Electronic device

Abstract

To ensure satisfactory drip-proof performance at a joining part of three members.SOLUTION: A first member 1 and a second member 2 constituting a housing of an electronic apparatus have first joining surfaces 1A and 2A, second joining surfaces 1C and 2C, and third joining surfaces 1B and 2B, and the corresponding joining surfaces are assembled to face each other. The first member 1, the second member 2, and a third member 3 have fourth joining surfaces 1X, 2X, and 3X, fifth joining surfaces 1Z, 2Z, and 3Z, and sixth joining surfaces 1Y, 2Y, and 3Y, and the corresponding joining surfaces are assembled to face each other. At least one joining surface of the first to third joining surfaces of at least one member of the first and second members and at least one joining surface of the fourth to sixth joining surfaces of at least one member of the first to third members are provided with a fine structure that is molded to have liquid-repellent properties.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an electronic device, and more particularly to a drip-proof structure for an electronic device. [Background technology]

[0002] Many portable electronic devices require drip-proof (waterproof) performance. In particular, electronic devices whose housings are composed of three or more components need to ensure waterproof performance while suppressing size increase without compromising portability. Patent Document 1 discloses a waterproof structure in which a water-repellent coating is formed on the butted end faces of two components using polytetrafluoroethylene resin or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. H09-67456 Summary of the Invention [Problem to be solved by the invention]

[0004] However et al. Patent document 1 does not disclose the waterproof structure of the joints between the three members.

[0005] The present invention is based on the joint of three members. Tera To provide an electronic device that can ensure good drip-proof performance. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present invention has a housing formed by combining a first member, a second member, and a third member. The first and second members each have a first mating surface and a second mating surface provided on an outer surface and an inner surface, respectively, that are stepped relative to each other, and a third mating surface connected to the first and second mating surfaces. The housings are combined such that the first mating surfaces and the second mating surfaces face each other in a first direction and the third mating surfaces face each other in a second direction perpendicular to the first direction. The first, second, and third members each have a fourth mating surface and a fifth mating surface provided on an outer surface and an inner surface, respectively, that are stepped relative to each other, and a sixth mating surface connected to the fourth and fifth mating surfaces. The housings are combined such that the third mating surfaces and the fourth mating surfaces face each other in a third direction perpendicular to the first and second directions, and the sixth mating surfaces face each other in the second direction. In the first and second members, the first mating surface is connected to the fifth mating surface, and the third mating surface is not connected to the sixth mating surface, and a liquid-repellent microstructure is provided on each mating surface in at least one of the combinations of the first mating surface and the fourth, fifth, or sixth mating surface, and the combination of the second or third mating surface and the fifth mating surface. It is characterized by: Also, in the first and second members, the first mating surface is connected to the fourth mating surface but not connected to the fifth and sixth mating surfaces, and the third mating surface is not connected to the sixth mating surface, and a liquid-repellent microstructure is provided on each mating surface in at least one combination of the first or third mating surface and the fourth mating surface, and the second mating surface and the fourth, fifth, or sixth mating surface. Also, in one of the first and second members, the third mating surface is continuous with the sixth mating surface, and a liquid-repellent microstructure is provided on each mating surface in at least one combination of the first mating surface and the fourth mating surface, and the second mating surface and the fifth or sixth mating surface. [Effects of the Invention]

[0007] According to the present invention, at the joint of three members in an electronic device, Tera This ensures good waterproof performance. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is an exploded perspective view of a housing of the imaging apparatus according to the embodiment. [Figure 2] FIG. 2 is a perspective view of a housing model obtained by modeling the housing. [Figure 3] FIG. 2 is a cross-sectional view of the housing model. [Figure 4] 2A and 2B are an exploded perspective view and a partially enlarged view of a housing model in the first embodiment. [Figure 5] FIG. 2 is a perspective view of a housing model (first and third members) in the first embodiment. [Figure 6] FIG. 3 is a perspective view of a housing model (second and third members) in the first embodiment. [Figure 7] FIG. 2 is a diagram showing a finely machined surface in Example 1. [Figure 8] FIG. 10 is a diagram showing a water intrusion path of the housing model in the first embodiment. [Figure 9] FIG. 4 is another perspective view of the housing model in the first embodiment. [Figure 10] FIG. 10 is an exploded perspective view of a housing model according to a second embodiment. [Figure 11] FIG. 10 is a perspective view of a housing model (first and third members) in Example 2. [Figure 12] FIG. 10 is a perspective view of a housing model (second and third members) in Example 2. [Figure 13] FIG. 10 is a diagram showing a water intrusion path of the housing model in the second embodiment. [Figure 14] FIG. 11 is an exploded perspective view of a housing model according to a third embodiment. [Figure 15] FIG. 11 is a perspective view of a housing model (first and third members) in Example 3. [Figure 16] FIG. 11 is a perspective view of a housing model (second and third members) in the third embodiment. [Figure 17] FIG. 11 is a diagram showing a water intrusion path of the housing model in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. [Example]

[0010] Fig. 1(a) shows an exploded view of a housing 100 of an imaging device (camera) as an electronic device according to a first embodiment of the present invention, and Fig. 1(b) shows the housing 100 in an assembled state. The housing 100 is integrated by combining three exterior members consisting of a front cover member 41, a rear cover member 42, and a side cover member 43. The front cover member 41, the rear cover member 42, and the side cover member 43 correspond to a first member 1, a second member 2, and a third member 3, respectively, that constitute a housing model of the housing 100 as shown in Fig. 2.

[0011] In Fig. 2, the first member 1 and the second member 2 each have exterior surfaces (outer surfaces) 10, 20 which are yz planes, and their opposing z-direction ends are joined together. The third member 3 has an exterior surface 30 which is made up of an xz plane and a yz plane perpendicular to it, and its x-direction end is joined to the y-direction ends of the first member 1 and the second member 2. The exterior surfaces 10, 20, 30 are painted or textured as exterior surface treatments.

[0012] Fig. 3(a) shows a cross section of the joint in the z direction between the first member 1 and the second member 2, as viewed from the y direction. Fig. 3(b) and Fig. 3(c) respectively show cross sections of the joint in the y direction between the second member 2 and the first member 1 and the third member 3, as viewed from the z direction. As shown in Figs. 3(a) to 3(c), the joints of the first to third members 1 to 3 have a staircase shape with uneven steps in the direction in which they are combined.

[0013] The first member 1 has mating surfaces 1A and 1C as xy planes at the joint with the second member 2, and mating surface 1B as a yz plane provided therebetween. The first member 1 also has mating surfaces 1X and 1Z as xz planes at the joint with the third member 3, and mating surface 1Y as a yz plane provided therebetween. In the first member 1, mating surfaces 1A and 1C correspond to the first and second mating surfaces provided on the outer and inner surfaces, respectively, and having a step between them. Furthermore, mating surface 1B corresponds to the third mating surface connected perpendicularly to mating surfaces 1A and 1C.

[0014] The second member 2 has mating surfaces 2A and 2C as xy planes at the joint with the first member 1, and mating surface 2B between them as the yz plane. The second member 2 also has mating surfaces 2X and 2Z as xz planes at the joint with the third member 3, and mating surface 2Y between them as the yz plane. In the second member 2, mating surfaces 2A and 2C correspond to the first and second mating surfaces provided on the outer and inner surfaces, respectively, and having a step between them. Furthermore, mating surface 2B corresponds to the third mating surface connected perpendicularly to mating surfaces 2A and 2C.

[0015] The third member 3 has mating surfaces 3X and 3Z as xz planes at the joints between the first and second members 1 and 2, and mating surface 3Y as a yz plane therebetween. In the third member 3, mating surfaces 3X and 3Z correspond to the first and second mating surfaces provided on the outer and inner (inner) surfaces, respectively, and having a step between them. Furthermore, mating surface 3Y corresponds to the third mating surface connected perpendicularly to mating surfaces 3X and 3Z.

[0016] The first and second members 1 and 2 are assembled so that mating surfaces 1A, 1B, and 1C and mating surfaces 2A, 2B, and 2C (i.e., corresponding mating surfaces) face each other with a predetermined clearance (gap) between them. As a result, mating surfaces 1X and 2X, mating surfaces 1Y and 2Y, and mating surfaces 1Z and 2Z are continuous surfaces via the clearance. In Figures 3(b) and 3(c), these continuous mating surfaces are also denoted in parentheses as 12X, 12Y, and 12Z. The first and second members 1 and 2 and the third member 3 are assembled so that mating surfaces 12X, 12Y, and 12Z and mating surfaces 3X, 3Y, and 3Z face each other with a predetermined clearance between them.

[0017] Note that the step shapes of the mating portions shown in Figures 3(a) to 3(c) are merely examples, and other step shapes may be used. For example, in Figures 3(b) and 3(c), the mating portion of the third member 3 has a step shape with the outer (exterior surface) portion convex downward and the inner portion concave upward, and the mating portions of the first and second members 1 and 2 have a step shape with the outer portion concave downward and the inner portion convex upward. However, the outer portion of the mating portion of the third member 3 may have a step shape with the outer portion concave upward and the inner portion convex downward, and the outer portion of the mating portions of the first and second members 1 and 2 may have a step shape with the outer portion convex upward and the inner portion concave downward.

[0018] The upper view of Figure 4 shows the first to third members 1 to 3 exploded, and the lower view shows an enlarged view of the area within the frame in the upper view. Figure 5 shows the mating portion of the first member 1 and the third member 3 as seen from an oblique angle from the inside. The second member 2 is not shown in Figure 5. Figure 6 shows the mating portion of the second member 2 and the third member 3 as seen from an oblique angle from the inside. The first member 1 is not shown in Figure 6. As shown in Figures 4 to 6, mating surfaces 1A and 2A are connected so as to be perpendicular to mating surfaces 1Z and 2Z, respectively. Furthermore, mating surfaces 1B and 2B are not connected to mating surfaces 1Y and 2Y, respectively.

[0019] Figure 7 shows an enlarged view of the surface of a resin part with a microstructure that has liquid-repellent (water-repellent) properties. This microstructure has numerous convex shapes arranged at a 40 μm pitch, with concave shapes between the convex shapes. This microstructure was created (i.e., molded) by transferring fine irregularities formed on the surface of a resin molding die by irradiating it with a femtosecond laser onto the resin surface. It is known that a resin surface with such a microstructure has a larger contact angle of a liquid droplet (water droplet) than a resin surface without the microstructure, resulting in a water-repellent effect. Note that the microstructure may have any shape or pitch as long as it achieves a water-repellent effect.

[0020] In this embodiment, at least one (or both) of mating surfaces 1A and 2A is subjected to a water-repellent treatment by molding a microstructure as shown in Fig. 7. Furthermore, at least one of mating surfaces 12X and 3X is also subjected to a similar water-repellent treatment. The contact angle of a water droplet on the mating surface that has been subjected to the water-repellent treatment is larger than the contact angle on a surface that has not been subjected to the water-repellent treatment, thereby preventing water from seeping into the inside of housing 100 through the surface that has been subjected to the water-repellent treatment.

[0021] In this example, the first to third members 1 to 3 are produced using a mold in which a microstructure is formed as described above, and thus the water-repellent treatment is performed on each mating surface at the same time as molding the first to third members 1 to 3. This is the same as in the other examples described below.

[0022] In order to apply a water-repellent treatment to at least one of the two opposing mating surfaces, it is desirable that at least two of the first to third members 1-3 be formed from a resin material that can easily transfer a microstructure using a mold. This eliminates the need to fill the gap between the mating surfaces with a sealing material, and it is possible to prevent an increase in the number of manufacturing steps for the housing 100 and an increase in the size of the housing 100 (i.e., the imaging device). Furthermore, by forming the microstructure by transferring it from a mold, it is possible to reduce the number of manufacturing steps and manufacturing costs compared to when a water-repellent coating or the like is secondarily provided on each mating surface of the first to third members 1-3.

[0023] Furthermore, when a water-repellent treatment is applied to both of the opposing mating surfaces 12X and 3X, the microstructures on each mating surface do not necessarily need to have the same shape or pitch. For example, the mold for molding the first member 1 shown in FIG. 3(c) is opened (pulled out) in the x and -x directions in the figure, and the mold for molding the third member 3 is opened in the y and -y directions. Because the mating surface 3X is a surface that is nearly perpendicular to the mold opening direction, it is possible to easily form a microstructure even if the microstructure pitch is narrow or the unevenness is deep. However, because the mating surface 1X is a surface that is nearly parallel to the mold opening direction, it may be necessary to impart a significant slope to the mating surface 1X in order to form a microstructure equivalent to that of the mating surface 3X. To avoid this resulting increase in the size of the housing 100, for example, the pitch and shape of the microstructure formed on the mating surface 1X may be different from those on the mating surface 3X. Furthermore, the microstructure may be provided only on a partial area of ​​the mating surface 1X, rather than on the entire surface.

[0024] There are other combinations of mating surfaces that can be treated with a water-repellent coating to prevent water from seeping into the inside of the housing 100 besides those described above. Specifically, when at least one of mating surfaces 1A and 2A is treated with a water-repellent coating, at least one of mating surfaces 12Y and 3Y or at least one of mating surfaces 12Z and 3Z is also treated with a water-repellent coating. When at least one of mating surfaces 1B and 2B is treated with a water-repellent coating, at least one of mating surfaces 12Z and 3Z is also treated with a water-repellent coating. When at least one of mating surfaces 1C and 2C is treated with a water-repellent coating, at least one of mating surfaces 12Z and 3Z is also treated with a water-repellent coating. Table 1 summarizes the combinations of mating surfaces that can be treated with a water-repellent coating and whether or not these combinations can prevent water seepage (make the housing waterproof). Water seepage paths 101 and 102 in the table will be described later.

[0025] [Table 1]

[0026] Fig. 8 shows water penetration paths 101 and 102 at the joint between the first member 1 and the third member 3. The second member 2 is not shown in Fig. 8. In water penetration path 101, water droplets that penetrate between mating surfaces 1A and 2A reach mating surfaces 3Z and 12Z and penetrate into the inside of the housing 100 through the gap between them. In addition, in water penetration path 102, water droplets that penetrate between mating surfaces 1A and 2A pass between mating surfaces 1B and 2B and reach mating surfaces 3Z and 12Z and penetrate into the inside of the housing 100 through the gap between them.

[0027] To prevent these water intrusion paths 101 and 102 from being formed, water-repellent treatment can be applied to at least one of the mating surface combinations marked "waterproof" in Table 1, thereby preventing water from infiltrating into the housing 100. In other words, an imaging device equipped with a housing 100 having good waterproof (drip-proof) performance can be provided. In this case, water-repellent treatment may also be applied to mating surfaces of other combinations.

[0028] Figure 9 shows the water penetration path of the joint between the first member 1 and the third member 3 for the combinations marked with * in Table 1. Here, the case is shown where only the mating surface 3Z of the mating surfaces 12Z and 3Z is treated with a water repellent coating. The second member 2 is also not shown in Figure 9.

[0029] In this water penetration path, water droplets that penetrate between mating surfaces 1A and 2A reach mating surfaces 3Z and 12Z. Here, a line extending in the z direction inside mating surface 3Z, further inward than the point where mating surfaces 1A and 2A approach each other in the y direction, is defined as boundary line 31. In this case, the only region on mating surface 3Z that is subjected to the water-repellent treatment is region (second region) 32 located inside boundary line 31, and the water-repellent treatment is not applied to region (first region) 33 located outside boundary line 31 (i.e., region 33 is more hydrophilic than region 32). This is for the following reason.

[0030] If the entire mating surface 3Z were treated with a water-repellent coating, and a large amount of water droplets flowing from between mating surfaces 1A and 2A into the water-repellent treated region, it would be difficult for mating surface 3Z to prevent the water droplets from penetrating into the interior, which could result in water seeping into housing 100. By separating water-repellent treated region 32 from non-water-repellent treated region 33 by boundary line 31, water droplets that have penetrated between mating surfaces 1A and 2A can first reach non-water-repellent treated region 33 of mating surface 3Z. This significantly changes the contact angle of the water droplets as they move from region 33 toward water-repellent treated region 32, making it possible to prevent water from seeping into housing 100.

[0031] Here, the case where the water-repellent treatment is applied to the inside of mating surface 3Z has been described, but when the water-repellent treatment is applied to mating surface 12Z, water can be prevented from seeping into housing 100 by applying the water-repellent treatment only to the area inside boundary line 31. Furthermore, water can be prevented from seeping into housing 100 by applying this not only to the combination of mating surfaces 3Z and 12Z, but also to any combination of mating surfaces having a similar relationship. [Example]

[0032] Next, a second embodiment of the present invention will be described. The upper view of FIG. 10 shows the first to third members 1 to 3 in this embodiment in an exploded view, and the lower view shows an enlarged view of the area within the frame in the upper view. FIG. 11 shows the mating portion between the first member 1 and the third member 3 as seen obliquely from the inside. The second member 2 is not shown in FIG. 11. FIG. 12 shows the mating portion between the second member 2 and the third member 3 as seen obliquely from the inside. The first member 1 is not shown in FIG. 12. As shown in FIGS. 10 to 12, mating surfaces 1A and 2A are connected to mating surfaces 1X and 2X, respectively, but are not connected to mating surfaces 1Y and 2Y and mating surfaces 1Z and 2Z, respectively. Furthermore, mating surfaces 1B and 2B are not connected to mating surfaces 1Y and 2Y, respectively.

[0033] In this embodiment, the following combinations of mating surfaces are subjected to a water-repellent treatment to prevent water from seeping into the inside of the housing 100. When at least one of mating surfaces 1A and 2A is subjected to a water-repellent treatment, at least one of mating surfaces 12X and 3X is also subjected to the water-repellent treatment. When at least one of mating surfaces 1B and 2B is subjected to a water-repellent treatment, at least one of mating surfaces 12X and 3X is also subjected to the water-repellent treatment. When at least one of mating surfaces 1C and 2C is subjected to a water-repellent treatment, at least one of mating surfaces 12X and 3X, at least one of mating surfaces 12Y and 3Y, or at least one of mating surfaces 12Z and 3Z is also subjected to the water-repellent treatment. Table 2 summarizes the combinations of mating surfaces that are subjected to the water-repellent treatment and whether or not these combinations can prevent water seepage (are waterproof). Water seepage paths 201 and 202 in the table will be described later.

[0034] [Table 2]

[0035] 13 shows water penetration paths 201 and 202 at the joint between the first member 1 and the third member 3. The second member 2 is not shown in FIG. 13. In water penetration path 201, water droplets that penetrate between mating surfaces 12X and 3X pass between mating surfaces 1B and 2B, reach mating surfaces 1C and 2C, and then penetrate into the inside of the housing 100 from between them. In addition, in water penetration path 202, water droplets that penetrate between mating surfaces 12X and 3X reach mating surfaces 1C and 2C, and then penetrate into the inside of the housing 100 from between them.

[0036] To prevent these water intrusion paths 201 and 202 from being formed, water repellent treatment can be applied to at least one of the mating surface combinations marked "waterproof" in Table 2, thereby preventing water from infiltrating into the housing 100. In other words, an imaging device equipped with a housing 100 having good waterproof performance can be provided. In this case, water repellent treatment may also be applied to mating surfaces of other combinations. [Example]

[0037] Next, a third embodiment of the present invention will be described. The upper view of FIG. 14 shows the first to third members 1 to 3 in this embodiment in an exploded view, and the lower view shows an enlarged view of the area within the frame in the upper view. FIG. 15 shows the mating portion of the first member 1 and the third member 3 as seen from an oblique inside view. The second member 2 is not shown in FIG. 15. FIG. 16 shows the mating portion of the second member 2 and the third member 3 as seen from an oblique inside view. The first member 1 is not shown in FIG. 16. In this embodiment, as shown in FIGS. 14 to 16, mating surfaces 2B and 2Y are continuous surfaces. Note that, instead of mating surfaces 2B and 2Y, mating surfaces 1B and 1Y may be continuous surfaces.

[0038] In this embodiment, the following combinations of mating surfaces are subjected to water-repellent treatment to prevent water from seeping into the inside of the housing 100. When at least one of mating surfaces 1A and 2A is subjected to water-repellent treatment, at least one of mating surfaces 12X and 3X is also subjected to water-repellent treatment. When at least one of mating surfaces 1C and 2C is subjected to water-repellent treatment, at least one of mating surfaces 12Y and 3Y or at least one of mating surfaces 12Z and 3Z is also subjected to water-repellent treatment. Table 3 summarizes the combinations of mating surfaces that are subjected to water-repellent treatment and whether or not these combinations can prevent water seepage (are waterproof). Water seepage routes 301, 302, and 303 in the table will be described later.

[0039] [Table 3]

[0040] FIG. 17 shows water penetration paths 301 to 303 at the joint between the first member 1 and the third member 3. In FIG. 17, the second member 2 is not shown. In water penetration path 301, water droplets that penetrate between mating surfaces 12X and 3X pass between mating surfaces 1B and 2B to reach mating surfaces 1C and 2C, and then penetrate into the inside of the housing 100 through the gap between them. In water penetration path 302, water droplets that penetrate between mating surfaces 1A and 2A pass between mating surfaces 3Y and 12Y to reach mating surfaces 3Z and 12Z, and then penetrate into the inside of the housing 100 through the gap between them. In water penetration path 303, water droplets that penetrate between mating surfaces 12X and 3X reach mating surfaces 1C and 2C, and then penetrate into the inside of the housing 100 through the gap between them.

[0041] To prevent these water penetration paths 301 to 303 from being formed, water repellent treatment can be applied to at least one of the mating surface combinations marked "waterproof" in Table 3, thereby preventing water from penetrating into the housing 100. In this case, water repellent treatment may also be applied to mating surfaces of other combinations.

[0042] According to the above-described embodiments, waterproof performance can be ensured at the joints of the three members 1 to 3 constituting the housing 100 in a space-saving and low-cost manner. Furthermore, since the exterior surfaces of the members are subjected to exterior surface treatments such as painting or embossing, it may be difficult to impart a microstructure as a water-repellent treatment to the mating surfaces (1A, 2A, 1X, 2X, 3X) connected to the exterior surfaces. Even in this case, by imparting a microstructure to other appropriate combinations of mating surfaces, it is possible to prevent water from seeping into the housing 100. In other words, it is possible to provide an imaging device equipped with a housing 100 that has good waterproof performance.

[0043] The embodiments described above are merely representative examples, and various modifications and changes can be made to each embodiment when implementing the present invention. [Explanation of symbols]

[0044] 100 cabinets 1. First member 2 Second member 3. Third Component 1A~1Z, 2A~2Z, 3A~3Z Mating surfaces

Claims

1. An electronic device having a housing configured by combining a first member, a second member, and a third member, the first and second members each have a first mating surface and a second mating surface provided on an outer surface side and an inner surface side and having a step with respect to each other, and a third mating surface connected to the first and second mating surfaces, and are assembled such that the first mating surfaces and the second mating surfaces face each other in a first direction, and the third mating surfaces face each other in a second direction perpendicular to the first direction; the first, second and third members each have a fourth mating surface and a fifth mating surface provided on the outer surface side and the inner surface side and having a step with respect to each other, and a sixth mating surface provided so as to be connected to the fourth and fifth mating surfaces, the fourth mating surfaces and the fifth mating surfaces are opposed to each other in a third direction perpendicular to the first and second directions, and the sixth mating surfaces are opposed to each other in the second direction, In the first and second members, the first mating surface is connected to the fifth mating surface and the third mating surface is not connected to the sixth mating surface; An electronic device characterized in that a liquid-repellent microstructure is provided on each mating surface in at least one of the combinations of the first mating surface and the fourth, fifth or sixth mating surface, and the combination of the second or third mating surface and the fifth mating surface.

2. An electronic device having a housing formed by combining a first member, a second member, and a third member, the first and second members each have a first mating surface and a second mating surface provided on an outer surface side and an inner surface side and having a step with respect to each other, and a third mating surface connected to the first and second mating surfaces, and are assembled such that the first mating surfaces and the second mating surfaces face each other in a first direction, and the third mating surfaces face each other in a second direction perpendicular to the first direction; the first, second and third members each have a fourth mating surface and a fifth mating surface provided on the outer surface side and the inner surface side and having a step with respect to each other, and a sixth mating surface provided so as to be connected to the fourth and fifth mating surfaces, the fourth mating surfaces and the fifth mating surfaces are opposed to each other in a third direction perpendicular to the first and second directions, and the sixth mating surfaces are opposed to each other in the second direction, In the first and second members, the first mating surface is connected to the fourth mating surface and is not connected to the fifth and sixth mating surfaces, and the third mating surface is not connected to the sixth mating surface; An electronic device characterized in that a liquid-repellent microstructure is provided on each mating surface in at least one of the combinations of the first or third mating surface and the fourth mating surface, and the combination of the second mating surface and the fourth, fifth or sixth mating surface.

3. An electronic device having a housing formed by combining a first member, a second member, and a third member, the first and second members each have a first mating surface and a second mating surface provided on an outer surface side and an inner surface side and having a step with respect to each other, and a third mating surface connected to the first and second mating surfaces, and are assembled such that the first mating surfaces and the second mating surfaces face each other in a first direction, and the third mating surfaces face each other in a second direction perpendicular to the first direction; the first, second and third members each have a fourth mating surface and a fifth mating surface provided on the outer surface side and the inner surface side and having a step with respect to each other, and a sixth mating surface provided so as to be connected to the fourth and fifth mating surfaces, the fourth mating surfaces and the fifth mating surfaces are opposed to each other in a third direction perpendicular to the first and second directions, and the sixth mating surfaces are opposed to each other in the second direction, In one of the first and second members, the third mating surface is continuous with the sixth mating surface; An electronic device characterized in that a liquid-repellent microstructure is provided on each mating surface in at least one of the combinations of the first mating surface and the fourth mating surface, and the combination of the second mating surface and the fifth or sixth mating surface.

4. The electronic device described in any one of claims 1 to 3, characterized in that the microstructure is not provided in a first region of the mating surface of one of the first to third components where opposing mating surfaces of the other two components are close to each other, and the microstructure is provided in a second region located more inward than the first region.

5. 5. The electronic device according to claim 1, wherein an exterior surface treatment is performed on the outer surfaces of the first to third members.

6. 6. The electronic device according to claim 1, wherein the microstructure is a structure transferred from a molding die of one of the first to third members on which the microstructure is provided.

7. The electronic device described in claim 6, characterized in that the shape, pitch or area of ​​the microstructure provided on a mating surface among the first to sixth mating surfaces that is parallel to the opening direction of the mold is different from the shape, pitch or area of ​​the microstructure provided on a mating surface perpendicular to the opening direction.

Images