Mold device for hot press forming and hot press forming method

JP7686312B1Active Publication Date: 2025-06-02IMAIZUMI IND CO LTD
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Patent Information

Application Number
JP2024078045
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-05-13
Publication Date
2025-06-02
Estimated Expiration
2044-05-13

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Abstract

【Problem】To enable a press forming part to be provided with high precision in a part of a plate-shaped work member made of a thermoplastic synthetic resin or the like. 【Solution】A mold device 1 for hot press forming, which is equipped with first and second molds 2 and 3 that are mounted on a press brake 101, are positioned relative to each other and overlapped to perform hot press forming on a plate-shaped work member 110. A work member mounting portion 5 on which the work member is mounted is provided on the overlapping surface side of the first mold and the second mold, and a press forming portion 8 for forming a work forming portion on the work member mounted on the work member mounting portion is provided between the first mold and the second mold. Further, a sheathed heater 106 and a temperature controller 107 for controlling and heating the heating temperature of the work member supported between the first mold and the second mold overlapped with each other are provided. 【Selected Drawing】Figure 2
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Citation Information

Patent Citations

  • Method and device for resin sealing

    JP2008283111A

  • Hot press molding apparatus and mold system for the apparatus

    JP2009073114A

  • Form used for press machine, and method for manufacturing board product

    JP2022104168A