Integrated heat dissipation module structure

Abstract

To provide an integrated heat dissipation module structure that is an efficient heat dissipation module structure where a heat sink and a vapor chamber are integrated together.SOLUTION: An integrated heat dissipation module structure comprises: a metallic top cover, including an outer heat-dissipating surface and an inner condensation surface, the outer heat-dissipating surface having a plurality of columnar heat dissipation structures, the inner condensation surface having a plurality of top grooves arranged parallel to each other; a metallic bottom cover, including an outer heat-absorption surface and an inner evaporation surface, the outer heat-absorption surface having a screw hole for locking a heat-dissipating electronic element, the inner evaporation surface having thereon a plurality of bottom grooves arranged parallel to each other, a plurality of supporting structures protruding among the bottom grooves, and a screw-hole protrusion corresponding to the screw hole; a working space, being an airtight space formed by a top frame and a bottom frame joined to each other; a suction channel formed by joining an upper channel groove and a lower channel groove correspondingly; capillary structures, disposed inside the bottom grooves or inside the top and bottom grooves; and a working fluid, present in the working space and the capillary structures.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a heat dissipation module structure, and more particularly to an integrated heat dissipation module structure. [Background technology]

[0002] High-power electronic components are a new generation of semiconductor components, and are gradually becoming the mainstream of applications, especially in high-speed rail transit, smart grids, and new energy electric vehicles. For example, insulated gate bipolar transistors (IGBTs) have low driving voltages, can withstand high operating voltages, and can withstand high switching frequencies, but are used in high-frequency and high-power fields. However, the operation of high-power electronic components inevitably involves the generation of a large amount of heat due to their high power density. If the heat accumulated in the power elements cannot be efficiently and timely dissipated, this will have a significant impact on the reliability of the electronic components, and the development of their applications will be restricted.

[0003] A typical power device heat dissipation module structure is that the power device or chip (IGBT / diode) is attached to one side of a ceramic substrate (e.g., copper clad ceramic substrate or DBC substrate) coated with a metal layer on both sides by welding, the commonly used ceramic materials are aluminum oxide and aluminum nitride, and the metal layer is mainly used for wiring layout, heat conduction and heat dissipation.Then, the other side of the ceramic substrate is welded to a copper base plate by solder, and the other side of the copper base plate is coated with a layer of thermal conductive paste or thermal conductive silicone grease before bonding the heat sink.

[0004] During the operation of the power element, a large amount of heat is generated, and in this power module structure, this large amount of heat is conducted to the copper base plate through the ceramic substrate, and then through the thermal conductive paste or thermal conductive silicone grease, the heat is further conducted to the heat sink, and the heat is quickly dissipated by the heat sink. However, the difference in thermal expansion coefficient between the ceramic substrate and the copper base plate is large, and the thermal conductive paste or thermal conductive silicone grease has insufficient thermal conductivity efficiency, so that the heat of the copper base plate is not conducted to the heat sink in a timely manner, and the heat that cannot be removed is accumulated in the copper base plate, resulting in an increase in temperature, and the substrate and the bake plate are deformed to different degrees due to the difference in thermal expansion coefficient, and the welding surface between them is usually destroyed, and the heat transfer is also hindered, and finally the temperature becomes too high, causing the whole component to fail.

[0005] Considering the above problems, some companies (e.g. Semikron) have developed another heat dissipation module, in which the original copper base plate is removed, and the ceramic substrate with the power element or chip is directly attached to the heat sink with thermal conductive paste or thermal conductive silicone grease, to avoid the abnormality caused by the difference in thermal expansion coefficient. However, considering the difficulty of processing and the problem of material properties, most heat sinks use aluminum or aluminum alloy as the material and adopt the extrusion process to form the heat sink. The thermal diffusion coefficient of aluminum or aluminum alloy is much smaller than that of copper, and a small volume of power element generates a large amount of heat rapidly and concentratedly. Without the rapid lateral diffusion of the copper base plate, the heat cannot be rapidly diffused to the entire heat sink, and the heat sink cannot achieve the maximum area heat dissipation efficiency.

[0006] In another type of heat dissipation module, in order to quickly disperse a large amount of concentrated heat to a larger area of ​​the heat sink, the manufacturer replaces the original copper base plate with a copper vapor chamber, welds or attaches the heat-generating power element and ceramic substrate to the heat absorption surface of the vapor chamber, and the heat sink is adhered to the heat dissipation surface of the vapor chamber through thermal conductive paste. When a large amount of heat source is rapidly generated from the power element and conducted to the vapor chamber, the working fluid in the internal space of the vapor chamber rapidly absorbs the heat and rapidly vaporizes to form steam. Since the vapor chamber is connected to the heat sink on one side, when the steam rises rapidly and contacts the relatively cold surface of the external heat sink, the steam condenses to become the working fluid, and this phase change circulation absorbs and releases a large amount of heat. Compared with the use of the traditional copper base plate, the vapor chamber can diffuse a large amount of heat source that is more rapidly concentrated to a larger area of ​​the heat sink, and obtain a larger heat dissipation area to perform faster heat dissipation.

[0007] Vapor chambers utilize the phase change of the working fluid in a sealed working chamber to quickly dissipate heat, and are currently the most efficient heat dissipation method. The purpose of rapid heat dissipation is achieved by using the large amount of latent heat of vaporization involved in the process in which the working fluid in the near-vacuum chamber rapidly vaporizes and condenses. The thermal conductivity efficiency of vapor chambers is 10,000W / (m 2 1. ·°C) or more, which is several tens of times higher than the thermal conductivity efficiency of conventional air convection or liquid convection. When the above heat sink is installed in a vapor chamber to form a heat dissipation module, the thermal conductive paste applied between the vapor chamber and the heat sink becomes a large thermal resistance, and the high thermal conductivity coefficient of the vapor chamber cannot be effectively utilized. Summary of the Invention [Problem to be solved by the invention]

[0008] In view of the above problems, the present invention provides an integrated heat dissipation module structure, which is a highly efficient heat dissipation module structure that integrates a heat sink and a vapor chamber. More specifically, the integrated heat dissipation module structure of the present invention is manufactured by integrating the heat dissipation structure of the heat sink and the metal top cover plate of the vapor chamber by integral molding using the same metal sheet, thereby eliminating the thermal resistance existing in the thermal conductive paste with low thermal conductivity efficiency between the vapor chamber and the heat sink, and improving the heat dissipation efficiency. At the same time, the improvement in heat dissipation efficiency effectively reduces the deformation stress caused by temperature between the ceramic substrate and the vapor chamber. The integrated heat dissipation module structure provided by the present invention integrates the heat sink and the vapor chamber into one, eliminating the interface originally existing between the heat sink and the heat vapor chamber, and eliminating the thermal resistance caused by the use of the thermal conductive paste. In addition, the integrated heat dissipation module structure of the present invention can directly fix the power element or the ceramic substrate to the heat absorption surface of the vapor chamber, without the need for a thermal conductive medium such as a thermal conductive paste, and can further eliminate the thermal resistance between the heat source and the heat dissipation module, and can further effectively improve the heat dissipation efficiency.

[0009] The integrated heat dissipation module structure of the present invention can be manufactured by metal processing methods such as stamping, extrusion, milling, casting, forging, etc., and can also be processed and shaped by cold forging forming method on metal sheet / block (e.g. copper), and since cold forging forming is adopted and there is no need to heat forge metal in advance and then anneal it as in the general forging method, the internal grain structure of the metal processed and shaped by the cold forging method does not cause pores and structure enlargement due to annealing, which reduces the thermal conductivity coefficient. That is, since the metal after cold forging does not go through a heating process, the internal grain structure still maintains a considerable density, and the metal after forging has the additional advantage of improved rigidity and density, and the thermal conductivity coefficient and thermal diffusion coefficient of the metal can be further improved after testing. [Means for solving the problem]

[0010] According to an embodiment of the present invention, there is provided an integrated heat dissipation module structure, comprising at least a metal top cover plate, a metal bottom cover plate, a working space, an intake channel, a capillary structure and a working fluid. The metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame of suitable height is provided around the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other. The metal bottom cover plate includes a heat absorption outer surface and an evaporation inner surface, the heat absorption outer surface has a screw hole for fixing a heat dissipation electronic component, a lower frame of suitable height is provided around the evaporation inner surface, the lower frame is provided with a lower channel groove, and the evaporation inner surface has a plurality of lower grooves arranged parallel to each other, a plurality of support structures protruding between the lower grooves, and a screw hole protrusion corresponding to the screw hole, the screw hole protrusion recessed from the heat absorption outer surface toward the evaporation inner surface and protruding into the evaporation inner surface but not penetrating, and the height of the screw hole protrusion is equal to or less than the height of the support structure. The working space is an airtight space formed by joining the upper frame of the metal top cover plate and the lower frame of the metal bottom cover plate to each other, the condensation inner surface of the metal top cover plate and the evaporation inner surface of the metal bottom cover plate face each other, and the arrangement of the upper groove and the lower groove can be mapped to each other and overlapped to align, and a plurality of support structures protrude and extend from the evaporation inner surface and abut between the upper groove of the condensation inner surface to support it. The intake channel is formed by joining the upper channel groove and the lower channel groove correspondingly, and draws air into the working space. A capillary structure is installed in the lower groove or in the upper groove and the lower groove. A working fluid is present in the working space and the capillary structure.

[0011] According to an embodiment of the present invention, there is provided an integrated heat dissipation module structure, comprising at least a metal top cover plate, a metal bottom cover plate, a working space, an intake channel, a capillary structure and a working fluid. The metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame of a suitable height is provided around the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other. The metal bottom cover plate includes a heat absorption outer surface and an evaporation inner surface, the heat absorption outer surface has a plurality of screw holes for fixing a plurality of heat dissipation electronic components, a lower frame of a suitable height is provided around the evaporation inner surface, the lower frame is provided with a lower channel groove, and the evaporation inner surface has a plurality of lower grooves arranged parallel to each other and a plurality of screw hole protrusions corresponding to the plurality of screw holes, the screw hole protrusions are recessed from the heat absorption outer surface toward the evaporation inner surface and protrude into the evaporation inner surface but do not penetrate. The working space is an airtight space formed by joining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate to each other, the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate face each other, and the arrangement of the upper groove and the lower groove can be mapped to each other and overlapped to align, and a plurality of screw hole protrusions protrude and extend from the evaporation inner surface and abut against the condensation inner surface to support it. The intake channel is formed by joining the upper channel groove and the lower channel groove correspondingly, and draws air into the working space. A capillary structure is installed in the lower groove or in the upper groove and the lower groove. A working fluid is present in the working space and the capillary structure. Effect of the Invention

[0012] The integrated heat dissipation module structure of the present invention is manufactured by integrating the heat dissipation structure of the heat sink and the metal top cover plate of the vapor chamber by one-piece molding using the same metal sheet, thereby eliminating the thermal resistance existing in the thermal conductive paste with low thermal conductivity between the vapor chamber and the heat sink, and improving the heat dissipation efficiency. At the same time, the improvement of the heat dissipation efficiency also effectively reduces the deformation stress caused by temperature between the ceramic substrate and the vapor chamber. The integrated heat dissipation module structure provided by the present invention integrates the heat sink and the vapor chamber into one, eliminating the interface originally existing between the heat sink and the heat vapor chamber, and eliminating the thermal resistance caused by the use of the thermal conductive paste. In addition, the integrated heat dissipation module structure of the present invention can directly fix the power element or the ceramic substrate to the heat absorption surface of the vapor chamber, without the need for a thermal conductive medium such as a thermal conductive paste, and can further eliminate the thermal resistance between the heat source and the heat dissipation module, and can further effectively improve the heat dissipation efficiency. [Brief description of the drawings]

[0013] [Figure 1] 1 is an integrated heat dissipation module structure according to an embodiment of the present invention; [Diagram 2] 1 is a cross-sectional view of an integrated heat dissipation module structure according to one embodiment of the present invention; [Diagram 3] 2 is a structural diagram of a metal top cover plate of an integrated heat dissipation module structure according to one embodiment of the present invention; [Figure 4] 2 is a structural diagram of a metal bottom cover plate of an integrated heat dissipation module structure according to one embodiment of the present invention; [Diagram 5] 4 is an integrated heat dissipation module structure according to another embodiment of the present invention. [Figure 6] FIG. 4 is a structural diagram of a metal bottom cover plate of an integrated heat dissipation module structure according to another embodiment of the present invention; [Figure 7] 4 is an integrated heat dissipation module structure according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiment of the integrated heat dissipation module structure of the present invention will be described with reference to the related drawings, and the dimensions and proportions of each component in the drawings may be exaggerated or reduced for clarity and convenience of the description of the drawings. In the following description and / or claims, the technical terms used should be interpreted in the meaning well known and commonly used in the art, and for ease of understanding, the same components in the following embodiments are labeled with the same reference numerals. The term "about" used in this specification generally refers to an actual value being within ±10%, 5%, 1% or 0.5% of a specific value or range. The term "about" used in this specification refers to an actual value being within an acceptable standard error of the mean value, and is determined by those skilled in the art. Except for the embodiments, or unless otherwise clearly stated, the ranges, quantities, values ​​and percentages used herein should all be understood to be modified by "about". Therefore, unless otherwise stated, the values ​​or parameters disclosed in this specification and claims are all approximate values ​​and can be changed as necessary.

[0015] 1 to 4 are explanatory diagrams of an integrated heat dissipation module structure 10 according to an embodiment of the present invention. As shown in the drawings, the integrated heat dissipation module structure 10 of the present invention includes at least a metal top cover plate 100 including a heat dissipation outer surface 110 and a condensation inner surface 120, the heat dissipation outer surface 110 has a plurality of columnar heat dissipation structures 111, an upper frame 122 of an appropriate height is provided around the condensation inner surface 120, an upper channel groove 123 is provided on the upper frame, and the condensation inner surface 120 has a plurality of upper grooves 121 arranged parallel to each other; a heat absorption outer surface 210 and an evaporation inner surface 220, the heat absorption outer surface 210 and the evaporation inner surface 220 are provided on the heat absorption outer surface 210 and the evaporation inner surface 220. 10 has a screw hole 211 for fixing a heat dissipating electronic component, a lower frame 222 of an appropriate height is provided around an evaporation inner surface 220, a lower channel groove 223 is provided in the lower frame 222, and the evaporation inner surface 220 has a plurality of lower grooves 221 arranged parallel to each other, a plurality of support structures 224 protruding between the lower grooves 221, and a screw hole protrusion 225 corresponding to the screw hole 211, the screw hole protrusion 225 being recessed from the heat absorbing outer surface 210 toward the evaporation inner surface 220, 20 but does not penetrate, and the height of the screw hole protrusion portion 225 is equal to or lower than the height of the support structure 224. The metal bottom cover plate 200 is an airtight space formed by joining the upper frame 122 of the metal top cover plate 100 and the lower frame 222 of the metal bottom cover plate 200 to each other, the condensation inner surface 120 of the metal top cover plate 100 and the evaporation inner surface 220 of the metal bottom cover plate 200 face each other, and the arrangement of the upper groove 121 and the lower groove 221 can be aligned by mapping and overlapping each other, The multiple support structures 224 include a working space 300 that protrudes and extends from the evaporative inner surface 220 and abuts between the upper grooves 121 of the condensing inner surface 120 to support it, an intake channel 400 that is formed by correspondingly joining the upper channel grooves 123 and the lower channel grooves 223 and draws air into the working space 300, a capillary structure 500 that is installed in the lower grooves 221 or in the upper grooves 121 and the lower grooves 221, and a working fluid present in the working space 300 and the capillary structure 500.

[0016] In one embodiment, the upper frame 122 and the lower frame 222 of the integrated heat dissipation module structure 10 of the present invention further have solder joint grooves 1010 for soldering the metal top cover plate 100 and the metal bottom cover plate 200 to form the integrated heat dissipation module structure 10 of the present invention.

[0017] 2 and 3, in one embodiment, the integrated heat dissipation module structure 10 of the present invention is characterized by the shape and columnar heat dissipation structures 111 of the metal top cover plate 100, which are not attached externally but directly integrally formed from the same metal sheet (or metal block), that is, the entire metal top cover plate 100 is manufactured by integrally molding a metal sheet (or metal block). More specifically, the multiple columnar heat dissipation structures 111 of the heat dissipation outer surface 110 of the metal top cover plate 100 of the integrated heat dissipation module structure 10 of this embodiment are directly formed on the heat dissipation outer surface 110, cannot be separated from the heat dissipation outer surface 110 of the metal top cover plate 100, and have no heterogeneous or homogeneous boundary surface, and are not adhered to the heat dissipation surface of the vapor chamber with heat dissipation paste as in the commonly seen prior art, nor are the heat dissipation structures formed on the heat dissipation surface of the vapor chamber by welding or sintering. In other words, the integrated heat dissipation module of the present invention forms the heat dissipation structure directly on the metal top cover plate of the vapor chamber, thereby eliminating the foreign interface between the heat sink and the vapor chamber and the thermal resistance associated therewith, thereby improving heat dissipation efficiency.

[0018] 2 and 4, in one embodiment, the integrated heat dissipation module structure 10 of the present invention is characterized by the shape and structure of the metal under cover plate 200, which is directly and integrally formed from the same metal sheet (or metal block). In other words, the multiple support structures 224 and screw hole protrusions 225 of the evaporation inner surface 220 of the metal under cover plate 200 of the integrated heat dissipation module structure 10 of this embodiment are directly formed on the evaporation inner surface 220, are made of the same metal as the evaporation inner surface 220 of the metal under cover plate 200, cannot be separated, and do not have any heterogeneous or homogeneous interface, and do not sinter the support structures 224 to the evaporation inner surface 220 by the commonly seen sintering of the prior art.

[0019] Generally speaking, the method for manufacturing the integrally formed metal top cover plate 100 and metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention as described above can adopt an etching process or a combined machining process (such as the integration of milling and stamping or extrusion processes). The advantage of the etching process is that it can etch more complex structures, and it is generally used for products that are difficult to manufacture by traditional machining processes. The advantage of the combined machining process is that most of the processes used are mature manufacturing methods, and can be produced without the need for much development. However, the etching process is relatively time-consuming, and there is a problem that the processed surface is not flat and requires secondary processing, and the combined machining process requires relatively many steps and time to produce and manufacture.

[0020] In one embodiment, the integrated heat dissipation module structure 10 of the present invention adopts cold forging to manufacture the shape and structure of the metal top cover plate 100 and the metal bottom cover plate 200, and can be modified by combining CNC processes. Different from the etching process or the combined machining process, the cold forging method places the metal sheet (or metal block) to be processed into a female die, and then continuously forges and shapes the metal sheet with a male die at room temperature. Those skilled in the art will understand that the cold forging method does not require preheating, softening and annealing the metal during the forging process as in the general stamping process, so the internal crystal grain structure of the metal after forging will cause holes and structure enlargement due to annealing, which will reduce the thermal conductivity coefficient. Since the metal after cold forging has not undergone a heating process, its internal grain structure can still maintain a considerable density, and defects such as internal pores can be reduced. The metal surface after forging is flatter, and has the advantages of improved rigidity and density and less deformation. After testing, it has been found that the thermal conductivity coefficient and thermal diffusion coefficient of the metal after forging are higher than those before forging. That is, in this embodiment, the heat dissipation efficiency of the integrated heat dissipation module structure of the present invention is higher than that of the general conventional process.

[0021] In one embodiment, the metal top cover plate 100 of the integrated heat dissipation module structure 10 of the present invention is manufactured by cold forging, and its characteristic is that the shape and structural features contained in the above-mentioned metal top cover plate 100 are all directly formed in the same metal sheet by cold forging, including a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100.

[0022] In one embodiment, the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention is manufactured by cold forging, and its feature is that the shape and structural features included in the above-mentioned metal bottom cover plate 200 are all directly formed on the same metal sheet by cold forging, including the plurality of protruding support structures 224 and the screw hole protrusions 225 on the evaporation inner surface 220 of the metal bottom cover plate 200, i.e., like the same metal top cover plate 100, the plurality of protruding support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200 are not produced by an external method or a conventional sintering method, but are integrally formed with the metal top cover plate by forging. In one embodiment, the support structure 224 among the plurality of protrusions is a columnar structure.

[0023] In one embodiment, the metal top cover plate 100 and the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of a metal sheet (e.g., pure copper) with high thermal conductivity and thermal diffusion coefficient, and the above structure is integrally formed by cold forging. In one embodiment, the metal sheet is pure copper.

[0024] As can be understood by those skilled in the art, in the above embodiment, when the metal top cover plate 100 and the metal bottom cover plate 200 are manufactured by cold forging using pure copper as a material, the pure copper material is continuously forged in a mold at room temperature, and the physical properties of the material of the obtained metal top cover plate 100 and the metal bottom cover plate 200, such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, are all higher than those of the pure copper material that has not undergone cold forging, and at the same time, are higher than those of the metal top cover plate 100 and the metal bottom cover plate 200 obtained by other manufacturing methods (such as etching, stamping, extrusion, or general forging processes). In other words, after the pure copper material undergoes cold forging, it has relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, which are different from the material properties obtained by other processing means.

[0025] For example, the inventor of the present invention, in another disclosure, fabricated the metal upper cover plate and the metal lower cover plate of the vapor chamber by cold forging, and commissioned a third measurement institute (Yuanhe) to measure the physical properties of the material after cold forging, such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, and compared the obtained values ​​with the material properties after a conventional composite processing process (combining conventional stamping and CNC processes), as shown in the following Table (1). As can be understood by those skilled in the art, the cold forging method imparts relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient to the material due to the characteristics of the process, and the degree of increase in these physical properties is related to the number of forgings and the magnitude of force required in the cold forging process required by the material, and the more the number of forgings and the greater the force, the higher the above values ​​become, so that after cold forging, the above values ​​are all better than those of unprocessed or general conventionally processed materials, and have a greater advantage over the conventional composite processing method.

[0026] [Table 1]

[0027] In one embodiment, the metal top cover plate 100 and the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper having a relatively high thermal conductivity coefficient and thermal diffusion coefficient, and the metal top cover plate 100 and the metal bottom cover plate 200 manufactured after cold forging have a Vickers hardness of 90HV or more, for example, 90HV, 95HV, 100HV or 105HV.

[0028] In another embodiment, the metal top cover plate 100 and the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with a relatively high thermal conductivity coefficient and thermal diffusion coefficient, and the metal top cover plate 100 and the metal bottom cover plate 200 manufactured after cold forging have a thermal conductivity coefficient of 400 W / (m·K) or more, for example, 400 W / (m·K), 405 W / (m·K), 408 W / (m·K) or 410 W / (m·K).

[0029] In another embodiment, the metal top cover plate 100 and the metal bottom cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with a relatively high thermal conductivity coefficient and thermal diffusion coefficient, and the metal top cover plate 100 and the metal bottom cover plate 200 manufactured after cold forging have a length of 90 mm. 2 / sec or more, e.g., 90 mm 2 / sec, 95mm 2 / sec, 100mm 2 / sec or 105mm 2 / sec thermal diffusion coefficient.

[0030] The integrated heat dissipation module structure 20 in FIG. 5 is another embodiment of the integrated heat dissipation module structure 10 in FIG. 1 of the present invention. The heat absorption outer surface 210 of the metal lower cover plate 201 further has a plurality of screw holes 211 used for fastening a plurality of heat dissipation electronic components in contact with the heat absorption outer surface 210. The plurality of screw holes 211 are recessed from the heat absorption outer surface 210 in the direction of the evaporation inner surface 220 and protrude into the evaporation inner surface 220, forming a plurality of screw hole protrusions 225, but do not penetrate, and the height of the screw hole protrusions 225 is less than or equal to the height of the support structure 224. In one embodiment, when fastening a plurality of heat dissipation electronic components to the heat absorption outer surface 210 with screws through the screw holes 211, the heat dissipation electronic components can be in close contact with the heat absorption outer surface 210, improving the heat dissipation efficiency. Of course, adding a heat conduction material with good heat conduction efficiency, such as heat conduction paste or graphite flakes, between the heat dissipation electronic component and the heat absorption outer surface 210 can also reduce the thermal resistance caused by the non-flat contact surface.

[0031] In any one of the above embodiments, after the metal upper cover plate 100 or 101 and the metal lower cover plate 200 or 201 of the integrated heat dissipation module structure 10 or 20 are joined to each other, they are joined by welding.

[0032] In any one of the above embodiments, the working fluid used in the integrated heat dissipation module structure 10 or 20 of the present invention is pure water.

[0033] In any one of the above embodiments, the working space 300 described in the integrated heat dissipation module structure 10 or 20 of the present invention, after intake, has an air pressure less than 1×10 ‐3 Torr, for example, 1×10 ‐3 Torr, 1×10 ‐4 Torr or 1×10 ‐5 Torr.

[0034] FIG. 7 shows an integrated heat dissipation module structure 30 according to another embodiment of the present invention. As shown in the figure, the integrated heat dissipation module structure 30 of the present invention includes a heat dissipation outer surface 110 and a condensation inner surface 120, the heat dissipation outer surface 110 has a plurality of columnar heat dissipation structures 111, and an upper frame 122 of a suitable height is provided around the condensation inner surface 120, the upper frame 122 is provided with an upper channel groove 123, and the condensation inner surface 120 has a plurality of upper grooves 121 arranged parallel to each other on the metal top cover plate 101; a heat absorption outer surface 210 and an evaporation inner surface 220, the heat absorption outer surface 210 has a plurality of screw holes 211 for fixing a plurality of heat dissipation electronic components, a lower frame 222 of a suitable height is provided around the evaporation inner surface 220, the lower frame 222 is provided with a lower channel groove 223, and the evaporation inner surface 220 has a plurality of screw hole protrusions 225 corresponding to the plurality of lower grooves 221 and the plurality of screw holes 211 arranged parallel to each other on the evaporation inner surface 220, the screw hole protrusions 225 are arranged from the heat absorption outer surface 210 to the evaporation inner surface 220 The metal bottom cover plate 202 is recessed and protrudes into but does not penetrate the evaporation inner surface 220, and the upper frame 122 of the metal top cover plate 101 and the lower frame 222 of the metal bottom cover plate 202 are joined together to form an airtight space. The condensation inner surface 120 of the metal top cover plate 101 and the evaporation inner surface 220 of the metal bottom cover plate 202 face each other, and the arrangement of the upper groove 121 and the lower groove 221 can be aligned by mapping and overlapping each other, and a plurality of screw hole protrusions 22 5 comprises at least a working space 300 that protrudes and extends from the evaporative inner surface 220 and abuts against and supports the condensing inner surface 120, an intake channel 400 that is formed by correspondingly joining an upper channel groove 123 and a lower channel groove 223 and draws air into the working space 300, a capillary structure 500 that is installed in the lower groove 221 or in the upper groove 121 and the lower groove 221, and a working fluid present in the working space 300 and the capillary structure 500.

[0035] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the entire metal upper cover plate 101 includes a columnar passion structure 111 manufactured by integrally molding a metal sheet (or a metal block), and the entire metal lower cover plate 202 includes a plurality of screw hole protrusions manufactured by integrally molding a metal sheet.

[0036] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the screw holes 211 have at least ten pieces, and the screw hole protrusions 225 have the same number correspondingly.

[0037] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the material of the metal top cover plate 101 and the metal bottom cover plate 202 is pure copper.

[0038] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the metal top cover plate 101 and the metal bottom cover plate 202 are joined together and then coupled by welding.

[0039] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the working fluid is pure water.

[0040] In one embodiment, in the integrated heat dissipation module structure 30 of the present invention, the air pressure in the working space 300 is 1×10 ‐3 Less than 1×10 ‐3 Thor, 1×10 ‐4 Thor or 1×10 ‐5 It's Thor.

[0041] Of course, the above embodiments are for illustrative purposes only and do not limit the scope of the present invention, and any equivalent modifications or variations based on the integrated heat dissipation module structure of the above embodiments should still fall within the protection scope of the present invention.

[0042] In addition, most of the conventional heat dissipation modules adopt an external heat sink, and such a combination adds a thermal resistance of the thermal conduction interface in front of the heat sink, which reduces the heat dissipation efficiency. The integrated heat dissipation module structure of the present invention integrally molds the upper cover of the vapor chamber and the heat sink, so that the ultra-high heat dissipation efficiency of the vapor chamber is not limited by the thermal resistance of the conductive interface, and the heat dissipation efficiency can be further improved. In addition, the integrated heat dissipation module structure of the present invention can be manufactured by cold forging in addition to being manufactured by an etching process or a composite processing process (such as casting, forging, milling, punching or extrusion), which can further refine the grain structure of the material and reduce the defects of the internal pores, so that the material can obtain excellent mechanical properties such as relatively high strength, deformation resistance and fatigue resistance, and can improve the heat conduction efficiency and heat diffusion efficiency of the material, and the integrated heat dissipation module formed is superior in heat dissipation efficiency performance, durability and reliability to general heat dissipation modules of similar structures.

[0043] In view of the above, it is found that the present invention overcomes the problems of the prior art, truly achieves the desired effects, and is not something that a person skilled in the art could easily come up with. It is inventive, practical, and meets the requirements of the patent claims. Therefore, we have filed a patent application in accordance with the law, and we sincerely hope that your office will grant the patent application of the present invention in order to encourage invention.

[0044] The above description is merely illustrative and not limiting. Any other equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the scope of the following claims. [Explanation of symbols]

[0045] 10 Integrated heat dissipation module structure 20 Integrated heat dissipation module structure 30 Integrated heat dissipation module structure 100 Metal top cover plate 101 Metal top cover plate 110 Heat dissipation outer surface 111 Columnar heat dissipation structure 120 Condensation inner surface 121 Kamimizo 122 Upper Frame 123 Upper channel groove 200 Metal lower cover plate 201 Metal lower cover plate 202 Metal lower cover plate 210 Endothermic outer surface 211 Screw hole 220 Evaporation inner surface 221 Lower groove 222 Lower Frame 223 Lower Channel Groove 224 Support structure 225 Screw hole protrusion 300 working space 400 Intake Channel 500 capillary structure 1010 Solder joint groove

Claims

1. A metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame having an appropriate height is provided around the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other; a metal lower cover plate including a heat absorbing outer surface and an evaporative inner surface, the heat absorbing outer surface having a screw hole for fixing a heat dissipating electronic component, a lower frame having an appropriate height provided around the evaporative inner surface, the lower frame having a lower channel groove, the evaporative inner surface having a plurality of lower grooves arranged parallel to each other, a plurality of support structures protruding between the lower grooves, and a screw hole protrusion corresponding to the screw hole, the screw hole protrusion being recessed from the heat absorbing outer surface toward the evaporative inner surface and protruding into the evaporative inner surface but not penetrating it, and the height of the screw hole protrusion being equal to or less than the height of the support structure; an airtight space formed by joining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate to each other, the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate face each other, and the upper groove and the lower groove are arranged in positions facing each other, and the support structure protrudes and extends from the evaporation inner surface and abuts between the upper grooves of the condensation inner surface to support it; an intake channel configured by joining the upper channel groove and the lower channel groove correspondingly, for drawing air into the working space; A capillary structure disposed in the lower groove or in the upper groove and the lower groove; a working fluid present within the working space and the capillary structure; An integrated heat dissipation module structure.

2. The integrated heat dissipation module structure as described in claim 1, wherein the support structure is a columnar structure.

3. The integrated heat dissipation module structure of claim 1, wherein the working fluid is pure water.

4. The integrated heat dissipation module structure of claim 1, wherein the air pressure in the working space is less than 1 x 10-3 Torr.

5. An integrated heat dissipation module structure as described in claim 1, wherein the heat absorbing outer surface of the metal bottom cover plate further has a plurality of screw holes for fixing a plurality of the heat dissipating electronic components, and the evaporative inner surface has a plurality of screw hole protrusions corresponding to the screw holes, the screw hole protrusions are recessed from the heat absorbing outer surface toward the evaporative inner surface and protrude into, but do not penetrate, the evaporative inner surface, and the height of the screw hole protrusions is equal to or less than the height of the support structure.

6. 2. The manufacturing method of the integrated heat dissipation module structure of claim 1, wherein the entire metal upper cover plate includes the columnar heat dissipation structure and is formed by cold forging a metal sheet into a single piece, and the entire metal lower cover plate includes the support structure and the screw hole protrusion portion and is formed by cold forging a metal sheet into a single piece.

7. The method of claim 6 , wherein the metal sheet is pure copper.

8. The manufacturing method described in claim 6, wherein the metal sheet is pure copper, and the metal upper cover plate and the metal lower cover plate have a Vickers hardness of 90 HV or more.

9. The manufacturing method according to claim 6, wherein the metal sheet is made of pure copper, and the metal upper cover plate and the metal lower cover plate have a thermal conductivity coefficient of 400 W / (m·K) or more.

10. The metal sheet is made of pure copper, and the metal top cover plate and the metal bottom cover plate are 90 mm ２ The method according to claim 6, wherein the thermal diffusion coefficient is greater than or equal to 1 / sec.

11. The method of claim 6, wherein the metal top cover plate and the metal bottom cover plate are joined together and then bonded by welding.

12. A metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame having an appropriate height is provided around the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other; a metal lower cover plate including a heat absorbing outer surface and an evaporative inner surface, the heat absorbing outer surface having a plurality of screw holes for fixing a plurality of heat dissipating electronic components, a lower frame having an appropriate height provided around the evaporative inner surface, the lower frame having a lower channel groove, and the evaporative inner surface having a plurality of lower grooves arranged parallel to each other and a plurality of screw hole protrusions corresponding to the plurality of screw holes, the screw hole protrusions being recessed from the heat absorbing outer surface toward the evaporative inner surface and protruding into but not penetrating the evaporative inner surface; a working space formed by joining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate to each other, the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate face each other, the upper groove and the lower groove are arranged in positions facing each other, and the screw hole protrusion protrudes and extends from the evaporation inner surface and abuts against and supports the condensation inner surface; an intake channel configured by joining the upper channel groove and the lower channel groove correspondingly, for drawing air into the working space; A capillary structure disposed in the lower groove or in the upper groove and the lower groove; a working fluid present within the working space and the capillary structure; An integrated heat dissipation module structure.

13. The integrated heat dissipation module structure of claim 12, wherein the entire metal upper cover plate includes the columnar heat dissipation structure manufactured by integrally molding a metal sheet, and the entire metal lower cover plate includes the screw hole protrusion portion manufactured by integrally molding a metal sheet.

14. The integrated heat dissipation module structure according to claim 12 , wherein the screw holes have at least ten pieces, and the screw hole protrusions have a corresponding number of the same pieces.

15. The integrated heat dissipation module structure as claimed in claim 12 , wherein the material of the metal top cover plate and the metal bottom cover plate is pure copper.

16. The integrated heat dissipation module structure according to claim 12 , wherein the metal top cover plate and the metal bottom cover plate are joined together and then coupled by welding.

17. The integrated heat dissipation module structure as claimed in claim 12 , wherein the working fluid is pure water.

18. The air pressure in the work space is 1 x 10 ‐３ 13. The integrated heat dissipation module structure of claim 12, wherein the thermal expansion coefficient is less than 1 / 2 MPa.

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