Capacitor Parts

Abstract

To provide a capacitor component that has improved moisture resistance reliability and can prevent penetration of plating solution during a process and / or penetration of external moisture during operation of a product.SOLUTION: A capacitor component according one embodiment of the present invention includes: a body including a dielectric layer, first and second internal electrodes laminated in a first direction, opposing each other, and first and second cover portions disposed on the outermost side of the first and second internal electrodes and each having a thickness of 25 μm or less; first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes; and plating layers, respectively disposed on the first and second external electrodes. A metal oxide is disposed on a boundary between the first and the plating layer and a boundary between the second external electrodes and the plating layer.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a capacitor component. [Background technology]

[0002] Among capacitor components, multi-layer ceramic capacitors (MLCCs) have the advantages of being small yet guaranteed to have high capacitance, and being easy to mount.

[0003] Recently, ceramic electronic components, especially multilayer capacitors, have become ultra-high capacity. In order to secure the capacity, it is necessary to reduce the thickness of the effective margin, cover, electrode terminal, etc. However, such a structural change has a problem of reducing the moisture resistance reliability.

[0004] In addition, the penetration of the plating solution during the plating process can cause defects in the electrode terminals and the internal structure of the element, which can cause problems in the reliability of the final product, particularly deterioration of characteristics and failure during high temperature / high pressure operation. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a capacitor component that has improved moisture resistance reliability and is capable of preventing penetration of plating solution during processing and / or penetration of external moisture during product operation. [Means for solving the problem]

[0006] One embodiment of the present invention can provide a capacitor component including a body including a dielectric layer, first and second internal electrodes stacked in a first direction and facing each other, and first and second cover parts arranged on the outermost sides of the first and second internal electrodes and having a thickness of 25 μm or less, first and second external electrodes arranged on both sides of the body in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively, and plating layers arranged on the first and second external electrodes, respectively, wherein a metal oxide is arranged at the interface between the first and second external electrodes and the plating layers. Effect of the Invention

[0007] According to one embodiment of the present invention, a groove is disposed at the interface between the internal electrode and the external electrode, thereby making it possible to minimize the induction of defects caused by the penetration of moisture from the outside while ensuring contact with the external terminal.

[0008] According to another embodiment of the present invention, the grooves at the interface between the internal electrode and the external electrode are arranged at a predetermined size and ratio, thereby preventing a decrease in reliability of the electronic component due to penetration of a plating solution or moisture.

[0009] According to another embodiment of the present invention, by disposing a metal oxide at the interface between the external electrode and the plating layer, it is possible to prevent cracks caused by external impacts, etc.

[0010] According to still another embodiment of the present invention, a metal oxide is disposed at the interface between the external electrode and the plating layer, thereby improving the moisture resistance reliability.

[0011] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a schematic configuration of a capacitor component according to an embodiment of the present invention; [Diagram 2]FIG. 2 is a perspective view showing a main body of FIG. 1. [Diagram 3] 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] 2 is a cross-sectional view taken in the X and Y directions in FIG. 1, showing a cross section of a first internal electrode. [Diagram 5] 2 is a cross-sectional view taken in the X and Y directions in FIG. 1, showing a cross section of a second internal electrode. [Figure 6] FIG. 4 is an enlarged view of part A in FIG. [Figure 7] FIG. 2 is a schematic diagram showing an internal electrode according to an embodiment of the present invention. [Figure 8] FIG. 4 is a schematic diagram showing an internal electrode according to another embodiment of the present invention. [Figure 9] 1 is a cross-sectional view of a capacitor component according to one embodiment of the present invention. [Figure 10] FIG. 10 is an enlarged view of part B in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0014] In order to clearly explain the present invention, parts not relevant to the description are omitted in the drawings, thicknesses are enlarged to clearly show multiple layers and regions, and components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified.

[0015] In the drawings, the X direction may be defined as the second direction, the L direction or the length direction, the Y direction may be defined as the third direction, the W direction or the width direction, and the Z direction may be defined as the first direction, the T direction or the thickness direction.

[0016] Hereinafter, a capacitor component according to an embodiment of the present invention will be described in detail with reference to FIGS.

[0017] The capacitor component 100 of the present invention includes a body 110 including a dielectric layer 111, first and second internal electrodes 121, 122 stacked in a first direction (Z direction) and facing each other, and first and second cover parts arranged on the outermost sides of the first and second internal electrodes 121, 122 and having a thickness of 25 μm or less, first and second external electrodes 131a, 132a arranged on both sides of the body 110 in a second direction (X direction) perpendicular to the first direction (Z direction) and electrically connected to the first and second internal electrodes 121, 122, respectively, and plating layers 131b, 132b arranged on the first and second external electrodes 131a, 132a, respectively.

[0018] At this time, metal oxide may be disposed at the interfaces between the first and second external electrodes 131a and 132a and the plating layers 131b and 132b.

[0019] In an embodiment of the present invention, the body 110 may include a dielectric layer 111, first and second internal electrodes 121, 122, and first and second cover portions.

[0020] The specific shape of the body 110 is not particularly limited, but as shown in the figure, the body 110 may be a hexahedron or a shape similar thereto. Due to shrinkage of ceramic powder contained in the body 110 during firing, the body 110 may have a substantially hexahedron shape, but not a hexahedron having perfect straight lines. The body 110 may have first and second faces 1, 2 facing each other in a thickness direction (Z direction), third and fourth faces 3, 4 connected to the first and second faces 1, 2 and facing each other in a length direction (X direction), and fifth and sixth faces 5, 6 connected to the first and second faces 1, 2 and connected to the third and fourth faces 3, 4 and facing each other in a width direction (Y direction).

[0021] The body 110 may be formed by alternately stacking ceramic green sheets having a first internal electrode 121 printed on a dielectric layer 111 and ceramic green sheets having a second internal electrode 122 printed on a dielectric layer 111 in the thickness direction (Z direction).

[0022] In one example of the present invention, the dielectric layers 111 and the internal electrodes 121, 122 may be alternately stacked in a first direction. The plurality of dielectric layers 111 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0023] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can obtain a sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used.

[0024] The material forming the dielectric layer 111 is barium titanate (BaTiO 3 ) and the like, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. can be added depending on the purpose of the present invention.

[0025] For example, the dielectric layer 111 may be made of barium titanate (BaTiO 3 The ceramic sheet may be formed by coating a slurry containing powder such as ceram ic powder, binder, and solvent on a carrier film, and drying the slurry to provide a plurality of ceramic sheets. The ceramic sheet may be formed by mixing ceramic powder, binder, and solvent to prepare a slurry, and forming the slurry into a sheet having a thickness of several μm using a doctor blade method, but is not limited thereto.

[0026] In one example of the present invention, the average thickness of the dielectric layer 111 may be 0.4 um or less. The average thickness of the dielectric layer 111 may be an average of values ​​measured at five different positions on the fired dielectric layer 111. The lower limit of the average thickness of the dielectric layer 111 is not particularly limited, but may be, for example, 0.01 um or more.

[0027] In one example of the present invention, the multiple internal electrodes 121, 122 may be arranged to face each other across the dielectric layer 111. The internal electrodes 121, 122 may include first and second internal electrodes 121, 122 that are alternately arranged to face each other across the dielectric layer 111.

[0028] The first internal electrode 121 may be exposed to one surface of the body 110 in the second direction (X direction), and a portion exposed to the one surface in the second direction (X direction) may be connected to the first external electrode 131. The second internal electrode 122 may be exposed to the other surface of the body 110 in the second direction (X direction), and a portion exposed to the other surface in the second direction (X direction) may be connected to the second external electrode 132. The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0029] The material for forming the first and second internal electrodes 121 and 122 is not particularly limited, and may be formed using a conductive paste containing at least one of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti), and alloys thereof. The conductive paste may be printed using a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0030] The average thickness of the first and second internal electrodes 121 and 122 may be 0.4 um or less. The average thickness of the internal electrodes may be an average of values ​​measured at five different positions of the fired internal electrodes. The lower limit of the average thickness of the first and second internal electrodes is not particularly limited, but may be, for example, 0.01 um or more.

[0031] In an embodiment of the present invention, a groove may be disposed at at least one of the interface between the first internal electrode 121 and the first external electrode 131 and the interface between the second internal electrode 122 and the second external electrode 132 .

[0032] 4 and 5 are diagrams showing grooves 151 and 152 according to the present invention. Referring to FIG. 4 and FIG. 5, the groove 151 may be disposed at the interface between the first internal electrode 121 and the first external electrode 131. Also, the groove 152 may be disposed at the interface between the second internal electrode 122 and the second external electrode 132. The method of forming the grooves 151 and 152 is not particularly limited, and for example, the grooves 151 and 152 may be formed by controlling the component and / or content of the metal contained in the internal electrode and using the difference in firing speed with the ceramic layer during firing, or the grooves 151 and 152 may be formed by controlling the content of the glass component contained in the external electrode and using the glass component that dissolves during firing of the external electrode. Such grooves can minimize the induction of defects even when moisture penetrates from the outside while maintaining contact with the external electrode.

[0033] In one embodiment of the present invention, the grooves 151 and 152 may contain glass. The grooves 151 and 152 containing glass may mean that the insides of the grooves 151 and 152 are filled with glass. The glass may be filled in 20% or more of the total grooves 151 and 152, which may mean the number of grooves filled with glass with respect to the total number of grooves. When the grooves contain glass, the penetration of a plating solution and / or external moisture can be more effectively prevented, and thus the moisture resistance reliability can be further improved. The grooves containing glass may be formed by adding a glass component to a conductive paste for external electrodes and dissolving it during a firing process, as described below.

[0034] In one embodiment of the present invention, the grooves 151 and 152 may be disposed at the outermost interface in the first direction of the main body 110 among the interface between the first internal electrode 121 and the first external electrode 131 and the interface between the second internal electrode 122 and the second external electrode 132. FIG. 7 is a schematic diagram showing a dielectric layer and an internal electrode included in the main body according to the present embodiment. Referring to FIG. 7, the grooves 151 and 152 may be present at the outermost interface in the first direction of the main body 110 among the interface between the first internal electrode 121 and the first external electrode 131 and the interface between the second internal electrode 122 and the second external electrode 132. In this way, the grooves 151 and 152 are disposed at the outermost interface in the first direction of the main body 110 among the interface between the first internal electrode 121 and the first external electrode 131 and the interface between the second internal electrode 122 and the second external electrode 132, thereby improving the moisture resistance reliability of the outermost region into which the plating solution or external moisture is most likely to penetrate.

[0035] In another embodiment according to the present invention, the grooves 251 and 252 may be disposed at the interface between the first internal electrode 221 and the first external electrode 131 and the interface between the second internal electrode 222 and the second external electrode 132, or may be disposed at both of the interfaces. FIG. 8 is a schematic diagram showing a dielectric layer and an internal electrode included in a body according to the present embodiment. Referring to FIG. 8, the grooves 251 and 252 may be disposed at all of the interfaces where the first and second internal electrodes 221 and 222 included in the body 110 meet with the first and second external electrodes, which may mean that the grooves are formed on the first and second internal electrodes exposed in the second direction (X direction) of the body. In this case, the moisture resistance reliability against the penetration of external moisture can be maximized.

[0036] In one embodiment of the present invention, the sum of the widths of the grooves 151, 152 of the first internal electrode 121 or the second internal electrode 122 may be within a range of 30 to 80% of the entire width of the first internal electrode 121 or the second internal electrode 122. The sum of the widths of the grooves of the first internal electrode 121 may mean the total length of the widths of the grooves 151 formed in the first internal electrode 121 in the third direction (W direction), for example, the total length of the widths of the grooves 151 formed in the surface of the first internal electrode 121 closest to the first external electrode 131. The sum of the widths of the grooves 152 of the second internal electrode 122 may mean the total length of the widths of the grooves 152 formed in the second internal electrode 122 in the third direction (W direction), for example, the total length of the widths of the grooves 152 formed in the surface of the second internal electrode 122 closest to the second external electrode 132. The overall width of the first internal electrode 121 or the second internal electrode 122 may mean the length of the first internal electrode and the second internal electrode in the Y direction, and may correspond to the sum of the width of the portion where the first and second internal electrodes contact the first and second external electrodes and the width of the groove. When the sum of the widths of the grooves 151, 152 of the first internal electrode 121 or the second internal electrode 122 satisfies the above-mentioned range with respect to the overall width of the first internal electrode 121 or the second internal electrode 122, the occurrence of defects due to penetration of external moisture can be minimized.

[0037] In an embodiment of the present invention, the length t1 of the grooves 151, 152 may be 5 μm or less. The length t1 of the grooves 151, 152 may refer to the length of the grooves 151, 152 in the second direction (X direction). FIG. 6 is a schematic diagram showing the length t1 of the grooves according to this embodiment. Referring to FIG. 6, the length t1 of the grooves may refer to the length where the internal electrodes and the external electrodes are not in contact with each other when viewed from the Y direction. If the length of the grooves 151, 152 according to the present invention exceeds 5 μm, a problem may occur in that the contact between the internal electrodes 121, 122 and the external electrodes 131, 132 is reduced. The lower limit of the length of the grooves 151, 152 is not particularly limited, but may be, for example, more than 0 μm and 0.01 μm or more. If the length of the grooves 151, 152 is shorter than the above range, the contact between the internal electrodes 121, 122 and the external electrodes 131, 132 may be poor, and the moisture resistance reliability may be reduced.

[0038] In another embodiment of the present invention, a glass layer may be disposed at the interface between the first internal electrode 121 and the first external electrode 131 and / or the interface between the second internal electrode 122 and the second external electrode 132. The glass layer may be formed by dissolving glass contained in the internal electrode and / or the external electrode during a firing process. The glass layer serves to block external moisture, and the thickness may be appropriately selected within a range that does not affect contact. The thickness of the glass layer may be, for example, 5 μm or less, and the lower limit is not particularly limited, but may be, for example, more than 0 μm and 0.01 μm or more.

[0039] In an embodiment of the present invention, first and second cover parts may be disposed on the outermost sides of the first and second internal electrodes 121 and 122. The first and second cover parts may be disposed under the lowermost internal electrode and over the uppermost internal electrode of the body 110. In this case, the lower and upper cover parts may be made of the same composition as the dielectric layer 111, and may be formed by laminating at least one dielectric layer not including an internal electrode on the uppermost internal electrode of the body 110 and on the lowermost internal electrode of the body 110, respectively.

[0040] The first and second cover parts essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0041] The thickness of each of the first and second cover parts is not particularly limited, but may be, for example, 25 μm or less. By minimizing the thickness of each of the first and second cover parts, the capacitance per unit volume of the capacitor component 100 can be improved.

[0042] In addition, the lower limit of the thickness of each of the first and second cover parts is not particularly limited and can be selected appropriately taking into consideration the radius of curvature (R1) of the corners of the main body at the end faces in the first and second directions, and can be, for example, 5 μm or more.

[0043] Here, the thickness of each of the first and second cover parts may refer to the length of each of the first and second protective parts in the first direction (Z direction).

[0044] In one example of the present invention, a first external electrode 131 and a second external electrode 132 may be disposed on both sides of the body in the second direction. The first external electrode 131 may be electrically connected to the first internal electrode 121, and the second external electrode 132 may be electrically connected to the second internal electrode 122.

[0045] The first and second external electrodes 131, 132 may be disposed to extend on both sides in a first direction (Z direction) and in a third direction (Y direction) of the body 110. In this case, the first and second external electrodes 131, 132 may be disposed to extend to parts of the first and second surfaces 1, 2 of the body. In addition, the first and second external electrodes 131, 132 may be disposed to extend to parts of the fifth and sixth surfaces 5, 6 of the body.

[0046] The method of forming the first and second external electrodes 131 and 132 is not particularly limited, and may be formed using a conductive paste containing glass and one or more of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti), and alloys thereof. The conductive paste may be printed using a screen printing method or a gravure printing method, but the present invention is not limited thereto. By forming the first and second external electrodes using the conductive paste, sufficient conductivity is maintained while the density of the external electrodes is increased by the added glass, thereby effectively suppressing the penetration of a plating solution and / or external moisture.

[0047] The glass component included in the first and second external electrodes may be a mixed oxide composition, and may be, but is not limited to, at least one selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, and alkaline earth metal oxide. The transition metal may be selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni), the alkali metal may be selected from the group consisting of lithium (Li), sodium (Na), and potassium (K), and the alkaline earth metal may be at least one selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0048] In one embodiment of the present invention, the thickness of the central portion of the first and second external electrodes may be within a range of 1 um to 10 um. The thickness of the central portion of the external electrodes may be a value measured at an intersection point of lines connecting mutually opposing corners based on four corners of the surface on which the external electrodes are formed. If the external electrodes are thinner than the above thickness, the main body of the corners may be exposed, and if they are thicker than the above thickness, cracks may occur during the firing process.

[0049] In an embodiment of the present invention, plating layers 131b and 132b may be disposed on the first and second external electrodes 131a and 132a, respectively. The plating layers 131b and 132b may be formed by sputtering or electrolytic plating, but are not limited thereto.

[0050] The plating layers 131b and 132b may contain nickel (Ni) in the largest amount, but are not limited thereto, and may contain copper (Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), etc. alone or in alloys thereof. By including the plating layers, it is possible to improve mountability with a board, structural reliability, durability against the outside, heat resistance, and / or equivalent series resistance (ESR).

[0051] In one embodiment of the present invention, the thickness of the central portion of the plating layer may be within a range of 3 um to 5 um. The thickness of the central portion of the plating layer may be a value measured at an intersection point of lines connecting mutually opposing corners based on four corners of the surface on which the plating layer is formed. If the plating layer is thinner than the above thickness, it may not be possible to effectively block external moisture penetration, and if it is thicker than the above thickness, the plating layer may be separated by external heat during mounting on a board.

[0052] In one embodiment of the present invention, a metal oxide 361 may be disposed at the interface between the first external electrode 331a and the plating layer 331b and the interface between the second external electrode 332a and the plating layer 332b. The metal oxide 361 may contain aluminum (Al) in the largest amount, but is not limited thereto, and may be one or more selected from the group including magnesium (Mg), manganese (Mn), nickel (Ni), lithium (Li), silicon (Si), titanium (Ti), barium (Ba), and alloys thereof.

[0053] The metal oxide may be, for example, in the form of one or more of an island, a plurality of oxides, an amorphous form, and a powder, and may be arranged in a mixed form of the above forms.

[0054] Such metal oxides can be generated during the process of polishing with the metal oxide abrasive to remove glass that has been introduced onto the surface of the external electrodes in order to strengthen plating connectivity, or can be generated through wet chemical growth (e.g., formation of metal oxide and glass-based secondary phases) or partial dry physical / chemical growth (PVD / CVD, etc.) on the portions of the external electrodes prior to plating.

[0055] By disposing the metal oxide at the interface between the external electrode and the plating layer, defects inside the chip due to the penetration of a plating solution can be prevented, and moisture can be prevented from penetrating due to defects at the interface between the external electrode and the plating layer, which can also contribute to improving the moisture resistance reliability of the capacitor component.

[0056] The metal oxide disposed at the interface between the external electrode and the plating layer may have a length that is in the range of 5% to 90% of the total length of the interface between the external electrode and the plating layer. The length of the metal oxide may be based on any end face of the capacitor component, and may be a value measured based on, for example, an end face perpendicular to the internal electrode or a plane parallel to the internal electrode. That is, the total length of the interface between the external electrode and the plating layer at an end face perpendicular to the internal electrode of the capacitor component (for example, a plane passing through the center of the capacitor component) may be based on the length of the metal oxide exposed at the end face. The ratio may be an average of values ​​measured at five different positions on the capacitor component.

[0057] The ratio can be adjusted within a range that does not hinder plating growth, and can be, for example, 90% or less, 80% or less, 70% or less, 60% or less, 50% or less, 45% or less, 40% or less, 38% or less, 37% or less, 36% or less, or 35% or less, but is not limited thereto. The lower limit of the ratio can be, for example, 1% or more, 2% or more, 3% or more, 4% or more, 5% or more, 6% or more, 7% or more, or 7.5% or more, but is not limited thereto. When the ratio of the length in which the metal oxide exists satisfies the above range, the plating layer does not break while improving the moisture resistance reliability.

[0058] Table 1 below shows the contact, high temperature / high voltage reliability, and moisture resistance reliability depending on the length of the groove. Table 1 covers capacitor components in which grooves are formed in all internal electrodes, and capacitor components in which the total width of the grooves is in the range of 30 to 80% of the width of the internal electrodes. In Table 1, contact failure is evaluated as failure when it exceeds ±30% of the upper and lower limits of the reference capacitance. The high temperature / high voltage reliability failure is shown by investigating the number of capacitor components that have defects out of 400 samples when a voltage of 2Vr is applied at 150°C. In addition, the moisture resistance reliability failure is shown by investigating the number of capacitor components that have defects out of 400 samples when a voltage of 1Vr is applied at 85°C and 85% RH.

[0059] [Table 1]

[0060] Referring to Table 1 above, it can be seen that the high temperature / high pressure reliability and the moisture resistance reliability are significantly decreased when the groove length is 0 um compared to when it is 5 um, and that the contact failure is significantly increased when the groove length is 10 um.

[0061] Table 2 below shows the plating connectivity and chipping rate with respect to the ratio of metal oxides present between the external electrodes and the plating layer. 2 O 3The glass of the external electrode part was physically etched using an abrasive, and then the removal rate of the abrasive was adjusted before carrying out the post-processing. (Method 1)

[0062] The metal oxide ratios in Table 2 below are calculated based on the amount of Al between the external electrodes and the plating layer on the end faces of the finished chips after post-processing. 2 O 3 The frequency of plating layer breakage was calculated by randomly selecting 100 capacitor components from the manufactured capacitor components and measuring the length of each of the two end faces in the second direction of the capacitor components. Length and thickness The element was divided into 5 equal parts up to the middle, and the frequency of breakage of the plating layer on the end face at each position was confirmed. The chipping frequency was confirmed by randomly selecting 100 capacitor components from the manufactured capacitor components and observing the appearance of the element part under a microscope.

[0063] [Table 2]

[0064] Referring to Table 2 above, it can be seen that when no metal oxide is present, the frequency of occurrence of breaks and chipping of the plating layer increases, whereas when the metal oxide is more than 5%, it can be seen that breaks and chipping of the plating layer are improved.

[0065] Table 3 below shows the plating connectivity and chipping rate as a function of the ratio of metal oxide between the external electrode and the plating layer. The capacitor parts in Table 3 are entirely coated with amorphous metal oxide on the external electrodes by physical vapor deposition, and Al 2 O 3 It was produced by removing a certain proportion of the deposited metal oxide using an abrasive (Method 2).

[0066] [Table 3]

[0067] Referring to Table 3 above, even if the metal oxide is formed by a method different from Method 1 in Table 2, when the metal oxide is present at 1%, chipping occurs in all chips. When the metal oxide is present at more than 5%, it is confirmed that breakage and chipping of the plating layer are improved, and when the metal oxide is present at 95%, breakage occurs in all plating layers.

[0068] Table 4 below shows the high temperature / high voltage reliability and humidity resistance reliability according to Method 1 and Method 2. The high temperature / high voltage reliability failure was shown by investigating the number of capacitor parts that failed out of 400 samples when a voltage of 2Vr was applied at 150°C. The humidity resistance reliability failure was shown by investigating the number of capacitor parts that failed out of 400 samples when a voltage of 1Vr was applied at 85°C and 85% RH.

[0069] [Table 4]

[0070] Referring to Table 4, it can be seen that although Method 1, which physically etches the glass of the external electrode portion of the manufactured capacitor component and adjusts the ratio of the abrasive, and Method 2, which deposits an amorphous metal on the external electrode of the capacitor component and removes the deposited metal oxide at a certain ratio, adjust the ratio of the metal oxide in different ways, they all show excellent results in high temperature / high pressure reliability and moisture resistance. This confirms that the high temperature / high pressure reliability and moisture resistance reliability of the capacitor component according to the present invention are not affected by the manufacturing method, but are improved by the ratio of the metal oxide.

[0071] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0072] 100 Capacitor parts 110 Main unit 111 Dielectric layer 121, 122, 221, 222 Internal electrode 131, 132, 331, 332 external electrode 131a, 132a, 331a, 332a external electrode 131b, 132b, 331b, 332b plating layer 151, 152, 251, 252 Groove 361 Metal Oxides

Claims

1. a main body including a dielectric layer, first and second internal electrodes stacked in a first direction and facing each other, and first and second cover portions disposed on the outermost sides of the first and second internal electrodes and having a thickness of 25 μm or less; a first external electrode and a second external electrode disposed on both surfaces of the body in a second direction perpendicular to the first direction and electrically connected to the first internal electrode and the second internal electrode, respectively; a plating layer disposed on the first external electrode and the second external electrode, a metal oxide is disposed at interfaces between the first external electrode and the plating layer, and the second external electrode has a length that is in a range of 5% to 90% of an entire length of the interfaces between the first external electrode and the plating layer, and the second external electrode has a length that is in a range of 5% to 90% of an entire length of the interfaces between the first external electrode and the plating layer, A capacitor component, comprising: at least one extending groove disposed along an interface between the first internal electrode and the first external electrode and an interface between the second internal electrode and the second external electrode; and the inside of the groove is filled with glass.

2. The capacitor component of claim 1 , wherein the metal oxide is in one or more of an island form, a multi-oxide form, an amorphous form, and a powder form.

3. The capacitor component according to claim 1 , wherein the first external electrode and the second external electrode contain a glass component.

4. The capacitor component according to claim 1 , wherein the first external electrode and the second external electrode contain copper (Cu).

5. 5. The capacitor component according to claim 1, wherein the thickness of the central portion of the first external electrode and the second external electrode is within a range of 1 to 10 um.

6. The capacitor component according to claim 1 , wherein the plating layer contains nickel (Ni).

7. The capacitor component according to any one of claims 1 to 6, wherein the thickness of the central portion of the plating layer is within a range of 3 to 5 um.

8. The capacitor component according to claim 1 , wherein the groove portion is disposed at an outermost interface in a first direction of the body, among an interface between a first internal electrode and a first external electrode and an interface between a second internal electrode and a second external electrode.

9. The capacitor component according to claim 1 , wherein the grooves are disposed at an interface between the first internal electrode and the first external electrode and at an interface between the second internal electrode and the second external electrode.

10. The capacitor component according to claim 1 , wherein the groove has a length of 5 μm or less.

11. The capacitor component according to claim 1 , wherein the first internal electrode and the second internal electrode have a thickness of 0.01 um or more and 0.4 um or less.

12. The capacitor component according to claim 1 , wherein the thickness of the dielectric layer is 0.01 um or more and 0.4 um or less.

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