Mitigating crosstalk in dispersive waveguides.

Abstract

To provide baseband modules that mitigate crosstalk in dispersive waveguides.SOLUTION: In a system, a transmit baseband module 100 having a communication path for a first data signal received at a signal input 115a and a second data signal received at a signal input 115b has finite impulse response (FIR) filters 120a, 120b in a communication path between the first signal input and a second signal output. The system further has a radio frequency channel 110 and a receive baseband module 105.SELECTED DRAWING: Figure 1

Description

[Background technology]

[0001] Millimeter wave (mmWave) and terahertz frequency (THz) waveguide interconnects offer potential alternatives to electrical and optical interconnects in data centers and high performance computing applications. [Brief description of the drawings]

[0002] [Figure 1] 1 illustrates an example architecture with crosstalk mitigation in accordance with various embodiments.

[0003] [Diagram 2] 1 illustrates an alternative example architecture with crosstalk mitigation, according to various embodiments.

[0004] [Diagram 3] 1 illustrates an alternative example architecture with crosstalk mitigation, according to various embodiments.

[0005] [Figure 4] 1 illustrates an alternative example architecture with crosstalk mitigation, according to various embodiments.

[0006] [Diagram 5] FIG. 1 is a block diagram of an example electrical device that may include a baseband module with crosstalk mitigation in accordance with various embodiments.

[0007] [Figure 6] 1 illustrates an example system level diagram of an architecture that may include crosstalk mitigation, in accordance with various embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like numerals refer to like parts throughout. In the drawings, there are shown, by way of example, embodiments in which the subject matter of the present disclosure may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense.

[0009] For purposes of this disclosure, the phrase "A or B" means (A), (B), or (A and B). For purposes of this disclosure, the phrase "A, B, or C" means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C).

[0010] This document may use the phrases "in one embodiment" or "in embodiments," which may each refer to one or more of the same or different embodiments. Additionally, the terms "comprising," "including," "having," and the like, as used with respect to embodiments of the present disclosure, are synonymous.

[0011] The term "coupled to," along with its derivatives, may be used herein. "Coupled" may mean one or more of the following: "Coupled" may mean that two or more elements are in direct physical or electrical contact. However, "coupled" may mean that two or more elements are in indirect contact with each other, but still cooperate or interact with each other, and may mean that one or more other elements are coupled or connected between the elements that are said to be coupled to each other. The term "directly coupled" may mean that two or more elements are in direct contact.

[0012] As used herein, the term "module" may refer to, be a part of, or include an application specific integrated circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or a group) or memory (shared, dedicated, or a group) that executes one or more software or firmware programs, a combinatorial logic circuit, or other suitable component that provides the functionality described above.

[0013] Various operations may be described, sequentially, as multiple discrete operations in a manner that is most helpful in understanding the claimed subject matter, however, the order of description should not be construed as to imply that these operations are necessarily order dependent.

[0014] As mentioned above, mmWave and THz waveguide interconnects may be desirable for use in data centers and high performance computing applications. Such uses may benefit from waveguide signaling that increases achievable throughput while decreasing power consumption, i.e., optimizes link power efficiency. Also, it may be desirable for such technologies to be low latency or high density.

[0015] In general, waveguide dispersion can severely limit the achievable data rate and therefore the throughput. Specifically, for direct or superheterodyne upconversion approaches with dual-sideband (DSB) modulation, waveguide group dispersion over relatively long propagation lengths can limit the achievable data rate due to destructive interference of the sidebands during demodulation. Some legacy systems may use purely dielectric waveguides, which can exhibit lower dispersion but also suffer from radiation losses at bends and discontinuities as well as crosstalk in bundles of waveguides.

[0016] Embodiments of the present application relate to a transceiver baseband topology that allows quadrature modulated signaling over a dispersive waveguide at multiple carrier frequencies, i.e., simultaneous transmission of two baseband signals, such as data streams with pulse amplitude modulation (PAM), at each carrier frequency, while mitigating deleterious dispersion induced crosstalk that can occur with standard quadrature modulation and demodulation.

[0017] In general, the signaling architectures described herein can mitigate the deleterious effects of waveguide dispersion. This can allow for increased data rates for individual carrier frequencies, thereby increasing overall throughput without the use of multiple oscillators and filters, and with relatively low power consumption. Embodiments can also allow for flexibility and adaptability.

[0018] FIG. 1 illustrates an example architecture with crosstalk mitigation in accordance with various embodiments. Specifically, FIG. 1 illustrates the I→I′ (or Q→Q′) and Q→I′ (or I→Q′) low-pass (or baseband) transfer functions T II,QQ,IQ,QI 1 illustrates a frequency domain (ω) that may result from an mmWave waveguide interconnect system assembly that performs quadrature modulation and demodulation. As discussed above, embodiments of the present application may relate to mmWave waveguides that may allow the propagation of electromagnetic signals having frequencies between about 30 gigahertz (GHz) and about 300 GHz. In other embodiments, the waveguide may be a THz waveguide that may allow the propagation of electromagnetic signals having frequencies on the order of 4 THz (or higher), which is greater than about 300 GHz. As used herein, "I" may refer to an in-phase signal, and "Q" may refer to a quadrature signal. Additionally, ω may be equal to 2πf, which may be an angular frequency corresponding to the frequency f of the electromagnetic signal.

[0019] Specifically, FIG. 1 illustrates a system including a transmit baseband module 100 and a receive baseband module 105 communicatively coupled by a radio frequency (RF) channel 110. It will be understood that FIG. 1 is a highly simplified depiction of the system and that real world embodiments may have significantly more components than depicted, such as signal sources, various additional signal lines, buffers, etc. Generally, the transmit baseband module 100 and the receive baseband module 105 are discussed as unidirectional items, but in other embodiments, one or both of the transmit and receive baseband modules 100 / 105 may be replaced by a baseband module having both transmit and receive capabilities. In general, as discussed above, the transmit and receive baseband modules 100 / 105 may be or include hardware, software, firmware, processors, logic, circuits, or other components, which may be tangible or intangible, that may be configured to perform one or more of the processes, operations, or functions described herein.

[0020] To provide context for various items discussed or described herein, FIG. 6 illustrates an exemplary system level diagram of an architecture that may include crosstalk mitigation, according to various embodiments. Specifically, FIG. 6 illustrates a transmit (TX) baseband module 600, which may be similar to, for example, the transmit baseband module 100 or some other transmit baseband module discussed or described herein. The transmit baseband module 600 may provide a first data signal 685a and a second data signal 685b to an RF channel 610, which may be similar to, for example, the RF channel 110 or some other RF channel described herein. Specifically, the transmit baseband module 600 may receive information related to the first or second data signals 685a and 685b from some other component of an electronic device to which the transmit baseband module 600 may be coupled. Such a component may be, for example, a processor, a processor core of a multi-core processor, a central processing unit (CPU), a graphics processing unit (GPU), or some other component, element, or logic of an electronic device.

[0021] The RF channel 610 may include a transmit RF front-end (RFFE) 675a, which may be configured to modulate the first and second data signals 685a and 685b to generate a modulated signal 695. The modulated signal may be modulated according to quadrature amplitude modulation (QAM), quadrature phase shift keying (QPSK), pulse amplitude modulation (PAM), or some other modulation scheme. The RFFE 675a ​​may be hardware, software, firmware, circuitry, logic, or any other component, element, or combination of elements that may be configured to perform the modulation functions or other functions described herein.

[0022] The modulated signal may be output to a combiner / filter 680a. In some embodiments, combiner / filter 680a may be coupled to several RFFEs, such as RFFE 675a, and combiner / filter 680a may be configured to receive several modulated signals, such as modulated signal 695, and combine the signals in some manner. For example, combiner / filter 680a may be or include hardware, software, firmware, or other types of logic or circuitry to further modulate signals, route signals, buffer signals, etc.

[0023] Combiner / filter 680a may output modulated signal 695 (and other signals as appropriate) to waveguide 685, which may be, for example, a silicon waveguide, a metal clad dielectric waveguide, a dielectric clad dielectric waveguide, or some other type of waveguide. In some embodiments, waveguide 685 may be about 5 meters long, although in other embodiments the waveguide may be longer or shorter.

[0024] The modulated signal (and other signals output from combiner / filter 680a) may propagate along waveguide 685 to a corresponding receive (RX) splitter / filter 680b. Like combiner / filter 680a, splitter / filter 680b may be or include hardware, software, firmware, or some other type of logic or circuitry that may demodulate the signal received from waveguide 685, route the signal to one or more receive RFFEs, buffer the signal, etc. In particular, although only one receive RFFE 675b is depicted in FIG. 6, in other embodiments, receive splitter / filter 680b may be coupled to multiple RFFEs 675b and may direct different signals to different RFFEs 675b.

[0025] The receive RFFE 675b may be configured to demodulate the signal received from the splitter / filter 680b and generate a recovered first data signal 690a and a recovered second data signal 690b. Like the RFFE 675a, the RFFE 675b may be or include hardware, software, firmware, circuitry, logic, or any other components, elements, or combinations of elements that may be configured to perform demodulation functions or other functions described herein. In general, the first and second recovered data signals 690a and 690b may correspond to the first and second data signals 685a and 685b. The recovered first and second data signals 690a and 690b may be provided to a receive baseband module 605, which may be similar to, for example, the receive baseband module 105 or any other receive baseband module described herein.

[0026] In general, it will be appreciated that FIG. 6 depicts a transmit side of the system, which may include baseband module 600, RFFE 675a, and combiner / filter 680a. FIG. 6 further depicts a receive side of the system, which may include splitter / filter 680b, RFFE 675b, and baseband module 605. Typically, the transmit side of the system and the receive side of the system may be realized in different electronic devices communicatively coupled by waveguide 685. However, in other embodiments, the transmit side of the system and the receive side of the system may be implemented within a single physical device, for example, a server rack, where different blades of the server rack are coupled by waveguide 685. In other embodiments, other implementations may be possible.

[0027] Returning to FIG. 1, the transmit baseband module 100 may include signal inputs 115a and 115b that may receive first and second data signals, respectively. The first data signal may be referred to as an "in-phase" signal and may be generally indicated by the letter "I" in FIG. 1. For example, the first data signal may be received at the signal input 115a, propagate along a first signal path, and be output to the RF channel 110 at the signal output at a location indicated by "I" in FIG. 1. The second data signal may be referred to as a "quadrature" signal and may be generally indicated by the letter "Q" in FIG. 1. For example, the second data signal may be received at the signal input 115b, propagate along a second signal path, and be output to the RF channel 110 at the signal output at a location indicated by "Q" in FIG. 1.

[0028] As can be seen, the transmit baseband module 100 may further include a first signal combiner 125a in the first signal path and a second signal combiner 125b in the second signal path. The transmit baseband module 100 may further include a first finite impulse response (FIR) filter 120a in the communication path between the signal input 115a and the combiner 125b. The transmit baseband module 100 may further include a second FIR filter 120b in the communication path between the signal input 115b and the combiner 125a. The first and second FIR filters 120a / 120b may be implemented as hardware, software, firmware, or any combination thereof, and may be configured to perform a Hilbert transform on signals propagating along the communication path and through the FIR filters. Combiner 125a may then combine the output of FIR filter 120b with the first data signal, and combiner 125b may then combine the output of FIR filter 120a with the second data signal, as shown in FIG. 1.

[0029] In general, performing the Hilbert transform of a signal, H, is mathematically equivalent to deriving a transfer function T in the frequency domain. HThis corresponds to the multiplication of (ω) = -jsgn(ω), where j is the imaginary unit (j 2 =-1). For example, H{cos(ωt)}=sin(ωt) for any frequency ω and all time t. As mentioned above, this operation may be easily implemented as an FIR filter, which can be made causal by introducing a suitable delay. However, in other embodiments, the FIR filter may be replaced by a wideband 90 degree phase shifter, a Lange coupler, a quadrature hybrid filter, a branch-line hybrid filter, etc.

[0030] The signal may then be output from the transmit baseband module 100 to the RF channel 110, which may modulate the data signal, facilitate communication of the data signal from the transmit baseband module 100 to the receive baseband module 105, demodulate the data signal, etc., as described above. In particular, the RF channel 110 may be configured to operate in a manner similar to that described above, with a transfer function T II,QQ,IQ,QI (ω) may be applied. These various transfer functions are

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[0031] The receive baseband module 105 may include elements similar to those of the transmit baseband module 100. Specifically, the receive baseband module 105 may include a first signal path along which a first data signal may be recovered at an input (I') and provided to a signal output 145a. The receive baseband module 105 may also include a second signal path along which a second data signal may be recovered at an input (Q') and provided to a signal output 145b. The receive baseband module 105 may also include FIR filters 130a and 130b, where an inverse Hilbert transform is performed and then output to combiners 135a and 135b as shown.

[0032] In general, the Hilbert transform configuration shown in FIG. 1 may diagonalize the channel transfer matrix for all frequencies. This means that the first data signal and the second data signal (i.e., the I channel and the Q channel) may be decoupled from each other and I / Q crosstalk may be eliminated. It will be appreciated that with ideal building blocks, the transfer functions from 115a to the output of 135a and from 115b to the output of 135b may exhibit relatively flat all-pass behavior. In real-world embodiments, the elements of the baseband modules 100 and 105 or the RF channel 110 may not be ideal, but each of these transfer functions may still exhibit close to all-pass behavior.

[0033] It will be noted that the first data signal (e.g., the data signal received from signal input 115a) may be transmitted by a lower sideband associated with a carrier frequency, and the second data signal (e.g., the data signal received from signal input 115b) may be transmitted by an upper sideband associated with a carrier frequency. In other words, the system may exhibit single-sideband (SSB) quadrature modulation, including quadrature phase shift keying (QPSK) and QAM, i.e., SSB-QPSK / QAM.

[0034] Additional dispersion compensation or equalization may be added in the transmit baseband module 100 or the receive baseband module 105. FIG. 1 illustrates equalizers 140a and 140b in the receive baseband module 105. Typically, the equalizers 140a / 140b may be configured to perform dispersion compensation or equalization at the receive side of the system architecture, which may be implemented using a transfer function T L =T II +T IQ T H Reverse it to get T L -1 , T U =T II -T IQ T H Reverse it to get T U-1 In some embodiments, the equalizers 140a and 140b may be implemented in a causal circuit that may be adaptively changed to maximize signal integrity and power efficiency under various conditions of the RF channel 110, e.g., channel loss.

[0035] In this way, the waveguide dispersion of the architecture of Figure 1 may be mitigated and the overall throughput and spectral efficiency for a given carrier frequency may be maximized. Another advantage of the topology shown in Figure 1 is that the Hilbert operation may be independent of the waveguide design (e.g., the design of the waveguide of RF channel 110, such as waveguide 685). This independence may be desirable in applications where waveguide cable assemblies of various lengths are used.

[0036] Figure 2 illustrates an alternative exemplary architecture with crosstalk mitigation, according to various embodiments. In general, Figure 2 can be viewed as a mathematically similar or equivalent configuration to the embodiment of Figure 1, however, baseband-related crosstalk mitigation may be implemented at the transmit or receive side, rather than at both the transmit and receive sides as shown in Figure 1. In Figure 2, crosstalk mitigation may be performed in the receive baseband module 205, rather than the transmit and receive baseband modules 200 and 205.

[0037] More generally, Figure 2 illustrates a transmit baseband module 200 that may be similar to baseband module 100. Specifically, baseband module 200 may include signal inputs 215a and 215b, and signal outputs (denoted by I and Q), which may be similar to signal inputs 115a / 115b and signal outputs, respectively, of baseband module 100. Figure 2 further illustrates an RF channel 210 that may be similar to RF channel 110 of Figure 1.

[0038] 2 may further show a receive baseband module 205, which may be similar to receive baseband module 105. Specifically, receive baseband module 205 may have signal inputs (denoted by "I'" and "Q'" similar to the signal inputs of baseband module 105) and signal outputs 245a and 245b (which may be similar to signal outputs 145a and 145b). Receive baseband module 205 may further include several combiners (not specifically numbered for clarity and to avoid clutter in the figure, but which may be considered to be similar to combiners 135a and 135b), FIR filters 220a and 220b, which may be configured to perform a Hilbert transform in a manner similar to FIR filters 120a and 120b, and equalizers 240a and 240b, which may be similar to equalizers 140a and 140b.

[0039] In some cases, FIR filters performing the Hilbert transform may exhibit conflicting low-frequency cutoffs, which may cause distortion or intersymbol interference (ISI) at the receiver. The embodiment of FIG. 2 may solve the low-frequency problem and may also provide the benefit of having two fewer FIR filters than shown in FIG. 1. Specifically, FIG. 2 may show a crosstalk equalizer (CEQ) (which may also be referred to as a crosstalk canceller) formed from blocks that are all nearly all-pass over a frequency range in situations where the RF channel 210 waveguide has a relatively flat transmission characteristic. The architecture shown in FIG. 2 may be implemented using a crosstalk equalizer (CEQ) that is formed from blocks that are all nearly all-pass over a frequency range in situations where the RF channel 210 waveguide has a relatively flat transmission characteristic. L -1 and T U -1 The implementation of the transfer function T L and T U It will be noted that this may be based on the assumption that θ is a good approximation of the inverse of θ.

[0040] 3 illustrates an alternative exemplary architecture with crosstalk mitigation, according to various embodiments. Specifically, FIG. 3 illustrates a transmit baseband module 300, which may be similar to the baseband module 100. The baseband module 300 may include signal inputs 315a and 315b and signal outputs (denoted by I and Q), which may be similar to the signal inputs 115a / 115b and signal outputs, respectively, of the baseband module 100. FIG. 3 further illustrates an RF channel 310, which may be similar to the RF channel 110 of FIG. 1.

[0041] 3 may further show a receive baseband module 305, which may be similar to receive baseband module 105. Specifically, receive baseband module 305 may have signal inputs (denoted by "I'" and "Q'" similar to the signal inputs of baseband module 105) and signal outputs 345a and 345b (which may be similar to signal outputs 145a and 145b).

[0042] The receive baseband module may further include a CEQ 350 that may include several combiners (not specifically numbered to avoid cluttering the diagram, but which may be recognized as being similar to combiners 125a / 125b / 135a / 135b in FIG. 1), which may further include several FIRs 360a / 360b / 360c / 360d, as shown in FIG.

[0043] Generally, in FIG. 3, the CEQ 350 is implemented as two pairs of real FIR filters u with subunit interval (UI) sampling. R 360a / 360d and u I This can be achieved by designing the FIR filter as 360b / 360c. For example, in some embodiments, the FIR filter may have fractional UI sampling, such as half UI sampling or some other sampling interval less than the signaling UI.R and u I is an element of T II,QQ,IQ,QI (ω) can be the inverse of a matrix U II,QQ,IQ,QI (ω) or U II =U QQ =F{u R} and U QI =-U IQ =F{u I} relationship, where F{x} denotes the Fourier transform of x.

[0044] It may be noted that the architecture of FIG. 3 may not depict an explicit Hilbert transform by the FIR filters 360a-360d. Instead, a generalized zero-forcing based minimum mean squared error approach utilizing complex-valued representations of the I and Q signals (i.e., the first and second data signals) may be used to determine the tap coefficients of the FIR filters 360a-360d from the complex pulse response of the system. In some embodiments, it may be desirable or useful to make the tap coefficients programmable (and thus make the CEQ 350 adaptive) so that signal integrity can be dynamically optimized. In some embodiments, such optimization may be based on input from a processor or other logic of the system (i.e., subject to system-level control). In other embodiments, purely analog or mixed-signal implementations may also be possible.

[0045] For design flexibility, the embodiment of Figure 4 may also be present. Specifically, the embodiment of Figure 3 may include the CEQ 350 in the receive baseband module 305. However, in other embodiments, the CEQ may be present in the transmit baseband module shown in Figure 4, since the CEQ may approximate the inverse of the channel transfer matrix.

[0046] More generally, FIG. 4 illustrates an alternative exemplary architecture with crosstalk mitigation, according to various embodiments. Specifically, FIG. 4 illustrates a receiving baseband module 405, which may be similar to baseband module 105. The receiving baseband module 405 may have signal inputs (denoted by "I'" and "Q'" similar to the signal inputs of baseband module 105) and signal outputs 445a and 445b (which may be similar to signal outputs 145a and 145b). The embodiment of FIG. 4 may further include an RF channel 410, which may be similar to RF channel 110 or any other RF channel of an embodiment of the present disclosure.

[0047] 4 may further include a transmit baseband module 400, which may be generally similar to the transmit baseband module 100. The baseband module 400 may include signal inputs 415a and 415b and signal outputs (denoted by I and Q), which may be similar to the signal inputs 115a / 115b and signal outputs, respectively, of the baseband module 100. The baseband module 400 may further include a CEQ 450, which may be similar to the CEQ 350. Specifically, the CEQ 450 may include several combiners (not specifically numbered in FIG. 4) and FIR filters 460a, 460b, 460c, and 460d, which may be similar to the FIR filters 360a, 360b, 360c, and 360d.

[0048] In FIG. 5, the basis for moving the CEQ 450 to the transmit baseband module 400 is that the CEQ can approximate the inverse of the channel transfer matrix, thus:

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[0049] It will be appreciated that in general, quadrature modulated signaling through dispersive waveguide channels may not be limited to the use of a single carrier frequency. Rather, the embodiments described herein may be compatible with frequency division multiplexing (FDM) and combinable with other dispersion mitigation schemes or techniques. It will also be appreciated that the embodiments herein are intended as example embodiments to illustrate various concepts and may not include various additional elements or components that may be present in real world embodiments, such as active components, passive components, interconnects, conductive elements, etc., as previously discussed. Moreover, these embodiments are intended as sample embodiments and other variations may exist in other embodiments.

[0050] FIG. 5 is a block diagram of an example electrical device 1800 that may include one or more baseband modules with crosstalk mitigation according to any of the embodiments disclosed herein. For example, any suitable one of the components of electrical device 1800 may include or be a baseband module, such as baseband module 100 / 104 or any other baseband module of the embodiments of the present disclosure. Although FIG. 5 illustrates several components included in electrical device 1800, any one or more of these components may be omitted or duplicated as appropriate for an application. In some embodiments, some or all of the components included in electrical device 1800 may be mounted on one or more motherboards. In some embodiments, some or all of these components are fabricated on a single system-on-chip (SoC) die.

[0051] 5, but the electrical device 1800 may include interface circuitry for coupling to one or more of the components. For example, the electrical device 1800 may not include a display device 1806, but may include display device interface circuitry (e.g., connectors and driver circuitry) to which the display device 1806 may be coupled. In another set of examples, the electrical device 1800 may not include an audio input device 1824 or an audio output device 1808, but may include audio input or output device interface circuitry (e.g., connectors and support circuitry) to which the audio input device 1824 or the audio output device 1808 may be coupled.

[0052] The electrical device 1800 may include a processing unit 1802 (e.g., one or more processing units). As used herein, the term “processing unit” or “processor” may refer to a device or part of a device that processes electronic data from registers and / or memory and converts the electronic data into other electronic data that may be stored in registers and / or memory. The processing unit 1802 may include one or more digital signal processors (DSPs), ASICs, CPUs, GPUs, cryptographic processors (specialized processors that execute cryptographic algorithms in hardware), server processors, or any other suitable processing units. The electrical device 1800 may include a memory 1804, which may itself include one or more memory devices, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM)), flash memory, solid-state memory, and / or a hard drive. In some embodiments, the memory 1804 may include memory that shares a die with the processing unit 1802. This memory may be used as cache memory and may include embedded dynamic random access memory (eDRAM) or spin-transfer torque magnetic random access memory (STT-MRAM).

[0053] In some embodiments, electrical device 1800 may include a communications chip 1812 (e.g., one or more communications chips). For example, communications chip 1812 may be configured to manage wireless communications for transferring data to and from electrical device 1800. The term "wireless" and its derivatives may be used to describe circuits, apparatus, systems, methods, techniques, communications channels, etc. that can communicate data through the use of modulated electromagnetic radiation through a non-solid medium. This term does not imply that the associated apparatus does not include wires, although in some embodiments the associated devices may not include wires.

[0054] The communications chip 1812 may implement any of a number of wireless standards or protocols, including, but not limited to, Wi-Fi (IEEE 802.11 family), Institute of Electrical and Electronics Engineers (IEEE) standards, including the IEEE 802.16 standard (e.g., IEEE 802.16-2005 amendment), the Long Term Evolution (LTE) project and any amendments, updates and / or modifications thereto (e.g., Advanced LTE project, Ultra Mobile Broadband (UMB) project (also known as "3GPP2"), etc.). IEEE 802.16 compatible broadband wireless access (BWA) networks are commonly referred to as WiMAX networks (short for Worldwide Interoperability for Microwave Access), which is a certification mark for products that have passed conformance and interoperability testing for the IEEE 802.16 standard. The communications chip 1812 can operate according to a Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMLS), High Speed ​​Packet Access (HSPA), Evolved HSPA (E-HSPA) or LTE network. The communications chip 1812 may also operate according to Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN) or Evolved UTRAN (E-UTRAN).The communications chip 1812 may operate according to Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO) and their derivatives, as well as any other wireless protocols designated as 3G, 4G, 5G and beyond. The communications chip 1812 may operate according to other wireless protocols in other embodiments. The electrical device 1800 may include an antenna 1822 to facilitate wireless communication and / or receive other wireless communications (such as AM or FM radio transmissions).

[0055] In some embodiments, the communications chip 1812 may manage wired communications, such as electrical, optical, or any other suitable communications protocol (e.g., Ethernet). As discussed above, the communications chip 1812 may include multiple communications chips. For example, a first communications chip 1812 may be dedicated to shorter-range wireless communications, such as Wi-Fi or Bluetooth, and a second communications chip 1812 may be dedicated to longer-range wireless communications, such as Global Positioning System (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, etc. In some embodiments, the first communications chip 1812 may be dedicated to wireless communications, and the second communications chip 1812 may be dedicated to wired communications. In some embodiments, the communications chip 1812 may be, include, or be communicatively coupled to a baseband module, such as the baseband module 100 / 105 or some other baseband module associated with an embodiment of the present disclosure.

[0056] Electrical device 1800 may include a battery / power circuit 1814. Battery / power circuit 1814 may include one or more energy storage devices (e.g., batteries or capacitors) and / or circuitry for coupling components of electrical device 1800 to an energy source separate from electrical device 1800 (e.g., an AC line power source).

[0057] The electrical device 1800 may include a display device 1806 (or corresponding interface circuitry, as described above). The display device 1806 may include any visual indicator, such as a head-up display, a computer monitor, a projector, a touch screen display, a liquid crystal display (LCD), a light emitting diode display, or a flat panel display.

[0058] The electrical device 1800 may include an audio output device 1808 (or corresponding interface circuitry, as described above). The audio output device 1808 may include any device that produces an audible indicator, such as a speaker, a headset, or earphones.

[0059] Electrical device 1800 may include audio input device 1824 (or corresponding interface circuitry, as described above), which may include any device that generates a signal representing sound, such as a microphone, a microphone array, or a digital instrument (e.g., a device having a Musical Instrument Digital Interface (MIDI) output).

[0060] Electrical device 1800 may include a GPS unit 1818 (or corresponding interface circuitry, as described above), which may communicate with a satellite-based system and receive the location of electrical device 1800, as is known in the art.

[0061] The electrical device 1800 may also include other output devices 1810 (or corresponding interface circuitry, as described above). Examples of other output devices 1810 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or additional storage devices.

[0062] The electrical device 1800 may also include other input devices 1820 (or corresponding interface circuitry, as described above). Examples of other input devices 1820 may include an accelerometer, a gyroscope, a compass, an image capture device, a keyboard, a cursor control device such as a mouse, a stylus, a touch pad, a barcode reader, a quick response (QR) code reader, any sensor, or a radio frequency identification (RFID) reader.

[0063] Electrical device 1800 may have any desired form factor, such as a handheld or mobile device (e.g., a mobile phone, a smart phone, a mobile Internet device, a music player, a tablet computer, a laptop computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultra-mobile personal computer, etc.), a desktop electrical device, a server device or other networked computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a vehicle control unit, a digital camera, a digital video recorder, or a wearable electrical device. In some embodiments, electrical device 1800 may be any other electronic device that processes data.

[0064] Examples of Various Embodiments Example 1 includes a baseband module having a first signal input for receiving a first data signal; a second signal input for receiving a second data signal; a first signal output for outputting the first data signal; a second signal output for outputting the second data signal; and a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output, the FIR filter performing a Hilbert transform on the first data signal.

[0065] Example 2 includes the baseband module of example 1, further including a second FIR filter in a second communication path between the second signal input and the first signal output, the second FIR filter performing a Hilbert transform on the second data signal.

[0066] Example 3 includes the baseband module of example 1, wherein the first output outputs the first data signal to a radio frequency (RF) channel that performs quadrature modulation and demodulation; the second output outputs the second data signal to the RF channel; and the RF channel performs quadrature amplitude modulation (QAM) of the first and second data signals.

[0067] Example 4 includes the baseband module of example 3, wherein the RF channel performs QAM on the first and second data signals to generate a modulated data signal having a frequency of at least 30 gigahertz (GHz).

[0068] Example 5 includes the baseband module of any one of Examples 1 to 4, wherein the first input is for receiving the first data signal from a radio frequency (RF) channel; the second input is for receiving the second data signal from the RF channel; and the RF channel performs quadrature amplitude demodulation of the first and second data signals before providing the first and second data signals to the first and second inputs.

[0069] Example 6 includes the baseband module of Example 5, further comprising an equalizer communicatively coupled between the first signal output and the communication path, the equalizer performing equalization based on an inverse of a transfer function of the RF channel.

[0070] Example 7 includes a first signal input for receiving a first data signal; a second signal input for receiving a second data signal; a first signal output for outputting the first data signal; a second signal output for outputting the second data signal; and a complex equalizer (CEQ) communicatively coupled to the first signal input, the second signal input, the first signal output, and the second signal output, the CEQ including: a first finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output; and a second FIR filter in a communication path between the second signal input and the first signal output.

[0071] Example 8 includes the baseband module of Example 7, wherein the first and second signal outputs are coupled to inputs of a radio frequency (RF) channel, and the RF channel modulates the first and second data signals to generate a millimeter wave (mmWave) or terahertz (THz) signal.

[0072] Example 9 includes the baseband module of example 8, wherein the RF channel modulates the first and second data signals using quadrature amplitude modulation (QAM).

[0073] Example 10 includes the baseband module of Example 7, wherein the first and second signal inputs are coupled to an output of a radio frequency (RF) channel, the RF channel demodulating a millimeter wave (mmWave) or terahertz (THz) signal to generate the first and second data signals.

[0074] An eleventh embodiment includes the baseband module of any one of the seventh to tenth embodiments, wherein the first FIR filter and the second FIR filter perform a Hilbert transform on a signal passing through the first FIR filter and the second FIR filter.

[0075] Example 12 includes the baseband module of Example 11, wherein the CEQ further includes: first logic for performing a first inverse transform between the first signal input and the first signal output; second logic for performing a second inverse transform between the first signal input and the first FIR filter; third logic for performing a third inverse transform between the second signal input and the second FIR filter; and fourth logic for performing a fourth inverse transform between the second signal input and the second signal output.

[0076] Example 13 includes the baseband module according to any one of Examples 7 to 10, wherein the first FIR filter and the second FIR filter have a sampling rate equal to or less than a signal transmission unit interval of a quadrature signal and an in-phase signal.

[0077] Example 14 includes the baseband module of example 13, wherein coefficients of the first FIR filter are programmable based on a system level control.

[0078] Example 15 includes the baseband module of example 14, wherein the coefficients are programmable transistor or capacitor values ​​of the first FIR filter.

[0079] Example 16 includes the baseband module of any one of Examples 7 to 10, wherein the CEQ further includes: a third FIR communicatively coupled between the first signal input and the first signal output; and a fourth FIR communicatively coupled between the second signal input and the second signal output.

[0080] Example 17 includes an electronic device having: one or more processors; a radio frequency front end (RFFE) that facilitates communication of modulated electronic signals between the electronic device and another electronic device communicatively coupled to the electronic device by a waveguide; and a baseband module communicatively coupled to the processor and the RFFE, the baseband module including: a first signal path that facilitates communication of a first data signal between the one or more processors and the RFFE; a second signal path that facilitates communication of a second data signal between the one or more processors and the RFFE; a first finite impulse response (FIR) filter communicatively coupled between an input of the first signal path and an output of the second signal path; and a second FIR filter communicatively coupled between an input of the second signal path and an output of the first signal path.

[0081] Example 18 includes the baseband module of example 17, wherein the RFFE modulates the first data signal and the second data signal to generate a modulated data signal having a frequency greater than 30 GHz.

[0082] Example 19 includes the baseband module of example 18, wherein the RFFE modulates the first data signal and the second data signal to generate a modulated data signal having a frequency greater than 300 GHz.

[0083] Example 20 includes the baseband module of any one of Examples 17 to 19, wherein the first FIR filter performs a Hilbert transform on the first data signal.

[0084] Example 21 includes the baseband module of any one of Examples 17 to 19, wherein the first FIR filter performs equalization based on system programmable coefficients.

[0085] Various embodiments may include any suitable combination of the above embodiments, including alternative (or) embodiments of the embodiments described above in conjunction (and) (e.g., "and" may be "and / or"). Further, some embodiments may include one or more articles of manufacture (e.g., non-transitory computer-readable media) storing instructions that, when executed, cause the operation of any of the above-described embodiments. Further, some embodiments may include an apparatus or system having any suitable means for performing the various operations of the above-described embodiments.

[0086] The above description of illustrated embodiments, including what is described in the Abstract, is not intended to be exhaustive or limiting with respect to the precise forms disclosed. While specific implementations and examples of various embodiments or concepts have been described herein for illustrative purposes, various equivalent modifications may be possible, as one skilled in the art will recognize. These modifications may be made in light of the above detailed description, Abstract, drawings, or claims.

Claims

1. a first signal input for receiving a first data signal; a second signal input for receiving a second data signal; a first signal output; a second signal output; a baseband module having a first signal input, a second signal input, a first signal output, and a complex equalizer (CEQ) communicatively coupled to the second signal output, the CEQ comprising: a first finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output, the first FIR filter performing a Hilbert transform on the first data signal; a second FIR filter in a communication path between the second signal input and the first signal output, the second FIR filter performing a Hilbert transform on the second data signal; and first logic to perform a first inverse transformation between the first signal input and the first signal output; second logic for performing a second inverse transform between the first signal input and the first FIR filter; third logic that performs a third inverse transform between the second signal input and the second FIR filter; fourth logic for performing a fourth inverse transformation between the second signal input and the second signal output; At least one of Baseband module.

2. 2. The baseband module of claim 1, wherein the first and second signal outputs are coupled to inputs of a radio frequency (RF) channel, the RF channel modulating the first and second data signals to generate a millimeter wave (mmWave) or terahertz (THz) signal.

3. 3. The baseband module of claim 2, wherein the RF channel modulates the first and second data signals using quadrature amplitude modulation (QAM).

4. 2. The baseband module of claim 1, wherein the first and second signal inputs are coupled to an output of a radio frequency (RF) channel, the RF channel demodulating a millimeter wave (mmWave) or terahertz (THz) signal to generate the first and second data signals.

5. 5. The baseband module according to claim 1, wherein the first FIR filter and the second FIR filter have a sampling rate equal to or less than a signal transmission unit interval of a quadrature signal and an in-phase signal.

6. 5. The baseband module of claim 1, wherein coefficients of the first FIR filter are programmable based on a system level control.

7. The CEQ further comprises: a third FIR communicatively coupled between the first signal input and the first signal output; a fourth FIR communicatively coupled between the second signal input and the second signal output. A baseband module according to any one of claims 1 to 4.

8. 1. An electronic device, the electronic device comprising: one or more processors; a radio frequency (RF) component for communicating modulated electronic signals between the electronic device and another electronic device communicatively coupled to the electronic device by a waveguide; a baseband module communicatively coupled to the one or more processors and the RF component, the baseband module comprising: a first signal path carrying a first data signal between the one or more processors and the RF component; a second signal path carrying a second data signal between the one or more processors and the RF component; a first finite impulse response (FIR) filter communicatively coupled between an input of the first signal path and an output of the second signal path, the first FIR filter performing a Hilbert transform on the first data signal; a second FIR filter communicatively coupled between the second signal path input and the first signal path output, the second FIR filter performing a Hilbert transform on the second data signal; first logic to perform a first inverse transformation between an input of the first signal path and an output of the first signal path; second logic to perform a second inverse transform between an input of the first signal path and the first FIR filter; third logic that performs a third inverse transform between an input of the second signal path and the second FIR filter; and fourth logic for performing a fourth inverse transformation between the input of the second signal path and the output of the second signal path; and at least one of electronic equipment.

9. 9. The electronic device of claim 8, wherein the RF component modulates the first and second data signals to generate a modulated data signal having a frequency greater than 30 gigahertz (GHz).

10. 10. The electronic device of claim 9, wherein the RF component modulates the first data signal and the second data signal to generate a modulated data signal having a frequency greater than 300 GHz.

11. 11. Electronic device according to any one of claims 8 to 10, wherein the first FIR filter (120) performs an equalization based on coefficients.

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