How to make a vapor chamber

Abstract

To provide members for manufacturing a vapor chamber, which are superior in flexibility and have a specially excellent heat transfer ability, and to provide a vapor chamber superior in flexibility and having a specifically excellent heat transfer ability, and a manufacturing method thereof.SOLUTION: Members for manufacturing a vapor chamber of the present invention are members used in manufacturing a vapor chamber and are characterized to include a fiber base material made of fibers and resin materials in a non-hardened state impregnated with the fiber base material. A thickness of the fiber base material is preferably 10 μm or more and 1,000 μm or less.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to How to make a vapor chamber This is regarding. [Background technology]

[0002] For example, heat-generating components such as central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors used in mobile terminals such as mobile terminals and tablet terminals are cooled by heat pipes (see, for example, Patent Document 1).

[0003] In recent years, in order to make mobile devices thinner, vapor chambers, which can be made thinner than heat pipes, have been developed.

[0004] A working fluid is sealed inside the vapor chamber, and this working fluid absorbs heat from the heat-generating components and transfers the heat, thereby cooling the heat-generating components.

[0005] More specifically, the working fluid in the vapor chamber receives heat from the heat-generating component in the part close to the heat-generating component (evaporation part) and evaporates into vapor, and the vapor then moves to a position away from the evaporation part, where it is cooled and condenses into liquid.

[0006] A liquid flow path section with a capillary structure (wick) is provided within the vapor chamber, and the liquefied working fluid passes through this liquid flow path section and is transported toward the evaporation section, where it is again exposed to heat and evaporated.

[0007] In this way, the working fluid circulates inside the vapor chamber while repeatedly undergoing phase changes, i.e. evaporation and condensation, thereby transferring heat from the device and improving heat dissipation efficiency.

[0008] However, conventional vapor chambers lack flexibility, and depending on the shape of the heat-generating component, it may not be possible to achieve sufficient adhesion to the heat-generating component. Also, there is a demand for further improvement in the heat transport capacity of vapor chambers. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2016-205693 A Summary of the Invention [Problem to be solved by the invention]

[0010] The object of the present invention is to 、 A vapor chamber that is highly flexible and has particularly excellent heat transport capabilities of The present invention aims to provide a manufacturing method thereof. [Means for solving the problem]

[0011] Such objectives are as follows: 9 This is achieved by the present invention. (1) Fibers and an uncured resin material A vapor chamber manufacturing component preparation process for preparing a vapor chamber manufacturing component; A first bonding step of bonding the vapor chamber manufacturing member to a first sheet material at a first surface, which is one surface of the member; an exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern; a developing step for removing the uncured resin material from the portion not irradiated with the light in the exposure step; A second bonding process of bonding the vapor chamber manufacturing member that has undergone the developing process to a second sheet material on a second surface that is the surface opposite to the first surface; and a hydraulic fluid supplying and sealing step of injecting a hydraulic fluid into the space between the first sheet material and the second sheet material and sealing the space. A vapor chamber characterized by Manufacturing method .

[0012] (2) The vapor chamber manufacturing member is the fiber A fiber base material composed of and impregnated in the fiber base material. The above and a resin material. The method for producing a vapor chamber according to the above (1) .

[0013] (3) The fiber substrate according to (2) above, wherein the thickness of the fiber substrate is 10 μm or more and 1000 μm or less. How to make a vapor chamber .

[0014] (4) The above The thickness of the vapor chamber manufacturing member according to (2) or (3) above is 10 μm or more and 2000 μm or less. How to make a vapor chamber .

[0015] (5) The fiber according to any one of (1) to (4) above, wherein the fiber is made of an aromatic resin containing a heterocycle in the molecule. How to make a vapor chamber .

[0016] (6) The above Any one of (1) to (5) above, wherein when the content of the fiber in the vapor chamber manufacturing member is Xf [mass%] and the content of the resin material is Xr [mass%], the relationship of 0.01≦Xf / Xr≦8.0 is satisfied. How to make a vapor chamber .

[0017] (7) The resin material according to any one of (1) to (6) above, which contains an alkali-soluble resin and a photopolymerizable resin. How to make a vapor chamber .

[0018] (8) The alkali-soluble resin according to (7), wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group. How to make a vapor chamber .

[0019] (9) The resin material further comprises: The above The composition according to any one of (7) to (8), which contains a thermosetting resin different from the alkali-soluble resin. How to make a vapor chamber . Effect of the Invention

[0023] According to the present invention 、 A vapor chamber that is highly flexible and has particularly excellent heat transport capabilities of A method of manufacture may be provided. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a perspective view showing a schematic diagram of an example of a member for manufacturing a vapor chamber according to the present invention. [Diagram 2] FIG. 1 is a longitudinal sectional view showing a schematic diagram of an example of a member for manufacturing a vapor chamber according to the present invention. [Diagram 3] 1 is a longitudinal cross-sectional view showing a schematic diagram of another example of a vapor chamber manufacturing member of the present invention. FIG. [Figure 4] 1 is a longitudinal cross-sectional view showing a schematic diagram of another example of a vapor chamber manufacturing member of the present invention. FIG. [Diagram 5] FIG. 1 is a vertical cross-sectional view illustrating a schematic diagram of an example of a vapor chamber of the present invention. [Figure 6] FIG. 2 is a vertical cross-sectional view illustrating a schematic diagram of another example of the vapor chamber of the present invention. [Figure 7] FIG. 2 is a vertical cross-sectional view illustrating a schematic diagram of another example of the vapor chamber of the present invention. [Figure 8] FIG. 2 is a vertical cross-sectional view illustrating a schematic diagram of another example of the vapor chamber of the present invention. [Figure 9] 2 is a plan view showing a schematic diagram of a wick structure provided in the vapor chamber of the present invention. FIG. [Figure 10] 1 is a vertical cross-sectional view illustrating a schematic example of a method for manufacturing a vapor chamber of the present invention. FIG. [Figure 11] 1 is a vertical cross-sectional view illustrating a schematic example of a method for manufacturing a vapor chamber of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] The present invention will now be described in detail with reference to the accompanying drawings. [1] Vapor chamber manufacturing materials First, the member for manufacturing a vapor chamber of the present invention will be described. Fig. 1 is a perspective view showing an example of a vapor chamber manufacturing member of the present invention. Fig. 2 is a vertical cross-sectional view showing an example of a vapor chamber manufacturing member of the present invention. Fig. 3 and Fig. 4 are vertical cross-sectional views showing other examples of the vapor chamber manufacturing member of the present invention.

[0026] The vapor chamber manufacturing member 10' is used for manufacturing the vapor chamber 100 described later. More specifically, the vapor chamber manufacturing member 10' is a wick structure manufacturing member as a molded body manufacturing member used for manufacturing the wick structure 10 as a molded body provided in the vapor chamber 100.

[0027] The vapor chamber manufacturing member 10' includes the fibers 131 and an uncured resin material 14'.

[0028] This makes it possible to provide a vapor chamber manufacturing member 10' that has excellent flexibility and can be suitably used to manufacture a vapor chamber 100 having particularly excellent heat transport capacity. In addition, since the vapor chamber 100 can have excellent flexibility, the vapor chamber 100 can be in good contact with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the vapor chamber 100 can more reliably exhibit excellent heat transport capacity.

[0029] Such excellent effects are believed to be obtained for the following reasons. That is, since the vapor chamber manufacturing member 10' contains the fiber 131 and the uncured resin material 14', the wick structure 10 formed using the vapor chamber manufacturing member 10' can be made of a material containing the fiber 131 and the cured resin 14, and the vapor chamber 100 as a whole can exhibit excellent flexibility (pliability). In addition, since the vapor chamber manufacturing member 10' contains the uncured resin material 14', for example, by irradiating light (exposure light) in a predetermined pattern in a method to be described later, the flow path portion 15 of the working liquid 30 in the vapor chamber 100, particularly the flow path portion of the gaseous working liquid 30 (a portion of the flow path portion 15 where the fiber 131 does not exist or a portion where the density of the fiber 131 is low) and the flow path portion of the liquid working liquid 30 (a portion of the flow path portion 15 where the fiber 131 exists or a portion where the density of the fiber 131 is high) can be suitably formed. More specifically, a structure for moving the gaseous working liquid 30 and a structure for moving the liquid working liquid 30 by capillary action can be formed in a suitable arrangement. This can speed up the cycle of evaporation and condensation of the working liquid 30, and the heat transport capacity of the vapor chamber 100 as a whole can be particularly excellent. However, in the flow path portion of the gaseous working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are not present or where the density of the fibers 131 is low), a part of the liquid working liquid 30 may flow, or in the flow path portion of the liquid working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are present or where the density of the fibers 131 is high), a part of the gaseous working liquid 30 may flow.

[0030] In addition, the shape of the flow path portion 15 and the flow path wall 16 of the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing member 10' can be suitably adjusted according to the use of the vapor chamber 100, the application site, etc. In other words, it has excellent on-demand properties. In addition, the vapor chamber 100 (wick structure 10) can be suitably manufactured by general treatments such as light irradiation and heat treatment, and the vapor chamber 100 with the above-mentioned excellent characteristics can be manufactured without performing complicated metal processing, etc. In addition, the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 can be formed in a common process, and alignment of these parts is not required, so that high productivity and high yield can be achieved in the manufacture of the vapor chamber 100.

[0031] The uncured resin material 14' may be a curable resin material in which the curing reaction has not yet been completed, or may be a resin material in which the curing reaction has partially progressed, for example, a B-stage resin material.

[0032] In particular, in the illustrated configuration, the vapor chamber manufacturing member 10' includes a fiber base material 13 made of fibers 131 and an uncured resin material 14' impregnated in the fiber base material 13.

[0033] This makes the above-mentioned effects more pronounced. For example, by including the fiber base material 13 in which the fibers 131 are not only contained in an independent state but in which a plurality of fibers 131 are entangled, for example, it is easy to adjust the gaps between the fibers 131 in the vapor chamber manufacturing member 10' to a state in which the liquid working liquid 30 is likely to cause capillary action, and it is also easy to adjust the arrangement position of the fibers 131 in the vapor chamber manufacturing member 10'. Therefore, in the wick structure 10 formed using the vapor chamber manufacturing member 10', the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 can be more suitably formed, and the above-mentioned effects can be more reliably exhibited. Furthermore, the vapor chamber manufacturing member 10' can be manufactured easily, and the arrangement and distribution of the fibers 131 in the vapor chamber manufacturing member 10' can be easily adjusted. For example, undesired uneven distribution of the fibers 131 in each part of the vapor chamber manufacturing member 10' (for example, insufficient presence of the fibers 131 in the part that should become the flow path portion 15) can be preferably prevented.

[0034] In the illustrated configuration, the fiber base material 13 is in the form of a sheet, but the shape of the fiber base material 13 is not particularly limited.

[0035] In addition, in the illustrated configuration, the vapor chamber manufacturing member 10' is sheet-shaped, and in particular has a shape corresponding to the sheet-shaped fiber base material 13, but the shape of the vapor chamber manufacturing member 10' is not particularly limited.

[0036] [1-1] Fiber The member 10 ′ for manufacturing a vapor chamber includes fibers 131 .

[0037] The fiber 131 may be made of any material. Examples of the material for the fiber 131 include cotton, linen, wool, polyester resin, polyamide resin, acrylic resin, aromatic resin containing a heterocycle in the molecule, glass, carbon, iron, silver, copper, etc., and one or more types selected from these may be used in combination.

[0038] In particular, if the fibers 131 are made of an aromatic resin containing a heterocycle in the molecule, the long-term durability of the vapor chamber 100 is improved.

[0039] Examples of aromatic resins containing a heterocycle in the molecule include polyimide, polyamideimide, polyesterimide, polybenzoxazole, etc., among which polyphenylenebenzobisoxazole is preferred. An example of a commercially available fiber made of polyparaphenylenebenzobisoxazole is Zylon manufactured by Toyobo Co., Ltd.

[0040] The thickness of the fibers 131 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 4 μm or more and 30 μm or less, and even more preferably 5 μm or more and 15 μm or less.

[0041] This prevents the vapor chamber manufacturing member 10' from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, and improves the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

[0042] In the vapor chamber manufacturing member 10' and the vapor chamber 100, the fibers 131 may be included in a state where a plurality of fibers 131 are bundled together, that is, as a fiber bundle. Examples of the fiber bundle include a multiple-ply yarn, a single-ply yarn, a lange-ply yarn, a braid, and the like.

[0043] This prevents the vapor chamber manufacturing member 10' from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, and improves the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

[0044] In the illustrated configuration, the fibers 131 form a sheet-like fiber base material (fiber sheet) 13.

[0045] This provides the above-mentioned effect of including the fiber base material 13. In addition, since the fiber base material 13 is in the form of a sheet, it is possible to suitably prevent the vapor chamber manufacturing member 10' from becoming thicker than necessary, and it is also possible to more suitably prevent unintended deformation of the fiber base material 13 during the manufacturing of the vapor chamber 100 (wick structure 10) and unintended movement of the fibers 131 in the vapor chamber manufacturing member 10' (wick structure 10).

[0046] The fiber base material 13 may be, for example, a nonwoven fabric or a woven fabric. When the fiber base material 13 is a woven fabric, examples of the woven fabric include plain weave, twill weave, satin weave, leno weave, mock weave, twill weave, double weave, and the like.

[0047] The thickness of the fiber base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 200 μm or less.

[0048] This prevents the vapor chamber manufacturing member 10' from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, and further improves the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

[0049] The fiber base material 13 may have a portion having a different fiber density. For example, the fiber base material 13 may have a portion having a different fiber density in the thickness direction.

[0050] The vapor chamber manufacturing member 10' may include a plurality of fiber base materials 13. In this case, these fiber base materials 13 may be of the same condition or of different conditions. When the vapor chamber manufacturing member 10' includes a plurality of fiber base materials 13, for example, the plurality of fiber base materials 13 may be laminated in the thickness direction of the vapor chamber manufacturing member 10'.

[0051] The member 10 ′ for manufacturing a vapor chamber may include the fiber base material 13 , and may further include fibers 131 independent of the fiber base material 13 .

[0052] The content of fibers 131 in the vapor chamber manufacturing member 10' is preferably 1% by mass or more and 80% by mass or less, more preferably 3% by mass or more and 75% by mass or less, and even more preferably 5% by mass or more and 70% by mass or less.

[0053] In particular, when the fibers 131 are made of an inorganic material, the content of the fibers 131 in the vapor chamber manufacturing member 10' is preferably 40% by mass or more and 80% by mass or less, more preferably 45% by mass or more and 75% by mass or less, and even more preferably 50% by mass or more and 70% by mass or less.

[0054] Furthermore, when the fibers 131 are made of an organic material, the content of the fibers 131 in the vapor chamber manufacturing component 10' is preferably 1% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 35% by mass or less, and even more preferably 5% by mass or more and 30% by mass or less.

[0055] By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[0056] [1-2] Resin materials The vapor chamber manufacturing member 10' contains an uncured resin material 14'.

[0057] The resin material 14' may be any material containing a curable resin in an uncured state, may be a material in which the curing reaction has progressed to a certain degree (e.g., a resin in the B stage), or may be a material containing a thermoplastic resin in addition to a curable resin in an uncured state.

[0058] Among them, it is preferable that the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin.

[0059] As a result, in a method to be described later, a predetermined pattern can be preferably formed through an exposure step and a development step, and an alkaline aqueous solution, which has a smaller environmental impact, can be preferably used in the development step, instead of an organic solvent that is widely used as a developer.

[0060] The alkali-soluble resin will now be described. Examples of the alkali-soluble resin include novolak resins such as cresol type, phenol type, bisphenol A type, bisphenol F type, catechol type, resorcinol type, and pyrogallol type; acrylic resins such as phenol aralkyl resins, hydroxystyrene resins, methacrylic acid resins, and methacrylic acid ester resins; cyclic olefin resins containing a hydroxyl group, a carboxyl group, or the like; and polyamide resins (specifically, resins having at least one of a polybenzoxazole structure and a polyimide structure and having a hydroxyl group, a carboxyl group, an ether group, or an ester group in the main chain or side chain, resins having a polybenzoxazole precursor structure, resins having a polyimide precursor structure, resins having a polyamic acid ester structure, and the like).

[0061] As the alkali-soluble resin, for example, a resin having an alkali-soluble group and a double bond can be suitably used.

[0062] Examples of the resin having an alkali-soluble group and a double bond include curable resins that can be cured by both light and heat.

[0063] Examples of the alkali-soluble group include a hydroxyl group, a carboxyl group, etc. The alkali-soluble group can also contribute to the thermosetting reaction.

[0064] Examples of such resins include thermosetting resins having a photoreactive group such as an acryloyl group, a methacryloyl group, or a vinyl group, and photocurable resins having a thermally reactive group such as a phenolic hydroxyl group, an alcoholic hydroxyl group, a carboxyl group, or an acid anhydride group. The photocurable resin may further have a thermally reactive group such as an epoxy group, an amino group, or a cyanate group. Specific examples of such resins include (meth)acrylic modified phenolic resins, (meth)acryloyl group-containing acrylic acid polymers, and carboxyl group-containing (epoxy)acrylates. Among these, the alkali-soluble resin is preferably one containing a (meth)acrylic group and a phenolic hydroxyl group, and more preferably a (meth)acrylic-modified phenolic resin.

[0065] By using a resin containing an alkali-soluble group, when removing resin whose double bond moieties have not reacted during development, an alkaline aqueous solution which has a lower environmental impact can be used instead of an organic solvent which is usually used as a developer, and since the double bond moieties contribute to the curing reaction, the heat resistance of the cured resin 14 described below can be maintained.

[0066] Here, when a thermosetting resin having a photoreactive group is used, the modification rate (substitution rate) of the photoreactive group is not particularly limited, but is preferably 20 mol % or more and 80 mol % or less, and more preferably 30 mol % or more and 70 mol % or less, of the total reactive groups of the resin having an alkali-soluble group and a double bond.

[0067] This makes it possible to improve the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described later, i.e., the reproducibility of the pattern in the exposure process. As a result, it can be more suitably applied to the manufacture of the vapor chamber 100 including the wick structure 10 having a fine pattern.

[0068] On the other hand, when a photocurable resin having a thermally reactive group is used, the modification rate (substitution rate) of the thermally reactive group is not particularly limited, but is preferably from 20 mol% to 80 mol%, and more preferably from 30 mol% to 70 mol%, of the total reactive groups of the resin having an alkali-soluble group and a double bond.

[0069] This makes it possible to improve the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 described later, i.e., the reproducibility of the pattern in the exposure process. As a result, it can be more suitably applied to the manufacture of the vapor chamber 100 including the wick structure 10 having a fine pattern.

[0070] The weight average molecular weight of the resin having an alkali-soluble group and a double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 or more and 150,000 or less.

[0071] This makes it possible to more suitably remove the resin material 14' in the developing step while ensuring sufficient stability of the shape of the resin material 14' in the vapor chamber manufacturing member 10'.

[0072] The weight average molecular weight can be evaluated, for example, by using GPC, and can be calculated from a calibration curve prepared in advance using a styrene standard substance. In particular, it can be measured using tetrahydrofuran (THF) as a measurement solvent under a temperature condition of 40°C. In the examples described later, the value obtained by measurement under these conditions is also shown as the weight average molecular weight.

[0073] The content of the alkali-soluble resin in the resin material 14' is not particularly limited, but is preferably from 10% by mass to 80% by mass, and more preferably from 15% by mass to 70% by mass.

[0074] This makes it possible to improve the resolution in the exposure process and the developability in the development process while sufficiently improving the stability of the shape of the resin material 14' in the vapor chamber manufacturing member 10'. Also, by the heat treatment in the manufacturing process of the vapor chamber 100, it is possible to improve the bonding strength and adhesion between the wick structure 10 and the container 20 (the first sheet material 21 and the second sheet material 22).

[0075] Next, the photopolymerizable resin will be described. When the resin material 14' contains a photopolymerizable resin in addition to the above-mentioned alkali-soluble resin, the patterning properties can be improved.

[0076] Examples of photopolymerizable resins include unsaturated polyesters, acrylic compounds such as acrylic monomers and oligomers having at least one acryloyl group or methacryloyl group in one molecule, and vinyl compounds such as styrene. One or a combination of two or more selected from these can be used.

[0077] Among these, ultraviolet-curable resins mainly composed of acrylic compounds are preferred. Acrylic compounds cure quickly when irradiated with light (exposure light), and the resin material 14' can be suitably patterned with a relatively small amount of exposure light.

[0078] Examples of the acrylic compound include monomers of acrylic acid esters and methacrylic acid esters, and more specifically, bifunctional acrylates such as ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, glycerin diacrylate, glycerin dimethacrylate, 1,10-decanediol diacrylate, and 1,10-decanediol dimethacrylate, and polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate.

[0079] Among these, (meth)acrylic acid esters are preferred, and acrylic acid esters and methacrylic acid alkyl esters having an ester moiety with 1 to 15 carbon atoms are more preferred. This can improve the reactivity and the sensitivity in the exposure step.

[0080] The photopolymerizable resin is not particularly limited, but is preferably liquid at room temperature (23° C.).

[0081] This can improve the curing reactivity with exposure light (especially ultraviolet light). In addition, it can facilitate the mixing with other compounding components (e.g., alkali-soluble resin). Examples of photopolymerizable resins that are liquid at room temperature include the above-mentioned ultraviolet curable resins mainly composed of acrylic compounds.

[0082] The weight average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 or more and 3,000 or less.

[0083] This can improve the reactivity of the resin material 14', improve the sensitivity in the exposure step, and improve the resolution of the resin material 14'.

[0084] The content of the photopolymerizable resin in the resin material 14' is not particularly limited, but is preferably from 9% by mass to 40% by mass, and more preferably from 13% by mass to 30% by mass.

[0085] This allows the resin cured material 14 described later to have both high heat resistance and flexibility. Also, the resolution of the resin material 14' in the method for producing the vapor chamber 100 described later, i.e., the reproducibility of the pattern in the exposure step, can be improved. As a result, the method can be more suitably applied to the production of the vapor chamber 100 including the wick structure 10 having a fine pattern.

[0086] When the content of alkali-soluble resin in resin material 14' is XA [mass %] and the content of photopolymerizable resin in resin material 14' is XP [mass %], it is preferable to satisfy the relationship of 0.15≦XP / XA≦0.90, it is more preferable to satisfy the relationship of 0.19≦XP / XA≦0.87, and it is even more preferable to satisfy the relationship of 0.22≦XP / XA≦0.33.

[0087] This makes it possible to further improve the balance of the shape stability of the resin material 14' in the vapor chamber manufacturing component 10', the resolution in the exposure process, the developability in the development process, the bonding strength between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22), adhesion, the heat resistance and flexibility of the cured resin 14, etc.

[0088] When the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin, it is preferable that the resin material 14' further contains a thermosetting resin different from the alkali-soluble resin.

[0089] This can improve the heat resistance of the vapor chamber 100 (wick structure 10). In addition, suitable adhesion can be exhibited in the manufacturing process of the vapor chamber 100 described below, and the bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22) can be improved.

[0090] Examples of the thermosetting resin include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin, phenolic resins such as resol phenolic resin, bisphenol A epoxy resin, and bisphenol F epoxy resin, novolac-type epoxy resins such as novolac epoxy resin and cresol novolac epoxy resin, biphenyl-type epoxy resin, stilbene-type epoxy resin, triphenol methane-type epoxy resin, alkyl-modified triphenol methane-type epoxy resin, triazine nucleus-containing epoxy resin, dicyclopentadiene-modified phenolic epoxy resin, urea resin, resins having a triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resins having a benzoxazine ring, cyanate ester resin, and the like, and one or more selected from these can be used in combination. Among them, epoxy resin is particularly preferable as the thermosetting resin. This can improve the heat resistance of the cured resin 14 described below and the adhesion of the cured resin 14 to the fibers 131, the first sheet material 21, and the second sheet material 22.

[0091] In particular, it is preferable to use a silicone-modified epoxy resin as the epoxy resin, and it is more preferable to use in combination an epoxy resin that is solid at room temperature (particularly, a bisphenol-type epoxy resin) and an epoxy resin that is liquid at room temperature (particularly, a silicone-modified epoxy resin that is liquid at room temperature).

[0092] This allows the heat resistance and flexibility of the cured resin 14, which will be described later, to be compatible at an even higher level. Also, the resolution of the resin material 14' in the method for producing the vapor chamber 100, which will be described later, i.e., the reproducibility of the pattern in the exposure step, can be made even better. As a result, the method can be more suitably applied to the production of the vapor chamber 100 including the wick structure 10 having a fine pattern.

[0093] The content of the thermosetting resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 55% by mass or less.

[0094] This allows the cured resin 14, which will be described later, to have both high heat resistance and high toughness.

[0095] When the content of the alkali-soluble resin in the resin material 14' is XA [mass%] and the content of the thermosetting resin in the resin material 14' is XT [mass%], it is preferable to satisfy the relationship of 0.20≦XT / XA≦1.5, it is more preferable to satisfy the relationship of 0.30≦XT / XA≦1.2, and it is even more preferable to satisfy the relationship of 0.55≦XT / XA≦0.80.

[0096] This makes it possible to achieve an even better balance between the shape stability of the resin material 14' in the vapor chamber manufacturing component 10', the resolution in the exposure process, the developability in the development process, the heat resistance and toughness of the cured resin 14, and the bonding strength and adhesion between the wick structure 10 and the container 20 (first sheet material 21, second sheet material 22).

[0097] The content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

[0098] In particular, when the fiber 131 is made of an inorganic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 50% by mass or less, more preferably 15% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less.

[0099] Furthermore, when the fiber 131 is made of an organic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 50% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and even more preferably 60% by mass or more and 85% by mass or less.

[0100] By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[0101] When the content of fiber 131 in the vapor chamber manufacturing component 10' is Xf [mass %] and the content of resin material 14' is Xr [mass %], it is preferable to satisfy the relationship 0.01≦Xf / Xr≦8.0, it is more preferable to satisfy the relationship 0.1≦Xf / Xr≦5.0, and it is even more preferable to satisfy the relationship 0.3≦Xf / Xr≦3.0.

[0102] In particular, when the fibers 131 are made of an inorganic material, it is preferable that the relationship satisfies 0.8≦Xf / Xr≦8.0, it is more preferable that the relationship satisfies 1.0≦Xf / Xr≦7.0, and it is even more preferable that the relationship satisfies 2.0≦Xf / Xr≦6.0.

[0103] Furthermore, when the fibers 131 are made of an organic material, it is preferable that the relationship satisfies 0.01≦Xf / Xr≦0.8, it is more preferable that the relationship satisfies 0.05≦Xf / Xr≦0.6, and it is even more preferable that the relationship satisfies 0.10≦Xf / Xr≦0.4.

[0104] By satisfying the above-mentioned content relationship, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[0105] [1-3] Fillers The vapor chamber manufacturing member 10' may further contain a filler in addition to the fibers 131 and the resin material 14'.

[0106] This makes it possible to provide the cured resin 14 (described later) with better shape retention and to improve the durability of the vapor chamber 100.

[0107] The filler may have any shape, for example, a spherical, spindle-like, needle-like, rod-like, fibrous, or scale-like shape.

[0108] Examples of the filler include organic fillers such as fine particles of phenolic resin, acrylic resin, polyamide, polysulfone, polystyrene, and fluororesin, silicates such as talc, calcined clay, uncalcined clay, mica, and glass, oxides such as silica, such as titanium oxide, alumina, fused silica (fused spherical silica, fused crushed silica), and crystalline silica, carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite, hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite, borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate, nitrides such as aluminum nitride, boron nitride, and silicon nitride, carbon-based materials such as graphite and diamond, and metal materials such as copper and aluminum, and the like. One or more of these may be used in combination.

[0109] When the filler is spherical, its average particle size is preferably 0.05 μm or more and 0.35 μm or less, more preferably 0.10 μm or more and 0.30 μm or less, and even more preferably 0.10 μm or more and 0.25 μm or less.

[0110] This makes it possible to more effectively suppress the generation of residues after the development process in the manufacturing method of the vapor chamber 100 described below, and also makes it possible to improve the shape retention of the cured resin material 14 described below.

[0111] In this specification, unless otherwise specified, the average particle size refers to the average particle size based on the number of particles, and can be determined, for example, by measuring the filler in a state where the filler is dispersed in water using a laser diffraction particle size distribution analyzer (SALD-7000). In addition, when measuring, for example, the above-mentioned dispersion may be subjected to ultrasonic treatment before measurement. In the examples described later, the filler was added to water and stirred, and then ultrasonic treatment was performed for 1 minute, and then measurement was performed using a laser diffraction particle size distribution analyzer (SALD-7000) to determine the average particle size.

[0112] The content of the filler in the vapor chamber manufacturing component 10' is preferably 1% by mass or more and 50% by mass or less, more preferably 3% by mass or more and 45% by mass or less, and even more preferably 5% by mass or more and 40% by mass or less.

[0113] This makes it possible to more effectively suppress the generation of residues after the development process in the manufacturing method of the vapor chamber 100 described below, and also makes it possible to further improve the shape retention of the cured resin material 14 described below.

[0114] [1-4] Hardener The vapor chamber manufacturing member 10' may further contain a curing agent in addition to the fibers 131 and the resin material 14'.

[0115] The curing agent (photosensitive agent) is not particularly limited as long as it cures the resin material 14', and examples thereof include benzophenone, acetophenone, benzoin, benzoin isobutyl ether, benzoin methyl benzoate, benzoin benzoic acid, benzoin methyl ether, benzyl phenyl sulfide, benzyl, dibenzyl, diacetyl, etc., and one or more selected from these may be used in combination.

[0116] The content of the curing agent (photosensitive agent) in the vapor chamber manufacturing component 10' is not particularly limited, but is preferably from 0.1% by mass to 50% by mass, more preferably from 0.5% by mass to 40% by mass, and even more preferably from 1.0% by mass to 30% by mass.

[0117] This allows the storage stability of the vapor chamber manufacturing member 10' to be sufficiently excellent, while allowing the photopolymerization reaction to be more suitably initiated and progressed during the manufacture of the vapor chamber 100 described below.

[0118] [1-5] Other ingredients The vapor chamber manufacturing member 10' may contain components other than the above-mentioned components (hereinafter, also referred to as "other components"). Examples of such components include ultraviolet absorbers, leveling agents, coupling agents, flame retardants, antioxidants, etc., and one or more selected from these may be used in combination.

[0119] However, the content of other components in the vapor chamber manufacturing member 10' is preferably 7.0 mass % or less, more preferably 5.0 mass % or less, and even more preferably 3.0 mass % or less.

[0120] [1-6] Overall configuration of vapor chamber manufacturing components The shape of the vapor chamber manufacturing member 10' is not particularly limited, but in the illustrated configuration, it is in the form of a sheet.

[0121] This makes it possible to suitably manufacture the sheet-shaped vapor chamber 100 (wick structure 10). Also, it is possible to more suitably prevent unintended deformation of the vapor chamber manufacturing member 10' during manufacture of the vapor chamber 100 (wick structure 10) and unintended movement of the fibers 131 in the vapor chamber manufacturing member 10' (wick structure 10).

[0122] When the vapor chamber manufacturing member 10' is in the form of a sheet, the sheet-like fiber base material 13 (fibers 131) may be present over almost the entire thickness of the vapor chamber manufacturing member 10' as shown in Fig. 2, or may be unevenly distributed near the center of the thickness of the vapor chamber manufacturing member 10' as shown in Fig. 3, or may be unevenly distributed on one side of the vapor chamber manufacturing member 10' as shown in Fig. 4. The sheet-like fiber base material 13 (fibers 131) may be unevenly distributed on both sides of the vapor chamber manufacturing member 10', and the content of fibers 131 near the center of the thickness of the vapor chamber manufacturing member 10' may be lower than those portions.

[0123] The thickness of the vapor chamber manufacturing member 10' is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

[0124] This makes it possible to more suitably form the flow path portion for the gaseous working liquid 30 and the flow path portion for the liquid working liquid 30 while preventing the vapor chamber 100 manufactured using the vapor chamber manufacturing component 10' from becoming unnecessarily thick.

[0125] [2] Vapor chamber Next, the vapor chamber of the present invention will be described. FIG. 5 is a vertical cross-sectional view showing an example of the vapor chamber of the present invention. FIGS. 6 to 8 are vertical cross-sectional views showing another example of the vapor chamber of the present invention. FIG. 9 is a plan view showing a wick structure of the vapor chamber of the present invention. In FIG. 9, the fibers 131 are omitted. In the following description, the vapor chamber 100 will be mainly described in the case where the lower surface (surface of the first sheet material 21) in FIGS. 5 to 8 contacts the member (heat generating member) to which the vapor chamber 100 is applied, but the upper surface in FIGS. 5 to 8 may be used so as to contact the member (heat generating member) to which the vapor chamber 100 is applied. In addition, in FIGS. 5 to 8, the first sheet material 21 is shown facing downward, but the orientation of the vapor chamber 100 when the vapor chamber 100 is used is not particularly limited, and for example, the first sheet material 21 may be used facing upward.

[0126] The vapor chamber 100 includes a container 20 having a hollow portion therein, a wick structure 10 disposed in the hollow portion, and a working liquid 30 disposed in the hollow portion.

[0127] The wick structure 10 is made of a material containing a cured resin 14 and fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the working liquid 30 where the cured resin 14 is not arranged.

[0128] This makes it possible to provide a vapor chamber that is excellent in flexibility and has a particularly excellent heat transport capacity. In addition, since the flexibility of the vapor chamber 100 can be excellent, the vapor chamber 100 can be in good contact with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the excellent heat transport capacity can be more reliably exhibited.

[0129] [2-1] Container The container 20 stores the wick structure 10 and the working liquid 30, and mainly has the function of transferring heat to the working liquid 30 stored inside the container 20 in the evaporation section by coming into contact with a component to be cooled, such as a heat-generating component, and the function of dissipating heat received from the working liquid 30 undergoing a phase transition from a gas state to a liquid state in the condensation section.

[0130] The container 20 is formed using a first sheet material 21 and a second sheet material 22 .

[0131] Both the first sheet material 21 and the second sheet material 22 are made of a material having high thermal conductivity, such as metal materials including copper, aluminum, magnesium, zinc, and alloys containing at least one of these metals.

[0132] The first sheet material 21 and the second sheet material 22 may be made of the same material, or may be made of different materials.

[0133] The thickness of the first sheet material 21 and the second sheet material 22 is not particularly limited, but is preferably 12 μm or more and 70 μm or less, and more preferably 18 μm or more and 35 μm or less.

[0134] The first sheet material 21 and the second sheet material 22 are sealed at their outer peripheries by a sealing portion 23. This seals the cavity that contains the wick structure 10 and the working liquid 30, and maintains a liquid-tight and airtight state.

[0135] The sealing portion 23 may be made of, for example, the same material as the first sheet material 21 or the second sheet material 22, or may be made of a material different from the first sheet material 21 and the second sheet material 22.

[0136] The sealing portion 23 can be formed by, for example, plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, or adhesion.

[0137] [2-2] Wick structure The wick structure 10 is a component through which the flow of working liquid 30 associated with heat transport, in particular the flow of working liquid 30 vaporized by receiving heat in the evaporator section of the container 20, and the flow of working liquid 30 condensed by receiving heat in the condenser section of the container 20, occurs.

[0138] The wick structure 10 is made of a material containing a cured resin 14 and fibers 131, and the fibers 131 are arranged in a part of a flow path portion 15 of the working liquid 30 where the cured resin 14 is not arranged. In particular, the flow path portion 15 has a flow path portion of the gaseous working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are not present or a portion where the density of the fibers 131 is low) and a flow path portion of the liquid working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are present or a portion where the density of the fibers 131 is high).

[0139] Such a wick structure 10 may be formed by any method, but is preferably formed using the above-mentioned vapor chamber manufacturing member 10' of the present invention.

[0140] This makes it possible to manufacture the vapor chamber 100 with high productivity and high yield, for example, by a method described below, and makes it possible to improve the reliability of the vapor chamber 100.

[0141] When the wick structure 10 is formed using the vapor chamber manufacturing member 10' of the present invention described above, the wick structure 10 may be manufactured using one vapor chamber manufacturing member 10' or may be manufactured using a plurality of vapor chamber manufacturing members 10'. When a plurality of vapor chamber manufacturing members 10' are used, these vapor chamber manufacturing members 10' may be arranged in the surface direction of the wick structure 10, or may be arranged (stacked) in the thickness direction of the wick structure 10.

[0142] In the following explanation, we will mainly explain the case where the wick structure 10 is manufactured using the above-mentioned vapor chamber manufacturing component 10', and in particular the case where it is manufactured using the vapor chamber manufacturing component 10' including a fiber base material 13.

[0143] The wick structure 10 is in contact with the inner surface of the container 20 on both sides thereof. More specifically, the wick structure 10 is in contact with a first sheet material 21 on one side, a first side 11, and in contact with a second sheet material 22 on the other side, a second side 12.

[0144] The fibers 131 and fiber base material 13 constituting the wick structure 10 preferably satisfy the same conditions as those described in the section on the vapor chamber manufacturing member 10'.

[0145] The sheet-like fiber base material 13 (fibers 131) may be present over almost the entire thickness of the wick structure 10 as shown in Fig. 5, or may be unevenly distributed near the center of the thickness of the wick structure 10 as shown in Fig. 6, or may be unevenly distributed on the second surface 12 side of the wick structure 10 as shown in Fig. 7, or may be unevenly distributed on the first surface 11 side of the wick structure 10 as shown in Fig. 8. The sheet-like fiber base material 13 (fibers 131) may be unevenly distributed on both sides of the wick structure 10 (the first surface 11 side and the second surface 12 side), and the content of fibers 131 near the center of the thickness of the wick structure 10 may be lower than those in these areas.

[0146] The cured resin 14 is suitably obtained by curing the above-mentioned resin material 14'. The wick structure 10 extends in its longitudinal direction, is made of a material containing a cured resin 14 , and has a plurality of portions that function as flow path walls 16 for the working liquid 30 .

[0147] The distance S between adjacent flow path walls 16 (i.e., the width of the flow path portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and even more preferably 300 μm or more and 700 μm or less.

[0148] This allows the working liquid 30 (gaseous working liquid 30 and liquid working liquid 30) to move more smoothly while suppressing the increase in size of the wick structure 10 and the vapor chamber 100. In addition, when the pressure is reduced in the part of the flow path portion 15 where the fibers 131 are not present in order to lower the boiling point of the working liquid 30, the flow path wall 16 exists between the first sheet material 21 and the second sheet material 22, so that deformation of the first sheet material 21 and the second sheet material 22 can be prevented. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent.

[0149] The ratio (L / S) of the width L [μm] of the flow path wall 16 to the width S [μm] of the flow path portion 15 is not particularly limited, but is preferably 0.05 or more and 0.50 or less, more preferably 0.08 or more and 0.40 or less, and even more preferably 0.10 or more and 0.35 or less.

[0150] This makes it possible to improve the heat transport capacity and durability of the vapor chamber 100 while suppressing the increase in size of the wick structure 10 and the vapor chamber 100. On the other hand, if the value of L / S is less than the lower limit, the first sheet material 21 or the second sheet material 22 is likely to deform when the flow path portion 15 is depressurized. Also, if the value of L / S exceeds the upper limit, the heat transport efficiency decreases.

[0151] In the illustrated configuration, the channel portion 15 and channel wall 16 have a constant width, but they may have portions with different widths.

[0152] In addition, in the illustrated configuration, the flow path portion 15 and the flow path wall 16 are provided linearly in one direction, but they may have curved or bent portions.

[0153] [2-3] Hydraulic fluid A working liquid 30 is disposed in the cavity of the container 20 together with the wick structure 10 .

[0154] The working fluid 30 mainly has the function of transporting heat in the hollow portion inside the container 20 .

[0155] Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, hydrofluoroethers, alcohols such as ethanol and methanol, acetone, carbon dioxide gas, ammonia, and propane.

[0156] [2-4] Overall configuration of the vapor chamber The thickness of the vapor chamber 100 is preferably 150 μm or more and 3000 μm or less, more preferably 200 μm or more and 2000 μm or less, and even more preferably 250 μm or more and 1000 μm or less.

[0157] This allows the working liquid 30 (gaseous working liquid 30 and liquid working liquid 30) to move more smoothly while preventing the vapor chamber 100 from becoming thick. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. In addition, the durability of the vapor chamber 100 can be made even more excellent.

[0158] [2-5] How to use the vapor chamber Next, examples of usage of the vapor chamber of the present invention will be described.

[0159] The vapor chamber of the present invention may be used, for example, for the purpose of transferring heat from a heat-generating component to a specified location, or for the purpose of equalizing the heat of a localized high-temperature portion of a heat-generating component.

[0160] The following description will focus on the case where the vapor chamber of the present invention is used for the purpose of transferring heat from a specific component (heat-generating component).

[0161] When used for the purpose of cooling a heat-generating component (e.g., a CPU, etc.), the vapor chamber is used with a part of its surface (the evaporation part) in contact with the heat-generating component itself or a component made of a highly thermally conductive material that comes into contact with it (e.g., a thermally conductive sheet, etc.) (hereinafter, these are collectively referred to as "heat-generating component, etc.").

[0162] At this time, the vapor chamber may be in a state where the condensation section, which is a section different from the evaporation section, i.e., the section that dissipates heat received from the heat-generating component, is in contact with a heat dissipation component (e.g., a heat sink, etc.) or a component made of a highly thermally conductive material that is in contact with it (e.g., a thermally conductive sheet, etc.) (hereinafter, these are collectively referred to as "heat dissipation components, etc.").

[0163] As described above, the vapor chamber of the present invention is excellent in flexibility.

[0164] Therefore, when there is a step between the part where the heat generating component is installed and the part where the heat dissipating component should be installed, if a conventional heat pipe or vapor chamber with poor flexibility is used, it is necessary to install a spacer (e.g., a metal spacer, etc.) to eliminate or reduce the step, which causes problems such as increased costs due to an increase in parts and increased weight of the entire device. In contrast, the vapor chamber of the present invention has excellent flexibility and can be suitably bent, for example, so that even if the spacer is omitted, it is possible to ensure good adhesion with other components (heat generating components, heat dissipating components, etc.) in the condensation section and evaporation section. Therefore, it is possible to exhibit good heat dissipation performance while suitably solving the above-mentioned problems.

[0165] Furthermore, when the vapor chamber of the present invention is used, interference with other components can be preferably avoided by curving or bending the vapor chamber, thereby increasing the freedom in the layout of each component in a device equipped with a heat-generating component.

[0166] In addition, in the present invention, by using the above-mentioned method, the shape of the flow path part and flow path wall of the vapor chamber (wick structure) can be suitably adjusted. Therefore, according to the present invention, it is possible to suitably manufacture a vapor chamber having not only a simple shape such as a rectangle, but also a complex shape such as a shape with a notch, and having a flow path part and a flow path wall corresponding to the shape. Therefore, for example, it is possible to suitably eliminate interference with other members while making the contact area with a heat generating member or a heat dissipating member large. This allows for better heat dissipation performance.

[0167] Also, for example, in a housing (such as a joint of an articulated robot) that houses a motor as a heat generating member, an aluminum molded body and a heat conductive sheet are sometimes used in combination inside the housing to dissipate heat from the motor to the outside through the housing, but in this case, there is a problem that the housing becomes large. In contrast, when using the vapor chamber of the present invention, there is no need to use an aluminum molded body, which is advantageous from the viewpoint of miniaturizing the housing and reducing the number of parts.

[0168] [3] How to make a vapor chamber Next, a method for producing the vapor chamber of the present invention will be described. 10 and 11 are vertical cross-sectional views that diagrammatically show an example of a method for producing a vapor chamber of the present invention.

[0169] The method for manufacturing the vapor chamber 100 of this embodiment includes a vapor chamber manufacturing member preparation step (1a) of preparing a vapor chamber manufacturing member 10' of the present invention, a first bonding step (1b) of bonding the vapor chamber manufacturing member 10' to a first sheet material 21 at one of its surfaces, that is, a first surface 11, and an exposure step (1c) of irradiating the vapor chamber manufacturing member 10' bonded to the first sheet material 21 with light (exposure light) E in a predetermined pattern. The method is characterized by having a developing process (1d) for removing uncured resin material 14' from areas not irradiated with light E in the exposure process, a second bonding process (1e) for bonding the vapor chamber manufacturing component 10' that has undergone the developing process to a second sheet material 22 on a second surface 12 that is the surface opposite to the first surface 11, and a working liquid supply / sealing process (1f) for injecting working liquid 30 into the space between the first sheet material 21 and the second sheet material 22 and sealing the space.

[0170] This provides a method for manufacturing a vapor chamber that is excellent in flexibility and particularly excellent in heat transport capacity. In addition, since the manufactured vapor chamber 100 can be excellent in flexibility, the vapor chamber 100 can be well adhered to the member regardless of the member or arrangement to which the vapor chamber 100 is applied, and the excellent heat transport capacity can be more reliably exhibited.

[0171] [3-1] Vapor chamber manufacturing component preparation process In the vapor chamber manufacturing member preparation step, the vapor chamber manufacturing member 10' of the present invention described above is prepared (1a).

[0172] The vapor chamber manufacturing member 10' can be obtained, for example, by impregnating a fiber base material 13 with a composition containing an uncured resin material 14'.

[0173] The composition may contain, for example, the resin material 14' and other components described above. The composition may also contain a solvent. When the composition contains a solvent, the fiber base material 13 is impregnated with the composition and then the solvent is evaporated to obtain a vapor chamber manufacturing member 10'.

[0174] The composition may be applied, for example, from the side corresponding to the first side 11 of the fiber substrate 13, from the side corresponding to the second side 12 of the fiber substrate 13, or from both the side corresponding to the first side 11 and the side corresponding to the second side 12 of the fiber substrate 13.

[0175] Examples of methods for applying the composition to the fiber base material 13 include a coating method, a spraying method, and a dipping method.

[0176] [3-2] First joining process In the first bonding step, the vapor chamber manufacturing member 10' is bonded to a first sheet material 21 at a first surface 11, which is one surface of the member 10' (1b).

[0177] The uncured resin material 14' constituting the vapor chamber manufacturing member 10' is brought into contact with the first sheet material 21, and the two sheets can be suitably joined by applying pressure. The two sheets can be even more suitably joined by applying heat in addition to pressure.

[0178] [3-3] Exposure process In the exposure step, the vapor chamber manufacturing member 10' bonded to the first sheet material 21 is irradiated with light E in a predetermined pattern (1c).

[0179] As a result, the portions of the resin material 14' irradiated with the light E are selectively cured to become the cured resin material 14. That is, in a pattern corresponding to the irradiation pattern of the light E, it is possible to form cured portions corresponding to the portions that are to become the flow path walls 16 made of the cured resin material 14.

[0180] The curing reaction in this step need only proceed to an extent that allows the uncured resin material 14' to be removed in the subsequent development step while leaving the cured resin 14 behind; it is not necessary for the reaction to proceed completely.

[0181] The type of light E irradiated in this step is determined according to the type of resin material 14', but is preferably ultraviolet light.

[0182] This allows the resin material 14' to be cured suitably with a relatively short exposure process, and the productivity of the vapor chamber 100 can be improved.

[0183] The exposure step may be carried out, for example, by scanning light such as laser light in a predetermined pattern, but can be suitably carried out by using a photomask.

[0184] [3-4]Developing process In the development process, the uncured resin material 14' in the area not irradiated with the light E in the exposure process is removed (1d).

[0185] This makes it possible to remove the resin material 14' while leaving behind the cured resin 14 and the fibers 131. This makes it possible to reveal portions that are to become the flow path walls 16 in a predetermined pattern, i.e., a pattern corresponding to the irradiation pattern of the light E.

[0186] The developing step can be suitably carried out by using a developer that selectively dissolves the resin material 14' and does not dissolve the cured resin material 14.

[0187] The composition of the developer varies depending on the resin material 14', the cured resin 14, etc., but for example, when the resin material 14' contains an alkali-soluble resin as described above, an alkaline aqueous solution of sodium hydroxide, tetramethylammonium hydroxide, etc. can be suitably used.

[0188] [3-5] Second joining process In the second bonding step, the vapor chamber manufacturing member 10' that has been subjected to the developing step is bonded to a second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11 (1e).

[0189] The second sheet material 22 and the vapor chamber manufacturing member 10' may be joined by, for example, applying an adhesive to the second sheet material 22 or the vapor chamber manufacturing member 10', but if a resin material 14' that satisfies the above-mentioned conditions (particularly, one that contains an alkali-soluble resin and a photopolymerizable resin as well as a thermosetting resin different from the alkali-soluble resin) is used, the vapor chamber manufacturing member 10' and the second sheet material 22 are brought into contact with each other and then heated, so that the thermosetting resin exhibits adhesiveness during the thermal curing process, and the bonding strength between the second sheet material 22 and the vapor chamber manufacturing member 10' (wick structure 10) can be made particularly excellent. Similarly, the bonding strength between the first sheet material 21 and the vapor chamber manufacturing member 10' (wick structure 10) can also be made particularly excellent.

[0190] In this case, the heating temperature in this step is preferably 80°C or higher and 250°C or lower, more preferably 90°C or higher and 220°C or lower, and even more preferably 100°C or higher and 200°C or lower.

[0191] This makes it possible to more effectively prevent undesired deterioration of the constituent materials of the vapor chamber 100, while more significantly exerting the effects described above. In addition, the productivity of the vapor chamber 100 can be improved.

[0192] In addition, this step may be performed by combining heating under different conditions. Specifically, for example, a heat treatment under pressure (thermocompression bonding) and a subsequent heat treatment after the pressure is released (post-cure) may be performed in combination.

[0193] The heating time in this step is preferably from 0.1 minutes to 600 minutes. This makes it possible to more effectively prevent undesired deterioration of the constituent materials of the vapor chamber 100, while more significantly exerting the effects described above. In addition, the productivity of the vapor chamber 100 can be improved.

[0194] As described above, when a heat treatment under pressure (thermocompression bonding) is combined with a subsequent heat treatment after the pressure is released (post-cure), the treatment time for the heat treatment under pressure (thermocompression bonding) is preferably 0.1 minutes or more and 10 minutes or less, and the treatment time for the heat treatment after the pressure is released (post-cure) is preferably 20 minutes or more and 480 minutes or less.

[0195] [3-6] Hydraulic fluid supply and sealing process In the hydraulic fluid supplying and sealing step, hydraulic fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed (1f).

[0196] The hydraulic fluid 30 can be suitably injected, for example, in a state in which the space between the first sheet material 21 and the second sheet material 22 is depressurized by vacuum drawing.

[0197] By reducing the pressure in the space between the first sheet material 21 and the second sheet material 22, the boiling point of the working liquid 30 can be lowered and the evaporation and condensation cycle of the working liquid 30 can be carried out more efficiently, thereby further enhancing the heat transport effect and the heat uniformity effect.

[0198] After the working liquid 30 is injected, the injection portion for the working liquid 30 is sealed, and the space containing the wick structure 10 and the working liquid 30 is sealed liquid-tight and air-tight.

[0199] The space containing the wick structure 10 and the working liquid 30 is sealed by forming a sealing portion 23.

[0200] Examples of methods for forming the sealing portion 23 include plating-up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and adhesion.

[0201] Although a preferred embodiment of the present invention has been described above, the present invention is not limited to the above, and modifications and improvements within the scope of the present invention that can achieve the object of the present invention are included in the present invention.

[0202] For example, the method for manufacturing a vapor chamber of the present invention may further include other steps in addition to the steps described above.

[0203] Furthermore, the vapor chamber of the present invention is not limited to one manufactured by the method described above, and may be one manufactured by any method.

[0204] In addition, in the above-described embodiment, the vapor chamber manufacturing component of the present invention and the wick structure constituting the vapor chamber of the present invention have been mainly described as including fibers in the form of a sheet-like fiber substrate (fiber sheet), but the vapor chamber manufacturing component of the present invention and the wick structure constituting the vapor chamber of the present invention may include fibers in any form, and may include fibers in a form other than a sheet-like fiber substrate.

[0205] In addition, in the above-described embodiment, the vapor chamber has been mainly described as being used for the purpose of transferring heat from a heat-generating component to a specified location, but the vapor chamber may also be used for the purpose of, for example, equalizing the heat of a localized high-temperature portion of a heat-generating component. EXAMPLES

[0206] The present invention will be described in detail below based on examples, but the present invention is not limited thereto.

[0207] [4] Components for manufacturing vapor chambers, manufacturing of vapor chambers Example 1 1. Synthesis of alkali-soluble resin (resin having alkali-soluble groups and double bonds (curable resin that can be cured by both light and heat: methacrylic modified bisphenol A novolac resin: MPN))

[0208] 500 g of a 60% solids solution of bisphenol A novolac resin (Phenolite LF-4871, Dainippon Ink and Chemicals) in methyl ethyl ketone (MEK) was placed in a 2 L flask, to which 1.5 g of tributylamine as a catalyst and 0.15 g of hydroquinone as a polymerization inhibitor were added, and the mixture was heated to 100°C.

[0209] Then, 180.9 g of glycidyl methacrylate was added dropwise to the mixture over 30 minutes, and the mixture was stirred at 100°C for 5 hours to react, yielding a methacryl-modified bisphenol A novolac resin with a non-volatile content of 74%. The modification rate of the methacryl-modified bisphenol A novolac resin (alkali-soluble resin) thus obtained was 50%.

[0210] 2. Preparation of Resin Varnish The following were weighed out as alkali-soluble resins (curable resins that can be cured by both light and heat): 31.74 parts by mass of methacrylic modified bisphenol A novolac resin (MPN) synthesized as described above; acrylic resin monomers (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) that are liquid at room temperature as photopolymerizable resins: 9.83 parts by mass; bisphenol A novolac type epoxy resins (Epicron N-865, manufactured by Dainippon Ink and Chemicals, Inc.) as thermosetting resins: 19.84 parts by mass; silicone epoxy resins (BY16-115, manufactured by Toray Dow Corning Silicones Co., Ltd.): 3.63 parts by mass; and silica (KE-P30, manufactured by Nippon Shokubai Co., Ltd., average particle size: 0.28 μm, maximum particle size: 0.9 μm): 33.71 parts by mass as particulate filler. Further, methyl ethyl ketone (MEK) was added to adjust the resin component concentration to 71% by mass. Then, the mixture was stirred until the bisphenol A novolac type epoxy resin (N-865) was dissolved.

[0211] Next, the silica was dispersed using a bead mill (bead diameter 400 μm, processing speed 6 g / s, 5 passes).

[0212] Thereafter, 1.25 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by Ciba Specialty Chemicals) was further added, and the mixture was stirred with a stirring blade (450 rpm) for 1 hour to obtain a resin varnish.

[0213] 3. Manufacturing of adhesive film A portion of the resin varnish prepared in "2. Preparation of resin varnish" above was applied to a supporting substrate polyester film (Mitsubishi Polyester Film Co., Ltd., T100G, thickness 25 μm) using a comma coater, and dried at 80°C for 10 minutes to form a film, obtaining an adhesive film 65 μm thick.

[0214] 4. Manufacturing of components for manufacturing vapor chambers A portion of the resin varnish prepared in "2. Preparation of resin varnish" above was impregnated into a glass woven fabric (Unitika Ltd., #1078, thickness 46 μm) and dried in a heating furnace at 100° C. for 3 minutes to obtain a prepreg with a thickness of 50 μm.

[0215] Next, two sheets of prepreg thus obtained were stacked, and the 65 μm thick photosensitive adhesive film produced in the above "3. Production of adhesive film" was stacked on both sides of the prepreg, and bonded using a laminating roll at 80 ° C. to obtain a vapor chamber manufacturing member having a thickness of 230 μm (first photosensitive adhesive film layer: 65 μm, prepreg: 100 μm, second photosensitive adhesive film layer: 65 μm) (see FIG. 1). Furthermore, after that, this vapor chamber manufacturing member was cut to a size of 15 mm × 100 mm in outer dimensions.

[0216] The vapor chamber manufacturing component obtained in this manner was in the form of a sheet having a thickness of 230 μm, containing uncured resin material, and as shown in Figure 3, the fiber base material was present near the center in the thickness direction, and no fibers were present on either side of the vapor chamber manufacturing component.

[0217] 5. Vapor Chamber Fabrication First, a vapor chamber manufacturing component (external dimensions: 15 mm x 100 mm) obtained as described above was prepared (vapor chamber manufacturing component preparation process), and one of its sides, the first side, was bonded to a copper sheet material (external dimensions: 15 mm x 100 mm, thickness: 35 μm) as a first sheet material by utilizing the adhesiveness of the uncured resin material that constitutes the vapor chamber manufacturing component (first bonding process).

[0218] Next, the vapor chamber manufacturing member bonded to the first sheet material was irradiated with light (exposure) using a photomask having openings (light-transmitting parts) in a pattern corresponding to the flow path walls to be formed (exposure step). For the exposure, a mercury lamp with a main wavelength of 365 nm was used, and the exposure amount was 500 mJ / cm. 2 The trip was conducted under the following conditions.

[0219] Next, a 3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), an alkaline aqueous solution, was used as the developer, and processing was carried out under the conditions of developer pressure: 0.2 MPa, development time: 300 seconds, to remove the uncured resin material from the areas that were not irradiated with light in the exposure process (development process).

[0220] Next, the vapor chamber manufacturing member that has undergone the development process is brought into contact with a copper sheet material (thickness: 35 μm) as a second sheet material on the second surface, which is the surface opposite to the first surface, and pressed with a pressure of 0.3 MPa. In this state, thermocompression bonding is performed at 185°C for 60 minutes, and then heat treatment (post-cure) is performed in an oven at 180°C for 1 hour to firmly adhere the vapor chamber manufacturing member to the second sheet material, and then the curing reaction is completed, resulting in a bonded body in which the wick structure formed using the vapor chamber manufacturing member is firmly bonded to the first sheet material on the first surface and firmly bonded to the second sheet material on the second surface (second bonding process).

[0221] The periphery of the first sheet material and the second sheet material (excluding the working fluid inlet) was sealed by soldering, and then 80 mg of pure water was injected as the working fluid into the space between the first sheet material and the second sheet material, and the working fluid inlet was further sealed with solder (working fluid supply and sealing process). This resulted in the vapor chamber shown in Figure 6.

[0222] The wick structure of the vapor chamber thus obtained had a thickness of 230 μm and a structure as shown in FIG. 9, extending in its longitudinal direction, being made of a material including a cured resin, and having multiple portions which functioned as flow path walls for the working fluid, with the spacing between adjacent flow path walls (i.e., the width of the flow path portion) being 500 μm, and the width of the flow path walls being 100 μm.

[0223] Example 2 Methacrylic modified bisphenol A novolac resin (MPN): 50 parts by mass, acrylic resin monomer (Kyoeisha Chemical Co., Ltd., Light Ester TMP): 15.5 parts by mass as a photopolymerizable resin that is liquid at room temperature, bisphenol A novolac type epoxy resin (Mitsubishi Chemical Co., Ltd., 1032H60): 18 parts by mass as a thermosetting resin, bisphenol F type epoxy resin (DIC Corporation, EPICLON 830): 5 parts by mass, phenol novolac resin (Sumitomo Bakelite Co., Ltd., PR-53647): 9 parts by mass, hardener (photosensitive agent) (Ciba Specialty Chemicals Co., Ltd., Irgacure 651): 2.5 parts by mass were weighed, and methyl ethyl ketone (MEK) was further added to prepare a resin varnish so that the resin component concentration was 50% by mass.

[0224] An adhesive film, a member for producing a vapor chamber, and a vapor chamber were produced in the same manner as in Example 1, except that the resin varnish thus obtained was used.

[0225] Example 3 A vapor chamber was manufactured in the same manner as in Example 2, except that the amount of pure water injected as the working fluid was changed from 80 mg to 160 mg.

[0226] Example 4 A vapor chamber was manufactured in the same manner as in Example 2, except that the amount of pure water injected as the working fluid was changed from 80 mg to 40 mg.

[0227] Example 5 First, an adhesive film was produced in the same manner as in Example 2, except that the thickness was set to 40 μm.

[0228] Then, the number of prepregs used to laminate in the production of the vapor chamber manufacturing parts was changed from two to three, and the adhesive film having a thickness of 40 μm was used as the adhesive film (first photosensitive adhesive film layer and second photosensitive adhesive film layer), but the vapor chamber manufacturing parts and vapor chamber were produced in the same manner as in Example 2.

[0229] Example 6 First, an adhesive film was produced in the same manner as in Example 2, except that the thickness was 100 μm.

[0230] Also, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (Unitika Ltd., #1037, thickness 27 μm) and dried in a heating furnace at 100° C. for 3 minutes to obtain a prepreg having a thickness of 30 μm.

[0231] Then, the above-mentioned 100 μm thick adhesive film was superimposed on both sides of one sheet of the 30 μm thick prepreg, and bonded using a laminating roll at 80° C. to obtain a vapor chamber manufacturing member having a thickness of 230 μm (first photosensitive adhesive film layer: 100 μm, prepreg: 30 μm, second photosensitive adhesive film layer: 100 μm).Furthermore, after that, this vapor chamber manufacturing member was cut into a size of 15 mm×100 mm in outer dimensions.

[0232] Thereafter, a vapor chamber was produced in the same manner as in Example 1, except that this vapor chamber production member was used.

[0233] Example 7 First, an adhesive film was produced in the same manner as in Example 2, except that the thickness was set to 90 μm.

[0234] Also, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (Unitika Ltd., #1078, thickness 46 μm) and dried in a heating furnace at 100° C. for 3 minutes to obtain a prepreg having a thickness of 50 μm.

[0235] Then, the 90 μm thick adhesive film was laminated on both sides of one sheet of the 50 μm thick prepreg, and bonded using a laminating roll at 80° C. to obtain a vapor chamber manufacturing member having a thickness of 230 μm (first photosensitive adhesive film layer: 90 μm, prepreg: 50 μm, second photosensitive adhesive film layer: 90 μm). After that, the vapor chamber manufacturing member was cut to a size of 15 mm × 100 mm in outer dimensions.

[0236] Thereafter, a vapor chamber was produced in the same manner as in Example 1, except that this vapor chamber production member was used.

[0237] Example 8 A vapor chamber was manufactured in the same manner as in Example 2, except that the first photosensitive adhesive film layer was manufactured to have a thickness of 40 μm and the second photosensitive adhesive film layer was manufactured to have a thickness of 90 μm.

[0238] Example 9 A vapor chamber was manufactured in the same manner as in Example 2, except that the first photosensitive adhesive film layer was manufactured to have a thickness of 40 μm, the second photosensitive adhesive film layer was manufactured to have a thickness of 40 μm, and the amount of pure water injected as the working fluid was changed from 80 mg to 40 mg.

[0239] Example 10 A vapor chamber was produced in the same manner as in Example 9, except that one sheet of the prepreg produced in Example 7 was used.

[0240] Example 11 A vapor chamber was manufactured in the same manner as in Example 2, except that the first photosensitive adhesive film layer was manufactured to have a thickness of 88 μm, the second photosensitive adhesive film layer was manufactured to have a thickness of 88 μm, and the first and second sheet materials were GTS-MP (12 μm thick) manufactured by Furukawa Electric Co., Ltd.

[0241] Example 12 Methacrylic modified bisphenol A novolac resin (MPN): 60 parts by mass synthesized in the same manner as described in Example 1, acrylic resin monomer (Kyoeisha Chemical Co., Ltd., Light Ester TMP): 10.5 parts by mass that is liquid at room temperature as a photopolymerizable resin, bisphenol A novolac type epoxy resin (Mitsubishi Chemical Co., Ltd., 1032H60): 18 parts by mass as a thermosetting resin, phenol novolac resin (Sumitomo Bakelite Co., Ltd., PR-53647): 9 parts by mass, and hardener (photosensitive agent) (Ciba Specialty Chemicals Co., Ltd., Irgacure 651): 2.5 parts by mass were weighed out, and methyl ethyl ketone (MEK) was further added to prepare a resin varnish so that the resin component concentration was 50% by mass.

[0242] An adhesive film, a member for producing a vapor chamber, and a vapor chamber were produced in the same manner as in Example 1, except that the resin varnish thus obtained was used.

[0243] Example 13 As an alkali-soluble resin (curable resin that can be cured by both light and heat), 69 parts by mass of Cyclomer P (manufactured by Daicel Allnex Corporation), 16 parts by mass of an acrylic resin monomer that is liquid at room temperature (manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester 3G) as a photopolymerizable resin, 5 parts by mass of a bisphenol A novolac type epoxy resin (manufactured by Dainippon Ink and Chemicals, Inc., Epiclon N-865) as a thermosetting resin, 3 parts by mass of a bisphenol F type epoxy resin (manufactured by DIC Corporation, EPICLON 830), 5 parts by mass of a phenol novolac resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647), and 2.0 parts by mass of a curing agent (photosensitive agent) (manufactured by Ciba Specialty Chemicals, Irgacure 651) were weighed out, and methyl ethyl ketone (MEK) was further added to prepare a resin varnish so that the resin component concentration was 50% by mass.

[0244] An adhesive film, a member for producing a vapor chamber, and a vapor chamber were produced in the same manner as in Example 1, except that the resin varnish thus obtained was used.

[0245] Comparative Example 1 A vapor chamber was manufactured in the same manner as in Example 2, except that the first photosensitive adhesive film layer was manufactured to have a thickness of 115 μm, the second photosensitive adhesive film layer was manufactured to have a thickness of 115 μm, and the first photosensitive adhesive film layer and the second photosensitive adhesive film layer were directly bonded together without using a prepreg.

[0246] The configurations of the vapor chambers of the above-mentioned respective Examples and Comparative Examples are summarized in Tables 1 and 2. In the tables, the constituent material of the adhesive film of the vapor chamber manufacturing member in Example 1 is shown as "C-1", the constituent material of the adhesive film of the vapor chamber manufacturing member in Example 2 is shown as "C-2", the constituent material of the adhesive film of the vapor chamber manufacturing member in Example 12 is shown as "C-12", and the constituent material of the adhesive film of the vapor chamber manufacturing member in Example 13 is shown as "C-13". In addition, in Tables 1 and 2, the value of Xf / Xr is also shown when the fiber content in the vapor chamber manufacturing member is Xf [mass%] and the resin material content is Xr [mass%].

[0247] [Table 1]

[0248] [Table 2]

[0249] [5] Evaluation A ceramic heater (manufactured by Sakaguchi Electric Heating Co., Ltd., product number: Ultramic, heater part 12 mm square, 2.5 mm thick) was prepared, with variable heater output and the ability to measure the temperature inside the heater.

[0250] When the ceramic heater was powered at 4 W and 7 W, the internal temperatures of the heater were 225°C and 310°C, respectively.

[0251] Next, the ceramic heater was outputted at 4 W and 7 W, respectively, and the end of the vapor chamber manufactured in each of the Examples and Comparative Examples was placed on the heater part, and the temperature inside the heater was measured when it stabilized. These results are summarized in Tables 3 and 4.

[0252] [Table 3]

[0253] [Table 4]

[0254] As is clear from Tables 3 and 4, in Comparative Example 1, in which no fiber base material was used in the vapor chamber manufacturing components, the temperature of the ceramic heater dropped by 30°C at both 4 W and 7 W output, but in the vapor chambers of each of the above Examples, the temperature drop was much greater, demonstrating good heat transport capacity.

[0255] It was also confirmed that the vapor chambers according to each of the above examples all had excellent flexibility.

[0256] In addition, the thickness of the fiber base material constituting the vapor chamber manufacturing component was variously changed within the range of 10 μm or more and 1000 μm or less, the thickness of the vapor chamber manufacturing component was variously changed within the range of 10 μm or more and 2000 μm or less, and the value of Xf / Xr, where Xf [mass%] is the fiber content in the vapor chamber manufacturing component and Xr [mass%] is the resin material content in the vapor chamber manufacturing component, was variously changed within the range of 0.01 or more and 8.0 or less. Vapor chambers were manufactured in the same manner as above and evaluated in the same manner as above, and excellent effects similar to those described above were obtained.

[0257] In addition, by changing the method of applying the resin varnish to the fiber substrate, vapor chamber manufacturing components were manufactured as shown in Figures 2 and 4. These vapor chamber manufacturing components were used to manufacture vapor chambers in the same manner as above, except that they were used to form the cross-sectional structures shown in Figures 5, 7, and 8. When the components were evaluated in the same manner as above, excellent effects were obtained, as described above.

[0258] In addition, a vapor chamber was manufactured in the same manner as above, except that a woven fabric composed of fibers composed of paraphenylene benzobisoxazole, an aromatic resin containing a heterocycle in the molecule, was used instead of the glass woven fabric, and evaluation was performed in the same manner as above, and the same excellent effects were obtained. [Explanation of symbols]

[0259] 100: Vapor chamber 10: Wick structure 10': Vapor chamber manufacturing materials 11: First Side 12: The second side 13: Fiber base material (fiber sheet) 131: Fiber 14': Resin material 14: Cured resin material 15: Flow path part 16: Channel wall 20: Container 21: First sheet material 22: Second sheet material 23: Sealing part 30: Hydraulic fluid S: Spacing L: Width E: Light (exposure light)

Claims

1. A vapor chamber manufacturing component preparation step of preparing a vapor chamber manufacturing component including fibers and an uncured resin material; a first joining step of joining the vapor chamber manufacturing member to a first sheet material at a first surface, which is one surface of the member; an exposure step of irradiating the vapor chamber manufacturing member joined to the first sheet material with light in a predetermined pattern; a developing step for removing the uncured resin material from the portion not irradiated with the light in the exposure step; a second bonding step of bonding the vapor chamber manufacturing member that has undergone the developing step to a second sheet material on a second surface that is the surface opposite to the first surface; A method for manufacturing a vapor chamber, comprising a hydraulic fluid supply and sealing process for injecting a hydraulic fluid into the space between the first sheet material and the second sheet material and sealing the space.

2. A method for manufacturing a vapor chamber as described in Claim 1, wherein the component for manufacturing a vapor chamber includes a fiber base material composed of the fibers and the resin material impregnated in the fiber base material.

3. The method for manufacturing a vapor chamber according to claim 2 , wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less.

4. A method for manufacturing a vapor chamber as described in claim 2 or 3, wherein the thickness of the vapor chamber manufacturing component is 10 μm or more and 2000 μm or less.

5. The method for manufacturing a vapor chamber according to any one of claims 1 to 4, wherein the fibers are made of an aromatic resin containing a heterocycle in its molecule.

6. A method for manufacturing a vapor chamber described in any one of claims 1 to 5, wherein when the content of the fiber in the vapor chamber manufacturing component is Xf [mass%] and the content of the resin material is Xr [mass%], the relationship of 0.01≦Xf / Xr≦8.0 is satisfied.

7. The method for manufacturing a vapor chamber according to any one of claims 1 to 6, wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin.

8. The method for manufacturing a vapor chamber according to claim 7 , wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group.

9. The method for manufacturing a vapor chamber according to claim 7 or 8, wherein the resin material further contains a thermosetting resin different from the alkali-soluble resin.

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