Heat treatment apparatus and heat treatment method

The heat treatment apparatus addresses the challenge of maintaining uniform temperature across multiple regions by using a sophisticated power control system and judgment unit to adjust and correct temperature readings, thereby simplifying and expediting the process of ensuring temperature uniformity.

JP7684114B2Active Publication Date: 2025-05-27SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2021111123
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-07-02
Publication Date
2025-05-27
Estimated Expiration
2041-07-02

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Abstract

To provide a heat treatment device and a heat treatment method, capable of easily determining whether or not a detection temperature value in each region of a heat treatment plate is proper in a short time.SOLUTION: A heat treatment device comprises: a conversion part that converts an output value of a plurality of temperature sensors into each detection temperature value; a power control part 411 that applies a plurality of power operation amounts corresponding to a plurality of regions to a power supply circuit 412 so that the plurality of detection temperature values are matched to a target temperature value; a storage part 450 that stores a proper operation amount that has to be applied to the power supply circuit by the power control part 411 in the case where the detection temperature value of each region obtained by the converter part is in a proper state; an operation amount acquisition part 440 that acquires the power operation amount in each region applied to the power supply circuit by the power control part 411; and a determination part 480 that determines whether or not the detection temperature value corresponding to each region is in the proper state on the basis of the proper operation amount in each region stored in the storage part 450 and the power operation amount of each region acquired by the operation amount acquisition part 440.SELECTED DRAWING: Figure 6
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Citation Information

Patent Citations

  • Heat treatment apparatus

    JP1994104248A

  • Substrate treatment equipment

    JP1999162812A

  • Device and method for heat treatment

    JP2005011852A

  • Substrate processing apparatus and method therefor

    JP2007053191A

  • Substrate heat treatment device and substrate heat treatment method

    JP2013162097A