Packaging Method and Package Structure of Image Sensor

Abstract

The present invention discloses a packaging method and a packaging structure for an image sensor, which relates to the technical field of semiconductor packaging. The packaging method specifically includes dispensing a filling rubber, which is sprayed onto the lead wires using atomized filling rubber at high frequency, and coating the surface of the lead wires until the outside of the lead wires is completely covered with the filling rubber. Then, when the filling rubber on the surface of the lead wires is not yet cured, the liquid filling rubber is filled toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the leads. The packaging method for an image sensor provided by the present invention solves the problem in the prior art that the leads are easily broken when the finished image sensor is shaken. The leads in the packaging structure for an image sensor manufactured by the packaging method for an image sensor provided by the present invention are more stably fixed by the filling rubber and are less likely to break.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly to a packaging method and a packaging structure for an image sensor.

Background Art

[0002] An image sensor is a core device of a digital imaging device and can convert an optical image signal into an electronic signal for processing. In order to protect the chip of the image sensor, make it operate stably for a long time, and maintain good detection sensitivity for a long time, it is necessary to design a stable and highly reliable packaging structure. When implementing the image sensor, on the one hand, it is necessary to protect the light-receiving area of the sensor chip. On the other hand, the electrical connection lines between the sensor and the external circuit need to be protected to prevent the influence of external elements on the normal acquisition and processing of the sensor signal.

[0003] In the prior art, for example, the packaging structure and packaging method of the image sensor disclosed in Chinese Patent Application No. 201910414621.7 directly inject the first filling rubber from directly above the lead wire, providing a relatively stable and highly reliable packaging structure.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The defects existing in the conventional packaging method are as follows. Since the first filling rubber has relatively high viscosity, after injecting the first filling rubber from directly above the lead wire, the first filling rubber diverges after contacting the lead wire, and at the part where the lead wire faces away from the injection direction of the first filling rubber, the first filling rubber cannot completely adhere to the lead wire, which causes the lead wire to be filled in the cavity in the first filling rubber, and the first filling rubber cannot completely cover the lead wire. The cited literature does not provide a method to solve this problem. After the filling is completed by the conventional method and the first filling rubber is completely solidified, the lead wire may vibrate and break in this cavity.

Means for Solving the Problems

[0005] For the above technical problem, the packaging method of the image sensor provided by the present invention can more stably fix the lead wires in the packaging structure of the image sensor.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows. The packaging method of the image sensor provided by the present invention includes the following steps. S1: Provide a substrate, the substrate having a first surface and a second surface opposite to the first surface. S2: Attach the image sensor to the substrate, that is, fix the lower surface of the image sensor to the first surface of the substrate. S3: Fix a transparent cover plate above the image sensor, the transparent cover plate being fixed to the edge region of the light receiving region of the image sensor by a support side wall, and forming a sealed light transmission region between the transparent cover plate and the image sensor. S4: Electrically connect the image sensor to the substrate, that is, electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light transmission region. S5: Provide a side plate and seal the side plate so as to surround the boundary of the substrate, and position all of the plurality of lead wires in a filling chamber surrounded by the substrate and the side plate. S6: Distribute filling rubber, and distribute filling rubber into the filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the support side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Among them, distributing the filling rubber in S6 includes the following. S61: Use atomized filling rubber to inject it onto the lead wires at high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered by the filling rubber. S62: After performing step S61, when the filling rubber on the surface of the lead wires has not yet hardened, fill the filling chamber with liquid filling rubber until the liquid level height of the filling rubber is higher than the highest height of all the lead wires and not higher than the top surface of the transparent cover plate.

[0007] The packaging method of the image sensor provided by the present invention preferably further includes step S63 after step S62: A second filling rubber is filled vertically above the filling rubber filled in step S62 until the upper surface of the second filling rubber is flush with the top surface of the transparent cover plate. The filling rubber is an epoxy resin. The second filling rubber is a thermosetting sealant that does not transmit light.

[0008] In the packaging method of the image sensor provided by the present invention, preferably, the support side walls are distributed on the upper surface of the image sensor surrounding the outside of the light receiving area of the image sensor, and the support side walls have a uniform height.

[0009] In the packaging method of the image sensor provided by the present invention, preferably, the image sensor is electrically connected to the substrate before or after fixing the transparent cover plate to the image sensor.

[0010] In the packaging method of the image sensor provided by the present invention, preferably, a UV adhesive or a thermosetting sealant is selected as the support side wall, and the transparent cover plate is fixed above the image sensor during the curing process.

[0011] The packaging method of the image sensor provided by the present invention preferably generates the atomized filling rubber by an epoxy resin atomizing device in step S61. The epoxy resin atomizing device includes two nozzles used to eject epoxy resin mist. The mouths of the two nozzles are provided opposite to each other. Except that two pins of the lead wire are respectively connected to the image sensor and the substrate, the other parts of the lead wire leave a gap between the image sensor and the substrate. The height of the nozzle is lower than the highest part of the lead wire. The epoxy resin mist ejected from the nozzle can penetrate through the gap. A plurality of lead wires are installed on one side of the image sensor. The distance between the two nozzles is longer than the sum of the distances between all adjacent lead wires on one side of the image sensor.

[0012] The package structure of the image sensor manufactured by the package method of the image sensor provided by the present invention includes the substrate, the image sensor, the transparent cover plate, the support side wall, a plurality of the lead wires, the side plate, and the filling rubber. The substrate includes the first surface and the second surface. The second surface faces the first surface. An image sensor, wherein the image sensor is fixed to the substrate. The image sensor includes a light receiving region, and the surface of the image sensor provided with the light receiving region is the upper surface of the image sensor, and the surface facing the upper surface is the lower surface of the image sensor. The transparent cover plate, wherein the transparent cover plate is adhered above the image sensor. The image sensor receives a sensing signal through the transparent cover plate. One surface adhered to the transparent cover plate is the bottom surface of the transparent cover plate, and the surface facing the bottom surface of the transparent cover plate is the top surface of the transparent cover plate. A support side wall, wherein the support side walls are respectively adhered to the transparent cover plate and the image sensor, and a sealed light transmission region is formed between the transparent cover plate and the light receiving region of the image sensor. The support side wall is fixedly installed surrounding the upper surface outside the light receiving region of the image sensor. A plurality of the lead wires electrically connect the substrate and the image sensor, and a plurality of the lead wires are distributed outside the support side wall. A side plate, wherein the side plate is fixedly installed and sealed so as to surround the boundary of the substrate, and a plurality of the lead wires are all located in the filling chamber surrounded by the substrate and the side plate. The side adjacent to the filling chamber of the side plate is the inner side. A filling rubber, wherein the filling rubber is filled in the filling chamber formed inside the side plate, above the first surface of the substrate, and outside the support side wall. The filling rubber is divided into two inner and outer layers. The inner layer of the filling rubber completely covers the outside of the lead wires. The outer layer of the filling rubber covers the inner layer of the filling rubber and the internal lead wires without gaps. The liquid level height of the outer layer of the filling rubber is higher than that of all the lead wires. The upper surface of the outer layer of the filling rubber is not higher than the top surface of the transparent cover plate.

Effects of the Invention

[0013] The above technical solution has the following advantages or beneficial effects. The present invention discloses a packaging method and a packaging structure of an image sensor, relating to the technical field of semiconductor packaging. The packaging method of the image sensor includes the following steps. S1: Provide a substrate, and the substrate has a first surface and a second surface opposite to the first surface. S2: Attach the image sensor to the substrate, that is, fix the lower surface of the image sensor to the first surface of the substrate. S3: Fix a transparent cover plate above the image sensor. The transparent cover plate is fixed to the edge region of the light-receiving region of the image sensor by a support side wall, and a sealed light-transmitting area is formed between the transparent cover plate and the image sensor. S4: Electrically connect the image sensor to the substrate, that is, electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light-transmitting area. S5: Provide a side plate, and provide and seal the side plate so as to surround the boundary of the substrate, and position all the plurality of lead wires in a filling chamber surrounded by the substrate and the side plate. S6: Distribute a filling rubber, and distribute the filling rubber in a filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the support side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Among them, distributing the filling rubber in S6 includes the following. S61: Use atomized filling rubber to inject it onto the lead wires at a high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered by the filling rubber. S62: After performing step S61, when the filling rubber on the surface of the lead wires has not yet hardened, fill the filling chamber with liquid filling rubber until the liquid level height of the filling rubber is higher than the highest height of all the lead wires and not higher than the top surface of the transparent cover plate. The packaging method of the image sensor provided by the present invention solves the problem that in the prior art, the lead wires in the packaging structure of the image sensor are likely to break when the finished image sensor shakes because the filling rubber does not sufficiently cover the lead wires. In the packaging structure of the image sensor of the present invention, the lead wires are stably fixed by the filling rubber.

Brief Description of the Drawings

[0014] The present invention and its features, outer appearance, and advantages will become clearer by describing non-limiting embodiments in detail with reference to the following drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. The drawings are not intended to be drawn to scale, and emphasis is placed on showing the gist of the present invention.

Figure 1

Figure 2

Mode for Carrying Out the Invention

[0015] Specifically, the embodiments and features in the embodiments of the present application can be combined with each other as long as they do not conflict. It should be noted that the terms used in this specification are only used for explaining specific embodiments and are not intended to limit the exemplary embodiments according to the present application.

[0016] Specifically, when the terms "include" and / or "comprise" are used in this specification, it should be understood that they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0017] Terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., the directions or positional relationships indicated thereby are based on the directions or positional relationships shown in the drawings, and are only for facilitating the description of the present invention and simplifying the description, and do not indicate or imply that the shown device or element must be configured and operate in a specific direction, and thus should not be construed as limiting the present invention.

[0018] The occurrences of terms such as "first", "second", and "third" are used only for the purpose of explanation and should not be construed as indicating or implying relative importance.

[0019] The occurrences of terms such as "attachment", "connection", and "coupling" shall, unless otherwise specifically stipulated or limited, be construed in a broad sense such as fixed type, removable type, or integral type. Mechanical or electrical connection is possible. It can be directly connected, indirectly connected through an intermediate medium, or can be a communication within two elements. The meanings of the above terms in the present invention can be fully understood by those skilled in the art.

[0020] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings in the embodiments of the present invention. However, the described embodiments are only some embodiments of the present invention, not all embodiments. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without creative labor are within the scope of the present invention.

[0021] Example 1 In the prior art, in the process of assembling the package structure of an image sensor, since the filling rubber is directly filled, after the filling rubber contacts the lead wire, it is blocked by the lead wire and deviates from the entering direction of the filling rubber, and a cavity is likely to appear between the filling rubber and the lead wire. After the assembly of the package structure of the image sensor is completed, the lead wire in the package structure of the image sensor is not fully covered by the filling rubber, and the lead wire not covered by the filling rubber is vulnerable. In an environment where the image sensor of the product shakes, it is easy to induce the fracture of the lead wire. The package method of the image sensor provided in Example 1 of the present invention includes the following steps as shown in FIGS. 1 to 2. S1: Provide a substrate 1, and the substrate 1 has a first surface and a second surface opposite to the first surface. S2: Attach the image sensor 2 to the substrate 1, that is, fix the lower surface of the image sensor 2 to the first surface of the substrate 1. S3: Fix the transparent cover plate 3 above the image sensor 2. The transparent cover plate 3 is fixed to the edge region of the light-receiving area of the image sensor 2 by the support side wall 4, and a sealed light-transmitting area is formed between the transparent cover plate 3 and the image sensor 2. S4: Electrically connect the image sensor 2 to the substrate 1, that is, electrically connect the first surface of the substrate 1 and the upper surface of the image sensor 2 through a plurality of lead wires 5, and the lead wires 5 for electrical connection are located outside the light-transmitting area. S5: Provide a side plate 6, and seal the side plate 6 so as to surround the boundary of the substrate 1, and position all the plurality of lead wires 5 in the filling chamber surrounded by the substrate 1 and the side plate 6. S6: Distribute the filling rubber 7, and distribute the filling rubber into the filling chamber formed by the inside of the side plate 6, above the first surface of the substrate 1, and the outside of the support side wall 4. The upper surface of the filling rubber 7 is not higher than the top surface of the transparent cover plate 3. Distributing the filling rubber in the S6 includes the following. S61: Use atomized filling rubber to inject it onto the lead wire 5 at high frequency, and paint the surface of the lead wire 5 until the outside of the lead wire 5 is completely covered with the filling rubber. S62: After performing step S61, when the filling rubber 7 on the surface of the lead wire 5 has not yet hardened, fill the filling chamber with the liquid filling rubber 7 until the liquid level height of the filling rubber 7 is higher than the highest height of all the lead wires 5 and not higher than the top surface of the transparent cover plate 3.

[0022] The packaging method of the image sensor provided by Embodiment 1 of the present invention is as follows: First, atomized filling rubber is used to coat the connecting lead wires between the substrate 1 and the image sensor 2, so that the outer surface of the lead wires is sufficiently covered with the filling rubber. Then, when the filling rubber outside the lead wires has not yet fully cured, liquid filling rubber is poured, and the filling chamber inside the side plate 6, above the first surface of the substrate 1, and outside the supporting side wall 4 is filled with the filling rubber. Since the atomized filling rubber and the liquid filling rubber are of the same material, when the liquid filling rubber flows, it can be more easily attached to the filling rubber on the surface of the lead wire 5, thereby avoiding the situation where the lead wire and the filling rubber do not stick tightly to the surface of the lead wire 5 due to different structural properties. Among them, the atomized filling rubber is ejected onto the lead wire at a high frequency, and the lead wire surface is coated. The high frequency ejects the atomized filling rubber relatively quickly and strikes the lead wire surface. The purpose of this is to make the atomized filling rubber contact the lead wire 5 at a higher speed, so that the filling rubber can be more easily adhered to the lead wire surface, and then the efficiency of adhering the atomized filling rubber to the surface of the lead wire 5 is further improved. In this way, it is possible to avoid the situation where the moving speed of the filling mist is too slow and the time to completely cover the surface of the lead wire 5 is too long, thoroughly cure the filling mist on the surface of the lead wire 5, and affect the seamless connection between the filling rubber covering the surface of these lead wires 5 and the subsequent liquid filling rubber to be filled. The reason for not using a direct high-speed filling mist by adopting a high frequency is that, on the one hand, a continuous filling mist may rapidly gather on the liquid filling rubber, which is disadvantageous for covering the surface of the lead wire 5 with the filling rubber. On the other hand, if the atomized filling rubber is simply ejected from the pipe at a high speed, the lead wire may be tilted because it is subjected to the impact force of the continuous atomized filling rubber. If the filling rubber is ejected onto the lead wire through a high-frequency stage, the impact force received by the lead wire is reduced because there is an interval between the impact forces, and in this way, the impact force received by the lead wire can be appropriately reduced, so that the situation where the filling rubber collides with the lead wire and causes deformation can be alleviated. Compared with the prior art, this embodiment sufficiently covers the outside of the lead wire with the filling rubber, there is no cavity between the lead wire 5 and the filling rubber 7, and the lead wire 5 vibrates in the cavity formed by the filling rubber 7 and is not easily broken.

[0023] The packaging method of the image sensor provided in Embodiment 1 of the present invention solves the problem that in the prior art, the lead wire in the package structure of the image sensor is easily broken when the finished image sensor shakes because the filling rubber does not sufficiently cover the lead wire. The present invention can more stably fix the lead wire in the package structure of the image sensor with filling rubber.

[0024] In a preferred form, in this embodiment, after step S62, step S63 is further included: For the filling rubber 7 filled in step S62, the second filling rubber 8 is filled vertically upward until the upper surface of the second filling rubber 8 is flush with the top surface of the transparent cover plate 3. The filling rubber 7 is epoxy resin. The second filling rubber 8 is a thermosetting sealant that does not transmit light. Similar to the prior art, after the filling rubber 7 is cured, the second filling rubber 8 is provided above the filling rubber 7. Since the second filling rubber 8 does not transmit light, it is possible to prevent the light rays irradiated into the filling chamber from irradiating the image sensor 2. At the same time, the upper surface of the second filling rubber 8 is at the same height as the transparent cover plate, and the upper surface of the final outer shape of the package structure can be made into one plane, and it is difficult for the transparent cover plate to fall off from the support side wall 4 due to the lateral pressure received. Among them, the support side walls 4 are distributed on the upper surface of the image sensor 2 surrounding the outside of the light receiving area of the image sensor 2, and the support side walls 4 have a uniform height. Among them, the support side walls 4 are distributed along the outer edge of the light receiving area of the image sensor 2 and have a uniform height. Therefore, the support side walls can more easily make the packaged image sensor fit flat to an external optical element (the transparent cover plate 3 is attached to a light source, and the surface of the light receiving area of the image sensor 2 can be perpendicular to the incident direction of the external light source, so the image sensor 2 can receive the light source better).

[0025] In this embodiment, the electrical connection between the image sensor 2 and the substrate 1 is made either before the transparent cover plate 3 is fixed to the image sensor 2 or after the transparent cover plate 3 is fixed to the image sensor 2. The image sensor 2 and the substrate 1 may be electrically connected via the lead wire 5 either before assembling the transparent cover plate 3 or after assembling the transparent cover plate 3.

[0026] In order to enable the support side wall 4 to be fixed to the image sensor 2, in this embodiment, as a preferred example, a UV curable adhesive or a heat curable adhesive is selected as the support side wall 4, and the transparent cover plate 3 is fixed above the image sensor 2 while the filling rubber 7 is curing. Since the support side wall 4 itself is an adhesive, adhesion and curing are performed simultaneously when it is attached to the image sensor 2, and the fixing efficiency can be improved.

[0027] In order to achieve full coverage of the entire surface of the lead wire 5, an epoxy resin mist is sprayed. As a preferred method, in this embodiment, in step S61, a filled rubber atomized by an epoxy resin atomizing device 9 is generated. The epoxy resin atomizing device 9 includes two nozzles 91 for spraying the epoxy resin mist. The mouths of the two nozzles 91 are provided facing each other. For the lead wire 5, except that two pins are respectively connected to the image sensor 2 and the substrate 1, the other parts of the lead wire 5 leave a gap from the image sensor 2 and the substrate 1. The height of the nozzle 91 is lower than the highest part of the lead wire 5. The epoxy resin mist from the nozzle 91 can pass through the gap. A plurality of lead wires 5 are arranged on one side of the image sensor 2. The distance between the two nozzles 91 is longer than the sum of the distances between all adjacent lead wires 5 on one side of the image sensor 2. The epoxy resin atomizing device 9 belongs to the prior art. Commonly, high pressure is used to extrude the epoxy resin liquid and the epoxy resin liquid is ejected from the atomizing nozzle. In this embodiment, a gap is left between the lead wire 5 and the image sensor 2, which prevents the non-endpoint part of the lead wire 5 from contacting the image sensor and the other contact points between the lead wire and the image sensor from interfering. However, the lead wire 5 is close to the image sensor 2 and the spray pipe cannot be extended vertically below the lead wire 5. Therefore, the epoxy resin atomizing device 9 in this embodiment includes two nozzles 91, and these two nozzles 91 spray oppositely. Since the height of the nozzle 91 is lower than the highest height of the lead wire, the ejected epoxy resin mist collides at the bottom of the lead wire 5, and the collided mist part moves vertically upward to the highest bottom of the lead wire 5. After the atomized epoxy resin contacts the bottom of the lead wire, it flows along the bottom of the lead wire 5. Therefore, by covering the entire bottom of the lead wire 5, the filled rubber also covers the bottom of the lead wire 5 where it is most difficult to spray the epoxy resin. It is combined with a normal vertically downward spray nozzle to perform spraying that fully and comprehensively covers the lead wire, which is advantageous for the adhesion of the subsequent liquid epoxy resin and the lead wire after the epoxy resin mist is sprayed, so that the lead wire is fully covered with the filled rubber and no cavity is formed around the lead wire.

[0028] The package structure of the image sensor finally manufactured using the above method includes a substrate 1, an image sensor 2, a transparent cover plate 3, a support sidewall 4, a plurality of lead wires 5, a side plate 6, and filling rubber. The substrate 1 includes a first surface and a second surface. The second surface faces the first surface. The image sensor 2 is fixed to the substrate 1. The image sensor 2 includes a light receiving region, and the surface of the image sensor 2 where the light receiving region is installed is the upper surface of the image sensor 2, and the surface opposite to the upper surface is the lower surface of the image sensor 2. The transparent cover plate 3 is adhered above the image sensor 2. The image sensor 2 receives a sensing signal through the transparent cover plate 3. The surface adhered to the transparent cover plate 3 is the bottom surface of the transparent cover plate 3, and the surface opposite to the bottom surface of the transparent cover plate 3 is the top surface of the transparent cover plate 3. The support sidewall 4 is adhered to the transparent cover plate 3 and the image sensor 2 respectively, and forms a sealed light transmission region between the transparent cover plate 3 and the light receiving region of the image sensor 2. The support sidewall 4 is fixedly installed surrounding the upper surface outside the light receiving region of the image sensor 2. The plurality of lead wires 5 electrically connect the substrate and the image sensor, and the plurality of lead wires 5 are distributed outside the support sidewall 4. The side plate 6 is fixed and sealed so as to surround the boundary of the substrate 1, and all the plurality of lead wires 5 are located in a filling chamber surrounded by the substrate 1 and the side plate 6. The side adjacent to the filling chamber of the side plate 6 is the inner side. The filling rubber is filled in a filling chamber formed inside the side plate, above the first surface of the substrate, and outside the support sidewall. The filling rubber is divided into two inner and outer layers. The inner layer of the filling rubber completely covers the outside of the lead wire. The outer layer of the filling rubber covers the inner layer of the filling rubber and the internal lead wire without gaps. The liquid level height of the outer layer of the filling rubber is higher than that of all the lead wires. The upper surface of the outer layer of the filling rubber is not higher than the top surface of the transparent cover plate.

[0029] As described above, the present invention discloses a packaging method and a packaging structure for an image sensor, which relate to the technical field of semiconductor packaging. The packaging method for the image sensor includes the following steps. S1: Provide a substrate, where the substrate has a first surface and a second surface opposite to the first surface. S2: Attach the image sensor to the substrate, that is, fix the lower surface of the image sensor to the first surface of the substrate. S3: Fix a transparent cover plate above the image sensor. The transparent cover plate is fixed to the edge region of the light-receiving area of the image sensor by a support side wall, and a sealed light-transmitting area is formed between the transparent cover plate and the image sensor. S4: Electrically connect the image sensor to the substrate, electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light-transmitting area. S5: Provide a side plate, and seal the side plate so as to surround the boundary of the substrate, and position all the plurality of lead wires in a filling chamber surrounded by the substrate and the side plate. S6: Distribute filling rubber, and distribute filling rubber into the filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the support side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Among them, distributing the filling rubber in S6 includes the following. S61: Use atomized filling rubber to inject it onto the lead wires at a high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered by the filling rubber. S62: After performing step S61, when the filling rubber on the surface of the lead wires has not yet hardened, fill the filling chamber with liquid filling rubber until the liquid level height of the filling rubber is higher than the highest height of all the lead wires and not higher than the top surface of the transparent cover plate. The image sensor packaging method provided by the present invention solves the problem in the prior art that the lead wires in the packaging structure of the image sensor are easily broken when the finished image sensor shakes because the filling rubber does not sufficiently cover the lead wires. The present invention can stably fix the lead wires in the packaging structure of the image sensor with filling rubber.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made using the content of the specification and the attached drawings of the present invention, or any application directly or indirectly to other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A method for packaging an image sensor, comprising the following steps: S1: Provide a substrate, the substrate having a first surface and a second surface opposite to the first surface; S2: Attach the image sensor to the substrate, i.e., fix the lower surface of the image sensor to the first surface of the substrate; S3: Fix a transparent cover plate above the image sensor, the transparent cover plate being fixed to the edge region of the light-receiving area of the image sensor by a support side wall, and forming a sealed light-transmitting area between the transparent cover plate and the image sensor; S4: Electrically connect the image sensor to the substrate, i.e., electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light-transmitting area; S5: Provide a side plate and seal it so as to surround the boundary of the substrate, and locate all of the plurality of lead wires within a filling chamber surrounded by the substrate and the side plate; S6: Distribute a filling rubber, distribute the filling rubber into the filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the support side wall, and the upper surface of the filling rubber is not higher than the top surface of the transparent cover plate; The distributing of the filling rubber in S6 includes the following: S61: Use atomized filling rubber to inject it onto the lead wires at high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered by the filling rubber; S62: After performing step S61, when the filling rubber on the surface of the lead wires has not yet hardened, fill the filling chamber with liquid filling rubber until the liquid level height of the filling rubber is higher than the highest height of all the lead wires and not higher than the top surface of the transparent cover plate. A method for packaging an image sensor, characterized by the above.

2. Further includes step S63 after step S62, Fill a second filling rubber vertically above the filling rubber filled in step S62 until the upper surface of the second filling rubber is flush with the top surface of the transparent cover plate; The filling rubber is an epoxy resin, and the second filling rubber is a thermosetting sealant that does not transmit light. The method for packaging an image sensor according to claim 1, characterized by the above.

3. On the upper surface of the image sensor surrounding the outside of the light-receiving region of the image sensor, the support sidewalls are distributed, and the support sidewalls have a uniform height. The method for packaging an image sensor according to claim 1, characterized in that.

4. Before fixing the transparent cover plate to the image sensor or after fixing the transparent cover plate to the image sensor, the image sensor is electrically connected to the substrate. The method for packaging an image sensor according to claim 1, characterized in that.

5. Select a UV adhesive or a thermosetting sealant as the support sidewall, and fix the transparent cover plate above the image sensor during the curing process. The method for packaging an image sensor according to claim 1, characterized in that.

6. In step S61, the atomized filling rubber is generated by an epoxy resin atomizing device, and the epoxy resin atomizing device includes two nozzles used for ejecting epoxy resin mist. The mouths of the two nozzles are installed opposite to each other. Except that two pins of the lead wire are respectively connected to the image sensor and the substrate, the other parts of the lead wire leave a gap between the image sensor and the substrate. The height of the nozzle is lower than the highest part of the lead wire. A plurality of lead wires are installed on one side of the image sensor, and the distance between the two nozzles is longer than the sum of the distances between all adjacent lead wires on one side of the image sensor. The method for packaging an image sensor according to claim 2, characterized in that.

7. A method for manufacturing an image sensor, including the method for packaging an image sensor according to any one of claims 1 to 6 in a manufacturing process.

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