Film with adhesive tablets, method for manufacturing a connector, and adhesive composition

Abstract

To provide a film with an adhesive piece-attached to one side, which has an adhesive piece superior in adhesiveness, and capable of reducing a quantity of exudation and suppressing the generation of a void.SOLUTION: An adhesive piece-attached film 10 comprises a belt-shaped carrier film 1 of 100 mm or less in width, and a plurality of adhesive pieces 3p disposed on the carrier film 1 so as to be arrayed along a longitudinal direction (i.e. a direction of the arrow X) of the carrier film 1. The plurality of adhesive pieces 3p have a storage elastic modulus of 600-3000 MPa at 25°C. The plurality of adhesive pieces 3p have a melt viscosity of 5000-9000 Pa s at 120°C.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an adhesive sheet-attached film, a method for manufacturing a connector, and an adhesive composition.

Background Art

[0002] Conventionally, semiconductor devices have been manufactured through the following steps. First, a semiconductor wafer is attached to a dicing adhesive sheet, and in that state, the semiconductor wafer is diced into semiconductor chips. Thereafter, a pick-up step, a mounting step, a reflow step, a die bonding step, etc. are carried out. Patent Document 1 discloses an adhesive sheet (die bond dicing sheet) having both a function of fixing a semiconductor wafer in a dicing step and a function of bonding a semiconductor chip to a substrate in a die bonding step.

[0003] In recent years, with the evolution of semiconductor devices for small devices typified by smartphones, the manufacturing process of conventional semiconductor devices has also changed significantly from the conventional one. For example, processes that do not perform a dicing step and a die bonding step using the adhesive sheet (die bond dicing sheet) described in Patent Document 1, or processes that do not perform a reflow step, are being put into practical use. Along with this, new types of adhesive films used in the manufacturing process of semiconductor devices are also required. Based on such a situation, in order to cope with the reduction in area, high functionality, thinning, etc. of small devices on which semiconductor devices are mounted, a carrier film that is easy to use for adhering semiconductor chips having corresponding shapes to limited specific regions of a substrate, and an adhesive sheet-attached film including a plurality of adhesive pieces arranged on the carrier film are being developed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, according to the study of the present inventors, when the adhesive piece of the adhesive piece-attached film is reduced in area (for example, 50 mm 2 or less), the amount of bleeding of the adhesive composition constituting the adhesive piece from the adhesive piece increases. For example, it has been found that transfer may occur on the back surface of the carrier film when the adhesive piece-attached film is wound around a reel.

[0006] Therefore, the main object of the present disclosure is to provide an adhesive piece-attached film including an adhesive piece that is excellent in adhesiveness, reduces the amount of bleeding, and further suppresses the generation of voids.

Means for Solving the Problems

[0007] One aspect of the present disclosure relates to an adhesive piece-attached film. The adhesive piece-attached film includes a strip-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged on the carrier film so as to be aligned in the longitudinal direction of the carrier film. The storage elastic modulus of the adhesive piece at 25°C is 600 to 3000 MPa, and the melt viscosity of the adhesive piece at 120°C is 5000 to 9000 Pa·s. According to such an adhesive piece in the adhesive piece-attached film, it is possible to be excellent in adhesiveness, reduce the amount of bleeding, and further suppress the generation of voids.

[0008] According to such an adhesive piece-attached film, a plurality of adhesive pieces arranged side by side on the carrier film can be sequentially picked up, and then each adhesive piece can be arranged in a predetermined region of the adherend, and the adhesion process between the adherends can be efficiently performed. The combination of the adherends can be, for example, a combination of a semiconductor chip and a flexible printed circuit board (FPC board). For example, in the mode where the strip-shaped adhesive piece-attached film is wound around a reel, the adhesion process can be performed more efficiently by the roll-to-roll method. The shape of the adhesive piece can be appropriately set according to the shape of the adherend.

[0009] The film with adhesive pieces can be applied, for example, to the manufacture of semiconductor devices. The film with adhesive pieces can be applied, for example, to the adhesion between a semiconductor chip and an FPC substrate.

[0010] The size, number, etc. of the adhesive pieces arranged on the carrier film can be appropriately set according to the design of the connector to be manufactured. The area of one adhesive piece can be, for example, 3 to 50 mm 2 It may be. On the carrier film, one or a plurality of rows composed of the plurality of adhesive pieces may be formed. The plurality of adhesive pieces can be formed, for example, by die-cutting an adhesive layer formed to cover the surface of the carrier film.

[0011] The film with adhesive pieces covers the second surface opposite to the first surface on the carrier film side of the adhesive piece, and may further include a protective member having the same shape as the adhesive piece. By covering the adhesive piece with the protective member, it is possible to prevent dust etc. from adhering to the adhesive piece until it is used. The adhesive piece and the protective member can be formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film arranged to cover the adhesive layer.

[0012] Another aspect of the present disclosure relates to a method for manufacturing a connector including a semiconductor chip and a circuit board. The method for manufacturing the connector includes a step of interposing the adhesive piece of the film with adhesive pieces between the semiconductor chip and the circuit board and adhering the semiconductor chip and the circuit board, a step of heating the adhesive piece at 100 to 175 ° C. for 30 to 360 minutes, and a step of wire bonding the semiconductor chip and the circuit board in this order. The circuit board can be a flexible printed circuit board.

[0013] Another aspect of the present disclosure relates to an adhesive composition. The adhesive composition has a storage elastic modulus of 600 to 3000 MPa at 25 ° C. and a melt viscosity of 5000 to 9000 Pa·s at 120 ° C. The adhesive composition is, for example, in the form of a film.

Advantages of the Invention

[0014] According to the present disclosure, there is provided a film with an adhesive piece that includes an adhesive piece having excellent adhesiveness, reducing the amount of bleeding, and further suppressing the generation of voids. Further, according to the present disclosure, there is provided a method for manufacturing a connector using the film with an adhesive piece. Furthermore, according to the present disclosure, there is provided an adhesive composition useful for forming an adhesive piece having excellent adhesiveness, reducing the amount of bleeding, and further suppressing the generation of voids.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present disclosure will be described with appropriate reference to the drawings. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the components (including steps, etc.) are not essential unless otherwise specified. The sizes of the components in each figure are conceptual, and the relative size relationships between the components are not limited to those shown in each figure.

[0017] In this specification, a numerical range indicated using "~" indicates a range including the numerical values described before and after "~" as the minimum value and the maximum value, respectively. In the numerical ranges described stepwise in this specification, the upper limit value or the lower limit value of a certain step's numerical range may be replaced with the upper limit value or the lower limit value of another step's numerical range. Also, in the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. Further, the individually described upper limit value and lower limit value can be arbitrarily combined. Also, in this specification, "(meth)acrylate" means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as "(meth)acryloyl". Also, "(poly)" means both cases with and without the prefix "poly". Also, "A or B" means that either A or B may be included, or both may be included. Also, the materials exemplified below may be used alone or in combination of two or more, unless otherwise specified. The content of each component in the composition means the total amount of the plurality of substances corresponding to each component in the composition, unless otherwise specified when there are a plurality of substances corresponding to each component in the composition.

[0018] [Film with Adhesive Pieces] FIG. 1 is a perspective view schematically showing an embodiment of a film with adhesive pieces. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1. The film with adhesive pieces 10 shown in these figures includes a strip-shaped carrier film 1 having a width of 100 mm or less, a plurality of adhesive pieces 3p arranged on the carrier film 1 so as to be aligned in the longitudinal direction (the direction of arrow X shown in FIG. 1), and a protective member 5p that covers the surface F2 of the adhesive piece 3p and has the same shape as the adhesive piece 3p. As shown in FIG. 2, the surface F2 (second surface) of the adhesive piece 3p is the surface on the side opposite to the surface F1 (first surface) of the adhesive piece 3p on the carrier film 1 side.

[0019] The film with adhesive pieces 10 can be applied, for example, to the manufacture of semiconductor devices. The film with adhesive pieces 10 can be applied, for example, to the adhesion between a semiconductor chip and an FPC substrate. According to the film with adhesive pieces 10, a plurality of adhesive pieces 3p arranged side by side on the carrier film 1 can be sequentially picked up, and then each adhesive piece 3p can be arranged in a predetermined region of the FPC substrate, and the adhesion process between the semiconductor chip and the FPC substrate can be efficiently carried out.

[0020] The storage elastic modulus of the adhesive piece 3p at 25°C is 600 to 3000 MPa. When the storage elastic modulus of the adhesive piece 3p at 25°C is in such a range, the semiconductor chip can be accurately adhered in a limited region of the FPC substrate. Also, when the storage elastic modulus of the adhesive piece 3p at 25°C is 600 MPa or more, it is easy to maintain the shape and the amount of bleeding tends to be reduced. When the storage elastic modulus of the adhesive piece 3p at 25°C is 3000 MPa or less, the adhesive layer does not become too hard and it is easy to perform die cutting into a desired shape. The storage elastic modulus of the adhesive piece 3p at 25°C may be, for example, 650 MPa or more, 700 MPa or more, or 800 MPa or more, and may also be 2500 MPa or less, 2000 MPa or less, or 1500 MPa or less.

[0021] In this specification, the storage elastic modulus of the adhesive sheet 3p at 25°C is a value measured by the following method. First, an adhesive sheet (adhesive layer) with a thickness of 25 μm is bonded to a Teflon (registered trademark) sheet and pressed with a roll (temperature 60°C, line pressure 0.2 MPa, feed rate 0.5 m / min). Then, the PET film is peeled off, and another adhesive layer with a thickness of 25 μm is stacked on the adhesive sheet and laminated while being pressed. This is repeated to obtain an adhesive sample with a thickness of approximately 300 μm. The storage elastic modulus of the obtained adhesive sample is measured in the temperature range of 20 to 200°C using a dynamic elastic modulus measuring device (manufactured by UBM Co., Ltd., product name: E4000HP) under the conditions of a width of 4 mm, a length of 20 mm, a temperature increase rate of 3°C / min, and a frequency of 10 Hz. From this measurement result, the storage elastic modulus at 25°C is determined.

[0022] The storage elastic modulus of the adhesive sheet 3p at 25°C can be increased, for example, by increasing the proportion of a thermosetting resin having a melting point of around room temperature (25°C) or higher.

[0023] The melt viscosity of the adhesive sheet 3p at 120°C is 5000 to 9000 Pa·s. When the melt viscosity of the adhesive sheet 3p at 120°C is 5000 Pa·s or more (the adhesive sheet 3p is moderately hard at 120°C), it is possible to sufficiently suppress a change in the thickness of the adhesive sheet (the adhesive composition interposed between the semiconductor chip and the FPC substrate) in the wire bonding process performed after the bonding process. As a result, there is a tendency to achieve excellent wire bondability. In the wire bonding process, since the positions (for example, height positions) to be connected of the semiconductor chip and the FPC substrate are preset in advance, if the thickness of the adhesive layer becomes non-uniform or excessively thick, wire bonding may not be suitably performed in some cases. When the melt viscosity of the adhesive sheet 3p at 120°C is 9000 Pa·s or less (the adhesive sheet 3p is moderately soft at 120°C), excellent adhesion can be achieved in the bonding process between the semiconductor chip and the FPC substrate, and furthermore, there is a tendency to suppress the generation of voids. The melt viscosity of the adhesive sheet 3p at 120°C may be, for example, 5200 Pa·s or more, 5500 Pa·s or more, or 6000 Pa·s or more, and may also be 8500 Pa·s or less, 8000 Pa·s or less, or 7500 Pa·s or less.

[0024] In this specification, the melt viscosity of the adhesive sheet 3p at 120°C is a value measured by the following method. First, an adhesive sheet (adhesive layer) with a thickness of 25 μm is bonded to a Teflon (registered trademark) sheet and pressed with a roll (temperature: 60°C, linear pressure: 0.2 MPa, feed rate: 0.5 m / min). Then, the PET film is peeled off, and another adhesive layer with a thickness of 25 μm is stacked on the adhesive sheet and laminated while being pressed. This is repeated to obtain an adhesive sample with a thickness of about 300 μm. The melt viscosity of the obtained adhesive sample is measured in the temperature range of 20 to 200°C under the conditions of a heating rate of 10°C / min and a frequency of 1 Hz using a viscoelasticity measuring device (manufactured by Rheometric Scientific F.E. Co., Ltd., trade name: ARES) with a parallel plate having a diameter of 8 mm as the measuring plate. The melt viscosity at 120°C is determined from this measurement result.

[0025] The melt viscosity of the adhesive sheet 3p at 120°C can be increased, for example, by a method such as increasing the proportion of the thermoplastic resin.

[0026] In the present embodiment, as shown in FIG. 1, an adhesive sheet 3p having a substantially rectangular (substantially rectangular) shape is illustrated. However, the shape of the adhesive sheet can be appropriately set according to the shape of the region of the FPC substrate to which the semiconductor chip is to be adhered or the shape of the semiconductor chip. The shape of the adhesive sheet may be a substantially rectangular (substantially rectangular) shape. In FIGS. 1 and 2, a case where a row 3A composed of a plurality of adhesive sheets 3p is provided in a row on the carrier film 1 is illustrated. However, two or more rows 3A may be provided on the carrier film 1.

[0027] The adhesive sheet 3p is assumed to be sufficiently small in size. The area of one adhesive sheet 3p is, for example, 3 to 50 mm 2 . The area of one adhesive sheet 3p is 5 mm 2 or more, 8 mm 2 or more, 10 mm 2 or more, or 15 mm 2 or more, and may be 45 mm 2 or less, 40 mm 2 or less, or 35 mm 2 or less.

[0028] When the shape of the adhesive sheet is a substantially rectangular shape, the width (short side) of the substantially rectangle may be, for example, 5 mm or less, 4 mm or less, 3.5 mm or less, or 3 mm or less. The width of the substantially rectangle may be, for example, 1 mm or more. The aspect ratio of the substantially rectangle (length (long side) of the substantially rectangle / width (short side) of the substantially rectangle) may be, for example, 1 or more, 2 or more, 3 or more, or 4 or more. The aspect ratio of the substantially rectangle may be, for example, 10 or less.

[0029] Hereinafter, the configuration of the film 10 with the adhesive sheet will be described. <Carrier film> As described above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive piece 3p disposed thereon and the number of columns 3A. For example, as shown in FIG. 1, when the number of columns 3A is one, the width of the carrier film 1 may be, for example, 10 to 50 mm, or may be 10 to 30 mm or 10 to 20 mm. When the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is adopted, it is easy to prevent a decrease in workability due to the carrier film 1 being twisted.

[0030] The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied in the manufacturing process of the film 10 with an adhesive piece and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of the visibility of the adhesive piece 3p and / or the protective member 5p disposed thereon. Examples of the carrier film 1 include polyester-based films such as polyethylene terephthalate films; polyolefin-based films such as polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyvinyl acetate films, poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, and ethylene-ethyl acrylate copolymers; and plastic films such as polyvinyl chloride films and polyimide films. The carrier film 1 may have a single-layer structure or a multilayer structure.

[0031] The thickness of the carrier film 1 can be appropriately selected within a range that does not impair workability. The thickness of the carrier film 1 is, for example, 10 to 200 μm, or may be 20 to 100 μm or 25 to 80 μm. These thickness ranges are practically problem-free and economically effective ranges.

[0032] From the perspective of enhancing the adhesion strength of the adhesive sheet 3p to the carrier film 1, the surface of the carrier film 1 may be subjected to chemical or physical surface treatments such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionization radiation treatment, etc. As the carrier film 1, a film with low surface energy made of a fluororesin can also be used. Examples of such films include A-63 (manufactured by Toyobo Film Solutions Co., Ltd., release agent: modified silicone-based), A-31 (manufactured by Toyobo Film Solutions Co., Ltd., release agent: Pt-based silicone-based), etc.

[0033] In order to prevent the adhesion strength of the adhesive sheet 3p to the carrier film 1 from becoming excessively high, a release agent layer composed of a release agent such as a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate-based release agent, etc. may be formed on the surface of the carrier film 1.

[0034] <Adhesive sheet> The adhesive sheet 3p can be formed together with the protective member 5p, for example, by simultaneously die-cutting an adhesive layer 3 formed to cover the surface of the carrier film 1 and a protective film 5 disposed to cover the adhesive layer 3 (see FIG. 4). The thickness of the adhesive sheet 3p can be appropriately selected within a range that does not impair workability. For example, it is 1 to 200 μm, and it may also be 3 to 150 μm or 5 to 150 μm. When the thickness of the adhesive sheet 3p is 1 μm or more, it tends to have sufficient adhesiveness. When the thickness of the adhesive sheet 3p is 200 μm or less, the adhesive composition constituting the adhesive sheet 3p tends to be easily suppressed from protruding from the protective member 5p.

[0035] The adhesive composition constituting the adhesive sheet 3p preferably has appropriate softness (adhesiveness) and the property of not stretching excessively at 120°C. The adhesive sheet 3p may contain, for example, a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may further contain a coupling agent, a photoreactive monomer, a photoinitiator, etc. as required.

[0036] (Thermoplastic resin) As the thermoplastic resin, a resin having thermoplasticity, or a resin having thermoplasticity at least in the uncured state and forming a crosslinked structure after heating can be used. From the viewpoints of shrinkage property, heat resistance, and peelability as a tape for semiconductor processing, the thermoplastic resin may be a (meth)acrylic copolymer having a reactive group (hereinafter, may also be referred to as a "reactive group-containing (meth)acrylic copolymer"). When the thermoplastic resin contains a reactive group-containing (meth)acrylic copolymer, the adhesive sheet 3p may be in a mode that does not contain a thermosetting resin. That is, the adhesive sheet 3p may be in a mode that contains a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler. The thermoplastic resin may be used alone or in combination of two or more kinds.

[0037] Examples of the (meth)acrylic copolymer include (meth)acrylate copolymers such as acrylic glass and acrylic rubber. The (meth)acrylic copolymer may be acrylic rubber. The acrylic rubber may be formed by copolymerization of a monomer selected from (meth)acrylate and acrylonitrile, with acrylate as a main component.

[0038] Examples of the (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, and the like. The (meth)acrylate copolymer may be, for example, a copolymer containing butyl acrylate and acrylonitrile as copolymerization components, or a copolymer containing ethyl acrylate and acrylonitrile as copolymerization components.

[0039] The reactive group-containing (meth)acrylic copolymer may be, for example, a reactive group-containing (meth)acrylic copolymer containing a (meth)acrylate monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth)acrylic copolymer can be obtained by copolymerizing a monomer composition containing a (meth)acrylate monomer having a reactive group and the above monomer.

[0040] Examples of the reactive group include an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, an episulfide group, etc. from the viewpoint of improving heat resistance. Among them, from the viewpoint of crosslinkability, the reactive group may be an epoxy group or a carboxyl group.

[0041] The reactive group-containing (meth)acrylic copolymer may be an epoxy group-containing (meth)acrylic copolymer containing a (meth)acrylate monomer having an epoxy group as a copolymerization component. Examples of the (meth)acrylate monomer having an epoxy group include glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl (meth)acrylate, etc. The (meth)acrylic monomer having a reactive group may be glycidyl (meth)acrylate from the viewpoint of heat resistance.

[0042] The Tg of the thermoplastic resin may be -50 to 50°C. When the Tg of the thermoplastic resin is 50°C or lower, it tends to be easy to ensure the flexibility of the adhesive sheet 3p. Also, when there are irregularities when attaching to the adherend, it tends to be easy to follow and has appropriate adhesiveness. When the Tg of the thermoplastic resin is -50°C or higher, it is easy to suppress the excessive increase in the flexibility of the adhesive sheet 3p, and it tends to achieve excellent handleability, adhesiveness, peelability, etc.

[0043] The Tg of the thermoplastic resin is the midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is the midpoint glass transition temperature calculated by measuring the heat quantity change under the conditions of a heating rate of 10 °C / min and a measurement temperature of -80 to 80 °C according to the method compliant with JIS K 7121:1987.

[0044] The weight average molecular weight of the thermoplastic resin may be 100,000 to 2,000,000. When the weight average molecular weight is 100,000 or more, it tends to be easier to ensure heat resistance when used for temporary fixing applications. When the weight average molecular weight is 2,000,000 or less, it tends to be easier to suppress the decrease in adhesiveness when used for temporary fixing applications. From the above viewpoints, the weight average molecular weight of the thermoplastic resin may be 500,000 to 2,000,000 or 1,000,000 to 2,000,000. The weight average molecular weight is a polystyrene conversion value using a calibration curve with standard polystyrene by gel permeation chromatography (GPC).

[0045] When the (meth)acrylic copolymer having a reactive group contains glycidyl (meth)acrylate as a copolymerization component, their total content may be 0.1 to 20% by mass, 0.5 to 15% by mass, or 1.0 to 10% by mass based on the total amount of the copolymerization components. When the content is within such a range, it tends to be easier to achieve all of the flexibility, adhesiveness, and peelability of the adhesive sheet 3p at a higher level.

[0046] As the (meth)acrylic copolymer having a reactive group, those obtained by polymerization methods such as pearl polymerization and solution polymerization can be used, and commercially available products can be used. Examples of commercially available products of the (meth)acrylic copolymer having a reactive group include HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Corporation), etc.

[0047] (Thermosetting resin) As the thermosetting resin, any resin that cures by heat can be used without particular limitation. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea resin, etc. These may be used alone or in combination of two or more. The thermosetting resin may be, for example, an epoxy resin.

[0048] The epoxy resin is not particularly limited as long as it cures and has a heat-resistant effect. Examples of the epoxy resin include bifunctional epoxy resins such as bisphenol A type epoxy, novolak type epoxy resins such as phenol novolak type epoxy resin and cresol novolak type epoxy resin, etc. Also, as the epoxy resin, conventionally known ones such as polyfunctional epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, glycidylamine type epoxy resin, heterocyclic ring-containing epoxy resin, alicyclic epoxy resin, etc. can be used. These may be used alone or in combination of two or more.

[0049] When using an epoxy resin as the thermosetting resin, an epoxy resin curing agent may be used as part of the thermosetting resin component. As the epoxy resin curing agent, known resins that are usually used can be used. Specifically, amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; bisphenols having two or more phenolic hydroxyl groups in one molecule such as bisphenol A, bisphenol F, bisphenol S, etc.; phenolic resins such as phenol novolak resin, bisphenol A novolak resin, cresol novolak resin, etc. can be mentioned. Since the epoxy resin curing agent is excellent in electrolytic corrosion resistance when absorbing moisture, it may be a phenolic resin such as phenol novolak resin, bisphenol A novolak resin, cresol novolak resin, etc. Note that the epoxy curing agent may be used simultaneously with the epoxy resin or alone.

[0050] The content of the thermosetting resin in the adhesive sheet 3p may be, for example, 40 to 300 parts by mass, 60 to 280 parts by mass, 80 to 260 parts by mass, 100 to 240 parts by mass, 120 to 220 parts by mass, or 150 to 200 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within such a range, it is possible to suppress the shrinkage accompanying the thermosetting of the adhesive sheet 3p, and it tends to be easy to achieve excellent adhesion after thermosetting.

[0051] (Curing accelerator) Examples of the curing accelerator include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazides, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate, and the like. These may be used alone or in combination of two or more.

[0052] When the adhesive sheet 3p contains a (meth)acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator that promotes the curing of the epoxy group contained in such an acrylic copolymer. Examples of the curing accelerator that promotes the curing of the epoxy group include acid anhydride-based curing agents, amine-based curing agents, imidazole-based curing agents, imidazoline-based curing agents, triazine-based curing agents, phosphine-based curing agents, and the like. Among these, from the viewpoints of rapid curability, heat resistance, and peelability, the curing accelerator may be an imidazole-based curing agent. By using an imidazole-based curing agent as the curing accelerator, it is possible to shorten the process time and improve workability. These may be used alone or in combination of two or more.

[0053] The content of the curing accelerator in the adhesive sheet 3p may be, for example, 0.01 to 2.0 parts by mass, 0.02 to 1.5 parts by mass, or 0.03 to 1.0 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the content of the curing accelerator is within such a range, it tends to be possible to sufficiently suppress the decrease in storage stability while improving the curability of the adhesive sheet 3p.

[0054] (Filler) The adhesive sheet 3p may contain a filler. The filler may be an inorganic filler or an organic filler.

[0055] Examples of the inorganic filler include metal fillers such as silver powder, gold powder, and copper powder, and non-metal inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide, and ceramic. The inorganic filler can be selected according to the desired function. The inorganic filler may be, for example, silica.

[0056] The inorganic filler may have an organic group on its surface. When the surface of the inorganic filler is modified by an organic group, the dispersibility in an organic solvent when preparing a varnish for forming the adhesive sheet 3p, and the shrinkage accompanying the thermosetting of the adhesive sheet 3p can be suppressed, and it is easy to achieve both a high elastic modulus and excellent peelability of the adhesive sheet 3p.

[0057] The inorganic filler having an organic group on its surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and an inorganic filler and stirring at a temperature of 30°C or higher. Whether the surface of the inorganic filler is modified by an organic group can be confirmed by UV measurement, IR measurement, XPS measurement, etc.

[0058] Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, and polyimide fine particles.

[0059] The filler content in the adhesive sheet 3p may be, for example, 400 parts by mass or less, 300 parts by mass or less, 250 parts by mass or less, or 230 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. The lower limit of the filler content is not particularly limited, but may be, for example, 100 parts by mass or more, 150 parts by mass or more, 180 parts by mass or more, or 200 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin. When the filler content is within such a range, shrinkage associated with thermosetting can be suppressed, and it is likely to achieve both a high melt viscosity and excellent peelability of the adhesive sheet 3p.

[0060] (Coupling agent) The adhesive sheet 3p may contain a coupling agent. The coupling agent may be a silane coupling agent.

[0061] Examples of the silane coupling agent include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylene propyltrialkoxysilane, polyethoxydimethylsiloxane, and the like. Among these, the silane coupling agent may be 3-mercaptopropyltrimethoxysilane or 3-ureidopropyltriethoxysilane. These may be used alone or in combination of two or more.

[0062] From the viewpoint of achieving a balance between heat resistance and storage stability, the content of the coupling agent in the adhesive sheet 3p is, for example, 0.1 to 10 parts by mass or 0.1 to 5 parts by mass with respect to 100 parts by mass of the thermoplastic resin. From the viewpoint of storage stability, it may be 0.1 to 3 parts by mass.

[0063] <Protective member> The protective member 5p can be formed together with the adhesive piece 3p, for example, by simultaneously die-cutting an adhesive layer 3 formed to cover the surface of the carrier film 1 and a protective film 5 disposed to cover the adhesive layer 3 (see FIG. 4). When the protective member 5p is formed by die-cutting, it has substantially the same shape as the adhesive piece 3p. The protective film 5 can be die-cut in the manufacturing process of the film 10 with an adhesive piece, and can be easily peeled from the adhesive piece 3p in the manufacturing process of the semiconductor device.

[0064] Examples of the protective film 5 include polyester films such as polyethylene terephthalate films; polyolefin films such as polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyvinyl acetate films, poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, and ethylene-ethyl acrylate copolymers; and plastic films such as polyvinyl chloride films and polyimide films. The protective film 5 may have a single-layer structure or a multilayer structure.

[0065] The thickness of the protective film 5 can be appropriately selected within a range that does not impair workability. The thickness of the protective film 5 is, for example, 10 to 200 μm, and may be 20 to 100 μm or 25 to 80 μm. These thickness ranges are practically problem-free and economically effective ranges.

[0066] The light transmittance of the protective member 5p is preferably lower than the light transmittance of the carrier film 1. By adopting such a configuration, it becomes possible to recognize the position and orientation of the adhesive piece 3p with a device such as a camera, and the bonding process in the manufacturing process of the semiconductor device tends to be easily automated. The protective member 5p may be colored, for example, such that the light transmittance of light with a wavelength of 500 nm is less than 10% (more preferably less than 7%).

[0067] [Manufacturing Method of Film with Adhesive Piece] Next, a method for manufacturing the adhesive sheet-attached film 10 will be described. The manufacturing method of the present embodiment includes the following steps. (A) A step of preparing a laminate 20 having a strip-shaped carrier film 1 with a width of 100 mm or less, an adhesive layer 3 formed so as to cover the surface of the carrier film 1, and a protective film 5 disposed so as to cover the adhesive layer 3. (B) A step of forming a plurality of adhesive pieces 3p arranged in the longitudinal direction of the carrier film 1 on the carrier film 1 by die-cutting the adhesive layer 3 and the protective film 5 in the laminate 20.

[0068] FIG. 3 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order. The laminate 20 can be produced as follows.

[0069] First, a coating liquid (adhesive varnish) obtained by dissolving an adhesive composition constituting the adhesive layer 3 in a solvent such as an organic solvent to form a varnish is prepared. After this coating liquid is applied onto the carrier film 1, the solvent is removed to form the adhesive layer 3.

[0070] The organic solvent as the solvent is not particularly limited, but can be arbitrarily selected in consideration of volatility during film formation from the boiling point. Examples of the organic solvent include methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, dimethylacetamide, dimethylformamide, N-methylpyrrolidone (NMP), cyclohexanone, and the like. These organic solvents may be used alone or in combination of two or more.

[0071] Examples of the coating method include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method.

[0072] Next, a protective film 5 is bonded to the surface of the adhesive layer 3 under the conditions of 25°C to 60°C. Thereby, the laminate 20 can be obtained. In addition, after forming the adhesive layer 3 on a wide carrier film, a laminated film is produced by bonding the protective film 5 so as to cover it, and the laminate 20 can also be obtained by cutting (slitting) the laminated film into a width of 100 mm or less.

[0073] FIG. 4 is a perspective view showing a state in which a plurality of adhesive pieces are formed on a carrier film by die-cutting. As shown in FIG. 4, as the laminate 20 passes between a rotating body 51 having a plurality of blades 51c on its outer peripheral surface for die-cutting and a roll 52 paired with the rotating body 51, the adhesive pieces 3p and the protective members 5p corresponding to the shape of the blades 51c are continuously formed on the carrier film 1. At this time, the surface of the laminate 20 on the side of the protective film 5 faces the rotating body 51, and the surface on the side of the carrier film 1 faces the roll 52. By adjusting the distance between the rotation axis 51a of the rotating body 51 and the rotation axis 52a of the roll 52, the depth of the cut formed in the laminate 20 by the blades 51c can be adjusted.

[0074] The laminate 20 that has passed between the rotating body 51 and the roll 52 is separated into a film 10 with adhesive pieces and an unnecessary portion 30 as shown in FIG. 4, and is wound around respective reels (not shown). The unnecessary portion 30 is composed of the adhesive layer 3 and the protective film 5 from which the adhesive pieces 3p and the protective members 5p are punched out.

[0075] In this way, a film 10 with adhesive pieces having adhesive pieces 3p and protective members 5p of a desired shape can be manufactured.

[0076] [Method of using the film with adhesive pieces (method of manufacturing a connection body)] Next, regarding the method of using the film 10 with adhesive pieces, a method for manufacturing a connection body (module) including a semiconductor chip and a circuit board (FPC board) will be described as an example. The method for manufacturing the connection body includes a step of bonding the semiconductor chip and the circuit board (FPC board) with the adhesive piece of the above-mentioned film with adhesive pieces interposed therebetween (bonding step), a step of heating the adhesive piece for 30 to 360 minutes at 100 to 175°C (heating step), and a step of wire bonding the semiconductor chip and the circuit board (FPC board) (wire bonding step) in this order.

[0077] FIG. 5 is a cross-sectional view schematically showing a state in which the adhesive piece and the protective member covering the same are picked up from the carrier film. With a certain tension applied to the film 10 with adhesive pieces, while bringing the surface on the carrier film 1 side of the film 10 with adhesive pieces into contact with the wedge-shaped member 60, the film 10 with adhesive pieces is moved in the direction of the arrow shown in FIG. 5. As a result, as shown in FIG. 5, the front of the adhesive piece 3p and the protective member 5p floats from the carrier film 1. In this state, for example, the adhesive piece 3p and the protective member 5p are picked up by a pickup device 65 having a suction force. For example, by using a pickup device 65 equipped with a camera or the like for visually recognizing the protective member 5p, it is possible to grasp information such as the presence or absence and orientation of the adhesive piece 3p and the protective member 5p. Based on this information, the subsequent bonding step can be appropriately carried out.

[0078] FIG. 6(a) and FIG. 6(b) are cross-sectional views schematically showing the state of the adhesive sheet before the adhesion process of the tip of the FPC substrate to the semiconductor chip is performed. The adhesive sheet 3p covered with the protective member 5p is arranged at a predetermined position and orientation on the surface C1 of the semiconductor chip C (see FIG. 6(a)). In this state, temporary crimping of the adhesive sheet 3p to the semiconductor chip C is performed. The temporary crimping can be performed, for example, under the conditions of a temperature of 60 to 100°C and a pressing force of 0.1 to 0.8 MPa for 0.1 to 10 seconds. By the temporary crimping, the adhesive sheet 3p semi-cures, improving the adhesiveness to the surface C1. Then, the protective member 5p is peeled off from the adhesive sheet 3p using an adhesive tape or the like (see FIG. 6(b)).

[0079] The adhesion process of the tip S1 of the FPC substrate S to the semiconductor chip C includes a step of crimping the semiconductor chip C and the tip S1 of the FPC substrate S via the adhesive sheet 3p, and then a step of performing a curing process on the adhesive sheet 3p. That is, first, after arranging the tip S1 of the FPC substrate S on the surface of the adhesive sheet 3p exposed by the peeling of the protective member 5p, the tip S1 of the FPC substrate S is crimped to the semiconductor chip C. The crimping can be performed, for example, under the conditions of a temperature of 90 to 150°C and a pressing force of 0.1 to 1 MPa for 0.1 to 10 seconds.

[0080] FIG. 7 is a cross-sectional view schematically showing a state in which the curing process of the adhesive sheet between the tip of the FPC substrate and the semiconductor chip is performed while holding the FPC substrate by applying an upward force to the FPC substrate. As shown in FIG. 7, while holding the FPC substrate S by applying an upward force F to the FPC substrate S, the curing process of the adhesive sheet 3p between the tip S1 of the FPC substrate S and the semiconductor chip C is performed to bond the semiconductor chip and the FPC substrate. The curing process can be performed, for example, at a temperature of 100 to 175°C for 30 to 360 minutes.

[0081] FIG. 8(a) is a cross-sectional view schematically showing a module in which the tip of the FPC substrate can be suitably adhered to the semiconductor chip, and FIG. 8(b) is a cross-sectional view schematically showing a module in which the tip of the FPC substrate cannot be suitably adhered to the semiconductor chip. As shown in FIG. 8(b), when a force F is applied during the curing process of the adhesive piece 3p, a part of the adhesive piece 3p extends, and as a result, when a part of the adhesive piece 3p becomes thick, the position where wire bonding should be performed shifts from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC substrate S, and suitable wire bonding cannot be performed.

[0082] In the suitable module 50 shown in FIG. 8(a), a module (not shown) in which the semiconductor chip C and the FPC substrate S are electrically connected can be obtained by performing wire bonding from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC substrate S.

[0083] [Adhesive Composition] The adhesive composition has a storage elastic modulus at 25°C of 600 to 3000 MPa and a melt viscosity at 120°C of 5000 to 9000 Pa·s. The adhesive composition may contain, for example, a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may further contain a coupling agent, a photoreactive monomer, a photopolymerization initiator, etc. as required. The materials used in the adhesive composition are the same as those used in the adhesive layer 3 and the adhesive piece 3p. Also, the storage elastic modulus at 25°C and the melt viscosity at 120°C in the adhesive composition are the same as the storage elastic modulus and the melt viscosity at 120°C in the adhesive layer 3 and the adhesive piece 3p. Therefore, the overlapping explanations are omitted here.

[0084] The adhesive composition is, for example, in the form of a film. The film-shaped adhesive composition (film-shaped adhesive) can be obtained, for example, in the same manner as the method for forming the adhesive layer 3.

[0085] As described above in detail with respect to the embodiments of the present disclosure, the present disclosure is not limited to the above embodiments. For example, in the above embodiments, the case where the colored protective film 5 is used so that the presence, absence, orientation, etc. of the protective member 5p can be grasped by a camera or the like has been illustrated. However, instead of this, a mark may be provided at a predetermined position of the protective member 5p. Further, if the adhesive piece 3p is colored, the protective member 5p may not be provided. In addition, when the orientation of the adhesive piece 3p is not a problem (for example, when the shape of the adhesive piece 3p is circular), there is no need to identify the orientation.

[0086] Also, in the above embodiments, the case where the adhesive piece 3p made of the adhesive composition is prepared in advance by die-cutting has been illustrated. However, a coating liquid containing the adhesive composition may be prepared and applied to a predetermined region of the semiconductor chip C or the FPC substrate S, whereby an adhesive layer can be formed in the region.

Example

[0087] Hereinafter, the present disclosure will be described based on examples. The present disclosure is not limited to the following examples.

[0088] <Example 1> (Preparation of Adhesive Varnish) An adhesive varnish was obtained by mixing the following materials and subjecting them to vacuum degassing (see Example 1 in Table 1). · Thermoplastic resin: HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Corporation, glycidyl group-containing acrylic rubber, molecular weight: 1 million, Tg: 12°C) 20 parts by mass · Thermosetting resin: N-500P-10 (trade name, manufactured by DIC Corporation, cresol novolak type epoxy resin, epoxy equivalent: 214) 11 parts by mass · Thermosetting resin: NC-7000L (trade name, manufactured by Nippon Kayaku Co., Ltd., naphthalene type epoxy resin, epoxy equivalent 227) 0 parts by mass · Thermosetting resin: CG-500 (trade name, manufactured by Osaka Gas Chemical Co., Ltd., fluorene type epoxy resin, epoxy equivalent 300) 0 parts by mass · Thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel Chemical & Material Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent: 157) 14 parts by mass · Thermosetting resin (epoxy resin curing agent): PSM-4326 (trade name, manufactured by Gunei Chemical Industry Co., Ltd., phenol resin, hydroxyl equivalent: 105) 13 parts by mass · Curing accelerator: 2PZ-CN (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd., imidazole compound) 0.1 part by mass · Filler: SC-2050-HLG (surface-treated silica, trade name, manufactured by Admatechs Co., Ltd.) 42 parts by mass · Coupling agent: A-189 (trade name, manufactured by ENEOS NUC Corporation, 3-mercaptopropyltrimethoxysilane) 0.1 part by mass · Coupling agent: A-1160 (trade name, manufactured by ENEOS NUC Corporation, 3-ureidopropyltriethoxysilane) 0.2 part by mass

[0089] (Preparation of adhesive sheet film) The above adhesive varnish was coated on a surface-released polyethylene terephthalate film with a thickness of 38 μm as a carrier film (manufactured by Toyobo Film Solutions Co., Ltd., trade name: Teijin Tetoron Film A-55). Through a drying process, a film with an adhesive layer having a thickness of 25 μm formed on one surface of the above polyethylene terephthalate film (carrier film) was obtained. By laminating this film with a colored polyethylene film with a thickness of 50 μm as a protective member (manufactured by Tamapoly Co., Ltd., TDM-1), a laminated film was obtained.

[0090] By die-cutting the laminate obtained as described above, the adhesive sheet film of Example 1 was obtained. The shape of the adhesive sheet was a square shape of 3.2 mm × 3.2 mm (area: 10.2 mm 2 )). The storage elastic modulus of the adhesive sheet at 25 °C was 670 MPa, and the melt viscosity at 120 °C was 5400 Pa·s.

[0091] (Preparation of adhesion measurement module) On the upper surface of a semiconductor chip (vertically about 7 mm × horizontally about 7 mm × thickness 0.4 mm), an adhesive piece of 3.2 mm × 3.2 mm and a protective member covering it were arranged. In this state, under a temperature condition of 90 °C, a pressing force of 10 N was applied to the adhesive piece for 0.5 seconds to perform temporary crimping of the adhesive piece to the semiconductor chip. Then, the protective member was peeled off to expose the adhesive piece. The tip of a polyimide film (manufactured by Ube Industries, Ltd., product name: Upilex 50S) (width 5 mm × length 50 mm) was crimped to the exposed adhesive piece. The crimping was performed by applying a pressing force of 15 N to the adhesive piece at a temperature of 130 °C for 1 second. After crimping, the adhesive piece was cured at a temperature of 130 °C for 1 hour, and a total of 5 adhesion measurement modules obtained as described above were fabricated. These steps were repeated to fabricate a total of 5 adhesion measurement modules.

[0092] (Fabrication of bleeding amount measurement module) Two laminated films with the adhesive layer exposed were prepared, and the exposed surfaces were laminated on a hot plate at 70 °C. Two obtained laminates were prepared, and the same operation was repeated to obtain a laminate having an adhesive layer with a thickness of 100 μm. The adhesive layer in the obtained laminate was cut out into 3.2 mm × 3.2 mm to fabricate an adhesive piece. The protective member on one side was peeled off to expose the adhesive piece, and the exposed adhesive piece was placed on a slide glass to fabricate a bleeding amount measurement module. These steps were repeated to fabricate a total of 3 bleeding amount measurement modules.

[0093] (Fabrication of void observation module) On the upper surface of a semiconductor chip (vertically about 15 mm × horizontally about 15 mm × thickness 0.4 mm), an adhesive piece of 3.2 mm × 3.2 mm and a protective member covering it were arranged. In this state, under a temperature condition of 90 °C, a pressing force of 10 N was applied to the adhesive piece for 0.5 seconds to temporarily crimp the adhesive piece to the semiconductor chip. Then, the protective member was peeled off to expose the adhesive piece. The tip of the FPC substrate was crimped to the exposed adhesive piece. The crimping was performed by applying a pressing force of 15 N to the adhesive piece at a temperature of 130 °C for 1 second. After crimping, while applying an upward force of 2.5 N (250 gf) to the FPC substrate to hold the FPC substrate, the adhesive piece was cured at a temperature of 130 °C for 1 hour to fabricate a void observation module. These steps were repeated to fabricate a total of 2 void observation modules.

[0094] <Example 2> An adhesive film with an adhesive piece of Example 2 was fabricated in the same manner as in Example 1, except that the adhesive varnish having the composition shown in Example 2 of Table 1 was used. Using this, an adhesion measurement module, a bleeding amount measurement module, and a void observation module were fabricated. The storage elastic modulus of the adhesive piece of Example 2 at 25 °C was 1130 MPa, and the melt viscosity at 120 °C was 6600 Pa·s.

[0095] <Example 3> An adhesive film with an adhesive piece of Example 3 was fabricated in the same manner as in Example 1, except that the adhesive varnish having the composition shown in Example 3 of Table 1 was used. Using this, an adhesion measurement module, a bleeding amount measurement module, and a void observation module were fabricated. The storage elastic modulus of the adhesive piece of Example 3 at 25 °C was 2820 MPa, and the melt viscosity at 120 °C was 8900 Pa·s.

[0096] <Comparative Example 1> An adhesive film with an adhesive piece of Comparative Example 1 was produced in the same manner as in Example 1, except that the adhesive varnish having the composition shown in Comparative Example 1 of Table 1 was used. Using this, a module for measuring adhesiveness, a module for measuring the amount of bleeding, and a module for observing voids were produced. The storage elastic modulus of the adhesive piece of Comparative Example 1 at 25°C was 1020 MPa, and the melt viscosity at 120°C was 9900 Pa·s.

[0097] <Comparative Example 2> An adhesive film with an adhesive piece of Comparative Example 2 was produced in the same manner as in Example 1, except that the adhesive varnish having the composition shown in Comparative Example 2 of Table 1 was used. Using this, a module for measuring adhesiveness, a module for measuring the amount of bleeding, and a module for observing voids were produced. The storage elastic modulus of the adhesive piece of Comparative Example 2 at 25°C was 380 MPa, and the melt viscosity at 120°C was 5400 Pa·s.

[0098] The adhesive pieces of the adhesive films of the above Examples and Comparative Examples were evaluated for the following items. The results are shown in Table 1.

[0099] (1) Adhesiveness of the adhesive piece The adhesiveness in the five modules for measuring adhesiveness obtained as described above was evaluated as follows. The semiconductor chip in the module for measuring adhesiveness was fixed to the stage, the tip of the polyimide was lifted, and it was pulled up at an angle of 90° and a speed of 50 mm / min, and the strength when the adhesive piece was peeled off from the semiconductor chip was measured, and the average of the five was obtained. Evaluation was carried out according to the following criteria. A: The average of the five is 0.5 N / 3.2 mm or more. B: The average of the five is less than 0.5 N / 3.2 mm.

[0100] (2) Amount of bleeding of the adhesive piece The three modules for measuring the amount of bleeding obtained as described above were pressurized at 10 MPa for 120 seconds at 25°C using a press machine. After pressurization, the bleeding amount on the four sides of the adhesive piece was observed with a microscope (manufactured by Mitutoyo Corporation). Evaluation was carried out according to the following criteria. A: The average of the four sides of the bleeding amount is 55 μm or less. B: The average of the four sides of the bleeding amount exceeds 55 μm and is 70 μm or less. C: The average of the four sides of the bleeding amount exceeds 70 μm.

[0101] (3) Voids in the adhesive sheet The voids of the two void observation modules obtained as described above were observed as follows. The void observation module was observed with an ultrasonic imaging device SAT (manufactured by Hitachi Construction Machinery Co., Ltd., FS200II), and the ratio of voids (voids) was evaluated. Evaluation was carried out according to the following criteria. A: The ratio of voids is less than 10 area%. B: The ratio of voids is 10 area% or more.

[0102]

Table 1

Industrial Applicability

[0103] According to the present disclosure, there is provided a film with an adhesive sheet including an adhesive sheet excellent in adhesiveness, reducing the bleeding amount, and further suppressing the generation of voids. Further, according to the present disclosure, there is provided a method for manufacturing a connector using a film with an adhesive sheet. Furthermore, according to the present disclosure, there is provided an adhesive composition effective for forming an adhesive sheet excellent in adhesiveness, reducing the bleeding amount, and further suppressing the generation of voids.

Explanation of Reference Numerals

[0104] 1... Carrier film, 3... Adhesive layer, 3p... Adhesive sheet (adhesive composition), 5... Protective film, 5p... Protective member, 10... Film with an adhesive sheet, 50... Module (connector) C... Semiconductor chip, F1... Surface of the adhesive sheet (first surface), F2... Surface of the adhesive sheet (second surface), S... Flexible printed circuit board (FPC board).

Claims

1. A strip-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged on the carrier film so as to be aligned in the longitudinal direction of the carrier film, comprising: the adhesive piece contains a thermoplastic resin, a thermosetting resin, and a filler, the content of the thermosetting resin is 120 to 220 parts by mass with respect to 100 parts by mass of the thermoplastic resin, the content of the filler is 150 to 300 parts by mass with respect to 100 parts by mass of the thermoplastic resin, the storage elastic modulus of the adhesive piece at 25°C is 600 to 3000 MPa, the melt viscosity of the adhesive piece at 120°C is 5000 to 9000 Pa·s, a film with adhesive pieces.

2. The area of the adhesive sheet is 3 to 50 mm ２ The film with an adhesive sheet according to claim 1, wherein the area is as described above.

3. The film with adhesive pieces according to claim 1 or 2, wherein the adhesive piece is formed by die-cutting an adhesive layer formed so as to cover the surface of the carrier film.

4. The film with adhesive pieces according to any one of claims 1 to 3, further comprising a protective member that covers the second surface of the adhesive piece opposite to the first surface on the carrier film side of the adhesive piece and has the same shape as the adhesive piece.

5. The film with adhesive pieces according to claim 4, wherein the adhesive piece and the protective member are formed by die-cutting an adhesive layer formed so as to cover the surface of the carrier film and a protective film arranged so as to cover the adhesive layer.

6. A method for manufacturing a connector including a semiconductor chip and a circuit board, a step of interposing the adhesive piece of the film with adhesive pieces according to any one of claims 1 to 5 between the semiconductor chip and the circuit board and bonding the semiconductor chip and the circuit board, a step of heating the adhesive piece at 100 to 175°C for 30 to 360 minutes, a step of wire-bonding the semiconductor chip and the circuit board, A method for manufacturing a connector, including these steps in this order.

7. An adhesive composition containing a thermoplastic resin, a thermosetting resin, and a filler, the content of the thermosetting resin is 120 to 220 parts by mass with respect to 100 parts by mass of the thermoplastic resin, the content of the filler is 150 to 300 parts by mass with respect to 100 parts by mass of the thermoplastic resin, the storage elastic modulus at 25°C is 600 to 3000 MPa, the melt viscosity at 120°C is 5000 to 9000 Pa·s.

8. The adhesive composition according to claim 7, which is in the form of a film.

Images