Laser processing device

Abstract

To provide a laser processing device that can process even a work-piece with a large dimension quickly with high accuracy.SOLUTION: The laser processing device comprises a first moving part, a second moving part that is movably supported by the first moving part, and a laser emitting part that is movably supported by the second moving part. A first maximum movement distance of the second moving part by the first moving part is longer than a second maximum movement distance of the laser emitting part by the second moving part. The first moving part can move the second moving part in both of a first direction and a second direction orthogonal to the first direction. The second moving part can move the laser emitting part in both of the first direction and the second direction. While the laser emitting part emits a laser beam to process a work-piece, the first moving part stops moving the second moving part but the second moving part moves the laser emitting part.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a laser processing apparatus and a laser processing method suitable for processing composite materials.

Background Art

[0002] Fiber Reinforced Plastics (FRP) are lightweight yet strong, and are thus used, for example, in aircraft fuselages. As representative examples of FRP, Glass Fiber Reinforced Plastics (GFRP) and Carbon Fiber Reinforced Plastics (CFRP) are known.

[0003] Laser light is irradiated to perform processing such as cutting a member made of fiber reinforced plastic. For example, Patent Document 1 discloses a laser processing apparatus for composite materials that can achieve high speed and high precision. Patent Document 1 provides two laser oscillation means: a primary laser oscillation means for providing a primary laser beam and a secondary laser oscillation means for providing a secondary laser beam. When irradiating the primary laser beam, the primary laser beam is irradiated while moving within the width of the cutting essential part under high-speed conditions. Further, when irradiating the secondary laser beam, the part irradiated with the primary laser beam is irradiated with the secondary laser beam.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The laser processing apparatus of Patent Document 1 includes a work station on which a work to be processed by laser light is placed. In the laser processing apparatus of Patent Document 1, the positions of the primary laser oscillation means and the secondary laser oscillation means are fixed, and when processing a work, the relative position of the work to the laser emission means is moved by operating the work station.

[0006] The method of operating the work station for processing is applicable when the work is small, but is unsuitable for large works. For example, a work related to an aircraft can have a total length of several tens of meters. In addition to the fact that the work station on which this work is placed becomes large in its own dimensions, a space for operating the work station is also required. Also, in a large work station, the accuracy and speed of movement are inferior. From the above, an object of the present disclosure is to provide a laser processing apparatus and a laser processing method capable of quickly processing a work with large dimensions with high accuracy.

Means for Solving the Problems

[0007] The laser processing apparatus of the present disclosure includes a first moving part, a second moving part movably supported by the first moving part, and a laser emission part movably supported by the second moving part. The first maximum moving distance of the second moving part by the first moving part is longer than the second maximum moving distance of the laser emission part by the second moving part. The first moving part can move the second moving part in both a first direction and a second direction orthogonal to the first direction, and the second moving part can move the laser emission part in both the first direction and the second direction. The first maximum moving distance is longer than the second maximum moving distance in both the first direction and the second direction. While the laser light is being emitted from the laser emission part to process the work, the movement of the second moving part by the first moving part is stopped, but the laser emission part is moved by the second moving part.

[0008] The laser processing method of the present disclosure performs processing by irradiating laser light from a laser head along a predetermined processing path and in order on a processing area divided into a plurality of parts along the processing path. This laser processing method includes a processing step of processing a preceding processing area while the laser head moves, and a range movement step of moving the laser head for processing a subsequent processing area after finishing the processing of the preceding processing area, and these steps are repeated.

Advantages of the Invention

[0009] According to the laser processing apparatus of the present disclosure, by providing the first moving part with the longest maximum moving distance, it is possible to process the entire area of a large-sized workpiece without omission. Further, according to the laser processing apparatus of the present disclosure, since the second moving part with the shortest maximum moving distance supports the laser head, high-precision processing can be performed quickly. According to the laser processing method of the present disclosure, high-precision processing can be performed quickly in the processing step, and by repeatedly performing the area movement step, it is possible to process the entire area of a large-sized workpiece without omission.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0011] Hereinafter, the laser processing apparatus 1 according to the embodiment will be described with reference to the accompanying drawings. All the following descriptions are examples in the present disclosure.

[0012] [Overall Configuration of Laser Processing Apparatus 1: Refer to FIG. 1] As shown in FIG. 1, the laser processing apparatus 1 includes a first moving part 10, a second moving part 30 supported by the first moving part 10, and a laser emitting part 50 supported by the second moving part 30. When processing a large-sized workpiece W, when processing each of the processing regions (CA1 to CAn) divided into a plurality, the second moving part 30 is moved, and when shifting from the previously processed processing region (CAn) to the subsequent processing region (CAn+1), the first moving part 10 is operated. Since the maximum moving distance of the second moving part 30 during laser processing can be short, high-precision processing can be performed quickly. Also, since the maximum moving distance of the first moving part 10 is long, even for a large-sized workpiece W, the entire area can be processed without moving the workpiece W. Hereinafter, the details will be described in the order of the first moving part 10, the second moving part 30, and the laser emitting part 50. In the laser processing apparatus 1, as shown in FIG. 1, the longitudinal direction X, the width direction Y, and the height direction Z are defined. Also, in the present disclosure, the maximum moving distance refers to the distance that can be moved derived from the mechanical specifications. Also, when simply referring to the moving distance, it is the distance actually moved for laser processing and is within the range of the maximum moving distance.

[0013] [First Moving Part 10: Refer to FIG. 1] The first moving part 10 has a maximum moving distance that can accommodate the processing of a large workpiece W with a total length of, for example, 20 to 30 m. However, in the process of processing the workpiece W, the first moving part 10 does not move the entire maximum moving distance at once, but only moves the moving distance required to move the adjacent processing areas (CAn → CAn+1). Summing up the moving distances within the processing areas (CA1 to CAn) may reach the maximum moving distance. The first moving part 10 is configured such that the moving frame 11 can move in the longitudinal direction X and the width direction Y.

[0014] The first moving part 10 includes a gantry-shaped moving frame 11 when viewed from the front, and a base 15 whose position for supporting the moving frame 11 is fixed. The moving frame 11 includes a pair of column legs 12A, 12B provided at intervals in the width direction Y, and a beam member 13 supported at both ends by the upper ends of the column legs 12A, 12B. For example, each of the column legs 12A, 12B is provided with rollers at its lower end that rotate to travel on a pair of rails corresponding to the column legs 12A, 12B provided on the base 15. Also, for example, each of the column legs 12A, 12B is provided with a mover of a linear motor corresponding to the linear stator of a pair of linear motors corresponding to the column legs 12A, 12B provided on the base 15 at its lower end. The beam member 13 supports the second moving part 30. Therefore, the second moving part 30 is moved in the longitudinal direction X and the width direction Y as the first moving part 10 moves.

[0015] The moving frame 11 is capable of reciprocating within a range of a maximum moving distance L1X in the longitudinal direction X. This reciprocating movement is realized by known means such as rotating rollers and linear motors provided on the aforementioned column feet 12A and 12B along a linear trajectory. The portion of the moving frame 11 that supports the laser emitting portion 50 of the beam member 13 is capable of reciprocating within a range of a maximum moving distance L1Y (<L1X) in the width direction Y. This reciprocating movement is also realized by known means. The maximum moving distance L1X and the maximum moving distance L1Y exceed the dimensions of the workpiece W in the longitudinal direction X and the width direction Y placed on the base 15, and the first moving portion 10 has a maximum moving distance sufficient to process the entire area of the workpiece W. However, the moving frame 11 stops without moving while irradiating the workpiece W with laser light for processing.

[0016] [Second moving portion 30: Refer to FIGS. 1 and 2] The second moving portion 30 is capable of moving in the longitudinal direction X and the width direction Y while being supported by the beam member 13 of the first moving portion 10. The second moving portion 30 moves during the process of irradiating the workpiece W with laser light for processing. As shown in FIGS. 1 and 2, the second moving portion 30 includes a spindle 31 that supports the laser head 51 and a two-dimensional stage 33 that supports the spindle 31. The spindle 31 is rotatable around the axis C by appropriate means, and the laser head 51 supported by the spindle 31 is also capable of rotating forward and backward around the axis C by appropriate means. The two-dimensional stage 33 includes, for example, a first moving body 33A capable of reciprocating in the longitudinal direction X and a second moving body 33B capable of reciprocating in the width direction Y.

[0017] The spindle 31 is not limited to only rotating around the axis C and can be made into a vertically articulated robot that typically has six degrees of freedom. The first moving body 33A and the second moving body 33B are each movable by a linear motor as an example. A mover is provided on the side of the first moving body 33A, and a stator for this mover is provided on the side of the second moving body 33B. Also, a mover is provided on the side of the second moving body 33B, and a stator for this mover is provided on the side of the first moving body 33A. In this way, the first moving body 33A and the second moving body 33B can move relative to each other.

[0018] During the process of machining the work W, one or both of the first moving body 33A and the second moving body 33B move. As shown in the front view (FV) and side view (SV) of FIG. 2, the first moving body 33A is movable in the longitudinal direction X within a range of distance L3X, and the second moving body 33B is movable in the width direction Y within a range of distance L3Y.

[0019] As the distances L1X, L1Y, L3X, and L3Y have the following relationship, the maximum moving distance of the first moving part 10 is longer than that of the second moving part 30, and conversely, the maximum moving distance of the second moving part 30 is shorter than that of the first moving part 10. As an example, the maximum moving distance of the first moving part 10 reaches several tens of m, for example, 30 m, but the maximum moving distance of the second moving part 30 is several m, for example, about 2 m. Distance L1X > Distance L3X Distance L1Y > Distance L3Y

[0020] [Laser emitting unit 50; see FIGS. 1 and 2] Next, the laser emitting unit 50 includes a laser head 51 that emits laser light for machining the work W, and a collector 53 that collects scattered matter generated during machining by the laser light.

[0021] Regarding the laser head 51, its type is not limited as long as it can machine the work W. However, the dimensions of the work W to be machined by the laser processing apparatus 1 are large, and the thickness for cutting the work W cited as an example of machining is also large. Therefore, it is preferable to apply a single-mode fiber laser with high output as the laser head 51.

[0022] When the work W is laser processed, dust and smoke such as fume and spatter are generated from the processed part. In the present disclosure, these dust and smoke generated from the processed part are collectively referred to as flying objects. Since the flying objects are an obstacle to the irradiation of the laser beam on the work W, it is desirable to collect them from the processed part. Therefore, as a preferable element of the laser emitting unit 50, a scavenging recovery device 53 is provided. Here, scavenging means performing both air supply and exhaust to collect flying objects. That is, as an example, the recovery device 53 includes an air supply nozzle 53A that supplies scavenging gas such as air and inert gas to the processed part, and an exhaust duct 53B that discharges the scavenging gas containing flying objects from the processed part. In a preferred form, the laser processing apparatus 1 continuously supplies scavenging gas from the air supply nozzle 53A and continuously discharges the scavenging gas containing flying objects from the exhaust duct 53B while processing the work W. Although it is a preferred form to include both the air supply nozzle 53A and the exhaust duct 53B, if the flying objects can be removed from the processed part, only one of the air supply nozzle 53A and the exhaust duct 53B can also be used.

[0023] Each of the air supply nozzle 53A and the exhaust duct 53B of the recovery machine 53 is fixed to the laser head 51 via support arms 55A and 55B that constitute a support, and is rotated together with the laser head 51 as the spindle 31 rotates. The air supply nozzle 53A supported by the support arm 55A and the exhaust port 54B of the exhaust duct 53B supported by the support arm 55B are provided to face each other in a region where the workpiece W will be irradiated with laser light. While machining the workpiece W, the air supply nozzle 53A and the exhaust duct 53B move together with the laser head 51. At this time, considering the scavenging efficiency, as shown in FIG. 2, it is desirable to place the air supply nozzle 53A on the front side (F) before movement and the exhaust duct 53B on the reverse rear side (R). If the air supply nozzle 53A is placed on the front side (F) before movement, the flow of the scavenging gas follows the relative atmospheric flow due to the movement, so it can enter the exhaust duct 53B with almost no reverse resistance. This front and back is based on the premise that the second moving part 30 is moving to the left in the drawing of the white arrow in FIG. 2. If the second moving part 30 is moving to the right in the drawing of the white arrow in FIG. 2, the front side (F) replaces the rear side (R), and the rear side (R) replaces the front side (F).

[0024] [Processing procedure: Refer to FIGS. 3 and 4] Next, with reference to FIGS. 3 and 4, a procedure for processing the workpiece W using the laser processing apparatus 1 will be described. The workpiece W used in the description is made of a composite material having a rectangular shape in plan view as an example. Processing for cutting the workpiece W is performed along the rectangular processing path CT indicated by the broken line of the workpiece W. The workpiece W has a thickness, for example, 20 mm, which cannot be cut by irradiating the laser beam emitted from the laser head 51 only once, not to mention the dimensions in plan view. Note that FIGS. 3 and 4 are prepared only for explaining the processing procedure, and the dimensions of the workpiece W and the moving distance of the laser head 51 shown in FIGS. 3 and 4 are arbitrary. In FIGS. 3 and 4, the processing procedure proceeds in the order of STEP1, STEP2,.... Further, the processing procedure divides the processing path CT into eight first regions CA1 to CA8, and sequentially executes cutting of the first region CA1, cutting of the second region CA2,... cutting of the eighth region CA8.

[0025] [FIG. 3 STEP1 Cutting of the First Region CA1] First, the first region CA1 is cut (FIG. 3 STEP1). When cutting the first region CA1, the moving frame 11 of the first moving unit 10 stops at a position corresponding to the first region CA1, for example, an intermediate point MP1 corresponding to the first region CA1. On the other hand, the second moving unit 30 reciprocates while cutting the workpiece W. This reciprocating movement indicates that the laser head 51 also reciprocates. In FIG. 3, the solid arrows indicate that this reciprocating movement is being performed. In STEP1, the upward arrow indicates the forward path of one pass, and the downward arrow indicates the return path of one pass. Note that these arrows indicate the movement itself, but not the position of the movement. In FIG. 3, the thick solid line drawn on the processing path CT represents that the first region CA1 of the workpiece W has been cut by the reciprocating movement of the laser head 51. The cutting of the first region CA1 starts from the start point SP. As an example, after reciprocating the forward path toward the second region CA2 and its reverse return path twice, it ends by moving the forward path. That is, while the laser head 51 moves for five passes, this reciprocating movement is performed by operating the two-dimensional stage 33 of the second moving unit 30.

[0026] While cutting the first region CA1, the orientation of the recovery machine 53 is determined such that the air supply nozzle 53A and the exhaust duct 53B are along the processing path CT. And, as described above, the air supply nozzle 53A is placed on the front side and the exhaust duct 53B is placed on the rear side. However, since the laser head 51 reciprocates, as the movement of the laser head 51 is reversed, the main shaft 31 is rotated by 180 degrees, and the arrangement of the air supply nozzle 53A and the exhaust duct 53B is changed. This also applies to the second region CA2 in the same way.

[0027] [Figure 3 STEP2 Cutting of the second region CA2] When the cutting of the first region CA1 is completed, the process proceeds to the cutting of the second region CA2 (Figure 3 STEP2). Along with this transition, the moving frame 11 of the first moving part 10 moves to a position corresponding to the second region CA2, for example, to the intermediate point MP2 corresponding to the second region CA2 and stops. During this time, the second moving part 30 and the laser emitting part 50 are stopped. Also in the second region CA2, while the laser head 51 irradiates the second region CA2 of the processing path CT with laser light, by operating the two-dimensional stage 33 of the second moving part 30, the second region CA2 is reciprocated 2.5 times to complete the cutting.

[0028] [Figure 3 STEP3 Cutting of the third region CA3] When the cutting of the second region CA2 is completed, the process proceeds to the cutting of the third region CA3 (Figure 3 STEP3). Since the third region CA3 is orthogonal to the preceding first region CA1 and second region CA2, the main shaft 31 is rotated by 90 degrees, and the orientation of the air supply nozzle 53A and the exhaust duct 53B of the recovery machine 53 in particular of the laser emitting part 50 is changed. Also at this time, the air supply nozzle 53A is placed on the front side and the exhaust duct 53B is placed on the rear side.

[0029] Also in the third region CA3, while the laser head 51 irradiates the third region CA3 of the processing path CT with laser light, by operating the two-dimensional stage 33 of the second moving part 30, the third region CA3 is reciprocated 2.5 times to complete the cutting.

[0030] [Cutting of the Fourth Region CA4 in FIG. 3, Step 4] When the cutting of the third region CA3 is completed, the process proceeds to the cutting of the fourth region CA4. Along with this transition, the moving frame 11 of the first moving unit 10 moves to a position corresponding to the fourth region CA4, for example, to an intermediate point MP2 corresponding to the second region CA2, and stops. During this period, the second moving unit 30 and the laser emission unit 50 are stopped. Also in the fourth region CA4, while the laser head 51 irradiates the fourth region CA4 of the processing path CT with laser light, the two-dimensional stage 33 of the second moving unit 30 is operated to reciprocate the fourth region CA4 2.5 times to complete the cutting.

[0031] [FIG. 4, Steps 5 to 8] Up to this point, half of the distance of the processing path CT has been cut. Thereafter, as shown in FIG. 4, by performing the same procedure as before, the entire area of the processing path CT can be cut. In the above embodiment, as an example, the distances of the regions CA1, CA2, CA5, and CA6 are the same, and the distances of the regions CA3, CA4, CA7, and CA8 are also the same. However, in the present disclosure, the distances of the processing regions that divide the processing path CT are arbitrary according to the shape including the dimensions of the workpiece W. Also, in the above embodiment, an example where the thickness of the workpiece W is constant is shown. However, in the present disclosure, it is also possible to process a workpiece W whose thickness changes in the processing region. In this case, the number of reciprocations of the laser head 51 is adjusted such that the number of reciprocations is increased in the thick processing region and decreased in the thin processing region.

[0032] [Control Procedure: FIG. 5] Next, with reference to FIG. 5, an example of the control procedure for cutting the workpiece W using the laser processing apparatus 1 will be described. The laser processing apparatus 1 includes a controller 100 that controls the operations of the first moving unit 10, the second moving unit 30, and the laser emitting unit 50. The following control procedure is performed by this controller 100. Note that the following description follows the cutting procedure of the workpiece W described with reference to FIGS. 3 and 4.

[0033] The control procedure starts with the controller 100 inputting the shape (including dimensions) for cutting the workpiece W (FIG. 5 S100). The following control is executed based on the input cutting shape. The input cutting shape defines the processing path CT shown in FIGS. 3 and 4. Based on the defined processing path CT, the controller 100 adjusts the zero point of the first moving unit 10 and also adjusts the zero point of the second moving unit 30 (FIG. 5 S200, S300). The first moving unit 10 and the second moving unit 30 perform the movements necessary for cutting according to the instructions from the controller 100 with reference to the zero point.

[0034] After adjusting the zero points of the first moving unit 10 and the second moving unit 30, the controller 100 divides the processing path CT into the first region CA1 to the eighth region CA8 and sets the position information necessary for the first moving unit 10 and the second moving unit 30 to move (FIG. 5 S101). The position information is two-dimensional (xn, yn) information for a flat workpiece W and three-dimensional (xn, yn, zn) information for a workpiece W with undulations. This position information includes the starting point SP where the cutting process starts and the ending point EP where the cutting ends. Note that in the processing examples shown in FIGS. 3 and 4, the starting point SP and the ending point EP coincide, but there may be cases where the starting point SP and the ending point EP are different. After setting the position information, the controller 100 drives the first moving unit 10, the second moving unit 30, and the laser emitting unit 50 to execute the cutting. Specifically, it is as follows.

[0035] First, the controller 100 instructs the drive source of the first moving part 10 to move the first moving part 10 to the position corresponding to the starting point SP (Fig. 5 S201). If the first moving part 10 has moved to the starting point SP, the controller 100 instructs the second moving part 30 and the laser emitting part 50 to operate, and the actual cutting process is performed according to the following procedure.

[0036] Prior to the actual processing with the laser beam, the controller 100 activates the air system consisting of a blower, a suction machine, etc. so that the flying debris can be scavenged (Fig. 5 S301). Next, the controller 100 activates the laser light source to emit laser light from the laser head 51, and by operating the second moving part 30, the laser head 51 is moved along the forward path of the first pass in the first area CA1 while processing the forward path (Fig. 5 S303). When the laser head 51 has moved and processed to the end point of the forward path, the operation of the second moving part 30 and the emission of laser light from the laser head 51 are temporarily stopped, and during that time, the laser head 51 is rotated by 180 degrees together with the air supply nozzle 53A and the exhaust duct 53B (Fig. 5 S305). This rotation of the laser head 51 prepares for the cutting process of the return path of the first pass. Then, the controller 100 activates the laser light source to emit laser light from the laser head 51, and by operating the second moving part 30, the laser head 51 is moved along the return path of the first pass in the first area CA1 while processing the return path (Fig. 5 S307).

[0037] When the laser head 51 has moved and processed to the end point of the return path, the operation of the second moving part 30 and the emission of laser light from the laser head 51 are temporarily stopped, and during that time, the laser head 51 is rotated by 180 degrees together with the air supply nozzle 53A and the exhaust duct 53B (Fig. 5 S309). This prepares for the cutting process of the forward path of the next pass. However, here, instead of immediately starting the cutting process of the forward path of the next pass, it is determined whether all the processing of a plurality of preset passes has been completed (Fig. 5 S311).

[0038] If the machining of all paths has not been completed (No in FIG. 5 S311), start the machining of the forward path of the next path and repeat the above procedure (FIG. 5 S303 to S309). If the machining of all paths has been completed (Yes in FIG. 5 S311), the controller 100 stops the air system and the laser (FIG. 5 S313), and then determines whether the machining of all preset machining areas, that is, taking FIGS. 3 and 4 as examples, from the first area CA1 to the eighth area CA8 has been completed (FIG. 5 S315). If the machining of all the set areas has been completed (Yes in FIG. 5 S315), stop the movement of the second moving part 30 and the first moving part 10, and end the machining of the workpiece W (S317, S203). If the machining of all the set areas has not been completed (No in FIG. 5 S315), move the second moving part 30 and the first moving part 10 to the machining start point of the next area, for example, the second area CA2, and then repeat the above machining procedure (FIG. 5 S303 to S309).

[0039] [Effects achieved by the laser processing apparatus 1] According to the laser processing apparatus 1, since the first moving part 10 having the longest maximum moving distance is provided, even a large-sized workpiece W can be machined over its entire area. Further, according to the laser processing apparatus of the present disclosure, since the second moving part 30 having the shortest maximum moving distance supports the laser head 51, high-precision machining can be performed quickly.

[0040] [Posture of the laser head 51: FIG. 6] In the embodiment described above, since the workpiece W to be cut is along the horizontal direction, the posture of the laser head 51 is along the vertical direction. However, the laser head 51 can be tilted in the vertical direction for cutting. The posture of the laser head 51 can be changed because the main shaft 31 has multiple joints. For example, FIG. 6 shows two examples of processing a workpiece W having an L-shaped cross section with a vertical portion WV along the vertical direction and a horizontal portion WH along the horizontal direction. The two examples differ in whether the vertical portion WV is on the left or right side of the drawing. Here, as an example, assuming that the boundary BO between the vertical portion WV and the horizontal portion WH is to be cut, the laser head 51 is tilted so that the laser beam LB is irradiated on the boundary BO. The air supply nozzle 53A and the exhaust duct 53B are arranged above the boundary BO to be cut so that the scavenging gas is blown downward from above, and the air supply nozzle 53A is arranged above the exhaust duct 53B. By arranging them in this way, the scavenging efficiency will not decrease.

[0041] Here, an example of cutting the boundary BO between the vertical portion WV and the horizontal portion WH is shown. However, for example, if the laser head 51 is arranged along the horizontal direction, the vertical portion WV can also be cut.

[0042] [Direction of the recovery device 53: FIG. 7] Next, the direction of the recovery device 53 when the laser head 51 moves while changing its direction for cutting will be described with reference to FIG. 7. The direction in which the laser head 51 moves is indicated by the solid arrow. When cutting the workpiece W along the processing path CT shown in FIG. 7, it is necessary to change the direction in which the laser head 51 moves at points B, C, D, and E after starting from point A. This change in direction can be achieved by operating the first moving body 33A and the second moving body 33B of the two-dimensional stage 33 in combination. Here, in order to perform scavenging efficiently, the intake nozzle 53A and the exhaust duct 53B should be arranged along the respective sections of the machining path CT. In addition, it is preferable that the intake nozzle 53A supplies air from the front side (F) of the laser head 51. As described above, the intake nozzle 53A and the exhaust duct 53B face each other with the laser head 51 interposed therebetween and are fixed to the laser head 51. Therefore, as shown in the lower part of FIG. 7, by rotating the laser head 51, the intake nozzle 53A and the exhaust duct 53B can be adjusted to be parallel to the machining path CT. With this arrangement, compared with the case where the scavenging gas is blown obliquely, the force with which the scavenging gas is blown can be utilized to the maximum extent, so that high scavenging efficiency can be obtained. Note that the description of the exhaust duct 53B is omitted in FIG. 7.

[0043] [Appendix] [Appendix 1] The laser processing apparatus (1) includes a first moving part (10), a second moving part (30) movably supported by the first moving part (10), and a laser emitting part (50) movably supported by the second moving part (30). The first maximum moving distances (L1X, L1Y) of the second moving part (30) by the first moving part (10) are longer than the second maximum moving distances (L3X, L3Y) of the laser emitting part (50) by the second moving part (30).

[0044] In the laser processing apparatus (1), the first moving part (10) can move the second moving part (30) in both a first direction (X) and a second direction (Y) orthogonal to the first direction. The second moving part (30) can move the laser emitting part (50) in both the first direction (X) and the second direction (Y). The first maximum moving distances (L1X, L1Y) are longer than the second maximum moving distances (L3X, L3Y) in both the first direction (X) and the second direction (Y). According to the laser processing apparatus (1) having this configuration, since both the first moving part (10) and the second moving part (30) can move in both the first direction (X) and the second direction (Y) orthogonal to the first direction (X), machining corresponding to a complex machining path (CT) is possible.

[0045] While the laser beam is emitted from the laser emitting unit (50) to process the workpiece (W), the movement of the second moving unit (30) by the first moving unit (10) is stopped, but the laser emitting unit (50) is moved by the second moving unit (30). According to the laser processing apparatus (1) having this configuration, when actual processing is performed, only the second moving unit (30) is moved, so the control for movement can be simplified compared to moving the first moving unit (10) as well.

[0046] <Appendix 2> In Appendix 1, preferably, the movement of the laser emitting unit (50) by the second moving unit (30) is performed along a predetermined processing path (CT), and processing is sequentially performed while the laser emitting unit (50) is moved by the second moving unit (30) for each of a plurality of regions (CA1 to CA8) into which the processing path (CT) is divided. Since the maximum movement distance of the laser emitting unit (50) by the second moving unit (30) is short, the processing path (CT) is divided into a plurality of regions (CA1 to CA8) so that the movement distance is below this short maximum possible distance.

[0047] <Appendix 3> In Appendix 2, preferably, for each of the plurality of regions (CA1 to CA8), processing is performed while the laser emitting unit (50) reciprocates. By reciprocating the laser emitting unit (50), even a thick workpiece W can be cut.

[0048] <Appendix 4> In Appendix 2 or Appendix 3, preferably, when shifting to the processing of the subsequent region (CA2) after finishing the processing of the preceding region (CA1), the second moving unit (30) is moved by the first moving unit (10) from the position corresponding to the preceding region (CA1) to the position corresponding to the subsequent region (CA2). There may be a case where the distance from the position corresponding to the preceding region (CA1) to the position corresponding to the subsequent region (CA2) is long, and considering further moving to the position corresponding to the subsequent region (CA3), it is preferable that the movement between regions is performed by the first moving unit having the longest maximum movement distance.

[0049] <Appendix 5> In any one of Appendices 1 to 4, preferably, the laser emission unit (50) includes a laser head (51) that emits laser light, and a collector (53) for collecting scattered matter generated by irradiating the workpiece (W) with the laser light. By providing the collector (53) for scattered matter, the processing performance by laser light irradiation can be stably obtained.

[0050] <Appendix 6> In Appendix 5, a preferable collector (53) includes an air supply nozzle (53A) that supplies scavenging gas, and an exhaust duct (53B) that is disposed opposite to the air supply nozzle (53A) with the laser head (51) interposed therebetween. The air supply nozzle (53A) is disposed on the front side (F) where the laser head (51) moves, and the exhaust duct (53B) is disposed on the rear side (R). By disposing the air supply nozzle (53A) on the front side of the exhaust duct (53B), the flow of the scavenging gas follows the flow of the relative atmosphere due to the movement, so that it can enter the exhaust duct 53B with almost no reverse resistance. That is, the efficiency of scavenging recovery is high.

[0051] <Appendix 7> In Appendix 6, when processing the processing path (CT) along the vertical direction while moving upward in the vertical direction, the preferable air supply nozzle (53A) and exhaust duct (53B) are disposed with the air supply nozzle (53A) above the exhaust duct (53B). By arranging and processing in this way, the scavenging gas can be blown downward in the vertical direction along the gravity, so that it is possible to prevent the scavenging efficiency from dropping.

[0052] <Appendix 8> In Appendix 6, the preferable air supply nozzle (53A) and the exhaust duct (53B) are rotatably provided around the laser head (51) so as to be disposed parallel to the processing path (CT) whose direction changes. By arranging and processing in this way, the force with which the scavenging gas is blown can be maximally utilized, so that a high scavenging efficiency can be obtained.

[0053] <Appendix 9> The present disclosure provides a processing method in which laser light is irradiated from a laser head (51) in order along a predetermined processing path (CT) and in regions (CA1 to CA8) into which the processing path (CT) is divided into a plurality of sections. This processing method includes a processing step of processing a preceding region (CA1) while the laser head (51) moves, and a region movement step of moving the laser head (51) for processing a subsequent region (CA2) after the processing of the preceding region (CA1) is completed, and these steps are repeated. According to the processing method of the present disclosure, highly accurate processing can be quickly performed in the processing step, and even a large-sized workpiece (W) can be processed over its entire area by repeatedly performing the region movement step.

[0054] In addition to the above, it is possible to select and discard the configurations described in the above embodiments or appropriately modify them to other configurations.

Explanation of Reference Numerals

[0055] 1 Laser processing apparatus 10 First moving part 11 Moving frame 12A, 12B Column feet 13 Beam member 15 Base 30 Second moving part 31 Spindle 33 Two-dimensional stage 33A First moving body 33B Second moving body 50 Laser emission part 51 Laser head 53 Collector 53A Air supply nozzle 53B Exhaust duct 54A Air supply port 54B Exhaust port 55A Support Arm 55B Support Arm 100 Controller CT Machining Path SP Starting Point EP End Point L1X, L1Y Maximum Travel Distance L3X, L3Y Maximum Travel Distance LB Laser Beam MP1, MP2 Intermediate Point W Workpiece WH Horizontal Portion WV Vertical Portion X Longitudinal Direction Y Width Direction Z Height Direction

Claims

1. A first moving part, a second moving part movably supported by the first moving part, and a laser emitting part movably supported by the second moving part, wherein a first maximum moving distance of the second moving part by the first moving part is longer than a second maximum moving distance of the laser emitting part by the second moving part, the first moving part is movable in both a first direction and a second direction orthogonal to the first direction, the second moving part is movable in both the first direction and the second direction with respect to the laser emitting part, the first maximum moving distance is longer than the second maximum moving distance in both the first direction and the second direction, while the laser emitting part emits laser light to process a workpiece, movement of the second moving part by the first moving part is stopped, but the laser emitting part is moved by the second moving part, the laser emitting part includes a laser head that emits laser light, and a collector for collecting scattered matter generated by irradiation of the workpiece with the laser light, the collector includes an air supply nozzle that supplies scavenging gas, and an exhaust duct disposed opposite to the air supply nozzle with the laser head interposed therebetween, the air supply nozzle is disposed on the front side where the laser head moves, the exhaust duct is disposed on the rear side, the air supply nozzle and the exhaust duct are rotatably provided about the laser head so as to be disposed in parallel with a machining path whose predetermined direction changes, a laser processing apparatus.

2. Movement of the laser emitting part by the second moving part is performed along a predetermined machining path, and machining is sequentially performed while the laser emitting part is moved by the second moving part for each of a plurality of machining regions into which the machining path is divided, The laser processing apparatus according to Claim 1.

3. For each of the plurality of machining regions, the laser emitting part reciprocates while machining, The laser processing apparatus according to Claim 2.

4. After finishing machining of a preceding machining region and when shifting to machining of a subsequent machining region, the second moving part is moved by the first moving part from a position corresponding to the preceding machining region to a position corresponding to the subsequent machining region, The laser processing apparatus according to Claim 3.

5. The air supply nozzle and the exhaust duct when machining a predetermined machining path along the vertical direction while moving upward in the vertical direction, The supply air nozzle is disposed above the exhaust duct. The laser processing apparatus according to claim 1.

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