Terminals and connection methods

Abstract

The present invention prevents breakage of joined parts of a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate.　This terminal is disposed between an electrode of an element and an electrode of the substrate on which the element is mounted, and electrically connects the electrode of the element and the electrode of the substrate. The terminal is provided with a plurality of unit lattices and connection parts. The unit lattices provided to the terminal are formed by joining a plurality of beams in a cubic shape. The connection parts provided to the terminal connect unit lattices adjacent to each other among the plurality of unit lattices.

Description

[Technical field]

[0001] The present disclosure relates to a terminal and a connection method, and more particularly to a terminal for connecting a semiconductor element to a substrate and a connection method using the terminal. [Background technology]

[0002] Conventionally, bare chip mounting has been performed in which a semiconductor chip on which a large number of terminals are arranged is bonded to a substrate for mounting. For example, a method for manufacturing a semiconductor device has been proposed in which gold (Au) bumps arranged on an LSI chip are bonded to electrodes arranged on a silicon (Si) substrate via a bonding material made of resin with metal particles dispersed therein (see, for example, Patent Document 1). In this method for manufacturing a semiconductor device, a bonding material made of silver (Ag) nanoparticles or tin (Sn) nanoparticles dispersed in epoxy resin is used as the bonding material. This bonding material is placed between the Au bumps of the LSI chip and the electrodes of the substrate, heated to 200°C, and pressed with a load of 19.6 N to bond them. As a result, the metal particles such as Ag are sintered like ceramics to bond the Au bumps and the electrodes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-208082 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned conventional technology has a problem that the joint between the semiconductor chip and the substrate is damaged by temperature stress. The semiconductor chip and the substrate may show different thermal behaviors due to differences in the thermal expansion coefficients of the semiconductor chip and the substrate. In such cases, stress may concentrate on the joint between the semiconductor chip and the substrate, causing damage.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and aims to prevent damage to the bonded portion between the semiconductor chip and the substrate. [Means for solving the problem]

[0006] The present disclosure has been made to solve the above-mentioned problems, and a first aspect thereof is a terminal comprising a plurality of unit cells formed by joining a plurality of beams in a cubic shape, and a connecting portion connecting adjacent unit cells among the plurality of unit cells, the terminal being disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connecting the electrode of the element and the electrode of the substrate.

[0007] In the first aspect, the beam may be made of resin.

[0008] In the first aspect, the connecting portion may be made of resin.

[0009] In addition, in the first aspect, a conductive member having electrical conductivity and arranged adjacent to the beam and the connecting portion may be further included.

[0010] In addition, in this first aspect, the device further includes a flexible member that is configured in a rod shape that bulges inwardly of the cubic shape, is arranged inside the cubic shape of the beam, and has its ends joined near both ends of the beam, so that it bends inwardly of the cubic shape when the temperature rises, and a flexible member connecting portion that is joined to the center of the beam and the center of the flexible member to connect the beam and the flexible member, and the connecting portion may be joined to the center of each of the beams of the adjacent unit cells to connect the adjacent unit cells.

[0011] Also, in this first aspect, the flexible member may be configured to have a higher coefficient of thermal expansion than the beam.

[0012] In the first aspect, the flexible member may be made of resin.

[0013] In the first aspect, the flexible member connecting portion may be made of resin.

[0014] In addition, in the first aspect, a reinforcing member may be further provided that is joined to the beams at two vertices that face each other across the center of the cubic shape of the unit lattice.

[0015] In the first aspect, the reinforcing member may be made of resin.

[0016] A second aspect of the present disclosure is a connection method in which a terminal having a plurality of unit cells formed by joining a plurality of beams in a cubic shape and a connecting portion connecting adjacent unit cells among the plurality of unit cells is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, thereby electrically connecting the electrode of the element to the electrode of the substrate.

[0017] According to the aspect of the present disclosure, a terminal is configured by connecting a plurality of unit lattices formed by joining a plurality of beams in a cubic shape with each other via connecting parts. It is assumed that the addition of flexibility due to the lattice shape is achieved. [Brief description of the drawings]

[0018] [Figure 1] 1 is a diagram illustrating a configuration example of a semiconductor device according to a first embodiment of the present disclosure. [Diagram 2] 3A to 3C are diagrams illustrating a configuration example of a terminal according to the first embodiment of the present disclosure. [Diagram 3] FIG. 1 is a diagram illustrating an example of the configuration of a unit lattice according to an embodiment of the present disclosure. [Figure 4] 1A to 1C are diagrams illustrating an example of contraction of a terminal according to an embodiment of the present disclosure. [Diagram 5] 5A to 5C are diagrams illustrating an example of a manufacturing method for a terminal according to an embodiment of the present disclosure. [Figure 6] FIG. 4 is a diagram illustrating a configuration example of a semiconductor device according to a second embodiment of the present disclosure. [Figure 7]13A to 13C are diagrams illustrating a configuration example of a terminal according to a third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Next, a mode for carrying out the present disclosure (hereinafter, referred to as an embodiment) will be described with reference to the drawings. In the following drawings, the same or similar parts are given the same or similar reference numerals. The embodiment will be described in the following order. 1. First embodiment 2. Second embodiment 3. Third embodiment

[0020] <1. First embodiment> [Configuration of semiconductor device] 1 is a diagram showing a configuration example of a semiconductor device according to a first embodiment of the present disclosure. The semiconductor device 1 in the figure is configured by mounting a semiconductor chip 20 on a substrate 30.

[0021] The semiconductor chip 20 is a semiconductor chip made of silicon (Si) or the like. A plurality of pads 21 are arranged on the semiconductor chip 20. The pads 21 are electrode-like terminals that transmit signals of the semiconductor chip 20. The pads 21 can be made of a metal such as aluminum (Al) or Au. The semiconductor chip 20 is an example of an element recited in the claims. The pads 21 are an example of an electrode recited in the claims.

[0022] The substrate 30 is a circuit board arranged in an electronic device or the like. The semiconductor chip 20 is bare-chip mounted on this substrate 30. A plurality of lands 31 are arranged on the substrate 30. The lands 31 are conductors to which terminals such as the pads 21 of the semiconductor chip 20 are joined. The lands 31 can be made of metal. Specifically, the lands 31 can be made of copper (Cu) and Au laminated in this order. The lands 31 are an example of an electrode as described in the claims.

[0023] When mounting the semiconductor chip 20 on the substrate 30, the pads 21 of the semiconductor chip 20 are bonded to the lands 31 of the substrate 30. At this time, the terminals 10 are disposed between the pads 21 and the lands 31. The terminals 10 bond the pads 21 and the lands 31.

[0024] [Terminal configuration] 2 is a diagram showing a configuration example of a terminal according to the first embodiment of the present disclosure. The diagram shows a configuration example of a terminal 10, and is an enlarged view of a region in which the terminal 10 of the semiconductor device 1 in FIG. 1 is arranged.

[0025] As described above, the terminal 10 is disposed between the pad 21 of the semiconductor chip 20 and the land 31 of the substrate 30, and electrically connects the pad 21 of the semiconductor chip 20 and the land 31 of the substrate 30. The terminal 10 includes a unit cell 100 and a connecting portion 11.

[0026] The unit lattice 100 is a lattice-shaped structure formed by joining a plurality of beams in a cubic shape. The unit lattices 100 are arranged in a three-dimensional lattice to form the terminal 10. The configuration of the unit lattice 100 will be described in detail later.

[0027] The connecting portions 11 connect adjacent unit cells 100 among the plurality of unit cells 100. The unit cells 100 are connected by the connecting portions 11, and the plurality of unit cells 100 are arranged in a three-dimensional lattice shape. The connecting portions 11 can be made of, for example, resin. The configuration of the connecting portions 11 will be described in detail later.

[0028] In the figure, for convenience, nine unit cells 100 arranged two-dimensionally are shown, but the number of unit cells 100 is not limited, and a three-dimensional shape is formed by further arranging multiple unit cells 100 in the depth direction of the paper surface of the figure.

[0029] The terminal 10 in the figure also includes a conductive member 12. The conductive member 12 is a member that is disposed adjacent to the unit lattice 100 and the connecting portion 11 and has conductivity. The hatched area in the figure represents the conductive member 12. The figure shows an example in which a film of the conductive member 12 is attached to the surface of the unit lattice 100 and the connecting portion 11. The conductive member 12 can be made of, for example, a resin in which metal particles such as Ag are dispersed. By disposing the conductive member 12, even when the unit lattice 100 and the connecting portion 11 made of an insulating material are used, the terminal 10 can be made conductive and the pad 21 and the land 31 can be electrically connected. The conductive member 12 can be formed by attaching a liquid resin in which metal particles are dispersed to the surface of the unit lattice 100 and the connecting portion 11 and curing it.

[0030] In addition, in the figure, a connection portion 22 is disposed between the pad 21 and the terminal 10, and a connection portion 32 is disposed between the terminal 10 and the land 31. These connection portions 22 and 32 connect the terminal 10 to the pad 21 and the land 31. The connection portions 22 and 32 are made of, for example, a conductive adhesive such as silver paste or low-melting point solder, and join the terminal 10 to the pad 21 and the land 31. By disposing the connection portions 22 and 32, the terminal 10 to the pad 21 and the land 31 can be electrically and mechanically connected.

[0031] Also, liquid metal, for example, elastomer containing eutectic gallium indium (EGaIn) can be used as the connecting parts 22 and 32. By applying this elastomer containing eutectic gallium indium to the connecting parts between the pads 21 and the lands 31 and the terminals 10 and applying pressure, the liquid metals in the elastomer bond together to obtain an electrical connection. In addition, this bonded liquid metal has a self-repairing function, and therefore the reliability of the connecting parts with the pads 21, etc. can be improved.

[0032] The semiconductor device 1 can be manufactured as follows. First, the connection portion 22 is placed on the pad 21 of the semiconductor chip 20. Next, the terminal 10 is placed adjacent to the connection portion 22 placed on the pad 21, and the connection portion 22 is hardened to connect the terminal 10 to the pad 21. Next, the connection portion 32 is placed on the land 31 of the substrate 30. Next, the semiconductor chip 20 is mounted on the substrate 30 while aligning the pad 21 to which the terminal 10 is connected with the land 31 to which the connection portion 32 is placed. As a result, the terminal 10 is placed between the pad 21 and the land 31. Next, the connection portion 32 is hardened to connect the terminal 10 to the land 31. Through the above steps, the semiconductor chip 20 can be mounted on the substrate 30.

[0033] [Unit cell configuration] 3 is a diagram showing an example of the configuration of a unit lattice according to an embodiment of the present disclosure. The figure shows an example of the configuration of a unit lattice 100. The unit lattice 100 in the figure includes a beam 110, a flexible member 120, a reinforcing member 140, and a flexible member connecting portion 130. Note that the unit lattice 100 in the figure also includes a connecting portion 11. The dashed cube 101 in the figure is an auxiliary line showing the outer shape of the unit lattice 100, and does not constitute the unit lattice 100.

[0034] The beams 110 are formed in rod shapes and joined into a cube shape. A plurality of beams 110 are joined together to form the outer shape of the unit lattice 100. This beam 110 represents an example in which it is disposed between opposing vertices on each face of the cube 101. The beams 110 in the figure represent an example in which two beams 110 cross each other on each face of the cube 101 to form a diagonal brace. The beams 110 can be made of, for example, resin.

[0035] The flexible member 120 bends the beam 110 toward the inside of the cube 101. The flexible member 120 is configured in a rod shape that bulges toward the inside of the cube 101, and is disposed inside the cube 101 of the beam 110, with the ends being joined to the vicinity of both ends of the beam 110. The flexible member 120 can be disposed on each of the multiple beams 110. Similarly to the beam 110, the flexible member 120 can be configured in a shape in which two flexible members 120 intersect on each face of the cube 101. The flexible member 120 can be configured of a member having a higher thermal expansion coefficient than the beam 110, for example, a resin having a higher thermal expansion coefficient than the member constituting the beam 110. In this case, the flexible member 120 will extend longer than the beam 110 when the temperature rises. As a result, the flexible member 120 deforms into a shape that bends toward the inside of the cube 101 as the temperature rises.

[0036] The flexible member connecting portion 130 is configured in a rod shape and connects the beam 110 and the flexible member 120. This flexible member connecting portion 130 is joined to the center of the beam 110 and the center of the flexible member 120 to connect the beam 110 and the flexible member 120. The flexible member connecting portions 130 in the figure are disposed on each face of the cube 101. By disposing the flexible member connecting portions 130, it is possible to cause the beam 110 to bend toward the inside of the cube 101 when the flexible member 120 bends with an increase in temperature. The flexible member connecting portions 130 can be made of, for example, resin.

[0037] The reinforcing member 140 reinforces the multiple beams 110 joined together. This reinforcing member 140 is disposed between two vertices that face each other across the center of the cube 101, and is joined to the beams 110 at these two vertices. The figure shows an example in which four reinforcing members 140 are configured to intersect at the center of the cube 101. The reinforcing member 140 can be made of, for example, resin.

[0038] The connecting portion 11 can be disposed on a side of the beam 110 different from the side on which the flexible member connecting portion 130 is disposed.

[0039] As described above, the beam 110, the flexible member 120, the flexible member connecting portion 130, the reinforcing member 140, and the connecting portion 11 can be made of resin. A photocurable resin can be used as this resin. Specifically, the beam 110 and the like can be made of polyethylene glycol diacrylate (PEGDA) that has been given photocurability. This allows the terminal 10 to be manufactured by a 3D printer or the like.

[0040] By configuring the terminal 10 from a plurality of unit cells 100 connected by the connecting portions 11, it is possible to impart flexibility to the terminal 10. As a result, even if the semiconductor device 1 is distorted with an increase in temperature due to differences in the thermal expansion coefficients of the semiconductor chip 20 and the substrate 30, and stress is applied to the terminal 10, the stress can be dispersed, and damage to the terminal 10 can be prevented.

[0041] The thermal expansion coefficient of the above-mentioned PEGDA is 1.56 × 10 -4 [K -1 The thermal expansion coefficient of PEGDA can be adjusted by adding a reinforcing material. Specifically, the thermal expansion coefficient of PEGDA can be reduced by adding Cu nanoparticles (particle size 50 to 80 nm). When the thermal expansion coefficient of the added Cu is 2×10 -5 For example, the addition of 5% Cu nanoparticles reduces the thermal expansion coefficient of PEGDA to 5.1×10 -5 [K -1 ] can be reduced to.

[0042] Therefore, the flexible member 120 is made of PEGDA, and the beam 110, the flexible member connecting portion 130, the reinforcing member 140, and the connecting portion 11 are made of PEGDA reinforced with the addition of Cu nanoparticles. This allows the thermal expansion coefficient of the flexible member 120 to be greater than that of the beam 110, etc., and allows the beam 110 to bend inwardly of the cube 101 when the temperature rises. It becomes possible to bend the beam 110 inwardly of the unit lattice 100.

[0043] [Terminal shrinkage] 4 is a diagram showing an example of contraction of a terminal according to an embodiment of the present disclosure. The diagram shows the behavior of connected unit cells 100 when the temperature of terminal 10 rises. The diagram also shows a pair of beams 110, flexible members 120, flexible member connectors 130, and reinforcing members 140 of unit cells 100a and 100b connected by connectors 11.

[0044] In the figure, A shows the state of unit cells 100a and 100b before the temperature is increased. "D" in A in the figure shows the spacing between unit cells 100a and 100b before the temperature is increased.

[0045] B in the figure shows the state of the unit cells 100a and 100b after the temperature rises. The flexible member 120 expands as the temperature rises. As described above, the flexible member 120 is configured such that both ends are joined to the beam 110 and the reinforcing member 140, and the central portion bulges inwardly of the cube 101. Therefore, when the temperature rises, the flexible member 120 expands and the central portion bends inwardly of the cube 101. As a result, the beam 110 connected to the flexible member 120 by the flexible member connecting portion 130 is pulled inwardly of the cube 101 and bends. If the amount of bending of the beam 110 is greater than the amount of bending of the connecting portion 11, the unit cells 100a and 100b approach each other. "D'" in B in the figure shows the distance between the unit cells 100a and 100b after the temperature rises, and is narrower than "D" in A in the figure. The terminal 10 formed by connecting such unit cells 100 has a property of shrinking in volume with an increase in temperature. For convenience, the expansion of members other than the flexible member 120 with an increase in temperature is omitted in B in the figure.

[0046] In this way, by making the thermal expansion coefficient of the flexible member 120 larger than that of the beam 110, the thermal expansion coefficient of the terminal 10 can be made a negative value. In addition, by adjusting the thermal expansion coefficients of the flexible member 120 and the beam 110, etc., it is possible to configure the terminal 10 having an arbitrary thermal expansion coefficient. For example, it is also possible to configure the terminal 10 having a thermal expansion coefficient of "0". It becomes possible to arrange the terminal 10 having a thermal expansion coefficient according to the thermal behavior of the semiconductor chip 20 and the substrate 30, and damage to the joint portion between the semiconductor chip 20 and the substrate 30 can be prevented.

[0047] [Terminal manufacturing method] 5 is a diagram showing an example of a method for manufacturing a terminal according to an embodiment of the present disclosure. The diagram shows an example of a 3D printer device for manufacturing a terminal 10. The 3D printer device in the diagram includes a sample holder 301, a material conveying disk 302, a motor 303, a Z-axis drive motor 304, a material supply unit 305, a dispenser 306, an image output unit 307, an optical system consisting of a lens 308 and a reflector 309, and a control unit 310.

[0048] The sample holder 301 holds the terminal 10 in the middle of manufacture. The terminal 10 is held on the lower surface of the sample holder 301.

[0049] The dispenser 306 holds the resin material that constitutes the beams 110 and the like. The beams 110 and the like are made of a photocurable resin. The dispenser 306 holds this resin material before hardening. The dispenser 306 supplies the resin material to a material conveying disk 302 (described later) under the control of a material supply unit 305. The dispensers 306 can be arranged according to the type of resin material.

[0050] The material supplying section 305 causes the dispenser 306 to supply the resin material under the control of the control section 310. The material supplying section 305 causes the dispenser 306 to supply the resin material according to the portion where the terminal 10 is to be formed.

[0051] The material conveying disk 302 conveys the resin material supplied by the dispenser 306 to the formation portion of the terminals 10. The material conveying disk 302 conveys the resin material by rotating. The formation portion of the terminals 10 is a region directly below the sample holder 301.

[0052] Motor 30 3 The motor 30 rotates the material conveying disk 302. 3 A stepping motor can be used for the rotation of the actuator.

[0053] The image output unit 307 emits light for hardening the resin material under the control of the control unit 310. The image output unit 307 emits light based on image data that is configured by decomposing an image of the terminal 10 into multiple layers in the Z-axis direction.

[0054] The optical system guides the light emitted from the image output section 307 to the section where the terminals 10 are formed.

[0055] The Z-axis drive motor 304 moves the sample holder 301 in the Z-axis direction. The Z-axis drive motor 304 moves the sample holder 301 upward in the figure at a speed according to the formation of the terminal 10.

[0056] The control unit 310 controls the entire manufacturing apparatus. Based on the configuration data of the terminal 10, the control unit 310 controls the image output unit 307 and the material supply unit 305 to form the terminal 10 on the lower surface of the sample holder 301. For example, when forming the beam 110 or the reinforcing member 140, the material resin (PEGDA before hardening in which Cu is dispersed) of the beam 110 and the like is supplied from the dispenser 306 to the material conveying disk 302. On the other hand, light corresponding to one layer of image data for forming the beam 110 and the like is emitted from the image output unit 307 and guided to the formation unit of the terminal 10. As a result, the material resin is hardened in the formation unit of the terminal 10, and one layer of the beam 110 and the like is formed. Next, the material resin (PEGDA before hardening) of the flexible member 120 is supplied from the dispenser 306 to the material conveying disk 302, and the light corresponding to one layer of image data for forming the flexible member 120 is emitted from the image output unit 307, and one layer of the flexible member 120 is formed. By performing this process for all layers, the terminal 10 can be manufactured.

[0057] As described above, the terminal 10 according to the first embodiment of the present disclosure is configured to have a flexible structure including the unit cell 100 and the connecting portion 11. As a result, when a rise in temperature of the semiconductor chip 20 and the substrate 30 causes distortion and stress is applied to the terminal 10, the stress can be dispersed to prevent damage to the terminal 10.

[0058] <2. Second embodiment> The terminal 10 in the first embodiment described above is configured to have a single thermal expansion coefficient. In contrast, the terminal in the second embodiment of the present disclosure differs from the first embodiment described above in that terminal regions configured to have different thermal expansion coefficients are stacked.

[0059] [Configuration of semiconductor device] Fig. 6 is a diagram showing a configuration example of a semiconductor device according to a second embodiment of the present disclosure. Similar to Fig. 1, this diagram shows a configuration example of the semiconductor device 1. This differs from the semiconductor device 1 in Fig. 1 in that a terminal 50 is arranged instead of the terminal 10.

[0060] The terminal 50 in the figure is composed of two laminated terminal regions 18 and 19. These terminal regions 18 and 19 are both regions of the terminal that include a unit cell 100 and a connecting portion 11. The terminal regions 18 and 19 are disposed adjacent to the pad 21 and the land 31, respectively. The flexible members 120 disposed in the unit cells 100 of the terminal regions 18 and 19 can be configured to have different thermal expansion coefficients. This allows the terminal regions 18 and 19 to be configured to have different thermal expansion coefficients. By configuring the terminal regions 18 and 19 to have thermal expansion coefficients corresponding to the pad 21 and the land 31, respectively, the stress applied to the terminal 50 can be concentrated at the joints of the terminal regions 18 and 19. The stress at the connection between the terminal 50 and the pad 21 and the land 31 can be reduced.

[0061] Other than this, the configuration of the terminal 50 is similar to the configuration of the terminal 10 described in the first embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0062] As described above, the terminal 50 according to the second embodiment of the present disclosure is able to reduce stress applied to the connection portions between the terminal 50 and the pad 21 and the land 31 by arranging the terminal regions 18 and 19 having different thermal expansion coefficients. This makes it possible to prevent damage to the connection portions between the terminal 50 and the pad 21 and the land 31.

[0063] <3. Third embodiment> In the terminal 10 of the first embodiment described above, the film-like conductive member 12 is disposed by being attached to the surfaces of the unit cells 100 and the connecting portions 11. In contrast, the terminal of the third embodiment of the present disclosure differs from the first embodiment described above in that the conductive member is filled into a plurality of unit cells 100 connected by the connecting portions 11.

[0064] [Terminal configuration] Fig. 7 is a diagram showing a configuration example of a terminal according to a third embodiment of the present disclosure. Similar to Fig. 2, Fig. 7 shows a configuration example of a terminal 10. It differs from the terminal 10 in Fig. 2 in that the connecting portions 22 and 32 are omitted and a conductive member 13 is disposed instead of the conductive member 12.

[0065] The conductive member 13 is a conductive member that is filled and arranged in a plurality of unit cells 100 that are connected by the connecting portions 11. The conductive member 13 can be made of a liquid metal such as eutectic gallium indium. The terminal 10 can be formed by impregnating and filling the unit cells 100 with the conductive member 13. In this case, the connecting portions 22 and 32 can be omitted. The conductive member 13 can also be made of a resin that has high flexibility even after curing and has metal particles dispersed in it.

[0066] Also, a material containing nanoparticles of Ag or Cu whose size and shape are controlled so as to have plasmon resonance can be filled into a plurality of unit cells 100 connected by the connecting portion 11. After filling, the nanoparticles are irradiated with light to sinter them by the heat conversion effect caused by the resonance of light. At this time, by adjusting the intensity and frequency of the irradiated light, it is possible to adjust the sintering of the nanoparticles and adjust the flexibility of the terminal 10. Also, it is possible to adjust the conditions of the irradiated light according to the element such as the semiconductor chip 20, and to arrange terminals 10 with different flexibility for each element.

[0067] Other than this, the configuration of the terminal 10 is similar to the configuration of the terminal 10 described in the first embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0068] As described above, in the terminal 10 according to the third embodiment of the present disclosure, by disposing the conductive member 13 that fills the multiple unit cells 100 connected by the connecting portion 11, it is possible to omit the connecting portions 22 and 32. This makes it possible to simplify the configuration of the semiconductor device 1.

[0069] The configuration of the terminal 10 of the third embodiment can be combined with other embodiments. 2 It can be used in place of the conductive member 12.

[0070] Finally, the above-mentioned embodiments are merely examples of the present disclosure, and the present disclosure is not limited to the above-mentioned embodiments. Therefore, even if the embodiments are different from the above-mentioned embodiments, various modifications can be made depending on the design, etc., as long as they do not deviate from the technical idea of ​​the present disclosure.

[0071] In addition, the effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0072] In addition, the drawings in the above-mentioned embodiments are schematic, and the dimensional ratios of the various parts do not necessarily correspond to the actual ones. In addition, the drawings may include parts whose dimensional relationships and ratios differ from one another.

[0073] The present technology can also be configured as follows. (1) A plurality of unit cells formed by joining a plurality of beams in a cubic shape; a connecting portion that connects adjacent unit cells among the plurality of unit cells; Equipped with A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element to the electrode of the substrate. (2) The terminal according to (1), wherein the beam is made of resin. (3) The terminal according to (1) or (2), wherein the connecting portion is made of resin. (4) The terminal according to any one of (1) to (3), further comprising a conductive member arranged adjacent to the beam and the connecting portion and having electrical conductivity. (5) a flexible member configured in a rod shape that bulges inwardly of the cube shape, disposed inside the cube shape of the beam, and having ends joined to the vicinity of both ends of the beam, the flexible member bending inwardly of the cube shape when the temperature rises; a flexible member connecting portion that is joined to a center portion of the beam and a center portion of the flexible member to connect the beam and the flexible member; Further comprising: The connecting portion is joined to the center portion of each of the beams of the adjacent unit cells to connect the adjacent unit cells. A terminal according to any one of (1) to (4). (6) The terminal according to (5), wherein the flexible member is configured to have a higher thermal expansion coefficient than the beam. (7) The terminal according to (5), wherein the flexible member is made of resin. (8) The terminal according to (5), wherein the flexible member connecting portion is made of resin. (9) The terminal according to any one of (1) to (8), further comprising a reinforcing member joined to the beams at two vertices that face each other across the center of the cubic shape of the unit lattice. (10) The terminal according to (9), wherein the reinforcing member is made of resin. (11) A connection method in which a terminal having a plurality of unit cells formed by joining a plurality of beams in a cubic shape and a connecting portion connecting adjacent unit cells among the plurality of unit cells is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, thereby electrically connecting the electrode of the element to the electrode of the substrate. [Explanation of symbols]

[0074] 1 Semiconductor device 10, 50 terminals 11 Connecting part 12 Conductive material 18, 19 terminal area 20. Semiconductor Chips 21 Pad 22, 32 Connection 30 Substrate 31 Rand 100, 100a, 100b unit cells 101 cube 110 Beam 120 Flexible member 130 Flexible member connection section 140 Reinforcement member

Claims

1. A plurality of unit cells formed by joining a plurality of beams in a cubic shape; a connecting portion connecting adjacent unit cells among the plurality of unit cells; a conductive member disposed adjacent to the beam and the connecting portion and having electrical conductivity; A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element to the electrode of the substrate.

2. The terminal according to claim 1 , wherein the beam is made of resin.

3. 3. The terminal according to claim 1, wherein the connecting portion is made of resin.

4. a flexible member configured in a rod shape that bulges inwardly of the cube shape, disposed inside the cube shape of the beam, and having ends joined to the vicinity of both ends of the beam, so that the flexible member bends inwardly of the cube shape when a temperature rises; a flexible member connecting portion that is joined to a center portion of the beam and a center portion of the flexible member to connect the beam and the flexible member; Further comprising: The connecting portion is joined to the center portion of each of the beams of the adjacent unit cells to connect the adjacent unit cells. The terminal according to any one of claims 1 to 3.

5. 5. The terminal of claim 4, wherein said flexible member is configured with a higher coefficient of thermal expansion than said beam.

6. The terminal according to claim 4 , wherein the flexible member is made of a resin.

7. The terminal according to claim 4 , wherein the flexible member connecting portion is made of resin.

8. The terminal according to any one of claims 1 to 7, further comprising a reinforcing member joined to the beams at two vertices that face each other across a center of the cubic shape of the unit lattice.

9. The terminal according to claim 8 , wherein the reinforcing member is made of a resin.

10. A plurality of unit cells formed by joining a plurality of beams in a cubic shape; a connecting portion connecting adjacent unit cells among the plurality of unit cells; Equipped with the beam and the connecting portion are made of a resin to which metal particles have been added, A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element to the electrode of the substrate.

11. A connection method for electrically connecting an electrode of an element and an electrode of a substrate on which the element is mounted, by disposing a terminal between the electrode of the element and an electrode of the substrate, the terminal comprising: a plurality of unit cells formed by joining a plurality of beams in a cubic shape; a connecting portion connecting adjacent unit cells among the plurality of unit cells; and a conductive member having conductivity and disposed adjacent to the beams and the connecting portion.

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