Absorbent composition, moisture-absorbing film, optical filter, imaging device, and infrared sensor

Abstract

To provide an absorbent composition and its use.SOLUTION: An absorbent composition comprises a compound represented by the chemical formula 1 in the figure and a compound represented by a specific chemical formula 2, and satisfies specific conditions.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to an absorbent composition and its uses.

Background Art

[0002] Absorbents, particularly those capable of absorbing light in the infrared region, can be applied to various uses. For example, imaging devices using CCD (Charge-Coupled Device) or CMOS (complementary metal-oxide-semiconductor) image sensors, infrared sensors, etc. include silicon photodiodes having sensitivity to the near-infrared region, so the above absorbents can be used.

[0003] Although there are various methods for applying such absorbents, usually, a method using a coating solution obtained by mixing an absorbent dissolved in a solvent and a resin component is applied. Therefore, it is necessary for the absorbent to exhibit excellent solubility and compatibility with the solvent and the resin component.

[0004] If the solubility or compatibility of the absorbent with the solvent or the resin component is poor, it may not be possible to obtain the desired spectral characteristics for the absorption film to which the absorbent is applied, or the light characteristics may deteriorate due to phenomena such as precipitation of the absorbent in the absorption film. However, it is difficult to secure an absorbent that exhibits excellent solubility and compatibility with various types of solvents and resin components simultaneously.

[0005] Also, for example, when light characteristics with a wide absorption bandwidth or light characteristics that are difficult to obtain with a single absorbent are required, two or more types of absorbents must be applied. However, it is difficult for all of two or more types of absorbents to exhibit excellent solubility and compatibility with various types of solvents and resin components simultaneously.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present disclosure aims to provide an absorbent composition and its uses. In the present disclosure, an absorbent composition containing two or more absorbents is provided, which exhibits excellent compatibility and solubility with various solvents and resin components.

[0007] Moreover, the present disclosure aims to apply the above absorbent composition to ensure desired optical properties.

[0008] Furthermore, the present disclosure aims to provide uses of the above absorbent composition, for example, to provide an absorption film, an optical filter, a solid-state imaging device, and / or an infrared sensor formed using the above absorbent composition.

Means for Solving the Problems

[0009] Among the physical properties mentioned in this specification, for those physical properties where the measurement temperature affects the results, unless otherwise specified, they are the results measured at room temperature.

[0010] The term "room temperature" is the natural temperature without heating and cooling, for example, any one temperature within the range of 10°C to 30°C, a temperature of about 23°C or about 25°C. Also, in this specification, the unit of temperature is Celsius (°C) unless otherwise specified.

[0011] Among the physical properties mentioned in this specification, for those physical properties where the measurement pressure affects the results, unless otherwise specified, they are the results measured at normal pressure.

[0012] The term "normal pressure" is the pressure as it is without pressurization and depressurization, and usually means about 740 mmHg to 780 mmHg at the atmospheric pressure level.

[0013] In this specification, in the case of physical properties where the measurement humidity affects the results, the physical properties are those measured at the natural humidity without special adjustment at room temperature and / or normal pressure.

[0014] When the optical properties (e.g., refractive index) mentioned in this specification vary with wavelength, unless otherwise specified, the optical properties are those for light with a wavelength of 520 nm.

[0015] In this specification, the terms "transmittance", "reflectance" or "absorbance" mean the actual transmittance (measured transmittance), actual reflectance (measured reflectance) or actual absorbance (measured absorbance) confirmed within a specific wavelength or within a wavelength range of a predetermined region, unless otherwise specified.

[0016] In this specification, the terms "transmittance", "reflectance" or "absorbance" are the transmittance, reflectance or absorbance based on an incident angle of 0 degrees, unless otherwise specified.

[0017] In this specification, the term "average transmittance" is, unless otherwise specified, the result obtained by measuring the transmittance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength region and then calculating the arithmetic mean of the measured transmittances. For example, the average transmittance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm and 360 nm.

[0018] In this specification, the term "maximum transmittance" is the maximum transmittance when measuring the transmittance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength region. For example, the maximum transmittance within the wavelength range of 350 nm to 360 nm is the highest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm and 360 nm.

[0019] In this specification, unless otherwise specified, the term "average reflectance" is the result obtained by measuring the reflectance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range, and then calculating the arithmetic mean of the measured reflectances. For example, the average reflectance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the reflectances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0020] In this specification, the term "maximum reflectance" is the maximum reflectance when measuring the reflectance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range. For example, the maximum reflectance within the wavelength range of 350 nm to 360 nm is the highest reflectance among the reflectances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0021] In this specification, unless otherwise specified, the term "average absorptance" is the result obtained by measuring the absorptance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range, and then calculating the arithmetic mean of the measured absorptances. For example, the average absorptance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the absorptances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0022] In this specification, the term "maximum absorptance" is the maximum absorptance when measuring the absorptance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range. For example, the maximum absorptance within the wavelength range of 350 nm to 360 nm is the highest absorptance among the absorptances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0023] In this specification, the term "incident angle" refers to the angle with respect to the normal of the surface to be evaluated. For example, the transmittance at an incident angle of 0 degrees for an optical filter means the transmittance for light incident in a direction substantially parallel to the normal of the optical filter surface. Also, for example, an incident angle of 40 degrees is a value for incident light that forms a substantially 40-degree angle with the normal in the clockwise or counterclockwise direction. Such a definition of the incident angle is equally applicable to other properties such as transmittance.

[0024] In this specification, the term "alkyl group" means an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may optionally be substituted by one or more substituents.

[0025] In this specification, the term "alkoxy group" means an alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. The alkoxy group may be linear, branched, or cyclic. The alkoxy group may optionally be substituted by one or more substituents.

[0026] In this specification, the term "haloalkyl group" means an alkyl group substituted by at least one halogen element, and the term "alkoxyalkyl group" means an alkyl group substituted by at least one alkoxy group. At this time, the specific types of the alkyl group and the alkoxy group are as described above. Also, examples of halogen atoms that can be substituted for the haloalkyl group include fluorine (F), chlorine (Cl), bromine (Br), and / or iodine (I).

[0027] This disclosure relates to an absorbent composition.

[0028] In this specification, the term "absorbent composition" means a mixture containing two absorbents having different chemical structures from each other.

[0029] In one example, the absorbent composition may include the compound of Chemical Formula 1 below and the compound of Chemical Formula 2 below. The compounds of Chemical Formula 1 and Chemical Formula 2 have different structures from each other.

[0030] [Chemical Formula 1] [Chem.] In Chemical Formula 1, R 11 , R 12 , R 51 and R 52 may each independently be an alkyl group, a haloalkyl group, an alkoxy group or an alkoxyalkyl group, and R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 may each independently be hydrogen, an alkyl group, an alkoxy group or an alkoxyalkyl group.

[0031] [Chemical Formula 2] [Chem.] In Chemical Formula 2, R 71 and R 72 are each independently an alkyl group, an alkoxy group or an alkoxyalkyl group, R 61 ~R 64 are each independently hydrogen, an alkyl group, an alkoxy group or an alkoxyalkyl group, and A 1 , B 1 , A 2 and B 2 each independently is a benzene structure or does not exist.

[0032] The inventors have confirmed that an absorbent composition composed of a compound having the skeleton of Chemical Formula 1 and satisfying any one of the following Conditions 1 and 2, and a compound having the skeleton of Chemical Formula 2 and satisfying any one of the following Conditions 3 and 4 exhibits excellent solubility and compatibility with various solvents and resin components, and can impart desired optical properties to the absorption film.

[0033] That is, the compound of Chemical Formula 1 satisfies at least one of the following Conditions 1 and 2. Condition 1: The total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 in Chemical Formula 1 is 16 or more. Condition 2: The total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 in Chemical Formula 1 is 14 or more, and at least one of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 is an alkoxy group or an alkoxyalkyl group.

[0034] The compound of Chemical Formula 2 satisfies at least one of the following Condition 3 and Condition 4. Condition 3: In Chemical Formula 2, the total number of carbon atoms of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 is 10 or more. Condition 4: In Chemical Formula 2, the total number of carbon atoms of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 is 4 or more, and at least one of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 is an alkoxy group or an alkoxyalkyl group.

[0035] In relation to Condition 1, the total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 in Chemical Formula 1 may be 18 or more, 20 or more, 22 or more, 24 or more, 26 or more, 28 or more, or 30 or more.

[0036] In relation to Condition 1, the total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32, R 41 and R 42 The upper limit of the total number of carbon atoms of is not particularly limited. However, if the total number of carbon atoms is too large, the synthesis of the compound is not easy, the crystallinity of the synthesized compound decreases, and purification becomes difficult. Therefore, the total number of carbon atoms may be, for example, about 50 or less, 48 or less, 46 or less, 44 or less, 42 or less, 40 or less, 38 or less, 36 or less, 34 or less, 32 or less, 30 or less, 28 or less, 26 or less, 24 or less, or 22 or less.

[0037] Even when Condition 1 is satisfied, R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 at least one of may be an alkoxy group or an alkoxyalkyl group. In such a case, although not particularly limited, for example, at least R 11 , R 12 , R 51 and R 52 at least one of may be an alkoxy group or an alkoxyalkyl group.

[0038] In relation to Condition 2, the total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 may be 14 or more, 16 or more, 18 or more, 20 or more, 22 or more, 24 or more, 26 or more, 28 or more, or 30 or more.

[0039] In relation to Condition 2, R in Chemical Formula 1 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 The upper limit of the total number of carbon atoms is not particularly limited. However, if the total number of carbon atoms is too large, the synthesis of the compound is not easy, the crystallinity of the synthesized compound decreases, and purification becomes difficult. Therefore, the total number of carbon atoms may be, for example, 50 or less, 48 or less, 46 or less, 44 or less, 42 or less, 40 or less, 38 or less, 36 or less, 34 or less, 32 or less, 30 or less, 28 or less, 26 or less, 24 or less, 22 or less, 20 or less, or 18 or less.

[0040] In the case of Condition 2, when the total number of carbon atoms of R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 is less than 20, R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42At least one of them may be an alkoxy group or an alkoxyalkyl group. In such a case, although not particularly limited, for example, at least R 11 、R 12 、R 51 and R 52 may be an alkoxy group or an alkoxyalkyl group.

[0041] In relation to Condition 3, in Chemical Formula 2, the total number of carbon atoms of R 61 、R 62 、R 63 、R 64 、R 71 and R 72 may be 10 or more, 12 or more, 14 or more, or 16 or more.

[0042] In relation to Condition 3, the upper limit of the total number of carbon atoms of R 61 、R 62 、R 63 、R 64 、R 71 and R 72 in Chemical Formula 2 is not particularly limited. However, if the total number of carbon atoms is too large, the synthesis of the compound is not easy, the crystallinity of the synthesized compound decreases, and purification becomes difficult. Therefore, the total number of carbon atoms may be, for example, 40 or less, 38 or less, 36 or less, 34 or less, 32 or less, 30 or less, 28 or less, 26 or less, 24 or less, 22 or less, 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, or 10 or less.

[0043] Even when Condition 3 is satisfied, at least one of R 61 、R 62 、R 63 、R 64 、R 71 and R 72 may be an alkoxy group or an alkoxyalkyl group. In such a case, although not particularly limited, for example, at least one of R 71 and R 72 may be an alkoxy group or an alkoxyalkyl group.

[0044] In relation to Condition 4, in Chemical Formula 2, R 61 , R 62 , R 63 , R 64 , R 71 and R 72 may have a total carbon number of 4 or more, 6 or more, 8 or more, 10 or more, 12 or more, 14 or more, or 16 or more.

[0045] In relation to Condition 4, the total carbon number of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 in Chemical Formula 2 is not particularly limited. However, if the total carbon number is too large, the synthesis of the compound is not easy, the crystallinity of the synthesized compound decreases, and purification becomes difficult. Therefore, the total carbon number may be, for example, 40 or less, 38 or less, 36 or less, 34 or less, 32 or less, 30 or less, 28 or less, 26 or less, 24 or less, 22 or less, 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, 10 or less, 8 or less, 6 or less, or 4 or less.

[0046] In the case of Condition 4, when the total carbon number of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 is less than 10, at least one of R 61 , R 62 , R 63 , R 64 , R 71 and R 72 may be an alkoxy group or an alkoxyalkyl group. In such a case, although not particularly limited, for example, at least one of R 71 and R 72 may be an alkoxy group or an alkoxyalkyl group.

[0047] In Chemical Formula 1, R11 and R 12 and R 51 and R 52 and R may each independently be an alkyl group, a haloalkyl group, an alkoxy group or an alkoxyalkyl group. The lower limit of the number of carbon atoms in the alkyl group, haloalkyl group, alkoxy group or alkoxyalkyl group of R 11 and R 12 and R 51 and R 52 may be 1, 2, 3, 4, 5, 6, 7 or 8, and the upper limit may be about 20, 18, 16, 14, 12, 10, 8, 6, 4 or 2. The number of carbon atoms in the alkyl group, haloalkyl group, alkoxy group or alkoxyalkyl group of R 11 and R 12 and R 51 and R 52 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0048] R 11 and R 12 The ratio C1 / C5 of the total number of carbon atoms C1 of R 51 and R 52 to the total number of carbon atoms C5 of R may be in the range of 0.1 to 10.

[0049] The ratio C1 / C5 may, in other examples, be about 0.1 or more, 0.3 or more, 0.5 or more, 1 or more, 1.5 or more, 2 or more, 2.5 or more or 3 or more, or about 9 or less, 8 or less, 7 or less, 6 or less, 5 or less, 4 or less, 3 or less, 2 or less or 1 or less.

[0050] In one example, in Chemical Formula 1, R 11 The number of carbon atoms C11 of R 12The lower limit of the ratio C11 / C12 to the carbon number C12 may be about 0.1, 0.3, 0.5, 0.7, 0.9, or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2, or 1. The ratio C11 / C12 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0051] In one exemplification, in Chemical Formula 1, R 51 The lower limit of the ratio C51 / C52 of the carbon number C51 existing in R 52 to the carbon number C52 existing in R may be about 0.1, 0.3, 0.5, 0.7, 0.9, or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2, or 1. The ratio C51 / C52 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0052] In one exemplification of Chemical Formula 1, R 21 , R 22 , R 23 , R 24 , R 25 and R 26 are each independently an alkyl group, an alkoxy group, or an alkoxyalkyl group, and R 31 , R 32 , R 41 and R 42 may be hydrogen. In such a case, the carbon number contained in the alkyl group, alkoxy group, or alkoxyalkyl group of R 21 , R 22 , R 23 , R 24 , R 25 and R 26 may be about 1 to 4, 1 to 3, 1 to 2, or 1.

[0053] In Chemical Formula 1, the total carbon number C1 of R 11 and R 12 ~R 21 ~R 26 , R 31 , R 32 , R 41and R 42 The lower limit of the ratio C1 / C2 of the total number of carbon atoms C1 to C2 may be about 1, 1.2, 1.4, 1.6, 1.8 or 2, and the upper limit may be about 10, 9, 8, 7, 6, 5, 4, 3, 2 or 1.5. The ratio C1 / C2 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0054] In one exemplary embodiment, in Chemical Formula 1, R 21 ~R 23 The lower limit of the ratio CR2 / CL2 of the number of carbon atoms CR2 contained in R 24 ~R 26 to the number of carbon atoms CL2 contained in R may be about 0.1, 0.3, 0.5, 0.7, 0.9 or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2 or 1. The ratio CR2 / CL2 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0055] In one exemplary embodiment, in Chemical Formula 1, R 31 The lower limit of the ratio CR3 / CL3 of the number of carbon atoms CR3 contained in R 32 to the number of carbon atoms CL3 contained in R may be about 0.1, 0.3, 0.5, 0.7, 0.9 or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2 or 1. The ratio CR3 / CL3 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0056] In one exemplary embodiment, in Chemical Formula 1, R 41 The lower limit of the ratio CR4 / CL4 of the number of carbon atoms CR4 contained in R 42 to the number of carbon atoms CL4 contained in R may be about 0.1, 0.3, 0.5, 0.7, 0.9 or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2 or 1. The ratio CR4 / CL4 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0057] The alkyl group, haloalkyl group, alkoxy group, or alkoxyalkyl group present in Chemical Formula 1 may each be linear, branched, or cyclic, and may optionally be substituted with one or more substituents.

[0058] In Chemical Formula 2, R 71 and R 72 may each independently be an alkyl group, an alkoxy group, or an alkoxyalkyl group. The lower limit of the number of carbon atoms contained in the alkyl group, alkoxy group, or alkoxyalkyl group of R 71 and R 72 may be 1, 2, 3, 4, 5, or 6, and the upper limit may be about 20, 18, 16, 14, 12, 10, 8, 6, 4, or 3. The number of carbon atoms present in the alkyl group, alkoxy group, or alkoxyalkyl group of R 71 and R 72 may be within the range of any one of the above-described lower limits and any one of the above-described upper limits.

[0059] In one example of Chemical Formula 2, for the ratio C71 / C72 of the number of carbon atoms C71 of R 71 to the number of carbon atoms C72 of R 72 the lower limit may be about 0.1, 0.3, 0.5, 0.7, 0.9, or 1, and the upper limit may be about 2, 1.8, 1.6, 1.4, 1.2, or 1. The ratio C71 / C72 may be within the range of any one of the above-described lower limits and any one of the above-described upper limits.

[0060] In one example of Chemical Formula 1, R 61 ~R 64 may each independently be an alkyl group, an alkoxy group, or an alkoxyalkyl group. In such a case, the number of carbon atoms contained in the alkyl group, alkoxy group, or alkoxyalkyl group of R 61 ~R 64 may be 1 to 4, 1 to 3, 1 to 2, or about 1.

[0061] In Chemical Formula 2, R 71 and R 72 The total number of carbon atoms of C7 for R 61 ~R 64 The lower limit of the ratio C7 / C6 of the total number of carbon atoms of C7 for R

[0062] In one exemplary case, in Chemical Formula 2, R 61 and R 62 The ratio CR6 / CL6 of the number of carbon atoms CR6 contained in R 63 and R 64 to the number of carbon atoms CL6 contained in R

[0063] The alkyl group, alkoxy group or alkoxyalkyl group present in Chemical Formula 2 may each be linear, branched or cyclic, and may optionally be substituted with one or more substituents.

[0064] In Chemical Formula 2, A 1 、A 2 、B 1 and B 2 are each independently a benzene structure or do not exist. Here, the benzene structure means the case where the dotted line at the relevant site is represented by a solid line, and "do not exist" means that the dotted line at the relevant site does not exist. For example, in Chemical Formula 1, A 1 and A 2 are benzene structures, and the structure where B 1 and B 2 do not exist is represented by the following Chemical Formula 21.

[0065] [Chemical Formula 21] [Chem.]

[0066] In one exemplary case, in Chemical Formula 2, A 1 and B 1 any one of which is a benzene structure and the other one does not exist, and A 2 and B 2 any one of which is a benzene structure and the other one may not exist.

[0067] In order to obtain a more appropriate effect, the relationship between Chemical Formula 1 and Chemical Formula 2 can be adjusted.

[0068] For example, the upper limit and / or lower limit of the total number of carbon atoms present in R of Chemical Formula 1 and Chemical Formula 2, R 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 , R 42 , R 61 , R 62 , R 63 , R 64 , R 71 and R 72 can be further adjusted. For example, the lower limit of the total number of carbon atoms may be about 26, 28, 30, 32, 34, 36, 38, 40, 42, 44 or 46. The upper limit of the total number of carbon atoms may be about 80, 75, 70, 65, 60, 55, 50, 48, 46, 44, 42, 40, 38, 36, 34 or 32, 30, 28. The total number of carbon atoms may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0069] R of Chemical Formula 1 11 and R 12 The total number of carbon atoms of R in Chemical Formula 2, C1 71 and R 72 Furthermore, the upper limit and / or lower limit of the ratio C1 / C7 of the total number of carbon atoms of R to the total number of carbon atoms of R in Chemical Formula 2, C7, can be adjusted. For example, the lower limit of the total number of carbon atoms may be about 0.1, 0.3, 0.5, 1, 1.5, or 2. The upper limit of the ratio C1 / C7 may be about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1. The ratio C1 / C7 may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0070] R of Chemical Formula 1 11 , R 12 , R 51 , R 52 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 31 , R 32 , R 41 and R 42 The total number of carbon atoms of R, CA 61 , R 62 , R 63 , R 64 , R 71 and R 72 Furthermore, the upper limit and / or lower limit of the ratio CA / CB of the total number of carbon atoms of R to the total number of carbon atoms of R, CB, can be adjusted. For example, the lower limit of the total number of carbon atoms may be about 0.5, 0.7, 0.9, 1, 1.1, 1.5, 2, or 2.5. The upper limit of the ratio CA / CB may be about 5, 4, 3, or 2. The ratio CA / CB may be within the range of any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0071] By including the compounds of Chemical Formula 1 and Chemical Formula 2, an absorbent composition exhibiting the desired properties can be provided.

[0072] The ratio between the compounds of Chemical Formula 1 and Chemical Formula 2 within the absorbent composition is not particularly limited. That is, the ratio between the compounds can be adjusted in consideration of the desired optical properties. In one example, the compound of Chemical Formula 2 may be included in the absorbent composition at a ratio of 1 to 500 parts by weight relative to 100 parts by weight of the compound of Chemical Formula 1.

[0073] In other examples, the ratio of the compound of Chemical Formula 2 to 100 parts by weight of the compound of Chemical Formula 1 may be about 5 parts by weight or more, 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, or 70 parts by weight or more, or about 450 parts by weight or less, 400 parts by weight or less, 350 parts by weight or less, 300 parts by weight or less, 250 parts by weight or less, 200 parts by weight or less, 150 parts by weight or less, or 100 parts by weight or less. The above ratio may be within the range that is less than any one of the above upper limits and greater than any one of the above lower limits.

[0074] In order to obtain the desired effect, if necessary, the upper limit and / or lower limit of the ratio of the compounds of Chemical Formula 1 and Chemical Formula 2 to all the absorbents contained in the absorbent composition can be adjusted. For example, the lower limit of the total weight ratio (weight ratio) of the compounds of Chemical Formula 1 and Chemical Formula 2 based on the weight of all the absorbents contained in the absorbent composition may be about 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or 95 wt%. The upper limit of the weight ratio may be about 100 wt%, 95 wt%, 90 wt%, or 85 wt%. The weight ratio may be within the range of any one of the above lower limits and any one of the above upper limits.

[0075] The absorbent composition can further contain other necessary components in addition to the compounds of Chemical Formula 1 and Chemical Formula 2.

[0076] For example, the absorbent composition may further include a resin component that serves as a binder. The type of resin component to be applied in such a case is not particularly limited, and known resin components used to form an absorption film, for example, a near-infrared absorption film, can be applied. The absorbent of the present disclosure can exhibit appropriate compatibility and solubility with various known resin components.

[0077] Examples of applicable resin components include cyclic olefin (COP, Cycloolefin)-based resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyparaphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins, or silicone resins, etc., and one or more of various other organic resins or organic-inorganic hybrid resins, but are not limited thereto.

[0078] When applying the resin component, its ratio is not particularly limited. For example, the resin component may be present such that the total weight of the compounds of Chemical Formula 1 and Chemical Formula 2 is in the range of 0.1 to 50 parts by weight with respect to 100 parts by weight of the resin component.

[0079] In other examples, the total weight of the compounds of Chemical Formula 1 and Chemical Formula 2 with respect to 100 parts by weight of the resin component may be about 0.5 part by weight or more, 1 part by weight or more, 1.5 parts by weight or more, 2 parts by weight or more, 2.5 parts by weight or more, 3 parts by weight or more, 3.5 parts by weight or more, 4 parts by weight or more, 4.5 parts by weight or more, 5 parts by weight or more, 5.5 parts by weight or more, 6 parts by weight or more, 6.5 parts by weight or more, or 7 parts by weight or more, or about 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, 30 parts by weight or less, 25 parts by weight or less, 20 parts by weight or less, 15 parts by weight or less, or 10 parts by weight or less. The above ratio may be within the range not exceeding any one of the above upper limits and not less than any one of the above lower limits.

[0080] When applying the resin component, the weight ratio of the compound of Chemical Formula 1 per 100 parts by weight of the resin component may be in the range of 0.5 to 50 parts by weight. In other examples, the weight ratio of the compound of Chemical Formula 1 to 100 parts by weight of the resin component is 1 part by weight or more, 1.5 parts by weight or more, 2 parts by weight or more, 2.5 parts by weight or more, 3 parts by weight or more, 3.5 parts by weight or more, 4 parts by weight or more, 4.5 parts by weight or more, 5 parts by weight or more, 5.5 parts by weight or more, 6 parts by weight or more, 6.5 parts by weight or more, or about 7 parts by weight or more, or 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, 30 parts by weight or less, 25 parts by weight or less, 20 parts by weight or less, 15 parts by weight or less, 10 parts by weight or less, 9 parts by weight or less, 8 parts by weight or less, 7 parts by weight or less, 6 parts by weight or less, or about 5 parts by weight or less. The above ratio may be within the range not exceeding any one of the above upper limits and not less than any one of the above lower limits.

[0081] When applying the resin component, the weight ratio of the compound of Chemical Formula 2 to 100 parts by weight of the resin component may be in the range of 0.5 to 50 parts by weight. In other examples, the weight ratio of the compound of Chemical Formula 2 to 100 parts by weight of the resin component is 1 part by weight or more, 1.5 parts by weight or more, 2 parts by weight or more, 2.5 parts by weight or more, 3 parts by weight or more, 3.5 parts by weight or more, 4 parts by weight or more, 4.5 parts by weight or more, 5 parts by weight or more, 5.5 parts by weight or more, 6 parts by weight or more, 6.5 parts by weight or more, or about 7 parts by weight or more, or 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, 30 parts by weight or less, 25 parts by weight or less, 20 parts by weight or less, 15 parts by weight or less, 10 parts by weight or less, 9 parts by weight or less, 8 parts by weight or less, 7 parts by weight or less, 6 parts by weight or less, 5 parts by weight or less, 4 parts by weight or less, or about 3 parts by weight or less. The above ratio may be within the range not exceeding any one of the above upper limits and not less than any one of the above lower limits.

[0082] For example, the absorbent composition may further include a solvent in which an absorbent containing the compounds of Chemical Formula 1 and Chemical Formula 2 and / or a resin component is dispersed. The type of solvent applicable in such a case is not particularly limited, and a known solvent used to form an absorption film, for example, a near-infrared absorption film, can be applied. The absorbent of the present disclosure can exhibit appropriate compatibility and solubility with various known solvents.

[0083] Examples of applicable solvents include, but are not limited to, cyclohexanone, toluene, methyl ethyl ketone, methyl isobutyl ketone, chlorobenzene, or xylene.

[0084] When applying the solvent, there are no special restrictions on its ratio, and the ratio can be adjusted within the range where appropriate dispersion of compounds such as those of Chemical Formula 1 and Chemical Formula 2 is possible.

[0085] The absorbent composition may further include other necessary components in addition to the above-described components.

[0086] The present disclosure also relates to the use of the absorbent composition.

[0087] For example, the present disclosure relates to an absorption film to which the absorbent composition is applied.

[0088] Such an absorption film may include at least a resin component and an absorbent composition or the compounds of Chemical Formula 1 and Chemical Formula 2.

[0089] The specific type of the resin component and the ratio between the resin component and the compounds of Chemical Formula 1 and Chemical Formula 2 are as described in the above-described absorbent composition.

[0090] The absorption film may be a film capable of absorbing light within a predetermined wavelength range. In one example, the absorption film may be an infrared absorption film or a near-infrared absorption film. Such an absorption film can exhibit absorption characteristics, for example, in at least a part of the wavelength range within the range of about 600 nm to 900 nm.

[0091] In one example, the absorption film may have a relatively wide bandwidth within the wavelength range of 600 nm to 900 nm described above and may have absorption characteristics for longer wavelengths through the application of the absorbent composition or the compounds of Chemical Formula 1 and Chemical Formula 2 described above.

[0092] Due to such characteristics, the absorption film can be applied to devices such as various optical filters and infrared sensors to prevent the shift phenomenon due to the incident angle. In addition, when a dielectric film is applied to an optical filter or an infrared sensor, etc., the reflection characteristics of the dielectric film can be adjusted to prevent defects such as so-called petal flare, and the number of layers of the dielectric film can be reduced, thereby ensuring a process merit.

[0093] Therefore, in one example, the absorption film can exhibit an absorption band with a bandwidth of 60 nm or more within the wavelength range of 600 nm to 900 nm.

[0094] The absorption band means a region showing a transmittance of approximately 70% or less in the transmittance curve of the absorption film.

[0095] In addition, the bandwidth means the difference between the longest wavelength showing a transmittance of 20% and the shortest wavelength showing a transmittance of 20% in the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film.

[0096] Within the wavelength range of 600 nm to 900 nm of such an absorption film, the bandwidth may be, in other examples, about 70 nm or more, 80 nm or more, 90 nm or more, 100 nm or more, or 120 nm or more. The upper limit of the bandwidth is not particularly limited. For example, the bandwidth may be about 600 nm or less, 550 nm or less, 500 nm or less, 450 nm or less, 400 nm or less, 350 nm or less, 300 nm or less, 250 nm or less, 200 nm or less, 190 nm or less, 180 nm or less, 160 nm or less, 150 nm or less, 140 nm or less, or 130 nm or less. The bandwidth may be equal to or greater than any one of the lower limits described above, or may be within a range that is equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0097] Also, the absorption film may have a T50% Cut on wavelength within the range of 600 nm to 800 nm. The lower limit of the T50% Cut on wavelength may be about 610 nm, 620 nm, or 630 nm in other examples, and the upper limit may be about 750 nm, 700 nm, or 650 nm in other examples. The T50% Cut on wavelength may be within a range that is equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above.

[0098] Here, the T50% Cut on wavelength means the shortest wavelength that exhibits a transmittance of 50% in the wavelength region of 600 nm to 900 nm of the transmittance curve of the absorption film.

[0099] The absorption film may have a T50% cut-off wavelength in the range of 700 nm to 900 nm. The T50% cut-off wavelength may be a longer wavelength than the T50% cut-on wavelength. The lower limit of the T50% cut-off wavelength may be about 720 nm, 740 nm, 760 nm, 780 nm or 800 nm in other examples, and the upper limit may be about 880 nm, 860 nm, 840 nm, 820 nm, 810 nm or 800 nm in other examples. The T50% cut-off wavelength may be within a range that is equal to or greater than any one of the above-described lower limits and equal to or less than any one of the above-described upper limits.

[0100] Here, the T50% cut-off wavelength means the longest wavelength that exhibits a transmittance of 50% in the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film.

[0101] Through its absorption characteristics, the absorption film can be applied to various devices such as optical filters and infrared sensors, and the desired characteristics can be efficiently achieved.

[0102] The absorption film of the present disclosure can be formed by a known method as long as the absorbent composition of the present disclosure is applied.

[0103] For example, the absorbent composition can be coated by an appropriate method, and a curing or drying process can be performed as necessary to form the absorption film.

[0104] The thickness of the absorption film is not particularly limited, and the thickness can be adjusted in consideration of the desired characteristics.

[0105] In one example, the absorption film may have a thickness of approximately 0.1 μm to 20 μm.

[0106] The present disclosure also relates to an optical filter. The optical filter may include a substrate layer and the above-described absorption film formed on one or both surfaces of the substrate layer.

[0107] FIG. 1 shows a case where an absorption film 200 is formed on one surface of a substrate layer 100 as an exemplary optical filter.

[0108] Such an optical filter of the present disclosure can exhibit excellent performance by including the absorption film described above. For example, the optical filter can realize a visible light transmission band with high transmittance while efficiently and accurately blocking unnecessary infrared light.

[0109] The type of transparent substrate applied to the optical filter is not particularly limited, and a known transparent substrate for an optical filter can be used.

[0110] In one example, the substrate layer may be a so-called infrared absorption substrate. An infrared absorption substrate is a substrate that exhibits absorption characteristics in at least a part of the infrared region. So-called Blue Glass containing copper and showing the above characteristics is a typical example of an infrared absorption substrate. Such an infrared absorption substrate is useful when constructing an optical filter that blocks light in the infrared region, but is disadvantageous in terms of ensuring a high transmittance in the visible light region due to its absorption characteristics and is also disadvantageous in terms of durability. In the present disclosure, by selecting an infrared absorption substrate and combining it with the absorption film described above, it is possible to provide an optical filter that efficiently blocks desired light, exhibits high transmittance characteristics in the visible light region, and is excellent in durability.

[0111] As the infrared absorption substrate, a substrate showing an average transmittance of 75% or more in the range of 425 nm to 560 nm can be used. The average transmittance may be in the range of 77% or more, 79% or more, 81% or more, 83% or more, 85% or more, 87% or more, or 89% or more and / or 98% or less, 96% or less, 94% or less, 92% or less, or 90% or less in other examples.

[0112] As the infrared absorption substrate, a substrate showing a maximum transmittance of 80% or more within the range of 425 nm to 560 nm can be used. The maximum transmittance may be within the range of 82% or more, 84% or more, 86% or more, 88% or more, or 90% or more and / or within the range of 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, or 90% or less in other examples.

[0113] As the infrared absorption substrate, a substrate showing an average transmittance of 75% or more within the range of 350 nm to 390 nm can be used. The average transmittance may be within the range of 77% or more, 79% or more, 81% or more, or 83% or more and / or within the range of 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, 88% or less, 86% or less, or 84% or less in other examples.

[0114] As the infrared absorption substrate, a substrate showing a maximum transmittance of 80% or more within the range of 350 nm to 390 nm can be used. The maximum transmittance may be within the range of 82% or more, 84% or more, 86% or more, or 87% or more and / or within the range of 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, or 88% or less in other examples.

[0115] As the infrared absorption substrate, a substrate with a transmittance at a wavelength of 700 nm within the range of 10% to 45% can be used. The transmittance may be about 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less, or 29% or less, or about 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, or 28% or more in other examples.

[0116] As the infrared absorption substrate, a substrate showing an average transmittance in the range of 5% to 30% within the range of 700 nm to 800 nm can be used. The average transmittance may be in the range of 7% or more, 9% or more, 11% or more, 13% or more, 15% or more, 15.5% or more, 16% or more or 16.5% or more and / or 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less or 17% or less in other examples.

[0117] As the infrared absorption substrate, a substrate showing a maximum transmittance in the range of 10% to 45% within the range of 700 nm to 800 nm can be used. The maximum transmittance may be in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more or 28% or more and / or 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less or 29% or less in other examples.

[0118] As the infrared absorption substrate, a substrate showing an average transmittance in the range of 3% to 20% within the range of 800 nm to 1000 nm can be used. The average transmittance can be further adjusted in the range of 5% or more, 7% or more, 9% or more or 11% or more and / or 18% or less, 16% or less, 14% or less or 12% or less in other examples.

[0119] As the infrared absorption substrate, a substrate showing a maximum transmittance in the range of 5% to 30% within the range of 800 nm to 1000 nm can be used. The maximum transmittance may be in the range of 7% or more, 9% or more, 11% or more, 13% or more or 15% or more and / or 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less or 16% or less in other examples.

[0120] As the infrared absorption substrate, a substrate showing an average transmittance in the range of 10% to 50% within the range of 1000 nm to 1200 nm can be applied. The average transmittance can be further adjusted within the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, or 25% or more and / or within the range of 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, 36% or less, 34% or less, 32% or less, 30% or less, 28% or less, or 26% or less in other examples.

[0121] As the infrared absorption substrate, a substrate showing a maximum transmittance in the range of 10% to 70% within the range of 1000 nm to 1200 nm can be used. The maximum transmittance can be within the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, 28% or more, 30% or more, 32% or more, 34% or more, or 36% or more and / or within the range of 68% or less, 66% or less, 64% or less, 62% or less, 60% or less, 58% or less, 56% or less, 54% or less, 52% or less, 50% or less, 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, or 37% or less in other examples.

[0122] The infrared absorption substrate with the above characteristics can form the target optical filter in combination with the absorption film of the present disclosure.

[0123] As such a substrate, a substrate known as so-called infrared absorption glass can be used. Such glass is an absorption-type glass produced by adding CuO or the like to phosphate fluoride glass, phosphate glass, or the like. Therefore, in one example, in the present disclosure, a CuO-containing phosphate fluoride glass substrate or a CuO-containing phosphate glass substrate may be used as the infrared absorption substrate. In the phosphate glass, a part of the glass skeleton is SiO 2Phosphate silicate glass composed of such is also included. Such absorption-type glass is well-known, and for example, glass disclosed in Korean Registered Patent No. 10-2056613 and other commercially available absorption-type glass (for example, commercially available products from Hoya, Schott, PTOT, etc.) can be used.

[0124] Such an infrared absorption substrate contains copper. In the present disclosure, a substrate with a copper content in the range of 1% by weight to 7% by weight can be used. The copper content may be, in other examples, about 1.5% by weight or more, 2% by weight or more, 2.5% by weight or more, 2.6% by weight or more, 2.7% by weight or more, or 2.8% by weight or more, or about 6.5% by weight or less, 6% by weight or less, 5.5% by weight or less, 5% by weight or less, 4.5% by weight or less, 4% by weight or less, 3.5% by weight or less, 3% by weight or less, or 2.9% by weight or less. A substrate having such a copper content is likely to exhibit the above-described optical properties and can form an optical filter with desired properties in combination with the absorption film.

[0125] The copper content can be confirmed using an X-ray fluorescence analysis (WD XRF, Wavelength Dispersive X-Ray Fluorescence Spectrometry) device. When irradiating a test piece (substrate layer) with X-rays using an X-ray fluorescence analysis device, characteristic secondary X-rays are generated from each element of the test piece, and the device detects the secondary X-rays according to the wavelength of each element. The intensity of the secondary X-rays is proportional to the element content, and thus, quantitative analysis can be performed through the intensity of the secondary X-rays measured according to the wavelength of each element.

[0126] The thickness of the infrared absorption substrate can be adjusted, for example, within the range of about 0.03 mm to 5 mm, but is not limited thereto.

[0127] The optical filter of the present disclosure can further include other known configurations necessary for the substrate layer and the absorption film.

[0128] For example, the aforementioned optical filter may further include a dielectric film. The optical filter may further include, for example, a so-called dielectric film on one or both sides of the substrate layer.

[0129] FIGS. 2 and 3 are illustrations of an optical filter with a dielectric film added, showing a case where the dielectric film 300 is formed on one or both sides of a laminated structure including a substrate layer 100 and an absorption film 200.

[0130] Such a dielectric film is a film formed by repeatedly laminating a low refractive index dielectric material and a high refractive index dielectric material, and is used to form a so-called IR reflection layer and an AR (Anti-reflection) layer. In the present disclosure, such a dielectric film for forming a known IR reflection layer or AR layer can also be applied.

[0131] Therefore, the dielectric film may be a multilayer structure including at least two sub-layers having different refractive indices from each other, or may include a multilayer structure in which two sub-layers are repeatedly laminated.

[0132] The material for forming the dielectric film, that is, the type of material for forming each sub-layer, is not particularly limited, and known materials can be applied. Usually, for the production of the low refractive index sub-layer, SiO 2 or Na 5 Al 3 F1 4 、Na 3 AlF 6 or MgF 2 etc. are applied, and for the production of the high refractive index sub-layer, amorphous silicon, TiO 2 、Ta 2 O 5 、Nb 2 O 5 、ZnS or ZnSe etc. can be applied, but the materials applied in the present disclosure are not limited to the above.

[0133] The method for forming the dielectric film is not particularly limited, and for example, a known vapor deposition method can be applied for formation. Methods for controlling the reflection and transmission characteristics of the dielectric film in consideration of the vapor deposition thickness and the number of layers of the sublayer are known, and in the present disclosure, the dielectric film can be formed by such known methods.

[0134] In one example, the dielectric film included in the optical filter of the present disclosure has a shortest wavelength showing a reflectance of 50% within the wavelength range of 600 nm to 900 nm of 710 nm or more, or the shortest wavelength may not exist. When the shortest wavelength does not exist, the maximum reflectance of the dielectric film in the wavelength range of 600 nm to 900 nm is less than 50%. When it exists, the shortest wavelength showing a reflectance of 50% is 715 nm or more, 720 nm or more, 725 nm or more, 730 nm or more, 735 nm or more, 740 nm or more, 745 nm or more, 750 nm or more, or 754 nm or more in other examples, or may be about 900 nm or less, 850 nm or less, 800 nm or less, 790 nm or less, 780 nm or less, 770 nm or less, or 760 nm or less. The shortest wavelength showing a reflectance of 50% may be within the range of any one of the lower limits described above and the upper limit, and in this case, the upper limit may be 900 nm.

[0135] By controlling the reflection characteristics of the dielectric film, so-called petal flare phenomenon can be prevented. The petal flare phenomenon means a phenomenon in which a red line or the like that was not visually observed when photographing a light emitter or the like is captured in the photograph, and the red line often takes a shape like a petal with respect to the light emitter, and is called petal flare. The occurrence frequency of the above petal flare has increased by increasing the sensitivity of the sensor included in the imaging device and increasing the transmittance of an optical filter or the like to obtain a clearer photograph.

[0136] One of the causes of the petal flare phenomenon is considered to be the repeated reflection of near-infrared light within the imaging device equipped with the optical filter. Usually, among the dielectric films formed on the optical filter, especially the so-called IR film is formed to block the light in the near-infrared region by reflection. Therefore, the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is formed near the visible light, which is usually less than 710 nm. However, the reflection of near-infrared light within the imaging device is accelerated by such a dielectric film, thereby causing the petal flare phenomenon. Nevertheless, if the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is adjusted to 710 nm or more, the infrared light blocking efficiency of the optical filter decreases.

[0137] However, in the present disclosure, through the application of the absorption film described above, even when the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is adjusted to 710 nm or more, infrared light can be effectively blocked, and the petal flare phenomenon can also be prevented. Note that the design method for adjusting the reflection characteristics of the dielectric film is known.

[0138] The optical filter may further include an absorption film (hereinafter referred to as an ultraviolet absorption film) that exhibits absorption characteristics with respect to ultraviolet rays as an absorption film that is distinguished from the absorption film described above. However, such an ultraviolet absorption film is not an essential component. For example, an ultraviolet absorber can also be introduced into one absorption film together with the compounds of Chemical Formula 1 and Chemical Formula 2 described later.

[0139] In one example, the ultraviolet absorption film can be designed to exhibit an absorption maximum in the wavelength range of about 300 nm to 390 nm.

[0140] The ultraviolet absorption film can contain only an ultraviolet absorber, or can contain two or more ultraviolet absorbers as necessary.

[0141] For example, as the ultraviolet absorber, known absorbers that exhibit an absorption maximum in the wavelength range of approximately 300 nm to 390 nm can be applied. Examples thereof include ABS 407 from Exiton; UV381A, UV381B, UV382A, UV386A, VIS404A from QCR Solutions Corp; ADA1225, ADA3209, ADA3216, ADA3217, ADA3218, ADA3230, ADA5205, ADA3217, ADA2055, ADA6798, ADA3102, ADA3204, ADA3210, ADA2041, ADA3201, ADA3202, ADA3215, ADA3219, ADA3225, ADA3232, ADA4160, ADA5278, ADA5762, ADA6826, ADA7226, ADA4634, ADA3213, ADA3227, ADA5922, ADA5950, ADA6752, ADA7130, ADA8212, ADA2984, ADA2999, ADA3220, ADA3228, ADA3235, ADA3240, ADA3211, ADA3221, ADA5220, ADA7158 from H.W.Sands; DLS381B, DLS381C, DLS382A, DLS386A, DLS404A, DLS405A, DLS405C, DLS403A from CRYSTALYN, etc. However, it is not limited thereto.

[0142] The materials and the forming method for constituting such an ultraviolet absorption film are not particularly limited, and known materials and forming methods can be applied.

[0143] Generally, the ultraviolet absorption film is formed using a material in which an ultraviolet absorber is blended with a transparent resin so as to be able to exhibit the target absorption maximum. At this time, as the transparent resin, the resin component applicable to the absorber composition can be applied.

[0144] In addition to the above-described layers, the optical filter can have various necessary layers added within a range that does not impair the intended effect.

[0145] The present disclosure also relates to an imaging device including the aforementioned optical filter. At this time, the method of configuring the imaging device and the method of applying the optical filter are not particularly limited, and known configurations and application methods can be applied.

[0146] In addition, the use of the optical filter of the present disclosure is not limited to imaging devices, and it can be applied to various other applications that require near-infrared cut (for example, display devices such as PDPs, etc.).

[0147] The present disclosure also relates to an infrared sensor including the aforementioned absorption film. The configuration of the infrared sensor is not particularly limited as long as the absorption film of the present disclosure is included. For example, the absorption film of the present disclosure can be introduced into a known motion sensor, proximity sensor, or gesture sensor for configuration.

[0148] In addition, the use of the absorbent composition or absorption film of the present disclosure is not limited to optical filters, infrared sensors, and / or imaging devices, and it can be applied to various other applications that require infrared cut (for example, display devices such as PDPs, etc.).

Advantages of the Invention

[0149] The present disclosure can provide an absorbent composition and its uses. In the present disclosure, an absorbent composition containing two or more absorbents can be provided, which exhibits excellent compatibility and solubility with various solvents and resin components.

[0150] The present disclosure can apply the absorbent composition to ensure desired optical properties.

[0151] The present disclosure also aims to provide uses of the absorbent composition, and for example, an absorption film, an optical filter, a solid-state imaging device, and / or an infrared sensor formed using the absorbent composition can be provided.

Brief Description of the Drawings

[0152]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0153] Hereinafter, the optical filter of the present disclosure will be specifically described based on examples, but the scope of the optical filter of the present disclosure is not limited by the following examples.

[0154] <1. Evaluation of Transmittance Spectrum> The transmittance spectrum was measured using a spectrophotometer (manufacturer: PerkinElmer, product name: Lambda 750 spectrophotometer) for a test piece obtained by cutting a measurement target (for example, an absorption film) so that the horizontal and vertical sides were 10 mm and 10 mm, respectively. The transmittance spectrum was measured for each wavelength and each incident angle. The test piece was placed on a straight line between the measurement beam and the detector of the spectrophotometer, and the transmittance spectrum was measured while changing the incident angle of the measurement beam from 0 degrees to 40 degrees. Unless otherwise specified, the results of the transmittance spectrum in this example are the results when the incident angle is 0 degrees. An incident angle of 0 degrees is a direction substantially parallel to the surface normal direction of the test piece.

[0155] The average transmittance within a predetermined wavelength range in the transmittance spectrum is the result obtained by measuring the transmittance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength in the wavelength range and then obtaining the arithmetic mean of the measured transmittances. The maximum transmittance is the maximum transmittance among the transmittances measured while increasing the wavelength by 1 nm. For example, the average transmittance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm, and the maximum transmittance within the wavelength range of 350 nm to 360 nm is the highest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0156] <2.Mass spectrometry> Mass spectrometry of the synthesized compound was performed using a liquid chromatograph / mass spectrometer (Thermo Finnigan).

[0157] (Synthesis Example 1. Preparation of Compound (A1)) The compound of Chemical Formula A1 was synthesized through the process of the following Reaction Formula 1.

[0158] [Reaction Formula 1] [Chemical Formula]

[0159] 4.1 g of Compound A1 in Reaction Formula 1, 2.24 g of squaric acid, and 8.7 g of tetraethyl orthoformate were dissolved in 100 mL of n-butanol and reacted at 95°C for about 4 hours. After completion of the reaction, it was cooled to room temperature (about 25°C), 300 mL of ethanol was added, and after stirring for 6 hours or more, the precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target product (compound of Chemical Formula A1) (7.4 g, 51%).

[0160] The Mass spectrometry results for the synthesized target compound (the compound of Chemical Formula A1) are as follows. <Mass spectrometry results> LC-MS m / z 739.7[M+H] +

[0161] (Synthesis Example 2. Production of Compound (A2)) The compound of Chemical Formula A2 was synthesized through the process of Reaction Formula 2 below.

[0162] [Reaction Formula 2]

Chemical formula

[0163] 14.1 g of Compound B14, 2.24 g of squaric acid, and 8.7 g of tetraethyl orthoformate in Reaction Formula 2 were dissolved in 100 mL of n-butanol and reacted at 95 °C for about 4 hours. After the reaction was completed, it was cooled to room temperature (about 25 °C), 300 mL of ethanol was added, and after stirring for 6 hours or more, the precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target product (the compound of Chemical Formula A2) (6.1 g, 39%).

[0164] The Mass spectrometry results for the synthesized target compound (the compound of Chemical Formula A2) are as follows. <Mass spectrometry results> LC-MS m / z 795.7[M+H] +

[0165] (Synthesis Example 3. Production of Compound A3) The compound of Chemical Formula A3 was synthesized through the process of Reaction Formula 3 below.

[0166] [Reaction Formula 3]

Chemical formula

[0167] 17.5 g of compound C17 in Reaction Formula 3, 2.5 g of squaric acid, and 9.8 g of tetraethyl orthoformate were dissolved in 100 mL of n-butanol and reacted at 95 °C for about 4 hours. After completion of the reaction, the mixture was cooled to room temperature (about 25 °C), 300 mL of ethanol was added, and the mixture was stirred for 6 hours or more. Then, the precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target compound (compound of Chemical Formula A3) (6.9 g, 36%).

[0168] The Mass spectrometry results for the synthesized target compound (compound of Chemical Formula A3) are as follows. <Mass spectrometry results> LC-MS m / z 876.1 [M+H] +

[0169] (Synthesis Example 4. Production of compound (A4)) The compound of Chemical Formula A4 was synthesized through the process of the following Reaction Formula 4.

[0170] [Reaction Formula 4]

Chemical formula

[0171] 14 g of compound D14 in Reaction Formula 4, 2.5 g of squaric acid, and 9.3 g of tetraethyl orthoformate were dissolved in 100 mL of n-butanol and reacted at 95 °C for about 4 hours. After completion of the reaction, the mixture was cooled to room temperature (about 25 °C), 300 mL of ethanol was added, and the mixture was stirred for 6 hours or more. Then, the precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target compound (compound of Chemical Formula A4) (6.8 g, 45%).

[0172] The Mass spectrometry results for the above synthesized target compound (compound of Chemical Formula A4) are as follows. <Mass spectrometry results> LC-MS m / z 687.5 [M+H] +

[0173] (Synthesis Example 5. Production of Compound (A5)) The compound of Chemical Formula A5 was synthesized through the process of Reaction Scheme 5 below.

[0174] [Reaction Scheme 5]

Chemical Structure

[0175] 15.3 g of Compound E15 in Reaction Scheme 5, 2.5 g of squaric acid, and 9.8 g of tetraethyl orthoformate are dissolved in 100 mL of n-butanol and reacted at 95°C for about 4 hours. After completion of the reaction, it is cooled to room temperature (about 25°C), 300 mL of ethanol is added, and after stirring for 6 hours or more, the precipitated solid is passed through ethanol and filtered under reduced pressure to obtain the target product (Compound of Chemical Formula A5) (7.2 g, 44%).

[0176] The Mass analysis results for the synthesized target compound (Compound of Chemical Formula A5) are as follows. <Mass Analysis Results> LC-MS m / z 743.6 [M+H] +

[0177] (Synthesis Example 6. Production of Compound (A6)) The compound of Chemical Formula A6 was synthesized through the process of Reaction Scheme 6 below.

[0178] [Reaction Scheme 6]

Chemical Structure

[0179] Dissolve 10.7 g of the compound of Reaction Formula 6, 2.5 g of squaric acid, and 9.3 g of tetraethyl orthoformate in 100 mL of n-butanol, and react at 95 °C for about 4 hours. After the reaction is completed, cool to room temperature (about 25 °C), add 300 mL of ethanol, stir for 6 hours or more, and then pass the precipitated solid through ethanol and filter under reduced pressure to obtain the target product (Compound of Chemical Formula A6) (5.7 g, 48%).

[0180] The Mass spectrometry results for the synthesized target compound (Compound of Chemical Formula A6) are as follows. <Mass spectrometry results> LC-MS m / z 543.4[M+H] +

[0181] (Synthesis Example 7. Production of Compound (B1)) The compound of Chemical Formula B1 was synthesized through the process of the following Reaction Formula 7.

[0182] [Reaction Formula 7]

Chemical formula

[0183] Dissolve 10.1 g of the compound of Reaction Formula 7, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate in 100 mL of n-butanol, and react at 95 °C for 4 hours. After the reaction, cool to room temperature (about 25 °C), add 300 mL of ethanol, stir for 6 hours or more, and then pass the precipitated solid through ethanol and filter under reduced pressure to obtain the target product (Compound of Chemical Formula B1) (6.8 g, 58%).

[0184] The Mass spectrometry results for the synthesized target compound (Compound of Chemical Formula B1) are as follows. <Mass spectrometry results> LC-MS m / z 665.8 [M+H] +

[0185] (Synthesis Example 8. Production of Compound (B2)) The compound of Chemical Formula B2 was synthesized through the process of Reaction Formula 8 below.

[0186] [Reaction Formula 8] [Chemical Formula]

[0187] 8.9 g of Compound H8 in Reaction Formula 8, 2.0 g of squaric acid, and 7.5 g of tetraethyl orthoformate are dissolved in 100 mL of n-butanol and reacted at 95°C for 4 hours. After the reaction, it is cooled to room temperature (about 25°C), 300 mL of ethanol is added, and after stirring for 6 hours or more, the precipitated solid is passed through ethanol and filtered under reduced pressure to obtain the target product (compound of Chemical Formula B2) (5.9 g, 55%).

[0188] The Mass spectrometry results for the synthesized target compound (compound of Chemical Formula B2) are as follows. [Mass spectrometry results] LC-MS m / z 641.5 [M+H] +

[0189] (Synthesis Example 9. Production of Compound (B3)) The compound of Chemical Formula B3 was synthesized through the process of Reaction Formula 9 below.

[0190] [Reaction Formula 9] [Chemical Formula]

[0191] 8.8 g of Compound I of Reaction Formula 9, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate are dissolved in 100 mL of n-butanol and reacted at 95 °C for 4 hours. After the reaction, it is cooled to room temperature (about 25 °C), 300 mL of ethanol is added, and after stirring for 6 hours or more, the precipitated solid is passed through ethanol and filtered under reduced pressure to obtain the target product (Compound of Chemical Formula B3) (5.4 g, 51%).

[0192] The Mass spectrometry results for the synthesized target compound (Compound of Chemical Formula B3) are as follows. <Mass spectrometry results> LC-MS m / z 609.2[M+H] +

[0193] (Synthesis Example 10. Production of Compound (B4)) The compound of Chemical Formula B4 was synthesized through the process of the following Reaction Formula 10.

[0194] [Reaction Formula 10]

Chemical formula

[0195] 10.3 g of Compound J of Reaction Formula 10, 2.0 g of squaric acid, and 8.5 g of tetraethyl orthoformate are dissolved in 100 mL of n-butanol and reacted at 95 °C for 4 hours. After the reaction, it is cooled to room temperature (about 25 °C), 300 mL of ethanol is added, and after stirring for 6 hours or more, the precipitated solid is passed through ethanol and filtered under reduced pressure to obtain the target product (Compound of Chemical Formula B4) (3.6 g, 31%).

[0196] The Mass spectrometry results for the above synthesized target compound (Compound of Chemical Formula B4) are as follows. <Mass spectrometry results> LC-MS m / z 665.4 [M+H] +

[0197] (Synthesis Example 11. Production of Compound (B5)) The compound of Chemical Formula B5 was synthesized through the process of Reaction Scheme 11 below.

[0198] [Reaction Scheme 11]

Chemical Structure

[0199] Dissolve 9.3 g of Compound K9, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate in 100 mL of n-butanol, and react at 95 °C for 4 hours. After the reaction, cool to room temperature (about 25 °C), add 300 mL of ethanol, stir for 6 hours or more, and then pass the precipitated solid through ethanol and filter under reduced pressure to obtain the target product (compound of Chemical Formula B5) (5.7 g, 53%).

[0200] The Mass spectrometry results for the synthesized target compound (compound of Chemical Formula B5) are as follows. <Mass spectrometry results> LC-MS m / z 636.4 [M+H] +

[0201] (Synthesis Example 12. Production of Compound (B6)) The compound of Chemical Formula B6 was synthesized through the process of Reaction Scheme 12 below. [Reaction Scheme 12]

Chemical Structure

[0202] Dissolve 8.9 g of compound L in Reaction Formula 12, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate in 100 mL of n-butanol, and react at 95 °C for 4 hours. After the reaction, cool to room temperature (about 25 °C), add 300 mL of ethanol, stir for 6 hours or more, and then pass the precipitated solid through ethanol and filter under reduced pressure to obtain the target product (compound of Chemical Formula B6) (5.6 g, 52%).

[0203] The Mass spectrometry results for the synthesized target compound (compound of Chemical Formula B6) are as follows. <Mass spectrometry results> LC-MS m / z 612.3[M+H] +

[0204] (Synthesis Example 13. Production of Compound (B7)) The compound of Chemical Formula B7 was synthesized through the process of the following Reaction Formula 13.

[0205] [Reaction Formula 13]

Chemical formula

[0206] Dissolve 7.8 g of compound M in Reaction Formula 13, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate in 100 mL of n-butanol, and react at 95 °C for 4 hours. After the reaction, cool to room temperature (about 25 °C), add 300 mL of ethanol, stir for 6 hours or more, and then pass the precipitated solid through ethanol and filter under reduced pressure to obtain the target product (compound of Chemical Formula B7) (4.5 g, 49%).

[0207] The Mass spectrometry results for the synthesized target compound (compound of Chemical Formula B7) are as follows. <Mass spectrometry results> LC-MS m / z 525.6 [M+H] +

[0208] (Synthesis Example 14. Production of Compound (B8)) The compound of Chemical Formula B8 was synthesized through the process of Reaction Formula 14 below.

[0209] [Reaction Formula 14] [Chemical Formula]

[0210] 7.8 g of Compound N7 in Reaction Formula 14, 2.0 g of squaric acid, and 7.8 g of tetraethyl orthoformate are dissolved in 100 mL of n-butanol and reacted at 95°C for 4 hours. After the reaction, it is cooled to room temperature (about 25°C), 300 mL of ethanol is added, and after stirring for 6 hours or more, the precipitated solid is passed through ethanol and filtered under reduced pressure to obtain the target product (compound of Chemical Formula B8) (3.9 g, 42%).

[0211] The Mass analysis results for the synthesized target compound (compound of Chemical Formula B8) are as follows. [Mass analysis results] LC-MS m / z 525.5 [M+H] +

[0212] The solubility of each synthesized compound was evaluated. The solubility was evaluated based on the solubility of each compound in a plurality of solvents (cyclohexanone, toluene, methyl isobutyl ketone (MIBK), or methyl ethyl ketone (MEK)) at room temperature (about 25°C) and judged according to the following criteria. [Solubility judgment criteria] A: When the solubility is 1 mass% or more B: When the solubility is 0.5 mass% or more and less than 1 mass% C: When the solubility is 0.2 mass% or more and less than 0.5 mass% D: When the solubility is less than 0.2 mass%

[0213] The evaluation results of solubility were organized and described in Table 1 below.

[0214]

Table 1

[0215] (Example 1) An absorbent composition was produced by dispersing the compound of Synthesis Example 1 (chemical formula A1) and the compound of Synthesis Example 7 (chemical formula B1) in a mixture containing a solvent and a resin component at a weight ratio of about 55:40 (A1:B1). In the above process, the dispersion was carried out such that the total weight of the compound of Synthesis Example 1 and the compound of Synthesis Example 7 was about 7 parts by weight with respect to 100 parts by weight of the resin component.

[0216] As the mixture of the resin component and the solvent, a mixture in which an acrylic resin (PMMA (polymethylmethacrylate)) of LG Chem is dispersed in methyl isobutyl ketone (MIBK) at a concentration of about 15% by weight (Example 1-1), a mixture in which a silicone resin (Dow) is dispersed in cyclohexanone at a concentration of about 15% by weight (Example 1-2), or a mixture in which a cyclic olefin resin (TOPAS) is dispersed in cyclohexanone at a concentration of about 15% by weight (Example 1-3) was applied.

[0217] (Example 2) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 2 (chemical formula A2) was used instead of the compound of Synthesis Example 1. As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 2-1), a mixture of silicone resin and cyclohexanone (Example 2-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 2-3) was applied.

[0218] (Example 3) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 8 (chemical formula B2) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 3-1), a mixture of silicone resin and cyclohexanone (Example 3-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 3-3) was applied.

[0219] (Example 4) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 2 (chemical formula A2) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 9 (chemical formula B3) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 4-1), a mixture of silicone resin and cyclohexanone (Example 4-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 4-3) was applied.

[0220] (Example 5) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 4 (chemical formula A4) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 10 (chemical formula B4) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 5-1), a mixture of silicone resin and cyclohexanone (Example 5-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 5-3) was applied.

[0221] (Example 6) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 5 (chemical formula A5) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 11 (chemical formula B5) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 6-1), a mixture of silicone resin and cyclohexanone (Example 6-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 6-3) was applied.

[0222] (Example 7) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 5 (chemical formula A5) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 8 (chemical formula B2) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 7-1), a mixture of silicone resin and cyclohexanone (Example 7-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 7-3) was applied.

[0223] (Example 8) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 5 (chemical formula A5) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 12 (chemical formula B6) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 8-1), a mixture of silicone resin and cyclohexanone (Example 8-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 8-3) was applied.

[0224] (Example 9) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 5 (chemical formula A5) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 9 (chemical formula B3) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Example 9-1), a mixture of silicone resin and cyclohexanone (Example 9-2), or a mixture of cyclic olefin resin and cyclohexanone (Example 9-3) was applied.

[0225] (Comparative Example 1) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 5 (chemical formula A5) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 13 (chemical formula B7) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Comparative Example 1-1), a mixture of silicone resin and cyclohexanone (Comparative Example 1-2), or a mixture of cyclic olefin resin and cyclohexanone (Comparative Example 1-3) was applied.

[0226] (Comparative Example 2) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 6 (chemical formula A6) was used instead of the compound of Synthesis Example 1 (chemical formula A1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Comparative Example 2-1), a mixture of silicone resin and cyclohexanone (Comparative Example 2-2), or a mixture of cyclic olefin resin and cyclohexanone (Comparative Example 2-3) was applied.

[0227] (Comparative Example 3) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 6 (chemical formula A6) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 8 (chemical formula B2) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Comparative Example 3-1), a mixture of silicone resin and cyclohexanone (Comparative Example 3-2), or a mixture of cyclic olefin resin and cyclohexanone (Comparative Example 3-3) was applied.

[0228] (Comparative Example 4) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 6 (chemical formula A6) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 13 (chemical formula B7) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Comparative Example 4-1), a mixture of silicone resin and cyclohexanone (Comparative Example 4-2), or a mixture of cyclic olefin resin and cyclohexanone (Comparative Example 4-3) was applied.

[0229] (Comparative Example 5) An absorbent composition was produced in the same manner as in Example 1, except that the compound of Synthesis Example 6 (chemical formula A6) was used instead of the compound of Synthesis Example 1 (chemical formula A1), and the compound of Synthesis Example 14 (chemical formula B8) was used instead of the compound of Synthesis Example 7 (chemical formula B1). As the mixture of the resin component and the solvent, the same mixture of acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) as in Example 1 (Comparative Example 5-1), a mixture of silicone resin and cyclohexanone (Comparative Example 5-2), or a mixture of cyclic olefin resin and cyclohexanone (Comparative Example 5-3) was applied.

[0230] The solubility of each absorbent composition of the examples and comparative examples was evaluated. The solubility was evaluated according to the following criteria while injecting each absorbent composition using a syringe filter with a filter size of about 1 μm at room temperature (about 25°C). <Criteria for Solubility> A: When the absorbent composition passes well through the filter without clogging during injection with the syringe filter B: When the absorbent composition passes through the filter during injection with the syringe filter, but the passing rate is significantly slowed down due to clogging C: When the absorbent composition does not pass through the filter during injection with the syringe filter

[0231] The evaluation results were organized and described in Table 2 below. In Table 2, Condition 1 is the case where a mixture of an acrylic resin (PMMA (polymethylmethacrylate)) and methyl isobutyl ketone (MIBK) was used as the mixture of the resin component and the solvent of the absorbent composition, Condition 2 is the case where a mixture of a silicone resin and cyclohexanone was used, and Condition 3 is the case where a mixture of a cyclic olefin resin and cyclohexanone was applied.

[0232]

Table 2

[0233] (Example 10) A cyclic olefin resin (COP, Cycloolefin polymer), the compound of Synthesis Example 1 (Chemical Formula A1), the compound of Synthesis Example 7 (B1), and a solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.055:0.04:10 (COP:A1:B1:cyclohexanone) and stirred for 12 hours or more to produce an absorbent composition. As a result of evaluating the solubility of this composition in the same manner as described above, the evaluation result was A (when injecting with a syringe filter, the absorbent composition passed well through the filter without clogging).

[0234] The absorbent composition was spin-coated onto a transparent substrate (SCHOTT) with substantially no light absorption and reflection, and heat-treated at a temperature of about 130 °C for about 2 hours to form an absorption film with a thickness of about 3 μm.

[0235] Figure 4 is a diagram showing the results of evaluating the transmittance of the manufactured absorption film.

[0236] (Example 11) Silicone resin, the compound of Synthesis Example 2 (chemical formula A2), the compound of Synthesis Example 9 (B3), and a solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.055:0.04:10 (COP:A2:B3:cyclohexanone), and stirred for 12 hours or more to produce an absorbent composition. As a result of evaluating the solubility of this composition in the same manner as the above-described method, the evaluation result was A (when injecting through a syringe filter, the absorbent composition passed well without clogging the filter).

[0237] An absorption film was formed in the same manner as in Example 10 using the manufactured absorbent composition.

[0238] Figure 5 is a diagram showing the results of evaluating the transmittance of the absorption film as described above.

[0239] (Comparative Example 6) Silicone resin, the compound of Synthesis Example 5 (chemical formula A5), the compound of Synthesis Example 13 (B7), and a solvent (cyclohexanone) were mixed at a weight ratio of 1.5:0.055:0.04:10 (COP:A4:B7:cyclohexanone), and stirred for 12 hours or more to produce an absorbent composition. As a result of evaluating the solubility of this composition in the same manner as the above-described method, the evaluation result was B (when injecting through a syringe filter, the absorbent composition passed through the filter, but the passing speed was significantly slowed down due to the clogging phenomenon).

[0240] An absorption film was formed in the same manner as in Example 10 using the manufactured absorbent composition.

[0241] FIG. 6 is a diagram showing the results of evaluating the transmittance of the manufactured absorption film.

[0242] The absorption characteristics in the wavelength range of 600 nm to 900 nm were evaluated for the absorption films of Example 10, Example 11, and Comparative Example 6, and the results were tabulated in Table 3 below. In Table 3, T50% cut on is the shortest wavelength showing a transmittance of 50% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum, and T50% cut off is the longest wavelength showing a transmittance of 50% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum. In Table 3, T20% cut on is the shortest wavelength showing a transmittance of 20% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum, and T20% cut off is the longest wavelength showing a transmittance of 20% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum. In Table 3, T MIN is the minimum transmittance confirmed in the wavelength range of 600 nm to 900 nm, and T AVG is the average transmittance in the wavelength range of 600 nm to 900 nm.

[0243]

Table 3

Explanation of Symbols

[0244] 100: Substrate layer 200: Absorption film 300: Dielectric film

Claims

1. The compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 are included, An absorbent composition that satisfies conditions 1 and 3. [Chemical formula 1] 【Chemistry 1】 [Chemical formula 2] 【Chemistry 2】 (In the above Chemical Formula 1, R １１ and R １２ are each independently an alkyl group or an alkoxyalkyl group; R ５１ and R ５２ are each independently an alkyl group, a haloalkyl group, or an alkoxy group; R ２１ and R 24 are each independently a methyl group or an ethyl group; R ２２ , R ２３ , R ２５ and R ２６ are each independently a methyl group; R ３１ , R ３２ , R ４１ and R ４２ are each independently hydrogen; In the above Chemical Formula 2, R ７１ and R ７２ are each independently an alkyl group or an alkoxyalkyl group; R ６１ ~R ６４ are each independently a methyl group; A １ , B １ , A ２ and B ２ are each independently a benzene structure or absent, The condition 1 is R １１ , R １２ , R ５１ , R ５２ , R ２１ , R ２２ , R ２３ , R ２４ , R ２５ , R ２６ , R ３１ , R ３２ , R ４１ and R ４２ The total number of carbon atoms is 16 or more and 28 or less, The condition 3 is that in the chemical formula 2, R ６１ , R ６２ , R ６３ , R ６４ , R ７１ and R ７２ The total number of carbon atoms is 10 or more and 16 or less.

2. In the above formula 1, R １１ R of carbon number C11 １２ The absorbent composition according to claim 1, wherein the ratio of carbon number C12 to carbon number C12 is 1.

3. In the above formula 1, R ５１ Carbon number C51 R ５２ The absorbent composition according to claim 1, wherein the ratio of carbon number of C52 to carbon number of C52 is 1.

4. In the above Chemical Formula 2, A １ and B １ Any one of the groups is a benzene structure, and the other group is absent. ２ and B ２ The absorbent composition according to claim 1 , wherein one of the above is a benzene structure and the other is absent.

5. The absorbent composition described in claim 1, wherein the chemical formula 1 is any one of the following chemical formulas 1-1 to 1-5. [Chemical formula 1-1] 【Chemistry 3】 [Chemical formula 1-2] 【Chemistry 4】 [Chemical formula 1-3] 【Chemistry 5】 [Chemical formula 1-4] 【Chemistry 6】 [Chemical formula 1-5] 【Chemistry 7】

6. The absorbent composition described in claim 5, wherein the chemical formula 2 is any one of the following chemical formulas 2-1 to 2-6. [Chemical formula 2-1] 【Chemistry 8】 [Chemical formula 2-2] 【Chemistry 9】 [Chemical formula 2-3] 【Chemistry 10】 [Chemical formula 2-4] 【Chemistry 11】 [Chemical formula 2-5] 【Chemistry 12】 [Chemical formula 2-6] 【Chemistry 13】

7. 2. The absorbent composition of claim 1, comprising 1 to 500 parts by weight of the compound represented by Chemical Formula 2 relative to 100 parts by weight of the compound represented by Chemical Formula 1.

8. The absorbent composition of claim 1, further comprising one or more resin components selected from the group consisting of cycloolefin (COP)-based resins, polyarylate resins and silicone resins.

9. The absorbent composition of claim 1 further comprising a solvent.

10. One or more resin components selected from the group consisting of cycloolefin (COP)-based resins, polyarylate resins, and silicone resins; An absorbing film comprising a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2. [Chemical formula 1] 【Chemistry 14】 [Chemical formula 2] 【Chemistry 15】 (In the above Chemical Formula 1, R １１ and R １２ are each independently an alkyl group or an alkoxyalkyl group; R ５１ and R ５２ are each independently an alkyl group, a haloalkyl group, or an alkoxy group; R ２１ and R 24 are each independently a methyl group or an ethyl group; R ２２ , R ２３ , R ２５ and R ２６ are each independently a methyl group; R ３１ , R ３２ , R ４１ and R ４２ are each independently hydrogen; In the above Chemical Formula 2, R ７１ and R ７２ are each independently an alkyl group or an alkoxyalkyl group; R ６１ ~R ６４ are each independently a methyl group; A １ , B １ , A ２ and B ２ are each independently a benzene structure or absent.)

11. The absorbing film described in claim 10, wherein the chemical formula 1 is any one of the following chemical formulas 1-1 to 1-5. [Chemical formula 1-1] 【Chemistry 16】 [Chemical formula 1-2] 【Chemistry 17】 [Chemical formula 1-3] 【Chemistry 18】 [Chemical formula 1-4] 【Chemistry 19】 [Chemical formula 1-5] 【Chemistry 20】

12. The absorbing film described in claim 11, wherein the chemical formula 2 is any one of the following chemical formulas 2-1 to 2-6. [Chemical formula 2-1] 【Chemistry 21】 [Chemical formula 2-2] 【Chemical 22】 [Chemical formula 2-3] 【Chemistry 23】 [Chemical formula 2-4] 【Chemistry 24】 [Chemical formula 2-5] 【Chemistry 25】 [Chemical formula 2-6] 【Chemistry 26】

13. The absorbing film according to claim 10, which exhibits an absorption band having a bandwidth of 60 nm or more in the wavelength range of 600 nm to 900 nm.

14. The absorbing film according to claim 10, wherein the T50% Cut on wavelength is in the range of 600 nm to 800 nm.

15. The absorbing film according to claim 10, wherein the T50% Cut off wavelength is in the range of 700 nm to 900 nm.

16. The absorbing film according to claim 10, comprising 0.5 to 50 parts by weight of the compound represented by Chemical Formula 1 per 100 parts by weight of the resin component.

17. The absorbing film according to claim 10, comprising 0.5 to 50 parts by weight of the compound represented by the chemical formula 2 per 100 parts by weight of the resin component.

18. A base layer; An optical filter comprising: an absorbing film according to claim 10 formed on one or both surfaces of the base layer.

19. Further comprising a dielectric film; 20. The optical filter according to claim 18, wherein the dielectric film has a shortest wavelength at which it exhibits a reflectance of 50% within a wavelength range of 600 nm to 900 nm of 710 nm or more, or does not exist.

20. An imaging device comprising the optical filter of claim 18.

21. An infrared sensor comprising an absorbing film according to claim 10.

Images