Buffer material, packaging material, and packaged product

Abstract

To prevent disassembly of a cushioning material.SOLUTION: A cushioning material is housed in a packaging box which can house an electronic apparatus, and buffers external force applied on the electronic apparatus housed in the packaging box, and includes: a holding member having a first plate which has a first opening and faces the electronic apparatus, and a second plate which has a second opening and faces an inner wall surface of the packaging box; and a first cushioning block which is held by a holding member between the first plate and second plate. The first cushioning block includes: a first cushioning part which protrudes from the first opening in a first direction from the first plate to the electronic apparatus and can contact with the electronic apparatus; a second cushioning part which protrudes from the second opening in a second direction from the second plate to an inner wall surface of the packaging box; and a first connection part which is arranged between the first plate and the second plate, and connects the first cushioning part and the second cushioning part. The first connection part is longer than the first opening and second opening in a first holding direction intersecting with the first direction and the second direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a cushioning material, a packaging material, and a packaged product.

Background Art

[0002] There is known a cushioning material that is housed in a packaging box capable of accommodating an electronic device and buffers an external force applied to the electronic device. For example, Patent Document 1 discloses a technique for holding a corner portion at the lower end of an electronic device by a cushioning material formed by fitting two cushioning members.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional technology, when an external force is applied to the cushioning material, the two cushioning members constituting the cushioning material may separate. And when the two cushioning members constituting the cushioning material separate and the cushioning material decomposes, there is a high possibility that the electronic device cannot be protected by the cushioning material.

Means for Solving the Problems

[0005] In order to solve the above problems, a buffer material according to the present invention is a buffer material that is housed in a packing box capable of housing an electronic device and buffers an external force applied to the electronic device housed in the packing box. A first opening is formed. When the buffer material and the electronic device are housed in the packing box, a first plate facing the electronic device and a second opening are formed. When the buffer material and the electronic device are housed in the packing box, a holding member including a second plate facing the inner wall surface of the packing box, and a first buffer block held by the holding member between the first plate and the second plate. The first buffer block projects from the first opening in a first direction from the first plate toward the electronic device and has a first buffer portion capable of contacting the electronic device, and projects from the second opening in a second direction from the second plate toward the inner wall surface of the packing box and has a second buffer portion capable of contacting the inner wall surface of the packing box, and a first connecting portion provided between the first plate and the second plate and connecting the first buffer portion and the second buffer portion. The first connecting portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction.

[0006] The packaging material according to the present invention further includes a packaging box capable of accommodating an electronic device, and a buffer material for buffering an external force applied to the electronic device accommodated in the packaging box. The buffer material has a first opening formed therein. When the buffer material and the electronic device are accommodated in the packaging box, there is a first plate facing the electronic device. The buffer material further has a second opening formed therein. When the buffer material and the electronic device are accommodated in the packaging box, there is a second plate facing the inner wall surface of the packaging box. The buffer material includes a holding member having the second plate, and a first buffer block held by the holding member between the first plate and the second plate. The first buffer block protrudes from the first opening in a first direction from the first plate toward the electronic device and has a first buffer portion capable of contacting the electronic device. The first buffer block also protrudes from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and has a second buffer portion capable of contacting the inner wall surface of the packaging box. The first buffer block further includes a first connecting portion provided between the first plate and the second plate for connecting the first buffer portion and the second buffer portion. The first connecting portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction.

[0007] In addition, the packaged product according to the present invention includes an electronic device, a packaging box capable of accommodating the electronic device, and a cushioning material for buffering an external force applied to the electronic device accommodated in the packaging box. The cushioning material has a first opening formed therein, and when the cushioning material and the electronic device are accommodated in the packaging box, a first plate facing the electronic device, and a second opening formed therein, and when the cushioning material and the electronic device are accommodated in the packaging box, a second plate facing the inner wall surface of the packaging box. The holding member includes a first buffer block held by the holding member between the first plate and the second plate. The first buffer block protrudes from the first opening in a first direction from the first plate toward the electronic device and has a first buffer portion capable of contacting the electronic device, protrudes from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box, and has a second buffer portion capable of contacting the inner wall surface of the packaging box. The first connection portion is provided between the first plate and the second plate and connects the first buffer portion and the second buffer portion. The first connection portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, in each figure, the dimensions and scales of each part are appropriately different from the actual ones. Also, the embodiments described below are preferred specific examples of the present invention, so various technically preferable limitations are imposed. However, the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to limit the present invention specifically.

[0010] <<1. First Embodiment>> Hereinafter, the first embodiment of the present invention will be described.

[0011] <<1.1. Overall Outline of the Packaged Product>> Hereinafter, with reference to FIG. 1, an example of the configuration of the packaging material 1 according to the present embodiment will be described.

[0012] FIG. 1 is an exploded perspective view showing an example of the configuration of the packaging material 1.

[0013] As illustrated in FIG. 1, the packaging material 1 houses the electronic device 100. Specifically, the packaging material 1 includes a packaging box 2 capable of housing the electronic device 100, and a plurality of buffer materials S for buffering an external force applied to the electronic device 100 housed in the packaging box 2. Here, the electronic device 100 is, for example, a printing device such as an inkjet printer. However, in the present embodiment, as the electronic device 100, devices other than printing devices such as a television, a refrigerator, a washing machine, a microwave oven, or a personal computer may be adopted. In the following, the packaging material 1 and the electronic device 100 in the state of being housed in the packaging material 1 may be referred to as a "packaged product".

[0014] As illustrated in FIG. 1, in the present embodiment, it is assumed that the packaging material 1 has four cushioning materials S-1 to S-4. In the present embodiment, the electronic device 100 and the four cushioning materials S-1 to S-4 are inserted into the packaging box 2 from the opening 20 of the packaging box 2 and housed in the packaging box 2.

[0015] Hereinafter, for convenience of explanation, a packaging box coordinate system ΣW fixed to the packaging box 2 is introduced. The packaging box coordinate system ΣW is a three-axis coordinate system having a Zw axis extending in the +Zw direction, which is the direction from the bottom surface of the packaging box 2 toward the opening 20, an Xw axis extending in the +Xw direction orthogonal to the +Zw direction, and a Yw axis extending in the +Yw direction orthogonal to the +Zw direction and the +Xw direction. Hereinafter, the opposite direction of the +Xw direction is referred to as the -Xw direction, the opposite direction of the +Yw direction is referred to as the -Yw direction, and the opposite direction of the +Zw direction is referred to as the -Zw direction.

[0016] Also, hereinafter, a cushioning material coordinate system ΣS fixed to the cushioning material S is introduced. The cushioning material coordinate system ΣS is a three-axis coordinate system having a Zs axis extending in the +Zs direction, an Xs axis extending in the +Xs direction orthogonal to the +Zs direction, and a Ys axis extending in the +Ys direction orthogonal to the +Zs direction and the +Xs direction. Hereinafter, the opposite direction of the +Xs direction is referred to as the -Xs direction, the opposite direction of the +Ys direction is referred to as the -Ys direction, and the opposite direction of the +Zs direction is referred to as the -Zs direction.

[0017] As illustrated in FIG. 1, when the electronic device 100 and the four cushioning materials S-1 to S-4 are housed in the packaging box 2, the cushioning material S-1 is a cushioning material that holds the lower end portion of the electronic device 100 in the -Zw direction of the electronic device 100 and in the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-1 fixed to the cushioning material S-1 is provided such that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0018] Further, when the electronic device 100 and the four cushioning materials S-1 to S-4 are accommodated in the packing box 2, the cushioning material S-2 is a cushioning material S that holds the lower end portion of the electronic device 100 in the -Zw direction of the electronic device 100 and in the +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-2 fixed to the cushioning material S-2 is provided such that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the +Xw direction.

[0019] Further, when the electronic device 100 and the four cushioning materials S-1 to S-4 are accommodated in the packing box 2, the cushioning material S-3 is a cushioning material S that holds the lower end portion of the electronic device 100 in the +Zw direction of the electronic device 100 and in the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-3 fixed to the cushioning material S-3 is provided such that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the -Xw direction.

[0020] Further, when the electronic device 100 and the four cushioning materials S-1 to S-4 are accommodated in the packing box 2, the cushioning material S-4 is a cushioning material S that holds the lower end portion of the electronic device 100 in the +Zw direction of the electronic device 100 and in the +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-4 fixed to the cushioning material S-4 is provided such that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0021] <<1.2. Overview of Cushioning Material>> Hereinafter, with reference to FIGS. 2 and 3, an example of the configuration of the cushioning material S according to the present embodiment will be described.

[0022] FIG. 2 is a perspective view showing an example of the configuration of the cushioning material S.

[0023] As illustrated in FIG. 2, the cushioning material S includes a plurality of cushioning blocks R for cushioning an external force applied to the electronic device 100, and a holding member H for holding each cushioning block R.

[0024] Among these, the holding member H includes a plate-like portion P1 that constitutes the side surface of the cushioning member S on the -Xs side, a plate-like portion P2 that constitutes the side surface of the cushioning member S on the +Xs side, a plate-like portion Pd that constitutes the back surface of the cushioning member S, and a plate-like portion Ph that constitutes the bottom surface of the cushioning member S. More specifically, the plate-like portion P1 is the side surface portion of the cushioning member S located at the end in the -Xs direction and having the +Xs direction as the normal direction. Also, the plate-like portion P2 is the side surface portion of the cushioning member S located at the end in the +Xs direction and having the +Xs direction as the normal direction. Further, the plate-like portion Pd is the back surface portion of the cushioning member S located at the end in the +Ys direction and having the +Ys direction as the normal direction. Additionally, the plate-like portion Ph is the bottom surface portion of the cushioning member S located at the end in the -Zs direction and having the +Zs direction as the normal direction. Hereinafter, the plate-like portion P1, the plate-like portion P2, the plate-like portion Pd, and the plate-like portion Ph may be collectively referred to as the plate-like portion P. In this embodiment, as an example, it is assumed that each of the plurality of plate-like portions P constituting the holding member H is made of cardboard.

[0025] As illustrated in FIG. 2, in this embodiment, it is assumed that the cushioning member S includes six cushioning blocks R, namely, a cushioning block R1 held by the plate-like portion P1, a cushioning block R2 held by the plate-like portion P2, cushioning blocks R3 and R4 held by the plate-like portion Pd, and cushioning blocks Rh1 and Rh2 held by the plate-like portion Ph. Here, the cushioning block R4 is a cushioning block R located on the +Xs side of the cushioning block R3. Also, the cushioning block Rh2 is a cushioning block R located on the +Xs side of the cushioning block Rh1.

[0026] In this embodiment, it is assumed that the cushioning block R is formed of an object having lower elasticity than polystyrene foam. Further, in the present embodiment, it is assumed as an example that when a buffer block R is formed by obtaining fibers contained in an object such as paper or clothing by decomposing the object including various fibers such as animal fibers, plant fibers, or chemical fibers, and processing the obtained fibers. More specifically, in the present embodiment, it is assumed that when paper is decomposed to obtain the fibers contained in the paper and the obtained fibers are solidified, a buffer block R is formed. As described above, in the present embodiment, the buffer block R is formed by obtaining fibers from an object including fibers such as paper or clothing. That is, in the present embodiment, when an object including fibers such as paper or clothing is discarded, the buffer block R can be formed by reusing the object. Therefore, according to the present embodiment, it is possible to significantly reduce the environmental load associated with the manufacture and disposal of the buffer block R.

[0027] FIG. 3 is a cross-sectional view showing an example of a cross-section of the cushioning material S when the cushioning material S is cut along the E-e line in FIG. 2.

[0028] As illustrated in FIG. 3, a plate-like portion P1, which is an end portion of the cushioning material S in the -Xs direction, includes a plate member P1-A, a plate member P1-B, and a plate member P1-C.

[0029] Among these, the plate member P1-A is located at the end portion of the plate-like portion P1 in the +Xs direction, and is a flat plate-like member having the +Xs direction as the normal direction. When the cushioning material S and the electronic device 100 are accommodated in the packing box 2, the plate member P1-A faces the electronic device 100. An opening K1-A is formed in the plate member P1-A. In the present embodiment, the plate member P1-A is an example of the "first plate", and the opening K1-A is an example of the "first opening". Further, the plate member P1-B is located at the end portion of the plate-like portion P1 in the -Xs direction, and is a flat plate-like member having the +Xs direction as the normal direction. When the cushioning material S and the electronic device 100 are accommodated in the packing box 2, the plate member P1-B faces the packing box 2. An opening K1-B is formed in the plate member P1-B. In the present embodiment, the plate member P1-B is an example of the "second plate", and the opening K1-B is an example of the "second opening". Further, the plate member P1-C is located at the end of the plate-like portion P1 in the +Zs direction, and is a flat plate-like portion having the +Zs direction as the normal direction, and connects the plate member P1-A and the plate member P1-B. In the present embodiment, the plate member P1-C is an example of the "first connecting plate".

[0030] As illustrated in FIG. 3, the buffer block R1 is held by the plate-like portion P1 between the plate member P1-A and the plate member P1-B. Specifically, the buffer block R1 includes a buffer portion Q-A protruding in the +Xs direction from an opening K1-A provided in the plate member P1-A, a buffer portion Q-B protruding in the -Xs direction from an opening K1-B provided in the plate member P1-B, and a connecting portion Q-C provided between the plate member P1-A and the plate member P1-B and connecting the buffer portion Q-A and the buffer portion Q-B. In the present embodiment, the buffer block R1 is an example of the "first buffer block", the buffer portion Q-A is an example of the "first buffer portion", the buffer portion Q-B is an example of the "second buffer portion", and the connecting portion Q-C is an example of the "first connecting portion". Further, in the present embodiment, the +Xs direction is an example of the "first direction", the -Xs direction is an example of the "second direction", and the +Zs direction is an example of the "first holding direction".

[0031] Hereinafter, the length of the buffer portion Q-A in the +Zs direction is referred to as length LQ-A, the length of the buffer portion Q-B in the +Zs direction is referred to as length LQ-B, and the length of the connecting portion Q-C in the +Zs direction is referred to as length LQ-C. Further, hereinafter, the length in the +Zs direction from the plate member P1-C to the buffer portion Q-A is referred to as length LQ-At, and the length in the +Zs direction from the plate member P1-C to the buffer portion Q-B is referred to as length LQ-Bt.

[0032] In this embodiment, it is assumed that the lengths LQ-A and LK-A are substantially the same. Also, in this embodiment, it is assumed that the lengths LQ-B and LK-B are substantially the same. Here, "substantially the same" includes cases where, in addition to being exactly the same, there is an error of about 5% or less and it can be regarded as the same if the error is removed, and cases where there are manufacturing errors but they are the same in design, etc.

[0033] Also, in this embodiment, it is assumed that the length LQ-C is longer than the length LK-A and the length LQ-C is longer than the length LK-B. That is, in this embodiment, in the +Zs direction, the connecting portion Q-C is longer than the opening K1-A and the connecting portion Q-C is longer than the opening K1-B. For this reason, in this embodiment, it becomes possible to prevent the buffer block R1 from dropping off in the +Xs direction from the opening K1-A, and it becomes possible to prevent the buffer block R1 from dropping off in the -Xs direction from the opening K1-B. Note that in this embodiment, a mode is assumed in which the buffer block R1 is held by the plate-like portion P1 without using an adhesive. However, the present invention is not limited to such a mode, and the buffer block R1 may be fixed to the plate-like portion P1 with an adhesive.

[0034] Also, hereinafter, the length of the buffer block R1 in the +Xs direction is referred to as the length LR, and the length of the plate member P1-C in the +Xs direction is referred to as the length LP.

[0035] In this embodiment, it is assumed that the length LR is longer than the length LP. That is, in this embodiment, in the +Xs direction, the buffer block R1 is longer than the plate member P1-C. For this reason, in this embodiment, even when an external force is applied to the packing box 2, it is possible to buffer the external force with the buffer block R1 and weaken the external force transmitted to the electronic device 100.

[0036] As illustrated in FIG. 3, the plate-like portion P2, which is the end portion of the cushioning material S in the +Xs direction, includes a plate member P2-A, a plate member P2-B, and a plate member P2-C.

[0037] Among these, the plate member P2-A is a flat plate-shaped member located at the -Xs-direction end of the plate-shaped portion P2, with the +Xs direction as the normal direction. When the buffer material S and the electronic device 100 are accommodated in the packing box 2, it faces the electronic device 100. An opening K2-A is formed in the plate member P2-A. Also, the plate member P2-B is a flat plate-shaped member located at the +Xs-direction end of the plate-shaped portion P2, with the +Xs direction as the normal direction. When the buffer material S and the electronic device 100 are accommodated in the packing box 2, it faces the packing box 2. An opening K2-B is formed in the plate member P2-B. Further, the plate member P2-C is a flat plate-shaped portion located at the +Zs-direction end of the plate-shaped portion P2, with the +Zs direction as the normal direction, and connects the plate member P2-A and the plate member P2-B. In this embodiment, the plate-shaped portion P2 has substantially the same shape as the plate-shaped portion P1. That is, the plate member P2-A has substantially the same shape as the plate member P1-A, the plate member P2-B has substantially the same shape as the plate member P1-B, and the plate member P2-C has substantially the same shape as the plate member P1-C.

[0038] As illustrated in FIG. 3, the buffer block R2 is held by the plate-shaped portion P2 between the plate member P2-A and the plate member P2-B. In this embodiment, the buffer block R2 is formed of the same material as the buffer block R1 and has substantially the same shape as the buffer block R1. Specifically, the buffer block R2 includes a buffer portion Q-A protruding in the -Xs direction from the opening K2-A provided in the plate member P2-A, a buffer portion Q-B protruding in the +Xs direction from the opening K2-B provided in the plate member P2-B, and a connecting portion Q-C provided between the plate member P2-A and the plate member P2-B and connecting the buffer portion Q-A and the buffer portion Q-B.

[0039] That is, in the present embodiment, in the +Zs direction, the connection portion Q-C provided in the buffer block R2 is longer than the opening K2-A, and the connection portion Q-C provided in the buffer block R2 is longer than the opening K2-B. For this reason, in the present embodiment, it is possible to prevent the buffer block R2 from dropping off in the -Xs direction from the opening K2-A, and it is possible to prevent the buffer block R2 from dropping off in the +Xs direction from the opening K2-B.

[0040] As illustrated in FIG. 3, the plate-like portion Ph, which is the end portion of the cushioning material S in the -Zs direction, includes a plate member Ph-A and a plate member Ph-B.

[0041] Among these, the plate member Ph-A is located at the end portion of the plate-like portion Ph in the +Zs direction, and is a flat plate member having the +Zs direction as the normal direction. When the cushioning material S and the electronic device 100 are accommodated in the packaging box 2, it faces the electronic device 100. An opening Kh1-A is formed in the plate member Ph-A. Further, an opening Kh2-A is formed in the plate member Ph-A on the +Xs side of the opening Kh1-A. In the present embodiment, the plate member Ph-A is an example of the "third plate", and the opening Kh1-A is an example of the "third opening". Also, the plate member Ph-B is located at the end portion of the plate-like portion P1 in the -Zs direction, and is a flat plate member having the +Zs direction as the normal direction. When the cushioning material S and the electronic device 100 are accommodated in the packaging box 2, it faces the packaging box 2. An opening Kh1-B is formed in the plate member Ph-B. Further, an opening Kh2-B is formed in the plate member Ph-B on the +Xs side of the opening Kh1-B. In the present embodiment, the plate member Ph-B is an example of the "fourth plate", and the opening Kh1-B is an example of the "fourth opening".

[0042] As illustrated in FIG. 3, the buffer block Rh1 is held by the plate-like portion Ph between the plate member Ph-A and the plate member Ph-B. Specifically, the buffer block Rh1 includes a buffer portion Qh-A protruding in the +Zs direction from an opening Kh1-A provided in the plate member Ph-A, a buffer portion Qh-B protruding in the -Zs direction from an opening Kh1-B provided in the plate member Ph-B, and a connecting portion Qh-C provided between the plate member Ph-A and the plate member Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B. In this embodiment, the buffer block Rh1 is an example of the "second buffer block", the buffer portion Qh-A is an example of the "third buffer portion", the buffer portion Qh-B is an example of the "fourth buffer portion", and the connecting portion Qh-C is an example of the "second connecting portion". Also, in this embodiment, the +Zs direction is an example of the "third direction", the -Zs direction is an example of the "fourth direction", and the +Xs direction is an example of the "second holding direction".

[0043] Hereinafter, the length of the buffer portion Qh-A in the +Xs direction is referred to as length HQ-A, the length of the buffer portion Qh-B in the +Xs direction is referred to as length HQ-B, and the length of the connecting portion Qh-C in the +Xs direction is referred to as length HQ-C. Also, hereinafter, the length of the opening Kh1-A in the +Xs direction is referred to as length HK-A, and the length of the opening Kh1-B in the +Xs direction is referred to as length HK-B. Further, hereinafter, the length in the +Xs direction from the end portion of the connecting portion Qh-C in the -Xs direction to the buffer portion Qh-A is referred to as length HQ-At1, and the length in the +Xs direction from the end portion of the connecting portion Qh-C in the +Xs direction to the buffer portion Qh-A is referred to as length HQ-At2. Also, hereinafter, the length in the +Xs direction from the end portion of the connecting portion Qh-C in the -Xs direction to the buffer portion Qh-B is referred to as length HQ-Bt1, and the length in the +Xs direction from the end portion of the connecting portion Qh-C in the +Xs direction to the buffer portion Qh-B is referred to as length HQ-Bt2.

[0044] In this embodiment, it is assumed that the length HQ-A and the length HK-A are substantially the same. Also, in this embodiment, it is assumed that the length HQ-B and the length HK-B are substantially the same.

[0045] Further, in the present embodiment, it is assumed that the length HQ-C is longer than the length HK-A and the length HQ-C is longer than the length HK-B. That is, in the present embodiment, in the +Xs direction, the connecting portion Qh-C is longer than the opening Kh1-A, and the connecting portion Qh-C is longer than the opening Kh1-B. Therefore, in the present embodiment, it becomes possible to prevent the buffer block Rh1 from dropping in the +Zs direction from the opening Kh1-A, and it becomes possible to prevent the buffer block Rh1 from dropping in the -Zs direction from the opening Kh1-B. In the present embodiment, a mode is assumed in which the buffer block Rh1 is held by the plate-like portion Ph without using an adhesive. However, the present invention is not limited to such a mode, and the buffer block Rh1 may be fixed to the plate-like portion Ph by an adhesive.

[0046] Further, in the present embodiment, it is assumed that at least one of the length HQ-At1 and the length HQ-Bt1 is longer than the length LQ-At and the length HQ-Bt1 is longer than the length LQ-Bt. In other words, in the present embodiment, at least one of the length in the +Xs direction from the end portion in the -Xs direction of the connecting portion Qh-C to the opening Kh1-A and the length in the +Xs direction from the end portion in the -Xs direction of the connecting portion Qh-C to the opening Kh1-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. Further, in the present embodiment, it is assumed that at least one of the length HQ-At2 and the length HQ-Bt2 is longer than the length LQ-At and the length HQ-Bt2 is longer than the length LQ-Bt. In other words, in the present embodiment, at least one of the length in the +Xs direction from the end portion in the +Xs direction of the connecting portion Qh-C to the opening Kh1-A and the length in the +Xs direction from the end portion in the +Xs direction of the connecting portion Qh-C to the opening Kh1-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. Therefore, in the present embodiment, it is possible to prevent the buffer block Rh1 from being erroneously provided between the plate members P1-A and P1-B instead of the buffer block R1, and the buffer block Rh1 from being erroneously provided between the plate members P2-A and P2-B instead of the buffer block R2. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the occurrence of misplacement between the buffer block Rh1 and the buffer block R1 or the buffer block R2.

[0047] Also, in the present embodiment, at least one of the length LQ-A and the length LQ-B is made longer than the length HK-A and longer than the length HK-B. For this reason, in the present embodiment, it is possible to prevent the buffer block R1 from being erroneously provided between the plate members Ph-A and Ph-B instead of the buffer block Rh1, and the buffer block R2 from being erroneously provided between the plate members Ph-A and Ph-B instead of the buffer block Rh1. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the occurrence of misplacement between the buffer block Rh1 and the buffer block R1 or the buffer block R2.

[0048] As illustrated in FIG. 3, the buffer block Rh2 is held by the plate-like portion Ph between the plate members Ph-A and Ph-B. In the present embodiment, the buffer block Rh2 is formed of the same material as the buffer block Rh1 and has substantially the same shape as the buffer block Rh1. Also, in the present embodiment, the opening Kh2-A is substantially the same shape as the opening Kh1-A, and the opening Kh2-B is substantially the same shape as the opening Kh1-B. The buffer block Rh2 includes a buffer portion Qh-A protruding in the +Zs direction from the opening Kh2-A provided in the plate member Ph-A, a buffer portion Qh-B protruding in the -Zs direction from the opening Kh2-B provided in the plate member Ph-B, and a connecting portion Qh-C provided between the plate member Ph-A and the plate member Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B.

[0049] Therefore, in the present embodiment, it becomes possible to prevent the buffer block Rh2 from dropping in the +Zs direction from the opening Kh2-A, and it also becomes possible to prevent the buffer block Rh2 from dropping in the -Zs direction from the opening Kh2-B. In the present embodiment, a mode is assumed in which the buffer block Rh2 is held by the plate-like portion Ph without using an adhesive. However, the present invention is not limited to such a mode, and the buffer block Rh2 may be fixed to the plate-like portion Ph with an adhesive.

[0050] Further, in the present embodiment, at least one of the length in the +Xs direction from the end portion in the +Xs direction of the connection portion Qh-C to the opening Kh2-A and the length in the +Xs direction from the end portion in the +Xs direction of the connection portion Qh-C to the opening Kh2-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and is also longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. Also, in the present embodiment, at least one of the length in the +Xs direction from the end portion in the -Xs direction of the connection portion Qh-C to the opening Kh2-A and the length in the +Xs direction from the end portion in the -Xs direction of the connection portion Qh-C to the opening Kh2-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and is also longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. For this reason, in the present embodiment, it is possible to prevent the buffer block Rh2 from being erroneously provided between the plate members P1-A and P1-B instead of the buffer block R1, and it is also possible to prevent the buffer block Rh2 from being erroneously provided between the plate members P2-A and P2-B instead of the buffer block R2. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the occurrence of misplacement between the buffer block Rh2 and the buffer block R1 or the buffer block R2.

[0051] Also, as described above, in the present embodiment, at least one of the length LQ-A and the length LQ-B is longer than the length HK-A and longer than the length HK-B. Therefore, in the present embodiment, it is possible to prevent the buffer block R1 from being erroneously provided between the plate members Ph-A and Ph-B instead of the buffer block Rh2, and the buffer block R2 from being erroneously provided between the plate members Ph-A and Ph-B instead of the buffer block Rh2. That is, in the present embodiment, when manufacturing the cushioning material S, it is possible to suppress the occurrence of misplacement between the buffer block Rh2 and the buffer block R1 or the buffer block R2.

[0052] <<1.3. Outline of the holding member>> FIG. 4 is a plan view showing an example of the shape of the flat plate member HH obtained by developing the holding member H.

[0053] In the present embodiment, as an example, it is assumed that the holding member H is formed by bending the flat plate member HH illustrated in FIG. 4 along the broken lines θ11 to θ35 illustrated in FIG. 4. As described above, in the present embodiment, as an example, it is assumed that the flat plate member HH is made of cardboard.

[0054] As illustrated in FIG. 4, the flat plate member HH includes, in addition to the plate members P1-A, P1-B, P1-C, P2-A, P2-B, P2-C, Ph-A, and Ph-B described in FIG. 3, plate members P1-D, P1-E, P2-D, P2-E, Ph-C, Pd-A, Pd-B, and Pd-C. Note that FIG. 4 assumes, as an example, a case where the cushioning material coordinate system ΣS is a coordinate system fixed to the plate member Ph-B, and the flat plate member HH is obtained by developing the holding member H in a state where the cushioning material coordinate system ΣS is fixed to the plate member Ph-B.

[0055] As illustrated in FIG. 4, the plate member P1-D and the plate member P1-A are connected via a broken line θ11, the plate member P1-A and the plate member P1-C are connected via a broken line θ12, the plate member P1-C and the plate member P1-B are connected via a broken line θ13, and the plate member P1-B and the plate member P1-E are connected via a broken line θ14. Also, the plate member P2-D and the plate member P2-A are connected via a broken line θ21, the plate member P2-A and the plate member P2-C are connected via a broken line θ22, the plate member P2-C and the plate member P2-B are connected via a broken line θ23, and the plate member P2-B and the plate member P2-E are connected via a broken line θ24. Further, the plate member P1-B and the plate member Pd-B are connected via a broken line θ15, and the plate member P2-B and the plate member Pd-B are connected via a broken line θ25. Also, the plate member Pd-A and the plate member Pd-C are connected via a broken line θ31, the plate member Pd-C and the plate member Pd-B are connected via a broken line θ32, the plate member Pd-B and the plate member Ph-B are connected via a broken line θ33, the plate member Ph-B and the plate member Ph-C are connected via a broken line θ34, and the plate member Ph-C and the plate member Ph-A are connected via a broken line θ35.

[0056] In the present embodiment, the broken lines θ11 and θ21 are mountain-fold broken lines, and the broken lines other than the broken lines θ11 and θ21 are valley-fold broken lines. Here, the valley-fold broken line is a broken line for bending the plate members at both ends of the broken line in the +Zs direction, which is the front side in the figure, about the broken line when forming the holding member H from the flat plate member HH. Also, the mountain-fold broken line is a broken line for bending the plate members at both ends of the broken line in the -Zs direction, which is the back side in the figure, about the broken line when forming the holding member H from the flat plate member HH.

[0057] As illustrated in FIG. 4, an opening K1-D is formed in the plate member P1-D, an opening K1-A is formed in the plate member P1-A, an opening K1-B is formed in the plate member P1-B, and a protrusion T1-E is formed in the plate member P1-E. Also, an opening K2-D is formed in the plate member P2-D, an opening K2-A is formed in the plate member P2-A, an opening K2-B is formed in the plate member P2-B, and a protrusion T2-E is formed in the plate member P2-E. Further, an opening K3-A, an opening K4-A, and an opening Kd-G are formed in the plate member Pd-A, an opening K3-B and an opening K4-B are formed in the plate member Pd-B, an opening Kd1-F, an opening Kd2-F, and an opening Kh-H are formed on a broken line θ33 which is the boundary between the plate member Pd-B and the plate member Ph-B, an opening Kh1-B, an opening Kh2-B, an opening Kh1-E, and an opening Kh2-E are formed in the plate member Ph-B, and an opening Kh1-A, an opening Kh2-A, a protrusion Th1-D, and a protrusion Th2-D are formed in the plate member Ph-A. Also, the plate member Pd-A includes a protruding portion Td-H that protrudes in the +Ys direction in FIG. 4, and the plate member Ph-A includes a protruding portion Th-G, a protruding portion Th1-F, and a protruding portion Th2-F that protrude in the -Ys direction in FIG. 4.

[0058] Then, the flat plate member HH is folded into a mountain fold along the fold lines θ11 and θ21, and the flat plate member HH is folded into a valley fold along the fold lines θ12 to θ15, θ22 to θ25, and θ31 to θ35, so that the protrusion Th1-D is fitted into the opening K1-D, the protrusion Th2-D is fitted into the opening K2-D, the protrusion T1-E is fitted into the opening Kh1-E, the protrusion T2-E is fitted into the opening Kh2-E, the protruding portion Th1-F is fitted into the opening Kd1-F, the protruding portion Th2-F is fitted into the opening Kd2-F, the protruding portion Th-G is fitted into the opening Kd-G, and the protruding portion Td-H is fitted into the opening Kh-H. Further, when the flat plate member HH is folded along the fold lines θ11 to θ35, the buffer block R1 is fitted into the openings K1-A and K1-B so that the buffer block R1 is held between the plate members P1-A and P1-B, the buffer block R2 is fitted into the openings K2-A and K2-B so that the buffer block R2 is held between the plate members P2-A and P2-B, the buffer block R3 is fitted into the openings K3-A and K3-B so that the buffer block R3 is held between the plate members Pd-A and Pd-B, the buffer block R4 is fitted into the openings K4-A and K4-B so that the buffer block R4 is held between the plate members Pd-A and Pd-B, the buffer block Rh1 is fitted into the openings Kh1-A and Kh1-B so that the buffer block Rh1 is held between the plate members Ph-A and Ph-B, and the buffer block Rh2 is fitted into the openings Kh2-A and Kh2-B so that the buffer block Rh2 is held between the plate members Ph-A and Ph-B.

[0059] In addition, in this embodiment, the buffer blocks R3 and R4 are formed of the same material as the buffer block R1. Further, the buffer blocks R3 and R4 are formed in a shape such that, when manufacturing the buffer material S, similar to the buffer blocks R1 and R2, the occurrence of misidentification between the buffer blocks R3 and R4 and the buffer blocks Rh1 and Rh2 is suppressed. Note that in this embodiment, the buffer blocks R3 and R4 have a shape different from that of the buffer blocks R1 and R2, but may have the same shape as the buffer blocks R1 and R2.

[0060] <<1.4. Reference Example 1>> FIG. 5 is a cross-sectional view showing an example of a cross-section of the buffer material SV according to Reference Example 1.

[0061] As illustrated in FIG. 5, the buffer material SV according to Reference Example 1 differs from the buffer material S according to the first embodiment in that it includes a holding member HV instead of the holding member H and a plurality of buffer blocks RV instead of the plurality of buffer blocks R. Here, the holding member HV differs from the holding member H according to the first embodiment in that it includes a plate-like portion PV1, a plate-like portion PV2, and a plate-like portion PhV instead of the plate-like portion P1, the plate-like portion P2, and the plate-like portion Ph. Further, the plurality of buffer blocks RV provided in the buffer material SV include a buffer block RV1, a buffer block RV2, a buffer block RhV1, and a buffer block RhV2.

[0062] In Reference Example 1, the buffer block RV is formed of the same material as the buffer block R according to the first embodiment. Further, in Reference Example 1, the buffer block RV is attached to the holding member HV with an adhesive.

[0063] Thus, in Reference Example 1, the buffer block RV is attached to the holding member HV by an adhesive. Therefore, in Reference Example 1, when disassembling the buffer material SV, the labor required to remove the buffer block RV from the holding member HV increases. Also, in Reference Example 1, when disassembling the buffer material SV, it is difficult to completely remove the buffer block RV from the holding member HV, and in some cases, a part of the buffer block RV may continue to adhere to the plate-like portion PhV even after the buffer material SV is disassembled. Therefore, in Reference Example 1, when the buffer block RV is formed of a material different from that of the holding member HV, the recyclability of the buffer material SV is low.

[0064] In contrast, according to the present embodiment, the buffer block R is attached to the holding member H without using an adhesive. Therefore, according to the present embodiment, it is possible to reduce the labor required to remove the buffer block R from the holding member H when disassembling the buffer material S as compared with Reference Example 1. Also, according to the present embodiment, since it is easy to completely remove the buffer block R from the holding member H when disassembling the buffer material S as compared with Reference Example 1, it is possible to increase the recyclability of the buffer material S.

[0065] Also, when buffering an external force by the buffer material SV as in Reference Example 1, the external force applied to the electronic device 100 is buffered not only by the buffer block RV but also by the holding member HV. Therefore, in Reference Example 1, in order to achieve effective buffering of the external force by the buffer material SV, it is necessary to consider not only the buffering of the external force applied to the electronic device 100 by the buffer block RV but also the buffering of the external force applied to the electronic device 100 by the holding member HV. That is, in Reference Example 1, it is difficult to accurately suppress the external force applied to the electronic device 100 by the buffer material SV.

[0066] On the other hand, according to this embodiment, when buffering an external force by the buffer material S, the external force applied to the electronic device 100 will be buffered only by the buffer block R. Therefore, in this embodiment, in order to realize effective buffering of the external force by the buffer material S, it is only necessary to consider the buffering by the buffer block R of the external force applied to the electronic device 100. Compared with Reference Example 1, the design of the buffer material S becomes easier.

[0067] <<1.5. Conclusion of the First Embodiment>> As described above, the buffer material S according to this embodiment is a buffer material S that is housed in a packing box 2 capable of housing the electronic device 100 and buffers an external force applied to the electronic device 100 housed in the packing box 2. An opening K1-A is formed. When the buffer material S and the electronic device 100 are housed in the packing box 2, a plate member P1-A facing the electronic device 100 and an opening K1-B are formed. When the buffer material S and the electronic device 100 are housed in the packing box 2, a holding member H including a plate member P1-B facing the inner wall surface of the packing box 2, and a buffer block R1 held by the holding member H between the plate member P1-A and the plate member P1-B. The buffer block R1 includes a buffer portion Q-A that protrudes from the opening K1-A in the +Xs direction from the plate member P1-A toward the electronic device 100 and can contact the electronic device 100, and a buffer portion Q-B that protrudes from the opening K1-B in the -Xs direction from the plate member P1-B toward the inner wall surface of the packing box 2 and can contact the inner wall surface of the packing box 2. And a connecting portion Q-C provided between the plate member P1-A and the plate member P1-B and connecting the buffer portion Q-A and the buffer portion Q-B. The connecting portion Q-C is longer than the opening K1-A and the opening K1-B in the +Zs direction intersecting the +Xs direction and the -Xs direction.

[0068] Therefore, in this embodiment, it becomes possible to prevent the buffer block R1 from dropping in the +Xs direction from the opening K1-A, and it also becomes possible to prevent the buffer block R1 from dropping in the -Xs direction from the opening K1-B. For this reason, in this embodiment, the buffer block R1 can maintain a state where the external force applied to the electronic device 100 can be buffered, and the possibility that the buffer block R1 cannot protect the electronic device 100 can be suppressed. Further, in this embodiment, the buffer block R1 can be held by the holding member H between the plate member P1-A and the plate member P1-B without using an adhesive.

[0069] Further, in this embodiment, the holding member H includes a plate member P1-C that connects the plate member P1-A and the plate member P1-B, and in the +Xs direction, the width of the buffer block R1 is larger than the width of the plate member P1-C.

[0070] For this reason, in this embodiment, even when an external force is applied to the packing box 2, the external force can be buffered by the buffer block R1, and the external force transmitted to the electronic device 100 can be weakened.

[0071] Further, the cushioning material S according to the present embodiment includes a cushioning block Rh1, the holding member H has an opening Kh1-A formed therein, and when the cushioning material S and the electronic device 100 are housed in the packing box 2, a plate member Ph-A facing the electronic device 100, and an opening Kh1-B is formed therein, and when the cushioning material S and the electronic device 100 are housed in the packing box 2, a plate member Ph-B facing the inner wall surface of the packing box 2, and the cushioning block Rh1 projects from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and has a cushioning portion Qh-A capable of contacting the electronic device 100, and projects from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packing box 2 and has a cushioning portion Qh-B capable of contacting the inner wall surface of the packing box 2, and is provided between the plate member Ph-A and the plate member Ph-B and has a connecting portion Qh-C connecting the cushioning portion Qh-A and the cushioning portion Qh-B, and the connecting portion Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction, and at least one of the length LQ-A of the cushioning portion Q-A in the +Zs direction and the length LQ-B of the cushioning portion Q-B in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction and longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0072] Therefore, in the present embodiment, it is possible to prevent the cushioning block R1 from being erroneously provided between the plate member Ph-A and the plate member Ph-B instead of the cushioning block Rh1. That is, in the present embodiment, when manufacturing the cushioning material S, it is possible to suppress the occurrence of misplacement between the cushioning block Rh1 and the cushioning block R1.

[0073] Further, the buffer material S according to the present embodiment includes a buffer block Rh1. The holding member H includes a plate member P1-C that connects the plate members P1-A and P1-B, and an opening Kh1-A is formed. When the buffer material S and the electronic device 100 are accommodated in the packaging box 2, a plate member Ph-A that faces the electronic device 100, and an opening Kh1-B is formed. When the buffer material S and the electronic device 100 are accommodated in the packaging box 2, a plate member Ph-B that faces the inner wall surface of the packaging box 2. The buffer block Rh1 protrudes from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100, and has a buffer portion Qh-A that can contact the electronic device 100, and protrudes from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2, and has a buffer portion Qh-B that can contact the inner wall surface of the packaging box 2. The buffer block Rh1 is provided between the plate member Ph-A and the plate member Ph-B, and includes a connection portion Qh-C that connects the buffer portion Qh-A and the buffer portion Qh-B. The connection portion Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction that intersects the +Zs direction and the -Zs direction. At least one of the length HQ-At2 in the +Xs direction from the end portion of the connection portion Qh-C in the +Xs direction to the opening Kh1-A and the length HQ-Bt2 in the +Xs direction from the end portion of the connection portion Qh-C in the +Xs direction to the opening Kh1-B is longer than the length LQ-At in the +Zs direction from the plate member P1-C to the opening K1-A, and is also longer than the length LQ-Bt in the +Zs direction from the plate member P1-C to the opening K1-B. This is the feature.

[0074] Therefore, in the present embodiment, it is possible to prevent the buffer block Rh1 from being erroneously provided between the plate members P1-A and P1-B instead of the buffer block R1. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the occurrence of misplacement between the buffer block Rh1 and the buffer block R1.

[0075] <<2. Second Embodiment>> Hereinafter, a second embodiment of the present invention will be described. For elements in each of the embodiments exemplified below whose operations and functions are the same as those in the first embodiment, the reference numerals used in the description of the first embodiment are reused, and the detailed description of each is appropriately omitted.

[0076] <<2.1. Overview of the cushioning material>> Hereinafter, with reference to FIGS. 6 and 7, the cushioning material SJ according to the present embodiment will be described.

[0077] FIG. 6 is a perspective view showing an example of the configuration of the cushioning material SJ used for the packaging material according to the second embodiment. Further, FIG. 7 is a cross-sectional view showing an example of the cross-section of the cushioning material SJ when the cushioning material SJ is cut along the E-e line in FIG. 6. The packaging material according to the second embodiment is the same as the packaging material 1 according to the first embodiment, except that it includes a cushioning material SJ instead of the cushioning material S.

[0078] As illustrated in FIG. 6, the cushioning material SJ is different from the cushioning material S according to the first embodiment in that it includes cushioning blocks RJ1, RJ2, RJ3, and RJ4 instead of cushioning blocks R1, R2, R3, and R4. Hereinafter, the cushioning blocks RJ1, RJ2, RJ3, and RJ4 may be collectively referred to as cushioning blocks RJ.

[0079] In the present embodiment, as an example, it is assumed that the cushioning blocks RJ1, RJ2, RJ3, and RJ4 have the same shape. However, the present invention is not limited to such a mode, and among the plurality of cushioning blocks RJ provided in the cushioning material SJ, some of the cushioning blocks RJ may have a shape different from that of the other cushioning blocks RJ. Further, in the present embodiment, as an example, it is assumed that the cushioning blocks RJ are formed of the same material as the cushioning blocks R in the first embodiment described above.

[0080] Hereinafter, with reference to FIGS. 6 and 7, the cushioning block RJ will be described by exemplifying the cushioning block RJ1.

[0081] In this embodiment, the buffer block RJ1 is different from the buffer block R1 in that it includes a buffer portion QJ-A instead of the buffer portion Q-A and a buffer portion QJ-B instead of the buffer portion Q-B. Note that the buffer block RJ1 is another example of the "first buffer block".

[0082] The buffer portion QJ-A provided in the buffer block RJ1 comes into contact with the electronic device 100 when the electronic device 100 and the buffer material SJ are housed in the packing box 2. Also, in this embodiment, the buffer portion QJ-A provided in the buffer block RJ1 includes a plurality of buffer sheets J-A laminated in the +Ys direction. Note that the buffer portion QJ-A provided in the buffer block RJ1 is another example of the "first buffer portion". As described above, the +Zw direction and the -Zw direction, and the +Zs direction and the -Zs direction are parallel. And the +Ys direction intersects the +Zs direction. Therefore, the +Ys direction is a direction that intersects the -Zw direction, which is the direction in which the electronic device 100 and the buffer material SJ are inserted into the packing box 2, and also intersects the +Zw direction, which is the direction in which the electronic device 100 and the buffer material SJ are removed from the packing box 2.

[0083] In this embodiment, the buffer sheet J-A has a so-called "vertically long shape" in which the length in the +Zs direction is longer than the lengths in the +Xs direction and the +Ys direction. Also, the buffer sheet J-A has an inclined surface SL-A. In the buffer sheet J-A provided in the buffer block RJ1 in this embodiment, the inclined surface SL-A is a plane having a direction between the +Xs direction and the +Zs direction as the normal direction.

[0084] Also, the buffer portion QJ-B provided in the buffer block RJ1 comes into contact with the inner wall surface of the packing box 2 when the electronic device 100 and the buffer material SJ are housed in the packing box 2. Note that the buffer portion QJ-B provided in the buffer block RJ1 is another example of the "second buffer portion". Also, in this embodiment, the buffer portion QJ-B provided in the buffer block RJ1 includes a plurality of buffer sheets J-B laminated in the +Ys direction.

[0085] In this embodiment, the buffer sheet J-B has a so-called "vertically long shape" in which the length in the +Zs direction is longer than the lengths in the +Xs direction and the +Ys direction. Further, the buffer sheet J-B has an inclined surface SL-B. In this embodiment, in the buffer sheet J-B provided on the buffer block RJ1, the inclined surface SL-B is a plane having a direction between the -Xs direction and the +Zs direction as the normal direction.

[0086] In this embodiment, each of the buffer blocks RJ2, RJ3, and RJ4 includes a buffer portion QJ-A including a plurality of buffer sheets J-A, a buffer portion QJ-B including a plurality of buffer sheets J-B, and a connection portion Q-C, similar to the buffer block RJ1. Among these, in the buffer block RJ2, the buffer portion QJ-A is composed of a plurality of buffer sheets J-A laminated in the +Ys direction, and the buffer portion QJ-B is composed of a plurality of buffer sheets J-B laminated in the +Ys direction. Further, in the buffer blocks RJ3 and RJ4, the buffer portion QJ-A is composed of a plurality of buffer sheets J-A laminated in the +Xs direction, and the buffer portion QJ-B is composed of a plurality of buffer sheets J-B laminated in the +Xs direction. Note that the +Xs direction intersects the -Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are inserted into the packing box 2, and also intersects the +Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are removed from the packing box 2.

[0087] <<2.2. Reference Example 2>> Hereinafter, the cushioning material SW according to Reference Example 2 will be described with reference to FIGS. 8 and 9.

[0088] FIG. 8 is a perspective view showing an example of the configuration of the cushioning material SW used for the packaging material according to Reference Example 2. Further, FIG. 9 is a cross-sectional view showing an example of the cross-section of the cushioning material SW when the cushioning material SW is cut along the E-e line in FIG. 8. The packaging material according to Reference Example 2 is different from the packaging material according to the second embodiment in that it includes a cushioning material SW instead of the cushioning material SJ.

[0089] As illustrated in FIG. 8, the buffer material SW is different from the buffer material SJ according to the second embodiment in that instead of the buffer blocks RJ1, RJ2, RJ3, and RJ4, it includes buffer blocks RW1, RW2, RW3, and RW4. Hereinafter, the buffer blocks RW1, RW2, RW3, and RW4 may be collectively referred to as buffer block RW. Also, in Reference Example 2, as an example, it is assumed that the buffer blocks RW1, RW2, RW3, and RW4 have the same shape.

[0090] Hereinafter, with reference to FIGS. 8 and 9, the buffer block RW will be described by exemplifying the buffer block RW1.

[0091] In the present embodiment, the buffer block RW1 is different from the buffer block RJ1 in that it includes a buffer portion QW-A instead of the buffer portion QJ-A and a buffer portion QW-B instead of the buffer portion QJ-B.

[0092] The buffer portion QW-A provided in the buffer block RW1 comes into contact with the electronic device 100 when the electronic device 100 and the buffer material SW are housed in the packing box 2. Also, in the present embodiment, the buffer portion QW-A provided in the buffer block RW1 includes a plurality of buffer sheets W-A laminated in the +Zs direction. In the present embodiment, the buffer sheet W-A provided in the buffer block RW1 has a so-called "landscape shape" in which the length in the +Ys direction is longer than the lengths in the +Xs direction and the +Zs direction.

[0093] The buffer portion QW-B provided in the buffer block RW1 contacts the inner wall surface of the packaging box 2 when the electronic device 100 and the cushioning material SW are accommodated in the packaging box 2. Further, in the present embodiment, the buffer portion QW-B provided in the buffer block RW1 includes a plurality of buffer sheets W-B laminated in the +Zs direction. In the present embodiment, the buffer sheet W-B provided in the buffer block RW1 has a so-called "landscape shape" in which the length in the +Ys direction is longer than the length in the +Xs direction and the length in the +Zs direction.

[0094] In addition, in Reference Example 2, each of the buffer block RW2, the buffer block RW3, and the buffer block RW4 includes a buffer portion QW-A including a plurality of buffer sheets W-A laminated in the +Zs direction, a buffer portion QW-B including a plurality of buffer sheets W-B laminated in the +Zs direction, and a connection portion Q-C.

[0095] As shown in FIG. 9, when the electronic device 100 is inserted into the packaging material according to Reference Example 2, the electronic device 100 moving in the -Zs direction contacts the buffer portion QW-A among the buffer blocks RW provided in the cushioning material SW included in the packaging material according to Reference Example 2. As a result, as shown in the region Ar1 of FIG. 9, the electronic device 100 may ride on the +Zs side end of the buffer portion QW-A, making it impossible to accommodate the electronic device 100 in the packaging material. Further, as shown in the region Ar2 of FIG. 9, since the electronic device 100 moving in the -Zs direction applies a strong force to the buffer sheet W-A located at the +Zs direction end of the buffer portion QW-A, the buffer sheet W-A may peel off from the buffer block RW. Also, when the cushioning material SW is inserted into the packaging box 2, due to the friction generated between the packaging box 2 and the cushioning material SW, a part of the plurality of buffer sheets W-B constituting the buffer portion QW-B of the buffer block RW may peel off from the buffer block RW.

[0096] In contrast, according to the present embodiment, when the electronic device 100 is inserted into the packaging material, the electronic device 100 moving in the -Zs direction comes into contact with the buffer block RJ provided in the buffer material SJ included in the packaging material according to the second embodiment, at the buffer portion QJ-A. Each buffer sheet J-A constituting the buffer portion QJ-A is provided with an inclined surface SL-A at the end in the +Zs direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility that the electronic device 100 moving in the -Zs direction rides on the +Zs side end of the buffer portion QJ-A can be reduced. Further, according to the present embodiment, the buffer portion QJ-A includes a buffer sheet J-A having the +Zs direction as the longitudinal direction, instead of the buffer sheet W-A having the +Ys direction as the longitudinal direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility that the buffer sheet J-A peels off from the buffer block RJ due to the influence of the electronic device 100 moving in the -Zs direction can be reduced. Furthermore, according to the present embodiment, the buffer portion QJ-B includes a buffer sheet J-B having the +Zs direction as the longitudinal direction, instead of the buffer sheet W-B having the +Ys direction as the longitudinal direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility that the buffer sheet J-B peels off from the buffer block RJ due to the influence of the friction generated between the packaging box 2 and the buffer material SJ can be reduced.

[0097] <<2.3. Conclusion of the Second Embodiment>> As described above, the packaging material according to the present embodiment includes a packaging box 2 capable of accommodating the electronic device 100, and a buffer material SJ accommodated in the packaging box 2 and in contact with the electronic device 100 accommodated in the packaging box 2 to buffer an external force applied to the electronic device 100. The buffer material SJ includes a plurality of buffer sheets J-A laminated along the +Ys direction intersecting the -Zs direction, which is the direction in which the electronic device 100 is inserted into the packaging box 2.

[0098] Therefore, in the present embodiment, compared with the aspect in which the buffer sheets J-A are laminated along the +Zs direction, the possibility that the buffer sheets J-A peel off from the buffer material SJ can be reduced.

[0099] In addition, in the packaging material according to the present embodiment, the buffer sheet J-A is characterized in that an inclined surface SL-A is provided at an end portion in the +Zs direction opposite to the -Zs direction.

[0100] Therefore, in the present embodiment, the possibility that the electronic device 100 rides on the end portion of the buffer sheet J-A in the +Zs direction can be reduced.

[0101] In addition, in the packaging material according to the present embodiment, the buffer material SJ has an opening K1-A, and when the buffer material SJ and the electronic device 100 are accommodated in the packaging box 2, a plate member P1-A facing the electronic device 100, and an opening K1-B is formed, and when the buffer material SJ and the electronic device 100 are accommodated in the packaging box 2, a plate member P1-B facing the inner wall surface of the packaging box 2, a holding member H, and a buffer block RJ1 held by the holding member H between the plate member P1-A and the plate member P1-B, the buffer block RJ1 is composed of a plurality of buffer sheets J-A, projects from the opening K1-A in the +Xs direction toward the electronic device 100, and has a buffer portion QJ-A capable of contacting the electronic device 100, and projects from the opening K1-B in the -Xs direction from the plate member P1-B toward the inner wall surface of the packaging box 2, and has a buffer portion QJ-B capable of contacting the inner wall surface of the packaging box 2, and a connecting portion Q-C provided between the plate member P1-A and the plate member P1-B and connecting the buffer portion QJ-A and the buffer portion QJ-B, the connecting portion Q-C is longer than the opening K1-A and the opening K1-B in the +Zs direction intersecting the +Xs direction and the -Xs direction, and is characterized in that.

[0102] Therefore, in the present embodiment, it is possible to prevent the buffer block RJ1 from dropping in the +Xs direction from the opening K1-A, and it is also possible to prevent the buffer block RJ1 from dropping in the -Xs direction from the opening K1-B. Further, in the present embodiment, the buffer block RJ1 can be held by the holding member H between the plate member P1-A and the plate member P1-B without using an adhesive.

[0103] Further, in the present embodiment, the holding member H includes a plate member P1-C that connects the plate members P1-A and P1-B, and in the +Xs direction, the width of the buffer block RJ1 is larger than the width of the plate member P1-C.

[0104] Therefore, in the present embodiment, even when an external force is applied to the packing box 2, the external force can be buffered by the buffer block RJ1, and the external force transmitted to the electronic device 100 can be weakened.

[0105] Further, in the present embodiment, the cushioning material SJ includes a buffer block Rh1, the holding member H has an opening Kh1-A formed therein, and when the cushioning material SJ and the electronic device 100 are accommodated in the packing box 2, a plate member Ph-A facing the electronic device 100, and an opening Kh1-B is formed therein, and when the cushioning material SJ and the electronic device 100 are accommodated in the packing box 2, a plate member Ph-B facing the inner wall surface of the packing box 2, and the buffer block Rh1 projects from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and has a buffer portion Qh-A capable of contacting the electronic device 100, and projects from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packing box 2 and has a buffer portion Qh-B capable of contacting the inner wall surface of the packing box 2, and is provided between the plate member Ph-A and the plate member Ph-B and has a connecting portion Qh-C that connects the buffer portion Qh-A and the buffer portion Qh-B. The connecting portion Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction that intersects the +Zs direction and the -Zs direction, and at least one of the length LQ-A of the buffer portion QJ-A in the +Zs direction and the length LQ-B of the buffer portion QJ-B in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction and longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0106] Therefore, in the present embodiment, it is possible to prevent the buffer block RJ1 from being erroneously provided between the plate members Ph-A and Ph-B instead of the buffer block Rh1. That is, in the present embodiment, when manufacturing the buffer material SJ, it is possible to suppress the occurrence of misplacement between the buffer block Rh1 and the buffer block RJ1.

[0107] Further, in the present embodiment, the buffer material SJ includes the buffer block Rh1, and the holding member H includes a plate member P1-C that connects the plate members P1-A and P1-B, an opening Kh1-A is formed, and when the buffer material SJ and the electronic device 100 are housed in the packaging box 2, a plate member Ph-A facing the electronic device 100, and an opening Kh1-B is formed, and when the buffer material SJ and the electronic device 100 are housed in the packaging box 2, a plate member Ph-B facing the inner wall surface of the packaging box 2. The buffer block Rh1 projects from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and has a buffer portion Qh-A that can contact the electronic device 100, projects from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2, and has a buffer portion Qh-B that can contact the inner wall surface of the packaging box 2, and is provided between the plate members Ph-A and Ph-B and includes a connecting portion Qh-C that connects the buffer portion Qh-A and the buffer portion Qh-B. The connecting portion Qh-C is longer than the openings Kh1-A and Kh1-B in the +Xs direction that intersects the +Zs direction and the -Zs direction, and at least one of the length HQ-At2 in the +Xs direction from the end portion of the connecting portion Qh-C in the +Xs direction to the opening Kh1-A and the length HQ-Bt2 in the +Xs direction from the end portion of the connecting portion Qh-C in the +Xs direction to the opening Kh1-B is longer than the length LQ-At in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length LQ-Bt in the +Zs direction from the plate member P1-C to the opening K1-B.

[0108] Therefore, in this embodiment, it is possible to prevent the buffer block Rh1 from being erroneously provided between the plate members P1-A and P1-B instead of the buffer block RJ1. That is, in this embodiment, when manufacturing the buffer material SJ, it is possible to suppress the occurrence of misidentification between the buffer block Rh1 and the buffer block RJ1.

[0109] <<3. Variation Example>> Each of the above embodiments can be variously modified. Specific modification modes are exemplified below. Two or more modes arbitrarily selected from the following examples can be appropriately combined within a range where they do not conflict with each other. In addition, for elements whose actions and functions are equivalent to those of the embodiment in the variation examples exemplified below, the reference signs referred to in the above description are reused, and the detailed description of each is appropriately omitted.

[0110] <<3.1. Variation Example 1>> In the above-described second embodiment, the buffer block RJ includes a buffer portion QJ-A composed of a plurality of buffer sheets J-A, a buffer portion QJ-B composed of a plurality of buffer sheets J-B, and a connection portion Q-C. However, the present invention is not limited to such a mode. That is, the buffer block RJ only needs to include at least the buffer portion QJ-A. For example, the buffer block RJ may include a buffer portion Q-B instead of the buffer portion QJ-B.

[0111] <<3.2. Variation Example 2>> In the above-described first embodiment, second embodiment, and variation example 1, the Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW are orthogonal to each other. However, the present invention is not limited to such a mode. The Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW only need to extend in different directions from each other. Also, in the above-described first embodiment, second embodiment, and variation example 1, the Xs-axis, Ys-axis, and Zs-axis of the buffer material coordinate system ΣS are orthogonal to each other. However, the present invention is not limited to such a mode. The Xs-axis, Ys-axis, and Zs-axis of the buffer material coordinate system ΣS only need to extend in different directions from each other.

[0112] <<3.3. Modification Example 3>> In the above-described first and second embodiments and modification examples 1 and 2, the case where the packaging material has four cushioning materials S or SJ has been illustrated. However, the present invention is not limited to such a mode. The packaging material according to the present invention may include one or more and three or less cushioning materials S or SJ, or may include five or more cushioning materials S or SJ.

Explanation of Reference Numerals

[0113] 1... Packaging material, 2... Packaging box, 100... Electronic device, H... Holding material, P... Plate-like part, P1... Plate-like part, P1-A... Plate member, P1-B... Plate member, P1-C... Plate member, Ph... Plate-like part, Ph-A... Plate member, Ph-B... Plate member, Q-A... Cushioning part, Q-B... Cushioning part, Q-C... Connection part, R... Cushioning block, R1... Cushioning block, Rh1... Cushioning block, S... Cushioning material.

Claims

1. A cushioning material housed in a packing box capable of housing an electronic device, the cushioning material cushioning an external force applied to the electronic device housed in the packing box, A first opening is formed, and when the cushioning material and the electronic device are housed in the packing box, a first plate facing the electronic device, and A second opening is formed, and when the cushioning material and the electronic device are housed in the packing box, a second plate facing the inner wall surface of the packing box, A holding member comprising: A first cushioning block held by the holding member between the first plate and the second plate; Comprising, The first cushioning block is, A first cushioning portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; A second cushioning portion protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packing box and capable of contacting the inner wall surface of the packing box; A first connecting portion provided between the first plate and the second plate and connecting the first cushioning portion and the second cushioning portion; Comprising, The first connecting portion is, In a first holding direction intersecting the first direction and the second direction, longer than the first opening and the second opening, A cushioning material characterized by this.

2. The holding member is, Comprises a first connecting plate connecting the first plate and the second plate, In the first direction, The width of the first cushioning block is larger than the width of the first connecting plate, The cushioning material according to claim 1, characterized by this.

3. The cushioning material is, Comprises a second cushioning block, The holding member is, A third opening is formed, and when the cushioning material and the electronic device are housed in the packing box, a third plate facing the electronic device; and A fourth opening is formed, and when the cushioning material and the electronic device are housed in the packing box, a fourth plate facing the inner wall surface of the packing box; Comprising, The second cushioning block is, A third cushioning portion protruding from the third opening in a third direction from the third plate toward the electronic device and capable of contacting the electronic device; A fourth cushioning portion protruding from the fourth opening in a fourth direction from the fourth plate toward the inner wall surface of the packing box and capable of contacting the inner wall surface of the packing box; A second connecting portion provided between the third plate and the fourth plate and connecting the third cushioning portion and the fourth cushioning portion; Comprising, The second connecting portion is, In a second holding direction intersecting the third direction and the fourth direction, longer than the third opening and the fourth opening, The length of the first buffer portion in the first holding direction, and at least one of the lengths of the second buffer portions in the first holding direction is longer than the length of the third opening in the second holding direction, and longer than the length of the fourth opening in the second holding direction, The cushioning material according to claim 1 or 2, characterized in that.

4. The cushioning material includes a second buffer block, The holding member includes a first connection plate connecting the first plate and the second plate, a third opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a third plate facing the electronic device, a fourth opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a fourth plate facing the inner wall surface of the packaging box, and is provided with The second buffer block includes a third buffer portion protruding from the third opening in a third direction from the third plate toward the electronic device and capable of contacting the electronic device, a fourth buffer portion protruding from the fourth opening in a fourth direction from the fourth plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box, a second connection portion provided between the third plate and the fourth plate and connecting the third buffer portion and the fourth buffer portion, and is provided with The second connection portion is longer than the third opening and the fourth opening in a second holding direction intersecting the third direction and the fourth direction, the length in the second holding direction from the end portion of the second connection portion in the second holding direction to the third opening, and at least one of the lengths in the second holding direction from the end portion of the second connection portion in the second holding direction to the fourth opening is longer than the length in the first holding direction from the first connection plate to the first opening, and longer than the length in the first holding direction from the first connection plate to the second opening, The cushioning material according to any one of claims 1 to 3, characterized in that.

5. a packaging box capable of housing an electronic device, a cushioning material that cushions an external force applied to the electronic device housed in the packaging box, and is provided with The cushioning material includes a first plate having a first opening formed therein and facing the electronic device when the cushioning material and the electronic device are housed in the packaging box, and a second plate having a second opening formed therein and facing the inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box, a holding member including A first buffer block held by the holding material between the first plate and the second plate; comprising; the first buffer block; a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and being capable of contacting the electronic device; a second buffer portion protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packing box and being capable of contacting the inner wall surface of the packing box; a first connecting portion provided between the first plate and the second plate and connecting the first buffer portion and the second buffer portion; comprising; the first connecting portion; is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction; A packing material characterized by this.

6. An electronic device; A packing box capable of accommodating the electronic device; A buffer material for buffering an external force applied to the electronic device accommodated in the packing box; comprising; the buffer material; a first plate having a first opening formed therein and facing the electronic device when the buffer material and the electronic device are accommodated in the packing box, and a second plate having a second opening formed therein and facing the inner wall surface of the packing box when the buffer material and the electronic device are accommodated in the packing box, a holding material comprising; a first buffer block held by the holding material between the first plate and the second plate; comprising; the first buffer block; a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and being capable of contacting the electronic device; a second buffer portion protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packing box and being capable of contacting the inner wall surface of the packing box; a first connecting portion provided between the first plate and the second plate and connecting the first buffer portion and the second buffer portion; comprising; the first connecting portion; is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction; A packed product characterized by this.

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