Solid imaging device, shape measurement device, and shape measurement method

Abstract

To provide a solid state imaging device capable of evaluating and adjusting an optical setting state when being used for shape measurement by a light cut method.SOLUTION: A solid state imaging device 5A includes a first light-receiving unit 10 and second light-receiving units 20A and 20B. The first light-receiving unit 10 has a plurality of pixel pairs 11 arranged in an x direction. The second light-receiving units 20A and 20B each have a plurality of pixels 21 generating electric charges of the amount corresponding to each light-receiving amount arranged in a y direction. Each pixel pair 11 includes a first pixel 12 and a second pixel 13. When linear light extending in the x direction is incident to the first light-receiving unit 10, as the light incident position goes from one side to the other side in the y direction, the amount of electric charges generated by the first pixel 12 is gradually decreasing, and the amount of electric charges generated by the second pixel 13 is gradually increasing.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a solid-state imaging device, a shape measurement device, and a shape measurement method.

Background Art

[0002] Patent Documents 1 and 2 disclose an invention of a solid-state imaging device including a light-receiving unit in which a first pixel and a second pixel are alternately arranged along a first direction. In one configuration example of this solid-state imaging device, the width of the first pixel in the first direction gradually decreases from one side to the other side in a second direction intersecting the first direction, and the width of the second pixel in the first direction gradually increases. Further, these documents describe that the shape of an object can be measured by the optical sectioning method using this solid-state imaging device.

[0003] In shape measurement by the optical sectioning method, a solid-state imaging device (area sensor) including a light-receiving unit in which a plurality of pixels are two-dimensionally arranged can also be used. In this case, since the number of pixels is large, it takes a long time to read out a signal corresponding to the amount of received light for each pixel. On the other hand, in shape measurement by the optical sectioning method, if the solid-state imaging device described in Patent Documents 1 and 2 is used, since the number of pixels is smaller than that of an area sensor, the time required to read out a signal from each pixel can be shortened, and high-speed and high-resolution shape measurement is possible.

[0004] The solid-state imaging devices described in Patent Documents 1 and 2 are the same as linear sensors in that a plurality of pixels (a first pixel and a second pixel) are arranged in a one-dimensional manner in the light-receiving section. Therefore, compared with the case of using an area sensor, the time required to read out signals from each pixel can be shortened. Further, in the solid-state imaging devices described in Patent Documents 1 and 2, since each of the first pixel and the second pixel has a characteristic structure in the light-receiving section, the light incident position in the second direction intersecting the first direction can be obtained by calculation at each position in the first direction in which these pixels are arranged. That is, the solid-state imaging devices described in Patent Documents 1 and 2 can be used in place of an area sensor in shape measurement by the light-section method, and it is possible to increase the speed and resolution of shape measurement compared with the case of using an area sensor.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] In the process of researching and developing a shape measurement technique by the light-section method using the solid-state imaging devices described in Patent Documents 1 and 2, the present inventors have found that these solid-state imaging devices have the following problems. That is, although the solid-state imaging devices described in Patent Documents 1 and 2 can obtain the light incident position in the second direction intersecting the first direction by calculation in the light-receiving section, since they cannot detect the two-dimensional intensity distribution of incident light in the light-receiving section, it is impossible to determine whether the optical setting state is appropriate.

[0007] For example, it is desirable that the light irradiated onto the object by the light irradiation unit is in the form of a narrow line extending in a predetermined direction. It is desirable that the light irradiation region on the object and the light receiving unit of the solid-state imaging device have an optically conjugate positional relationship with each other by the imaging optical system provided between the object and the solid-state imaging device. Further, when the object is flat in shape measurement by the light cutting method, it is desirable that the reflected light incident on the light receiving unit of the solid-state imaging device from the object via the imaging optical system is in the form of a line parallel to the first direction at the light receiving unit. To achieve these, it is necessary that the optical setting state is appropriate.

[0008] However, although the evaluation of the optical setting state is possible when using an area sensor capable of detecting the two-dimensional intensity distribution of the incident light at the light receiving unit, it is difficult when using the solid-state imaging devices described in Patent Documents 1 and 2. When measuring the shape of the object by the light cutting method when the optical setting state is not appropriate, the accuracy of the output signal from the solid-state imaging device deteriorates, and the accuracy of the shape measurement may also deteriorate. Further, since it is difficult to evaluate the optical setting state, it is also difficult to adjust and optimize the optical setting state.

[0009] The present invention has been made to solve the above problems, and an object thereof is to provide a solid-state imaging device capable of evaluating and adjusting the optical setting state when used for shape measurement by the light cutting method. Another object of the present invention is to provide an apparatus and a method capable of measuring the shape of an object at high speed and high resolution by the light cutting method using the above-described solid-state imaging device.

Means for Solving the Problems

[0010] The solid-state imaging device of the present invention includes a first light-receiving unit in which a plurality of pixel pairs are arranged along a first direction, and a second light-receiving unit in which a plurality of pixels that generate an amount of charge corresponding to the amount of received light are arranged along a second direction intersecting the first direction. Each of the plurality of pixel pairs in the first light-receiving unit includes a first pixel and a second pixel arranged side by side along the first direction. When line-shaped light extending in the first direction is incident on the first light-receiving unit, as the light incident position moves from one side to the other side in the second direction, the amount of charge generated by the first pixel gradually decreases, and the amount of charge generated by the second pixel gradually increases.

[0011] In one aspect of the present invention, it is preferable that the second light-receiving unit is provided on one side of the first light-receiving unit in the first direction. It is also preferable that the second light-receiving unit is provided on both sides of the first light-receiving unit in the first direction. Further, the first light-receiving unit may be divided into a first region on one side and a second region on the other side in the first direction. In this case, it is also preferable that the second light-receiving unit is provided between the first region and the second region.

[0012] In one aspect of the present invention, it is preferable that, as going from one side to the other side in the second direction, the width of the first pixel in the first direction gradually becomes narrower, and the width of the second pixel in the first direction gradually becomes wider. Each of the plurality of pixel pairs in the first light-receiving unit includes a first filter provided to cover the first pixel and a second filter provided to cover the second pixel. It is also preferable that, as going from one side to the other side in the second direction, the light transmittance of the first filter gradually becomes smaller, and the light transmittance of the second filter gradually becomes larger. Further, each of the plurality of pixel pairs in the first light-receiving unit includes a first light-shielding film provided to cover a part of the first pixel and a second light-shielding film provided to cover a part of the second pixel. It is also preferable that, as going from one side to the other side in the second direction, the width of the portion of the first pixel not covered by the first light-shielding film in the first direction gradually becomes narrower, and the width of the portion of the second pixel not covered by the second light-shielding film in the first direction gradually becomes wider.

[0013] In one aspect of the present invention, it is preferable that the solid-state imaging device further includes a signal processing unit that outputs a first electrical signal of a data series corresponding to the amount of charge generated in each of the first pixels and the second pixels of a plurality of pixel pairs in the first light-receiving unit, and outputs a second electrical signal of a data series corresponding to the amount of charge generated in each of the plurality of pixels in the second light-receiving unit. The solid-state imaging device preferably further includes an arithmetic unit that obtains the light incident position in the second direction at each position in the first direction in the first light-receiving unit based on the first electrical signal, and obtains the light incident intensity distribution in the second direction in the second light-receiving unit based on the second electrical signal. Further, the solid-state imaging device preferably further includes a storage unit that stores a correction formula for correcting the light incident position in the second direction obtained based on the first electrical signal, and when the arithmetic unit obtains the light incident position in the second direction at each position in the first direction in the first light-receiving unit based on the first electrical signal, it is also preferable that the arithmetic unit performs correction based on the correction formula stored in the storage unit.

[0014] The shape measurement device of the present invention is a device that measures the shape of an object by the light section method, and includes a light irradiation unit that irradiates light at each position on a predetermined line on the object, an imaging optical system that inputs and images the reflected light generated by irradiating the object with the light from the light irradiation unit, and the above-described solid-state imaging device of the present invention that receives the reflected light that has passed through the imaging optical system. The arithmetic unit of the solid-state imaging device obtains the light incident position in the second direction at each position in the first direction in the first light-receiving unit based on the first electrical signal output from the signal processing unit of the solid-state imaging device, measures the shape of the object, and obtains the light incident intensity distribution in the second direction in the second light-receiving unit based on the second electrical signal output from the signal processing unit of the solid-state imaging device, and evaluates the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device. It is preferable that the shape measurement device further includes an adjustment unit that adjusts the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device based on the result of the evaluation by the arithmetic unit.

[0015] The shape measurement method of the present invention is a method for measuring the shape of an object by the optical sectioning method using a light irradiation unit that irradiates light at each position on a predetermined line with respect to the object, an imaging optical system that inputs and forms an image of the reflected light generated by irradiating the object with the light from the light irradiation unit, and the above-described solid-state imaging device of the present invention that receives the reflected light that has passed through the imaging optical system. The shape measurement method includes a measurement step of obtaining the light incident positions in the second direction at each position in the first direction in the first light receiving unit based on the first electrical signal output from the signal processing unit of the solid-state imaging device and measuring the shape of the object, and an evaluation step of obtaining the light incident intensity distribution in the second direction in the second light receiving unit based on the second electrical signal output from the signal processing unit of the solid-state imaging device and evaluating the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device. The shape measurement method preferably further includes an adjustment step of adjusting the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device based on the result of the evaluation in the evaluation step.

[0016] The correction method of the present invention corrects the light incident position in the second direction obtained based on the first electrical signal based on the comparison of the light incident positions in the second direction obtained based on the first electrical signal and the second electrical signal output from the signal processing unit of the solid-state imaging device, respectively, by making light incident on each position in the second direction at each position on a predetermined line extending in the first direction with respect to the solid-state imaging device of the present invention.

Advantages of the Invention

[0017] According to the present invention, it is possible to provide a solid-state imaging device capable of evaluating and adjusting the optical setting state when used for shape measurement by the optical sectioning method.

Brief Description of the Drawings

[0018]

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[0019] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are given to the same elements, and redundant descriptions are omitted. The present invention is not limited to these examples, but is shown by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0020] FIG. 1 is a diagram showing the configuration of the shape measuring device 1. The shape measuring device 1 measures the surface shape of the object 2 by the optical sectioning method, and includes an optical irradiation unit 3, an imaging optical system 4, a solid-state imaging device 5, and an adjustment unit 6. The imaging optical system 4 and the solid-state imaging device 5 constitute an imaging camera that images the surface of the object 2.

[0021] The object 2 is placed on the placement surface S of the moving stage that moves in the direction D1, and moves in the direction D1 as the moving stage moves. This moving speed is, for example, 1 m / s. The placement surface S is a plane parallel to both the direction D1 and the direction D2. The direction D2 intersects (for example, is orthogonal to) the direction D1. The object 2 has a rectangular parallelepiped appearance with the direction D1 as the longitudinal direction in this figure, but is not limited thereto.

[0022] The light irradiation unit 3 irradiates light at each position on a predetermined line with respect to the surface 2a of the object 2. The light irradiation unit 3 includes a light source and an irradiation optical system. The light irradiation unit 3 preferably outputs laser light. The light irradiation unit 3 is disposed at a position facing the surface 2a of the object 2 in a direction D3 that intersects (for example, is orthogonal to) both the direction D1 and the direction D2. The light irradiation unit 3 may irradiate line-shaped light extending along the direction D2. In this case, for example, it includes a light source that outputs the light L1, and a cylindrical lens as an irradiation optical system that condenses and irradiates the light L1 output from the light source onto a line-shaped region ML. The light L1 travels along the direction D3, passes through the cylindrical lens, and is then simultaneously irradiated onto each position on the line-shaped region ML of the surface 2a of the object 2 in a state of spreading in the direction D2. Further, the light irradiation unit 3 may scan the spot light along the line-shaped region ML. In this case, for example, it includes a light source that outputs light, and a scanning means for scanning the light output from the light source along the line-shaped region ML.

[0023] The imaging optical system 4 inputs and images the reflected light L2 generated by the irradiation of the light L1 from the light irradiation unit 3 onto the object 2. The solid-state imaging device 5 receives the reflected light L2 that has passed through the imaging optical system 4. The imaging optical system 4 and the solid-state imaging device 5 constitute an imaging camera that inputs the reflected light L2 generated by the irradiation of the light L1 from the light irradiation unit 3 onto the object 2 and images the surface of the object 2. The imaging camera is provided in an inclined direction Db inclined with respect to the irradiation direction Da of the light L1 onto the line-shaped region ML, starting from the line-shaped region ML.

[0024] The solid-state imaging device 5 sequentially captures the reflected light L2 generated in the linear region ML of the surface 2a of the object 2 at each position along the direction D1 in a stacked manner at a predetermined frame rate, and outputs an electrical signal composed of a data sequence obtained by the imaging. The solid-state imaging device 5 includes a light-receiving unit into which the reflected light L2 generated in the linear region ML is input, and a signal processing unit that processes a signal output from the light-receiving unit in response to the incidence of the reflected light L2.

[0025] As the object 2 moves in the direction D1 of the moving stage, it relatively moves along the direction D1 with respect to the light irradiation unit 3 and the imaging camera. As a result, for each position along the direction D1, the irradiation of the light L1 to the linear region ML by the light irradiation unit 3 and the imaging of the linear region ML based on the reflected light L2 by the solid-state imaging device 5 are sequentially performed. Thereby, the three-dimensional shape of the surface 2a of the object 2 can be measured.

[0026] The adjustment unit 6 adjusts the optical setting states of the light irradiation unit 3, the imaging optical system 4, or the solid-state imaging device 5 based on the signal output from the solid-state imaging device 5. The adjustment unit 6 may be a computer including a processing unit such as a CPU and a storage unit such as a RAM, HDD, or SSD. Details of this adjustment will be described later.

[0027] FIG. 2 is a diagram showing a first configuration example of the solid-state imaging device 5. The solid-state imaging device 5A of the first configuration example shown in this figure includes a first light-receiving unit 10, second light-receiving units 20A and 20B, a first signal processing unit 30, second signal processing units 40A and 40B, an arithmetic unit 50, and a storage unit 60.

[0028] These may be formed on a single semiconductor substrate. Alternatively, the first light-receiving unit 10 and the second light-receiving units 20A and 20B may be formed on a single semiconductor substrate, and the first signal processing unit 30, the second signal processing units 40A and 40B, the arithmetic unit 50, and the storage unit 60 may be formed on another single semiconductor substrate. In this case, these two semiconductor substrates may be electrically connected by bumps. The arithmetic unit 50 and the storage unit 60 may be a computer or an embedded system having a microcomputer, FPGA, or the like.

[0029] The first light receiving unit 10 has a plurality of pixel pairs 11 arranged along the first direction (x direction). Each of the second light receiving units 20A and 20B has a plurality of pixels 21 arranged along a second direction intersecting the first direction, and generates an amount of charge corresponding to the amount of received light. The second direction may be the y direction orthogonal to the x direction.

[0030] Each of the plurality of pixel pairs 11 of the first light receiving unit 10 includes a first pixel 12 and a second pixel 13. When line-shaped light extending in the x direction is incident on the first light receiving unit 10, as the light incident position moves from one side to the other side in the y direction, the amount of charge generated by the first pixel 12 gradually decreases, and the amount of charge generated by the second pixel 13 gradually increases.

[0031] The first pixel 12 and the second pixel 13 having such a relationship between the light incident position in the y direction and the amount of charge generation can have various configurations, but in the configuration shown in this figure, they are characterized by the shape of each pixel. That is, the shape of the first pixel 12 is a triangle whose width in the x direction gradually narrows from one side to the other side in the y direction, and the shape of the second pixel 13 is a triangle whose width in the x direction gradually widens from one side to the other side in the y direction. For example, this triangle is an isosceles triangle, the width of the base is about 10 μm, and the height is about several mm. The width in the x direction of each of the first pixel 12 and the second pixel 13 is the width in the x direction of the region (light sensitive region) that can generate charge in each pixel in response to light incidence.

[0032] The second light receiving unit 20A is provided on one side in the x direction with respect to the first light receiving unit 10. The second light receiving unit 20B is provided on the other side in the x direction with respect to the first light receiving unit 10. The number of pixels 21 included in the second light receiving unit 20A is preferably the same as the number of pixels 21 included in the second light receiving unit 20A, and they are preferably provided at the same position in the y direction. The pixels 21 included in each of the second light receiving unit 20A and the second light receiving unit 20B may have the same configuration.

[0033] The first signal processing unit 30 is electrically connected to the first pixels 12 and the second pixels 13 of the plurality of pixel pairs 11 of the first light receiving unit 10, and outputs a first electrical signal of a data series corresponding to the amount of charge generated in each of these first pixels 12 and second pixels 13. The second signal processing unit 40A is electrically connected to each of the plurality of pixels 21 of the second light receiving unit 20A, and outputs a second electrical signal of a data series corresponding to the amount of charge generated in these pixels 21. The second signal processing unit 40B is electrically connected to each of the plurality of pixels 21 of the second light receiving unit 20B, and outputs a second electrical signal of a data series corresponding to the amount of charge generated in these pixels 21.

[0034] The arithmetic unit 50 is electrically connected to the first signal processing unit 30. Based on the first electrical signal output from the first signal processing unit 30, the arithmetic unit 50 obtains the light incident position in the y direction at each position in the x direction in the first light receiving unit 10, and measures the shape of the object 2 (measurement step). Specifically, for each of the plurality of pixel pairs 11 (that is, for each position in the x direction in the first light receiving unit 10), the arithmetic unit 50 obtains the data D12 of the first pixel 12 and the data D13 of the second pixel 13 based on the first electrical signal, and can obtain the light incident position in the y direction based on the ratio of these two data D12 and D13.

[0035] The arithmetic unit 50 is also electrically connected to the second signal processing units 40A and 40B. Based on the second electrical signal output from the second signal processing unit 40A, the arithmetic unit 50 obtains the light incident intensity distribution in the y direction in the second light receiving unit 20A, and evaluates the optical setting state of the light irradiation unit 3, the imaging optical system 4, or the solid-state imaging device 5 (evaluation step). The arithmetic unit 50 obtains the light incident intensity distribution in the y direction in the second light receiving unit 20B based on the second electrical signal output from the second signal processing unit 40B. The light incident intensity distribution includes information on the light intensity peak position and information on the width of the distribution (for example, the full width at half maximum).

[0036] It is preferable that the storage unit 60 is provided. The storage unit 60 stores a correction formula for correcting the light incident position in the y direction obtained based on the first electrical signal. When the storage unit 60 is provided, when the calculation unit 50 obtains the light incident position in the y direction at each position in the x direction in the first light receiving unit 10 based on the first electrical signal, it performs correction based on the correction formula stored in the storage unit 60. Details of this correction will be described later.

[0037] FIG. 3 is a diagram showing a circuit configuration example of the first signal processing unit 30. In this figure, the first pixel 12 and the second pixel 13 are shown by the circuit symbols of photodiodes. The first signal processing unit 30 includes the same number of NMOS transistors 31, a shift register 32, a charge amplifier 33, and an AD conversion circuit 34 as the total number of the first pixel 12 and the second pixel 13.

[0038] Each of the first pixel 12 and the second pixel 13 is electrically connected to the input terminal of the charge amplifier 33 via the corresponding NMOS transistor 31. The NMOS transistor 31 is used as a switch and is set to either an on state or an off state according to the value of the control signal output from the shift register 32 and applied to the gate. The shift register 32 sequentially turns on the plurality of NMOS transistors 31 by applying a control signal to the gate of each of the plurality of NMOS transistors 31.

[0039] The charge amplifier 33 inputs a charge from the first pixel 12 or the second pixel 13 via the NMOS transistor 31 and inputs a voltage value corresponding to the amount of the charge. The AD conversion circuit 34 is electrically connected to the charge amplifier 33. The AD conversion circuit 34 inputs the voltage value (analog value) output from the charge amplifier 33 and outputs a digital value corresponding to the voltage value.

[0040] When a plurality of NMOS transistors 31 are sequentially turned on one by one, charges generated by light reception in the first pixel 12 or the second pixel 13 connected to the turned-on NMOS transistor 31 are input to the charge amplifier 33, a voltage value corresponding to the amount of the charges is output from the charge amplifier 33, and further, a digital value corresponding to the voltage amount output from the charge amplifier 33 is output from the AD conversion circuit 34. By sequentially turning on the plurality of NMOS transistors 31 one by one, a first electrical signal of a data string corresponding to the amount of charges generated in each of the first pixels 12 and the second pixels 13 of the plurality of pixel pairs 11 is output from the AD conversion circuit 34.

[0041] The second signal processing units 40A and 40B can also have the same configuration as the first signal processing unit 30. The second signal processing units 40A and 40B may output signals during a common period. In this case, the shift register may be provided in common in the second signal processing units 40A and 40B. The first signal processing unit 30 and the second signal processing units 40A and 40B may output signals during a common period. In this case, the shift register may be provided in common in the first signal processing unit 30 and the second signal processing units 40A and 40B. The first signal processing unit 30 and the second signal processing units 40A and 40B may output signals during different periods. In this case, the first signal processing unit 30 and the second signal processing units 40A and 40B may be provided separately, or the output of the first signal and the output of the second signal may be performed during different periods by a common signal processing unit.

[0042] The signal processing unit shown in FIG. 3 had a configuration of a PPS (Passive Pixel Sensor), but the signal processing unit may have a configuration of an APS (Active Pixel Sensor). Further, the signal processing unit shown in FIG. 3 had a configuration of a rolling shutter method that sequentially reads out signals of each pixel, but the signal processing unit may have a configuration of a global shutter method that simultaneously reads out signals of each pixel.

[0043] Next, another configuration example of the solid-state imaging device 5 will be described with reference to FIGS. 4 to 6. FIG. 4 is a diagram showing a second configuration example of the solid-state imaging device 5. The solid-state imaging device 5B of the second configuration example shown in this figure includes a first light receiving unit 10, a second light receiving unit 20A, a first signal processing unit 30, a second signal processing unit 40A, an arithmetic unit 50, and a storage unit 60. In the solid-state imaging device 5A (FIG. 2) of the first configuration example, the second light receiving unit 20A is provided on one side in the x direction with respect to the first light receiving unit 10, and the second light receiving unit 20B is provided on the other side. In contrast, in the solid-state imaging device 5B (FIG. 4) of the second configuration example, the second light receiving unit 20A is provided only on one side in the x direction with respect to the first light receiving unit 10.

[0044] FIG. 5 is a diagram showing a third configuration example of the solid-state imaging device 5. The solid-state imaging device 5C of the third configuration example shown in this figure includes a first light receiving unit 10 and a second light receiving unit 20C, and also includes a signal processing unit, an arithmetic unit, and a storage unit. Note that the signal processing unit, the arithmetic unit, and the storage unit are not shown. In the solid-state imaging device 5C of the third configuration example, the first light receiving unit 10 is divided into a first region 10A on one side in the x direction and a second region 10B on the other side, and the second light receiving unit 20C is provided between the first region 10A and the second region 10B. The second light receiving unit 20C has the same configuration as the second light receiving units 20A and 20B of the solid-state imaging device 5A (FIG. 2) of the first configuration example.

[0045] FIG. 6 is a diagram showing a fourth configuration example of the solid-state imaging device 5. The solid-state imaging device 5D of the fourth configuration example shown in this figure includes a first light receiving unit 10 and second light receiving units 20A, 20B, and 20C, and also includes a signal processing unit, an arithmetic unit, and a storage unit. Note that the signal processing unit, the arithmetic unit, and the storage unit are not shown. In the solid-state imaging device 5D of the fourth configuration example, the second light receiving unit 20A is provided on one side in the x direction with respect to the first light receiving unit 10, and the second light receiving unit 20B is provided on the other side. Further, the first light receiving unit 10 is divided into a first region 10A on one side in the x direction and a second region 10B on the other side, and the second light receiving unit 20C is provided between the first region 10A and the second region 10B.

[0046] In the solid-state imaging device 5C (Fig. 5) of the third configuration example and the solid-state imaging device 5D (Fig. 6) of the fourth configuration example, the width in the x direction of each pixel 21 of the second light-receiving unit 20C provided between the first region 10A and the second region 10B of the first light-receiving unit 10 can be several micrometers. The shift register for reading out the charges of the second light-receiving unit 20C can be provided on either one side in the x direction with respect to the first light-receiving unit 10. Therefore, the gap between the first region 10A and the second region 10B of the first light-receiving unit 10 can be made narrow enough not to cause a major problem during shape measurement by the optical cutting method.

[0047] Also, if the light incident on the first light-receiving unit 10, the second light-receiving unit 20C, etc. is made to enter from the back surface on the side opposite to the surface of the semiconductor substrate on which they are formed, the wiring between each pixel 21 of the second light-receiving unit 20C and the shift register will not block the light incidence. It is also preferable to adopt a configuration in which the first light-receiving unit 10, the second light-receiving unit 20C, etc. are formed on one semiconductor substrate, and the signal processing unit, etc. are formed on another semiconductor substrate, and these two semiconductor substrates are electrically connected by bumps. Also in this case, the gap between the first region 10A and the second region 10B of the first light-receiving unit 10 can be made narrow, and the wiring between each pixel 21 of the second light-receiving unit 20C and the shift register can be made not to block the light incidence.

[0048] Next, the operation and effect when using the solid-state imaging devices 5 (5A to 5D) of each configuration example in the shape measurement device 1 will be described with reference to Figs. 7 to 10. Figs. 7 to 9 are diagrams showing examples of the intensity distribution of the line-shaped light incident on the first light-receiving unit 10 etc. of the solid-state imaging device 5A (Fig. 2) of the first configuration example in shading. Fig. 10 is a diagram showing an example of the intensity distribution of the line-shaped light incident on the first light-receiving unit 10 etc. of the solid-state imaging device 5D (Fig. 6) of the fourth configuration example in shading.

[0049] In the example shown in FIG. 7, in the first light receiving unit 10 and the second light receiving units 20A and 20B, the light L is incident on a region that extends in a direction parallel to the x direction and has a narrow width in the y direction. This indicates that the optical settings of the light irradiation unit 3, the imaging optical system 4, and the solid-state imaging device 5 in the shape measurement apparatus 1 are in an appropriate state. At this time, the second electrical signals output from the second signal processing units 40A and 40B indicate that the light intensity peak positions in the y direction are equal to each other and the width of the distribution is narrow in the light incident intensity distribution in the y direction in each of the second light receiving units 20A and 20B. That is, based on the second electrical signals output from the second signal processing units 40A and 40B, it is possible to detect that the light L is incident on a region that extends in a direction parallel to the x direction and has a narrow width in the y direction in the first light receiving unit 10, and further, it is possible to detect that the optical settings of the light irradiation unit 3, the imaging optical system 4, and the solid-state imaging device 5 in the shape measurement apparatus 1 are in an appropriate state.

[0050] In the example shown in FIG. 8, in the first light receiving unit 10 and the second light receiving units 20A and 20B, the light L is incident on a region that extends in a direction parallel to the x direction and has a wide width in the y direction. This indicates that in the shape measurement apparatus 1, the optical setting of the light irradiation unit 3 is not in an appropriate state (a state in which a wide range of the surface of the object 2 is irradiated with light), or the optical setting of the imaging optical system 4 is not in an appropriate state (a state in which the focus of imaging is not appropriate). At this time, the second electrical signals output from the second signal processing units 40A and 40B indicate that the light intensity peak positions in the y direction are equal to each other and the width of the distribution is wide in the light incident intensity distribution in the y direction in each of the second light receiving units 20A and 20B. That is, based on the second electrical signals output from the second signal processing units 40A and 40B, it is possible to detect that the light L is incident on a region that extends in a direction parallel to the x direction and has a wide width in the y direction in the first light receiving unit 10, and further, it is possible to detect that the optical settings of the light irradiation unit 3 or the imaging optical system 4 in the shape measurement apparatus 1 are not in an appropriate state.

[0051] In the example shown in FIG. 9, in the first light receiving unit 10 and the second light receiving units 20A and 20B, the light L is incident on a region that extends in a direction inclined with respect to the x-direction and has a narrow width in the y-direction. This indicates that in the shape measurement device 1, the optical setting of the light irradiation unit 3 is not appropriate (a state in which the line-shaped region ML inclined with respect to the direction D2 is irradiated with light on the surface of the object 2), or the optical setting of the solid-state imaging device 5 is not appropriate (a state in which the orientation around the optical axis is not appropriate). At this time, the second electrical signals output from the second signal processing units 40A and 40B indicate that the peak positions of the light intensity in the y-direction are different from each other and the width of the distribution is narrow in the light incident intensity distribution in the y-direction in each of the second light receiving units 20A and 20B. That is, based on the second electrical signals output from the second signal processing units 40A and 40B, it can be detected that the light L is incident on a region that extends in a direction inclined with respect to the x-direction and has a narrow width in the y-direction in the first light receiving unit 10, and further, it can be detected that the optical setting of the light irradiation unit 3 or the solid-state imaging device 5 in the shape measurement device 1 is not in an appropriate state.

[0052] Note that the detection of the width in the y-direction of the light incident on the first light receiving unit 10 is possible not only with the solid-state imaging device 5A (FIG. 2) of the first configuration example, but also with the solid-state imaging device 5B (FIG. 4) of the second configuration example, the solid-state imaging device 5C (FIG. 5) of the third configuration example, and the solid-state imaging device 5D (FIG. 6) of the fourth configuration example. Further, the detection of the degree of inclination of the light incident on the first light receiving unit 10 is possible not only with the solid-state imaging device 5A (FIG. 2) of the first configuration example, but also with the solid-state imaging device 5D (FIG. 6) of the fourth configuration example.

[0053] In the example shown in FIG. 10, in the first light receiving unit 10 and the second light receiving units 20A, 20B, and 20C, the light L is incident on a region extending in a direction inclined with respect to the x direction. This is, as in the case of FIG. 9, a state where the optical setting of the light irradiation unit 3 is not appropriate (a state where light is irradiated on a line-shaped region ML inclined with respect to the direction D2 on the surface of the object 2), or a state where the optical setting of the solid-state imaging device 5 is not appropriate (a state where the orientation around the optical axis is not appropriate). Further, in this example, the incident region of the light L is narrow in the y direction near the center and wide in the y direction at both ends. This means that although the optical setting of the imaging optical system 4 is appropriate (the focus of imaging is appropriate) near the center of the incident region of the light L, the optical setting of the imaging optical system 4 is not appropriate (the focus of imaging is not appropriate) at both ends.

[0054] In the example shown in FIG. 10, the second electrical signal output from the second signal processing unit indicates that the peak positions of the light intensity in the y direction are different from each other in the light incident intensity distribution in the y direction in each of the second light receiving units 20A, 20B, and 20C. Further, the second electrical signal output from the second signal processing unit indicates that the width of the light incident intensity distribution in the y direction in the second light receiving unit 20C provided in the center is narrow, while the width of the light incident intensity distribution in the y direction in the second light receiving units 20A and 20B provided at both ends is wide. That is, based on the second electrical signal output from the second signal processing unit, it is possible to detect that the light L is incident on a region extending in a direction inclined with respect to the x direction in the first light receiving unit 10, and it is possible to detect that the focus is appropriate near the center but not appropriate at both ends. Furthermore, in the shape measurement device 1, it is possible to detect that the optical settings of the light irradiation unit 3, the imaging optical system 4, or the solid-state imaging device 5 are not in an appropriate state.

[0055] The arithmetic unit 50 of the solid-state imaging device 5 (5A to 5D) obtains the light incident intensity distribution in the y direction in the second light receiving unit based on the second electrical signal output from the second signal processing unit. Then, based on the light incident intensity distribution in the y direction in the second light receiving unit, as described with reference to FIGS. 7 to 10, the arithmetic unit 50 can evaluate the optical setting state of the light irradiation unit 3, the imaging optical system 4, or the solid-state imaging device 5 (evaluation step).

[0056] The adjustment unit 6 of the shape measurement device 1 can adjust the optical setting state of the light irradiation unit 3, the imaging optical system 4, or the solid-state imaging device 5 based on the result of the evaluation by the arithmetic unit 50 of the solid-state imaging device 5 (adjustment step). The optical setting state of the light irradiation unit 3 is, for example, the relative position and orientation with respect to the object 2, and the state of the optical system between the light source and the object 2. The optical setting state of the imaging optical system 4 is, for example, the focus adjustment state. The optical setting state of the solid-state imaging device 5 is, for example, the relative position and orientation with respect to the object 2.

[0057] Next, a method for correcting the light incident position in the y direction obtained based on the first electrical signal in the solid-state imaging device 5 (5A to 5D) will be described with reference to FIG. 11. When the light incident position in the y direction obtained based on the first electrical signal is not accurate, it is preferable to perform the following correction to obtain the true light incident position in the y direction. FIG. 11 is a diagram for explaining a method for correcting the light incident position in the y direction obtained based on the first electrical signal in the solid-state imaging device 5A (FIG. 2) of the first configuration example.

[0058] In this correction, first, at each position in the y direction, light is made to enter each position on a predetermined line extending in the x direction with respect to the solid-state imaging device 5A. At this time, at each position in the y direction, line-shaped light extending in the x direction may be made to enter, or as shown in FIG. 11, the incident position of the spot light Ls may be scanned along the x direction. Based on the first signal output from the signal processing unit, the light incident position in the y direction is obtained at each position in the x direction of the first light receiving unit 10, and based on the second signal output from the signal processing unit, the light incident position in the y direction in the second light receiving units 20A and 20B is obtained. Then, at each position in the y direction, based on the comparison of the light incident positions in the y direction respectively obtained based on the first electric signal and the second electric signal, the light incident position in the y direction obtained based on the first electric signal is corrected.

[0059] The storage unit 60 stores a correction formula for correcting the light incident position in the y direction obtained based on the first electric signal. The correction formula is obtained for each position in the x direction. The correction formula is a conversion formula for converting the light incident position in the y direction obtained based on the first electric signal into the light incident position in the y direction (true light incident position in the y direction) obtained based on the second electric signal. The storage unit 60 may store the coefficients of the function formula when the correction formula is represented by a certain function formula. Also, the storage unit 60 may be a look-up table. In this case, using the light incident position in the y direction obtained based on the first electric signal as the address of the look-up table, the data at that address is taken as the true light incident position in the y direction.

[0060] When the arithmetic unit 50 obtains the light incident position in the y direction at each position in the x direction in the first light receiving unit 10 based on the first electric signal, it performs correction based on the correction formula stored in the storage unit 60. Even when the light incident position in the y direction obtained based on the first electric signal is not accurate, by performing such correction, an accurate light incident position in the y direction can be obtained.

[0061] The correction described above is applicable not only to the solid-state imaging device 5A (Fig. 2) of the first configuration example, but also to the solid-state imaging device 5B (Fig. 4) of the second configuration example, the solid-state imaging device 5C (Fig. 5) of the third configuration example, and the solid-state imaging device 5D (Fig. 6) of the fourth configuration example.

[0062] Fig. 12(a) is a graph showing the values of the first electrical signals at the first pixel 12 and the second pixel 13 of one pixel pair 11 of the first light-receiving section 10 of the solid-state imaging device 5 when the height of the object 2 is changed in the shape measurement device 1, and the change in the height conversion value of the object 2 obtained from the values of the first electrical signals. The horizontal axis of this graph is the actual height of the object 2 set by changing the height of the Z stage on which the object 2 is placed by 1 mm at a time. As shown in this graph, when the height of the object 2 is changed, the increase and decrease in the values of the first electrical signals at the first pixel 12 and the second pixel 13 respectively have opposite tendencies. Therefore, the data D12 of the first pixel 12 and the data D13 of the second pixel 13 can be obtained based on the first electrical signal, and the light incident position (height conversion value) in the y direction can be obtained based on the ratio of these two data D12 and D13.

[0063] Fig. 12(b) is a graph showing the difference between the height conversion value of the object 2 obtained from the first electrical signal and the true height when the height of the object 2 is changed in the shape measurement device 1. This difference is ideally 0 (or a very small value), but actually becomes a significant value other than 0. With such an error, the measurement accuracy of the shape of the object 2 decreases. Therefore, by performing the correction as described above, the light incident position in the y direction in the first light-receiving section 10 can be accurately obtained, and the shape of the object 2 can be accurately measured.

[0064] Next, other configuration examples of the first pixels 12 and the second pixels 13 of each of the plurality of pixel pairs 11 of the first light receiving unit 10 will be described. When line-shaped light extending in the x direction is incident on the first light receiving unit 10, as the light incident position moves from one side in the y direction to the other side, the amount of charge generated by the first pixel 12 gradually decreases, and the amount of charge generated by the second pixel 13 gradually increases. The first pixel 12 and the second pixel 13 having such a relationship between the light incident position in the y direction and the charge generation amount can have various configurations. In the configuration examples described so far, the first pixel 12 and the second pixel 13 are characterized by their shapes, and the shape is an isosceles triangle. The first pixel 12 and the second pixel 13 are not limited to this, and may be configuration examples as shown in FIGS. 13 to 22.

[0065] FIG. 13 is a diagram showing another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. Each pixel pair 11A in the configuration example shown in this figure includes a first pixel 12A and a second pixel 13A. The shape of the first pixel 12A is a right triangle whose width in the x direction gradually narrows from one side in the y direction to the other side, and the shape of the second pixel 13A is a right triangle whose width in the x direction gradually widens from one side in the y direction to the other side. In each pixel pair 11A, the first pixel 12A and the second pixel 13A are arranged such that the hypotenuses of the three sides of each right triangle face each other. The overall shape of each pixel pair 11A can be approximately rectangular.

[0066] In the configuration example shown in FIG. 13, in the first light receiving unit 10 in which a plurality of pixel pairs 11A are arranged along the x direction, the first pixel 12A and the second pixel 13A may be arranged alternately, or may be arranged as shown in FIG. 14. In the arrangement shown in FIG. 14, the first pixel 12A of a certain pixel pair 11A and the first pixel 12A of the adjacent pixel pair 11A have sides parallel to the y direction among the three sides of each right triangle facing each other, and the second pixel 13A of a certain pixel pair 11A and the second pixel 13A of the adjacent pixel pair 11A have sides parallel to the y direction among the three sides of each right triangle facing each other.

[0067] FIG. 15 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. Each pixel pair 11B in the configuration example shown in this figure includes a first pixel 12B and a second pixel 13B. The shape of the first pixel 12B is a trapezoid whose width in the x direction gradually narrows from one side in the y direction to the other side, and the shape of the second pixel 13B is a trapezoid whose width in the x direction gradually widens from one side in the y direction to the other side. The overall shape of each pixel pair 11B can be a substantially parallelogram as shown in this figure, or can also be a substantially rectangle.

[0068] FIG. 16 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. In the configuration examples described so far, in each of the first pixel 12 and the second pixel 13, the width in the x direction continuously changes from one side in the y direction to the other side. In contrast, each pixel pair 11C in the configuration example shown in this figure includes a first pixel 12C and a second pixel 13C. The shape of the first pixel 12C is such that the width in the x direction gradually decreases stepwise from one side in the y direction to the other side, and the shape of the second pixel 13C is such that the width in the x direction gradually increases stepwise from one side in the y direction to the other side. For example, in each of the first pixel 12C and the second pixel 13C, the maximum width W1 in the x direction is about 10 μm, the minimum width W2 in the x direction is 1 μm or less, the length in the y direction is several mm, and the width in the x direction increases or decreases stepwise by a certain value (for example, 0.05 μm to 0.10 μm) at every certain interval H (for example, 10 μm to 20 μm) in the y direction. The width in the y direction of the line-shaped light incident on the first light receiving portion 10 in which a plurality of pixel pairs 11C are arranged along the x direction or the diameter of the spot-shaped light is set to be larger than the interval H in the y direction in which the width in the x direction changes in each of the first pixel 12C and the second pixel 13C, for example, about 20 μm.

[0069] FIG. 17 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. Each pixel pair 11D in the configuration example shown in this figure includes a first pixel 12D and a second pixel 13D. The shape of the first pixel 12D is such that the width in the x direction gradually narrows from one side in the y direction to the other side, and the shape of the second pixel 13D is such that the width in the x direction gradually widens from one side in the y direction to the other side. At this time, since the y-direction position of the line-shaped or spot-shaped light incident on the first light-receiving portion 10 is detected by the signal change of each pixel pair, in each of the first pixel 12D and the second pixel 13D, the detection resolution can be improved by changing the step position in the y direction. For example, in each of the first pixel 12D and the second pixel 13D, the maximum width W1 in the x direction is about 10 μm, the minimum width W2 in the x direction is 1 μm or less, the length in the y direction is several mm, and the width in the x direction gradually increases or decreases by a fixed value (for example, 0.05 μm to 0.10 μm) at every fixed interval H (for example, 10 μm to 20 μm) in the y direction. At this time, in each pixel, one step position in the x direction is moved by H / 2 in the y direction with respect to the other step position. The width in the y direction of the line-shaped light incident on the first light-receiving portion 10 in which a plurality of pixel pairs 11D are arranged along the x direction or the diameter of the spot-shaped light is set to be, for example, about 10 μm so as to be larger than the interval H in the y direction in which the width in the x direction changes in each of the first pixel 12D and the second pixel 13D.

[0070] FIG. 18 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. Each pixel pair 11E in the configuration example shown in this figure includes a first pixel 12E and a second pixel 13E. The shape of the first pixel 12E is such that the width in the x direction gradually narrows while repeating increases and decreases from one side in the y direction to the other side, and the shape of the second pixel 13E is such that the width in the x direction gradually widens while repeating increases and decreases from one side in the y direction to the other side. The shape of each of the first pixel 12E and the second pixel 13E may be one in which a plurality of rectangles arranged along the y direction are sequentially joined.

[0071] FIG. 19 is a diagram showing still another configuration example of a pixel pair 11 including a first pixel 12 and a second pixel 13. Each pixel pair 11F in the configuration example shown in this figure includes a first pixel 12F and a second pixel 13F. The first pixel 12F is electrically connected to a wiring 35 by a plurality of contacts 18 discretely provided along the y direction, and is electrically connected to a first signal processing unit 30 by these plurality of contacts 18 and the wiring 35. The second pixel 13F is electrically connected to a wiring 36 by a plurality of contacts 19 discretely provided along the y direction, and is electrically connected to the first signal processing unit 30 by these plurality of contacts 19 and the wiring 36. In the configuration example shown in FIG. 19, the impedance between the first pixel 12F and the first signal processing unit 30 can be reduced, and even the charge generated at a location far from the first signal processing unit 30 in the first pixel 12F can reach the first signal processing unit 30 in a short time, so that the charge reading speed can be improved. The same applies to the second pixel 13F. The width of each of the wirings 35 and 36 in the x direction can be made narrow enough not to affect the light reception of the first pixel 12F and the second pixel 13F, respectively. Further, if the light incident on the first light receiving unit 10 or the like is incident from the back surface opposite to the surface of the semiconductor substrate on which they are formed, the wiring does not block the light incident.

[0072] In the configuration examples described so far, the first pixel 12 and the second pixel 13 of each pixel pair 11 have characteristics in shape. In the configuration examples to be described hereinafter, each pixel pair 11 further includes a light transmission filter or a light shielding film in addition to the first pixel 12 and the second pixel 13.

[0073] FIG. 20 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. FIG. 20(a) is a plan view, and FIG. 20(b) is a cross-sectional view. Each pixel pair 11G of the configuration example shown in this figure further includes a first filter 14 and a second filter 15 in addition to the first pixel 12G and the second pixel 13G. The shape of each of the first pixel 12G and the second pixel 13G may be a rectangle having four sides parallel to the x direction or the y direction. The first filter 14 is provided so as to cover the entire area of the first pixel 12G, and attenuates the intensity of light incident on the first pixel 12G according to the light transmittance. The second filter 15 is provided so as to cover the entire area of the second pixel 13G, and attenuates the intensity of light incident on the second pixel 13G according to the light transmittance.

[0074] In the configuration example shown in FIG. 20, from one side to the other side in the y direction, the light transmittance of the first filter 14 gradually decreases, and the light transmittance of the second filter 15 gradually increases. FIG. 20(a) shows the magnitude of the light transmittance of each of the first filter 14 and the second filter 15 in shading. When line-shaped light extending in the x direction is incident on the first light receiving portion 10, as the light incident position moves from one side to the other side in the y direction, the light transmittance of the first filter 14 gradually decreases, so the amount of charge generated by the first pixel 12G gradually decreases. On the other hand, since the light transmittance of the second filter 15 gradually increases, the amount of charge generated by the second pixel 13G gradually increases.

[0075] FIG. 21 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. FIG. 21(a) is a plan view, and FIG. 21(b) is a cross-sectional view. Each pixel pair 11H of the configuration example shown in this figure further includes a first light-shielding film 16 and a second light-shielding film 17 in addition to the first pixel 12H and the second pixel 13H. The shape of each of the first pixel 12H and the second pixel 13H may be a rectangle having four sides parallel to the x direction or the y direction. The first light-shielding film 16 is provided so as to cover a part of the first pixel 12H, and restricts light incidence on a part of the first pixel 12H. The second light-shielding film 17 is provided so as to cover a part of the second pixel 13H, and restricts light incidence on a part of the second pixel 13H.

[0076] In the configuration example shown in FIG. 21, from one side to the other side in the y direction, the width in the x direction of the portion of the first pixel 12H not covered by the first light-shielding film 16 gradually becomes narrower, and the width in the x direction of the portion of the second pixel 13H not covered by the second light-shielding film 17 gradually becomes wider. In the example shown in this figure, the shape of the portion of the first pixel 12H not covered by the first light-shielding film 16 is an isosceles triangle whose width in the x direction gradually becomes narrower from one side to the other side in the y direction, and the shape of the portion of the second pixel 13H not covered by the second light-shielding film 17 is an isosceles triangle whose width in the x direction gradually becomes wider from one side to the other side in the y direction. Also in this configuration example, when line-shaped light extending in the x direction is incident on the first light-receiving portion 10, as the light incidence position goes from one side to the other side in the y direction, the amount of charge generated by the first pixel 12H gradually decreases, and the amount of charge generated by the second pixel 13H gradually increases.

[0077] FIG. 22 is a diagram showing still another configuration example of the pixel pair 11 including the first pixel 12 and the second pixel 13. Each pixel pair 11J in the configuration example shown in this figure further includes a first filter 14 and a second filter 15 in addition to the first pixel 12J and the second pixel 13J. Compared with the configuration example shown in FIG. 20, the configuration example shown in this FIG. 22 is different in that each of the first pixel 12J and the second pixel 13J is divided into two regions. The first pixel 12J is divided into a first region 12Ja on one side in the y direction and a second region 12Jb on the other side. The second pixel 13J is divided into a first region 13Ja on one side in the y direction and a second region 13Jb on the other side.

[0078] In the configuration example shown in FIG. 22, the first signal processing unit that reads signals from each pixel of the first light receiving unit 10 includes a first circuit provided on one side of the first light receiving unit 10 in the y direction, a second circuit provided on the other side of the first light receiving unit 10 in the y direction, and an addition circuit that adds data for the same pixel (first pixel 12J or second pixel 13J) among the signals output from each of the first circuit and the second circuit. It is preferable to include. The first circuit reads signals from the first region 12Ja of the first pixel 12J and the first region 13Ja of the second pixel 13J of each pixel pair 11J. The second circuit reads signals from the second region 12Jb of the first pixel 12J and the second region 13Jb of the second pixel 13J of each pixel pair 11J. The first electrical signal output from the addition circuit is a data string corresponding to the amount of charge generated in each of the first pixel 12J and the second pixel 13J of the plurality of pixel pairs 11J.

[0079] In the configuration example shown in FIG. 22, since each of the first pixel 12J and the second pixel 13J is divided into a region on one side and a region on the other side in the y direction, the signal line between the first region 12Ja of the first pixel 12J and the first region 13Ja of the second pixel 13J and the first circuit can be shortened, and the signal line between the second region 12Jb of the first pixel 12J and the second region 13Jb of the second pixel 13J and the second circuit can be shortened.

[0080] The solid-state imaging device and the shape measurement device are not limited to the above-described configuration examples, and various modifications are possible. For example, a configuration combining two or more of the above-described configuration examples may be used.

Explanation of Reference Numerals

[0081] 1... Shape measurement device, 2... Object, 3... Light irradiation unit, 4... Imaging optical system, 5, 5A to 5D... Solid-state imaging device, 6... Adjustment unit, 10... First light receiving unit, 10A... First region, 10B... Second region, 11, 11A to 11J... Pixel pairs, 12, 12A to 12J... First pixels, 13, 13A to 13J... Second pixels, 14... First filter, 15... Second filter, 16... First light-shielding film, 17... Second light-shielding film, 20A, 20B, 20C... Second light receiving units, 21... Pixel, 30... First signal processing unit, 31... NMOS transistor, 32... Shift register, 33... Charge amplifier, 34... AD conversion circuit, 40A, 40B... Second signal processing units, 50... Arithmetic unit, 60... Storage unit.

Claims

1. A first light receiving unit in which a plurality of pixel pairs are arranged along a first direction, A second light receiving unit in which a plurality of pixels that generate an amount of charge corresponding to the amount of light received are arranged along a second direction intersecting the first direction, Comprising, Each of the plurality of pixel pairs in the first light receiving unit includes a first pixel and a second pixel arranged side by side along the first direction, When line-shaped light extending in the first direction is incident on the first light receiving unit, as the light incident position goes from one side to the other side in the second direction, the amount of charge generated by the first pixel gradually decreases, and the amount of charge generated by the second pixel gradually increases, A solid-state imaging device.

2. The second light receiving unit is provided on one side of the first light receiving unit in the first direction, The solid-state imaging device according to claim 1.

3. The second light receiving unit is provided on both sides of the first light receiving unit in the first direction, The solid-state imaging device according to claim 1.

4. The first light receiving unit is divided into a first region on one side of the first direction and a second region on the other side, The second light receiving unit is provided between the first region and the second region, The solid-state imaging device according to any one of claims 1 to 3.

5. From one side to the other side in the second direction, the width of the first pixel in the first direction gradually becomes narrower, and the width of the second pixel in the first direction gradually becomes wider, The solid-state imaging device according to any one of claims 1 to 4.

6. Each of the plurality of pixel pairs in the first light receiving unit includes a first filter provided to cover the first pixel and a second filter provided to cover the second pixel, From one side to the other side in the second direction, the light transmittance of the first filter gradually becomes smaller, and the light transmittance of the second filter gradually becomes larger, The solid-state imaging device according to any one of claims 1 to 4.

7. Each of the plurality of pixel pairs in the first light receiving unit includes a first light-shielding film provided to cover a part of the first pixel and a second light-shielding film provided to cover a part of the second pixel, From one side to the other side in the second direction, the width of the portion of the first pixel not covered by the first light-shielding film in the first direction gradually becomes narrower, and the width of the portion of the second pixel not covered by the second light-shielding film in the first direction gradually becomes wider, The solid-state imaging device according to any one of claims 1 to 4.

8. Output a first electrical signal of a data sequence corresponding to the amount of charge generated in each of the first and second pixels of the plurality of pixel pairs of the first light receiving unit, and further include a signal processing unit that outputs a second electrical signal of a data sequence corresponding to the amount of charge generated in each of the plurality of pixels of the second light receiving unit. The solid-state imaging device according to any one of claims 1 to 7.

9. Further include an arithmetic unit that obtains the light incident position in the second direction at each position in the first direction in the first light receiving unit based on the first electrical signal, and obtains the light incident intensity distribution in the second direction in the second light receiving unit based on the second electrical signal. The solid-state imaging device according to claim 8.

10. Further include a storage unit that stores a correction formula for correcting the light incident position in the second direction obtained based on the first electrical signal. When obtaining the light incident position in the second direction at each position in the first direction in the first light receiving unit based on the first electrical signal, the arithmetic unit performs correction based on the correction formula stored in the storage unit. The solid-state imaging device according to claim 9.

11. An apparatus for measuring the shape of an object by the light cutting method, A light irradiation unit that irradiates light to each position on a predetermined line of the object, An imaging optical system that inputs and images the reflected light generated by irradiating the object with light from the light irradiation unit, The solid-state imaging device according to claim 9 or 10 that receives the reflected light that has passed through the imaging optical system, Comprising, The arithmetic unit of the solid-state imaging device, Based on the first electrical signal output from the signal processing unit of the solid-state imaging device, obtain the light incident position in the second direction at each position in the first direction in the first light receiving unit, and measure the shape of the object. Based on the second electrical signal output from the signal processing unit of the solid-state imaging device, obtain the light incident intensity distribution in the second direction in the second light receiving unit, and evaluate the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device. Shape measurement device.

12. Further include an adjustment unit that adjusts the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device based on the result of the evaluation by the arithmetic unit. The shape measurement device according to claim 11.

13. A light irradiation unit that irradiates light to each position on a predetermined line of the object, An imaging optical system that inputs and images the reflected light generated by irradiating the object with light from the light irradiation unit, The solid-state imaging device according to claim 9 or 10 that receives the reflected light that has passed through the imaging optical system, A method for measuring the shape of an object by a light cutting method, using: A measurement step of measuring the shape of the object by obtaining the light incident positions in the second direction at each position in the first direction in the first light receiving unit based on the first electrical signal output from the signal processing unit of the solid-state imaging device; An evaluation step of evaluating the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device by obtaining the light incident intensity distribution in the second direction in the second light receiving unit based on the second electrical signal output from the signal processing unit of the solid-state imaging device; A shape measurement method comprising:

14. Further comprising an adjustment step of adjusting the optical setting state of the light irradiation unit, the imaging optical system, or the solid-state imaging device based on the result of the evaluation in the evaluation step, The shape measurement method according to claim 13.

15. At each position in the second direction, light is made to be incident on each position on a predetermined line extending in the first direction with respect to the solid-state imaging device according to any one of claims 8 to 10, and based on a comparison of the light incident positions in the second direction obtained respectively based on the first electrical signal and the second electrical signal output from the signal processing unit of the solid-state imaging device, correcting the light incident position in the second direction obtained based on the first electrical signal, A correction method.

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