Mold device

Abstract

To provide a mold device that can suppress deterioration in positioning accuracy due to thermal expansion.SOLUTION: A mold device 100 according to the present disclosure comprises a stationary mold 1, a stationary platen 31 to which the stationary mold 1 is attached, a movable mold 2, and a movable platen 32 to which the movable mold 2 is attached. The stationary mold 1 and the movable mold 2 are closed by the movable mold 2 pressing against the stationary mold 1 in a lateral direction. The mold device 100 comprises a protrusion 41, a concavity 42, and a floating structure 5. When the floating structure 5 is provided on one of the bottom surfaces of the stationary mold 1, the protrusion 41 is provided on one of the top surfaces of the stationary mold 1 and the stationary platen 31, and the concavity 42 is provided on the top surface of stationary mold 1 and on the other side of the top surface of the stationary platen 31. The protrusion 41 and concavity 42 fit together, and the floating structure body 5 compresses and deforms elastically in response to the thermal expansion of the lower surface of the stationary mold 1.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a mold apparatus. [Background technology]

[0002] The die device disclosed in Patent Document 1 includes a die for die casting, which is made up of a combination of multiple dies. One of the multiple dies has a protrusion formed in the radial direction from the approximate center of thermal expansion of the die, and the other has a recess. The radial dimension of this recess is set to be larger than that of the protrusion, and the protrusion and the recess are engaged with each other. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-066714 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present inventors have discovered the following problems. The inventors of the present application have considered applying the above-mentioned configuration of the mold device to a mold device in which one mold is pressed against the other mold in a lateral direction to close the first and second molds. In the above-mentioned configuration of the mold device, multiple molds are positioned at their approximate centers of thermal expansion. In the first and second molds, portions separated in the thermal expansion direction from the approximate center of thermal expansion thermally expand without any particular restriction. Therefore, there is a risk that the positioning accuracy will decrease in the portions separated in the thermal expansion direction from the approximate center of thermal expansion.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and provides a mold device that can suppress a decrease in positioning accuracy due to thermal expansion. [Means for solving the problem]

[0006] The mold apparatus according to the present disclosure is Fixed type and a fixed platen on which the fixed die is attached; Movable type and A movable platen to which the movable die is attached, A mold apparatus in which the fixed mold and the movable mold are closed by the movable mold being pressed against the fixed mold in a lateral direction, A convex portion, A recess; A floating structure, When the floating structure is provided on the lower surface of the fixed mold, the protrusion is provided on one of an upper surface of the fixed mold and an upper surface of the fixed platen, the recess is provided on the other of the upper surface of the fixed mold and the upper surface of the fixed platen, The protrusion and the recess are fitted together, the floating structure is compressed and elastically deformed in response to thermal expansion of the lower surface of the fixed mold; When the floating structure is provided on the lower surface of the movable mold, the protrusion is provided on one of an upper surface of the movable die and an upper surface of the movable platen, the recess is provided on the other of the upper surface of the movable mold and the upper surface of the movable platen, The protrusion and the recess are fitted together, The floating structure is compressed and elastically deformed in response to thermal expansion of the lower surface of the movable mold.

[0007] According to this configuration, the convex portion and the concave portion fit together. Also, the floating structure is positioned at approximately the same height as either the upper surface of the fixed mold and the upper surface of the fixed platen, or the upper surface of the movable mold and the upper surface of the movable platen. Also, a floating structure is provided on either the lower surface of the fixed mold or the lower surface of the movable mold. Therefore, even if the fixed mold and the movable mold thermally expand, the floating structure contracts, and the upper surface of the floating structure descends from either the lower surface of the fixed mold or the lower surface of the movable mold. Therefore, the floating structure absorbs the thermal expansion of either the fixed mold or the movable mold, and it is possible to suppress a decrease in positioning accuracy due to thermal expansion.

[0008] In addition, when the floating structure is provided on the lower surface of the fixed mold, The stationary platen includes a support pillar protruding toward the stationary mold, The fixed die has a slot, The cross-sectional shape of the long hole extends in the vertical direction, The support may be inserted through the long hole to support the fixed mold.

[0009] With this configuration, even if the fixed mold thermally expands and the long hole drops, the support pillar is prevented from coming into contact with the upper part of the long hole, and the support pillar does not press against the long hole. Therefore, the support pillar does not interfere with the thermal expansion of the fixed mold. The fixed mold can thermally expand uniformly without being biased depending on the part. Therefore, it is possible to stably suppress the deterioration of positioning accuracy due to thermal expansion.

[0010] Furthermore, when the floating structure is provided on the lower surface of the movable mold, The movable platen includes a support protruding toward the movable die, The movable die has a slot, The cross-sectional shape of the long hole extends in the vertical direction, The support may be inserted through the long hole to support the movable die.

[0011] With this configuration, even if the movable mold thermally expands and the long hole descends, the support pillar is prevented from coming into contact with the upper part of the long hole, and the support pillar does not press against the long hole. Therefore, the support pillar does not impede the thermal expansion of the movable mold. The movable mold can thermally expand uniformly without being biased depending on the part. Therefore, it is possible to stably suppress the deterioration of positioning accuracy due to thermal expansion.

[0012] The cross-sectional shape of the slot includes an upper portion and a lower portion disposed below the upper portion, The diameter of the upper portion may be larger than the diameter of the lower portion.

[0013] With this configuration, even if at least one of the fixed and movable dies thermally expands and the slot moves down, the support pillar will relatively approach the upper part of the slot, which has a larger diameter than the lower part of the slot. This makes it possible to prevent contact between the support pillar and the slot. This further reduces the deterioration of positioning accuracy due to thermal expansion. Effect of the Invention

[0014] According to the present disclosure, it is possible to suppress a decrease in positioning accuracy due to thermal expansion. [Brief description of the drawings]

[0015] [Figure 1] 1 is a partially cutaway cross-sectional view showing a mold device according to a first embodiment. [Diagram 2] 3 is a diagram showing a specific example of a main part of a die device according to the first embodiment. FIG. [Diagram 3] 1 is a partially cutaway cross-sectional view showing an example of use of a mold device according to embodiment 1. FIG. [Figure 4] FIG. 11 is a partially cutaway cross-sectional view showing a mold device according to a second embodiment. [Diagram 5] 11 is a partially cutaway cross-sectional view showing an example of use of a mold device according to a second embodiment. FIG. [Figure 6] 11 is a diagram showing a specific example of a main part of a die device according to the second embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In addition, the following description and drawings are appropriately simplified for clarity of explanation.

[0017] (Embodiment 1) A first embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a partially cutaway cross-sectional view showing a mold apparatus according to the first embodiment. Fig. 2 is a view showing a specific example of a main part of the mold apparatus shown in Fig. 1. Fig. 3 is a partially cutaway cross-sectional view showing an example of use of the mold apparatus shown in Fig. 1.

[0018] Naturally, the right-handed xyz coordinate system shown in Figure 1 and other drawings is for the convenience of explaining the positional relationship of the components. Usually, the z-axis positive direction is vertically upward, and the xy plane is a horizontal plane, which is common among the drawings.

[0019] 1, the mold apparatus 100 includes a fixed mold 1, a movable mold 2, a fixed platen 31, a movable platen 32, a convex portion 41, a concave portion 42, and a floating structure 5. The mold apparatus 100 may include a base 6.

[0020] The fixed mold 1 is attached to a fixed platen 31 and fixed at a predetermined position. The fixed platen 31 is, for example, a plate-like body extending in the vertical direction (here, the z direction) and is one component of the molding machine. The upper surface 1a of the fixed mold 1 according to this embodiment and the upper surface 31a of the fixed platen 31 are flush with each other. The positions of the upper surface 1a of the fixed mold 1 and the upper surface 31a of the fixed platen 31 may be appropriately adjusted in consideration of the fit between the convex portion 41 and the concave portion 42 described below.

[0021] The movable die 2 is attached to the movable platen 32. The movable platen 32 is, for example, a substantially rectangular plate-like body extending in the vertical direction, and is one component of the molding machine. The movable platen 32 is held so as to be separated from or approachable to the fixed platen 31 in the lateral direction (here, the y direction). When the movable platen 32 approaches the fixed platen 31 in the lateral direction, the movable die 2 is pressed against the fixed die 1 in the lateral direction, and the movable die 2 and the fixed die 1 are closed. The closed movable die 2 and the fixed die 1 have, for example, a runner, a gate, a cavity, and the like. For example, a whipped body may be poured into the closed movable die 2 and the fixed die 1 to form a core. The movable die 2 and the fixed die 1 may also be applied to various molding methods, specifically, molding methods involving heat, more specifically, casting, injection molding, and the like. Although the upper surface 32a of the movable platen 32 according to this embodiment is higher than the upper surface 2a of the movable mold 2, the upper surface 2a of the movable mold 2 and the upper surface 32a of the movable platen 32 may be flush with each other.

[0022] As shown in FIG. 2, the movable die 2 may be attached to the movable platen 32 by, for example, fastening the four corners of the movable die 2 to the movable platen 32 with bolts. Specifically, holes 2c, 2d, 2e, and 2f are provided at the four corners of the movable die 2, respectively. The holes 2c, 2d, 2e, and 2f extend to the inside of the movable platen 32. The bolt 7c is inserted into the hole 2c to fasten the movable die 2 and the movable platen 32. Similarly, the bolt 7d, 7e, and 7f are inserted into the holes 2d, 2e, and 2f, respectively, to fasten the movable die 2 and the movable platen 32. The bolts 7c, 7d, 7e, and 7f may be loosened so that the bolts 7c, 7d, 7e, and 7f do not suppress the thermal expansion of the movable die 2. Also, the shapes and sizes of bolts 7c, 7d, 7e, 7f, holes 2c, 2d, 2e, and 2f may be adjusted as appropriate so as not to inhibit the thermal expansion.

[0023] The protrusion 41 is provided on the upper surface 31a of the fixed platen 31. The protrusion 41 and the fixed platen 31 are mechanically connected to each other. The protrusion 41 protrudes toward the fixed mold 1 (here, in the negative Y-axis direction).

[0024] The recess 42 is provided on the upper surface 1a of the fixed mold 1. The recess 42 and the fixed mold 1 are mechanically connected. The recess 42 is recessed in the direction in which the protrusion 41 protrudes (here, in the negative Y-axis direction). The recess 42 fits into the protrusion 41.

[0025] The floating structure 5 is provided on the lower surface 1b of the fixed mold 1. The floating structure 5 is compressed and elastically deformed. The floating structure 5 may include an elastic body such as a spring. Such an elastic body may constitute or support the upper surface 5a of the floating structure 5. When the upper surface 5a of the floating structure 5 is pressed downward, it descends. Note that when the fixed mold 1 is not thermally expanded, the floating structure 5 may press the lower surface 1b of the fixed mold 1 so as to support the fixed mold 1.

[0026] The base 6 is disposed below the fixed mold 1. The base 6 is fixed at a predetermined height. The base 6 supports the floating structure 5.

[0027] Here, as shown in FIG. 3, the movable mold 2 and the fixed mold 1 thermally expand. For example, by carrying out the above-mentioned molding method using the mold device 100, the movable mold 2 and the fixed mold 1 thermally expand. Meanwhile, since the convex portion 41 and the concave portion 42 are fitted together, the upper surface 1a of the fixed mold 1 and the upper surface 31a of the fixed platen 31 are positioned at approximately the same height. Therefore, when the fixed mold 1 thermally expands, the lower surface 1b of the fixed mold 1 descends while the upper surface 1a of the fixed mold 1 and the upper surface 31a of the fixed platen 31 remain positioned at approximately the same height. Then, the upper surface 5a of the floating structure 5 is pressed downward from the lower surface 1b of the fixed mold 1, and the floating structure 5 shrinks. Therefore, the floating structure 5 absorbs the thermal expansion of the fixed mold 1, and the deterioration of the positioning accuracy due to the thermal expansion can be suppressed.

[0028] (Embodiment 2) A second embodiment will be described with reference to Figs. 4 to 6. Fig. 4 is a partially cutaway cross-sectional view showing a mold apparatus according to the second embodiment. Fig. 5 is a partially cutaway cross-sectional view showing an example of use of the mold apparatus shown in Fig. 4. Fig. 6 is a diagram showing a specific example of a main part of the mold apparatus shown in Fig. 4. A mold apparatus 200 according to the second embodiment has the same configuration as the mold apparatus 100 according to the first embodiment, except for the fixed mold and fixed platen.

[0029] As shown in FIG. 4, the mold device 200 includes a fixed mold 201 and a fixed platen 231 .

[0030] 1, except that the fixed platen 231 has a retaining hole 31b and a support pillar 31c. The support pillar 31c is inserted into the retaining hole 31b and is provided so as to protrude into the fixed mold 201. The support pillar 31c is inserted into the elongated hole 1c of the fixed mold 201 to support the fixed mold 201.

[0031] The fixed mold 201 has the same configuration as the fixed mold 1 shown in FIG. 1, except for having an elongated hole 1c. The elongated hole 1c opens in a surface 201d of the fixed mold 201 on the side of the fixed platen 231. The elongated hole 1c extends from the surface 201d to the inside of the fixed mold 201. The elongated hole 1c may penetrate the fixed mold 201. The cross-sectional shape of the elongated hole 1c may extend in the vertical direction (here, the z-axis direction). Specifically, the cross-sectional shape of the elongated hole 1c is a circle extending in the vertical direction. One specific example of the cross-sectional shape of the elongated hole 1c is composed of a first semicircle, a second semicircle, and a square or rectangle formed by connecting the first and second semicircles. The first semicircle protrudes upward, and the second semicircle protrudes downward.

[0032] Here, as shown in FIG. 5, the movable mold 2 and the fixed mold 201 thermally expand. For example, by implementing the above-mentioned molding method using the mold device 200, the movable mold 2 and the fixed mold 201 thermally expand. Since the convex portion 41 and the concave portion 42 fit together, the upper surface 1a of the fixed mold 201 and the upper surface 231a of the fixed platen 231 are positioned at approximately the same height, as in the mold device 100. Therefore, the fixed mold 201 thermally expands, and the lower surface 1b of the fixed mold 201 descends while the upper surface 1a of the fixed mold 201 and the upper surface 231a of the fixed platen 231 remain positioned at approximately the same height. Then, the upper surface 5a of the floating structure 5 is pressed downward from the lower surface 1b of the fixed mold 201, and the floating structure 5 contracts. Therefore, as in the mold device 100, the floating structure 5 absorbs the thermal expansion of the fixed mold 201, and the deterioration of the positioning accuracy due to the thermal expansion can be suppressed.

[0033] In addition, even if the fixed mold 201 thermally expands and the elongated hole 1c moves downward, the support pillars 31c are prevented from contacting the upper portion of the elongated hole 1c, and the support pillars 31c do not press against the elongated hole 1c. Therefore, the support pillars 31c do not impede the thermal expansion of the fixed mold 201. The fixed mold 201 can thermally expand uniformly without being biased depending on the part. Therefore, it is possible to stably suppress the deterioration of positioning accuracy due to thermal expansion.

[0034] (One specific example of the main part) Next, the fixed mold 301 shown in FIG. 6 is a specific example of the fixed mold 201 shown in FIG. 4. The fixed mold 301 has an elongated hole 301c, which is a specific example of the elongated hole 1c. The cross-sectional shape of the elongated hole 301c includes an upper portion 301d and a lower portion 301e disposed below the upper portion 301d. The diameter D1 of the upper portion 301d is larger than the diameter D2 of the lower portion 301e. The upper portion 301d has, for example, a substantially missing circle shape that protrudes upward. The lower portion 301e is composed of a semicircle that protrudes downward and a square or rectangle that connects the upper portion 301d and the semicircle.

[0035] When the fixed mold 301 thermally expands and the elongated hole 301c moves downward, the support 31c approaches the upper portion 301d relatively. The upper portion 301d has a diameter D1 larger than the diameter D2 of the lower portion 301e. This further suppresses contact between the support 31c and the elongated hole 301c. This further suppresses deterioration of positioning accuracy due to thermal expansion.

[0036] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention. In addition, the present invention can be implemented by appropriately combining the above-described embodiment and examples thereof.

[0037] For example, in the mold apparatus 100, 200 according to embodiments 1 and 2, the convex portion 41 is provided on the upper surface 31a of the fixed platen 31 and the concave portion 42 is provided on the upper surface 1a of the fixed mold 1, but the convex portion 41 may be provided on the upper surface 1a of the fixed mold 1 and the concave portion 42 may be provided on the upper surface 31a of the fixed platen 31.

[0038] Moreover, the convex portion 41 may be provided on the upper surface 2a of the movable die 2, and the concave portion 42 may be provided on the upper surface 32a of the movable platen 32. Moreover, the convex portion 41 may be provided on the upper surface 32a of the movable platen 32, and the concave portion 42 may be provided on the upper surface 2a of the movable die 2. The positions of the upper surface 2a of the movable die 2 and the upper surface 32a of the movable platen 32 may be appropriately adjusted in consideration of the fit between the convex portion 41 and the concave portion 42, which will be described later.

[0039] In addition, in the mold apparatus 100, 200 according to the first and second embodiments, the floating structure 5 is provided on the lower surface 1b of the fixed mold 1, but the floating structure 5 may be provided on the lower surface 2b of the movable mold 2. In such a case, it is preferable that the platform 6 is located below the movable mold 2 and supports the floating structure 5.

[0040] In addition, in the mold apparatus 200 according to the second embodiment, the fixed platen 231 includes the support pillars 31c, but the movable platen 32 may include the support pillars 31c. [Explanation of symbols]

[0041] 100 and 200 Mold Devices 1, 201, and 301 Fixed Molds 1a Upper Surface, 1b Lower Surface 1c and 301c Long Holes 301d Upper Part, 301e Lower Part 2 Movable Mold 2a Upper Surface, 2b Lower Surface 201d Surface 2c, 2d, 2e, and 2f Holes 31 and 231 Fixed Plates 31a Upper Surface, 31b Holding Hole 31c Support Pillar 32 Movable Plate 32a Upper Surface 41 Protrusion, 42 Depression 5 Floating Structure, 6 Sets 7c, 7d, 7e, and 7f Bolts

Claims

1. A fixed type, A fixed plate to which the fixed type is attached, A movable type, A movable plate to which the movable type is attached, and comprising: A mold device in which the fixed type and the movable type are closed by the movable type being pressed against the fixed type in the lateral direction, A convex portion, A concave portion, An elastic body, and comprising: When the elastic body is provided on the lower surface of the fixed type, The convex portion is provided on one of the upper surface of the fixed type and the upper surface of the fixed plate, The concave portion is provided on the other of the upper surface of the fixed type and the upper surface of the fixed plate, The convex portion and the concave portion are fitted together, When the fixed type thermally expands and the lower surface of the fixed type descends, the upper surface of the elastic body is pressed downward from the lower surface of the fixed type, the elastic body is compressed and elastically deformed, and the upper surface of the elastic body descends, When the elastic body is provided on the lower surface of the movable type, The convex portion is provided on one of the upper surface of the movable type and the upper surface of the movable plate, The concave portion is provided on the other of the upper surface of the movable type and the upper surface of the movable plate, The convex portion and the concave portion are fitted together, When the movable type thermally expands and the lower surface of the movable type descends, the upper surface of the elastic body is pressed downward from the lower surface of the movable type, the elastic body is compressed and elastically deformed, and the upper surface of the elastic body descends, A mold device.

2. When the elastic body is provided on the lower surface of the fixed type, The fixed plate includes a support column protruding toward the fixed type, The fixed type has a long hole, The cross-sectional shape of the long hole extends in the vertical direction, The support column passes through the long hole and supports the fixed type, The mold device according to claim 1, characterized in that.

3. When the elastic body is provided on the lower surface of the movable type, The movable plate includes a support column protruding toward the movable type, The movable type has a long hole, The cross-sectional shape of the long hole extends in the vertical direction, The support column passes through the long hole and supports the movable type, The mold device according to claim 1, characterized in that.

4. The cross-sectional shape of the long hole includes an upper portion and a lower portion disposed below the upper portion, The diameter of the upper portion is larger than the diameter of the lower portion, The mold device according to claim 2 or 3, characterized in that.

Images