Shot processing system and shot processing method

Abstract

To determine projection conditions of a projection material for processing a processing object with the desired strength.SOLUTION: A shot processing device 10 according to one embodiment comprises: the shot processing device 10 for projecting a projection material; a measuring apparatus 20 which receives the projected projection material, and outputs a signal waveform concerning wave motion caused by collision of the projection material; and a control apparatus 30 for controlling the shot processing device 10. The control apparatus 30 has: a processing condition acquisition part 41 which acquires a request intensity; a control part 34 which controls the shot processing device 10 so that shot processing is performed on a measuring apparatus 30 under first projection condition; a strength analysis part 47 which analyzes the signal waveform which has been outputted from the measuring apparatus 20 by shot processing on the measuring apparatus 20, thereby acquiring a measurement intensity; and a correction part 49 which corrects the projection condition of the shot processing device 10 to second projection condition from the first projection condition so that a difference between the request intensity and the measurement intensity becomes small.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a shot processing system and a shot processing method. [Background technology]

[0002] In shot processing such as shot blasting and shot peening, a shot processing device is used that projects a shot medium (projection material) onto a processing object. When performing shot processing using a shot processing device, it is required to collide the projection material with an appropriate strength against the processing object so that the processing object is in an appropriate processing state according to its application.

[0003] As a method for measuring the projection strength of a projection material, for example, the technology described in Patent Document 1 is known. Patent Document 1 describes a method for converting an elastic wave generated when a projection material collides with a disk into a high-frequency electric signal, and detecting the shot impact amount and kinetic energy based on a counter output voltage and a peak voltage acquired by analyzing the high-frequency electric signal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 04-019071 Summary of the Invention [Problem to be solved by the invention]

[0005] In the device described in Patent Document 1, the projection amount and projection strength of the projection material are adjusted by changing the projection conditions of the shot processing device. However, since there are many parameters as the projection conditions of the shot processing, such as the injection pressure of the projection material, the injection amount of the projection material, the type of projection material (particle size and hardness), the distance from the nozzle to the processing object, the nozzle diameter, etc., it is not easy to uniquely determine appropriate projection conditions for processing the processing object with the desired strength. If appropriate projection conditions cannot be set, the processing object cannot be processed with the desired strength.

[0006] Therefore, it is necessary to determine appropriate projection conditions for processing the object to be processed with a desired strength. [Means for solving the problem]

[0007] A shot processing device according to one embodiment includes a shot processing device, a measuring device, and a control device. The shot processing device performs a shot processing to project a projection material. The measuring device receives the projection material projected from the shot processing device, and outputs a signal waveform related to a wave motion generated by the collision of the projection material. The control device controls the shot processing device. The control device has a processing condition acquisition unit, a control unit, an intensity analysis unit, and a correction unit. The processing condition acquisition unit acquires a required intensity indicating the intensity of the shot processing to be performed on the processing object. The control unit controls the shot processing device so that the measurement device performs the shot processing under a first projection condition. The intensity analysis unit acquires a measured intensity indicating the intensity of the shot processing to the measurement device by analyzing a signal waveform output from the measurement device by the shot processing to the measurement device. The correction unit corrects the projection conditions of the shot processing device from the first projection condition to the second projection condition so that the difference between the required intensity and the measured intensity becomes small.

[0008] In the shot processing system of this aspect, when a shot material is projected from the shot processing device to the measuring device under the first projection condition, a signal waveform related to a wave motion generated by the collision of the shot material is output from the measuring device. By analyzing this signal waveform, a measured intensity indicating the strength of the shot processing to the measuring device is obtained. Then, the first projection condition is corrected to the second projection condition so that the difference between the required intensity and the measured intensity is reduced. By such correction, the projection condition of the shot processing device can be brought closer to the projection condition for obtaining the required intensity. Therefore, according to this aspect, it is possible to determine an appropriate projection condition for processing the processing object at the required intensity.

[0009] In one embodiment, the control device may further include a determination unit that determines a first projection condition based on the required intensity. According to this embodiment, the measurement device can perform a shot process under a projection condition according to the required intensity.

[0010] In one embodiment, the measurement device may include a projection surface that receives the projection material, and an AE sensor that outputs a signal waveform related to an elastic wave generated by the collision of the projection material with the projection surface. According to this embodiment, the measurement intensity can be appropriately obtained by analyzing the waveform signal related to the elastic wave measured by the AE sensor.

[0011] In one embodiment, the shot processing device includes a second AE sensor that is fixed to a nozzle of the shot processing device, measures elastic waves generated when the projection material is projected, and outputs a signal waveform related to the measured elastic waves, and the control device may further include a projection condition analysis unit that measures the projection conditions of the shot processing device by analyzing the signal waveform output from the second AE sensor. According to this embodiment, the projection conditions of the shot processing device can be appropriately determined by analyzing the waveform signal related to the elastic waves measured by the second AE sensor.

[0012] In one embodiment, the control device may further include an alarm output unit that outputs an alarm when the difference between the projection conditions set in the shot processing device by the control unit and the projection conditions measured by the projection condition analysis unit exceeds a predetermined threshold. If the difference between the set projection conditions and the projection conditions measured by the projection condition analysis unit exceeds a predetermined threshold, it is presumed that an abnormality has occurred in the shot processing device. In this embodiment, an alarm is output when the difference between the projection conditions set by the control unit and the projection conditions measured by the projection condition analysis unit exceeds a predetermined threshold, so that an abnormality in the shot processing device can be notified early.

[0013] In one embodiment, the control device may further include a second correction unit that corrects the set projection conditions when a difference between the set projection conditions and the measured projection conditions exceeds a predetermined threshold. According to this embodiment, the actual projection conditions of the shot processing device can be made closer to the target projection conditions.

[0014] In another aspect, a shot processing method is provided using a shot processing device that performs a shot processing to project a projection material. This shot processing method includes a step of acquiring a required intensity indicating the intensity of the shot processing to be performed on a processing object, a step of controlling the shot processing device so that the measurement device performs the shot processing under a first projection condition, a step of outputting a signal waveform related to a wave motion generated by the projection material colliding with the measurement device, a step of acquiring a measured intensity indicating the intensity of the shot processing to the measurement device by analyzing the signal waveform, and a step of correcting the projection condition of the shot processing device from the first projection condition to the second projection condition so that the difference between the required intensity and the measured intensity becomes small.

[0015] As described above, according to the shot processing method of the present aspect and the embodiment, the projection conditions of the shot processing device can be made closer to the projection conditions for obtaining the required intensity, and therefore, it is possible to determine the projection conditions appropriate for processing the processing object with the required intensity. Effect of the Invention

[0016] According to various aspects of the present disclosure, it is possible to determine appropriate projection conditions for processing an object to be processed with a desired strength. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic diagram of a shot processing system according to an embodiment. [Diagram 2] FIG. 2 is a block diagram showing a functional configuration of the shot processing system. [Diagram 3] FIG. 4 is a diagram showing an example of an AE signal waveform measured by an AE sensor. [Figure 4] 1 is a graph showing the relationship between AE parameters and intensity. [Diagram 5] 1 is a graph showing the relationship between AE parameters and the blast pressure of the projection material. [Figure 6] 1 is a flowchart illustrating a shot processing method according to an embodiment. [Figure 7] 10 is a flowchart showing a method for monitoring an abnormality in the shot processing device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the following description, the same or equivalent elements are denoted by the same reference numerals, and redundant description will not be repeated. The dimensional ratios of the drawings do not necessarily correspond to those in the description.

[0019] FIG. 1 is a diagram showing a schematic diagram of a shot processing system according to an embodiment. FIG. 2 is a block diagram showing a functional configuration of a shot processing system according to an embodiment. The shot processing system 1 shown in FIG. 1 and FIG. 2 determines the projection conditions of the projection material in order to process the processing object with a desired intensity, and projects the projection material under the determined projection conditions. In this specification, the process of projecting the projection material from the shot processing device is referred to as "shot processing". The shot processing includes shot blasting processing for the purpose of removing scale, deburring, adjusting surface roughness, etc., and shot peening processing for the purpose of imparting residual compressive stress to the processing object.

[0020] As shown in FIG. 1, the shot processing system 1 includes a shot processing device 10, a measuring device 20, and a control device 30. The shot processing device 10 processes the surface of the processing object by projecting a blast material onto the processing object and colliding the blast material with the processing object. For example, the shot processing device 10 is a shot peening device that imparts compressive residual stress to the surface of the processing object. Examples of the processing object that undergoes shot processing by the shot processing device 10 include automobile parts such as cylinder heads and crankshafts, gears, and dies, but the processing object is not limited to these. The fatigue properties of the processing object are improved by imparting compressive residual stress to the surface of the processing object by the shot processing. The compressive residual stress to be imparted to the processing object is determined according to the application of the processing object. The magnitude of the compressive residual stress imparted to the processing object depends on the strength of the shot processing (the impact strength of the blast material).

[0021] The shot processing device 10 shown in Fig. 1 is a direct pressure type shot peening device. The shot processing device 10 may be a suction type or gravity type shot peening device. As the shot material S to be blasted onto the treatment object, for example, steel balls are used. The particle size of the steel balls is appropriately selected according to the compressive residual stress to be imparted to the treatment object.

[0022] As shown in Fig. 1, the shot processing device 10 includes a blasting material tank 11, a blasting material supply device 12, a pressurized tank 13, a compressor 14, and a nozzle 15. The blasting material tank 11 stores blasting material S. The blasting material tank 11 is connected to the pressurized tank 13 via the blasting material supply device 12. An openable and closable poppet valve 64 is provided between the blasting material supply device 12 and the pressurized tank 13. When the poppet valve 64 is opened, the blasting material S stored inside the blasting material tank 11 is supplied to the pressurized tank 13 via the blasting material supply device 12.

[0023] The compressor 14 generates compressed air and supplies the compressed air to the pressurized tank 13 and the nozzle 15. One end of a pipe 61 is connected to the compressor 14. The other end of the pipe 61 is connected to a pipe 63 described later. A pipe 62 branches off from a position between the one end and the other end of the pipe 61. The pipe 62 is connected to an air inlet 13A of the pressurized tank 13. An air flow rate control valve 68 is provided in the pipe 62. The air flow rate control valve 68 adjusts the flow rate of the compressed air flowing through the pipe 62. When the air flow rate control valve 68 is opened, the compressed air from the compressor 14 is supplied to the pressurized tank 13 via the pipes 61 and 62. The inside of the pressurized tank 13 is pressurized by supplying the compressed air from the compressor 14 to the pressurized tank 13.

[0024] The pressurized tank 13 has a shot outlet 13B through which the projection material S flows out. The shot outlet 13B is provided with a cut gate 60 that can be opened and closed. A pipe 63 is connected to the shot outlet 13B via the cut gate 60. The pipe 63 is provided with a shot amount adjustment valve 65 that adjusts the amount of the projection material S sprayed from the nozzle 15. The other end of the pipe 61 is connected to the pipe 63. The connection between the pipe 61 and the pipe 63 constitutes a mixing section 25A where the projection material S supplied from the pressurized tank 13 and the compressed air supplied from the compressor 14 are mixed. This mixing section 25A is located downstream of the branching section 25B where the pipe 62 branches off from the pipe 61 in the flow direction of the compressed air.

[0025] An air flow rate regulating valve 66 is provided at a position between the mixing section 25A and the branching section 25B in the piping 61. The air flow rate regulating valve 66 regulates the flow rate of compressed air supplied from the compressor 14 to the nozzle 15. The compressed air whose flow rate has been regulated by the air flow rate regulating valve 66 is mixed with the projection material S supplied from the pressurized tank 13 in the mixing section 25A, and sent to the nozzle 15.

[0026] The nozzle 15 is provided at the tip of the piping 63, and sprays the blast material S supplied from the pressurized tank 13 together with compressed air as a two-phase solid-gas flow. The nozzle 15 is disposed inside the cabinet 70. The cabinet 70 defines a processing chamber 70s, which is a space for processing the object to be processed. When the object to be processed is subjected to shot processing, the object to be processed is placed in the processing chamber 70s, and the blast material S is projected from the nozzle 15 toward the object to be processed in the processing chamber 70s, causing the blast material S to collide with the object to be processed.

[0027] Although not shown in Fig. 1, the shot processing device 10 may further include a dust collector, a classifier, and a circulation device to reuse the used blast material S. The dust collector is connected to the processing chamber 70s via the classifier, and transports the blast material S and cutting chips of the processing object that have fallen to the bottom of the processing chamber 70s to the classifier by sucking them in. The classifier is, for example, a cyclone-type classifier, and receives the blast material S and cutting chips of the processing object, and classifies them into granules that can be reused as blast material S and granules that cannot be used as blast material S. The circulation device returns the reusable blast material S to the blast material tank 11 via a packet elevator, a screw conveyor, a separator, etc.

[0028] The shot processing device 10 further includes an AE sensor (second AE sensor) 16, an AD conversion unit 17, and a communication unit 18 (see FIG. 2). The AE sensor 16 is fixed to the nozzle 15, and measures acoustic emission (AE) generated when the projection material S is projected from the nozzle 15 of the shot processing device 10, and outputs a signal waveform related to the measured AE (hereinafter referred to as "AE signal waveform"). The AE signal waveform is a signal waveform related to elastic waves such as vibrations or sound waves generated when the projection material S is jetted and passes through the nozzle 15. The AE signal waveform includes characteristic parameters related to the intensity of the shot processing, such as amplitude, duration, AE count, rise time, AE count rate, and average frequency.

[0029] The AD conversion unit 17 converts the AE signal waveform output from the AE sensor 16 into digital data and outputs it. The communication unit 18 is a communication module capable of wireless communication such as LAN, Bluetooth (registered trademark), and Wifi. The communication unit 18 receives digital data of the AE signal waveform measured by the AE sensor 16 from the AD conversion unit 17, and transmits the digital data to the control device 30 by wireless communication.

[0030] As described above, the shot material S projected from the nozzle 15 of the shot processing device 10 collides with the object to be processed. The shot material S strikes the surface of the object to be processed and stretches it, and a reaction force against the force is generated in the object to be processed, and as a result, compressive residual stress is imparted to the object to be processed. Here, the compressive residual stress to be imparted to the object to be processed is determined according to the application of the object to be processed. In order to impart the required compressive residual stress to the object to be processed, it is required to perform the shot processing with an appropriate intensity for the object to be processed. In the following description, intensity is used as an index that quantitatively represents the intensity of the shot processing. The intensity corresponds to the arc height at the point when the increase rate of the arc height read from the saturation curve becomes within 10% by measuring the arc height value after performing the shot processing on a test piece for an arbitrary time. In the following description, the intensity for imparting the required compressive residual stress to the object to be processed is called the "required intensity". In other words, the required intensity represents the strength of the shot treatment that should be performed on the treatment object.

[0031] In the shot processing system 1, in order to check whether the intensity of the shot processing matches the required intensity, the intensity of the shot processing is measured by performing the shot processing on the measurement device 20 before performing the shot processing on the processing object. Then, it is periodically checked whether the measured intensity matches the required intensity. The measurement of the intensity is performed, for example, once or multiple times before performing the shot processing on the processing object.

[0032] The measuring device 20 receives the projection material S projected from the shot processing device 10 on the projection surface 20a, and outputs a signal related to the wave motion generated by the collision of the projection material S. The wave motion is a general term for the wave generated when the projection material S collides with the projection surface 20a, and is a concept including elastic waves, vibrations, ultrasonic waves, and electromagnetic waves. As shown in FIG. 2, the measuring device 20 includes an AE sensor 21, an AD conversion unit 22, and a communication unit 23. The AE sensor 21 measures the AE generated when the projection material S projected from the shot processing device 10 collides with the projection surface 20a of the measuring device 20, and outputs a signal waveform related to the measured AE. FIG. 3 shows an example of an AE signal waveform measured by the AE sensor 21 when the projection material S collides. The AE signal waveform is a signal waveform related to the AE (elastic wave) generated by the collision of the projection material S with the projection surface 20a.

[0033] The AD conversion unit 22 converts the AE signal waveform output from the AE sensor 21 into digital data and outputs it. The communication unit 23 is a communication module capable of wireless communication such as LAN, Bluetooth (registered trademark), and Wifi. The communication unit 23 receives digital data of the AE signal waveform measured by the AE sensor 21 from the AD conversion unit 22, and transmits the digital data to the control device 30 by wireless communication.

[0034] The control device 30 is a computer equipped with a processor, a storage device, an input device, a display device, a communication device, etc., and controls the operation of the entire shot processing system 1. The control device 30, for example, loads a program stored in the storage device and executes the loaded program on the processor to realize various functions described below. In the control device 30, an operator can use the input device to input commands and the like to manage the shot processing device 10, and the operating status of the shot processing device 10 can be visualized and displayed on the display device.

[0035] The control device 30 is connected to be able to communicate with the shot processing device 10 and the measurement device 20. The control device 30 determines the projection conditions of the projection material S of the shot processing device 10, and controls the shot processing device 10 so as to project the projection material S under the determined projection conditions. Here, the projection conditions are conditions set in the shot processing device 10 in order to project the projection material S, and examples of these include the injection pressure of the projection material S and the injection amount of the projection material S.

[0036] 2, the control device 30 has, as functional components, a projection condition determination unit 31, a projection condition correction unit 32, an equipment monitoring unit 33, a control unit 34, and a memory unit 35. The projection condition determination unit 31 determines the projection conditions for obtaining the required intensity by utilizing the correlation between the projection conditions of the projection material S and the intensity.

[0037] The blasting condition determination unit 31 includes a processing condition acquisition unit 41 and a determination unit 42. The processing condition acquisition unit 41 acquires the required intensity of the processing object as the processing condition. In addition to the required intensity, the processing condition acquisition unit 41 may acquire the intensity management range and information on the blasting material (particle size, hardness, etc.). These processing conditions may be input by, for example, an operator of the shot processing device 10, or may be stored in advance in the storage unit 35. The processing condition acquisition unit 41 saves the acquired processing conditions in the storage unit 35.

[0038] The determination unit 42 determines projection conditions for obtaining the required intensity based on the processing conditions of the processing object acquired by the processing condition acquisition unit 41. There is a correlation between the projection conditions of the shot processing device 10 and the intensity, and a model formula expressing the correlation between the projection conditions of the shot processing device 10 and the intensity is stored in advance in the storage unit 35 of the control device 30. The determination unit 42 determines first projection conditions as projection conditions corresponding to the required intensity acquired by the processing condition acquisition unit 41 using the model formula stored in the storage unit 35. The determination unit 42 stores the determined first projection conditions in the storage unit 35.

[0039] The control unit 34 controls the shot processing device 10 to project the projection material under the first projection conditions determined by the projection condition determination unit 31. For example, the control unit 34 controls the operation of the compressor 14 of the shot processing device 10, the opening and closing of the cut gate 60, the opening degree of the shot amount adjustment valve 65, and the opening degrees of the air flow rate adjustment valve 66 and the air flow rate adjustment valve 68, thereby causing the shot processing device 10 to project the projection material S at the injection pressure and injection amount set as the first projection conditions. The projection material S projected from the shot processing device 10 collides with the projection surface 20a of the measurement device 20. The measurement device 20 measures the AE generated by the collision of the projection material S and outputs an AE signal waveform.

[0040] The projection condition correction unit 32 analyzes the AE signal waveform measured by the measurement device 20 to obtain a measured value of intensity (hereinafter referred to as "measured intensity"), and corrects the projection conditions of the shot processing device 10 based on the difference between the measured intensity and the required intensity. As shown in Fig. 2, the projection condition correction unit 32 includes a signal receiving unit 46, an intensity analysis unit 47, a comparison unit 48, and a correction unit 49. The signal receiving unit 46 receives digital data of the AE signal waveform measured by the AE sensor 21 from the communication unit 23.

[0041] The intensity analysis unit 47 analyzes the AE signal waveform received by the signal receiving unit 46, and calculates the intensity when the shot processing is performed under the first projection condition. For example, the intensity analysis unit 47 acquires AE parameters from the AE signal waveform. For example, the amplitude, duration, AE count, or rise time of the AE signal waveform is used as the AE parameter. Note that the peak value, average value, or effective value of the AE signal waveform may also be used as the AE parameter.

[0042] FIG. 4 is a graph plotting the relationship between the AE parameter and the intensity for each type of projection material. As shown in FIG. 4, there is a correlation between the AE parameter and the intensity. The intensity analysis unit 47 draws an approximate line or an approximate curve representing the relationship between the AE parameter and the intensity of the shot process on the graph shown in FIG. 4, and generates a model formula representing the correlation between the AE parameter and the shot process for each type of projection material from the approximate line or the approximate curve. Then, the intensity analysis unit 47 calculates the intensity corresponding to the AE parameter of the AE signal waveform received by the signal receiving unit 46 based on the generated model formula. The intensity calculated in this way is the measured intensity obtained from the measurement value of the measurement device 20. The intensity analysis unit 47 stores the measured intensity in the memory unit 35.

[0043] The comparison section 48 compares the required intensity with the measured intensity, determines whether the difference between the required intensity and the measured intensity falls within a specified control range, and outputs information indicating the determination result to the correction section 49.

[0044] When the comparison unit 48 determines that the difference between the required intensity and the measured intensity is not within the specified control range, the correction unit 49 corrects the projection conditions of the shot processing device 10 from the first projection conditions to the second projection conditions so that the difference between the required intensity and the measured intensity becomes smaller. For example, the intensity of the shot processing tends to increase as the injection pressure or injection amount of the projection material S increases. Therefore, when the measured intensity is smaller than the required intensity, for example, the correction unit 49 sets the second projection conditions in which the injection pressure or injection amount is higher than the injection pressure or injection amount specified in the first projection conditions. Then, the correction unit 49 stores the second projection conditions, which are the corrected projection conditions, in the memory unit 35.

[0045] The control unit 34 controls the shot processing device 10 to project the projection material S onto the processing object under the second projection conditions corrected by the correction unit 49. By projecting the projection material S under the second projection conditions, the intensity of the shot processing can be made to approach the required intensity. Therefore, the desired compressive residual stress can be imparted to the processing object.

[0046] 2, the equipment monitoring unit 33 detects abnormalities in the shot processing device 10, and includes a signal receiving unit 51, a projection condition analysis unit 52, an abnormality determination unit 53, an alarm output unit 54, and a correction unit (second correction unit) 55. The signal receiving unit 51 receives digital data of the AE signal waveform measured by the AE sensor 16 of the shot processing device 10 from the communication unit 18.

[0047] The projection condition analysis unit 52 analyzes the AE signal waveform received by the signal receiving unit 51, and acquires the projection conditions of the shot processing device 10 when projecting the projection material S. First, the projection condition analysis unit 52 acquires AE parameters from the AE signal waveform.

[0048] FIG. 5 is a graph in which the relationship between the AE parameter and the ejection pressure of the projection material S, which is one of the projection conditions, is plotted for each type of projection material. As shown in FIG. 5, there is a correlation between the ejection pressure and the AE parameter. The projection condition analysis unit 52 draws an approximate line or an approximate curve representing the relationship between the ejection pressure and the AE parameter on the graph shown in FIG. 5, and generates a model formula representing the correlation between the ejection pressure and the AE parameter from the approximate line or the approximate curve for each type of projection material. Then, the intensity analysis unit 47 calculates the ejection pressure (projection condition) corresponding to the AE parameter of the AE signal waveform received by the signal receiving unit 51 based on the generated model formula. Note that the projection condition analysis unit 52 may calculate the ejection amount corresponding to the AE parameter of the AE signal waveform received by the signal receiving unit 51 based on the model formula representing the correlation between the ejection amount of the projection material S and the AE parameter. The projection condition calculated in this way is the measurement value of the projection condition calculated from the measurement value of the AE sensor 21 (hereinafter referred to as the "measured projection condition"). The projection condition analysis unit 52 stores the calculated measurement projection conditions in the storage unit 35.

[0049] The abnormality determination unit 53 compares the projection conditions (for example, the first projection conditions or the second projection conditions) set in the shot processing device 10 (hereinafter referred to as the "set projection conditions") with the measured projection conditions. If there is a difference between the set projection conditions and the measured projection conditions, for example, a defect such as a hole in the piping of the shot processing device 10 may occur, and the actual projection conditions of the shot processing device 10 may deviate from the set projection conditions. Therefore, when the difference between the set projection conditions and the measured projection conditions exceeds a predetermined threshold, the abnormality determination unit 53 outputs abnormality detection information indicating that an abnormality has occurred in the shot processing device 10 to the alarm output unit 54. When the alarm output unit 54 receives the abnormality detection information from the abnormality determination unit 53, it outputs an alarm. The alarm output form is arbitrary as long as it can notify the operator of the shot processing device 10 of the alarm, but for example, the alarm output unit 54 may visually display information indicating the occurrence of an abnormality on the display device of the control device 30, or may transmit information indicating the occurrence of an abnormality to the computer terminal of the operator. This allows the operator of the shot processing device 10 to be notified of any abnormality in the shot processing device 10 at an early stage.

[0050] The correction unit 55 corrects the projection conditions of the shot processing device 10 when the abnormality detection information is output by the abnormality determination unit 53. For example, when the injection pressure of the measured injection conditions is smaller than the injection pressure of the set injection conditions, the injection pressure of the set injection conditions is increased. This allows the actual injection conditions of the shot processing device 10 to approach the target injection conditions. In the embodiment shown in FIG. 2, the equipment monitoring unit 33 includes both the alarm output unit 54 and the correction unit 55, but the equipment monitoring unit 33 may include only one of the alarm output unit 54 and the correction unit 55.

[0051] As described above, in the shot processing system 1 according to the embodiment, when the projection material S is projected from the shot processing device 10 to the measuring device 20 under the first projection condition, an AE signal waveform generated by the collision of the projection material S is output from the measuring device 20. Then, the measured intensity is calculated by analyzing this AE signal waveform. Then, the projection conditions of the shot processing device 10 are corrected from the first projection condition to the second projection condition so that the difference between the required intensity and the measured intensity becomes small. By performing shot processing on the processing object under the corrected second projection condition, it is possible to impart a desired compressive residual stress to the processing object.

[0052] Next, there will be described a shot processing method for a processing object using the above-mentioned shot processing system 1. Fig. 6 is a flowchart showing a shot processing method according to one embodiment.

[0053] In this method, first, the processing condition acquisition unit 41 of the control device 30 acquires the required intensity (step ST1). The required intensity may be input by an operator of the shot processing device 10, or information previously stored in the storage unit 35 may be read. In step ST1, the allowable range (tolerance) of the intensity may be acquired in addition to the required intensity.

[0054] Next, the processing condition acquisition unit 41 acquires information about the projection material S (step ST2). The information about the projection material includes, for example, the particle size and hardness of the projection material S. Next, the determination unit 42 determines the projection conditions of the shot processing device 10 based on the required intensity and the information about the projection material (step ST3). The projection conditions of the shot processing device 10 include, for example, the ejection pressure and ejection amount of the projection material S. The determination unit 42 determines the projection conditions corresponding to the required intensity as the first projection conditions, for example, using a model formula that represents the correlation between the projection conditions of the shot processing device 10 and the intensity.

[0055] Next, the first projection conditions are set in the shot processing device 10 (step ST4). Here, the first projection conditions may be manually input by an operator using an input device, or the control unit 34 may transmit the determined first projection conditions to the shot processing device 10 and set them.

[0056] Next, the shot processing device 10 projects the projection material S under the first projection condition to the measuring device 20 arranged in the processing chamber 70s (step ST5). The projection material S projected from the shot processing device 10 collides with the projection surface 20a of the measuring device 20. The measuring device 20 measures elastic waves generated by the collision of the projection material S, and transmits an AE signal waveform related to the measured elastic wave to the control device 30 by wireless communication. The signal receiving unit 46 acquires the AE signal waveform output from the AE sensor 21 of the measuring device 20 (step ST6).

[0057] Next, the intensity analysis unit 47 analyzes the AE signal waveform to obtain AE parameters (step ST7). Also, the intensity analysis unit 47 obtains a measured intensity corresponding to the AE waveform signal obtained in step ST6 by using a model formula that represents the correlation between the AE parameters and the intensity (step ST8).

[0058] Next, the comparison unit 48 compares the required intensity acquired in step ST1 with the measured intensity calculated in step ST8, and judges whether the difference between the measured intensity and the required intensity is within the control range (step ST9). That is, the comparison unit 48 judges that the difference between the measured intensity and the required intensity is within the control range when the measured intensity is equal to or lower than the upper limit of the control range of the required intensity and equal to or higher than the lower limit of the control range of the required intensity. If it is judged that the measured intensity is outside the control range, the correction unit 49 calculates the difference between the required intensity and the measured intensity (step ST10).

[0059] Next, the correction unit 49 corrects the projection conditions so that the difference between the required intensity and the measured intensity becomes smaller (step ST11). For example, if the measured intensity is smaller than the required intensity, the projection conditions of the shot processing device 10 are corrected to second projection conditions including a higher injection pressure or injection amount than the injection pressure or injection amount of the first projection conditions. The correction amount of the injection pressure or injection amount becomes larger as the difference between the required intensity and the measured intensity becomes larger.

[0060] Next, the corrected second projection conditions are set in the shot processing device 10 (step ST4), and the shot processing device 10 projects the projection material S to the measurement device 20 under the corrected second projection conditions (step ST5). Then, steps ST4 to ST11 are repeated until the difference between the measured intensity and the required intensity falls within the control range.

[0061] When the measured intensity falls within the control range, the measuring device 20 is removed from the processing chamber 70s, and the object to be treated is placed in the processing chamber 70s. Then, the shot processing device 10 projects the projection material S onto the object to be treated under the set projection conditions (step ST12). This allows the object to be shot at the required intensity. As a result, the object to be treated is given the desired compressive residual stress.

[0062] Next, a method for monitoring an abnormality in the shot processing device 10 will be described with reference to Fig. 7. Fig. 7 is a flowchart showing a method for monitoring an abnormality in the shot processing device 10. The method shown in Fig. 7 may be executed in parallel with the shot processing method shown in Fig. 6.

[0063] In this method, first, projection conditions are set in the shot processing device 10 (step ST21). The projection conditions set in step ST21 may be first projection conditions determined by the projection condition determination unit 31, or may be second projection conditions corrected by the projection condition correction unit 32. Next, the shot processing device 10 projects the projection material S under the set projection conditions (step ST22). At this time, elastic waves such as sound waves and vibrations are generated around the nozzle 15 as the projection material S passes through the nozzle 15 of the shot processing device 10.

[0064] Next, the AE sensor 16 of the shot processing device 10 measures the elastic waves generated when the projection material S is projected, and outputs an AE signal waveform related to the measured elastic waves. The signal receiving unit 51 acquires the AE signal waveform output from the AE sensor 16 (step ST23). Next, the projection condition analysis unit 52 analyzes the AE signal waveform received by the signal receiving unit 51, and acquires AE parameters corresponding to the AE signal waveform (step ST24). Next, the projection condition analysis unit 52 calculates the projection conditions corresponding to the AE waveform signal using a model formula that represents the correlation between the AE parameters and the projection conditions (step ST25). The projection conditions calculated in step ST25 are the measured projection conditions calculated from the measurement values ​​of the AE sensor 21.

[0065] Next, the abnormality determination unit 53 compares the set projection conditions set in step ST21 with the measured projection conditions calculated in step ST25, and determines whether the difference between the set projection conditions and the measured projection conditions is within an allowable range (step ST26). The abnormality determination unit 53 determines that the difference between the set projection conditions and the measured projection conditions is within an allowable range when the difference is equal to or less than a predetermined threshold. If the difference between the set projection conditions and the measured projection conditions is within an allowable range, it is determined that the shot processing device 10 is operating normally, and the series of processes is terminated.

[0066] On the other hand, if the difference between the set projection conditions and the measured projection conditions exceeds a predetermined threshold, the abnormality determination unit 53 outputs abnormality detection information. In response to the output of this abnormality detection information, the warning output unit 54 outputs a warning (step ST27). By outputting this warning, the operator of the shot processing device 10 can be notified of an abnormality in the shot processing device 10 at an early stage.

[0067] When the abnormality determination unit 53 outputs the abnormality detection information, the correction unit 55 may correct the projection conditions of the shot processing device 10. For example, when the ejection pressure calculated in step ST25 is lower than the ejection pressure set in step ST21, the ejection pressure of the shot processing device 10 is increased to bring the actual ejection pressure of the shot processing device 10 closer to the target ejection pressure.

[0068] The shot processing system and shot processing method according to various embodiments have been described above, but the invention is not limited to the above-described embodiments and various modifications can be made without departing from the spirit and scope of the invention.

[0069] 2, the control device 30 is provided with an equipment monitoring unit 33 that detects abnormalities in the shot processing device 10, but the control device 30 does not necessarily have to be provided with the equipment monitoring unit 33. By providing at least the projection condition determination unit 31 and the projection condition correction unit 32, it is possible to determine the projection conditions for performing shot processing on the processing object with the required intensity.

[0070] In the above embodiment, the projection condition analysis unit 52 of the equipment monitoring unit 33 calculates the measured projection conditions by analyzing the AE signal waveform output from the AE sensor 16, but if the measured projection conditions can be calculated, the AE signal waveform from the AE sensor 16 does not necessarily have to be used. As described above, there is a correlation between the projection conditions of the shot processing device 10 and the intensity. Therefore, in one embodiment, the measured projection conditions may be calculated from the measured intensity calculated by the intensity analysis unit 47 by utilizing the correlation between the projection conditions of the shot processing device 10 and the intensity. Then, the set projection conditions and the measured projection conditions calculated from the measured intensity may be compared, and when the difference between the two projection conditions exceeds a predetermined threshold, abnormality detection information may be output. In this embodiment, an abnormality in the shot processing device 10 can be detected without using the AE sensor 16. Therefore, it is possible to reduce the number of parts of the shot processing system 1.

[0071] In the above-described embodiment, a shot peening device that imparts compressive residual stress to a processing object is used as the shot processing device 10, but the shot processing device 10 is not limited to a shot peening device as long as it is a device that projects a projection material. For example, the shot processing device 10 may be a shot blasting device that projects a projection material to a processing object to remove burrs or adjust surface roughness. In addition, the shot processing device 10 according to the above-described embodiment is an air nozzle type shot peening device that injects the projection material S with compressed air, but in one embodiment, the shot processing device 10 may be an impeller type shot peening device that projects the projection material S by the centrifugal force of a high-speed rotating impeller. In this case, the impeller rotation speed is included in the projection conditions.

[0072] In the above embodiment, the measuring device 20 uses an AE sensor to measure elastic waves generated when the projection material collides with the projection surface 20a, but the measuring device 20 may measure a wave motion other than an elastic wave and output a signal waveform related to the wave motion. Examples of sensors that measure a wave motion other than an elastic wave include a vibration sensor, an acceleration sensor, and an impact sensor that measure vibrations, an ultrasonic sensor that measures ultrasonic waves, an electromagnetic sensor that measures electromagnetism, an eddy current sensor, a laser displacement meter, and an ultrasonic sensor that measure displacement, a color sensor that measures color, and a Barkhausen noise sensor that measures Barkhausen noise.

[0073] The various embodiments described above can be combined to the extent that no contradiction occurs. [Explanation of symbols]

[0074] DESCRIPTION OF THE REFERENCE NUMERALS 1...shot processing system, 10...shot processing device, 15...nozzle, 16...AE sensor (second AE sensor), 20...measuring device, 20a...projection surface, 21...AE sensor, 30...control device, 34...control unit, 47...intensity analysis unit, 49...correction unit, 52...projection condition analysis unit, 54...alarm output unit, 55...correction unit (second correction unit), S...projection material.

Claims

1. a shot processing device that performs a shot processing for projecting a projection material; a measuring device that receives the projection material projected from the shot processing device and outputs a signal waveform related to a wave motion generated by the collision of the projection material; A control device for controlling the shot processing device; Equipped with The control device includes: a processing condition acquisition unit that acquires a required intensity indicating the intensity of the shot processing to be performed on the processing object; a determination unit that determines a first projection condition for obtaining the required intensity based on a correlation between the projection condition of the shot processing device and the intensity; a control unit that controls the shot processing device so that the measurement device performs the shot processing under the first projection condition; an intensity analysis unit that acquires a measurement intensity indicating an intensity of the shot treatment to the measurement device by analyzing the signal waveform output from the measurement device by the shot treatment to the measurement device; a correction unit that corrects the projection conditions of the shot processing device from the first projection conditions to second projection conditions so that a difference between the required intensity and the measured intensity becomes small; A shot processing system comprising:

2. 2. The shot processing system according to claim 1, wherein the measurement device comprises: a projection surface that receives the projection material; and an AE sensor that outputs the signal waveform related to an elastic wave generated by the collision of the projection material with the projection surface.

3. the shot processing device is provided with a second AE sensor that is fixed to a nozzle of the shot processing device, measures an elastic wave generated when the projection material is projected, and outputs a signal waveform related to the measured elastic wave; 3. The shot processing system according to claim 1, wherein the control device further comprises a projection condition analysis unit that measures projection conditions of the shot processing device by analyzing the signal waveform output from the second AE sensor.

4. 4. The shot processing system according to claim 3, wherein the control device further includes an alarm output unit that outputs an alarm indicating that an abnormality has occurred in the shot processing device when a difference between the projection conditions set in the shot processing device by the control unit and the projection conditions measured by the projection condition analysis unit exceeds a predetermined threshold value.

5. 5. The shot processing system according to claim 4, wherein the control device further comprises a second correction unit that corrects the set projection conditions when a difference between the set projection conditions and the measured projection conditions exceeds a predetermined threshold value.

6. A shot processing method using a shot processing device that performs shot processing to project a projection material, comprising: Obtaining a required intensity indicating the intensity of the shot treatment to be performed on the treatment object; determining a first blasting condition for obtaining the required intensity based on a correlation between the blasting condition of the shot processing device and the intensity; performing the shot processing from the shot processing device to a measuring device under a first projection condition; A step of acquiring a signal waveform related to a wave motion generated by the projection material colliding with the measuring device; obtaining a measured intensity indicative of the intensity of the shot treatment on the measuring device by analyzing the signal waveform; correcting the projection conditions of the shot processing device from the first projection conditions to second projection conditions so that a difference between the required intensity and the measured intensity becomes small; A method of processing a shot.

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