Thermal transfer sheet and method for manufacturing a transfer product
JP7686340B1Pending Publication Date: 2025-06-02MARUAI CORP
Patent Information
- Application Number
- JP2025014462
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-01-31
- Publication Date
- 2025-06-02
- Estimated Expiration
- 2045-01-31
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Abstract
【Problem】To provide a thermal transfer sheet and a method for manufacturing a transferred product that can suppress disconnection of a transferred conductive layer and an increase in resistance value due to deformation of a substrate to be transferred even when printing a fine conductive pattern. 【Solution】The thermal transfer sheet of the present invention is a thermal transfer sheet that is disposed between a foil stamper having a pattern formed thereon and a substrate to be transferred and is thermally transferred. The thermal transfer sheet includes a substrate and a transfer layer. The transfer layer includes, in this order from the substrate side, a conductive layer containing carbon nanotubes or a conductive polymer, and an adhesive layer that melts by heating of the foil stamper. Further, the thermal transfer sheet of the present invention is a thermal transfer sheet that is laminated on a substrate to be transferred having a pattern formed by a heat-melting material and is thermally transferred. The thermal transfer sheet includes a substrate and a transfer layer. The transfer layer includes a conductive layer containing carbon nanotubes or a conductive polymer. 【Selected Drawing】Figure 1
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Citation Information
Patent Citations
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