade has two states: a first state that holds the stored object with sufficient firmness to store the object in the holder; and a second state in which the irregular but nearly conical shape of the flexible blade interferes with the housing of the object held in the holder to form a curved portion that enables removal of the held object from the container.

Sensor module comprising: an RF channel line, a signal acquisition line and a double-sided PCBA board; wherein the RF channel line is provided on one side of the PCBA board and the signal acquisition line is provided on the other side of the PCBA board.

Method for producing a water-resistant substrate (20), wherein the method comprises the steps: Providing a substrate (22); Mounting the substrate (22) with at least one component; Purifying the substrate (22) containing the at least one component to form a purified substrate (22); and Deposition of a multilayer waterproof coating (24, 26, 28) onto the cleaned substrate (22); wherein the multi-layer waterproof coating (24, 26, 28) consists exclusively of silicone; wherein the deposition step comprises a step of spraying a first water-resistant layer (24) onto the cleaned substrate (22) and curing the first water-resistant layer (24); wherein the deposition step further comprises a step of spraying a second waterproof layer (26) onto the first waterproof layer (24) and curing the second waterproof layer (26); and wherein the deposition step further comprises a step of spraying a third waterproof layer (28) onto the second waterproof layer (26) and curing the third waterproof layer (28) to produce the multilayer waterproof coating (24, 26, 28).

The invention relates to a base body for a feed-through element, comprising a metallic base body (1), at least one through-hole (4) for receiving a functional element in a fastening material (10), in particular an electrically insulating fastening material (10), and at least one conductor (6) which is electrically conductively connected to the base body by means of a brazing connection. The brazed connection comprises a metal solder (7) which covers a surface region of the substrate such that a brazed region (7) is formed on the surface of the substrate. The main body (1) has a microstructure at least in the brazing region (7), said microstructure comprising at least recesses in the surface of the main body. The invention likewise relates to a method for producing such a substrate (1) and to the use thereof.

Capacitor support (20; 220) configured to support a capacitor (2) comprising a sheath (4), a first capacitor cable (8) and a second capacitor cable (8), wherein the first and second capacitor cables (8) protrude from one end of the sheath (4), wherein the support (20; 220) comprises wall structures (21; 221) configured to encapsulate at least one section of both the first capacitor cable (8) and the second capacitor cable (8), wherein the wall structures (21; 221) comprise a first section and a second section, the first section of the wall structures (21; 221) of the support (20; 220) is arranged to provide a first container section (222(1)), the second section of the wall structures (21; 221) of the support (20; 220) is arranged to provide a second container section (222(2)), and the second tank section (222(2)) is configured to be installed with the first tank section (222(1)) in such a way that the condenser (2) can be arranged between the first tank section (222(1)) and the second tank section (222(2)).

The invention discloses a TF card embedded with a national secret security chip, and belongs to the technical field of intelligent chips, the TF card comprises a TF card body and a U-shaped frame used for storing the TF card body, a groove structure is arranged in the U-shaped frame, a packaging assembly is rotatably connected in the groove structure of the U-shaped frame, one side of the TF card body is inserted into the packaging assembly, and the other side of the TF card body is inserted into the packaging assembly. A locking and pushing assembly is slidably connected to the top surface of the U-shaped frame, a top fixing assembly is inserted into the U-shaped frame, the bottom end of the top fixing assembly is inserted into the packaging assembly and used for stopping the packaging assembly in the U-shaped frame, and the locking and pushing assembly is pushed to move horizontally on the U-shaped frame, so that one side of the top fixing assembly extends out of the outer wall of the U-shaped frame, and the bottom end of the top fixing assembly is separated from the packaging assembly. By adopting the cooperative sealing design of the rotating frame and the blocking part, the protection cavity is formed in the U-shaped frame, so that daily collision is effectively resisted, the impact resistance is improved, the failure rate of the intelligent chip in a humid environment is reduced, and the protection effect on the intelligent chip is improved.

Methods may involve supporting a plurality of microelectronic dies on a printed circuit panel. A respective microelectronic die of the plurality of microelectronic dies may be electrically connected to the at least one via of the printed circuit panel. The microelectronic device packages may be singulated from the printed circuit panel, each microelectronic device package including at least one of the plurality of microelectronic dies and a portion of the printed circuit panel. A structure may include a plurality of microelectronic dies supported on a printed circuit panel. The printed circuit panel may include vias, a subset of which are positioned for electrical connection to respective ones of the plurality of microelectronic dies.

In some examples, a feedthrough assembly for a medical device may include a collar. The collar defines an aperture extending through the collar from an outer end surface defined by the collar to an inner end surface defined by the collar. The aperture includes a first portion having a first diameter and a second portion having a second diameter smaller than the first diameter. The aperture defines a longitudinal axis extending therethrough, and the collar defines a flange between the first and second portions of the aperture, the flange extending radially inward toward the longitudinal axis. The feedthrough assembly may also include a conductive pin within the aperture and an insulating member surrounding at least a portion of the pin. The insulating member electrically insulates the conductive pin from the collar, and the flange and the surface of the insulating member adjacent to the flange may define a space therebetween.

The methods can involve mounting a plurality of microelectronic chips onto a printed circuit board (PCB). The individual microelectronic chips within the plurality of chips can be electrically connected via at least one via on the PCB. Microelectronic component packages can be isolated from the PCB, each package comprising at least one microelectronic chip from the plurality of chips and a section of the PCB. The structures can include multiple microelectronic chips mounted on a PCB. The PCB can include vias, with subsets of the vias positioned for electrical connection to a specific microelectronic chip within the plurality of chips.

The present technology provides an external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in an approximately vertical direction on a ground.

A cover member which is detachable from an electronic device operated by means of a first battery is provided with: a first communication unit capable of communicating with an external terminal; a second communication unit for acquiring information relating to the electronic device from said electronic device; and a control unit for controlling communication of the first communication unit and the second communication unit on the basis of the information relating to the electronic device acquired through the second communication unit.

An inhalation device (10) has a heater (14), which is adapted to receive a consumable and has an opening (16), and an electric port (18), wherein a cover (20) is provided, which is adapted to engage the port and to cover (20) the opening (16). In a method of operating an inhalation device (10) having a heater (14), which is adapted to receive a consumable and has an opening (16), and an electric port (18), a cover (20) covers the opening (16) and engages the port.

The present invention reduces uneven filling of encapsulant in a semiconductor module using a case with an integrated lid. A semiconductor module (2) includes: a case (210) covering a circuit board (4) mounted on a base (200), the case including sides (211) surrounding the perimeter of the circuit board and a lid (212) located above the circuit board; a plurality of conductor plates (6A-6D), each being electrically connected to a conductor pattern on the circuit board and extending out of the case through a slit (220) provided in the case; and encapsulants (701, 702) encapsulating the circuit board, wherein the case has partitions (214, 215) which are placed in the area enclosed by the lid, the sides, and the circuit board and which are placed between the plurality of conductor plates to insulate the plurality of conductor plates from one another, and the partitions have notched sections (216, 217) at positions that do not overlap with the plurality of conductor plates, thereby making the height of the portion that does not overlap with the plurality of conductor plates lower than the height of the portion that does overlap.