Mounting structure of optical waveguide device

Abstract

This packaging structure (10) for an optical waveguide device comprises, above an electrical packaging substrate (18), an optical waveguide device (11), a fiber fixing component (14) to which an optical fiber (13) is fixed, and an optical path conversion component (12) disposed between the optical waveguide device (11) and the fiber fixing component (14), the optical waveguide device (11) being packaged on an upper surface of the electrical packaging substrate (18) or an interposer (15) on the electrical packaging substrate (18) so as to face a surface on a waveguide core (111) side of the optical waveguide device (11), the optical waveguide device (11) and the optical fiber (13) being optically coupled via the optical path conversion component (12), the optical path conversion component (12) having a mirror part (121) on the optical waveguide device (11) side thereof, and having a beam diameter adjustment part (122) on the fiber fixing component (14) side thereof with respect to the mirror part (121), and the mirror part (121) reflecting, at a prescribed angle, light that is incident on the mirror part (121).　Through this configuration, the present invention can provide a packaging structure for an optical waveguide device that is compatible with higher signal speeds and has a high degree of design freedom.

Description

[Technical field]

[0001] The present invention relates to a mounting structure for an optical waveguide device that connects an optical waveguide device to an optical fiber. [Background technology]

[0002] In order to cope with the recent rapid increase in Internet traffic, there is a demand to expand the communication capacity of data center networks. In order to further expand transmission capacity and reduce power consumption, optical interconnections that transmit light even for short and medium distance applications are being introduced.

[0003] In a typical optical interconnection system, signal processing is achieved by transmitting signals between optical emitters such as laser diodes (LD) and optical receivers such as photodiodes (PD) arranged on a printed circuit board using optical transmission media such as optical waveguides and optical fibers.

[0004] Depending on the transmission method, the optical light emitting element is integrated with an optical modulation element or is connected discretely, and further connected to a driver that performs electrical-optical conversion, etc. A configuration including these optical light emitting elements, optical modulation elements, drivers, etc. is mounted on an electrical mounting board such as a printed circuit board (PCB) as an optical transmitter.

[0005] Similarly, optical processors and the like are appropriately integrated with or discretely connected to the optical receiving element, and electrical amplifier circuits and the like that perform optical-electrical conversion are further connected. A configuration including these optical receiving elements, optical processors, electrical amplifier circuits, and the like is mounted on a printed circuit board as an optical receiver. An optical transceiver that integrates these optical transmitters and optical receivers is mounted in a package or on a printed circuit board, and optically connected to an optical transmission medium such as optical fiber to realize optical interconnection. Depending on the topology, optical interconnection is also realized via repeaters such as optical switches.

[0006] As the light emitting element, light receiving element, and light modulating element, elements using semiconductors such as silicon and germanium, and III-V group semiconductors such as indium phosphide (InP), gallium arsenide (GaAs), indium gallium arsenide (InGaAs), etc., have been put to practical use. In recent years, optical waveguide type optical transceivers that integrate silicon optical circuits (silicon photonics) and indium phosphide optical circuits having an optical propagation mechanism, as well as these elements, have been developed. In addition, as the light modulating element, materials such as ferroelectrics such as lithium niobate and polymers may be used in addition to semiconductors.

[0007] Furthermore, optical functional elements such as planar lightwave circuits made of quartz glass may be integrated together with the above-mentioned optical light-emitting elements, optical light-receiving elements, and optical modulation elements. Optical functional elements include splitters, wavelength multiplexers / demultiplexers, optical switches, polarization control elements, and optical filters. Hereinafter, devices that integrate the above-mentioned optical light-emitting elements, optical light-receiving elements, optical modulation elements, optical functional elements, and optical amplification elements that have the above-mentioned optical propagation and waveguiding mechanisms will be called optical waveguide devices. Among optical waveguide devices, optical waveguide devices using silicon photonics are excellent in integration, mass production, and compatibility with electrical components, and are attracting attention as key devices for realizing next-generation optical interconnections.

[0008] Methods for connecting the optical transceiver, in which the silicon photonics chip, driver, electric amplifier circuit, etc. are integrated, to the electrical wiring on the board include wire bonding, flip chip connection, and connection methods using a ball-grid array (BGA), land-grid array (LGA), pin-grid array (PGA), copper pillar, etc. When making the connection, if necessary, it may be connected to the electrical mounting board via another package substrate such as an interposer component.

[0009] One of the representative methods for connecting the optical waveguide device and the optical fiber is a structure in which the optical waveguide device is connected to an optical fiber array integrated with glass having a V-groove formed therein. In this structure, it is required to connect each core of the optical fiber to the core of each waveguide of the optical waveguide device with low loss. To achieve this low-loss connection, it is necessary to position (hereinafter referred to as "alignment") and fix the optical waveguide device and the optical fiber to the submicron level.

[0010] In conventional optical waveguide devices, alignment (optical alignment) is performed while actually inputting and outputting light and monitoring the power, and the device is mounted in a package or on a board in a state integrated with an optical fiber array (for example, non-patent document 1). [Prior art documents] [Non-patent literature]

[0011] [Non-Patent Document 1] 36, no. 24, pp. 5815-5822, 2018. Summary of the Invention [Problem to be solved by the invention]

[0012] However, the conventional mounting structure of the optical waveguide device has the following problems.

[0013] In recent years, in the electrical packaging of optical waveguide devices, flip-chip connections have been used instead of conventional wire bonding in order to minimize the length of electrical wiring as the signals handled become faster. In this case, the surface of the optical waveguide device facing the waveguide layer is mounted face-down, facing the surface of the electrical packaging board / package / interposer (hereinafter simply referred to as the "interposer").

[0014] Typically, the electrical contacts of an optical waveguide device are provided near the waveguide layer formed on the waveguide substrate, so the thickness-wise gap between the waveguide core and the interposer when mounted face-down on an electrical mounting substrate is approximately the same as the thickness of the electrical contacts, i.e., a few tens of μm to 100s of μm or less.

[0015] On the other hand, the thickness of the V-groove substrate used in conventional fiber arrays needs to be about several hundred microns, so if a fiber array is directly bonded and fixed to an optical waveguide device that is face-down mounted using flip-chip connection or the like using conventional methods, mechanical interference between the V-groove substrate and the interposer will be a problem.

[0016] Therefore, in order to avoid this mechanical interference, it was necessary to configure the end face of the optical waveguide device to be flush with the end face of the interposer, or to position the optical waveguide device 61 so that it protrudes beyond the end face of the interposer 65, as shown in Figure 13A.

[0017] 13B, it was necessary to increase the thickness of the interposer 65 by the thickness of the fiber array and provide a notch 65_2 for accommodating the fiber array 64 in the interposer 65. This is problematic because it restricts the interposer design and the mounting position of the optical waveguide device. [Means for solving the problem]

[0018] In order to solve the above-mentioned problems, the mounting structure of an optical waveguide device according to the present invention comprises: A mounting structure of an optical waveguide device into and out of which light is incident,an optical waveguide device, a fiber fixing part to which an optical fiber is fixed, and an optical path changing part disposed between the optical waveguide device and the fiber fixing part, the optical waveguide device being mounted on an upper surface of the electrical mounting board or an interposer on the electrical mounting board with a surface of the optical waveguide device on a waveguide core side facing the upper surface of the electrical mounting board, the optical waveguide device and the optical fiber being optically coupled via the optical path changing part, the optical path changing part having a mirror part on the optical waveguide device side and a beam diameter adjusting part on the fiber fixing part side relative to the mirror part, the optical path conversion component is fixed to and integrated with an end face of the optical waveguide device, and the light is made to enter and exit a mounting structure of the optical waveguide device from a waveguide core of the optical waveguide device above the end face of the optical waveguide device; The mirror portion is The above It is characterized by reflecting light at a predetermined angle. Further, the mounting structure of an optical waveguide device according to the present invention is a mounting structure of an optical waveguide device into and out of which light is incident and which includes an optical waveguide device, a fiber fixing component to which an optical fiber is fixed, an optical path changing component disposed between the optical waveguide device and the fiber fixing component, and a support portion fixed to an end face of the optical waveguide device, above an electrical mounting board, the optical waveguide device being mounted on an upper face of the electrical mounting board or an interposer on the electrical mounting board with a surface of the optical waveguide device facing the waveguide core side, the optical waveguide device and the optical fiber being optically coupled via the optical path changing component, and the optical path changing component being configured to change the optical path of the optical waveguide device. a mirror portion on the optical waveguide device side and a beam diameter adjusting portion on the fiber fixing component side relative to the mirror portion, the optical waveguide device is disposed at a distance from the optical path changing component via the support portion, the optical path changing component has a second beam diameter adjusting portion between the mirror portion and the optical waveguide device, is fixed to and integrated with the support portion, and is optically connected to an end face of the optical waveguide device via the second beam diameter adjusting portion, and the mirror portion reflects the light incident on the mirror portion at a predetermined angle so as to cause the light to enter and exit a mounting structure for the optical waveguide device above a waveguide core of the optical waveguide device. Effect of the Invention

[0019] By arranging and integrating a flip-up structure and a beam diameter adjustment structure close to the light input / output end face of the optical waveguide device, the optical path of the light input / output to the optical waveguide device can be converted and mechanical interference with the interposer can be avoided.

[0020] This makes it possible to eliminate the aforementioned constraints on interposer design and constraints on the mounting position of optical waveguide devices, and realizes a highly flexible mounting form of optical waveguide devices while using flip-chip connections that support higher signal speeds. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic side cross-sectional view showing the configuration of a mounting structure for an optical waveguide device according to a first embodiment of the present invention. [Figure 2A] FIG. 2A is a schematic front cross-sectional view showing the configuration of a mounting structure for an optical waveguide device according to a first embodiment of the present invention. [Figure 2B] FIG. 2B is a schematic front sectional view showing the configuration of the mounting structure of the optical waveguide device according to the first embodiment of the present invention. [Diagram 3]FIG. 3 is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the first embodiment of the present invention. [Figure 4A] FIG. 4A is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to a second embodiment of the present invention. [Figure 4B] FIG. 4B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the second embodiment of the present invention. [Figure 4C] FIG. 4C is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the second embodiment of the present invention. [Figure 4D] FIG. 4D is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the second embodiment of the present invention. [Figure 4E] FIG. 4E is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the second embodiment of the present invention. [Figure 4F] FIG. 4F is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the second embodiment of the present invention. [Figure 5A] FIG. 5A is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to a third embodiment of the present invention. [Figure 5B] FIG. 5B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the third embodiment of the present invention. [Figure 5C] FIG. 5C is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the third embodiment of the present invention. [Figure 5D] FIG. 5D is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the third embodiment of the present invention. [Figure 5E] FIG. 5E is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the third embodiment of the present invention. [Figure 6A] FIG. 6A is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to a fourth embodiment of the present invention. [Figure 6B] FIG. 6B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fourth embodiment of the present invention. [Figure 6C] FIG. 6C is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fourth embodiment of the present invention. [Figure 6D] FIG. 6D is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fourth embodiment of the present invention. [Figure 6E] FIG. 6E is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fourth embodiment of the present invention. [Figure 7A] FIG. 7A is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to a fifth embodiment of the present invention. [Figure 7B] FIG. 7B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fifth embodiment of the present invention. [Figure 7C] FIG. 7C is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the fifth embodiment of the present invention. [Figure 8A] FIG. 8A is a schematic side cross-sectional view showing the configuration of a mounting structure for an optical waveguide device according to a sixth embodiment of the present invention. [Figure 8B] FIG. 8B is a schematic front sectional view for explaining a mounting structure of an optical waveguide device according to the sixth embodiment of the present invention. [Figure 9A] FIG. 9A is a schematic side cross-sectional view showing the configuration of a mounting structure for an optical waveguide device according to a sixth embodiment of the present invention. [Figure 9B] FIG. 9B is a schematic front sectional view for explaining a mounting structure of an optical waveguide device according to the sixth embodiment of the present invention. [Figure 10A] FIG. 10A is a schematic side cross-sectional view showing an example of a configuration of a mounting structure for an optical waveguide device according to a seventh embodiment of the present invention. [Figure 10B]FIG. 10B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the seventh embodiment of the present invention. [Figure 11A] FIG. 11A is a schematic side cross-sectional view showing an example of a configuration of a mounting structure for an optical waveguide device according to a seventh embodiment of the present invention. [Figure 11B] FIG. 11B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the seventh embodiment of the present invention. [Figure 12A] FIG. 12A is a schematic side cross-sectional view showing an example of a configuration of a mounting structure for an optical waveguide device according to a seventh embodiment of the present invention. [Figure 12B] FIG. 12B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for an optical waveguide device according to the seventh embodiment of the present invention. [Figure 13A] FIG. 13A is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for a conventional optical waveguide device. [Figure 13B] FIG. 13B is a schematic side cross-sectional view showing an example of the configuration of a mounting structure for a conventional optical waveguide device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] <First embodiment> A mounting structure of an optical waveguide device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG.

[0023] <Configuration of mounting structure for optical waveguide device> As shown in FIG. 1, an optical waveguide device mounting structure 10 according to this embodiment includes an optical waveguide device 11, an optical path changing component 12, and a fiber fixing component 14 to which an optical fiber 13 is fixed.

[0024] Hereinafter, in the horizontal plane (substrate surface), the direction in which light is guided in the optical waveguide device 11 (X direction in the figure) is defined as the "longitudinal direction of the optical waveguide device", the direction perpendicular to the longitudinal direction (Y direction in the figure) is defined as the "width direction of the optical waveguide device", the direction perpendicular to the horizontal plane (substrate surface) (Z direction in the figure) is defined as the thickness direction, and with respect to the waveguide core 111 of the optical waveguide device 11, the element substrate 112 side is defined as the "upper" direction (Z+ direction), and the electrical mounting substrate 18 side is defined as the "lower" direction (Z- direction).

[0025] The optical waveguide device 11 includes a waveguide core 111 and an element substrate 112, and is mounted on the upper surface of the interposer 15 with the surface of the optical waveguide device 11 on the side of the waveguide core 111 facing the upper surface (face down), and is electrically connected via electrical contacts 16. A known flip chip connection is used for face down mounting.

[0026] Similarly, the electrical element 17 is mounted face down on the upper surface of the interposer 15 and is electrically connected via the electrical contacts 16 .

[0027] The interposer 15 has an electric wiring layer (not shown) and a pad for flip chip connection on the upper surface, and multiple electrical wiring is formed as necessary. In addition, although not shown in the drawing, another electric element 17 such as a capacitor or coil is mounted, or a structure having a similar effect is integrally formed.

[0028] Interposer 15 has electrical wiring formed by through vias or inner layer wiring to electrically connect the upper and lower surfaces. Similarly, electrical contacts (gold bumps, copper pillars, solder balls, etc.) 16 are formed on the lower surface opposite to the upper surface connected to the flip chip, and are electrically connected to an electrical mounting board 18 via the electrical contacts 16 on the lower surface.

[0029] The electrical mounting substrate 18 is, for example, a known PCB or build-up substrate. The electrical contacts 16 on the lower surface side are formed by solder terminals. For example, they are made of known BGA, LGA, or PGA. Note that the electrical contacts may be made of metal bumps (gold bumps, copper pillars, etc.) as in flip chip connections.

[0030] The interposer 15 may be any known interposer, such as silicon, glass, ceramic (LTCC, HTCC), or glass epoxy substrate. It may also be called a subcarrier, package, etc. The interposer and the electrical mounting substrate may be connected by wire bonding as necessary.

[0031] The electric element 17 may be any electric element such as a driver, a transimpedance amplifier circuit, a retimer, an FPGA, an ASIC, a DSP, a CPU / GPU, or a clock circuit. The electric element is disposed on the interposer 15 and mounted by flip-chip mounting. Note that the mounting form of the electric element does not necessarily have to be face-down mounting since this is not the main focus of the present invention, and may be face-up mounting using, for example, wire bonding. The electric element and the optical waveguide device 11 are electrically connected via the electric wiring of the interposer 15 and the respective electric contacts 16.

[0032] The optical waveguide device 11 is a known silicon photonics chip, and the optical waveguide layer is formed on a BOX layer on a silicon substrate, and the thickness of the waveguide substrate is, for example, 625 μm, which is the standard silicon wafer thickness. In addition to the optical waveguide layer, the optical waveguide device 11 also has an electrical wiring layer, which has connection pads and is electrically connected to the interposer 15 via electrical contacts 16. As described above, since it is face-down mounted, the position (height) of the input / output light from the optical waveguide device 11 is low, about several tens of μm to several hundred tens of μm from the surface of the interposer 15.

[0033] The silicon photonics chip 11 has an optical input / output section at least at one end face for inputting and outputting light to the outside, and a spot size converter or the like is integrated in the optical circuit as an edge coupler. Generally, the mode field diameter of the optical propagation mode in the silicon photonics optical circuit is very small at 1 μm or less, but the edge coupler expands the mode field diameter to about 3 μm to 10 μm when the optical beam is emitted (incident). Below, the explanation will be given taking the emission of light from the silicon photonics chip 11 as an example, but the operation when the light is incident on the silicon photonics chip 11 is also reversible.

[0034] 1, an optical path changing component 12 is disposed near the end face of the silicon photonics chip 11, and the optical path changing component 12 includes a mirror section 121 and a beam diameter adjusting section 122. The mirror section 121 is used to bounce the emitted beam upward (Z+ direction), and the beam passes through the beam diameter adjusting section 122 and is connected to the optical fiber 13.

[0035] The optical fiber 13 is actually fixed by a fiber fixing part 14 consisting of a V-groove part, a lid part, and the like, like the above-mentioned fiber array.

[0036] The beam diameter adjustment unit 122 converts the beam diameter emitted from the end face of the silicon photonics chip 11 into an appropriate beam size that can be easily connected to the mode field diameter of the optical fiber 13 with low loss, and the converted beam is then emitted from the end of the optical path changing component 12.

[0037] This allows light propagating through the core of the optical fiber 13 and the core 111 of the silicon photonics chip 11 to be optically coupled with low loss.

[0038] The mirror section 121 and the beam diameter adjustment section 122 in the optical path conversion component 12 may be formed as an integrated component, or the mirror section 121 and the beam diameter adjustment section 122 may be configured as different components and integrated as necessary.

[0039] The mirror section 121 can be configured with a component that changes the optical path by using total reflection, and can be, for example, a bulk prism component or a component in which the end face of the optical fiber 13 or optical waveguide is polished (or diced or laser cut) at an angle in the thickness direction (Z direction). In order to perform total reflection efficiently and reversibly with respect to the input and output of light, the reflective surface may be coated with a highly reflective film as necessary. Alternatively, a microstructure that achieves high reflection with a similar function may be formed.

[0040] The beam diameter tuning unit 122 can be configured with components that focus, collimate, or expand the light beam, and can use structures such as spherical lenses, aspherical lenses, concave lenses, and Fresnel lenses, as well as graded index (GI) lenses or GI fibers having a refractive index distribution. If necessary, an anti-reflection (AR) film or an anti-reflection structure that exhibits a similar function is formed on the input and output end faces of the beam diameter tuning unit 122.

[0041] When a lens structure is used, a free space for the light beam is provided, and the free space is made of an air layer, an organic resin layer having a refractive index different from that of the lens structure, a glass layer, a silicon layer, etc. The free space has an appropriate length for adjusting the beam diameter and functions as a spacer.

[0042] In this embodiment, an example is shown in which the optical path is changed by a mirror at an angle of 90°, but the invention is not limited to this and the optical path may be changed at another angle. For example, the optical path change angle may be finely adjusted to 82°, 60°, 75°, etc., as necessary, and may be 45° to 90°.

[0043] Although the beam diameter adjustment unit 122 is shown in the figure as an example of a coaxial system using lenses and GI components, the arrangement of the central axis may be shifted so as to add an offset to the optical path, rather than being coaxial.

[0044] Also, an example is shown in which the angle between the end face of the optical waveguide device 11 and the horizontal plane is a right angle (90°), but the end face angle may be a predetermined angle such as 80°, 100°, etc. Also, the angle in the width direction (Y direction) of the optical waveguide device 11 (depth direction on the paper) may also have a predetermined angle.

[0045] When a typical single mode fiber for communication wavelengths is used as the optical fiber 13, for example, in the 1.5 μm wavelength band, its mode field diameter is about 10 μm. Therefore, it is preferable to adjust the beam diameter to about 10 μm at the fiber end to match this.

[0046] In addition, the mode field diameter on the optical fiber side may be adjusted as necessary. For example, if the optical fiber is known as a high NA fiber, the mode field diameter can be changed to about 4 μm, which can be made to be approximately the same as the mode field diameter of the silicon photonics end face. In this case, it is not necessary to expand the beam diameter at the fiber end and the silicon photonics end, and the beam adjustment unit can be configured by a coupling system using one lens, two lenses, or three lenses, or a collimating system.

[0047] In addition, in Figure 1, one optical fiber and one silicon photonics circuit are shown as a side cross-sectional view, but multiple (multiple channels) optical fibers and multiple silicon photonics circuits may be arranged in the depth direction (Y direction) of the paper.

[0048] For example, as shown in Figures 2A and 2B, four waveguide cores 111 and four optical fibers are arranged to be connected. In this case, as shown in Figure 2A, the mirror section 121 and the beam diameter tuning section 122 may use a structure that functions collectively for the multiple waveguide cores 111, or as shown in Figure 2B, an individual structure (mirror section 121 and beam diameter tuning section 122) may be arranged for each waveguide core 111.

[0049] Although not shown in the drawings, the mirror section may function collectively on multiple waveguide cores and the beam diameter tuning section may function individually, or the mirror section may function individually and the beam diameter tuning section may function collectively on multiple waveguide cores.

[0050] As described later, the beam diameter adjustment unit is not limited to one, and may be a combination of multiple structures. In that case, a beam diameter adjustment unit may be provided in front of the mirror unit. Also, a component that simultaneously exhibits a beam diameter adjustment function and a mirror function, such as a concave mirror, may be used.

[0051] The relative positions of the beam diameter adjusting portion 122, the mirror portion 121, the optical waveguide device 11, and the optical fiber 13 in the optical path conversion component 12 can be fixed after being aligned by a known active alignment technique.

[0052] In the manufacturing process of the mounting structure of the optical waveguide device 11 according to this embodiment, it is not necessary to align everything, and as described above, only the beam diameter adjusting portion 122 and the mirror portion 121 may be divided in advance and integrated into one member after alignment. Also, the optical path changing component 12 and the optical waveguide device 11 may be aligned in advance before flip-chip mounting to form an integrated connecting member. This can reduce the process load.

[0053] Moreover, each component may be aligned and integrated using passive alignment based on the component accuracy, without using active alignment.

[0054] In addition, in this embodiment, an example has been shown in which the optical waveguide device 11 is connected to the optical fiber 13, but it may be connected to another optical waveguide device, for example, to a polymer waveguide.

[0055] Furthermore, the interposer 15 may be equipped with a plurality of electric elements and optical waveguide devices.

[0056] Although an example in which a silicon photonics chip is used as the optical waveguide device 11 has been shown, other optical waveguide devices may be used. For example, a device in which optical functional elements such as an optical light emitting element, an optical light receiving element, an optical modulation element, and a planar lightwave circuit made of quartz glass or the like are integrated may be used. Here, examples of optical functional elements include splitters, wavelength multiplexers / demultiplexers, optical switches, polarization control elements, and optical filters. In this way, an optical waveguide device in which an optical light emitting element, an optical light receiving element, an optical modulation element, an optical functional element, an optical amplification element, and the like having a mechanism for propagating and guiding light are integrated may be used.

[0057] For example, an adhesive is filled between the end faces of the optical waveguide device and the optical path changing component 12 to fix them together.

[0058] Furthermore, when the mirror section 121 and the beam diameter adjusting section 122 are combined with other components, the respective components are similarly integrated with an adhesive or the like to form the optical path changing component 12. At this time, for example, as shown in Fig. 4B described below, the optical waveguide device 11 and the optical path changing component 12 may be integrated via a support component 21. Furthermore, the optical path changing component 12 may be fixed onto the upper surface of the interposer 15, or may be fixed with an adhesive or the like.

[0059] 3, in this embodiment, flip-chip mounting may be performed directly on the electrical mounting substrate 18 without using an interposer. For example, a build-up substrate may be used as the electrical mounting substrate 18, and LSI elements such as a CPU / GPU / MPU for a computer may be integrated on the same substrate to configure an optical interconnection. In this case, since there is no electrical wiring portion for the interposer, electrical signals can be transmitted with less loss and no latency.

[0060] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0061] In conventional mounting structures for optical waveguide devices, the optical waveguide device was placed near the edge of the interposer, etc. This restricted the high-density electrical wiring design, which enlarged the pad pitch when laying out the electrical wiring from the electrical contacts on the back surface of the interposer, and wired with the lowest possible loss. In addition, in conventional mounting structures for optical waveguide devices, providing cavities such as notches increased costs and could degrade characteristics.

[0062] On the other hand, in the mounting structure of the optical waveguide device according to this embodiment, the contact pad terminals for electrical connection with the optical waveguide can be arranged on any surface of the interposer without providing a notch or the like, thereby improving the freedom in deploying the electrical wiring and enabling the design of a faster, higher density interposer.

[0063] Furthermore, restrictions on the mounting position of the optical waveguide device can be eliminated, and a highly flexible mounting structure for the optical waveguide device can be realized.

[0064] For example, in the mounting structure of conventional optical waveguide devices, the optical fiber could only be placed outside the interposer, meaning that optical fiber fixing components and the like consumed unnecessary space on the PCB.

[0065] On the other hand, in the mounting structure of the optical waveguide device according to the present embodiment, it is possible to eliminate the constraints imposed on the mounting of the optical waveguide device. For example, by arranging the optical fiber fixing component on the upper part of the interposer surface, it is possible to save the substantial area within the surface, and it is possible to realize a mounting structure of the optical waveguide device with higher density.

[0066] <Second embodiment> A mounting structure of an optical waveguide device according to a second embodiment of the present invention will be described with reference to FIGS. 4A to 4F.

[0067] <Configuration of mounting structure for optical waveguide device> 4A-F show side cross-sectional views of a mounting structure of an optical waveguide device according to a second embodiment of the present invention. The basic components are the same as those of the first embodiment, with the optical waveguide device 11 being a silicon photonics chip, the interposer 15 being an LTCC substrate, and the optical fiber 13 being a normal single mode fiber.

[0068] In FIG. 4A, in the optical path conversion component 12, the mirror component 121 and the beam diameter adjustment component 122 are not integrated, but are configured as separate components.

[0069] The mirror component 121 is made of a triangular prism component, and is adhesively fixed to the end face of the optical waveguide device 11. Here, the triangular prism component is made of glass, but may be a resin molded product, a resin structure, or a silicon structure as necessary.

[0070] The beam diameter adjustment part 122 is composed of a microlens array, and a microlens is mounted on each waveguide core 111 in the depth direction (Y direction) of the paper. The microlens is composed of a single lens system, and converts the beam diameter expanded after passing through the mirror part 121 and the mirror, and focuses the beam on the fiber core part. The beam diameter adjustment part (lens) 122 has a support part 123 and is arranged at an appropriate position.

[0071] As described above, by converting the optical path through which light is input and output from the optical waveguide device 11, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in a flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0072] This, like the first embodiment, eliminates restrictions on the interposer design and on the mounting position of the optical waveguide device 11, making it possible to realize a highly flexible and high-density mounting structure.

[0073] 4A, a single lens system is described as an example, but a two-lens system or a three-lens system may be used. Also, instead of a microlens array, a common lens corresponding to a plurality of optical waveguide cores 111 may be used.

[0074] In this embodiment, an example has been shown in which the beam diameter adjusting component shown in FIG. 4A is used, but beam diameter adjusting components of other forms may also be used.

[0075] 4B, a GRIN lens component is used as the beam diameter adjustment component 122 after the mirror component 121 (on the optical fiber side). Here, the optical waveguide device 11 and the beam diameter adjustment component 122 are arranged via a support 21, and a microlens array (second beam diameter adjustment unit) 122_2 is mounted on the input / output end face of the optical waveguide device 11 to convert the light into collimated light.

[0076] 4C, a microlens array 122_2 is mounted on the input / output end face of the optical waveguide device 11, and a two-lens system is configured as the beam diameter adjusting unit 122 after the mirror component 121 (on the optical fiber side).

[0077] 4D, the beam diameter tuning section 12 may include a GRIN lens component 122 and a two-lens system 122_2 between the mirror section 121 and the optical waveguide device 11.

[0078] As shown in FIG. 4E, the beam diameter adjustment sections 122_2, 122 may be configured using a GRIN lens or a GI fiber between the mirror section 121 and the optical waveguide device 11 and between the mirror section 121 and the optical fiber 13.

[0079] As described in the first embodiment, the angle of optical path conversion by the mirror may be changed from 90 degrees as shown in Fig. 4F. Similarly, although the beam diameter tuning unit 122 is shown as a coaxial system using lenses and GI components as an example, the arrangement of the central axis may be shifted so as to add an offset to the optical path instead of being coaxial.

[0080] As a result, in addition to the effects mentioned above, the mounting accuracy tolerance of the relative positions of the mirror portion 121, the beam diameter adjusting component 122, the optical waveguide device 11, and the optical fiber 13 can be increased, thereby reducing the process load.

[0081] <Third embodiment> A mounting structure of an optical waveguide device according to a third embodiment of the present invention will be described with reference to FIGS. 5A to 5E.

[0082] <Configuration of mounting structure for optical waveguide device> 5A to 5E are side cross-sectional views of a mounting structure of an optical waveguide device according to a third embodiment of the present invention. The basic components are the same as those of the first embodiment.

[0083] The difference from the first and second embodiments is that the direction of the optical fiber 13 is rotated by 90 degrees and is arranged parallel to the longitudinal direction (X direction) of the optical waveguide device 11. These can be combined with various modified examples as described in the first and second embodiments.

[0084] For example, in FIG. 5A, a mirror part 121 is disposed near the end face of the optical waveguide device 11, and after passing through a beam diameter adjustment section 122, the optical path is converted by a second mirror section 121_2 and the optical fiber 13 is connected thereto.

[0085] In FIG. 5B, in addition to the configuration of the beam diameter tuning section shown in FIG. 5A, a two-lens system 122_3 is provided between the optical fiber 13 and the mirror.

[0086] In FIG. 5C, in addition to the configuration of the beam diameter adjustment section shown in FIG. 5A, a beam diameter adjustment section 122_4 using a lens is provided in front of the second mirror section 121_2 (on the first mirror section side).

[0087] In FIG. 5D, a fiber support portion 31 that supports the optical fiber 13 is provided, and the optical fiber 13 is supported on the interposer 15 substrate.

[0088] In FIG. 5E, the orientation of the second mirror portion 121_2 is rotated by 180 degrees, and the fiber fixing component 14 is provided directly above the optical waveguide device 11. In FIG.

[0089] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0090] This similarly eliminates restrictions on interposer design and on the mounting position of optical waveguide devices, enabling a highly flexible, high-density mounting structure to be realized.

[0091] In addition to the above effects, by changing the direction of the optical fiber by 90 degrees and making it parallel to the in-plane direction of the interposer or electrical mounting board, it is possible to facilitate the handling of the fiber on the electrical mounting board.

[0092] For example, compared to the configurations in the first and second embodiments, the height in the substrate thickness direction (Z direction) can be made lower.

[0093] Furthermore, in the configurations of the first and second embodiments, in order to align the fiber direction with the in-plane direction of the electrical mounting board, the fiber needs to be bent by 90 degrees, requiring a certain bending radius.

[0094] On the other hand, in the configuration of this embodiment, the fiber direction is aligned in the in-plane direction of the electrical mounting board in advance, so that the process load and space required in the thickness direction for fiber routing can be reduced.

[0095] The configuration in which the second mirror is provided in this embodiment can of course be similarly combined with the first and second embodiments and the embodiments described below.

[0096] <Fourth embodiment> A mounting structure of an optical waveguide device according to a fourth embodiment of the present invention will be described with reference to FIGS. 6A to 6E.

[0097] <Configuration of mounting structure for optical waveguide device> 6A to 6E are side cross-sectional views of a mounting structure of an optical waveguide device according to a third embodiment of the present invention. The basic components are the same as those of the first embodiment.

[0098] The difference from the first to third embodiments is that the mirror part is not integrated with the optical waveguide device, but is arranged and fixed on the upper surface of the interposer. Here, an example of the mounting structure of the optical waveguide device according to this embodiment is shown in Figures 6A-E, but similar configurations can be applied in the same way.

[0099] 6A-C, in order to improve the mountability on the interposer 15, for example, a cube-shaped prism in which triangular prisms are combined is used for the mirror section 121. Also, a microlens 122_2 is disposed on the end face side of the optical waveguide device 11 in the mirror section 121.

[0100] 6D and 6E, a normal mirror may be used for the mirror section 11. In this case, a step structure for mounting the mirror section 121 may be provided on the interposer 15 side depending on the degree of expansion of the beam diameter.

[0101] Moreover, as shown in FIG. 6E, the function of the beam diameter adjustment unit 122 may be integrated into the mirror unit 11 by using a concave mirror.

[0102] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0103] This similarly eliminates restrictions on interposer design and on the mounting position of optical waveguide devices, enabling a highly flexible, high-density mounting structure to be realized.

[0104] In addition to the above effects, mounting the mirror part on the interposer surface increases adhesive strength and simplifies the alignment process, thereby improving mounting reliability and reducing the process load.

[0105] In particular, by preparing mounting marks and mounting structures for the mirror part in advance so that they are in specified positions relative to the pad positions for electrical contacts on the interposer, it is possible to mount the optical path conversion components on the interposer based solely on the precision of the components, thereby reducing the process load.

[0106] <Fifth embodiment> Next, a mounting structure of an optical waveguide device according to a fifth embodiment of the present invention will be described with reference to FIGS. 7A to 7C.

[0107] <Configuration of mounting structure for optical waveguide device> 7A to 7C are side cross-sectional views of a mounting structure of an optical waveguide device according to a fifth embodiment of the present invention. The basic components are the same as those of the first embodiment.

[0108] The difference from the first to fourth embodiments is that a GI fiber is used as an optical path conversion component, and a plurality of GI fibers are arranged in the depth direction (Y direction) of the paper surface, the number of which corresponds to the number of cores of the optical waveguide device.

[0109] By cutting the GI fiber to a specified length, it can function as a beam diameter adjustment unit and can collimate, expand, and focus the beam. In addition, by cutting or polishing the tip of the GI fiber to an angle of, for example, 45 degrees, it can also function as a mirror unit. If necessary, the reflection efficiency can be increased by applying a high-reflection coating.

[0110] In this manner, the GI fiber has a mirror unit 121 and a beam diameter adjusting unit 122.

[0111] The GI fiber is fixed and aligned as shown in Figures 7A-C. A second fiber fixing component 14_2 or the like may be used to fix the GI fiber.

[0112] In the mounting structure of the optical waveguide device, as shown in FIG. 7A, a GI fiber having a predetermined end face angle as a mirror portion 121 is disposed in the vicinity of an end face of the optical waveguide device 11, and is connected to the fiber fixing part 14 while adjusting the beam diameter by a beam diameter adjusting portion 122.

[0113] Also, as shown in FIGS. 7B and 7C, the beam diameter tuning section does not have to be configured with only a GI fiber, and other lens components or lens structures, GRIN lenses, etc. may be combined (122_2 in the figures).

[0114] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0115] This similarly eliminates restrictions on interposer design and on the mounting position of optical waveguide devices, enabling a highly flexible, high-density mounting structure to be realized.

[0116] In addition to the above effects, by consolidating the beam diameter adjustment section and the mirror section into the GI fiber, the number of components can be reduced, and it is easy to create an array that can accommodate multiple waveguide cores.

[0117] Sixth embodiment Next, a mounting structure of an optical waveguide device according to a sixth embodiment of the present invention will be described with reference to FIGS. 8A to 9B.

[0118] <Configuration of mounting structure for optical waveguide device> In the mounting structure of the optical waveguide device according to this embodiment, an optical path changing component is connected to a ferrule to which an optical fiber is fixed. The other basic components are the same as those of the first to fifth embodiments.

[0119] The mounting structure of the optical waveguide device is similar to that of the fifth embodiment, as shown in FIGS. 8A and 8B.

[0120] The optical path changing part 12 includes a GI fiber having a mirror part 121 and a beam diameter adjusting part 122, and a GI fiber fixing part 14_2 for fixing the GI fiber. Here, an end face of the GI fiber fixed to the GI fiber fixing part 14_2 faces an end face of the optical fiber 13 of the ferrule 41 and is connected to be optically coupled.

[0121] In the GI fiber, the oblique end face as the mirror portion and the micromirror as the beam diameter adjusting portion are integrated.

[0122] The mounting structure of the optical waveguide device may be similar to the configuration of the fourth embodiment, as shown in Figures 9A and 9B. In this configuration, the beam diameter tuning unit 122 and the mirror unit 121 are integrated and mounted on the interposer 15.

[0123] The configuration of this embodiment can be used in combination with the structures of the first to fifth embodiments.

[0124] A known MT ferrule can be used as the multi-core ferrule 41. The MT ferrule has two guide pins 42 for alignment, and is positioned by inserting the guide pins into pin holes 43.

[0125] 8B or 9B, the optical path changing component 12 has guide pin holes 43 corresponding to the guide pins 42 of the ferrule 41. Although not shown in the drawings, after the connector is connected, the connection can be maintained by mechanically fitting and pressing the MT ferrule using a clip or leaf spring component that presses the MT ferrule.

[0126] The material of the ferrule may be a filler-containing resin used in MT ferrules, or other resin materials, glass materials, ceramic materials, metal materials, Si, or the like.

[0127] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0128] This similarly eliminates restrictions on interposer design and on the mounting position of optical waveguide devices, enabling a highly flexible, high-density mounting structure to be realized.

[0129] In addition to the above effects, by using a ferrule as the fiber fixing component, a detachable multi-core connector connection between the optical waveguide device and the optical fiber can be realized.

[0130] This allows the interposer to be mounted on the electrical packaging board without the need for optical fibers or fiber fixing parts, and the fiber can be connected after mounting on the electrical packaging board, which increases the flexibility of the process and eliminates packaging constraints.

[0131] <Seventh embodiment> Next, a mounting structure of an optical waveguide device according to a seventh embodiment of the present invention will be described with reference to FIGS. 10A to 12B.

[0132] <Configuration of mounting structure for optical waveguide device> 10A and 10B show a package structure (before mounting on an electrical mounting board) and a mounting structure in a side cross-sectional view of the mounting structure of an optical waveguide device according to the seventh embodiment of the present invention. The basic components are the same as those of the first to sixth embodiments and can be used in any of the embodiments. The difference from the first to sixth embodiments is that it is composed of a thin-film electrical wiring layer called a rewiring layer instead of an interposer.

[0133] The thin-film electrical wiring layer 51 is a multi-layer wiring layer in which, for example, copper foil layers and insulating resin layers are alternately laminated, and is generally called a re-distribution layer (RDL) when manufactured by fan-out wafer-level package (FOWLP) technology or fan-out panel-level package (FOPLP) technology.

[0134] There are several methods for fan-out packaging, but by adopting the "RDL-first method," in which an electrical wiring layer (RDL) is first formed on a supporting substrate (wafer or panel), then chip mounting and resin molding are performed, and finally the supporting substrate is peeled off, the structure shown in Figures 10A and B can be produced.

[0135] However, the thin-film electrical wiring layer 51 is not limited to RDL, and may be a more general wiring substrate (organic build-up substrate or ceramic substrate). Furthermore, in such a wiring substrate, it is possible to partially reduce the substrate thickness or provide a notch.

[0136] Since each of the thin-film electrical wiring layers 51 is very thin, when it is mounted on an electrical mounting board, the distance in the thickness direction between the optical waveguide layer and the top of the electrical mounting board becomes very small.

[0137] As described above, by converting the optical path through which light is input and output to and from the optical waveguide device, when the waveguide layer and the upper surface of the interposer or the electrical mounting board are arranged in close proximity to each other, such as in flip-chip connection, it is possible to achieve low-loss optical connection while avoiding mechanical interference between the interposer or the electrical mounting board and the optical fiber fixing component.

[0138] This similarly eliminates restrictions on interposer design and on the mounting position of optical waveguide devices, enabling a highly flexible, high-density mounting structure to be realized.

[0139] In addition to the above effects, the use of mold resin 52 allows the optical path changing component 12 to be integrated, and the device can be handled as a package in the state of Fig. 10A. Also, the structure shown in Fig. 10A can be manufactured at the wafer level and panel level by the above-mentioned fan-out package manufacturing method, which provides the effect of excellent manufacturability.

[0140] As shown in FIGS. 11A and 11B, the configuration of the fifth embodiment may be configured by using a thin-film electrical wiring layer 51 and a mold resin 52 by fan-out package technology.

[0141] FIG. 11A shows an example of a configuration in which a fiber fixing component is adhesively fixed by active alignment.

[0142] The optical path changing component 12 includes a GI fiber having a mirror portion 121 and a beam diameter adjusting portion 122, and a pair of microlenses 122_2 between the optical waveguide device 11. The GI fiber is fixed by a second fiber fixing component 14_2.

[0143] The optical fiber 13 is fixed to a fiber fixing component 14, and is coupled to the optical path changing component 12 by the second mirror portion 121_2.

[0144] Also, Fig. 11B shows an example of a configuration in which a ferrule is used instead of a fiber fixing part for fixing an optical fiber, and the rest is the same as the configuration shown in Fig. 11A.

[0145] The optical fiber 13 is fixed to the ferrule 41, and is coupled to the optical path changing component 12 by the second mirror portion 121_2.

[0146] Moreover, the ferrule 41 has a guide pin 42, the fiber fixing part 14_2 has a guide hole 43, and the guide pin 42 and the guide hole 43 are fitted together to fix the ferrule 41 and the fiber fixing part 14_2.

[0147] In FIG. 11, a second mirror is provided on the optical fiber side in the same manner as in the third embodiment to change the optical path.

[0148] 11B, the longitudinal direction of the guide pin 42 (Z direction in the figure) is arranged perpendicular to the direction of the optical fiber 13 (X direction in the figure), and the relative positions of the optical fiber 13 and the guide pin 42 are adjusted with high precision. Therefore, with the configuration in FIG. 11B, a connector connection can be realized in the same way as in the sixth embodiment.

[0149] The beam diameter tuning unit 122 may have the configurations of the first to sixth embodiments, but in the example of Figures 11A and 11B, for example, the light propagates through the mold resin. Therefore, the mold resin has a certain level of transmittance or higher for the wavelength of the signal light.

[0150] In addition, when the beam diameter tuning unit 122 is made to function as a lens, it is necessary to provide a difference in refractive index between the beam diameter tuning unit (lens) and the molding resin, so the resin is made to have a low refractive index. Alternatively, the beam diameter tuning unit (lens) is appropriately set by making it from a high refractive index medium such as silicon.

[0151] Further, the end faces of all the components are designed to prevent reflected light from returning to the optical waveguide device 11 by providing a known anti-reflection film or by shifting the end face angle from a right angle.

[0152] Furthermore, as shown in FIGS. 12A and 12B, the configuration of the second embodiment may be configured by using a thin-film electrical wiring layer 51 and a mold resin 52 by fan-out package technology.

[0153] Fig. 12A shows an example of a configuration in which adhesive fixing by active alignment is used for the fiber fixing component 14. Also, Fig. 12B shows an example of a configuration in which a ferrule 41 and a guide pin as the fiber fixing component and a corresponding guide hole are provided in the optical path changing component 12.

[0154] Therefore, in the configuration of FIG. 12B, connector connection can be achieved in the same manner as in the sixth embodiment.

[0155] In this embodiment, the beam diameter adjusting unit is composed of the GRIN lenses 122 and 122_2, and the beam diameter is converted without propagating through the mold resin. This has the advantage that the transmittance and refractive index of the mold resin part as described above do not need to be taken into consideration.

[0156] According to the optical waveguide device of the present embodiment, since it can be manufactured at the wafer level and panel level by the fan-out package manufacturing method, it has an advantage of being excellent in manufacturability.

[0157] In the embodiment of the present invention, an example in which guided light propagates from an optical waveguide device to an optical fiber has been shown, but the present invention can also be applied to a case in which guided light propagates from an optical fiber to an optical waveguide device.

[0158] In the embodiment of the present invention, examples of the structure, dimensions, materials, etc. of each component in the configuration of the mounting structure for the optical waveguide device are shown, but the present invention is not limited to these. Anything that can exert the function and effect of the mounting structure for the optical waveguide device may be used. [Industrial Applicability]

[0159] The present invention relates to a mounting structure for an optical waveguide device, and can be applied to equipment and systems for optical communications and the like. [Explanation of symbols]

[0160] 10 Mounting structure of optical waveguide device 11 Optical Waveguide Devices 111 Waveguide core 12 Optical path conversion parts 121 Mirror section 122 Beam diameter adjustment unit 13 Optical Fiber 14 Fiber Fixing Parts 15 Interposer 18 Electrical mounting board

Claims

1. A mounting structure for an optical waveguide device into and out of which light is incident, comprising: Above the electrical mounting board, an optical waveguide device; a fiber fixing component to which the optical fiber is fixed; an optical path changing component disposed between the optical waveguide device and the fiber fixing component; Equipped with the optical waveguide device is mounted on an upper surface of the electrical mounting board or an interposer on the electrical mounting board with a surface of the optical waveguide device facing a waveguide core side; the optical waveguide device and the optical fiber are optically coupled via the optical path changing component; the optical path changing component has a mirror portion on the optical waveguide device side and a beam diameter adjusting portion on the fiber fixing component side with respect to the mirror portion, the optical path changing component is fixed to and integrated with an end surface of the optical waveguide device; The mirror portion reflects the light incident on the mirror portion at a predetermined angle so that the light can be incident on and emitted from a waveguide core of the optical waveguide device upward to a mounting structure of the optical waveguide device.

1. A mounting structure for an optical waveguide device comprising:

2. The optical path changing component includes a GI fiber, The GI fiber is fixed to an end face of the optical waveguide device.

2. The mounting structure of an optical waveguide device according to claim 1.

3. A mounting structure for an optical waveguide device into and out of which light is incident, comprising: Above the electrical mounting board, an optical waveguide device; a fiber fixing component to which the optical fiber is fixed; an optical path changing component disposed between the optical waveguide device and the fiber fixing component; a support portion fixed to an end surface of the optical waveguide device; Equipped with the optical waveguide device is mounted on an upper surface of the electrical mounting board or an interposer on the electrical mounting board with a surface of the optical waveguide device facing a waveguide core side; the optical waveguide device and the optical fiber are optically coupled via the optical path changing component; the optical path changing component has a mirror portion on the optical waveguide device side and a beam diameter adjusting portion on the fiber fixing component side with respect to the mirror portion, the optical waveguide device is disposed at a distance from the optical path changing component via the support portion, the optical path changing component has a second beam diameter adjusting portion between the mirror portion and the optical waveguide device, is fixed to and integrated with the support portion, and is optically connected to an end face of the optical waveguide device via the second beam diameter adjusting portion; The mirror portion reflects the light incident on the mirror portion at a predetermined angle so that the light can be incident on and emitted from a waveguide core of the optical waveguide device upward to a mounting structure of the optical waveguide device.

1. A mounting structure for an optical waveguide device comprising:

4. The second beam diameter adjusting unit is a microlens.

4. The mounting structure of an optical waveguide device according to claim 3.

5. The mirror portion reflects the light incident on the mirror portion in a direction oblique to a direction perpendicular to the upper surface.

5. The mounting structure of an optical waveguide device according to claim 3 or 4.

6. the optical path changing component includes another mirror portion on the fiber fixing component side, the other mirror portion reflects light incident on the other mirror portion at a predetermined angle; The traveling direction of light guided through the optical waveguide device is parallel to the traveling direction of light guided through the optical fiber.

5. The mounting structure of the optical waveguide device according to claim 1, wherein the mounting structure is a structure including a first insulating layer and a second insulating layer.

7. The fiber fixing component is disposed directly above the optical waveguide device.

7. The mounting structure of an optical waveguide device according to claim 6.

8. the fiber fixing component is a ferrule, The ferrule has a guide pin, The optical path changing component has a guide pin hole into which the guide pin fits.

8. The mounting structure of the optical waveguide device according to claim 1, wherein the mounting structure is a structure including a first insulating layer and a second insulating layer.

9. The optical waveguide device, the mirror portion, and the optical path changing component are covered with a molding resin.

9. The mounting structure of the optical waveguide device according to claim 1,

Images