Vacuum transport device and method for controlling the vacuum transport device

Abstract

To reduce moisture adhering to a substrate.SOLUTION: A vacuum transport device is arranged between a process chamber and a load lock chamber, and transports a substrate between the process chamber and the load lock chamber, and includes a container, a transport device, an exhaust device, a dew point meter, and a control device. The container is connected to each of the process chamber and the load lock chamber via a gate valve. The transport device is provided in the container, and transports the substrate between the process chamber and the load lock chamber. The exhaust device exhausts a gas in the container. The dew point meter measures a dew point temperature of the gas in the container. The control device determines, based on the dew point temperature measured by the dew point meter, whether the process can be executed, and when the process is allowed to be executed, the control device notifies a user of the vacuum transport device of this fact.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] Various aspects and embodiments of the present disclosure relate to a vacuum transfer apparatus and a method for controlling a vacuum transfer apparatus. [Background technology]

[0002] In recent years, with the miniaturization of wiring patterns, moisture adhering to the substrate can oxidize the wiring formed on the substrate, which can degrade the quality of the wiring. For this reason, in a front-opening unified pod (FOUP) for transporting and storing substrates, the space inside the FOUP that contains the substrate is filled with nitrogen gas to prevent moisture from adhering to the substrate. In addition, the pressure inside the vacuum transport device is controlled to a low level, so not much moisture adheres to the substrate during the process of transporting it through the vacuum transport device.

[0003] However, since the substrate is exposed to the atmosphere between being removed from the FOUP and being transferred to the vacuum transfer device, and between being removed from the vacuum transfer device and being stored in the FOUP, a large amount of moisture adheres to the substrate.

[0004] To avoid this, a technique is known in which a mini-environment transfer device is provided between the FOUP and the vacuum transfer device to keep the transfer path between the FOUP and the vacuum transfer device in a low humidity state (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2013-115065 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure provides a vacuum transfer device and a method for controlling the vacuum transfer device that can reduce moisture adhering to a substrate. [Means for solving the problem]

[0007] One aspect of the present disclosure is a vacuum transfer device disposed between a process chamber and a load lock chamber, which transfers a substrate between the process chamber and the load lock chamber, the vacuum transfer device comprising a container, a transfer device, an exhaust device, a dew point meter, and a control device. The container is connected to each of the process chamber and the load lock chamber via a gate valve. The transfer device is provided in the container, and transfers the substrate between the process chamber and the load lock chamber. The exhaust device exhausts gas from within the container. The dew point meter measures a dew point temperature of the gas within the container. The control device determines whether or not a process can be performed based on the dew point temperature measured by the dew point meter, and when the process can be performed, notifies a user of the vacuum transfer device of that effect. Effect of the Invention

[0008] According to various aspects and embodiments of the present disclosure, moisture adhering to a substrate can be reduced. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating an example of the configuration of a film forming system according to an embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line XX showing an example of a vacuum transfer device, a load lock chamber, and an atmospheric transfer chamber. [Diagram 3] FIG. 3 is a flow chart showing an example of control of the vacuum transfer device before the start of a process. [Figure 4] FIG. 4 is a flow chart showing an example of control of the vacuum transfer device when a gate valve between a process chamber and the vacuum transfer device is opened when a process in one process chamber is completed. [Diagram 5] FIG. 5 is a flowchart showing an example of a method for managing the dew point temperature inside a container during execution of a process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the vacuum transfer device and the control method for the vacuum transfer device disclosed in the present application will be described in detail with reference to the drawings. Note that the vacuum transfer device and the control method for the vacuum transfer device disclosed in the following embodiments are not limited to the embodiments.

[0011] Incidentally, the vacuum transport device is sealed after being released to the atmosphere, and the pressure inside the vacuum transport device is reduced by exhausting the gas inside the vacuum transport device. Therefore, even if the gas concentration inside the vacuum transport device is reduced by exhausting, the proportion of moisture contained in the gas inside the vacuum transport device is the same as that of the outside air. As wiring patterns become finer, even the adhesion of a small amount of moisture may change the characteristics of the wiring. As wiring patterns become finer, therefore, the characteristics of the wiring may change during the process of transporting the substrate inside the vacuum transport device.

[0012] Therefore, the present disclosure provides a technique that can further reduce the amount of moisture that adheres to a substrate.

[0013] [Film forming system 100] FIG. 1 is a schematic diagram showing an example of a film forming system 100 according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view taken along line XX showing an example of a vacuum transfer device 200, a load lock chamber 102, and an atmospheric transfer chamber 103. The cross-section taken along line XX in FIG. 1 corresponds to FIG. 2. The film forming system 100 is a multi-chamber type vacuum processing system. The film forming system 100 includes a plurality of process chambers 101, a plurality of load lock chambers 102, an atmospheric transfer chamber 103, a gas supply device 110, an exhaust device 120, a control device 130, and a vacuum transfer device 200.

[0014] The multiple process chambers 101 are connected to four side walls of a vacuum transfer device 200 having a heptagonal planar shape via gate valves G1. Each process chamber 101 performs a process such as film formation, etching, or modification on a substrate W that is carried inside via the vacuum transfer device 200. In this embodiment, four process chambers 101 are connected to the four side walls of the vacuum transfer device 200 having a heptagonal planar shape, but the number of process chambers 101 connected to the vacuum transfer device 200 may be three or less, or five or more.

[0015] The multiple load lock chambers 102 are connected to three side walls of the vacuum transfer device 200 via gate valves G2, respectively. The atmospheric transfer chambers 103 are connected to each of the load lock chambers 102 via gate valves G3. The load lock chambers 102 switch the atmosphere between the atmospheric atmosphere and the vacuum atmosphere when transferring the substrate W between the atmospheric transfer chambers 103 and the vacuum transfer device 200. In this embodiment, three load lock chambers 102 are connected to three side walls of the vacuum transfer device 200, but the number of load lock chambers 102 connected to the vacuum transfer device 200 may be two or less, or may be four or more.

[0016] The vacuum transfer device 200 includes a container 201, a transfer device 202, a plurality of heaters 203, and a dew point meter 204. The transfer device 202 is, for example, a robot arm, and transfers a substrate W between each process chamber 101 and each load lock chamber 102. The transfer device 202, for example, takes out an unprocessed substrate W from the load lock chamber 102 and carries it into the process chamber 101. The transfer device 202 also takes out a processed substrate W from the process chamber 101 and carries it into the process chamber 101 where another process is performed on the substrate W. The transfer device 202 also takes out a processed substrate W from the process chamber 101 and carries it into the load lock chamber 102.

[0017] The heater 203 is, for example, rod-shaped, embedded in the side wall of the container 201, and heats the side wall of the container 201. This heats the wall surface of the container 201, making it easier for water molecules adsorbed to the wall surface of the container 201 to detach. The heater 203 may also be embedded in the floor or ceiling of the container 201 to heat the floor or ceiling of the container 201. Supply and stop of power to the heater 203 is controlled by the control unit 132 in the control device 130.

[0018] The dew point meter 204 is disposed in the container 201 and measures the dew point temperature T d In this embodiment, the dew point meter 204 is a capacitance type dew point meter. The dew point temperature T d This information is output to the control device 130.

[0019] The exhaust device 120 is connected to the container 201 via a pipe 126. The exhaust device 120 includes a TMP (TurboMolecular Pump) 121, a DP (Dry Pump) 122, a valve 123, a valve 124, and a valve 125. The inlet of the TMP 121 is connected to the pipe 126 via the valve 124, and the exhaust port of the TMP 121 is connected to the DP 122 via the valve 125. A pipe 127 is connected between the pipe 126 and the pipe between the valve 125 and the DP 122, and the pipe 127 is provided with a valve 123. The DP 122 can exhaust gas in the container 201 to a vacuum level of about several Torr. On the other hand, the TMP 121 can exhaust gas in the container 201 to a vacuum level of 1 Torr or less. The TMP 121 consumes more power than the DP 122. The TMP 121 , the DP 122 , the valve 123 , the valve 124 , and the valve 125 are controlled by a control unit 132 in the control device 130 .

[0020] A gas supply device 110 is connected to the container 201 via a pipe 113. The gas supply device 110 has a PCV (Pressure Control Valve) 111 and a gas supply source 112. The gas supply source 112 is a supply source of an inert gas such as nitrogen gas or a rare gas. The PCV 111 controls the amount of inert gas supplied to the container 201 so that the pressure inside the container 201 becomes a predetermined pressure. The PCV 111 is controlled by a control unit 132 in the control device 130.

[0021] A plurality of ports 105 are provided on the side of the atmospheric transfer chamber 103 for attaching a carrier (FOUP or the like) C that accommodates a substrate W. An alignment chamber 104 for aligning the substrate W is provided inside the atmospheric transfer chamber 103. A transfer device 106 such as a robot arm is also provided inside the atmospheric transfer chamber 103. The transfer device 106 transfers the substrate W between the carrier C, the load lock chamber 102, and the alignment chamber 104. A downflow of low-humidity dry air is formed inside the atmospheric transfer chamber 103.

[0022] The control device 130 has a memory, a processor, and an input / output interface. The memory stores a program executed by the processor and a recipe including conditions for each process. The processor executes the program read from the memory, and controls each part of the film forming system 100 via the input / output interface based on the recipe stored in the memory.

[0023] The processor of the control device 130 executes a program read from the memory to realize the functions of the determination unit 131 and the control unit 132. The determination unit 131 determines the dew point temperature T d The dew point temperature T d is a predetermined first temperature T d1 It is judged whether the dew point temperature T d is the first temperature Td1 When it becomes equal to or smaller than this, the control unit 132 is notified of this.

[0024] In addition, the determination unit 131 determines the dew point temperature T d is the first temperature T d1 After notifying the control unit 132 that the dew point temperature T d Then, the determination unit 131 obtains the dew-point temperature T d A second temperature T d2 Determine whether the dew point temperature T d is the second temperature T d2 If the second temperature T d2 is the first temperature T d1 In another embodiment, the first temperature T d1 and the second temperature T d2 may be the same temperature.

[0025] The control unit 132 controls each unit of the film forming system 100. For example, the control unit 132 controls the PCV 111, the TMP 121, the DP 122, the valve 123, the valve 124, the valve 125, the heater 203, the gate valve G1, and the gate valve G2 in response to a notification from the determination unit 131. Details of the control by the control unit 132 will be described in a flowchart to be described later.

[0026] [Preparation before starting the process] 3 is a flowchart showing an example of control of the vacuum transfer device 200 before the start of a process. For example, when the inside of the vacuum transfer device 200 is released to the atmosphere and then sealed due to setup, maintenance, etc., the control device 130 starts the process shown in this flowchart.

[0027] First, the control unit 132 starts supplying power to each heater 203, thereby causing the heaters 203 to start heating the container 201 (S100).

[0028] Next, the control unit 132 starts evacuation by the TMP 121 and the DP 122 (S101). In step S101, the control unit 132 controls the valve 123 to a closed state, controls the valves 124 and 125 to an open state, and operates the TMP 121 and the DP 122. As a result, the gas in the container 201 is evacuated, and the pressure P in the container 201 decreases.

[0029] Next, the control unit 132 refers to the measurement value of a pressure gauge (not shown) disposed in the container 201 and checks whether the pressure P in the container 201 is equal to a predetermined first pressure P 1 It is determined whether the first pressure P 1 The pressure P in the container 201 is equal to the first pressure P 1 If it is higher (S102: No), the process of step S102 is executed again.

[0030] On the other hand, the pressure P in the container 201 is the first pressure P 1 If the pressure P in the container 201 is equal to or lower than the predetermined second pressure P (S102: Yes), the control unit 132 controls the PCV 111 to start supplying the inert gas into the container 201 (S103). 2 The supply amount of the inert gas is controlled so as to satisfy the second pressure P 2 is, for example, a pressure in the range of 1 to 10 Torr.

[0031] Then, the control unit 132 controls the valve 123 to an open state, controls the valve 124 to a closed state, and stops the TMP 121 (S105). By stopping the TMP 121, the power consumption of the vacuum transfer device 200 can be reduced.

[0032] Here, although the container 201 is sealed, a small amount of outside air may enter the container 201 through seal members arranged at the connection between the container 201 and the process chamber 101, or at the connection between the container 201 and the load lock chamber 102, etc. When outside air enters the container 201, some of the water molecules contained in the outside air adhere to the inner surface of the container 201. As a result, even if the gas in the container 201 is exhausted, the amount of moisture in the container 201 may not decrease below a certain level.

[0033] Therefore, in this embodiment, the gas in the container 201 is exhausted and an inert gas is supplied into the container 201. This suppresses adhesion of water molecules contained in the outside air that has entered the container 201 to the inner surface of the container 201. This allows the water molecules contained in the outside air that has entered the container 201 to be quickly exhausted by the exhaust device 120, and the amount of moisture in the container 201 can be further reduced.

[0034] Next, the determination unit 131 determines the dew point temperature T d is the first temperature T d1 It is determined whether the dew point temperature T d is the first temperature T d1 If it is higher (S106: No), the process shown in step S106 is executed again.

[0035] On the other hand, the dew point temperature T d is the first temperature T d1 If it is equal to or lower than the dew-point temperature T d is the first temperature T d1 The control unit 132 is notified that the temperature has reached or below the threshold level. The control unit 132 stops the supply of power to each heater 203, thereby stopping the heating of the container 201 by the heaters 203 (S107). This makes it possible to reduce the power consumption of the vacuum transfer device 200.

[0036] Next, the control unit 132 judges whether or not all the conditions for starting the process are satisfied (S108). The conditions for starting the process include the dew point temperature T d is the first temperature T d1In addition to the following, the pressure adjustment and temperature control in each process chamber 101 must be completed, and the carrier C must be set in the port 105.

[0037] If at least some of the conditions for starting the process are not satisfied (S108: No), the determination unit 131 determines whether the dew-point temperature T d is the second temperature T d2 It is determined whether the dew point temperature T d is the second temperature T d2 If it is less than the predetermined value (S109: No), the process in step S108 is executed again.

[0038] On the other hand, the dew point temperature T d is the second temperature T d2 If it is equal to or higher than the dew-point temperature T d is the second temperature T d2 The control unit 132 is notified that the dew-point temperature T d is the second temperature T d2 If the temperature exceeds the dew point temperature T , it is considered that the amount of intrusion of outside air has increased due to some cause such as weakening of the sealing property of the sealing member that maintains the airtightness of the container 201. Therefore, the control unit 132 notifies the user of the film forming system 100 of the error (S110). The control unit 132 displays the dew point temperature T d is the second temperature T d2 By displaying a message indicating that the above has occurred, the controller 130 notifies the user of the film forming system 100 of the error. Then, the controller 130 ends the process shown in this flowchart.

[0039] On the other hand, if all the conditions for starting the process are satisfied (S108: Yes), the control unit 132 notifies the user of the film forming system 100 that the process can be executed by displaying, for example, on a display device (not shown) that the process is ready to start (S111). Then, the control device 130 ends the process shown in this flowchart.

[0040] [Control of the vacuum transfer device 200 during process execution] 4 is a flowchart showing an example of control of the vacuum transfer device 200 when opening the gate valve G1 between the process chamber 101 and the vacuum transfer device 200 when a process in one process chamber 101 is completed. For example, when execution of a specific process on a substrate W in one process chamber 101 is completed, the control device 130 starts the processing shown in this flowchart.

[0041] First, the control unit 132 controls the PCV 111 to increase the pressure P inside the container 201 (S200). Then, the control unit 132 refers to the measurement value of a pressure gauge (not shown) disposed inside the container 201 and checks whether the pressure inside the container 201 reaches a predetermined third pressure P 3 It is determined whether the third pressure P 3 is a pressure higher than the pressure in the process chamber 101 and lower than atmospheric pressure. 3 If it is less than the predetermined value (S201: No), the process in step S201 is executed again.

[0042] On the other hand, the pressure in the container 201 is a third pressure P 3 If this is the case (S201: Yes), the control unit 132 controls the gate valve G1 between the process chamber 101 in which the specific process has been completed and the container 201 to an open state, thereby opening the gate valve G1 (S202). Then, the control unit 132 controls the transfer device 202 to unload the substrate W from the process chamber 101 (S203). Then, the control unit 132 controls the gate valve G1 between the process chamber 101 and the container 201 to a closed state, thereby closing the gate valve G1 (S204).

[0043] As described above, in this embodiment, the control unit 132 controls the pressure in the container 201 to be higher than the pressure in the process chamber 101 before opening the gate valve G1. This prevents particles, residual gas, and the like in the process chamber 101 from entering the container 201 when the gate valve G1 is opened. This prevents particles generated in the process chamber 101 from entering another process chamber 101 via the container 201.

[0044] Next, a gate valve between the container 201 and an apparatus to which the substrate W is to be transferred is controlled to an open state, thereby opening the gate valve (S205). In step S205, when another process is performed on the substrate W by another process chamber 101, a gate valve G1 between the container 201 and the other process chamber 101 is opened. In addition, when the substrate W is accommodated in the carrier C, a gate valve G2 between the load lock chamber 102 and the container 201 is opened.

[0045] Then, the control unit 132 controls the transfer device 202 to load the substrate W into another process chamber 101 or the load lock chamber 102 (S206). Then, the control unit 132 closes the gate valve (S207).

[0046] Next, the control unit 132 controls the PCV 111 to adjust the pressure P in the container 201 to a predetermined second pressure P 2 The supply amount of the inert gas is controlled so as to satisfy the above condition (S208). Then, the control device 130 ends the process shown in this flowchart.

[0047] An embodiment has been described above. As described above, the vacuum transfer device 200 in this embodiment is disposed between the process chamber 101 and the load lock chamber 102, and transfers the substrate W between the process chamber 101 and the load lock chamber 102. The vacuum transfer device 200 includes a container 201, a transfer device 202, an exhaust device 120, a dew point meter 204, and a control device 130. The container 201 is connected to each of the process chamber 101 and the load lock chamber 102 via gate valves (G1, G2). The transfer device 202 is provided in the container 201, and transfers the substrate W between the process chamber 101 and the load lock chamber 102. The exhaust device 120 exhausts gas from within the container 201. The dew point meter 204 measures the dew point temperature of the gas within the container 201. The control device 130 determines whether or not a process can be executed based on the dew point temperature measured by the dew point meter 204, and when the process can be executed, notifies the user of the vacuum transfer device 200 of the state. In this way, the vacuum transfer device 200 can reduce moisture adhering to the substrate W.

[0048] In the above embodiment, the control device 130 includes a determination unit 131 and a control unit 132. The determination unit 131 determines the dew point temperature T d A first temperature T d1 The control unit 132 judges whether the dew-point temperature T d is the first temperature T d1 When all of a plurality of predetermined conditions are satisfied, one of which is that it is determined that the following has occurred: When the plurality of predetermined conditions are satisfied, the user of the vacuum transfer apparatus 200 is notified that the process can be executed. In this way, the vacuum transfer apparatus 200 can reduce moisture adhering to the substrate W.

[0049] In the above embodiment, the control unit 132 controls the dew-point temperature T d A second temperature T d2If it is determined that the dew point temperature T d This can prevent the substrate W from passing through the container 201 in a high pressure state.

[0050] In the above embodiment, the container 201 is provided with a heater 203 for heating the inner wall surface of the container 201. After the inside of the container 201 is opened to the atmosphere and then sealed again, the control unit 132 supplies power to the heater 203 to heat the inner wall surface of the container 201. This allows water molecules adhering to the inner wall surface of the container 201 to be quickly detached, and the moisture in the container 201 to be quickly reduced.

[0051] In the above embodiment, the control unit 132 determines the dew point temperature T d is the first temperature T d1 If it is determined that the temperature is below the predetermined temperature, the supply of power to the heater 203 is stopped, thereby stopping the heating of the inner wall surface of the container 201 by the heater 203. This makes it possible to reduce the power consumption of the vacuum transfer device 200.

[0052] Moreover, the vacuum transfer device 200 in the above embodiment further includes a gas supply device 110 that supplies an inert gas into the container 201. This prevents water molecules contained in the outside air that has entered the container 201 through a sealing member or the like from adhering to the inner surface of the container 201.

[0053] In the above embodiment, the gas supply device 110 includes the PCV 111, and the exhaust device 120 includes the TMP 121 and the DP 122. The control unit 132 exhausts the gas in the container 201 by operating the TMP 121 and the DP 122. The control unit 132 then controls the pressure P in the container 201 to be equal to a predetermined first pressure P 1 When the pressure in the container 201 becomes equal to or lower than the first pressure P 1A second pressure P 2 This controls the PCV 111 so that the moisture in the container 201 can be rapidly reduced, and the power consumption of the vacuum transfer device 200 can be reduced.

[0054] Furthermore, in the above-described embodiment, the control unit 132 controls the PCV 111 so that the pressure in the container 201 becomes higher than the pressure in the process chamber 101 before the gate valve G1 between the process chamber 101 and the container 201 is opened. This prevents particles, residual gas, and the like in the process chamber 101 from entering the container 201 when the gate valve G1 between the process chamber 101 and the container 201 is opened.

[0055] In addition, the control method of the vacuum transfer device 200 in this embodiment is to determine the dew point temperature T of the gas in the container 201 measured by a dew point meter 204 provided in the container 201 after the container 201 is opened to the atmosphere and then sealed again. d is a predetermined first temperature T d1 a step of determining whether the dew point temperature T d is the first temperature T d1 and notifying a user of the vacuum transfer device that a process can be executed when all of a plurality of predetermined conditions are satisfied, the conditions including one of which is that it is determined that the following has occurred: In this way, the vacuum transfer device 200 can reduce moisture adhering to the substrate W.

[0056] [others] It should be noted that the technology disclosed in the present application is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist thereof.

[0057] For example, in the above embodiment, the dew point temperature T measured by the dew point meter 204 provided in the container 201 is dWhether or not the process can be executed is determined based on the temperature T , but the disclosed technology is not limited to this. For example, an oxygen concentration meter that measures the concentration of oxygen contained in the gas in the container 201 is provided in the container 201, and the dew point temperature T d Based on the oxygen concentration, it may be determined whether or not a process can be performed.

[0058] For example, the dew point temperature T of the gas in the container 201 d is the first temperature T d1 If the oxygen concentration of the gas in the container 201 is equal to or lower than the first concentration, it may be determined that one of the conditions for starting the process is satisfied. d is the second temperature T d2 If the oxygen concentration in the gas in the container 201 becomes higher than the second concentration, or if the oxygen concentration in the gas in the container 201 becomes higher than the second concentration, an error may be notified to a user of the film forming system 100 and the process may be interrupted. This also suppresses oxidation of the substrate W due to oxygen remaining in the vacuum transfer device 200.

[0059] In the above embodiment, the description has been focused on the management of the dew point temperature of the gas inside the container 201 when the container 201 of the vacuum transfer device 200 is sealed after being exposed to the atmosphere due to setup, maintenance, etc., but the disclosed technology is not limited to this. For example, the dew point temperature inside the container 201 may be managed even during execution of a process on the substrate W.

[0060] 5 is a flowchart showing an example of a method for managing the dew point temperature in the container 201 during the execution of a process. For example, when a process is started, the control device 130 starts the processing shown in this flowchart.

[0061] First, the determination unit 131 of the control device 130 determines the dew point temperature T d Based on the dew point temperature T d A third temperature T d3 It is determined whether the third temperature Td3 is, for example, the second temperature T d2 Same as or a second temperature T d2 The dew point temperature T d is the third temperature T d3 If it is lower (S300: No), the process shown in step S300 is executed again.

[0062] On the other hand, the dew point temperature T d is the third temperature T d3 If it is equal to or higher than the dew-point temperature T d is the third temperature T d3 The control unit 132 is notified that this has been reached. The control unit 132 suspends removal of the substrates W included in the new lot from the carrier C, and determines whether or not the processing of the substrates W included in the lot being transported and processed has been completed (S301). If the processing of the substrates W included in the lot being processed has not been completed (S301: No), the processing of the substrates W included in the lot being processed continues, and the processing shown in step S300 is executed again.

[0063] On the other hand, when the processing of the substrates W included in the lot being processed is completed (S301: Yes), the controller 130 executes the processing of steps S100 to S107 described with reference to FIG. d is again the first temperature T d1 The controller 130 then resumes removing the substrates W contained in the next lot from the carrier C, and resumes the process on the substrates W (S302). Then, the process shown in step S300 is executed again.

[0064] This makes it possible to keep the moisture adhering to the substrate W low even after the process for the substrate W is started. In step S301, the end of the process is determined for each lot, but the end of the process may be determined for each substrate W. That is, in step S300, the dew-point temperature T d is the third temperature T d3If it is determined that the dew point temperature T 1 of the gas in the container 201 has reached or exceeded the dew point temperature T 2 , removal of a new substrate W from the carrier C may be suspended even if it is from the same lot as the substrate W being transported or processed. In this way, even if it is in the middle of a lot, as soon as the processing of the substrate W being transported or processed is completed, the dew point temperature T 2 of the gas in the container 201 may be suspended. d The first temperature T d1 The following can be quickly restored:

[0065] It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be construed as limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0066] C Career G1 Gate Valve G2 Gate Valve G3 Gate Valve W substrate 100 Film Deposition System 101 Process chamber 102 Load lock chamber 103 Atmospheric Transport Chamber 104 Alignment Room 105 Port 106 Transport Equipment 110 Gas supply equipment 111 PCV 112 Gas supply source 113 Piping 120 Exhaust system 121 TMP 122DP 123 Valve 124 Valve 125 Valve 126 Piping 127 Piping 130 Control device 131 Judgment section 132 Control section 200 Vacuum transport device 201 Container 202 Transport device 203 Heater 204 Dew point meter

Claims

1. A vacuum transfer apparatus disposed between a process chamber and a load lock chamber for transferring a substrate between the process chamber and the load lock chamber, comprising: a container connected to each of the process chamber and the load lock chamber via a gate valve; a transport device provided within the container for transporting substrates between the process chamber and the load lock chamber; an exhaust device for exhausting gas from within the container; a dew point meter for measuring a dew point temperature of the gas in the container; a control device that determines whether or not a processing process for the substrate can be performed based on the dew point temperature measured by the dew point meter after the exhaust processing of the inside of the container; A vacuum conveying device comprising:

2. The control device includes: a determination unit that determines whether or not the dew-point temperature has become equal to or lower than a predetermined first temperature after the container is opened to the atmosphere and then sealed again; a control unit that determines that a treatment process for the substrate is in a state in which it is possible to perform the treatment process when a plurality of predetermined conditions are satisfied, the condition including one of the conditions being that the dew-point temperature is determined by the determination unit to be equal to or lower than the first temperature; 2. The vacuum transport apparatus of claim 1, further comprising:

3. The control unit is The vacuum transport device of claim 2, wherein when the determination unit determines that the dew point temperature has reached or exceeded a predetermined second temperature while the substrate is being processed by the process chamber, an error is notified to a user of the vacuum transport device.

4. The container is provided with a heater that heats an inner wall surface of the container, The control unit is 4. The vacuum transfer apparatus according to claim 2, wherein the wall surface is heated by supplying electric power to the heater after the inside of the container is opened to the atmosphere and then sealed again.

5. The control unit is The vacuum conveying device according to claim 4, wherein when the judgment unit judges that the dew point temperature has become equal to or lower than the first temperature, the supply of power to the heater is stopped to stop the heater from heating the wall surface.

6. 6. The vacuum transfer apparatus according to claim 2, further comprising a gas supply device for supplying an inert gas into the container.

7. The gas supply device has a pressure control valve, the exhaust device includes a first pump and a second pump; The control unit is 7. The vacuum transfer device according to claim 6, further comprising: a pressure control valve that controls a pressure in the container to a second pressure higher than the first pressure while the second pump is operating, and that controls the pressure control valve to stop the first pump when the pressure in the container becomes equal to or lower than a predetermined first pressure and that controls the pressure in the container to a second pressure higher than the first pressure, while the second pump is operating.

8. The control unit is 8. The vacuum transfer apparatus according to claim 6, further comprising a pressure control valve that controls a pressure in the vessel to be higher than a pressure in the process chamber before a gate valve between the process chamber and the vessel is opened.

9. a container disposed between the process chamber and the load lock chamber; a transport device provided within the container for transporting substrates between the process chamber and the load lock chamber; an exhaust device for exhausting gas from within the container; A method for controlling a vacuum conveying apparatus comprising: a step of exhausting the inside of the container by the exhaust device; After the exhaust process in the container, acquiring a dew point temperature of the gas in the container measured by a dew point meter provided in the container; determining whether or not a treatment process for the substrate can be performed based on the dew point temperature; A method for controlling a vacuum transport device comprising:

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