Light-emitting device and electronic device

Abstract

This light emitting device is provided with a light emitting region comprising light emitting elements arranged in a matrix, and includes, as an optical element formed to correspond to each of the light emitting elements and designed to adjust the emission direction of light, an optical element formed such that one of a color filter layer and a transparent layer constitutes an incidence-side lower layer part and the other constitutes an emission-side upper layer part, and formed such that at least part of the lower layer part and the upper layer part are exposed on an interface with the outside world.

Description

[Technical field]

[0001] The present disclosure relates to a light-emitting device and an electronic device. [Background technology]

[0002] 2. Description of the Related Art Current-driven light-emitting elements and light-emitting devices including such light-emitting elements are well known. For example, light-emitting elements formed of organic electroluminescence elements have attracted attention as light-emitting elements capable of emitting high-luminance light when driven by a low-voltage direct current.

[0003] Light-emitting devices having a light-emitting region made up of light-emitting elements arranged in a matrix are used, for example, for displaying images by emitting visible light, or for measuring distances by emitting infrared light in a predetermined pattern. Light-emitting devices that are attached to eyewear such as glasses or goggles and display images are required to have light-emitting elements with a size of several micrometers to 10 micrometers, as well as high brightness. For example, Patent Document 1 proposes forming a microlens array made up of color filters on the light-emitting region to improve light extraction efficiency. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-149536 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a microlens made of a color filter, there remains a problem of how to optimally achieve both the property of adjusting the light emission direction, such as focusing or divergence, and the property of efficiently extracting light of a specified wavelength. That is, in order to ensure the lens power, it is necessary to make the color filter thick to a certain extent, but this reduces the efficiency of extracting light of the specified wavelength.

[0006] Therefore, an object of the present disclosure is to provide a light-emitting device that can optimally achieve both the property of adjusting the light emission direction and the property of efficiently extracting light of a specified wavelength, and an electronic device equipped with such a light-emitting device. [Means for solving the problem]

[0007] In order to achieve the above object, the light emitting device according to the present disclosure comprises: The light-emitting region is made up of light-emitting elements arranged in a matrix. As an optical element formed corresponding to a light emitting element and for adjusting the light emission direction, an optical element is formed in which one of a color filter layer and a transparent layer constitutes a lower layer portion on the incident side and the other constitutes an upper layer portion on the emission side, and at least a part of the lower layer and the upper layer are exposed at an interface with the outside. It is a light-emitting device.

[0008] In order to achieve the above object, an electronic device according to the present disclosure includes: The light-emitting region is made up of light-emitting elements arranged in a matrix. As an optical element formed corresponding to a light emitting element and for adjusting the light emission direction, an optical element is formed in which one of a color filter layer and a transparent layer constitutes a lower layer portion on the incident side and the other constitutes an upper layer portion on the emission side, and at least a part of the lower layer and the upper layer are exposed at an interface with the outside. The electronic device includes a light-emitting device. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic plan view for explaining the light emitting device according to the first embodiment. [Diagram 2] FIG. 2 is a schematic partial cross-sectional view of a substrate and the like for explaining the structure of the light emitting device. [Diagram 3] FIG. 3 is a schematic partial cross-sectional view of a substrate and the like for illustrating adjustment of the light emission direction by an optical element. [Figure 4] 4A, 4B, 4C, 4D, and 4E are schematic perspective views for explaining the shape of the optical element. [Diagram 5] 5A, 5B, 5C, 5D and 5E are schematic overhead views for explaining the shape of the optical element, following FIG. 4E. [Figure 6] 6A and 6B are schematic partial cross-sectional views of a substrate and the like for illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 7] 7 is a schematic partial cross-sectional view of the substrate etc. for illustrating the method for manufacturing the light emitting device according to the first embodiment, continuing from FIG. 6B. [Figure 8] 8 is a schematic partial cross-sectional view of the substrate etc. for illustrating the method for manufacturing the light emitting device according to the first embodiment, continuing from FIG. [Figure 9] 9 is a schematic partial cross-sectional view of the substrate etc. for illustrating the method for manufacturing the light emitting device according to the first embodiment, continuing from FIG. [Figure 10] FIG. 10 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a first modified example of the first embodiment. [Figure 11] FIG. 11 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a second modified example of the first embodiment. [Figure 12] FIG. 12 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a third modified example of the first embodiment. [Figure 13] FIG. 13 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a fourth modified example of the first embodiment. [Figure 14] FIG. 14 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a fifth modified example of the first embodiment. [Figure 15] FIG. 15 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a sixth modified example of the first embodiment. [Figure 16]FIG. 16 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a seventh modified example of the first embodiment. [Figure 17] FIG. 17 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to an eighth modified example of the first embodiment. [Figure 18] FIG. 18 is a schematic plan view for explaining a light emitting device according to a ninth modification of the first embodiment. [Figure 19] FIG. 19 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a ninth modified example of the first embodiment. [Figure 20] FIG. 20 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to the second embodiment. [Figure 21] FIG. 21 is a schematic partial cross-sectional view of a substrate and the like for illustrating a method for manufacturing a light emitting device according to the second embodiment. [Figure 22] 22 is a schematic partial cross-sectional view of a substrate and the like for illustrating the method for manufacturing the light emitting device according to the second embodiment, continuing from FIG. [Figure 23] 23 is a schematic partial cross-sectional view of a substrate and the like for illustrating the method for manufacturing the light emitting device according to the second embodiment, continuing from FIG. [Figure 24] 24 is a schematic partial cross-sectional view of a substrate and the like for illustrating the method for manufacturing the light emitting device according to the second embodiment, continuing from FIG. [Diagram 25] FIG. 25 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to the third embodiment. [Figure 26] FIG. 26 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to the fourth embodiment. [Figure 27] FIG. 27 is a diagram showing the appearance of a lens-interchangeable single-lens reflex type digital still camera, with FIG. 27A showing a front view and FIG. 27B showing a rear view. [Figure 28] FIG. 28 is an external view of a head mounted display. [Figure 29]FIG. 29 is an external view of a see-through head mounted display. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the present disclosure will be described based on the embodiments with reference to the drawings. The present disclosure is not limited to the embodiments, and various numerical values ​​and materials in the embodiments are examples. In the following description, the same elements or elements having the same functions will be designated by the same reference numerals, and duplicated descriptions will be omitted. The description will be given in the following order. 1. General Description of the Light-Emitting Device and Electronic Device According to the Present Disclosure 2. First embodiment and various modifications 3. Second embodiment 4. Third embodiment 5. Fourth embodiment 6. Description of Electronic Devices 7.Other

[0011] [General Description of the Light-Emitting Device and Electronic Device According to the Present Disclosure] As described above, the light-emitting device according to the present disclosure and the light-emitting device used in the electronic device according to the present disclosure (hereinafter, these may be simply referred to as the "light-emitting device according to the present disclosure"), The light-emitting region is made up of light-emitting elements arranged in a matrix. The optical element is formed corresponding to the light-emitting element and is used to adjust the direction of light emission, and includes an optical element in which one of a color filter layer and a transparent layer constitutes a lower layer on the incident side and the other constitutes an upper layer on the emission side, and in which at least a portion of the lower layer and the upper layer are exposed at the interface with the outside.

[0012] The light-emitting device of the present disclosure may be configured to include optical elements in which a color filter layer constitutes a lower layer portion on the incident side and a transparent layer constitutes an upper layer portion on the exit side, in which case different types of color filter layers may be stacked in the regions between adjacent optical elements.

[0013] Alternatively, the light emitting device of the present disclosure may include an optical element in which a transparent layer constitutes a lower layer on the incident side and a color filter layer constitutes an upper layer on the exit side.

[0014] In the light emitting device of the present disclosure including the various preferred configurations described above, the interface between the upper layer and the lower layer of the optical element may be configured to be flat or curved.

[0015] The light-emitting device of the present disclosure including the various preferred configurations described above may further include an optical element entirely formed from a color filter layer or a transparent layer. For example, a light-emitting element that displays white may be provided with an optical element entirely formed from a transparent layer, a light-emitting element that displays red and blue may be provided with an optical element having a laminated color filter layer and a transparent layer, and a light-emitting element that displays green may be provided with an optical element entirely formed from a green color filter layer.

[0016] In the light-emitting device of the present disclosure including the various preferred configurations described above, the color filter layer can be configured to include color materials and / or particles that constitute quantum dots. The color filter layer may be configured using a known resist material to which a desired color material or the like has been added. Well-known pigments and dyes can be used as color materials. The particles that constitute quantum dots are not particularly limited, and for example, luminescent semiconductor nanoparticles can be used. The color filter layer including color materials transmits light in a desired wavelength range from the light-emitting element to perform color display. The color filter layer including particles that constitute quantum dots performs color display by converting the wavelength of light from the light-emitting element.

[0017] In the light-emitting device of the present disclosure including the various preferred configurations described above, a transparent protective film may be formed on the entire surface including the optical element. In this case, the protective film may be formed from a material having a refractive index different from that of the material constituting the optical element. In addition to the shape of the interface between the optical element and the protective film, the light emission direction can also be adjusted depending on the magnitude relationship of the refractive index between the protective film and the optical element. The material constituting the transparent layer and the material constituting the protective film may be appropriately selected from transparent organic materials and inorganic materials.

[0018] In the light-emitting device of the present disclosure including the various preferred configurations described above, the cross-sectional shape of the optical element cut along a plane perpendicular to the light-emitting region can be any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these. Note that "circle" also includes, for example, a semicircle.

[0019] In the light-emitting device of the present disclosure including the various preferred configurations described above, a light-shielding layer may be formed between adjacent light-emitting elements. The position of the light-shielding layer is not particularly limited as long as it does not interfere with the operation of the light-emitting device. From the viewpoint of efficient light-shielding, it is preferable to configure the light-shielding layer to be disposed on the lower layer side of the optical element. The material constituting the light-shielding layer is not particularly limited, and may be appropriately selected from, for example, a metal material such as chromium (Cr) or a black organic material.

[0020] In the light-emitting device of the present disclosure including the various preferred configurations described above, the optical elements may be arranged so that the positional relationship between the center of the corresponding light-emitting element and the center of the optical element is approximately the same. Alternatively, the optical elements may be arranged so that the positional relationship between the center of the corresponding light-emitting element and the center of the optical element has a predetermined amount of deviation. Alternatively, the optical elements may be arranged so that the amount of deviation in the positional relationship between the center of the light-emitting element and the center of the optical element changes depending on the position of the light-emitting element in the light-emitting region.

[0021] In the light-emitting device of the present disclosure including the various preferred configurations described above, the light-emitting element may be configured to be composed of an organic electroluminescence element, an LED element, a semiconductor laser element, or the like. These may be configured using well-known materials and methods. From the viewpoint of configuring a flat light-emitting device, it is particularly preferable that the light-emitting element is configured to be composed of an organic electroluminescence element.

[0022] In this case, the light emitting element may have a resonator structure that resonates light. The light emitting element may also include a driving circuit. The light emitting element and the driving circuit may be connected through a conductive portion such as a via provided in an interlayer insulating film.

[0023] The light-emitting region consisting of light-emitting elements arranged in a matrix is ​​formed, for example, on a substrate. Examples of materials constituting the substrate include semiconductor materials, glass materials, and plastic materials. When the driving circuit is formed by transistors formed on a semiconductor substrate, for example, a well region may be provided on a semiconductor substrate made of silicon, and the transistors may be formed in the well. On the other hand, when the driving circuit is formed by thin film transistors or the like, a substrate made of glass or plastic material may be used, and a semiconductor thin film may be formed thereon to form the driving circuit. Various wirings may have a known configuration or structure.

[0024] In the light-emitting device of the present disclosure, the configuration of the driving circuit that controls the light emission of the light-emitting element is not particularly limited. The light-emitting element can be formed, for example, in a certain plane on a substrate, and can be arranged, for example, above the driving circuit that drives the light-emitting element via an interlayer insulating layer. The configuration of the transistor that constitutes the driving circuit is not particularly limited. It may be a p-channel type field effect transistor or an n-channel type field effect transistor.

[0025] In the light-emitting device of the present disclosure, the light-emitting element can be configured as a so-called top-emitting type. For example, a light-emitting element made of an organic electroluminescence element is configured by sandwiching an organic layer including a hole transport layer, a light-emitting layer, an electron transport layer, etc., between a first electrode and a second electrode. When the cathode is shared, the second electrode becomes the cathode electrode and the first electrode becomes the anode electrode.

[0026] The first electrode is provided on the substrate for each light-emitting element. When the cathode is shared, the first electrode functions as an anode electrode of the light-emitting element. The first electrode can be made of metals such as aluminum (Al), aluminum alloys, platinum (Pt), gold (Au), chromium (Cr), tungsten (W), or alloys thereof. Alternatively, the first electrode may be made by laminating a transparent conductive material layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) and a reflective layer made of a light-reflecting material. The second electrode is provided as a common electrode for each light-emitting element, and can be made of, for example, a mixed layer of magnesium (Mg) and silver (Ag), a metal such as silver (Ag), or a transparent conductive material layer such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0027] The organic layer is formed by laminating a plurality of material layers, and is provided as a common continuous film on the entire surface including the first electrode and the partition wall. The organic layer emits light when a voltage is applied between the first electrode and the second electrode. The organic layer can be configured, for example, by laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the first electrode side. The hole transport material, hole transport material, electron transport material, and organic light emitting material that constitute the organic layer are not particularly limited, and well-known materials can be used.

[0028] The organic layer may include a structure in which a plurality of light-emitting layers are laminated. For example, a light-emitting element that emits white light can be formed by laminating red-, blue-, and green-emitting light-emitting layers, or by laminating blue- and yellow-emitting light-emitting layers. Alternatively, the light-emitting layers can be painted differently for each light-emitting element depending on the color to be displayed.

[0029] The light emitting device of the present disclosure may be configured for color display. In some cases, the light emitting device may be configured for so-called monochrome display. In the case of monochrome display, one light emitting element constitutes one pixel.

[0030] In the case of color display, one light-emitting element constitutes one subpixel. For example, one pixel may be constituted by a plurality of subpixels, specifically, one pixel may be constituted by three subpixels, namely, a red display subpixel, a green display subpixel, and a blue display subpixel. Furthermore, a pixel may be constituted by adding one or more types of subpixels to these three types of subpixels (for example, a set including a subpixel that emits white light to improve luminance, a set including a subpixel that emits a complementary color to expand the color reproduction range, a set including a subpixel that emits yellow to expand the color reproduction range, and a set including a subpixel that emits yellow and cyan to expand the color reproduction range).

[0031] The partition portion separating adjacent light-emitting elements can be formed using a material appropriately selected from known inorganic and organic materials, and can be formed, for example, by a combination of a known film formation method, such as a physical vapor deposition method (PVD method) exemplified by a vacuum deposition method or a sputtering method, or various chemical vapor deposition methods (CVD methods), and a known patterning method, such as an etching method or a lift-off method.

[0032] Examples of pixel values ​​of the light emitting device include VGA (640,480), S-VGA (800,600), XGA (1024,768), APRC (1152,900), S-XGA (1280,1024), U-XGA (1600,1200), HD-TV (1920,1080), Q-XGA (2048,1536), as well as (1920,1035), (720,480), (1280,960), and other image display resolutions, but are not limited to these values.

[0033] Examples of electronic devices equipped with the light-emitting device of the present disclosure include direct-view and projection-type light-emitting devices, as well as various types of electronic devices equipped with an image display function.

[0034] The various conditions in this specification are satisfied not only when they are strictly met, but also when they are substantially met. Various variations that occur in design or manufacturing are permitted. In addition, the drawings used in the following description are schematic and do not indicate actual dimensions or proportions.

[0035] [First embodiment] The first embodiment relates to a light emitting device and an electronic device according to the present disclosure.

[0036] Fig. 1 is a schematic plan view for explaining a light emitting device according to a first embodiment. Fig. 2 is a schematic partial cross-sectional view of a substrate and the like for explaining the structure of the light emitting device. Fig. 3 is a schematic partial cross-sectional view of a substrate and the like for explaining adjustment of the light emission direction by an optical element. For convenience of illustration, hatching has been omitted for some components in Fig. 3. The same applies to Fig. 25 described later.

[0037] As shown in Fig. 1, the light emitting device 1 includes a substrate 100 and a light emitting region LP consisting of light emitting elements ELP arranged in a matrix on the substrate 100. As shown in Fig. 2, the light emitting device 1 includes optical elements 150 formed in correspondence with the light emitting elements ELP for adjusting the emission direction of light. The light emitting device 1 is capable of color display. In Fig. 1, the light emitting elements ELP corresponding to red display, blue display, and green display are indicated by the symbols R, B, and G, respectively.

[0038] The detailed structure of the light emitting device 1 will be described with reference to Fig. 2. The light emitting element ELP is composed of an organic electroluminescence element. The organic electroluminescence element is configured by sequentially laminating an organic layer including a light emitting layer and a second electrode on a first electrode 111 provided for each light emitting element ELP. For convenience of illustration, the organic layer is shown as a single layer 120 in Fig. 2. The organic layer is formed to emit white light. A second electrode 121 made of, for example, a transparent conductive material is formed on the entire surface including the organic layer 120, and further a protective layer 122 and a planarization layer 123 are formed thereon.

[0039] Between adjacent first electrodes 111, partitions 112 made of an insulating material are provided, which separate the light-emitting elements ELP. Although not shown, a drive circuit is formed on the substrate 100 for each light-emitting element ELP. The light-emitting state of the light-emitting element ELP is controlled in response to an external signal.

[0040] As shown in Fig. 2, the display device 1 includes an optical element formed in correspondence with the light-emitting element ELP to adjust the light emission direction. More specifically, the display device 1 includes an optical element 150 in which one of the color filter layer 130 and the transparent layer 140 constitutes a lower layer on the incident side and the other constitutes an upper layer on the emission side, and at least a part of the lower layer and the upper layer are exposed at the interface with the outside. As shown in Fig. 2, the optical element 150 has a convex lens shape in cross section. The interface between the upper layer and the lower layer of the optical element 150 is flat.

[0041] The display device 1 includes an optical element 150 in which a color filter layer 130 constitutes a lower layer portion on the incident side and a transparent layer 140 constitutes an upper layer portion on the emission side. In the color filter layer 130 constituting the lower layer portion, a portion that is not exposed to the interface remains on the flattening layer 123 side. A transparent protective film 160 is formed on the entire surface including the optical element 150. The optical element 150 is arranged so that the positional relationship between the center of the corresponding light-emitting element ELP and the center of the light-emitting element 150 is approximately the same. The material constituting the protective film 160 may be appropriately selected in consideration of the characteristics related to the adjustment of the light emission direction by the optical element 150. Here, it is assumed that the protective film 160 is composed of a material having a smaller refractive index than the material constituting the optical element 150. As shown in FIG. 3, the optical element 150 adjusts the light emission direction so as to collect the light from the light-emitting element ELP.

[0042] The color filter layer 130 shown in FIG. 2 is made of, for example, a resist material containing particles that form color materials and / or quantum dots. A red color filter layer 130 is provided on the light emitting element ELP that corresponds to red display. R A blue color filter layer 130 is formed on the light emitting element ELP corresponding to blue display. B A green color filter layer 130 is formed on the light emitting element ELP corresponding to green display. G Therefore, the white light from the light emitting element ELP is incident on the color filter layer 130. Then, light according to the color filter layer 130 is emitted via the optical element 150.

[0043] In order to ensure the lens power of the optical element 150, it is necessary to make the thickness of the optical element 150 thick to a certain extent. The optical element 150 is configured by laminating the color filter layer 130 and the transparent layer 140, and therefore has a structure that makes it easy to ensure the thickness. According to this structure, the thickness of the color filter layer 130 can be determined by placing emphasis on the property of efficiently extracting light of a predetermined wavelength, and the thickness of the transparent layer 140 can be determined by placing emphasis on the property related to the adjustment of the light emission direction. Therefore, an object of the present disclosure is to be able to suitably achieve both the property related to the adjustment of the light emission direction and the property of efficiently extracting light of a predetermined wavelength.

[0044] In the figure, the optical element 150 has a convex lens shape on the light emission side, but this is only an example, and as long as it can adjust the light emission direction as shown in this example, the shape can be appropriately selected according to the required specifications for the optical element. For example, the cross-sectional shape of the light emitting element 150 cut on a plane perpendicular to the light emitting region can be any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these. Below, examples of the shape of the optical element 150 will be described with reference to the figures.

[0045] Figures 4A, 4B, 4C, 4D, and 4E are schematic overhead views for explaining the shape of the optical element. These show the case where the lower layer side of the optical element 150 is circular. Figure 4A shows an example of a circular cross-sectional shape, Figure 4B shows an example of a trapezoidal cross-sectional shape, Figure 4C shows an example of a rectangular cross-sectional shape, Figure 4D shows an example of a combination of a rectangular cross-sectional shape and a circular cross-sectional shape, and Figure 4E shows an example of a combination of a rectangular cross-sectional shape and a trapezoidal cross-sectional shape.

[0046] 5A, 5B, 5C, 5D, and 5E are also schematic overhead views for explaining the shape of the optical element. These show cases where the lower layer side of the optical element 150 is rectangular (square). Fig. 5A shows an example where the cross-sectional shape is circular, Fig. 5B shows an example where the cross-sectional shape is trapezoidal, Fig. 5C shows an example where the cross-sectional shape is rectangular, Fig. 5D shows an example where the cross-sectional shape is a combination of rectangular and circular, and Fig. 5E shows an example where the cross-sectional shape is a combination of rectangular and trapezoid.

[0047] The above describes the detailed structure of the light emitting device 1. Next, a method for manufacturing the light emitting device 1 according to the first embodiment will be described.

[0048] 6 to 9 are schematic partial cross-sectional views of a substrate and the like for illustrating the method for manufacturing the light emitting device according to the first embodiment.

[0049] [Step-100] (see Figures 6A and 6B) 2 is prepared (see FIG. 6A), and a light-emitting region LP consisting of light-emitting elements ELP arranged in a matrix on the substrate 100 is formed (see FIG. 6B). Specifically, a first electrode 111 corresponding to each light-emitting element ELP is formed on the substrate 100. Next, an organic layer 120 including a light-emitting layer, a second electrode 121, a protective layer 122, and a planarization layer 123 are formed in this order.

[0050] [Step-110] (see Figures 7, 8 and 9) Next, an optical element 150 corresponding to each light-emitting element ELP is formed. First, a color filter layer 130 is formed by a known method on the planarizing layer 123. After that, a transparent layer 140 is formed thereon (see FIG. 7).

[0051] Next, a resist 190 for forming an optical element is formed on the transparent layer 140. For example, a trapezoidal resist 190 is formed (see FIG. 8).

[0052] Thereafter, the resist 190, the transparent layer 140, and the color filter layer 130 are etched, for example, by dry etching. Fig. 9 shows a schematic diagram of the state during the etching process. The thicker the resist 190, the less the amount of etching of the base, so that an optical element 150 is formed, the upper layer of which is made of the transparent layer 140 and the lower layer of which is made of the color filter layer 130.

[0053] [Process-120] Thereafter, the protective film 160 is formed on the entire surface including the optical element 150. Through the above steps, the light emitting device 1 can be obtained.

[0054] If necessary, a transparent opposing substrate may be disposed on the protective film 160. Alternatively, it is also possible to form the optical element 150 on the opposing substrate side and then bond this separately.

[0055] The method for manufacturing the light emitting device 1 has been described above.

[0056] Various modifications are possible to the first embodiment, and various modifications will be described below.

[0057] FIG. 10 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a first modified example of the first embodiment.

[0058] In the optical element 150 of the light-emitting device 1 shown in Fig. 2, the color filter layer 130 constituting the lower layer has a portion that is not exposed to the interface, so that the color filter layer 130 is partially exposed to the interface with the outside. In contrast, the light-emitting device 1A shown in Fig. 10 differs in that the color filter layer 130 constituting the lower layer is entirely etched so as to be exposed to the interface with the outside.

[0059] Fig. 11 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a second modified example of the first embodiment, and Fig. 12 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a third modified example of the first embodiment.

[0060] In the light emitting device 1 shown in Fig. 2, the interface between the upper and lower layers of the optical element 150 is flat. In contrast, in the light emitting device 1B shown in Fig. 11 or the light emitting device 1C shown in Fig. 11, the interface between the upper and lower layers of the light emitting element 150 is curved.

[0061] For example, since the color filter layer 130 is patterned according to each light-emitting element ELP, the upper surface of the color filter layer 130 may become curved in the process. In such a case, the interface between the color filter layer 130 and the transparent layer 140 becomes curved. Fig. 11 shows an example in which the upper surface of the color filter layer 130 is a convex curved surface, and Fig. 12 shows an example in which the upper surface of the color filter layer 130 is a concave curved surface.

[0062] Fig. 13 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a fourth modified example of the first embodiment, and Fig. 14 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a fifth modified example of the first embodiment.

[0063] If the etching characteristics differ between the material of the upper layer and the material of the lower layer constituting the light emitting element 150, a difference also occurs in the shape after etching. In the light emitting device 1D shown in Fig. 13, the transparent layer 140 constituting the upper layer is etched to have a rectangular cross section, and the color filter layer 130 constituting the lower layer is etched to have a trapezoidal cross section. In the light emitting device 1E shown in Fig. 14, the transparent layer 140 constituting the upper layer is etched to have a circular cross section, and the color filter layer 130 constituting the lower layer is etched to have a rectangular cross section.

[0064] FIG. 15 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to a sixth modified example of the first embodiment.

[0065] 15, different types of color filter layers are formed so as to be stacked in the regions (denoted by the reference characters DP) between adjacent light emitting elements 150. This is what makes the light emitting device 1F shown in FIG.

[0066] In the area where different types of color filter layers are stacked, light transmission is prevented, which makes it possible to prevent color mixing due to light leakage from adjacent light-emitting elements ELP.

[0067] FIG. 16 is a schematic cross-sectional view of a portion of a light emitting device according to a seventh modification of the first embodiment.

[0068] 16 further includes a light emitting element 150 entirely formed of a color filter layer. More specifically, the optical element 150 disposed on the light emitting element ELP involved in green display is entirely formed of the color filter layer 130. G The above points are different from the light emitting device 1 shown in FIG.

[0069] FIG. 17 is a schematic partial cross-sectional view of a substrate and the like for explaining a light emitting device according to an eighth modified example of the first embodiment.

[0070] 17, a light-shielding layer BM is formed between adjacent light-emitting elements ELP. The light-shielding layer BM is formed by patterning a chromium film or the like formed on the planarization layer 123. The position of the light-shielding layer BM is not limited to on the planarization layer 123, and it can be disposed, for example, between the optical elements 150 in the protective film 160 or on the protective film 160.

[0071] Fig. 18 is a schematic plan view for explaining a light emitting device according to a ninth modification of the first embodiment, and Fig. 19 is a schematic partial cross-sectional view of a substrate and the like for explaining the light emitting device according to the ninth modification of the first embodiment.

[0072] The light emitting device 1J according to the eighth modification further includes a light emitting element 150 entirely formed of a transparent layer 140. More specifically, as shown in Fig. 1, the light emitting device 1J has light emitting elements ELP corresponding to red, blue and green displays, as well as a light emitting element ELP (denoted by the symbol W) corresponding to white display. Then, as shown in Fig. 19, an optical element 150 entirely formed of a transparent layer 140 is disposed on the light emitting element ELP corresponding to white display. The above points are different from the light emitting device 1 shown in Fig. 2.

[0073] [Second embodiment] The second embodiment also relates to a light emitting device and an electronic device according to the present disclosure.

[0074] 20 is a schematic partial cross-sectional view of a substrate and the like for explaining the light emitting device according to the second embodiment. In the schematic plan view for explaining the light emitting device according to the second embodiment, the light emitting device 1 in FIG. 1 can be read as the light emitting device 2.

[0075] The light emitting device 1 described in the first embodiment includes an optical element 150 in which the color filter layer 130 constitutes the lower layer on the incident side and the transparent layer 140 constitutes the upper layer on the emission side. In contrast, the light emitting device 2 according to the second embodiment is different in that it includes an optical element 250 in which the transparent layer 223 constitutes the lower layer on the incident side and the color filter layer 130 constitutes the upper layer on the emission side. As shown in FIG. 20, the optical element 250 has a convex lens shape in cross section. The interface between the upper layer and the lower layer of the optical element 250 is flat.

[0076] The transparent layer 223 has the same composition as the planarization layer 123 described in the first embodiment, but is different in that it is formed to a thickness sufficient to constitute the lower layer of the optical element 250. In the first embodiment, in order to form the optical element 150, it was necessary to form the transparent layer 140 separately from the planarization layer 123. The light emitting device 2 has an advantage that it is not necessary to separately form the transparent layer 140 in order to form the optical element 250.

[0077] In the transparent layer 223 constituting the lower layer, a portion that is not exposed at the interface remains on the protective layer 122 side. A transparent protective film 160 is formed on the entire surface including the optical element 250. The optical element 250 is arranged so that the positional relationship between the center of the corresponding light-emitting element ELP and the center of the optical element 250 is approximately the same. The material constituting the protective film 160 may be appropriately selected in consideration of the characteristics related to the adjustment of the light emission direction by the optical element 250. Here, it is assumed that the protective film 160 is composed of a material having a smaller refractive index than the material constituting the optical element 250. The optical element 250 adjusts the light emission direction so as to collect the light from the light-emitting element ELP.

[0078] As in the first embodiment, in order to ensure the lens power of the optical element 250, it is necessary to make the thickness of the optical element 250 thick to some extent. The optical element 250 is configured by laminating the transparent layer 223 and the color filter layer 130, and therefore has a structure in which the thickness can be easily ensured. Even in this structure, the thickness of the color filter layer 130 can be determined by placing emphasis on the characteristic of efficiently extracting light of a predetermined wavelength, and the thickness of the transparent layer 223 can be determined by placing emphasis on the characteristic related to the adjustment of the light emission direction. Therefore, the object of the present disclosure is to suitably achieve both the characteristic related to the adjustment of the light emission direction and the characteristic of efficiently extracting light of a predetermined wavelength.

[0079] In the figure, the optical element 250 has a convex lens shape on the light emission side, but this is only an example, and it is sufficient if the optical element 250 has the function of adjusting the light emission direction as shown in this example. As explained in the first embodiment with reference to Figures 4 and 5, the cross-sectional shape of the optical element 250 cut on a plane perpendicular to the light-emitting region can be any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these.

[0080] The above describes the structure of the light emitting device 2. Next, a method for manufacturing the light emitting device 2 according to the second embodiment will be described.

[0081] 21 to 24 are schematic partial cross-sectional views of a substrate and the like for illustrating a method for manufacturing the light emitting device according to the first embodiment.

[0082] [Step-200] (See Figure 21) A process similar to [Step-100] described in the first embodiment is performed to form a light-emitting region LP consisting of light-emitting elements ELP arranged in a matrix on the substrate 100. Specifically, a first electrode 111 corresponding to each light-emitting element ELP is formed on the substrate 100. Next, an organic layer 120 including a light-emitting layer, a second electrode 121, a protective layer 122, and a transparent layer 223 are formed in this order.

[0083] [Step-210] (see Figures 22, 23 and 24) Next, optical elements 250 corresponding to each light-emitting element ELP are formed. First, a color filter layer 130 is formed on the transparent layer 223 by a well-known method (see FIG. 22). Next, a resist 190 for forming optical elements is formed on the color filter layer 130. For example, a trapezoidal resist 190 is formed (see FIG. 22).

[0084] Thereafter, the resist 190, the color filter layer 130, and the transparent layer 223 are etched, for example, by dry etching. Fig. 24 shows a schematic diagram of the state during the etching process. The thicker the resist 190, the less the amount of etching of the base, so that an optical element 250 is formed, the upper layer of which is the color filter layer 130 and the lower layer of which is the transparent layer 223.

[0085] [Process-220] Thereafter, the protective film 160 is formed on the entire surface including the optical element 250. Through the above steps, the light emitting device 2 can be obtained. Note that a transparent opposing substrate may be disposed on the protective film 160, if necessary.

[0086] The method for manufacturing the light emitting device 2 has been described above.

[0087] Incidentally, the various modified examples described in the first embodiment can also be applied to the second embodiment as long as they do not impede implementation.

[0088] [Third embodiment] The third embodiment also relates to a light emitting device and an electronic device according to the present disclosure.

[0089] In the first and second embodiments described above, the optical elements 150 and 250 are arranged so that the centers of the corresponding light-emitting elements and the optical elements are substantially aligned in position. In contrast, in the third embodiment, the optical elements are configured so that there is a misalignment between the centers of the corresponding light-emitting elements and the optical elements.

[0090] 25 is a schematic partial cross-sectional view of a substrate and the like for explaining a light-emitting device according to a third embodiment. More specifically, the light-emitting device 3 is configured such that there is a misalignment between the center of the optical element 150 and the center of the corresponding light-emitting element ELP in the light-emitting device 1 in the first embodiment. Although not shown, the light-emitting device 2 described in the second embodiment may be configured such that there is a misalignment between the center of the optical element 250 and the center of the corresponding light-emitting element ELP.

[0091] As shown in the figure, the direction of light collection changes depending on the deviation between the center of the optical element and the center of the corresponding light emitting element. The optical elements may be arranged so that the positional relationship between the center of the corresponding light emitting element and the center of the optical element has a predetermined deviation amount, or may be arranged so that the amount of deviation between the positional relationship between the center of the light emitting element and the center of the optical element changes depending on the position of the light emitting element in the light emitting region.

[0092] For example, when it is necessary to change the light collecting direction between the light emitting device for the right eye and the light emitting device for the left eye, the light emitting devices may be arranged so that the positional relationship between the center of the corresponding light emitting element and the center of the optical element has a predetermined amount of deviation in each light emitting element. Alternatively, when the condition of the positional relationship between the light emitting device and the observer changes significantly between the central part and the peripheral part of the light emitting area, the light emitting devices may be arranged so that the amount of deviation in the positional relationship between the center of the light emitting element and the center of the optical element changes according to the position of the light emitting element in the light emitting area.

[0093] [Fourth embodiment] The fourth embodiment also relates to a light emitting device and an electronic device according to the present disclosure.

[0094] 26 is a schematic partial cross-sectional view of a substrate and the like for explaining the light emitting device according to the fourth embodiment. In the schematic plan view for explaining the light emitting device according to the fourth embodiment, the light emitting device 1 in FIG. 1 can be read as the light emitting device 4.

[0095] In the light emitting devices according to the above-mentioned embodiments, the light emitting element may be configured to have a resonator structure that resonates light. The light emitting device 4 is basically configured by adding a resonator structure to the light emitting device 1 in the first embodiment. Although not shown in the figure, it may also be configured by adding a resonator structure to the light emitting device 2 described in the second embodiment.

[0096] The resonator structure will now be described with reference to the drawings.

[0097] 26, a reflector ML is disposed within the substrate 100. The reflector ML can be formed using, for example, a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing these as main components. The first electrode 411 is made of a transparent conductive material layer, and the second electrode 421 is made of a semi-transparent conductive material, and a resonator structure is formed according to the distance between the reflector ML and the second electrode 421.

[0098] For example, the red color filter layer 130R In the light emitting element ELP, the blue color filter layer 130 is disposed so as to satisfy the resonance condition for light of a red wavelength. B In the light emitting element ELP, the reflector ML is disposed so as to satisfy the resonance condition for light of a blue wavelength. G In the light-emitting element ELP in which the first electrode 421 is disposed, the reflector ML is disposed so as to satisfy the resonance condition for the green wavelength light. The white light from the organic layer 120 is extracted with the light of a predetermined wavelength emphasized by the resonator structure between the reflector ML and the second electrode 421. This can improve the light-emitting efficiency.

[0099] [Electronic device description] The light-emitting device of the present disclosure described above can be used as a display unit (light-emitting device) of electronic devices in various fields that displays a video signal input to the electronic device or a video signal generated within the electronic device as an image or video. For example, it can be used as a display unit of a television set, a digital still camera, a notebook personal computer, a portable terminal device such as a mobile phone, a video camera, a head-mounted display, etc.

[0100] The light-emitting device of the present disclosure also includes a sealed module. The display module may be provided with a circuit section or a flexible printed circuit (FPC) for inputting and outputting signals from the outside to the light-emitting region. Below, a digital still camera and a head-mounted display are given as specific examples of electronic devices using the light-emitting device of the present disclosure. However, the specific examples given here are merely examples and are not limited thereto.

[0101] (Example 1) Fig. 27 is an external view of a lens-interchangeable single-lens reflex type digital still camera, with Fig. 27A showing a front view and Fig. 27B showing a rear view. A lens-interchangeable single-lens reflex type digital still camera has, for example, an interchangeable taking lens unit (interchangeable lens) 512 on the right side of the front of a camera main body (camera body) 511, and a grip part 513 for the photographer to hold on the left side of the front.

[0102] A monitor 514 is provided in the approximate center of the back surface of the camera body 511. A viewfinder (eyepiece window) 515 is provided above the monitor 514. By looking through the viewfinder 515, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 512 and determine the composition.

[0103] In the lens-interchangeable single-lens reflex type digital still camera having the above configuration, the light emitting device of the present disclosure can be used as the viewfinder 515. That is, the lens-interchangeable single-lens reflex type digital still camera according to this example is produced by using the light emitting device of the present disclosure as the viewfinder 515.

[0104] (Example 2) 28 is an external view of a head mounted display. The head mounted display has, for example, ear hooks 612 on both sides of a glasses-shaped display unit 611 for wearing on the user's head. In this head mounted display, the light emitting device of the present disclosure can be used as the display unit 611. That is, the head mounted display according to this example is produced by using the light emitting device of the present disclosure as the display unit 611.

[0105] (Example 3) 29 is an external view of the see-through head mounted display 711. The see-through head mounted display 711 is composed of a main body 712, an arm 713, and a lens barrel 714.

[0106] The main body 712 is connected to the arm 713 and the glasses 700. Specifically, an end of the long side of the main body 712 is coupled to the arm 713, and one side of the main body 712 is connected to the glasses 700 via a connecting member. The main body 712 may be directly attached to the head of the human body.

[0107] The main body 712 incorporates a control board for controlling the operation of the see-through head mounted display 711 and a display unit. The arm 713 connects the main body 712 and the lens barrel 714 and supports the lens barrel 714. Specifically, the arm 713 is coupled to an end of the main body 712 and an end of the lens barrel 714, respectively, and fixes the lens barrel 714. The arm 713 also incorporates a signal line for communicating data related to an image provided from the main body 712 to the lens barrel 714.

[0108] The lens barrel 714 projects image light provided from the main body 712 via the arm 713 through an eyepiece lens toward the eyes of a user wearing the see-through head mounted display 711. In this see-through head mounted display 711, the light emitting device of the present disclosure can be used for the display unit of the main body 712.

[0109] The effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0110] [others] The technology of the present disclosure can also be configured as follows.

[0111] [A1] The light-emitting region is made up of light-emitting elements arranged in a matrix. As an optical element formed corresponding to a light emitting element and for adjusting the light emission direction, an optical element is formed in which one of a color filter layer and a transparent layer constitutes a lower layer portion on the incident side and the other constitutes an upper layer portion on the emission side, and at least a part of the lower layer and the upper layer are exposed at an interface with the outside. Light emitting device. [A2] an optical element in which a color filter layer constitutes a lower layer portion on an incident side and a transparent layer constitutes an upper layer portion on an exit side, The light emitting device according to the above [A1]. [A3] Different types of color filter layers are formed so as to be laminated in the regions between the respective adjacent optical elements. The light emitting device according to the above [A2]. [A4] The optical element includes a transparent layer that constitutes a lower layer on the incident side and a color filter layer that constitutes an upper layer on the exit side. The light emitting device according to the above [A1]. [A5] The interface between the upper layer and the lower layer of the optical element is flat or curved. The light emitting device according to any one of the above [A1] to [A4]. [A6] Further comprising an optical element entirely formed from a color filter layer or a transparent layer. The light emitting device according to any one of the above [A1] to [A5]. [A7] The color filter layer contains fine particles constituting a color material and / or quantum dots. The light emitting device according to any one of the above [A1] to [A6]. [A8] A transparent protective film is formed on the entire surface, including the optical element. The light emitting device according to any one of the above [A1] to [A7]. [A9] The protective film is made of a material having a refractive index different from that of the material constituting the optical element. The light emitting device according to the above [A8]. [A10] The cross-sectional shape of the optical element when cut along a plane perpendicular to the light-emitting region is any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these. The light emitting device according to any one of the above [A1] to [A9]. [A11] A light-shielding layer is formed between each of the adjacent light-emitting elements. The light emitting device according to any one of the above [A1] to [A10]. [A12] The optical elements are arranged so that the center of the corresponding light emitting element and the center of the optical element are substantially aligned. The light emitting device according to any one of the above [A1] to [A11]. [A13] The optical elements are arranged such that the positional relationship between the center of the corresponding light-emitting element and the center of the optical element is a predetermined amount of deviation. The light emitting device according to any one of the above [A1] to [A11]. [A14] the optical element is disposed such that the amount of deviation of the positional relationship between the center of the light emitting element and the center of the optical element varies depending on the position of the light emitting element in the light emitting region; The light emitting device according to any one of the above [A1] to [A11]. [A15] The light-emitting element is an organic electroluminescence element. The light emitting device according to any one of the above [A1] to [A14]. [A16] The light-emitting device has a resonator structure that resonates light. The light emitting device according to the above [A15].

[0112] [B1] The light-emitting region is made up of light-emitting elements arranged in a matrix. As an optical element formed corresponding to a light emitting element and for adjusting the light emission direction, an optical element is formed in which one of a color filter layer and a transparent layer constitutes a lower layer portion on the incident side and the other constitutes an upper layer portion on the emission side, and at least a part of the lower layer and the upper layer are exposed at an interface with the outside. An electronic device equipped with a light-emitting device. [B2] an optical element in which a color filter layer constitutes a lower layer portion on an incident side and a transparent layer constitutes an upper layer portion on an exit side, The electronic device described in [B1] above. [B3] Different types of color filter layers are formed so as to be laminated in the regions between the respective adjacent optical elements. The electronic device described in [B2] above. [B4] The optical element includes a transparent layer that constitutes a lower layer on the incident side and a color filter layer that constitutes an upper layer on the exit side. The electronic device described in [B1] above. [B5] The interface between the upper layer and the lower layer of the optical element is flat or curved. An electronic device according to any one of [B1] to [B4] above. [B6] Further comprising an optical element entirely formed from a color filter layer or a transparent layer. An electronic device according to any one of [B1] to [B5] above. [B7] The color filter layer contains fine particles constituting a color material and / or quantum dots. An electronic device according to any one of [B1] to [B6] above. [B8] A transparent protective film is formed on the entire surface, including the optical element. An electronic device according to any one of [B1] to [B7] above. [B9] The protective film is made of a material having a refractive index different from that of the material constituting the optical element. The electronic device described in [B8] above. [B10] The cross-sectional shape of the optical element when cut along a plane perpendicular to the light-emitting region is any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these. An electronic device according to any one of [B1] to [B9] above. [B11] A light-shielding layer is formed between each of the adjacent light-emitting elements. The electronic device according to any one of [B1] to [B10] above. [B12] The optical elements are arranged so that the center of the corresponding light emitting element and the center of the optical element are substantially aligned. The electronic device according to any one of [B1] to [B11] above. [B13] The optical elements are arranged such that the positional relationship between the center of the corresponding light-emitting element and the center of the optical element has a predetermined amount of deviation. The electronic device according to any one of [B1] to [B11] above. [B14] the optical element is disposed such that the amount of deviation of the positional relationship between the center of the light emitting element and the center of the optical element varies depending on the position of the light emitting element in the light emitting region; The electronic device according to any one of [B1] to [B11] above. [B15] The light-emitting element is an organic electroluminescence element. The electronic device according to any one of [B1] to [B14] above. [B16] The light-emitting device has a resonator structure that resonates light. The electronic device according to [B15] above. [Explanation of symbols]

[0113] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1J, 2, 3, 4... light emitting device, 100... substrate, 111... first electrode, 112... partition wall portion, 121... second electrode, 122... protective layer, 123... planarization layer, 130, 130 R ,130 B ,130 Gcolor filter layer, 140 transparent layer, 150 optical element, 160 protective film, 190 resist, 223 transparent layer, 411 first electrode, 421 second electrode, 511 camera body, 512 photographing lens unit, 513 grip, 514 monitor, 515 viewfinder, 611 eyeglasses-shaped display, 612 ear hook, 700 eyeglasses, 711 see-through head mounted display, 712 body, 713 arm, 714 lens barrel, LP light-emitting area, ELP light-emitting element, DP area between adjacent optical elements, BM light-shielding layer, ML reflective film

Claims

1. A light-emitting region is formed of a plurality of light-emitting elements arranged in a matrix, a plurality of optical elements for adjusting a light emission direction, each of which is formed corresponding to the light emitting element; a lower layer portion of the optical element located on the side where light from the light emitting element is incident is made of a color filter layer, an upper layer portion of the optical element that is located on the light emission side and is laminated on the lower layer portion is made of a transparent layer; the upper layer and at least a portion of the lower layer are exposed at an interface with the outside, an interface between the upper layer and the lower layer of the optical element has a curved surface; A cross section of the optical element has a convex lens shape having a convex portion protruding toward a direction in which light from the light emitting element is emitted to the outside. Light emitting device.

2. The interface between the upper layer portion and the lower layer portion of the optical element has a convex shape in which the lower layer portion protrudes toward the upper layer portion. The light emitting device according to claim 1 .

3. The interface between the upper layer and the lower layer of the optical element has a concave shape in which the lower layer is recessed relative to the upper layer. The light emitting device according to claim 1 .

4. In the region between the adjacent optical elements, different types of the color filter layers are stacked along the direction in which light from the light emitting element is emitted. The light emitting device according to any one of claims 1 to 3.

5. At least one of the plurality of optical elements is The entire surface of the substrate is made of the color filter layer, or is made of the transparent layer. The light emitting device according to any one of claims 1 to 4.

6. The color filter layer contains a color material and / or fine particles constituting quantum dots. The light emitting device according to any one of claims 1 to 5.

7. A transparent protective film is formed on the entire surface of the optical element. The light emitting device according to any one of claims 1 to 6.

8. the protective film is made of a material having a refractive index different from that of a material constituting the optical element; The light emitting device according to claim 7.

9. A cross-sectional shape of the optical element when cut along a plane perpendicular to the light-emitting region is any one of a circle, a trapezoid, a rectangle, and a polygon, or a combination of these. The light emitting device according to any one of claims 1 to 8.

10. A light-shielding layer is formed between adjacent optical elements. The light emitting device according to any one of claims 1 to 3.

11. The optical element is arranged such that the center of the corresponding light-emitting element and the center of the optical element are substantially aligned. The light emitting device according to any one of claims 1 to 10.

12. The optical element is arranged such that the center of the corresponding light emitting element and the center of the optical element are shifted by a predetermined amount. The light emitting device according to any one of claims 1 to 10.

13. The predetermined amount of deviation varies depending on the position of the light-emitting element in the light-emitting region.

13. The light emitting device according to claim 12.

14. The light-emitting element is an organic electroluminescent element. The light emitting device according to any one of claims 1 to 13.

15. １６ The light-emitting device has a resonator structure that resonates light.

15. The light emitting device according to claim 14.

16. A light-emitting device having a light-emitting region made up of a plurality of light-emitting elements arranged in a matrix, a plurality of optical elements for adjusting a light emission direction, each of which is formed corresponding to the light emitting element; a lower layer portion of the optical element located on the side where light from the light emitting element is incident is made of a color filter layer, an upper layer portion of the optical element that is located on the light emission side and is laminated on the lower layer portion is made of a transparent layer; the upper layer and at least a portion of the lower layer are exposed at an interface with the outside, an interface between the upper layer and the lower layer of the optical element has a curved surface; A cross section of the optical element has a convex lens shape having a convex portion protruding toward a direction in which light from the light emitting element is emitted to the outside. electronic equipment.

Images