PCB Connector

Abstract

The present invention relates to a board connector including a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the RF contacts; a plurality of transmission contacts coupled to the insulating portion; a ground housing to which the insulating portion is coupled; a first ground contact coupled to the insulating portion and providing shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact coupled to the insulating portion and providing shielding between a second RF contact and the transmission contact among the RF contacts, wherein the first ground contact provides shielding between the first RF contact and the transmission contacts based on a first axial direction and also provides shielding between the first RF contact and the transmission contacts based on a second axial direction perpendicular to the first axial direction.

Description

[Technical field]

[0001] The present invention relates to a board connector that is installed in an electronic device for electrical connection between boards. [Background technology]

[0002] A connector is provided in various electronic devices for electrical connection. For example, connectors are installed in electronic devices such as mobile phones, computers, tablet computers, etc., and can electrically connect various components installed in the electronic devices to each other.

[0003] Generally, RF connectors and board to board connectors (hereinafter referred to as "board connectors") are installed inside wireless communication devices such as smartphones and tablet PCs among electronic devices. RF connectors transmit RF (Radio Frequency) signals. Board connectors process digital signals such as those of cameras.

[0004] These RF connectors and board connectors are mounted on a PCB (Printed Circuit Board). Previously, many board connectors and RF connectors were mounted along with many components in the limited PCB space, which caused a problem of a large PCB mounting area. Therefore, with the trend toward smaller smartphones, there is a need for technology that can integrate RF connectors and board connectors to optimize the PCB mounting area to a smaller one.

[0005] FIG. 1 is a schematic perspective view of a board connector according to the prior art.

[0006] Referring to FIG. 1, a prior art board connector 100 includes a first connector 110 and a second connector 120 .

[0007] The first connector 110 is intended to be coupled to a first substrate (not shown) and may be electrically connected to the second connector 120 through a plurality of first contacts 111.

[0008] The second connector 120 is intended to be coupled to a second substrate (not shown) and may be electrically connected to the first connector 110 through a plurality of second contacts 121.

[0009] The conventional board connector 100 can electrically connect the first board and the second board by connecting the first contact 111 and the second contact 121 to each other. In addition, when some of the first contact 111 and the second contact 121 are used as RF contacts for transmitting RF signals, the conventional board connector 100 can be embodied such that the RF signal is transmitted between the first board and the second board through the RF contacts.

[0010] Here, the board connector 100 according to the conventional technology has the following problems.

[0011] First, in the conventional board connector 100, when the contacts spaced relatively closely among the contacts 111, 121 are used as the RF contacts, there is a problem that signal transmission is not smooth due to RF signal interference between the RF contacts 111', 111", 121', 121".

[0012] Secondly, the conventional board connector 100 has an RF signal shielding portion 112 at the outermost portion of the connector, and therefore, although it can block the external radiation of RF signals, it has a problem in that it does not shield between RF signals.

[0013] Thirdly, in the conventional board connector 100, the RF contacts 111', 111", 121', 121" each include mounting portions 111a', 111a", 121a', 121a" that are mounted on the board, but the mounting portions 111a', 111a", 121a', 121a" are arranged so as to be exposed to the outside. As a result, the conventional board connector 100 has a problem in that the mounting portions 111a', 111a", 121a', 121a" are not shielded. Summary of the Invention [Problem to be solved by the invention]

[0014] The present invention has been devised to solve the problems described above, and aims to provide a board connector that can reduce the possibility of RF signal interference occurring between RF contacts. [Means for solving the problem]

[0015] In order to solve the above problems, the present invention may include the following configurations.

[0016] The board connector according to the present invention may include a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the RF contacts; a plurality of transmission contacts coupled to the insulating portion; a ground housing to which the insulating portion is coupled; a first ground contact coupled to the insulating portion and providing shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact coupled to the insulating portion and providing shielding between a second RF contact and the transmission contact among the RF contacts. The first ground contact may include a first shielding member that provides shielding between the first RF contact and the transmission contact based on a first axial direction and provides shielding between the first RF contact and the transmission contact based on a second axial direction perpendicular to the first axial direction.

[0017] The board connector according to the present invention may include a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating part supporting the RF contacts; a plurality of transmission contacts coupled to the insulating part; a ground housing coupled to the insulating part; a first ground contact coupled to the insulating part and providing shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact coupled to the insulating part and providing shielding between a second RF contact and the transmission contact among the RF contacts. The first and second ground contacts may be formed with ground arms that are connected to ground contacts of a mating connector and move elastically. Effect of the Invention

[0018] According to the present invention, the following effects can be achieved.

[0019] The present invention can realize a shielding function of signals, electromagnetic waves, etc. for RF contacts by using a ground housing and a ground contact. Accordingly, the present invention can prevent electromagnetic waves generated from the RF contacts from interfering with signals of circuit components located nearby in electronic devices, and can prevent electromagnetic waves generated from circuit components located nearby in electronic devices from interfering with RF signals transmitted by the RF contacts. Therefore, the present invention can contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using a ground housing and a ground contact.

[0020] The present invention can be embodied in such a way that the first RF contact and the second RF contact are arranged asymmetrically with respect to the first axial direction and the second axial direction, thereby reducing the possibility of RF signal interference between the RF contacts and reducing the size thereof. [Brief description of the drawings]

[0021] [Figure 1]FIG. 1 is a schematic perspective view of a board connector according to the prior art;

[0022] [Diagram 2] 1 is a schematic perspective view of a receptacle connector and a plug connector in a board connector according to the present invention;

[0023] [Diagram 3] 1 is a schematic perspective view of a board connector according to a first embodiment. FIG.

[0024] [Figure 4] 1 is a schematic exploded perspective view of a board connector according to a first embodiment of the present invention;

[0025] [Diagram 5] FIG. 2 is a conceptual plan view for explaining a ground loop in the board connector according to the first embodiment.

[0026] [Figure 6] 1 is a schematic perspective view of a first ground contact and a second ground contact in a board connector according to a first embodiment of the present invention;

[0027] [Figure 7] FIG. 2 is a conceptual plan view for explaining a shielding distance in the board connector according to the first embodiment.

[0028] [Figure 8] FIG. 1 is a schematic plan view of a board connector according to a first embodiment.

[0029] [Figure 9] 9 is a schematic cross-sectional side view taken along line II in FIG. 8, showing a state in which the board connector according to the first embodiment and the board connector according to the second embodiment are coupled together.

[0030] [Figure 10] FIG. 11 is a schematic perspective view of a board connector according to a second embodiment.

[0031] [Figure 11] FIG. 11 is a schematic exploded perspective view of a board connector according to a second embodiment.

[0032] [Figure 12] FIG. 11 is a conceptual plan view for explaining a ground loop in the board connector according to the second embodiment.

[0033] [Figure 13] 13 is a schematic perspective view of a first ground contact and a second ground contact in a board connector according to a second embodiment of the present invention. FIG.

[0034] [Figure 14] 1 is a schematic perspective view showing a state in which a ground contact of a board connector according to a first embodiment and a ground contact of a board connector according to a second embodiment are disassembled. FIG.

[0035] [Figure 15] 1 is a schematic cross-sectional view showing a state in which a ground contact of a board connector according to a first embodiment and a ground contact of a board connector according to a second embodiment are coupled to each other.

[0036] [Figure 16] 11 is a schematic cross-sectional view showing a state in which a first ground arm of a board connector according to a second embodiment is connected to a first ground protrusion according to the first embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] Hereinafter, an embodiment of the board connector according to the present invention will be described in detail with reference to the accompanying drawings. Fig. 8 shows the connector according to the first embodiment coupled to the connector according to the second embodiment along the direction shown in Fig. 3.

[0038] Referring to FIG. 2, the board connector 1 according to the present invention may be installed in an electronic device (not shown) such as a mobile phone, a computer, a tablet computer, etc. The board connector 1 according to the present invention may be used to electrically connect a plurality of boards (not shown). The board may be a printed circuit board (PCB). For example, when electrically connecting a first board and a second board, a receptacle connector mounted on the first board and a plug connector mounted on the second board may be connected to each other. Accordingly, the first board and the second board may be electrically connected through the receptacle connector and the plug connector. The plug connector mounted on the first board and the receptacle connector mounted on the second board may be connected to each other.

[0039] The board connector 1 according to the present invention may be embodied as the receptacle connector. The board connector 1 according to the present invention may be embodied as the plug connector. The board connector 1 according to the present invention may be embodied including both the receptacle connector and the plug connector.

[0040] Hereinafter, an embodiment in which the board connector 1 according to the present invention is embodied as the receptacle connector is defined as the board connector 200 according to a first embodiment, and an embodiment in which the board connector 1 according to the present invention is embodied as the plug connector is defined as the board connector 300 according to a second embodiment, and will be described in detail with reference to the accompanying drawings. Also, the description will be based on an embodiment in which the board connector 200 according to the first embodiment is mounted on the first board, and the board connector 300 according to the second embodiment is mounted on the second board. It will be obvious to one skilled in the art to which the present invention pertains that an embodiment in which the board connector 1 according to the present invention includes both the receptacle connector and the plug connector can be derived from this.

[0041]

[0042] <Board connector 200 according to the first embodiment>

[0043] 2 to 4, the board connector 200 according to the first embodiment may include a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground housing 230, and an insulating portion 240.

[0044] The RF contact 210 is for transmitting a radio frequency (RF) signal. The RF contact 210 can transmit a very high frequency RF signal. The RF contact 210 may be supported by the insulating part 240. The RF contact 210 may be coupled to the insulating part 240 through an assembly process. The RF contact 210 may be molded integrally with the insulating part 240 through injection molding.

[0045] 2 to 5, the RF contacts 210 may be disposed spaced apart from each other. The RF contacts 210 may be mounted on the first board, thereby being electrically connected to the first board. The RF contacts 210 may be connected to RF contacts of the mating connector, thereby being electrically connected to the second board on which the mating connector is mounted. Accordingly, the first board and the second board may be electrically connected. When the board connector 200 according to the first embodiment is a receptacle connector, the mating connector may be a plug connector. When the board connector 200 according to the first embodiment is a plug connector, the mating connector may be a receptacle connector.

[0046] A first RF contact 211 of the RF contacts 210 and a second RF contact 212 of the RF contacts 210 may be spaced apart from each other along a first axis direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be supported by the insulating part 240 at positions spaced apart from each other along the first axis direction (X-axis direction).

[0047] The first RF contact 211 of the RF contacts 210 and the second RF contact 212 of the RF contacts 210 may be spaced apart from each other along a second axis direction (Y axis direction) perpendicular to the first axis direction (X axis direction). The first RF contact 211 and the second RF contact 212 may be supported by the insulating part 240 at positions spaced apart from each other along the second axis direction (Y axis direction). In this case, the first ground contact may include a first shielding member that shields the first RF contact and the transmission contact with respect to the first axis direction and also shields the first RF contact and the transmission contact with respect to a second axis direction perpendicular to the first axis direction. Accordingly, the transmission contact 220 may be disposed in a space that separates the first RF contact 211 and the second RF contact 212 in order to reduce interference of RF signals between the first RF contact 211 and the second RF contact 212. Therefore, the board connector 200 according to the first embodiment can reduce RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212, and can improve space utilization for the insulating part 240 by arranging the transmission contact 220 in the space for this purpose. The first RF contact 211 and the second RF contact 212 can be positioned diagonally from each other by arranging the first RF contact 211 and the second RF contact 212 to be spaced apart from each other in both the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). In this case, the distance between the RF contacts 210 can be secured compared to the case where the first RF contact 211 and the second RF contact 212 are arranged on a straight line. Therefore, the possibility of RF signal interference between the RF contacts 210 can be reduced, and the board connector 200 according to the first embodiment can be implemented to be compact in size. The first RF contact 211 and the second RF contact 212 may be spaced apart based on a first axis direction (X-axis direction) and may be arranged in non-opposing positions spaced apart based on a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction).In this case, the first RF contact 211 and the second RF contact 212 may be spaced apart based on the first axis direction (X-axis direction) and may be arranged at asymmetric positions spaced apart based on the second axis direction (Y-axis direction).

[0048] The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first board. Accordingly, the first RF contact 211 may be electrically connected to the first board through the first RF mounting member 2111. The first RF contact 211 may be made of an electrically conductive material. For example, the first RF contact 211 may be made of a metal. The first RF contact 211 may be connected to one of the RF contacts of the mating connector.

[0049] The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first board. Accordingly, the second RF contact 212 may be electrically connected to the first board through the second RF mounting member 2121. The second RF contact 212 may be made of an electrically conductive material. For example, the second RF contact 212 may be made of a metal. The second RF contact 212 may be connected to one of the RF contacts of the mating connector.

[0050] 2 to 5, the transmission contact 220 is coupled to the insulating part 240. The transmission contact 220 may have a function of transmitting a signal, data, power, etc. The transmission contact 220 may be coupled to the insulating part 240 through an assembly process. The transmission contact 220 may be molded integrally with the insulating part 240 through injection molding.

[0051] The transmission contacts 220 may be spaced apart from each other. The transmission contacts 220 may be mounted on the first board, thereby being electrically connected to the first board. In this case, a transmission mounting member 2201 of each of the transmission contacts 220 may be mounted on the first board. The transmission contacts 220 may be made of a material having electrical conductivity. For example, the transmission contacts 220 may be made of a metal. The transmission contacts 220 may be connected to a transmission contact of the mating connector, thereby being electrically connected to the second board on which the mating connector is mounted. Accordingly, the first board and the second board may be electrically connected to each other.

[0052] 2 to 5, the transmission contact 220 may include a first transmission contact 221 and a second transmission contact 222.

[0053] The first transmission contact 221 may be disposed apart from the second RF contact 212 based on the first axis direction (X-axis direction). The second transmission contact 222 may be disposed apart from the first RF contact 211 based on the first axis direction (X-axis direction). The first transmission contact 221 and the second transmission contact 222 may be disposed apart from each other along the second axis direction (Y-axis direction). In this case, a part of the first transmission contact 221 and a part of the second transmission contact 222 may be disposed to overlap only partially based on the second axis direction (Y-axis direction). For example, a part of the first transmission contact 221 and a part of the second transmission contact 222 may be disposed to face each other at a position separated from each other based on the second axis direction (Y-axis direction). The first transmission contacts 221 may be disposed apart from each other along the first axis direction (X-axis direction). The second transmission contacts 322 may be disposed apart from each other along the first axis direction (X-axis direction).

[0054] The first transmission contact 221 may include a 1-1 transmission contact 221a, a 1-2 transmission contact 221b, and a 1-3 transmission contact 221c.

[0055] The 1-1 transmission contact 221a, the 1-2 transmission contact 221b, and the 1-3 transmission contact 221c may be arranged to be spaced apart from the second RF contact 212 based on the first axial direction (X-axis direction). In this case, the 1-1 transmission contact 221a may be arranged to be spaced apart from the second RF contact 212 at the furthest distance based on the first axial direction (X-axis direction). The 1-2 transmission contact 221b may be arranged to be spaced apart at a distance shorter than the distance by which the 1-1 transmission contact 221a is spaced apart from the second RF contact 212 based on the first axial direction (X-axis direction). The 1-3 transmission contact 221c may be arranged to be spaced apart at a distance shorter than the distance by which the 1-2 transmission contact 221b is spaced apart from the second RF contact 212 based on the first axial direction (X-axis direction). The 1-2 transmission contact 221b may be disposed between the 1-1 transmission contact 221a and the 1-3 transmission contact 221c with respect to the first axis direction (X-axis direction). The 1-3 transmission contact 221c may be disposed between the 1-2 transmission contact 221b and the second RF contact 212 with respect to the first axis direction (X-axis direction).

[0056] Also, at least one of the first transmission contacts 221 may be arranged to overlap the first RF contact 211 with respect to the second axis direction (Y axis direction). In this case, the 1-1 transmission contact 221a may be arranged to overlap the first RF contact 211 with respect to the second axis direction (Y axis direction). For example, at least one of the first transmission contacts 221 may be arranged to face the first RF contact 211 with respect to the second axis direction (Y axis direction). In this case, the 1-1 transmission contact 221a may be arranged to face the first RF contact 211 with respect to the second axis direction (Y axis direction). Therefore, the board connector 200 according to the first embodiment may be embodied to be miniaturized in size along the first axis direction (X axis direction).

[0057] The second transmission contact 222 may include a 2-1 transmission contact 222a, a 2-2 transmission contact 222b, and a 2-3 transmission contact 222c.

[0058] The 2-1 transmission contact 222a, the 2-2 transmission contact 222b, and the 2-3 transmission contact 222c may be arranged to be spaced apart from the first RF contact 211 based on the first axial direction (X-axis direction). In this case, the 2-1 transmission contact 222a may be arranged to be spaced apart from the first RF contact 211 at the furthest distance based on the first axial direction (X-axis direction). The 2-2 transmission contact 222b may be arranged to be spaced apart at a distance shorter than the distance the 2-1 transmission contact 222a is spaced from the first RF contact 211 based on the first axial direction (X-axis direction). The 2-3 transmission contact 222c may be arranged to be spaced apart at a distance shorter than the distance the 2-2 transmission contact 222b is spaced from the first RF contact 211 based on the first axial direction (X-axis direction). The 2-2 transmission contact 222b may be disposed between the 2-1 transmission contact 222a and the 2-3 transmission contact 222c with respect to the first axial direction (X-axis direction). The 2-3 transmission contact 222c may be disposed between the 2-2 transmission contact 222b and the first RF contact 211 with respect to the first axial direction (X-axis direction).

[0059] Also, at least one of the second transmission contacts 222 may be arranged to overlap the second RF contact 212 based on the second axial direction (Y-axis direction). In this case, the 2-1 transmission contact 222a may be arranged to overlap the second RF contact 212 based on the second axial direction (Y-axis direction). For example, at least one of the second transmission contacts 222 may be arranged to face the second RF contact 212 based on the second axial direction (Y-axis direction). In this case, the 2-1 transmission contact 222a may be arranged to face the second RF contact 212 based on the second axial direction (Y-axis direction). Therefore, the board connector 200 according to the first embodiment may be embodied to be miniaturized in size along the first axial direction (X-axis direction).

[0060] Meanwhile, at least one of the first transmission contacts 221 may overlap with at least one of the second transmission contacts 222 along the second axis direction (Y axis direction). In this case, the 1-3 transmission contact 221c and the 2-3 transmission contact 222c may be arranged to overlap with each other along the second axis direction (Y axis direction). For example, at least one of the first transmission contacts 221 may face at least one of the second transmission contacts 222 along the second axis direction (Y axis direction). In this case, the 1-3 transmission contact 221c and the 2-3 transmission contact 222c may be arranged to face each other along the second axis direction (Y axis direction). That is, at least one of the first transmission contacts 221 may be arranged not to overlap with at least one of the second transmission contacts 222 along the second axis direction (Y axis direction). For example, at least one of the first transmission contacts 221 may be arranged not to face with at least one of the second transmission contacts 222 along the second axis direction (Y axis direction). Therefore, the board connector 200 of the first embodiment can reduce RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212, and can also improve space utilization for the insulating part 240 by arranging the transmission contact 220 in the space provided for this purpose.

[0061] Meanwhile, in Figures 2 to 5, the board connector 200 according to the first embodiment is illustrated as including three first transmission contacts 221 embodied as the 1-1 transmission contact 221a, the 1-2 transmission contact 221b, and the 1-3 transmission contact 221c, and three second transmission contacts 222 embodied as the 2-1 transmission contact 222a, the 2-2 transmission contact 222b, and the 2-3 transmission contact 222c, but is not limited thereto, and the board connector according to the first embodiment may include four or more first transmission contacts 221 and second transmission contacts 222, respectively.

[0062] 2 to 5, the ground housing 230 is combined with the insulating part 240. The ground housing 230 may be grounded by being mounted on the first board. Accordingly, the ground housing 230 may implement a shielding function for signals, electromagnetic waves, etc. for the RF contact 210. In this case, the ground housing 230 may prevent electromagnetic waves generated from the RF contact 210 from interfering with signals of circuit components located nearby in the electronic device, and may prevent electromagnetic waves generated from circuit components located nearby in the electronic device from interfering with RF signals transmitted by the RF contact 210. Accordingly, the board connector 200 according to the first embodiment may contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using the ground housing 230. The ground housing 230 may be made of a material having electrical conductivity. For example, the ground housing 230 may be made of a metal.

[0063] The ground housing 230 may be disposed to surround a side of the inner space 230a. A part of the insulating part 240 may be located in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contact 220 may all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting member 2201 may also all be located in the inner space 230a. Therefore, the ground housing 230 may implement a shielding wall for the first RF contact 211 and the second RF contact 212, thereby enhancing the shielding function for the first RF contact 211 and the second RF contact 212 and implementing complete shielding. The mating connector may be inserted into the inner space 230a.

[0064] The ground housing 230 may be disposed to surround all sides of the inner space 230a. The inner space 230a may be disposed inside the ground housing 230. When the ground housing 230 is formed in the shape of a square ring as a whole, the inner space 230a may be formed in the shape of a rectangular parallelepiped. In this case, the ground housing 230 may be disposed to surround four sides of the inner space 230a.

[0065] The ground housing 230 may be formed as a single unit without any seams. The ground housing 230 may be formed as a single unit without any seams by a metal injection method such as metal die casting, MIM (Metal Injection Molding), etc. The ground housing 230 may be formed as a single unit without any seams by CNC (Computer Numerical Control) processing, MCT (Machining Center Tool) processing, etc.

[0066] 2 to 5, the insulating part 240 supports the RF contact 210. The RF contact 210 and the transmission contact 220 may be coupled to the insulating part 240. The insulating part 240 may be made of an insulating material. The insulating part 240 may be coupled to the ground housing 230 such that the RF contact 210 is positioned in the inner space 230a.

[0067] 2 to 6, the board connector 200 according to the first embodiment may include a first ground contact 250. As shown in FIG.

[0068] The first ground contact 250 is coupled to the insulating part 240. The first ground contact 250 may be grounded by being mounted on the first substrate. The first ground contact 250 may be coupled to the insulating part 240 through an assembly process. The first ground contact 250 may be molded integrally with the insulating part 240 through injection molding.

[0069] The first ground contact 250 may implement a shielding function for the first RF contact 211 together with the ground housing 230. In this case, the first ground contact 250 may be disposed between the first RF contact 211 and the transmission contact 220 based on the first axis direction (X-axis direction). The first ground contact 250 may be made of an electrically conductive material. For example, the first ground contact 250 may be made of a metal. When the mating connector is inserted into the inner space 230a, the first ground contact 250 may be connected to a ground contact of the mating connector.

[0070] 2 to 4, the board connector 200 according to the first embodiment may include a second ground contact 260. As shown in FIG.

[0071] The second ground contact 260 is coupled to the insulating part 240. The second ground contact 260 may be grounded by being mounted on the first substrate. The second ground contact 260 may be coupled to the insulating part 240 through an assembly process. The second ground contact 260 may be molded integrally with the insulating part 240 through injection molding.

[0072] The second ground contact 260 may implement a shielding function for the second RF contact 212 together with the ground housing 230. The second ground contact 260 may be disposed between the transmission contact 220 and the second RF contact 212 with respect to the first axis direction (X-axis direction). The second ground contact 260 may be formed of an electrically conductive material. For example, the second ground contact 260 may be formed of a metal. When the mating connector is inserted into the inner space 230a, the second ground contact 260 may be connected to a ground contact of the mating connector.

[0073] 2 to 9, the first RF contact 211 and the second RF contact 212 may be disposed apart from each other along the first axis direction (X-axis direction). Also, the first RF contact 211 and the second RF contact 212 may be disposed apart from each other along the second axis direction (Y-axis direction). The first RF contact 211 and the second transmission contact 222 may be disposed apart from each other based on the first axis direction (X-axis direction). The second RF contact 212 and the first transmission contact 221 may be disposed apart from each other based on the first axis direction (X-axis direction). In this case, the first ground contact 250 may shield the first RF contact 211 and the first transmission contact 221 based on the second axis direction (X-axis direction) and may shield the first RF contact 211 and the second transmission contact 222 based on the first axis direction (X-axis direction). The second ground contact 260 may provide shielding between the second RF contact 212 and the second transmission contact 222 along the second axis direction (Y-axis direction) and may provide shielding between the second RF contact 212 and the first transmission contact 221 along the first axis direction (X-axis direction).

[0074] In the board connector 200 according to the first embodiment, the first RF contact 211 and the second RF contact 212 may be arranged asymmetrically with respect to the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). In this case, the first ground contact 250 may implement a shielding function between the first RF contact 211 and the transmission contact 220, and may secure a space in the board connector 200. Accordingly, by arranging the transmission contact 220 in the space, the size of the board connector 200 according to the first embodiment may be reduced.

[0075] 2 to 6, the first ground contact 250 may include the first shielding member 251.

[0076] The first shielding member 251 may be located between the first RF contact 211 and the 1-1 transmission contact 221a based on the second axis direction (Y-axis direction). Accordingly, the first RF contact 211 may shield the first RF contact 211 and the 1-1 transmission contact 221a using the first shielding member 251. Accordingly, the first ground contact 250 may prevent interference of signals between the first RF contact 211 and the 1-1 transmission contact 221a using the first shielding member 251. The first shielding member 251 may be formed in a plate shape vertically disposed between the first RF contact 211 and the 1-1 transmission contact 221a.

[0077] The first ground contact 250 may include a first shielding protrusion 252 .

[0078] The first shielding protrusion 252 protrudes from the first shielding member 251. The first shielding protrusion 252 may be connected to the insulator 240. Accordingly, the first ground contact 250 is electrically connected to the insulator 240 through the first shielding protrusion 252, thereby enhancing the shielding performance between the first RF contact 211 and the 1-1 transmission contact 221a and implementing complete shielding. The first shielding protrusion 252 may be formed in a plate shape disposed in the vertical direction. The first shielding protrusion 252 may protrude outside the insulator 240 and be connected to a ground housing of the mating connector.

[0079] The first ground contact 250 may include the first ground connection member 253 and a first ground mounting member 254 .

[0080] The first ground connection member 253 is coupled to the first shielding member 251 and the first ground mounting member 254. The first shielding member 251 and the first ground mounting member 254 may be connected to each other through the first ground connection member 253. The first ground connection member 253 may be connected to a ground contact of a mating connector. Accordingly, the first ground contact 250 may be electrically connected to the ground contact of the mating connector by being connected to the ground contact of the mating connector through the first ground connection member 253. Therefore, the first RF contact 211 and the 1-1 transmission contact 221a, which are spaced apart from each other along the second axis direction (Y axis direction), may be shielded by the first ground contact 250 being connected to the ground contact of the mating connector through the first ground connection member 253. The first shielding member 251 may be coupled to the first ground connection member 253. The first shielding member 251 may protrude from the first ground connection member 253 along the first axis direction (X-axis direction). In this case, the first shielding protrusion 252 may protrude from the first shielding member 251 along the first axis direction (X-axis direction).

[0081] The first ground mounting member 254 is mounted on the first board. The first ground mounting member 254 may be grounded by being mounted on the first board. Accordingly, the first ground contact 250 may be grounded to the first board through the first ground mounting member 254. The first ground mounting member 254 may protrude from the first ground connection member 253 along the second axis direction (Y axis direction). In this case, the first ground mounting member 254 may be disposed between the first RF contact 211 and the first transmission contact 221 based on the first axis direction (X axis direction). The first ground mounting member 254 may protrude from the first ground connection member 253 to a length that allows it to be connected to the ground housing 230 based on the second axis direction (Y axis direction). In this case, the first ground mounting member 254 and the first shielding member 251 may protrude in different directions from the first ground connection member 253 and be connected to different side walls of the ground housing 230. Therefore, in the board connector 200 according to the first embodiment, the first ground contact 250 and the ground housing 230 are electrically connected to each other while surrounding all sides of the first RF contact 211, so that the shielding performance for the first RF contact 211 can be further enhanced to implement complete shielding. The first ground mounting member 254 may be formed in a plate shape arranged in a horizontal direction.

[0082] The first ground contact 250 may include a first ground protrusion 255 .

[0083] The first ground protrusion 255 may protrude from the first shielding member 251. The first ground protrusion 255 may be mounted on the first board. Accordingly, the board connector 200 according to the first embodiment may increase an area in which the first ground contact 250 is mounted on the first board, and thus the shielding performance using the first ground contact 250 may be further enhanced. The first ground protrusion 255 may be mounted on the first board by penetrating the insulating part 240 and protruding from the insulating part 240. The first ground protrusion 255 and the first ground mounting member 254 may be mounted on the board at positions spaced apart from each other. The first ground protrusion 255 may protrude from the first shielding member 251 along the vertical direction. The first ground protrusion 255 may be formed in a plate shape arranged in the vertical direction.

[0084] Meanwhile, as shown in Fig. 7, the first ground protrusion 255 and the first ground protrusion 255 may be mounted at positions spaced apart from each other. Accordingly, since electromagnetic waves generated in the first shielding member 251 may be grounded through the first ground protrusion 255, the shielding performance using the first ground contact 250 may be further enhanced. In this case, since the electromagnetic waves are grounded through the first ground protrusion 255 without bypassing the first ground mounting member 254, the shielding distance of the electromagnetic waves may be shortened in the board connector 200 according to the first embodiment. Therefore, the electromagnetic waves are quickly grounded in the board connector 200 according to the first embodiment, so that the shielding performance of the board connector 200 may be improved.

[0085] For example, as shown in FIG. 7, a path in which the electromagnetic waves generated in the first shielding member 251 are grounded to the board through the first ground protrusion 255 may be defined as a first path A. A path in which the electromagnetic waves generated in the first shielding member are grounded to the board through the first ground connection member 253 and the first ground mounting member 254 may be defined as a second path B. When the first shielding member 251 is formed with the first ground protrusion 255 and grounded to the board, the electromagnetic waves, etc. may be grounded to the first board through the first path A, which is shorter than the second path B, and dissipate. Accordingly, the electromagnetic waves, etc. are quickly dissipated on the board, so that the shielding performance of the board connector 200 according to the first embodiment can be further enhanced and reliability can be ensured.

[0086] The first ground contact 250 may include a first connecting protrusion 256 .

[0087] The first connecting protrusion 256 protrudes from the first shielding member 251. The first connecting protrusion 256 may be connected to the ground housing of the mating connector. Accordingly, the board connector 200 according to the first embodiment can increase a connection area where the first ground contact 250 is connected to the ground housing of the board connector, and thus the shielding performance using the first ground contact 250 can be further enhanced. The first connecting protrusion 256 may penetrate the insulating part 240 and protrude from the insulating part 240 to be connected to the ground housing of the mating connector. The first connecting protrusion 256 may be inserted into an insulating part of the mating connector and connected to the ground housing of the mating connector. In this case, a through hole into which the first connecting protrusion 256 is inserted may be formed in the insulating part of the mating connector. The first connecting protrusion 256 may protrude from the first shielding member 251 along the vertical direction. The first connecting protrusion 256 and the first ground protrusion 255 may protrude from the first shielding member 251 in opposite directions based on the vertical direction. The first connection protrusion 256 may be formed in a plate shape disposed in the vertical direction.

[0088] In this manner, the board connector 200 according to the first embodiment can implement a first ground loop (250a, shown in FIG. 5) for the first RF contact 211 using the first ground contact 250 and the ground housing 230. Therefore, the board connector 200 according to the first embodiment can implement complete shielding for the first RF contact 211 by further strengthening the shielding edge for the first RF contact 211 using the first ground loop 250a.

[0089] The second ground contact 260 may include at least one of a second shielding member 261, a second shielding protrusion 262, a second ground connection member 263, a second ground mounting member 264, a second ground protrusion 265, and a second connecting protrusion 266. In this case, the second shielding member 261, the second shielding protrusion 262, the second ground connection member 263, the second ground mounting member 264, the second ground protrusion 265, and the second connecting protrusion 266 may be embodied to substantially coincide with the first shielding member 251, the first shielding protrusion 252, the first ground connection member 253, the first ground mounting member 254, the first ground protrusion 255, and the first connecting protrusion 256, respectively, and therefore a detailed description thereof will be omitted.

[0090] The second ground contact 260 and the first ground contact 250 may be formed in the same shape. Accordingly, the board connector 200 according to the first embodiment may improve the ease of manufacturing the second ground contact 260 and the first ground contact 250. In this case, as shown in FIG. 5, the second ground contact 260 and the first ground contact 250 may be arranged to be point-symmetrical with respect to a symmetric point SP. The symmetric point SP is a point spaced the same distance from both side walls 230b and 230c of the ground housing 230 spaced apart based on the first axis direction (X-axis direction) and also spaced the same distance from both side walls 230d and 230e of the ground housing 230 spaced apart based on the second axis direction (Y-axis direction). Therefore, in the board connector 200 according to the first embodiment, the second ground contact 260 and the first ground contact 250 are formed in the same shape and are embodied with only the arrangement direction being different, which can further improve the ease of manufacturing the second ground contact 260 and the first ground contact 250. In this case, the second RF contact 212 and the first RF contact 211 can be arranged to be point-symmetrical with respect to the symmetric point SP.

[0091] Meanwhile, as shown in Fig. 5, the second shielding member 261 and the first shielding member 251 may be disposed on the same line. In this case, the second shielding member 261 may be disposed to overlap the first shielding member 251 along the first axis direction (X-axis direction). The second shielding member 261 may be disposed to face the first shielding member 251 along the first axis direction (X-axis direction). Accordingly, the board connector 200 according to the first embodiment may be miniaturized by reducing the overall size based on the first axis direction (X-axis direction) while implementing a shielding force between the first RF contact 211 and the first transmission contact 221 and a shielding force between the second RF contact 212 and the second transmission contact 222.

[0092] 2 to 9, in the board connector 200 according to the first embodiment, the ground housing 230 may be embodied as follows.

[0093] The ground housing 230 may include a ground inner wall 231 , a ground outer wall 232 , and a ground connecting wall 233 .

[0094] The ground inner wall 231 faces the insulating part 240. The ground inner wall 231 may be disposed facing the inner space 230a. The first ground contact 250 and the second ground contact 260 may be connected to the ground inner wall 231. The ground inner wall 231 may be disposed to surround all sides based on the inner space 230a. Although not shown, the ground inner wall 231 may be embodied to include a plurality of sub-ground inner walls, and the sub-ground inner walls may be disposed on different sides based on the inner space 230a.

[0095] The ground inner wall 231 may be connected to a ground housing of a mating connector inserted into the inner space 230a. For example, as shown in FIG. 9, the ground inner wall 231 may be connected to a ground housing 330 of a mating connector. In this manner, the board connector 200 according to the first embodiment may further enhance the shielding function through the connection between the ground housing 230 and the ground housing of the mating connector. In addition, the board connector 200 according to the first embodiment may reduce adverse electrical effects such as crosstalk that may occur due to mutual capacitance or induction between adjacent terminals through the connection between the ground housing 230 and the ground housing of the mating connector. In this case, the board connector 200 according to the first embodiment may further enhance the EMI shielding performance since a path for electromagnetic waves to flow into at least one ground of the first board and the second board may be secured.

[0096] The ground outer wall 232 is spaced apart from the ground inner wall 231. The ground outer wall 232 may be disposed outside the ground inner wall 231. The ground outer wall 232 may be disposed to surround all sides of the ground inner wall 231. The ground outer wall 232 and the ground inner wall 231 may be implemented as a double shielding wall surrounding the sides of the inner space 230a. The first RF contact 211 and the second RF contact 212 may be located in the inner space 230a surrounded by the shielding wall. Accordingly, the ground housing 230 may implement a shielding function for the RF contact 210 by using the shielding wall. Therefore, the board connector 200 according to the first embodiment may contribute to further improving EMI shielding performance and EMC performance by using the shielding wall.

[0097] The ground outer wall 232 may be grounded by being mounted on the first board. In this case, the ground housing 230 may be grounded through the ground outer wall 232. When one end of the ground outer wall 232 is connected to the ground connecting wall 233, the other end of the ground outer wall 232 may be mounted on the first board. In this case, the ground outer wall 232 may be formed to have a greater height than the ground inner wall 231.

[0098] The ground connection wall 233 is coupled to each of the inner ground wall 231 and the outer ground wall 232. The ground connection wall 233 may be disposed between the inner ground wall 231 and the outer ground wall 232. The inner ground wall 231 and the outer ground wall 232 may be electrically connected to each other through the ground connection wall 233. Accordingly, when the outer ground wall 232 is mounted on the first board and grounded, the ground connection wall 233 and the inner ground wall 231 are also grounded to implement a shielding function.

[0099] The ground connecting wall 233 may be coupled to one end of the outer ground wall 232 and one end of the inner ground wall 231. With reference to Fig. 9, one end of the outer ground wall 232 may correspond to an upper end of the outer ground wall 232, and one end of the inner ground wall 231 may correspond to an upper end of the inner ground wall 231. The ground connecting wall 233 may be formed as a plate arranged in a horizontal direction, and the outer ground wall 232 and the inner ground wall 231 may be formed as a plate arranged in a vertical direction. The ground connecting wall 233, the outer ground wall 232, and the inner ground wall 231 may be formed integrally.

[0100] The ground connection wall 233 may be connected to a ground housing of a mating connector inserted into the inner space 230a. Accordingly, in the board connector 200 according to the first embodiment, the ground outer wall 232 and the ground connection wall 233 are connected to the ground housing of the mating connector, so that the contact area between the ground housing 230 and the ground housing of the mating connector is increased, thereby further enhancing the shielding function.

[0101] The ground bottom 234 protrudes from the lower end of the ground inner wall 231 toward the inner space 230a. That is, the ground bottom 234 may protrude inward of the ground inner wall 231. The ground bottom 234 may be formed in a closed ring shape extending along the lower end of the ground inner wall 231. The ground bottom 234 may be grounded by being mounted on the first board. In this case, the ground housing 330 may be grounded through the ground bottom 234. When the mating connector is inserted into the inner space 230a, the ground bottom 234 may be connected to the ground housing of the mating connector. The ground bottom 234 may be formed in a plate shape arranged in a horizontal direction.

[0102] Here, the ground housing 230 may implement a shielding function for the first RF contact 211 together with the first ground contact 250. The ground housing 230 may implement a shielding function for the second RF contact 212 together with the second ground contact 260.

[0103] In this case, as shown in Fig. 5, the ground housing 230 may include a first shielding wall 230b, a second shielding wall 230c, a third shielding wall 230d, and a fourth shielding wall 230e. The first shielding wall 230b, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e may be implemented by the ground inner wall 231, the ground outer wall 232, and the ground connecting wall 233, respectively. The first shielding wall 230b and the second shielding wall 230c are disposed to face each other with respect to the first axis direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be located between the first shielding wall 230b and the second shielding wall 230c with respect to the first axis direction (X-axis direction). The first RF contact 211 may be located at a position where the distance from the first shielding wall 230b is shorter than the distance from the second shielding wall 230c based on the first axis direction (X axis direction). The second RF contact 212 may be located at a position where the distance from the second shielding wall 230c is shorter than the distance from the first shielding wall 230b based on the first axis direction (X axis direction). The third shielding wall 230d and the fourth shielding wall 230e are disposed to face each other based on the second axis direction (Y axis direction). The first RF contact 211 and the second RF contact 212 may be located between the third shielding wall 230d and the fourth shielding wall 230e based on the second axis direction (Y axis direction).

[0104] The first ground contact 250 may be disposed between the second transmission contacts 222 with respect to the first axis direction (X-axis direction). Accordingly, the first RF contact 211 may be disposed between the first shielding wall 230b and the first ground connection member 253 of the first ground contact 250 with respect to the first axis direction (X-axis direction), and may be disposed between the third shielding wall 230d and the first shielding member 251 of the first ground contact 250 with respect to the second axis direction (Y-axis direction). Therefore, the board connector 200 according to the first embodiment may enhance a shielding function for the first RF contact 211 by using the first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d. The first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d are disposed on four sides with respect to the first RF contact 211, and may implement a shielding force for an RF signal. In this case, the first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d may implement the first ground loop (250a, shown in FIG. 5) for the first RF contact 211. Therefore, the board connector 200 according to the first embodiment may implement complete shielding for the first RF contact 211 by further enhancing the shielding function for the first RF contact 211 using the first ground loop 250a.

[0105] The second ground contact 260 may be disposed between the second RF contact 212 and the first transmission contact 221 with respect to the first axis direction (X-axis direction). Accordingly, the second RF contact 212 may be disposed between the second shielding wall 230c and the second ground connection member 263 of the second ground contact 260 with respect to the first axis direction (X-axis direction), and may be disposed between the fourth shielding wall 230e and the second shielding member 261 of the second ground contact 260 with respect to the second axis direction (Y-axis direction). Therefore, the board connector 200 according to the first embodiment may enhance a shielding function for the second RF contact 212 by using the second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e. The second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e are disposed on four sides with respect to the second RF contact 212, and may implement a shielding force for an RF signal. In this case, the second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e may implement the second ground loop (260a, shown in FIG. 5) for the second RF contact 212. Therefore, the board connector 200 according to the first embodiment may implement complete shielding for the second RF contact 212 by further enhancing the shielding function for the second RF contact 212 using the second ground loop 260a.

[0106] 2 to 9, in the board connector 200 according to the first embodiment, the insulating part 240 may be embodied as follows.

[0107] The insulating part 240 may include an insulating member 241 , an insert member 242 , and a connecting member 243 .

[0108] The insulating member 241 supports the RF contact 210 and the transmission contact 220. The insulating member 241 may be located in the inner space 230a. The insulating member 241 may be located inside the ground inner wall 231. The insulating member 241 may be inserted into an inner space of the mating connector.

[0109] The insertion member 242 is inserted between the ground inner wall 231 and the ground outer wall 232. The insertion member 242 is inserted between the ground inner wall 231 and the ground outer wall 232, so that the insulating part 240 may be coupled to the ground housing 230. The insertion member 242 may be inserted between the ground inner wall 231 and the ground outer wall 232 in an interference fit manner. The insertion member 242 may be disposed outside the insulating member 241. The insertion member 242 may be disposed to surround the outside of the insulating member 241.

[0110] The connecting member 243 is coupled to the insertion member 242 and the insulating member 241, respectively. The insertion member 242 and the insulating member 241 may be connected to each other through the connecting member 243. The connecting member 243 may be formed to have a smaller thickness than the insertion member 242 and the insulating member 241 in the vertical direction. Accordingly, a space is provided between the insertion member 242 and the insulating member 241, and the mating connector may be inserted into the space. The connecting member 243, the insertion member 242, and the connecting member 243 may be integrally formed.

[0111] The insulating portion 240 may include a solder inspection window (244, shown in FIG. 8).

[0112] The soldering inspection window 244 may be formed through the insulating portion 240. The soldering inspection window 244 may be used to inspect the state in which the RF mounting members 2111, 2121 are mounted on the first board. In this case, the RF contact 210 may be coupled to the insulating portion 240 such that the RF mounting members 2111, 2121 are positioned in the soldering inspection window 244. Accordingly, the RF mounting members 2111, 2121 are not blocked by the insulating portion 240. Therefore, when the board connector 200 according to the first embodiment is mounted on the first board, an operator can inspect the state in which the RF mounting members 2111, 2121 are mounted on the first board through the soldering inspection window 244. Accordingly, the board connector 200 according to the first embodiment can improve the accuracy of the mounting operation of mounting the RF contacts 210 on the first board even if the entire RF contacts 210 including the RF mounting members 2111 and 2121 are located inside the ground housing 230. The soldering inspection window 244 can be formed to penetrate the insulating member 241.

[0113] The insulating part 240 may include a plurality of the soldering inspection windows 244. In this case, the RF mounting members 2111 and 2121 may be located in different soldering inspection windows 244. The transmission mounting member 2201 may be located in some of the soldering inspection windows 244. Therefore, when the board connector 200 according to the first embodiment is mounted on the first board, an operator can inspect the state in which the RF mounting members 2111 and 2121 and the transmission mounting member 2201 are mounted on the first board through the soldering inspection window 244. Accordingly, the board connector 200 according to the first embodiment can improve the accuracy of the work of mounting the RF mounting members 2111 and 2121 and the transmission mounting member 2201 on the first board. The soldering inspection windows 244 may be formed at positions spaced apart from each other, penetrating the insulating part 240.

[0114]

[0115] <Board connector 300 according to the second embodiment>

[0116] 2, 10 and 11, the board connector 300 according to the second embodiment may be mounted on the second board. When the board connector 300 according to the second embodiment and the mating connector are assembled to be coupled to each other, the second board on which the board connector 300 according to the second embodiment is mounted and the first board on which the mating connector is mounted may be electrically connected. In this case, the mating connector may be embodied as the board connector 200 according to the first embodiment. Meanwhile, the mating connector of the board connector 200 according to the first embodiment may be embodied as the board connector 300 according to the second embodiment.

[0117] The board connector 300 according to the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a ground housing 330, and an insulating part 340. The RF contacts 310, the transmission contacts 320, the ground housing 330, and the insulating part 340 may be embodied to be substantially identical to the RF contacts 210, the transmission contacts 220, the ground housing 230, and the insulating part 240, respectively, in the board connector 200 according to the first embodiment described above, and therefore the following description will focus on differences.

[0118] A first RF contact 311 of the RF contacts 310 and a second RF contact 312 of the RF contacts 310 may be supported by the insulating part 340 at asymmetric positions spaced apart in the first axis direction (X-axis direction) and spaced apart in the second axis direction (Y-axis direction). The first RF contact 311 may include a first RF mounting member 3111 for mounting on the second board. The second RF contact 312 may include a second RF mounting member 3121 for mounting on the second board.

[0119] Referring to FIG. 11, the transmission contact 320 may include a first transmission contact 321 and a second transmission contact 322 .

[0120] The first transmission contact 321 may be disposed apart from the second RF contact 312 based on the first axis direction (X-axis direction). The second transmission contact 322 may be disposed apart from the first RF contact 311 based on the first axis direction (X-axis direction). The first transmission contact 321 and the second transmission contact 322 may be disposed apart from each other along the second axis direction (Y-axis direction). In this case, a part of the first transmission contact 321 and a part of the second transmission contact 322 may be disposed to overlap only partially based on the second axis direction (Y-axis direction). For example, a part of the first transmission contact 321 and a part of the second transmission contact 322 may be disposed to face only partially based on the second axis direction (Y-axis direction). The first transmission contacts 321 may be disposed apart from each other along the first axis direction (X-axis direction). The second transmission contacts 322 may be disposed apart from each other along the first axis direction (X-axis direction).

[0121] Meanwhile, in FIG. 11, the board connector 300 according to the second embodiment is illustrated as including three first transmission contacts 321 and three second transmission contacts 322, but this is not limited thereto, and the board connector 300 according to the second embodiment may include four or more first transmission contacts 321 and four or more second transmission contacts 322, respectively.

[0122] The ground housing 330 is combined with the insulating part 340. The ground housing 330 may be grounded by being mounted on the second board. The ground housing 330 may be arranged to surround the sides of the inner space 330a. The insulating part 340 may be located in the inner space 330a. The first RF contact 311, the second RF contact 312, and the transmission contact 320 may all be located in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and the transmission mounting member 3201 may also all be located in the inner space 330a. The mating connector may be inserted into the inner space 330a. In this case, a part of the mating connector may be inserted into the inner space 330a, and a part of the board connector 300 according to the second embodiment may be inserted into the inner space of the mating connector. The ground housing 330 may be arranged to surround all sides based on the inner space 330a.

[0123] The insulating part 340 supports the RF contact 310. The RF contact 310 and the transmission contact 320 may be coupled to the insulating part 340. The insulating part 340 may be coupled to the ground housing 330 such that the RF contact 310 and the transmission contact 320 are positioned in the inner space 330a.

[0124] 9 to 16, the board connector 300 according to the second embodiment may include a first ground contact 350 and a second ground contact 360. The first ground contact 350 and the second ground contact 360 may be embodied to be substantially identical to the first ground contact 250 and the second ground contact 260, respectively, in the board connector 200 according to the first embodiment described above, and therefore, the following description will focus on differences.

[0125] The first ground contact 350 may implement a shielding function for the first RF contact 311 together with the ground housing 330. The first ground contact 350 may be disposed between the first RF contact 311 and the transmission contact 320 based on the first axis direction (X-axis direction). When the mating connector is inserted into the inner space 330a, the first ground contact 350 may be connected to a ground contact of the mating connector.

[0126] The second ground contact 360 may implement a shielding function for the second RF contact 312 together with the ground housing 330. The second ground contact 360 may be disposed between the transmission contact 320 and the second RF contact 212 based on the first axis direction (X-axis direction). When the mating connector is inserted into the inner space 330a, the second ground contact 360 may be connected to a ground contact of the mating connector.

[0127] 10 to 16, the first RF contact 311 and the second RF contact 312 may be spaced apart from each other along the first axis direction (X-axis direction).

[0128] The first ground contact 350 may include a first ground connection member 351 and a first ground mounting member 352 .

[0129] The first ground connection member 351 is for connection to a ground contact of a mating connector. The first ground contact 350 may be electrically connected to the ground contact of the mating connector by being connected to the ground contact of the mating connector through the first ground connection member 351. Therefore, the shielding ability of the first ground contact 350 with respect to the first RF contact 311 may be enhanced. For example, the first ground connection member 351 may be connected to a first ground connection member 253 of the first ground contact 250 of the board connector 200 according to the first embodiment.

[0130] The first ground connection member 351 may be located between the first RF contact and the second transmission contact 322 based on the first axis direction (X-axis direction). Accordingly, the first ground connection member 351 may shield the first RF contact 311 and the transmission contact 320 based on the first axis direction (X-axis direction). In this case, the first ground connection member 351 may be located between the first RF contact 311 and the 1-1 transmission contact 321a based on the first axis direction (X-axis direction). The first ground connection member 351 may be formed in a plate shape disposed in the vertical direction. In this case, the first ground connection member 351 may be embodied to be disposed in the vertical direction through a bending process on a plate material.

[0131] The first ground mounting member 352 is mounted on the second board. The first ground mounting member 352 may be grounded by being mounted on the second board. Accordingly, the first ground contact 350 may be grounded to the second board through the first ground mounting member 352. The first ground mounting member 352 may protrude from the first ground connection member 351 along the second axis direction (Y-axis direction). The first ground mounting member 352 may be formed in a plate shape arranged in the horizontal direction.

[0132] The first ground contact 350 may include a first ground connecting member 353 .

[0133] The first ground connecting member 353 is coupled to the first ground connection member 351. The first ground connecting member 353 may protrude from the first ground connection member 351 along the second axis direction (Y axis direction). The first ground connecting member 353 may be formed in a plate shape disposed in the horizontal direction.

[0134] Meanwhile, the first ground connection member 353 is mounted on the second board. The first ground connection member 353 may be grounded by being mounted on the second board. Accordingly, the first ground contact 350 may be grounded to the second board through the first ground mounting member 352.

[0135] The first ground contact 350 may include a first connecting arm 354 .

[0136] The first connection arm 354 is for connecting to the ground contact of the mating connector. The first connection arm 354 may be elastically moved by being connected to the ground contact of the mating connector. Accordingly, the first ground contact 350 may be firmly maintained in a state of being connected to the ground contact of the mating connector by using the elastic force or restoring force of the first connection arm 354, so that the connection stability to the ground contact of the mating connector may be improved. Therefore, the board connector 300 according to the second embodiment may strengthen the connection force to the mating connector by using the first connection arm 354, so that the shielding performance through the connection with the ground contact of the mating connector may be further strengthened. For example, as shown in FIG. 14, the first connection arm 354 may be connected to the first shielding member 251 of the first ground contact 250 of the board connector 200 according to the first embodiment. In this case, the first connection arm 354 may be pushed by the first shielding member 251 to elastically move, and may press the first shielding member 251 by using the restoring force.

[0137] 13 to 16, the first connection arm 354 may be elastically and movably coupled to the first ground connection member 353. As the first connection arm 354 is connected to the ground contact of the mating connector, the first connection arm 354 may rotate based on a portion coupled to the first ground connection member 353. The first connection arm 354 may protrude from the first ground connection member 353 along the first axis direction (X-axis direction). In this case, the first connection arm 354 and the first ground connection member 353 may be coupled to the first ground connection member 353 such that an included angle between them forms an obtuse angle. For example, the first connection arm 354 and the first ground connection member 353 may be formed to extend in different directions. The first connection arm 354 may be formed in a plate shape arranged in a horizontal direction.

[0138] The first ground contact 350 may include the first connecting protrusion 355 .

[0139] The first connecting protrusion 355 is connected to a ground contact of the board connector 200 according to the first embodiment. The first connecting protrusion 355 may protrude from the first ground connection member 351. The first connecting protrusion 355 may be connected to a ground contact of the mating connector. In this case, the first connecting protrusion 355 and the first connecting arm 354 may be connected to the ground contact of the mating connector at different positions. Accordingly, the first ground contact 350 is connected to the ground contact of the mating connector at a plurality of positions, thereby shortening the distance to the position where the electromagnetic waves are grounded to the board. Therefore, the board connector 300 according to the second embodiment can further enhance the shielding performance by allowing the electromagnetic waves to be quickly grounded through the first ground contact 350.

[0140] For example, referring to FIGS. 14 to 16, a first connection arm 354 of the first ground contact 350 may be connected to a first shielding member 251 of the first ground contact 250 of the board connector 200 according to the first embodiment. A first connection protrusion 355 of the first ground contact 350 may be connected to a first ground connection member 253 of the first ground contact 250 of the board connector 200 according to the first embodiment. In this case, electromagnetic waves generated at a portion where the first connection arm 354 and the first ground contact 250 are connected may be grounded at the shortest distance through the first ground connection member 353 mounted on the second board. Electromagnetic waves generated at a portion where the first connection protrusion 355 and the first ground connection member 253 are connected may be grounded at the shortest distance through the first ground mounting member 254 mounted on the first board. Accordingly, the board connector 1 can further enhance shielding performance by quickly grounding the electromagnetic waves, etc. through the first ground contact 250 of the board connector 200 according to the first embodiment and the first ground contact 350 of the board connector 300 according to the second embodiment.

[0141] In this manner, the first connecting arm 354 and the first connecting protrusion 355 can be connected to the ground contacts of the mating connector at different positions. Accordingly, the number of points where the ground contacts 250, 350 are connected to each other is increased, so that the distance at which the electromagnetic waves are grounded can be minimized. Therefore, the electromagnetic waves of the board connector 1 can be quickly grounded, so that the shielding performance can be further enhanced.

[0142] In this manner, the board connector 300 according to the second embodiment may implement a first ground loop (350a, shown in FIG. 12) for the first RF contact 311 using the first ground contact 350 and the ground housing 330. Therefore, the board connector 300 according to the second embodiment may implement complete shielding for the first RF contact 311 by further enhancing the shielding performance for the first RF contact 311 using the first ground loop 350a.

[0143] The second ground contact 360 may include at least one of a second ground connection member 361, a second ground mounting member 362, a second ground connecting member 363, a second connecting arm 364, and a second connecting protrusion 365. In this case, the second ground connection member 361, the second ground mounting member 362, the second ground connecting member 363, the second connecting arm 364, and the second connecting protrusion 365 may be embodied to approximately coincide with the first ground connection member 351, the first ground mounting member 352, the first ground connecting member 353, the first connecting arm 354, and the first connecting protrusion 355, respectively, and therefore a detailed description thereof will be omitted.

[0144] The second ground contact 360 and the first ground contact 350 may be formed in the same shape. Accordingly, the board connector 300 according to the second embodiment may improve the ease of manufacturing the second ground contact 360 and the first ground contact 350. In this case, as shown in FIG. 12, the second ground contact 360 and the first ground contact 350 may be arranged to be point-symmetrical with respect to a symmetric point SP. The symmetric point SP is a point spaced the same distance from both side walls 330b and 330c of the ground housing 330 spaced apart based on the first axis direction (X-axis direction) and also spaced the same distance from both side walls 330d and 330e of the ground housing 330 spaced apart based on the second axis direction (Y-axis direction). Therefore, in the board connector 300 according to the second embodiment, the second ground contact 360 and the first ground contact 350 are formed in the same shape and are embodied with only the arrangement direction being different, which may further improve the ease of manufacturing the second ground contact 360 and the first ground contact 350. In this case, the second RF contact 312 and the first RF contact 311 may be arranged to be point-symmetrical with respect to the symmetric point SP.

[0145] Meanwhile, as shown in Fig. 12 and Fig. 13, the first connection arm 354 and the second connection arm 364 may be arranged to overlap along the first axis direction (X-axis direction). For example, the first connection arm 354 and the second connection arm 364 may be arranged to face each other along the first axis direction (X-axis direction). In this case, the first connection arm 354 and the second connection arm 364 may be arranged on the same line. Accordingly, the board connector 300 according to the second embodiment may be miniaturized by reducing the overall size based on the first axis direction (X-axis direction) while implementing a shielding force between the first RF contact 311 and the first transmission contact 321 and a shielding force between the second RF contact 312 and the second transmission contact 322.

[0146] 10 to 12, in the board connector 300 according to the second embodiment, the ground housing 330 may be embodied as follows.

[0147] The ground housing 330 may include a ground side wall 331 , a ground top wall 332 , and a ground bottom wall 333 .

[0148] The ground sidewall 331 faces the insulating portion 240. The ground sidewall 331 may be disposed to face the inner space 330a. The ground sidewall 331 may be disposed to surround all sides based on the inner space 330a.

[0149] The ground side wall 331 may be connected to a ground housing of a mating connector inserted into the inner space 330a. For example, as shown in FIG. 9, the ground side wall 331 may be connected to a ground inner wall 231 of the ground housing 230 of the board connector 200 according to the first embodiment. In this manner, the board connector 300 according to the second embodiment may further enhance the shielding function through the connection between the ground housing 330 and the ground housing of the mating connector. In addition, the board connector 300 according to the second embodiment may reduce adverse electrical effects such as crosstalk that may occur due to mutual capacitance or induction between adjacent terminals through the connection between the ground housing 330 and the ground housing of the mating connector. In this case, the board connector 300 according to the second embodiment may further enhance the EMI shielding performance since a path for electromagnetic waves to flow into at least one ground of the second board and the first board may be secured.

[0150] The ground upper wall 332 is coupled to the ground side wall 331. The ground upper wall 332 may be coupled to one end of the ground side wall 331. The ground upper wall 332 may protrude from the ground side wall 331 toward the inner space 330a. The ground upper wall 332 may be connected to a ground housing of a mating connector inserted into the inner space 330a. Accordingly, in the board connector 300 according to the second embodiment, the ground upper wall 332 and the ground side wall 331 are connected to the ground housing of the mating connector, so that the contact area between the ground housing 330 and the ground housing of the mating connector can be increased, thereby further enhancing the shielding function. For example, as shown in FIG. 9, the ground upper wall 332 may be connected to a ground bottom 234 of the ground housing 230 of the board connector 200 according to the first embodiment.

[0151] The ground lower wall 333 is coupled to the ground side wall 331. The ground lower wall 333 may be coupled to the other end of the ground side wall 331. The ground lower wall 333 may protrude from the ground side wall 331 to the opposite side of the inner space 330a. The ground lower wall 333 may be disposed to surround all sides based on the ground side wall 331. The ground lower wall 333 and the ground side wall 331 may be embodied as a shielding wall surrounding the sides of the inner space 330a. The first RF contact 311 and the second RF contact 312 may be located in the inner space 330a surrounded by the shielding wall. Accordingly, the ground housing 330 may implement a shielding function for the RF contact 310 by using the shielding wall. Therefore, the board connector 300 according to the second embodiment may contribute to further improving EMI shielding performance and EMC performance by using the shielding wall. The ground bottom wall 333 may be mounted on the second board to be grounded. In this case, the ground housing 330 may be grounded through the ground bottom wall 333.

[0152] The lower ground wall 333 and the upper ground wall 332 may be formed as plates arranged in the horizontal direction, and the side ground wall 331 may be formed as a plate arranged in the vertical direction. The lower ground wall 333, the upper ground wall 332, and the side ground wall 331 may be integrally formed.

[0153] Here, the ground housing 330 may implement a shielding function for the first RF contact 311 together with the first ground contact 350. The ground housing 330 may implement a shielding function for the second RF contact 312 together with the second ground contact 360.

[0154] In this case, as shown in Fig. 12, the ground housing 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be realized by the ground side wall 331, the ground lower wall 333, and the ground upper wall 332, respectively. The first shielding wall 330b and the second shielding wall 330c are disposed to face each other with respect to the first axis direction (X-axis direction). The first RF contact 311 and the second RF contact 312 may be located between the first shielding wall 330b and the second shielding wall 330c with respect to the first axis direction (X-axis direction). The first RF contact 311 may be located at a position that is closer to the first shielding wall 330b than the second shielding wall 330c based on the first axis direction (X axis direction). The second RF contact 312 may be located at a position that is closer to the second shielding wall 330c than the first shielding wall 330b based on the first axis direction (X axis direction). The third shielding wall 330d and the fourth shielding wall 330e are disposed to face each other based on the second axis direction (Y axis direction). The first RF contact 311 and the second RF contact 312 may be located between the third shielding wall 330d and the fourth shielding wall 330e based on the second axis direction (Y axis direction).

[0155] The first ground contact 350 may be disposed between the first RF contact 311 and the second transmission contact 322 with respect to the first axis direction (X-axis direction). Accordingly, the first RF contact 311 may be disposed between the first shielding wall 330b and the first ground connection member 351 of the first ground contact 350 with respect to the first axis direction (X-axis direction), and may be disposed between the third shielding wall 330d and the first connection arm 354 of the first ground contact 350 with respect to the second axis direction (Y-axis direction). Therefore, the board connector 300 according to the second embodiment may enhance a shielding function for the first RF contact 311 by using the first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d. The first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d are disposed on four sides with respect to the first RF contact 311, and may implement a shielding force for an RF signal. In this case, the first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d may implement the first ground loop (350a, shown in FIG. 12) for the first RF contact 311. Therefore, the board connector 300 according to the second embodiment may implement complete shielding for the first RF contact 311 by further enhancing the shielding function for the first RF contact 311 using the first ground loop 350a.

[0156] The second ground contact 360 may be disposed between the second RF contact 312 and the first transmission contact 321 with respect to the first axis direction (X-axis direction). Accordingly, the second RF contact 312 may be disposed between the second shielding wall 330c and the second ground connection member 361 of the second ground contact 360 with respect to the first axis direction (X-axis direction), and may be disposed between the third shielding wall 330d and the second connection arm 364 of the second ground contact 360 with respect to the second axis direction (Y-axis direction). Therefore, the board connector 300 according to the second embodiment may enhance a shielding function for the second RF contact 312 by using the second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e. The second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e are disposed on four sides with respect to the second RF contact 312, and may implement a shielding force for an RF signal. In this case, the second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e may implement the second ground loop (360a, shown in FIG. 12) for the second RF contact 312. Therefore, the board connector 300 according to the second embodiment may implement complete shielding for the second RF contact 312 by further enhancing the shielding function for the second RF contact 312 using the second ground loop 360a.

[0157] Referring to FIG. 11, in the board connector 300 according to the second embodiment, the insulating part 340 may include a soldering inspection window 341 .

[0158] The lead soldering inspection window 341 may be formed penetrating the insulating portion 340. The soldering inspection window 341 may be used to inspect the state in which the RF mounting members 3111, 3121 are mounted on the second board. In this case, the RF contact 310 may be coupled to the insulating portion 340 such that the RF mounting members 3111, 3121 are positioned at the soldering inspection window 341. Accordingly, the RF mounting members 3111, 3121 are not blocked by the insulating portion 340. Therefore, when the board connector 300 according to the second embodiment is mounted on the second board, an operator can inspect the state in which the RF mounting members 3111, 3121 are mounted on the second board through the soldering inspection window 341. Accordingly, the board connector 300 of the second embodiment can improve the accuracy of the mounting operation of mounting the RF contact 310 to the second board, even if the entire RF contact 310 including the RF mounting members 3111, 3121 is located inside the ground housing 330.

[0159] The insulating part 340 may include a plurality of the soldering inspection windows 341. In this case, the RF mounting members 3111 and 3121 may be located in different soldering inspection windows 341. The transmission mounting member 3201 may be located in some of the soldering inspection windows 341. Therefore, when the board connector 300 according to the second embodiment is mounted on the second board, an operator can inspect the state in which the RF mounting members 3111 and 3121 and the transmission mounting member 3201 are mounted on the second board through the soldering inspection window 341. Accordingly, the board connector 300 according to the second embodiment can improve the accuracy of the work of mounting the RF mounting members 3111 and 3121 and the transmission mounting member 3201 on the second board. The soldering inspection windows 341 may be formed at positions spaced apart from each other, penetrating the insulating part 340.

[0160] The present invention described above is not limited to the above-mentioned embodiments and the accompanying drawings, and it will be apparent to those skilled in the art to which the present invention pertains that various substitutions, modifications and alterations are possible within the scope of the technical concept of the present invention.

Claims

1. A plurality of RF (Radio Frequency) contacts for transmitting RF signals; an insulating portion supporting the RF contact; a plurality of transmission contacts coupled to the insulating portion; a ground housing coupled to the insulating portion so as to surround an outer surface and an inner surface of the insulating portion, respectively; a first ground contact provided separately from the ground housing and coupled to the insulating portion separate from the ground housing, the first ground contact providing shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact provided separately from the ground housing and the first ground contact and coupled to the insulating portion so as to be isolated from the ground housing, the second ground contact providing shielding between a second RF contact and the transmission contact among the RF contacts; A board connector characterized in that the first ground contact includes a first shielding member that provides shielding between the first RF contact and the transmission contact based on a first axial direction, and that provides shielding between the first RF contact and the transmission contact based on a second axial direction perpendicular to the first axial direction.

2. 2. The board connector of claim 1, characterized in that the first RF contact and the second RF contact are spaced apart based on a first axial direction and are arranged in non-opposing positions spaced apart based on a second axial direction perpendicular to the first axial direction.

3. the transmission contact includes a first transmission contact spaced apart from the second RF contact with respect to the first axial direction, and a second transmission contact spaced apart from the first RF contact with respect to the first axial direction; 2. The board connector according to claim 1, wherein at least one of the first transmission contacts is disposed to face at least one of the second transmission contacts along the second axial direction.

4. the transmission contacts include a first transmission contact arranged to face the first RF contact along the second axial direction, and a second transmission contact arranged to face the second RF contact along the second axial direction; 2. The board connector of claim 1, characterized in that the first ground contact includes a first ground connection member that shields between the first RF contact and at least one of the second transmission contacts based on the first axial direction, and a first shielding member that shields between the first RF contact and at least one of the first transmission contacts in the second axial direction.

5. a first shielding wall and a second shielding wall arranged to face each other with respect to the first axis direction, and a third shielding wall and a fourth shielding wall arranged to face each other with respect to a second axis direction perpendicular to the first axis direction, 2. The board connector of claim 1, wherein the first shielding wall, the third shielding wall, and the first ground contact are disposed on four sides of the first RF contact to provide shielding against RF signals.

6. the transmission contacts include a first transmission contact arranged to face the first RF contact along the second axial direction, and a second transmission contact arranged to face the second RF contact along the second axial direction; the first ground contact includes a first shielding member that provides shielding between the first RF contact and the first transmission contact in the second axial direction; the second ground contact includes a second shielding member that provides shielding between the second RF contact and the second transmission contact in the second axial direction; 2. The board connector according to claim 1, wherein the second shielding member is disposed so as to face the first shielding member along the first axial direction.

7. 2. The board connector of claim 1, characterized in that the first ground contact and the second ground contact are arranged to be point-symmetrical with respect to a symmetrical point that is spaced the same distance from each of both side walls of the ground housing that are spaced apart based on the first axial direction and that is spaced the same distance from each of both side walls of the ground housing that are spaced apart based on the second axial direction.

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