CELL ASSEMBLY, METHOD FOR MANUFACTURING CELL ASSEMBLY, SOLAR CELL, AND METHOD FOR MANUFACTURING SOLAR CELL

Abstract

A cell aggregate (100) of a solar battery having a plurality of sub-segments (10) which serve as a plurality of solar battery cells by being divided, and having one rectilinear side in plan view, each of the plurality of sub-segments (10) comprising: a photoelectric conversion unit (2) having a main surface and is delineated by a delineation line (11) which is a straight line substantially parallel to one rectilinear side of the cell aggregate (100); a transparent conductive layer (3) provided to a region corresponding to each of the plurality of sub-segments (10) on the main surface of the photoelectric conversion unit (2) and having a first region and a second region which has a different position from the first region; a collector electrode (4) which includes a plating layer and is provided to the first region of the transparent conductive layer (3); and a transparent insulation layer (5) which is provided to the second region of the transparent conductive layer (3), wherein the photoelectric conversion unit (2) is exposed in a delineation region (111) which is a region along the delineation line (11) and including the delineation line (11).

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to Japanese Patent Application No. 2020-060126, the entire disclosure of which is incorporated herein by reference. [Technical field]

[0002] The present invention relates to a cell assembly that is the raw material for solar cells that are connected in a shingled manner to form a solar cell, a method for manufacturing the cell assembly, a solar cell formed from the cell assembly, and a method for manufacturing the solar cell. [Background technology]

[0003] Solar cells having various structures have been proposed in the past. One such solar cell is a solar module in which a plurality of rectangular solar cells are arranged, for example, like roofing shingles, with the long sides of adjacent solar cells overlapping each other and the ends of the solar cells connected to form a solar cell string (Patent Document 1). In this solar module, the solar cells are arranged overlapping each other to eliminate gaps between adjacent solar cells. This improves the charging rate of the solar cells in the solar module and increases the module efficiency.

[0004] It is also known that a plating method is used when forming a metal electrode of a solar cell (Patent Document 2). This solar cell includes a photoelectric conversion section including a silicon substrate, a first transparent conductive layer and a transparent resin layer laminated in order on the light receiving surface side of the photoelectric conversion section, and a second transparent conductive layer and a transparent resin layer laminated in order on the back surface side of the photoelectric conversion section. In this solar cell, the transparent resin layer has an opening, and a part of the surface of the first transparent conductive layer and the surface of the second transparent conductive layer is exposed from the opening of the transparent resin layer. In addition, this solar cell includes a plated metal electrode laminated on a part of the surface of the first transparent conductive layer and the surface of the second transparent conductive layer exposed from the opening of the transparent resin layer. In this solar cell, the transparent resin layer functions as a mask when forming the plated metal electrode and also functions as a protective layer for the completed solar cell.

[0005] When manufacturing the solar cell, the plated metal electrode located on the light-receiving surface side is formed by first laminating a first transparent conductive layer and a transparent resin layer having an opening in that order on the photoelectric conversion section. The shape of the opening in the transparent resin layer is formed to correspond to the shape of the plated metal electrode (i.e., the pattern of the plated metal electrode). Furthermore, the plated metal electrode is precipitated by electrolytic plating on the first transparent conductive layer exposed from the opening in the transparent resin layer. The same process is also carried out when forming the plated metal electrode located on the back surface side. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japan Special Publication No. 2017-517145 [Patent Document 2] International Publication No. 2019 / 003818 Summary of the Invention [Problem to be solved by the invention]

[0007] Incidentally, it is conceivable to apply solar cells having the above-mentioned plated metal electrodes to a solar module in which solar cells are stacked as described above, i.e., a solar module formed by shingling connection. In this case, in order to obtain a plurality of rectangular solar cells, it is necessary to cut the cell assembly having the above-mentioned plated metal electrodes by laser cutting. However, since the transparent resin layer in the cell assembly absorbs the laser, this transparent resin layer cannot be completely cut, and it is difficult to obtain divided solar cells.

[0008] The present invention aims to provide a cell assembly, which is the raw material for solar cells that are connected in a shingled manner to form a solar cell, a cell assembly that includes metal electrodes formed by a plating method and that can be easily cut, a method for manufacturing the cell assembly, a solar cell formed from the cell assembly, and a method for manufacturing the solar cell. [Means for solving the problem]

[0009] The solar cell assembly of the present invention is a solar cell cell assembly having a plurality of small partitions each of which becomes a plurality of solar cell cells by being divided, and one side of which is straight in a planar view, wherein each of the plurality of small partitions is defined by a demarcation line that is a straight line approximately parallel to the one straight side of the cell assembly, and the solar cell assembly comprises: a photoelectric conversion unit having a main surface; a transparent conductive layer provided in a region of the main surface of the photoelectric conversion unit corresponding to each of the plurality of small partitions, and having a first region and a second region positioned differently from the first region; a collecting electrode provided on the first region of the transparent conductive layer, the collecting electrode including a plating layer; and a transparent insulating layer provided on the second region of the transparent conductive layer, wherein the photoelectric conversion unit is exposed in the demarcation region which is along the demarcation line and which includes the demarcation line.

[0010] The method for manufacturing a solar cell assembly of the present invention is a method for manufacturing a solar cell assembly having a plurality of small partitions each of which becomes a plurality of solar cell cells by being divided and one side of which is straight in a planar view, wherein each of the plurality of small partitions is defined by a demarcation line that is a straight line approximately parallel to the one side of the cell assembly, the method including the steps of: preparing a photoelectric conversion unit having a main surface; forming a transparent conductive layer in an area of ​​the main surface of the photoelectric conversion unit corresponding to each of the plurality of small partitions; forming a transparent insulating layer in the transparent conductive layer, the transparent insulating layer having an opening through which a portion of the transparent conductive layer is exposed; and forming a collecting electrode by a plating method on the transparent conductive layer exposed from the opening, wherein the steps of forming the transparent conductive layer, forming the transparent insulating layer, and forming the collecting electrode are performed so that the photoelectric conversion unit is exposed in a demarcation area that is along the demarcation line and includes the demarcation line.

[0011] The solar cell of the present invention is A solar cell string can be formed by connecting a plurality of solar cells to each other in a single ring, the solar cell having one straight side and an opposite straight side that is substantially parallel to the one straight side in a plan view, A photoelectric conversion portion having a main surface; a transparent conductive layer provided on a principal surface of the photoelectric conversion section, the transparent conductive layer having a first region and a second region positioned differently from the first region; a collecting electrode provided on the first region of the transparent conductive layer and including a plating layer; a transparent insulating layer provided on the second region of the transparent conductive layer, The photoelectric conversion portion is exposed at the one side and the opposite side.

[0012] The method for manufacturing a solar cell of the present invention is a method for manufacturing a solar cell using the cell assembly of the solar cell, and includes a step of cutting the cell assembly by applying a laser to the demarcation lines. [Brief description of the drawings]

[0013] [Figure 1A] FIG. 1A is a plan view of a cell assembly of a solar cell according to this embodiment. [Figure 1B] FIG. 1B is a bottom view of the cell assembly of the solar cell according to this embodiment. [Diagram 2] FIG. 2 is an enlarged cross-sectional view taken along the line II-II of FIG. 1A. [Figure 3A] FIG. 3A is a plan view of a photoelectric conversion unit of the cell assembly. [Figure 3B] FIG. 3B is an enlarged cross-sectional view taken along line III-III of FIG. 3A. [Figure 4A] FIG. 4A is a plan view of the photoelectric conversion section on which a transparent conductive layer is formed. [Figure 4B] FIG. 4B is a bottom view of the photoelectric conversion section on which a transparent conductive layer is formed. [Diagram 5] FIG. 5 is an enlarged cross-sectional view taken along the line VV in FIG. 4A. [Figure 6A] 6A is a plan view of the photoelectric conversion unit on which a transparent insulating layer is formed; [Figure 6B] FIG. 6B is a bottom view of the photoelectric conversion section on which a transparent insulating layer is formed. [Figure 7] FIG. 7 is an enlarged cross-sectional view taken along line VII-VII in FIG. 6A. [Figure 8A] FIG. 8A is a plan view of a solar cell according to this embodiment. [Figure 8B] FIG. 8B is a bottom view of the solar cell. [Figure 9] FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 8A. [Figure 10] FIG. 10 is a schematic cross-sectional view of a solar cell string using the solar cell. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present invention will be described below with reference to one embodiment and the drawings. In the following description, the term "solar cell" refers to each plate-shaped part that constitutes a "solar cell string." The drawings are schematic diagrams of the configuration of this embodiment and are different from design drawings. Therefore, the dimensional relationships in the drawings may not be correct.

[0015] As shown in Figs. 1A and 1B, a solar cell assembly 100 of this embodiment (hereinafter also simply referred to as "cell assembly 100") is a solar cell assembly having a plurality of small sections 10 which are each divided to become a plurality of solar cell cells 1. The cell assembly 100 also has one side (one side 100a) which is linear in plan view. Each of the multiple small sections 10 is defined by a demarcation line 11 which is a straight line substantially parallel to the one side 100a of the cell assembly 100.

[0016] As shown in FIG. 2, the cell assembly 100 includes a photoelectric conversion unit 2 having a main surface 20, a transparent conductive layer 3 provided in a region 200 of the main surface 20 of the photoelectric conversion unit 2 corresponding to each of the multiple small sections 10, a current collecting electrode 4 provided on a first region 31 of the transparent conductive layer 3 and including a plating layer 40, and a transparent insulating layer 5 provided on a second region 32 of the transparent conductive layer 3, the second region 32 being located differently from the first region 31. In the cell assembly 100 of this embodiment, each layer is stacked in the z-axis direction in FIG. 2. The photoelectric conversion unit 2 is exposed in a demarcated region 111 that is a region along a demarcation line 11 of the cell assembly 100 and that includes the demarcation line 11. The main surface 20 is a main surface that constitutes the plate-shaped surface of the photoelectric conversion unit 2. The photoelectric conversion unit 2 has side surfaces (end faces) as edges.

[0017] The cell assembly 100 of this embodiment has a plurality of demarcation lines 11 and a plurality of demarcation regions 111. Specifically, the cell assembly 100 has three demarcation lines 11 and three demarcation regions 111 (see FIGS. 1A and 1B). In the cell assembly 100, the demarcation lines 11 extend along the y-axis direction and are disposed at equal intervals in the x-axis direction.

[0018] The defined region 111 of this embodiment extends along the y-axis direction. The widths (e.g., dimensions in the x-axis direction) of the multiple defined regions 111 are all the same. The defined regions 111 extend on both sides of the defined line 11 in the x-axis direction. In each defined region 111, for example, the distance between the edge 111a located on one side of the defined region 111 in the x-axis direction (the right side in Figs. 1A and 2) and the defined line 11 is the same as the distance between the edge 111b located on the other side of the defined region 111 in the x-axis direction (the left side in Figs. 1A and 2) and the defined line 11. That is, the defined line 11 extends through the center of each defined region 111 in the width direction (e.g., the x-axis direction).

[0019] The photoelectric conversion unit 2 is, for example, a plate-shaped member. The photoelectric conversion unit 2 has a pn junction or a pin junction. The photoelectric conversion unit 2 of the present embodiment has a conductive type crystalline silicon substrate 21 (hereinafter also referred to as "silicon substrate 21") (see FIG. 2). The photoelectric conversion unit 2 also has a pn junction formed between conductive type silicon-based thin films 22 and 23. Further, the photoelectric conversion unit 2 of the present embodiment also has intrinsic silicon-based thin films 24 and 25 provided between the silicon substrate 21 and the conductive type silicon-based thin films 22 and 23.

[0020] The silicon substrate 21 is, for example, either an n-type crystalline silicon substrate or a p-type crystalline silicon substrate. The silicon substrate 21 of the present embodiment is, for example, an n-type single crystal silicon substrate.

[0021] A first conductive type silicon-based thin film 22 is provided on the first main surface 211 of the silicon substrate 21 (the upper surface of the silicon substrate 21 in FIG. 2). A second conductive type silicon-based thin film 23 is provided on the second main surface 212 of the silicon substrate 21 (the lower surface of the silicon substrate 21 in FIG. 2).

[0022] One of the first conductive type silicon-based thin film 22 and the second conductive type silicon-based thin film 23 is p-type and the other is n-type. The first conductive type silicon-based thin film 22 of the present embodiment is p-type. Also, the second conductive type silicon-based thin film 23 of the present embodiment is n-type. The film thicknesses of the first conductive type silicon-based thin film 22 and the second conductive type silicon-based thin film 23 are each 2 nm or more and 20 nm or less.

[0023] The transparent conductive layer 3 includes a first transparent conductive layer 33 provided on the first main surface 201 side of the photoelectric conversion unit 2 and a second transparent conductive layer 34 provided on the second main surface 202 side of the photoelectric conversion unit 2. The material of the transparent conductive layer 3 is, for example, a conductive metal oxide such as ITO (indium tin oxide). The film thickness of the transparent conductive layer 3 is, for example, 20 nm or more and 120 nm or less.

[0024] The current collecting electrode 4 is a patterned metal electrode. The current collecting electrode 4 of this embodiment is composed of a plating layer 40. Further, the current collecting electrode 4 of this embodiment has a first current collecting electrode 41 provided on the first main surface 201 of the photoelectric conversion unit 2 (the upper surface of the photoelectric conversion unit 2 in FIG. 2), and a second current collecting electrode 42 provided on the second main surface 202 (the lower surface of the photoelectric conversion unit 2 in FIG. 2).

[0025] For example, the current collecting electrode 4 has a plurality of finger electrodes 43 extending parallel to each other, and a bus bar electrode 44 extending so as to intersect (specifically, be orthogonal to) the finger electrodes 43 (see FIGS. 1A and 1B). In the current collecting electrode 4 of this embodiment, the finger electrodes 43 and the bus bar electrode 44 constitute a pattern electrode on the grid. The thickness of the current collecting electrode 4 is, for example, 10 μm or more and 30 μm or less.

[0026] The shape of the second current collecting electrode 42 is, for example, the same as the shape of the first current collecting electrode 41. Note that the shape of the second current collecting electrode 42 may be different from the shape of the first current collecting electrode 41.

[0027] The plating layer 40 is adjacent to the defined region 111 where the photoelectric conversion unit 2 is exposed. Specifically, the plating layer 40 is arranged side by side with the defined region 111 where the photoelectric conversion unit 2 is exposed in the x-axis direction.

[0028] The transparent insulating layer 5 functions as a mask when forming the plating layer 40. Further, the transparent insulating layer 5 also functions as a protective layer on the surface of the completed cell assembly 100 and the solar cell 1.

[0029] An opening 50 including the region where the current collecting electrode 4 is formed is provided in the transparent insulating layer 5 (see FIG. 2). That is, an opening 50 for exposing the first region 31 of the transparent conductive layer 3 is provided in the transparent insulating layer 5. Further, the transparent insulating layer 5 covers one end 36 of both ends of the transparent conductive layer 3 in the extending direction of the finger electrode 43 (the x-axis direction in FIG. 2) and exposes the other end 35.

[0030] The material of the transparent insulating layer 5 in this embodiment is, for example, a resin having optical transparency. This material is preferably a resin having thermosetting or photosetting properties. The thickness of the transparent insulating layer 5 is, for example, preferably 5 μm or more and 30 μm or less, and more preferably 8 μm or more and 20 μm or less. The thickness of the transparent insulating layer 5 is, for example, the distance from the surface of the transparent conductive layer 3 to the surface of the transparent insulating layer 5 at the place where the thickness is the greatest.

[0031] A method for manufacturing the cell assembly 100 having the above configuration includes the steps of preparing a photoelectric conversion unit 2 having a main surface 20, forming a transparent conductive layer 3 in regions 200 of the main surface 20 of the photoelectric conversion unit 2 corresponding to each of a plurality of small sections, forming a transparent insulating layer 5 having openings 50 in the transparent conductive layer 3 through which parts of the transparent conductive layer 3 are exposed, and forming a collecting electrode 4 by plating on the transparent conductive layer 3 exposed from the openings. In this manufacturing method, the steps of forming the transparent conductive layer 3, forming the transparent insulating layer 5, and forming the collecting electrode 4 are performed so that the photoelectric conversion unit 2 is exposed in the defined region 111. Each step will be specifically described below with reference to FIGS. 3 to 8.

[0032] 3A and 3B, the process of preparing the photoelectric conversion unit 2 includes a step of forming silicon-based thin films 22 and 23 on a silicon substrate 21. Specifically, the process of preparing the photoelectric conversion unit 2 includes a step of forming silicon-based thin films 24 and 25, in addition to the step of forming the silicon-based thin films 22 and 23.

[0033] The silicon substrate 21 is, for example, a 6-inch n-type single crystal silicon substrate. The silicon-based thin films 22, 23, 24, and 25 are provided on the entire first main surface 211 and the entire second main surface 212 of the silicon substrate 21. The silicon-based thin films 22, 23, 24, and 25 are formed by, for example, a plasma CVD method.

[0034] 4A, 4B, and 5, the step of forming the transparent conductive layer 3 includes a step of forming a first transparent conductive layer 33 on the first main surface 201 of the photoelectric conversion section 2, and a step of forming a second transparent conductive layer 34 on the second main surface 202 of the photoelectric conversion section 2. Specifically, the step of forming the transparent conductive layer 3 includes a step of forming the first transparent conductive layer 33 on the side opposite to the silicon substrate 21 side (side in contact with the silicon substrate 21) of the first conductivity type silicon-based thin film 22, and a step of forming the second transparent conductive layer 34 on the side opposite to the silicon substrate 21 side (side in contact with the silicon substrate 21) of the second conductivity type silicon-based thin film 23.

[0035] By the process of forming the transparent conductive layer 3, the transparent conductive layer 3 is formed into a rectangular shape extending in the y-axis direction. The transparent conductive layers 3 are also formed so as to be spaced apart from each other in the x-axis direction. As a result, the transparent conductive layer 3 is formed so as to expose a portion that becomes the defined region 111 of the cell assembly 100 in the photoelectric conversion unit 2. The transparent conductive layer 3 is formed by, for example, an MOCVD method or a sputtering method.

[0036] 6A, 6B, and 7, the process of forming the transparent insulating layer 5 includes a process of printing a resin solution on the transparent conductive layer 3, and a process of forming openings 50 in the printed resin layer to form the transparent insulating layer 5. This resin solution is, for example, an acrylic resin solution. This acrylic resin solution is adjusted so that the solution viscosity at room temperature (25°C) is 70 Pa s or more and 120 Pa s or less.

[0037] In addition, when the resin material constituting the transparent insulating layer 5 is a thermosetting or photocurable material, in the process of forming the transparent insulating layer 5, it is preferable to print a resin solution on the transparent conductive layer 3 by screen printing or the like, and then harden the transparent insulating layer 5 before the process of forming the collecting electrode 4.

[0038] In the step of forming the transparent insulating layer 5, the transparent insulating layer 5 is formed into a rectangular shape extending in the y-axis direction. The transparent insulating layers 5 are also formed so as to be spaced apart from one another (openings 50) in the x-axis direction. As a result, the transparent insulating layer 5 is formed so as to expose a portion of the photoelectric conversion unit 2 that will become the demarcated region 111 of the cell assembly 100.

[0039] The step of forming the collecting electrode 4 includes a step of forming a plating layer 40 by a plating method on the transparent conductive layer 3 exposed below the opening 50 of the transparent insulating layer 5 (see FIGS. 1A, 1B, and 2). Specifically, the step of forming the plating layer 40 includes a step of depositing a first plating layer by electrolytic plating on the transparent conductive layer 3 exposed below the opening 50 of the transparent insulating layer 5, and a step of depositing a second plating layer by electrolytic plating on the first plating layer. For example, Ni is used for depositing the first plating layer, and for example, Cu is used for depositing the second plating layer.

[0040] By the process of forming the collecting electrode 4, the collecting electrode 4 is formed to have a plurality of finger electrodes 43 extending parallel to one another and bus bar electrodes 44 extending to intersect (specifically, perpendicular to) the finger electrodes 43. The collecting electrode 4 is also formed on the transparent conductive layer 3 exposed below the opening 50 in the transparent insulating layer 5. As a result, the collecting electrode 4 is formed to expose a portion that will become the defined region 111 of the cell assembly 100 in the photoelectric conversion unit 2.

[0041] The cell assembly 100 manufactured by the above manufacturing method is cut to manufacture the solar cell 1. The manufacturing method of the solar cell 1 includes a step of cutting the cell assembly 100 by applying a laser to the demarcation lines 11.

[0042] 8A, 8B, and 9, the solar cell 1 has one straight side 1a and an opposite straight side 1b that is approximately parallel to the one side 1a. The solar cell 1 includes a photoelectric conversion section 2 having a main surface 20, a transparent conductive layer 3 provided on the main surface 20 of the photoelectric conversion section 2, a current collecting electrode 4 including a plating layer 40 provided on a first region 31 of the transparent conductive layer 3, and a transparent insulating layer 5 provided on a second region 32 different from the first region 31 of the transparent conductive layer 3, and the photoelectric conversion section 2 is exposed at the one side 1a and the opposite side 1b.

[0043] The solar cell 1 of this embodiment has a rectangular shape (approximately rectangular shape) in a plan view. The solar cell 1 is, for example, a bifacial solar cell.

[0044] Furthermore, as shown in Fig. 10, a solar cell string 101 can be configured by connecting a plurality of solar cells 1 to each other in a shingled manner. Note that the shingled connection refers to connecting adjacent solar cells 1, 1 in a state in which the first collector electrode 41 of one of the adjacent solar cell 1 and the second collector electrode 42 of the other solar cell 1 overlap each other. In this shingled connection, the collector electrodes 40 of the adjacent solar cell 1, 1 are connected to each other by a conductive adhesive 6 (see Fig. 10). This conductive adhesive 6 is, for example, a metal paste, specifically, a silver paste.

[0045] According to the above solar cell assembly 100, the photoelectric conversion unit 2 is exposed in the demarcation region 111 (see FIG. 2). In other words, where the demarcation line 11 is located (the demarcation region 111), the main surface 20 of the photoelectric conversion unit 2 is not covered by the transparent insulating layer 5 or the plating layer 40. Therefore, the cell assembly 100 can be easily cut by simply applying a laser to the demarcation line 11.

[0046] According to the manufacturing method of the cell assembly 100 of this embodiment, at the location of the demarcation line 11 (demarcation region 111), the main surface 20 of the photoelectric conversion body 2 is not covered by the transparent insulating layer 5 or the plating layer 40, so that a cell assembly 100 that can be easily cut can be manufactured by simply applying a laser to the demarcation line 11.

[0047] Moreover, the solar cell 1 of this embodiment can be easily obtained by applying a laser to portions of the main surface 20 of the photoelectric conversion section 2 of the solar cell cell assembly 100 that are not covered by the transparent insulating layer 5 or the plating layer 40, and dividing the cell assembly 100.

[0048] Furthermore, according to the manufacturing method of the solar cell 1 of this embodiment, a laser is applied to the portions of the photoelectric conversion section 2 of the solar cell cell assembly 100 that are not covered by the transparent insulating layer 5 or the plating layer 40, and the cell assembly 100 is divided, whereby the solar cell cell 1 can be easily obtained.

[0049] It should be noted that the cell assembly and solar cell of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the configuration of one embodiment can be added to the configuration of another embodiment, and part of the configuration of one embodiment can be replaced with the configuration of another embodiment. Furthermore, part of the configuration of one embodiment can be deleted.

[0050] In the cell assembly 100 of the above embodiment, the demarcation line 11 extends to the center of each demarcation region 111 in the width direction (e.g., the x-axis direction), but the position to which the demarcation line 11 extends does not matter as long as it is included in each demarcation region 111. Even if the demarcation line 11 extends to a position offset in the width direction of the demarcation region 111, a solar cell 1 can be obtained by cutting the cell assembly 100 at the demarcation line 11. The widths of the multiple demarcation regions 111 provided in the cell assembly 100 may be different.

[0051] The materials and shapes of the layers constituting the cell assembly 100 and the solar cell 1 are not limited to those in the above embodiment. For example, the plating layer 40 of the current collecting electrode 4 has a two-layer structure, but a third plating layer formed by electrolytic plating or electroless plating (including displacement plating) may be provided on the second plating layer made of Cu. Note that the current collecting electrode 4 may include, in addition to the plating layer 40, an electrode layer formed by a method other than plating.

[0052] Furthermore, the solar cell 1 may be of a single-sided light receiving type.

[0053] Furthermore, in the solar cell 1 of the present embodiment, the cell assembly 100 is cut by applying a laser to the demarcation lines 11, but the method of dividing the cell assembly 100 is not limited to cutting with a laser. For example, a groove may be formed along the demarcation lines 11 of the cell assembly 100 by a laser or mechanical scribing, and the cell assembly 100 may be divided along the groove to obtain the solar cell 1. Even in this case, since there is no transparent insulating layer 5 or plating layer 40 on the demarcation lines 11, it is easy to form the groove, and it is easy to divide the cell assembly 100 into solar cells 1.

[0054] As described above, according to the present invention, it is possible to provide a cell assembly, which is the raw material for solar cells that are connected in a shingled manner to form a solar cell, a cell assembly that includes metal electrodes formed by a plating method and that can be easily cut, a method for manufacturing the cell assembly, a solar cell formed from the cell assembly, and a method for manufacturing the solar cell.

[0055] The solar cell assembly of the present invention is a solar cell cell assembly having a plurality of small partitions each of which becomes a plurality of solar cell cells by being divided, and one side of which is straight in a planar view, wherein each of the plurality of small partitions is defined by a demarcation line that is a straight line approximately parallel to the one straight side of the cell assembly, and the solar cell assembly comprises: a photoelectric conversion unit having a main surface; a transparent conductive layer provided in a region of the main surface of the photoelectric conversion unit corresponding to each of the plurality of small partitions, and having a first region and a second region positioned differently from the first region; a collecting electrode provided on the first region of the transparent conductive layer, the collecting electrode including a plating layer; and a transparent insulating layer provided on the second region of the transparent conductive layer, wherein the photoelectric conversion unit is exposed in the demarcation region which is along the demarcation line and which includes the demarcation line.

[0056] According to this configuration, the main surface of the photoelectric conversion unit is not covered by a transparent insulating layer or a plating layer at the location of the demarcation line (demarcation region), so that the cell assembly can be easily cut by simply applying a laser to the demarcation line.

[0057] The method for manufacturing a solar cell assembly of the present invention is a method for manufacturing a solar cell assembly having a plurality of small partitions each of which becomes a plurality of solar cell cells by being divided and one side of which is straight in a planar view, wherein each of the plurality of small partitions is defined by a demarcation line that is a straight line approximately parallel to the one side of the cell assembly, the method including the steps of: preparing a photoelectric conversion unit having a main surface; forming a transparent conductive layer in an area of ​​the main surface of the photoelectric conversion unit corresponding to each of the plurality of small partitions; forming a transparent insulating layer in the transparent conductive layer, the transparent insulating layer having an opening through which a portion of the transparent conductive layer is exposed; and forming a collecting electrode by a plating method on the transparent conductive layer exposed from the opening, wherein the steps of forming the transparent conductive layer, forming the transparent insulating layer, and forming the collecting electrode are performed so that the photoelectric conversion unit is exposed in a demarcation area that is along the demarcation line and includes the demarcation line.

[0058] According to this configuration, the main surface of the photoelectric conversion unit is not covered by a transparent insulating layer or a plating layer at the location of the demarcation line (demarcation region), so that a solar cell assembly can be manufactured in which the cell assembly can be easily cut simply by applying a laser to the demarcation line.

[0059] The solar cell of the present invention can be configured as a solar cell string by connecting a plurality of solar cells to each other in a single manner, and is a solar cell having one straight side and an opposite straight side that is approximately parallel to the one side in a planar view, and is equipped with a photoelectric conversion unit having a main surface, a transparent conductive layer provided on the main surface of the photoelectric conversion unit, the transparent conductive layer having a first region and a second region positioned differently from the first region, a collecting electrode provided on the first region of the transparent conductive layer and including a plating layer, and a transparent insulating layer provided on the second region of the transparent conductive layer, and the photoelectric conversion unit is exposed at the one side and the opposite side.

[0060] A solar cell having such a configuration can be easily manufactured by applying a laser to a portion of the main surface of the photoelectric conversion section of the solar cell assembly that is not covered by a transparent insulating layer or a plating layer, and dividing the cell assembly.

[0061] The method for manufacturing a solar cell of the present invention is a method for manufacturing a solar cell using a cell assembly of solar cells, and includes a step of cutting the cell assembly by applying a laser to the demarcation lines.

[0062] According to this configuration, solar cells can be easily obtained by applying a laser to the photoelectric conversion section of the solar cell assembly that is not covered by a transparent insulating layer or a plating layer to divide the cell assembly. [Explanation of symbols]

[0063] 1...solar cell, 1a...one side, 1b...opposite side, 2...photoelectric conversion section, 3...transparent conductive layer, 4...collecting electrode, 5...transparent insulating layer, 6...conductive adhesive, 10...small compartment, 11...defining line, 20...main surface, 21...conductive crystalline silicon substrate (silicon substrate), 22...first conductive type silicon-based thin film (conductive type silicon-based thin film, silicon-based thin film), 23...second conductive type silicon-based thin film (conductive type silicon-based thin film, silicon-based thin film), 24, 25...intrinsic silicon-based thin film (silicon-based thin film) film), 31...first region, 32...second region, 33...first transparent conductive layer, 34...second transparent conductive layer, 35, 36...edge, 40...plating layer, 41...first current collecting electrode, 42...second current collecting electrode, 43...finger electrode, 44...bus bar electrode, 50...opening, 100...cell assembly, 100a...side, 101...solar cell string, 111...defined region, 111a, 111b...edge, 200...region, 201...first main surface, 202...second main surface, 211...first main surface, 212...second main surface

Claims

1. A solar cell assembly having a plurality of small sections each of which is divided to form a plurality of solar cell cells, the small sections having one side that is linear in plan view, Each of the plurality of small sections is defined by a defining line that is a straight line substantially parallel to one of the linear sides of the cell assembly, A photoelectric conversion portion having a main surface; a transparent conductive layer provided in a region of a main surface of the photoelectric conversion unit corresponding to each of the plurality of small sections, the transparent conductive layer having a first region and a second region positioned differently from the first region; a collecting electrode provided on the first region of the transparent conductive layer and including a plating layer; a transparent insulating layer provided on the second region of the transparent conductive layer, the collecting electrode includes a plurality of finger electrodes extending parallel to each other and a bus bar electrode extending so as to intersect with the plurality of finger electrodes, the transparent insulating layer covers one end of the transparent conductive layer in an extending direction of the finger electrodes and exposes the other end, The photoelectric conversion unit is exposed in a demarcated region that is an area along and including the demarcation line. Solar cell assembly.

2. A method for manufacturing a solar cell assembly, the solar cell assembly having a plurality of small sections each of which becomes a plurality of solar cell cells by being divided and one side of which is linear in a plan view, wherein each of the plurality of small sections is defined by a demarcation line which is a straight line approximately parallel to the one side of the cell assembly, comprising: preparing a photoelectric conversion body having a main surface; forming a transparent conductive layer in regions of a main surface of the photoelectric conversion unit corresponding to each of the plurality of small sections; forming a transparent insulating layer on the transparent conductive layer, the transparent insulating layer having an opening through which a portion of the transparent conductive layer is exposed; forming a current collecting electrode, the current collecting electrode having a plurality of finger electrodes extending parallel to each other and a bus bar electrode extending so as to intersect with the plurality of finger electrodes, on the transparent conductive layer exposed from the opening by a plating method; Including, the step of forming the transparent conductive layer, the step of forming the transparent insulating layer, and the step of forming the collecting electrode are performed such that the transparent insulating layer covers one end of both ends of the transparent conductive layer in an extending direction of the plurality of finger electrodes and exposes the other end, and the photoelectric conversion unit is exposed in a demarcated region along and including the demarcation line. A method for manufacturing a solar cell assembly.

3. A solar cell string can be formed by connecting a plurality of solar cells to each other in a single ring, the solar cell having one straight side and an opposite straight side that is substantially parallel to the one straight side in a plan view, A photoelectric conversion portion having a main surface; a transparent conductive layer provided on a principal surface of the photoelectric conversion section, the transparent conductive layer having a first region and a second region positioned differently from the first region; a collecting electrode provided on the first region of the transparent conductive layer and including a plating layer; a transparent insulating layer provided on the second region of the transparent conductive layer, the collecting electrode includes a plurality of finger electrodes extending parallel to each other and a bus bar electrode extending so as to intersect with the plurality of finger electrodes, the transparent insulating layer covers one end of the transparent conductive layer entirely up to an edge thereof in a direction in which the finger electrodes extend, and exposes the other end, a main surface of the photoelectric conversion unit is exposed at the one side and the opposite side; Solar cell.

4. A method for manufacturing a solar cell using the solar cell assembly according to claim 1, comprising the steps of: cutting the cell assembly by applying a laser to the defined line; A method for manufacturing solar cells.

Images