Impact Indicator

Abstract

The impact indicator includes a microsensor having a mass element configured to move from a first position to a second position upon receiving an impact event. The microsensor has a detection circuit configured to change from a first state to a second state when the mass element moves from the first position to the second position. The detection circuit is prevented from returning to the first state upon changing to the second state. A radio frequency identification (RFID) module is coupled to the detection circuit and configured to output a value indicative of the mass element being in the second position. An activation element is configured to maintain the mass element in the first position until removed from the microsensor.

Description

Summary of the Invention

Problems to be Solved by the Invention

[0001] Many types of objects need to be monitored during manufacturing, storage, or transportation due to the sensitivity or fragility of the objects. For example, certain types of objects may be damaged when dropped or when subjected to a large impact. Therefore, for general monitoring of quality control and / or transportation conditions, it is desirable to determine and / or verify the environmental conditions to which the object has been exposed.

Means for Solving the Problems

[0002] According to one aspect of the present disclosure, a device and technique for shock detection are disclosed. The shock indicator includes a microsensor having a mass element configured to move from a first position to a second position upon receiving a shock event. The microsensor has a detection circuit configured to change from a first state to a second state in response to the movement of the mass element from the first position to the second position. The detection circuit is prevented from returning to the first state in response to a change to the second state. A radio frequency identification (RFID) module is coupled to the detection circuit and is configured to output a value indicating that the mass element is in the second position. The activation element is configured to maintain the mass element in the first position until removed from the microsensor.

[0003] According to another embodiment of the present disclosure, the shock indicator includes a substrate having a communication module inlay configured to communicate the operating state of the shock indicator. A microsensor is communicatively coupled to the communication module inlay to detect a collision event. The microsensor has an irreversible detection circuit configured to detect the operating state. The activation element is configured to maintain the microsensor in a non-responsive state until removed from the microsensor.

[0004] According to yet another embodiment of the present disclosure, the impact indicator includes a microsensor configured to activate upon receiving an impact event, and the microsensor has a detection circuit configured to change from a first state to a second state in response to the activation of the microsensor. The detection circuit is configured to prevent returning to the first state in response to activation. A radio frequency identification (RFID) module is coupled to the detection circuit and configured to output a value indicating that the microsensor has been activated. The activation element is configured to maintain the microsensor in a non-responsive state until removed from the microsensor.

Brief Description of the Drawings

[0005] Reference is made to the following description related to the accompanying drawings to more fully understand the present application, its objects, and advantages.

[0006]

Figure 1

Figure 2

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Figure 9A

Figure 9B

[0007] Embodiments of the present disclosure provide devices and techniques for detecting and indicating impacts. According to one embodiment, an impact indicator includes a microsensor having a mass element configured to move from a first position to a second position upon receiving an impact event. The microsensor has a detection circuit configured to change from a first state to a second state when the mass element moves from the first position to the second position. The detection circuit is prevented from returning to the first state when it changes to the second state. A radio frequency identification (RFID) module is coupled to the detection circuit and configured to output a value indicating that the mass element is in the second position. An activation element is configured to maintain the mass element in the first position until removed from the microsensor. Embodiments of the present disclosure enable detection of impact and / or acceleration events without using an internal power source. The RFID module can detect the state of a switch circuit and issue or output a value indicating the operating state of the impact indicator. For example, in one embodiment, an RFID reader can be used to activate the RFID module to determine the operating state of the impact indicator device. Further, in embodiments of the present invention, a microsensor (e.g., micro-mechanical components and / or microelectronic components) is used to detect an impact event or an acceleration event, and the microsensor has a circuit that causes irreversibility of the operating state of the indicator after detecting the impact event. Further, in embodiments of the present invention, on-site activation of the indicator (i.e., maintaining the indicator in a non-responsive state) is enabled so that an impact event detected prior to the intended application of the indicator does not cause the indicator to operate unintentionally.

[0008] Referring to the drawings, particularly FIG. 1, an exemplary view of an impact indicator 10 in which an illustrated embodiment of the present disclosure may be implemented is shown. In FIG. 1, the impact indicator 10 is a portable device configured to be secured to or disposed within a transport container 14 that includes an object for which related impact and / or acceleration events are monitored. In embodiments of the impact indicator 10, it is monitored whether the object has been subjected to an impact or a certain level of acceleration event during the manufacture, storage, use, and / or transport of the object. In certain embodiments, the impact indicator 10 may be secured to the transport container 14 using, for example, adhesives, permanent or temporary fasteners, or various different types of mounting devices. The transport container 14 may include a container in which the object to be monitored is loosely disposed, or may include the container / surface of the object itself. It should be recognized that FIG. 1 is merely exemplary and is not intended to claim or imply any limitation with respect to the environments in which various embodiments may be implemented.

[0009] FIG. 2 is a block diagram illustrating an embodiment of the indicator 10 in accordance with an embodiment of the present disclosure. In FIG. 2, the indicator 10 includes a microsensor 20 and a wireless communication module 22. The microsensor 20 is a microelectromechanical device and / or a microelectronic device for detecting impact / acceleration events (e.g., a micrometer-sized component having a general overall size typically measured in square millimeters, a fine device or system). The microsensor 20 may be configured as a microelectromechanical system (MEMS) device (e.g., using a process or technique of depositing material layers, patterning by photolithography, etching to manufacture the required shape / components, and using silicon or other materials), a device manufactured with a liquid crystal display (LCD) panel (e.g., a device manufactured using an LCD manufacturing process, e.g., patterning, laminating, masking, cutting, and thin film transistor (TFT) deposition techniques, using glass components and / or glass substrates that may or may not include liquid crystals), and / or may be formed using roll-to-roll (R2R) processing techniques (e.g., fabricating a device on a roll of flexible plastic, metal foil, or flexible glass).

[0010] In one embodiment, the microsensor 20 has a detection circuit 24. The detection circuit 24 may include one or more switch elements, traces, contacts, and / or circuits that respond to the detection of a change in the operating state of the sensor 20. For example, in one embodiment, the sensor 20 may have a movable element or movable member that moves or displaces when receiving an impact event. The displacement of the movable element may change the state of the detection circuit 24 (e.g., change the impedance, change from an open circuit state to a closed circuit state or vice versa). The wireless communication module 22 is configured to wirelessly communicate information related to the state of the detection circuit 24 that indicates the operating state of the indicator 10 (e.g., based on the open circuit state or closed circuit state of the detection circuit 24). For example, in one embodiment, the wireless communication module 22 has an RFID module 30. In one embodiment, the RFID module 30 has a passive RFID module 30 (e.g., a passive RFID tag) that has an RFID integrated circuit or RFID circuit 32 and a memory 34 together with an antenna 36 (e.g., arranged on a printed circuit board or as part of a printed circuit board). As a passive RFID module 30, the indicator 10 does not include a battery (e.g., is powered by an RFID reader 40), thereby forming a battery-less impact indicator 10. For example, when the RFID module 30 receives radio waves from the RFID reader 40, the antenna 36 forms a magnetic field to supply power to the RFID module 30 and energize the RFID circuit 32. When energized / activated, the RFID module 30 may output / transmit the encoded information in the memory 34. However, it should be understood that in one embodiment, the RFID module 30 may have an active RFID module 30 that includes a power source (e.g., a battery) configured to transmit or send certain information continuously, intermittently, and / or in response to a program trigger or an event trigger. One embodiment of a passive RFID tag is a roll-form flexible circuit RFID.In a flexible circuit RFID, the chip and the antenna are embedded in a thin substrate of 100-200 nm using, for example, polyvinyl chloride (PVC), polyethylene terephthalate (PET), phenols, polyester, styrene, or paper, by copper etching or hot stamping. One process of RFID manufacturing is screen printing using a conductive ink containing copper, nickel, or carbon. An example of a commercially available flexible circuit passive RFID tag product that can be in the hundreds or thousands per roll is the Smartrac (trademark) product of Avery Dennison Corporation.

[0011] It should be further understood that the wireless communication module 22 may be configured for other types of wireless communication types, modes, protocols, and / or formats (e.g., short message service (SMS), wireless data using general packet radio service (GPRS) / 3G / 4G, wireless data via the public Internet via Wi-Fi, or other wireless communication protocol standards such as Wi-Fi, Z-Wave, ZigBee, Bluetooth (registered trademark), Bluetooth Low Energy (BLE), LoRA, NB-IoT, SigFox, Digital Enhanced Cordless Telecommunications (DECT), or other general technologies for local use of wireless data). As further described below, the impact indicator 10 functions as a passive impact sensor / indicator that can be used as part of an electronic signal or circuit when receiving a collision / acceleration event of a specific level and / or magnitude. In certain embodiments, the impact detection performance / function of the impact indicator 10 of the present disclosure does not require power during the monitoring state.

[0012] In the illustrated embodiment, the memory 34 includes at least two different stored and / or encoded values 42 and 44. For example, the value 42 may correspond to a value output / sent by the RFID module 30 when the detection circuit 24 is in an open-circuit situation or state, and the value 44 may correspond to a value output / sent by the RFID module 30 when the detection circuit 24 is in a closed-circuit situation or state. As an example, the value 44 may represent an RFID tag identification (ID) number when the impact detection circuit 24 is not activated, and the ID number of the RFID tag may have an additional character (e.g., "0") at the end. The value 42 may represent an RFID identification (ID) number when the impact detection circuit 24 is activated, and the ID number of the RFID tag may have an additional character different from the additional character of the value 44 (e.g., "1") at the end. In the illustrated embodiment, the RFID module 30 (e.g., the RFID circuit 32) is connected to the detection circuit 24 and is capable of detecting whether the detection circuit 24 is in an open-circuit or closed-circuit situation or state. Thus, for example, the detection circuit 24 may initially be in a closed-circuit situation or state. Thus, when powered / activated, the RFID module 30 sends the value 44 to the reader 40. When the indicator is exposed to an impact event, the sensor 20 causes a change in the detection circuit 24 such that the detection circuit 24 becomes an open-circuit situation or state. Thus, when powered / activated (e.g., after an impact event), the RFID module 30 instead sends the value 42 to the reader 40. Thus, according to an embodiment of the present invention, although the indicator 10 does not include or require any internal power source (e.g., a battery), the indicator 10 can use an electronic indicator (e.g., an RFID reader) to monitor the delicate product / object to which the indicator is attached for damage that may be caused by a collision. In one embodiment, the detection circuit 24 is irreversibly configured such that when the state of the detection circuit 24 changes, the detection circuit 24 is prevented from returning to its previous state.For example, when the detection circuit 24 is in a closed - circuit state or condition before the sensor 20 operates, the sensor 20 is activated by an impact event, and further the detection circuit 24 is shifted to an open - circuit state or condition, the detection circuit 24 is configured to be maintained in the open - circuit state and thus cannot return to the closed - circuit state. Therefore, embodiments of the present invention prevent any unauthorized reset of the impact indicator 10.

[0013] The present invention may include computer program instructions at any technically possible detailed integration level (e.g., described in a (one or more) computer-readable storage medium (e.g., memory 34)) for causing a processor to perform aspects of the present invention. The computer-readable program instructions described herein may be downloaded to respective computing / processing devices (e.g., wireless communication module 22 and / or RFID module 30). The computer-readable program instructions for performing the operations of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, configuration data for integrated circuits, or source code or object code described in any combination of one or more programming languages. In certain embodiments, an electronic circuit (e.g., circuit 32) including, for example, a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA) may execute the computer-readable program instructions using the state information of the computer-readable program instructions to customize the electronic circuit to perform aspects of the present invention. Aspects of the present invention are described herein with reference to the explanatory diagrams and / or block diagrams of the method and / or apparatus according to embodiments of the present invention. It is understood that each block of the explanatory diagrams and / or block diagrams, as well as combinations of blocks in the explanatory diagrams and / or block diagrams, may represent a module, segment, or portion of code that can be executed by computer-readable program instructions. These computer-readable program instructions may be provided to a processor or other programmable data processing apparatus to produce a means for causing the computer-readable program instructions to execute the functions / operations specified in one or more blocks of the explanatory diagrams and / or block diagrams when executed via the processor.A computer-readable storage medium storing the instructions may further store computer-readable program instructions that can direct a computing device, a programmable data processing apparatus, and / or other devices to function in a particular manner so as to have a product that includes instructions for performing the functions / operations specified in one or more blocks of the explanatory diagrams and / or block diagrams. The detection circuit 24, the wireless communication module 22, and / or the RFID module 30 may be implemented in any suitable manner using known techniques that may be hardware-based, software-based, or a combination of both. For example, the detection circuit 24, the wireless communication module 22, and / or the RFID module 30 may have software, logic, and / or executable code for performing various functions as described above (such as software and / or algorithms executed by a processor unit, hardware logic that exists in a processor or other type of logic chip or is gathered in one integrated circuit or is distributed across different chips of a data processing system). As will be recognized by those skilled in the art, aspects of the present disclosure may be embodied as a system, method, or computer program product. Accordingly, aspects of the present disclosure may take the form of an hardware embodiment, a software embodiment (including firmware, resident software, microcode, etc.), or an embodiment combining software aspects and hardware aspects that may generally be referred to herein as all "circuit", "module", or "system".

[0014] FIG. 3 is an exploded view showing various embodiments of the impact indicator 10 according to the present disclosure, and FIG. 4 is an enlarged view showing a part of the embodiment of the impact indicator 10 shown in FIG. 3 according to the present disclosure. Referring to FIG. 3, the impact indicator 10 includes a housing or casing 50 having a bottom, i.e., a lower wall 52, and a top, i.e., an upper wall 54. An RFID module 30 is disposed between the upper wall 54 and the lower wall 52. FIG. 4 is an enlarged view of the RFID module 30. In FIGS. 3 and 4, the RFID module 30 has a substrate 60 having an RFID inlay 62 forming an antenna 36, together with an RFID chip or RFID circuit 32 connected to the RFID inlay. In the illustrated embodiment, the micro sensor 20 is adhered and / or connected to the RFID module 30. For example, in the illustrated embodiment, the sensor 20 is a MEMS sensor 20 1 or a sensor 20 manufactured with an LCD panel 2 and may include. Referring to FIG. 4, the RFID module 30 has a mounting area 66 for receiving the micro sensor 20, and the RFID module 30 further has a trace or lead wire 68 for communicably and / or electrically connecting the sensor 20 to the RFID circuit 32.

[0015] Referring to FIG. 3, in the illustrated embodiment, the indicator 10 includes an activation element 70. The activation element 70 is configured to maintain the sensor 20 in a non-responsive state until the activation element 70 is removed from the indicator 10 (i.e., it cannot transition from a non-operating state to an operating state. Here, the non-operating state refers to the state of the sensor 20 before the sensor 20 receives a shock event exceeding a specific threshold value, and the operating state refers to the state of the sensor 20 after the sensor receives a shock event at or above the threshold value). For example, while the indicator 10 is being transported to an end user (or others), the indicator 10 may receive a shock event detected by the sensor 20 that causes the sensor 20 to enter an operating state (i.e., it may indicate that a shock event has occurred). The activation element 70 prevents the sensor 20 from transitioning from a non-operating state to an operating state even when the sensor 20 receives a shock event. When the activation element 70 is removed from the indicator 10, the sensor 20 enters an active mode or a sensing mode (i.e., it can detect a shock event and transition to an operating state, indicating that a shock event has occurred).

[0016] For example, as described in more detail below, in one embodiment, the activation element 70 has a retaining element 72 that is adhesively bonded to the upper wall 54 and / or connected in other ways, and the upper wall 54 includes a stopper 74 that extends downward through an opening 80 formed in the upper wall 54. The stopper 74 may extend downward and be in the form of a pin or other structural member that engages at least a portion of the sensor 20 to prevent the operation of the sensor 20. During operation, when the retaining element 72 is removed from the indicator 10 (e.g., the retaining element 72 is peeled off the upper wall 54), the stopper 74 is further pulled outward from the indicator 10, disengaging from the sensor 20 and enabling the sensor 20 to operate in response to the detection of a shock event.

[0017] FIG. 5 is a diagram showing an embodiment of the impact indicator 10 incorporating the MEMS type microsensor 20 according to the present disclosure, and FIG. 6 is a cross-sectional view showing the impact indicator 10 of FIG. 5 along line 6-6 of FIG. 5. Various aspects of the operational features of this embodiment of the indicator 10 according to the present disclosure may be found in U.S. Patent No. 7,266,988, which is hereby incorporated by reference in its entirety. In FIGS. 5 and 6, a micromachined test mass element 100 attached to a substrate (not shown) through a fixture 102 through a test mass flexure 104 is used for the indicator 10. The test mass element 100 has a contact region 106 and a latch 108. When subjected to an impact event or a collision load, the inertia of the test mass element 100 generates a force indicated by reference numeral F in FIG. 5. G This force causes the mass element 100 to be displaced sufficiently to forcefully engage the latch 108 with a similar latch on a thin latch body 110 attached to the substrate through a fixture 102 through a latch flexure 112. The force F G If meets the desired threshold, the latch 108 moves into contact with the latch body 110, generating a force indicated by reference numeral F in FIG. 5. A This force moves the latch body 110 substantially perpendicular to the movement of the test mass element 100 so that the latch 108 and the latch body 110 can be locked together. The force F G further connects the contact 114 attached to the substrate through a fixture 102 through a contact flexure 116 to the test mass contact region 106. After locking, the contact region 106 remains in contact with the contact 114.

[0018] In the illustrated embodiment, the impact indicator 10 includes an activation element 70 such that during the manufacture, storage, and / or transportation of the impact indicator 10 (e.g., before the indicator 10 is placed on the product being monitored for impact), the test mass element 100 does not move a sufficient distance toward the pawl body 110. Thus, even if the sensor 20 is exposed to the threshold of a collision, latching does not occur at the latch 108. As shown in FIGS. 5 and 6, the test mass element 100 having an opening 120 therein is formed with a stopper 74 at least partially extending within the opening 120 in the immediate vicinity of the mass element 100, thereby restricting the movement of the mass element 100 when the sensor 20 receives an impact or collision event. To limit and / or prevent the test mass element 100 from moving to the point where the sensor 20 becomes operative or active, it should be understood that the stopper 74 may be arranged and / or positioned in other ways in the immediate vicinity of the test mass element 100 (e.g., along the side of the test mass element 100 near the latch 108).

[0019] Referring to FIG. 6, in the illustrated embodiment, the stopper 74 is fixed and / or coupled to the substrate 122 of the sensor 20. For example, in one embodiment, the stopper 74 is formed in the opening 120 of the proof mass element 100 using MEMS manufacturing techniques. In at least one direction, the stopper 74 is formed at a distance identified by reference numeral 124 in FIG. 6 from the edge or surface 126 of the opening 120. Unlike the proof mass element 100, the stopper 74 is configured to be removed from the substrate 122 at the proximal end 130 of the stopper with respect to the substrate 122. For example, since the proof mass element 100 is attached to the substrate 122 using the flexure 104 and the proof mass element 100 moves during a collision event, the proof mass element 100 can move relative to the stopper 74. In the event of a collision, if the proof mass element 100 moves more than the locking distance (e.g., from the latch 108 to the pawl 110), the proof mass element 100 first contacts the stopper 74, limiting the amount of movement of the proof mass element 100 and preventing the amount of movement of the proof mass element 100 that would engage the latch 108 with the pawl 110. Thus, the stopper 74 is attached to the substrate 122 at the proximal end 130 with sufficient strength to withstand the momentum of the proof mass element 100 due to movement of the proof mass element 100 during an impact event. As described above, the distance 124 is less than the locking distance between the latch 108 and the pawl 110.

[0020] In the embodiment shown in FIG. 6, the stopper 74 is attached to the holding element 72 using an adhesive layer 134 and has an enlarged distal end 132 (distal to the proximal end 130) and an intermediate portion 136 that extends between the proximal end 130 and the enlarged distal end 132 and extends through the opening 120. Since the microsensor 20 is on a microscale, when the holding element 72 is removed or separated from the sensor 20, the holding element 72 pulls on the enlarged distal end 132, resulting in a force being applied to the proximal end 130 of the stopper 74 in a direction away from the substrate 122, causing the stopper 74 to be detached from the substrate 122. The enlarged distal end 132 is configured to have a sufficient surface area such that the adhesive layer 134 remains attached to the enlarged distal end 132. In the illustrated embodiment, the proximal end 130 is configured to have a smaller cross-sectional area than the enlarged distal end 132, so that the surface area of the proximal end 130 attached to the substrate 122 is reduced, enabling the stopper 74 to be detached from the substrate 122 when the holding element 72 is removed from the indicator 10. In some embodiments, the proximal end 130 may be formed of a material that is more brittle than the material of the other portions of the stopper 74 to facilitate separation of the proximal end 130 from the substrate when the holding element 72 is removed. In one embodiment, the stopper 74 may be undercut at the proximal end 130 to weaken the attachment of the stopper 74 to the substrate 122 at the proximal end 130. It should be understood that in some embodiments, the opening 120 is formed as a circular opening, but the opening 120 may be formed in other shapes and / or configurations (e.g., trenches or comb-shaped).

[0021] In some embodiments, the indicator 10 may be configured to correspond to a specific threshold of an impact event by adjusting and / or changing the distance between the latch 108 and the pawl body 110, or by changing the weight of the test mass element 100, or by changing the biasing force of the test mass flexure 104, or by some combination of all of these variables. FIG. 5 shows one direction (e.g., force F GAn indicator 10 for detecting impact events in a direction (e.g., the direction of

[0022] FIG. 7 is an exploded view showing another embodiment of the impact indicator 10 according to the present disclosure, and FIG. 8 is an enlarged view showing a part of the embodiment of the impact indicator 10 shown in FIG. 7 according to the present disclosure. Referring to FIG. 7, the impact indicator 10 includes a housing or casing 50 having a bottom, i.e., a lower wall 52, and a top, i.e., an upper wall 54. An RFID module 30 is disposed between the upper wall 54 and the lower wall 52. FIG. 8 is an enlarged view of the RFID module 30. In FIGS. 7 and 8, the RFID module 30 has a substrate 60 having an RFID inlay 62 forming an antenna 36, together with an RFID chip or RFID circuit 32 connected to the RFID inlay. In the illustrated embodiment, the micro sensor 20 is adhered and / or connected to the RFID module 30. For example, in the illustrated embodiment, the micro sensor 20 may include an R2R micro sensor 20 3 Referring to FIG. 8, the RFID module 30 has a mounting area 66 for receiving the micro sensor 20, and the RFID module 30 further has traces or leads 68 for communicatively and / or electrically connecting the micro sensor 20 to the RFID circuit 32.

[0023] Referring to FIG. 7, in the illustrated embodiment, the indicator 10 includes an activation element 70 for maintaining the sensor 20 in a non-responsive state (i.e., unable to transition from a non-operating state to an operating state) until the activation element 70 is removed from the indicator 10. For example, while the indicator 10 is being transported to an end user (or others), the indicator 10 may receive an impact event that is detected by the sensor 20 and causes the sensor 20 to enter an operating state (i.e., may indicate that an impact event has occurred). The activation element 70 prevents the sensor 20 from transitioning from a non-operating state to an operating state even if the sensor 20 receives an impact event. When the activation element 70 is removed from the indicator 10, the sensor 20 enters an active mode or a sensing mode (i.e., can detect an impact event, transition to an operating state, and indicate that an impact event has occurred).

[0024] In the illustrated embodiment, the activation element 70 has a retaining element 72 adhesively bonded to the upper wall 54, and the upper wall 54 includes a blocker 74 that extends downwardly through an opening 80 formed in the upper wall 54. The blocker 74 may extend downwardly and be in the form of a pin or other structural member that engages at least a portion of the sensor 20 to prevent operation of the sensor 20. During operation, when the retaining element 72 is removed from the indicator 10 (e.g., peeled from the upper wall 54), the blocker 74 is further pulled outwardly from the indicator 10, disengaging from the sensor 20 and enabling the sensor 20 to operate in response to detection of an impact event.

[0025] FIGS. 9A and 9B are diagrams showing another embodiment of the impact indicator 10 according to the present disclosure. FIG. 9A shows an embodiment of the micro sensor 20 manufactured with an LCD panel 2 in a non-operating state, and FIG. 9B shows an embodiment of the LCD micro sensor 20 2 in an operating state. FIGS. 9A and 9B show the micro sensor 20 manufactured with an LCD panel 2is shown, it should be understood that the MEMS-based or R2R manufactured microsensor 20 may be similarly configured. In the illustrated embodiment, the microsensor 20 2 has a test mass element 140 supported by beams 142 and 144. In the illustrated embodiment, two beams 142, 144 are shown, but it should be understood that the number of beams used may be less or more. In an embodiment, the test mass element 140, the beams 142 and the beams 144 are formed of a glass substrate material by LCD manufacturing technology. Further, the beams 142 and 144 are sized and / or configured in other ways to break or fracture at a certain level of impact force. For example, in an embodiment, the beams 142 and 144 may be configured to have a size of a desired magnification greater than the length indicated by reference numeral 150 in FIG. 9A and the width indicated by reference numeral 152 in FIG. 9A. In the illustrated embodiment, the beams 142 and 144 extend outwardly from the respective support elements 154 and support elements 156 to suspend the mass element 140 above the underlying substrate. It should be understood that the mass element 140 may be further configured to be on the underlying substrate if the friction level is minimized to allow movement of the mass element 140 relative to such a substrate upon receiving an impact event. In an embodiment, the length 150 may have a size that is 5 to 10 times the value of the width 152 to correspond to the breakage of the beams 142 and 144 at a specific level or threshold of force (e.g., 25 g) corresponding to an impact event. The size of the mass element 140 may further be varied to correspond to the desired operation of the microsensor 20 2 under a specific impact level.

[0026] During operation, when the mass element 140 receives an impact event in the direction indicated by reference numeral 160, it is forced to move in the direction 160, causing the beams 142, 144 to break. Thus, in response to a collision event, the mass element 140 moves from a first position (FIG. 9A) associated with the non-operating state of the indicator 10 to a second position (FIG. 9B) associated with the operating state of the indicator 10.

[0027] Figures 9A and 9B further illustrate exemplary states of the detection circuit 24 associated with the respective non-operating and operating states of the sensor 20 2 For example, in one embodiment, the detection circuit 24 may have a conductive trace 162 that extends across the beams 142, 144 and the mass element 140 and is coupled to the RFID circuit 32. It should be understood that the detection circuit 24 may be formed in other manners (e.g., a conductive coating applied to the beams 142, 144 and the mass element 140). As shown in FIG. 9A, the detection circuit 24 has a specific RC value for the detection circuit 24 by having a resistance associated with the sensor 20 2 in the non-operating state (FIG. 9A). However, in the operating state of the sensor 20 2 since there is no resistance associated with the sensor 20 2 the RC value of the detection circuit 24 changes. The RFID circuit 32 coupled to the detection circuit 24 is configured to detect various RC values and output specific values (e.g., a non-operating state value 44 and an operating state value 42) by the RFID module 30 when queried. Further, in the illustrated embodiment, the detection circuit 24 is irreversibly configured (e.g., by breaking the beams 142 and 144 such that the conductivity of the trace 162 is irreversibly impaired) to prevent the detection circuit 24 from returning to its previous non-operating state after the sensor 20 2 is actuated.

[0028] Accordingly, embodiments of the present disclosure enable impact and / or acceleration event detection using an impact indicator with a small installation area, which uses a passive RFID tag that provides different read values depending on the state of the impact switch circuit. Since the RFID tag is passive, the impact indicator does not require a battery or other external power source. Further, due to the configuration of the impact indicator, the impact indicator can be made irreversible when activated (or when exposed to a sufficient magnitude of an impact event). Further, the impact indicator of the present disclosure may be composed of one or more display mechanisms (for example, the sensor 20 manufactured with an LCD panel may include a liquid that can be seen within a certain area of the indicator 10 during operation). Further, various manufacturing processes may be used for the indicator 10 (for example, 1) a conductive sidewall capable of making electrical contact, and 2) any manufacturing process that realizes a single thick micro-mechanical structure layer having a suspended inertial mass with a size or configuration according to a desired collision detection threshold may be used). By way of example, there are bulk micromachining and wafer bonding manufacturing techniques in silicon, silicon dioxide, ceramics, nickel, titanium and other conductors, LIGA-type manufacturing processes using electroplated metals (i.e., lithography, electroplating and molding), additive manufacturing methods such as inkjet dispensing, paste screening, and other deposition methods using liquids that are subsequently solidified.

[0029] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used in this specification, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. The terms "comprises" and / or "comprising", as used in this specification, specify the presence of the described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0030] Corresponding structures, materials, acts, and equivalents of all means or steps in the following claims, as well as functional elements, are intended to include any structure, material, or act for performing the functions in combination with other claimed elements as specifically claimed. The description of the present disclosure has been shown for purposes of illustration and description, but is not intended to be exhaustive or limiting of the present disclosure in the form disclosed. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the present disclosure. This embodiment has been chosen and described in order to best explain the principles and practical application of the present disclosure and to enable others skilled in the art to understand the present disclosure of various embodiments with various modifications suitable for the particular use contemplated.

Claims

1. a mass element configured to move from a first position to a second position upon receiving an impact event; and A detection circuit configured to change from a first state to a second state in response to movement of the mass element from the first position to the second position, the detection circuit being prevented from returning to the first state in response to the change to the second state. a microsensor having a a radio frequency identification (RFID) module coupled to the detection circuit and configured to output a value indicative of the mass element being in the second position; an actuation element configured to maintain the mass element in the first position until removed from the microsensor; Equipped with an impact indicator.

2. The impact indicator of claim 1 , wherein the microsensor has a substrate to which the mass element is movably coupled, and the actuation element is removably coupled to the substrate.

3. The impact indicator of claim 2 , wherein the activation element extends through an opening formed in the mass element.

4. The impact indicator of claim 1 , wherein the microsensor is formed on a wafer substrate.

5. The impact indicator of claim 1 , wherein the microsensor is formed on a liquid crystal display (LCD) panel substrate.

6. The impact indicator of claim 1 , wherein the microsensor is formed on a roll-to-roll (R2R) substrate.

7. The activation element includes: a first portion disposed proximate the mass element; and a second portion configured to displace the first portion from proximate the mass element upon application of a force; The impact indicator of claim 1 , further comprising:

8. 1. An impact indicator comprising: a substrate having a communication module inlay configured to communicate an activation status of the impact indicator; a microsensor communicatively coupled to the communication module inlay for detecting a crash event, the microsensor having a non-reversible detection circuit configured to detect the actuation condition; an activation element configured to maintain the microsensor in a non-responsive state until removed from the microsensor; Equipped with an impact indicator.

9. 9. The impact indicator of claim 8, wherein the activation element has a retention element coupled to a block, the retention element disengaging the block from the microsensor when the retention element is disengaged from the impact indicator.

10. The impact indicator of claim 9, wherein the block is adhesively connected to the retaining element.

11. The impact indicator of claim 8 , wherein the activation element includes a block configured to limit movement of a movable element of the microsensor.

12. The impact indicator of claim 8 , wherein the microsensor is formed on a wafer substrate.

13. a microsensor configured to be activated upon receiving an impact event, the microsensor having a detection circuit configured to change from a first state to a second state in response to activation of the microsensor and prevented from returning to the first state in response to the activation; a radio frequency identification (RFID) module coupled to the detection circuit and configured to output a value indicative of the microsensor being activated; an activation element configured to maintain the microsensor in a non-responsive state until removed from the microsensor; Equipped with an impact indicator.

14. The impact indicator of claim 13 , wherein the microsensor is formed on a wafer substrate.

15. The impact indicator of claim 13 , wherein the microsensor is formed on a liquid crystal display (LCD) panel substrate.

16. The impact indicator of claim 13 , wherein the activation element comprises a block configured to limit movement of a movable element of the microsensor.

17. 14. The impact indicator of claim 13, wherein the activation element has a retention element coupled to a block, the retention element disengaging the block from the microsensor when the retention element is disengaged from the impact indicator.

18. The impact indicator of claim 13, wherein the activation element includes a block extending through a movable element of the microsensor.

19. 14. The impact indicator of claim 13, wherein the microsensor has a mass element coupled to at least one beam element, the beam element configured to break when the microsensor is subjected to an impact event.

20. The impact indicator of claim 19, wherein the detection circuit is formed on the beam element.

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