Laser Processing Equipment

Abstract

To provide a laser machining device whose position to a machining object can be more accurately adjusted.SOLUTION: A laser machining device 10 includes: a laser light source 33 emitting laser light LW; a guiding light source 44 emitting guide light LG having a wavelength in a visible area; a scanning part 46 scanning the laser light LW and the guide light LG; and a protection glass 48 through which the laser light LW and the guide light LG transmit. A displacement sensor 47 includes a light projecting part 47a and a light receiving part 47b. The light projecting part 47a projects detection light LK having a wavelength in a visible area to a machining object W. The displacement sensor 47 is disposed so that the detection light LK intersects a vertical axis of the protection glass 48 at a prescribed reference distance. The light receiving part 47b receives the detection light LK (reflection light KR) which is dispersed and reflected in the machining object W. The displacement sensor 47 measures a distance on the basis of the light receiving condition of the light receiving part 47b. A main control part 21 displays the distance on a display part 51 of a console 14 on the basis of a measurement result of the displacement sensor 47.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a laser processing apparatus. [Background technology]

[0002] The laser processing device includes a laser light source that emits invisible laser light, and a visible light source that emits visible guide light (see, for example, Patent Documents 1 and 2). This laser processing device irradiates a workpiece with laser light, and processes the workpiece with the laser light. The laser processing device also irradiates visible guide light at the same position on the workpiece as the position where the processing laser light is irradiated. This guide light allows an operator to check the irradiation position of the laser light on the workpiece, adjust the position of the workpiece, etc. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-208132 A [Patent Document 2] JP 2017-030011 A Summary of the Invention [Problem to be solved by the invention]

[0004] Laser light has the highest energy at the focal position. Therefore, in applications where processing is performed with high energy, it is necessary to place the workpiece at the focal position, that is, to place the workpiece at a position with the focal distance of the laser processing device. However, position adjustment using guide light is performed by the operator's visual confirmation, so there is a risk that the position of the workpiece may deviate from the focal position. For this reason, more accurate position adjustment is required.

[0005] On the other hand, in an application called color printing on the processed surface of a workpiece such as resin, it may be necessary to position the processed surface of the workpiece at a position shifted from the focal position. In such cases, it is necessary to position the workpiece (processed surface) on the far or near side of the focal position. In such cases, accurate position adjustment is also required.

[0006] An object of the present disclosure is to provide a laser processing apparatus that makes it possible to adjust the position of a workpiece more accurately. [Means for solving the problem]

[0007] A laser processing apparatus according to the present disclosure is a laser processing apparatus for processing an object to be processed with laser light, the laser processing apparatus including: a laser light source that emits the laser light; a guide light source that emits guide light having a wavelength in the visible range; a light combining section that combines the laser light and the guide light; an emission window section through which the laser light and the guide light pass; a scanning section that scans the laser light and the guide light; a light projecting section that projects detection light having a wavelength in the visible range onto the object to be processed; and a light receiving section that receives light that is diffusely reflected by the detection light at the object to be processed, the laser processing apparatus including: a displacement sensor that is disposed such that an optical axis of the detection light intersects with a vertical axis of the emission window section at a predetermined reference distance from the emission window section; a mode selection unit which selects a processing mode in which the workpiece is processed by laser beam irradiation, or a position adjustment mode which adjusts the position of the workpiece; a control unit which controls the scanning unit to process the workpiece with the laser beam in the processing mode, and controls the scanning unit to project a reference mark for position adjustment onto the workpiece with the guide light in the position adjustment mode; the position adjustment modes include a first adjustment mode and a second adjustment mode, and the control unit projects the reference mark onto the workpiece and projects the detection light toward the workpiece in the first adjustment mode, and projects at least the detection light toward the workpiece to measure the distance to the workpiece and displays the measurement result on a display unit. Effect of the Invention

[0008] According to the laser processing apparatus of the present disclosure, it is possible to adjust the position of the workpiece more accurately. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a laser processing apparatus according to one embodiment. [Diagram 2] FIG. 2 is a block diagram showing the electrical configuration of the laser processing apparatus of FIG. [Diagram 3] FIG. 3 is a plan view showing an outline of the internal structure of the head unit in FIG. [Figure 4] FIG. 4 is a partial schematic diagram of the internal structure of the head unit in FIG. 1 viewed from below, and is an explanatory diagram showing the relationship between the optical axes of the laser light and the guide light and the displacement sensor. [Diagram 5] FIG. 5 is a schematic diagram of the head unit of FIG. 1 viewed from the front, illustrating the relationship between the optical axes of the laser light and the guide light and the displacement sensor. [Figure 6] FIG. 6 is a schematic diagram of the head unit in FIG. 1 as viewed from the side, and is an explanatory diagram showing the relationship between the optical axes of the laser light and the guide light and the displacement sensor. [Figure 7A] FIG. 7A is an explanatory diagram showing the relationship between the lens position in the focus adjustment unit and the focal position of the laser light. [Figure 7B] FIG. 7B is an explanatory diagram showing the relationship between the lens position in the focus adjustment unit and the focal position of the laser light. [Figure 7C] FIG. 7C is an explanatory diagram showing the relationship between the lens position in the focus adjustment unit and the focal position of the laser light. [Figure 8] FIG. 8 is an explanatory diagram showing guide marks and guide points produced by the guide light. [Figure 9] FIG. 9 is a block diagram showing an electrical configuration of a laser processing device according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of a laser processing apparatus will be described with reference to the drawings. The embodiments shown below are illustrative of configurations and methods for embodying the technical ideas, and do not limit the materials, shapes, structures, arrangements, dimensions, etc. of each component to those described below. For simplicity and clarity of explanation, the components shown in the drawings are not necessarily drawn to scale. The accompanying drawings are merely illustrative of the embodiments of the present disclosure and should not be considered as limiting the present disclosure. Terms such as "first", "second", and "third" in this disclosure are used merely to distinguish objects and do not rank the objects.

[0011] [Laser processing equipment overview] As shown in FIG. 1, the laser processing apparatus 10 includes a controller unit 11, a light source unit 12, a head unit 13, and a console 14. The light source unit 12 is connected to the head unit 13 by a first electric cable 81 and an optical fiber cable FL. The light source unit 12 is connected to the controller unit 11 by a second electric cable 82. The first electric cable 81 is composed of a first power cable SP1 and a first signal cable SL1. The second electric cable 82 is composed of a second power cable SP2 and a second signal cable SL2. The controller unit 11 is supplied with AC power by the power cable. The laser processing apparatus 10 operates by the supplied AC power and processes the workpiece W. The console 14 is connected to the controller unit 11 by a third electric cable 83. The console 14 is provided for performing various settings in the laser processing apparatus 10. The console 14 is provided for displaying the state of the laser processing apparatus 10 and various information.

[0012] The controller unit 11 controls the light source unit 12 and the head unit 13. The light source unit 12 generates a laser light LW for processing the workpiece W. The laser light is transmitted to the head unit 13 by an optical fiber cable FL. The head unit 13 emits the laser light LW toward the workpiece W.

[0013] [Configuration of each unit] [Light source unit] 2, the light source unit 12 includes a light source control unit 31, a storage unit 32, a laser light source 33, and a fan 34. The light source control unit 31, the storage unit 32, the laser light source 33, and the fan 34 are 2 Power Cable SP 2 The light source control unit 31 is operated by a driving power supply supplied by the 2 Signal cable SL 2 Thus, it is configured to be able to communicate with the main control unit 21 of the controller unit 11.

[0014] The light source control unit 31 controls the laser light source 33. The laser light source 33 emits a laser beam LW. The laser light source 33 may be any type that emits a laser beam, and may be, for example, a fiber laser, a YAG laser, or a CO 2 Lasers, etc.

[0015] The storage unit 32 stores information about the light source unit 12. The information about the light source unit 12 includes identification information about the light source unit 12. The identification information includes model information (type) and unique information (serial number) of the light source unit 12. The fan 34 is controlled by, for example, the light source control unit 31. The fan 34 cools the laser light source 33 and various electronic components of the light source unit 12.

[0016] [Head unit] The head unit 13 includes a head control unit 41, a storage unit 42, a monitor unit 43, a guide light source 44, a focus adjustment unit 45, a scanning unit 46, a displacement sensor 47, and a protective glass 48.

[0017] The storage unit 42 stores information about the head unit 13. The information about the head unit 13 includes identification information about the head unit 13. The identification information includes model information about the head unit 13 ( Model ), including unique information (serial number).

[0018] The monitor section 43 monitors the amount of laser light transmitted from the light source unit 12 through the optical fiber cable FL. The guide light source 44 emits guide light LG having a wavelength in the visible region.

[0019] The focal point adjustment unit 45 adjusts the focal point position (focal length) of the laser light LW. The scanning unit 46 irradiates the laser light LW toward the workpiece W. The scanning unit 46 also scans the processing surface Wa of the workpiece W with the laser light LW. The laser light LW reflected by the scanning unit 46 is emitted to the outside of the head unit 13 through a protective glass 48. The protective glass 48 constitutes an emission window. The protective glass 48 has an emission surface 48a that constitutes a part of the outer circumferential surface of the head unit 13.

[0020] The displacement sensor 47 includes a light-projecting unit 47a and a light-receiving unit 47b. The light-projecting unit 47a projects detection light LK having a wavelength in the visible region. The detection light LK is emitted to the outside of the head unit 13 through a protective glass 48. The light-projecting unit 47a is arranged to project the detection light LK toward the workpiece W. The light-receiving unit 47b receives the detection light LK (reflected light KR) reflected by the workpiece W. The displacement sensor 47 outputs the amount of received light. The displacement sensor 47 measures the distance based on the light-receiving state of the light-receiving unit 47b. This distance is the distance from the reference surface of the head unit 13 to the object that reflects the detection light LK, here the workpiece W. The reference surface is set, for example, on the emission surface 48a of the protective glass 48, the bottom surface of the head unit 13, or the like.

[0021] The displacement sensor 47 is a sensor that measures the distance to an object by, for example, triangulation. The light receiving unit 47b includes, for example, a light receiving element that detects the receiving position of the reflected light KR on the light receiving surface. Such a light receiving element is, for example, a CMOS image sensor (CMOS (Complementary Metal-Oxide Semiconductor) image sensor), a CCD image sensor (CCD (Charge Coupled Device) image sensor), a PSD (Position Sensitive Detector), or the like. The displacement sensor 47 of this embodiment is configured as one unit that integrally has the light projecting unit 47a and the light receiving unit 47b.

[0022] The head control unit 41 controls the guide light source 44, the focus adjustment unit 45, the scanning unit 46, and the displacement sensor 47. The head control unit 41 transmits the monitoring results of the monitor unit 43 to the main control unit 21 of the controller unit 11. The head control unit 41 transmits the measurement results of the displacement sensor 47 and the amount of received light to the main control unit 21 of the controller unit 11.

[0023] [Controller unit] 2, the controller unit 11 has a main control unit 21, a storage unit 22, a power supply circuit 23, and a fan 24. The power supply circuit 23 supplies driving power to the controller unit 11, the light source unit 12, and the head unit 13. The power supply circuit 23 may also supply driving power to the console 14.

[0024] The memory unit 22 stores various types of information. The memory unit 22 stores, for example, identification information of units (light source unit 12, head unit 13) connected to the controller unit 11. The memory unit 22 stores processing data for processing the workpiece W. The processing data is, for example, information on processing patterns such as characters and figures to be printed on the processing surface Wa of the workpiece W. The memory unit 22 stores reference mark data. The reference mark data is information on reference marks for position adjustment that are projected onto the processing surface Wa of the workpiece W. The reference marks are used to adjust the distance (work distance) between the workpiece W and the head unit 13.

[0025] The memory unit 22 stores information on the workpiece W. The information on the workpiece W is information on the type of the workpiece W, and includes the material, color, surface condition, and reflection state (specular reflection, diffuse reflection, reflection amount) of the workpiece W. The memory unit 22 stores various types of distance information. The various types of distance information include a working distance, a focal position, a reference distance, and the like.

[0026] Furthermore, the storage unit 22 stores the measurement results obtained by the displacement sensor 47. The storage unit 22 also stores a first setting value, a second setting value, and a value The first and second set values ​​are set as the lower and upper limits of the range of the amount of light suitable for measuring the distance in the displacement sensor 47. Less than If the amount of light received is less than the second set value, More than In this case, an error may occur in the incident position of the reflected light KR obtained by the light receiving portion 47b of the displacement sensor 47, i.e., in the measurement result. For this reason, when the amount of light received by the displacement sensor 47 is equal to or greater than the first set value and equal to or less than the second set value, the measurement result of the displacement sensor 47 is considered valid. This makes it possible to adjust the position with high accuracy.

[0027] The main control unit 21 is configured to be able to communicate with the light source control unit 31 of the light source unit 12 and the head control unit 41 of the head unit 13 via the first signal cable SL1 and the second signal cable SL2. The main control unit 21 transmits control data to the light source control unit 31 and the head control unit 41 based on the processing data and the like. For example, the main control unit 21 generates control data including a plurality of scanning position data (coordinate data) corresponding to processing positions on the workpiece W and on-off data based on the processing data. The main control unit 21 transmits the control data to the light source control unit 31 and the head control unit 41.

[0028] The light source control unit 31 controls the laser light source 33 based on the control data. For example, the light source control unit 31 controls the laser light emitted from the laser light source 33. LW Controls the amount of light (optical power). The head control unit 41 controls the scanning unit 46 so as to process the workpiece W with the laser light LW based on the control data. data Based on the above, the head control unit 41 controls the guide light source 44 to emit a guide light LG from the guide light source 44. The head control unit 41 also controls the scanning unit 46 to project a processing pattern and a reference mark onto the workpiece W by the guide light LG. The processing pattern is a shape such as a character, a symbol, or a figure to be formed on the workpiece W. The reference mark is a figure for adjusting the distance between the head unit 13 and the workpiece W.

[0029] [console] The console 14 has a display unit 51 and an operation unit 52. The display unit 51 is configured to be capable of displaying various information of the laser processing apparatus 10. The operation unit 52 is configured to allow a user to input data. The console 14 is configured by a general-purpose terminal such as a tablet terminal, a notebook computer, a PDA (Personal Digital Assistant), or a smartphone, and dedicated application software installed therein.

[0030] The console 14 instructs the controller unit 11 to perform various controls and operation modes in response to the operation of the operation unit 52. The control to be instructed includes, for example, starting processing and stopping processing. The operation modes include a processing mode, a teaching mode, and a position adjustment mode. The processing mode is a mode in which a processing pattern is formed on the workpiece W by the laser light LW. The teaching mode is a mode in which a processing pattern is projected onto the workpiece W by the guide light LG. The position adjustment mode is a mode in which the position of the workpiece W is adjusted. The position of the workpiece W is the position of the workpiece W relative to the laser processing device 10 (head unit 13), and can be said to be the relative position between the laser processing device 10 (head unit 13) and the workpiece W. The position adjustment mode includes a first adjustment mode and a second adjustment mode. The first adjustment mode is a mode in which the position of the workpiece W is adjusted by the guide light LG and the detection light LK. The second adjustment mode is a mode in which the position of the workpiece W is adjusted based on the measurement result of the displacement sensor 47. The console 14 displays characters and the like for selecting these operation modes. Then, the console 14 instructs the main control section 21 of the controller unit 11 on the operation mode selected by operating the operation section 52. The console 14 functions as a mode selection section for selecting an operation mode and as a workpiece setting section.

[0031] The main control unit 21 of the controller unit 11 causes the monitor results of the monitor section 43 of the head unit 13, the measurement results of the displacement sensor 47, and the like to be displayed on the display section 51 of the console .

[0032] [Head unit configuration] 3 to 6 show an outline of the optical elements included in the head unit 13. In Figs. 3 to 6, the outer shape of the head unit 13 is shown by a two-dot chain line. In Figs. 3 to 6, the optical axis of the laser light LW etc. is shown by a one-dot chain line. In Figs. 5 and 6, the processing surface Wa of the workpiece W is shown by a solid line and Dashed line It is shown in.

[0033] As shown in Fig. 3, a head connector FLa of an optical fiber cable FL is attached to the head unit 13. The laser light LW transmitted through the optical fiber cable FL is emitted from the head connector FLa into the inside of the head unit 13. The laser light LW passes through a light combining member 49. The light combining member 49 is, for example, a dichroic mirror. The light combining member 49 is provided on the optical axis of the laser light LW and is arranged at a predetermined angle with respect to the optical axis. The light combining member 49 is formed so as to reflect a part of the laser light LW at its incident surface 49a.

[0034] A portion of the laser light LWa reflected by the light combining member 49 is incident on the monitor unit 43. The monitor unit 43 includes a light receiving element that receives the laser light LWa. The monitor unit 43 detects the amount of the received laser light LWa. This makes it possible to monitor the amount of the laser light LW.

[0035] A focus adjustment unit 45 and a scanning unit 46 are disposed downstream of the light combining member 49 . The focus adjustment unit 45 of this embodiment has three lenses 45a, 45b, and 45c. The lenses 45a to 45c are arranged on the optical axis of the laser light LW. The lens 45a is, for example, a concave lens, and the lenses 45b and 45c are, for example, convex lenses. The focus adjustment unit 45 has a support member that supports the lens 45a, and a drive unit that moves the support member along the optical axis of the laser light LW. The support member is, for example, a linear slider, etc. The drive unit is, for example, a stepping motor, etc. The laser light LW passing through the focus adjustment unit 45 is focused at a distance according to the positions of the lenses 45a to 45c. This makes it possible to adjust the focal length (focal position) of the laser light LW.

[0036] The scanning unit 46 has a pair of mirrors 46a, 46b and driving units 46c, 46d that drive the mirrors 46a, 46b, respectively. The driving units 46c, 46d are configured with, for example, stepping motors or the like. The mirrors 46a, 46b each reflect the laser light LW. The driving units 46c, 46d rotate the mirrors 46a, 46b. Due to the rotation of the mirrors 46a, 46b, the laser light LW reflected by the mirrors 46a, 46b is scanned along two axial directions perpendicular to each other with respect to the workpiece W.

[0037] The guide light source 44 is disposed so as to emit the guide light LG toward the exit surface 49b of the light combining member 49. The light combining member 49 is formed so as to reflect the guide light LG at its exit surface 49b. The guide light LG is reflected by the light combining member 49 so as to be coaxial with the laser light LW transmitted through the light combining member 49. That is, the light combining member 49 coaxially combines the laser light LW and the guide light LG. The guide light LG reflected by the light combining member 49 passes through the focus adjustment unit 45, is reflected by the scanning unit 46 in the same manner as the laser light LW, and is irradiated onto the workpiece W. Therefore, the main control unit 21 controls the scanning unit 46 based on the processing data in the same manner as when scanning the laser light LW. As a result, the main control unit 21 projects the processing pattern onto the processing surface Wa of the workpiece W by the guide light LG. The guide light LG has a wavelength in the visible region. Therefore, the processing pattern can be confirmed by the guide light LG.

[0038] Furthermore, the main control unit 21 controls the scanning unit 46 based on the reference mark data. As a result, the main control unit 21 projects the reference mark onto the processing surface Wa of the workpiece W by using the guide light LG.

[0039] As shown in Figs. 4 to 6, the displacement sensor 47 projects a detection light LK from a light projecting unit 47a. The detection light LK is inclined with respect to a vertical axis 48L of the protective glass 48. It can be said that the displacement sensor 47 is disposed so that the optical axis of the detection light LK projected from the light projecting unit 47a is inclined with respect to the vertical axis 48L of the protective glass 48. The vertical axis 48L of the protective glass 48 is equal to the optical axis of the laser light LW reflected by the scanning unit 46 when it is vertically emitted from the emission surface 48a of the protective glass 48.

[0040] Moreover, the optical axis of the detection light LK intersects with the vertical axis 48L of the protective glass 48 at a predetermined distance. It can be said that the displacement sensor 47 is disposed so that the optical axis of the detection light LK intersects with the vertical axis 48L of the protective glass 48 at a predetermined distance. The predetermined distance at which the optical axis of the detection light LK intersects with the vertical axis 48L is, for example, the distance from the exit surface 48a of the protective glass 48 to the point of intersection. This predetermined distance is defined as the reference distance.

[0041] As shown in FIG. 4, when the head unit 13 is viewed from the side of the emission surface 48a of the protective glass 48, the displacement sensor 47 is disposed on the tip side (left side in FIG. 4) of the head unit 13 with respect to the vertical axis 48L of the protective glass 48. The displacement sensor 47 is disposed so that the light projecting unit 47a and the light receiving unit 47b are located on one side (upper side in FIG. 4) of a plane LP (indicated by a dashed line) that includes the vertical axis 48L of the protective glass 48 and is parallel to the optical axis of the laser light LW incident on the scanning unit 46. Therefore, the optical axis of the detection light LK projected from the displacement sensor 47 is inclined with respect to the two axes that scan the laser light LW in the scanning unit 46. It can be said that the light projecting unit 47a and the light receiving unit 47b are disposed so that, in the plane including the vertical axis 48L of the protective glass 48, a plane perpendicular to the laser light LW emitted from the focus adjustment unit 45 and a plane including the detection light LK and the reflected light KR intersect at a predetermined angle. In Fig. 4, mirror 46a scans laser light LW in the left-right direction of the drawing. This scanning axis is defined as the X-axis. Similarly, mirror 46b scans laser light LW in the up-down direction of the drawing. This scanning axis is defined as the Y-axis. The above-mentioned vertical axis 48L is, for example, the intersection of the X-axis and Y-axis, and is the origin (center) of the XY coordinate system for scanning laser light LW.

[0042] [Focal length adjustment] As shown in Fig. 7A, the focus adjustment unit 45 has lenses 45a, 45b, and 45c. The lens 45a is a concave lens, and the lenses 45b and 45c are convex lenses. The lenses 45a and 45b expand the beam diameter of the incident laser light and output the laser light LW as a parallel light. The lens 45c focuses the laser light LW as a parallel light.

[0043] As shown in Fig. 7B, when the lens 45a is brought closer to the lens 45b, the laser light LW transmitted through the lens 45b spreads, that is, the beam diameter gradually increases. The focal position of the laser light LW collected by the lens 45c becomes farther from the lens 45c than the focal position shown in Fig. 7A. That is, the focal length of the laser light LW becomes longer.

[0044] As shown in Fig. 7C, when the lens 45a is moved away from the lens 45b, the laser light LW transmitted through the lens 45b is narrowed, that is, the beam diameter is gradually reduced. A 4. In other words, the focal length of the laser light LW becomes shorter.

[0045] 2 controls the position of lens 45a of focus adjustment unit 45. The movement of lens 45a changes the inter-lens distance between lenses 45a and 45b. In other words, head control unit 41 controls focus adjustment unit 45 to adjust the inter-lens distance.

[0046] 7A shows the state when the lens 45a is moved to a reference position. The reference position is the middle position of the movement range of the movement mechanism that moves the lens 45a. A plane that includes the focal position of the laser light LW at this time and is perpendicular to the optical axis is defined as a reference plane BP. The distance from the head unit 13 (the exit surface 48a of the protective glass 48) to the reference plane BP is defined as a reference focal length. The plane perpendicular to the optical axis is defined by the X axis (X coordinate value) and the Y axis (Y coordinate value) (two-dimensional coordinate value). And the direction along the optical axis is defined by the Z axis (Z coordinate value) (one-dimensional coordinate value).

[0047] 7B and 7C show the adjustment range of the focal position by moving the lens 45a. 7B shows a state where the lens 45a, which is in the reference position shown in FIG. 7A, is brought closest to the lens 45b within the movement range of the first lens 45a. The focal position of the laser light LW at this time is the farthest point position in the Z-axis direction, and the plane that includes the farthest point position and is perpendicular to the optical axis is the farthest point plane FP. Strictly speaking, the two-dimensional plane above The diagonal points of the rectangular processing area (printing area) in are the farthest points including the processing area, but here, aboveThe distance from the head unit 13 (the exit surface 48a of the protective glass 48) to the farthest point plane FP is defined as the farthest focal length.

[0048] 7C shows a state where the lens 45a in the reference position shown in FIG. 7A is moved to the farthest position from the lens 45b within the movement range of the first lens 45a. The focal position of the laser light LW at this time is defined as the closest position in the Z-axis direction, and the plane that includes the closest position and is perpendicular to the optical axis is defined as the closest point plane NP. The distance from the head unit 13 (the exit surface 48a of the protective glass 48) to the closest point plane NP is defined as the closest focal distance.

[0049] [Guide marks and guide points] 8 shows an example of a reference mark 60. The reference mark 60 includes a circle 61 having a predetermined radius, and two straight lines 62a, 62b that are perpendicular to each other at a center point 61a of the circle 61. The center point 61a of the circle 61 is set to the origin of an XY coordinate system for scanning the laser light LW by the scanning unit 46 shown in, for example, FIGS. 3 to 6. The color of the reference mark 60, that is, the color of the guide light LG, is, for example, green.

[0050] A guide point 70 is shown in Fig. 8. The guide point 70 is indicated on the processing surface Wa of the workpiece W by the detection light LK projected from the light projecting unit 47a of the displacement sensor 47. In Fig. 8, the guide point 70 is indicated as a circle. Note that Fig. 8 shows three guide points 70a, 70b, and 70c as examples of the guide point 70. The color of the guide points 70a to 70c, that is, the color of the detection light LK, is, for example, red.

[0051] As shown in FIGS. 4 to 6, the detection light LK intersects with the vertical axis at a predetermined distance (reference distance). This predetermined reference distance at which the light intersects is set to, for example, the distance of the reference plane BP shown in FIG. 7A. In this case, the detection light LK intersects with the vertical axis 48L at the reference plane BP. On this reference plane BP, as shown in FIG. 8, a reference mark 60 including a circle 61 centered on the vertical axis 48L is projected. Therefore, a guide point 70 by the detection light LK is located at the center of the reference mark 60. In other words, when the processing surface Wa of the workpiece W is located at the position of the reference plane BP, a guide point 70a (70) is projected at the center of the reference mark 60.

[0052] (action) Next, the operation of the laser processing apparatus 10 of this embodiment will be described. [Processing mode] The main control unit 21 starts a processing process on the workpiece W when a processing mode is selected on the console 14 and a processing start command is issued.

[0053] The main processing executes processing to irradiate the workpiece W with the laser light LW based on the processing data. The main control unit 21 generates control data. The control data includes a plurality of scanning position data (coordinate data) corresponding to processing positions on the workpiece W based on processing data related to characters to be printed, etc., and on / off data for the laser light LW. The main control unit 21 transmits the control data to the light source control unit 31 of the light source unit 12 and the head control unit 41 of the head unit 13.

[0054] The light source control unit 31 of the light source unit 12 controls the laser light source 33 based on the control data to emit the laser light LW. The head control unit 41 of the head unit 13 controls the focus adjustment unit 45 and the scanning unit 46 based on the control data to scan the laser light LW toward the workpiece W. In this way, the laser processing apparatus 10 processes the processing surface Wa of the workpiece W into a processing pattern.

[0055] [Teaching mode] The main control unit 21 starts a teaching process for the workpiece W when the teaching mode is selected on the console 14 and an instruction to start is given.

[0056] The main processing executes processing for irradiating the guide light LG onto the workpiece W based on the processing data. The main control unit 21 generates control data. The control data includes a plurality of scanning position data (coordinate data) corresponding to processing positions on the workpiece W based on processing data related to characters to be printed, etc., and on / off data for the guide light LG. The main control unit 21 transmits the control data to the head control unit 41 of the head unit 13.

[0057] The head control unit 41 of the head unit 13 controls the guide light source 44 based on the control data, and also controls the focus adjustment unit 45 and the scanning unit 46 to scan the guide light LG toward the workpiece W. As a result, the laser processing apparatus 10 projects a processing pattern onto the processing surface Wa of the workpiece W.

[0058] [Position adjustment mode: 1st adjustment mode] The main control unit 21 starts processing of the first adjustment mode on the workpiece W when the position adjustment mode: first adjustment mode is selected on the console 14 and an instruction to start is given.

[0059] The main processing unit executes a process of irradiating the guide light LG onto the workpiece W based on the reference mark data. The main control unit 21 generates control data. The control data includes a plurality of scanning position data (coordinate data) corresponding to processing positions on the workpiece W based on the reference mark data, and on / off data for the guide light LG. The control data also includes an instruction to emit the detection light LK from the light projecting unit 47a of the displacement sensor 47. The main control unit 21 transmits the control data to the head control unit 41 of the head unit 13.

[0060] The head control unit 41 of the head unit 13 controls the guide light source 44 based on the control data, and also controls the focus adjustment unit 45 and the scanning unit 46 to scan the guide light LG toward the workpiece W. As a result, the laser processing apparatus 10 projects a reference mark 60 onto the processing surface Wa of the workpiece W. Also, the head control unit 41 causes the light projecting unit 47a of the displacement sensor 47 to project the detection light LK based on the control data. As a result, the laser processing apparatus 10 projects a guide point 70 onto the processing surface Wa of the workpiece W.

[0061] As shown in Figs. 4 to 6, the detection light LK is inclined with respect to the vertical axis 48L of the protective glass 48. Therefore, when the processing surface Wa is located closer to the head unit 13 with respect to the reference plane BP, or when the processing surface Wa is located farther from the head unit 13, the guide point by the detection light LK 70 8 is shown. C When the machining surface Wa is at the closest point position shown in Fig. 8, a guide point 70c shown in Fig. 8 is indicated. By the guide points 70a to 70c projected in this manner, it can be easily determined whether or not the machining surface Wa is at the position of the reference surface BP.

[0062] [Position adjustment mode: 2nd adjustment mode] The main control unit 21 starts processing of the second adjustment mode on the workpiece W, when the position adjustment mode: second adjustment mode is selected on the console 14 and an instruction to start is given.

[0063] The main control unit 21 generates control data including an instruction to measure the distance using the displacement sensor 47. The main control unit 21 transmits the control data to the head control unit 41 of the head unit 13. The head control unit 41 measures the distance using the displacement sensor 47 based on the control data. The head control unit 41 transmits data including the measurement results of the displacement sensor 47 and the amount of received light to the main control unit 21. The main control unit 21 displays the measurement results of the displacement sensor 47 on the display unit 51 of the console 14 based on the data received from the head control unit 41.

[0064] The detection light LK is projected from the light projecting unit 47a of the displacement sensor 47 shown in FIG. 2. The displacement sensor 47 measures the distance based on the light receiving state of the light receiving unit 47b. The head control unit 41 shown in FIG. 2 transmits the measurement result of the displacement sensor 47 to the main control unit 21. The main control unit 21 displays the distance on the display unit 51 of the console 14 based on the received measurement result. For example, the main control unit 21 displays the measured distance on the display unit 51 of the console 14 based on the measurement result. The measured distance is shown as, for example, the distance from the head unit 13 (the exit surface 48a of the protective glass 48) to the processing surface Wa of the workpiece W. This measured distance allows the position of the workpiece W to be adjusted with higher accuracy.

[0065] The main control unit 21 causes the display unit 51 to display the workpiece distance stored in the memory unit 22. The workpiece distance is a distance at which the processing pattern is processed with a desired beam diameter on the processing surface Wa of the workpiece W. For example, the above-mentioned reference distance is set as the workpiece distance. The workpiece distance is set to be changeable by operating the console 14. The workpiece distance is stored in the memory unit 22. Processing with a desired beam diameter can be performed by shifting the focal position of the laser light LW in the height direction (optical axis direction) with respect to the processing surface Wa. For example, when processing a processing pattern with the laser light LW in the most narrowed state (focal position), the focal length of the laser light LW is equal to the workpiece distance. Then, by displaying the workpiece distance and the measured distance on the display unit 51, it is possible to easily determine whether the position of the workpiece W is aligned. Then, by moving the workpiece W so that the displayed measured distance matches the workpiece distance, adjustment can be performed more easily and with higher accuracy.

[0066] In the second adjustment mode, the main control unit 21 stops projection of the reference mark 60 by the guide light LG. This prevents the guide light LG reflected from the processing surface Wa of the workpiece W from entering the light receiving unit 47b. For example, the main control unit 21 transmits control data indicating a stop to the head control unit 41, and the head control unit 41 stops emission of the guide light LG by the guide light source 44. Note that, for example, a shutter may be provided between the light combining member 49 and the focus adjustment unit 45 shown in FIG. 3, and the guide light LG may be blocked by the shutter.

[0067] The main control unit 21 compares the amount of light received by the displacement sensor 47 included in the data received from the head control unit 41 with the first set value and the second set value stored in the storage unit 22. The main control unit 21 notifies a measurement error according to the comparison result. When the amount of light received is less than the first set value, the main control unit 21 displays a measurement error on the display unit 51 of the console 14. This allows the user to confirm that the amount of light received by the displacement sensor 47 is insufficient. Furthermore, when the amount of light received is greater than the second set value, the main control unit 21 displays a measurement error on the display unit 51 of the console 14. This allows the user to confirm that the amount of light received by the displacement sensor 47 is too great. This error display allows the user to confirm that the distance measurement by the displacement sensor 47 is unstable.

[0068] The main control unit 21 may disable the second adjustment mode, that is, may not execute the process in the second adjustment mode, depending on the information of the workpiece W stored in the storage unit 22. For example, the main control unit 21 enables the second adjustment mode in the case of the workpiece W for which diffuse reflection is set as the reflection state in the type of the workpiece W, and displays the measurement result by the displacement sensor 47 on the display unit 51 of the console 14. On the other hand, the main control unit 21 disables the second adjustment mode in the case of the workpiece W for which specular reflection is set as the reflection state in the type of the workpiece W.

[0069] 4, the light receiving portion 47b of the displacement sensor 47 is located on the same side as the light projecting portion 47a of the displacement sensor 47 with respect to a plane including the vertical axis 48L of the protective glass 48. Therefore, in the case of a workpiece W that specularly reflects the detection light LK, the reflected light KR from the workpiece W is unlikely to be incident on the light projecting portion 47a, making it difficult to measure the distance. For this reason, the main control portion 21 disables the second adjustment mode. In other words, the main control portion 21 determines whether the second adjustment mode is enabled or disabled based on the information (reflection state) of the workpiece W.

[0070] The main control unit 21 may make the determination based on other information. For example, the determination is based on the color of the workpiece W. For example, when the color of the workpiece W is black and the amount of light reflected by the detection light LK is small, the second adjustment mode is disabled. The main control unit 21 may cause the display unit 51 to display that the second adjustment mode has been disabled.

[0071] (effect) As described above, according to this embodiment, the following effects are achieved. (1) The laser processing apparatus 10 includes a laser light source 33 that emits a laser beam LW, a guide light source 44 that emits a guide beam LG having a wavelength in the visible region, and a scanning unit 46 that scans the laser beam LW and the guide beam LG. The laser processing apparatus 10 includes a protective glass 48 through which the laser beam LW and the guide beam LG transmit. The laser processing apparatus 10 also includes a displacement sensor 47 including a light projecting unit 47a and a light receiving unit 47b. The light projecting unit 47a projects a detection beam LK having a wavelength in the visible region onto the workpiece W. The displacement sensor 47 is disposed so that the detection beam LK intersects with a vertical axis 48L of the protective glass 48 at a predetermined reference distance. The light receiving unit 47b receives the detection beam LK (reflected beam KR) diffusely reflected by the workpiece W. The displacement sensor 47 measures the distance based on the light receiving state of the light receiving unit 47b. The main control unit 21 displays the distance on the display unit 51 of the console 14 based on the measurement result of the displacement sensor 47 .

[0072] For example, the main control unit 21 displays the measured distance on the display unit 51 of the console 14 based on the measurement result. The measured distance is shown, for example, as the distance from the head unit 13 (the exit surface 48a of the protective glass 48) to the processing surface Wa of the workpiece W. Based on this measured distance, the position of the workpiece W can be adjusted with higher accuracy.

[0073] (2) The main control unit 21 causes the display unit 51 to display the workpiece distance stored in the memory unit 22. The workpiece distance is the distance at which the processing pattern is processed with a desired beam diameter on the processing surface Wa of the workpiece W. The workpiece distance is set to, for example, the above-mentioned reference distance. The workpiece distance is also set so as to be changeable by operating the console 14. The workpiece distance is stored in the memory unit 22. By shifting the focal position of the laser light LW in the height direction (optical axis direction) with respect to the processing surface Wa, processing can be performed with a desired beam diameter.

[0074] (3) The main control unit 21 compares the amount of light received by the displacement sensor 47 included in the data received from the head control unit 41 with the first set value and the second set value stored in the memory unit 22. If the amount of light received is less than the first set value, the main control unit 21 displays an error on the display unit 51 of the console 14. This makes it possible to confirm that the amount of light received by the displacement sensor 47 is insufficient. Furthermore, if the amount of light received is greater than the second set value, the main control unit 21 displays an error on the display unit 51 of the console 14. This makes it possible to confirm that the amount of light received by the displacement sensor 47 is too great. This error display makes it possible to confirm that the distance measurement by the displacement sensor 47 is unstable.

[0075] (4) The memory unit 22 stores the measurement results obtained by the displacement sensor 47. The memory unit 22 also stores a first setting value and a second setting value for the amount of light received by the displacement sensor 47. value The first and second set values ​​are set as the lower and upper limits of the range of the amount of light suitable for measuring the distance in the displacement sensor 47. Less If the amount of light received is less than the second set value, MoreIn this case, an error may occur in the incident position of the reflected light KR obtained by the light receiving portion 47b of the displacement sensor 47, i.e., in the measurement result. For this reason, when the amount of light received by the displacement sensor 47 is equal to or greater than the first set value and equal to or less than the second set value, the measurement result of the displacement sensor 47 is considered valid. This makes it possible to adjust the position with high accuracy.

[0076] (5) A portion of the laser light LWa reflected by the light combining member 49 is incident on the monitor unit 43. The monitor unit 43 includes a light receiving element that receives the laser light LWa. The monitor unit 43 detects the amount of the received laser light LWa. This makes it possible to monitor the amount of the laser light LW.

[0077] (6) The guide light source 44 is disposed so as to emit the guide light LG toward the exit surface 49b of the light combining member 49. The light combining member 49 is formed so as to reflect the guide light LG at its exit surface 49b. The guide light LG is reflected by the light combining member 49 so as to be coaxial with the laser light LW transmitted through the light combining member 49. The guide light LG reflected by the light combining member 49 passes through the focus adjustment unit 45, is reflected by the scanning unit 46 in the same manner as the laser light LW, and is irradiated onto the workpiece W. Therefore, the main control unit 21 controls the scanning unit 46 based on the processing data in the same manner as when scanning the laser light LW. As a result, the main control unit 21 projects the processing pattern onto the processing surface of the workpiece W by the guide light LG. The guide light LG has a wavelength in the visible region. Therefore, the processing pattern can be confirmed by the guide light LG.

[0078] (7) The detection light LK is inclined with respect to the vertical axis 48L of the protective glass 48. Therefore, when the processing surface Wa is located closer to the head unit 13 with respect to the above-mentioned reference plane BP, or when it is located farther from the head unit 13, the guide point by the detection light LK is shifted from the center of the reference mark 60. For example, when the processing surface Wa is at the farthest point position shown in FIG. 7B, the guide point 70b shown in FIG. 8 is indicated. Also, for example, when the processing surface Wa is at the farthest point position shown in FIG. 7 CWhen the machining surface Wa is at the closest point position shown in Fig. 8, a guide point 70c shown in Fig. 8 is indicated. By the guide points 70a to 70c projected in this manner, it can be easily determined whether or not the machining surface Wa is at the position of the reference surface BP.

[0079] [Example of change] The description of the embodiment is an example of a form that the laser processing apparatus according to the present disclosure can take, and is not intended to limit the form. In addition to the embodiment, the present disclosure can take a form in which, for example, the embodiment shown below is modified, or at least two modified examples that are not mutually contradictory are combined.

[0080] The main control unit 21 may display the difference between the workpiece distance and the measured distance as a relative distance on the display unit 51. The display unit 51 displays the difference as a relative distance based on the measurement result with the workpiece distance as the reference. This allows adjustment to be made more easily and with higher accuracy by moving the workpiece W so that the displayed value becomes "0". Also, in the case of the difference between the workpiece distance and the measured distance, a plus or minus sign is displayed on the display unit 51 together with the numerical value. Therefore, the plus or minus sign can easily indicate the direction in which the workpiece W should be moved.

[0081] The laser processing device may have a different unit configuration. FIG. 9 shows a laser processing apparatus 110 configured by connecting two units. This laser processing apparatus 110 has the above-mentioned controller unit 111, head unit 112, and console 114. The head unit 112 is connected to the controller unit 111 by the second electric cable 82. The controller unit 111 has the same configuration as the controller unit 11 of the above-mentioned laser processing apparatus 10. That is, the controller unit 111 has a main control unit 21, a storage unit 22, a power supply circuit 23, and a fan 24, similar to the above-mentioned controller unit 11. The head unit 112 has a head control unit 121, a storage unit 122, a laser light source 33, a fan 34, a monitor unit 43, a guide light source 44, a focus adjustment unit 45, a scanning unit 46, a displacement sensor 47, and a protective glass 48. The laser light source 33 and the fan 34 are configured in the same manner as the components of the light source unit 12 shown in FIG. 2. The monitor section 43, the guide light source 44, the focus adjustment section 45, the scanning section 46, the displacement sensor 47, and the protective glass 48 are configured in the same manner as the components of the head unit 13 shown in FIG. 2. The head control section 121 has the functions of the light source control section 31 and the head control section 41 shown in FIG. 2. The memory section 122 stores information stored in the memory sections 32 and 42 shown in FIG. 2. The console 114 has the same configuration as the console 14 of the laser processing apparatus 10 described above. That is, the console 114 has a display section 51 and an operation section 52, like the console 14 described above. The laser processing apparatus 10 configured in this manner can also obtain the same effects as the above embodiment.

[0082] In the above embodiment, the displacement sensor 47 has the light projecting portion 47a and the light receiving portion 47b integrally formed therewith. However, a displacement sensor in which the light projecting portion 47a and the light receiving portion 47b are provided separately may be used.

[0083] The laser processing device may be provided with at least one of the display unit 51 and the operation unit 52 in the controller unit. The displacement sensor 47 may be configured such that a filter that blocks the wavelength range of the guide light LG is attached to the light receiving portion 47b. In this case, the displacement sensor 47 can measure the distance in a state where the reference mark 60 is projected by the guide light LG.

[0084] The head unit 13 may be configured to include a convergent lens, an fθ lens, and the like. The first set value and the second set value may be stored in the memory section 42 of the head unit 13. The head control section 41 compares the amount of light received by the light receiving section 47b of the displacement sensor 47 with the first set value and the second set value to determine whether or not an error has occurred. Then, the head control section 41 transmits information indicating whether or not an error has occurred to the main control section 21. This allows the state of the amount of light received by the displacement sensor 47 to be displayed on the console 14. Note that the head control section 41 may transmit the information indicating whether or not an error has occurred and the amount of light received to the main control section 21.

[0085] The light combining member 49 may be a half mirror, a beam splitter, or the like. In the above embodiment, the light combining member 49 is formed to transmit the laser light LW and reflect the guide light LG, but a light combining member configured to reflect the laser light LW and transmit the guide light LG may be used.

[0086] In the above embodiment, a portion of the laser light LW is reflected by the light combining member 49 and made to enter the monitor unit 43. However, a configuration in which a portion of the laser light LW is reflected by a separate reflecting member and made to enter the monitor unit 43 may also be used.

[0087] In the above embodiment, the displacement sensor 47 is positioned so that the detection light LK passes through the protective glass 48 serving as an exit window. However, an exit window may be provided separately from the protective glass 48, and the displacement sensor 47 may be positioned so that the detection light LK passes through that exit window.

[0088] In the above embodiment, the direction in which the light projecting portion 47a and the light receiving portion 47b of the displacement sensor 47 are arranged may be changed as appropriate. As a first example of the direction, the displacement sensor 47 may be disposed so that the light projecting portion 47a and the light receiving portion 47b are aligned parallel to the plane LP shown in FIG.

[0089] As a second example of the direction, the displacement sensor 47 may be disposed so that the light-projecting unit 47a and the light-receiving unit 47b are equidistant from the vertical axis 48L of the protective glass 48 when viewed from the side of the emission surface 48a of the protective glass 48. In this case, the displacement sensor 47 may be disposed so that the light-projecting unit 47a and the light-receiving unit 47b are aligned along the circumferential direction of a circle centered on the vertical axis 48L. The displacement sensor 47 may also be disposed so that the angle between the detection light LK emitted from the light-projecting unit 47a and the vertical axis 48L is equal to the angle between the reflected light KR incident on the light-receiving unit 47b by the detection light LK and the vertical axis 48L.

[0090] The above description is merely illustrative. Those skilled in the art can recognize that many more possible combinations and permutations are possible other than the components and methods (manufacturing processes) listed for the purpose of describing the technology of the present disclosure. The present disclosure is intended to embrace all alternatives, modifications, and alterations that fall within the scope of the present disclosure, including the scope of the claims. [Appendix 1] A laser processing apparatus for processing an object to be processed by laser light, a laser light source that emits the laser light; A guide light source that emits guide light having a wavelength in the visible region; a light combining member that combines the laser light and the guide light; an exit window through which the laser light and the guide light pass; A scanning unit that scans the laser light and the guide light; a light-projecting unit that projects detection light having a wavelength in the visible range onto the workpiece, and a light-receiving unit that receives light that is diffusely reflected from the detection light by the workpiece, the light-projecting unit being disposed so that an optical axis of the detection light intersects with a vertical axis of the exit window at a predetermined reference distance from the exit window, and the displacement sensor that measures a distance based on a light-receiving state of the light-receiving unit; a mode selection unit that selects a processing mode in which the object is processed by the laser light or a position adjustment mode that adjusts a position of the object; a control unit that controls the scanning unit so as to process the object with the laser light in the processing mode, and controls the scanning unit so as to project a reference mark for position adjustment onto the object with the guide light in the position adjustment mode; the position adjustment mode includes a first adjustment mode and a second adjustment mode; The control unit, in the first adjustment mode, projects the reference mark onto the workpiece and projects the detection light toward the workpiece, and in the second adjustment mode, projects at least the detection light toward the workpiece to measure the distance to the workpiece and displays the measurement result on a display unit. Laser processing equipment. [Appendix 2] The laser processing apparatus of claim 1, wherein, when viewed from the side of the emission surface from which the laser light is emitted in the emission window portion, the light-projecting unit and the light-receiving unit are arranged side by side in a direction intersecting with the optical axis of the laser light toward the scanning unit. [Appendix 3] 3. The laser processing apparatus according to claim 1, wherein, when viewed from the side of the emission surface from which the laser light is emitted in the emission window portion, the light receiving unit is arranged on the same side as the light projecting unit with respect to the optical axis of the laser light traveling toward the scanning unit. [Appendix 4] 4. The laser processing apparatus according to claim 2, wherein the light-projecting unit and the light-receiving unit are arranged side by side in a direction perpendicular to an optical axis of the laser light directed toward the scanning unit. [Appendix 5] 4. The laser processing apparatus according to claim 2, wherein the light-projecting unit and the light-receiving unit are arranged side by side in a circumferential direction of a circle centered on the vertical axis. [Appendix 6] 6. The laser processing apparatus according to claim 1, wherein in the position adjustment mode, a work distance to the workpiece is set to be changeable. [Appendix 7] The laser processing apparatus of claim 6, wherein the control unit causes the display unit to display the measured distance as a measurement result. [Appendix 8] 8. The laser processing apparatus according to claim 7, wherein the control unit causes the display unit to display the workpiece distance. [Appendix 9] The laser processing apparatus according to any one of appendix 6 to appendix 8, wherein the control unit determines a difference between the measured distance of the measurement result and the workpiece distance as a relative distance, and displays the relative distance on the display unit. [Appendix 10] 10. The laser processing apparatus according to any one of claims 1 to 9, wherein the control unit notifies a measurement error when the amount of light received by the displacement sensor is smaller than a first set value. [Appendix 11] a processing object setting unit for setting information of the processing object, the information on the object includes information on reflection of the detection light on a surface of the object, the control unit disables measurement of the distance by the displacement sensor when the information that the detection light is specularly reflected is set. 11. The laser processing apparatus according to claim 1. [Appendix 12] a focal length adjustment unit for changing a focal length of the laser light, The control unit controls the focus adjustment unit to adjust the focal length of the laser light in the processing mode to a measurement distance of a measurement result in the second adjustment mode of the position adjustment mode. 12. The laser processing apparatus according to claim 1. [Appendix 13] 13. The laser processing apparatus according to claim 12, wherein the reference distance is a reference focal length adjusted by the focus adjustment unit. [Appendix 14] The laser processing apparatus of claim 13, wherein the reference focal length is an intermediate distance between an farthest focal length farthest from the exit window and a nearest focal length closest to the exit window, among focal lengths adjustable by the focus adjustment unit. [Appendix 15] 15. The laser processing apparatus according to claim 1, wherein the displacement sensor is arranged so that the detection light passes through the exit window portion. [Appendix 16] 16. The laser processing apparatus according to any one of claims 1 to 15, wherein, in the second adjustment mode, the control unit controls the displacement sensor to perform measurement without irradiating the guide light to the workpiece. [Explanation of symbols]

[0091] 10 Laser processing equipment 11 Controller unit 12 Light source unit 13 Head Unit 14 Console 21 Main control unit 22 Memory section 23 Power circuit 24 Fans 31 Light source control unit 32 Storage section 33 Laser light source 34 Fans 41 Head control unit 42 Storage section 43 Monitor section 44 Guide Light Source 45 Focus adjustment section 45a~45c Lens 46 Scanning unit 46a, 46b Mirror 46c, 46d Drive unit 47 Displacement Sensor 47a Light projector 47b Light receiving part 48 Protective Glass 48a Output surface 48L Vertical axis 49 Optical coupling components 49a Entrance plane 49b Exit surface 51 Display section 52 Operation section 60 Reference Mark 61 yen 61a Center point 62a,62b straight line 70,70a~70c Guide points 81 First Electric Cable 82 Second Electric Cable 83 Third Electric Cable 110 Laser processing equipment 111 Controller unit 112 Head Unit 114 Console 121 Head control section 122 Storage section BP reference plane FL Fiber Optic Cable FLa head connector FP farthest point plane KR reflected light LG Guide Light LK Detection light LP plane LW laser light LWa laser light NP nearest point plane SL1 1st signal cable SL2 2nd signal cable SP1 1st power cable SP2 2nd power cable W Processing object Wa Processed surface

Claims

1. A laser processing apparatus for processing an object to be processed by laser light, a laser light source that emits the laser light; A guide light source that emits guide light having a wavelength in the visible region; a light combining member that combines the laser light and the guide light; an exit window through which the laser light and the guide light pass; A scanning unit that scans the laser light and the guide light; a light-projecting unit that projects detection light having a wavelength in the visible range onto the workpiece, and a light-receiving unit that receives light that is diffusely reflected from the detection light by the workpiece, the light-projecting unit being disposed so that an optical axis of the detection light intersects with a vertical axis of the exit window at a predetermined reference distance from the exit window, and the displacement sensor that measures a distance to the workpiece based on a light-receiving state of the light-receiving unit; a mode selection unit that selects a processing mode in which the object is processed by the laser light or a position adjustment mode that adjusts a position of the object; a control unit that controls the scanning unit so as to process the object with the laser light in the processing mode, and controls the scanning unit so as to project a reference mark for position adjustment onto the object with the guide light in the position adjustment mode; the position adjustment mode includes a first adjustment mode and a second adjustment mode, The control unit, in the first adjustment mode, projects the reference mark onto the workpiece and projects the detection light toward the workpiece, and in the second adjustment mode, projects at least the detection light toward the workpiece to measure the distance to the workpiece and displays the measurement result on a display unit. Laser processing equipment.

2. The laser processing apparatus according to claim 1, wherein when viewed from the side of the emission surface from which the laser light is emitted in the emission window portion, the light-projecting portion and the light-receiving portion are arranged side by side in a direction intersecting the optical axis of the laser light directed toward the scanning portion.

3. 2. The laser processing apparatus according to claim 1, wherein when viewed from the side of the emission surface from which the laser light is emitted in the emission window portion, the light receiving portion is arranged on the same side as the light projecting portion with respect to the optical axis of the laser light traveling toward the scanning portion.

4. The laser processing device according to claim 2 , wherein the light projecting section and the light receiving section are arranged side by side in a direction perpendicular to an optical axis of the laser light directed toward the scanning section.

5. The laser processing device according to claim 2 , wherein the light projecting section and the light receiving section are arranged side by side in a circumferential direction of a circle centered on the vertical axis.

6. 2. The laser processing apparatus according to claim 1, wherein in the position adjustment mode, a workpiece distance to the workpiece is set to be changeable.

7. The laser processing device according to claim 6 , wherein the control unit causes the display unit to display a measured distance as a result of the measurement.

8. The laser processing device according to claim 7 , wherein the control unit causes the display unit to display the workpiece distance.

9. The laser processing device according to claim 6 , wherein the control unit determines a difference between the measurement distance of the measurement result and the workpiece distance as a relative distance, and causes the display unit to display the relative distance.

10. The laser processing device according to claim 1 , wherein the control unit notifies a measurement error when the amount of light received by the displacement sensor is smaller than a first set value.

11. a processing object setting unit for setting information of the processing object, the information on the object includes information on reflection of the detection light on a surface of the object, the control unit disables measurement of the distance by the displacement sensor when the information that the detection light is specularly reflected is set. The laser processing apparatus according to any one of claims 1 to 9.

12. a focal length adjustment unit for changing a focal length of the laser light, The control unit controls the focus adjustment unit to adjust the focal length of the laser light in the processing mode to a measurement distance of a measurement result in the second adjustment mode of the position adjustment mode. The laser processing apparatus according to any one of claims 1 to 9.

13. The laser processing apparatus according to claim 12 , wherein the reference distance is a reference focal length adjusted by the focus adjustment unit.

14. 14. The laser processing apparatus according to claim 13, wherein the reference focal length is an intermediate distance between an farthest focal length farthest from the exit window and a nearest focal length closest to the exit window, among focal lengths adjustable by the focus adjustment unit.

15. The laser processing device according to claim 1 , wherein the displacement sensor is disposed so that the detection light passes through the exit window portion.

16. 10. The laser processing apparatus according to claim 1, wherein in the second adjustment mode, the control unit controls the displacement sensor to perform measurement in a state in which the guide light is not irradiated onto the workpiece.

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