Resin composition

Abstract

The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a large-sized and finely wired circuit board. A resin composition comprising (A) an epoxy resin and (B) an inorganic filler, which satisfies the relation ship 0.75<C2 / C1<1 [wherein: C1 represents the amount of chloride ion contained in a cured product of the resin composition, which is thermally cured at 170°C for 4 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007); and C2 represents the amount of chloride ion contained in a cured product of the resin composition, which is thermally cured at 200°C for 2 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), and which also satisfies the relationship D2 / D1<1.3 [wherein: D1 represents the elastic modulus at 25°C of a cured product of the resin composition which is thermally cured at 170°C for 4 hours; and D2 represents the elastic modulus at 25°C of a cured product of the resin composition which is thermally cured at 230°C for 4 hours].

Description

[Technical field]

[0001] The present invention relates to a resin composition. The present invention further relates to a resin sheet, a printed wiring board, a semiconductor chip package, a semiconductor device, a method for producing a printed wiring board, and a method for producing a semiconductor chip package, each of which uses the resin composition. [Background technology]

[0002] As an insulating material that can be used as an insulating layer of a circuit board, for example, one formed by curing a resin composition is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-237715 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for larger circuit boards in order to provide higher functionality, and therefore there is a demand for insulating layers that have excellent insulation reliability in high-temperature and high-humidity environments even when the circuit boards are enlarged.

[0005] However, as the size of a circuit board increases, the curing temperature when curing a resin composition may not be uniform, and the curing temperature may vary. The present inventors have found that the variation in the curing temperature causes unevenness in the insulation reliability of the insulating layer in a high-temperature and high-humidity environment.

[0006] The present invention was conceived in view of the above problems, and provides a resin composition capable of obtaining a cured product excellent in insulation reliability even when the circuit board is enlarged, in a high-temperature and high-humidity environment; a resin sheet using the resin composition; a printed wiring board, a semiconductor chip package, a semiconductor device, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor chip package using the resin composition.

Means for Solving the Problems

[0007] As a result of intensive studies, the present inventors have found that the above problems can be solved by a resin composition having the following configuration, and have completed the present invention.

[0008] That is, the present invention includes the following contents. [1] A resin composition containing (A) an epoxy resin and (B) an inorganic filler, wherein when the amount of chloride ions contained in the cured product of the resin composition heat-cured at 170°C for 4 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), is C1, and the amount of chloride ions contained in the cured product of the resin composition heat-cured at 200°C for 2 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), is C2, the relationship of 0.75 < C2 / C1 < 1 is satisfied, and when the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 170°C for 4 hours is D1, and the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 230°C for 4 hours is D2, the resin composition satisfies the relationship of D2 / D1 < 1.3. [2] The resin composition according to [1], wherein the amount C1 of chloride ions contained in the cured product of the resin composition heat-cured at 170°C for 4 hours is 230 ppm or less. [3] The resin composition according to [1] or [2], wherein the amount C2 of chloride ions contained in the cured product of the resin composition heat-cured at 200°C for 2 hours is 200 ppm or less. [4] The resin composition according to any one of [1] to [3], further containing (C) a compound having a radically polymerizable unsaturated group. [5] The resin composition according to [4], wherein the radically polymerizable unsaturated group is a maleimide group. [6] The resin composition according to [4] or [5], wherein the component (C) has a long-chain aliphatic skeleton. [7] The resin composition according to any one of [1] to [6], further comprising (D) a curing agent. [8] The resin composition according to [7], wherein the component (D) contains a carbodiimide-based curing agent. [9] The resin composition according to any one of [1] to [8], further comprising (E) an elastomer.

[10] The resin composition according to any one of [1] to [9], further comprising (F) an antioxidant.

[11] The resin composition according to

[10] , wherein the component (F) contains a hindered phenol-based antioxidant.

[12] The resin composition according to any one of [1] to

[11] , which is for forming an insulating layer of a multilayer printed wiring board formed by a dry process.

[13] A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of [1] to

[12] .

[14] A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of [1] to

[12] .

[15] A semiconductor chip package comprising: a semiconductor chip; and, on the semiconductor chip, a cured product of the resin composition according to any one of [1] to

[12] .

[16] A semiconductor device comprising the printed wiring board according to

[14] or the semiconductor chip package according to

[15] .

[17] A step of forming an insulating layer containing a cured product of the resin composition according to any one of [1] to

[12] on an inner layer circuit board; and A method for manufacturing a printed wiring board, comprising: performing a dry desmear treatment on a surface of an insulating layer.

[18] A method for producing a semiconductor chip package, comprising the step of forming a layer containing a cured product of the resin composition according to any one of [1] to

[12] on a semiconductor chip. Effect of the Invention

[0009] According to the present invention, even when the circuit board is enlarged, it is possible to obtain a cured product having excellent insulation reliability in a high-temperature and high-humidity environment; a resin sheet using the resin composition; a printed wiring board using the resin composition; a semiconductor chip package; a semiconductor device; a method for manufacturing a printed wiring board; and a method for manufacturing a semiconductor chip package can be provided.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples given below, and can be arbitrarily modified and implemented without departing from the scope of the claims of the present invention and its equivalent scope. Also, "ppm" is based on mass unless otherwise specified.

[0011] [Resin Composition] The resin composition of the present invention is a resin composition containing (A) an epoxy resin and (B) an inorganic filler. When the amount of chloride ions contained in the cured product of the resin composition heat-cured at 170°C for 4 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), is C1, and the amount of chloride ions contained in the cured product of the resin composition heat-cured at 200°C for 2 hours, measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), is C2, the relationship of 0.75 < C2 / C1 < 1 is satisfied. When the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 170°C for 4 hours is D1, and the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 230°C for 4 hours is D2, the relationship of D2 / D1 < 1.3 is satisfied. As a result, even when the inner layer circuit board is enlarged, the insulation reliability becomes excellent in a high-temperature and high-humidity environment. Also, usually, even when the inner layer circuit board has fine wiring, excellent insulation reliability can be achieved in a high-temperature and high-humidity environment. In addition, it becomes possible to obtain a cured product in which an increase in the elastic modulus is suppressed, and it also becomes possible to form an insulating layer having a high Vickers hardness.

[0012] As described above, when an attempt is made to form a larger insulating layer in accordance with the increase in size of the inner layer circuit board, the insulating reliability deteriorates in a high temperature and high humidity environment due to variations in the curing temperature.

[0013] Usually, the epoxy resin contained in the resin composition contains epichlorohydrin and chlorine atom-containing compounds derived from epichlorohydrin as impurities, and the chloride ions derived from epichlorohydrin and chlorine atom-containing compounds derived from epichlorohydrin affect the insulation reliability of the insulating layer. As a result of intensive research by the present inventors, it was found that the amount of chloride ions contained in the insulating layer varies depending on the curing conditions of the resin composition, specifically, the amount of chloride ions contained in the insulating layer is reduced when the resin composition is cured at a high temperature compared to when it is cured at a low temperature. In addition, the present inventors found that when a large-area insulating layer is formed, the curing temperature of the resin composition to form the insulating layer may vary, and that the chloride ions may become locally large in the area where the curing temperature is lowered due to the temperature variation. In contrast, in the present invention, when the (A) and (B) components are adjusted so that the ratio between the amount of chloride ions contained in the cured product when cured at low temperature and the amount of chloride ions contained in the cured product when cured at high temperature is within a specified range, the amount of chloride ions in the part where the curing temperature is locally low can be reduced to the same level as in the other parts. Therefore, even if the cured product is enlarged in order to form an insulating layer on a large-area inner layer circuit board, it has been found that the insulating reliability of the cured product under high temperature and high humidity can be improved. The amount of chloride ions will be described later.

[0014] In addition, as a result of intensive research by the present inventors, it was found that the degree of phase separation of the resin composition varies depending on the curing temperature of the resin composition. In particular, when a large-area insulating layer is formed, it was found that if the curing temperature of the resin composition can vary, the degree of phase separation of the resin composition also varies depending on the temperature variation. The present inventors also found that the elastic modulus changes locally due to the variation in phase separation, making the insulating layer brittle and affecting the insulation reliability. In contrast, if the (A) component and the (B) component are adjusted so that the ratio of the elastic modulus of the cured product when cured at a low temperature to the elastic modulus of the cured product when cured at a high temperature is within a predetermined range as in the present invention, the local change in the elastic modulus due to the variation in the curing temperature can be reduced. Therefore, it was found that even when the cured product is enlarged in order to form an insulating layer on a large-area inner layer circuit board, the insulation reliability of the cured product under high temperature and high humidity can be excellent. The elastic modulus will be described later.

[0015] The resin composition may further contain optional components in combination with the components (A) and (B). Examples of the optional components include (C) a compound having a radical polymerizable unsaturated group, (D) a curing agent, (E) an elastomer, (F) an antioxidant, (G) a curing accelerator, and (H) other additives. Each component contained in the resin composition of the present invention will be described in detail below.

[0016] <(A) Epoxy resin> The resin composition contains an epoxy resin (A) as component (A). Examples of epoxy resins include bixylenol type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, cresol novolac type epoxy resins, phenol aralkyl type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylethane type epoxy resins, isocyanurate type epoxy resins, and phenolphthalimidine type epoxy resins. The epoxy resin may be used alone or in combination of two or more. In addition, it is preferable to use a flexible epoxy resin that has a low elastic modulus when combined with a curing agent (D) described later.

[0017] From the viewpoint of obtaining a cured product having excellent heat resistance, the epoxy resin preferably contains an aromatic structure. The aromatic structure is a chemical structure generally defined as aromatic, and includes polycyclic aromatic rings and aromatic heterocycles. Examples of epoxy resins containing an aromatic structure include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, bisxylenol type epoxy resins, glycidylamine type epoxy resins having an aromatic structure, glycidyl ester type epoxy resins having an aromatic structure, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins having an aromatic structure, epoxy resins having a butadiene structure having an aromatic structure, alicyclic epoxy resins having an aromatic structure, heterocyclic epoxy resins, spiro ring-containing epoxy resins having an aromatic structure, cyclohexane dimethanol type epoxy resins having an aromatic structure, naphthylene ether type epoxy resins, trimethylol type epoxy resins having an aromatic structure, and tetraphenylethane type epoxy resins having an aromatic structure.

[0018] The (A) epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, based on 100% by mass of the non-volatile components of the epoxy resin.

[0019] Epoxy resins include epoxy resins that are liquid at a temperature of 20° C. (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20° C. (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition may contain only liquid epoxy resins as the epoxy resin, or may contain only solid epoxy resins, or may contain a combination of liquid epoxy resins and solid epoxy resins.

[0020] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0021] As the liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, and epoxy resin having a butadiene structure are preferred, and bisphenol A type epoxy resin and naphthalene type epoxy resin are more preferred.

[0022] Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycirol type epoxy resin) manufactured by ADEKA Corporation; "EP-3950L" and "EP-3980S" ( glycidylamine type epoxy resin); ADEKA's "EP-4088S" (dicyclopentadiene type epoxy resin); Nippon Steel Chemical & Material Chemical's "ZX1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); Nagase Chemtex's "EX-721" (glycidyl ester type epoxy resin); Daicel's "Celloxide 2021P" (alicyclic epoxy resin having an ester skeleton); Daicel's "PB-3600", Nippon Soda's "JP-100" and "JP-200" (epoxy resin having a butadiene structure); Nippon Steel Chemical & Material's "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. These may be used alone or in combination of two or more types.

[0023] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

[0024] As the solid epoxy resin, bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, naphthol novolac type epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, and phenolphthalimidine type epoxy resin are preferred, and biphenyl type epoxy resin and naphthylene ether type epoxy resin are more preferred.

[0025] Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene type epoxy resins) manufactured by DIC Corporation; and "EXA-7311" manufactured by DIC Corporation. , "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN475V", "ESN4 100V" (naphthalene type epoxy resin); "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "Y Examples of epoxy resins include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals; "YX7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0026] When a liquid epoxy resin and a solid epoxy resin are used in combination as the epoxy resin, the mass ratio thereof (liquid epoxy resin:solid epoxy resin) is preferably 1:0.01 to 1:20, more preferably 1:0.05 to 1:10, and particularly preferably 1:0.1 to 1:5.

[0027] The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 3,000 g / eq., further preferably 80 g / eq. to 2,000 g / eq., and particularly preferably 110 g / eq. to 1,000 g / eq. The epoxy equivalent represents the mass of the resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0028] The weight average molecular weight (Mw) of the epoxy resin is preferably from 100 to 5,000, more preferably from 250 to 3,000, and further preferably from 400 to 1500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0029] From the viewpoint of obtaining a cured product exhibiting good mechanical strength and insulation reliability, the content of the (A) epoxy resin is preferably 1% by mass or more, more preferably 3% by mass or more, particularly preferably 5% by mass or more, and is preferably 25% by mass or less, more preferably 20% by mass or less, particularly preferably 15% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. In the present invention, the content of each component in the resin composition is the value when the nonvolatile components in the resin composition are taken as 100% by mass, unless otherwise specified, and the nonvolatile components refer to the entire nonvolatile components in the resin composition excluding the solvent.

[0030] The above-mentioned commercially available epoxy resin may contain epichlorohydrin and chlorine atom-containing compounds derived from epichlorohydrin. Therefore, the commercially available epoxy resin may be used after being purified to remove epichlorohydrin and chlorine atom-containing compounds derived from epichlorohydrin. This can reduce the amount of chloride ions in the resin composition. Examples of the purification process include distillation.

[0031] <(B) Inorganic filler> The resin composition contains an inorganic filler (B) as component (B). By using the inorganic filler (B), the elastic modulus of the cured product of the resin composition can be reduced, and the occurrence of cracks and warping in the cured product can be suppressed.

[0032] As the material of the inorganic filler, an inorganic compound is used. Examples of the material of the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, calcium carbonate and silica are preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. In addition, as the silica, spherical silica is preferred. The (B) inorganic filler may be used alone or in combination of two or more kinds.

[0033] Examples of commercially available products of component (B) include "ST7030-20" manufactured by Nippon Steel Chemical & Materials Co., Ltd.; "MSS-6" and "AC-5V" manufactured by Tatsumori Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30", "SFP-130MC", "FB-7SDC", "FB-5SDC", and "FB-3SDC" manufactured by Denka Co., Ltd.; "Silfill NSS-3N", "Silfill NSS-4N", and "Silfill NSS-5N" manufactured by Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", and "FE9" manufactured by Admatechs Co., Ltd.

[0034] The specific surface area of ​​component (B) is preferably 1 m 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 3m 2 / g or more. There is no particular upper limit, but it is preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area is determined by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountec Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multipoint method.

[0035] From the viewpoint of significantly obtaining the desired effects of the present invention, the average particle size of component (B) is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and is preferably 20 μm or less, more preferably 15 μm or less, even more preferably 10 μm or less.

[0036] The average particle size of component (B) can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, a particle size distribution of the inorganic filler is created on a volume basis using a laser diffraction / scattering particle size distribution measuring device, and the median diameter is used as the average particle size. The measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture by ultrasonic waves for 10 minutes. The measurement sample is measured using a laser diffraction particle size distribution measuring device with blue and red light wavelengths as the light source, and the particle size distribution of component (B) on a volume basis is measured using a flow cell method, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0037] From the viewpoint of improving moisture resistance and dispersibility, the (B) component is preferably treated with a surface treatment agent. Examples of the surface treatment agent include vinylsilane coupling agents, (meth)acrylic coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilane, organosilazane compounds, and titanate coupling agents. Among them, from the viewpoint of obtaining the effects of the present invention remarkably, vinylsilane coupling agents, (meth)acrylic coupling agents, aminosilane coupling agents, epoxysilane coupling agents, and silane coupling agents are preferred, and aminosilane coupling agents, epoxysilane coupling agents, and silane coupling agents are more preferred. In addition, the surface treatment agent may be used alone or in any combination of two or more types.

[0038] Commercially available surface treatment agents include, for example, Shin-Etsu Chemical Co., Ltd.'s "KBM1003" (vinyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM503" (3-methacryloxypropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), ... Examples of such silane coupling agents include Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0039] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 parts by mass to 5 parts by mass of the surface treatment agent, more preferably 0.2 parts by mass to 3 parts by mass, and even more preferably 0.3 parts by mass to 2 parts by mass.

[0040] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity in the form of a sheet, it is more preferable that the content is 1 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0041] The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. The carbon analyzer that can be used is the "EMIA-320V" manufactured by Horiba, Ltd.

[0042] From the viewpoint of effectively lowering the elastic modulus of the cured product of the resin composition, the content of the (B) component is preferably 60 mass% or more, more preferably 70 mass% or more, and even more preferably 75 mass% or more, and is preferably 95 mass% or less, more preferably 93 mass% or less, and even more preferably 90 mass% or less, when the non-volatile components in the resin composition are taken as 100 mass%.

[0043] <(C) Compound Having a Radically Polymerizable Unsaturated Group> In addition to the above-mentioned components, the resin composition may contain (C) a compound having a radical polymerizable unsaturated group. The component (C) does not include those corresponding to the components (A) to (B). By including the component (C) in the resin composition, it is possible to obtain a cured product having excellent insulation reliability. The component (C) may be used alone or in combination of two or more kinds.

[0044] The (C) component preferably contains a compound having a radically polymerizable unsaturated group in the molecule. The radically polymerizable unsaturated group refers to a group containing an unsaturated bond exhibiting radical polymerizability. Examples of the radically polymerizable unsaturated group include a group containing an ethylenic double bond. The (C) component containing such a radically polymerizable unsaturated group can cause radical polymerization by heat or active energy rays, and can cure the resin composition.

[0045] Examples of the radically polymerizable unsaturated group include a maleimide group, a vinyl group, an allyl group, a styryl group, a vinylphenyl group, a (meth)acryloyl group, a fumaroyl group, and a maleoyl group. Among them, from the viewpoint of obtaining the effect of the present invention remarkably, the radically polymerizable unsaturated group is preferably one or more selected from a maleimide group, a (meth)acryloyl group, a styryl group, and a vinylphenyl group, and more preferably a maleimide group. The number of radically polymerizable unsaturated groups contained in the (C) component is usually 1 or more, preferably 2 or more. When the (C) component contains two or more radically polymerizable unsaturated groups, the two or more radically polymerizable unsaturated groups may be the same or different. The (meth)acryloyl group includes a methacryloyl group, an acryloyl group, and a combination thereof.

[0046] The component (C) preferably has a long-chain aliphatic skeleton in addition to the radically polymerizable unsaturated group. Examples of the long-chain aliphatic skeleton include an aliphatic group having 5 or more carbon atoms.

[0047] Examples of the aliphatic group having 5 or more carbon atoms include an alkylene group, an alkenylene group, and an alkyl group.

[0048] The number of carbon atoms of the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. The alkylene group may be linear, branched, or cyclic, and linear is preferred. Here, the cyclic alkylene group is a concept that includes the case where it is composed of only a cyclic alkylene group and the case where it contains both a linear alkylene group and a cyclic alkylene group. Examples of such alkylene groups include pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriacontylene, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0049] The number of carbon atoms of the alkenylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. This alkenylene group may be linear, branched, or cyclic, and among them, a linear one is preferable. Here, the cyclic alkenylene group is a concept including both the case consisting only of a cyclic alkenylene group and the case including both a linear alkenylene group and a cyclic alkenylene group. Examples of such an alkenylene group include a pentynylene group, a hexynylene group, a heptylenylene group, an octynylene group, a nonynylene group, a decynylene group, an undecynylene group, a dodecynylene group, a tridecynylene group, a heptadecynylene group, a hexatriacontynylene group, a group having an octynylene-cyclohexynylene structure, a group having an octynylene-cyclohexynylene-octynylene structure, a group having a propynylene-cyclohexynylene-octynylene structure, and the like.

[0050] The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. This alkyl group may be linear, branched, or cyclic, and among them, a linear one is preferable. Examples of such an alkyl group include a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, and the like. The alkyl group having 5 or more carbon atoms may be used as a substituent of the alkylene group having 5 or more carbon atoms.

[0051] As the maleimide resin containing a maleimide group as a radically polymerizable unsaturated group, a compound having one or more (preferably two or more) maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl groups) in one molecule can be used. In addition, the maleimide resin containing a maleimide group as a radically polymerizable unsaturated group preferably has a long-chain aliphatic skeleton. Examples of maleimide resins include maleimide resins containing an aliphatic skeleton having 36 carbon atoms derived from dimer diamine, such as "BMI-3000J", "BMI-5000", "BMI-1400", "BMI-1500", "BMI-1700", "BMI-689", and "SLK-6895" (all manufactured by DigiCner Molecules); maleimide resins containing an indane skeleton, as described in the Japan Institute of Invention and Innovation Disclosure Technical Bulletin No. 2020-500211; and maleimide resins containing an aromatic ring skeleton directly bonded to the nitrogen atom of the maleimide group, such as "MIR-3000-70MT" (manufactured by Nippon Kayaku Co., Ltd.), "BMI-4000" (manufactured by Daiwa Kasei Co., Ltd.), and "BMI-80" (manufactured by Keiai Kasei Co., Ltd.).

[0052] The (meth)acrylic resin containing a (meth)acryloyl group as a radically polymerizable unsaturated group is not particularly limited in type, and may be a monomer or an oligomer, as long as it has one or more (preferably two or more) (meth)acryloyl groups in one molecule. Here, the term "(meth)acryloyl group" is a general term for acryloyl groups and methacryloyl groups. Examples of methacrylic resins include (meth)acrylic resins such as "A-DOG" (manufactured by Shin-Nakamura Chemical Co., Ltd.), "DCP-A" (manufactured by Kyoeisha Chemical Co., Ltd.), "NPDGA", "FM-400", "R-687", "THE-330", "PET-30", and "DPHA" (all manufactured by Nippon Kayaku Co., Ltd.). The (meth)acrylic resin is a resin that includes a methacryloyl group, an acryloyl group, and a combination thereof.

[0053] The styryl resin containing a styryl group or a vinylphenyl group as a radically polymerizable unsaturated group is not particularly limited in type, and may be a monomer or an oligomer, so long as it has one or more (preferably two or more) styryl groups or vinylphenyl groups in one molecule. Examples of the styryl resin include styryl resins such as "OPE-2St", "OPE-2St 1200", and "OPE-2St 2200" (all manufactured by Mitsubishi Gas Chemical Company, Inc.).

[0054] From the viewpoint of obtaining a cured product having excellent insulation reliability, the content of the (C) component is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more, and is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0055] When the resin composition of the present invention contains the component (C), the component (C) preferably contains a maleimide resin from the viewpoint of obtaining a cured product having excellent insulation reliability, and the maleimide resin more preferably has a long-chain aliphatic skeleton. When the resin composition of the present invention contains the component (C), the component (C) is preferably contained in combination with the component (D), and more preferably contains a maleimide resin and a carbodiimide-based curing agent in combination.

[0056] <(D) Hardener> The resin composition may contain a (D) curing agent as an optional component in addition to the above-mentioned components. The (D) component does not include those corresponding to the (A) to (C) components. As the (D) curing agent, a compound having a function of reacting with the (A) component to cure the resin composition can be used, and examples thereof include carbodiimide-based curing agents, active ester-based curing agents, phenol-based curing agents, naphthol-based curing agents, benzoxazine-based curing agents, and cyanate ester-based curing agents. Among them, from the viewpoint of improving insulation reliability, the (D) curing agent preferably contains one or more of carbodiimide-based curing agents, phenol-based curing agents, naphthol-based curing agents, and active ester-based curing agents, and more preferably contains a carbodiimide-based curing agent. The (D) curing agent may be used alone or in combination of two or more.

[0057] As the phenol-based curing agent and naphthol-based curing agent, from the viewpoint of heat resistance and water resistance, a phenol-based curing agent having a novolac structure or a naphthol-based curing agent having a novolac structure is preferable. Also, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based curing agent is more preferable.

[0058] Specific examples of phenol-based curing agents and naphthol-based curing agents include, for example, "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd., "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", and "SN395" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA3018-50P", "EXB-9500", and "KA-1163" manufactured by DIC Corporation.

[0059] Specific examples of benzoxazine-based curing agents include "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd.

[0060] Examples of the cyanate ester curing agent include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylidene))benzene, bis(4-cyanate phenyl)thioether, and bis(4-cyanate phenyl)ether; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0061] The carbodiimide curing agent is a compound having one or more carbodiimide groups (-N=C=N-) in one molecule, and the carbodiimide curing agent is preferably a compound having two or more carbodiimide groups in one molecule.

[0062] Specific examples of the carbodiimide-based curing agent include commercially available carbodiimide-based curing agents such as Carbodilite V-03 (carbodiimide group equivalent: 216, V-05 (carbodiimide group equivalent: 262), V-07 (carbodiimide group equivalent: 200), V-09 (carbodiimide group equivalent: 200), and Stavaxol P (carbodiimide group equivalent: 302), all manufactured by Nisshinbo Chemical Co., Ltd.

[0063] The active ester curing agent is not particularly limited, but generally, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, the term "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0064] Specifically, active ester compounds containing a dicyclopentadiene-type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated product of phenol novolac, and active ester compounds containing a benzoylated product of phenol novolac are preferred, and among these, active ester compounds containing a naphthalene structure and active ester compounds containing a dicyclopentadiene-type diphenol structure are more preferred. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0065] Commercially available active ester curing agents include active ester compounds containing a dicyclopentadiene-type diphenol structure, such as "EXB-9451", "EXB-9460", "EXB-9460S", "HPC-8000-65T", "HPC-8000H-65TM", and "HPC-8000L-65TM" (manufactured by DIC Corporation); active ester compounds containing a naphthalene structure, such as "EXB-9416-70BK", "EXB-8100L-65T", "EXB-8150-65T", "EXB-8150L-65T", "HPC-8150-60T", "HPC-8150-62T", and "HP-B-8151-62T" (manufactured by DIC Corporation); and phenol novolac. Examples of the active ester compound containing an acetylated product of phenol novolac include "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester compound containing a benzoylated product of phenol novolac includes "YLH1026" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent which is an acetylated product of phenol novolac includes "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent which is a benzoylated product of phenol novolac includes "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation), and an active ester compound containing a styryl group includes "PC1300-02-65MA" (manufactured by Air Water Corporation).

[0066] When the resin composition contains the (D) component, the ratio of the amount of the (A) epoxy resin to the (D) component is preferably 1:0.01 to 1:5, more preferably 1:0.3 to 1:3, and even more preferably 1:0.5 to 1:2, in terms of the ratio of [total number of epoxy groups in the (A) epoxy resin]:[total number of active groups in the (D) component]. Here, the "number of epoxy groups in the epoxy resin" refers to the total value obtained by dividing the mass of the non-volatile components of the epoxy resin present in the resin composition by the epoxy equivalent. In addition, the "number of active groups in the (D) component" refers to the total value obtained by dividing the mass of the non-volatile components of the (D) component present in the resin composition by the active group equivalent. By setting the ratio of the amount of the epoxy resin to the (D) component within this range, the effects of the present invention can be obtained significantly.

[0067] From the viewpoint of obtaining the desired effect of the present invention remarkably, the content of the (D) component is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, based on 100% by mass of the non-volatile components in the resin composition. The upper limit is preferably 15% by mass or less, more preferably 13% by mass or less, and even more preferably 10% by mass or less.

[0068] <(E) Elastomer> The resin composition may contain an optional component (E) elastomer in addition to the above-mentioned components. The component (E) does not include components (A) to (D). When the component (E) is contained in the resin composition, the crosslink density of the component (A) etc. of the cured product of the resin composition is reduced. Therefore, at the curing stage of the resin composition, the chloride ions contained in the resin composition are easily removed from the resin composition, and it is possible to reduce the amount of chloride ions in the cured product. As a result, it is possible to obtain a cured product with improved insulation reliability in a high-temperature and high-humidity environment. The component (E) may be used alone or in combination of two or more types.

[0069] (E) elastomer means a flexible resin, which is an amorphous resin component that dissolves in an organic solvent, and is preferably a resin having rubber elasticity or a resin that exhibits rubber elasticity by polymerizing with other components. Examples of rubber elasticity include resins that exhibit an elastic modulus of 1 GPa or less when a tensile test is performed at a temperature of 25°C and a humidity of 40% RH in accordance with the Japanese Industrial Standards (JIS K7161).

[0070] In one embodiment, the component (E) is preferably one or more resins selected from resins having a glass transition temperature of 25°C or lower or which are liquid at 25°C.

[0071] The glass transition temperature (Tg) of component (E) of the polymer resin having a glass transition temperature of 25° C. or lower is preferably 20° C. or lower, and more preferably 15° C. or lower. There is no particular lower limit for the glass transition temperature of component (E), but it can usually be −15° C. or higher.

[0072] The resin that is liquid at 25°C as component (E) is preferably a resin that is liquid at 20°C or lower, and more preferably a resin that is liquid at 15°C or lower.

[0073] The (E) component preferably has a functional group capable of reacting with the (A) component. That is, the (E) component is preferably a resin having a functional group with a glass transition temperature of 25° C. or less, and is preferably one or more resins selected from resins having a functional group that are liquid at 25° C. In a preferred embodiment, the functional group of the (E) component is one or more functional groups selected from the group consisting of a hydroxyl group, an acid anhydride group, a phenolic hydroxyl group, an epoxy group, an isocyanate group, and a urethane group. Among these, the functional group is preferably a hydroxyl group, an acid anhydride group, an epoxy group, or a phenolic hydroxyl group, and more preferably a phenolic hydroxyl group. However, when the (E) component contains an epoxy group as a functional group, it is preferable that the (E) component does not have an aromatic structure.

[0074] The component (E) preferably has one or more structures selected from the group consisting of a polybutadiene structure, a polycarbonate structure, a poly(meth)acrylate structure, a polyalkylene structure, a polyalkyleneoxy structure, a polyisoprene structure, a polyisobutylene structure, and a polysiloxane structure, and more preferably has one or more structures selected from the group consisting of a polybutadiene structure and a polycarbonate structure. Note that "(meth)acrylate" refers to methacrylate and acrylate.

[0075] A suitable embodiment of the (E) component is a butadiene resin. The butadiene resin is preferably a butadiene resin that is liquid at 25°C or has a glass transition temperature of 25°C or less, more preferably one or more resins selected from the group consisting of hydrogenated polybutadiene skeleton-containing resins (e.g., hydrogenated polybutadiene skeleton-containing epoxy resins), hydroxyl group-containing butadiene resins, phenolic hydroxyl group-containing butadiene resins (resins having a polybutadiene structure and a phenolic hydroxyl group), carboxyl group-containing butadiene resins, acid anhydride group-containing butadiene resins, epoxy group-containing butadiene resins, isocyanate group-containing butadiene resins, and urethane group-containing butadiene resins, and even more preferably a phenolic hydroxyl group-containing butadiene resin. Here, the term "butadiene resin" refers to a resin that contains a polybutadiene structure, and in these resins, the polybutadiene structure may be contained in the main chain or in the side chain. The polybutadiene structure may be partially or entirely hydrogenated. Here, the term "hydrogenated polybutadiene skeleton-containing resin" refers to a resin in which at least a portion of the polybutadiene skeleton is hydrogenated, and it is not necessarily a resin in which the polybutadiene skeleton is completely hydrogenated.

[0076] The number average molecular weight (Mn) of the butadiene resin is preferably 1,000 to 100,000, more preferably 5,000 to 50,000, more preferably 7,500 to 30,000, and even more preferably 10,000 to 15,000. Here, the number average molecular weight (Mn) of the resin is a polystyrene-equivalent number average molecular weight measured using GPC (gel permeation chromatography).

[0077] When the butadiene resin has a functional group, the functional group equivalent is preferably 100 to 10,000, more preferably 200 to 5,000. The functional group equivalent is the number of grams of a resin containing 1 gram equivalent of a functional group. For example, the epoxy group equivalent can be measured according to JIS K7236. The hydroxyl group equivalent can be calculated by dividing the molecular weight of KOH by the hydroxyl value measured according to JIS K1557-1.

[0078] Specific examples of butadiene resins include "Ricon 657" (epoxy group-containing polybutadiene), "Ricon 130MA8", "Ricon 130MA13", "Ricon 130MA20", "Ricon 131MA5", "Ricon 131MA10", "Ricon 131MA17", "Ricon 131MA20", and "Ricon 184MA6" (acid anhydride group-containing polybutadiene), "JP-100", "JP-200" (epoxidized polybutadiene), "GQ-1000" (hydroxyl group- and carboxyl group-introduced polybutadiene), "G-1000", "G-2000", and "G-3000" (polybutadiene with hydroxyl groups at both ends), "GI-1000", "GI-2000", and "GI-3000" (polybutadiene with hydrogenated hydroxyl groups at both ends) manufactured by Cray Valley Corporation, and Daicel Corporation. Examples of such epoxy resins include "PB3600" and "PB4700" (polybutadiene-based epoxy resins), "Epofriend A1005", "Epofriend A1010", and "Epofriend A1020" (epoxidized styrene-butadiene-styrene block copolymers) manufactured by Nagase ChemteX Corporation; "FCA-061L" (hydrogenated polybutadiene-based epoxy resin) and "R-45EPT" (polybutadiene-based epoxy resin) manufactured by Nagase ChemteX Corporation.

[0079] A preferred embodiment of the component (E) is a carbonate resin. The carbonate resin is preferably a carbonate resin having a glass transition temperature of 25° C. or less, and is preferably one or more resins selected from the group consisting of hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, epoxy group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Here, the term "carbonate resin" refers to a resin containing a carbonate structure, and in these resins, the carbonate structure may be contained in the main chain or in the side chain.

[0080] The number average molecular weight (Mn) and functional group equivalent of the carbonate resin are similar to those of the butadiene resin, and the preferred ranges are also similar.

[0081] Specific examples of carbonate resins include "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090", "C-2090", and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd.

[0082] Also usable is a linear polyimide (PCT / JP2016 / 053609) made from a hydroxyl-terminated polycarbonate, a diisocyanate compound, and a tetrabasic acid anhydride. The content of the carbonate structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. For details of the polyimide resin, refer to the description in PCT / JP2016 / 053609, the contents of which are incorporated herein by reference.

[0083] As another preferred embodiment of the (E) component, a resin having an imide structure can be used. Examples of such (E) component include linear polyimides (polyimides described in JP 2006-37083 A and WO 2008 / 153208 A) made from hydroxyl-terminated polybutadiene, diisocyanate compounds, and tetrabasic acid anhydrides. The content of the butadiene structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. For details of the polyimide resin, the descriptions in JP 2006-37083 A and WO 2008 / 153208 A can be referred to, and the contents of these documents are incorporated herein.

[0084] Component (E) is a polyimide resin having a polybutadiene structure, a urethane structure, and an imide structure in the molecule, or a polyimide resin having a carbonate structure, a urethane structure, and an imide structure in the molecule, and the polyimide resin may have a phenol structure at the molecular terminal.

[0085] The number average molecular weight (Mn) of the polyimide resin is preferably 1,000 to 100,000, and more preferably 10,000 to 15,000. Here, the number average molecular weight (Mn) of the resin is a polystyrene-equivalent number average molecular weight measured using GPC (gel permeation chromatography).

[0086] The acid value of the polyimide resin is preferably 1 KOH / g to 30 KOH / g, and more preferably 10 KOH / g to 20 KOH / g.

[0087] The content of the butadiene structure in the polyimide resin is preferably 60% by mass to 95% by mass, and more preferably 75% by mass to 85% by mass.

[0088] Another preferred embodiment of the component (E) is an acrylic resin. The acrylic resin is preferably an acrylic resin having a glass transition temperature (Tg) of 25° C. or less, and more preferably one or more resins selected from the group consisting of hydroxyl group-containing acrylic resin, phenolic hydroxyl group-containing acrylic resin, carboxyl group-containing acrylic resin, acid anhydride group-containing acrylic resin, epoxy group-containing acrylic resin, isocyanate group-containing acrylic resin, and urethane group-containing acrylic resin. Here, the term "acrylic resin" refers to a resin containing a (meth)acrylate structure, and in these resins, the (meth)acrylate structure may be contained in the main chain or in the side chain.

[0089] The number average molecular weight (Mn) of the acrylic resin is preferably 10,000 to 1,000,000, and more preferably 30,000 to 900,000. Here, the number average molecular weight (Mn) of the resin is a polystyrene-equivalent number average molecular weight measured using GPC (gel permeation chromatography).

[0090] When the acrylic resin has a functional group, the functional group equivalent is preferably 1,000 to 50,000, and more preferably 2,500 to 30,000.

[0091] Specific examples of acrylic resins include Nagase ChemteX's Teisan Resin "SG-70L", "SG-708-6", "WS-023", "SG-700AS", and "SG-280TEA" (carboxy group-containing acrylic acid ester copolymer resin, acid value 5 to 34 mgKOH / g, weight average molecular weight 400,000 to 900,000, Tg-30 to 5°C), "SG-80H", "SG-80H-3", and "SG-P3" (epoxy group-containing acrylic acid ester copolymer resin, epoxy equivalent 4761 to 14285 g / eq, weight average molecular weight 350,000 to 85 Examples of such resins include "SG-600TEA" and "SG-790" (hydroxy group-containing acrylic ester copolymer resin, hydroxyl value 20-40 mgKOH / g, weight average molecular weight 500,000-1,200,000, Tg -37 to -32°C) manufactured by Negami Chemical Industries, Ltd., as well as "ME-2000", "W-116.3" (carboxy group-containing acrylic ester copolymer resin), "W-197C" (hydroxy group-containing acrylic ester copolymer resin), "KG-25", and "KG-3000" (epoxy group-containing acrylic ester copolymer resin).

[0092] Further, a preferred embodiment of the further component (E) is a polyalkylene resin, a polyalkyleneoxy resin, a polysiloxane resin, an alkylene resin, an alkyleneoxy resin, an isoprene resin, or an isobutylene resin.

[0093] The polyalkylene resin is a resin containing a polyalkylene structure. The polyalkylene structure is preferably a polyalkylene structure having 2 to 15 carbon atoms, more preferably a polyalkylene structure having 3 to 10 carbon atoms, and more preferably a polyalkylene structure having 5 to 6 carbon atoms.

[0094] The polyalkyleneoxy resin is a resin containing a polyalkyleneoxy structure. The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and more preferably a polyalkyleneoxy structure having 5 to 6 carbon atoms.

[0095] The polysiloxane resin is a resin containing a polysiloxane structure. Specific examples of the polysiloxane resin include "SMP-2006", "SMP-2003PGMEA", and "SMP-5005PGMEA" manufactured by Shin-Etsu Silicones Co., Ltd., amine-terminated polysiloxane, and linear polyimide made from tetrabasic acid anhydride (International Publication No. 2010 / 053185).

[0096] The alkylene resin is a resin containing a polyalkylene structure. Specific examples of the alkylene resin include "PTXG-1000" and "PTXG-1800" manufactured by Asahi Kasei Fibers Corporation, and "YX-7180" manufactured by Mitsubishi Chemical Corporation (a resin containing an alkylene structure having an ether bond).

[0097] The alkyleneoxy resin is a resin containing a polyalkyleneoxy structure. Specific examples of the alkyleneoxy resin include "EXA-4850-150", "EXA-4816", and "EXA-4822" manufactured by DIC Corporation, "EP-4000", "EP-4003", "EP-4010", and "EP-4011" manufactured by ADEKA Corporation, "BEO-60E" and "BPO-20E" manufactured by New Japan Chemical Co., Ltd., and "YL7175" and "YL7410" manufactured by Mitsubishi Chemical Corporation.

[0098] Isoprene resin is a resin that contains a polyisoprene structure. Specific examples of isoprene resin include "KL-610" and "KL613" manufactured by Kuraray Co., Ltd.

[0099] Isobutylene resin is a resin containing a polyisobutylene structure. Specific examples of isobutylene resin include Kaneka Corporation's "SIBSTAR-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer).

[0100] Further preferred embodiments of the (E) component include acrylic rubber particles, polyamide fine particles, silicone particles, etc. Specific examples of acrylic rubber particles include resin fine particles obtained by subjecting resins exhibiting rubber elasticity, such as acrylonitrile butadiene rubber, butadiene rubber, and acrylic rubber, to chemical crosslinking treatment to make them insoluble and infusible in organic solvents, and specifically include XER-91 (manufactured by Japan Synthetic Rubber Co., Ltd.), Staphyloid AC3355, AC3816, AC3832, AC4030, AC3364, IM101 (all manufactured by Ganz Chemical Industry Co., Ltd.), Paraloid EXL2655, EXL2602 (all manufactured by Kureha Chemical Industry Co., Ltd.), etc. Specific examples of polyamide fine particles include aliphatic polyamides such as nylon, and further, any flexible skeleton such as polyamideimide, and specifically include VESTOSINT 2070 (manufactured by Daicel-Huls Co., Ltd.) and SP500 (manufactured by Toray Industries, Inc.).

[0101] From the viewpoint of obtaining the effects of the present invention prominently, the content of the (E) component is preferably 1 mass% or more, more preferably 2 mass% or more, and even more preferably 3 mass% or more, and is preferably 10 mass% or less, more preferably 8 mass% or less, and even more preferably 5 mass% or less, when the non-volatile components in the resin composition are taken as 100 mass%.

[0102] <(F) Antioxidants> In addition to the above-mentioned components, the resin composition may further contain an optional component (F) an antioxidant. The component (F) excludes those corresponding to the components (A) to (E). The component (F) may be used alone or in combination of two or more.

[0103] Examples of the (F) antioxidant include hindered phenol-based antioxidants, phosphorus-based antioxidants, sulfur-based antioxidants, etc. Among these, from the viewpoint of obtaining the effects of the present invention significantly, the hindered phenol-based antioxidant is preferred as the antioxidant.

[0104] (F) Specific examples of the antioxidant include, for example, dibutylhydroxytoluene (BHT), pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate), 2,2'-thio-diethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and the like.

[0105] (F) Commercially available products may be used as the antioxidant. Examples of commercially available products include "IRGANOX 1010", "IRGANOX 1035", "IRGANOX 3114" manufactured by Ciba Japan Co., Ltd.; "AO-60" manufactured by ADEKA Corporation, and the like.

[0106] (F) From the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile components in the resin composition are 100% by mass, the content of the antioxidant is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, and preferably 3% by mass or less, more preferably 2% by mass or less, still more preferably 1% by mass or less.

[0107] <(G) Curing accelerator> The resin composition may contain (G) a curing accelerator as an optional component. Examples of (G) the curing accelerator include, for example, phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, and the like. Amine-based curing accelerators and imidazole-based curing accelerators are preferred, and amine-based curing accelerators are more preferred. The curing accelerator may be used alone or in combination of two or more.

[0108] Examples of the phosphorus-based curing accelerator include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like, with triphenylphosphine and tetrabutylphosphonium decanoate being preferred.

[0109] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred.

[0110] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2, 4-Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-furan Examples of the imidazole compounds include imidazole compounds such as 2-ethyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds and epoxy resins. Of these, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferred.

[0111] As the imidazole-based curing accelerator, a commercially available product may be used, for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0112] Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, and 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene. Examples of such biguanide include o-[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide. Of these, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are preferred.

[0113] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0114] From the viewpoint of significantly obtaining the effects of the present invention, the content of the (G) curing accelerator is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, and even more preferably 0.05% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass, and is preferably 3% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less.

[0115] <(H) Other Additives> The resin composition may further contain other additives as optional components in addition to the above-mentioned components. Examples of such additives include thermoplastic resins (excluding those corresponding to component (C)); flame retardants; organic fillers (excluding those corresponding to component (C)); organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; thickeners; defoamers; leveling agents; adhesion promoters; colorants; and pigments. These additives may be used alone or in combination of two or more at any ratio.

[0116] <Method of producing resin composition> The resin composition of the present invention can be produced, for example, by a method of stirring the blended components using a stirring device such as a rotary mixer. Before producing the resin composition, epichlorohydrin, which is the main component of the impurities in the epoxy resin (A), and chlorine atom-containing compounds derived from epichlorohydrin may be removed as necessary. In addition, impurities contained in the components (B) to (H) may also be removed as necessary.

[0117] <Characteristics and properties of resin composition> When the amount of chloride ions contained in the cured product of the resin composition heat-cured at 170°C for 4 hours is C1 and the amount of chloride ions contained in the cured product of the resin composition heat-cured at 200°C for 2 hours is C2, C2 / C1 is more than 0.75, preferably 0.6 or more, more preferably 0.7 or more, or 0.8 or more. The upper limit is less than 1, preferably 0.95 or less, more preferably 0.9 or less. By adjusting C2 / C1 within this range, the insulation reliability under high temperature and high humidity can be improved. The amount of chloride ions was measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007), and C2 / C1 can be measured by the method described in the examples described below.

[0118] The amount C1 of chloride ions contained in the cured product of the resin composition thermally cured at 170°C for 4 hours is preferably 230 ppm or less, more preferably 220 ppm or less, and even more preferably 210 ppm or less, and is preferably 100 ppm or more, more preferably 120 ppm or more, and even more preferably 130 ppm or more, from the viewpoint of obtaining the effects of the present invention significantly. The amount C1 of chloride ions can be measured by the method described in the examples below. Unless otherwise specified, the amount C1 of chloride ions is the amount of chloride ions measured at the center of the cured product of the resin composition when a sheet larger than 30 mm x 30 mm is formed from the cured product of the resin composition, and the center of the cured product of the resin composition refers to an area of ​​30 mm x 30 mm from the center point.

[0119] The standard deviation of the amount C1 of chloride ions is preferably 10 ppm or less, more preferably 9 ppm or less, and further preferably 8 ppm or less, from the viewpoint of obtaining the effects of the present invention remarkably. There is no particular restriction on the lower limit, but it can usually be 0.1 ppm or more.

[0120] The amount C2 of chloride ions contained in the cured product of the resin composition thermally cured at 200°C for 2 hours is preferably 200 ppm or less, more preferably 180 ppm or less, and even more preferably 170 ppm or less, and is preferably 100 ppm or more, more preferably 120 ppm or more, and even more preferably 130 ppm or more, from the viewpoint of obtaining the effects of the present invention significantly. The amount C2 of chloride ions can be measured by the method described in the examples below. Unless otherwise specified, the amount C2 of chloride ions is the amount of chloride ions measured at the center of the cured product of the resin composition when a sheet larger than 30 mm x 30 mm is formed from the cured product of the resin composition, and the center of the cured product of the resin composition refers to an area of ​​30 mm x 30 mm from the center point.

[0121] The standard deviation of the amount C2 of chloride ions is preferably 10 ppm or less, more preferably 8 ppm or less, and even more preferably 7 ppm or less, from the viewpoint of obtaining the effects of the present invention remarkably. There is no particular restriction on the lower limit, but it can usually be 0.1 ppm or more.

[0122] The amount of chloride ions contained in a 5 mm x 5 mm area from each of the four corners of a cured product of a resin composition thermally cured at 170°C for 4 hours is preferably 210 ppm or less, more preferably 190 ppm or less, and even more preferably 170 ppm or less. There is no particular lower limit, but it may be 0 ppm, 0 ppm or more, or 0.1 ppm or more. The amount of chloride ions can be measured by the method described in the Examples below.

[0123] The standard deviation of the amount of chloride ions contained in a 5 mm x 5 mm area from each of the four corners of a cured product of a resin composition thermally cured at 170°C for 4 hours is preferably 10 ppm or less, more preferably 8 ppm or less, and even more preferably 7 ppm or less, from the viewpoint of obtaining a remarkable effect of the present invention. There is no particular lower limit, but it can usually be 0.1 ppm or more.

[0124] The amount of chloride ions contained in a 5 mm x 5 mm area from each of the four corners of a cured product of a resin composition thermally cured at 200°C for 2 hours is preferably 200 ppm or less, more preferably 180 ppm or less, and even more preferably 170 ppm or less, and is preferably 100 ppm or more, more preferably 120 ppm or more, and even more preferably 130 ppm or more. The amount of chloride ions can be measured by the method described in the Examples below.

[0125] In a cured product of a resin composition thermally cured for 2 hours at 200° C., the standard deviation of the amount of chloride ions contained in an area of ​​5 mm×5 mm from each of the four corners of the cured product is preferably 10 ppm or less, more preferably 8 ppm or less, and even more preferably 7 ppm or less, from the viewpoint of obtaining a remarkable effect of the present invention. There is no particular lower limit, but it may usually be 0.1 ppm or more.

[0126] The difference (absolute value) between the standard deviation of the amount of chloride ions C1 and the standard deviation of the amount of chloride ions measured at the end of the cured product of the resin composition thermally cured at 170°C for 4 hours is preferably 10 ppm or less, more preferably 7 ppm or less, and even more preferably 3 ppm or less. There is no particular restriction on the lower limit, but it may be 0 ppm, 0 ppm or more, or 0.1 ppm or more. Since the difference in standard deviation is 10 ppm or less, deterioration of insulation reliability in a high temperature and high humidity environment is suppressed even if the curing temperature varies.

[0127] The difference (absolute value) between the standard deviation of the amount of chloride ions C2 and the standard deviation of the amount of chloride ions measured at the end of the cured product of the resin composition thermally cured at 200°C for 2 hours is preferably 10 ppm or less, more preferably 7 ppm or less, and even more preferably 3 ppm or less. There is no particular lower limit, but it can usually be 0.1 ppm or more. Since the difference between the amount of chloride ions C2 and the standard deviation is 10 ppm or less, deterioration of insulation reliability in a high temperature and high humidity environment is suppressed even if the curing temperature varies.

[0128] In measuring the amount of chloride ions, it is preferable that the degree of cure of the resin composition heat-cured at 170°C for 4 hours and the degree of cure of the resin composition heat-cured at 200°C for 2 hours are the same. The degree of cure of the resin composition is preferably 80% or more, more preferably 85% or more, and even more preferably 90% or more. The upper limit is not particularly limited, but may be 100% or less, 95% or less, etc. The degree of cure can be measured, for example, using a differential scanning calorimeter.

[0129] Usually, when a resin composition is cured, the resins contained in the resin composition react with each other to form a crosslinked structure. At this time, by appropriately adjusting the degree of crosslinking, the chloride ions in the resin composition and its cured product can be smoothly discharged through the gaps between the molecules that form the crosslinked network. Therefore, by adjusting the composition of the resin composition so as to promote the discharge of such chloride ions, the amounts C1 and C2 of chloride ions that satisfy the above-mentioned requirements can be obtained. Specifically, the amounts C1 and C2 of chloride ions that satisfy the above-mentioned requirements can be obtained by adjusting the composition of the resin composition so that the crosslinked network in the cured product can be coarsened so that chloride ions can be smoothly discharged at a relatively low temperature of 170°C to the same extent as at a relatively high temperature of 200°C.

[0130] In addition, when the curing temperature varies when the resin composition is cured due to the increase in size of the inner layer circuit board, the elastic modulus of the insulating layer also varies, and a portion with a locally high curing temperature may occur. The elastic modulus of the insulating layer at the portion with a high curing temperature becomes excessive, and stress is applied to that portion, which may cause cracks. Furthermore, the occurrence of cracks may cause deterioration of insulation reliability. As a result of intensive research by the present inventors, by adjusting the (A) component and the (B) component, the elastic modulus is suppressed from increasing even when the curing temperature is high. As a result, it has been found that even in a large-sized insulating layer, the variation in the elastic modulus is suppressed, and therefore the occurrence of a portion with an excessive elastic modulus can be suppressed, thereby suppressing the occurrence of cracks and improving insulation reliability.

[0131] When the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 170°C for 4 hours is D1, and the elastic modulus at 25°C of the cured product of the resin composition heat-cured at 230°C for 4 hours is D2, D2 / D1 is less than 1.3, preferably 1.25 or less, more preferably 1.21 or less, and even more preferably 1.2 or less. There is no particular lower limit, but it may be preferably 0 or more, more preferably 0.1 or more. D2 / D1 can be measured by the method described in the examples below.

[0132] From the viewpoint of obtaining the effects of the present invention significantly, the elastic modulus D1 at 25° C. of the cured product of the resin composition thermally cured at 170° C. for 4 hours is preferably 1 GPa or more, more preferably 3 GPa or more, and even more preferably 5 GPa or more, and is preferably 25 GPa or less, more preferably 20 GPa or less, and even more preferably 15 GPa or less. The elastic modulus D1 can be measured by the method described in the examples described later.

[0133] From the viewpoint of obtaining the effects of the present invention significantly, the elastic modulus D2 at 25° C. of the cured product of the resin composition thermally cured at 230° C. for 4 hours is preferably 1 GPa or more, more preferably 3 GPa or more, and even more preferably 5 GPa or more, and is preferably 25 GPa or less, more preferably 20 GPa or less, and even more preferably 15 GPa or less. The elastic modulus D2 can be measured by the method described in the examples below.

[0134] For example, a cured product having elastic moduli D1 and D2 that satisfy the above-mentioned requirements can be obtained by adjusting the composition of the resin composition. In this case, from the viewpoint of keeping the ratio D2 / D1 within the above-mentioned range, it is preferable to adjust the composition of the resin composition so that the crosslinking reaction can proceed to the same extent even at a relatively low temperature of 170° C. as at a relatively high temperature of 200° C. In addition, from the viewpoint of keeping the elastic moduli D1 and D2 within the above-mentioned ranges, it is preferable to adjust the composition of the resin composition so that the crosslinking network can be coarse even if the reaction in the resin composition has progressed sufficiently.

[0135] The area of ​​the enlarged circuit board is preferably 10,000 mm 2 More preferably, it is 100,000 mm 2 More preferably, 706,500 mm 2 There is no particular upper limit, but it is preferably 1,000,000 mm 2 Less than or equal to 800,000 mm, more preferably 2 Less than 640,000 mm, more preferably 2 It could be the following etc.

[0136] The resin composition is thermally cured at 200°C for 4 hours to produce a cured product that exhibits excellent insulation reliability even under high temperature and high humidity conditions. Therefore, the cured product provides an insulating layer with excellent insulation reliability. When the thickness of the insulating layer is 50 μm, the insulation resistance is preferably 1×10 9 Ω or more, preferably 5×10 9 Ω or more, more preferably 1×10 10 Ω or more, 1×10 11 Ω or more. The upper limit is not particularly limited, but is preferably 1×10 15 The insulation reliability can be evaluated by measurement according to the method described in the examples below.

[0137] A cured product obtained by thermally curing a resin composition at 200°C for 4 hours usually exhibits the property of excellent Vickers hardness. Therefore, the cured product provides an insulating layer excellent in Vickers hardness. The Vickers hardness is preferably 20Hv or more, more preferably 30Hv or more, and even more preferably 40Hv or more. There is no particular upper limit, but it is preferably 200Hv or less, more preferably 190Hv or less, and even more preferably 180Hv or less. The Vickers hardness can be evaluated according to the method described in the examples below.

[0138] Since the resin composition has the above-mentioned characteristics, it is suitable as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). The resin composition is suitable as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board). In addition, the resin composition is suitable as a resin composition for forming an insulating layer (resin composition for forming an insulating layer for forming a conductor layer) for forming a conductor layer (including a rewiring layer) formed on the insulating layer. Furthermore, the resin composition is suitable as a resin composition for forming an insulating layer of a semiconductor chip package (resin composition for forming an insulating layer of a semiconductor chip package), and is suitable as a resin composition for forming an encapsulation layer of a semiconductor chip package (resin composition for forming an encapsulation layer of a semiconductor chip package) and a resin composition for forming a rewiring formation layer of a semiconductor chip package (resin composition for forming a rewiring formation layer of a semiconductor chip package).

[0139] In addition, since the resin composition has the above-mentioned properties, it is useful in dry process applications that are useful for manufacturing large-sized and finely wired circuit boards, etc. For example, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board formed by a dry process (a resin composition for forming an insulating layer of a multilayer printed wiring board formed by a dry process), a resin composition for forming an insulating layer of a printed wiring board including a metal pillar (a resin composition for forming an insulating layer of a multilayer printed wiring board including a metal pillar), a resin composition for forming an insulating layer to be desmeared by a dry desmear treatment (a resin composition for forming an insulating layer to be roughened by a dry desmear treatment), etc.

[0140] [Resin sheet] The resin sheet of the present invention includes a support and a resin composition layer formed from the resin composition of the present invention provided on the support.

[0141] The thickness of the resin composition layer is preferably 100 μm or less, more preferably 70 μm or less, and even more preferably 55 μm or less, from the viewpoint of making the printed wiring board thinner and being able to provide a cured product with excellent insulation even if the cured product of the resin composition is a thin film. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more, 10 μm or more, etc.

[0142] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0143] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0144] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0145] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0146] In addition, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the support with a release layer may be, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The support with a release layer may be a commercially available product, for example, "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by Unitika Limited, which are PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0147] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the total thickness of the support with a release layer is in the above range.

[0148] In one embodiment, the resin sheet may further include other layers as necessary. Examples of such other layers include a protective film equivalent to the support provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dirt and the like to the surface of the resin composition layer and scratches can be suppressed.

[0149] The resin sheet can be produced, for example, by preparing a resin varnish by dissolving a resin composition in an organic solvent, applying this resin varnish onto a support using a die coater or the like, and then drying the same to form a resin composition layer.

[0150] Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. The organic solvents may be used alone or in combination of two or more.

[0151] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is performed so that the content of organic solvent in the resin composition layer becomes 10 mass % or less, preferably 5 mass % or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30 mass % to 60 mass % of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0152] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0153] [Printed wiring board and its manufacturing method] The printed wiring board according to one embodiment of the present invention includes an insulating layer formed of a cured product obtained by curing the above-mentioned resin composition. Since the printed wiring board of the present invention includes an insulating layer formed of a cured product obtained by curing the resin composition of the present invention, even if the printed wiring board is large-sized and finely wired, it has excellent insulation reliability in a high-temperature and high-humidity environment. For this reason, the printed wiring board of the present invention is preferably formed by a dry process useful for manufacturing a large-sized and finely wired printed wiring board.

[0154] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet, by a method including the following steps (I) and (III). (I) A step of forming an insulating layer containing a cured product of a resin composition on an inner layer circuit board. (III) A process of performing a dry desmear process on the surface of the insulating layer If necessary, the following step (II) may be included between step (I) and step (III). (II) Drilling holes in the insulating layer

[0155] In step (I), an insulating layer is usually formed on the main surface of the inner layer circuit board. The main surface of the inner layer circuit board refers to the surface of the inner layer circuit board on which the insulating layer is provided. The area of ​​the inner layer circuit board is preferably 900 mm 2 More preferably, it is 1000 mm 2 More preferably, 1500 mm 2 That's all. There is no upper limit, but it is recommended to use 5000mm. 2 It could be the following etc.

[0156] The step (I) may include a step (I-1) of preparing an inner layer circuit board. The inner layer circuit board usually includes a support substrate and a metal layer provided on the surface of the support substrate. The metal layer is exposed on the main surface of the inner layer circuit board. The inner layer circuit board may include a metal pillar as an electrode.

[0157] Examples of materials for the support substrate include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, etc. Examples of materials for the metal layer include copper foil, copper foil with a carrier, and materials for the conductor layer described below, with copper foil being preferred.

[0158] The step (I) may further include the step (I-2) of preparing a resin sheet. The resin sheet is as described above.

[0159] In step (I), for example, a resin composition layer of a resin sheet is laminated on a main surface of an inner layer circuit board, and the resin composition layer is thermally cured to form an insulating layer.

[0160] The lamination of the inner layer circuit board and the resin sheet can be carried out, for example, by thermocompression bonding the resin sheet to the inner layer circuit board from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer circuit board (hereinafter also referred to as the "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression bonding member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the inner layer circuit board.

[0161] The lamination of the inner layer circuit board and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the heat-pressure bonding temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the heat-pressure bonding pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa, and the heat-pressure bonding time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably performed under reduced pressure conditions of 26.7hPa or less.

[0162] The lamination can be performed by a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch type vacuum pressure laminator.

[0163] After lamination, the laminated resin sheet may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The smoothing treatment may be performed using a commercially available laminator. The lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0164] The support may be removed after laminating the resin sheet and before thermal curing, or may be removed after step (I).

[0165] After laminating the resin sheet on the inner layer circuit board, the resin composition layer is heat cured to form an insulating layer. The heat curing conditions for the resin composition layer are not particularly limited, and conditions that are usually adopted when forming an insulating layer for a printed wiring board may be used.

[0166] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, etc., but the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0167] Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50° C. or more and less than 120° C. (preferably 60° C. or more and 115° C. or less, more preferably 70° C. or more and 110° C. or less) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes).

[0168] The thickness of the insulating layer is preferably 100 μm or less, more preferably 50 μm or less, further preferably 40 μm or less, 30 μm or less, or 20 μm or less, and is preferably 1 μm or more, more preferably 5 μm or more.

[0169] Instead of forming the insulating layer using a resin sheet, the insulating layer may be formed by directly applying a resin composition onto the main surface of the inner layer circuit board. The conditions for forming the insulating layer are the same as those for forming the insulating layer using a resin sheet. The resin composition to be applied is as described above.

[0170] Step (II) is a step of drilling holes in the insulating layer, which allows holes such as via holes and through holes to be formed in the insulating layer. Step (II) may be performed using, for example, a drill, a laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined depending on the design of the printed wiring board.

[0171] The shape of the hole is not particularly limited, but is generally circular (approximately circular). The top diameter of the via hole is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 20 μm or less, and is preferably 3 μm or more, preferably 10 μm or more, and more preferably 15 μm or more. Here, the top diameter of the via hole refers to the diameter of the opening of the via hole on the surface of the insulating layer.

[0172] Step (III) is a step of performing a dry desmear treatment on the insulating layer. Usually, in this step (III), smears generated during the formation of via holes are also removed.

[0173] The dry desmear treatment may be, for example, a desmear treatment using plasma. The desmear treatment using plasma may be performed using a commercially available plasma desmear treatment device. Suitable examples of the commercially available plasma desmear treatment device include a microwave plasma device manufactured by Nissin Co., Ltd. and an atmospheric pressure plasma etching device manufactured by Sekisui Chemical Co., Ltd.

[0174] In addition, the dry desmear treatment may be a dry sandblasting treatment in which an abrasive is sprayed from a nozzle to polish the treatment target. The dry sandblasting treatment may be performed using a commercially available dry sandblasting treatment device. When a water-soluble abrasive is used as the abrasive, washing with water after the dry sandblasting treatment can effectively remove the smear without the abrasive remaining inside the via hole.

[0175] In one embodiment, the arithmetic mean roughness Ra of the insulating layer surface after step (III) is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc. The root mean square roughness (Rq) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0176] The method for producing a printed wiring board may further include a step (IV) of forming a conductor layer. When the support is removed after step (II), the removal of the support may be performed between step (I) and step (II), between step (II) and step (III), or between step (III) and step (IV). In addition, the formation of the insulating layer and the conductor layer in steps (I) to (IV) may be repeated as necessary to form a multilayer wiring board.

[0177] Step (IV) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy and copper-titanium alloy). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, and the like, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0178] The conductor layer may be a single-layer structure, or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

[0179] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, and preferably 5 μm to 30 μm.

[0180] The conductor layer is preferably formed by plating. For example, the surface of the insulating layer can be plated by a semi-additive method, a full-additive method, or the like to form a conductor layer having a desired wiring pattern. From the viewpoint of ease of production, it is preferable to form the conductor layer by the semi-additive method. An example of forming the conductor layer by the semi-additive method will be described below.

[0181] A plating seed layer is formed on the surface of the insulating layer by electroless plating. Then, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to a desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[0182] <Semiconductor chip package and method of manufacturing same> The semiconductor chip package of the present invention includes a semiconductor chip and a cured product of the resin composition of the present invention on the semiconductor chip. In such a semiconductor chip package, the cured product of the resin composition usually functions as a rewiring formation layer. Examples of the semiconductor chip package include a fan-out type WLP and a fan-out type PLP.

[0183] The method for producing a semiconductor chip package of the present invention may include, for example, a step of forming a layer containing a cured product of the resin composition of the present invention on a semiconductor chip. The layer containing the cured product of the present invention is either a sealing layer or a rewiring formation layer, and the rewiring formation layer is preferred.

[0184] Specifically, the method for manufacturing such a semiconductor chip package includes: (A) a step of laminating a temporary fixing film on a substrate; (B) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (C) forming an encapsulation layer on the semiconductor chip; (D) peeling the substrate and the temporary fixing film from the semiconductor chip; (E) a step of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; (F) forming a rewiring layer as a conductor layer on the rewiring formation layer; and (G) forming a solder resist layer on the rewiring layer; The method for manufacturing the semiconductor chip package further comprises: (H) A process of dicing and separating multiple semiconductor chip packages into individual semiconductor chip packages. may also include

[0185] Step (A) is a step of laminating a temporary fixing film (release film) on a substrate. This lamination can be performed, for example, by bonding the temporary fixing film to the substrate from the temporary fixing film side under heat and pressure, thereby laminating the temporary fixing film to the substrate. Examples of a member for heat-pressing the temporary fixing film to the substrate (hereinafter, sometimes referred to as a "heat-pressing member") include a heated metal plate (such as a SUS plate) or a metal roll (such as a SUS roll). Note that, rather than directly pressing the temporary fixing film with the heat-pressing member, it is preferable to press it via an elastic material such as heat-resistant rubber so that the temporary fixing film can sufficiently follow the surface irregularities of the substrate.

[0186] The lamination of the substrate and the temporary fixing film may be carried out, for example, by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C. The thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa. The thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of a pressure of 13hPa or less.

[0187] After lamination, the laminated temporary fixing film may be smoothed under normal pressure (atmospheric pressure), for example, by pressing the temporary fixing film side with a thermocompression member. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. Note that lamination and smoothing treatment may be performed successively using a vacuum laminator.

[0188] Examples of the substrate include silicon wafers; glass wafers; glass substrates; metal substrates such as copper, titanium, stainless steel, and cold-rolled steel (SPCC); substrates such as FR-4 substrates in which glass fibers are impregnated with epoxy resin or the like and then heat-cured; and substrates made of bismaleimide triazine resins such as BT resin.

[0189] The temporary fixing film may be made of any material that can be peeled off from the semiconductor chip and can temporarily fix the semiconductor chip. Commercially available products include "Riva Alpha" manufactured by Nitto Denko Corporation.

[0190] Step (B) is a step of temporarily fixing the semiconductor chip on the temporary fixing film. The temporary fixing of the semiconductor chip can be performed using, for example, a device such as a flip chip bonder or a die bonder. The layout and number of the semiconductor chips can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor chip packages to be produced, etc. For example, the semiconductor chips may be temporarily fixed by arranging them in a matrix shape of multiple rows and multiple columns.

[0191] Step (C) is a step of forming an encapsulating layer on the semiconductor chip. Any material having insulating properties can be used for the encapsulating layer, and a cured product of the resin composition of the present invention may be used. The encapsulating layer is usually formed by a method including a step of forming a resin composition layer on the semiconductor chip and a step of thermally curing the resin composition layer to form the encapsulating layer.

[0192] Taking advantage of the excellent compression moldability of the resin composition, the resin composition layer is preferably formed by a compression molding method. In the compression molding method, the semiconductor chip and the resin composition are usually placed in a mold, and pressure and, if necessary, heat are applied to the resin composition in the mold to form a resin composition layer covering the semiconductor chip.

[0193] A specific operation of the compression molding method can be, for example, as follows. An upper mold and a lower mold are prepared as molds for compression molding. A resin composition is applied to the semiconductor chip temporarily fixed on the temporary fixing film as described above. The semiconductor chip to which the resin composition is applied is attached to the lower mold together with the substrate and the temporary fixing film. Then, the upper mold and the lower mold are clamped, and heat and pressure are applied to the resin composition to perform compression molding.

[0194] In addition, the specific operation of the compression molding method may be, for example, as follows. An upper mold and a lower mold are prepared as molds for compression molding. A resin composition is placed on the lower mold. Also, a semiconductor chip is attached to the upper mold together with a substrate and a temporary fixing film. Thereafter, the upper mold and the lower mold are clamped so that the resin composition placed on the lower mold contacts the semiconductor chip attached to the upper mold, and heat and pressure are applied to perform compression molding.

[0195] The molding conditions vary depending on the composition of the resin composition, and appropriate conditions can be adopted so that good sealing is achieved. For example, the temperature of the mold during molding is preferably a temperature at which the resin composition can exhibit excellent compression moldability, and is preferably 80°C or higher, more preferably 100°C or higher, particularly preferably 120°C or higher, and preferably 200°C or lower, more preferably 170°C or lower, and particularly preferably 150°C or lower. The pressure applied during molding is preferably 1 MPa or higher, more preferably 3 MPa or higher, particularly preferably 5 MPa or higher, preferably 50 MPa or lower, more preferably 30 MPa or lower, and particularly preferably 20 MPa or lower. The cure time is preferably 1 minute or more, more preferably 2 minutes or more, particularly preferably 5 minutes or more, and preferably 60 minutes or less, more preferably 30 minutes or less, and particularly preferably 20 minutes or less. Usually, the mold is removed after the formation of the resin composition layer. The mold may be removed before or after the resin composition layer is thermally cured.

[0196] After forming the resin composition layer on the semiconductor chip, the resin composition layer is thermally cured to obtain an encapsulation layer that covers the semiconductor chip, thereby encapsulating the semiconductor chip with the cured resin composition.

[0197] The heat curing conditions for the resin composition layer are the same as the heat curing conditions in step (I) in the method for producing a printed wiring board.

[0198] Step (D) is a step of peeling off the substrate and the temporary fixing film from the semiconductor chip. It is desirable to adopt an appropriate peeling method according to the material of the temporary fixing film. For example, the peeling method may be a method of heating, foaming or expanding the temporary fixing film to peel it off. In addition, for example, the peeling method may be a method of irradiating the temporary fixing film with ultraviolet light through the substrate to reduce the adhesive strength of the temporary fixing film to peel it off.

[0199] In the method of peeling off the temporary fixing film by heating, foaming or expanding it, the heating conditions are usually 100° C. to 250° C. for 1 second to 90 seconds or 5 minutes to 15 minutes. In the method of peeling off the temporary fixing film by reducing the adhesive strength of the temporary fixing film by irradiating it with ultraviolet light, the irradiation amount of ultraviolet light is usually 10 mJ / cm 2 ~1000mJ / cm 2 It is.

[0200] Step (E) is a step of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off.

[0201] The material for the rewiring formation layer can be any material having insulating properties, and the resin composition of the present invention may be used. However, from the viewpoint of obtaining the effects of the present invention more significantly, it is preferable to use the resin composition of the present invention.

[0202] After forming the rewiring formation layer, via holes may be formed in the rewiring formation layer to provide interlayer connection between the semiconductor chip and the rewiring layer.

[0203] The method for forming the via holes is the same as that in step (II) in the method for producing a printed wiring board.

[0204] Step (F) is a step of forming a rewiring layer as a conductor layer on the rewiring formation layer. The formation of the rewiring layer is the same as step (IV) in the method for producing a printed wiring board.

[0205] The conductor layer may be patterned. In this case, the line (circuit width) / space (width between circuits) ratio of the conductor layer is not particularly limited, but is preferably 20 / 20 μm or less (i.e., pitch is 40 μm or less), more preferably 10 / 10 μm or less, even more preferably 5 / 5 μm or less, even more preferably 1 / 1 μm or less, and particularly preferably 0.5 / 0.5 μm or more. The pitch does not need to be the same throughout the conductor layer. The minimum pitch of the conductor layer may be, for example, 40 μm or less, 36 μm or less, or 30 μm or less.

[0206] Step (G) is a step of forming a solder resist layer on the rewiring layer. Any material having insulating properties can be used as the material of the solder resist layer. Among them, photosensitive resins and thermosetting resins are preferred from the viewpoint of ease of manufacturing the semiconductor chip package. The resin composition of the present invention may be used as the thermosetting resin.

[0207] In step (G), bumping processing may be performed to form bumps, if necessary. The bumping processing can be performed by a method such as solder balls or solder plating. In addition, the formation of via holes in the bumping processing can be performed in the same manner as in step (E).

[0208] The method for manufacturing a semiconductor chip package may include a step (H) in addition to the steps (A) to (G). The step (H) is a step of dicing a plurality of semiconductor chip packages into individual semiconductor chip packages to separate them. The method for dicing the semiconductor chip packages into individual semiconductor chip packages is not particularly limited.

[0209] Another embodiment of a semiconductor chip package includes the above-mentioned printed wiring board and a semiconductor chip mounted on the printed wiring board. The semiconductor chip package can be manufactured by bonding the semiconductor chip to the printed wiring board.

[0210] The bonding conditions between the printed wiring board and the semiconductor chip may be any conditions that allow conductive connection between the terminal electrodes of the semiconductor chip and the circuit wiring of the printed wiring board. For example, the conditions used in flip-chip mounting of the semiconductor chip may be used. Also, for example, the semiconductor chip and the printed wiring board may be bonded via an insulating adhesive.

[0211] An example of a bonding method is a method in which a semiconductor chip is pressure-bonded to a printed wiring board. Pressure-bonding conditions are a pressure-bonding temperature usually in the range of 120°C to 240°C (preferably in the range of 130°C to 200°C, more preferably in the range of 140°C to 180°C), and a pressure-bonding time usually in the range of 1 second to 60 seconds (preferably in the range of 5 seconds to 30 seconds).

[0212] Another example of the bonding method is a method of bonding a semiconductor chip to a printed wiring board by reflow. The reflow conditions may be in the range of 120°C to 300°C.

[0213] After the semiconductor chip is bonded to the printed wiring board, the semiconductor chip may be filled with a molded underfill material, which may be the resin composition of the present invention.

[0214] [Semiconductor Devices] A semiconductor device according to an embodiment of the present invention includes the above-mentioned printed wiring board or semiconductor chip package, and can be manufactured using the above-mentioned printed wiring board or semiconductor chip package.

[0215] Examples of the semiconductor device include various semiconductor devices used in electric appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). EXAMPLES

[0216] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to the following examples. In the following description, the amounts of "ppm", "parts" and "%" are based on mass unless otherwise specified. Furthermore, the operations described below were performed in an environment of normal temperature and pressure unless otherwise specified.

[0217] The inorganic fillers 1 and 2 used in the examples and comparative examples are as follows. Inorganic filler 1: average particle size 0.1μm, specific surface area 50m 2 / g, spherical silica surface-treated with KBM573 (Shin-Etsu Chemical Co., Ltd.). Inorganic filler 2: average particle size 0.5μm, specific surface area 6.0m 2 / g, spherical silica surface-treated with KBM573 (Shin-Etsu Chemical Co., Ltd.).

[0218] <Synthesis Example 1: Synthesis of Polymer Resin A> In a reaction vessel, 69 g of G-3000 (bifunctional hydroxyl group-terminated polybutadiene, number average molecular weight = 5047 (GPC method), hydroxyl group equivalent = 1800 g / eq, solid content 100 mass%: manufactured by Nippon Soda Co., Ltd.), 40 g of IPZOL 150 (aromatic hydrocarbon-based mixed solvent: manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin laurate were mixed and dissolved uniformly. When the mixture became uniform, the temperature was raised to 50°C, and 8 g of isophorone diisocyanate (manufactured by Evonik Degussa Japan Co., Ltd., IPDI, isocyanate group equivalent = 113 g / eq) was added while further stirring, and the reaction was carried out for about 3 hours. Next, the reaction mixture was cooled to room temperature, and then 23 g of cresol novolak resin (KA-1160, manufactured by DIC Corporation, hydroxyl group equivalent = 117 g / eq) and 60 g of ethyl diglycol acetate (manufactured by Daicel Corporation) were added thereto, and the mixture was heated to 80°C with stirring and reacted for about 4 hours. -1 The disappearance of the NCO peak was confirmed. The disappearance of the NCO peak was regarded as the end point of the reaction, and the reaction mixture was cooled to room temperature and filtered through a 100 mesh filter cloth to obtain a polymer resin A (non-volatile content 50% by mass) having a butadiene structure and a phenolic hydroxyl group. The number average molecular weight was 5,500.

[0219] <Synthesis Example 2: Synthesis of Polymer Resin B> In a reaction vessel, 80 g of polycarbonate diol (number average molecular weight: about 1,000, hydroxyl equivalent: 500 g / eq, non-volatile content: 100%, "C-1015N" manufactured by Kuraray Co., Ltd.) and 0.01 g of dibutyltin dilaurate were uniformly dissolved in 37.6 g of diethylene glycol monoethyl ether acetate ("Ethyl diglycol acetate" manufactured by Daicel Corporation). The mixture was then heated to 50°C, and 27.8 g of toluene-2,4-diisocyanate (isocyanate equivalent: 87.08) was added while stirring, and the reaction was carried out for about 3 hours. After cooling the reaction mixture to room temperature, 14.3 g of benzophenonetetracarboxylic dianhydride (acid anhydride equivalent: 161.1 g / eq), 0.12 g of triethylenediamine, and 84.0 g of diethylene glycol monoethyl ether acetate (Daicel Corporation's "Ethyl Diglycol Acetate") were added thereto, and the mixture was heated to 130°C with stirring and reacted for about 4 hours. -1 The disappearance of the NCO peak was confirmed. The disappearance of the NCO peak was regarded as the end point of the reaction, and the reaction mixture was cooled to room temperature and then filtered through a filter cloth with a mesh size of 100 μm to obtain a polymer resin B (non-volatile content 50 mass%) having an imide structure, a urethane structure, and a polycarbonate structure. The number average molecular weight was 8,500.

[0220] <Synthesis Example 3: Synthesis of Polymer Resin C> In a 500 mL separable flask equipped with a water content receiver connected to a reflux condenser, a nitrogen inlet tube, and a stirrer, 25 parts by mass of 6FDA (4,4'-(hexafluoroisopropylidene)diphthalic anhydride), 68.1 parts by mass of γ-butyrolactone, 7 parts by mass of toluene, 58.4 parts by mass of diaminosiloxane X-22-9409 (manufactured by Shin-Etsu Chemical Co., Ltd.) (amine equivalent 665), and 1.8 parts by mass of 1,5-diaminonaphthalene (hereinafter referred to as NDA) were added, and the reaction was carried out by stirring at 45°C for 2 hours under a nitrogen stream. Next, the reaction solution was heated and, while maintaining the temperature at about 160°C, condensed water was azeotropically removed together with toluene under a nitrogen stream. After confirming that a predetermined amount of water had accumulated in the water content receiver and that no water was flowing out, the temperature was further raised and the mixture was stirred at 200°C for 1 hour. The mixture was then cooled to complete the process, and a varnish containing 55 mass % of polyimide resin (polymer resin C) was prepared.

[0221] <Example 1> Flexible epoxy resin (EP-4040L, ADEKA, epoxy equivalent 310g / eq.) 2 parts, phenolic hardener (LA-3018-50P, DIC, active group equivalent approx. 151g / eq., 2-methoxypropanol solution with 50% solids) 6 parts, bisphenol type epoxy resin (ZX1059, Nippon Steel & Sumikin Chemical, 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169g / eq.) 3 parts, naphthalene type epoxy resin (HP-4032D, DIC, 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent approx. 145g / eq.) 3 parts, inorganic filler 2 90 parts, active ester curing agent (DIC Corporation, "HPC8150-62T", toluene solution with 62% solids) 4.8 parts, carbodiimide curing agent (Nisshinbo Chemical Co., Ltd., "V-03", active group equivalent of about 216, toluene solution with 50% solids) 2 parts, polymer resin A 20 parts of cyclohexanediaminetetraacetate, 3.3 parts of a maleimide compound (liquid bismaleimide "SLK-6895-M90" manufactured by Shin-Etsu Chemical Co., Ltd., MEK solution with a solid content of 90% by mass, maleimide group equivalent of 345 g / eq.), 0.05 parts of a curing accelerator ("1B2PZ" manufactured by Shikoku Chemical Industry Co., Ltd., 1-benzyl-2-phenylimidazole), 0.05 parts of an imidazole curing accelerator ("C11Z-A" manufactured by Shikoku Chemical Industry Co., Ltd.), 0.1 parts of a hindered phenol compound ("AO-60" manufactured by ADEKA Corporation), 7 parts of cyclohexanone, and 6 parts of methyl ethyl ketone were uniformly dispersed using a mixer to obtain a resin varnish.

[0222] Next, the resin varnish was uniformly applied onto a polyethylene terephthalate film ("Lumirror T6AM" manufactured by Toray Industries, Inc., thickness 38 μm) as a support so that the thickness of the resin composition layer after drying would be 50 μm, and dried at 80°C to 120°C (average 100°C) for 6 minutes to form a resin composition layer. A protective film having a rough surface (polypropylene film, "Alphan MA-430" manufactured by Oji F-Tex Co., Ltd., thickness 20 μm) was prepared, and the rough surface of the protective film was attached to the resin composition layer to obtain a resin sheet having a layer structure of support / resin composition layer / protective film.

[0223] <Example 2> In Example 1, 90 parts of Inorganic Filler 2 was changed to 52 parts of Inorganic Filler 1. A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above-mentioned points.

[0224] <Example 3> In Example 1, 1) 2 parts of flexible epoxy resin ("EP-4040L", manufactured by ADEKA, epoxy equivalent weight 310g / eq.) was replaced with 2 parts of dicyclopentadiene type epoxy resin ("HP7200", manufactured by DIC, epoxy equivalent weight 258g / eq.). 2) 4.8 parts of an active ester curing agent (DIC Corporation, "HPC-8150-62T", a toluene solution with a solid content of 62%) was replaced with 4.6 parts of an active ester resin (DIC Corporation, "HPC-8000L-65TM", an active ester resin containing a dicyclopentadiene-type diphenol structure, a 1:1 solution of toluene:MEK with a non-volatile content of 65% by mass, functional group equivalent of 281 g / eq.); 3) 6 parts of a phenol-based curing agent (DIC Corporation's "LA-3018-50P", active group equivalent approximately 151 g / eq., 2-methoxypropanol solution with 50% solids) was changed to 4 parts of a bisphenol A dicyanate prepolymer (Lonza Japan's "BA230S75", cyanate equivalent approximately 232, MEK solution with 75% nonvolatiles by mass). A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above.

[0225] <Example 4> In Example 3, 1) The amount of inorganic filler 2 was changed from 90 parts to 85 parts. 2) 4 parts of bisphenol A dicyanate prepolymer ("BA230S75" manufactured by Lonza Japan, cyanate equivalent of approximately 232, MEK solution with non-volatile content of 75% by mass) was changed to 3 parts of phenolic resin (KA-1163 manufactured by DIC Corporation). A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above.

[0226] <Example 5> In Example 1, 1) The amount of the inorganic filler 2 was changed from 90 parts to 85 parts, 2) 20 parts of the polymer resin A was changed to 20 parts of the polymer resin B. A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above matters.

[0227] <Example 6> In Example 4, 1) 20 parts of the polymer resin A was changed to 20 parts of the polymer resin C, 2) 4.8 parts of the active ester-based curing agent (manufactured by DIC Corporation, "HPC-8150-62T", toluene solution with a solid content of 62%) was changed to 4.8 parts of the active ester-based curing agent (manufactured by DIC Corporation, "HPC8150-62T", toluene solution with a solid content of 62%), 3) 3.3 parts of the maleimide compound (liquid bismaleimide "SLK-6895-M90" manufactured by Shin-Etsu Chemical Co., Ltd., MEK solution with a solid content of 90% by mass, maleimide group equivalent of 345 g / eq.) was not used. A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above matters.

[0228] <Comparative Example 1> In Example 1, 1) 2 parts of the flexible epoxy resin ("EP-4040L", manufactured by ADEKA Corporation, epoxy equivalent of 310 g / eq.) was changed to 2 parts of the glycidylamine type epoxy resin ("630", manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of 90 to 105 g / eq.), 2) 20 parts of the polymer resin A was changed to 29 parts of the polymer resin C. A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above matters.

[0229] <Comparative Example 2> In Example 1, 1) 2 parts of the flexible epoxy resin ("EP-4040L", manufactured by ADEKA Corporation, epoxy equivalent of 310 g / eq.) was changed to 2 parts of the dicyclopentadiene type epoxy resin ("HP7200" manufactured by DIC Corporation, epoxy equivalent of 258 g / eq.), 2) The amount of the polymer resin A was changed from 20 parts to 32 parts. A resin varnish and a resin sheet were obtained in the same manner as in Example 1 except for the above.

[0230] <Preparation of cured product for evaluation> A release PET film ("501010" manufactured by Lintec Corporation, 38 μm thick, 240 mm square) having a release-treated surface (release surface) and a surface not treated with release treatment (untreated surface) was prepared. This release PET film was placed on a 2 mm thick stainless steel plate so that the untreated surface of the release PET film was in contact with the stainless steel plate. The four sides of the release PET film were fixed to the stainless steel plate with polyimide adhesive tape (width 10 mm).

[0231] The protective film was peeled off from each resin sheet (200 mm x 200 mm square) prepared in the examples and comparative examples, and the resin composition layer was laminated in the center so as to contact the release surface of the release PET film using a batch-type vacuum pressure laminator (a two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.). The lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at 100 ° C and a pressure of 0.74 MPa for 30 seconds. Next, the support was peeled off, and the resin composition layer was thermally cured under curing conditions of 170 ° C for 4 hours to obtain a cured product of the resin composition layer.

[0232] After thermal curing, the polyimide adhesive tape was peeled off, the stainless steel plate was removed, and the release PET film was peeled off to obtain a sheet-like cured product, which is hereinafter referred to as "evaluation cured product 1."

[0233] Cured product 2 for evaluation was obtained in the same manner as cured product 1 for evaluation, except that the curing conditions were changed to 200° C. for 2 hours.

[0234] Cured product for evaluation 3 was obtained in the same manner as cured product for evaluation 1, except that the curing conditions were changed to 230° C. for 4 hours.

[0235] Cured product for evaluation 4 was obtained in the same manner as cured product for evaluation 1, except that the curing conditions were changed to 200° C. for 4 hours.

[0236] <Measurement of chloride ion amount> The amount of chloride ions in the evaluation cured materials 1 and 2 was measured using a combustion-ion chromatography method (in accordance with BS EN 14582 2007).

[0237] Specifically, five samples were taken from the center of each of the evaluation cured materials 1 and 2 (an area of ​​30 mm x 30 mm from the center point) and five samples were taken from each of the edges of each of the evaluation cured materials 1 and 2 (an area of ​​5 mm x 5 mm from the four corners) and measured. The amount of chloride ions in the center, the amount of chloride ions at the edges, and their standard deviations were measured, and C2 / C1 was calculated from the measurement results of the amount of chloride ions in the center.

[0238] <Measurement of elastic modulus> The cured products for evaluation 3 and 4 were each cut into a dumbbell shape No. 1 to obtain a test piece. The test piece was subjected to tensile strength measurement using a tensile tester (Orientec Co., Ltd. "RTC-1250A") to determine the elastic modulus at 25°C. The measurement was performed in accordance with JIS K7127. This operation was performed three times, and the average value is shown in the table. In addition, D2 / D1 was calculated from the measured elastic modulus.

[0239] <Insulation test> A 38 μm thick polyimide film on which a comb-shaped electrode pattern (six electrodes for each sample) with L / S=10 / 10 μm and circuit thickness of 8 μm was formed was laminated with the resin sheets prepared in the Examples and Comparative Examples so as to cover the entire surface of the comb-shaped electrode pattern, and cured for 4 hours at 200° C. The insulation resistance value of the obtained evaluation sample after 200 hours under conditions of 130° C., 85% relative humidity, and 10 V DC voltage application was measured with an electrochemical migration tester (IMVCORPORATION's MIG8600B) using a highly accelerated life tester (Hirayama Manufacturing Co., Ltd.'s PC422-R8D), and evaluated according to the following criteria. 〇: Insulation resistance value is 1×10 10 More than Ω. △: Insulation resistance is 1×10 9 Ω or more 1×10 10 Less than ohms. ×: Insulation resistance is 1×10 9 Less than ohms.

[0240] <Vickers hardness measurement> The Vickers hardness (HV) of the test piece obtained was measured using a Vickers hardness tester (manufactured by Mitutoyo Corporation, product name HM200) for the cured product for evaluation 1. This measurement was carried out three times, and the average value is shown in the table.

[0241] [Table 1]

[0242] [Table 2]

[0243] In Examples 1 to 6, it was confirmed that even when components (D) to (G) were not contained, the results were similar to those of the above Examples, although to a different extent.

Claims

1. (A) an epoxy resin, (B) inorganic filler, (D) a curing agent, (E) an elastomer, and (F) an antioxidant; The component (D) contains a carbodiimide-based curing agent, an active ester-based curing agent, and a phenol-based curing agent, The content of the (E) component is 1% by mass or more and 10% by mass or less, when the total amount of non-volatile components in the resin composition is 100% by mass, The component (F) contains a hindered phenol-based antioxidant, The component (E) has one or more structures selected from the group consisting of a polybutadiene structure and a polycarbonate structure, the amount of chloride ions contained in a cured product of a resin composition heat-cured at 170°C for 4 hours, as measured in accordance with a sample combustion-ion chromatography method (BS EN 14582 2007), is defined as C1, and the amount of chloride ions contained in a cured product of a resin composition heat-cured at 200°C for 2 hours, as measured in accordance with a sample combustion-ion chromatography method (BS EN 14582 2007), is defined as C2, the relationship of 0.75<C2 / C1<1 is satisfied, A resin composition that satisfies the relationship D2 / D1<1.3, where D1 is the elastic modulus at 25°C of a cured product of a resin composition that has been heat-cured at 170°C for 4 hours, and D2 is the elastic modulus at 25°C of a cured product of a resin composition that has been heat-cured at 230°C for 4 hours.

2. 2. The resin composition according to claim 1, wherein the amount C1 of chloride ions contained in a cured product of the resin composition heat-cured at 170° C. for 4 hours is 230 ppm or less.

3. 2. The resin composition according to claim 1, wherein the amount C2 of chloride ions contained in a cured product of the resin composition thermally cured at 200° C. for 2 hours is 200 ppm or less.

4. The resin composition according to claim 1 , further comprising (C) a compound having a radically polymerizable unsaturated group.

5. The resin composition according to claim 4, wherein the radically polymerizable unsaturated group is a maleimide group.

6. The resin composition according to claim 4 , wherein the component (C) has a long-chain aliphatic skeleton.

7. The resin composition according to claim 1, which is used for forming an insulating layer of a multilayer printed wiring board formed by a dry process.

8. The area of ​​the circuit board is 10,000 mm ２ The resin composition according to claim 1, which is used for forming an insulating layer having the above structure.

9. A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of claims 1 to 8.

10. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 8.

11. A semiconductor chip package comprising a semiconductor chip and, on the semiconductor chip, a cured product of the resin composition according to any one of claims 1 to 8.

12. A semiconductor device comprising the printed wiring board according to claim 10.

13. A semiconductor device comprising the semiconductor chip package according to claim 11.

14. A step of forming an insulating layer containing a cured product of the resin composition according to any one of claims 1 to 8 on an inner layer circuit board; and A method for manufacturing a printed wiring board, comprising: performing a dry desmear treatment on a surface of an insulating layer.

15. A method for producing a semiconductor chip package, comprising the step of forming a layer containing a cured product of the resin composition according to any one of claims 1 to 8 on a semiconductor chip.

Images