Module with connection tongue for supply line

Abstract

To provide a module in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, and a method.SOLUTION: A module (1) includes: an electrically insulating carrier (2); connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) that is delimited by a first end (23) and a second end (24); electronic components (19, 20) which are electrically connected to the connection means (3) as required; and cooling means (14). In order that power is supplied from the outside via the connection means (3) directly to the module, and thus typical bonding processes are omitted and parasitic inductances on a power supply part are avoided, the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4). The connection means is not fixed to the carrier (2) in the protruding area (9) and has contact means (22).SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a module in the field of power electronics that can control voltages above 1000 V and currents above 100 A. This module has at least, - an electrically insulating support having at least one connecting means, the connecting means being joined to the support via a metallized region, the connecting means preferably being formed of copper and having a material thickness greater than 0.3 mm, - an electronic component disposed on the support and electrically connected to the connecting means for controlling the supplied power, and - cooling means suitable for dissipating heat and has.

[0002] Bipolar transistors with insulated gate electrodes (IGBTs) used as semiconductor components in power electronics are well known. Voltages above 1000 V and currents above 100 A are applied to these IGBT modules via supply lines.

[0003] Modules known in the prior art have a plate-shaped substrate having a front side and a back side, for example, sintered ceramic. A metal cooling body is disposed on the back side for cooling the module. On the front side of the substrate, a metallized region made of copper having a material thickness of 0.3 mm to 1.0 mm is provided. The connection between the copper and the current / voltage supply part existing outside the module is made via so-called bonding wires. A large number of bonding wires are required to ensure that high voltages and currents can be introduced into the module. These bonding wires are partially arranged at small intervals from each other and curved to compensate for temperature variations. This may form so-called parasitic inductance. Well-known methods of joining the metallized region to the substrate are DCB "Direct copper bonded" or AMB "Active Metal Brazing".

[0004] The DCB method is a bonding technique capable of bonding copper to a ceramic substrate within a high temperature range of 1060 - 1065°C. For this purpose, copper is heated to around its melting point of 1085°. At this time, copper reaches the softening temperature range, thereby affecting the properties and dimensional stability of copper in this process step. In the case of the DCB method, hollow chambers, so-called cavities, can occur between the ceramic and the copper. These hollow chambers have an adverse effect on heat transfer and promote partial discharge, which can mean a risk from the perspective of safety. The DCB method is used in the metallization of so-called master cards with a size of 7.5″×5.5″. One master card may contain a plurality of substrates having a smaller size, and these substrates are individualized according to their uses. By the DCB method, composites composed of copper and ceramic can be manufactured. These composites are suitable for 100 - 1000 load fluctuations depending on the ceramic used.

[0005] The AMB method refers to “Active Metal Brazing”, that is, active brazing, for example, the bonding of metal and ceramic. In this case, copper is bonded to a ceramic, such as AlSiC, via a metal brazing alloy in a vacuum or inert gas atmosphere. The AMB method is a high-cost process based on process conditions, that is, a vacuum or inert gas atmosphere. Nevertheless, the AMB method has become established in the industrial production of cooled output modules. This is because composites suitable for up to 5000 load fluctuations are manufactured depending on the materials used.

[0006] The problem underlying the present invention is to improve the performance of modules in power electronics so that an electronic function that is permanently free of problems even in a large number of load fluctuations is guaranteed in a compact form.

[0007] This problem is solved according to the present invention by a module having the features described in claim 1.

[0008] The module according to the invention has a support, preferably a ceramic support, on which connection means are arranged in a first plane. The connection means are preferably formed from copper and form a connection to an external current or voltage source. The connection means may be formed in the form of a guide rail or a bus bar and are joined to the support via a metallization region. According to the invention, the connection means extend beyond the geometrical dimensions of the metallization region and / or the support and project from the metallization region and / or the support. In other words, the connection means project laterally from the support and / or the metallization region at at least one point. By one point may be meant one position and / or one region, for example a side surface and / or a partial region of a side surface and / or a peripheral part / region. If the support and / or the metallization region has the shape of a cuboid with dimensions, for example, length × width × height, then in the context of the invention one region or part of the connection means is arranged outside this cuboid. That is, a first end of the connection means is arranged outside the support and / or the metallization region, while a second end of the connection means is arranged in the region of the first plane of the support and / or the metallization region.

[0009] The connecting means is joined to the support in a material-connecting (i.e., chemically bonding) manner via a metallized part. In order to ensure a reliable joint between the support and the connecting means, it has surprisingly been confirmed that it is sufficient to join the connecting means to the support via the metallized part only in a partial region. For reliable functioning, it is sufficient if approximately 66% of the base surface of the connecting means is joined to the support via the metallized part. That is, approximately 33% of the base surface of the connecting means is arranged outside the support of the output module or outside the metallized region, forming a protrusion with respect to the support and / or the metallized region. In other words, in the case of a connecting means having a cuboid shape with length × width × height, if 66% of the base surface of the connecting means resulting from length × width is joined to the support, a reliable joint between the connecting means and the support is ensured. A suitable joining process is AMB. In the region of the protrusion, the connecting means may be supported on the support and be able to slide on the support during thermal expansion.

[0010] The connecting means has at least one contact member at its first end, and a current source or a voltage source can be connected to the contact member. The contact member may be formed as an extension of the connecting means and, in this case, is arranged in the same plane as the connecting means. Thereby, the soldering or welding process for attaching the supply line is thermally separated from the support. Thereby, the influence of the mounting process of the power supply unit on the module is reduced and ideally completely blocked.

[0011] In one alternative embodiment, the contact member may be formed at a predetermined angle with respect to the connecting means. In this case, the contact member and the connecting means have, for example, an L-shape. Other shapes, such as U-shape, T-shape, etc., are also possible depending on the connecting means of the current / voltage supply unit.

[0012] A heat load reduction zone in the form of an extension means may be provided between the first end and the second end of the connection means. At least one extension means may be preferably arranged outside the support and / or the metallization region, preferably immediately adjacent to these. The extension means compensates for the thermal expansion difference between the connection means and the heated metallization under the support and / or an electronic component such as a chip. Thereby, the mechanical load on the output module caused by heat generation is reduced and preferably completely prevented.

[0013] The extension means may be a member integrated into the connection means and may be formed, for example, in the form of a curved or bent portion, an emboss, a rounding, a bend, etc. The cross-section of the extension means may be the same as or smaller than the cross-section of the connection means.

[0014] In one particular embodiment, the extension means may have a cross-section smaller than the cross-section of the connection means. Thereby, the flexibility of the extension means is increased. The extension means may have one or more recesses. The recesses may be formed in the form of an opening with a bottom or in the form of a through-opening. If the extension means has a plurality of through-openings arranged in a row, this is formed in the form of a perforation.

[0015] The shape of the recess or opening may optionally be formed, for example, circular or square or rectangular, or in combination of these shapes. The connection means may have the extension means before being joined to the support.

[0016] Regardless of the form of the extension means, the extension means may extend only over the entire width of the connection means or alternatively over a partial region of the width of the connection means. The configuration of the extension means is adapted to the heat generation during power supply. The extension means compensates for the expansion of the connection means and thus extends the life of the module according to the invention.

[0017] In the region where the connection means is led out laterally or at a predetermined angle beyond the metallized region at at least one location, it is not fixedly positioned on the support, and by having contact members for the supply line, the connection of an external power supply unit to the module is facilitated. The bonding process, which is laborious in manufacturing, is no longer necessary and is omitted. Additionally, parasitic inductance in the power supply unit is thereby avoided. Another advantage of the direct connection means of the power supply unit to the module according to the present invention is the reduced overall height thereby achieved. The bent bonding wires, which are necessary in the prior art, are omitted. Thus, the overall height of the high-power circuit is reduced by only the extension length of the bonding wires beyond the electronic components. Miniaturization in power electronics, i.e., a smaller overall height, is always an issue in the development of components in power electronics.

[0018] In one embodiment according to the present invention, the connection means projects laterally or at a predetermined angle from the metallized region at at least one location and has contact members, and the contact members do not project from the support. That is, in this embodiment, the connection means is located in the region of the support, but in one partial region, it is not fixedly positioned on the support, for example, joined in a material-bonding manner. However, the connection means can be supported on the support and is capable of sliding on the support during thermal expansion. This special embodiment is suitable for applications where only a very small space is provided laterally beside the support.

[0019] In an alternative embodiment, the connection means projects beyond the metallized region on all sides defining the connection means, i.e., all around, and nevertheless, it may be arranged within the dimensions of the support.

[0020] The term "electronic component" includes all active and passive electrical or electronic components or parts and / or portions of components or parts, such as conductor paths, bonding wires, voltage sources, circuits, resistors, capacitors, coils, diodes, actuators, sensors, ICs (integrated circuits), chips, SiC chips, transistors, etc. This list of electronic components is to clarify that all electrical or electronic components that can be used in the context of this specification are considered electronic components. The list is not intended to be exhaustive.

[0021] An electronic component has a plurality of contact points in the form of metallization regions, through which connection is possible, for example, to connection means and / or another electronic component as described above. These contact points are part of the electronic component, are metallic and conductive, and enable the function of the electronic component to be incorporated into an electrical circuit. The contact points, i.e., the metallization regions, may be formed as a coating consisting of Ag, Au, Sn, and / or SAC solder in one preferred configuration. This makes it possible to ensure a materially conductive joint with another component of the electrical circuit.

[0022] The connection means preferably consists of copper. In one configuration, the connection means is provided with at least one conductive coating, i.e., a contact point or a metallization region. The metallization region, i.e., the contact point, is a component of the connection means and is joined to the connection means in a materially connected (chemically bonded) manner. The coating is preferably selected from Ag, Au, Sn, and / or SAC solder.

[0023] In one preferred configuration, the connection means consists of copper having a purity of 99% or more, preferably 99.9% or more, and particularly preferably 99.99% or more. In one particularly preferred configuration, copper with a low oxygen and / or phosphorus content is used for the connection means.

[0024] At least one electronic component is provided directly on the connecting means in the present invention, that is, the contact points of these electronic components are electrically connected in a material - connecting manner directly to the contact points of the connecting means. In this case, the metal and / or coating material of the connecting means, that is, the contact points, react when the electronic component is connected with the metal and / or coating material of the electronic component, that is, the contact points. A material - connecting, mechanical bonding and / or electrical connection occurs. There is no connecting means such as bonding wires or the like between these electronic components and the connecting means. In this regard, being directly connected means that two parts, for example, an electronic component and a connecting means, are arranged in direct contact so as to be operatively connected to each other. For electrical connection, no additional means are required. By omitting the additional means, on the one hand, these means and the processes such as soldering and welding required for joining these means additionally can be reduced. Omitting the additional means and processes reduces the power loss, for example, the transition part between two components that causes inductance. The efficiency and lifespan of such a unit are improved, and the manufacturing cost and product cost are reduced.

[0025] By directly joining between the connecting means and the electronic component, these components of the electrical circuit can be arranged in one plane, thereby avoiding or minimizing the displacement in the vertical direction between individual components. The displacement of the electronic component with respect to the connecting means and the electrical connection of the electronic component via bonding wires or other wire - connecting means often cause electronic signal interference, and since electronic signal interference causes power loss, it should be avoided. The unit according to the present invention avoids these drawbacks.

[0026] In the module according to the present invention, in order to protect from external influences, a non - conductive compound, for example, a silicone compound as well - known in the prior art, may be poured in except for the contact means leading to the outside.

[0027] Depending on the use of the module, a mounting method known per se is selected. For example, an external power source is electrically connected to the contact member via fixing means such as soldering, clamping, clamping, screw fastening, etc. Plug-in connection can also be used.

[0028] Preferably, the electrically insulating support is a sintered ceramic. To manufacture a high-quality and long-life output module, aluminum oxide ceramic or aluminum nitride ceramic is extremely suitable. These are excellent in terms of their excellent thermal conductivity combined with electrically insulating properties.

[0029] For cooling the module, the support preferably has cooling means. These cooling means may be arranged, for example, in the form of fins for air cooling on the second plane of the support. In order to optimize the thermal coupling between the fins and the support, the fins are preferably integrally coupled to the support. In other words, the cooling means and the support form one component and are manufactured together. There is no separation line between the cooling means and the support.

[0030] The support may have at least one hollow chamber in the form of a passage. In this case, this passage forms a cooling means through which a fluid (gas, water, air, etc.) flows, whereby the module can be cooled. In this case, it is a fluid-cooled or fluid-cooled module.

[0031] The connecting means is preferably joined to the ceramic support via the AMB process (AMB method). Exactly this AMB process enables the ceramic support to be joined to connecting means having a material thickness greater than 0.3 mm and / or a load-reducing zone protruding or overhanging from the metallization region and / or the support. In this case, copper is joined to the ceramic, for example AlSiC, via a metal brazing alloy, i.e. an active solder, in a vacuum or inert gas atmosphere. Preferably, in the AMB method, work is carried out using a solder paste that can be compressed to 20 - 40 μm and thus wet the surface uniformly. It has been found that when the AMB method is applied carefully, no cavities or hollow chambers are formed between the ceramic and the connecting means. This enables a reliable and trustworthy connection to be created between the ceramic and the connecting means. The connection between the connecting means and the ceramic without a hollow chamber promotes heat transfer and thus heat dissipation by the cooling means. This significantly improves the cooling performance.

[0032] The connection of the electronic components in the module, for example Si / SiC chips, to the connecting means may be carried out by means of a strip using so-called "ribbon bonding".

[0033] The method according to the invention for manufacturing the module according to the invention is defined in the method claims 14This will be described based on the features described. This method relates to a module to which a voltage exceeding 1000 V and a current exceeding 100 A are applied via a supply line. An electrically insulating support is joined to connection means having a material thickness greater than 0.3 mm via a metallized region. Since the connection means is led out at least at one location laterally or at a predetermined angle beyond at least the metallized region and / or the support and has at least one contact member, the bonding process is no longer necessary at all for supplying power to the module from the outside. As a result, parasitic inductance is avoided. Additionally, the structural height of the high-power circuit is reduced or decreased. The arcuate extension of the bonding wire over the electronic component is no longer necessary. The connection means is connected to the power supply via the contact member.

[0034] Preferably, sintered ceramic is used as the electrically insulating support, and the connection means is fixed in position on the metallized region of the support by the AMB process or the AMB method. The advantages of the AMB method have already been described in detail in the description of the module according to the invention of the high-power circuit.

[0035] The present invention relates to an electronic high-power module or a plurality of such modules to which a voltage exceeding 1000 V and a current exceeding 100 A are applied via a supply line, comprising an electrically insulating support, on which connection means having a material thickness greater than 0.3 mm are fixed in position via a metallized region and electronic components are arranged, and the electronic components are electrically connected to the connection means as required.

[0036] The power supply is directly from the outside to the module, that is, the connection means, and thus the common bonding process in the prior art is omitted. In order to avoid the parasitic inductance in the power supply unit, in the present invention, the connection means is led out at least at one location laterally or at a predetermined angle and at least beyond the metallization region. In this protruding portion, it is not fixedly positioned on the support and has contact means for the supply line.

[0037] The present invention will be further described below with reference to the drawings. All the drawings include partial schematic views of the present invention and are used to illustrate the present invention by way of example. The special embodiments of the present invention may be different from these drawings. The illustration of the output module according to the present invention is schematic like a sketch.

Brief Description of the Drawings

[0038]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

[0039] Figure 1 shows a module 1 according to the invention, namely an output module, comprising a support 2 and connection means 3 having a height or material thickness of 0.3 mm or more, joined to the support 2 via a metallization region 4. The support 2 is a plate having dimensions of 7.5 inches × 5.5 inches in Figure 1. This ceramic plate is also called a substrate. A first electronic component 19, for example a chip, is directly joined to the support 2 via a metallization region 4 as well. This first electronic component 19 is connected to a second electronic component 20 by means of so-called bonding wires 21. The second electronic component 20 is directly arranged on the connection means 3 via the metallization region 4. The metallization region 4 denoted by reference numeral 4 includes contact locations in the form of a coating in this embodiment. Some of these contact locations are part of the connection means 3 and the others of these contact locations are part of the second electronic component 20. Thereby, the electronic component 20 is directly joined to the connection means 3 in a material-connecting (chemically bonding) manner without additional means (bonding wires 21). The support 2 shown in Figure 1 is a ceramic support 2 in the shape of a cuboid. This cuboid is defined by a first plane 5 and a second plane 6. The distance between these two planes 5 and 6 forms the height of the ceramic support 2. Laterally, the support 2 is defined by four side faces. In Figure 1, a first side face 7 and a second side face 8 are recognizable. The connection means 3 is defined by a first end 11 and a second end 12. The second end 12 of the connection means 3 is arranged inside a region formed by the side face of the support 2. The first end 11 of the connection means 3 is arranged at a distance from the support 2 and a metallization region 4 having a first end 23 and a second end 24. This distance is apparent as a protrusion 9 in Figure 1. In this case, the protrusion 9a has the length of the distance between the first end 11 of the connection means 3 and the first side face 7 of the support 2. The protrusion 9b has the length of the distance between the first end 11 of the connection means 3 and the first end 23 of the metallization region 4. Contact means 22 or a connection tongue 22 is provided at the first end 11 of the connection means 3. This contact means 22 is connected to a power supply (not shown).Thereby, current and voltage can be supplied to the output module. In order to be able to sufficiently cool the output module 1, the output module 1 has a plurality of cooling passages 14. In order to enable and improve heat dissipation, fluid can be guided through these cooling passages 14.

[0040] FIG. 2 shows a top view of a first plane 5 of the module 1 according to the invention shown in FIG. 1. The connecting means 3 joined to the support 2 via the metallization region 4 has five contact means 22. A space, that is, a gap, is provided between the individual contact means 22. The size of the space is such that no arcing occurs between two adjacent contact means 22 when a voltage is applied. The number, as well as the size and shape, of the contact means 22 depends on the received power of the module 1 and may be adapted to the received power. The region where the connecting means 3 protrudes from the support 2 is indicated by the protrusion 9. Additionally shown in FIG. 2 are the first and second electronic components 19, 20. The connection between the electronic components 19, 20 is suggested by the bonding wires 21. For the sake of clarity, only two bonding wires 21 are shown respectively. In reality, a number of these bonding wires 21 are used to connect between the electronic components. The second electronic component 20 is directly joined to the connecting means. In order to connect the second electronic component 20 to the connecting means 3, the bonding wires 21 are not necessary.

[0041] Figure 3 shows a particular embodiment of module 1 according to the present invention. In this case, both the first end 11 and the second end 12 of the connecting means 3 are located inside the region surrounded by the side surface of the support 2. The metallization region 4 is defined by a first end 23 and a second end 24. The surface of the connecting means 3 facing the support 2 is larger than the surface of the metallization region 4 that joins the connecting means 3 to the support 2. The protrusion 9 has a length corresponding to the distance between the first end 11 of the connecting means 3 and the first end 23 of the metallization region 4. The ceramic support 2 has cooling means 14 in the shape of fins. These cooling means 14 are components integrated into the support 2 and are integrally coupled to the support 2. There is no separation line whatsoever between the cooling means 14 and the support 2. The cooling means 14 are individual fins arranged at intervals from each other. Air can circulate in the space thus created, thereby increasing the cooling output.

[0042] In module 1 according to the present invention shown in Figure 4, the connecting means 3 has a load-relieving zone 15 provided with extension means 16 in the region of the protrusion 9. This load-relieving zone 15 is formed so as to counteract the expansion resulting from the power input to the module and the associated heat generation. Thereby, the lifespan of module 1 is extended. The load-relieving zone 15 shown in Figure 4 is the extension means 16 and consists of a plurality of rounded parts. The extension means 16 are formed to be flexible. The flexibility can be achieved by reducing the cross-section of these parts compared to the cross-section of the connecting means 3. Additionally, it is clear from Figure 4 the cooling means 14 in the form of cooling passages. These cooling means 14 shown in Figure 4 are shown by way of example and they are variable with respect to their arrangement, orientation, diameter, size and the shape of their extension depending on the application of module 1.

[0043] From FIGS. 5A, 5B, and 5C, the differently formed extension means 16 of the load reduction zone 15 are apparent. In this case, it is a flexible zone arranged in a mountain shape, formed in the shape of a recess as shown in FIG. 5A, or a triangle as shown in FIG. 5B, or a curved portion as shown in FIG. 5C. The extension means 16 may have a cross-section smaller than that of the connecting means 3, regardless of its shape, in order to enhance its flexibility. In FIG. 5C, it is clear that the height 18 or material thickness of the extension means 16 is smaller than the height 17 or material thickness of the connecting means 3. All these differently formed extension means 16 are commonly formed flexibly. The flexibility may be formed by the geometric shape or, for example, by a gradually decreasing cross-section.

[0044] FIG. 6 shows a perspective view of the module 1 according to the present invention. In this case, different cooling means 14a, 14b, 14c are arranged on the support 2. The support 2 has cooling means 14a in the form of the same cooling passage as shown in FIG. 4. Additionally, the support 2 has cooling means 14b the same as that shown in FIG. 3. This cooling means is integrally coupled to the support 2. Additionally, from FIG. 6, cooling means 14c coupled to the support 2 can be recognized. The cooling means 14c is an independent means coupled to the support 2 by a coupling technique known per se. Thus, a separation line 25 can be recognized between the cooling means 14c and the support 2. The different cooling means 14a, 14b, 14c shown in FIG. 6 may be arranged on the support 2 individually or in any arbitrary combination.

[0045] Additionally, from FIG. 6, a load reduction zone 15 is recognized. This load reduction zone 15 has extension means 16 formed differently. In this case, it is a plurality of recesses within the load reduction zone 15, thereby enhancing the flexibility of the load reduction zone. Each recess may be formed by a hole, a blind hole, or a cutout having an arbitrary shape, such as an elliptical cutout, or a cutout having a free shape. Any combination of the plurality of cutouts within the load reduction zone 15 that enhances the flexibility of this load reduction zone 15 is conceivable.

[0046] Although not shown in all the drawings, the high-power electronic circuit may be surrounded by a non-conductive encapsulating compound. In this case, only the contact means 22 protrudes from the encapsulating compound and is adapted to be connected to an external power supply unit.

Explanation of Reference Numerals

[0047] 1 module 2 support 3 connecting means 4 metallization region 5 The first plane of 2 6 The second plane of 2 7 The first side of 2 8 The second side of 2 9, 9a, 9b protrusion 11 The first end of 3 12 The second end of 3 14, 14a, 14b cooling means 15 load reduction zone 16 extension means 17 The height of 3 18 The height of 16 19 The first electronic component 20 The second electronic component 21 bonding wire 22 contact means 23 The first end of 4 24 The second end of 4 25 separation line

Claims

1. A module (1) to which a voltage exceeding 1000 V and a current exceeding 100 A are applied via a supply line, - an electrically insulating support (2), - connecting means (3) having a material thickness greater than 0.3 mm, joined to the support (2) via a metallized region (4) defined by a first end (23) and a second end (24), - electronic components (19, 20) electrically connected to the connecting means (3) as required, and - cooling means (14) having, The connecting means (3), preferably copper, protrudes beyond one end (23, 24) of the metallized region (4) at least at one location. In this protruding region (9), the connecting means (3) is not fixed in position on the support (2) and has contact means (22). At least one electronic component (20) is joined to the connecting means (3) via the metallized region (4), The surface of the connecting means (3) facing the support (2) is larger than the surface of the metallized region (4) joining the connecting means (3) to the support (2), thereby creating a protrusion (9), In the region of the protrusion (9), the connecting means (3) is supported on the support (2) and slides on the support (2) during thermal expansion, module (1).

2. The module (1) according to claim 1, wherein both the first end (11) and the second end (12) of the connecting means (3) are located inside the region surrounded by the side surface of the support (2).

3. The module according to claim 1 or 2, wherein 33% of the base surface of the connecting means (3) is arranged outside the metallized region (4) to form the protrusion (9) with respect to the support (2).

4. The connecting means (3) and at least one of the electronic components (20) are arranged on a first plane (5) of the support (2), and the cooling means (14) is arranged on a second plane (6) of the support (2). The module according to any one of claims 1 to 3.

5. The module according to any one of claims 1 to 4, wherein the support (2) is defined by a plurality of side surfaces, and the connecting means (3) protrudes from at least one side surface (7) of the support (2).

6. The module according to any one of claims 1 to 5, wherein the connecting means (3) has at least one heat load reduction zone (15).

7. The module according to claim 6, wherein at least one of the heat load reduction zones (15) is arranged outside the support (2), preferably immediately adjacent to the support (2).

8. The module according to claim 6 or 7, wherein at least one of the heat load reduction zones (15) has expansion means (16).

9. The module according to claim 8, wherein the cross-section of the expansion means (16) is smaller than the cross-section of the connecting means (3).

10. The module according to claim 8 or 9, wherein the expansion means (16) is formed by an opening or a material cutout.

11. The module according to any one of claims 1 to 10, wherein the electrically insulating support (2) is a sintered ceramic.

12. The module according to any one of claims 1 to 11, wherein the cooling means (14) of the support (2) is formed by fins.

13. The module according to claim 12, wherein the cooling means (14) formed as fins is integrally joined to the support (2) without a separation line.

14. The module according to any one of claims 1 to 11, wherein the cooling means (14) of the support (2) is formed by a hollow chamber.

15. The module according to any one of claims 1 to 14, wherein the connecting means (3) is joined to the support (2) by material connection by an AMB process.

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