Electrostatic substrate cleaning systems, apparatus and methods

Abstract

The substrate cleaning system includes a chamber and a substrate stage disposed within the chamber. The substrate stage is designed to secure a substrate for cleaning by the cleaning head. The substrate cleaning system includes a robot designed to transfer the substrate between a storage container and the substrate stage. The cleaning head includes a ribbon of disposable electrodes loaded on a roller assembly. The disposable electrode ribbon includes a positive electrode and a negative electrode and is designed to electrostatically clean the substrate by electrostatic removal of particles from the substrate. The roller assembly is designed to advance the disposable electrode ribbon following cleaning of the substrate.

Description

[Technical field]

[0001] REFERENCE TO RELATED APPLICATIONS This application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application 63 / 185,365 (filed May 7, 2021), which is incorporated by reference herein in its entirety. [Background technology]

[0002] The present invention relates generally to wafer cleaning, and more particularly to an apparatus and method for electrostatically cleaning silicon wafers. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2007-007731A1 publication [Patent Document 2] JP 2003-282671 A Summary of the Invention [Problem to be solved by the invention]

[0004] Silicon wafers are typically cleaned by either chemical solvents or vibration techniques (e.g., ultrasonic or megasonic cleaning). Chemical solvents are dangerous to use and can damage the wafer, and vibration techniques often require large, expensive tools. Furthermore, both methods often result in low throughput. It would therefore be advantageous to provide a system and method for remedying the shortcomings of the above-identified approaches. [Means for solving the problem]

[0005] A substrate cleaning system is disclosed in accordance with one or more exemplary embodiments of the present disclosure. In one exemplary embodiment, the substrate cleaning system includes a chamber. In another exemplary embodiment, the substrate cleaning system includes a substrate stage disposed within the chamber and configured to secure the substrate for cleaning. In another exemplary embodiment, the substrate cleaning system includes a robot configured to transfer the substrate between a storage container in the chamber and the substrate stage. In another exemplary embodiment, the substrate cleaning system includes a cleaning head including a disposable electrode ribbon loaded on a roller assembly. In another exemplary embodiment, the disposable electrode ribbon includes a positive electrode and a negative electrode, and the disposable electrode is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. In another exemplary embodiment, the roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

[0006] An apparatus is disclosed according to one or more exemplary embodiments of the present disclosure. In one exemplary embodiment, the substrate cleaning apparatus includes a roller assembly. In another exemplary embodiment, the substrate cleaning apparatus includes a disposable electrode ribbon loaded on the roller assembly. In another exemplary embodiment, the disposable electrode ribbon includes a positive electrode and a negative electrode. In another exemplary embodiment, the disposable electrode ribbon is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. In another exemplary embodiment, the roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

[0007] According to one or more exemplary embodiments of the present disclosure, a method of cleaning a substrate is disclosed. In one exemplary embodiment, the method can include, but is not limited to, transferring a substrate from a substrate storage to a substrate stage receptively within a vacuum chamber. In another exemplary embodiment, the method can include, but is not limited to, using a substrate stage to actuate the substrate to a position below a cleaning head. In another exemplary embodiment, the method can include, but is not limited to, using a cleaning lift assembly to actuate the substrate to a selected cleaning distance above the substrate. In another exemplary embodiment, the method can include, but is not limited to, activating a disposable electrode ribbon to electrostatically clean a surface of the substrate by removing particles from the substrate, the disposable electrode ribbon being activated by applying a bias voltage between a positive pole and a negative pole. In another exemplary embodiment, the method can include, but is not limited to, advancing a roller to expose an unused portion of the disposable electrode ribbon. Effect of the Invention

[0008] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not necessarily restrictive of the invention as claimed. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the general description, serve to explain the principles of the invention. [Brief description of the drawings]

[0009] Many advantages of the present disclosure may be better understood by those skilled in the art by reference to the following drawings. [Figure 1A] FIG. 1A illustrates a simplified schematic end view of a substrate cleaning system in accordance with one or more embodiments of the present disclosure. [Figure 1B] FIG. 1B shows a simplified top view of a substrate cleaning system integrated with a substrate handling system. [Diagram 2] FIG. 2 shows a schematic diagram of a disposable electrode ribbon according to one or more embodiments of the present disclosure. [Diagram 3] FIG. 3 illustrates a conceptual block diagram of a system incorporating a substrate cleaning system in accordance with one or more embodiments of the present disclosure. [Figure 4] FIG. 4 shows a flow diagram illustrating a method for cleaning a substrate in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present disclosure has been specifically shown and described with respect to certain embodiments and certain features thereof. The embodiments described herein are to be construed as illustrative and not restrictive. It should be readily apparent to those skilled in the art that various changes and modifications in form and details may be made without departing from the spirit and scope of the present disclosure. Reference will now be made in detail to the disclosed subject matter, which is illustrated in the accompanying drawings.

[0011] Embodiments of the present disclosure are directed to substrate cleaning systems and processes. For example, embodiments of the present disclosure are directed to substrate cleaning systems and processes for cleaning processed and / or blank silicon wafers in a semiconductor manufacturing system, a wafer inspection system, or a wafer metrology system. In this sense, the substrate cleaning systems and processes of the present disclosure can be integrated with a semiconductor manufacturing system, a wafer inspection system, or a wafer metrology system. For example, the cleaning systems of the present disclosure can be implemented in a wafer fabrication facility to clean in-line production wafers, or in a wafer fabrication house to clean blank wafers. The substrate cleaning systems and processes of the present disclosure can utilize disposable electrode ribbons to clean a substrate to initiate a dielectrophoresis-based cleaning process, which causes particles on a given substrate to move away from the substrate in the direction of an electric field gradient created by the disposable electrode ribbons.

[0012] 1A-1B show simplified schematic diagrams of a substrate cleaning system 100 in accordance with one or more embodiments of the present disclosure. Fig. 1A shows a simplified schematic end view of the substrate cleaning system 100. Fig. 1B shows a simplified top view of the substrate cleaning system 100 integrated with a substrate handling system 120.

[0013] In an embodiment, the cleaning system 100 includes a cleaning station 101. The cleaning station 101 includes a cleaning head 102. The cleaning head may include a disposable electrode ribbon 104 loaded on a roller assembly 105. The roller assembly 105 may include one or more rollers 106a, 106b. In an embodiment, the disposable electrode ribbon 104 includes a positive electrode and a negative electrode. The disposable electrode ribbon may be configured to electrostatically clean the substrate 110 by electrostatically removing particles from the substrate 110. In this regard, particles disposed on the substrate 110 may be detached from the substrate 110 and collected by the disposable electrode ribbon 104. In operation, the roller assembly 105 may advance the disposable electrode ribbon 104 following cleaning of the substrate 110 such that a new portion of the disposable electrode ribbon 104 is available for the next cleaning cycle (e.g., repeating the cleaning of the current substrate or the cleaning of a subsequent substrate). In an embodiment, one or more of the rollers 106a, 106b include an electric motor that can be controlled to rotate the one or more rollers, thereby advancing the disposable electrode ribbon 104.

[0014] In an embodiment, the cleaning system 100 includes a substrate stage 108 for securing and actuating the substrate 110. The substrate stage 108 may include a chuck 112. For example, the chuck 112 may include a wafer chuck, such as, but not limited to, a vacuum wafer chuck. In an embodiment, the substrate stage 108 is configured to actuate the substrate 110 into position under the cleaning head 102. For example, the substrate stage 108 may include a linear stage and / or a rotary stage. It is noted that while a linear stage is shown in FIG. 1B, this should not be construed as a limitation on the scope of the present disclosure. It is contemplated that a rotary stage may be implemented whereby the stage rotates the substrate 110 under the cleaning head 102.

[0015] In an embodiment, the cleaning system 100 includes a cleaning head lift actuator 114 and a proximity sensor 116. In an embodiment, the cleaning head lift actuator 114 is configured to lower the cleaning head 102 to a selected cleaning distance above the substrate 110. The cleaning head lift actuator 114 may include, but is not limited to, a mechanical actuator (e.g., a stepper). In an embodiment, the proximity sensor 116 is configured to identify when a selected cleaning distance between the cleaning head 102 and the top surface of the substrate 110 has been achieved. The proximity sensor 116 may include any proximity sensor known in the art. For example, the proximity sensor 116 may include, but is not limited to, an optical sensor, an inductive sensor, a capacitive sensor, or an ultrasonic sensor.

[0016] In an embodiment, the cleaning system 100 includes a vacuum chamber 118. One or more of the various components of the cleaning system 100 may be housed within the vacuum chamber 118. For example, the cleaning head 102, the roller assembly 105, the substrate stage 108, and / or the cleaning head lift actuator 114 may be housed within the vacuum chamber 118.

[0017] 1B, the cleaning system 100 includes a substrate handling system 120. In this sense, the cleaning station 101 of the cleaning system 100 may be integrated with the substrate handling system 120. Both the substrate cleaning station 101 and the substrate handling system 120 may be integrated within a semiconductor manufacturing line, an inspection system, or a metrology system.

[0018] In an embodiment, the cleaning station (handling subsystem) 101 includes one or more robots 122a, 122b. The one or more robots 122a, 122b are configured to transfer a substrate from a storage container 124 to the substrate stage 108. For example, the one or more robots 122a, 122b can transfer a substrate 110 to be cleaned from one of the storage containers 124 to the substrate handling system 120. The one or more robots 122a, 122b can then load the substrate 110 into an input port 126 of the cleaning station 101. The input port 126 is then closed and the pressure in the vacuum chamber 118 of the cleaning station 101 is increased. The substrate stage 108 can then secure the substrate 110 via the chuck 112. After the substrate 110 is secured, the cleaning head lift actuator 114 can adjust the position of the cleaning head 102 to a selected cleaning distance (e.g., 50 μm) from the top surface of the substrate 110 using feedback from the proximity sensor 116. The substrate stage 108 can then translate the substrate 110 (e.g., translate to the right in FIG. 1B) so that the entire wafer is scanned under the cleaning head 102. Following cleaning of the substrate 110, the substrate stage 108 can translate the substrate 110 to an output port 128. One or more robots 122a, 122b of the substrate handling system 120 can then move the substrate 110 to one of the storage containers 124, where the substrate 110 can then be moved to a subsequent process / characterization tool. The storage containers 124 can include, but are not limited to, front-open unified pods (FOUPs).

[0019] FIG. 2 shows a schematic diagram of a disposable electrode ribbon 104 according to one or more embodiments of the present disclosure. In an embodiment, as previously discussed herein, the disposable electrode ribbon 104 includes one or more negative electrodes 202 and one or more positive electrodes 204. The use of pairs of negative electrodes 202 and positive electrodes 204 allows the ribbon 104 to electrostatically clean the substrate 110 via dielectrophoresis. During charging of the ribbon, particles present on the substrate 110 may move away from the substrate 110 in the direction of the electric field gradient formed by the electrodes 202, 204 of the ribbon 104. For example, during energization, the electric field gradient created by the electrodes 202, 204 may cause particles disposed on the substrate 110 to detach from the substrate 110 and move towards the ribbon 110, where they are collected by the ribbon 104. It should be noted that all particles have ionic mobility, even non-conductive particles. The ionic mobility of the particles increases as the particle temperature increases. In semiconductor manufacturing, the temperatures are often very high and therefore most particulate materials involved have high ion mobility during operation.

[0020] In an embodiment, the backing of the ribbon 104 is formed from a flexible insulating material (e.g., plastic or rubber) that allows the ribbon to be wound or spooled into a roll. In operation, following a given cleaning cycle, the roller assembly 105 may rotate the roll of ribbon 110 (or a corresponding used roll) using rollers to advance the disposable electrode ribbon 104 so that a new portion of the disposable electrode ribbon 104 is available for the next cleaning cycle.

[0021] In an embodiment, the cleaning system 100 includes a controller 130. The controller 130 can include one or more processors and a memory, with one or more program instructions maintained in the memory. In an embodiment, the controller 130 is configured to control one or more functions of the system 100. In an embodiment, the one or more program instructions are configured to cause the one or more processors to direct one or more robots 122a, 122b to transfer the substrate 110 between the storage container 124 in the chamber 118 and the substrate stage 108.

[0022] In an embodiment, the one or more program instructions are configured to cause the one or more processors to direct the cleaning head lift actuator 114 to lower the cleaning head 102 to a selected cleaning distance above the substrate 110. In an embodiment, the controller 130 is configured to receive proximity data from the proximity sensor 116. For example, at the direction of the controller 130, the cleaning head lift actuator 114 can adjust the position of the cleaning head 102 to a selected cleaning distance from the top surface of the substrate 110 based on the proximity data received by the controller 130 from the proximity sensor 116. In an embodiment, the one or more program instructions are configured to cause the one or more processors to direct the stage to actuate (move) the substrate along a path below the cleaning head 102. In an embodiment, the one or more program instructions are configured to cause the one or more processors to apply a bias voltage between the negative pole 202 and the positive pole 204 of the disposable electrode ribbon 104. For example, the negative electrode 202 and the positive electrode 204 may be disposed in communication with the controller 130 such that the controller 130 may control a bias voltage between the negative electrode 202 and the positive electrode 204. In an embodiment, the one or more program instructions are configured to cause the one or more processors to advance one or more of the rollers 106a, 106b to expose an unused portion of the disposable electrode ribbon 104. For example, the one or more rollers 106a, 106b may include an electric motor disposed in communication with the controller 130 such that the controller 130 may control the rotation of the one or more rollers 106a, 106b to selectively advance the disposable electrode ribbon 104.

[0023] The one or more processors of the controller 130 may include any processor or processing element known in the art. For purposes of this disclosure, the term "processor" or "processing element" may be broadly defined to encompass any device having one or more processing or logic elements (e.g., one or more microprocessor devices, one or more application specific integrated circuits (ASIC) devices, one or more field programmable gate arrays (FPGAs), or one or more digital signal processors (DSPs)). In this sense, the one or more processors may include any device configured to execute algorithms and / or instructions (e.g., program instructions stored in a memory), and in embodiments, the one or more processors may be embodied as a desktop computer, a mainframe computer system, a workstation, an image computer, a parallel processor, a network computer, or any other computer system configured to execute a program that operates or is configured to operate with the system 100 as described throughout this disclosure. Additionally, the steps described throughout this disclosure may be performed by a single controller or, alternatively, by multiple controllers. Additionally, the controller 130 may include one or more controllers housed within a common housing or multiple housings. In this manner, any controller or combination of controllers may be separately packaged as a module suitable for integration into system 100. Additionally, controller 130 may analyze data received from detector 103 and provide the data to additional components within system 100 or external to system 100.

[0024] The memory of the controller 130 may include any storage medium known in the art suitable for storing program instructions executable by the associated one or more processors. For example, the storage medium may include a non-transitory storage medium. As another example, the memory medium may include, but is not limited to, a read-only memory (ROM), a random access memory (RAM), a magnetic or optical memory device (e.g., disk), a magnetic tape, a solid-state drive, and the like. Furthermore, it is noted that the memory medium may be housed in a common controller housing along with the one or more processors. In one embodiment, the memory medium may be located remotely relative to the physical location of the one or more processors. For example, the one or more processors may access a remote memory (e.g., a server) accessible via a network (e.g., the Internet, an intranet, etc.).

[0025] 3 illustrates a conceptual block diagram of a system 300 incorporating the substrate cleaning system 100 in accordance with one or more embodiments of the present disclosure. In an embodiment, the system 300 may include a semiconductor manufacturing tool and / or a characterization tool (e.g., an inspection tool or a metrology tool) such that the cleaning system 100 may be integrated into a semiconductor manufacturing facility and / or a characterization system. For example, tool 1 302 may include, but is not limited to, a lithography tool, an inspection tool, and / or a metrology tool. As another example, tool 2 304 may include, but is not limited to, a lithography tool, an inspection tool, and / or a metrology tool.

[0026] FIG. 4 shows a flow diagram illustrating a method of cleaning a substrate according to one or more embodiments of the present disclosure. In step 402, a substrate is received by a substrate stage from a substrate holding container. In step 404, the substrate is actuated to a position below a cleaning head using the substrate stage. In step 406, the substrate is actuated to a selected cleaning distance above the substrate using a cleaning lift assembly. In step 408, the disposable electrode ribbon is activated to electrostatically clean the surface of the substrate by removing particles from the substrate. The disposable electrode ribbon is activated by applying a bias voltage between the positive and negative poles. In step 410, a roller holding the disposable electrode ribbon is advanced to expose an unused portion of the disposable electrode ribbon.

[0027] It is further contemplated that each of the method embodiments described above may include any other step(s) of any other method described herein. In addition, each of the method embodiments described above may be performed by any of the systems described herein.

[0028] Those skilled in the art will recognize that the component operations, devices, objects, and their accompanying discussion described herein are used as examples for conceptual clarity, and that various configuration modifications are contemplated. Thus, as used herein, the specific examples described and the accompanying discussion are intended to be representative of their more general classes. In general, the use of any specific example is intended to represent its class, and non-inclusion of specific components, operations, devices, and objects should not be construed as limiting.

[0029] As used herein, directional terms such as "top", "bottom", "over", "under", "upper", "upward", "lower", "down", "downward", and the like are intended to provide relative positions for purposes of description and are not intended to indicate an absolute frame of reference. Various modifications to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments.

[0030] With respect to the use of virtually any plural and / or singular term herein, those of skill in the art can convert from plural to singular and / or from singular to plural as appropriate to the context and / or application. The various singular / plural permutations are not expressly set forth herein for ease of understanding.

[0031] The subject matter described herein illustrates different components that are sometimes included within or connected to other components. It should be understood that such depicted architectures are merely exemplary, and that in fact many other architectures that achieve the same functionality may be implemented. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively "associated" such that the desired functionality is achieved. Thus, any two components herein that are combined to achieve a particular functionality can be considered to be "associated" with each other such that the desired functionality is achieved, regardless of the architecture or intermediate components. Similarly, any two components so associated can also be considered to be "connected" or "coupled" with each other to achieve the desired functionality, and any two components capable of being so associated can also be considered to be "couplable" with each other to achieve the desired functionality. Specific examples of what can be coupled include, but are not limited to, physically coupleable and / or physically interacting components and / or wirelessly interactable and / or wirelessly interacting components and / or logically interacting and / or logically interacting components.

[0032] It should further be understood that the present invention is defined by the appended claims. In general, those skilled in the art will understand that the terms used in this specification and in particular in the appended claims (e.g., the body of the appended claims) are generally intended as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to", the term "having" should be interpreted as "at least having", the term "includes" should be interpreted as "includes but not limited to", etc.). Those skilled in the art will further understand that if a specific number of claim recitations introduced are intended, such intention will be expressly recited in the claim, and in the absence of such recitation, no such intention exists. For example, as an aid to understanding, the following appended claims may include the use of the introductory phrases "at least one" and "one or more" to introduce the claim recitation. However, the use of such phrases should not be interpreted as meaning that the introduction of a claim recitation with the indefinite article "a" or "an" limits any particular claim that includes such an introduced claim recitation to an invention that includes only one such recitation. The same applies to the use of clear articles used to introduce claim recitations, even when the same claim includes the introductory phrase "one or more" or "at least one" and an indefinite article such as "a" or "an" (e.g., "a" and / or "an" should typically be interpreted to mean "at least one" or "one or more"). Also, those skilled in the art will recognize that even when a specific number of introduced claim recitations is explicitly recited, such recitation should typically be interpreted to mean at least the recited number (e.g., a bare recitation of "two recitations" without other modifiers typically means at least two recitations, or two or more recitations).Furthermore, in instances where a conventional expression similar to "such as at least one of A, B, and C" is used, such a configuration is generally intended in the sense that one of ordinary skill in the art would understand the conventional expression (e.g., "a system having at least one of A, B, and C" includes, but is not limited to, systems having only A, only B, only C, A and B together, A and C together, B and C together, and / or A, B, and C together). In instances where a conventional expression similar to "such as at least one of A, B, or C" is used, such a configuration is generally intended in the sense that one of ordinary skill in the art would understand the conventional expression (e.g., "a system having at least one of A, B, or C" includes, but is not limited to, systems having only A, only B, only C, A and B together, A and C together, B and C together, and / or A, B, and C together). Those skilled in the art will further appreciate that virtually any disjunctive word and / or phrase presenting two or more alternative terms, wherever it appears in the description, claims, or drawings, should be understood to contemplate the possibility of including one of the terms, either of the terms, or both terms. For example, the phrase "A or B" will be understood to include the possibilities of "A" or "B" or "A and B."

[0033] It is believed that the present disclosure and many of its attendant advantages will be understood from the foregoing description, and it will be apparent that various changes can be made in the form, construction and arrangement of the elements without departing from the disclosed subject matter or sacrificing all of its material advantages. The forms described are merely illustrative, and it is the intent of the following claims to embrace and include such modifications. It is to be understood, further, that the invention is defined by the appended claims.

Claims

1. 1. A substrate cleaning system comprising: A chamber; a substrate stage positioned within the chamber and configured to secure a substrate for cleaning; a cleaning head including a disposable electrode ribbon loaded on a roller assembly, the disposable electrode ribbon including a positive electrode and a negative electrode, the disposable electrode ribbon configured to electrostatically clean a substrate by electrostatically removing particles from the substrate, the roller assembly configured to advance the disposable electrode ribbon following cleaning of the substrate; Including, Substrate cleaning system.

2. 2. The substrate cleaning system of claim 1, a substrate handling subsystem including a robot configured to transfer the substrate between a storage container in the chamber and the substrate stage; Further comprising: Substrate cleaning system.

3. 2. The substrate cleaning system of claim 1, Electrostatic cleaning of the substrate is performed by dielectrophoresis, where particles move away from the substrate in the direction of an electric field gradient created by the disposable electrode ribbons. Substrate cleaning system.

4. 2. The substrate cleaning system of claim 1, Particles located on the substrate are detached from the substrate and collected by the disposable electrode ribbon. Substrate cleaning system.

5. 2. The substrate cleaning system of claim 1, Storage containers including front-opening unified pods (FOUPs), Substrate cleaning system.

6. 2. The substrate cleaning system of claim 1, the substrate stage is configured to actuate the substrate into position beneath the cleaning head. Substrate cleaning system.

7. 2. The substrate cleaning system of claim 1, Further comprising a cleaning head lift actuator and a proximity sensor. Substrate cleaning system.

8. 8. The substrate cleaning system of claim 7, the cleaning head lift actuator is configured to lower the cleaning head to a selected cleaning distance above the substrate; the proximity sensor is configured to identify when a selected cleaning distance between the cleaning head and an upper surface of the substrate is achieved. Substrate cleaning system.

9. 2. The substrate cleaning system of claim 1, Further comprising a controller, the controller includes one or more processors and a memory, and one or more program instructions are retained in the memory, the one or more program instructions being configured to direct a robot to transfer a substrate between a storage container and a substrate stage in the chamber; Substrate cleaning system.

10. 2. The substrate cleaning system of claim 1, the one or more program instructions are configured to cause the one or more processors to direct a cleaning head lift actuator to lower the cleaning head to a selected cleaning distance above the substrate. Substrate cleaning system.

11. 2. The substrate cleaning system of claim 1, one or more program instructions configured to cause one or more processors to direct the substrate stage to move the substrate along a path beneath the cleaning head. Substrate cleaning system.

12. 2. The substrate cleaning system of claim 1, the one or more program instructions are configured to cause the one or more processors to apply a bias voltage between a positive electrode and a negative electrode of the disposable electrode ribbon; Substrate cleaning system.

13. 2. The substrate cleaning system of claim 1, The one or more program instructions are configured to cause the one or more processors to advance the roller to expose an unused portion of the disposable electrode ribbon. Substrate cleaning system.

14. 2. The substrate cleaning system of claim 1, The substrate comprises a semiconductor wafer. Substrate cleaning system.

15. 2. The substrate cleaning system of claim 1, the roller assembly includes one or more rollers configured to secure the disposable electrode ribbon; Substrate cleaning system.

16. 16. The substrate cleaning system of claim 15, the one or more rollers are rotatable to advance the disposable electrode ribbon; Substrate cleaning system.

17. A roller assembly; a disposable electrode ribbon including a positive electrode and a negative electrode, the disposable electrode ribbon configured to electrostatically clean a substrate by electrostatically removing particles from the substrate; Including, the roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate. Substrate cleaning equipment.

18. A substrate cleaning method for cleaning a substrate, comprising the steps of: transferring the substrate from a storage container to a substrate stage; driving the substrate using the substrate stage into a position beneath a cleaning head; driving the substrate to a selected cleaning distance above the substrate with a cleaning lift assembly; electrostatically cleaning a surface of the substrate by activating a disposable electrode ribbon including a positive electrode and a negative electrode to remove particles from the substrate, the disposable electrode ribbon being activated by applying a bias voltage between the positive electrode and the negative electrode and advancing a roller to expose an unused portion of the disposable electrode ribbon; A method for cleaning a substrate.

19. 20. A method for cleaning a substrate according to claim 18, comprising: Activating the disposable electrode ribbons to electrostatically clean a surface of a substrate includes: activating the disposable electrode ribbons to electrostatically clean the substrate via dielectrophoresis. A method for cleaning a substrate.

20. 20. A method for cleaning a substrate according to claim 18, comprising: further comprising the step of determining, via the proximity sensor, whether a selected cleaning distance has been achieved; A method for cleaning a substrate.

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