SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Abstract

To provide a substrate processing method and substrate processing device which can monitor a filling state of a filler material in a gap while applying the filler material to a gap between an edge portion of a first substrate and an edge portion of a second substrate.SOLUTION: A method comprises the steps of: applying a filler material F to a gap between an edge portion E1 of a first substrate W1 and an edge portion E2 of a second substrate W2; curing the applied filler material F; generating an image of an edge portion of a lamination substrate Ws applied with the filler material F by an infrared imaging device 5; and determining the filling state of the filler material F applied to the gap between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 on the basis of the image.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate processing method and substrate processing apparatus that suppress cracking and chipping in a laminated substrate manufactured by bonding multiple substrates, and in particular to a technique for applying a filler to gaps formed between edge portions of multiple substrates that constitute a laminated substrate. [Background technology]

[0002] In recent years, in order to achieve higher density and higher functionality in semiconductor devices, development of three-dimensional packaging technology, which stacks multiple substrates to integrate them three-dimensionally, has been progressing. In three-dimensional packaging technology, for example, a device surface of a first substrate on which an integrated circuit and electrical wiring are formed is bonded to a device surface of a second substrate on which an integrated circuit and electrical wiring are formed. Furthermore, after bonding the first substrate to the second substrate, the second substrate is thinned by a polishing device or a grinding device. In this way, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first substrate and the second substrate.

[0003] In the three-dimensional packaging technology, three or more substrates may be bonded together. For example, after a second substrate bonded to a first substrate is laminated, a third substrate may be bonded to the second substrate and the third substrate may be laminated together. In this specification, the form of multiple substrates bonded together may be referred to as a "laminated substrate."

[0004] Usually, the edge of the substrate is polished in advance to a rounded or chamfered shape to prevent cracks or chipping. When a second substrate having such a shape is ground, a sharp edge is formed on the second substrate. This sharp edge (hereinafter referred to as a knife edge) is formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such a knife edge is easily chipped by physical contact, and the laminated substrate itself may be damaged during transportation of the laminated substrate. Furthermore, if the bonding between the first substrate and the second substrate is insufficient, the second substrate may crack during grinding.

[0005] Therefore, in order to prevent cracking or chipping of the knife edge portion, a filler is applied to the edge portion of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate. The filler supports the knife edge portion formed after grinding the second substrate, and can prevent cracking or chipping of the knife edge portion. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 5-304062 Summary of the Invention [Problem to be solved by the invention]

[0007] However, when applying filler to the gap between the edge of the first substrate and the edge of the second substrate, filling defects such as insufficient or excessive application of filler may occur under preset application conditions. If the laminated substrate is processed in a subsequent process while filling defects remain, the laminated substrate may be scratched, which may adversely affect the laminated substrate and process performance. Conventionally, the state of filling of the filler in the laminated substrate was checked after the application of the filler was completed, and in some cases, it was necessary to destroy the laminated substrate.

[0008] Therefore, an object of the present invention is to provide a substrate processing method and a substrate processing apparatus that can apply filler to the gap between the edge portion of a first substrate and the edge portion of a second substrate while monitoring the filling state of the filler in the gap. [Means for solving the problem]

[0009] In one aspect, there is provided a substrate processing method for applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, the method comprising: applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; hardening the applied filler; generating an image of the edge portion of the laminated substrate to which the filler has been applied using an infrared imaging device; and determining a filling state of the filler in the gap based on the image. In one aspect, determining the fill state comprises determining the fill state based on a size of the filler within a pre-defined target area on the image. In one aspect, The substrate processing method includes: The application of the filler is terminated based on the filling state. In one aspect, The substrate processing method includes: The method further includes applying additional filler based on the filled state.

[0010] In one aspect, The substrate processing method includes: The method further includes a step of counting the number of voids generated in the filler on the image, and determining that an abnormality has occurred when the number of the voids reaches an allowable value. In one embodiment, the steps of applying the filler, curing the filler, and generating the image are performed while rotating the laminate substrate. In one aspect, The substrate processing method includes: The application conditions of the filler are changed based on the filled state. In one aspect, The substrate processing method includes: While the laminated substrate makes one rotation, the images are generated at a plurality of measurement points of the laminated substrate, and the application conditions of the filler at at least one of the plurality of measurement points are changed based on the filling state at the plurality of measurement points and position information of the plurality of measurement points.

[0011] In one aspect, The substrate processing method includes: The method further includes a step of changing the application conditions of the filler for the next laminated substrate based on the filled state. In one embodiment, the application conditions include at least one of the total amount of the filler to be applied, the shape of the filler outlet of an application device for applying the filler, the distance between the laminated substrate and the filler outlet, the amount of the filler discharged from the filler outlet per unit time, and the rotation speed of the laminated substrate. In one aspect, the infrared imaging device irradiates infrared light substantially perpendicularly to a bonding surface between the first substrate and the second substrate of the laminated substrate.

[0012] In one aspect, there is provided a substrate processing apparatus for applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, the substrate processing apparatus comprising: a filler application module configured to apply the filler to the laminated substrate; and an operation control unit configured to control the operation of the filler application module, the filler application module comprising: a substrate holding unit for holding the laminated substrate; an application device for applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; a hardening device for hardening the applied filler; and an infrared imaging device for generating an image of the edge portion of the laminated substrate to which the filler has been applied, the operation control unit configured to determine a filling state of the filler applied to the gap based on the image. In one aspect, the operation control unit is further configured to give a command to the filler application module based on the filling state to terminate application of the filler by the application device. In one aspect, the operation control unit is further configured to issue a command to the filler application module based on the filling state to apply additional filler. In one embodiment, the filler application module further includes a rotation mechanism that rotates the substrate holder. In one embodiment, the operation control unit changes the application conditions of the filler based on the filling state. Effect of the Invention

[0013] According to the present invention, by applying filler to a laminated substrate while monitoring the filling state of the filler, the application of the filler can be terminated at an appropriate time, and an appropriate filling state can be achieved by applying additional filler or changing the application conditions as necessary. [Brief description of the drawings]

[0014] [Figure 1] 1(a) and 1(b) are enlarged cross-sectional views showing the edge portion of a substrate. [Diagram 2] FIG. 2 is an enlarged cross-sectional view showing a laminated substrate. [Diagram 3] 1 is a plan view showing an embodiment of a substrate processing apparatus; [Figure 4] 1 is a side view illustrating an embodiment of a substrate processing apparatus. [Diagram 5] FIG. 1 is a schematic diagram illustrating an embodiment of a coating device. [Figure 6] FIG. 2 is a schematic diagram showing how an infrared imaging device generates an image. [Figure 7] FIG. 13 is a diagram showing an example of measurement points set on a laminated substrate. [Figure 8] Fig. 8(a) is an enlarged cross-sectional view of an edge portion of the laminated substrate in the middle of being filled with a filler, and Fig. 8(b) is a diagram showing an image of the edge portion of the laminated substrate shown in Fig. 8(a). [Figure 9] Fig. 9(a) is an enlarged cross-sectional view of an edge portion of the laminated substrate after filling with the filler, and Fig. 9(b) is a diagram showing an image of the edge portion of the laminated substrate shown in Fig. 9(a). [Figure 10] 1 is a flow chart illustrating an embodiment of a method for processing a substrate. [Figure 11] Figure 11(a) is an enlarged cross-sectional view of an edge portion of a laminate substrate where voids have occurred in the filler, and Figure 11(b) is a diagram showing an image of the edge portion of the laminate substrate shown in Figure 11(a). [Figure 12] 10 is a flow chart illustrating another embodiment of a substrate processing method. [Figure 13]Fig. 13(a) is an enlarged cross-sectional view of an edge portion of a laminated substrate where a filling defect occurs with a filler, and Fig. 13(b) is a diagram showing an image of the edge portion of the laminated substrate shown in Fig. 13(a). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1(a) and 1(b) are enlarged cross-sectional views showing an edge portion E of a substrate W. More specifically, FIG. 1(a) is a cross-sectional view of a so-called straight-type substrate W, and FIG. 1(b) is a cross-sectional view of a so-called round-type substrate W. The edge portion E is the outermost side surface inclined with respect to the flat surfaces (front and back sides) of the substrate W, and has a rounded or chamfered shape. In the substrate W of FIG. 1(a), the edge portion E is the outermost peripheral surface of the substrate W composed of an upper inclined portion (upper bevel portion) B1, a lower inclined portion (lower bevel portion) B2, and a side portion (apex) B3. In the substrate W of FIG. 1(b), the edge portion E is a portion having a curved cross section that constitutes the outermost peripheral surface of the substrate W. The edge portion E is sometimes called a bevel portion.

[0016] FIG. 2 is an enlarged cross-sectional view showing a laminated substrate Ws. The laminated substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are joined at a joining surface P. The first substrate W1 and the second substrate W2 used in this embodiment are circular. The laminated substrate Ws of this embodiment has a structure in which a round-shaped first substrate W1 and a second substrate W2 are joined as shown in FIG. 1(b), but in one embodiment, the laminated substrate Ws may have a structure in which a straight-shaped first substrate W1 and a second substrate W2 are joined as shown in FIG. 1(a). In this specification, the edge portion of the laminated substrate Ws refers to the outer edge portion of the laminated substrate Ws including the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portions E1 and E2 are sometimes called bevel portions. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire circumference of the laminated substrate Ws.

[0017] Fig. 3 is a plan view showing an embodiment of the substrate processing apparatus 1, and Fig. 4 is a side view showing the embodiment of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus for applying a filler F to a laminated substrate Ws in which a first substrate W1 and a second substrate W2 are joined together. The substrate processing apparatus 1 includes a filler application module 9 configured to apply the filler F to the laminated substrate Ws, and an operation control unit 10 for controlling the operation of the filler application module 9. The filler application module 9 includes a substrate holding unit 2 for holding the laminated substrate Ws, an application device 3 for applying the filler F, a curing device 4 for curing the applied filler F, and an infrared imaging device 5 for generating an image of an edge portion of the laminated substrate Ws.

[0018] The substrate holding unit 2 is a stage that holds the back surface of the laminated substrate Ws by vacuum suction. The filler application module 9 further includes a rotating shaft 7 connected to the center of the substrate holding unit 2, and a rotating mechanism 8 that rotates the substrate holding unit 2 and the rotating shaft 7. The laminated substrate Ws is placed on the substrate holding unit 2 so that the center of the laminated substrate Ws coincides with the axis of the rotating shaft 7. The rotating mechanism 8 includes a motor (not shown). As shown in FIG. 3, the rotating mechanism 8 is configured to rotate the substrate holding unit 2 and the laminated substrate Ws together in the direction indicated by the arrow around the central axis Cr of the laminated substrate Ws.

[0019] The coating device 3 is located on the substrate holding unit 2 on the radial outside of the laminated substrate Ws, and is configured to coat the filler F in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. FIG. 5 is a schematic diagram showing one embodiment of the coating device 3. The coating device 3 includes a syringe 21 for discharging the filler F, a piston 22 capable of reciprocating within the syringe 21, and a horizontal movement mechanism (not shown) for moving the syringe 21 closer to or farther from the laminated substrate Ws. This horizontal movement mechanism allows the coating device 3 to adjust the distance between the laminated substrate Ws and the filler discharge port 21a of the coating device 3. In one embodiment, the coating device 3 may omit the horizontal movement mechanism. In this case, the distance between the laminated substrate Ws and the filler discharge port 21a is determined in advance so that the filler F is appropriately injected into the gap G of the laminated substrate Ws.

[0020] Syringe 21 has a hollow structure and is configured to be filled with filler F. Piston 22 is disposed within syringe 21. Syringe 21 has a filler discharge port 21a at its tip for discharging filler F. The tip of syringe 21 including filler discharge port 21a may be configured to be removable. An appropriate shape of filler discharge port 21a is selected depending on the physical properties (e.g., viscosity, etc.) of filler F to be applied. Filler discharge port 21a is disposed to face gap G between edge portion E1 of first substrate W1 and edge portion E2 of second substrate W2.

[0021] The coating device 3 is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. Due to the advancement of the piston 22, the filler F within the syringe 21 is discharged from the filler discharge port 21a.

[0022] A pressure regulator 26 and an on-off valve 27 are disposed in the gas supply line 25. The on-off valve 27 is an actuator-driven valve such as an electric valve or an electromagnetic valve. When the on-off valve 27 is opened, gas is supplied from the gas supply source to the coating device 3, and the coating device 3 applies the filler F to the laminated substrate Ws. When the on-off valve 27 is closed, the supply of gas to the coating device 3 is stopped, and thus the application of the filler F is stopped. The pressure regulator 26 can adjust the amount of filler F discharged from the filler discharge port 21a per unit time by adjusting the pressure of the gas supplied from the gas supply source to the coating device 3. The operations of the pressure regulator 26 and the on-off valve 27 are controlled by the operation control unit 10.

[0023] In one embodiment, the application device 3 may include a screw feeder instead of the combination of the syringe 21 and the piston 22 .

[0024] As shown in Figs. 3 and 4, the curing device 4 is located radially outward of the laminated substrate Ws on the substrate holding unit 2. The curing device 4 is disposed downstream of the coating device 3 in the rotation direction of the laminated substrate Ws, and is configured to cure the filler F applied to the laminated substrate Ws by the coating device 3. The curing device 4 cures the filler F while rotating the laminated substrate Ws. In this embodiment, the filler F is a filler having thermosetting properties. An example of such a filler is a thermosetting resin.

[0025] The curing device 4 is an air heater, and is configured to blow hot air toward the filler F applied to the laminated substrate Ws. The curing device 4 is configured to be able to adjust the wind pressure and temperature of the blown hot air. The filler F heated by the hot air is cured by a crosslinking reaction. If the filler F contains a solvent, the solvent is volatilized by heating. The curing device 4 is not limited to an air heater, and may be a lamp heater or other configuration as long as it can heat and cure the filler F.

[0026] In this embodiment, the filler F is a filler having thermosetting properties, but in one embodiment, the filler F may be a filler having ultraviolet curing properties. In this case, the curing device 4 may be a UV irradiation device that irradiates ultraviolet rays to cure the filler F. If the filler F contains a solvent, it may be heated using an air heater or the like in combination to volatilize the solvent.

[0027] The infrared imaging device 5 is disposed downstream of the curing device 4 in the rotation direction of the laminated substrate Ws. The infrared imaging device 5 is configured to generate an image including the filler F applied to the laminated substrate Ws by the application device 3 and cured by the curing device 4. The distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the application device 3. The infrared imaging device 5 is located above the edge portion of the laminated substrate Ws and configured to generate an image of the edge portion of the laminated substrate Ws. More specifically, the infrared imaging device 5 is configured to irradiate the edge portion of the laminated substrate Ws with infrared rays, receive infrared rays reflected from the edge portion of the laminated substrate Ws, and generate an image of the edge portion of the laminated substrate Ws. An example of the infrared imaging device 5 is an infrared microscope.

[0028] FIG. 6 is a schematic diagram showing how the infrared imaging device 5 generates an image. The infrared imaging device 5 irradiates infrared rays substantially perpendicularly to the joint surface P of the first substrate W1 and the second substrate W2 of the laminated substrate Ws. The infrared imaging device 5 generates an image of the imaging region R including the filler F applied to the laminated substrate Ws by the application device 3 and cured by the curing device 4. The infrared imaging device 5 may generate an image while rotating the laminated substrate Ws. The infrared rays have a wavelength that transmits silicon. In this embodiment, the first substrate W1 and the second substrate W2 are basically made of silicon wafers, and the infrared rays irradiated from the infrared imaging device 5 transmit through the first substrate W1 and the second substrate W2. Since the infrared rays do not transmit through the filler F, the infrared imaging device 5 can generate an image of the imaging region R including the filler F from the infrared rays reflected from the edge portion of the laminated substrate Ws.

[0029] The operation control unit 10 is configured to control the operation of the filler application module 9 configured as described above. The filler application module 9 including the application device 3, the curing device 4, the infrared imaging device 5, the rotation mechanism 8, the pressure adjustment device 26, and the on-off valve 27 is electrically connected to the operation control unit 10.

[0030] The operation control unit 10 is composed of at least one computer. The operation control unit 10 includes a storage device 10a in which a program for controlling the operation of the filler application module 9 is stored, and a processing device 10b that executes calculations according to instructions included in the program. The storage device 10a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the processing device 10b include a CPU (central processing unit) and a GPU (graphic processing unit). However, the specific configuration of the operation control unit 10 is not limited to these examples.

[0031] The infrared imaging device 5 generates an image of the edge portion of the laminated substrate Ws at preset measurement points while the laminated substrate Ws rotates once. The number of measurement points may be one or may be two or more. FIG. 7 is a diagram showing an example of measurement points set on the laminated substrate Ws. In this embodiment, the number of measurement points is four.

[0032] As shown in FIG. 7, four measurement points M1 to M4 are positioned at equal intervals around the central axis Cr of the laminated substrate Ws at the edge portion of the laminated substrate Ws. The operation control unit 10 has position information (e.g., angle information) of the application start point of the filler F and the measurement points M1 to M4. The laminated substrate Ws rotates in the direction indicated by the arrow. When the application start point of the filler F coincides with the measurement point M1, the application device 3 starts application from the measurement point M1, and then the filler F is continuously applied to the edge portion of the laminated substrate Ws. The filler F may be applied during multiple rotations of the laminated substrate Ws depending on the total amount of the filler F to be applied.

[0033] Similarly, the curing device 4 continuously cures the filler F applied to the edge portion of the laminated substrate Ws. Furthermore, the infrared imaging device 5 generates images of the edge portion of the laminated substrate Ws at each measurement point M1, M2, M3, and M4 in this order. The operation control unit 10 determines the filling state of the filler F applied to the gap G (see FIG. 5) between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 based on the generated images. The operation control unit 10 causes the application device 3 to end application of the filler F at an appropriate timing based on the determined filling state of the filler F.

[0034] Next, a method for determining the filling state of the filler F will be described. FIG. 8(a) is an enlarged cross-sectional view of an edge portion of the laminated substrate Ws in the middle of filling with the filler F. FIG. 8(b) is a diagram showing an image of the edge portion of the laminated substrate Ws shown in FIG. 8(a). The edge portion of the laminated substrate Ws shown in FIG. 8(a) corresponds to the imaging region R shown in FIG. 6. FIG. 8(b) shows an image of the imaging region R generated by an infrared imaging device 5 arranged above the edge portion of the laminated substrate Ws. In this embodiment, the image generated by the infrared imaging device 5 is two-dimensional, but in one embodiment, the image generated by the infrared imaging device 5 may be three-dimensional.

[0035] 8(a), width x1 is the radial width of the portion where the first substrate W1 and the second substrate W2 are joined within the imaging region R. Width x2 is the radial width of the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0036] Widths x1 to x3 shown in Fig. 8(b) correspond to widths x1 to x3 shown in Fig. 8(a). Regions Rn corresponding to portions where no filler F is present appear in the image in a color close to white because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1. Regions Rf corresponding to portions where filler F is present appear in the image in a color close to black because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and is reflected by the filler F.

[0037] The operation control unit 10 determines the filling state of the filler F applied to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, the operation control unit 10 determines the filling state based on the size of the filler F in a preset target area T on the image. The target area T may be a part of the image or the whole image. As shown in FIG. 8(b), the target area T in this embodiment is an area with a radial width of x1+x2 and a length in a direction perpendicular to the radial direction of y. In one embodiment, the target area T may be set to an area (indicated by the symbol Tx) with a radial width of x2 and a length in a direction perpendicular to the radial direction of y. The target area T can be set arbitrarily as long as it is within a range that includes all the portions where the filler F is present in the radial width.

[0038] The laminated substrate Ws shown in FIG. 8(a) is filled with filler F to a radial width x3, and filling of the filler F is completed when the filler F is applied up to a radial width x2. That is, the filling state of the filler F in this embodiment is "filling incomplete". The operation control unit 10 determines the filling state as "filling incomplete" when the size of the filler F in the target region T (i.e., the area of ​​the region Rf when the radial width is x2) is smaller than a predetermined threshold. In this embodiment, the predetermined threshold is set to the size of the filler F in the target region T when the radial width is x2 (i.e., the area of ​​the region Rf when the radial width is x2).

[0039] FIG. 9(a) is an enlarged cross-sectional view of an edge portion of the laminated substrate Ws after the filling of the filler F is completed. FIG. 9(b) is a diagram showing an image of the edge portion of the laminated substrate Ws shown in FIG. 9(a). Details of this embodiment that are not particularly described are the same as those of the embodiment described with reference to FIG. 8(a) and FIG. 8(b), so that the overlapping description will be omitted. In FIG. 9(a), width x1 is the radial width of the portion where the first substrate W1 and the second substrate W2 are joined in the imaging region R. Width x2 is the radial width of the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0040] Widths x1 to x3 shown in Fig. 9(b) correspond to widths x1 to x3 shown in Fig. 9(a). Regions Rn corresponding to portions where no filler F is present appear in the image in a color close to white because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1. Regions Rf corresponding to portions where filler F is present appear in the image in a color close to black because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and is reflected by the filler F.

[0041] The operation control unit 10 determines the filling state of the filler F applied to the gap between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, the operation control unit 10 determines the filling state based on the size of the filler F within the target area T on the image.

[0042] The laminated substrate Ws shown in FIG. 9(a) is filled with filler F to a radial width x3, and filling is completed when the filler F is applied to a radial width x2. That is, the filling state of the filler F in this embodiment is "filling completed." The operation control unit 10 determines the filling state as "filling completed" when the size of the filler F in the target region T (i.e., the area of ​​the region Rf when the radial width is x2) is equal to or greater than a predetermined threshold. In this embodiment, the predetermined threshold is set to the size of the filler F in the target region T when the radial width is x2 (i.e., the area of ​​the region Rf when the radial width is x2).

[0043] The operation control unit 10 terminates the application of filler F by the application device 3 based on the determined filling state of filler F. More specifically, when the filling state of filler F is determined to be "filling incomplete", the operation control unit 10 gives a command to the filler application module 9 to cause the application device 3 to continue applying filler F, and when the filling state of filler F is determined to be "filling completed", the operation control unit 10 gives a command to the filler application module 9 to cause the application device 3 to terminate applying filler F.

[0044] FIG. 10 is a flow chart illustrating one embodiment of a method for processing a substrate. In step S101, the operation control unit 10 issues a command to the rotation mechanism 8 of the filler application module 9 to rotate the substrate holding unit 2 and the laminated substrate Ws at a predetermined rotation speed. In step S102, the operation control unit 10 issues a command to the on-off valve 27 of the filler coating module 9 to open the on-off valve 27 and supply gas from the gas supply source to the coating device 3. By this operation, the filler F is injected into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. In step S103, the operation control unit 10 issues a command to the curing device 4 of the filler application module 9 to heat the laminated substrate Ws and cure the applied filler F. In step S104, the operation control unit 10 issues a command to the infrared imaging device 5 of the filler application module 9 to generate an image of the edge portion of the laminated substrate Ws at the measurement point on the laminated substrate Ws.

[0045] In step S105, the operation control unit 10 compares the size of the filler F within the target region T on the image generated by the infrared imaging device 5 with a predetermined threshold value. When the size of the filler F in the target T is smaller than a predetermined threshold, the operation control unit 10 determines the filling state to be "filling incomplete" (step S106-1). When the operation control unit 10 determines the filling state to be "filling incomplete", it issues a command to the filler application module 9 to cause the application device 3 to continue applying the filler F, and repeats steps S102 to S105. The operation control unit 10 determines the filling state to be "filling completed" when the size of the filler F in the target T is equal to or larger than a predetermined threshold value (step S106-2). When the operation control unit 10 determines the filling state to be "filling completed", it gives a command to the filler application module 9 to end the application of the filler F. When the application start point of the filler F reaches the application position of the application device 3, the operation control unit 10 may give a command to the filler application module 9 to stop the application of the filler F.

[0046] According to this embodiment, the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the application device 3, so the filling state of the filler F is determined immediately after the curing device 4 hardens the filler F. Therefore, the filling state of the filler F can be monitored in real time, and the application of the filler F can be terminated at an appropriate timing. This makes it possible to achieve an appropriate filling state of the filler F.

[0047] In one embodiment, the operation control unit 10 may determine the filling state by comparing the size of the filler F in the target region T with a predetermined threshold value after stopping the operations of the application device 3 and the curing device 4 (step S105). In this case, when the filling state is determined to be "filling incomplete" (step S106-1), the operation control unit 10 may give a command to the filler application module 9 to restart the operations of the application device 3 and the curing device 4, and perform additional application of the filler F by the application device 3 (step S102), and repeat steps S103 to S105.

[0048] In one embodiment, the additional application of filler F may be performed only on a part of the edge portion of the laminated substrate Ws based on the filling states of filler F at a plurality of measurement points and the position information of the plurality of measurement points. For example, the operation control unit 10 may determine the filling states of filler F at a plurality of measurement points M1 to M4 shown in Fig. 7, and when the filling state at measurement point M1 is determined to be "filling incomplete" and the filling state at measurement points M2 to M4 is determined to be "filling completed", the operation control unit 10 may cause the filler application module 9 to additionally apply filler F only at measurement point M1.

[0049] Next, another embodiment of the substrate processing method will be described. FIG. 11(a) is an enlarged cross-sectional view of an edge portion of a laminated substrate Ws in which a void B occurs in the filler F. The void B is an air gap formed in the filler F applied to the laminated substrate Ws. FIG. 11(b) is a diagram showing an image of the edge portion of the laminated substrate Ws shown in FIG. 11(a). Details of this embodiment that are not particularly described are the same as those of the embodiment described with reference to FIG. 8(a) and FIG. 8(b), so that the overlapping description will be omitted. Depending on the application conditions of the filler F, etc., a void B may occur in the applied filler F. In FIG. 11(a), width x1 is the radial width of the portion where the first substrate W1 and the second substrate W2 are joined in the imaging region R. Width x2 is the radial width of the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0050] Widths x1 to x3 shown in Fig. 11(b) correspond to widths x1 to x3 shown in Fig. 11(a). Regions Rn corresponding to portions where filler F is not present appear in the image in a color close to white because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1. Regions Rf corresponding to portions where filler F is present appear in the image in a color close to black because infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and is reflected by the filler F. Voids B generated in the filler F appear in the image in a color close to white.

[0051] The operation control unit 10 determines the filling state of the filler F applied to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, when the operation control unit 10 detects a void B in the filler F (i.e., the region Rf) in the image, it determines the filling state as "void occurrence". Furthermore, the operation control unit 10 counts the number of voids B in the image, and when the number of voids B reaches a preset allowable value, it determines that "abnormality has occurred".

[0052] Fig. 12 is a flow chart showing another embodiment of the substrate processing method. Steps S201 to S204 of this embodiment are the same as steps S101 to S104 of the embodiment described with reference to Fig. 10, so duplicated description will be omitted.

[0053] In step S205, the operation control unit 10 determines whether or not a void B has occurred in the filler F based on the image generated by the infrared imaging device 5. When voids B are generated in the filler F, the operation control unit 10 determines the filling state as "voids generated" (step S206). When the operation control unit 10 determines that voids B are not generated in the filler F ("No" in step 205), it continues application of the filler F by the filler application module 9 and repeats steps S202 to S205.

[0054] If voids B have occurred in the filler F ("Yes" in step S205), the operation control unit 10 counts the number of voids B on the image generated by the infrared imaging device 5 (step S207). In step S208, the operation control unit 10 judges whether the number of voids B reaches a predetermined allowable value. When the number of voids B reaches the allowable value, the operation control unit 10 judges that an "abnormality has occurred" (step S209). When the operation control unit 10 judges that an "abnormality has occurred", it issues a command to the filler application module 9 to end application of the filler F. If the number of voids B has not reached the predetermined allowable value ("No" in step S208), the operation control unit 10 issues a command to the filler application module 9 to continue application of the filler F and repeats steps S202 to S205.

[0055] According to this embodiment, the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the application device 3, so the filling state of the filler F is determined immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and the occurrence of an abnormality can be quickly detected.

[0056] In one embodiment, the operation control unit 10 may detect voids B in the filler F based on the increase rate of the size of the filler F in the target region T (see FIG. 11(b)) on the image. The increase rate of the size of the filler F is the amount of increase in the size of the filler F per unit time in the target region T. When voids B are generated in the filler F, the radial width x3 (see FIG. 11(a) and FIG. 11(b)) of the filler F applied to the gap G becomes larger than when voids B are not generated. Therefore, in this embodiment, the operation control unit 10 determines the filling state as "void generation" when the increase rate of the size of the filler F in the target region T (i.e., the increase rate of the area of ​​the region Rf) is larger than a predetermined reference value. The predetermined reference value may be set based on the increase rate of the size of the filler F when voids B are not generated in the filler F, which is obtained in advance by an experiment or the like.

[0057] The rate of increase in the size of the filler F can be obtained from the size of the filler F in the target area T on the image generated by the infrared imaging device 5 each time the laminated substrate Ws rotates. For example, the operation control unit 10 calculates the amount of increase in the size of the filler F from the size of the filler F in the target area T on the image when the laminated substrate Ws has made one rotation from the start of application of the filler F and the size of the filler F in the target area T on the image when the laminated substrate Ws has made another one rotation. The operation control unit 10 divides the calculated amount of increase in the size of the filler F by the time it takes for the laminated substrate to make one rotation, thereby calculating the amount of increase in the size of the filler F per unit time, i.e., the rate of increase in the size of the filler F.

[0058] Furthermore, the operation control unit 10 may issue a command to the filler application module 9 to end application of the filler F when the rate of increase in the size of the filler F in the target region T is greater than the above-mentioned reference value.

[0059] When many voids occur in the filler F, the volume of the applied filler F becomes larger than expected. Therefore, in one embodiment, the operation control unit 10 may determine the filling state as "void occurrence" when the size of the filler F in the target region T (i.e., the area of ​​the region Rf) is larger than a preset upper limit value. Furthermore, the operation control unit 10 may give a command to the filler application module 9 to end application of the filler F when the size of the filler F in the target region T (i.e., the area of ​​the region Rf) is larger than the above-mentioned preset upper limit value.

[0060] In one embodiment, the operation control unit 10 may change the application conditions of the filler F based on the filling state of the filler F. The application conditions include at least one of the total application amount of the filler F, the shape of the filler discharge port 21a (see FIG. 5) of the application device 3, the distance between the laminated substrate Ws and the filler discharge port 21a, the amount of filler F discharged from the filler discharge port 21a per unit time, and the rotation speed of the laminated substrate Ws. In one embodiment, the application conditions may further include the wind pressure and temperature of the hot air blown from the curing device 4.

[0061] In one embodiment, the application conditions may be changed only at a part of the edge portion of the laminated substrate Ws based on the filling states of the filler F at a plurality of measurement points and position information of the plurality of measurement points. The operation control unit 10 determines the filling states of the filler F at a plurality of measurement points M1 to M4 shown in Fig. 7. When the operation control unit 10 determines that the filling state at the measurement point M1 is "insufficient filling" and that the filling state at the measurement points M2 to M4 is "not filled", the operation control unit 10 may change only the application conditions of the filler F at the measurement point M1 based on the position information of the measurement points M1 to M4.

[0062] According to this embodiment, the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the application device 3, so the filling state of the filler F is determined immediately after the curing device 4 cures the filler F. Therefore, the filling state of the filler F can be monitored in real time and the application conditions can be adjusted to achieve an optimal filling state.

[0063] In one embodiment, the filling state of the filler F in the laminated substrate Ws may be reflected in the application conditions of the filler F for the next laminated substrate. This allows the filler F to be applied in an appropriate filling state when the next laminated substrate has a similar configuration, without having to adjust the application conditions midway.

[0064] Next, another embodiment of the substrate processing method will be described. FIG. 13(a) is an enlarged cross-sectional view of an edge portion of a laminated substrate Ws where a filling defect of the filler F occurs. FIG. 13(b) is a diagram showing an image of the edge portion of the laminated substrate Ws shown in FIG. 13(a). Details of this embodiment that are not particularly described are the same as those of the embodiment described with reference to FIG. 8(a) and FIG. 8(b), so that the overlapping description will be omitted. In FIG. 13(a), width x1 is the radial width of the portion where the first substrate W1 and the second substrate W2 are joined in the imaging region R. Width x2 is the radial width of the portion where the filler F is not applied radially inward from the filler F. Width x3 is the radial width of the filler F applied to the gap G. Width x4 is the radial width of the portion where the filler F is not applied radially outward from the filler F, that is, the width from the radially outermost end of the filler F to the radially outermost end of the laminated substrate Ws.

[0065] Widths x1 to x4 shown in Fig. 13(b) correspond to widths x1 to x4 shown in Fig. 13(a). Regions Rn where no filler F is present appear in the image in a color close to white because the infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1. Regions Rf where filler F is present appear in the image in a color close to black because the infrared light irradiated from the infrared imaging device 5 passes through the second substrate W2 and is reflected by the filler F.

[0066] The operation control unit 10 determines the filling state of the filler F applied to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, based on the image generated by the infrared imaging device 5. More specifically, the operation control unit 10 determines the filling state based on the position of the filler F on the image.

[0067] In the laminated substrate Ws shown in FIG. 13(a), a filling defect of the filler F occurs, and the filler F is not applied to the portion of the radial width x2. In this case, as shown in FIG. 13(b), the radially inner end position Lf of the region Rf is located radially outward from the radially inner end position L0 of the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The operation control unit 10 determines the filling state as "filling defect" when the radially inner end position of the filler F (i.e., the radially inner end position Lf of the region Rf) is radially outward from the radially inner end position L0 of the gap G. When the operation control unit 10 determines that the filling state of the filler F is "filling defect", it ends the application of the filler F by the application device 3.

[0068] According to this embodiment, the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the application device 3, so the filling state of the filler F is determined immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and filling defects can be quickly detected.

[0069] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0070] 1. Substrate Processing Equipment 2 Board holding part 3 Coating equipment 4 Curing equipment 5. Infrared imaging device 7 Rotation Axis 8 Rotation mechanism 9 Filler Application Module 10 Operation control section 10a storage device 10b Processing device 21 Syringe 21a Filler outlet 22 Piston 25 Gas supply line 26 Pressure Regulating Device 27 On-off valve

Claims

1. 1. A substrate processing method for applying a filler to a laminated substrate in which a first substrate and a second substrate are bonded together, comprising the steps of: Applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; The applied filler is cured, generating an image of an edge portion of the laminated substrate to which the filler is applied using an infrared imaging device; determining a filling state of the filler in the gap based on the image.

2. 2. The substrate processing method according to claim 1, wherein the step of determining the filling state comprises determining the filling state based on a size of the filler within a preset target area on the image.

3. The substrate processing method according to claim 1 , further comprising the step of: terminating application of the filler based on the filled state.

4. The substrate processing method according to claim 1 , further comprising the step of additionally applying the filler based on the filled state.

5. The substrate processing method according to claim 1 , further comprising a step of counting the number of voids that have occurred in the filling material on the image, and determining that an abnormality has occurred when the number of the voids reaches an allowable value.

6. The substrate processing method according to claim 1 , wherein the step of applying the filler, the step of curing the filler, and the step of generating the image are performed while rotating the laminated substrate.

7. The substrate processing method according to claim 6 , further comprising changing a coating condition of the filler based on the filled state.

8. generating the image at a plurality of measurement points of the laminated substrate during one rotation of the laminated substrate; The substrate processing method according to claim 7 , further comprising changing a coating condition of the filler at least one of the plurality of measurement points based on the filling state at the plurality of measurement points and position information of the plurality of measurement points.

9. The substrate processing method according to claim 1 , further comprising the step of changing a coating condition of the filler for a next laminated substrate based on the filled state.

10. 10. The substrate processing method according to claim 7, wherein the coating conditions include at least one of a total amount of the filler to be applied, a shape of a filler outlet of a coating device for applying the filler, a distance between the laminated substrate and the filler outlet, an amount of the filler discharged from the filler outlet per unit time, and a rotation speed of the laminated substrate.

11. The substrate processing method according to claim 1 , wherein the infrared imaging device irradiates the infrared light substantially perpendicularly to a bonding surface between the first substrate and the second substrate of the laminated substrate.

12. 1. A substrate processing apparatus for applying a filler to a laminated substrate in which a first substrate and a second substrate are bonded together, comprising: a filler application module configured to apply the filler to the laminate substrate; An operation control unit for controlling the operation of the filler application module, The filler application module includes: A substrate holder that holds the laminated substrate; an application device for applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; A curing device for curing the applied filler; an infrared imaging device for generating an image of an edge portion of the laminated substrate to which the filler is applied; The substrate processing apparatus, wherein the operation control unit is configured to determine a filling state of the filler applied to the gap based on the image.

13. The substrate processing apparatus of claim 12 , wherein the operation control unit is further configured to give a command to the filler application module based on the filling state to cause the application device to end application of the filler.

14. The substrate processing apparatus of claim 12 , wherein the operation control unit is further configured to give a command to the filler application module based on the filling state to apply additional filler.

15. The substrate processing apparatus according to claim 12 , wherein the filler application module further comprises a rotation mechanism that rotates the substrate holder.

16. The substrate processing apparatus according to claim 15 , wherein the operation control unit changes a coating condition of the filler based on the filled state.

Images