Component assembly device

Abstract

To solve such a problem that in a conventional component assembly device, high accuracy has been required for positioning an assembly object component.SOLUTION: A component assembly device has: a holding part 31 at one end of which an adsorption face is provided; a guide part 32 which so grips a side face of the holding part 31 as to be slidable in a direction in which the holding part 31 is orthogonal to the adsorption face; and a slide control part 33 which slides the adsorption face of the holding part 31 between a first state that the same is further buried with respect to an end of the guide part 32 and a second state that the same further projects with respect to an end of a guide part 42. The holding part 41 has: a first opening which is provided in the adsorption face, and gives adsorption power to a component by air stream in a suction direction; a second opening which is provided in the side face of the holding part 41, and sucks air stream in the suction direction; and an air stream control structure which so makes that adsorption power given to the component by the first opening becomes smaller in the second state compared to the first state and the air stream sucked from the second opening becomes larger in the second state compared to the first state.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to, for example, a component assembling device that picks up components and assembles the picked-up components at a predetermined position.

Background Art

[0002] In the assembly of secondary batteries, alignment of various components is required, and a component assembling device that transports components and aligns the assembly positions is used. One of these component assembling devices is a component assembling device that generates a suction force by an air flow to pick up components to be assembled and assembles the picked-up components at a predetermined position. Therefore, a technique for adsorbing and transporting components is disclosed in Patent Document 1.

[0003] The vacuum suction device described in Patent Document 1, when adsorbing and holding a semiconductor wafer for transportation, switches the switching valve to the suction source side, sucks through the suction port via the suction path, and adsorbs and holds the semiconductor wafer on the placement part. When cleaning the placement part, the switching valve is switched to the cleaning gas supply source side, and cleaning gas (for example, air, nitrogen gas, etc.) is supplied from the cleaning gas supply source via the suction path and ejected from the suction port.

[0004] Also, among the components that need to be assembled in a secondary battery, there is a cap that closes the liquid injection hole. Therefore, a technique for assembling the cap is disclosed in Patent Document 2. The method for manufacturing a secondary battery described in Patent Document 2 includes a cap placement step of placing a cap containing a first magnetic body so as to close a liquid injection hole provided in a lid material, a lid material placement step of placing the lid material so as to close an opening of an outer case, and a step of bringing the first magnetic body and a second magnetic body that imparts a magnetic force to the first magnetic body closer to each other, thereby holding the position of the cap arranged to close the liquid injection hole by the magnetic force imparted from the second magnetic body to the first magnetic body.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] In the assembly of the cap, the positioning accuracy of the cap with respect to the liquid injection hole is important. The higher this positioning accuracy, the more time and cost tend to be required. However, Patent Documents 1 and 2 do not disclose or suggest relaxing the positioning accuracy of the parts.

[0007] The present invention has been made in view of the above circumstances, and an object thereof is to relax the positioning accuracy of the parts to be assembled.

Means for Solving the Problems

[0008] One aspect of the component assembly device according to the present invention includes a holding portion provided with a suction surface at one end, a guide portion that grips a side surface of the holding portion orthogonal to the suction surface so that the holding portion can slide in a direction orthogonal to the suction surface, and a sliding control portion that slides the holding portion between a first state in which the suction surface is buried more than an end portion of the holding portion in the sliding direction of the guide portion and a second state in which the suction surface protrudes more than the end portion of the guide portion. The holding portion has a first opening provided on the suction surface and applying an adsorption force to the component by an air flow in the suction direction, a second opening provided on the side surface of the holding portion and sucking the air flow in the suction direction, an air flow control mechanism configured such that the adsorption force applied to the component by the first opening is smaller in the second state than in the first state, and the air flow sucked from the second opening is larger in the second state than in the first state.

[0009] One aspect of the component assembly device according to the present invention includes a holding portion provided at one end with a suction surface provided with a first opening that applies an adsorbing force to a component by an air flow in the suction direction, and a second opening that sucks the air flow in the suction direction provided on a side surface; a guide portion that grips a side surface of the holding portion orthogonal to the suction surface such that the holding portion is slidable in a direction orthogonal to the suction surface; a sliding control portion that slides the holding portion between a first state in which the suction surface is buried more than an end portion of the holding portion in the sliding direction of the guide portion and a second state in which the suction surface protrudes more than the end portion of the guide portion; the holding portion has a main path that communicates with the first opening and allows the air flow in the suction direction to flow therethrough, and a sub-path that communicates the main path with the second opening; and the second opening is provided at a position that is covered by the guide portion in the first state and is exposed in the second state.

[0010] One aspect of the component assembly device according to the present invention includes a holding portion provided at one end with a suction surface provided with a first opening that applies an adsorbing force to a component by an air flow in the suction direction, and a second opening that sucks the air flow in the suction direction provided on a side surface; a guide portion that grips a side surface of the holding portion orthogonal to the suction surface such that the holding portion is slidable in a direction orthogonal to the suction surface; a sliding control portion that slides the holding portion between a first state in which the suction surface is buried more than an end portion of the holding portion in the sliding direction of the guide portion and a second state in which the suction surface protrudes more than the end portion of the guide portion; a suction pipe that supplies the air flow in the suction direction; a blowing pipe that supplies the air flow in a blowing direction opposite to the suction direction; the holding portion has a first pipe that communicates with the first opening and a second pipe that communicates with the second opening; an opening at a position opposite to the first opening of the first pipe is provided at a position that is connected to the suction pipe in the first state and is connected to the blowing pipe in the second state; and an opening at a position opposite to the second opening of the second pipe is provided at a position that is in an open state in the first state and is connected to the suction pipe in the second state.

Advantages of the Invention

[0011] According to the component assembling device of the present invention, the positioning accuracy of the components to be assembled can be relaxed.

Brief Description of Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0013] For the sake of clarity of explanation, the following description and drawings are appropriately omitted and simplified. In each drawing, the same reference numerals are assigned to the same elements, and redundant explanations are omitted as necessary.

[0014] Embodiment 1 First, the component assembling device according to Embodiment 1 is used in the manufacture of secondary batteries. And in the following description, a component assembling device for assembling a cap for preventing the intrusion of dust during welding in the assembly of a secondary battery will be described. Note that the components to be assembled by the component assembling device can be any components as long as they require positioning accuracy and can be held by suction. Therefore, in order to describe the components to be assembled by the component assembling device according to Embodiment 1, first, the configuration of the secondary battery will be described. Note that the component assembling device 30 described below will be described by taking an example of assembling the cap 21 so as to be inserted downward, but the insertion direction of the cap 21 is not particularly limited.

[0015] Fig. 1 shows a schematic diagram of a secondary battery according to Embodiment 1. As shown in Fig. 1, the secondary battery 1 according to Embodiment 1 includes a case 10 and a lid 11. A power body is housed in the case 10. The lid 11 seals the case 10 with the power body housed therein. And, a negative electrode terminal 12 and a positive electrode terminal 13 are provided on the lid 11. The negative electrode terminal 12 is an electrode that extracts power from the negative electrode of the power body in the case 10, and is joined by a negative electrode pole column penetrating the lid 11 and a negative electrode caulking tool 12a. The negative electrode pole column, the negative electrode caulking tool 12a, and the negative electrode terminal 12 are joined by laser welding. The positive electrode terminal 13 is an electrode that extracts power from the positive electrode of the power body in the case 10, and is joined by a positive electrode pole column penetrating the lid 11 and a positive electrode caulking tool 13a. The positive electrode pole column, the positive electrode caulking tool 13a, and the positive electrode terminal 13 are joined by laser welding.

[0016] In addition, an open valve 14 and a liquid injection hole 15 are provided on the lid 11. The open valve 14 is a valve that reduces the internal pressure of the case 10 when the internal pressure in the sealed case 10 becomes a certain level or higher. The liquid injection hole 15 is a hole provided for injecting an electrolytic solution into the case 10, and is sealed by a sealing member 22 after injection. However, since the injection of the electrolytic solution into the case 10 is performed after welding the lid 11 to the case 10, if nothing is done, dust may enter the case 10 from the liquid injection hole 15 when welding the lid 11 to the case 10. Therefore, in the manufacturing process of the secondary battery, when welding the lid 11 to the case 10, a cap 21 is filled in the liquid injection hole 15 to prevent dust from entering the case 10 from the liquid injection hole 15.

[0017] Here, FIG. 2 shows a flowchart of the assembly process of the secondary battery according to Embodiment 1. As shown in FIG. 2, in the assembly of the secondary battery, first, a current collector is welded to the electrode body, and then welded to an electrode that penetrates the current collector and the lid 11. In a state where the electrode body is housed in the case 10, a member assembly process is performed to close the opening of the case 10 with the lid 11 (step S1). Subsequently, a cap 21 is inserted into the liquid injection hole 15 of the lid 11 (step S2). Subsequently, the case 10 and the lid 11 are welded (step S3). Subsequently, the cap 21 is removed from the liquid injection hole 15, and an electrolytic solution is injected into the case 10 through the liquid injection hole 15 (step S4). Subsequently, with a sealing member 22 placed at the liquid injection hole 15, the lid 11 and the liquid injection hole 15 are welded to seal the liquid injection hole 15 with the sealing member 22 (step S5). Thus, the assembly process of the secondary battery is completed. In such a process, the component assembly device according to Embodiment 1 is used in the process of inserting the cap 21 in step S2 into the liquid injection hole 15.

[0018] The component assembly device 30 according to Embodiment 2 will be described in detail. FIG. 3 shows a diagram for explaining the structure of the component assembly device 30 according to Embodiment 1. As shown in FIG. 3, the component assembly device 30 according to Embodiment 1 includes a holding portion 31, a guide portion 32, and a sliding control portion 33. Also, in FIG. 3, the cap 21 is shown as a component to be transported by the component assembly device 30, and the lid 11 to which the cap 21 is to be assembled is shown.

[0019] The holding portion 31 is provided with an adsorption surface for adsorbing the cap 21 at one end. Also, the holding portion 31 has a first opening, a second opening, and an air flow control structure. The first opening is provided on the adsorption surface and gives an adsorption force to the component by the air flow in the suction direction. The second opening is provided on the side surface of the holding portion 31 and sucks the air flow in the suction direction. Details of the air flow control structure will be described later.

[0020] The guide portion 32 grips the side surface of the holding portion 31 that is orthogonal to the adsorption surface so that the holding portion 31 can slide in a direction orthogonal to the adsorption surface. This guide portion 32 moves the cap 21 from the place where it is prepared to the position where the liquid injection hole 15 is located by guide portion moving means such as a robot arm (not shown).

[0021] The sliding control unit 33 slides the holding unit 31 between a first state in which the adsorption surface is buried deeper than the end of the holding unit 31 in the sliding direction of the guide unit 32 and a second state in which the adsorption surface protrudes beyond the end of the guide unit 32. In FIG. 3, the configuration when the component assembly device 30 is in the first state is shown in the upper figure, and the configuration when the component assembly device 30 is in the second state is shown in the lower figure.

[0022] Here, the airflow control structure of the component assembly device 30 according to Embodiment 1 will be described in detail. The airflow control structure is such that the adsorption force applied to the component through the first opening is smaller in the second state than in the first state, and the airflow sucked from the second opening is larger in the second state than in the first state.

[0023] Specifically, the component assembly device 30 according to Embodiment 1 has a main path P11 and a sub-path P12 as an airflow control structure. The main path P11 communicates with the first opening and allows the airflow in the suction direction to flow. The sub-path P12 communicates the main path P11 with the second opening. The second opening is provided at a position covered by the guide unit 32 in the first state and exposed in the second state. Also, it is preferable that the cross-sectional area of the main path P11 is larger than the cross-sectional area of the sub-path P12. By making the cross-sectional area of the main path P11 larger than that of the sub-path P12, the component assembly device 30 can weaken the adsorption force of the adsorption surface in the second state compared to the first state while maintaining the adsorption force of the cap 21.

[0024] As shown in FIG. 3, in the component assembling device 30 according to the first embodiment, in the first state where the cap 21 is adsorbed on the adsorption surface of the holding portion 31 by a strong suction force, the guide portion 32 serves as a wall covering the periphery of the adsorption surface, preventing the cap 21 from laterally shifting on the adsorption surface. Also, in the first state, the gap between the guide portion 32 and the cap 21 is set to be small. In this way, by setting the area of the adsorption surface of the holding portion 31, the adsorption area and the shape of the cap 21 to be substantially the same, the positional accuracy of the cap 21 with respect to the holding portion 31 can be improved. Note that in the first state, the second opening of the sub-path P12 is blocked by the guide portion 32, and a strong adsorption force is generated at the first opening.

[0025] Also, referring to the second state of FIG. 3, in the component assembling device 30 according to the first embodiment, the adsorption surface of the holding portion 31 protrudes beyond the end of the guide portion 32, and the second opening is exposed. Therefore, most of the air flow in the suction direction of the main path P11 is supplied through the sub-path P12. And in the second state, the component assembling device 30 collects dust around the assembling position of the cap 21 by the air flow flowing through the sub-path P12 and discharges it to the outside. This dust may include sliding dust of the component assembling device 30, dust of the cell clamp jig, dust related to the cap, etc.

[0026] Also, in the second state of FIG. 3, since the air flow sucked from the first opening decreases compared to the first state, the suction force generated on the adsorption surface of the holding portion 31 decreases compared to the first state. Also, in the second state, the adsorption surface of the holding portion 31 protrudes with respect to the end of the guide portion 32. As a result, in the component assembling device 30 according to the first embodiment, since there is no wall around the holding portion 31 in the second state, the cap 21 can slide laterally on the adsorption surface. This lateral sliding will be described with reference to FIG. 4.

[0027] Fig. 4 shows a diagram for explaining the lateral sliding effect of the component assembling device 30 according to Embodiment 1. In Fig. 4, for the purpose of explaining the lateral sliding effect, as a comparative example, a component assembling device 300 is shown in which side walls for stopping the lateral sliding of the cap 21 are fixedly provided around the adsorption surface.

[0028] As shown in Fig. 4, a taper is provided at the tip of the cap 21. Therefore, within the range of the width of the taper, when the central axis of the cap 21 is deviated from the central axis of the liquid injection hole 15, the cap 21 is inserted into the liquid injection hole 15 while laterally shifting along the taper. At this time, in the component assembling device 30, there is nothing around the adsorption surface of the holding portion 31 that inhibits the lateral shift of the cap 21 in the second state. Also, in the component assembling device 30 according to Embodiment 1, the adsorption force for adsorbing the cap 21 to the adsorption surface of the holding portion 31 in the second state becomes weaker than that in the first state. Therefore, in the component assembling device 30 according to Embodiment 2, the lateral shift of the cap 21 occurs smoothly, and the cap 21 is accurately filled into the liquid injection hole 15.

[0029] On the other hand, in the comparative example, the lateral shift of the cap 21 is restricted by the side walls provided around the adsorption surface of the component assembling device 300. Therefore, when using the component assembling device 300 according to the comparative example, in order to accurately insert the cap 21 into the liquid injection hole 15, there is a problem that two precisions, namely, the relative position precision (precision of aligning the central axes) between the component assembling device 300 and the cap 21, and the precision of aligning the central axis of the component assembling device 300 with the central axis of the liquid injection hole 15, must be highly controlled.

[0030] From the above description, in the component assembling device 30 according to Embodiment 1, in the second state, the lateral shift width of the cap 21 can be made large. Therefore, by using the component assembling device 30 according to Embodiment 1, the alignment precision between the central axis of the cap 21 and the central axis of the liquid injection hole 15 can be relaxed.

[0031] In addition, by relaxing the core alignment accuracy, the tolerances such as the sizes of the cap 21 and the liquid injection hole 15 can be widened, so that the member cost can be reduced. Furthermore, by relaxing the core alignment accuracy, the adjustment time for moving the component assembling device 30 to the assembling position can be reduced, and the manufacturing cost of the component assembling device 30 can be reduced.

[0032] Moreover, in the component assembling device 30 according to the first embodiment, in order to increase the lateral slipperiness of the cap 21 on the adsorption surface of the holding portion 31 and attenuate the adsorption force, it is not necessary to reduce the pressure of the suction air flow supplied to the main path P11. As a result, in the component assembling device 30 according to the first embodiment, the time of the component assembling cycle can be shortened. In addition, since it is not necessary to reduce the pressure of the suction air flow, the configuration of the component assembling device 30 can be simplified.

[0033] Furthermore, in the component assembling device 30 according to the first embodiment, in the second state where the cap 21 is inserted into the liquid injection hole 15, by sucking the suction air flow from the sub-path P12, dust collection is performed around the component assembling site. As a result, since the periphery of the component assembling site can be continuously cleaned, the possibility of foreign matter entering the case 10 can be reduced.

[0034] Second Embodiment In the second embodiment, a component assembling device 40, which is another form of the component assembling device 30 according to the first embodiment, will be described. Note that the component assembling device 40 will be described by taking an example in which the cap 21 is assembled so as to be inserted downward, but it can also be applied when the cap 21 is inserted upward.

[0035] FIG. 5 shows a diagram for explaining the structure of the component assembling device 40 according to the second embodiment. As shown in FIG. 5, the component assembling device 40 according to the second embodiment includes a holding portion 41, a guide portion 42, a sliding control portion 43, a suction pipe 44, and a blowing pipe 45. In addition, in FIG. 5, the cap 21 is shown as a component to be conveyed by the component assembling device 40, and the lid 11 to which the cap 21 is to be assembled is shown.

[0036] The holding part 41 is provided with a suction surface for sucking the cap 21 at one end. Further, the holding part 41 has a first opening, a second opening, and an air flow control structure. The first opening is provided on the suction surface and gives an adsorption force to the component by the air flow in the suction direction. The second opening is provided on the side surface of the holding part 41 and sucks the air flow in the suction direction. Details of the air flow control structure will be described later.

[0037] The guide part 42 grips the side surface of the holding part 41 that is orthogonal to the suction surface so that the holding part 41 can slide in the direction orthogonal to the suction surface. This guide part 42 moves from the place where the cap 21 is prepared to the position where the liquid injection hole 15 is located by a guide part moving means such as a robot arm (not shown).

[0038] The sliding control part 43 slides the holding part 41 between a first state in which the suction surface is buried more than the end of the holding part 41 in the sliding direction of the holding part 41 by the guide part 42, and a second state in which the suction surface protrudes more than the end of the guide part 42. In FIG. 5, the configuration when the component assembling device 40 is in the first state is shown in the upper figure, and the configuration when the component assembling device 40 is in the second state is shown in the lower figure.

[0039] The suction pipe 44 supplies an air flow in the suction direction. The blowing pipe 45 supplies an air flow in the blowing direction opposite to the suction direction.

[0040] Here, the air flow control structure of the component assembling device 40 according to the second embodiment will be described in detail. The air flow control structure is such that the adsorption force applied to the component by the first opening is smaller in the second state than in the first state, and the air flow sucked from the second opening is larger in the second state than in the first state.

[0041] Specifically, the component assembling device 40 according to Embodiment 2 has a first pipe P21 and a second pipe P22 as an air flow control structure. The first pipe P21 communicates with the first opening. The second pipe P22 communicates with the second opening. And an opening located at a position opposite to the first opening of the first pipe P21 is provided at a position where it is connected to the suction pipe 44 in the first state and connected to the blowing pipe 45 in the second state. An opening located at a position opposite to the second opening of the second pipe P22 is provided in an open state in the first state and at a position where it is connected to the suction pipe 44 in the second state.

[0042] As shown in FIG. 5, in the component assembling device 40 according to Embodiment 2, in the first state where the cap 21 is adsorbed on the adsorption surface of the holding portion 41 by a strong suction force, the guide portion 42 becomes a wall covering the periphery of the adsorption surface, preventing the cap 21 from laterally shifting on the adsorption surface. Also, in the first state, the gap between the guide portion 42 and the cap 21 is set to be reduced. In this way, by setting the area and the shape of the adsorption portion of the cap 21 to be substantially the same as the area of the adsorption surface of the holding portion 41, the positional accuracy of the cap 21 with respect to the holding portion 41 can be improved. Note that, in the first state, the second opening of the sub-path P22 is blocked by the guide portion 42. Also, an air flow in the suction direction is supplied to the first opening through the first pipe P21 and the suction pipe 44, generating a strong adsorption force.

[0043] Also, referring to the second state in FIG. 5, in the component assembling device 40 according to the second embodiment, the suction surface of the holding portion 41 protrudes beyond the end of the guide portion 42. Further, in the second state, the first pipe P21 is connected to the blowing pipe 45, so that an extrusion force in the direction in which the air flow jets out from the first opening provided on the suction surface of the holding portion 41 is generated. As a result, the state of the first pipe P21 immediately switches from a negative pressure state to a positive pressure state. That is, also in the second embodiment, in the second state, the suction force generated on the suction surface of the holding portion 41 is reduced compared to the first state. On the other hand, in the second state, the second pipe P22 is connected to the suction pipe 44. Therefore, in the second state, an air flow in the suction direction is supplied to the second pipe P22 from the suction pipe 44, and dust around the component mounting site is sucked by this air flow through the second opening for dust collection.

[0044] Also, when transitioning from the first state to the second state in FIG. 5, a state occurs in which neither the suction pipe 44 nor the blowing pipe 45 is connected to the first pipe P21 and the second pipe P22. In this state, since no suction force is generated on the suction surface of the holding portion 41, the cap 21 smoothly slides laterally on the suction surface. Further, in the second embodiment, in the second state, a force in the direction of pushing the cap 21 from above downward is generated by the air flow in the blowing direction. As a result, in the component assembling device 40 according to the second embodiment, when assembling the cap 21 from above downward, it is also possible to insert the cap 21 into the liquid injection hole 15 so as to be pushed in from the upper side.

[0045] From the above description, also in the component assembling device 40 according to the second embodiment, the suction force to the cap 21 in the second state is reduced compared to the first state, and since there is no wall around the suction surface that obstructs the lateral sliding of the cap 21, the positioning accuracy when assembling the cap 21 can be relaxed in the same manner as in the first embodiment.

[0046] Furthermore, in the component assembling device 40 according to the second embodiment, by applying an airflow in the blowing direction to the cap 21 in the second state, the pressure in the first pipe P21 can be immediately switched from a negative pressure state to a positive pressure state, so that the peelability of the cap 21 adsorbed on the adsorption surface can be improved. In addition, the improvement of the peelability of the cap 21 results in the effect of shortening the time of the assembling process of the cap 21. Further, in the component assembling device 40 according to the second embodiment, by applying an airflow in the blowing direction to the cap 21 in the second state, the insertion force when inserting the cap 21 can be increased.

[0047] Also, in the second embodiment, the switching between the airflow in the suction direction and the airflow in the blowing direction is performed by the sliding operation of the holding portion 41. Specifically, in the second embodiment, by sliding the holding portion 41, the connection combination of the first pipe P21 and the second pipe P22 with the suction pipe 44 and the blowing pipe 45 is switched. As a result, in the component assembling device 40 according to the second embodiment, since it is not necessary to switch a valve or switch the generated airflow for switching the direction of the airflow, the configuration of the device can be simplified.

[0048] Note that the present invention is not limited to the above embodiments, and can be appropriately modified without departing from the spirit thereof.

Explanation of Reference Numerals

[0049] 1 Secondary battery 10 Case 11 Lid 12 Negative electrode terminal 12a Negative electrode caulking tool 13 Positive electrode terminal 13a Positive electrode caulking tool 14 Release valve 15 Liquid injection hole 21 Cap 22 Sealing member 30, 40 Component assembling device 31, 41 Holding portion 32, 42 Guide portion 33, 43 Sliding control portion 44 Suction pipe 45 Blowout pipe P11 Main path P12 Sub-path P21 First pipe P22 Second pipe

Claims

1. A holding part with a suction surface provided at one end, A guide part that grips a side surface of the holding part that is orthogonal to the suction surface so that the holding part can slide in a direction orthogonal to the suction surface, A sliding control part that slides the holding part between a first state in which the suction surface is buried more than the end of the holding part in the sliding direction of the holding part of the guide part and a second state in which the suction surface protrudes more than the end of the guide part, and has, The holding part is, A first opening provided on the suction surface and applying an adsorption force to the component by an air flow in the suction direction, A second opening provided on the side surface of the holding part and sucking an air flow in the suction direction, The adsorption force applied to the component by the first opening is made smaller in the second state than in the first state, and the air flow sucked from the second opening is made larger in the second state than in the first state. A component assembling device having an air flow control structure.

2. The air flow control structure is, A main path that communicates with the first opening and allows the air flow in the suction direction to flow, A sub-path that communicates the main path with the second opening, and has, The second opening is provided at a position covered by the guide part in the first state and exposed in the second state. The component assembling device according to claim 1.

3. A suction pipe that supplies the air flow in the suction direction, A blowing pipe that supplies an air flow in a blowing direction opposite to the suction direction, and further has, The air flow control structure is, A first pipe that communicates with the first opening, A second pipe that communicates with the second opening, and has, An opening at a position opposite to the first opening of the first pipe is provided at a position connected to the suction pipe in the first state and connected to the blowing pipe in the second state. The opening located at a position opposite to the second opening of the second pipe is provided at a position that is in an open state in the first state and is connected to the suction pipe in the second state, according to the component assembling device of claim 1.

4. A holding part provided with a suction surface having a first opening that gives an adsorption force to a component by an air flow in the suction direction at one end, and a second opening that sucks the air flow in the suction direction provided on a side surface, A guide part that grips a side surface of the holding part orthogonal to the suction surface so that the holding part can slide in a direction orthogonal to the suction surface, A sliding control part that slides the holding part between a first state in which the suction surface is buried more than an end portion of the holding part in the sliding direction of the guide part and a second state in which the suction surface protrudes more than the end portion of the guide part, The holding part, A main path that communicates with the first opening and allows the air flow in the suction direction to flow, A sub-path that communicates the main path and the second opening, The second opening is provided at a position that is covered by the guide part in the first state and is exposed in the second state, according to the component assembling device.

5. A holding part provided with a suction surface having a first opening that gives an adsorption force to a component by an air flow in the suction direction at one end, and a second opening that sucks the air flow in the suction direction provided on a side surface, A guide part that grips a side surface of the holding part orthogonal to the suction surface so that the holding part can slide in a direction orthogonal to the suction surface, A sliding control part that slides the holding part between a first state in which the suction surface is buried more than an end portion of the holding part in the sliding direction of the guide part and a second state in which the suction surface protrudes more than the end portion of the guide part, A suction pipe that supplies the air flow in the suction direction, A blowing pipe that supplies an air flow in a blowing direction opposite to the suction direction, The holding part, A first pipe that communicates with the first opening, It has a second pipe communicating with the second opening. The opening located at a position opposite to the first opening of the first pipe is provided at a position where it is connected to the suction pipe in the first state and connected to the blowing pipe in the second state. A component assembling device in which the opening located at a position opposite to the second opening of the second pipe is in an open state in the first state and is provided at a position where it is connected to the suction pipe in the second state.

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