Shower plate

Abstract

This shower plate includes: a substrate; a resistance heating element; a flow path, and a hollow part. The substrate is ceramic and has a plate-like shape. The resistance heating element is located within the substrate, along a first surface of the substrate. The flow path is located in the interior of the substrate, between the resistance heating element and a second surface opposite the first surface of the substrate, and has an intermediate flow path that extends in the surface direction of the substrate. The hollow part is located in the interior of the substrate and adjacent to the intermediate flow path, in the surface direction of the substrate.

Description

[Technical field]

[0001] The disclosed embodiments relate to a shower plate. [Background technology]

[0002] Conventionally, shower plates are used to spray heated process gas onto a substrate such as a semiconductor wafer in, for example, a semiconductor manufacturing process. A known example of such a shower plate is one having a disk-shaped base body made of ceramics, a flow path formed inside the base body, and a resistance heating element embedded in the base body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 009478 Summary of the Invention

[0004] A shower plate according to one aspect of the embodiment has a base, a resistance heating element, a flow path, and a cavity. The base is a plate-shaped base made of ceramics. The resistance heating element is located inside the base along a first surface of the base. The flow path is a flow path located inside the base, and has an intermediate flow path located between the resistance heating element and a second surface of the base opposite to the first surface and extending in a surface direction of the base. The cavity is located inside the base adjacent to the intermediate flow path in the surface direction of the base. [Brief description of the drawings]

[0005] [Figure 1] FIG. 1 is a schematic perspective view of a shower plate according to the first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view of the shower plate according to the first embodiment. [Diagram 3] FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the second embodiment. [Diagram 5] FIG. 5 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the third embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the fourth embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the fifth embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the sixth embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the seventh embodiment. [Figure 10] FIG. 10 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the eighth embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the ninth embodiment. [Figure 12] FIG. 12 is a schematic cross-sectional view of the periphery of a cavity in a shower plate according to the tenth embodiment. [Figure 13] FIG. 13 is a schematic cross-sectional view of a shower plate according to the eleventh embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] Hereinafter, an embodiment of the shower plate disclosed in the present application will be described with reference to the attached drawings. Note that the present disclosure is not limited to the following embodiments. It should be noted that the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, and the like may differ from reality. Furthermore, there may be parts in which the dimensional relationship and ratio differ between the drawings.

[0007] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical" and "parallel" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical" and "parallel" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy and installation accuracy.

[0008] In addition, the embodiments can be appropriately combined as long as the processing contents are not contradictory. In the following embodiments, the same components are denoted by the same reference numerals, and duplicated descriptions are omitted.

[0009] (First embodiment) Fig. 1 is a schematic perspective view of a shower plate 1 according to the first embodiment. Fig. 2 is a schematic cross-sectional view of the shower plate 1 according to the first embodiment. Fig. 3 is a schematic cross-sectional view taken along line III-III in Fig. 2. Fig. 2 also shows a schematic cross-sectional view taken along line II-II in Fig. 1.

[0010] 1, a shower plate 1 according to the first embodiment ejects a heated process gas (an example of a fluid) onto a substrate such as a semiconductor wafer in a semiconductor manufacturing process. The shower plate 1 is mounted on, for example, a substrate processing apparatus that performs plasma processing or the like on the substrate.

[0011] 1 and 2, the shower plate 1 has a base 10, a shaft 20, a resistance heating element 30, a flow path 40, and an electrode 50. In the following description, the direction from the base 10 to the shaft 20 is defined as the upward direction, and the direction from the shaft 20 to the base 10 is defined as the downward direction; however, the shower plate 1 may be used in any position, for example, upside down.

[0012] The base 10 has a disk shape that is thick in the up-down direction. Specifically, the base 10 has an upper surface (an example of a first surface) 101 and a lower surface (an example of a second surface) 102 that are circular when viewed from above, and a side surface 103 that is continuous with the upper surface 101 and the lower surface 102. The upper surface 101 and the lower surface 102 of the base 10 are approximately parallel to each other.

[0013] The base 10 is made of, for example, ceramics and has insulating properties. The ceramics constituting the base 10 are sintered bodies mainly composed of, for example, aluminum nitride (AlN), aluminum oxide (Al2O3, alumina), yttrium oxide (Y2O3, yttria), silicon carbide (SiC), silicon nitride (Si3N4), etc. The main component is, for example, a material that occupies 50 mass % or more or 80 mass % or more of the material.

[0014] The base body 10 may have any shape. For example, in this embodiment, the base body 10 has a circular plate shape, but is not limited to this, and may have an elliptical plate shape, a rectangular plate shape, a trapezoidal plate shape, or the like.

[0015] The shaft 20 is a member for introducing a process gas into the shower plate 1. The shaft 20 has, for example, a cylindrical shape. The shaft 20 has a through hole 21 penetrating the shaft 20 from one end face (here, the upper face) to the other end face (here, the lower face). The shaft 20 is connected to the upper face 101 of the base 10. In one embodiment, the shaft 20 is bonded (adhered) to the upper face 101 of the base 10 by an adhesive. In another embodiment, the shaft 20 may be bonded to the base 10 by solid-state bonding. The material of the shaft 20 is arbitrary. For example, the same ceramic as that of the base 10 may be used as the material of the shaft 20.

[0016] 2, the resistive heating element 30 is located inside the base 10 along the upper surface 101 of the base 10. The resistive heating element 30 is made of, for example, a metal such as Ni, W, Mo, or Pt, or an alloy containing at least one of the above metals.

[0017] The resistance heating element 30 extends along the upper surface 101 of the base 10. The resistance heating element 30 has, for example, a disk shape with an opening formed in the center corresponding to the through hole 21 of the shaft 20 in a plan view.

[0018] The resistance heating element 30 generates heat by Joule heat generated by power supplied from a power supply unit (not shown). The resistance heating element 30 generates heat, thereby heating the flow path 40 from the upper surface 101 side of the base 10. This allows the shower plate 1 to heat the process gas flowing through the flow path 40.

[0019] The flow path 40 is located inside the base 10. The flow path 40 connects an inlet 111 located on the upper surface 101 of the base 10 to a plurality of outlets 121 located on the lower surface 102 of the base 10. The inlet 111 communicates with the through hole 21 of the shaft 20.

[0020] Specifically, the flow path 40 has an inlet path 41 , an intermediate flow path 42 , and a plurality of outlet paths 43 .

[0021] The introduction path 41 communicates with the introduction port 111, and connects the introduction port 111 to the intermediate flow path . The introduction path 41 extends, for example, from the introduction port 111 in the thickness direction of the base 10 and communicates with the intermediate flow path .

[0022] The intermediate flow path 42 is located between the resistance heating element 30 and the lower surface 102 of the base 10. The intermediate flow path 42 extends in the surface direction of the base 10 along the lower surface 102 of the base 10. The surface direction of the base 10 is a direction approximately parallel to the upper surface 101 and the lower surface 102 of the base 10. Note that the intermediate flow path 42 may have a portion that is not located between the resistance heating element 30 and the lower surface 102 of the base 10.

[0023] The outlet path 43 communicates with the intermediate flow path 42, and connects the intermediate flow path 42 to the outlet 121. The outlet path 43 extends from the bottom surface of the intermediate flow path 42 in the thickness direction of the base 10 and communicates with the outlet 121, for example.

[0024] The flow path 40 is configured as described above, and the process gas that is introduced into the inlet path 41 from the inlet 111 via the through hole 21 of the shaft 20 and flows through the intermediate flow path 42 and the outlet path 43 can be discharged from the outlet 121 below the underside 102 of the substrate 10.

[0025] The electrode 50 is located inside the substrate 10, between the intermediate flow path 42 and the lower surface 102 of the substrate 10. Like the resistance heating element 30, the electrode 50 is made of a metal such as Ni, W, Mo, or Pt, or an alloy containing at least one of the above metals.

[0026] The electrode 50 extends along the lower surface 102 of the base 10. The electrode 50 has, for example, a disk shape in a plan view. The electrode 50 has a through hole that corresponds to the position of the lead-out path 43 of the base 10 and has a diameter larger than that of the lead-out path 43.

[0027] The electrode 50 is an RF electrode to which radio frequency (RF) power for generating plasma can be applied. When RF power is applied to the electrode 50 from an RF power source (not shown), the electrode 50 can convert the process gas discharged from the outlet 121 to below the lower surface 102 of the substrate 10 into plasma.

[0028] In a substrate processing apparatus equipped with a shower plate 1, when RF power is applied to an electrode 50 to generate plasma, a flow path 40 inside a substrate 10 is heated by a resistive heating element 30, thereby heating the process gas flowing through the flow path 40 to a temperature suitable for generating plasma.

[0029] Incidentally, in the shower plate 1, the resistance heating element 30, the flow path 40, and the electrodes 50 generally do not extend to the vicinity of the side surface 103 of the base 10. This is because if the resistance heating element 30, the flow path 40, and the electrodes 50 were extended to the vicinity of the side surface 103 of the base 10, delamination may occur in the base 10. For this reason, the resistance heating element 30, the flow path 40, and the electrodes 50 are disposed with a certain amount of space between them and the side surface 103 of the base 10. In other words, the resistance heating element 30, the flow path 40, and the electrodes 50 have a smaller diameter than the lower surface 102 of the base 10.

[0030] The heat of the flow passage 40 heated by the resistance heating element 30 is not only transferred to the process gas flowing through the flow passage 40, but also transferred from the flow passage 40 to the outside in the surface direction of the substrate 10, and is finally released from the side surface 103 of the substrate 10 into the external atmosphere. In particular, the heat of the intermediate flow passage 42, which has the smallest distance from the side surface 103 of the substrate 10, is easily transferred to the outside in the surface direction of the substrate 10. When the heat of the intermediate flow passage 42 is transferred to the outside in the surface direction of the substrate 10, the temperature of the process gas flowing through the flow passage 40 may be locally reduced, and the thermal uniformity of the process gas may be reduced. The reduction in the thermal uniformity of the process gas flowing through the flow passage 40 is undesirable because it may cause solidification of the process gas in the flow passage 40. In order to improve the thermal uniformity of the process gas flowing through the flow passage 40, it is desirable to suppress the thermal conduction from the intermediate flow passage 42, which has the smallest distance from the side surface 103 of the substrate 10, to the outside in the surface direction of the substrate 10.

[0031] In contrast, the shower plate 1 according to this embodiment has a cavity 60 inside the base 10. The cavity 60 is located adjacent to the intermediate flow passage 42 of the flow passage 40 in the surface direction of the base 10. Specifically, the cavity 60 is located adjacent to the intermediate flow passage 42 across a partition wall 104 molded integrally with the base 10.

[0032] The cavity 60 contains a gas having a lower thermal conductivity than the ceramics constituting the substrate 10. Therefore, by positioning the cavity 60 adjacent to the intermediate flow passage 42 of the flow passage 40 in the surface direction of the substrate 10, it is possible to suppress heat conduction from the intermediate flow passage 42 to the outside in the surface direction of the substrate 10. As a result, it is possible to improve the thermal uniformity of the process gas flowing through the flow passage 40. This reduces the generation of solidified matter of the process gas in the flow passage 40, and reduces defects in the substrate caused by the solidified matter adhering to the substrate.

[0033] Moreover, the hollow portion 60 is located between the intermediate flow path 42 and the side surface 103 of the base 10. By providing the hollow portion 60 between the intermediate flow path 42 and the side surface 103 of the base 10, it is possible to suppress the heat of the flow path 40 heated by the resistance heating element 30 from being transferred to the outside in the planar direction of the base 10 and ultimately being released from the side surface 103 of the base 10 into the external atmosphere.

[0034] Different gases may be accommodated in the cavity 60 depending on the ceramics constituting the base 10. For example, when the ceramics constituting the base 10 are aluminum oxide or yttrium oxide, the gas accommodated in the cavity 60 may be a gas containing at least nitrogen and argon and having a higher volume ratio of nitrogen and argon than air. Also, for example, when the ceramics constituting the base are aluminum nitride or silicon nitride, the gas accommodated in the cavity 60 may be a gas containing at least nitrogen and having a higher volume ratio of nitrogen than air. By accommodating these gases in the cavity 60, it is possible to suppress the heat conduction from the intermediate flow passage 42 to the outside in the surface direction of the base 10 by using an appropriate gas according to the type of ceramics constituting the base 10.

[0035] The inside of the cavity 60 may be in a vacuum state or a reduced pressure state. The reduced pressure state refers to a state in which the pressure inside the cavity 60 is lower than atmospheric pressure. By making the inside of the cavity 60 in a vacuum state or a reduced pressure state, it is possible to suppress a load on the base 10 due to the thermal expansion of the gas when the inside of the cavity 60 is a closed space.

[0036] 3, that is, in a cross-sectional view passing through the cavity 60 and in a cross-sectional view in the surface direction of the base 10, the cavity 60 extends in an annular shape surrounding the outer periphery of the intermediate flow passage 42. This makes it possible to suppress heat conduction from the intermediate flow passage 42 to the outside in the surface direction of the base 10 over the entire circumference of the base 10. Note that the cavity 60 does not necessarily have to extend in an annular shape. For example, the cavity 60 may be arranged by being divided into a plurality of arc-shaped spaces along the outer periphery of the intermediate flow passage 42.

[0037] Second embodiment Fig. 4 is a schematic cross-sectional view of the periphery of a cavity 60 in a shower plate 1A according to the second embodiment. As shown in Fig. 4, in the shower plate 1A according to the second embodiment, a base 10A has a resistance heating element 30A. The resistance heating element 30A extends in the surface direction of the base 10A to a position corresponding to the cavity 60.

[0038] By generating heat, the resistance heating element 30A can not only heat the flow path 40 (i.e., the intermediate flow path 42) from the upper surface 101 side of the base 10A, but also heat the cavity 60 located adjacent to the intermediate flow path 42.

[0039] In this way, by extending the resistance heating element 30A in the surface direction of the base 10A to a position corresponding to the cavity 60, the temperature difference between the cavity 60 and the intermediate flow path 42 can be reduced, thereby further suppressing heat conduction from the intermediate flow path 42 to the outside in the surface direction of the base 10A.

[0040] Third embodiment 5 is a schematic cross-sectional view of the periphery of a cavity 60B in a shower plate 1B according to the third embodiment. As shown in FIG. 5, in the shower plate 1B according to the third embodiment, a base 10B has a cavity 60B. The cavity 60B has a support 105. The upper end of the support 105 is located on the ceiling surface of the cavity 60B, and the lower end is located on the bottom surface of the cavity 60B. The support 105 may be made of the same ceramic as the base 10.

[0041] In this way, since the hollow portion 60B has the support 105, it is possible to promote the transfer of heat generated in the resistance heating element 30A to the lower surface 102 of the base 10B through the support 105. As a result, it is possible to maintain the temperature of the process gas discharged from the outlet 121 to below the lower surface 102 of the base 10B at a temperature suitable for generating plasma. Furthermore, since the hollow portion 60B has the support 105, it is possible to improve the strength of the base 10B.

[0042] (Fourth embodiment) 6 is a schematic cross-sectional view of the periphery of a cavity 60B in a shower plate 1C according to a fourth embodiment. 4 In a shower plate 1C according to the embodiment, a base 10C has an electrode 50C. The electrode 50C extends to a position corresponding to the lower end of the support 105 in the surface direction of the base 10C.

[0043] In this way, by extending electrode 50C in the surface direction of base 10C to a position corresponding to the lower end of pillar 105, it is possible to promote the transfer of heat generated in resistive heating element 30A through pillar 105 to electrode 50C, thereby making it possible to appropriately adjust the temperature of electrode 50C.

[0044] Fifth embodiment Fig. 7 is a schematic cross-sectional view of a cavity 60D and its periphery in a shower plate 1D according to the fifth embodiment. As shown in Fig. 7, in the shower plate 1D according to the fifth embodiment, a base 10D has a cavity 60D. The cavity 60D has a support 105D. The support 105D has a shape in which the width increases toward the lower end of the support 105D located on the bottom surface of the cavity 60D. The side surface of the support 105D is a tapered surface.

[0045] In this way, the width of the pillar 105D in the hollow portion 60D increases as it approaches the lower end of the pillar 105D, which further promotes the transfer of heat generated in the resistance heating element 30A through the pillar 105D to the underside 102 of the base 10D.

[0046] Sixth embodiment Fig. 8 is a schematic cross-sectional view of the periphery of a cavity 60E in a shower plate 1E according to the sixth embodiment. As shown in Fig. 8, in the shower plate 1E according to the sixth embodiment, a base 10E has a cavity 60E. The cavity 60E has a support 105E. Like the support 105D in the fifth embodiment, the support 105E has a shape that increases in width toward the lower end of the support 105E located on the bottom surface of the cavity 60E. The side surface of the support 105E is a stepped surface.

[0047] In this way, the support 105E of the cavity 60E has a stepped surface on the side surface. In this case, the same effect as the shower plate 1D according to the fifth embodiment can be obtained. That is, it is possible to further promote the transfer of heat generated in the resistance heating element 30A to the lower surface 102 of the base 10E through the support 105E.

[0048] Seventh embodiment Fig. 9 is a schematic cross-sectional view of the periphery of a cavity 60B in a shower plate 1F according to the seventh embodiment. As shown in Fig. 9, in the shower plate 1F according to the seventh embodiment, a base 10F has a cavity 60F. The cavity 60F is located adjacent to the intermediate flow passage 42 with a partition wall 104F interposed therebetween.

[0049] One wall surface of the partition 104F located on the cavity 60F side approaches the other wall surface located on the intermediate flow path 42 side as it moves away from the resistance heating element 30A. One wall surface of the partition 104F located on the cavity 60F side is a tapered surface.

[0050] In this way, by bringing one wall surface of the partition wall 104F on the cavity portion 60F side closer to the other wall surface on the intermediate flow passage 42 side, the heat generated in the resistance heating element 30A is concentrated on the inner surface of the intermediate flow passage 42 and is transferred from the intermediate flow passage 42 to the base 10 F It is possible to suppress heat conduction outward in the planar direction.

[0051] Eighth embodiment Fig. 10 is a schematic cross-sectional view of a cavity 60G and its periphery in a shower plate 1G according to the eighth embodiment. As shown in Fig. 10, in the shower plate 1G according to the eighth embodiment, a base 10G has a cavity 60G. The cavity 60G is located adjacent to the intermediate flow passage 42 with a partition wall 104G interposed therebetween.

[0052] Similar to the partition wall 104F in the seventh embodiment, one wall surface of the partition wall 104G located on the cavity 60G side approaches the other wall surface located on the intermediate flow path 42 side as it moves away from the resistance heating element 30A. The one wall surface of the partition wall 104G located on the cavity 60G side is a stepped surface.

[0053] In this way, one wall surface of the partition 104G located on the cavity 60G side is a stepped surface. In this case, too, the same effect as that of the shower plate 1F according to the seventh embodiment can be obtained. That is, the heat generated in the resistance heating element 30A is concentrated on the inner surface of the intermediate flow path 42, and is then transferred from the intermediate flow path 42 to the base 10. G It is possible to suppress heat conduction outward in the planar direction.

[0054] Ninth embodiment Fig. 11 is a schematic cross-sectional view of the periphery of a cavity 60H in a shower plate 1H according to embodiment 9. As shown in Fig. 11, in the shower plate 1H according to embodiment 9, a base 10H has a cavity 60H.

[0055] The cavity 60H has a first cavity 61, a second cavity 62, and a third cavity 63. The first cavity 61 is a cavity located adjacent to the intermediate flow path 42 in the surface direction of the base body 10H.

[0056] The second cavity 62 is a cavity located adjacent to the resistance heating element 30A in the surface direction of the base 10H. The second cavity 62 communicates with the first cavity 61.

[0057] The third cavity 63 is a cavity located adjacent to the electrode 50C in the surface direction of the base body 10H. The third cavity 63 communicates with the first cavity 61.

[0058] In this manner, the cavity 60H may have a second cavity 62 located adjacent to the resistance heating element 30A in the planar direction of the base 10H. With this configuration, in addition to the heat conduction from the intermediate flow passage 42 to the outside in the planar direction of the base 10H, the heat conduction from the resistance heating element 30A to the outside in the planar direction of the base 10H can be suppressed. Furthermore, since the first cavity 61 and the second cavity 62 are in communication with each other, the heat conduction from the resistance heating element 30A to the outside in the planar direction of the base 10H can be further suppressed.

[0059] Furthermore, the cavity 60H may have a third cavity 63 located adjacent to the electrode 50C in the planar direction of the base 10H. With this configuration, in addition to the heat conduction from the intermediate flow path 42 to the outside in the planar direction of the base 10H, the heat conduction from the electrode 50C to the outside in the planar direction of the base 10H can be suppressed. Furthermore, since the first cavity 61 and the third cavity 63 are in communication with each other, the heat conduction from the electrode 50C to the outside in the planar direction of the base 10H can be further suppressed.

[0060] Tenth embodiment Fig. 12 is a schematic cross-sectional view of the periphery of a cavity 60B in a shower plate 1I according to embodiment 10. As shown in Fig. 12, in the shower plate 1I according to embodiment 10, a base 10I further has a cavity 70 in addition to the cavity 60B.

[0061] The cavity 70 is located adjacent to each of the outlet paths 43 in the surface direction of the base 10I. A gas having a lower thermal conductivity than the ceramic constituting the base 10I is accommodated inside the cavity 70. The gas accommodated in the cavity 70 may be the same gas as the gas accommodated in the cavity 60B. In a cross section passing through the cavity 70 and viewed in the surface direction of the base 10I, the cavity 70 extends in a ring shape surrounding the outer periphery of each of the outlet paths 43.

[0062] In this manner, the shower plate 1I may have cavities 70 located inside the base 10I adjacent to the outlet paths 43 in the surface direction of the base 10I. With this configuration, in addition to the heat conduction from the intermediate flow paths 42 to the outside in the surface direction of the base 10I, the heat conduction from the outlet paths 43 to the outside in the surface direction of the base 10I can be suppressed, so that the thermal uniformity of the process gas flowing through the flow paths 40 can be further improved.

[0063] Eleventh embodiment Fig. 13 is a schematic cross-sectional view of a shower plate 1J according to the eleventh embodiment. For convenience, the resistive heating element 30 and the electrodes 50 shown in Fig. 2 are omitted in Fig. 13.

[0064] 13, in a shower plate 1J according to the eleventh embodiment, a base 10J has a cavity 60J. Also, a shaft 20 has a through hole 22 that passes through the shaft 20 from one end face (here, the upper face) to the other end face (here, the lower face).

[0065] The cavity 60J is a flow path through which a fluid other than the process gas flows, which flows through the flow path 40. Examples of the other fluid that flows through the cavity 60J include inert gases such as N2, Ar, and He.

[0066] The hollow portion 60J connects the inlet 112 located on the upper surface 101 of the base 10J to a plurality of outlets 122 located in a region surrounding the plurality of outlets 121 on the lower surface 102 of the base 10J. Specifically, the hollow portion 60J communicates with the inlet 112 via an inlet passage 65, and communicates with the outlet 122 via an outlet passage 66. The inlet 112 communicates with the through hole 22 of the shaft 20.

[0067] The cavity 60J is configured as described above. A fluid other than the process gas flowing through the flow path 40 is introduced from the inlet 112 to the inlet passage 65 via the through hole 22 of the shaft 20, flows through the cavity 60J and the outlet passage 66, and is then discharged from the outlet 122 to the lower side of the lower surface 102 of the base 10J.

[0068] In this way, the cavity 60J may be a flow path for a fluid other than the process gas flowing through the flow path 40. In this case, it is not necessary to provide a flow path for the other fluid separately from the flow path 40 for the process gas. In addition, the other fluid is discharged from the outlet 122 to below the lower surface 102 of the base 10J, and the other fluid is discharged from the outlet 121 to the lower surface 102 of the base 10J. J This can suppress diffusion of the process gas discharged below the lower surface 102.

[0069] (Other embodiments) In each of the above-described embodiments, the bases 10, 10A to 10J may be integrally formed rather than being made by bonding a plurality of members. With such a configuration, for example, there is no need to provide a bonding layer, and therefore reliability against thermal cycles can be improved.

[0070] In each of the above-described embodiments, a support supporting the ceiling of the cavity 60, 60B, 60D, 60E to 60H, 60J may be located inside the cavity 60, 60B, 60D, 60E to 60H, 60J. This configuration can promote heat conduction in the thickness direction of the base 10, 10A to 10J.

[0071] In each of the above-described embodiments, the partition walls 104, 104F, 104G in the base 10, 10A to 10J that separate the cavities 60, 60B, 60D, 60E to 60H, 60J from the intermediate flow passage 42 may have recesses on the wall surface on the cavity side. With this configuration, foreign matter in the process gas flowing through the flow passage 40 can be retained in the recesses.

[0072] (Method of manufacturing a shower plate) Next, a method for manufacturing a shower plate according to the present disclosure will be described. Here, as an example, a method for manufacturing the shower plate 1 according to the first embodiment will be described. In the method for manufacturing a shower plate, a base body and a shaft are separately manufactured. Then, these members are fixed to each other. Note that the base body and the shaft may be manufactured integrally in part or in whole. The method for manufacturing the shaft may be the same as various known methods, for example.

[0073] First, a base is formed by stacking a plurality of ceramic green sheets. Specifically, a ceramic green sheet constituting the base, a metal sheet constituting the resistance heating element, and a metal sheet constituting the electrodes are prepared. Here, a plurality of types of ceramic green sheets with different shapes are prepared to form the flow path and the cavity. Then, the prepared sheets are stacked.

[0074] Next, the laminate of the ceramic green sheets and the metal sheets is degreased and fired. The firing temperature is, for example, 1100°C or higher and 1850°C or lower. Here, the inside of the cavity contains a gas contained in the firing atmosphere during firing. This gas varies depending on the material of the ceramic green sheets prepared. In addition, when the cavity is a closed space, the firing atmosphere during firing can be made vacuum, so that the gas is discharged from the through holes of the ceramic green sheets generated during degreasing, and the cavity can be made in a vacuum state or a reduced pressure state. In addition, metal paste or wires may be used instead of the metal sheets. When the degreasing and firing of the laminate are completed, the shower plate according to the present disclosure is obtained.

[0075] (effect) As described above, the shower plate according to the embodiment (for example, shower plate 1, 1A to 1J) has a base (for example, base 10, 10A to 10J), a resistance heating element (for example, resistance heating element 30, 30A), a flow path (for example, flow path 40), and a cavity (60, 60B, 60D, 60E to 60H, 60J). The base is a plate-shaped base made of ceramics. The resistance heating element is located inside the base along a first surface (for example, upper surface 101) of the base. The flow path is a flow path located inside the base, and has an intermediate flow path (for example, intermediate flow path 42) that is located between the resistance heating element and a second surface (for example, lower surface 102) opposite to the first surface of the base and extends in the surface direction of the base. The cavity is located inside the base adjacent to the intermediate flow path in the surface direction of the base. As a result, the shower plate according to the embodiment can improve the temperature uniformity of a fluid (eg, a process gas) flowing through the flow path.

[0076] Furthermore, the cavity according to the embodiment may be located inside the base between the intermediate flow path and a side surface (e.g., side surface 103) continuous with the first and second surfaces of the base. As a result, the shower plate according to the embodiment can prevent the heat of the flow path heated by the resistance heating element from being transferred outward in the surface direction of the base and ultimately being released into the external atmosphere from the side surface of the base.

[0077] Furthermore, the cavity according to the embodiment may extend in a ring shape surrounding the outer periphery of the intermediate flow passage in a cross-sectional view in the surface direction of the base. As a result, the shower plate according to the embodiment can suppress heat conduction from the intermediate flow passage to the outside in the surface direction of the base around the entire circumference of the base.

[0078] Furthermore, the cavity according to the embodiment may be located adjacent to the intermediate flow passage with a partition wall (e.g., partition wall 104, 104F, 104G) sandwiched therebetween. One wall surface of the partition wall located on the cavity side may approach the other wall surface located on the intermediate flow passage side as it moves away from the resistance heating element. Furthermore, one wall surface of the partition wall located on the cavity side may be a tapered surface or a stepped surface. As a result, according to the shower plate according to the embodiment, heat generated in the resistance heating element can be concentrated on the inner surface of the intermediate flow passage, thereby suppressing thermal conduction from the intermediate flow passage to the outside in the surface direction of the base.

[0079] Furthermore, the cavity according to the embodiment may have a support (e.g., support 105, 105D, 105E) having one end located on the ceiling surface of the cavity and the other end located on the bottom surface of the cavity. As a result, the shower plate according to the embodiment can maintain the temperature of the process gas led out below the lower surface of the substrate at a temperature suitable for generating plasma.

[0080] Furthermore, the support according to the embodiment may have a shape in which the width increases toward the other end located at the bottom surface of the cavity. Furthermore, the side surface of the support may be a tapered surface or a stepped surface. As a result, the shower plate according to the embodiment can further promote the transfer of heat generated in the resistance heating element through the support to the underside of the base.

[0081] The shower plate according to the embodiment may further include an electrode (e.g., electrode 50, 50C) located inside the base between the intermediate flow path and the second surface of the base. The electrode may extend in the surface direction of the base to a position corresponding to the other end of the support. As a result, the shower plate according to the embodiment can promote the transfer of heat generated in the resistance heating element through the support to the electrode, and can appropriately adjust the temperature of the electrode.

[0082] Furthermore, the resistive heating element according to the embodiment may extend in the surface direction of the base to a position corresponding to the cavity, whereby the shower plate according to the embodiment can reduce the temperature difference between the cavity and the intermediate flow path, thereby further suppressing heat conduction from the intermediate flow path to the outside in the surface direction of the base.

[0083] Furthermore, the cavity according to the embodiment may have a first cavity (e.g., first cavity 61) located adjacent to the intermediate flow path in the surface direction of the base, and a second cavity (e.g., second cavity 62) located adjacent to the resistance heating element in the surface direction of the base. As a result, the shower plate according to the embodiment can suppress heat conduction from the intermediate flow path to the outside in the surface direction of the base, as well as heat conduction from the resistance heating element to the outside in the surface direction of the base.

[0084] Furthermore, the first cavity and the second cavity according to the embodiment may be in communication with each other, whereby the shower plate according to the embodiment can further suppress the heat conduction from the resistance heating element to the outside in the planar direction of the base.

[0085] Furthermore, the cavity according to the embodiment may have a first cavity located adjacent to the intermediate flow path in the surface direction of the base, and a third cavity (e.g., third cavity 63) located adjacent to the electrode in the surface direction of the base. As a result, the shower plate according to the embodiment can suppress heat conduction from the electrode to the outside in the surface direction of the base, in addition to heat conduction from the intermediate flow path to the outside in the surface direction of the base.

[0086] Furthermore, the first cavity and the third cavity according to the embodiment may be in communication with each other, whereby the shower plate according to the embodiment can further suppress the heat conduction from the electrode to the outside in the planar direction of the base.

[0087] Furthermore, the flow path according to the embodiment may further include a plurality of outlet paths (e.g., outlet 43) connecting the intermediate flow path and a plurality of outlets (e.g., outlet 121) located on the second surface of the substrate. Furthermore, the shower plate according to the embodiment may further include other cavities (e.g., cavity 70) located inside the substrate adjacent to each outlet path in the surface direction of the substrate. As a result, the shower plate according to the embodiment can suppress heat conduction from each outlet path to the outside in the surface direction of the substrate in addition to heat conduction from the intermediate flow path to the outside in the surface direction of the substrate, thereby further improving the thermal uniformity of the process gas flowing through the flow path.

[0088] Furthermore, the cavity according to the embodiment may contain a gas having a lower thermal conductivity than the ceramic constituting the base, thereby improving the thermal uniformity of the fluid flowing through the flow path according to the shower plate according to the embodiment.

[0089] Moreover, the ceramic constituting the base according to the embodiment may be aluminum oxide or yttrium oxide. In this case, the gas accommodated in the cavity may be a gas containing at least nitrogen and argon and having a higher volume ratio of nitrogen and argon than air. Moreover, the ceramic constituting the base may be aluminum nitride or silicon nitride. In this case, the gas accommodated in the cavity may be a gas containing at least nitrogen and having a higher volume ratio of nitrogen than air. As a result, according to the shower plate according to the embodiment, it is possible to suppress the heat conduction from the intermediate flow path to the outside in the surface direction of the base by using an appropriate gas according to the type of ceramic constituting the base.

[0090] Furthermore, the cavity according to the embodiment may be a flow path through which a fluid other than the fluid (e.g., process gas) passing through the flow path passes. The other fluid passing through the cavity may be an inert gas. Thus, according to the shower plate according to the embodiment, it is not necessary to provide a flow path for the other fluid separately from the flow path for the process gas.

[0091] Further advantages and modifications may readily occur to those skilled in the art. Thus, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof. [Explanation of symbols]

[0092] 1, 1A~1J Shower plate 10, 10A~10J base 30, 30A Resistance Heating Element 40 Flow Path 41 Introductory path 42 Intermediate Channel 43 Derivation Path 50, 50C electrode 60, 60B, 60D, 60E~60H, 60J, 70 Cavity 61 1st cavity 62 Second cavity 63 Third cavity 101 Top surface 102 Bottom surface 103 Side 104, 104F, 104G Bulkhead 105, 105D, 105E Post 121 Outlet

Claims

1. A plate-shaped substrate made of ceramics; a resistive heating element located within the base along a first surface of the base; a flow path located inside the base, the flow path being located between the resistance heating element and a second surface of the base opposite to the first surface and having an intermediate flow path extending in a surface direction of the base; a cavity portion located inside the base body and adjacent to the intermediate flow path in a surface direction of the base body; having The cavity is located adjacent to the intermediate flow passage across a partition wall, A shower plate, wherein one wall surface of the partition wall located on the cavity side approaches the other wall surface located on the intermediate flow path side as the wall surface moves away from the resistance heating element.

2. A plate-shaped substrate made of ceramics; a resistive heating element located within the base along a first surface of the base; a flow path located inside the base, the flow path being located between the resistance heating element and a second surface of the base opposite to the first surface and having an intermediate flow path extending in a surface direction of the base; a cavity portion located inside the base body and adjacent to the intermediate flow path in a surface direction of the base body; having The cavity has a support pillar having one end located on a ceiling surface of the cavity and the other end located on a bottom surface of the cavity.

3. A plate-shaped substrate made of ceramics; a resistive heating element located within the base along a first surface of the base; a flow path located inside the base, the flow path being located between the resistance heating element and a second surface of the base opposite to the first surface and having an intermediate flow path extending in a surface direction of the base; a cavity portion located inside the base body and adjacent to the intermediate flow path in a surface direction of the base body; having The resistance heating element extends in a surface direction of the base to a position corresponding to the cavity.

4. 4. The shower plate according to claim 1, wherein the cavity is located inside the base between the intermediate flow path and side surfaces of the base that are continuous with the first surface and the second surface.

5. 4. The shower plate according to claim 1, wherein the cavity extends in an annular shape surrounding an outer periphery of the intermediate flow passage in a cross-sectional view taken along a plane direction of the base body.

6. 2. The shower plate according to claim 1, wherein one wall surface of the partition wall located on the cavity side is a tapered surface or a stepped surface.

7. The shower plate according to claim 2 , wherein the support pillar has a shape whose width increases toward the other end located at a bottom surface of the cavity portion.

8. The shower plate according to claim 7 , wherein the side surface of the support is a tapered surface or a stepped surface.

9. an electrode located within the substrate between the intermediate flow path and the second surface of the substrate; The shower plate according to claim 2 , wherein the electrode extends in a surface direction of the base to a position corresponding to the other end of the support column.

10. The cavity is a first cavity portion located adjacent to the intermediate flow passage in a surface direction of the base body; a second cavity portion located adjacent to the resistance heating element in a surface direction of the base; The shower plate according to any one of claims 1 to 3, comprising:

11. The shower plate according to claim 10 , wherein the first cavity and the second cavity are in communication with each other.

12. an electrode located within the substrate between the intermediate flow path and the second surface of the substrate; The cavity is a first cavity portion located adjacent to the intermediate flow passage in a surface direction of the base body; a third cavity portion located adjacent to the electrode in a surface direction of the base; The shower plate according to any one of claims 1 to 3, comprising:

13. The shower plate according to claim 12 , wherein the first cavity and the third cavity are in communication with each other.

14. the flow path further includes a plurality of outlet paths connecting the intermediate flow path and a plurality of outlet ports located on the second surface of the base body, 4. The shower plate according to claim 1, further comprising other cavities located inside said base body adjacent to each of said outlet paths in a surface direction of said base body.

15. 4. The shower plate according to claim 1, wherein the cavity contains a gas having a lower thermal conductivity than the ceramic that constitutes the base.

16. the ceramic constituting the substrate is aluminum oxide or yttrium oxide; 16. The shower plate according to claim 15, wherein the gas contains at least nitrogen and argon and has a volume ratio of nitrogen and argon greater than that of air.

17. the ceramic constituting the substrate is aluminum nitride or silicon nitride; 16. The shower plate according to claim 15, wherein the gas contains at least nitrogen and has a volume ratio of nitrogen greater than that of air.

18. 4. The shower plate according to claim 1, wherein the cavity is a flow path through which a fluid different from the fluid flowing through the flow path flows.

19. 20. The shower plate according to claim 18, wherein the other fluid flowing through the cavity is an inert gas.

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