Cooling system having intermediate chamber

Abstract

The present disclosure relates to a cooling system for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes a housing defining a fluid chamber, the housing including an evaporative surface configured in thermal communication with a liquid fluid in the fluid chamber and in thermal communication with an electronic component coupled to the housing, the evaporative surface configured to transfer thermal energy from the electronic component to the liquid fluid such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and a condensing surface configured to absorb thermal energy from the vapor fluid such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the housing, the heat rejection system configured to absorb thermal energy from the condensing surface.

Description

Related Applications

[0001] Cross - References to Related Applications This application claims priority and the benefit thereof from U.S. Provisional Patent Application No. 63 / 064,311, filed on August 11, 2020, entitled "HEAT SINK WITH INTERMEDIATE CHAMBER", which is hereby incorporated by reference in its entirety for all purposes. BACKGROUND OF THE INVENTION

[0002] This section is intended to introduce readers to various aspects of the art that may be relevant to the various aspects of the present disclosure described below. This discussion is believed to be helpful in providing background information to the reader to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these descriptions are to be read from this perspective and not as an admission of prior art.

[0003] Electronic devices that generate heat can be cooled using any of various fluids such as air, refrigerant, water, and glycol, in conjunction with, for example, various heat exchangers (e.g., coils, shell and tube, round tube plate fin, microchannel, heat sink, heat pipe, and / or finned heat exchanger). The design of a heat exchanger can be based on the amount of heat to be removed, in addition to other factors such as cost, the size of the heat exchanger, and efficiency. Heat sinks are a common type of heat exchanger used in small electronic components because they can have a relatively compact design and low cost. Many heat sinks utilize fins for convective cooling. However, the metal materials typically used to form heat sinks may not have sufficient thermal conductivity characteristics to allow for heat dissipation while also enabling the electronic components to operate at the desired efficiency levels.

[0004] Other heat exchanger solutions for cooling electronic devices include heat pipes that direct the flow of a cooling fluid through tubes or pipes that allow for the dissipation of heat from the electronic components by conduction. Typically, the cooling fluid flows through the tubes or pipes by capillary action that can be generated by a wick structure on the inner surface of the heat pipe. However, heat pipe solutions can be limited due to the friction and shear forces acting on the cooling fluid, which can reduce the amount of heat removed from the electronic components by the heat pipe.

SUMMARY OF THE INVENTION

MEANS FOR SOLVING THE PROBLEM

[0005] The following describes an overview of certain embodiments disclosed herein. These aspects are presented only to provide the reader with a concise overview of these certain embodiments and it should be understood that these aspects are not intended to limit the scope of the present disclosure. Indeed, the present disclosure may include various aspects not described below.

[0006] In one embodiment, a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a housing that defines a fluid chamber, the housing including an evaporation surface configured to be in thermal communication with a liquid fluid within the fluid chamber and in thermal communication with electronic components coupled to the housing, where the evaporation surface is configured to transfer thermal energy from the electronic components to the liquid fluid such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and the housing includes a condensation surface configured to absorb thermal energy from the vapor fluid such that the vapor fluid condenses to a liquid fluid within the fluid chamber. The cooling system also includes a waste heat system coupled to an outer surface of the housing, where the waste heat system is configured to absorb thermal energy from the condensation surface.

[0007] In another embodiment, the cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes an exhaust heat system and a housing that defines a fluid chamber configured to contain a fluid therein. The housing includes a first surface configured to be in thermal communication with electronic components coupled to the housing, the first surface being configured to transfer thermal energy from the electronic components to the fluid to vaporize the fluid within the housing, and a second surface in thermal communication with the exhaust heat system, the second surface being configured to transfer thermal energy from the fluid to the exhaust heat system to condense the fluid within the housing.

[0008] In a further embodiment, a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes electronic components configured to generate heat during operation of the HVAC&R system and a cooling system coupled to the electronic components. The cooling system includes a housing that defines a fluid chamber configured to contain a liquid fluid, an evaporation surface of the housing in thermal communication with the electronic components, the evaporation surface being configured to transfer thermal energy from the electronic components to the liquid fluid within the fluid chamber to vaporize the liquid fluid into a vapor fluid, a condensation surface of the housing configured to be in thermal communication with an exhaust heat system of the cooling system, the condensation surface being configured to transfer thermal energy from the vapor fluid to the exhaust heat system to condense the vapor fluid into a liquid fluid, and a baffle disposed within the housing and configured to direct the vapor fluid from the evaporation surface toward the condensation surface.

Brief Description of the Drawings

[0009] Various aspects of the present disclosure may be better understood by reading the following detailed description and referring to the drawings.

[0010]

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DETAILED DESCRIPTION OF THE INVENTION

[0011] One or more specific embodiments of the present disclosure will be described below. These described embodiments are examples of the technology of the present disclosure. In addition, in order to provide a concise description of these embodiments, certain features with actual implementation examples may not be described herein. In the development of any such actual implementation example, as in any engineering or design project, many implementation-specific decisions may be made that can vary from implementation to implementation in order to achieve the developer's specific goals, such as compliance with system-related and industry-related constraints. It should be understood that such development efforts can be complex and time-consuming, but nevertheless, for those skilled in the art who benefit from the present disclosure, they will be routine work in design, fabrication, and manufacturing.

[0012] When introducing elements of various embodiments of the present disclosure, the articles "a," "an," and "the" are intended to mean that one or more of the elements exist. The terms "comprising," "including," and "having" are intended to be inclusive and mean that additional elements other than the recited elements may exist. In addition, it should be understood that references to "one embodiment" or "an embodiment" of the present disclosure are not intended to be construed as excluding the existence of additional embodiments that also incorporate the recited features.

[0013] Heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems can be used to thermally condition spaces within a building, dwelling, or other suitable structure. For example, an HVAC&R system can include a vapor compression system that transfers thermal energy between a heat transfer fluid such as a refrigerant and a conditioned fluid such as air or water. The vapor compression system can include a condenser and an evaporator that are fluidly coupled to each other via conduits. A compressor can be used to circulate the fluid through the conduits and thus enable the transfer of thermal energy between the condenser and the evaporator.

[0014] In many cases, the compressor of an HVAC&R system can be driven by a motor. The motor can be communicatively coupled to a control system that may include a variable speed drive (VSD). Each VSD can include a plurality of electronic components, such as a printed circuit board, that can generate a relatively high heat flux (e.g., 1 megawatt per square meter ( MW / m 2 ))). To operate these electronic components efficiently, a cooling system can be utilized to remove heat from and generated by the electronic components, thereby avoiding overheating of the electronic components. Typical cooling systems include liquid-cooled and air-cooled configurations that each eliminate heat from the electronic components via a flow of liquid and air, respectively. For example, a liquid-cooled cooling system can include a heat pipe that circulates a fluid through a tube in thermal communication with the electronic components. An air-cooled cooling system can include a fan that passes an air flow across the surface of the electronic components and / or a heat sink attached to the electronic components. Thus, different cooling systems can be used to cool the individual electronic components within a VSD. Unfortunately, conventional cooling systems have drawbacks related to size, cooling capacity, and / or cost. Induction The embodiments of the present disclosure are directed to an improved cooling system that includes a waste heat removal system (e.g., a heat sink) such as a fluid chamber and fins. For example, the improved cooling system can include a fluid chamber coupled to the electronic components, and the electronic components are in thermal communication with a fluid (e.g., a refrigerant of the HVAC&R system, a dedicated or isolated refrigerant, water, etc.) disposed within the fluid chamber. In addition, the waste heat removal system can be in thermal communication with the fluid to cool the fluid. In certain embodiments, the waste heat removal system (e.g., a heat sink) includes fins coupled to a portion of the fluid chamber and positions the fluid to be in thermal communication with air or another fluid flow external to the fluid chamber (e.g., surrounding the fins). In some embodiments, air is caused to flow across the fins (e.g., via a fan)

[0015] The embodiments of the present disclosure are directed to an improved cooling system that includes a waste heat removal system (e.g., a heat sink) such as a fluid chamber and fins. For example, the improved cooling system can include a fluid chamber coupled to the electronic components, and the electronic components are in thermal communication with a fluid (e.g., a refrigerant of the HVAC&R system, a dedicated or isolated refrigerant, water, etc.) disposed within the fluid chamber. In addition, the waste heat removal system can be in thermal communication with the fluid to cool the fluid. In certain embodiments, the waste heat removal system (e.g., a heat sink) includes fins coupled to a portion of the fluid chamber and positions the fluid to be in thermal communication with air or another fluid flow external to the fluid chamber (e.g., surrounding the fins). In some embodiments, air is caused to flow across the fins (e.g., via a fan) Inductionis arranged to promote the cooling of the fluid and thus increase the amount of cooling provided by the fluid of the cooling system. The fluid chamber may include an evaporation surface (e.g., in thermal communication with an electronic component) and a condensation surface (e.g., in thermal communication with fins). Thus, the fluid within the fluid chamber can absorb heat (e.g., thermal energy) from the electronic component at the evaporation surface. As the fluid absorbs heat, the fluid can evaporate and flow within the fluid chamber towards the condensation surface. In particular, a liquid fluid can absorb heat from the electronic component through the evaporation surface, evaporate into a vapor fluid, and rise within the fluid chamber and flow towards the condensation surface. The vapor fluid can contact the condensation surface and transfer heat from the vapor fluid to the fins, thereby condensing back into a liquid fluid. Additionally, the fins can transfer heat to the external air (e.g., the air surrounding the fluid chamber), thereby removing heat from the cooling system. The fins can transfer heat to the external air via natural or forced convection. Thus, the improved cooling system can utilize both conduction and convection to improve the cooling of the electronic component compared to conventional cooling systems.

[0016] In additional or alternative embodiments, the cooling system may include a different waste heat removal system configured to cool the fluid within the fluid chamber. By way of example, the cooling system may include a refrigerant system (e.g., a vapor compression system, a refrigerant circuit, an air-cooled chiller) that can circulate an additional fluid (e.g., a refrigerant, water). The refrigerant system can cool the additional fluid and position the additional fluid in thermal communication with the fluid within the fluid chamber, such as at the condensation surface. In this way, the cooling system can provide additional or alternative cooling to the fluid within the fluid chamber in addition to the cooling provided by the fins or other heat sinks.

[0017] Turning now to the drawings, FIG. 1 is a perspective view of one embodiment of the environment of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 within a building 12 for a typical commercial environment. The HVAC&R system 10 can include a vapor compression system 14 (e.g., chiller, heat pump, air handling unit, air conditioner, cooler, freezer) that supplies a chilled liquid that can be used to cool the building 12. The HVAC&R system 10 can also include a boiler 16 for supplying a warm liquid to heat the building 12 and an air distribution system for circulating air through the building 12. The air distribution system can also include an air return duct 18, an air supply duct 20, and / or an air handler 22. In some embodiments, the air handler 22 can include a heat exchanger connected to the boiler 16 and the vapor compression system 14 by conduits 24. The heat exchanger within the air handler 22 can receive either the heated liquid from the boiler 16 or the chilled liquid from the vapor compression system 14, depending on the operating mode of the HVAC&R system 10. The HVAC&R system 10 is shown with a separate air handler for each floor of the building 12, but in other embodiments, the HVAC&R system 10 can include an air handler 22 and / or other components that can be shared between floors.

[0018] FIGS. 2 and 3 illustrate embodiments of the vapor compression system 14 that can be used within the HVAC&R system 10. The vapor compression system 14 can circulate refrigerant through a circuit that begins with a compressor 32. The circuit can also include a condenser 34, an expansion valve or device 36, and a liquid chiller or evaporator 38. The vapor compression system 14 can further include a control panel 40 having an analog-to-digital (A / D) converter 42, a microprocessor 44, a non-volatile memory 46, and / or an interface board 48.

[0019] Some examples of fluids that can be used as refrigerants within the vapor compression system 14 include hydrofluorocarbon (HFC) refrigerants such as R-410A, R-407, R-134a, hydrofluoroolefin (HFO), ammonia (NH3), R-717, carbon dioxide (CO2), R-744, or a "natural" refrigerant such as a hydrocarbon refrigerant, water vapor, or any other suitable refrigerant. In some embodiments, the vapor compression system 14 can be configured to efficiently utilize a refrigerant having a standard boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere, also referred to as a low-pressure refrigerant, as compared to a medium-pressure refrigerant such as R-134a. As used herein, "standard boiling point" can refer to the boiling point temperature measured at one atmosphere.

[0020] In some embodiments, the vapor compression system 14 can use one or more of a variable speed drive (VSD) 52, a motor 50, a compressor 32, a condenser 34, an expansion valve or device 36, and / or an evaporator 38. The motor 50 can drive the compressor 32 and can be powered by a variable speed drive (VSD) 52. The VSD 52 receives AC power having a specific fixed line voltage and fixed line frequency from an alternating current (AC) power source and provides power having a variable voltage and frequency to the motor 50. In other embodiments, the motor 50 can be directly powered from an AC power source or a direct current (DC) power source. The motor 50 can include any type of motor that can be powered directly from an AC or DC power source by a VSD, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.

[0021] The compressor 32 compresses the refrigerant vapor and delivers the vapor to the condenser 34 through the discharge passage. In some embodiments, the compressor 32 can be a centrifugal compressor. The refrigerant vapor delivered to the condenser 34 by the compressor 32 can transfer heat to a cooling fluid (e.g., water or air) within the condenser 34. As a result of the heat transfer with the cooling fluid, the refrigerant vapor can condense into a refrigerant liquid within the condenser 34. The liquid refrigerant from the condenser 34 can flow through the expansion device 36 to the evaporator 38. In the illustrated embodiment of FIG. 3, the condenser 34 is water-cooled and includes a tube bundle 54 connected to a cooling tower 56 that supplies the cooling fluid to the condenser 34.

[0022] The liquid refrigerant delivered to the evaporator 38 can absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant within the evaporator 38 can undergo a phase change from the liquid refrigerant to a refrigerant vapor. As shown in the illustrated embodiment of FIG. 3, the evaporator 38 can include a tube bundle 58 having a supply line 60S and a return line 60R connected to a cooling load 62. The cooling fluid of the evaporator 38 (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) enters the evaporator 38 via the return line 60R and exits the evaporator 38 via the supply line 60S. The evaporator 38 can reduce the temperature of the cooling fluid within the tube bundle 58 through heat transfer with the refrigerant. The tube bundle 58 within the evaporator 38 can include a plurality of tubes and / or a plurality of tube bundles. In any case, the vapor refrigerant exits the evaporator 38 and returns to the compressor 32 via the suction line to complete the cycle.

[0023] FIG. 4 is a schematic of an embodiment of a vapor compression system 14 having an intermediate circuit 64 incorporated between a condenser 34 and an expansion device 36. The intermediate circuit 64 may have an inlet line 68 that is directly fluidly connected to the condenser 34. In other embodiments, the inlet line 68 may be indirectly fluidly coupled to the condenser 34. As shown in the illustrated embodiment of FIG. 4, the inlet line 68 includes a first expansion device 66 positioned upstream of an intermediate vessel 70. In some embodiments, the intermediate vessel 70 may be a flash tank (e.g., a flash intercooler). In other embodiments, the intermediate vessel 70 may be configured as a heat exchanger or a “surface economizer”. In the illustrated embodiment of FIG. 4, the intermediate vessel 70 is used as a flash tank, and the first expansion device 66 is configured to reduce (e.g., expand) the pressure of the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid can be vaporized, and thus, the intermediate vessel 70 can be used to separate vapor from the liquid received from the first expansion device 66.

[0024] In addition, the intermediate vessel 70 can cause further expansion of the liquid refrigerant due to the pressure drop that the liquid refrigerant experiences when entering the intermediate vessel 70 (e.g., due to a sudden increase in volume when entering the intermediate vessel 70). The vapor within the intermediate vessel 70 can be drawn out by the compressor 32 through the suction line 74 of the compressor 32. In other embodiments, the vapor within the intermediate vessel can be drawn into an intermediate stage of the compressor 32 (e.g., rather than the suction stage). The liquid that accumulates in the intermediate vessel 70 can have an enthalpy lower than that of the liquid refrigerant exiting the condenser 34 due to the expansion in the expansion device 66 and / or within the intermediate vessel 70. The liquid from the intermediate vessel 70 can then flow through line 72, through the second expansion device 36, to the evaporator 38.

[0025] It should be understood that any of the features described herein may be incorporated into an embodiment of the vapor compression system 14 or any other suitable HVAC&R system. As discussed above, various electronic components may be located within the VSD52. In fact, other portions of the HVAC&R system 10 may also include electronic components such as a controller of the HVAC&R system 10. According to this embodiment, an improved cooling system is included to remove heat from the electronic components of the HVAC&R system 10 and to expel heat generated by the electronic components from the HVAC&R system 10.

[0026] For example, FIG. 5 is a schematic of an embodiment of a cooling system 100 having an exhaust heat system 101 and a fluid chamber 108 (e.g., an intermediate fluid chamber, container, vessel, tank, etc.) in thermal communication with the exhaust heat system 101. In the illustrated embodiment, the exhaust heat system 101 includes fins 110 (e.g., heat sinks) coupled (e.g., thermally coupled) to the fluid chamber 108. The cooling system 100 is configured to remove heat from the electronic components 112 of the HVAC&R system 10, such as the electronic components of the VSD52 described above. The fluid chamber 108 is generally defined by a container, housing, or other enclosure 105 configured to enclose a fluid 106 therein. As discussed below, in some embodiments, the fluid 106 may be a refrigerant. The enclosure 105 and / or the fluid chamber 108 include an evaporation surface 102 and a condensation surface 104 formed on the enclosure 105 or by the enclosure 105 (e.g., within the interior of the fluid chamber 108). The fins 110 are disposed on the outer surface 111 of the enclosure 105 on the back-to-back side of the condensation surface 104. Although the condensation surface 104 and the fins 110 are illustrated on a particular side of the cooling system 100 (e.g., of the enclosure 105), it should be understood that the condensation surface 104 and the fins 110 may be positioned on any other suitable side of the cooling system 100. For example, in some embodiments, the condensation surface 104 and / or the fins 110 may be disposed on a side of the cooling system 100 (e.g., of the enclosure 105) that faces the evaporation surface 102, such as the top side or the upper side of the cooling system 100.

[0027] In the illustrated embodiment, the housing 105 is formed as a rectangular box or container (e.g., a rectangular prism) that generally defines a fluid chamber 108 and can be formed from a metallic material such as copper, aluminum, steel, or another suitable metal. In other embodiments, the housing 105 can have any other suitable shape or profile. For example, the housing 105 and / or the fluid chamber 108 can be spherical, cubic, cylindrical, triangular, trapezoidal, hexagonal, or any other type of shape. In any case, the size, internal volume, and / or shape of the housing 105 are selected and / or can be selected based on the expected heat density rejected by the electronic components 112, the size constraints of the HVAC&R system 10, the type of fluid 106 enclosed within the fluid chamber 108, the amount of fluid 106 enclosed within the fluid chamber 108, or other operating parameters, based on the target pressure of the fluid to be maintained within the fluid chamber 108. In fact, the size of the fluid chamber 108 and / or the housing 105 is selected such that the fluid 106 circulates within the volume of the fluid chamber 108 (e.g., between the condensation surface 104 and the evaporation surface 102) without incorporating certain additional features such as capillary structures (e.g., wicks) and conduits to direct the fluid 106 (e.g., a liquid fluid) within the fluid chamber 108, thereby enabling the cooling of the electronic components 112. Thus, the amount of cooling provided by the fluid 106 may not be limited by the frictional or shear forces imparted to the fluid 106 during the circulation of the fluid 106 within the fluid chamber 108 (e.g., within the volume of the housing 105).

[0028] The housing 105 can be a sealed (e.g., hermetically sealed) container for blocking the flow of fluid 106 from within the fluid chamber 108 to the environment surrounding the housing 105. As will be appreciated, isolating the fluid 106 within the fluid chamber 108 enables the cooling system 100 to operate without utilizing additional power (e.g., to power a pump for circulating the fluid 106 within the fluid chamber 108). In some embodiments, the housing 105 can include a fill port 113 that selectively enables the flow of fluid 106 into the fluid chamber 108 (e.g., fills the fluid chamber 108 with fluid 106 and / or otherwise adjusts the amount of fluid 106 within the fluid chamber 108). For example, the fill port 113 can be located on a side surface of the housing 105 that does not include the condensation surface 104 and / or the fins 110. The location of the fill port 113 is also selected such that the fluid chamber 108 is at least partially filled with fluid 106 (e.g., blocks an undesired flow of fluid 106 out of the fluid chamber 108 through the fill port 113) such that the fluid 106 (e.g., fluid 106 in a liquid state) covers, blankets, and / or is in complete contact with substantially the entire surface area of the evaporation surface 102.

[0029] In some embodiments, the fluid chamber 108 can first be filled with fluid 106 via the fill port 113, after which the fill port 113 can be brazed or otherwise mechanically sealed and blocked to prevent the fluid 106 from flowing out of the fluid chamber 108. In other embodiments, the fill port 113 can include a sealing element such as a valve or plug that allows for future selective access to the fluid chamber 108 (e.g., the internal volume of the housing 105). In this way, the fill port 113 can be utilized, for example, to periodically fill the fluid chamber 108 with additional fluid 106 and / or, alternatively, to adjust the amount of fluid 106 within the fluid chamber 108. Further, the housing 105 can include a sight glass (not shown) for observing and monitoring the amount of fluid 106 within the fluid chamber 108 to determine, for example, whether additional fluid 106 should be added and / or whether the fill port 113 should be closed or sealed when the fluid 106 is added to the fluid chamber 108.

[0030] In one or more embodiments, the housing 105 and / or the fluid chamber 108 may include a pressure relief device 115 (e.g., a pressure relief valve). The pressure relief device 115 may be a valve, disk, or any other type of pressure relief device configured to automatically allow the discharge of fluid 106 from the fluid chamber 108 when the pressure of the fluid 106 within the fluid chamber 108 reaches or exceeds a certain pressure threshold (e.g., a threshold pressure value). For example, the pressure relief device 115 may include a burst disk disposed on a side or surface of the housing 105 (e.g., the top surface of the housing 105 and / or a side surface excluding the condensation surface 104 and / or the fins 110). In such an embodiment, the burst disk may operate (e.g., burst) when the pressure within the fluid chamber 108 exceeds a predetermined threshold, thereby allowing the discharge of fluid 106 from the fluid chamber 108 and reducing the pressure within the fluid chamber 108. In other words, the pressure relief device 115 may be fluidly coupled or exposed to the fluid chamber 108 (e.g., the internal volume of the housing 105) and may also be fluidly coupled or exposed to the environment surrounding the housing 105. As a result, when the pressure relief device 115 is actuated, the fluid chamber 108 becomes fluidly coupled to the environment surrounding the housing 105 via the pressure relief device 115, thereby allowing the flow of fluid 106 out of the fluid chamber 108 to reduce the pressure within the fluid chamber 108.

[0031] The fluid 106 within the fluid chamber 108 can be any suitable type of fluid such as water, glycol, alcohol, R-1233zd, R-123, R-1234ze, R-1234yf, R-134a, R-410A, R-32, or another suitable type of refrigerant used for HVAC&R systems and / or heat transfer. During operation of the cooling system 100, the fluid 106 can alternately change between various states such as a liquid state, a gaseous state, a vapor state, or a two-phase state. The fluid 106 within the fluid chamber 108 can be selected based on operating parameters of the fluid 106 such as boiling temperature and / or pressure. Additionally or alternatively, the fluid 106 can be selected based on the target or expected amount of heat generated by the electronic component 112, as well as one or more parameters of the housing 105 and / or the fluid chamber 108, such as the size, shape, and / or material of the housing 105 and / or the fluid chamber 108. In some cases, a fluid that evaporates (e.g., boils) at a relatively low temperature and / or a relatively low pressure can be utilized within the fluid chamber 108. In practice, the type and / or amount of the fluid 106 can be selected to achieve a substantially uniform pressure of the fluid 106 when the fluid 106 functions to transfer heat during operation of the cooling system 100. In any case, the fluid 106 can repeatedly transition between various phases (e.g., liquid and vapor) within the fluid chamber 108 during operation of the cooling system 100.

[0032] As described above, the housing 105 and / or the fluid chamber 108 includes an evaporation surface 102 on a side surface 114 (e.g., the bottom surface) of the housing 105. The evaporation surface 102 is in partial or complete contact with the fluid 106 inside the fluid chamber 108. In this way, heat communication between the electronic component 112 and the fluid 106 is enabled via the evaporation surface 102. More specifically, the housing 105 and / or the fluid chamber 108 is arranged or configured such that the fluid 106 in the liquid phase within the fluid chamber 108 (e.g., forming a liquid pool 107 within the fluid chamber 108) can partially or completely cover the evaporation surface 102 to which the electronic component 112 is thermally connected (e.g., by conduction). For this purpose, the evaporation surface 102 is formed or positioned at the bottom or lower part of the fluid chamber 108 (e.g., with respect to gravity). The electronic component 112 can be coupled (e.g., attached) to the housing 105 on the side surface 114 and can be disposed outside the fluid chamber 108.

[0033] In some embodiments, the evaporation surface 102 includes copper or another conductive material. In fact, in some embodiments, the evaporation surface 102 can include a material different from other parts of the housing 105. Further, the evaporation surface 102 can be enhanced by a texture, groove, fin, cavity, pore, or other type of surface enhancement that promotes heat transfer between the electronic component 112 and the fluid 106. For example, the evaporation surface 102 can be sealed against the electronic component 112 and can be porous (e.g., including one or more holes) to allow some direct contact between the electronic component 112 and the liquid fluid 106. In this way, the resistance to heat transfer between the electronic component 112 and the liquid fluid 106 is reduced because the liquid fluid 106 can directly exchange heat with the electronic component 112 rather than transferring all heat through the evaporation surface 102.

[0034] During operation, the evaporation surface 102 transfers heat from the electronic component 112 to the fluid 106, thereby causing the fluid 106 to experience a temperature rise, evaporation, and a transition from a liquid state to a vapor state. Next, the vapor fluid 106 can flow in direction 116 (e.g., upward with respect to gravity) from the evaporation surface 102 and from the liquid pool 107 collected within the fluid chamber 108 adjacent to the evaporation surface 102. In fact, since the vapor fluid 106 is less dense and thus buoyant compared to the liquid fluid 106 within the liquid pool 107 at the bottom of the fluid chamber 108, the vapor fluid 106 can flow in direction 116 (e.g., rise within the fluid chamber 108).

[0035] As described above, the fluid chamber 108 is adjacent to the electronic component 112. That is, the housing 105 and the electronic component 112 are coupled to each other (e.g., mounted, fixed). The electronic component 112 can be any type of electronic device of the HVAC&R system 10 that generates or dissipates heat. For example, the electronic component 112 can be the VSD 52 or its components (e.g., a microprocessor or a control board). In other embodiments, the electronic component 112 can be a power panel, a control panel, a solid state starter, and / or other devices or systems. In any case, the electronic component 112 is in contact with the evaporation surface 102 of the fluid chamber 108. For example, the evaporation surface 102 can be located on the side surface 114 (e.g., the bottom surface) of the housing 105 where the liquid fluid 106 accumulates as a result of gravity. In some embodiments, the housing 105 can include an opening 126 configured to receive the electronic component 112 or to be in fluid communication with the electronic component 112 (e.g., in direct fluid communication). For example, the electronic component 112 can be mounted to the housing 105 such that the electronic component 112 is aligned with the opening 126 (e.g., in an overlapping arrangement). In such embodiments, at least a portion of the electronic component 112 can form part or all of the evaporation surface 102 when the electronic component 112 is in direct contact with the fluid 106 (e.g., liquid fluid) within the fluid chamber 108.

[0036] In addition, the housing 105 and / or the fluid chamber 108 include a condensation surface 104 disposed on a side surface 118 (e.g., a lateral side surface) of the housing 105. However, the condensation surface 104 and / or an additional condensation surface may also be located on another surface of the housing 105, such as a top surface. In one or more embodiments, the condensation surface 104 is not on the same side surface 114 as the evaporation surface 102. The condensation surface 104 may be larger (e.g., have a larger surface area) than the evaporation surface 102 to enable an increase in heat transfer between the fluid 106 and the fins 110 of the cooling system 100. When the fluid 106 (e.g., a vapor fluid) contacts the condensation surface 104 and transfers heat to the condensation surface 104 (and thus the fins 110), the vapor fluid 106 may condense into a liquid fluid 106. For example, the vapor fluid 106 may contact the condensation surface 104 and transition to the liquid phase, thereby increasing the density of the fluid 106 as heat is transferred from the fluid 106 to the condensation surface 104. In some embodiments, the condensed fluid 106 may collect on the condensation surface 104 and flow along the condensation surface 104. In fact, the liquid fluid 106 may flow in a direction 117 opposite to the direction 116 due to the increase in the density of the liquid fluid 106 and the gravity applied to the liquid fluid 106. In some embodiments, the condensation surface 104 may include a texture, groove, fin, cavity, pore, and / or any other type of surface feature that may enhance heat transfer between the fluid 106 and the condensation surface 104. For example, the condensation surface 104 may include fins or grooves arranged to function as drainage channels that re-direct the fluid 106 condensed on the condensation surface 104 towards the fluid chamber 108 and / or the base portion 120 (e.g., a lower region, a liquid fluid portion) of the housing 105.

[0037] As described above, the waste heat system 101 of the cooling system 100 may include a condensation surface 104 exposed to the fluid chamber 108 and fins 110 disposed on the outer surface 111 of the housing 105 on the back-to-back side. The fins 110 may have any suitable geometric shape such as a plane, rectangle, triangle, offset strip, pin, stud, annular, wavy, louver, perforated, and / or any other type of protrusion and / or extension extending from the outer surface 111. In some embodiments, the fins 110 are formed from the same material as the housing 105. In other embodiments, the fins 110 may include a material different from that of the housing 105 (e.g., a material having higher thermal conductivity than the material of the housing 105). Since the fins 110 are positioned on the outer surface 111 on the back-to-back side of the condensation surface 104, the fins 110 can absorb heat from the condensation surface 104 (e.g., heat transferred from the fluid 106 to the condensation surface 104). Using forced convection or natural convection, the heat absorbed from the fluid 106 and the condensation surface 104 through the fins 110 can be transferred to the external air outside the housing 105. For example, a fan 148 or other air moving device can direct air Induction through, across, and / or towards the fins 110 to enhance heat transfer from the fins 110 to the external air via forced convection. In some embodiments, the fan 148 can direct air Induction across the fins 110 in direction 116 (e.g., upward) to enable subcooling of the liquid fluid 106 that condenses on the condensation surface 104 and flows towards the liquid pool 107 by gravity. In such an arrangement, the heat absorbed by the air from the fins 110 can increase in buoyancy as it flows through the fins 110, thereby facilitating a more efficient flow of air in direction 116.

[0038] In another example, the cooling system 100 and / or the waste heat system 101 can be positioned such that the fins 110 are disposed within an air flow path of the HVAC&R system 10 (e.g., an existing air flow path of the HVAC&R system 10 where another air flow is induced to pass therethrough). As an example, the fan 148 can be configured to induce air across another device such as another heat exchanger or electronic component of the HVAC&R system 10 in addition to the fins 110 of the cooling system 100. Additionally or alternatively, the cooling system 100 can include a shroud or housing 146 disposed around some or all of the components of the cooling system 100. For example, the shroud or housing 146 can be disposed adjacent to the fins 110 and can be configured to induce an increased or concentrated flow of air through and / or between the fins 110 to increase the cooling capacity of the cooling system 100. In other embodiments, the fins 110 can be positioned within an environment having a relatively low temperature, such as the ambient environment surrounding the cooling system 100. In such embodiments, a portion of the shroud or housing 146 can generally extend between the housing 105 (e.g., the condensing surface 104) and the fins 110 and / or between the electronic component 112 and the fins 110 such that the fins 110 are disposed within the ambient environment and the housing 105 and / or the electronic component 112 are positioned within the shroud or housing 146 to protect the housing 105 and / or the electronic component 112 from the environment. In this way, the fins 110 can transfer heat to the environment via natural convection. In other embodiments, the housing 146 (e.g., a housing or section of the HVAC&R system 10) can surround the cooling system 100 including the fins 110, receive a flow of ambient air, be configured to direct the flow of ambient air across the fins 110, and discharge the flow of ambient air from the housing 146.

[0039] Turning to FIG. 6, a cross-sectional side elevation view of one embodiment of the cooling system 100 is shown. As shown in the illustrated embodiment, the cooling system 100 includes a housing 105 having a polygonal shape or profile, defining a fluid chamber 108 and having a condensation surface 104 and an evaporation surface 102. In the illustrated embodiment, the condensation surface 104 and the evaporation surface 102 are disposed on opposite sides of the fluid chamber 108, and no electronic components 112 are shown. The cooling system 100 also includes a waste heat system 101 having fins 110 attached to the housing 105. The cooling system 100 of FIG. 6 also includes a plurality of first baffles 130 and a second baffle 132 disposed within the fluid chamber 108 of the housing 105. The baffles 130, 132 can be coupled to the housing 105 or, alternatively, supported by the housing 105, and the baffles 130, 132 can direct or redirect the flow of fluid 106 within the fluid chamber 108 to promote the cooling provided by the fluid 106. The baffles 130, 132 are substantially linear within the cooling system 100 shown, but either of the baffles 130, 132 can have different shapes in additional or alternative embodiments, such as having a curved and / or multi-segmented profile. These components are described in more detail below.

[0040] A plurality of first baffles 130 may be disposed within the fluid chamber 108 (e.g., within the housing 105), proximate to the condensation surface 104 (e.g., within the upper portion of the fluid chamber 108 that faces the lower portion enclosing the liquid pool 107). As described above, the cooling system 100 may evaporate the fluid 106 by the heat absorbed from the electronic component 112 via the evaporation surface 102 (e.g., a transition from a liquid fluid to a vapor fluid). The plurality of first baffles 130 may be included in the fluid chamber 108 to direct the flow of the vapor fluid 106 within the fluid chamber 108 toward the condensation surface 104. That is, the plurality of first baffles 130 may re-direct the flow direction of the vapor fluid 106 from the direction 116 to the direction 133 toward the condensation surface 104. The plurality of first baffles 130 may reduce the amount of mixing between the vapor fluid 106 flowing from the evaporation surface 102 and the liquid fluid 106 that condenses at the condensation surface 104. The plurality of first baffles 130 may be of the same material as the housing 105 or any other suitable material.

[0041] In some embodiments, the plurality of first baffles 130 may include plates positioned at an angle 134 (e.g., a downward angle relative to horizontal, the condensation surface 104, another surface of the housing 105, etc.) to direct vapor (e.g., from the surface 136 of the housing 105) toward the condensation surface 104. In some embodiments, the angle 134 of the plurality of first baffles 130 is downwardly inclined toward the condensation surface 104 to facilitate the flow of any droplets of the liquid fluid 106 mixed with or entrained in the vapor fluid 106 toward the evaporation surface 102 (e.g., by gravity) and / or to reduce the entrainment of the liquid fluid 106 in the vapor fluid 106. In some embodiments, the plurality of first baffles 130 may be coupled to the fluid chamber 108 from one or more sides (e.g., lateral sides) of the housing 105 and / or, alternatively, may extend into the fluid chamber 108. For example, the fluid chamber 108 may include a plurality of first baffles 130 extending from a first side 138 (e.g., a lateral side) of the housing 105 to a second side (e.g., a lateral side) of the housing 105 opposite the first side 138. In certain embodiments, the surface 136 of the housing 105 may be positioned at an angle 137 (e.g., relative to vertical) to deflect the vapor fluid 106 toward the plurality of first baffles 130 and to facilitate directing the vapor fluid 106 toward the condensation surface 104. As discussed above, the change in density of the fluid 106 between the liquid and gas phases can drive the flow of the fluid 106 within the fluid chamber 108 (e.g., in directions 116, 133, 117, and 149). Thus, the fluid 106 can flow within the fluid chamber 108 due to buoyancy, dynamic propulsion, surface tension, surface adhesion, and / or gravity, without being driven by a pressure differential or capillary forces within the fluid chamber 108.

[0042] The cooling system 100 may also include a second baffle 132 disposed within the fluid chamber 108 (e.g., within the lower portion opposite the upper portion having the plurality of first baffles 130). The second baffle 132 may be formed from the same material as the housing 105 or any other suitable material. In some embodiments, the second baffle 132 is a plate that extends along a common axis with the condensation surface 104 of the housing 105 and / or the evaporation surface 102 of the housing 105. For example, in the illustrated embodiment, the second baffle 132 is disposed substantially vertically, similar to the condensation surface 104. Further, the second baffle 132 may extend (e.g., parallel) along two opposing side surfaces 140, 142 (e.g., lateral side surfaces, vertical side surfaces) of the housing 105. Additionally, the second baffle 132 may be substantially crosswise to the bottom surface 144 of the housing 105 and may be suspended above the bottom surface 144 (e.g., against gravity). In other embodiments, the second baffle 132 may be positioned at an angle with respect to the two opposing side surfaces 140, 142, the condensation surface 104, the bottom surface 144, and / or the evaporation surface 102. Further, the second baffle 132 may be a plate that extends between a first side surface 138 of the housing 105 and a second side surface (not shown) of the housing 105 that is opposite the first side surface 138. In any case, the second baffle 132 may allow the liquid fluid 106 drained from the condensation surface 104 to accumulate (e.g., form a liquid pool 107) within the fluid chamber 108 near the bottom surface 144 and may direct the fluid 106 towards the evaporation surface 102. More specifically, the liquid fluid 106 that gathers near the bottom surface 144 may accumulate between the second baffle 132 and the side surface 142 to create a column or "stack" of the liquid fluid 106 condensed through the condensation surface 104. This fluid 106 may then be directed from the liquid pool 107 towards the evaporation surface 102 in direction 149 (e.g., through a gap or opening 150 formed between the second baffle 132 and the bottom surface 144). As shown in FIG. 6, the second baffle 132 enables separation of the fluid chamber 108 into a first portion that mainly encloses the liquid fluid 106 (e.g., the fluid 106 condensed through the condensation surface 104) and a second portion that mainly encloses the vapor fluid 106 (e.g., the fluid 106 vaporized through the evaporation surface 102).

[0043] Embodiments of the cooling system 100 described herein may include additional features to enable more efficient cooling of the electronic component 112. For example, the cooling system 100 may include temperature and / or pressure sensors 152 that are coupled to the electronic component 112, disposed within the fluid chamber 108, coupled to the fins 110, or any combination thereof. Based on feedback from one or more sensors 152, the operation of the HVAC&R system 10 and / or the cooling system 100 may be controlled. For example, the sensors 152 may be configured to detect operating parameters of the fluid 106 (e.g., temperature, pressure, etc.), the temperature of the evaporation surface 102, the temperature of the housing 105, or other operating parameters of another component of the cooling system 100. The HVAC&R system 10 may include a controller 154 (e.g., a control panel 40, an electronic controller, an automation controller) that may include a memory 156 and a processing circuit 158. The memory 156 may include volatile memory such as random access memory (RAM), and / or non-volatile memory such as read-only memory (ROM), an optical drive, a hard disk drive, a solid state drive, or any other non-transitory computer-readable medium that stores instructions that, when executed, control the operation of the HVAC&R system 10 and / or the cooling system 100. The processing circuit 158 (e.g., a microprocessor) may be configured to execute the instructions stored in the memory 156. As an example, the processing circuit 158 may include one or more application-specific integrated circuits (ASICs), one or more field-programmable gate arrays (FPGAs), one or more general-purpose processors, or any combination thereof. In some embodiments, the controller 154 may adjust the operation of the fan 148 or other devices based on feedback output by the sensors 152 (e.g., indicating operating parameters of the fluid 106, the housing 105, etc.) to control the rate of heat exchange or cooling of the electronic component 112.In fact, in some embodiments, the controller (e.g., controller 154) of the HVAC&R system 10 and / or the cooling system 100 may temporarily stop the operation of the HVAC&R system 10 or its components based on the sensor 152 feedback, e.g., based on the pressure in the fluid chamber 108 exceeding a threshold level or value. The sensor 152 feedback may also be utilized to determine the fill level of the fluid chamber 108 (e.g., the amount of fluid 106 enclosed within the fluid chamber 108).

[0044] Note that the waste heat system 101 may include features in addition to, or in lieu of, the fins 110. For example, the waste heat system 101 may include a refrigerant circuit (e.g., a vapor compression system), a cooled fluid circuit (e.g., configured to circulate water, air, or glycol), a heat siphon, a heat pipe, and / or any other suitable system configured to enable cooling of the fluid 106 within the housing 105. Additionally or alternatively, the housing 105 may include the placement of another component (e.g., a heat siphon, a heat pipe) configured to passively circulate the fluid 106 between the electronic components 102 and the waste heat system 101 to transfer heat from the electronic components 102 to the waste heat system 101 and thereby cool the electronic components 102. Various embodiments of alternative features incorporating this technology for cooling electronic components are further contemplated herein.

[0045] For example, the techniques disclosed herein can also be utilized in embodiments having one or more air-cooled chillers. As an example, FIG. 7 is a schematic of one embodiment of a cooling system 100 that utilizes a refrigerant system 198 (e.g., a vapor compression system 14, a refrigerant circuit, a heat pipe) to circulate a refrigerant to cool an electronic component 228 (e.g., power electronics). In some embodiments, the refrigerant system 198 can also circulate the same refrigerant to cool a conditioned air flow and / or a conditioned fluid (e.g., water) supplied to cool a space served by the refrigerant system 198. That is, the refrigerant system 198 can be used to cool both a space and the electronic component 228 via the refrigerant. Thus, certain additional components (e.g., a dedicated compressor, a dedicated pump, associated piping and wiring) may not be incorporated into the cooling system 100 to provide proper cooling of the electronic component 228, thereby reducing the complexity and / or cost associated with cooling the electronic component 228 as compared to, for example, other conventional systems (e.g., those involving glycol cooling coils with associated pumps, piping, and wiring). In further embodiments, the refrigerant system 198 can be a dedicated cooling system (e.g., fluidly separated from a cooling system used to cool a space) for cooling the electronic component 228.

[0046] The refrigerant system 198 may include a condenser coil 232 (e.g., a round tube plate fin condenser coil, a microchannel condenser coil, a shell and tube heat exchanger). For example, the condenser coil 232 is positioned adjacent to an electronic component 228 (e.g., an electrical panel including the electronic component 228) to reduce the length or amount of conduit and / or the pressure drop of the refrigerant during operation of the refrigerant system 198 for cooling the electronic component 228, thereby improving the efficient manufacture and / or operation of the refrigerant system 198 and / or the cooling system 100. In some embodiments, during operation of the refrigerant system 198, the refrigerant vapor 200 is driven from the discharge of the compressor 199 or the pump of the refrigerant system 198 to the condenser coil 232 by a pressure difference within the refrigerant system 198 (e.g., a relatively high pressure upstream of the condenser coil 232, a relatively low pressure downstream of the condenser coil 232). The pressure difference within the refrigerant system 198 can drive the flow of the refrigerant to cool the electronic component 228 without a substantial increase in the operating capacity (e.g., pressurization) of the compressor 199 (e.g., compared to the operation of the compressor 199 for cooling another working fluid through the refrigerant system 198), thereby reducing the power consumption associated with the operation of the compressor 199. In other embodiments, the compressor 199 may be omitted and the refrigerant system 198 may be a thermosiphon having the condenser coil 232. In such embodiments, the refrigerant can be induced from the condenser coil 232 towards the electronic component 228 via a thermosiphon effect or cycle. In further embodiments, the refrigerant system 198 may include other components configured to generate a refrigerant pressure difference within the refrigerant system 198, such as an economizer, a flash tank, other heat exchangers, etc.

[0047] The refrigerant vapor 200 enters the first header 202 of the condenser coil 232 and flows through the first pass 210 of the condenser coil 232 and can condense at least partially into the liquid 214. That is, the liquid 214 can be in a single phase or can be a two-phase refrigerant rich in liquid. For example, the condenser coil 232 can include a fan 215 configured to induce an air flow across the first pass 210 to cool the refrigerant vapor 200 flowing through the first pass 210 and condense the refrigerant vapor 200 into the liquid 214. The liquid 214 flows from the first pass 210 to a first evaporator 216 (e.g., a heat exchanger, a heat pipe) that is in thermal communication with (e.g., attached to) the electronic component 228. The liquid 214 can absorb heat from the electronic component 228 via the first evaporator 216, thereby cooling the electronic component 228 and heating the liquid 214. For example, the liquid 214 can partially vaporize when absorbing heat from the electronic component 228, thereby forming a first two-phase refrigerant 234 (e.g., a two-phase refrigerant 234 rich in liquid).

[0048] The first two-phase refrigerant 234 flows from the first evaporator 216 to the second evaporator 218 (e.g., heat exchanger, heat pipe), and the second evaporator 218 is in thermal communication with an air flow 226 induced across the second evaporator 218. The air flow 226 can also flow within a housing 230 (e.g., electrical housing) that houses or encloses the electronic component 228 such that the electronic component 228 can be separated or isolated from other components of the refrigerant system 198 (e.g., fan 215). The housing 230 can shield or conceal the electronic component 228 from certain components of the refrigerant system 198 to reduce a potential undesirable effect of the refrigerant flow within the refrigerant system 198 on the operation of the electronic component 228. For example, the evaporators 216, 218 can be disposed within the housing 230, and the compressor 199 and / or the condenser coil 232 can be disposed outside of the housing 230. The first two-phase refrigerant 234 can absorb heat from the air flow 226 via the second evaporator 218, thereby cooling the air flow 226 and heating the first two-phase refrigerant 234. The air flow 226 can be used to cool the electronic component 228 and / or other electronic components such as other power electronics within the housing 230. The heating of the first two-phase refrigerant 234 can further vaporize the refrigerant to form a second two-phase refrigerant 220 (e.g., a two-phase refrigerant 220 rich in vapor).

[0049] From the second evaporator 218, the second two-phase refrigerant 220 flows through the second pass 212 of the condenser coil 232. In the second pass 212, the two-phase refrigerant 220 condenses to form a subcooled liquid 222. By way of example, the fan 215 and / or an additional fan may induce an air flow across the second pass 212 to cool the second two-phase refrigerant 220 flowing through the second pass 212. The subcooled liquid 222 then exits the condenser coil 232 and may flow towards other components of the refrigerant system 198. In some embodiments, the condenser coil 232 is positioned relative to the electronic component 228 (e.g., at a common height, at a higher height) to enable a desired flow of refrigerant, such as during a low load condition. For example, the condenser coil 232 may be physically higher relative to the first evaporator 216 and / or the electronic component 232 such that the liquid 214 flows from the first pass 210 to the first evaporator 216 and the electronic component 228 via gravity, and the second two-phase refrigerant 220, which may have a higher buoyancy than the liquid 214, may flow more readily from the second evaporator 218 through the second pass 212 of the condenser coil 232.

[0050] In certain embodiments, the subcooled fluid 222 can be directed to cool other components (e.g., to a heat exchanger in thermal communication with a conditioning fluid and / or air flow for cooling the space), thereby heating and evaporating the subcooled fluid 222. The vaporized refrigerant can then be directed to return to the compressor 199 of the refrigerant system 198 for pressurization and discharge to the first path 210 (e.g., as refrigerant vapor 200). In additional or alternative embodiments, the compressor 199 may be omitted, and the vapor refrigerant can be circulated to return to the condenser coil 232 as refrigerant vapor 200. The refrigerant system 198 can include additional condenser coils that can also be used to cool other components, for example, by using an additional refrigerant flow circulated by the refrigerant system 198. By way of example, all or a portion of the total amount or total flow of refrigerant circulated by the refrigerant system 198 can be used to cool the electronic components 228, and the remainder of the total amount of refrigerant circulated by the refrigerant system 198 can be used to cool other components. Thus, the subcooled fluid 222 exiting the condenser coil 232 can be directed to merge with a refrigerant flow exiting or passing through an additional condenser of the refrigerant system 198 before further circulating through the refrigerant system 198, such as for suction to the compressor 199 or to the first path 210 of the condenser coil 232.

[0051] In the illustrated embodiment, the first header 202 of the condenser coil 232 includes a first baffle 206, and the second header 204 of the condenser coil 232 includes a second baffle 208, which are each configured to separate the refrigerant flowing through the first and second headers 202 and 204 through the first and second paths 210 and 212 when the refrigerant flows through the first and second headers 202 and 204. The illustrated cooling system 100 has a series flow arrangement for the refrigerant, but other arrangements or configurations, such as a parallel flow arrangement (e.g., the refrigerant flows in parallel from the first path 210 through the evaporators 216, 218), or a flow arrangement that directs the refrigerant in a direction opposite to the direction shown along the illustrated series flow arrangement, may be utilized. Additionally, the cooling system 100 may include other components, such as additional fans for ventilation purposes (e.g., positioned within the housing 230 and adjacent to the paths 210, 212), additional paths for the condenser coil 232, etc., to facilitate the operation of the refrigerant system 198 for cooling the electronic components 228.

[0052] In certain embodiments, the cooling system 100 may utilize separate refrigerant flows for cooling various electronic components, such as dedicated refrigerant flows for each subset of the electronic components. For example, the cooling system 100 (e.g., the refrigerant system 198) may include separate evaporators (e.g., heat exchangers, heat pipes) configured to cool each respective electronic component, and each evaporator may be configured to receive a separate refrigerant flow, such as a refrigerant flow (e.g., a parallel refrigerant flow) from the same condenser coil 232 (e.g., the same or different paths of the same condenser coil 232), and / or a refrigerant flow from different condenser coils. In embodiments where each evaporator is configured to receive a refrigerant flow from a different condenser coil, separate fans may be used to cool the refrigerant flow (e.g., the refrigerant vapor 200) within each respective condenser coil, and the control system of the cooling system 100 may be configured to operate each of the respective fans (e.g., operate independently) to cool the refrigerant flow and enable the desired cooling provided to the electronic components by the refrigerant flow. Thus, the cooling system 100 may provide appropriate cooling of the electronic components using multiple refrigerant flows.

[0053] Furthermore, the cooling system 100 may include a plurality of refrigerant systems 198 (e.g., independently operable vapor compression systems, heat pipes, etc.) that are fluidly separated from each other. Each refrigerant system 198 may operate to cool its associated electronic component 228. In some embodiments, a subset of the refrigerant systems 198 may include a common or shared electronic component 228 or may be operated via a common or shared electronic component 228. For this reason, each refrigerant from each refrigerant system 198 associated with the common electronic component 228 may be directed to cool the common electronic component 228. Thus, when any one or more of the refrigerant systems 198 is not operating, the refrigerant from the operating refrigerant systems 198 may be used to effect cooling of the common electronic component 228. Thus, the operating electronic components 228 may be properly cooled while any one of the refrigerant systems 198 is operating.

[0054] Furthermore, the refrigerant system 198 may include additional devices that can facilitate the operation of the refrigerant system 198 for cooling the electronic component 228. For example, the refrigerant system 198 may include a dedicated pump configured to drive the flow of refrigerant (e.g., into the evaporators 216, 218) (e.g., instead of or in addition to the compressor 199), and additional conduits configured to direct the refrigerant from different components of the refrigerant system 198 (e.g., an evaporator configured to cool a regulated fluid or an air flow via the refrigerant) into either of the evaporators 216, 218, which can facilitate the cooling provided to the electronic component 228 by the refrigerant system 198. In fact, the refrigerant system 198 may include features for facilitating the cooling of the electronic component 228 when the refrigerant circulated by the refrigerant system 198 is not in a state to provide proper cooling of the electronic component 228 (e.g., the refrigerant is not cold enough), such as during startup of the refrigerant system 198. In some embodiments, the refrigerant system 198 includes a heat pipe or a heat pipe configured to provide cooling to the electronic component 228 to enable the refrigerant system 198 to more easily cool the electronic component 228, such as during startup of the refrigerant system 198, and a device (e.g., a jet pump) configured to generate or inject vapor or other fluid into the refrigerant liquid flow to increase the pressure and flow rate of the refrigerant liquid (e.g., toward the evaporators 216, 218). The refrigerant system 198 may additionally or alternatively include features configured to direct the refrigerant from another component (e.g., another heat exchanger) into either of the evaporators 216, 218 when the refrigerant is not flowing sufficiently from the first path 210 of the condenser 232 into the evaporators 216, 218 (e.g., during startup).

[0055] The refrigerant system 198 may further include a drain valve and conduits configured to regulate the flow of refrigerant through the refrigerant system 198. As an example, the drain valve and conduits may be configured to divert refrigerant from the evaporators 216, 218 to bypass certain components of the refrigerant system 198 that do not facilitate or enable the cooling of the electronic component 228 (e.g., an evaporator configured to cool a regulated fluid or air flow via the refrigerant). Thus, the drain valve and conduits may enable a dedicated supply of refrigerant flow for cooling the electronic component 228. As another example, the drain valve and conduits may be configured to divert refrigerant to bypass the cooling of the electronic component 228 (e.g., to bypass the flow through the housing 230). For example, the drain valve and conduits may be operated to avoid excessive cooling of the electronic component 228 by diverting the refrigerant flow away from the housing 230, such as by avoiding the formation of condensation within the housing 230 (e.g., when the temperature of the electronic component 228 is below a threshold temperature detected by a sensor, when the ambient temperature detected by the sensor is below the threshold temperature, within a predetermined time frame when starting the operation of the electronic component 228). The operation of any of the drain valves of the refrigerant system 198 may be controlled based on the operating parameters of the cooling system 100, such as the ambient temperature, the temperature of the electronic component 228, and the operating time of the cooling system 100.

[0056] The illustrated refrigerant system 198 is configured to circulate a refrigerant that is configured to evaporate and condense during operation of the refrigerant system 198 to cool the electronic component 228, but the refrigerant system 198 may use a different cooled fluid (e.g., water, glycol) to cool the electronic component 228. For example, the refrigerant system 198 may include a heat exchanger or conduits (e.g., a heat pipe or a thermosyphon) in thermal communication with the electronic component 228, and the refrigerant system 198 may direct a cooled fluid (e.g., from a cooling tower, from a source of cooled fluid, from a chiller, from a pump) to the heat exchanger. The cooled fluid may absorb heat from the electronic component 228 via the heat exchanger to cool the electronic component 228 (e.g., without changing the phase of the substance).

[0057] FIG. 8 is a perspective view of an embodiment of a cooling system 100 showing an embodiment of an evaporator 300 (e.g., a heat exchanger, a heat pipe) configured to enable cooling of an electronic component 302 and / or exhaust heat from the electronic component 302 via a refrigerant system (e.g., refrigerant system 198). By way of example, the electronic component 302 can be an electronic device module configured to function as a three-phase inverter for driving a compressor of a chiller. However, as discussed above, the electronic component 302 can be any electronic device or component that generates heat to be removed by the cooling system 100. The evaporator 300 (e.g., first evaporator 216) can include an evaporator coil 304 (e.g., a tube, a pipe) configured to receive a refrigerant flow (e.g., liquid 214) from a condenser (e.g., condenser coil 232) or the like. In the illustrated embodiment, a support 306 (e.g., an intermediate support, a block, a base, a mounting segment) is coupled to the evaporator coil 304. For example, the support 306 can include a plurality of parts and segments 308 configured to capture (e.g., individually capture) the evaporator coil 304. The support 306 can be configured to couple to the electronic component 302 and position the electronic component 302 in thermal communication with the refrigerant flowing through the evaporator 300. The support 306 can include a first hole 310 formed therein, which is configured to align with a second hole 312 of the electronic component 302. For example, the second hole 312 can be formed within a base structure (e.g., a substrate) configured to support the electronic component 302. Then, respective fasteners can be inserted into the aligned holes 310, 312 to fix the electronic component 302 and the support 306 to each other and establish thermal communication between the evaporator coil 304, the support 306, and the electronic component 302.

[0058] In some embodiments, the evaporator 300 (e.g., heat pipe, thermosyphon) can be configured to passively circulate a refrigerant or other working fluid within the evaporator 300 without the operation of a compressor or pump. For example, the refrigerant can flow within the evaporator 300 due to buoyancy, capillary force, dynamic propulsion force, and / or gravity, such as flowing into the evaporator coil 304 through the inlet conduit 314 and flowing out of the evaporator coil 304 through the outlet conduit 316. In fact, the evaporator 300 can include or be in thermal communication with a waste heat system (e.g., waste heat system 101) configured to cool the refrigerant at a part or end of the evaporator 300 on the opposite side of the evaporator coil 304. The waste heat system can include an actively operated waste heat system (e.g., vapor compression system, cooled fluid circuit, fan) and / or a passive waste heat system (e.g., fins, thermosyphon). By heating the refrigerant via the electronic component 302 in the evaporator coil 304, the refrigerant can move away from the evaporator coil 304 (e.g., via natural forces) towards the waste heat system where the refrigerant can be cooled. Then, by cooling the refrigerant via the waste heat system, the cooled refrigerant can move towards the evaporator coil 304 (e.g., via natural forces) to cool the electronic component 302. Thus, the refrigerant can continuously circulate between the waste heat system and the evaporator coil 304 without the active operation of another component (e.g., pump or compressor) that induces the refrigerant. However, the refrigerant can additionally or alternatively be actively circulated through the evaporator 300, such as via a compressor and / or a pump. As an example, the evaporator 300 can be part of a refrigerant circuit or a cooled fluid circuit, and the refrigerant can be actively induced to other components configured to position the refrigerant in thermal communication with the evaporator coil 304 and another cooling fluid (e.g., refrigerant, water, glycol) and then return to the evaporator coil 304 (e.g., via a compressor, via a pump).

[0059] FIG. 9 is a perspective view of an embodiment of a cooling system 100 showing an electronic component 302 coupled to an evaporator 300 (e.g., a heat exchanger, a heat pipe) via a support 306 to position the electronic component 302 in thermal communication with the refrigerant flowing through the evaporator 300. As an example, the electronic component 302 (e.g., the substrate or base structure of the electronic component 302) may abut the evaporator coil 304 when the electronic component 302 is fixed to the support 306. During operation of the evaporator 300 in the illustrated configuration, heat may be transferred from the electronic component 302 to the evaporator coil 304 and / or the support 306, and to the refrigerant flowing through the evaporator coil 304, thereby cooling the electronic component 302. The support 306 may be made of a conductive material to increase heat absorption from the electronic component 302. In this way, the support 306 may provide additional thermal mass to absorb heat from the electronic component 302 and thus cool the electronic component 302. For example, when the evaporator 300 is not substantially cooling the electronic component 302 via the refrigerant (e.g., when the evaporator 300 is not operating, when the temperature of the refrigerant flowing through the evaporator coil 304 has increased, when the refrigerant flowing through the evaporator coil 304 is paused), e.g., during startup of the cooling system 100 before refrigerant flows through the evaporator 300, the support 306 may operate as a heat sink to absorb heat from the electronic component 302 and dissipate heat to the ambient environment (e.g., via convection) to provide a cooling amount for the electronic component 302.

[0060] The refrigerant system 198 may also or alternatively be configured to cool the fluid 106 within the fluid chamber 108 in addition to or instead of cooling the fluid 106 provided via the fins 110. For example, a first evaporator 216 of the refrigerant system 198 may be in thermal communication with the condensation surface 104 of the housing 105. In this way, the refrigerant circulated by the refrigerant system 198 may be configured to cool the fluid 106 within the fluid chamber 108, and thus the fluid 106 within the fluid chamber 108 may be adjusted to cool the electronic component 228.

[0061] With this in mind, FIG. 10 is a schematic of one embodiment of the cooling system 100 showing a refrigerant system 198 configured to cool the fluid 106 within the fluid chamber 108. In this way, the refrigerant system 198 can be incorporated as part of the system of the waste heat system 101 described above. In the illustrated cooling system 100, the first evaporator 216 is also in thermal communication (e.g., coupled, in contact, attached) with the condensation surface 104 of the housing 105 described above. Thus, the refrigerant (e.g., liquid 214) induced to pass through the first evaporator 216 can absorb heat from the fluid 106 within the fluid chamber 108 and cool the fluid 106. In fact, the illustrated refrigerant system 198 can operate using any of the above techniques. Further, the evaporation surface 102 of the housing 105 may be in thermal communication with the electronic component 228. In this way, the fluid 106 within the fluid chamber 108 (e.g., the fluid 106 cooled by the refrigerant induced to pass through the first evaporator 216) can be configured to cool the electronic component 228 via the evaporation surface 102.

[0062] The condensation surface 104 is positioned on the side surface of the housing 105 facing the side surface of the evaporation surface 102. However, the condensation surface 104 and / or the evaporation surface 102 may be positioned on any suitable side surface of the housing 105 that encloses the fluid 106 within the fluid chamber 108. For example, the condensation surface 104 may be disposed on or above the top side surface of the housing 105, and the evaporation surface 102 may be disposed on or above the bottom side surface of the housing 105, etc. Further, the first evaporator 216 is oriented in any suitable manner with respect to the fluid chamber 108 and / or the housing 105 to direct a refrigerant (e.g., liquid 214) through the first evaporator 216 in a specific flow direction with respect to the flow direction of the fluid 106 within the fluid chamber 108 (e.g., along the condensation surface 104 to transition the fluid 106 from vapor to liquid). For example, the flow direction of the refrigerant within the first evaporator 216 may be substantially the same direction (e.g., parallel) as the flow direction of the fluid 106 along the condensation surface 104 within the fluid chamber 108, the flow direction of the refrigerant within the first evaporator 216 may be opposite to the flow direction of the fluid 106 along the condensation surface 104 within the fluid chamber 108 (e.g., in a countercurrent arrangement), and the flow direction of the refrigerant within the first evaporator 216 may be in a cross direction with respect to the flow direction of the fluid 106 along the condensation surface 104 within the fluid chamber 108, etc.

[0063] The refrigerant system 198 may also be configured to cool another component configured to cool the electronic device 228. As an example, FIG. 11 is a schematic of one embodiment of a cooling system 100 that includes a heat pipe 330 (e.g., evaporator 300) configured to cool the electronic component 228. For example, the heat pipe 330 may include a condensation surface 332 that may be coupled to, fixed to, and / or in contact with the evaporator 216. For example, the heat pipe 330 may be embedded (e.g., physically contacting) in a portion of the evaporator 216 to maintain contact and thermal communication with the evaporator 216. Thus, the refrigerant (e.g., liquid 214) flowing through the evaporator 216 may be configured to absorb heat from the fluid (e.g., refrigerant) circulating within the heat pipe 330 via the condensation surface 332, thereby cooling the fluid within the heat pipe 330 and configuring the fluid to condense into a liquid. In some embodiments, the heat pipe 330 may include a capillary structure (e.g., wick) that may absorb the condensed fluid. The capillary structure may drive the cooled liquid fluid through the capillary structure in a first direction 334 towards the evaporation surface 336 of the heat pipe 330 by capillary force. The evaporation surface 336 may be in thermal communication with the electronic component 228. Thus, the cooled liquid fluid may absorb heat from the electronic component 228 via the evaporation surface 336, thereby cooling the electronic component 228. As a result, the fluid may be heated and may flow in a second direction 338 from the evaporation surface 336 (e.g., via the open volume defined by the heat pipe 330) to the condensation surface 332, and the fluid may be recooled in the manner described above. Thus, the fluid within the heat pipe 330 may continuously circulate between the condensation surface 332 and the evaporation surface 336 during operation of the refrigerant system 198 to cool the electronic component 228. In fact, the fluid may circulate passively within the heat pipe 330 (e.g., without the operation of a compressor or pump to drive the movement of the fluid), thereby reducing the costs associated with operating the illustrated cooling system 100.

[0064] In the illustrated cooling system 100, the first direction 334 of the fluid flow within the heat pipe 330 from the condensation surface 332 to the evaporation surface 336 can be opposite to the direction of the refrigerant flow through the first evaporator 216 (e.g., countercurrent arrangement). However, in additional or alternative embodiments, the flow of fluid through the heat pipe 330 from the condensation surface 332 to the evaporation surface 336 can be in any suitable direction, such as substantially the same direction (e.g., parallel flow arrangement) or a cross direction with respect to the refrigerant flow through the first evaporator 216. Further, the heat pipe 330 can be oriented in any suitable manner such that the condensation surface 332 is in thermal communication with the first evaporator 216. For example, the condensation surface 332 can be disposed on a lateral side, a top side, and / or a bottom or lower side of the first evaporator 216. In fact, the heat pipe 330 can be coupled to the first evaporator 216 in any suitable manner to circulate the fluid within the heat pipe 330 using buoyancy, gravity, capillary force, and / or dynamic propulsion force, and the fluid can flow through the heat pipe 330 in any suitable direction with respect to gravity, such as a vertical direction and / or a horizontal direction, to facilitate heat exchange with the refrigerant. For this purpose, the condensation surface 332 can also extend in any suitable direction with respect to the length of the first evaporator 216, such as along the length (e.g., axially) or in a direction crossing the length (e.g., transversely). Still further, although the condensation surface 332 of the illustrated heat pipe 330 extends linearly, in additional or alternative embodiments, the condensation surface 332 can extend in any suitable manner. By way of example, the condensation surface 332 can curve or change direction along the direction of the first evaporator 216 (e.g., zigzag), and / or the condensation surface 332 can form a plurality of loops or coils configured to capture the first evaporator 216 (e.g., the cylindrical profile of the first evaporator 216).

[0065] In a further embodiment, the condensation surface 332 may be inserted inside the first evaporator 216 and extend through the inside of the first evaporator 216. Thus, a portion of the heat pipe 330 may be immersed in the liquid 214 encapsulated within the first evaporator 216, such as a pool of the liquid 214, to cool the heat pipe 330 via natural convection or pool boiling. In such an embodiment, baffles may be disposed within the evaporator 216 and / or the surface of the evaporator 216 (e.g., the inner surface) may include a enhanced surface (e.g., a finned surface) to direct the refrigerant across the condensation surface 332 within the first evaporator 216. Further, the cooling system 100 may include any suitable number of heat pipes 330 for cooling the electronic component 228. For example, the heat pipes 330 may be positioned in a parallel arrangement (e.g., each fluid of the heat pipes 330 is in thermal communication with the refrigerant flowing through the electronic component 228 and the first evaporator 216 side-by-side or in an end-to-end arrangement), or in a series arrangement (the fluids within a subset of the heat pipes 330 are in thermal communication with each other). The heat pipes 330 may also utilize different amounts and / or types of fluids to cool each other and / or the electronic component 228.

[0066] Although only certain features and embodiments have been illustrated and described, those skilled in the art will be able to envision many modifications and variations such as variations in the sizes, dimensions, structures, shapes, and ratios of various elements, the values of parameters such as temperature and pressure, mounting arrangements, the use of materials, color, and orientation, etc., without substantially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. Therefore, it should be understood that the appended claims are intended to cover all such modifications and variations that fall within the true spirit of the present disclosure. Further, in order to provide a concise description of the exemplary embodiments, not all features of actual implementation examples may be described, such as those not related to the presently contemplated best mode or those not related to enabling. It should be understood that, as in any engineering or design project, many implementation-specific decisions may be made in the development of any such actual implementation example. Such development efforts can be complex and time-consuming, but nevertheless, for those skilled in the art who benefit from the present disclosure without undue experimentation, they become routine tasks of design, fabrication, and manufacture.

[0067] The technology presented and claimed herein refers to and is applicable to material objects and specific examples of a practical nature that clearly improve the art, and thus is not abstract, intangible, or purely theoretical. Further, if any of the claims appended hereto include one or more elements designated as "means for [performing a function]" or "steps for [performing a function]", such elements are intended to be construed in accordance with 35 U.S.C. § 112(f). However, for any claim that includes elements designated in other ways, such elements are not intended to be construed in accordance with 35 U.S.C. § 112(f). 〔Aspect 1〕 A cooling system for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising: A housing defining a fluid chamber, An evaporation surface configured to be in thermal communication with a liquid fluid in the fluid chamber and in thermal communication with an electronic component coupled to the housing, the evaporation surface being configured to transfer thermal energy from the electronic component to the liquid fluid such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and A housing comprising a condensation surface configured to absorb thermal energy from the vapor fluid such that the vapor fluid condenses to the liquid fluid within the fluid chamber, and An exhaust heat system coupled to an outer surface of the housing, the exhaust heat system being configured to absorb thermal energy from the condensation surface. 〔Aspect 2〕 The cooling system according to Aspect 1, wherein the exhaust heat system comprises a plurality of fins. 〔Aspect 3〕 The cooling system according to Aspect 2, further comprising a fan configured to force air across the plurality of fins. 〔Aspect 4〕 The cooling system according to Aspect 2, further comprising an additional housing configured to guide air across the plurality of fins, at least a portion of the cooling system being disposed within the additional housing. 〔Aspect 5〕 The cooling system according to Aspect 1, further comprising a plurality of baffles positioned within the housing, the plurality of baffles being configured to direct the vapor fluid toward the condensation surface. 〔Aspect 6〕 The cooling system according to Aspect 5, wherein each baffle of the plurality of baffles is inclined at a downward angle toward the condensation surface. 〔Aspect 7〕 The cooling system according to Aspect 1, further comprising a baffle positioned within the fluid chamber, the baffle being configured to create a column of the liquid fluid within the fluid chamber and to direct the liquid fluid toward the evaporation surface. 〔Aspect 8〕 The cooling system according to Aspect 7, wherein the baffle is disposed above a bottom surface of the housing with respect to gravity, creating a gap between the baffle and the bottom surface. 〔Aspect 9〕 A cooling system for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising: An exhaust heat system, and A housing defining a fluid chamber configured to contain a fluid therein, and comprising: A first surface configured to be in thermal communication with an electronic component coupled to the housing, the first surface being configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the housing; A second surface in thermal communication with the exhaust heat system, the second surface being configured to transfer thermal energy from the fluid to the exhaust heat system to condense the fluid within the housing; a cooling system. 〔Aspect 10〕 The cooling system according to aspect 9, wherein the exhaust heat system comprises a plurality of fins coupled to an outer surface of the housing on a lateral side of the housing. 〔Aspect 11〕 The cooling system according to aspect 10, further comprising a fan configured to induce an air flow across the plurality of fins, the cooling system being configured to direct the fluid vaporized within the fluid chamber in a first direction, the cooling system being configured to direct the fluid condensed within the fluid chamber in a second direction opposite to the first direction, and the fan being configured to induce the air flow across the plurality of fins in the first direction. 〔Aspect 12〕 A sensor configured to detect an operating parameter of the fluid within the fluid chamber and output a feedback indicating the operating parameter; A controller communicably coupled to the sensor and the fan, the controller being configured to adjust the operation of the fan in response to the feedback; the cooling system according to aspect 11. 〔Aspect 13〕 The cooling system according to aspect 9, wherein the first surface is a bottom surface of the housing and the second surface extends in a direction intersecting the first surface. 〔Aspect 14〕 The cooling system according to aspect 9, further comprising the electronic component coupled to the housing, the first surface comprising an opening, and the electronic component being aligned with the opening such that at least a portion of the electronic component forms at least a portion of the first surface to enable direct contact between the electronic component and the fluid. 〔Aspect 15〕 The cooling system according to aspect 9, wherein the housing includes a third surface facing the second surface with respect to the fluid chamber, and the third surface is angled toward the second surface so as to guide vapor fluid from the first surface toward the second surface. 〔Aspect 16〕 A heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising: an electronic component configured to generate heat during operation of the HVAC&R system; and a cooling system coupled to the electronic component, the cooling system comprising: a housing defining a fluid chamber configured to contain a liquid fluid; an evaporation surface of the housing in thermal communication with the electronic component, the evaporation surface being configured to transfer thermal energy from the electronic component to the liquid fluid in the fluid chamber to vaporize the liquid fluid into a vapor fluid; a condensation surface of the housing configured to be in thermal communication with a waste heat system of the cooling system, the condensation surface being configured to transfer thermal energy from the vapor fluid to the waste heat system to condense the vapor fluid into the liquid fluid; and a baffle disposed within the housing and configured to guide the vapor fluid from the evaporation surface toward the condensation surface. 〔Aspect 17〕 The HVAC&R system according to aspect 16, wherein the evaporation surface is disposed on a first side surface of the housing, and the condensation surface is disposed on a second side surface of the housing opposite the first side surface. 〔Aspect 18〕 The HVAC&R system according to aspect 17, further comprising an additional baffle positioned within the housing and between the evaporation surface and the condensation surface, the additional baffle being configured to create a column of the liquid fluid between the additional baffle and the condensation surface and to guide the liquid fluid from the condensation surface toward the evaporation surface. 〔Aspect 19〕 The HVAC&R system according to aspect 16, wherein the housing includes a pressure relief device configured to operate in response to a pressure within the housing exceeding a predetermined threshold. 〔Aspect 20〕 The HVAC&R system according to aspect 16, comprising the exhaust heat system, wherein the exhaust heat system comprises a plurality of fins coupled to the housing, and the plurality of fins are configured to transfer thermal energy to an air flow induced across the plurality of fins from the condensation surface.

Claims

1. A cooling system for a heating, ventilation, air conditioning, and cooling (HVAC&R) system, comprising: A housing defining a fluid chamber, comprising: an evaporation surface configured in thermal communication with a liquid fluid in the fluid chamber and in thermal communication with an electronic component coupled to the housing, the evaporation surface configured to transfer thermal energy from the electronic component to the liquid fluid such that the liquid fluid transitions to a vapor fluid in the fluid chamber; and a housing including a condensation surface configured to absorb thermal energy from the vapor fluid such that the vapor fluid condenses into the liquid fluid within the fluid chamber, the condensation surface and the evaporation surface extending in different planes; and a heat rejection system coupled to an exterior surface of the housing, the heat rejection system configured to absorb thermal energy from the condensation surface; and A cooling system comprising a plurality of baffles positioned within the enclosure, the plurality of baffles configured to direct the vapor fluid towards the condensing surface.

2. The cooling system of claim 1 , wherein each baffle of the plurality of baffles is angled downwardly toward the condensing surface.

3. A cooling system for a heating, ventilation, air conditioning, and cooling (HVAC&R) system, comprising: A housing defining a fluid chamber, comprising: an evaporation surface configured in thermal communication with a liquid fluid in the fluid chamber and in thermal communication with an electronic component coupled to the housing, the evaporation surface configured to transfer thermal energy from the electronic component to the liquid fluid such that the liquid fluid transitions to a vapor fluid in the fluid chamber; and a housing including a condensation surface configured to absorb thermal energy from the vapor fluid such that the vapor fluid condenses into the liquid fluid within the fluid chamber, the condensation surface and the evaporation surface extending in different planes; and a heat rejection system coupled to an exterior surface of the housing, the heat rejection system configured to absorb thermal energy from the condensation surface; and A cooling system comprising: a baffle positioned within the fluid chamber and configured to create a column of the liquid fluid within the fluid chamber and to direct the liquid fluid towards the evaporative surface.

4. The cooling system of claim 3 , wherein the baffle is disposed above a bottom surface of the enclosure relative to gravity to define a gap between the baffle and the bottom surface.

5. A cooling system for a heating, ventilation, air conditioning, and cooling (HVAC&R) system, comprising: A heat exhaust system, a housing defining a fluid chamber configured to contain a fluid therein, said housing comprising: a first surface configured to be in thermal communication with an electronic component coupled to the housing, the first surface configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the housing; a second surface in thermal communication with the heat rejection system, the second surface configured to transfer thermal energy from the fluid to the heat rejection system to condense the fluid within the enclosure, the second surface and the first surface extending in different planes; The cooling system, wherein the first surface is a bottom surface of the housing, and the second surface extends transversely to the first surface.

6. A cooling system for a heating, ventilation, air conditioning, and cooling (HVAC&R) system, comprising: A heat exhaust system, a housing defining a fluid chamber configured to contain a fluid therein, said housing comprising: a first surface configured to be in thermal communication with an electronic component coupled to the housing, the first surface configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the housing; a second surface in thermal communication with the heat rejection system, the second surface configured to transfer thermal energy from the fluid to the heat rejection system to condense the fluid within the enclosure, the second surface and the first surface extending in different planes; 11. A cooling system comprising: an electronic component coupled to the housing, the first surface comprising an opening, the electronic component aligned with the opening such that at least a portion of the electronic component forms at least a portion of the first surface to enable direct contact between the electronic component and the fluid.

7. A cooling system for a heating, ventilation, air conditioning, and cooling (HVAC&R) system, comprising: A heat exhaust system, a housing defining a fluid chamber configured to contain a fluid therein, said housing comprising: a first surface configured to be in thermal communication with an electronic component coupled to the housing, the first surface configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the housing; a second surface in thermal communication with the heat rejection system, the second surface configured to transfer thermal energy from the fluid to the heat rejection system to condense the fluid within the enclosure, the second surface and the first surface extending in different planes; the housing includes a third surface opposing the second surface with respect to the fluid chamber, the third surface being angled toward the second surface to direct vapor fluid from the first surface toward the second surface.

8. A heating, ventilation, air conditioning, and cooling (HVAC&R) system comprising: an electronic component configured to generate heat during operation of the HVAC&R system; a cooling system coupled to the electronic component, the cooling system comprising: a housing defining a fluid chamber configured to contain a liquid fluid; an evaporation surface of the housing in thermal communication with the electronic component, the evaporation surface configured to transfer thermal energy from the electronic component to the liquid fluid in the fluid chamber to vaporize the liquid fluid into a vapor fluid; a condensation surface of the housing configured to be in thermal communication with a heat rejection system of the cooling system, the condensation surface configured to transfer thermal energy from the vapor fluid to the heat rejection system to condense the vapor fluid into the liquid fluid, the condensation surface and the evaporation surface being non-coplanar; a baffle disposed within the enclosure and configured to direct the vapor fluid from the evaporative surface toward the condensing surface. The HVAC&R system, wherein the evaporative surface is disposed on a first side of the housing and the condensing surface is disposed on a second side of the housing opposite the first side.

9. 10. The HVAC&R system of claim 8, further comprising an additional baffle positioned within the housing and between the evaporative surface and the condensing surface, the additional baffle configured to create a column of the liquid fluid between the additional baffle and the condensing surface and to direct the liquid fluid from the condensing surface towards the evaporative surface.

10. 10. The HVAC&R system of claim 8, wherein the enclosure includes a pressure relief device configured to actuate in response to pressure within the enclosure exceeding a predetermined threshold.

11. 10. The HVAC&R system of claim 8, further comprising a heat rejection system, the heat rejection system comprising a plurality of fins coupled to the housing, the plurality of fins configured to transfer thermal energy from the condensing surface to an airflow induced across the plurality of fins.

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