Camera module and electronic device including same

Abstract

To provide a camera module including a shielding structure, and an electronic device including the camera module.SOLUTION: An electronic device 100 comprises: a camera module CM-F, CM-R that includes an image sensor and a shielding structure 10-F, 10-R configured to shield components of the camera module from electromagnetic interference (EMI); and an external structure that two-dimensionally surrounds the camera module, at least a portion of the external structure being conductive. The shielding structure comprises an accommodating portion configured to accommodate the image sensor, and a protruding portion 10P-F, 10P-R that protrudes from the accommodating portion. The protruding portion of the shielding structure contacts the external structure (device housing 110).SELECTED DRAWING: Figure 5A

Description

[Technical field]

[0001] The present invention relates to a camera module and an electronic device including the camera module, and more particularly to a camera module including a shielding structure and an electronic device including the camera module. [Background technology]

[0002] In an electronic device including a camera module, electromagnetic waves generated from the camera module affect other electronic components in the electronic device, and electromagnetic waves generated from other electronic components in the electronic device affect the camera module. Therefore, in order to shield such electromagnetic interference (EMI) and improve electromagnetic compatibility (EMC), the camera module has a shielding structure. Summary of the Invention [Problem to be solved by the invention]

[0003] The problem to be solved by the technical idea of ​​the present disclosure is to provide a camera module having excellent electromagnetic compatibility and an electronic device including the same. [Means for solving the problem]

[0004] In order to solve the above-mentioned problems, an electronic device according to one embodiment includes a camera module including an image sensor and a shielding structure for shielding components of the camera module from Electro Magnetic Interference (EMI), and an external structure that two-dimensionally surrounds the camera module and has at least a portion that is conductive, the shielding structure including a housing that houses the image sensor and a protrusion that protrudes from the housing, and the protrusion of the shielding structure contacts the external structure.

[0005] According to an embodiment, an electronic device includes a main circuit board, electronic components connected to the main circuit board, a first camera module connected to the main circuit board, a device housing including side walls surrounding a space in which the main circuit board, the electronic components, and the first camera module are located, and a front panel covering the space in which the main circuit board, the electronic components, and the first camera module are located, wherein at least a portion of the device housing is conductive, the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor, the first shielding structure of the first camera module includes a first protrusion, and the first protrusion of the first shielding structure of the first camera module contacts the device housing.

[0006] According to an embodiment, an electronic device includes a main circuit board, a first camera module connected to the main circuit board, a second camera module connected to the main circuit board, a flange surrounding the first camera module and the second camera module, and a device housing for accommodating the main circuit board, the first camera module, the second camera module, and the flange, wherein at least a portion of the flange is conductive, and the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor and including a first protrusion, and the first protrusion contacts the flange. [Brief description of the drawings]

[0007] [Figure 1A] FIG. 2 is an exploded perspective view of a camera module according to an embodiment. [Figure 1B] FIG. 2 is a cross-sectional view of a camera module according to an embodiment. [Figure 2A] 1 is a cross-sectional view of a shielding structure according to an embodiment. [Figure 2B] 1 is a cross-sectional view of a shielding structure according to an embodiment. [Figure 2C] 1 is a cross-sectional view of a shielding structure according to an embodiment. [Figure 2D]1 is a cross-sectional view of a shielding structure according to an embodiment. [Figure 3A] FIG. 2 is a cross-sectional view of a camera module according to an embodiment. [Figure 3B] FIG. 2 is a cross-sectional view of a camera module according to an embodiment. [Figure 4] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment. [Figure 5A] FIG. 2 is a top view of an electronic device according to one embodiment with the front panel removed. [Figure 5B] 5B is a cross-sectional view of an electronic device according to an embodiment taken along line BB' in FIG. 5A. [Figure 5C] 5B is a cross-sectional view of an electronic device according to an embodiment taken along line CC' in FIG. 5A. [Figure 6] FIG. 2 is a top view of an electronic device according to an embodiment with the front panel removed. [Figure 7] FIG. 2 is a top view of an electronic device according to an embodiment with the front panel removed. [Figure 8] FIG. 2 is a top view of an electronic device according to an embodiment with the front panel removed. [Figure 9] FIG. 2 is a cross-sectional view of a device housing according to one embodiment. [Figure 10] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment. [Figure 11A] FIG. 2 is a top view of an electronic device according to one embodiment with the front panel removed. [Figure 11B] 11B is a cross-sectional view of an electronic device according to an embodiment taken along line BB' in FIG. 11A. [Figure 11C] 11B is a cross-sectional view of an electronic device according to an embodiment taken along line CC' in FIG. 11A. [Figure 12] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment. [Figure 13A] FIG. 2 is a top view of an electronic device with the back panel removed according to one embodiment. [Figure 13B] 13B is a cross-sectional view of an electronic device according to an embodiment taken along line BB' in FIG. 13A. [Figure 13C]13B is a cross-sectional view of an electronic device according to an embodiment taken along line CC' in FIG. 13A. [Figure 14] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment. [Figure 15A] FIG. 2 is a top view of an electronic device according to one embodiment with the front panel removed. [Figure 15B] 15B is a cross-sectional view of an electronic device according to an embodiment taken along line BB' in FIG. 15A. [Figure 15C] 15B is a cross-sectional view of an electronic device according to an embodiment taken along line CC' in FIG. 15A. [Figure 16] FIG. 2 is a cross-sectional view of a flange according to one embodiment. [Figure 17A] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 17B] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 17C] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18A] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18B] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18C] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18D] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18E] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18F] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18G] 1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 18H]1 is a top view of a device housing and a camera module in an electronic device according to an embodiment. [Figure 19A] FIG. 2 is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. [Figure 19B] FIG. 2 is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. [Figure 19C] FIG. 2 is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. [Figure 19D] FIG. 2 is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. [Figure 19E] FIG. 2 is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] 1A and 1B are exploded perspective and cross-sectional views of a camera module CM according to an embodiment.

[0009] 1A and 1B, the camera module CM includes a module circuit board 60, a connector 70, an image sensor 50, an optical filter 40, a lens assembly 20, a module housing 30, and a shielding structure 10. The module circuit board 60 may include, for example, a Printed Circuit Board (PCB). The connector 70 is coupled to the module circuit board 60. The camera module CM is coupled to a component outside the camera module CM, for example, a main circuit board 130 (FIG. 4), via the connector 70.

[0010] The image sensor 50 is located on and coupled to the module circuit board 60. The image sensor 50 converts light into an electrical signal. The electrical signal generated by the image sensor 50 is output to a component outside the camera module CM via the module circuit board 60 and a connector 70. The image sensor 50 may include, for example, a Complementary Metal Oxide Semiconductor (CMOS) sensor or a Charge Coupled Device sensor.

[0011] The optical filter 40 is located on the image sensor 50. The optical filter 40 blocks or transmits a portion of the spectrum of light entering the optical filter 40 having a particular wavelength. For example, the optical filter 40 may be an infrared blocking filter that blocks near infrared light (e.g., light with wavelengths between about 700 nm and about 1150 nm). In some embodiments, the optical filter 40 may be omitted.

[0012] The lens assembly 20 is located on the optical filter 40. The lens assembly 20 includes at least one lens for focusing light. The module housing 30 accommodates the image sensor 50, the optical filter 40, and the lens assembly 20. That is, the module housing 30 surrounds the image sensor 50, the optical filter 40, and the lens assembly 20. The module housing 30 fixes the optical filter 40 and the lens assembly 20. In some embodiments, the module housing 30 may be omitted, and the shielding structure 10 serves as the module housing 30. That is, in some embodiments, the shielding structure 10 may accommodate and protect the image sensor 50, the optical filter 40, and the lens assembly 20.

[0013] The shielding structure 10 houses the module housing 30. The shielding structure 10 surrounds the image sensor 50. The module housing 30 includes an opening or window that exposes the lens assembly 20 so that light can enter the lens assembly 20. The shielding structure 10 shields the internal components from electromagnetic interference. The shielding structure 10 is conductive and includes a conductive material. For example, the shielding structure 10 includes a metal such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or a combination thereof.

[0014] The shielding structure 10 includes a receiving portion 10Q that receives, i.e., surrounds, the image sensor 50, and a protruding portion 10P that protrudes outward from the receiving portion 10Q. The receiving portion 10Q includes a side wall and a top. For example, the receiving portion 10Q includes four side walls and a top that is connected to each of the four side walls. The top of the receiving portion 10Q includes an opening or window that allows light to enter the lens assembly 20. The protruding portion 10P of the shielding structure 10 protrudes outward from the side wall of the receiving portion 10Q, for example, in the -X direction in FIG. 1A. The protruding portion 10P of the shielding structure 10 is conductive and includes a conductive material. The protruding portion 10P of the shielding structure 10 includes the same material as the receiving portion 10Q of the shielding structure 10. However, the embodiment is not limited thereto. In some embodiments, the protruding portion 10P of the shielding structure 10 may include a material different from that of the receiving portion 10Q of the shielding structure 10.

[0015] In some embodiments, the protruding portion 10P of the shielding structure 10 may be integrally formed with the receiving portion 10Q of the shielding structure 10. That is, there may be no actual boundary between the protruding portion 10P of the shielding structure 10 and the receiving portion 10Q of the shielding structure 10, and the protruding portion 10P of the shielding structure 10 may be distinguished from the receiving portion 10Q of the shielding structure 10 solely by an imaginary boundary. In other embodiments, the protruding portion 10P of the shielding structure 10 and the receiving portion 10Q of the shielding structure 10 may be formed as separate bodies and thereafter connected together, for example, by bonding, adhesive, etc. That is, there may be an actual boundary between the protruding portion 10P of the shielding structure 10 and the receiving portion 10Q of the shielding structure 10.

[0016] The protrusion 10P of the shielding structure 10 is located outside the camera module CM and contacts an external structure (e.g., the device housing 110 shown in FIG. 4 or the flange 170 shown in FIG. 14) having at least a portion thereof being conductive. Thus, the shielding structure 10 is electrically connected to the external structure, improving the EMC of the shielding structure 10. Furthermore, since heat generated in the camera module CM can be transferred to the external structure, the heat dissipation performance of the shielding structure 10 is improved. Thus, the camera module CM according to one embodiment can have improved EMC and heat dissipation performance.

[0017] 2A to 2D are cross-sectional views illustrating examples of shielding structures 10a to 10d, respectively, according to embodiments.

[0018] 2A to 2C, the protrusions 10Pa to 10Pc of the shielding structures 10a to 10c have various shapes. For example, the protrusion 10P of the shielding structure 10 shown in FIGS. 1A and 1B extends in only one direction, while the protrusion 10Pa of the shielding structure 10a shown in FIG. 2A includes a plurality of portions extending in different directions. For example, the protrusion 10Pa includes a first portion 10Pa-1 extending outward (e.g., in the -X direction) and downward (e.g., in the -Z direction) from the receiving portion 10Q, and a second portion 10Pa-2 extending outward (e.g., in the -X direction) and upward (e.g., in the +Z direction). Also, the protrusion 10P of the shielding structure 10 shown in FIGS. 1A and 1B has a straight shape, while the protrusion 10Pb of the shielding structure 10b has a curved shape as shown in FIG. 2B, according to another embodiment. Also, in some embodiments, as shown in FIG. 2C, the protruding portion 10Pc of the shielding structure 10c may have a more complex shape, such as a coil.

[0019] In some embodiments, the protrusions 10Pa to 10Pc of the shielding structures 10a to 10c can also function as springs. That is, the protrusions 10Pa to 10Pc of the shielding structures 10a to 10c have a structure that can deform and apply an elastic force to the outside by the deformation. Therefore, the protrusions 10Pa to 10Pc of the shielding structures 10a to 10c can maintain contact with an external structure (e.g., the device housing 110 shown in FIG. 4 or the flange 170 shown in FIG. 14) by the elastic force.

[0020] Referring to FIG. 2D, according to some embodiments, the shielding structure 10d includes an adhesive portion 10T and a protruding portion 10Pd. The adhesive portion 10T attaches the protruding portion 10Pd of the shielding structure 10d to the receiving portion 10Q of the shielding structure 10d. In some embodiments, the protruding portion 10Pd includes a first surface 10Pd-s facing the receiving portion 10Q and a second surface 10Pd-o extending outward from the receiving portion 10Q (as in FIG. 1B), and as shown in FIG. 2D, the adhesive portion 10T is located between the receiving portion 10Q and the first surface 10Pd-s of the protruding portion 10Pd facing the receiving portion 10Q. That is, the adhesive portion 10T is attached to the side wall of the receiving portion 10Q between the first surface 10Pd-s and the side wall of the receiving portion 10Q. In that case, the adhesive portion 10T includes a conductive material. In another embodiment, different from that shown in Fig. 2D, the adhesive 10T may be located outside the second surface 10Pd-o of the outward protrusion 10Pd and extend over the receiving portion 10Q of the shielding structure 10d, i.e., the adhesive may not be provided between the protrusion 10Pd and the sidewall of the receiving portion 10Q, but may instead be attached to the exterior of the protrusion 10Pd and may wrap around at least a portion of the side and top of the receiving portion 10Q.

[0021] 3A and 3B are cross-sectional views of camera modules CMa and CMb according to embodiments, respectively.

[0022] Referring to FIG. 3A, the camera module CMa may further include a prism 80 located within the module housing 30. The prism 80 changes the traveling direction of light. Light enters the prism 80 in a vertical direction (e.g., −Z direction) through an opening or window in the module housing 30 and the shielding structure 10, and exits the prism 80 in a horizontal direction (e.g., X direction). The lens assembly 20 is located within the housing 30 and oriented such that the optical axis of the lens assembly 20 is parallel to the horizontal direction (e.g., X direction). The image sensor 50 is erected to receive light traveling in a horizontal direction (e.g., X direction). That is, the pixel array of the image sensor 50 faces the horizontal direction (e.g., −X direction).

[0023] 3B, the camera module CMb includes multiple individual camera modules CM1, CM2, which share a shielding structure 10. The camera module CMb is referred to as a dual camera module. In this configuration, the shielding structure 10 includes openings or windows corresponding to each of the multiple individual camera modules CM1, CM2, as shown in FIG. 3B.

[0024] Fig. 4 is an exploded perspective view of the electronic device 100 according to an embodiment. Fig. 5A is a plan view of the electronic device 100 according to an embodiment with the front panel 120 removed. Fig. 5B is a cross-sectional view of the electronic device 100 according to an embodiment taken along line BB' in Fig. 5A. Fig. 5C is a cross-sectional view of the electronic device 100 according to an embodiment taken along line CC' in Fig. 5A.

[0025] Hereinafter, the electronic device 100 will be described using a smartphone as an example, but the electronic device 100 is not limited thereto. For example, the electronic device 100 includes any portable electronic device such as a smart watch, smart glasses, smart band, tablet PC, PDA (Personal Digital Assistant), digital camera, or game console, any home appliance such as a refrigerator, washing machine, dryer, cleaning machine, or television, any transportation means such as an automobile, ship, or aircraft, industrial electronic equipment, or robot, etc.

[0026] Referring to FIG. 4, for example, the electronic device 100 includes a main circuit board 130, a camera module (front camera module CM-F and / or rear camera module CM-R), electronic components 140, a front panel 120, a rear panel 160, and a device housing 110.

[0027] The main circuit board 130 includes, for example, a PCB. The front camera module CM-F, the rear camera module CM-R, and the electronic components 140 are coupled to the main circuit board 130. Each of the front camera module CM-F and the rear camera module CM-R is one of the camera modules CM, CMa, and CMb described with reference to Figures 1A to 3B. The front camera module CM-F is oriented to face the front side of the electronic device 100, i.e., the front panel 120, and the rear camera module CM-R is oriented to face the rear side of the electronic device 100, i.e., the rear panel 160. The electronic components 140 include, for example, a memory, a processor, and / or an interface. The memory includes, for example, a dynamic random access memory (DRAM), a static random access memory (SRAM), a flash memory, an electrically erasable and programmable read-only memory (EEPROM), a phase-change random access memory (PRAM), a magnetic random access memory (MRAM), and / or a resistive random access memory (RRAM). The processor includes, for example, a central processing unit (CPU), a graphic processing unit (GPU), and / or an application processor (AP). The interfaces include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface.

[0028] In some embodiments, the electronic device 100 may further include a battery 150 coupled to the main circuit board 130. In some embodiments, the electronic device 100 may further include a communication module, a microphone, a speaker, a fingerprint sensor, a gyro sensor, a biosensor, an illuminance sensor, a humidity sensor, a temperature sensor, and / or a flashlight, although not shown in FIG.

[0029] The front panel 120 and the rear panel 160 face each other, and the device housing 110 is located between the front panel 120 and the rear panel 160. The front panel 120, the device housing 110, and the rear panel 160 together form the exterior of the electronic device 100. That is, the front panel 120, the device housing 110, and the rear panel 160 are exposed to the outside of the electronic device 100. For example, the front panel 120 forms the front side of the electronic device 100, the rear panel 160 forms the rear side of the electronic device 100, and the device housing 110 forms the side of the electronic device 100.

[0030] The main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are accommodated in a space formed by the front panel 120, the device housing 110, and the rear panel 160. The device housing 110 includes, for example, a side wall that surrounds in a planar manner the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located. The front panel 120 and the rear panel 160 cover the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located.

[0031] The front panel 120 includes a display 122. The front panel 120 may further include a front cover 121 including a transparent window on the display 122. The front panel 120 may further include a touch input panel (not shown) between the transparent window of the front cover 121 and the display 122. The front panel 120 may include an opening or window 120A through which the front camera module CM-F receives light. The rear panel 160 may include an opening or window 160A through which the rear camera module CM-R receives light.

[0032] The device housing 110 houses the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150. At least a portion of the device housing 110 is electrically conductive and includes an electrically conductive material. For example, the device housing 110 includes a metal such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or a combination thereof.

[0033] 5A to 5C, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F and the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R contact the device housing 110. In some embodiments, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F and the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R may protrude in different directions in a plane. For example, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F protrudes in the +Y direction, and the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R protrudes in the -X direction. In other words, the surface of the front camera module CM-F on which the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F is located and the surface of the rear camera module CM-R on which the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R is located face different directions. For example, the surface of the front camera module CM-F on which the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F is located faces the +Y direction, and the surface of the rear camera module CM-R on which the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R is located faces the -X direction.

[0034] FIG. 6 is a plan view of an electronic device 100 according to an embodiment with the front panel 120 removed. Referring to FIG. 6, in some embodiments, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F and the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R may protrude in the same direction in a plane. For example, the protrusion direction of the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F and the protrusion direction of the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R are +Y directions. In other words, the surface of the front camera module CM-F on which the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F is located and the surface of the rear camera module CM-R on which the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R is located face the same direction. For example, the surface of the front camera module CM-F on which the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F is located, and the surface of the rear camera module CM-R on which the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R is located, face in the +Y direction.

[0035] 7 is a plan view of an electronic device 100 according to an embodiment with the front panel 120 removed. Referring to FIG. 7, in some embodiments, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F contacts the device housing 110, while the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R contacts the shielding structure 10-F of the front camera module CM-F instead of the device housing 110. Thus, the shielding structure 10-R of the rear camera module CM-R is electrically connected to the device housing 110 via the shielding structure 10-F of the front camera module CM-F.

[0036] According to the embodiment shown in FIG. 7, the front camera module CM-F must be positioned so as not to overlap with the display 122 of the front panel 120 in a plan view. However, if there is no such constraint on the position of the rear camera module CM-R, the rear camera module CM-R can be placed relatively far from the side wall of the device housing 110 and still be able to come into contact with the shielding structure 10-F of the front camera module CM-F, thereby increasing the flexibility of the positioning design of the rear camera module CM-R.

[0037] 8 is a plan view of the electronic device 100 according to an embodiment with the front panel 120 removed. Referring to FIG. 8, the shielding structure 10-F of the front camera module CM-F includes two protrusions (a first protrusion 10P-F-1 and a second protrusion 10P-F-2), while the shielding structure 10-R of the rear camera module CM-R does not include a protrusion. The first protrusion 10P-F-1 of the shielding structure 10-F of the front camera module CM-F contacts the device housing 110, and the second protrusion 10P-F-2 of the shielding structure 10-F of the front camera module CM-F contacts the shielding structure 10-R of the rear camera module CM-R. Therefore, the shielding structure 10-R of the rear camera module CM-R is electrically connected to the device housing 110 through the shielding structure 10-F of the front camera module CM-F.

[0038] 8, if the manufacturer of the electronic device 100 purchases only the front camera module CM-F including the shielding structure 10-F including the two protrusions 10P-F-1 and 10P-F-2, the manufacturer can use the rear camera module CM-R including the shielding structure 10-R without the protrusions, which is economical. Furthermore, the front camera module CM-F must be arranged so as not to overlap the display 122 of the front panel 120 in plan view, but if there is no such constraint, the rear camera module CM-R can contact the shielding structure 10-F of the front camera module CM-F even if it is arranged at a position relatively far from the side wall of the device housing 110, so that the flexibility of the arrangement design of the rear camera module CM-R is increased.

[0039] FIG. 9 is a cross-sectional view of a device housing 110 according to an embodiment. Referring to FIG. 9, in some embodiments, the device housing 110 includes a conductive body 111 and an insulating coating 112 on the conductive body 111. The conductive body 111 includes any conductive material, for example, a metal such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or a combination thereof. The insulating coating 112 includes, for example, a polymer. The protrusions 10P-F, 10P-R of the shielding structures 10-F, 10-R of the camera modules CM-F, CM-R shown in FIG. 5A to FIG. 5C contact the conductive body 111 of the device housing 110. For example, the insulating coating 112 of the device housing 110 exposes at least a portion of the conductive body 111 of the device housing 110, and the protrusions 10P-F, 10P-R of the shielding structures 10-F, 10-R of the camera modules CM-F, CM-R shown in Figures 5A to 5C contact the exposed portion of the conductive body 111 of the device housing 110. Alternatively, the protrusions 10P-F, 10P-R of the shielding structures 10-F, 10-R of the camera modules CM-F, CM-R shown in Figures 5A to 5C may penetrate the insulating coating 112 of the device housing 110 and contact the conductive body 111 of the device housing 110.

[0040] Fig. 10 is an exploded perspective view of an electronic device 100b according to an embodiment. Fig. 11A is a plan view of an electronic device 100b according to an embodiment with a front panel 120 removed. Fig. 11B is a cross-sectional view of the electronic device 100b according to an embodiment taken along line BB' in Fig. 11A. Fig. 11C is a cross-sectional view of the electronic device 100b according to an embodiment taken along line CC' in Fig. 11A.

[0041] 10, the electronic device 100b, when compared with the electronic device 100 shown in FIG. 4, omits the rear panel 160 shown in FIG. 4 and includes a device housing 110b different from the device housing 110 shown in FIG. 4. When compared with the device housing 110 shown in FIG. 4, the device housing 110b further includes a bottom 110B. The bottom 110B of the device housing 110b faces the front panel 120 and is spaced apart from the front panel 120, and the side wall 110S of the device housing 110b is located between the front panel 120 and the bottom 110B of the device housing 110b. The device housing 110 forms at least a part of the exterior of the electronic device 100b. The bottom 110B of the device housing 110b forms the rear side of the electronic device 100b, and the side wall 110S of the device housing 110b forms the side of the electronic device 100b.

[0042] The main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are accommodated in a space formed by the front panel 120 and the device housing 110b. The side wall 110S of the device housing 110b surrounds the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located, for example, in a planar manner. The bottom 110B of the device housing 110b covers the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located. The bottom 110B of the device housing 110b may include an opening or window 110A for the rear camera module CM-R to receive light.

[0043] In some embodiments, the device housing 110b may further include an inner wall 110W located on the bottom 110B of the device housing 110b and located in a space surrounded by the side wall 110S of the device housing 110b. The inner wall 110W of the device housing 110b extends, for example, upward (in the +Z direction) from the bottom 110B of the device housing 110b toward the front panel 120. The inner wall 110W of the device housing 110b may be located around the opening or window 110A of the bottom 110B of the device housing 110b. The inner wall 110W of the device housing 110b may also be located around the rear camera module CM-R. In some embodiments, the inner wall 110W of the device housing 110b may completely enclose the rear camera module CM-R in plan view.

[0044] 11A to 11C, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F contacts the side wall 110S of the device housing 110b, while the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R contacts the inner wall 110W of the device housing 110b. If the front camera module CM-F must be arranged so as not to overlap the display 122 of the front panel 120 in plan view, it is advantageous for the front camera module CM-F to be located close to the side wall 110S of the device housing 110b and therefore to contact the side wall 110S of the device housing 110b. On the other hand, even if the rear camera module CM-R is arranged far from the side wall 110S of the device housing 110b, it contacts the inner wall 110W of the device housing 110b, which increases the flexibility of the arrangement design of the rear camera module CM-R.

[0045] Fig. 12 is an exploded perspective view of an electronic device 100c according to an embodiment. Fig. 13A is a plan view of an electronic device 100c according to an embodiment with a rear panel 160 removed. Fig. 13B is a cross-sectional view of the electronic device 100c according to an embodiment taken along line BB' in Fig. 13A. Fig. 13C is a cross-sectional view of the electronic device 100c according to an embodiment taken along line CC' in Fig. 13A.

[0046] 12 and 13A to 13C, compared with the electronic device 100b shown in FIG. 10, the electronic device 100c includes a device housing 110c instead of the device housing 110b shown in FIG. 10, and further includes the rear panel 160 shown in FIG. 4. The device housing 110c has an inverted structure compared with the device housing 110b shown in FIG. 10. That is, the bottom 110B of the device housing 110c is located on the front panel 120, faces the rear panel 160, and is spaced apart from the rear panel 160. The side wall 110S of the device housing 110c is located between the rear panel 160 and the bottom 110B of the device housing 110c.

[0047] The opening or window 110A of the device housing 110c is for the front camera module CM-F to receive light, not the rear camera module CM-R. The inner wall 110W of the device housing 110c extends, for example, downward (-Z direction) from the bottom 110B of the device housing 110c toward the rear panel 160. The inner wall 110W of the device housing 110c may be located around the rear camera module CM-R, not around the opening or window 110A of the bottom 110B of the device housing 110b. In some embodiments, the inner wall 110W of the device housing 110c may completely surround the rear camera module CM-R in plan view.

[0048] Fig. 14 is an exploded perspective view of an electronic device 100d according to an embodiment. Fig. 15A is a plan view of an electronic device 100d according to an embodiment with the front panel 120 removed. Fig. 15B is a cross-sectional view of the electronic device 100d according to an embodiment taken along line BB' in Fig. 15A. Fig. 15C is a cross-sectional view of the electronic device 100d according to an embodiment taken along line CC' in Fig. 15A.

[0049] 14, unlike the electronic device 100 shown in FIG. 4, the electronic device 100d further includes a flange 170 accommodated in the housing 110. The flange 170 may not be exposed to the outside of the electronic device 100d. The flange 170 may incorporate the rear camera module CM-R. The flange 170 is conductive and includes a conductive material. For example, the flange 170 includes a metal such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or a combination thereof.

[0050] 15A to 15C, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F contacts the device housing 110, while the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R contacts the flange 170. When the front camera module CM-F must be arranged so as not to overlap the display 122 of the front panel 120 in plan view, it is advantageous for the front camera module CM-F to be located close to the side wall of the device housing 110 and therefore contact the side wall of the device housing 110. On the other hand, even if the rear camera module CM-R is arranged far from the side wall of the device housing 110, it contacts the flange 170, which increases the flexibility of the arrangement design of the rear camera module CM-R.

[0051] Figure 16 is a cross-sectional view of a flange 170 according to one embodiment. Referring to Figure 16, in some embodiments, the flange 170 includes a conductive body 171 and an insulative coating 172 on the conductive body 171. The conductive body 171 includes any conductive material, for example, a metal such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or combinations thereof. The insulative coating 172 includes, for example, a polymer.

[0052] The protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in Figures 15A to 15C contacts the conductive body 171 of the flange 170. Although Figures 15A to 15C show the flange 170 incorporating the rear camera module CM-R, the embodiment is not limited thereto, and in other embodiments, the flange 170 may alternatively be arranged to incorporate the front camera module CM-F, and in other embodiments, the protrusion 10P-F of the shielding structure 10-F of the front camera module CM-F may alternatively contact the conductive body 171 of the flange 170. In some embodiments, the insulating coating 172 of the flange 170 exposes at least a portion of the conductive body 171 of the flange 170, and the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in Figures 15A to 15C contacts the exposed portion of the conductive body 171 of the flange 170. Alternatively, in other embodiments, the protrusion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in Figures 15A to 15C may penetrate the insulating coating 172 of the flange 170 and contact the conductive body 171 of the flange 170.

[0053] 17A-17C are plan views illustrating a device housing 110 and camera modules CM-1 and CM-2 in an electronic device according to an embodiment. In the embodiment of FIG. 17A-17C, device housing 110 accommodates a first camera module CM-1 and a second camera module CM-2.

[0054] 17A, in some embodiments, the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 may contact a side wall of the device housing 110. In some embodiments, both the first camera module CM-1 and the second camera module CM-2 may be front cameras, and in other embodiments, both the first camera module CM-1 and the second camera module CM-2 may be rear cameras. The combination of the first camera module CM-1 and the second camera module CM-2 is, for example, a combination of a wide-angle camera and a telephoto camera, a combination of a color camera and an infrared camera, or a combination of a main camera and a Time-of-Flight (TOF) camera.

[0055] In some embodiments, the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 may protrude in the same direction in a plane. For example, the direction in which the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 protrudes and the direction in which the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 protrudes are the +Y direction. In other words, the surface of the first camera module CM-1 on which the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 is located and the surface of the second camera module CM-2 on which the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 is located face the same direction. For example, the surface of the first camera module CM-1 on which the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 is located, and the surface of the second camera module CM-2 on which the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 is located, face in the +Y direction.

[0056] In another embodiment, unlike FIG. 17A, the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 may protrude in different directions in a plane. For example, the protrusion direction of the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 is the +Y direction, and the horizontal component of the protrusion direction of the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 is the -X direction. In other words, the surface of the first camera module CM-1 on which the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 is located and the surface of the second camera module CM-2 on which the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 is located face different directions. For example, the surface of the first camera module CM-1 on which the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 is located faces the +Y direction, and the surface of the second camera module CM-2 on which the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 is located faces the -X direction.

[0057] 17B, ​​in some embodiments, the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 contacts the sidewall of the device housing 110, while the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-1 of the first camera module CM-1. Thus, the shielding structure 10-2 of the second camera module CM-2 is electrically connected to the device housing 110 via the shielding structure 10-1 of the first camera module CM-1. According to such an embodiment, the second camera module CM-2 can be disposed at a position relatively far from the sidewall of the device housing 110, thereby increasing the flexibility of the layout design of the second camera module CM-2.

[0058] 17C, in some embodiments, the shielding structure 10-1 of the first camera module CM-1 includes a first protrusion 10P-1-1 and a second protrusion 10P-1-2, while the shielding structure 10-2 of the second camera module CM-2 does not include a protrusion. The first protrusion 10P-1-1 of the shielding structure 10-1 of the first camera module CM-1 contacts the device housing 110, and the second protrusion 10P-1-2 of the shielding structure 10-1 of the first camera module CM-1 contacts the shielding structure 10-2 of the second camera module CM-2. Thus, the shielding structure 10-2 of the second camera module CM-2 is electrically connected to the device housing 110 via the shielding structure 10-1 of the first camera module CM-1. According to this embodiment, it is economical to purchase only the first camera module CM-1 including the shielding structure 10-1 including the two protrusions 10P-1-1, 10P-1-2, since the second camera module CM-2 including the shielding structure 10-2 without any protrusions can be used. Furthermore, the second camera module CM-2 can be disposed at a position relatively far from the side wall of the device housing 110, which increases the flexibility of the layout design of the second camera module CM-2.

[0059] 18A-18H are plan views illustrating a device housing 110b and camera modules CM-1, CM-2, and CM-3 in an electronic device according to an embodiment. In the embodiment of FIG. 18A-18H, device housing 110b accommodates a first camera module CM-1, a second camera module CM-2, and a third camera module CM-3.

[0060] 18A, in some embodiments, the inner wall 110W of the device housing 110b may be located around the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. In some embodiments, the inner wall 110W of the device housing 110b may completely surround the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 in a planar manner. The protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1, the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2, and the protrusion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 may contact the inner wall 110W of the device housing 110b. In the example of FIG. 18A, the protrusions 10P-1, 10P-2, and 10P-3 all extend in the +Y direction and contact the same side wall of the inner wall 110W, but the embodiment is not limited thereto. In some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may have protrusions that contact different side walls of the inner wall 110W (see FIG. 18B for an example of protrusions that contact different side walls). In some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may all be front cameras. In other embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may all be rear cameras. The combination of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 is, for example, a combination of a telephoto camera, a wide-angle camera, and an ultra-wide-angle camera, or a combination of a telephoto camera, a wide-angle camera, and a TOF camera.

[0061] In some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may be arranged in a row, as shown in Fig. 18A. In some embodiments, the device housing 110b has a major axis (Y axis) and a minor axis (X axis), and the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may be arranged along the minor axis direction (X direction) of the device housing 110b.

[0062] Referring to FIG. 18B, unlike that shown in FIG. 18A, in some embodiments, the first camera module CM-1, the second camera module CM-2 and the third camera module CM-3 may be arranged along the longitudinal direction (Y direction) of the device housing 110b.

[0063] 18C, in some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may not be arranged in a line. For example, the first camera module CM-1 and the second camera module CM-2 are arranged in the short axis direction (X direction), and the first camera module CM-1 and the third camera module CM-3 are arranged in the long axis direction (Y direction).

[0064] 18D, in some embodiments, the shielding structure 10-2 of the second camera module CM-2 includes a first protrusion 10P-2-1 and a second protrusion 10P-2-2, the shielding structure 10-3 of the third camera module CM-3 includes one protrusion 10P-3, while the shielding structure 10-1 of the first camera module CM-1 does not include a protrusion. The first protrusion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 contacts the inner wall 110W of the device housing 110b, and the second protrusion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-1 of the first camera module CM-1. Therefore, the shielding structure 10-1 of the first camera module CM-1 is electrically coupled to the inner wall 110W of the device housing 110b via the shielding structure 10-2 of the second camera module CM-2.

[0065] 18E, in some embodiments, the shielding structure 10-2 of the second camera module CM-2 includes a first protrusion 10P-2-1, a second protrusion 10P-2-2, and a third protrusion 10P-2-3, while the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 may not include a protrusion. The first protrusion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 contacts the inner wall 110W of the device housing 110b, the second protrusion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-1 of the first camera module CM-1, and the third protrusion 10P-2-3 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-3 of the third camera module CM-3. Therefore, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 are electrically coupled to the inner wall 110W of the device housing 110b via the shielding structure 10-2 of the second camera module CM-2.

[0066] 18F, in some embodiments, the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the inner wall 110W of the device housing 110b, while the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 contact the shielding structure 10-2 of the second camera module CM-2. Thus, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 are electrically connected to the inner wall 110W of the device housing 110b via the shielding structure 10-2 of the second camera module CM-2.

[0067] 18G, in some embodiments, the inner wall 110W-1 of the device housing 110b may further include a first portion between the first camera module CM-1 and the second camera module CM-2, and a second portion between the second camera module CM-2 and the third camera module CM-3, when compared with the inner wall 110W shown in FIG. 18A. That is, the inner wall 110W-1 of the device housing 110b surrounds each of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. According to such an embodiment, the inner wall 110W-1 of the device housing 110b may be used to align the camera modules CM-1, CM-2, and CM-3.

[0068] 18H, in some embodiments, the inner wall 110W-2 of the device housing 110b may be located only around the second camera module CM-2. In some embodiments, the second camera module CM-2 is located within the space surrounded by the inner wall 110W-2 of the device housing 110b, while the first camera module CM-1 and the third camera module CM-3 are located outside the space surrounded by the inner wall 110W-2 of the device housing 110b. Thus, the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the inner surface of the inner wall 110W-2 of the device housing 110b, while the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 contact the outer surface of the inner wall 110W-2.

[0069] 19A-19E are plan views illustrating a flange 170 and camera modules CM-1, CM-2, and CM-3 in an electronic device according to an embodiment. In the embodiment of FIG. 19A-19E, the flange 170 accommodates a first camera module CM-1, a second camera module CM-2, and a third camera module CM-3.

[0070] 19A, in some embodiments, the flange 170 may surround the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. The protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1, the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2, and the protrusion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 may contact the flange 170. In the example of FIG. 19A, the protrusions 10P-1, 10P-2, and 10P-3 all extend in the +Y direction and contact the same side wall of the flange 170, but the embodiment is not limited thereto. In some embodiments, one or more of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may have protrusions that contact different side walls of the flange 170. In FIG. 19A, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 are shown as being arranged in a row along the X direction; however, as described with reference to FIGS. 18A to 18C, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 may be arranged in an alternative arrangement as shown in FIGS. 18A to 18C, for example, excluding the flange 170.

[0071] 19B is a plan view showing the flange 170 and the camera modules CM-1, CM-2, and CM-3 in an electronic device according to an embodiment. Referring to FIG. 19B, in some embodiments, the shielding structure 10-2 of the second camera module CM-2 includes two protrusions 10P-2-1 and 10P-2-2, and the shielding structure 10-3 of the third camera module CM-3 includes one protrusion 10P-3, while the shielding structure 10-1 of the first camera module CM-1 may not include a protrusion. The first protrusion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 contacts the flange 170, and the second protrusion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-1 of the first camera module CM-1. Therefore, the shielding structure 10-1 of the first camera module CM-1 is electrically coupled to the flange 170 via the shielding structure 10-2 of the second camera module CM-2.

[0072] 19C, the shielding structure 10-2 of the second camera module CM-2 includes three protrusions 10P-2-1, 10P-2-2, and 10P-2-3, while the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 may not include any protrusions. The first protrusion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 contacts the flange 170, the second protrusion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-1 of the first camera module CM-1, and the third protrusion 10P-2-3 of the shielding structure 10-2 of the second camera module CM-2 contacts the shielding structure 10-3 of the third camera module CM-3. Therefore, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 are electrically coupled to the flange 170 via the shielding structure 10-2 of the second camera module CM-2.

[0073] 19D, the protrusion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 contacts the flange 170, while the protrusion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protrusion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 contact the shielding structure 10-2 of the second camera module CM-2. Thus, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 are electrically connected to the flange 170 via the shielding structure 10-2 of the second camera module CM-2.

[0074] 19E, in some embodiments, the flange 170-1 may further include a portion between the first camera module CM-1 and the second camera module CM-2, and a portion between the second camera module CM-2 and the third camera module CM-3, when compared with the flange 170 shown in FIG. 19A. That is, the flange 170 surrounds each of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. According to such an embodiment, the flange 170-1 may be used to align the camera modules CM-1, CM-2, and CM-3.

[0075] The embodiments disclosed in the present invention are for illustration and not for the purpose of limiting the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted according to the claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention. [Industrial Applicability]

[0076] The present invention is applicable, for example, to technical fields related to electronic devices. [Explanation of symbols]

[0077] 10-F shielding structure 10-R shielding structure 10P-F Protrusion 10P-R Protrusion 100 Electronic equipment 110 Equipment housing 120 Front Panel 120A,160A Window 121 Front cover 122 Display 130 Main circuit board 140 Electronic Components 150 Battery 160 Rear Panel CM-F Front Camera Module CM-R Rear camera module

Claims

1. An electronic device, comprising: a camera module including an image sensor and a shielding structure for shielding components of the camera module from electromagnetic interference (EMI); an external structure that two-dimensionally surrounds the camera module and has at least a portion that is conductive; the shielding structure includes a housing portion that houses the image sensor and a protrusion that protrudes from the housing portion, the protrusion of the shielding structure contacts the external structure and is electrically coupled to the external structure; The external structure is not exposed to the outside of the electronic device.

2. The electronic device according to claim 1 , wherein the protrusion protrudes outward from a side wall of the housing portion.

3. 3. The electronic device of claim 1, wherein the protrusion is configured to maintain contact with the external structure by elastic force.

4. 4. The electronic device of claim 1, wherein the external structure comprises a conductive body and an insulating coating on the conductive body.

5. The electronic device according to claim 1 , wherein the shielding structure further comprises an adhesive portion that attaches the protrusion to the receiving portion.

6. A main circuit board; an electronic component coupled to the main circuit board; a first camera module and a second camera module connected to the main circuit board; an apparatus housing including a sidewall surrounding a space in which the main circuit board, the electronic components, the first camera module, and the second camera module are located; a front panel covering the space in which the main circuit board, the electronic components, the first camera module, and the second camera module are located, At least a portion of the device housing is electrically conductive; the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor; the second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor; the first shielding structure of the first camera module includes a first protrusion that contacts the device housing; The electronic device, wherein the second shielding structure of the second camera module includes a second protrusion contacting the first shielding structure of the first camera module.

7. A main circuit board; an electronic component coupled to the main circuit board; a first camera module and a second camera module connected to the main circuit board; an apparatus housing including a sidewall surrounding a space in which the main circuit board, the electronic components, the first camera module, and the second camera module are located; a front panel covering the space in which the main circuit board, the electronic components, the first camera module, and the second camera module are located, At least a portion of the device housing is electrically conductive; the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor; the second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor; 11. An electronic device, comprising: a first shielding structure of the first camera module including a first protrusion contacting the device housing; and a second protrusion contacting the second shielding structure of the second camera module.

8. 8. The electronic device of claim 6 or 7, wherein the first protrusion contacts the side wall of the device housing.

9. The electronic device of claim 6 or 7, wherein the device housing further comprises a bottom covering the space in which the main circuit board, the first camera module, and the second camera module are located.

10. the device housing further includes an inner wall located within the space enclosed by the side walls of the device housing and extending from the bottom of the device housing; The electronic device according to claim 9 , wherein the first protrusion contacts the inner wall.

11. A main circuit board; a first camera module connected to the main circuit board; a second camera module connected to the main circuit board; a flange surrounding the first camera module and the second camera module; an apparatus housing for accommodating the main circuit board, the first camera module, the second camera module, and the flange; At least a portion of the flange is electrically conductive; the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor and including a first protrusion; The electronic device, wherein the first protrusion contacts the flange and is electrically connected to the flange.

12. a third camera module connected to the main circuit board, The electronic device of claim 11 , wherein the flange surrounds each of the first camera module, the second camera module, and the third camera module.

13. the second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor and including a second protrusion; The electronic device according to claim 11 , wherein the second protrusion contacts the flange.

14. the second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor and including a second protrusion; 12. The electronic device according to claim 11, wherein the first protrusion of the first shielding structure of the first camera module and the second protrusion of the second shielding structure of the second camera module protrude in the same direction two-dimensionally.

15. the second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor and including a second protrusion; 12. The electronic device of claim 11, wherein the first protrusion of the first shielding structure of the first camera module and the second protrusion of the second shielding structure of the second camera module protrude in different directions in a plane.

16. The second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor and including a second protrusion; The electronic device of claim 11 , wherein the second protrusion of the second shielding structure of the second camera module contacts the first shielding structure of the first camera module.

17. The second camera module includes a second image sensor and a second shielding structure surrounding the second image sensor; The electronic device of claim 11 , wherein the first shielding structure of the first camera module further comprises a second protrusion contacting the second shielding structure of the second camera module.

Images