Pressure Sensor Characterization Module

Abstract

To provide a characterization module for a pressure sensor capable of conducting a characterization in a state in which the thermal capacity of an object to maintain a constant temperature at the characterization is small.SOLUTION: A characterization module 11 for a pressure sensor 14 accommodates the pressure sensor 14 including a sensor package 17 on a substrate 16 and also including first and second pressure introduction pipes 18, 19 extending from the sensor package 17, and is to be used for conducting a characterization of the pressure sensor 14. The characterization module also includes a pressure sensor molding member 15 including: a substrate holding part 27 configured to engage with a peripheral part of the substrate 16 to accommodate and hold the substrate 16; and first and second washer insertion holes 53, 54 penetrating through first and second washers 35, 36 at tips of the first and second pressure introduction pipes 18, 19 to enable a fluid pressure from outside to be transmitted to the first and second pressure introduction pipes 18, 19.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present invention relates to a pressure sensor characterization module used for characterizing a pressure sensor. [Background technology]

[0002] Industrial pressure gauges, as described in Patent Document 1 for example, are equipped with a sensor element made of Si or the like to detect pressure. After the manufacturing process is completed, this type of pressure gauge undergoes a correction called characterization before being sent to the next process. Characterization is performed to remove the effects of the surrounding environment, such as the surrounding temperature and pressure.

[0003] As shown in Fig. 19, the pressure measuring device shown in Patent Document 1 includes a sensor header 2 that houses a sensor element 1, a metal body 3 that supports the sensor header 2, and a cover 4. In order to protect the sensor element 1 from an external corrosive environment such as a measurement medium, this pressure measuring device 5 has a configuration in which the sensor element 1 is housed in the sensor header 2, and the sensor header 2 is further enclosed in a metal body 3 made of stainless steel or the like. Oil 7 is sealed in a pressure guide path 6 in the metal body 3 as a pressure transmission medium that transmits pressure to the sensor element 1. The sensor element 1 is electrically connected to an external output pin 9 of the cover 4 via a wiring 8 in the sensor header 2.

[0004] The sensor header 2 of the pressure measuring device 5 shown in Patent Document 1 is fixed by welding to a metal body 3 and a cover 4. In this pressure measuring device 5, characterization of the sensor element 1 is performed by connecting a characterization board (not shown) to the external output pin 9 after welding the sensor header 2 to the metal body 3 and the cover 4. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-187047 A Summary of the Invention [Problem to be solved by the invention]

[0006] In the pressure measuring device 5 described in Patent Document 1, characterization of the sensor element 1 is performed after the sensor header 2 is welded to the metal body 3 and the cover 4. For this reason, when performing characterization, the temperatures of the metal body 3 and the cover 4 must be maintained at the same temperature as that of the sensor element. In other words, the pressure measuring device 5 shown in Patent Document 1 has problems in that the equipment for performing characterization is large, and a long time is required for temperature stabilization because the heat capacity of the object to be kept constant in characterization is large.

[0007] An object of the present invention is to provide a module for characterizing a pressure sensor that enables characterization to be performed in a state in which the heat capacity of an object to be kept constant during characterization is small. [Means for solving the problem]

[0008] In order to achieve this object, the pressure sensor characterization module of the present invention is a pressure sensor characterization module used to accommodate a pressure sensor having a sensor package placed on a first surface of a substrate and a pressure introduction pipe extending from the sensor package through the substrate to the opposite side of the first surface of the substrate and having a washer at its end, and is equipped with a pressure sensor holding member having a substrate holding portion that engages with the peripheral portion of the substrate to accommodate and hold the substrate, and a washer insertion hole through which the washer of the pressure introduction pipe is inserted and which enables external fluid pressure to be transmitted to the pressure introduction pipe.

[0009] The present invention may also provide a cover member in the pressure sensor characterization module, the cover member having a holding member engagement portion that engages with the pressure sensor holding member and an electric wire connection hole for connecting an electric wire from the outside to wiring on the substrate, and forming a housing by combining with the pressure sensor holding member so as to cover the first surface of the substrate.

[0010] In the present invention, in the module for characterizing the pressure sensor, the bottom surface of the pressure sensor holding member may be provided with a positioning portion having a concave or convex portion for engaging with a convex or concave portion formed on the upper surface of a stage portion of a characterization device to position the sensor on the stage portion. Effect of the Invention

[0011] According to the present invention, characterization can be performed without assembling the pressure sensor to the body of the pressure measurement device, and therefore it is possible to provide a pressure sensor characterization module that allows characterization to be performed in a state where the heat capacity of the object to be kept constant during characterization is small. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a pressure sensor characterization module according to the present invention. [Diagram 2] FIG. 2 is an exploded perspective view of a module for characterizing a pressure sensor. [Diagram 3] FIG. 3 is a perspective view of the cover member. [Figure 4] FIG. 4 is an enlarged perspective cross-sectional view showing a portion of the cover member and the pressure sensor holding member. [Diagram 5] FIG. 5 is a perspective cross-sectional view of the characterization module. [Figure 6] FIG. 6 is an exploded perspective view of the pressure measuring device with the pressure measuring device body cut away. [Figure 7]FIG. 7 is a perspective cross-sectional view of the sensor package and the pressure introduction pipe. [Figure 8] FIG. 8 is an exploded perspective view of the pressure sensor. [Figure 9] FIG. 9 is a perspective view of the pressure sensor holding member. [Figure 10] FIG. 10 is an enlarged perspective cross-sectional view showing a part of the pressure sensor holding member and the substrate. [Figure 11] FIG. 11 is a perspective cross-sectional view of the characterization module. [Figure 12] FIG. 12 is a perspective view of the characterization device. [Figure 13] FIG. 13 is a perspective cross-sectional view of a portion of the characterization device. [Figure 14] FIG. 14 is a perspective view showing a part of the base member. [Figure 15] FIG. 15 is an enlarged cross-sectional view of a portion of the characterization device and the characterization module. [Figure 16] FIG. 16 is an enlarged cross-sectional view showing a part of the characterization device and the characterization module. [Figure 17] FIG. 17 is a perspective view showing a washer pressing pin. [Figure 18] FIG. 18 is a side view for explaining the operation of the toggle clamp. [Figure 19] FIG. 19 is a cross-sectional view of a conventional pressure measuring device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, one embodiment of a pressure sensor characterization module according to the present invention will be described in detail with reference to FIGS. The characterization module 11 shown in Fig. 1, in a form for storage and transportation, includes a cylindrical cover member 12 with a bottom, and a cap 13 that closes the opening of the cover member 12 to protect the inside. When characterization is performed, the cap 13 is removed from the cover member 12. In the following, when indicating directions in the explanation of the characterization module 11, the characterization module 11 will be explained in a position during characterization. The position during characterization is a position in which the bottom wall 12a of the cover member 12 shown in Fig. 1 faces upward.

[0014] 2, a pressure sensor 14 and a pressure sensor holding member 15 are housed inside the cover member 12 and the cap 13. The pressure sensor 14 includes a sensor package 17 mounted on a first surface 16a of a substrate 16, and first and second pressure introduction pipes 18 and 19, which will be described in detail later. The cover member 12 forms a housing for the characterization module 11 and is coupled to the pressure sensor holding member 15 so as to cover the first surface 16 a of the substrate 16 of the pressure sensor 14 .

[0015] As shown in Fig. 3(A), two insertion holes 21, 22 are formed in the bottom wall 12a (the upper wall in Fig. 3(A)) of the cover member 12. These insertion holes 21, 22 are holes for inserting pressing parts during characterization, which will be described later. As shown in FIG. 3(B), the peripheral wall 12b of the cover member 12 is provided with a holding member engaging portion 23, an electric wire connection hole 24, and a board positioning guide 25.

[0016] The holding member engagement portion 23 is composed of a module mounting hook 26 that engages with the pressure sensor holding member 15 described below. This module mounting hook 26 is formed so as to be able to bend in the radial direction of the cover member 12, and as shown in Fig. 4, is engaged with a board holding portion 27 of the pressure sensor holding member 15. The cover member 12 is joined to the pressure sensor holding member 15 by engaging the module mounting hook 26 with the board holding portion 27. The electric wire connection hole 24 is a hole for passing an electric wire 28 (see FIG. 12) from a characterization circuit (not shown) during characterization.

[0017] The board positioning guides 25 are for determining the circumferential position of the cover member 12 when the cover member 12 is attached to the pressure sensor holding member 15. If the circumferential angle differs by 180 degrees when the cover member 12 is attached to the pressure sensor holding member 15, the board positioning guides 25 will interfere with the connector 30 (see FIG. 5) on the board 16, making it impossible to attach the cover member 12.

[0018] 3(B), a recess 25a is formed in the board positioning guide 25. The recess 25a is formed so as to engage with the positioning protrusion 29 of the pressure sensor holding member 15, as shown in FIG. As shown in FIG. 5, the cap 13 is formed in a cylindrical shape with a bottom that fits onto the open end of the cover member 12 from the outside.

[0019] As shown in FIG. 6, the pressure sensor 14 is composed of a sensor package 17 located at the top in FIG. 6, first and second pressure introduction pipes 18, 19 each having one end connected to the sensor package 17, and a substrate 16 on which the sensor package 17 is placed and fixed. As shown in FIG. 7, the sensor package 17 includes a sensor case 31 and a pressure sensor chip 32 housed therein.

[0020] The first and second pressure introduction pipes 18, 19 are composed of first and second capillaries 33, 34 bent into a crank shape, and first and second washers 35, 36 welded to one end (lower end) of these capillaries 33, 34. The other end (upper end) of the first and second capillaries 33, 34 penetrates the bottom wall 31a of the sensor case 31 and is joined to the pressure sensor chip 32. An electrode pad 37 is provided on the bottom wall 31a of the sensor case 31. The electrode pad 37 is connected to a soldering land 38 (see FIGS. 6 and 8) of the substrate 16 when the sensor package 17 is mounted on the substrate 16. Although not shown, the electrode pad 37 is electrically connected to the pressure sensor chip 32 via wiring in the sensor case 31 and a bonding wire or the like that is stretched between the sensor case 31 and the pressure sensor chip 32.

[0021] 8, the substrate 16 is formed in a substantially circular plate shape, and has two circular through holes 41, 41, a slit 42 connecting these through holes 41, 41, and a plurality of holes 43 for connecting the connector 30. The through hole 41 is formed to pass the first and second washers 35, 36 of the pressure sensor 14. The slit 42 is formed to pass the first and second thin tubes 33, 34 of the first and second pressure introduction pipes 18, 19. The first and second pressure introduction pipes 18, 19 pass through the through hole 41 and the slit 42, and extend through the substrate 16 to the opposite side of the first surface 16a of the substrate 16.

[0022] In addition, the first surface 16a of the substrate 16 is provided with soldering lands 38 for connecting the sensor case 31. The soldering lands 38 are electrically connected to the connector 30 via a wiring pattern (not shown). The connector 30 is the tip of the "wiring on the substrate" as referred to in the present invention.

[0023] A pair of notches 44, 44 and a flat portion 45 are formed on the peripheral edge of the substrate 16. The notches 44 are provided at positions that divide the substrate 16 into two equal parts in the circumferential direction, and substrate mounting hooks 46 (see FIG. 2) of the pressure sensor holding member 15 described later are inserted into the notches 44. The flat portion 45 is formed to avoid interference with the board positioning guide 25 of the cover member 12 described above.

[0024] The pressure sensor holding member 15 is assembled together with the cover member 12 to a characterization device 47 (see FIG. 12) described below when characterizing the pressure sensor 14. After characterization is completed, the pressure sensor holding member 15 according to this embodiment is assembled into a pressure measuring device body 48 (see FIG. 6) together with the pressure sensor 14, the substrate 16, etc. The characterization device 47 and the pressure measuring device body 48 will be described later.

[0025] 9(A) and (B), the pressure sensor holding member 15 is formed in a cylindrical shape with a bottom that opens upward. A board holding portion 27 that houses and holds the board 16 is provided at the upper end of the pressure sensor holding member 15. The board holding portion 27 is composed of an upper end 51a of a peripheral wall 51 of the pressure sensor holding member 15, a positioning protrusion 29 that protrudes upward from the upper end 51a, and board mounting hooks 46. The upper end 51a is formed flat. The board mounting hooks 46 are formed so as to be flexible in the radial direction of the pressure sensor holding member 15, and as shown in Fig. 10, are inserted into the notches 44 of the board 16 to engage with the board 16. The board 16 is held by the pressure sensor holding member 15 in engagement with the board mounting hooks 46 with the peripheral edge of the lower surface of the board 16 placed on the upper end 51a.

[0026] 9(B), a first washer insertion hole 53 and a second washer insertion hole 54 are formed in the bottom wall 52 of the pressure sensor holding member 15. The first washer insertion hole 53 is a hole for inserting the first washer 35 of the pressure sensor 14, and the second washer insertion hole 54 is a hole for inserting the second washer 36. By inserting the first washer 35 into the first washer insertion hole 53 and the second washer 36 into the second washer insertion hole 54, it becomes possible for fluid pressure from the outside (from a characterization device 47 or a pressure measuring device body 48 described later) to be transmitted to the pressure introducing pipes 18, 19.

[0027] As shown in Fig. 9(A), ribs 55, 56 are formed on the upper surface of the bottom wall 52 so as to surround the first and second washer insertion holes 53, 54. Pipe positioning grooves 57 for passing the first and second capillaries 33, 34 are formed in these ribs 55, 56. As shown in Fig. 11, the upper end of the rib that forms the groove wall of the pipe positioning groove 57 is formed with a rounded portion 57a ​​that is rounded so that the first and second capillaries 33, 34 can be guided into the groove.

[0028] 9(B), a positioning portion 59 consisting of three protrusions 58 is provided on the bottom surface 52a (the lower surface of the bottom wall 52) of the pressure sensor holding member 15. The protrusions 58 of the positioning portion 59 position the pressure sensor holding member 15 relative to the characterization device 47 and the pressure measuring device body 48 so that the pressure sensor holding member 15 is attached to the characterization device 47 and the pressure measuring device body 48 in the correct position.

[0029] In this embodiment, these protrusions 58 correspond to the "protrusions provided on the bottom surface of the pressure sensor holding member" according to the present invention. These protrusions 58 are formed in a cylindrical shape and protrude downward from the bottom wall 52. Moreover, these protrusions 58 are formed so as to be distributed to one side (e.g., the front) and the other side (e.g., the rear) with respect to the imaginary line L connecting the first washer insertion hole 53 and the second washer insertion hole 54 as the center. In the pressure sensor holding member 15 shown in FIG. 9(B), two protrusions 58 are provided on one side (forward) of the imaginary line L, and one protrusion 58 is provided on the other side (rear) of the imaginary line L. That is, the number and positions of the protrusions 58 are asymmetric between the front and rear.

[0030] The pressure sensor holding member 15 is a component that forms the framework of the characterization module 11. As shown in FIG. 11, the characterization module 11 is assembled by attaching the cover member 12 and the cap 13 to the outside of the pressure sensor holding member 15 with the pressure sensor 14 housed inside the pressure sensor holding member 15. The characterization module 11 is stored and transported in the form shown in FIG. 11, and during characterization, it is loaded into a characterization device 47 described below with the cap 13 removed. As shown in FIG. 11, in the stored and transported form, gaps are formed between the inner bottom surface 13a of the cap 13 and the pressure sensor holding member 15 and between the cap 13 and the first and second washers 35 and 36.

[0031] The characterization device 47 is for characterizing the pressure sensor 14 while the pressure sensor 14 is housed in the characterization module 11, and as shown in Fig. 12, includes a base member 61 on which the characterization module 11 is placed, and a module fixing portion 62 that restricts movement of the characterization module 11 relative to the base member 61 during characterization. This characterization device 47 is formed so as to have a smaller heat capacity than a pressure measuring device body 48 described later.

[0032] The base member 61 is made of a metal material and formed into a predetermined shape. A stage portion 63 that abuts against the bottom surface of the characterization module 11 to support the characterization module 11 is provided on the upper surface of the base member 61. As shown in FIG. 13, a first test fluid introduction hole 64 and a second test fluid introduction hole 65 that introduce the pressure of a test fluid (not shown) used for characterization of the pressure sensor 14 are formed on one side and the other side of the base member 61. A first pressure introduction path 66 and a second pressure introduction path 67 that extend from the first and second test fluid introduction holes 64, 65 toward the stage portion 63 are formed inside the base member 61.

[0033] As shown in Figs. 14(A) and 14(B), the stage portion 63 is formed with first and second washer insertion holes 68, 69, three positioning holes 70, and one annular groove 71 surrounding the first and second washer insertion holes 68, 69 and the positioning holes 70. As shown in Figs. 15 and 16, the first and second washer insertion holes 68, 69 are formed in a shape that allows the first and second washers 35, 36 to be inserted at positions facing the first and second washer insertion holes 53, 54 of the pressure sensor holding member 15 placed on the stage portion 63. The first pressure introduction path 66 described above opens into the first washer insertion hole 68. The second pressure introduction path 67 opens into the second washer insertion hole 69.

[0034] An O-ring 72 for sealing between the stage portion 63 and the first and second washers 35, 36 is inserted into the first and second washer insertion holes 68, 69. The O-ring 72 is sandwiched between an O-ring groove 73 formed in the first and second washer insertion holes 68, 69 and the first and second washers 35, 36.

[0035] The positioning hole 70 is formed so that the protrusion 58 fits into the position corresponding to the protrusion 58 of the positioning portion 59 provided on the bottom surface 52a of the pressure sensor holding member 15. In this embodiment, the positioning hole 70 corresponds to the "recess formed in the upper surface of the stage portion" according to the present invention. By fitting the protrusion 58 into the positioning hole 70, the pressure sensor holding member 15 can be positioned at a correct position on the stage portion 63. The correct position here refers to a position where the electric wire connection hole 24 of the cover member 12 and the connector 30 on the board 16 are oriented toward the front of the characterization device 47. The annular groove 71 is a groove for inserting the open end of the cover member 12. The characterization module 11 is placed on the stage part 63 in a state in which the open end of the cover member 12 abuts against the bottom of the annular groove 71 and the first and second washers 35, 36 contact the O-ring 72, as shown in FIG.

[0036] First and second washer pressing pins 74 and 75 constituting a part of the module fixing portion 62 are placed on the first and second washers 35 and 36 shown in FIG. 13 from above. The module fixing portion 62 is composed of first and second washer pressing pins 74, 75 which are rod-shaped and extend in the vertical direction with one end (lower end) abutting the upper part of the first and second washers 35, 36, a washer pressing pin holding member 76 which holds the other ends (upper ends) of the first and second washer pressing pins 74, 75, and a toggle clamp 77 (see Figure 12) which presses the washer pressing pin holding member 76 downward.

[0037] As shown in Fig. 16, the first and second washer pressing pins 74, 75 are inserted into the characterization module 11 through the insertion holes 21, 22 formed in the cover member 12, and one end of each pin passes through the through hole 41 formed in the substrate 16 and abuts against the upper portions of the first and second washers 35, 36. The first and second washer pressing pins 74, 75 according to this embodiment are each formed in a cylindrical shape, and a slit 78 is formed in each of the lower ends (ends on the washer side). The slits 78 are for avoiding interference between the first capillary tube 33 of the first pressure introduction pipe 18 and the second capillary tube 34 of the second pressure introduction pipe 19, and are formed to penetrate the first and second washer pressing pins 74, 75 in the radial direction.

[0038] Small diameter portions 74a, 75a having smaller outer diameters than other portions are formed at the upper ends (other ends on the washer retainer pin holding member 76 side) of the first and second washer retainer pins 74, 75. The small diameter portions 74a, 75a are inserted into washer retainer pin insertion holes 79, 80 formed in the washer retainer pin holding member 76 described later. As shown in Fig. 17, the small diameter portions 74a, 75a are formed with flat portions 81. The flat portions 81 are formed at positions that bisect the small diameter portions 74a, 75a in the circumferential direction. The flat portions 81 are formed so as to extend in a direction (perpendicular to the paper surface of Fig. 16) perpendicular to the direction in which the above-mentioned slits 78 extend (the left-right direction in Fig. 16).

[0039] The washer retainer pin holding member 76 is made of a metal material and is formed into a rectangular plate shape in a plan view, and is supported so as to be movable up and down by a plurality of guide rods 82 that are erected on the base member 61 and extend in the vertical direction, as shown in Fig. 12. A through hole 83 is formed in a side surface 76a of the washer retainer pin holding member 76. As shown in Fig. 16, the through hole 83 is perpendicular to the washer retainer pin insertion holes 79, 80, and passes through from the washer retainer pin insertion holes 79, 80 to an opening 83a in the side surface 76a of the washer retainer pin holding member 76.

[0040] A screw hole 83b is formed at an end of the through hole 83 close to the washer retainer pin insertion holes 79, 80. A set screw 84 is screwed into the screw hole 83b. With the first and second washer retainer pins 74, 75 inserted into the washer retainer pin insertion holes 79, 80 of the washer retainer pin holding member 76, a setscrew 84 is inserted into the through hole 83 from an opening 83a of the through hole 83, and the tip of the setscrew 84 abuts against the flat portions 81 of the first and second washer retainer pins 74, 75, thereby preventing the first and second washer retainer pins 74, 75 from rotating. The state in which the setscrew 84 abuts against the flat portions 81 is a state in which the slit 78 is parallel to the extension direction of the first and second capillaries 33, 34.

[0041] 18(A) and (B), the toggle clamp 77 includes a frame 91 attached on the base member 61 and near the rear of the stage portion 63, and a handle 93 and a presser 94 connected to the frame 91 via a link mechanism 92. In this toggle clamp 77, the presser 94 is lowered by tilting the handle 93 as shown in Fig. 18(A), and the presser 94 is raised by standing the handle 93 as shown in Fig. 18(B).

[0042] In order to load the characterization module 11 into the characterization device 47 configured as described above, first, the handle 93 of the toggle clamp 77 is raised as shown in FIG. 18(B), and the washer retainer pin holding member 76 is removed upward from the guide rod 82. Then, the characterization module 11 is inserted from above into the space surrounded by the guide rod 82 and placed on the stage section 63. Thereafter, the washer retainer pin holding member 76 is slid downward through the guide rod 82, and the first and second washer retainer pins 74, 75 are brought into contact with the first and second washers 35, 36 through the insertion holes 21, 22 of the cover member 12 and the through hole 41 of the substrate 16 as shown in FIG.

[0043] With the characterization module 11 thus placed and fixed on the stage portion 63 and with the first and second washer retainer pins 74, 75 held by the washer retainer pin holding member 76, the handle 93 of the toggle clamp 77 is tilted as shown in Fig. 18(A) . By tilting the handle 93, the presser 94 applies a pressing force from the upper surface side of the washer retainer pin holding member 76 towards the stage portion 63.

[0044] This pressing force is transmitted to the first and second washer pressing pins 74, 75, which presses the first and second washers 35, 36 toward the stage portion 63, compressing the O-ring 72 and preventing leakage from the pressure introduction paths leading from the first and second pressure introduction paths 66, 67 to the insides of the first and second washers 35, 36. This pressing state is maintained until the characterization is completed.

[0045] Characterization is performed by connecting the electric wires 28 (see FIG. 12) extending from the characterization circuit to the connector 30 of the characterization module 11, setting the characterization device 47 to a predetermined test temperature, and applying a predetermined fluid pressure to the first and second test fluid introduction holes 64, 65. By performing this characterization, the linearity, temperature characteristics, static pressure characteristics, etc. of the sensor output of the pressure sensor chip 32 are corrected, and it becomes possible to eliminate the influence of the surrounding environment, such as the surrounding temperature and pressure.

[0046] After the characterization is completed, the characterization module 11 is removed from the characterization device 47 and attached to the pressure measuring device body 48. This attachment is performed after removing the cover member 12 from the characterization module 11. 6, the pressure measuring device body 48 has a cylindrical sensor accommodating portion 101 with a bottom that accommodates the pressure sensor holding member 15 of the characterization module 11. At the bottom of the sensor accommodating portion 101, there are formed first and second holes 102, 103 into which the first and second washers 35, 36 are inserted, three holes 104 (only two holes 104 are shown in FIG. 6) into which the three protrusions 58 of the pressure sensor holding member 15 fit, and a mounting surface 105 on which the pressure sensor holding member 15 is placed.

[0047] The first and second washers 35, 36 are welded to the hole wall surfaces of the first and second holes 102, 103 by resistance welding. First and second pressure guiding paths 106, 107 formed in the pressure measuring device body 48 open into the first and second holes 102, 103. The first and second pressure guiding paths 106, 107 communicate with a first pressure transmitting chamber 108 and a second pressure transmitting chamber 109 formed in the pressure measuring device body 48, and the first and second holes 102, 103. Although not shown, the first and second pressure guiding paths 106, 107 are filled with a pressure transmitting medium.

[0048] The first pressure transmission chamber 108 has a first pressure receiving diaphragm 110 formed as a part of its wall, and the pressure of the first process fluid applied to the first pressure receiving diaphragm 110 is transmitted via the first pressure receiving diaphragm 110 . The second pressure transmission chamber 109 has a second pressure-receiving diaphragm 111 formed as a part of the wall, and the pressure of the second process fluid applied to the second pressure-receiving diaphragm 111 is transmitted via the second pressure-receiving diaphragm 111 .

[0049] The pressure applied to the first pressure transmission chamber 108 is transmitted to the pressure sensor chip 32 via the first pressure guide path 106 and the first pressure introduction pipe 18 . The pressure applied to the second pressure transmission chamber 109 is transmitted to the pressure sensor chip 32 via the second pressure guide path 107 and the second pressure introduction pipe 19 . Therefore, the pressure difference between the pressure of the first process fluid and the pressure of the second process fluid can be measured by the pressure sensor chip 32.

[0050] According to the embodiment described above, the characterization module 11 formed by mounting the pressure sensor 14 on the pressure sensor holding member 15 can be loaded into a characterization device 47 that is smaller (has a smaller heat capacity) than the pressure measuring device body 48, and characterization of the pressure sensor 14 can be performed. Therefore, according to the characterization module 11 of this embodiment, it becomes possible to perform characterization in a state where the heat capacity of the object to be kept constant in characterization is small. Therefore, by using the characterization module 11 according to this embodiment, the size of the facility for performing characterization can be reduced, and the temperature can be stabilized in a short time during characterization.

[0051] The characterization module 11 according to this embodiment has a holding member engagement portion 23 that engages with the pressure sensor holding member 15, and an electric wire connection hole 24 for connecting an electric wire 28 from the outside to wiring on the substrate 16. The characterization module 11 also has a cover member 12 that forms a housing by being coupled with the pressure sensor holding member 15 so as to cover the first surface 16a of the substrate 16. Therefore, characterization can be performed in a state where the pressure sensor 14 is covered and protected by the cover member 12.

[0052] The bottom surface 52a of the pressure sensor holding member 15 according to this embodiment is provided with a positioning portion 59 having a protrusion 58 (convex portion) for engaging with a positioning hole 70 (concave portion) formed in the upper surface of the stage portion of the characterization device 47 to perform positioning on the stage portion 63. This makes it possible to load the characterization module 11 at the correct position in the characterization device 47, and to position the connector 30 and the first and second washers 35, 36 at the correct positions.

[0053] In the above-described embodiment, an example has been shown in which three protrusions 58 are provided as convex portions of the positioning portion 59 on the bottom surface of the pressure sensor holding member 15, and a positioning hole 70 is provided as a concave portion in the stage portion 63. However, the present invention is not limited to such a limitation, and it is possible to provide a plurality of concave portions on the bottom surface 52a of the pressure sensor holding member 15, and to provide convex portions on the stage portion 63 that engage with these concave portions. The number of concave portions and convex portions is also not limited to three, and may be two or four or more. [Explanation of symbols]

[0054] 11...characterization module, 12...cover member, 14...pressure sensor, 15...pressure sensor holding member, 16...substrate, 16a...first surface, 17...sensor package, 18...first pressure introduction pipe, 19...second pressure introduction pipe, 21, 22...insertion hole, 23...holding member engagement portion, 24...wire connection hole, 27...substrate holding portion, 28...electric wire from outside, 35...first washer, 36...second washer, 47...characterization device, 52a...bottom surface, 53...first washer insertion hole, 54...second washer insertion hole, 58...protrusion, 59...positioning portion, 63...stage portion, 70...positioning hole.

Claims

1. A pressure sensor characterization module for accommodating a pressure sensor having a sensor package mounted on a first surface of a substrate and a pressure introduction pipe extending from the sensor package through the substrate to a side opposite the first surface of the substrate and having a washer at its tip, the module being used for characterizing the pressure sensor, a substrate holder that engages with a peripheral portion of the substrate to accommodate and hold the substrate; a pressure sensor holding member having a washer insertion hole through which the washer of the pressure introduction pipe is inserted and through which external fluid pressure can be transmitted to the pressure introduction pipe; A module for characterizing a pressure sensor comprising:

2. 2. The pressure sensor characterization module of claim 1, a holding member engaging portion that engages with the pressure sensor holding member; a wire connection hole for connecting an external wire to a wiring on the substrate; a cover member that forms a housing by being coupled with the pressure sensor holding member so as to cover the first surface of the substrate; A module for characterizing a pressure sensor comprising:

3. 3. The pressure sensor characterization module according to claim 1, A module for characterizing a pressure sensor, characterized in that the bottom surface of the pressure sensor holding member is provided with a positioning portion having a concave or convex portion for engaging with a convex or concave portion formed on the upper surface of a stage portion of a characterization device to position the pressure sensor on the stage portion.

Images