Laser processing apparatus in liquid, and jig for laser processing apparatus in liquid

Abstract

To achieve excellent processing performance by appropriately holding assist gas with respect to a processed part to which laser is emitted.SOLUTION: An in-liquid laser processing device processes an object 2 to be processed, by emitting laser to the object while supplying assist gas in liquid. The device comprises a nozzle 4 and an assist gas holding part 20. The nozzle 4 has a tip part 4b that can supply assist gas and emit laser. The assist gas holding part 20 is supported together with the nozzle 4, which has an opening part 2a which extends along the object 2 to be processed and opens towards the object 2 to be processed, when the nozzle 4 is arranged to oppose to the object 2 to be processed.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a laser processing apparatus in liquid and a jig for a laser processing apparatus in liquid.

Background Art

[0002] For example, in the demolition work of in-reactor structures where the object to be processed is in water (liquid), a laser is irradiated onto the object to be processed in water for processing (such as cutting). In a laser processing apparatus in liquid used for such processing work, in order to suppress laser attenuation by passing through water, assist gas is supplied from a nozzle irradiated with the laser to the processing location to form a cavity where there is no liquid on the front or back surface of the processing location, thereby improving processing performance. For example, Patent Document 1 discloses a head shape for maintaining a constant distance between a condenser lens for irradiating a laser and an object to be processed in a laser processing head (nozzle) for performing laser surface modification processing on an in-reactor structure that is the object to be processed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, as in Patent Document 1 above, when continuously performing laser processing while moving the nozzle while maintaining a constant distance from the object to be processed, the assist gas supplied from the nozzle tends to flow to the side opposite to the advancing direction of the nozzle, and it is difficult to stably form a cavity at the processing location irradiated with the laser. As a means for solving this problem, for example, it is conceivable to increase the speed or amount of supply of the assist gas from the nozzle, but such supply of the assist gas requires a lot of energy. In particular, when the object to be processed is in deep water, the energy required for supplying the assist gas increases.

[0005] At least one aspect of the present disclosure has been made in view of the above circumstances, and an object thereof is to provide a submerged laser processing apparatus capable of realizing excellent processing performance by suitably holding an assist gas with respect to a processing portion irradiated with a laser, and a jig for a submerged laser processing apparatus.

Means for Solving the Problems

[0006] The submerged laser processing apparatus according to at least one aspect of the present disclosure is, in order to solve the above problems, A submerged laser processing apparatus for processing a processing object by irradiating a laser while supplying an assist gas in a liquid, A nozzle having a tip capable of supplying the assist gas and irradiating the laser, At least one assist gas holding portion that is supported together with the nozzle and has an opening portion that extends along the processing object and opens toward the processing object when the nozzle is disposed opposite to the processing object. Comprising.

[0007] The jig for a submerged laser processing apparatus according to at least one aspect of the present disclosure is, in order to solve the above problems, In a submerged laser processing apparatus for processing a processing object by irradiating a laser while supplying an assist gas in a liquid, a jig for a submerged laser processing apparatus attached to a nozzle having a tip capable of supplying the assist gas and irradiating the laser, At least one assist gas holding portion that is supported together with the nozzle and has an opening portion that extends along the processing object and opens toward the processing object.

Effects of the Invention

[0008] According to at least one aspect of the present disclosure, it is possible to provide a submerged laser processing apparatus capable of realizing excellent processing performance by suitably holding an assist gas with respect to a processing location irradiated with a laser, and a jig for the submerged laser processing apparatus.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0010] Hereinafter, several embodiments will be described with reference to the accompanying drawings. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described as embodiments or shown in the drawings are not intended to limit the scope of the invention thereto, but are merely illustrative examples.

[0011] With reference to FIG. 1, the configuration of a submerged laser processing apparatus 1 according to one embodiment will be described. FIG. 1 is an overall configuration diagram of the submerged laser processing apparatus 1 according to one embodiment, FIG. 2 is an enlarged cross-sectional view of the vicinity of the tip portion 4b of the submerged laser processing apparatus 1 according to one embodiment, and FIG. 3 is a perspective view of the submerged laser processing apparatus 1 according to one embodiment.

[0012] The underwater laser processing apparatus 1 is an apparatus for processing a workpiece 2 in a liquid by irradiating the laser L while supplying assist gas G to the workpiece 2 in the liquid. In the present embodiment, as the workpiece 2 of the underwater laser processing apparatus 1, an in-reactor structure immersed in water is exemplified. The in-reactor structure is composed of a metal material and is immersed at a depth of about 5 to 10 m.

[0013] As shown in FIG. 3, the workpiece 2 has a flat plate shape with a predetermined thickness as a basic shape, and a plurality of openings 2a having a substantially circular shape with an inner diameter R1 are provided on the surface thereof when viewed from a direction perpendicular to the surface. The plurality of openings 2a have the same inner diameter as each other, penetrate along the thickness direction of the workpiece 2, and are provided so as to be arranged at a predetermined interval.

[0014] Note that the configuration of the workpiece 2 shown in FIG. 1 is an example and is not limited within the range applicable to the underwater laser processing apparatus 1 as described below. Further, in the present embodiment, a case where the liquid in which the workpiece is immersed is water is exemplified, but the type of the liquid is not limited.

[0015] The underwater laser processing apparatus 1 includes a nozzle 4 for supplying the assist gas G and irradiating the laser L to such a workpiece 2. The nozzle 4 includes a main body portion 4a and a tip portion 4b (head) disposed so as to face the workpiece 2 during the processing operation. A laser oscillator 8 is connected to the nozzle 4 via a transmission fiber 6. The laser L generated by the laser oscillator 8 is transmitted through the transmission fiber 6, condensed by a condenser lens (not shown), and then irradiated onto the workpiece 2 by being ejected from the tip portion 4b of the nozzle 4 in the axial direction C.

[0016] The underwater laser processing apparatus 1 also has an assist gas supply system 10 for supplying an assist gas G. The assist gas G is, for example, compressed air. The assist gas supply system 10 includes a compressor 12, a filter 14, an air distribution board 16, and a supply pipe 18. The compressor 12 generates compressed air by compressing outside air. The compressed air generated by the compressor 12 passes through the filter 14, thereby removing foreign matters such as dust. The compressed air that has passed through the filter 14 is supplied as the assist gas G from the air distribution board 16 to the tip 4b of the nozzle 4 via the supply pipe 18.

[0017] The nozzle 4 capable of supplying the assist gas G and irradiating the laser L is supported by a support portion 9 provided in the underwater laser processing apparatus 1 in a posture where the tip 4b faces the workpiece 2. The support portion 9 is, for example, an arm member, and stably supports the nozzle 4 with respect to a support target (not shown). The arm member is appropriately configured such that the tip 4b of the nozzle 4 faces the processing target portion of the workpiece 2, and may be composed of a single member or a plurality of members.

[0018] The support portion 9 is movable along the surface of the workpiece 2 together with the nozzle 4 which is the support target. In laser processing, while such a support portion 9 moves along the surface of the workpiece 2, the assist gas G is supplied by the nozzle 4 and the laser L is irradiated, thereby performing a laser processing (laser cutting) operation along a predetermined pattern.

[0019] In addition, in the present embodiment, the support portion 9 supports the nozzle 4 so as to be inclined with respect to the surface of the workpiece 2. This is to prevent the laser L emitted from the tip 4b of the nozzle 4 from being reflected from the surface of the workpiece 2 and the tip 4b from directly receiving the reflected light. However, the support portion 9 may support the nozzle 4 perpendicular to the surface of the workpiece 2.

[0020] The laser processing apparatus 1 in liquid includes at least one assist gas holding part 20. The assist gas holding part 20 is configured to have an opening part that extends along the workpiece 2 and opens toward the workpiece 2 when the nozzle 4 is disposed to face the workpiece 2. The assist gas holding part 20 is supported together with the nozzle 4 by the aforementioned support part 9, and thus is movable relative to the workpiece 2 while maintaining a fixed relative positional relationship with the nozzle 4.

[0021] In addition, in the embodiment shown in FIG. 2, the case where the assist gas holding part 20 is supported by the common support part 9 with the nozzle 4 is illustrated. However, the support part for supporting the assist gas holding part 20 and the support part for supporting the nozzle 4 may be configured to be independent of each other.

[0022] In this embodiment, as the assist gas holding part 20, a first assist gas holding part 20A is provided so as to face a surface (back surface) symmetric to the nozzle 4 with respect to the workpiece 2. The first assist gas holding part 20A includes at least a plate member 20A1 extending along the workpiece 2. When the laser L is irradiated from the nozzle 4, the workpiece 2 is melted by the laser L and a cutting groove 25 is formed. A part of the assist gas G supplied from the nozzle 4 leaks to the back surface side of the workpiece 2 through the cutting groove 25. The plate member 20A1 extends along the workpiece 2, thereby preferably receiving the assist gas G that has reached the back surface side from the nozzle 4 through the cutting groove 25 formed in the workpiece 2, and holding the assist gas G by suppressing the diffusion of the assist gas G to the surroundings. Thereby, a cavity due to the assist gas G can be stably formed on the back surface side of the workpiece 2, and the quality of the laser processing can be preferably improved.

[0023] Further, the first assist gas holding part 20A may include an edge member 20A2 that is at least partially provided along the edge of the plate member 20A1 and extends so as to protrude toward the workpiece 2. By having such an edge member 20A2, the diffusion of the assist gas G received by the plate member 20A1 to the surroundings can be better prevented.

[0024] In this embodiment, the edge member 20A2 is provided along the entire circumference along the edge of the plate member 20A1. As a result, the first assist gas holding portion 20A has a box shape with an opening on the side of the object to be processed 2, and the assist gas G can be held more suitably. Note that the edge member 20A2 may be provided partially along the edge of the plate member 20A1. In this case, although the above-described effect is reduced compared to the case where it is provided over the entire circumference, the same effect can still be enjoyed to some extent.

[0025] The edge member 20A2 may be configured to be deformable, for example, by being formed in a mesh shape. In this case, since the edge member 20A2 is deformable, even if a gap is formed between the back surface of the object to be processed 2 and the first assist gas holding portion 20A due to the displacement of the nozzle 4, it is possible to effectively prevent the assist gas G held by the first assist gas holding portion 20A from leaking to the surroundings.

[0026] Further, the first assist gas holding portion 20A is provided so as to reach the optical path of the laser L irradiated from the nozzle 4. As a result, when the laser L irradiated from the nozzle 4 penetrates the cutting groove 25 formed in the object to be processed 2, by receiving the laser L with the first assist gas holding portion 20A, with the first assist gas holding portion 20A as a reference, other components (not shown) on the side of the object to be processed 2 opposite to the first assist gas holding portion 20A (the side opposite to the object to be processed 2 with respect to the first assist gas holding portion 20A when viewed in the axial direction C) can be protected from being exposed to the laser L. That is, it can function as a beam damper for blocking the laser L for other components.

[0027] Further, the first assist gas holding portion 20A may be provided so as to extend rearward with respect to the processing direction from a position corresponding to the nozzle 4 when viewed from the vertical direction of the object 2 to be processed. In the underwater laser processing apparatus 1, since the laser L is irradiated while supplying the assist gas G to the object 2 to be processed and advances in the processing direction, the assist gas G reaching the back surface of the object 2 to be processed through the cutting groove 25 formed in the object 2 to be processed easily flows rearward with respect to the processing direction. Therefore, by providing the first assist gas holding portion 20A within such a range, the assist gas G that easily flows rearward can be suitably held.

[0028] Further, the first assist gas holding portion 20A may be configured such that the assist gas G is directly supplied thereto. As shown in FIG. 2, an assist gas supply portion 21 is provided in the first assist gas holding portion 20A (the bottom surface of the plate member 20A1), and the assist gas G is supplied to the assist gas supply portion 21 through a supply route independent of the route of the assist gas G supplied from the nozzle 4. In this way, by directly supplying the assist gas G from a supply source (not shown) to the first assist gas holding portion 20A, the assist gas can be more stably held between the back surface of the object 2 to be processed and the first assist gas holding portion 20A.

[0029] FIG. 4 is an overall configuration diagram of the first modification of FIG. 1, FIG. 5 is a cross-sectional view showing the vicinity of the tip portion 4b of the first modification from the side, and FIG. 6 is a perspective view of the first modification. In the first modification, as the assist gas holding portion 20, a second assist gas holding portion 20B is provided so as to face the surface of the object 2 to be processed (the surface on the nozzle 4 side with respect to the object 2 to be processed). The second assist gas holding portion 20B includes at least a plate member 20B1 that extends along the object 2 to be processed. By extending along the object 2 to be processed, the plate member 20B1 suitably receives the assist gas supplied from the nozzle 4 to the object 2 to be processed, and holds the assist gas G by suppressing the diffusion of the assist gas G supplied to the object 2 to be processed to the surroundings. Thereby, a cavity due to the assist gas G can be stably formed on the surface side of the object 2 to be processed, and the quality of the laser processing can be suitably improved.

[0030] Further, the second assist gas holding part 20B may be configured to include an edge member 20B2 that is at least partially provided along the edge of the plate member 20B1 and extends so as to protrude toward the object to be processed 2. By having such an edge member 20B2, it is possible to better prevent the assist gas G received by the plate member 20B1 from diffusing to the surroundings.

[0031] In addition, in FIGS. 4 to 6, the support part 9 that supports the second assist gas holding part 20B is configured to be shorter than in the embodiment shown in FIGS. 1 to 3 so as not to penetrate the object to be processed 2 and reach the back side. As a result, when the nozzle 4 is moved along the processing direction, the support part 9 does not interfere with the object to be processed 2, so that by moving the nozzle 4 along the object to be processed 2, it is possible to smoothly shift to the next adjacent processing position.

[0032] In the present embodiment, the edge member 20B2 is provided over the entire circumference along the edge of the plate member 20B1. As a result, the second assist gas holding part 20B has a box shape with an opening on the side of the object to be processed 2, and the assist gas G can be held more suitably. Note that the edge member 20B2 may be partially provided along the edge of the plate member 20B1. Also in this case, it is possible to prevent the assist gas G from diffusing to the surroundings.

[0033] The edge member 20B2 may be configured to be deformable, for example, by being formed in a mesh shape. In this case, since the edge member 20B2 is deformable, even if the nozzle 4 is displaced, a gap is generated between the surface of the object to be processed 2 and the second assist gas holding part 20B, so that it is possible to effectively prevent the assist gas G held by the second assist gas holding part 20B from leaking to the surroundings.

[0034] Further, the second assist gas holding part 20B may be provided so as to extend rearward in the processing direction from the position corresponding to the nozzle 4 when viewed from the vertical direction of the object 2 to be processed. In the underwater laser processing apparatus 1, since the laser L is irradiated while supplying the assist gas G to the object 2 to be processed and advances in the processing direction, the assist gas G on the surface of the object 2 to be processed easily flows rearward with respect to the processing direction. Therefore, by providing the second assist gas holding part 20B within such a range, the assist gas G that easily flows rearward can be suitably held.

[0035] FIG. 7 is a perspective view of a second modification, FIG. 8 is a cross-sectional view showing the vicinity of the tip 4b of the second modification from the side, and FIG. 9 is a perspective view of the second modification. In the second modification, as the assist gas holding part 20, a first assist gas holding part 20A arranged so as to face the back surface of the object 2 to be processed and a second assist gas holding part 20B arranged so as to face the front surface of the object 2 to be processed are provided. By providing both the first assist gas holding part 20A and the second assist gas holding part 20B as described above, the underwater laser processing apparatus 1 can stably form cavities by the assist gas G over a wide range including the front and back surfaces of the object 2 to be processed, and can suitably improve the quality of the laser processing.

[0036] In addition, although FIG. 7 illustrates the case where the first assist gas holding part 20A and the second assist gas holding part 20B are supported by a common support part 9, the support part for supporting the first assist gas holding part 20A and the support part for supporting the second assist gas holding part 20B may be configured to be independent of each other.

[0037] As described above, according to each of the above embodiments, by arranging the assist gas holding portion 20 so as to face the object to be processed 2, at least a part of the assist gas G supplied from the nozzle 4 to the object to be processed 2 can be held by the assist gas holding portion 20. Thereby, it is possible to suppress the escape of the assist gas G supplied to the object to be processed 2 to the surroundings, secure a cavity in the optical path of the laser L, and suppress the attenuation of the laser in the liquid. Further, the assist gas holding portion 20 prevents the dross generated by melting the object to be processed 2 when the laser L is irradiated to the object to be processed 2 from diffusing to the surroundings. Thereby, the performance of laser processing in the liquid can be effectively improved.

[0038] In addition, within the scope not departing from the gist of the present disclosure, it is possible to appropriately replace the components in the above-described embodiments with well-known components, and the above-described embodiments may be appropriately combined.

[0039] The content described in each of the above embodiments is understood as follows, for example.

[0040] (1) A submerged laser processing apparatus according to one aspect is a submerged laser processing apparatus (1) for processing an object to be processed (2) by irradiating a laser (L) while supplying an assist gas (G) in a liquid, a nozzle (4) having a tip portion (4b) capable of supplying the assist gas and irradiating the laser, at least one assist gas holding portion (20) supported together with the nozzle and having an opening portion that extends along the object to be processed and opens toward the object to be processed when the nozzle is disposed to face the object to be processed, and is provided with.

[0041] According to the aspect (1) above, by arranging the assist gas holding part so as to face the object to be processed, at least a part of the assist gas supplied from the nozzle to the object to be processed can be held by the assist gas holding part. As a result, it is possible to suppress the escape of the assist gas supplied to the object to be processed to the surroundings, secure a cavity in the optical path of the laser, and suppress the attenuation of the laser in the liquid. In addition, the assist gas holding part prevents the dross generated by melting the object to be processed by irradiating the object to be processed with a laser from diffusing to the surroundings. Thereby, the performance of laser processing in the liquid can be effectively improved.

[0042] (2) In another aspect, in the aspect (1) above, The at least one assist gas holding part includes a first assist gas holding part (20A) facing a plane symmetric to the nozzle with respect to the object to be processed.

[0043] According to the aspect (2) above, by providing the assist gas holding part so as to face a plane symmetric to the nozzle with respect to the object to be processed, it is possible to satisfactorily hold the assist gas generated on the surface side of the object to be processed when the object to be processed is laser processed.

[0044] (3) In another aspect, in the aspect (2) above, The first assist gas holding part reaches the optical path of the laser irradiated from the nozzle.

[0045] According to the aspect (3) above, the first assist gas holding part disposed on the back surface of the object to be processed is provided so as to reach the optical path of the laser irradiated from the nozzle. Thereby, when the laser penetrates the object to be processed, the first assist gas holding part can receive the laser, so that other components on the plane side symmetric to the nozzle with respect to the object to be processed can be prevented from being exposed to the laser.

[0046] (4) In another aspect, in the aspect (2) or (3) above, The assist gas can be directly supplied to the first assist gas holding part.

[0047] According to the aspect of (4) above, by directly supplying the assist gas to the first assist gas holding part, the assist gas can be held more stably between the back surface of the object to be processed and the first assist gas holding part.

[0048] (5) In another aspect, in any one of the aspects (1) to (4) above, the at least one assist gas holding part includes a second assist gas holding part (20B) facing the surface of the object to be processed.

[0049] According to the aspect of (5) above, by providing the assist gas holding part so as to face the surface of the object to be processed, the assist gas supplied to the object to be processed can be held well.

[0050] (6) In another aspect, in any one of the aspects (1) to (5) above, the at least one assist gas holding part is a plate member (20A1, 20B1) extending along the object to be processed, and an edge member (20A2, 20B2) provided at least partially along the edge of the plate member and extending so as to protrude toward the object to be processed, and includes.

[0051] According to the aspect of (6) above, the assist gas holding part is configured to include a plate member and an edge member. The plate member extends along the object to be processed, so as to preferably receive the assist gas supplied from the nozzle to the object to be processed, and the edge member prevents the assist gas received by the plate member from diffusing to the surroundings. Thereby, an assist gas holding part capable of holding well the assist gas supplied to the object to be processed can be obtained.

[0052] (7) In another aspect, in the aspect of (6) above, at least a part of the edge member is composed of a deformable member.

[0053] According to the aspect (7) above, at least a part of the edge member constituting the assist gas holding part is made into a deformable member such as a mesh-like member or an elastic body. Since the edge member is deformable in this way, even if a gap is generated between the surface symmetric to the nozzle with respect to the workpiece and the assist gas holding part due to the displacement of the nozzle, it is possible to more effectively prevent the assist gas held by the assist gas holding part from diffusing to the surroundings.

[0054] (8) In another aspect, in any one of the aspects (1) to (7) above, the nozzle irradiates the laser to cut the workpiece.

[0055] According to the aspect (8) above, it is possible to realize a submerged laser processing apparatus that can effectively perform a so-called laser cutting operation of cutting a workpiece with a laser in a liquid.

[0056] (9) A jig for a submerged laser processing apparatus according to one aspect is a jig for a submerged laser processing apparatus (1) for processing a workpiece (2) by irradiating a laser (L) while supplying an assist gas (G) in a liquid, the jig being attached to a nozzle (4) having a tip portion (4b) capable of supplying the assist gas and irradiating the laser, comprising at least one assist gas holding part (20) that is supported together with the nozzle and has an opening portion that extends along the workpiece and opens toward the workpiece when the nozzle is disposed opposite to the workpiece.

[0057] According to the aspect of (9) above, by arranging the assist gas holding part so as to face the object to be processed, at least a part of the assist gas supplied from the nozzle to the object to be processed can be held by the assist gas holding part. As a result, it is possible to suppress the escape of the assist gas supplied to the object to be processed to the surroundings, secure a cavity in the optical path of the laser, and suppress the attenuation of the laser in the liquid. In addition, the assist gas holding part prevents the dross generated by laser processing from diffusing to the surroundings. Thereby, the performance of laser processing in the liquid can be effectively improved.

Explanation of Signs

[0058] 1 Submerged laser processing apparatus 2 Object to be processed 2a Opening 4 Nozzle 4a Main body part 4b Tip part 6 Transmission fiber 8 Laser oscillator 9 Support part 10 Assist gas supply system 12 Compressor 14 Filter 16 Empty board 18 Supply pipe 20 Assist gas holding part 20A First assist gas holding part 20A1, 20B1 Plate member 20A2, 20B2 Edge member 20B Second assist gas holding part 21 Assist gas supply part C Axial direction G Assist gas L Laser

Claims

1. A submerged laser processing apparatus for processing a workpiece by irradiating a laser while supplying an assist gas in a liquid, comprising: a nozzle having a tip capable of supplying the assist gas and irradiating the laser; at least one assist gas holding portion supported together with the nozzle and having an opening portion that extends along the workpiece and opens toward the workpiece when the nozzle is disposed opposite to the workpiece; The submerged laser processing apparatus according to claim 1, further comprising: wherein the at least one assist gas holding portion includes a first assist gas holding portion facing a plane symmetric to the nozzle with respect to the workpiece.

2. The submerged laser processing apparatus according to claim 1, wherein the first assist gas holding portion reaches the optical path of the laser irradiated from the nozzle.

3. The submerged laser processing apparatus according to claim 1 or 2, wherein the assist gas can be directly supplied to the first assist gas holding portion.

4. The submerged laser processing apparatus according to any one of claims 1 to 3, wherein the at least one assist gas holding portion includes a second assist gas holding portion facing the surface of the workpiece.

5. The at least one assist gas holding portion includes: a plate member extending along the workpiece; an edge member provided at least partially along an edge of the plate member and extending so as to protrude toward the workpiece; The submerged laser processing apparatus according to any one of claims 1 to 4, further comprising:

6. The submerged laser processing apparatus according to claim 5, wherein at least a part of the edge member is formed of a deformable member.

7. The submerged laser processing apparatus according to any one of claims 1 to 6, wherein the nozzle irradiates the laser to cut the workpiece.

8. A submerged laser processing apparatus for processing a workpiece by irradiating a laser while supplying an assist gas in a liquid, comprising: a nozzle having a tip capable of supplying the assist gas and irradiating the laser; at least one assist gas holding portion configured as a separate member from the nozzle and having an opening portion that extends along the workpiece and opens toward the workpiece when the nozzle is disposed opposite to the workpiece; a support part that supports the nozzle so that the tip part faces the surface of the object to be processed, and supports the at least one assist gas holding part so that the opening faces either the front or back surface of the object to be processed; comprising; the at least one assist gas holding part; a plate member extending along the object to be processed; an edge member provided at least partially along the edge of the plate member and extending so as to protrude toward the object to be processed; A submerged laser processing apparatus comprising.

9. The submerged laser processing apparatus according to claim 8, wherein the at least one assist gas holding part includes a second assist gas holding part that faces the surface of the object to be processed and is arranged behind the nozzle in the processing direction when viewed from the vertical direction of the object to be processed.

10. In a submerged laser processing apparatus for processing an object to be processed by irradiating a laser while supplying an assist gas in a liquid, a jig for a submerged laser processing apparatus attached to a nozzle having a tip part capable of supplying the assist gas and irradiating the laser, comprising at least one assist gas holding part that is supported together with the nozzle and has an opening that extends along the object to be processed and opens toward the object to be processed when the nozzle is disposed opposite the object to be processed; The jig for a submerged laser processing apparatus, wherein the at least one assist gas holding part includes a first assist gas holding part that faces a plane symmetric to the nozzle with respect to the object to be processed.

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