Electronic devices and electronic device housings

JP7668946B1Active Publication Date: 2025-04-25LENOVO (SINGAPORE) PTE LTD
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Patent Information

Application Number
JP2024183597
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-04-25
Estimated Expiration
2044-10-18

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Abstract

[Problem] To improve the adhesive strength of a bracket of a hinge. [Solution] An electronic device is an electronic device in which a first housing and a second housing are connected by a hinge, the hinge comprising a hinge shaft serving as a rotation axis, a first bracket fixed to the first housing and supporting one end of the hinge shaft, and a second bracket fixed to the second housing and supporting the other end of the hinge shaft, the first bracket having a plate-shaped portion and a bearing portion formed integrally with the plate-shaped portion and supporting one end of the hinge shaft, an adherend surface to which the plate-shaped portion is fixed with an adhesive is provided on one edge of the first housing, the plate-shaped portion has a chamfered portion or a concave portion at an end portion closer to the other edge portion in a first direction from the one edge portion of the first housing toward the other edge portion on the opposite side, the chamfered portion or the concave portion is provided to face the adherend surface side and is filled with the adhesive. [Selected Figure] Fig. 6A
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Citation Information

Patent Citations

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    JP2007510220A

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  • Hinge mechanism for mounting rotatable parts

    JP2016516952A