Cover tape for packaging electronic components and electronic component package

Abstract

To provide a cover tape which can be bonded to a carrier tape with adequate adhesive strength and is reduced in adhesion in a part where the carrier tape and the cover tape are not heat-sealed, in other words, has a good balance between "adhesion" to the carrier tape and "adhesion resistance" to the carrier taper.SOLUTION: A cover tape for electronic component packaging has a base material layer 1, an intermediate layer 2 and a sealant layer 3 in this order, wherein the sealant layer 3 contains (A) an adhesive resin, a glass transition temperature of (A) the adhesive resin is 60°C or higher and 120°C or lower, and tackiness at 60°C of the sealant layer is 0 N / cm2 or more and 5.0 N / cm2 or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cover tape for packaging electronic components and an electronic component package. [Background technology]

[0002] Conventionally, at electronic equipment manufacturing sites, electronic components such as transistors, diodes, capacitors, and piezoelectric resistors are contained in a package consisting of a carrier tape in which pockets capable of storing the electronic components are continuously formed, and a cover tape that is sealed to the carrier tape, and then subjected to a heat sealing process. The electronic components are then transported in a state in which they are wound on a paper or plastic reel to a working area where they are surface mounted on electronic circuit boards, etc. Then, after the cover tape of the package is peeled off in the above-mentioned working area, the electronic components are taken out of the pockets formed in the carrier tape and surface mounted on electronic circuit boards, etc.

[0003] In particular, various studies have been conducted on the adhesiveness and peelability of the cover tape. For example, Patent Document 1 discloses that the peelability is optimized by focusing on the peel resistance ratio α between the maximum and minimum values ​​of the peel resistance between the carrier tape and the cover tape. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-171393 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the process of peeling the cover tape from the carrier tape, if the peel strength, which is the strength required to peel the cover tape from the carrier tape, is too high, the carrier tape vibrates when the cover tape is peeled off, causing the electronic components to jump out of the storage pocket. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may peel off during transportation of the package, causing the packed electronic components to fall out. Therefore, the cover tape is required to have sufficient adhesive strength to the carrier tape and at the same time, to have releasability that allows it to be successfully peeled off from the carrier tape in the mounting process. In addition, in the process of transporting the package consisting of the carrier tape and the cover tape to the work area where surface mounting is performed, the environment may be high temperature and high humidity. In addition, since the package is wound on a reel, a certain pressure is applied to the carrier tape and the cover tape, and the carrier tape and the cover tape are in a state where they are bonded even in the non-heat-sealed parts, which causes a problem that the carrier tape and the cover tape do not peel off smoothly in the mounting process. Therefore, the cover tape is required to have the property of not bonding to the non-heat-sealed parts of the carrier tape even when a certain pressure is applied in a high temperature and high humidity environment.

[0006] One of the objects of the present invention is to provide a cover tape that can be adhered to a carrier tape with appropriate adhesive strength and that reduces sticking in areas where the carrier tape and cover tape are not heat-sealed, i.e., a cover tape that has a good balance between "adhesion" to the carrier tape and "resistance to adhesion" to the carrier tape. [Means for solving the problem]

[0007] After further investigation, the inventors discovered that the above problems could be solved by using a resin having a glass transition temperature in a specific range for the sealant layer of the cover tape, and thus completed the present invention.

[0008] According to the present invention, A base layer; The middle class, A sealant layer; A cover tape for packaging electronic components, comprising, in this order: The sealant layer contains an adhesive resin (A), The adhesive resin (A) has a glass transition temperature, measured according to the following <Method for Measuring Glass Transition Temperature>, of more than 60° C. and not more than 120° C., The tack strength of the sealant layer, as measured by the <Method of Measuring Tack Strength> below, is 0 N / cm 2 More than 5.0N / cm 2 The following is a cover tape for packaging electronic components. <Method of measuring glass transition temperature> The glass transition temperature (° C.) of the adhesive resin (A) is measured using a differential scanning calorimeter (DSC) by increasing the temperature from 0° C. to 200° C. at a rate of 10° C. / min in a nitrogen atmosphere. <Method of measuring tack strength> Contact area 20mm 2 The stainless steel material is pressed against the sealant layer of the electronic component packaging cover tape at a contact speed of 30 mm / min, and after holding the material at a measurement temperature of 60°C and a contact load of 25 N for 20 seconds, the material is peeled off at a speed of 600 mm / min. The measured load per unit area is defined as the tack force (N / cm) at 60°C. 2 )

[0009] Further, according to the present invention, a carrier tape having electronic components housed in recesses; The cover tape for packaging electronic components described above, An electronic component package is provided in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component. Effect of the Invention

[0010] According to the present invention, it is possible to provide a cover tape for packaging electronic components that has a good balance between adhesiveness and adhesion resistance. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing an example of a cover tape for packaging electronic components according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a diagram showing an example of a state in which a cover tape for packaging electronic components is bonded (heat sealed) to a carrier tape. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all drawings, similar components are given similar reference numerals and their description will be omitted as appropriate. In addition, the drawings are schematic diagrams and do not correspond to the actual dimensional ratio.

[0013] In this specification, the term "acrylic" represents a concept that includes both acrylic and methacrylic.

[0014] <Cover tape for packaging electronic components> FIG. 1 is a schematic diagram showing an example of a cover tape for packaging electronic components according to the present embodiment. The cover tape for packaging electronic components of this embodiment is a cover tape for packaging electronic components that includes a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In the cover tape 10 for packaging electronic devices, the sealant layer 3 is usually bonded to the carrier tape. In other words, the upper surface side in FIG. Moreover, each layer may be composed of a plurality of layers. The sealant layer 3 contains an adhesive resin (A), and the adhesive resin (A) has a glass transition temperature, measured by a predetermined method, of more than 60° C. and 120° C. or less. Furthermore, the tack strength of the sealant layer 3 measured by a predetermined method is 0 N / cm 2 More than 5.0N / cm 2 The following is the result. This makes it possible to achieve a good balance between the adhesiveness and adhesion resistance of the cover tape and carrier tape in the cover tape for packaging electronic components of this embodiment.

[0015] Although the details of the mechanism by which the cover tape 10 for packaging electronic components has an excellent balance between adhesion and adhesion resistance are not clear, by using (A) adhesive resin with a glass transition temperature of more than 60°C, the cover tape and carrier tape are bonded together to form a package, and since the resin is in a glass state even in a room temperature environment or a transport environment, it is possible to suppress adhesion while improving adhesion resistance. In addition, it is thought that by using (A) adhesive resin with a glass transition temperature of 120°C or less, the resin softens near the heat seal temperature, thereby imparting good adhesion between the cover tape and carrier tape. The upper limit is preferably 118°C or lower, more preferably 116°C or lower, and further preferably 114°C or lower.

[0016] <Other layers> An adhesive layer (not shown) may be provided between each layer of the cover tape for packaging electronic components 10. This adhesive layer can improve the adhesion between each layer. Materials for forming the adhesive layer include urethane-based adhesive resins for dry lamination or adhesive resins for anchor coats, and generally include a combination of a polyester composition such as polyester polyol or polyether polyol with an isocyanate compound. Furthermore, layers other than the adhesive layer may be provided, such as a layer for improving the strength of the entire film, a water vapor barrier layer, etc.

[0017] <Base material layer> The base material layer 1 can be a film made from various materials, so long as it has the mechanical strength to withstand the external forces applied during processing of the cover tape 10 for packaging electronic components, heat sealing to the carrier tape, and use, and the heat resistance to withstand the heat during heat sealing.

[0018] Specific examples of materials constituting the base layer 1 include ester resins, amide resins, olefin resins, acrylate resins, methacrylate resins, imide resins, carbonate resins, ABS resins, etc. Among these, ester resins and olefin resins are preferred as materials constituting the base layer 1, and polyethylene terephthalate and polyethylene, which can improve mechanical strength, are particularly preferred. In addition, when selecting an amide resin as the material constituting the base layer 1, it is preferred to use nylon, which can improve mechanical strength and flexibility.

[0019] The form of the film used to form the base layer 1 may be a stretched film or a film stretched uniaxially or biaxially, but from the viewpoint of improving the mechanical strength of the cover tape for packaging electronic components, a film stretched uniaxially or biaxially is preferable.

[0020] The base layer 1 may be formed of a single layer film containing the above-mentioned materials, or may be formed using a multilayer film containing the above-mentioned materials in each layer. From the viewpoint of reducing the amount of static electricity generated by peeling off the carrier tape, the base layer 1 may contain an antistatic agent, or an antistatic layer may be provided as one layer of the base layer on the surface of the base layer 1 opposite to the surface on which the intermediate layer 2 is provided. When electronic components are contained in a package consisting of the carrier tape and the cover tape 10 for packaging electronic components and transported, if multiple packages are stacked and transported, the surface of the base layer 1 or the antistatic layer containing such an antistatic agent may come into contact with the bottom surface of the carrier tape of the package stacked on top.

[0021] The thickness of the base layer 1 is, for example, 6 μm or more, preferably 7 μm or more, and more preferably 8 μm or more. The thickness of the base layer 1 is, for example, 35 μm or less, preferably 33 μm or less, and more preferably 30 μm or less. If the thickness of the base layer 1 is equal to or less than the above upper limit, the rigidity of the cover tape for packaging electronic components is not too high, and even if a torsional stress is applied to the carrier tape after sealing, the cover tape for packaging electronic components 10 follows the deformation of the carrier tape, and the possibility of peeling off can be reduced. If the thickness of the base layer 1 is equal to or more than the above lower limit, the mechanical strength of the cover tape for packaging electronic components 10 becomes suitable, and even when the cover tape for packaging electronic components 10 is peeled off from the carrier tape at high speed, the possibility of the cover tape for packaging electronic components 10 breaking can be reduced. The substrate layer 1 may have a two-layer structure of a first substrate layer and a second substrate layer, or a three-layer structure having an additional layer. In this case, the material may be, for example, the same as that used for the substrate layer 1. The thickness is preferably the total thickness of the first substrate layer, the second substrate layer, etc., which is the "thickness of substrate layer 1."

[0022] <Middle Class> The intermediate layer 2 is a layer provided for the purpose of imparting cushioning properties to the cover tape 10 for packaging electronic components according to this embodiment, thereby improving the adhesion between the cover tape 10 for packaging electronic components and the carrier tape during sealing.

[0023] The intermediate layer 2 may be made of any material that can provide cushioning properties to the cover tape 10 for packaging electronic components, and examples of such materials include one or more selected from polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene-based resins, olefin-based resins, and cyclic olefin resins, and copolymers thereof. Among these, olefin-based resins are preferred, and ethylene-based resins are more preferred.

[0024] The thickness of the intermediate layer 2 is typically 10 μm or more and 50 μm or less, and preferably 15 μm or more and 45 μm or less, from the viewpoint of improving the adhesion between the cover tape 10 for packaging electronic devices and the carrier tape during sealing.

[0025] <Sealant layer> The sealant layer 3 contains an adhesive resin (A) and is provided on the side of the intermediate layer 2 opposite to the side that contacts the base layer 1, and is the layer that comes into contact with the carrier tape when the cover tape 10 for packaging electronic components is sealed (e.g., heat sealed) to the carrier tape. The sealant layer 3 has heat sealability and can be adhered to a carrier tape, and exhibits easy peelability so that it can be easily peeled off when in use. The sealant layer 3 may be formed by laminating an adhesive resin layer and an antistatic layer in this order on the side opposite to the surface in contact with the intermediate layer 2.

[0026] Specific examples of the material of the adhesive resin (A) of the sealant layer 3 include one or more resins selected from acrylic resins, styrene resins, olefin resins, urethane resins and ester resins, and copolymers thereof, etc. Among these, it is preferable to contain at least one of styrene resins, acrylic resins and ester resins from the viewpoint of favorably dissolving or dispersing the antistatic agent. Specific examples of styrene-based resins include polystyrene, styrene-butadiene copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-methyl (meth)acrylate copolymer, hydrogenated styrene block copolymer, high impact polystyrene (HIPS), general purpose polystyrene resin (GPPS), and the like, and two or more of these may be used in combination. Among these, it is preferable to use styrene-butadiene copolymer (SB) from the viewpoint of high transparency and well-balanced improvement of adhesion resistance and peel strength. Specific examples of acrylic resins include resins composed of monomers such as acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate; methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, and butyl methacrylate; acrylonitrile, methacrylonitrile, and acrylamide. The monomers constituting the acrylic resin include one or more of these exemplified monomers. The monomers constituting the acrylic resin may further include monomers other than these exemplified monomers. The monomers may also be derivatives of these monomers. The ester resin is composed of an alcohol component and a carboxylic acid component. Specific examples of the alcohol component include, for example, aliphatic diols such as ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2,2-dimethyl-1,3-propanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, and 1,12-dodecanediol, alicyclic diols such as hydrogenated bisphenol A [2,2-bis(4-hydroxycyclohexyl)propane] and hydrogenated bisphenol A with alkylene oxide (average molar addition number of 2 to 12) having 2 to 4 carbon atoms, and polyhydric alcohols having 3 or more valences such as glycerin, pentaerythritol, trimethylolpropane, and sorbitol. These alcohol components may be used alone or in combination of two or more. Examples of the carboxylic acid component include aliphatic dicarboxylic acids such as oxalic acid, malonic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, succinic acid, adipic acid, sebacic acid, dodecanedioic acid, azelaic acid, dodecylsuccinic acid, dodecenylsuccinic acid, and octenylsuccinic acid, polyvalent carboxylic acids having three or more valences such as trimellitic acid or its anhydride, and aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, and terephthalic aromatic dicarboxylic acid. One or more of these carboxylic acid components may be used.

[0027] The adhesive resin of the sealant layer 3 has a glass transition temperature (°C) measured under a nitrogen atmosphere condition by increasing the temperature from 0°C to 200°C at a temperature increase rate of 10°C / min using a differential scanning calorimeter (DSC) and is greater than 60°C and not greater than 120°C, preferably not greater than 118°C, more preferably not greater than 116°C, and even more preferably not greater than 114°C. By setting the glass transition temperature within the above range, the 60°C tack strength of the cover tape for packaging electronic components can be set within an appropriate range, and further, when the cover tape and carrier tape are bonded together to form a package and wound on a reel for storage, adhesion between the cover tape and carrier tape can be suppressed at locations other than the portions bonded by heat sealing.

[0028] Furthermore, since the glass transition temperature (°C) of the adhesive resin of the sealant layer 3 is higher than 60°C, the rate of change over time in the peel strength of the cover tape for packaging electronic devices to the carrier tape compared to the initial value (immediately after heat sealing) can be kept within a predetermined range even when a package consisting of the cover tape for packaging electronic devices and the carrier tape is stored for a certain period of time in a high-temperature or high-humidity environment of about 60°C. This is thought to be because the adhesive resin of the sealant layer 3 has a glass transition temperature (°C) higher than 60°C, and therefore the adhesive resin can maintain its glass state even when stored in a high-temperature environment of about 60°C. These properties allow the packaging body consisting of the carrier tape and cover tape to have a good balance of adhesion and releasability to the carrier tape while it is being transported to the work area where surface mounting is performed, and even after transport, thereby preventing problems such as the cover tape peeling off during transport, causing electronic components contained in the packaging body to fall, or the cover tape not being successfully peeled off from the carrier tape during the mounting process.

[0029] The sealant layer 3 may further contain an antistatic agent (B) from the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress the generation of static electricity due to peeling and maintaining the sealability. In the sealant layer 3, the antistatic agent (B) is preferably dissolved or dispersed in the adhesive resin (A). That is, the compatibility between the adhesive resin (A) and the antistatic agent (B) is preferably good, and the antistatic agent (B) is uniformly dispersed throughout the sealant layer 3 in the adhesive resin (A) as the matrix resin. The mode of dissolution or dispersion may include a case where the antistatic agent (B) is dissolved in the adhesive resin (A) via a solvent, and a mode where the antistatic agent (B) is dispersed in water in the adhesive resin (A), and varies depending on the properties of the adhesive resin (A) and the antistatic agent (B). Specific examples of the (B) antistatic agent include antimony-doped tin, conductive polymers (e.g., polythiophene and polythiophene derivatives), phosphorus-doped tin, fluorine-doped tin, carbon nanotubes, etc. In view of good compatibility with the (A) adhesive resin, etc., it is preferable that the (B) antistatic agent contains one or more members selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers.

[0030] Examples of polythiophene or polythiophene derivatives, which are conductive polymers, include polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene-β-ethanesulfonic acid), etc. Among these, poly3,4-ethylenedioxythiophene or its derivatives are preferred from the viewpoint of maintaining better antistatic properties and sealing properties.

[0031] The sealant layer 3 may contain other additives such as a dispersant for improving the dispersibility of the antistatic agent, silica sol, a leveling agent, a conductive assistant, and the like.

[0032] From the viewpoint of suitably performing the sealing operation and the peeling operation, the thickness of the sealant layer 3 is typically preferably 0.02 μm or more and 20 μm or less, and more preferably 0.03 μm or more and 15 μm or less.

[0033] The thickness of the cover tape for packaging electronic components according to this embodiment is preferably 40 μm or more and 65 μm or less, and more preferably 45 μm or more and 60 μm or less, from the viewpoint of a balance between ensuring film strength and handling properties.

[0034] The characteristics of the cover tape for packaging electronic components according to this embodiment will be described below.

[0035] In the cover tape for packaging electronic components according to this embodiment, the tack strength of the sealant layer 3 is 2 The stainless steel material is pressed against the sealant layer 3 of the cover tape at a contact speed of 30 mm / min, and after holding for 20 seconds at a measurement temperature of 60°C and a contact load of 25 N, it is peeled off at a speed of 600 mm / min. The measured load per unit area is the tack force at 60°C. At this time, the tack strength of the sealant layer 3 at 60° C. is set to 5.0 N / cm from the viewpoint of adhesion resistance. 2 less than or equal to 4.5 N / cm 2 or less, and more preferably 4.0 N / cm 2 That is, by designing the cover tape so that the tack strength of the sealant layer 3 is sufficiently small at a temperature of 60° C., which is lower than the heat sealing temperature, good adhesion resistance can be obtained. There is no lower limit for the tack strength at 60°C, but for example, 0 N / cm 2 More specifically, 0.01N / cm 2 That's all.

[0036] The cover tape for packaging electronic components according to this embodiment has good "adhesion resistance" to the carrier tape. That is, the cover tape for packaging electronic components according to this embodiment and the carrier tape are prevented from sticking to each other in the portions that are not heat-sealed. This "adhesion resistance" can be quantified by the following <adhesion resistance test>. In other words, by designing the cover tape using the length of the adhesion mark measured in the following <adhesion resistance test> as a design index, a cover tape with better performance can be manufactured.

[0037] <Adhesion resistance test> In the cover tape for packaging electronic components according to the present embodiment, the cover tape for packaging electronic components is made to have a width of 10.0 mm, and the sealant layer side of the cover tape is bonded to the uneven surface side of a polystyrene film having a width of 8.0 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to obtain a sample. A sealing iron having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample, and the sample is left to stand for 24 hours under conditions of 60°C and 90% RH. After the sample is left to stand, the presence or absence of adhesion between the polystyrene film and the cover tape for packaging electronic components is evaluated based on the adhesion marks left on the polystyrene film. Specifically, the length of the adhesion marks left on the polystyrene film is measured as the length of the adhesion marks left on the polystyrene film. The length of the adhesion marks left on the polystyrene film is preferably 15 mm or less, more preferably 13 mm or less, and even more preferably 11 mm or less. There is no lower limit to the length of the adhesive mark on the polystyrene film, but it is, for example, 0 mm or more.

[0038] By designing the cover tape for packaging electronic devices so that the length of the adhesion mark is 15 mm or less, when the cover tape for packaging electronic devices and the carrier tape are laminated together to form a package and then wound on a reel for storage, adhesion between the cover tape and the carrier tape can be further suppressed in areas other than the area bonded by heat sealing, thereby further improving adhesion resistance.

[0039] The cover tape for packaging electronic components according to this embodiment has good adhesion to the carrier tape (heat sealability with the carrier tape). This can be quantified, for example, by the following <heat seal test>. In other words, a cover tape with better adhesion to the carrier tape can be manufactured by designing the cover tape using the peel strength obtained by the following <heat seal test> as a design index.

[0040] <Heat seal test> The cover tape for packaging electronic components is cut to a width of 5.5 mm, and the sealant layer side of this cover tape for packaging electronic components is bonded to the uneven surface side of a polystyrene film having a width of 8 mm and an average surface roughness (Ra) of 0.25 μm. A sample is then heat-sealed using a two-blade iron with one blade having a width of 0.4 mm and a length of 28 mm under conditions of a sealing temperature of 180°C, a load of 5 kgf, a sealing time of 60 milliseconds, and a carrier tape feed pitch of 4 mm. Using this sample, a peel test is performed under the conditions of a peel speed of 300 mm / min, a measurement temperature of 25° C., and a peel angle of 170°. The lower limit of the peel strength in this test is preferably 0.2 N or more, more preferably 0.22 N or more, and even more preferably 0.23 N or more. The upper limit of the peel strength is preferably 0.9 N or less, more preferably 0.8 N or less, and even more preferably 0.7 N or less. By setting the peel strength within the above range, the balance between the adhesion to the carrier tape and the peelability can be further improved.

[0041] <Peel strength when stored in a 60℃ environment after heat seal test> The peel strength of a package consisting of a cover tape for electronic components and a carrier tape stored at high temperature will be described. When a sample obtained in the above-mentioned <Heat Seal Test> is stored at 60°C for 30 days and then the peel strength at 170°C is measured in the same manner as in the above-mentioned <Heat Seal Test>, the lower limit of the peel strength is preferably 0.10N or more, more preferably 0.11N or more, and even more preferably 0.12N or more. The upper limit of the peel strength is preferably 1.35N or less, more preferably 1.20N or less, and even more preferably 1.05N or less. By keeping this peel strength within the above range, the balance between adhesion to the carrier tape and peelability can be made even better even when the packaging body in which the carrier tape and cover tape are bonded together is transported, stored, etc.

[0042] <Peel strength when stored in a 60℃ 90% RH environment after heat seal test> The peel strength of a package consisting of a cover tape for electronic components and a carrier tape stored at high temperature and high humidity will be described. When a sample obtained in the above-mentioned <Heat Seal Test> is stored at 60°C and 90% RH for 30 days and then the 170°C peel strength is measured in the same manner as in the above-mentioned <Heat Seal Test>, the lower limit of the peel strength is preferably 0.10 N or more, more preferably 0.11 N or more, and even more preferably 0.12 N or more. The upper limit of the peel strength is preferably 1.35 N or less, more preferably 1.20 N or less, and even more preferably 1.05 N or less. By keeping this peel strength within the above range, the balance between adhesion to the carrier tape and peelability can be made even better even when the packaging body in which the carrier tape and cover tape are bonded together is transported, stored, etc.

[0043] <Change in peel strength after heat seal test and storage at 60℃> The following describes the quantification of the change over time when a package consisting of a cover tape for electronic components and a carrier tape is stored at high temperature. The 170°C peel strength (i.e., the peel strength immediately after heat sealing) measured in the above-mentioned <Heat Sealing Test> is P, and the 170°C peel strength measured in the above-mentioned <Peel strength after storage in a 60°C environment after the heat sealing test> is P1. The upper limit of the absolute value of the rate of change in peel strength after storage at 60°C relative to the initial value of the peel strength immediately after heat sealing (|((P1-P) / P)×100|) (%) is preferably 50% or less, more preferably 40% or less, and even more preferably 35% or less. There is no particular restriction on the lower limit of the absolute value of the rate of change in peel strength, but it is, for example, 0% or more. By keeping this rate of change within the above range, the balance between adhesion to the carrier tape and peelability can be made even better even when the packaging body in which the carrier tape and cover tape are bonded together is transported, stored, etc.

[0044] <Change in peel strength after heat seal test and storage in 60℃ 90%RH environment> The following describes the quantification of the change over time when a package consisting of a cover tape for electronic components and a carrier tape is stored at high temperature and high humidity. The 170°C peel strength measured in the above-mentioned <Heat Sealing Test> (i.e., the peel strength immediately after heat sealing) is P, and the 170°C peel strength measured in the above-mentioned <Peel strength after storage in a 60°C, 90% RH environment after heat sealing test> is P2. The upper limit of the absolute value of the rate of change in peel strength after storage at 60°C relative to the initial value of the peel strength immediately after heat sealing (|((P2-P) / P)×100|) (%) is preferably 50% or less, more preferably 40% or less, and even more preferably 35% or less. There is no particular restriction on the lower limit of the absolute value of the rate of change in peel strength, but it is, for example, 0% or more. By keeping this rate of change within the above range, the balance between adhesion to the carrier tape and peelability can be made even better even when the packaging body in which the carrier tape and cover tape are bonded together is transported, stored, etc.

[0045] The surface resistance value of the surface of the above-mentioned base layer of the cover tape for packaging electronic components according to this embodiment, measured at 25° C. and 50% RH, is preferably 1.0×10 3 Ω or more, and more preferably 1.0×10 4 Ω or more, and more preferably 1.0×10 5 Ω or more, preferably 1.0×10 13 Ω or less, and more preferably 1.0×10 12 Ω or less, and more preferably 1.0×10 11 By setting the surface resistance value of the base material layer of the cover tape for packaging electronic components within the above range, static electricity generated due to various factors can be efficiently discharged to the outside. The surface of the base material layer refers to the exposed surface side of the base material layer in the cover tape for packaging electronic components (that is, the surface of the base material layer that is not in contact with the intermediate layer).

[0046] The surface resistance value of the surface of the sealant layer of the cover tape for packaging electronic components according to this embodiment, measured at 25° C. and 50% RH, is preferably 1.0×10 3 Ω or more, and more preferably 1.0×10 4 Ω or more, and more preferably 1.0×10 5 Ω or more, preferably 1.0×10 12 Ω or less, and more preferably 1.0×10 11 Ω or less, and more preferably 1.0×10 10 By controlling the surface resistance of the sealant layer of the cover tape for packaging electronic components, measured at 25° C. and 50% RH, to fall within the above range, the cover tape for packaging electronic components can have even better antistatic properties during peeling of the carrier tape. The surface of the sealant layer refers to the exposed surface side of the sealant layer in the cover tape for packaging electronic components (that is, the surface of the sealant layer that is not in contact with the intermediate layer).

[0047] The total light transmittance of the electronic component packaging cover tape according to this embodiment, measured with a light source D65 in accordance with JIS K 7361-1 (1997), is preferably 70% or more, more preferably 75% or more, even more preferably 80% or more, preferably 95% or less, more preferably 94% or less, and even more preferably 93% or less. In this way, the package 100 consisting of the cover tape 10 for packaging electronic components and the carrier tape can be given a degree of transparency that allows inspection of whether or not electronic components are properly accommodated in the pocket of the carrier tape. That is, by setting the total light transmittance of the cover tape for packaging electronic components to be equal to or more than the lower limit, it becomes possible to visually confirm the electronic components accommodated inside the package 100 consisting of the cover tape 10 for packaging electronic components and the carrier tape from the outside of the package 100.

[0048] The external haze of the cover tape for packaging electronic components according to this embodiment, measured with a light source D65 in accordance with JIS K 7136 (2000), is preferably 5% or more, more preferably 6% or more, and most preferably 7% or more, and is preferably 50% or less, more preferably 45% or less, and most preferably 40% or less. By making the external haze of the cover tape for packaging electronic components equal to or less than the upper limit, it is possible to impart transparency to a degree that allows inspection of whether electronic components are properly accommodated in the pockets of the carrier tape in a package consisting of the cover tape for packaging electronic components 10 and the carrier tape.

[0049] In this embodiment, by appropriately selecting conditions such as the type, properties and amounts of each component contained in the base layer 1, intermediate layer 2 and sealant layer 3 that constitute the cover tape for packaging electronic components, and the manufacturing method of the cover tape for packaging electronic components, it is possible to control the tack strength of the cover tape for packaging electronic components at 60°C. In this embodiment, in addition to using adhesive resin (A) having a glass transition temperature in a specific range for sealant layer 3, by further devising other conditions, it is possible to suppress unnecessary adhesion between the polystyrene film and the cover tape, and to control one or more of the surface resistance value of base layer 1, the surface resistance value of sealant layer 3, total light transmittance, and external haze. As a result, in the cover tape for packaging electronic components, when the cover tape and the carrier tape are bonded together to form a package, during transportation, it is possible to suppress adhesion between the cover tape and the carrier tape at places other than the part bonded by heat sealing, suppress static electricity during peeling, and further impart transparency to the extent that the electronic components can be visually recognized from the outside.

[0050] <Method of manufacturing cover tape for packaging electronic components> An example of a method for producing the cover tape for packaging electronic components according to this embodiment will be described. First, the intermediate layer 2 is formed on the surface of the base layer 1. The intermediate layer 2 can be formed by, for example, extrusion lamination or dry lamination. Next, a sealant layer coating solution is prepared using a predetermined material on the intermediate layer 2, and the solution is applied by a coating method and dried, or laminated by extrusion lamination, to form the sealant layer 3. The method for preparing the sealant layer coating solution includes a method of mixing an aqueous dispersion of (A) adhesive resin with an aqueous dispersion of (B) antistatic agent, and a method of mixing (A) adhesive resin with (B) antistatic agent using a solvent. Either method is selected depending on the types of (A) adhesive resin and (B) antistatic agent.

[0051] When forming the above-mentioned adhesive layer, the material for the adhesive layer may be applied to the surface of the layer to be formed by a conventionally known application method.

[0052] The cover tape for packaging electronic components according to the present embodiment can be attached to a carrier tape to be used as a package. That is, it is preferable to use a package that includes a carrier tape having a plurality of storage compartments for storing electronic components, the electronic components stored in the storage compartments, and the cover tape for packaging electronic components arranged to cover the storage compartments. Such a package can suppress the generation of static electricity, and can more reliably protect the electronic components stored in the storage section from static electricity.

[0053] <Electronic component packaging> An electronic component package can be obtained from the cover tape for packaging electronic components of this embodiment described above and a carrier tape having electronic components housed in recesses. This will be described with reference to FIG.

[0054] In FIG. 2, cover tape 10 for packaging electronic components is used as a lid material for band-shaped carrier tape 20 having recessed pockets 21 continuously formed to match the shapes of electronic components. Specifically, the cover tape 10 for packaging electronic components is adhered (usually by heat sealing) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 for packaging electronic components and the carrier tape 20 together will be referred to as the electronic component package 100.

[0055] The electronic component packaging body 100 can be produced, for example, by the following procedure. First, electronic components are placed in the pockets 21 of the carrier tape 20 . Next, the cover tape 10 for packaging electronic components is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 for packaging electronic components is in contact with the carrier tape 20 (that is, the heat sealing is performed so that the "back surface" of the cover tape 10 for packaging electronic components in FIG. 2 becomes the sealant layer 3). The specific method and conditions for heat sealing are not particularly limited as long as the cover tape 10 for packaging electronic components is sufficiently strongly adhered to the carrier tape 20. Typically, a known heat sealing machine is used, and the heat sealing can be performed at a temperature of 100 to 240° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

[0056] In this manner, a structure (electronic component packaging body 100) in which electronic components are hermetically housed is obtained. This structure (electronic component packaging body 100) is, for example, wound on a reel and then transported to a work area where the electronic components are mounted on an electronic circuit board, etc. The reel can be made of metal, paper, plastic, etc.

[0057] After the electronic component package 100 has been transported to the work area, the cover tape 10 for packaging electronic components is peeled off from the carrier tape 20, and the housed electronic components are taken out.

[0058] The electronic components contained in electronic component packaging 100 are not particularly limited. Examples include general components used in the manufacture of electric and electronic devices, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

[0059] Although the embodiments of the present invention have been described in detail above, these are merely examples of the present invention. In addition, various configurations other than those described above can be adopted. In addition, the present invention is not limited to the above-described embodiments. Below, examples of reference forms are given. 1. A base layer; The middle class, A sealant layer; A cover tape for packaging electronic components, comprising, in this order: The sealant layer contains an adhesive resin (A), The adhesive resin (A) has a glass transition temperature, measured according to the following <Method for Measuring Glass Transition Temperature>, of more than 60° C. and not more than 120° C., The tack strength of the sealant layer, as measured by the <Method of Measuring Tack Strength> below, is 0 N / cm 2 More than 5.0N / cm 2 The following is a cover tape for packaging electronic components. <Method of measuring glass transition temperature> The glass transition temperature (° C.) of the adhesive resin (A) is measured using a differential scanning calorimeter (DSC) by increasing the temperature from 0° C. to 200° C. at a rate of 10° C. / min in a nitrogen atmosphere. <Method of measuring tack strength> Contact area 20mm 2 The stainless steel material is pressed against the sealant layer of the electronic component packaging cover tape at a contact speed of 30 mm / min, and after holding the material at a measurement temperature of 60°C and a contact load of 25 N for 20 seconds, the material is peeled off at a speed of 600 mm / min. The measured load per unit area is defined as the tack force (N / cm) at 60°C. 2 ) 2. 1. A cover tape for packaging electronic components according to claim 1, A cover tape for packaging electronic components, wherein the adhesive resin (A) of the sealant layer contains at least one of a styrene-based resin, an acrylic-based resin, and an ester-based resin. 3. 1. A cover tape for packaging electronic components according to claim 1 or 2, The cover tape for packaging electronic components, wherein the sealant layer further comprises (B) an antistatic agent. 4. 3. The cover tape for packaging electronic components according to claim 2, The cover tape for packaging electronic components, wherein the (B) antistatic agent comprises at least one member selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers. 5. A cover tape for packaging electronic components according to any one of 1. to 4., A cover tape for packaging electronic components that, when evaluated in the <Adhesion Resistance Test> below, leaves an adhesion mark on a polystyrene film that is between 0 mm and 15 mm long. <Adhesion resistance test> The cover tape for packaging electronic components is cut to a width of 10.0 mm, and the sealant layer side of the cover tape is bonded to the uneven surface side of a polystyrene film having a width of 8.0 mm and an average surface roughness (Ra) of 0.25 μm to prepare a sample. A sealing iron having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample, and the sample is left to stand for 24 hours under conditions of 60°C and 90% RH. After leaving the sample to stand, the dimension of the adhesive mark on the polystyrene film in the length direction of the polystyrene film is measured as the length of the adhesive mark on the polystyrene film. 6. A cover tape for packaging electronic components according to any one of 1. to 5., The surface resistance of the surface of the substrate layer measured at 25° C. and 50% RH is 1.0×10 3 Ω or more 1.0×10 13 Cover tape for packaging electronic components with a resistance of less than Ω. 7. A cover tape for packaging electronic components according to any one of 1. to 6., The surface resistance of the sealant layer measured at 25° C. and 50% RH is 1.0×10 3 Ω or more 1.0×10 12 Cover tape for packaging electronic components with a resistance of less than Ω. 8. A cover tape for packaging electronic components according to any one of 1. to 7., A cover tape for packaging electronic components that has a total light transmittance of 70% or more and 95% or less, measured with light source D65, in accordance with JIS K 7361-1 (1997). 9. A cover tape for packaging electronic components according to any one of 1. to 8., A cover tape for packaging electronic components with an external haze of 5% to 50% measured with light source D65, conforming to JIS K 7136 (2000). 10. a carrier tape having electronic components housed in recesses; A cover tape for packaging electronic components according to any one of 1. to 9., An electronic component package in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component. EXAMPLES

[0060] The embodiments of the present invention will be described in detail based on examples and comparative examples, but the present invention is not limited to these.

[0061] The constituent materials of the sealant layers shown in Tables 1 and 2 are as follows. (adhesive resin) Resin 1: Styrene-based resin (Asahi Kasei Corporation "L8900") Resin 2: Ester resin ("Elite KA-3556" manufactured by Unitika) Resin 3: Acrylic resin (Mitsubishi Chemical "MB-2660") ·Resin 4: Acrylic resin (manufactured by Seiko PMC "US-1071") Resin 5: Acrylic resin (Kusumoto Chemical Industries, Ltd. "B-811") Resin 6: Styrene-based resin (Asahi Kasei Corporation "L1432") Resin 7: Acrylic resin (Daicel-Allnex "VSC6828w") Resin 8: Ester resin ("Elite KA-0134" manufactured by Unitika) Resin 9: Acrylic resin (Seiko PMC, X-310) Resin 10: Acrylic resin (Seiko PMC, TE-1048) (Antistatic agent) Antistatic agent 1: Antimony-doped tin oxide (Mitsubishi Materials Corporation "T-1") Antistatic agent 2: Polythiophene derivative (PEDOT:PSS) (Heraeus "Clevios P1000") Antistatic agent 3: Polythiophene derivative (Seplugida SAS-16, manufactured by Shin-Etsu Polymer Co., Ltd.)

[0062] <Example 1> An anchor coating agent was applied to a 12 μm thick antistatic polyethylene terephthalate (PET) film ("E7455" manufactured by Toyobo Co., Ltd.) to a wet thickness of 4 μm by gravure coating, and dried at 100° C. Then, low-density polyethylene ("Sumikasen L705" manufactured by Sumitomo Chemical Co., Ltd., 37 μ thick) was extrusion laminated, and cooled with a cooling roll (surface temperature 20° C.). In this way, a laminated film consisting of a base layer and an intermediate layer was produced.

[0063] On the surface of the obtained laminated film on the intermediate layer side, a film having a thickness of 0.5 μm was formed by gravure coating using the components shown in Table 1. In this way, a sealant layer was provided. The overall thickness of the cover tape is shown in Tables 1 and 2.

[0064] <Examples 2 to 6 and Comparative Examples 1 to 5> According to the formulations shown in Tables 1 and 2, a cover tape for packaging electronic devices was produced in the same manner as in Example 1.

[0065] <Glass transition temperature> The adhesive resins used in the examples and comparative examples were measured for their glass transition temperatures (°C) in a nitrogen atmosphere by increasing the temperature from 0°C to 200°C at a rate of 10°C / min using a differential scanning calorimeter (DSC) (manufactured by Hitachi High-Tech Science Corporation, "DSC7000X").

[0066] <Tack strength at 60℃> Contact area 20mm 2 The stainless steel material (SUS304) was pressed against the sealant layer of the cover tape at a contact speed of 30 mm / min, and after holding for 20 seconds at a measurement temperature of 60°C and a contact load of 25 N, the load per unit area when peeled off at a speed of 600 mm / min was measured using a tack tester TAC0-1000 manufactured by RHESCA. The tack force (N / cm) at 60°C was 2 The above stainless steel material was included with the tack testing machine.

[0067] <Adhesion resistance test> (measurement of the length of the adhesive mark) The cover tape for packaging electronic components obtained above was cut to a width of 10.0 mm, and the sealant layer side of the cover tape was bonded to the uneven surface side of a polystyrene film (Sumitomo Bakelite Co., Ltd.'s "CEL-E980A") with a width of 8.0 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to prepare a sample. A sealing iron with a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g was placed on the upper surface of the cover tape and left under conditions of 60°C and 90% RH for 24 hours. After that, the length of the polystyrene film in the adhesive mark (where gloss is observed) on the polystyrene film was measured as the length of the adhesive mark on the polystyrene film. Incidentally, the "length of the adhesive mark" means the total length of each adhesive mark when the adhesive mark is observed intermittently (discontinuously). It can be said that the shorter the adhesion mark is, the more the portions of the cover tape that are not heat sealed to the carrier tape are prevented from adhering to the carrier tape (unintentional adhesion).

[0068] <Heat seal test: 170° peel strength against polystyrene film> Each of the electronic component packaging cover tapes obtained above was cut to a width of 5.5 mm, and the sealant layer side of the electronic component packaging cover tape was bonded to the uneven surface side of a polystyrene film (manufactured by Sumitomo Bakelite Co., Ltd., "CEL-E980A") having a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm. The bonded product was heat-sealed using a heat sealer (manufactured by Tokyo Wells Co., Ltd., "TWA-6621") under the conditions of a sealing temperature of 180°C, a load of 5 kgf, a sealing time of 60 milliseconds, a carrier tape feed pitch of 4 mm, and 2 rows and 7 times of hitting, using a two-blade iron with a width of 0.4 mm and a length of 28 mm, to obtain a sample. The peel strength (N) of the electronic component packaging cover tape to the polystyrene film immediately after heat sealing was measured using the obtained sample. The peel strength was measured using a peel tester (EPI's "PTS-5000") at a peel speed of 300 mm / min, a peel angle of 170°, and a measurement temperature of 25° C. The results are shown in Tables 1 and 2. The surface roughness (Ra) of the polystyrene film was measured using a surface roughness measuring device (Mitutoyo's "SJ-210") in accordance with JIS B 0601 (2001) for the portion of the polystyrene film used above that was to be bonded to the cover tape for packaging electronic components before bonding to the cover tape for packaging electronic components.

[0069] <Test of storing samples at 60℃ and 60℃ 90% RH after heat sealing: 170° peel strength against polystyrene film> The samples obtained in the above-mentioned <Heat seal test: 170° peel strength against polystyrene film> were placed in a 60°C (0% RH to 20% RH) environment or a 60°C 90% RH environment for 30 days, and were used as 60°C storage samples and 60°C 90% RH storage samples, respectively. Using the 60°C storage samples and 60°C 90% RH storage samples, the 170° peel strength (N) was measured under the same conditions as described in the above-mentioned <Heat seal test: 170° peel strength against polystyrene film>, and was designated as P1 (N) and P2 (N), respectively. In addition, the peel strength (N) immediately after heat sealing of the cover tape for packaging electronic components against the polystyrene film was designated as P (N). From the values ​​of P, P1, and P2, the rate of change (absolute value) of 170° peel strength after storage at 60°C and the rate of change (absolute value) of 170° peel strength after storage at 60°C 90% RH were calculated according to the following formulas (1) and (2). Change in peel strength from the initial value after storage at 60°C for 30 days (absolute value) (%): |((P1-P) / P)×100| (1) Change in peel strength from the initial value (absolute value) (%) after 30 days of storage at 60°C and 90% RH: |((P2-P) / P)×100| (2) The values ​​of |((P1-P) / P)×100| and |((P2-P) / P)×100| are shown in Tables 1 and 2.

[0070] <Surface resistance value of base layer> The surface resistance (Ω) of the substrate layer surface of the cover tape for packaging electronic components obtained above was measured in a 25° C., 50% RH environment using a surface resistance measuring instrument manufactured by SIMCO (manufactured by SIMCO, “ST-3”). The results are shown in Table 1. In addition, in Tables 1 and 2, for example, "5.E+10" in Example 1 is "5×10 10 " represents.

[0071] <Surface resistance value of sealant layer> The surface resistance (Ω) of the sealant layer of the cover tape for packaging electronic components obtained above was measured in a 25°C, 50% RH environment using a surface resistance measuring device manufactured by SIMCO ("ST-3" manufactured by SIMCO). The results are shown in Table 1. In addition, in Tables 1 and 2, for example, "1.E+07" in Example 1 is "1×10 7 " represents.

[0072] <Total light transmittance> The total light transmittance (%) of the cover tape for packaging electronic components obtained above was measured in accordance with JIS K 7361-1 (1997) using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. under a light source of D65. The results are shown in Tables 1 and 2.

[0073] <External Haze> The external haze (%) of the cover tape for packaging electronic components obtained above was measured in accordance with JIS K 7136 (2000) using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. under a light source of D65. The results are shown in Tables 1 and 2.

[0074] [Table 1]

[0075] [Table 2]

[0076] In Examples 1 to 6, the adhesive resistance evaluated by the adhesive resistance test (length of adhesive mark) was good, and the cover tape for packaging electronic components was obtained with appropriate heat seal strength evaluated by 170° peel strength against polystyrene film. In addition, in Examples 1 to 6, the rate of change over time in peel strength after storage at 60°C and after storage at 60°C and 90% RH was small. On the other hand, in Comparative Examples 1 to 5, the glass transition temperature of the adhesive resin (A) was 60° C. or lower or exceeded 120° C., and therefore the results were inferior to those of the Examples. Furthermore, in Comparative Examples 1 to 5, the rate of change over time in peel strength after storage at 60° C. and after storage at 60° C. and 90% RH was large. [Explanation of symbols]

[0077] 1 Base material layer 2. Middle Tier 3 Sealant Layer 10 Cover Tape 20 Carrier Tape 21 Pocket 100 Electronic component packaging body

Claims

1. A base layer; The middle class, A sealant layer; A cover tape for packaging electronic components, comprising, in this order: The sealant layer contains an adhesive resin (A), The adhesive resin (A) has a glass transition temperature, measured according to the following <Method for Measuring Glass Transition Temperature>, of more than 60° C. and not more than 120° C.; The tack strength of the sealant layer, as measured by the <Method of Measuring Tack Strength> below, is 0 N / cm ２ 5.0N / cm or more ２ is as follows: The sealant layer further comprises (B) an antistatic agent, The intermediate layer is a layer that is in direct contact with the sealant layer and is made of one or more materials selected from the group consisting of polyacrylic acid derivatives, polyacrylic ester derivatives, olefin resins, and cyclic olefin resins (excluding a cover tape that is made of at least a base layer, an intermediate layer, and a heat seal layer, and is characterized in that the heat seal layer contains 25 to 50 parts by mass of an inorganic filler having a median diameter (D50) of less than 50 nm and 20 to 60 parts by mass of an inorganic filler having a median diameter (D50) of 50 to 300 nm, per 100 parts by mass of a thermoplastic resin having an acid value of 1 to 20 mgKOH / g that constitutes the heat seal layer). <Method of measuring glass transition temperature> The glass transition temperature (° C.) of the adhesive resin (A) is measured using a differential scanning calorimeter (DSC) by increasing the temperature from 0° C. to 200° C. at a temperature increase rate of 10° C. / min in a nitrogen atmosphere. <Method of measuring tack strength> Contact area 20mm ２ A stainless steel material having a thickness of 10 mm or less was pressed against the sealant layer of the cover tape for packaging electronic devices at a contact speed of 30 mm / min, and the measurement temperature was 60°C and a contact load of 25 N was maintained for 20 seconds. The measured load per unit area when the material was peeled off at a speed of 600 mm / min was then determined as the tack force (N / cm) at 60°C. ２ )

2. A base layer; The middle class, A sealant layer; A cover tape for packaging electronic components, comprising, in this order: The sealant layer contains an adhesive resin (A), The adhesive resin (A) has a glass transition temperature of 100° C. or higher and 120° C. or lower, as measured in accordance with the following <Method for Measuring Glass Transition Temperature>, The tack strength of the sealant layer, as measured by the <Method of Measuring Tack Strength> below, is 0 N / cm ２ 5.0N / cm or more ２ is as follows: A cover tape for packaging electronic components, the intermediate layer of which contains one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, olefin resins, and cyclic olefin resins (excluding a cover tape which is composed of at least a base layer, an intermediate layer, and a heat seal layer, and which contains 25 to 50 parts by mass of an inorganic filler having a median diameter (D50) of less than 50 nm and 20 to 60 parts by mass of an inorganic filler having a median diameter (D50) of 50 to 300 nm, per 100 parts by mass of a thermoplastic resin constituting the heat seal layer and having an acid value of 1 to 20 mgKOH / g). <Method of measuring glass transition temperature> The glass transition temperature (° C.) of the adhesive resin (A) is measured using a differential scanning calorimeter (DSC) by increasing the temperature from 0° C. to 200° C. at a temperature increase rate of 10° C. / min in a nitrogen atmosphere. <Method of measuring tack strength> Contact area 20mm ２ A stainless steel material having a thickness of 10 mm or less was pressed against the sealant layer of the cover tape for packaging electronic devices at a contact speed of 30 mm / min, and the measurement temperature was 60°C and a contact load of 25 N was maintained for 20 seconds. The measured load per unit area when the material was peeled off at a speed of 600 mm / min was then determined as the tack force (N / cm) at 60°C. ２ )

3. The cover tape for packaging electronic components according to claim 1 or 2, A cover tape for packaging electronic components, wherein the adhesive resin (A) of the sealant layer contains at least one of a styrene-based resin, an acrylic-based resin, and an ester-based resin.

4. 3. The cover tape for packaging electronic components according to claim 2, The cover tape for packaging electronic components, wherein the sealant layer further comprises (B) an antistatic agent.

5. The cover tape for packaging electronic components according to claim 1 or 4, The cover tape for packaging electronic components, wherein the (B) antistatic agent comprises at least one selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers.

6. The cover tape for packaging electronic components according to any one of claims 1 to 5, A cover tape for packaging electronic components, which, when evaluated in the following <Adhesion Resistance Test>, leaves an adhesion mark on a polystyrene film with a length of 0 mm or more and 15 mm or less. <Adhesion resistance test> The cover tape for packaging electronic components is made to have a width of 10.0 mm, and the sealant layer side of the cover tape is bonded to the uneven surface side of a polystyrene film having a width of 8.0 mm and an average surface roughness (Ra) of 0.25 μm, to obtain a sample. A sealing iron having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample, and the sample is left to stand for 24 hours under conditions of 60° C. and 90% RH. After standing, the dimension of the adhesive mark on the polystyrene film in the length direction of the polystyrene film is measured as the length of the adhesive mark on the polystyrene film.

7. The cover tape for packaging electronic components according to any one of claims 1 to 6, The surface resistance of the surface of the substrate layer measured at 25° C. and 50% RH is 1.0×10 ３ Ω or more 1.0×10 １３ A cover tape for packaging electronic components with a resistance of less than Ω.

8. The cover tape for packaging electronic components according to any one of claims 1 to 7, The surface resistance of the sealant layer measured at 25° C. and 50% RH is 1.0×10 ３ Ω or more 1.0×10 １２ A cover tape for packaging electronic components with a resistance of less than Ω.

9. The cover tape for packaging electronic components according to any one of claims 1 to 8, A cover tape for packaging electronic components, which has a total light transmittance of 70% or more and 95% or less as measured with a light source D65 in accordance with JIS K 7361-1 (1997).

10. The cover tape for packaging electronic components according to any one of claims 1 to 9, A cover tape for packaging electronic components, having an external haze of 5% or more and 50% or less as measured under light source D65 in accordance with JIS K 7136 (2000).

11. The cover tape for packaging electronic components according to any one of claims 1 to 10, The cover tape for packaging electronic components, wherein the adhesive resin (A) of the sealant layer contains at least one of a styrene-based resin and an ester-based resin.

12. a carrier tape having electronic components housed in recesses; The cover tape for packaging electronic components according to any one of claims 1 to 11, An electronic component package in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component.

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